Electronic component and apparatus

Abstract

To provide a technique advantageous for further reducing the occurrence of ghost caused by a conductive wire.SOLUTION: An electronic component comprises: a support substrate; a photoelectric conversion substrate fixed to the support substrate; and an optical member arranged to face the photoelectric conversion substrate. The photoelectric conversion substrate includes a principal surface including a photoelectric conversion region in which a plurality of photoelectric conversion elements are arranged, and a peripheral region in which a first electrode is arranged. The first electrode is connected to a second electrode arranged on the support substrate via a conductive wire. A first portion of the conductive wire arranged on the photoelectric conversion substrate includes one or more bent parts. The conductive wire is arranged within a range of 200 μm or less from a surface of the first electrode in the normal direction of the surface. In a portion of the first portion from the first electrode to a first height, the maximum angle relative to the normal direction is 30° or less. Here, the first height is 1 / 2 of the maximum height from the surface of the conductive wire in the normal direction.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to electronic components and devices. [Background technology]

[0002] Patent Document 1 discloses a solid-state imaging device including a solid-state imaging element, a transparent plate disposed opposite the solid-state imaging element, and bonding wires connected to electrodes disposed around the optical imaging surface of the solid-state imaging element. Patent Document 1 also discloses design guidelines for suppressing ghosts that occur when incident light is reflected by the bonding wires, and the reflected light is further reflected by the transparent plate and enters the optical imaging surface. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 5-275668 Summary of the Invention [Problem to be solved by the invention]

[0004] An object of the present invention is to provide a technique that is advantageous in further suppressing the occurrence of ghosts caused by conductive wires. [Means for solving the problem]

[0005] In view of the above problems, an electronic component according to an embodiment of the present invention is an electronic component comprising a support substrate, a photoelectric conversion substrate fixed to the support substrate, and an optical element arranged opposite the photoelectric conversion substrate, wherein the photoelectric conversion substrate has a main surface including a photoelectric conversion region in which a plurality of photoelectric conversion elements are arranged and a peripheral region in which a first electrode is arranged, the first electrode being connected to a second electrode arranged on the support substrate via a conductive wire, a first portion of the conductive wire arranged on the photoelectric conversion substrate having one or more bends, the conductive wire being arranged in a range of 200 μm or less from the surface in a normal direction to the surface of the first electrode, and a portion of the first portion from the first electrode to a first height having a maximum angle with respect to the normal direction of 30° or less, wherein the first height is 1 / 2 of the maximum height of the conductive wire from the surface in the normal direction. [Effects of the Invention]

[0006] According to the present invention, it is possible to provide a technique that is advantageous for further suppressing the occurrence of ghosts caused by conductive wires. [Brief explanation of the drawings]

[0007] [Figure 1] FIG. 1 is a cross-sectional view showing a configuration example of an electronic component according to an embodiment of the present invention. [Figure 2] FIG. 2 is a top view showing a configuration example of the electronic component shown in FIG. 1. [Figure 3] 10A and 10B are diagrams illustrating the occurrence of ghosts caused by conductive wires. [Figure 4] 10A and 10B are diagrams illustrating the occurrence of ghosts caused by conductive wires. [Figure 5] FIG. 2 is a cross-sectional view showing a configuration example of the electronic component of FIG. 1. [Figure 6] FIG. 2 is a cross-sectional view showing a configuration example of the electronic component of FIG. 1. [Figure 7] FIG. 2 is a cross-sectional view showing a configuration example of the electronic component of FIG. 1. [Figure 8] FIG. 2 is a cross-sectional view showing a configuration example of the electronic component of FIG. 1. [Figure 9] FIG. 2 is a cross-sectional view showing a configuration example of the electronic component of FIG. 1. [Figure 10] FIG. 2 is a cross-sectional view showing a modified example of the electronic component of FIG. [Figure 11] FIG. 11 is a top view showing a configuration example of the electronic component of FIG. [Figure 12] FIG. 2 is a diagram showing an example of the configuration of a device incorporating the electronic component of FIG. 1. DETAILED DESCRIPTION OF THE INVENTION

[0008] Hereinafter, embodiments will be described in detail with reference to the accompanying drawings. Note that the following embodiments do not limit the scope of the invention claimed. Although multiple features are described in the embodiments, not all of these multiple features are necessarily essential to the invention, and multiple features may be combined arbitrarily. Furthermore, in the accompanying drawings, the same reference numerals are used to designate the same or similar components, and redundant explanations will be omitted.

[0009] In the following description, terms indicating specific directions or positions (for example, "upper," "lower," "right," "left," and other terms including these terms) are used as necessary. The use of these terms is for the purpose of facilitating understanding of the embodiments with reference to the drawings, and the meanings of these terms do not limit the technical scope of the present invention.

[0010] In this specification, the term "planar view" refers to a view perpendicular to the light incident surface of the semiconductor layer included in the photoelectric conversion substrate. The term "cross-sectional view" refers to a view of a cross section perpendicular to the light incident surface of the semiconductor layer. When the light incident surface of the semiconductor layer is rough when viewed microscopically, the planar view is defined based on the light incident surface of the semiconductor layer when viewed macroscopically.

[0011] As used herein, expressions such as "A or B," "at least one of A and B," "at least one of A or / and B," and "one or more of A or / and B" can include all possible combinations of the listed items, unless expressly defined otherwise. That is, the above expressions are understood to disclose all cases, such as cases including at least one A, cases including at least one B, and cases including both at least one A and at least one B. This also applies to combinations of three or more elements.

[0012] Furthermore, the disclosure of this specification includes the complement of the concepts described in this specification. In other words, if this specification contains a statement that "A is greater than B," even if the statement that "A is not greater than B" is omitted, it can be said that this specification discloses that "A is not greater than B." This is because when a statement that "A is greater than B" is made, it is assumed that the case in which "A is not greater than B" is taken into consideration.

[0013] An electronic component according to an embodiment of the present disclosure will be described with reference to Figures 1 to 11. Figure 1 is a cross-sectional view showing an example configuration of an electronic component 100 according to this embodiment. The electronic component 100 includes a support substrate 101, a photoelectric conversion substrate 104 fixed to the support substrate 101, and an optical member 103 disposed to face the photoelectric conversion substrate 104. The support substrate 101 and the optical member 103 are bonded via a frame 102.

[0014] The support substrate 101 may be primarily made of ceramic, such as alumina or aluminum nitride. Alternatively, the support substrate 101 may be primarily made of a material containing a resin, such as glass epoxy. When the support substrate 101 is made of ceramic, it has high thermal conductivity, which is advantageous in terms of heat dissipation. When the support substrate 101 is made of a material containing a resin, such as glass epoxy, it is advantageous in terms of weight reduction.

