Electronic component mounting method and electronic component mounting apparatus

Abstract

To provide an electronic component mounting method and an electronic component mounting apparatus capable of suppressing the occurrence of defects such as tilting of an electronic component.SOLUTION: An electronic component mounting method of the present disclosure is an electronic component mounting method for mounting an electronic component having a lead onto an insulating layer, and includes: a first application step of applying a conductive fluid to a lead mounting-planned position on wiring formed on an upper surface of the insulating layer; a second application step of applying a conductive fluid to a part of an arrangement-planned region of a component body of the electronic component on the upper surface; a curing step of curing the conductive fluid; an electronic component arrangement step of arranging the electronic component at the position where the lead is arranged on the conductive fluid applied in the first application step and the component body is arranged on the conductive fluid applied in the second application step; and a pressing step of pressing the electronic component arranged in the electronic component arrangement step against the insulating layer to mount the electronic component on the insulating layer.SELECTED DRAWING: Figure 13

Description

[Technical Field]

[0001] The present disclosure relates to an electronic component mounting method and an electronic component mounting apparatus. [Background technology]

[0002] In recent years, various techniques have been developed for manufacturing electronic devices. For example, Patent Document 1 below describes a technique for forming an insulating layer and metal wiring by an inkjet method, and then mounting electronic components that are electrically connected to the formed metal wiring. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] International Publication No. 2019 / 102522 Summary of the Invention [Problem to be solved by the invention]

[0004] When connecting an electronic component to a wiring, it is necessary to electrically connect the electrodes of the electronic component to the connection portion of the wiring. However, for example, when a lead component is used as the electronic component, pressing the electronic component against an insulating layer during mounting to ensure electrical conductivity may cause problems such as tilting of the electronic component.

[0005] The present disclosure has been made in consideration of such circumstances, and aims to provide an electronic component mounting method and an electronic component mounting apparatus that can prevent defects such as tilting of electronic components from occurring. [Means for solving the problem]

[0006] This specification discloses an electronic component mounting method for mounting an electronic component having leads on an insulating layer, the method including: a first application step of applying a conductive fluid to a planned mounting position of the lead on wiring formed on the upper surface of the insulating layer; a second application step of applying the conductive fluid to a part of a planned placement area of ​​the component body of the electronic component on the upper surface; a curing step of hardening the conductive fluid; an electronic component placement step of placing the electronic component in a position where the lead is placed on the conductive fluid applied in the first application step and the component body is placed on the conductive fluid applied in the second application step; and a pressing step of pressing the electronic component placed in the electronic component placement step against the insulating layer to mount the electronic component on the insulating layer. The present disclosure is not limited to being embodied as an electronic component mounting method, but may be embodied in various forms. For example, the present disclosure may be usefully embodied as an electronic component mounting apparatus. [Effects of the Invention]

[0007] According to the present disclosure, when the electronic component is pressed against the insulating layer in the pressing step, the component body can be supported from below by the conductive fluid hardened in the intended placement area. Therefore, even if part of the force applied to the electronic component during pressing acts in a direction that tilts the electronic component, the occurrence of tilting or the like can be suppressed by supporting the component body by the conductive fluid hardened in the intended placement area. As a result, the leads and wiring can be electrically connected well via the conductive fluid applied to the intended mounting position. [Brief explanation of the drawings]

[0008] [Figure 1] 1 is a schematic diagram of a substrate forming apparatus 10 according to the present embodiment. [Figure 2] FIG. 2 is a block diagram showing a control device 28. [Figure 3] FIG. 2 is a block diagram showing a control device 28. [Figure 4] FIG. 2 is a perspective view of a pressing unit 26. [Figure 5]FIG. 10 is a cross-sectional view showing an example of a circuit board 159 on which a resin laminate 252 is formed. [Figure 6] 10 is a cross-sectional view showing an example of a circuit board 159 in which wiring 262 is formed on a resin laminate 252. FIG. [Figure 7] FIG. 10 is a cross-sectional view showing an example of a circuit board 159 in which a resin laminate 257 is further formed on a resin laminate 252. [Figure 8] FIG. 10 is a cross-sectional view showing an example of circuit board 159 in a state where conductive paste 266 is applied onto wiring 262 and conductive paste 266A is applied onto upper surface 252A. [Figure 9] 10 is a cross-sectional view showing an example of a circuit board 159 in a state where a conductive paste 266B is applied onto bumps 275 and supporting portions 276. FIG. [Figure 10] 10 is a cross-sectional view showing an example of a circuit board 159 in a state where a thermosetting resin 277 is applied onto a resin laminate 252. FIG. [Figure 11] FIG. 10 is a cross-sectional view showing an example of a circuit board 159 on which an electronic component 270 is mounted. [Figure 12] 10 is a cross-sectional view showing an example of a state in which a pressing member 165 is placed at a position facing an electronic component 270. FIG. [Figure 13] 10 is a cross-sectional view showing an example of a circuit board 159 in a state where it is pressed by a pressing member 165. FIG. [Figure 14] 10 is a cross-sectional view showing an example of a circuit board 159 in which a thermosetting resin 280 is applied around an electronic component 270. FIG. [Figure 15] FIG. 2 is a side view of the electronic component 270. [Figure 16] FIG. 2 is a bottom view of the electronic component 270, showing the position where the support portion 276 is formed. [Figure 17] FIG. 10 is a bottom view of an electronic component 270 according to another example, showing the position where a support portion 276 is formed. [Figure 18] FIG. 10 is a bottom view of an electronic component 270 according to another example, showing the position where a support portion 276 is formed. DETAILED DESCRIPTION OF THE INVENTION

