Glass fiber cloth product, prepreg and copper clad laminate

A glass fiber cloth with a tailored composition and surface treatment addresses the limitations of existing products, providing low thermal expansion, dielectric constant, and loss tangent for high-speed communication and computing applications.

JP2025168254APending Publication Date: 2025-11-07FULLTECH FIBER GLASS CORP
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Patent Information

Application Number
JP2025059712
Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-04-25
Filing Date
2025-03-31
Publication Date
2025-11-07

AI Technical Summary

Technical Problem

Existing glass fiber cloth products fail to meet the requirements of high-speed computing and communication circuits due to high thermal expansion coefficients, dielectric constants, and dielectric loss tangents, making them unsuitable for 5G mobile communication systems and high-performance servers.

Method used

A glass fiber cloth product with a specific glass composition and surface treatment using a silane coupling agent, achieving a thermal expansion coefficient of 2-3 ppm/°C, dielectric constant of 4-5, and dielectric loss tangent of 0.0010-0.0040, integrated into a prepreg and copper-clad laminate.

Benefits of technology

The glass fiber cloth product, prepreg, and copper-clad laminate exhibit low thermal expansion, dielectric constant, and dielectric loss tangent, ensuring high dimensional stability and performance for 5G mobile communication systems and high-performance servers.

✦ Generated by Eureka AI based on patent content.

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Abstract

To provide a glass fiber cloth product that has a low dielectric constant, a low dielectric loss tangent and a low thermal expansion coefficient.SOLUTION: A glass fiber cloth product comprises a glass fiber cloth and a silane coupling agent composition, the glass fiber cloth is a knitted or woven fabric made of a plurality of glass fiber yarns, each of the glass fiber yarns is composed of a glass fiber containing a glass composition, a thermal expansion coefficient of the glass composition is in the range of 2 ppm / °C to 3 ppm / °C, the value of a dielectric constant of the glass composition measured at a frequency of 10 GHz is in the range of 4 to 5, the value of a dielectric dissipation factor of the glass composition measured at a frequency of 10 GHz is in the range of 0.0010 to 0.0040, and the value of the dielectric constant and the value of the dielectric dissipation factor, and the thermal expansion coefficient satisfy formula (1): 1.0≤1000×(Df / Dk)×(CTE)2≤7.2, wherein Df is the value of the dielectric dissipation factor, Dk is the value of the dielectric constant, and CTE is the thermal expansion coefficient.SELECTED DRAWING: None
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Description

[Technical Field]

[0001] The present invention relates to laminate products, and more particularly to fiberglass cloth products, prepregs and copper clad laminates. [Background technology]

[0002] With the development of fifth-generation mobile communication systems (5G) and high-speed computing chips, the requirements for circuit boards in high-end electronic products are also increasing. For example, circuit boards are required to have small size changes due to heat and to be able to accommodate high-speed computing and communication.

[0003] In order to reduce the thermal change in size of the circuit board, it is necessary to select a material with a low thermal expansion coefficient, and in order to provide the circuit board with high-speed calculation and communication functions, it is necessary to select a material with a low dielectric constant and a low dielectric loss tangent.

[0004] Recently, examples of glass fiber cloth products used in the manufacture of circuit boards include T-glass glass fiber cloth products, E-glass glass fiber cloth products, and NE-glass glass fiber cloth products.

[0005] T-glass glass fiber cloth products have a low thermal expansion coefficient of 3 ppm / ℃ or less, but their dielectric constant exceeds 5 at a frequency of 10 GHz and their dielectric loss tangent exceeds 0.0065 at a frequency of 10 GHz, making them unsuitable for circuit boards that require high-speed computing and communication functions.

[0006] E-glass fiberglass cloth products have a thermal expansion coefficient exceeding 5 ppm / ℃, a dielectric constant exceeding 6 at a frequency of 10 GHz, and a dielectric loss tangent exceeding 0.0060 at a frequency of 10 GHz, making them unsuitable for circuit boards applied to 5G mobile communication systems.

[0007] NE-glass glass fiber cloth products have a dielectric constant of 5 or less at a frequency of 10 GHz and a dielectric loss tangent of 0.0035 or less at a frequency of 10 GHz, but because their thermal expansion coefficient exceeds 3 ppm / ℃, they cannot be used for circuit boards, which require minimal size change due to heat.