[0015] The frame body 102 may be made of, for example, ceramic such as alumina or aluminum nitride, glass epoxy, resin material, or metal material, similar to the support substrate 101. When the same material is used for the support substrate 101 and the frame body 102, such as when both the support substrate 101 and the frame body 102 are ceramic, the support substrate 101 and the frame body 102 may be formed as a single constituent material having a recessed shape. That is, although the support substrate 101 and the frame body 102 are shown as separate bodies in the configuration shown in FIG. 1 , the support substrate 101 and the frame body 102 may be integral. Furthermore, when different materials are used for the support substrate 101 and the frame body 102, from the viewpoint of the bonding reliability between the support substrate 101 and the frame body 102, for example, materials having similar linear expansion coefficients may be selected as the materials for the support substrate 101 and the frame body 102.

[0016] The optical member 103 may be made of, for example, glass, quartz, sapphire, or the like. When quartz or sapphire is used for the optical member 103, the optical member 103 may also function as a low-pass filter (LPF) that transmits light below a predetermined wavelength. Sapphire has higher strength than quartz, allowing the optical member 103 to be thinner than when quartz is used. Therefore, using sapphire for the optical member 103 is advantageous for miniaturizing the entire electronic component 100. Furthermore, since the linear expansion coefficient of sapphire is similar to that of alumina, if the frame 102 is made of alumina, using sapphire for the optical member 103 can improve adhesion reliability. The optical member 103 may be coated with an anti-reflection coating, an infrared-blocking coating, or the like. To suppress light reflection, an anti-reflection coating may be applied to both the surface of the optical member 103 facing the photoelectric conversion substrate 104 and the surface opposite the surface.

[0017] The photoelectric conversion substrate 104 has a main surface 120 including a photoelectric conversion region 105 in which a plurality of photoelectric conversion elements are arranged and a peripheral region 106 in which an electrode 107 is arranged. The electrode 107 is connected to an electrode 108 arranged on the support substrate 101 via a conductive wire 109. In this embodiment, the photoelectric conversion substrate 104 is fixed to the main surface of the support substrate 101 on which the electrode 108 is arranged. Therefore, the electrode 107 is arranged closer to the optical member 103 than the electrode 108. The photoelectric conversion substrate 104 may be a semiconductor substrate made of, for example, silicon. The photoelectric conversion region 105 is provided in the center of the photoelectric conversion substrate 104 in a plan view, and has a plurality of photoelectric conversion elements arranged in an array. The photoelectric conversion elements may be, for example, normal photodiodes or avalanche photodiodes. When the photoelectric conversion element is an avalanche photodiode, the avalanche photodiode may function as a single photon avalanche diode (SPAD) that detects weak signals at a single photon level at high speed.

[0018] FIG. 2 is a plan view of electronic component 100 of this embodiment, viewed from the optical member 103 side. Photoelectric conversion region 105 of photoelectric conversion substrate 104 is disposed in the center of electronic component 100. Photoelectric conversion substrate 104 may be rectangular as shown in FIG. 2. Photoelectric conversion region 105 may also be rectangular. A peripheral region 106 in which multiple electrodes 107 are disposed is disposed around photoelectric conversion region 105. Multiple conductive wires 109 are provided to electrically connect multiple electrodes 107 to multiple electrodes 108 disposed on support substrate 101. Here, assuming that the longitudinal length of electronic component 100 is x and the lateral length is y, electronic component 100 is assumed to have both x and y being approximately 10 mm to 60 mm. However, the size of electronic component 100 is not limited to this.

[0019] In electronic component 100 equipped with photoelectric conversion substrate 104 having a photoelectric conversion element, a phenomenon called wire ghosting may occur in which externally incident light strikes conductive wire 109, is reflected, enters the photoelectric conversion element, and is reflected in an image. Conductive wire 109 is generally made of metal such as gold, silver, aluminum, copper, or an alloy of these, and therefore is prone to reflecting light.

[0020] Figure 3 and Figures 4(a) to 4(f) are cross-sectional schematic diagrams illustrating the wire ghost phenomenon. Figure 3 shows how incident light 110, which enters from above the optical element 103, hits the conductive wire 109 and is reflected. Strictly speaking, the path of the incident light 110 passing through the optical element 103 changes depending on the refractive index of the optical element 103, but for simplicity of explanation, the incident light is illustrated as a straight line. Figures 4(a) to 4(f) are enlarged views of the vicinity of the conductive wire 109 shown in Figure 3.

[0021] 4(a) shows a state in which conductive wire 109 rises from electrode 107 at an angle of θ=15° toward the outside of photoelectric conversion substrate 104, where θ is the angle formed between the normal direction to the surface of electrode 107 and conductive wire 109. Here, the surface of electrode 107 may be a plane parallel to main surface 120 of photoelectric conversion substrate 104 or a plane parallel to the semiconductor layer that constitutes photoelectric conversion substrate 104. Furthermore, although each figure in this specification depicts the surface of electrode 107 and main surface 120 of photoelectric conversion substrate 104 as being at the same height, electrode 107 may protrude or be recessed by several μm from main surface 120 of photoelectric conversion substrate 104.

[0022] Incident light 110 that strikes the portion of conductive wire 109 at θ=15° is reflected and enters photoelectric conversion substrate 104, but the reflected light is incident at a position close to electrode 107. FIG. 4(b) shows a state in which conductive wire 109 stands up from electrode 107 at an angle of θ=30° on the outside of photoelectric conversion substrate 104. Incident light 110 that strikes the portion of conductive wire 109 at θ=30° is reflected and enters photoelectric conversion substrate 104, but the reflected light is incident at a position farther from electrode 107 than in the case of θ=15° shown in FIG. 4(a). FIG. 4(c) shows a state in which conductive wire 109 stands up from electrode 107 on the outside of photoelectric conversion substrate 104 at an angle of θ=45°. Incident light 110 that strikes the conductive wire 109 at a portion where θ=45° is reflected and travels toward the optical element 103, where it is reflected again by the surface of the optical element 103 facing the photoelectric conversion substrate 104 and is incident on the photoelectric conversion substrate 104. In this case, the reflected light is incident at a position farther from the electrode 107 than in the case of θ=30° shown in FIG. 4(b). Strictly speaking, the reflected light travels to the surface of the optical element 103 opposite the surface facing the photoelectric conversion substrate 104, and some components are reflected at that surface, but this is not shown in FIG. 4(c) because it is weaker than the light reflected by the surface facing the photoelectric conversion substrate 104.

