Structure

Abstract

To provide a structure that allows suppression of occurrence of electrostatic discharge.SOLUTION: A structure 1 includes a laminate 100 comprising at least one optical cooling layer 30a, 30b and a protective layer 40 on the optical cooling layers 30a, 30b, wherein the protective layer 40 contains a conductive material or a surfactant.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a structure including an optical cooling layer. [Background technology]

[0002] In recent years, structures including layers that perform cooling using optical properties have been developed (see Patent Documents 1 to 3 below). These structures have layers that perform cooling based on optical properties.

[0003] The structure described in Patent Document 1 has a polymer layer (optical cooling layer) containing a plurality of dielectric particles. The polymer layer has a high emissivity in the infrared wavelength range. As a result, the polymer layer is radiatively cooled by infrared radiation (thermal radiation).

[0004] The structure described in Patent Document 2 has an optical cooling layer containing a material that responds with anti-Stokes luminescence when absorbing light. Anti-Stokes luminescence is a phenomenon in which light with higher energy than the energy of the incident light is emitted. Anti-Stokes luminescence reduces the energy of electrons and / or lattice vibrations in the optical cooling layer, cooling the optical cooling layer.

[0005] The structure described in Patent Document 3 includes a laminate having an optical cooling layer that performs radiative cooling by infrared radiation (thermal radiation) and an optical cooling layer that contains a material that responds with anti-Stokes luminescence when absorbing light. [Prior art documents] [Patent documents]

[0006] [Patent Document 1] Special Publication No. 2019-515967 [Patent Document 2] International Publication No. 2018 / 020503 [Patent Document 3] International Publication No. 2023 / 100186 Summary of the Invention [Problem to be solved by the invention]

[0007] The above-described structure does not require electric power, and therefore can be used in areas where it is difficult to secure electric power. The inventors of the present application have considered using such a structure in an explosion-proof area. In this case, the inventors have found that it is necessary to prevent or make it difficult for electrostatic discharge to occur in the structure in the explosion-proof area.

[0008] Therefore, it is desirable to provide a structure that can suppress the occurrence of electrostatic discharge. [Means for solving the problem]

[0009] According to one embodiment, the structure includes a stack having an optical cooling layer and a protective layer on the optical cooling layer, the protective layer including a conductive material or a surfactant. [Effects of the Invention]

[0010] According to the above aspect, it is possible to provide a structure capable of suppressing the occurrence of electrostatic discharge. [Brief explanation of the drawings]

[0011] [Figure 1] FIG. 1 is a schematic cross-sectional view of a structure according to one embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0012] Hereinafter, embodiments will be described with reference to the drawings. In the following drawings, the same or similar parts are denoted by the same or similar reference numerals. However, it should be noted that the drawings are schematic and the ratios of the dimensions may differ from those of the actual parts.

[0013] In this specification, when simply referring to light, the concept of light includes ultraviolet light (ultraviolet rays), visible light, and infrared light. When these are described in terms of the wavelength of light as electromagnetic waves, light includes electromagnetic waves with wavelengths of 10 nm to 20,000 nm (electromagnetic waves of 0.01 μm to 20 μm).

[0014] FIG. 1 is a schematic cross-sectional view of a structure according to one embodiment. In this embodiment, the structure 1 is a sheet-like structure. FIG. 1 shows a cross section of the sheet-like structure along its thickness direction. In FIG. 1, the structure 1 is depicted as being short in a direction parallel to the sheet for convenience, but the structure 1 may actually extend long in a direction parallel to the sheet.

[0015] The structure 1 according to one embodiment may include a stack 100 having at least one optical cooling layer 30a, 30b. Preferably, the stack 100 may include an adhesive layer 80, at least one optical cooling layer 30a, 30b on the adhesive layer 80, and a protective layer 40 on the optical cooling layers 30a, 30b. More preferably, the stack 100 may include an adhesive layer 80, a metal reflective layer 20 on the adhesive layer 80, at least one optical cooling layer 30a, 30b on the metal reflective layer 20, and a protective layer 40 on the optical cooling layers 30a, 30b. The adhesive layer 80 is provided on the opposite side to the protective layer 40.

[0016] The protective layer 40 faces the side where light is emitted from the laminate 100 into the atmosphere. Hereinafter, the side where light is emitted from the laminate 100 into the atmosphere will be referred to as the "front side." The side opposite the front side of the laminate 100 will be referred to as the "back side." In the illustrated embodiment, the front side of the laminate 100 corresponds to the side of the laminate 100 where the protective layer 40 is provided. The back side of the laminate 100 corresponds to the side of the laminate 100 where the adhesive layer 80 is provided.