[0008] Patent Document 1 discloses a low-dielectric-constant glass fiber. The glass fiber is essentially composed of 52 wt% to 60 wt% SiO2, 11 wt% to 16 wt% Al2O3, 20 wt% to 30 wt% B2O3, and 4 wt% to 8 wt% CaO. The glass fiber has a dielectric constant of less than 5 at a frequency of 10 GHz and a dielectric loss tangent of 0.0032 or less at a frequency of 10 GHz, but a thermal expansion coefficient of 3.3 ppm / °C or more.

[0009] To promote the development of 5G mobile communication systems that transmit large amounts of data and technologies that process large amounts of data at high speeds, there is a great need for the development of glass fiber cloth products that have low dielectric constants, low dielectric loss tangents, and low thermal expansion coefficients. [Prior art documents] [Patent documents]

[0010] [Patent Document 1] Taiwan Patent No. I363744 Summary of the Invention [Problem to be solved by the invention]

[0011] An object of the present invention is to provide a glass fiber cloth product having a low dielectric constant, a low dielectric loss tangent, and a low coefficient of thermal expansion, and a prepreg and a copper-clad laminate containing the glass fiber cloth product. [Means for solving the problem]

[0012] The present invention includes a glass fiber cloth and a silane coupling agent composition, The glass fiber cloth is a woven or woven fabric made of a plurality of glass fiber yarns, Each of the glass fiber yarns is formed from a glass fiber containing a glass composition, The thermal expansion coefficient of the glass composition is in the range of 2 ppm / °C to 3 ppm / °C, The glass composition has a dielectric constant measured at a frequency of 10 GHz within a range of 4 to 5; The glass composition has a dielectric loss tangent measured at a frequency of 10 GHz within a range of 0.0010 to 0.0040; the value of the dielectric constant, the value of the dielectric loss tangent, and the thermal expansion coefficient satisfy formula (1), Formula (1): 1.0≦1000×(Df / Dk)×(CTE) 2 ≦7.2 In the formula, Df is the dielectric loss tangent value, Dk is the dielectric constant value, and CTE is the coefficient of thermal expansion of the glass fiber cloth product.

[0013] The present invention also provides a prepreg comprising a resin composition, an inorganic filler, and the above-described glass fiber cloth product.

[0014] The present invention also provides a copper-clad laminate comprising the above prepreg. [Effects of the Invention]

[0015] According to the present invention, the glass fiber cloth product of the present invention has a low thermal expansion coefficient, a low dielectric constant, and a low dielectric loss tangent, mainly due to the design of the glass fiber cloth.Furthermore, the prepreg of the present invention and the copper-clad laminate containing the prepreg also have a low thermal expansion coefficient, a low dielectric constant, and a low dielectric loss tangent. DETAILED DESCRIPTION OF THE INVENTION

[0016] The present invention will be described in detail below.

[0017] The glass fiber cloth product of the present invention comprises a glass fiber cloth and a silane coupling agent composition.

[0018] Specifically, the glass fiber cloth product of the present invention is a surface-treated glass fiber cloth formed by treating the surface of a glass fiber cloth with a silane coupling agent composition.

[0019] The glass fiber cloth is a knitted or woven fabric made of a plurality of glass fiber threads, that is, the glass fiber cloth is produced by knitting or weaving a plurality of glass fiber threads.

[0020] Each glass fiber yarn is formed from glass fibers containing a glass composition.

[0021] The glass composition has a thermal expansion coefficient in the range of 2 ppm / °C to 3 ppm / °C, a dielectric constant measured at a frequency of 10 GHz in the range of 4 to 5, and a dielectric loss tangent measured at a frequency of 10 GHz in the range of 0.0010 to 0.0040, and the dielectric constant, dielectric loss tangent, and thermal expansion coefficient satisfy formula (1). Formula (1): 1.0≦1000×(Df / Dk)×(CTE) 2 ≦7.2 In the formula, Df is the value of the dielectric loss tangent, Dk is the value of the dielectric constant, and CTE is the coefficient of thermal expansion.