[0023] FIG. 4(d) shows a state in which the conductive wire 109 rises from the electrode 107 at θ=0° (the normal direction to the surface of the electrode 107) and then bends at θ=60° so as to tilt outward from the photoelectric conversion substrate 104. Incident light 110 that strikes the portion of the conductive wire 109 at θ=60° is reflected toward the optical element 103, reflected again by the surface of the optical element 103 facing the photoelectric conversion substrate 104, and then enters the photoelectric conversion substrate 104. In this case, the reflected light is incident at a position closer to the electrode 107 than in the case of θ=45° shown in FIG. 4(c). FIG. 4(e) shows a state in which the conductive wire 109 rises from the electrode 107 at θ=0° and then bends at θ=75° so as to tilt outward from the photoelectric conversion substrate 104. Incident light 110 that strikes the conductive wire 109 at a θ=75° angle is reflected toward the optical element 103, reflected again by the surface of the optical element 103 facing the photoelectric conversion substrate 104, and then incident on the photoelectric conversion substrate 104. In this case, the reflected light strikes a position closer to the electrode 107 than in the case shown in FIG. 4(d) where the conductive wire 109 rises from the electrode 107 at θ=0° and bends at θ=60°. FIG. 4(f) shows the conductive wire 109 rising from the electrode 107 at θ=0° and then tracing an arc with a curvature radius R=0.1 mm toward the outside of the photoelectric conversion substrate 104. Incident light 110 that strikes the R-shaped bend of the conductive wire 109 is scattered at various angles depending on the position on the bend. Therefore, the reflected light is divided into a component that strikes the photoelectric conversion substrate 104 directly and a component that reflects off the optical element 103 at various angles and then strikes various positions on the photoelectric conversion substrate 104.

[0024] From the results shown in Figures 4(a) to 4(f), when the conductive wire 109 has a portion at an angle of approximately θ = 45° relative to the normal direction of the surface of the electrode 107, the amount of light incident on the photoelectric conversion substrate 104 at a position distant from the conductive wire 109 increases. As a result, the possibility of more light being incident on the photoelectric conversion region 105 where multiple photoelectric conversion elements are arranged increases. Therefore, the possibility of the wire ghost phenomenon occurring increases. Furthermore, the higher the height of the conductive wire 109 rising from the surface of the electrode 107, the more light is likely to be incident at a position distant from the conductive wire 109. Furthermore, the greater the distance between the photoelectric conversion substrate 104 and the optical member 103, the more light is likely to be incident at a position distant from the conductive wire 109. Whether the wire ghost phenomenon occurs due to light reflected by the conductive wire 109 being incident at a position close to the conductive wire 109 depends on the distance from the electrode 107 to the photoelectric conversion region 105. Furthermore, whether or not the wire ghost phenomenon occurs due to light reflected by the conductive wire 109 being incident at a position far from the conductive wire 109 is further related to the size of the photoelectric conversion region 105 .

[0025] Hereinafter, a configuration for suppressing the occurrence of the wire ghost phenomenon by allowing light reflected by the conductive wire 109 to be incident at a position close to the conductive wire 109 will be described. FIGS. 5(a) to 5(d) are schematic diagrams focusing on the conductive wire 109 of the electronic component 100. As shown in FIGS. 5(a) to 5(d), the maximum height of the conductive wire 109 from the electrode 107 in the direction normal to the surface of the electrode 107 is defined as height h. Furthermore, the height from the surface of the electrode 107 (or the main surface 120 of the photoelectric conversion substrate 104) to the optical member 103 in the normal direction is defined as height H. A portion 130 of the conductive wire 109 disposed on the photoelectric conversion substrate 104 includes one or more bent portions 131. In this case, the maximum angle θ1 with respect to the direction normal to the surface of the electrode 107 may be 30° or less for a portion of the portion 130 of the conductive wire 109 up to at least height h / 2 from the electrode 107. The height h / 2 refers to half the maximum height h of conductive wire 109 from electrode 107 in the normal direction to the surface of electrode 107. When angle θ1 is 30° or less, light that strikes and is reflected from the portion of portion 130 of conductive wire 109 that is inclined at θ=30° is incident on photoelectric conversion substrate 104 without being reflected toward optical member 103.

[0026] Although it depends on the position of the conductive wire 109 and the design of the optical system that directs light into the electronic component 100, as shown in FIGS. 3 and 4(a) to 4(f), light is incident on the conductive wire 109 at an angle of, for example, 10° to 20° with respect to the normal to the surface of the electrode 107. In this case, light that strikes a portion 130 of the conductive wire 109 that rises from the electrode 107 at an angle of θ=30° and is reflected is incident at a position approximately 100 μm to 400 μm from the electrode 107, depending on the height (length) of the portion. Meanwhile, the length between the electrode 107 and the photoelectric conversion region 105 can be, for example, approximately 500 μm to 1500 μm. Therefore, light that strikes the portion 130 of the conductive wire 109 that is tilted at θ=30° and is reflected is incident on the peripheral region 106 of the photoelectric conversion substrate 104 without being reflected toward the optical member 103. As a result, the occurrence of the wire ghost phenomenon can be suppressed.

[0027] Furthermore, the portion 130 of the conductive wire 109 from the electrode 107 to the bent portion 131 closest to the electrode 107 may be disposed along the normal direction to the surface of the electrode 107 (θ1 = 0°), or may be disposed so as to be inclined toward the photoelectric conversion region 105. This allows light that strikes the conductive wire 109 and is reflected to be incident on the photoelectric conversion substrate 104 at a position closer to the conductive wire 109, thereby suppressing the wire ghost phenomenon. Furthermore, since the distance from the electrode 107 to the photoelectric conversion region 105 can be shortened, the electronic component 100 (photoelectric conversion substrate 104) can be made smaller.

[0028] The higher the height h of the conductive wire 109, the greater the portion that reflects incident light. Therefore, a lower height h is preferable. For example, the conductive wire 109 may be disposed within a range of 200 μm or less from the surface of the electrode 107 in the normal direction to the surface of the electrode 107 (h≦200 μm). Furthermore, when the height h of the conductive wire 109 is the same, the higher the height H, the more likely light reflected by the conductive wire 109 and the optical member 103 is to be incident at a position farther from the electrode 107. Therefore, if the height H is large, reflected light may be incident on the photoelectric conversion region 105, potentially causing a wire ghost phenomenon. Therefore, the height h may be 3 / 4 or more of the height H (h≧0.75H).

[0029] In the configuration shown in FIG. 5(a), the conductive wire 109 rises from the electrode 107 to a height h / 2 at an angle θ1≦30° so as to be inclined toward the photoelectric conversion region 105, a bent portion 131 is provided at the height h / 2, and extends toward the end of the photoelectric conversion substrate 104. In the configuration shown in FIG. 5(b), the conductive wire 109 rises from the electrode 107 to a height h / 2 at an angle θ1≦30° so as to be inclined toward the end of the photoelectric conversion substrate 104, a bent portion 131 is provided at the height h / 2, and extends toward the end of the photoelectric conversion substrate 104. Of the portion 130 of the conductive wire 109 arranged on the photoelectric conversion substrate 104, a portion farther from the electrode 107 than the bent portion 131 may be arranged so as to be farther from the main surface 120 of the photoelectric conversion substrate 104 as it moves away from the bent portion 131, as shown in FIGS. 5(a) and 5(b). In this case, as described above, if a portion of portion 130 of conductive wire 109 that is farther from electrode 107 than bent portion 131 forms an angle of approximately 45° with respect to the normal to the surface of electrode 107, light reflected at that portion will be re-reflected by optical element 103. Furthermore, light reflected by optical element 103 may be incident on photoelectric conversion substrate 104 at a position farther from conductive wire 109. Therefore, the angle of portion 130 of conductive wire 109 that is farther from electrode 107 than bent portion 131 with respect to the normal to the surface of electrode 107 does not have to be in the range of 40° or more and 50° or less. In other words, the angle of portion 130 of conductive wire 109 that is farther from electrode 107 than bent portion 131 with respect to the normal to the surface of electrode 107 may be greater than 50° and less than 90°. Furthermore, for example, a portion of portion 130 of conductive wire 109 that is farther from electrode 107 than bent portion 131 may have an angle greater than 0° and less than 40° with respect to the normal to the surface of electrode 107. The description of the angle of portion 130 of conductive wire 109 that is farther from electrode 107 than bent portion 131 can also be applied to the portion of conductive wire 109 from bent portion 131 to height h.