[0017] In the illustrated embodiment, the stack 100 includes two optical cooling layers 30a, 30b. Alternatively, the stack 100 may include only one optical cooling layer, or may include more than two optical cooling layers.

[0018] The optical cooling layers 30a, 30b may be layers that can cool the stack 100 based on their optical properties. The optical cooling layers 30a, 30b may have, for example, a function of cooling the stack 100 by anti-Stokes emission when absorbing light, and / or a function of cooling the stack 100 by radiative cooling due to the emission of electromagnetic waves. Preferably, the stack 100 has at least one optical cooling layer that has a function of cooling the stack 100 by radiative cooling due to the emission of electromagnetic waves.

[0019] The optical cooling layers 30a and 30b may be layers that have the function of cooling by radiative cooling. Specifically, the optical cooling layers 30a and 30b may have an emissivity of 40% or more in the wavelength average range of 8 μm to 14 μm. Preferably, the optical cooling layers 30a and 30b have a reflectivity of 80% or more in the visible light wavelength range and an emissivity of 40% or more in the wavelength average range of 8 μm to 14 μm. Materials with such optical properties are mentioned, for example, in the aforementioned Patent Documents 1 and 3.

[0020] Here, "emissivity" is the ratio of the ease of radiation from a general object to the thermal radiation from a black body, expressed for each wavelength.

[0021] The spectrum of sunlight has a high intensity in the wavelength region of visible light, so if a material having a high reflectance in the wavelength region of visible light is used, heating of the laminate 100 by sunlight is suppressed.

[0022] Furthermore, the optical cooling layers 30a and 30b have an emissivity of 40% or more on average in the wavelength range of 8 μm to 14 μm, which makes it easier to emit light in specific wavelength bands with high emissivity, thereby producing a radiative cooling effect.

[0023] When the multiple optical cooling layers 30a, 30b contain a material with radiative cooling function, it is preferable that the multiple optical cooling layers 30a, 30b are made of materials with emissivity of 80% or more at different wavelengths (wavelengths different from the wavelength region of visible light).

[0024] The material having such optical properties of radiative cooling may be composed of, for example, a polymer material containing a dielectric filler 60. The combination of the polymer material and the dielectric filler is appropriately selected so as to exhibit the above optical properties. The polymer material may include, for example, at least one selected from the group consisting of vinyl chloride resin, fluororesin, epoxy resin, polyester, polyurethane resin, acrylic resin, and silicone resin. The vinyl chloride resin used in this embodiment is a homopolymer of vinyl chloride or vinylidene chloride, or a copolymer of vinyl chloride or vinylidene chloride.

[0025] The dielectric filler 60 may include, for example, at least one selected from the group consisting of aluminum oxide, zinc oxide, zirconium oxide, cerium oxide, lanthanum oxide, rhodium oxide, magnesium oxide, aluminum silicate, pearl powder, silica, ground calcium carbonate powder, aluminum oxide, zinc oxide, zirconium oxide, cerium oxide, lanthanum oxide, rhodium oxide, barium sulfate, talc powder, titanium oxide powder, zinc sulfide, ceramic powder, magnesium oxide, ceramic beads, and glass beads.

[0026] Alternatively or additionally, the optical cooling layers 30a and 30b may contain a material that exhibits anti-Stokes luminescence (anti-Stokes scattering). In this case, the material constituting the optical cooling layers 30a and 30b is not particularly limited as long as it exhibits anti-Stokes luminescence. Such materials are mentioned in, for example, the aforementioned Patent Documents 2 and 3.

[0027] Examples of materials that exhibit anti-Stokes luminescence include ytterbium-doped yttrium lithium fluoride, ytterbium-doped tungstate, cesium-doped fluorozirconate glass, and metal halide perovskite.

[0028] Preferably, the optical cooling layers 30a and 30b exhibit anti-Stokes luminescence by absorbing light at a specific wavelength within a relatively high-intensity wavelength range of sunlight, allowing the optical cooling layers 30a and 30b to exert a cooling function by absorbing sunlight.

[0029] When the multiple optical cooling layers 30a, 30b contain a material that exhibits anti-Stokes luminescence, the multiple optical cooling layers 30a, 30b are preferably made of materials that exhibit anti-Stokes luminescence in different wavelength regions.