[0022] More specifically, glass fibers are formed by melting and spinning a glass composition, and glass fiber yarns are formed by sizing, winding, and twisting a plurality of glass fibers.

[0023] In some embodiments, the glass composition includes silicon dioxide (SiO), aluminum (III) oxide (AlO), calcium oxide (CaO), magnesium oxide (MgO), copper (II) oxide (CuO), and boron oxide (BO).

[0024] In some embodiments, the glass composition includes, where the total amount of the glass composition is 100 wt%, silicon dioxide has a content ranging from 50 wt% to 60 wt%, aluminum (III) oxide has a content ranging from 15 wt% to 22 wt%, calcium oxide has a content greater than 0 wt% and less than 6 wt%, magnesium oxide has a content greater than 0 wt% and less than 7 wt%, copper (II) oxide has a content greater than 0 wt% and less than 2 wt%, and boron oxide has a content greater than 10 wt% and less than 20 wt%.

[0025] When the glass composition contains the above-mentioned components, by controlling the amount of each component used in the glass composition within the above-mentioned range, the thermal expansion coefficient of the glass composition can be set within the range of 2 ppm / °C to 3 ppm / °C, the dielectric constant of the glass composition measured at a frequency of 10 GHz can be set within the range of 4 to 5, and the dielectric loss tangent of the glass composition measured at a frequency of 10 GHz can be set within the range of 0.0010 to 0.0040.

[0026] In the present invention, by controlling the content of silicon dioxide within the range of 50 wt % to 60 wt %, the viscosity of the glass composition can be further reduced, which is advantageous for the melting treatment of the glass composition.

[0027] By controlling the content of aluminum (III) oxide within the range of 15 wt% to 22 wt%, the viscosity of the glass composition can be further reduced, which is advantageous for the melting process of the glass composition, and crystallization is less likely to occur in the glass composition during the process of forming glass fibers, resulting in good spinning processability.

[0028] By controlling the calcium oxide content to more than 0 wt % and less than 6 wt %, the viscosity of the glass composition can be further reduced, which is advantageous for the melting process of the glass composition, and crystallization is less likely to occur in the glass composition during the process of forming glass fibers, resulting in good spinning processability and further reducing the thermal expansion coefficient of the glass composition.

[0029] By controlling the magnesium oxide content to more than 0 wt% and less than 7 wt%, the viscosity of the glass composition can be further reduced, which is advantageous for the melting process of the glass composition, and the structure of the glass composition can be further tightened, so that the glass composition and the glass fibers formed from the glass composition have the advantages of a low thermal expansion coefficient and a low dielectric constant.

[0030] By controlling the content of copper (II) oxide to more than 0 wt % and less than 2 wt %, the structure of the glass composition can be made more compact, the thermal expansion coefficient of the glass composition and the thermal expansion coefficient of the glass fiber formed from the glass composition can be reduced, and crystallization is less likely to occur in the glass composition during the process of forming the glass fiber, resulting in good spinnability.

[0031] By controlling the content of boron oxide to more than 10 wt % and less than 20 wt %, the viscosity of the glass composition can be further reduced, which is advantageous for the melt processing of the glass composition, and furthermore, crystallization is less likely to occur in the glass composition during the process of forming the glass fiber, resulting in good spinning processability. In addition, the structure of the glass composition can be made more compact, and the glass composition and the glass fiber formed from the glass composition have the advantages of a low thermal expansion coefficient, a low dielectric constant, and a low dielectric loss tangent.

[0032] In some embodiments, the glass composition further contains zinc oxide in an amount greater than 0 wt% and less than 8 wt%, based on a total amount of the glass composition being 100 wt%, in order to further reduce the thermal expansion coefficient of the glass composition and the glass fiber formed from the glass composition.

[0033] In some embodiments, the glass composition further contains fluorine in an amount of more than 0 wt% and not more than 1 wt%, based on the total amount of the glass composition being 100 wt%, in order to further reduce the viscosity of the glass composition, making it more advantageous for melt processing, and to impart a lower dielectric constant and a lower dielectric loss tangent to the glass composition.