[0030] 5(a) and 5(b), the absolute value of the angle θ1, the height h, and the length from the electrode 107 to the portion of the conductive wire 109 at height h in a planar view are the same. In this case, the angle of the portion of the conductive wire 109 from height h / 2 (bent portion 131) to height h relative to the normal to the surface of the electrode 107 is larger in the shape shown in FIG. 5(a). In other words, the portion of the conductive wire 109 from height h / 2 (bent portion 131) to height h is closer to being horizontal to the surface of the electrode 107 (the main surface 120 of the photoelectric conversion substrate 104). Therefore, incident light that strikes the portion of the conductive wire 109 from the bent portion 131 to height h is reflected by the conductive wire 109, further reflected again by the optical member 103, and then enters a position close to the portion reflected by the conductive wire 109. That is, the configuration shown in FIG. 5(a) can more effectively suppress the occurrence of the wire ghost phenomenon than the configuration shown in FIG. 5(b).

[0031] In the configurations shown in FIGS. 5(c) and 5(d), the bent portion 131 closest to the electrode 107 is located at a position greater than height h / 2 from the surface of the electrode 107. The bent portion 131 can also be said to be located between height h / 2 and height h. In the configuration shown in FIG. 5(c), the conductive wire 109 rises from the electrode 107 to the bent portion 131 at an angle θ1≦30° so as to be inclined toward the photoelectric conversion region 105, and extends from the bent portion 131 toward the edge of the photoelectric conversion substrate 104. In the configuration shown in FIG. 5(d), the conductive wire 109 rises from the electrode 107 to the bent portion 131 at an angle θ1≦30° so as to be inclined toward the edge of the photoelectric conversion region 105, and extends from the bent portion 131 toward the edge of the photoelectric conversion substrate 104. 5(c) and 5(d), the angle of portion 130 of conductive wire 109 that is farther from electrode 107 than bent portion 131 with respect to the normal to the surface of electrode 107 does not have to be in the range of 40° to 50°. In other words, the angle of portion 130 of conductive wire 109 that is farther from electrode 107 than bent portion 131 with respect to the normal to the surface of electrode 107 may be greater than 50° and less than 90°. Furthermore, for example, the angle of portion 130 of conductive wire 109 that is farther from electrode 107 than bent portion 131 with respect to the normal to the surface of electrode 107 may be greater than 0° and less than 40°.

[0032] 5(c) and 5(d), let us consider a case where the absolute value of angle θ1, the height at which bent portion 131 is located, height h, and the length from electrode 107 to the portion of conductive wire 109 at height h in a planar view are all the same. In this case, the angle of the portion of conductive wire 109 from bent portion 131 to height h with respect to the normal to the surface of electrode 107 is larger in the shape shown in FIG. 5(c). In other words, the portion of conductive wire 109 from bent portion 131 to height h is closer to being horizontal to the surface of electrode 107 (main surface 120 of photoelectric conversion substrate 104). Therefore, incident light that strikes the portion of conductive wire 109 from bent portion 131 to height h is reflected by conductive wire 109, further reflected again by optical member 103, and then enters a position close to the portion reflected by conductive wire 109. That is, the configuration shown in FIG. 5(c) can more effectively suppress the occurrence of the wire ghost phenomenon than the configuration shown in FIG. 5(d).

[0033] Furthermore, from the same viewpoint, the configuration shown in Fig. 5(c) can suppress the occurrence of the wire ghost phenomenon more effectively than the configuration shown in Fig. 5(a). Furthermore, the configuration shown in Fig. 5(d) can suppress the occurrence of the wire ghost phenomenon more effectively than the configuration shown in Fig. 5(b). Since light striking a portion of the conductive wire 109 that is farther from the electrode 107 than the bent portion 131 is incident at a position close to the portion reflected by the conductive wire 109, it is preferable to position the bent portion 131 closest to the electrode 107 at a position close to the height h.

[0034] 6(a) to 6(d) are diagrams showing modified shapes of the conductive wire 109. Figures 6(a) to 6(d) show an example in which two bent portions, 131 and 132, are arranged in a portion 130 of the conductive wire 109 arranged on the photoelectric conversion substrate 104.

[0035] In the configuration shown in FIG. 6( a), the conductive wire 109 rises from the electrode 107 to a bent portion 131 located at a height h / 2, tilting toward the photoelectric conversion region 105 at an angle θ1≦30°. The conductive wire 109 then bends toward the end of the photoelectric conversion substrate 104 at the bent portion 131 and extends from the bent portion 131 to the bent portion 132 at an angle θ2 relative to the normal to the surface of the electrode 107. The conductive wire 109 then bends at the bent portion 132 and extends toward the end of the photoelectric conversion substrate 104. As described above, if the portion of the conductive wire 109 from the bent portion 131 to the bent portion 132 has an angle θ2 of approximately 45° relative to the normal to the surface of the electrode 107, light reflected at that portion is re-reflected by the optical element 103. Furthermore, the light reflected by the optical element 103 may be incident on the photoelectric conversion substrate 104 at a position away from the conductive wire 109. The portion 130 of the conductive wire 109 from the bent portion 131 to the bent portion 132 is arranged so that the distance from the bent portion 131 increases as the distance from the bent portion 131 increases from the main surface 120 of the photoelectric conversion substrate 104. In this case, the angle θ2 of the portion of the conductive wire 109 from the bent portion 131 to the bent portion 132 with respect to the normal to the surface of the electrode 107 does not have to be in the range of 40° or more and 50° or less. That is, the angle θ2 of the portion of the conductive wire 109 from the bent portion 131 to the bent portion 132 with respect to the normal to the surface of the electrode 107 may be 0° or more and less than 40°, or may be greater than 50° and less than 90°. The occurrence of the wire ghost phenomenon can be more effectively suppressed by setting the angle θ2 closer to 0° or closer to 90°. The same applies to the portion of the conductive wire 109 from the bent portion 132 to the height h. In other words, the portion of the conductive wire 109 from the bent portion 132 to the height h can have an angle similar to that of the portion of the conductive wire 109 that is farther from the electrode 107 than the bent portion 131, as described using Figures 5(a) to 5(d).