[0009] Hereinafter, embodiments embodying the electronic component mounting apparatus of the present disclosure will be described with reference to the drawings. FIG. 1 is a schematic diagram of a board forming apparatus 10 of this embodiment. FIGS. 2 and 3 are block diagrams showing a control device 28 of this embodiment. As shown in FIGS. 1 to 3, the board forming apparatus 10 includes a conveying device 20, a first modeling unit 22, a second modeling unit 23, a third modeling unit 24, a fourth modeling unit 25, a pressing unit 26, a mounting unit 27, and a control device 28 (see FIGS. 2 and 3). The conveying device 20, the first modeling unit 22, the second modeling unit 23, the third modeling unit 24, the fourth modeling unit 25, the pressing unit 26, and the mounting unit 27 are disposed on a base 29 of the board forming apparatus 10. The base 29 is generally rectangular in shape, and in the following description, as shown in FIG. 1, the longitudinal direction of the base 29 will be referred to as the X-axis direction, the short direction of the base 29 as the Y-axis direction, and the direction perpendicular to both the X-axis direction and the Y-axis direction as the Z-axis direction.

[0010] The transport device 20 includes an X-axis slide mechanism 30 and a Y-axis slide mechanism 32. The X-axis slide mechanism 30 includes an X-axis slide rail 34 and an X-axis slider 36. The X-axis slide rail 34 is disposed on a base 29 so as to extend in the X-axis direction. The X-axis slider 36 is held by the X-axis slide rail 34 so as to be slidable in the X-axis direction. The X-axis slide mechanism 30 also includes an electromagnetic motor 38 (see FIG. 2 ), which is driven to move the X-axis slider 36 to any position in the X-axis direction. The Y-axis slide mechanism 32 also includes a Y-axis slide rail 50 and a stage 52. The Y-axis slide rail 50 is disposed on the base 29 so as to extend in the Y-axis direction. One end of the Y-axis slide rail 50 in the Y-axis direction is connected to the X-axis slider 36. Therefore, the Y-axis slide rail 50 is movable in the X-axis direction together with the X-axis slider 36. A stage 52 is held on the Y-axis slide rail 50 so as to be slidable in the Y-axis direction. Furthermore, the Y-axis slide mechanism 32 has an electromagnetic motor 56 (see FIG. 2), and the stage 52 is moved to any position in the Y-axis direction by driving the electromagnetic motor 56. As a result, the stage 52 is moved to any position on the base 29 by driving the X-axis slide mechanism 30 and the Y-axis slide mechanism 32.

[0011] The stage 52 has a base 60, a holding device 62, an elevating device 64 (see FIG. 2), and a heater 66 (see FIG. 2). The base 60 is formed in a flat plate shape, and a pallet 61 is placed on the upper surface. The pallet 61 is, for example, a flat metal member. A circuit board is formed on the pallet 61. The holding devices 62 are provided on both sides of the base 60 in the X-axis direction. The holding devices 62 clamp both edges of the pallet 61 in the X-axis direction placed on the base 60, thereby fixedly holding the circuit board. The elevating device 64 is disposed below the base 60 and raises and lowers the base 60. The heater 66 is built into the base 60 and heats the circuit board placed on the base 60 to a desired temperature.