[0034] In some embodiments, the glass composition further comprises other compositions of matter, including fluxes and impurities.

[0035] The flux reduces the melting point of the glass composition, which is beneficial for producing glass fibers at lower melting temperatures. In some embodiments, the flux is selected from the group consisting of sodium oxide (NaO) and potassium oxide (KO).

[0036] In some embodiments, the impurities are metal impurities, such as, but not limited to, iron (III) oxide (FeO).

[0037] In some embodiments, the other composition of matter is at least one selected from the group consisting of sodium oxide, potassium oxide, and iron (III) oxide.

[0038] In some embodiments, the content of the other substance composition is greater than 0 wt% and 1 wt% or less, relative to 100 wt% of the total amount of the glass composition.

[0039] The silane coupling agent composition is used to perform a surface treatment on the glass fiber cloth, thereby promoting the interaction between the surface-treated glass fiber cloth and the resin composition to obtain a prepreg.

[0040] In some embodiments, the silane coupling agent composition is at least one selected from the group consisting of an aminosilane coupling agent, an alkenylsilane coupling agent, and an acryloyloxysilane coupling agent.

[0041] In some embodiments, the content of the silane coupling agent composition is within the range of 0.1 wt% to 1.2 wt%, with the total amount of the glass fiber cloth product being 100 wt%.

[0042] When the content of the silane coupling agent composition is 0.1 wt% or more, there is good reactivity between the surface-treated glass fiber cloth and the resin composition, and good bonding properties are formed between the surface-treated glass fiber cloth and the resin composition.

[0043] By setting the content of the silane coupling agent composition to 1.2 wt% or less, the glass fiber cloth is prevented from being wrapped in an excessive amount of the silane coupling agent composition, thereby ensuring good impregnation of the resin composition into the glass fiber cloth product.

[0044] In the present invention, the glass composition has a low thermal expansion coefficient within a range of 2 ppm / °C to 3 ppm / °C, a low dielectric constant value within a range of 4 to 5 measured at a frequency of 10 GHz, and a low dielectric dissipation factor value within a range of 0.0010 to 0.0040 measured at a frequency of 10 GHz. Therefore, the glass fiber formed from the glass composition, the glass fiber yarn formed from the glass fiber, and the glass fiber cloth formed from the glass fiber yarn all have a low thermal expansion coefficient, low dielectric constant, and low dielectric dissipation factor. Therefore, the glass fiber cloth product mainly contains glass fiber cloth, and therefore similarly has a low thermal expansion coefficient, low dielectric constant, and low dielectric dissipation factor.

[0045] The present invention also provides a prepreg, which comprises a resin composition, an inorganic filler, and the above-described glass fiber cloth product.

[0046] In some embodiments, the resin composition is at least one selected from the group consisting of a phenolic resin, an epoxy resin, a polyphenylene ether resin, a bismaleimide triazine resin, a fluororesin, and a polyimide resin.

[0047] The inorganic filler is intended to increase the thermal conductivity of the prepreg and provide high-temperature resistance to a copper-clad laminate including the prepreg. In some embodiments, the inorganic filler is at least one selected from the group consisting of silicon dioxide (SiO) and aluminum(III) oxide (AlO). In some embodiments, the inorganic filler is silicon dioxide. The present invention also provides a copper-clad laminate comprising the above-described prepreg.

[0048] Examples of the present invention will now be described, and it should be understood that these examples are illustrative and explanatory and should not be construed as limiting the present invention. [Production Example 1] Glass composition A glass composition was obtained by mixing 58.1 wt% SiO2, 15.3 wt% Al2O3, 2.2 wt% CaO, 0.1 wt% MgO, 2.3 wt% ZnO, 1.5 wt% CuO, 19.5 wt% B2O3, 0.5 wt% F2, and 0.5 wt% other substances, mainly sodium oxide and potassium oxide, in a total amount of 100 wt%. [Production Examples 2 to 4 and Comparative Production Examples 1 to 2] Glass Compositions The glass compositions of Production Examples 2 to 4 and Comparative Production Examples 1 and 2 were obtained in a manner similar to that of Production Example 1, except that the contents of each component in the glass compositions were different, as shown in Table 1. [Example 1] Glass fiber cloth product, prepreg and copper clad laminate The glass composition of Production Example 3 was placed in a melting furnace and melted to form a molten glass liquid, which was then spun to obtain a plurality of glass fibers. The glass fibers were then sizing, winding, and twisting in this order to obtain a plurality of glass fiber yarns.