[0030] When multiple optical cooling layers 30a, 30b are provided, one optical cooling layer 30a may be made of a material that exhibits anti-Stokes luminescence, and another optical cooling layer 30b may be made of a material that has the optical properties of radiative cooling.

[0031] In the illustrated embodiment, the stack 100 includes a metal reflective layer 20. The metal reflective layer 20 functions to emit light emitted from the optical cooling layers 30a and 30b toward the front surface side. The metal reflective layer 20 also functions to reflect light that enters the optical cooling layers 30a and 30b from the front surface side of the stack 100, passes through the optical cooling layers 30a and 30b, and reaches the metal reflective layer 20 toward the front surface side.

[0032] The metal reflective layer 20 may contain an inorganic metal material, such as at least one selected from the group consisting of Al, Ag, Ni, and Cr.

[0033] The protective layer 40 is a layer that protects the laminate 100. The protective layer 40 is preferably a layer that has weather resistance. The protective layer 40 may contain a conductive material or a surfactant.

[0034] In a preferred example, the protective layer 40 is made of a conductive material. Since the protective layer 40 itself is conductive, the protective layer 40 is not charged, and creeping discharge in the protective layer 40 is suppressed. As a result, even if the layers other than the protective layer 40 are made of insulating materials, the structure 1 can be suitably used as a structure 1 for an explosion-proof area and / or a container for a flammable substance.

[0035] Flammable substances may be substances that may cause explosions or fires due to static electricity discharge when mixed with air. Examples of flammable substances include flammable gases, flammable liquids, and flammable powders. Specifically, flammable substances include hydrogen, propylene, propane, ethylene, butane, ammonia, toluene, xylene, heptane, hexane, acetone, ethanol, propylene oxide, methyl ethyl ketone, ethyl acetate, tetrahydrofuran, bicyclohexanol, dibutyl ether, crude oil, gasoline, paint thinner, naphtha, diesel, kerosene, jet fuel, marine fuel, sucrose esters, lead stearate, zinc stearate, paranitrophenoxyacetone, powder paint, aluminum, Mg-Al alloy, metallic silicon, tantalum, and zirconium. Examples of containers for flammable substances include containers for storing flammable substances, transportation equipment with a function for transporting flammable substances, or containers for using flammable substances. Specifically, examples of containers for storing flammable substances include tanks, drums, portable cans, etc. Examples of transportation equipment having a function for transporting flammable substances or a container for using flammable substances include ships, automobiles, aircraft, etc.

[0036] When the protective layer 40 itself is made of a conductive material, the conductive material is preferably a conductive polymer. The conductive polymer may have a backbone of at least one π-conjugated conductive polymer selected from the group consisting of unsubstituted or substituted polyphenylene vinylene, polyacetylene, polythiophene, polypyrrole, polyaniline, polyisothianaphthene, polyfuran, polycarbazole, polydiaminoanthraquinone, and polyindole. The conductive polymer may have, in the backbone, an acidic group, preferably a sulfonic acid group and / or a carboxyl group, or an alkali metal salt, ammonium salt, or substituted ammonium salt thereof, or an alkyl group or an alkyl group containing an ether bond substituted with a sulfonic acid group and / or a carboxyl group, or an alkali metal salt, ammonium salt, or substituted ammonium salt thereof. The conductive polymer may have, on a nitrogen atom in the π-conjugated conductive polymer, an acidic group, preferably a sulfonic acid group and / or a carboxy group, or an alkali metal salt, ammonium salt or substituted ammonium salt thereof, or an alkyl group substituted with a sulfonic acid group and / or a carboxy group, or an alkali metal salt, ammonium salt or substituted ammonium salt thereof, or an alkyl group containing an ether bond.

[0037] Furthermore, the conductive polymer may be doped with an electron acceptor or an electron donor to the extent that the transparency and weather resistance of the protective layer 40 are not impaired.

[0038] Alternatively, in another preferred example, the protective layer 40 may contain a conductive filler and / or a surfactant. Specifically, the protective layer 40 may be made of a material in which the conductive filler and / or the surfactant is dispersed. More specifically, the protective layer 40 may be made of a polymer material in which the conductive filler and / or the surfactant is dispersed.

[0039] The polymer material as the main component of the protective layer 40 may include, for example, at least one selected from the group consisting of urethane-based, acrylic-based, silicone-based, and olefin-based polymers.