[0012] The first modeling unit 22 is a unit that models the wiring of a circuit board and includes a first printing unit 72 and a baking unit 74. The first printing unit 72 includes an inkjet head 76 (see FIG. 2), which ejects metal ink in a linear pattern. The metal ink is made by dispersing metal particles (for example, nanometer-sized metal (for example, silver) particles) in a solvent. The surfaces of the metal particles are coated with a dispersant to prevent aggregation in the solvent. The inkjet head 76 ejects the metal ink from multiple nozzles using, for example, a piezoelectric method using piezoelectric elements.

[0013] The baking unit 74 has an infrared irradiation device 78 (see FIG. 2). The infrared irradiation device 78 is a device that irradiates the ejected metal ink with infrared rays. The metal ink that has been irradiated with infrared rays is baked to form wiring. Note that baking of metal ink is a phenomenon in which, by applying energy, the solvent is vaporized and the protective film on the metal particles, i.e., the dispersant, is decomposed, and the metal particles come into contact or fuse together, thereby increasing the conductivity. Then, by baking the metal ink, metal wiring is formed.

[0014] The second modeling unit 23 is a unit that models the resin layer of the circuit board, and has a second printing unit 84 and a curing unit 86. The second printing unit 84 has an inkjet head 88 (see FIG. 2), which ejects ultraviolet curable resin. The ultraviolet curable resin is a resin that hardens when irradiated with ultraviolet light. The method by which the inkjet head 88 ejects the ultraviolet curable resin may be, for example, a piezo method using a piezoelectric element, or a thermal method in which the resin is heated to generate bubbles and then ejected from multiple nozzles.

[0015] The curing unit 86 has a flattening device 90 (see FIG. 2) and an irradiation device 92 (see FIG. 2). The flattening device 90 flattens the upper surface of the ultraviolet curing resin discharged by the inkjet head 88, for example, by leveling the surface of the ultraviolet curing resin and scraping off excess resin with a roller or blade, thereby making the thickness of the ultraviolet curing resin uniform. The irradiation device 92 is equipped with a mercury lamp or LED as a light source, and irradiates the discharged ultraviolet curing resin with ultraviolet light. This hardens the discharged ultraviolet curing resin, forming a resin layer.

[0016] The third modeling unit 24 is a unit that models connection portions between leads and wiring of electronic components, and includes a third printing unit 100. The third printing unit 100 includes a dispenser 106 (see FIG. 2), which dispenses conductive paste. The conductive paste is a resin that hardens when heated at a relatively low temperature, in which metal particles (e.g., micrometer-sized metal particles) larger than the metal microparticles of metal ink are dispersed. The metal particles are, for example, silver particles. The metal particles are flake-shaped, and the viscosity of the conductive paste is relatively high compared to that of metal ink. The type of metal contained in the conductive paste and metal ink is not limited to silver, and other metals such as gold and copper may also be used.

[0017] The conductive paste dispensed by the dispenser 106 is then heated by the heater 66 built into the base 60. The resin in the heated conductive paste hardens. At this time, the resin in the conductive paste hardens and shrinks, causing the flake-shaped metal particles dispersed in the resin to come into contact with each other. This causes the conductive paste to exhibit conductivity. The resin in the conductive paste is an organic adhesive, and exhibits adhesive strength when hardened by heating. The conductive paste hardens at, for example, approximately 80°C. The method for hardening the conductive paste is not limited to using the heater 66, but may also be a method using infrared rays. Similarly, the method for hardening the metal ink is not limited to using infrared rays, but may also be a method using a heater.

[0018] Furthermore, the third shaping unit 24 in this embodiment shapes a support portion that supports the component body of the electronic component from below. The conductive paste dispensed below the component body by the third shaping unit 24 is heated by the heater 66 to harden and form a support portion. This support portion supports the component body of the electronic component from below when the electronic component is pressed. Details of the support portion will be described later.

[0019] The fourth modeling unit 25 is a unit that models resin for fixing electronic components to a circuit board, and includes a fourth printing unit 110. The fourth printing unit 110 includes a dispenser 116 (see FIG. 2), which dispenses thermosetting resin. Thermosetting resin is a resin that hardens when heated, and is known as underfill resin. The dispenser 116 dispenses the thermosetting resin by, for example, an air pulse method using compressed air. The thermosetting resin dispensed by the dispenser 116 is heated by a heater 66 built into the base 60 and hardens. The thermosetting resin hardens at, for example, approximately 80°C.

[0020] Furthermore, pressing unit 26 is a unit for pressing electronic components arranged on the circuit board, and includes drive section 120 and heater 121 (see FIG. 2). Details of pressing unit 26 will be described later, but pressing unit 26 drives drive section 120 to press electronic components on the circuit board relatively against the circuit board.