[0049] Some of the glass fiber yarns were used as warp yarns and the other glass fiber yarns were used as weft yarns. The warp yarns were subjected to warping and sizing processes and beaming processes to obtain a weaver's beam, which was then placed on an air jet loom (manufacturer: Toyota Industries Corporation, model number: JAT710) and interwoven with the weft yarns to form a glass fiber cloth.

[0050] The glass fiber cloth was then subjected to a desizing treatment and an opening treatment to obtain a glass fiber cloth ready for processing.

[0051] The glass fiber cloth to be treated was then immersed in a silane coupling agent composition to perform a surface treatment on the glass fiber cloth to be treated, thereby obtaining a glass fiber cloth to be dried.

[0052] The glass fiber cloth waiting to dry was subjected to a drying treatment to obtain a glass fiber cloth product having a thickness of 0.01 mm and containing 0.62 wt % of the silane coupling agent composition.

[0053] The silane coupling agent composition was produced by mixing an aminosilane coupling agent (type: (3-aminopropyl)trimethoxysilane) with an aqueous acetic acid solution to obtain a reaction solution, and then subjecting the reaction solution to a hydrolysis reaction for 30 minutes at a pH value in the range of 3.5 to 5.5.

[0054] The total amount of the reaction solution was taken as 100 wt %, and the content of the aminosilane coupling agent was 0.08 wt %.

[0055] Two glass fiber cloth products were impregnated in a resin solution containing an inorganic filler (silicon dioxide), a resin composition, and a solvent to obtain two impregnated glass fiber cloth products. The two impregnated glass fiber cloth products were then solidified in an environment of 190°C for 6 minutes to produce two partially solidified prepregs, each of which contained 83.4 wt% of the resin composition.

[0056] The resin composition is an epoxy resin (manufacturer: Nan Ya Plastics Corporation, Taiwan, model number: NPEB475 K70), the solvent is 1-methoxy-2-propanol, and the content of the resin composition is 60 wt% of the total amount of the resin solution, which is 100 wt%.

[0057] The two partially solidified prepregs were stacked one on top of the other to form a first laminate, and two 1 oz thick copper foil layers were attached to the top and bottom surfaces of the first laminate to form a second laminate. The second laminate was then placed in a vacuum press (manufacturer: VIGOR, model number: V8117A) set at 210°C and heat-pressed for 1.5 hours to form a copper clad laminate (CCL). [Examples 2 to 6] Glass fiber cloth products, prepregs, and copper-clad laminates In Examples 2 to 6, as shown in Table 2, glass fiber cloth products, prepregs, and copper-clad laminates were obtained in a manner similar to that of Example 1, except that the structure of the glass fiber cloth, the type of silane coupling agent composition, and the type of resin composition were different.

[0058] The structure of the glass fiber cloth was adjusted based on the diameter of a single warp fiber, the number of single warp fibers, the warp density, the diameter of a single weft fiber, the number of single weft fibers, and the weft density shown in Table 2.

[0059] When the silane coupling agent composition is an alkenyl silane coupling agent (vinyltrimethoxysilane), the content of the alkenyl silane coupling agent is 0.14 wt%, based on the total amount of the reaction solution containing the alkenyl silane coupling agent and the acetic acid aqueous solution being 100 wt%.

[0060] When the silane coupling agent composition is an acryloyloxysilane coupling agent (type: 3-methacryloxypropyltrimethoxysilane), the content of the acryloyloxysilane coupling agent is 0.10 wt%, relative to the total amount of the reaction solution containing the acryloyloxysilane coupling agent and the acetic acid aqueous solution being 100 wt%.

[0061] When the resin composition in the resin solution was polyphenylene ether resin (manufacturer: Saudi SABIC, model number: NORYL SA9000), the corresponding solvent used was methyl ethyl ketone, and the content of the resin composition was 65 wt% of the total amount of the resin solution, taken as 100 wt%. A partially solidified prepreg was obtained by solidifying it in an environment of 180°C for 4 minutes.