[0036] In the configuration shown in FIG. 6(b), the conductive wire 109 rises from the electrode 107 to the bent portion 131 located at a height h / 2, with θ1≦30° so as to be inclined toward the end of the photoelectric conversion substrate 104. The portion of the conductive wire 109 from the bent portion 131 to a height h may be similar to the configuration shown in FIG. 6(a). In the configurations shown in FIGS. 6(c) and 6(d), the bent portion 131 closest to the electrode 107 is located at a position farther away from the surface of the electrode 107 than a height h / 2. In other words, the bent portion 131 is located between the height h / 2 and the height h. The configurations shown in FIGS. 6(c) and 6(d) may be similar to the configurations shown in FIGS. 6(a) and 6(b) except for the position of the bent portion 131.

[0037] 6(a) to 6(d), it is also preferable that the bent portion 131 closest to the electrode 107 be located at a position close to the height h. Furthermore, in the configurations shown in FIGS. 6(a) to 6(d), the bent portion 132 is located at a position less than the height h. Therefore, the portion 130 of the conductive wire 109 located on the photoelectric conversion substrate 104 that is farther from the electrode 107 than the bent portion 132 is located so as to move away from the main surface 120 of the photoelectric conversion substrate 104 as it moves away from the bent portion 132, but this is not limiting. The bent portion 132 may also be located at a height h. In this case, the portion 130 of the conductive wire 109 that is farther from the electrode 107 than the bent portion 132 may extend at an angle of 90° with respect to the normal to the surface of the electrode 107, or may be located so as to move closer to the main surface 120 of the photoelectric conversion substrate 104 as it moves away from the bent portion 132.

[0038] Furthermore, three or more bent portions may be arranged in the portion 130 of the conductive wire 109 arranged on the photoelectric conversion substrate 104. In this case, the conductive wire 109 rises from the electrode 107 to the bent portion 131 closest to the electrode 107 at θ1≦30°. If the conductive wire 109 is then arranged to move away from the main surface 120 of the photoelectric conversion substrate 104 as it moves away from the bent portion 131 until it reaches a height h, the conductive wire 109 may be formed so that the angle with respect to the normal to the surface of the electrode 107 is not in the range of 40° to 50°. This can suppress the occurrence of the wire ghost phenomenon.

[0039] FIG. 7 shows an example in which the portion 130 of the conductive wire 109 disposed on the photoelectric conversion substrate 104 includes an R-shaped bent portion 131. In the configuration shown in FIG. 7, the bent portion 131 closest to the electrode 107 has an R-shape, but this is not limiting. For example, the bent portion 132 shown in FIGS. 6(a) to 6(d) may also have an R-shape. Furthermore, as shown in FIG. 7, the R-shape of the bent portion 131 may include a portion positioned at a height h in the normal direction from the surface of the electrode 107. As shown in FIG. 4(f), light that strikes the R-shaped bent portion is scattered at various angles depending on the position where it strikes. Therefore, the reflected light is divided into a component that directly strikes the photoelectric conversion substrate 104 and a component that reflects off the optical member 103 at various angles and then strikes various positions on the photoelectric conversion substrate 104. As a result, the occurrence of the wire ghost phenomenon can be suppressed.

[0040] Furthermore, when a bent portion such as bent portion 131 has an R-shape, the radius of curvature of the R-shape may be made as small as possible so that less light hits the R-shaped bent portion. For example, it has been experimentally found that the occurrence of wire ghosting can be significantly suppressed by making the radius of curvature R 0.16 mm or less. The radius of curvature R of the R-shape may be 0.15 mm or less, 0.13 mm or less, or even 0.12 mm or less.

[0041] 8, 9(a), and 9(b) are diagrams illustrating modified examples of the arrangement positions of the electrodes 108 disposed on the support substrate 101. In each of the above-described embodiments, the electrodes 108 disposed corresponding to each side of the photoelectric conversion substrate 104 are disposed at positions the same length from the edge of the photoelectric conversion substrate 104. For example, as shown in FIG. 2, the electrodes 108 corresponding to each of the four sides of the photoelectric conversion substrate 104 may all be disposed at positions the same length from the edge of the photoelectric conversion substrate 104. On the other hand, in the configuration shown in FIGS. 8, 9(a), and 9(b), the electrode 108a is disposed at a position L1 from the edge of the photoelectric conversion substrate 104, and the electrode 108b is disposed at a position L2, which is longer than the length L1, from the edge of the photoelectric conversion substrate 104. The electrodes 108a and 108b may be electrodes disposed adjacent to each other among the multiple electrodes 108. For example, along one side of the photoelectric conversion substrate 104, the electrodes 108a and the electrodes 108b may be alternately arranged in a staggered pattern.

[0042] The conductive wire 109 shown in Fig. 8 may have any of the shapes described above in Figs. 5(a) to 5(d), 6(a) to 6(d), 7, etc. As shown in Fig. 8, the conductive wire 109a connecting the electrode 107a and the electrode 108a and the conductive wire 109b connecting the electrode 107b and the electrode 108b may have the same shape in the portion 130 disposed on the photoelectric conversion substrate 104.

[0043] 9(a) and 9(b) show examples in which the conductive wire 109a and the conductive wire 109b have different shapes. As shown in FIGS. 9(a) and 9(b), one of the conductive wires 109a and 109b may be arranged so as to be inclined toward the photoelectric conversion region 105 in a portion from the electrodes 107a and 107b to the bent portion 131 that is closest to the electrodes 107a and 107b. In the configuration shown in FIGS. 9(a) and 9(b), the conductive wire 109b connected to the electrode 108b that is arranged farther from the end of the photoelectric conversion substrate 104 than the electrode 108a is inclined toward the photoelectric conversion region 105 between the electrode 107 and the bent portion 131. However, this is not limited to this, and the conductive wire 109a connected to the electrode 108a arranged closer to the end of the photoelectric conversion substrate 104 than the electrode 108b may be inclined toward the photoelectric conversion region 105 between the electrode 107 and the bent portion 131.

[0044] The shapes of adjacent conductive wires 109a and 109b are different from each other in the portion from where they rise from electrode 107 to height h. This causes light incident on conductive wire 109a and light incident on conductive wire 109b to be reflected in different directions. As a result, the occurrence of the wire ghost phenomenon can be suppressed.

[0045] In the configuration shown in FIGS. 9(a) and 9(b), electrodes 108a and 108b are arranged in a staggered pattern, with electrodes 108a and 108b at different distances from the edge of the photoelectric conversion substrate 104. The conductive wire 109a connected to electrode 108a and the conductive wire 109b connected to electrode 108b have different shapes. However, this is not limited to this. Even if the distance between electrodes 107 and 108 is the same, adjacent conductive wires 109 may have different shapes. For example, by adjusting the length or tension of the conductive wires 109 in the wire bonding process, it is possible to arrange conductive wires 109 with different shapes even if the distance between electrodes 107 and 108 is the same. Furthermore, the conductive wires 109 are not limited to being arranged alternately, and may have different shapes, such as one conductive wire for every several electrodes or several conductive wires for every several electrodes. Furthermore, in the configuration shown in Figures 9(a) and 9(b), two types of conductive wires 109a and 109b are arranged, but three or more types of conductive wires 109 with different shapes may be arranged.