[0040] The conductive filler and / or surfactant has a function of suppressing charging of the protective layer 40. Therefore, the protective layer 40 is not charged, and creeping discharge is suppressed in the protective layer 40. As a result, even if the layers other than the protective layer 40 are made of insulating materials, the structure 1 can be suitably used as a structure 1 for an explosion-proof area and / or a container for a flammable substance.

[0041] The conductive filler may include, for example, at least one selected from the group consisting of metal particles, carbon particles, and conductive oxide particles. Examples of metal particles include powders of simple metals such as gold, silver, copper, nickel, chromium, palladium, rhodium, ruthenium, indium, aluminum, tungsten, malbutene, and platinum, as well as alloy powders such as copper-nickel alloys, silver-palladium alloys, copper-tin alloys, silver-copper alloys, and copper-manganese alloys, and metal-coated particles in which the surface of metal particles or alloy powders is coated with silver or the like. Examples of carbon particles include carbon black, graphite, and carbon nanotubes. Examples of conductive oxide particles include silver oxide, indium oxide, tin oxide, zinc oxide, and ruthenium oxide. These conductive fillers may be used alone or in combination.

[0042] The surfactant may include, for example, at least one selected from the group consisting of anionic surfactants, cationic surfactants, zwitterionic surfactants, and nonionic surfactants.

[0043] Examples of anionic surfactants include sulfonic acid surfactants such as alkyl sulfonates, alkylaryl sulfonates, and ester sulfonates; phosphoric acid surfactants such as alkyl phosphates or salts thereof, and polyoxyalkylene alkyl ether phosphates or salts thereof; sulfate surfactants such as alkyl sulfates and alkyl ether sulfates; and carboxylate surfactants such as alkyl fatty acid salts.

[0044] Examples of cationic surfactants include quaternary ammonium salts such as alkylammonium salts and alkylbenzylammonium salts, and amine salts such as N-methylbishydroxyethylamine fatty acid ester hydrochloride.

[0045] Examples of amphoteric surfactants include betaine surfactants such as alkylbetaine, amino acid surfactants such as alkylamino fatty acid salts, and amine oxide surfactants such as alkylamine oxide.

[0046] Examples of nonionic surfactants include ester types in which a polyhydric alcohol such as glycerin or a sugar is ester-bonded to a fatty acid; ether types such as polyoxyethylene alkyl ether and polyoxyethylene alkylphenyl ether; ester-ether types in which an alkylene oxide is added to a fatty acid or a polyhydric alcohol fatty acid ester; and amide types such as fatty acid alkanolamides in which a hydrophobic group and a hydrophilic group are connected via an amide bond.

[0047] The protective layer 40 may be composed of one layer or multiple layers. In this case, the surface-most layer of the protective layer 40 may preferably be a conductive layer, for example, a layer containing a conductive polymer. In this case, the layers other than the surface-most layer among the multiple layers constituting the protective layer 40 may be layers mainly composed of the above-mentioned polymer material. Even if the layer mainly composed of a polymer material is not conductive, as long as the surface-side layer of the protective layer 40 is a conductive layer containing a conductive polymer, the protective layer 40 will not be charged, and creeping discharge in the protective layer 40 will be suppressed.

[0048] The protective layer 40 preferably has a light transmittance of, for example, 70% or more, and more preferably 80% or more, at least in the wavelength band of the light (electromagnetic wave) emitted from the optical cooling layers 30a and 30b.

[0049] For example, when the optical cooling layers 30a and 30b are made of a material that exhibits anti-Stokes luminescence, it is preferable that the protective layer 40 has a light transmittance of 70% or more, and preferably 80% or more, at both the wavelength of the light to be absorbed and the wavelength of the anti-Stokes luminescence.

[0050] For example, when the optical cooling layers 30a and 30b are made of a material that exhibits radiative cooling function, the protective layer 40 preferably has a light transmittance of 70% or more, and more preferably 80% or more, in the wavelength range of, for example, 8 μm to 14 μm.

[0051] The surface resistivity (sheet resistance) of the protective layer 40 is 1×10 12 The surface resistivity of the protective layer 40 is preferably 1×10 [Ω / sq] or less. 5 or more, and 1 x 10 11 [Ω / sq] or less, and more preferably 1×10 6 or more, and 1 x 10 10 [Ω / sq] or less. This makes the protective layer 40 less likely to become charged and has the function of diffusing static electricity. Furthermore, by grounding the surface of the protective layer 40, charging can be prevented. Therefore, even if the layers other than the protective layer 40 are insulating, the structure 1 can be suitably used as a structure 1 for use in explosion-proof areas and / or as a container for flammable materials.