[0062] When the resin composition in the resin solution was bismaleimide triazine resin (manufacturer: Taiwan Prior Company Limited, model number: BT-0001), the corresponding solvent used was methyl ethyl ketone, and the content of the resin composition was 50 wt% of the total amount of the resin solution, which was taken as 100 wt%. A partially solidified prepreg was obtained by solidifying it in an environment of 210°C for 6 minutes. [Comparative Examples 1 to 6] Glass fiber cloth products, prepregs, and copper-clad laminates In Comparative Examples 1 to 6, as shown in Table 3, the glass composition of Comparative Manufacturing Example 2 was used, and glass fiber cloth products, prepregs, and copper-clad laminates were obtained in a manner similar to that of Example 1, except that the structure of the glass fiber cloth, the type of silane coupling agent composition, and the type of resin composition were different. [Evaluation items] The evaluation methods for each Production Example, each Production Comparative Example, each Example, and each Comparative Example will be explained below using Production Example 1 and Example 1. The evaluation results are shown in Tables 1 to 3. Thermal expansion coefficient: The glass composition of Production Example 1 was placed in a high-temperature furnace and heated at a temperature of 1500° C. to 1600° C. for 1 to 4 hours to obtain a completely melted molten glass liquid.

[0063] The molten glass liquid was poured into a graphite crucible having a diameter of 40 mm, and the graphite crucible was placed in an annealing furnace preheated to 800°C. The molten glass liquid was then cooled to room temperature (25°C) to obtain a glass block.

[0064] The glass block was cut and polished to obtain a sample measuring 0.5 cm x 0.5 cm x 2 cm.

[0065] Then, using a thermomechanical analyzer (manufacturer: Hitachi, model number: TMA71000), the sample was heated at a heating rate of 10°C / min, and the change in length of the sample at 50°C and 200°C was measured, and then the thermal expansion coefficient of the glass composition of Production Example 1 was calculated. The results are shown in Table 1. Measurement of dielectric constant and dielectric loss tangent values: The glass composition of Production Example 1 was placed in a high-temperature furnace and heated at a temperature of 1500°C to 1600°C for 1 to 4 hours to obtain a completely melted molten glass liquid. The molten glass liquid was then poured into a graphite crucible with a diameter of 40 mm, and the graphite crucible was placed in an annealing furnace preheated to 800°C. The molten glass liquid was then cooled to room temperature (25°C) to form a glass block.

[0066] The glass block was polished to obtain samples with thicknesses of 0.60 mm to 0.79 mm.

[0067] Then, the dielectric constant and dielectric loss tangent of the sample were measured at a frequency of 10 GHz using a vector network analyzer (ZNB20, manufactured by R&S, Germany) in combination with a split post dielectric resonator (Waveray Technology Co., Ltd., Taiwan), to obtain the dielectric constant and dielectric loss tangent of the glass composition of Production Example 1. Silane coupling agent composition content: In accordance with the measurement method in Section 4.4.8 of IPC-4412 (2006 edition), standard for knitted and woven fabrics composed of E-glass fiber for printed circuit boards, the glass fiber cloth product of Example 1 was cut into a plurality of samples each measuring 30 cm x 30 cm.

[0068] The samples were then placed on a stainless steel tray and baked in an oven (manufacturer: Dengyng, model number: DOS30) set at 105°C ± 5°C for 30 minutes, and then the samples were removed and cooled to obtain dry fiberglass cloth products. The dry fiberglass cloth products were weighed and recorded as W1.

[0069] The dried glass fiber cloth products were placed in a high-temperature oven (manufacturer: Great Tide Instrument Co., Ltd., Taiwan, model number: JH-01) set at a temperature of 625°C ± 5°C and heat-treated for 30 minutes, and then the dried glass fiber cloth products were removed and cooled to obtain a plurality of heat-treated glass fiber cloth products. The heat-treated glass fiber cloth products were weighed and recorded as W2.