[0046] Next, modified examples of the electronic component 100 will be described using FIGS. 10 and 11 . FIG. 10 is a cross-sectional view showing an example of the configuration of the electronic component 100 of this embodiment, and FIG. 11 is a plan view of the electronic component 100 from the optical member 103 side. In the configuration shown in FIGS. 10 and 11 , the frame 102 has protrusions 111 and 112 that protrude from the sides of the frame 102 in plan view. The frame 102 also covers the outer peripheral edge of the support substrate 101 and at least a portion of the surface of the support substrate 101 opposite the surface to which the photoelectric conversion substrate 104 is fixed. The remaining configuration may be the same as in the above-described embodiments, so the different configurations will be mainly described here, and descriptions of configurations that may be the same will be omitted as appropriate.

[0047] As shown in FIG. 11 , in a plan view, the frame body 102 is provided with protrusions 111 and 112 that protrude from at least two opposing sides of the four rectangular sides of the frame body 102. The spaces between the sides of the frame body 102 in a plan view may be rounded or chamfered as shown in FIG. 11 , or the sides may intersect at right angles. In the configuration shown in FIG. 11 , the protrusions 111 and 112 are arranged to protrude from two sides of the frame body 102 arranged in the longitudinal direction, but this is not a limitation. The protrusions 111 and 112 may be arranged on two opposing sides in the lateral direction, or on three or more sides.

[0048] The protrusions 111 and 112 can be used, for example, to fix the electronic component 100 to an external unit. The protrusion 111 has one or more through holes 113 that penetrate the protrusion 111. The protrusion 112 has through holes 114 and 115 that penetrate the protrusion 112. For example, the through holes 113 and 114 can be holes used to pass screws, bolts, or the like when fixing the electronic component 100 to an external unit using the screws, bolts, or the like. Furthermore, the through hole 115 can be a hole used for positioning the electronic component 100 when fixing the electronic component 100 to an external unit. Therefore, the through holes 113 and 114 and the through hole 115 can have different shapes. For example, the through holes 113 and 114 can have steps for receiving screw heads, nuts, or the like. Therefore, in a plan view, the through holes 113 and 114 can be larger than the through hole 115 in the structure including the steps.

[0049] As shown in FIG. 11 , the center of the through hole 114 in the protrusion 112 is located at a distance L11 from an imaginary line extending from the side on which the protrusion 112 is located. The center of the through hole 114 in the protrusion 112 is located at a distance L12 from an imaginary line extending from the side on which the protrusion 112 is located. The center of the through hole 113 in the protrusion 111 is located at a distance L13 from an imaginary line extending from the side on which the protrusion 111 is located. In this case, the lengths L11 and L12 may be different from each other. If the lengths L11 and L12 are the same, the protrusion 112 may become larger in the direction in which the through holes 114 and 115 are aligned. For example, as described above, the through holes 113 and 114 may be formed larger than the through hole 115 due to their structure. Therefore, through holes 113 and 114 are formed so that length L11 is longer than length L12. This reduces the outer shape of protrusion 112, potentially enabling the miniaturization of electronic component 100. Furthermore, since length L11 is longer than length L12, electronic component 100 can be made more compact than when length L11 is shorter than length L12. Lengths L11 and L13 may be the same length, as shown in FIG. 11 . This is because through holes 113 and 114 can be formed to have the same size (shape).

[0050] As described above, the protrusions 111 and 112 on the frame 102 can be used to secure the electronic component 100 to an external unit. However, the protrusions 111 and 112 on the frame 102 may cause partial warping or partial deformation of the support substrate 101 bonded to the frame 102. Therefore, the shape of the conductive wire 109 may be adjusted appropriately depending on the position where the conductive wire 109 is disposed. By adjusting the shape of the conductive wire 109 appropriately, it is possible to prevent problems such as breakage of the conductive wire 109 due to tensile stress applied to the conductive wire 109 caused by partial warping of the support substrate 101. In the configurations shown in FIGS. 10 and 11 , the multiple electrodes 108 on the support substrate 101 are arranged in a staggered pattern, similar to the configuration shown in FIG. 8 . However, this is not a limitation, and the shape of the conductive wire 109 and the arrangement of the electrodes 108 may be the same as those of the above-described embodiments. Even when the protrusions 111 and 112 are provided on the frame 102, the wire ghost phenomenon can be suppressed by forming the conductive wire 109 in the shape described above.

[0051] 11, protrusions 112a and 112b may be arranged on two opposing sides. The protrusions 112a and 112b may have the same shape. In this case, as shown in FIG. 11, the single protrusion 112b arranged on one side of the frame body 102 may be arranged at the center of the side. Here, the center of the side may be, for example, two parts that contact the center of the side when the side is divided into four equal parts. Furthermore, the center of the side may be, for example, a part that includes the center of the side when the side is divided into three equal parts. When only one protrusion 111 or protrusion 112 is arranged on one side, the protrusions 111 and 112 are arranged at the center of the side. This can suppress deformation and warping, such as twisting, of the frame body 102 and the support substrate 101 bonded to the frame body 102. 11, when protrusions 111 and 112a are arranged on one side, protrusions 111 and 112a may be arranged at positions that are the same length from the center of the side on which they are arranged. For example, the difference between the length from the center of the side on which protrusions 111 and 112a are arranged to the center of through-hole 113 in protrusion 111 and the length from the center of the side on which protrusions 111 and 112a are arranged to the center of through-hole 113 in protrusion 112a may be 20% or less of the length of the side. Furthermore, the difference between the length from the center of the side on which protrusions 111 and 112a are arranged to the center of through-hole 113 in protrusion 111 and the length from the center of the side on which protrusions 111 and 112a are arranged to the center of through-hole 113 in protrusion 112a may be 10% or less of the length of the side. Furthermore, for example, the length from the center of the side on which the protrusions 111 and 112a are arranged to the center of the through hole 113 of the protrusion 111 may be the same as the length from the center of the side on which the protrusions 111 and 112a are arranged to the center of the through hole 114 of the protrusion 112a. This can suppress deformation such as twisting or warping of the frame body 102 and the support substrate 101 joined to the frame body 102. When three or more protrusions 111 and 112 are arranged on one side, the protrusions 111 and 112 may be arranged at equal intervals, for example. The interval between the protrusions 111 and 112 may be defined, for example, by the length of a portion of the side on which no protrusions are provided, or by the length between the centers of through holes of the same shape.