[0052] The surface resistivity of the protective layer 40 can be adjusted by the amount of conductive filler and / or surfactant added to the protective layer 40 .

[0053] The adhesive layer 80 may be a layer having a pressure-sensitive adhesive, which allows the structure 1 to be easily attached to an object to be cooled via the adhesive layer 80.

[0054] Preferably, the adhesive layer 80 contains a thermally conductive filler. Specifically, the main component of the adhesive that constitutes the adhesive layer 80 may be a polymer material, and the thermally conductive filler may be dispersed in the polymer material.

[0055] The thermally conductive filler improves the thermal conductivity of the adhesive layer 80, making it easier to conduct heat from the object to be cooled to the optical cooling layers 30a and 30b. Therefore, even if the adhesive layer 80 is provided, it is possible to suppress a decrease in the cooling effect of the structure 1.

[0056] The inventors of the present application considered increasing the thickness of adhesive layer 80 in order to attach structure 1 to a rough, uneven surface such as an outdoor exterior wall. However, if adhesive layer 80 is too thick, there is a possibility that the cooling effect of structure 1 will be reduced. If adhesive layer 80 contains a thermally conductive filler, the thermal conductivity of adhesive layer 80 will be improved, and therefore the thickness of adhesive layer 80 can be increased.

[0057] The thermally conductive filler may be, for example, at least one selected from alumina, aluminum hydroxide, aluminum nitride, boron nitride, zinc oxide, carbon fiber, carbon nanotube, and metallic aluminum.

[0058] Preferably, the adhesive layer 80 contains a conductive filler or a surfactant. Specifically, the conductive filler or the surfactant may be dispersed in a polymer material that is the main component of the adhesive layer 80. This makes it possible to reduce the breakdown voltage of the entire laminate 100, as will be described later.

[0059] Preferably, adhesive layer 80 contains a plasticizer. The plasticizer softens adhesive layer 80, improving the ability of adhesive layer 80 to conform to a surface having rough irregularities. This is thought to make it easier to attach structure 1 to a surface having rough irregularities.

[0060] The thickness of the adhesive layer 80 is preferably greater than the thickness of the metal reflective layer 20. When the surface of the object to be cooled has rough irregularities, the metal reflective layer 20 is unlikely to deform to conform to the rough irregularities. However, when the thickness of the adhesive layer 80 is sufficiently greater than the thickness of the metal reflective layer 20, the adhesive layer 80 becomes more likely to deform to conform to the surface having rough irregularities, making it easier to ensure sufficient adhesive strength of the adhesive layer 80.

[0061] The thickness of the adhesive layer 80 is, for example, 5 μm or more, preferably 10 μm or more, more preferably 20 μm or more. The thickness of the adhesive layer 80 is, for example, 100 μm or less, preferably 80 μm or less, more preferably 50 μm or less.

[0062] The dielectric breakdown voltage of the laminate 100 is preferably 10 kV or less. It is said that a dielectric breakdown voltage of 10 kV or less can prevent creeping discharge. The dielectric breakdown voltage of the laminate 100 is preferably 6 kV or less, and more preferably 4 kV or less. This makes the structure 1 suitable for use in explosion-proof areas and / or as a structure 1 for containing flammable materials.

[0063] Here, the breakdown voltage of the laminate 100 depends on the conductivity (electrical resistivity) in the thickness direction of the layers constituting the laminate 100. In order to reduce the breakdown voltage of the laminate 100, the conductivity (electrical resistivity) of each layer constituting the laminate 100 may be appropriately set. For this purpose, it is preferable that at least one layer, preferably multiple layers, of the multiple layers of the laminate 100 contain a conductive filler or a surfactant.

[0064] More preferably, the insulating layer of the multiple layers constituting the laminate 100 contains a conductive filler or a surfactant, which can reduce the breakdown voltage of the entire laminate 100. Examples of the conductive filler or surfactant material are as described above.

[0065] The thickness of the laminate 100 is, for example, 100 μm or more, preferably 150 μm or more, and more preferably 300 μm or more. The thicker the laminate 100, the less likely dielectric breakdown occurs in the laminate 100. Therefore, the structure 1 can be suitably used as a structure 1 for explosion-proof areas and / or for containing flammable materials.