[0070] Then, the content of the silane coupling agent composition in the glass fiber cloth product was calculated using the following formula (2). Formula (2): [(W1-W2) / W1]×100% Resin composition content: According to IPC-TM-650 2.3.16.1 (1994 edition) method for measuring resin content of prepreg, the glass fiber cloth product of Example 1 was weighed and recorded as X1, and the prepreg of Example 1 was weighed and recorded as X2. The content of the resin composition in the prepreg was calculated using the following formula (3). Formula (3): [(X2-X1) / X2]×100% Dimensional Stability Test for Copper Clad Laminate: In accordance with the measurement method for "Dimensional Stability, Glass-Reinforced Laminates" in IPC-TM-650 2.4.39 (1994 edition), four test holes were drilled at four corresponding positions on the copper-clad laminate of Example 1 using a drilling machine, and the longitudinal and lateral distances between the test holes before etching were measured using a coordinate measuring machine (manufacturer: OPTEK, USA, model number: 713VSA).

[0071] The copper foil on the copper-clad laminate of Example 1 was then completely etched to obtain a sample, which was then hung vertically in an oven and baked at 150°C ± 5°C for 2 hours, after which the sample was immediately placed in a drying box and cooled for 1 hour.

[0072] Finally, the sample was removed from the dry box and the longitudinal and lateral distances between the test holes were measured.

[0073] The warp and weft dimensional changes of the copper-clad laminate of Example 1 after etching and baking were calculated using the dimensional stability formula described in the measurement method for "Dimensional Stability, Glass-Reinforced Laminates" in IPC-TM-650 2.4.39 (1994 edition).

[0074] [Table 1]

[0075] [Table 2]

[0076] [Table 3]

[0077] As shown in Tables 1 to 3, the glass composition of Manufacturing Example 3 used in the glass fiber cloth products of Examples 1 to 6 has a low thermal expansion coefficient (2.68 ppm / °C), while the glass composition of Comparative Manufacturing Example 1 used in the glass fiber cloth products of Comparative Examples 1 to 6 has a high thermal expansion coefficient of 5.60 ppm / °C. Therefore, when the glass fiber cloth structure is the same, the copper-clad laminates of Examples 1 to 6 expand and contract to a lesser extent than the copper-clad laminates of Comparative Examples 1 to 6, and therefore have good dimensional stability, which can prevent the generation of defects such as distortion of inner layer circuit patterns and deviation of holes due to expansion and contraction when later manufacturing printed circuit boards.

[0078] The glass composition of Production Example 3 used in the glass fiber cloth products of Examples 1 to 6 has a dielectric constant value of 5 or less measured at a frequency of 10 GHz, a dielectric loss tangent value of 0.0040 or less measured at a frequency of 10 GHz, and a dielectric constant value of 0.0040 or less measured at a frequency of 10 GHz, and the dielectric loss tangent value is expressed by the formula (1) (1.0≦1000×(Df / Dk)×(CTE) 2 ≦7.2), the glass fiber cloth products of Examples 1 to 6 not only have a low thermal expansion coefficient, but also have the properties of a low dielectric constant and a low dielectric loss tangent, and can meet the demands of IC substrates and high-performance servers applied to 5th generation mobile communication systems that communicate large amounts of data and technologies that process large amounts of data at high speed.

[0079] The glass composition of Comparative Production Example 1 used in the glass fiber cloth products of Comparative Examples 1 to 6 has a dielectric constant of 6.74 measured at a frequency of 10 GHz, a dielectric loss tangent of 0.0065 measured at a frequency of 10 GHz, and a CTE of 1000×(Df / Dk)×(CTE). 2 The value obtained by the above calculation is 30.2, which does not satisfy the formula (1), and therefore the glass fiber cloth products of Comparative Examples 1 to 6 do not have the properties of having a low thermal expansion coefficient, a low dielectric constant, and a low dielectric loss tangent.

[0080] According to the above, the glass fiber cloth product of the present invention has a low thermal expansion coefficient, a low dielectric constant and a low dielectric loss tangent, mainly due to the design of the glass fiber cloth. Therefore, it can be used for IC substrates applied to 5th generation mobile communication systems that communicate large amounts of data and technologies that process large amounts of data at high speed, and for circuit boards with high dimensional stability and high-speed calculation and communication required by high-performance servers, and the object of the present invention can be reliably achieved.