[0052] The photoelectric conversion substrate 104 mounted on the electronic component 100 may generate a heat distribution across its surface. For example, when the electrodes 107 arranged along the longitudinal direction of the electronic component 100 function as output terminals for outputting signals from the photoelectric conversion substrate 104, the heat generation of the electrodes 107 arranged along the longitudinal direction may be large. This is because the number of signal inputs and outputs during operation of the photoelectric conversion substrate 104 varies depending on the function of the electrodes 107, resulting in different heat generation. Therefore, as shown in FIG. 11 , the length between the frame 102 and the photoelectric conversion substrate 104 may be different in the longitudinal and lateral directions of the electronic component 100 in a plan view. In the configuration shown in FIG. 11 , the length L21 between the frame 102 and the photoelectric conversion substrate 104 in the longitudinal direction is shorter than the length L22 between the frame 102 and the photoelectric conversion substrate 104 in the lateral direction. In other words, the length L22 between the frame body 102 and the end of the photoelectric conversion substrate 104 where the electrodes 107 arranged along the longitudinal direction, which generates the most heat, are arranged is longer than the length L21 between the frame body 102 and the end of the photoelectric conversion substrate 104 where the electrodes 107 arranged along the lateral direction are arranged. This makes it possible to ensure a heat dissipation space. For example, a heat dissipation member such as a heat dissipation sheet may be arranged in the heat dissipation space ensured between the electrodes 108 and the frame body 102. By suppressing heat conduction to the frame body 102, deformation of the frame body 102 can be suppressed.

[0053] 11, the length L22 is longer than the length L21. However, this is not limiting, and the length L22 may be shorter than the length L21 depending on the function of each of the multiple electrodes 107, the heat distribution of the photoelectric conversion substrate 104, etc.

[0054] 10, the support substrate 101 and the frame body 102 are shown as separate bodies. However, this is not limiting, and the support substrate 101 and the frame body 102 may be integrated. Also, in the configuration of the support substrate 101 and the frame body 102 shown in FIGS. 1 and 2, protrusions 111 and 112 may be provided on the frame body 102.

[0055] Here, an application example of the electronic component 100 of this embodiment will be described with reference to FIG. 12. FIG. 12 is a schematic diagram of a device 9191 including the electronic component 100. The device 9191 can include at least one of an optical device 940, a control device 950, a processing device 960, a display device 970, a storage device 980, and a mechanical device 990. The optical device 940 is, for example, a lens, a shutter, or a mirror. The control device 950 controls, for example, the photoelectric conversion substrate 104 arranged in the electronic component 100. The control device 950 is, for example, a semiconductor device such as an ASIC.

[0056] The processing device 960 processes a signal output from the photoelectric conversion board 104 disposed in the electronic component 100. The processing device 960 is a semiconductor device such as a CPU or ASIC for configuring an AFE (analog front end) or a DFE (digital front end). The display device 970 is an EL display device or a liquid crystal display device that displays information (images) obtained by the photoelectric conversion board 104. The storage device 980 is a magnetic device or a semiconductor device that stores information (images) obtained by the photoelectric conversion board 104. The storage device 980 is a volatile memory such as an SRAM or a DRAM, or a non-volatile memory such as a flash memory or a hard disk drive.

[0057] The mechanical device 990 has a moving part or a propulsion part such as a motor or an engine. In the device 9191, a signal output from the photoelectric conversion board 104 arranged in the electronic component 100 is displayed on the display device 970, or transmitted to the outside by a communication device (not shown) provided in the device 9191. For this purpose, the device 9191 may further include a storage device 980 and a processing device 960 in addition to the memory circuit and arithmetic circuit provided in the photoelectric conversion board 104. The mechanical device 990 may be controlled based on the signal output from the photoelectric conversion board 104.

[0058] The device 9191 is also suitable for electronic devices such as information terminals with a photographing function (for example, smartphones and wearable devices) and cameras (for example, interchangeable lens cameras, compact cameras, video cameras, and surveillance cameras). The mechanical device 990 in the camera can drive components of the optical device 940 for zooming, focusing, and shutter operations. Alternatively, the mechanical device 990 in the camera can move the electronic component 100 on which the photoelectric conversion board 104 is arranged for vibration isolation operations.

[0059] The device 9191 can also be applied to an on-board camera mounted on transportation equipment such as a vehicle, ship, airplane, or industrial robot. The mechanical device 990 in transportation equipment can be used as a moving device. The device 9191 as transportation equipment is suitable for transporting an electronic component 100 having a photoelectric conversion substrate 104 disposed thereon, or for assisting and / or automating driving (piloting) using a photographing function. The processing device 960 for assisting and / or automating driving (piloting) can perform processing for operating the mechanical device 990 as a moving device based on information obtained by the photoelectric conversion substrate 104. The device 9191 incorporating the electronic component 100 having a photoelectric conversion substrate 104 disposed thereon is not limited to transportation equipment, but can be widely applied to equipment that uses object recognition, such as an intelligent transport system (ITS). Alternatively, the device 9191 may be a medical device such as an endoscope, a measuring device such as a distance measuring sensor, an analytical device such as an electron microscope, or an office machine such as a copier.

[0060] The disclosure of this specification includes the following electronic components and devices:

[0061] (Item 1) An electronic component comprising: a support substrate; a photoelectric conversion substrate fixed to the support substrate; and an optical member arranged to face the photoelectric conversion substrate, the photoelectric conversion substrate has a main surface including a photoelectric conversion region in which a plurality of photoelectric conversion elements are arranged and a peripheral region in which a first electrode is arranged; the first electrode is connected to a second electrode disposed on the support substrate via a conductive wire; a first portion of the conductive wire disposed on the photoelectric conversion substrate includes one or more bent portions; the conductive wire is arranged in a range of 200 μm or less from the surface of the first electrode in a normal direction to the surface of the first electrode; An electronic component characterized in that a portion of the first portion from the first electrode to a first height has a maximum angle of 30° or less with respect to the normal direction, and the first height is 1 / 2 of the maximum height of the conductive wire from the surface in the normal direction.

[0062] (Item 2) 2. The electronic component according to item 1, wherein a first bent portion, which is the closest to the first electrode among the bent portions, is disposed at a position farther from the surface than the first height.

[0063] (Item 3) The electronic component described in item 2, characterized in that the portion of the first portion from the first electrode to the first bend is arranged along the normal direction or is arranged so as to be inclined toward the photoelectric conversion region.

[0064] (Item 4) 4. The electronic component according to item 2 or 3, wherein a portion of the first portion that is farther from the first electrode than the first bent portion is arranged so as to move away from the main surface as it moves away from the first bent portion, and the angle with respect to the normal direction is not in the range of 40° or more and 50° or less.

[0065] (Item 5) the bending portion includes the first bending portion and the second bending portion, 5. The electronic component according to any one of items 2 to 4, wherein a portion of the first portion from the first bent portion to the second bent portion is disposed so as to move away from the main surface as it moves away from the first bent portion, and the angle with respect to the normal direction is not within a range of 40° or more and 50° or less.

[0066] (Item 6) the second bent portion is disposed at a position less than the maximum height from the surface in the normal direction, 6. The electronic component according to item 5, wherein a portion of the first portion that is farther from the first electrode than the second bent portion is arranged so as to move away from the main surface as it moves away from the second bent portion.

[0067] (Item 7) 6. The electronic component according to item 5, wherein the second bent portion is disposed at the maximum height from the surface in the normal direction.