[0066] In particular, it is more preferable that the dielectric breakdown voltage of the laminate 100 is 10 kV or less and the thickness of the laminate 100 is 1000 μm or less. In this case, dielectric breakdown does not occur in the entire laminate 100. Therefore, the structure 1 can be more suitably used as a structure 1 for explosion-proof areas and / or for containing flammable materials.

[0067] There is no particular upper limit to the thickness of the laminate 100. The thickness of the laminate 100 may be, for example, 1000 μm or less, and preferably 800 μm or less.

[0068] The configuration for reducing the surface resistivity of the surface of the laminate 100 and the configuration for reducing the breakdown voltage of the entire laminate 100 have already been described. From the viewpoint of suppressing the occurrence of electrostatic discharge in the structure 1, it is sufficient to achieve either reducing the surface resistivity of the surface of the laminate 100 or reducing the breakdown voltage of the entire laminate 100. Therefore, it is sufficient to apply either one of the configuration for reducing the surface resistivity of the surface of the laminate 100 and the configuration for reducing the breakdown voltage of the entire laminate 100, or preferably both.

[0069] For example, to reduce the surface resistivity of the surface of the laminate 100, as described above, the outermost surface of the protective layer 40 may be made of a conductive polymer, or a conductive filler and / or a surfactant may be added to the outermost surface of the protective layer 40. Here, if the optical cooling layers 30a, 30b contain the dielectric filler 60, the breakdown voltage of the entire laminate 100 may increase. In this case, to reduce the surface resistivity of the surface of the structure 1, the outermost surface of the protective layer 40 may be made of a conductive polymer, or a conductive filler and / or a surfactant may be added to the outermost surface of the protective layer 40.

[0070] However, even if the optical cooling layers 30a, 30b contain the dielectric filler 60, the breakdown may be suppressed by reducing the breakdown voltage of the entire laminate 100. In this case, the outermost surface of the protective layer 40 does not necessarily have to be made of a conductive polymer, and may not necessarily contain a conductive filler and / or a surfactant.

[0071] In the illustrated laminate 100, two layers depicted adjacent to each other may be provided in contact with each other. Alternatively, another layer (not shown) may be provided between the two layers depicted adjacent to each other. In other words, the laminate 100 may include layers other than those described above.

[0072] In the illustrated embodiment, as a preferred example, the protective layer 40 constituting the laminate 100 is exposed on the surface side. Alternatively, another layer may be provided on the surface side of the protective layer 40.

[0073] A release sheet (not shown) may be provided on the back side of the adhesive layer 80. The release sheet may be provided to protect the adhesive layer 80 in the structure 1 before use.

[0074] As described above, the contents of the present invention have been disclosed through the embodiments, but the descriptions and drawings that form part of this disclosure should not be understood to limit the present invention. Various alternative embodiments, examples, and operating techniques will become apparent to those skilled in the art from this disclosure. Therefore, the technical scope of the present invention is defined only by the inventive features of the claims that can be reasonably understood from the above description.

Claims

1. a stack having at least one optical cooling layer and a protective layer on the optical cooling layer; The structure, wherein the protective layer comprises a conductive material or a surfactant.

2. The structure according to claim 1 , wherein the protective layer is made of a conductive material.

3. The structure according to claim 1 , wherein the protective layer is made of a material in which a conductive filler or a surfactant is dispersed.

4. The surface resistivity of the protective layer is 1×10 １２ The structure according to any one of claims 1 to 3, wherein the surface roughness is [Ω / sq] or less.

5. The structure according to claim 1 , wherein at least two layers of the plurality of layers constituting the laminate contain a conductive filler or a surfactant.

6. 6. The structure according to claim 1, wherein the laminate has a breakdown voltage of 10 kV or less.

7. The structure of claim 1 , wherein the optical cooling layer comprises a material that exhibits anti-Stokes luminescence.

8. 8. The structure of claim 1, wherein the optical cooling layer has an emissivity of 40% or greater averaged over a wavelength range of 8 μm to 14 μm.

9. The structure according to claim 1 , wherein the thickness of the laminate is 100 μm or more.

10. 10. The structure of claim 1, wherein the stack includes a metal reflective layer.

11. The structure of claim 1 , wherein the laminate comprises an adhesive layer on the side opposite the protective layer.

12. 12. A structure according to any one of claims 1 to 11, wherein the structure is for an explosion-proof area and / or for the containment of flammable materials.

Images