[0081] Furthermore, the prepreg of the present invention and the copper-clad laminate containing the prepreg simultaneously have a low thermal expansion coefficient, a low dielectric constant, and a low dielectric loss tangent due to the inclusion of the glass fiber cloth product of the present invention, and are therefore applicable to IC substrates and high-performance servers used in fifth-generation mobile communication systems that communicate large amounts of data and technologies that process large amounts of data at high speed.

[0082] The above-described embodiments are illustrative for explaining the principles and effects of the present invention, and are not intended to limit the present invention. Those skilled in the art may make slight changes or modifications to the above-described embodiments without departing from the spirit and scope of the present invention. Therefore, all changes and modifications made by those skilled in the art without departing from the gist of the present invention should be considered to fall within the scope of protection of the present invention. [Industrial Applicability]

[0083] The glass fiber cloth product of the present invention can be used for IC substrates applied to 5th generation mobile communication systems that communicate large amounts of data and technologies that process large amounts of data at high speed, as well as circuit boards with high dimensional stability and high-speed computing and communication required by high-performance servers.

Claims

1. A glass fiber cloth and a silane coupling agent composition, The glass fiber cloth is a woven or woven fabric made of a plurality of glass fiber yarns, Each of the glass fiber yarns is formed from a glass fiber containing a glass composition, the thermal expansion coefficient of the glass composition is in the range of 2 ppm / °C to 3 ppm / °C; the glass composition has a dielectric constant measured at a frequency of 10 GHz in the range of 4 to 5; the glass composition has a dielectric loss tangent measured at a frequency of 10 GHz in the range of 0.0010 to 0.0040; the value of the dielectric constant, the value of the dielectric loss tangent, and the thermal expansion coefficient satisfy formula (1), Equation (1): 1.0 ≤ 1000 × (Df / Dk) × (CTE) 2 ≤7.2 where Df is the value of the dielectric loss tangent, Dk is the value of the dielectric constant, and CTE is the coefficient of thermal expansion of the glass fiber cloth product.

2. The glass composition is, with the total amount of the glass composition being 100 wt %, Silicon dioxide having a content in the range of 50 wt% to 60 wt%; aluminum (III) oxide having a content in the range of 15 wt % to 22 wt %; Calcium oxide having a content of more than 0 wt% and less than 6 wt%; Magnesium oxide having a content of more than 0 wt% and less than 7 wt%; Copper (II) oxide having a content of more than 0 wt % and less than 2 wt %; 2. The fiberglass cloth product of claim 1, further comprising: a boron oxide content of greater than 10 wt% and less than 20 wt%.

3. 3. The glass fiber cloth product according to claim 2, wherein the glass composition further contains zinc oxide in a content of more than 0 wt% and less than 8 wt%, with the total amount of the glass composition being 100 wt%.

4. 3. The glass fiber cloth product according to claim 2, wherein the glass composition further contains fluorine in an amount exceeding 0 wt% and not more than 1 wt%, with the total amount of the glass composition being 100 wt%.

5. 3. The fiberglass cloth product of claim 2, wherein the glass composition further comprises at least one other substance selected from the group consisting of sodium oxide, potassium oxide, and iron (III) oxide.

6. 2. The glass fiber cloth product according to claim 1, wherein the silane coupling agent composition is at least one selected from the group consisting of aminosilane coupling agents, alkenylsilane coupling agents, and acryloyloxysilane coupling agents.

7. 2. The glass fiber cloth product according to claim 1, wherein the content of the silane coupling agent composition is in the range of 0.1 wt % to 1.2 wt % based on the total amount of the glass fiber cloth product being 100 wt %.

8. A prepreg comprising a resin composition, an inorganic filler, and the glass fiber cloth product according to any one of claims 1 to 7.

9. 9. The prepreg according to claim 8, wherein the resin composition is at least one selected from the group consisting of phenolic resin, epoxy resin, polyphenylene ether resin, bismaleimide triazine resin, fluororesin, and polyimide resin.

10. A copper clad laminate comprising the prepreg of claim 8.

11. A copper clad laminate comprising the prepreg of claim 9.

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