[0068] (Item 8) 8. The electronic component according to any one of items 1 to 7, wherein the bent portion includes an R-shaped bent portion.

[0069] (Item 9) 8. The electronic component according to any one of items 2 to 7, wherein the first bent portion has an R shape.

[0070] (Item 10) the first bent portion has an R shape, 4. The electronic component according to item 2 or 3, wherein the R-shape includes a portion located at the maximum height from the surface in the normal direction.

[0071] (Item 11) 11. The electronic component according to any one of items 8 to 10, wherein the radius of curvature of the R-shape is 0.16 mm or less.

[0072] (Item 12) 12. The electronic component according to any one of items 1 to 11, wherein the maximum height is 3 / 4 or more of the height from the surface to the optical member in the normal direction.

[0073] (Item 13) 13. The electronic component according to any one of items 1 to 12, wherein the first electrode is disposed closer to the optical member than the second electrode.

[0074] (Item 14) a plurality of first electrodes including the first electrode, a plurality of second electrodes including the second electrode, and a plurality of conductive wires including the conductive wire are arranged; the plurality of second electrodes include a third electrode and a fourth electrode arranged adjacent to each other; An electronic component according to any one of items 1 to 13, characterized in that, in a plan view, the third electrode is arranged at a position a first length from the end of the photoelectric conversion substrate, and the fourth electrode is arranged at a position a second length longer than the first length from the end of the photoelectric conversion substrate.

[0075] (Item 15) Item 15. The electronic component according to item 14, characterized in that one of the conductive wires connected to the third electrode and one of the conductive wires connected to the fourth electrode are arranged so as to be inclined toward the photoelectric conversion region in the portion from the first electrode to the bent portion closest to the first electrode.

[0076] (Item 16) Item 16. The electronic component according to item 15, wherein the conductive wire connected to the fourth electrode among the plurality of conductive wires is arranged so as to be inclined toward the photoelectric conversion region in the portion from the first electrode to the bent portion closest to the first electrode.

[0077] (Item 17) the plurality of second electrodes include a plurality of third electrodes including the third electrode and a plurality of fourth electrodes including the fourth electrode, 17. The electronic component according to any one of items 14 to 16, wherein the third electrodes and the fourth electrodes are arranged alternately.

[0078] (Item 18) An electronic component according to any one of items 1 to 17; a processing device that processes a signal output from the photoelectric conversion substrate; An apparatus characterized by comprising:

[0079] The invention is not limited to the above-described embodiments, and various changes and modifications can be made without departing from the spirit and scope of the invention. Accordingly, the following claims are appended to apprise the public of the scope of the invention. [Explanation of symbols]

[0080] 100: electronic component, 101: support substrate, 103: optical member, 104: photoelectric conversion substrate, 105: photoelectric conversion region, 106: peripheral region, 107, 108: electrodes, 109: conductive wire, 130: portion, 131: bent portion

Claims

1. An electronic component comprising: a support substrate; a photoelectric conversion substrate fixed to the support substrate; and an optical member arranged to face the photoelectric conversion substrate, the photoelectric conversion substrate has a main surface including a photoelectric conversion region in which a plurality of photoelectric conversion elements are arranged and a peripheral region in which a first electrode is arranged; the first electrode is connected to a second electrode disposed on the support substrate via a conductive wire; a first portion of the conductive wire disposed on the photoelectric conversion substrate includes one or more bent portions; the conductive wire is disposed in a range of 200 μm or less from the surface of the first electrode in a normal direction to the surface of the first electrode; An electronic component characterized in that a portion of the first portion from the first electrode to a first height has a maximum angle of 30° or less with respect to the normal direction, and the first height is 1 / 2 of the maximum height of the conductive wire from the surface in the normal direction.

2. 2. The electronic component according to claim 1, wherein a first bent portion, which is closest to the first electrode, of the bent portions is disposed at a position farther from the surface than the first height.

3. The electronic component according to claim 2, characterized in that the portion of the first portion from the first electrode to the first bend is arranged along the normal direction or is arranged so as to be inclined toward the photoelectric conversion region.

4. The electronic component according to claim 2, characterized in that a portion of the first portion that is farther from the first electrode than the first bend portion is arranged so as to move away from the main surface as it moves away from the first bend portion, and that its angle with respect to the normal direction is not in the range of 40° or more and 50° or less.

5. the bent portion includes the first bent portion and the second bent portion, 3. The electronic component according to claim 2, wherein a portion of the first portion from the first bent portion to the second bent portion is arranged so as to move away from the main surface as it moves away from the first bent portion, and the angle with respect to the normal direction is not within a range of 40° or more and 50° or less.

6. the second bent portion is disposed at a position less than the maximum height from the surface in the normal direction, The electronic component according to claim 5 , wherein a portion of the first portion that is farther from the first electrode than the second bent portion is disposed so as to move away from the main surface as it moves away from the second bent portion.

7. The electronic component according to claim 5 , wherein the second bent portion is disposed at a position of the maximum height from the surface in the normal direction.

8. The electronic component according to claim 1 , wherein the bent portion includes an R-shaped bent portion.

9. The electronic component according to claim 2 , wherein the first bent portion has an R-shape.

10. the first bent portion has an R shape, 3. The electronic component according to claim 2, wherein the R-shape includes a portion located at the maximum height from the surface in the normal direction.

11. 9. The electronic component according to claim 8, wherein the radius of curvature of the R-shape is 0.16 mm or less.

12. 2. The electronic component according to claim 1, wherein the maximum height is equal to or greater than three-quarters of the height from the surface to the optical member in the normal direction.

13. 2. The electronic component according to claim 1, wherein the first electrode is disposed closer to the optical member than the second electrode.

14. a plurality of first electrodes including the first electrode, a plurality of second electrodes including the second electrode, and a plurality of conductive wires including the conductive wire are arranged; the plurality of second electrodes include a third electrode and a fourth electrode arranged adjacent to each other, The electronic component described in claim 1, characterized in that, in a planar view, the third electrode is arranged at a position a first length from the end of the photoelectric conversion substrate, and the fourth electrode is arranged at a position a second length longer than the first length from the end of the photoelectric conversion substrate.

15. 15. The electronic component according to claim 14, wherein one of the conductive wires connected to the third electrode and the conductive wire connected to the fourth electrode is arranged so as to be inclined toward the photoelectric conversion region in a portion from the first electrode to the bent portion closest to the first electrode.

16. The electronic component according to claim 15, wherein the conductive wire connected to the fourth electrode among the plurality of conductive wires is arranged so as to be inclined toward the photoelectric conversion region in the portion from the first electrode to the bent portion of the bent portion that is closest to the first electrode.

17. the plurality of second electrodes include a plurality of third electrodes including the third electrode and a plurality of fourth electrodes including the fourth electrode, 15. The electronic component according to claim 14, wherein the third electrodes and the fourth electrodes are arranged alternately.

18. An electronic component according to any one of claims 1 to 17; a processing device that processes a signal output from the photoelectric conversion substrate; An apparatus characterized by comprising:

Images