[0021] Furthermore, mounting unit 27 is a unit that mounts electronic components on a circuit board, and includes supply unit 130 and mounting unit 132. Supply unit 130 has a plurality of tape feeders 134 (see FIG. 3) that feed taped electronic components one by one, and supplies the electronic components at a supply position. Note that supply unit 130 is not limited to a tape feeder-type supply device, and may also be a tray-type supply device that picks up and supplies electronic components from a tray. Furthermore, supply unit 130 may be configured to include both tape feeder-type and tray-type supply devices, or other types of supply devices.

[0022] The placing unit 132 has a placing head 136 (see FIG. 3) and a moving device 138 (see FIG. 3). The placing head 136 has a suction nozzle (not shown) for suctioning and holding electronic components. The suction nozzle suctions and holds the electronic components by air when negative pressure is supplied from a positive / negative pressure supplying device (not shown). The positive / negative pressure supplying device then supplies a slight positive pressure to the suction nozzle, which then releases the electronic components. The moving device 138 also moves the placing head 136 between the position where the tape feeder 134 supplies electronic components and the circuit board placed on the base 60. As a result, in the placing unit 132, the electronic components supplied from the tape feeder 134 are held by the suction nozzle, and the electronic components held by the suction nozzle are placed on the circuit board.

[0023] The mounting unit 27 may be provided as a unit separate from the board forming apparatus 10. For example, the board forming apparatus 10 provided with the first modeling unit 22, the second modeling unit 23, the third modeling unit 24, the fourth modeling unit 25, and the pressing unit 26 may be connected to an electronic component mounting device that mounts electronic components. Then, the circuit board formed by the board forming apparatus 10 may be transported to the electronic component mounting device, and the electronic components may be mounted on the circuit board, and then the circuit board may be returned to the board forming apparatus 10 and pressed by the pressing unit 26.

[0024] 3, substrate forming apparatus 10 is provided with, for example, a touch panel 139 as a user interface. Touch panel 139 changes the display content under the control of control device 28. Touch panel 139 also outputs a signal to control device 28 in response to an operation input by the user.

[0025] 2 and 3 , the control device 28 includes a controller 140 and a plurality of drive circuits 142. Each of the plurality of drive circuits 142 is connected to the electromagnetic motors 38 and 56, the holding device 62, the lifting device 64, the heater 66, the inkjet head 76, the infrared irradiation device 78, the inkjet head 88, the flattening device 90, the irradiation device 92, the dispenser 106, the dispenser 116, the drive unit 120, the heater 121, the tape feeder 134, the mounting head 136, the moving device 138, and the touch panel 139. The controller 140 includes a CPU, a ROM, a RAM, and the like, and is primarily a computer. The controller 140 is connected to the plurality of drive circuits 142. As a result, the operation of the conveyance device 20, the first modeling unit 22, the second modeling unit 23, the third modeling unit 24, the fourth modeling unit 25, the pressing unit 26, the mounting unit 27, and the touch panel 139 is controlled by the controller 140.

[0026] With the above-described configuration, the substrate forming apparatus 10 forms a resin laminate on the base 60 and forms wiring on the upper surface of the resin laminate. The substrate forming apparatus 10 electrically connects the leads of the electronic components to the wiring via conductive paste and fixes the electronic components with resin, thereby forming a circuit board. The substrate forming apparatus 10 applies pressure using the pressing unit 26 when fixing the electronic components.

[0027] (Regarding the pressing unit 26) Next, the pressing unit 26 will be described. Fig. 4 shows a perspective view of the pressing unit 26. In the following description, as shown in Fig. 4, the front-rear direction, left-right direction, and up-down direction will be used with reference to the direction when the pressing unit 26 is viewed from the front. As will be described later, the front-rear direction is the direction (arrow 161) in which the pallet 61 is carried into the pressing unit 26, and is, for example, a direction parallel to the X-axis direction or the Y-axis direction.

[0028] As shown in FIG. 4, the pressing unit 26 includes a base 151, a movable part 152, and a holding part 153. The base 151 is fixed to an installation surface on which the pressing unit 26 is installed, and includes a moving mechanism 155. The moving mechanism 155 is provided below the pressing unit 26 and is a mechanism that drives the driving part 120 to move the movable part 152. The movable part 152 has multiple support columns 157, 158 that extend in the vertical direction inserted therein, and is capable of sliding in the vertical direction with a pallet mounting part 152A on which the pallet 61 is placed placed. The driving part 120 is, for example, a servo motor. The moving mechanism 155 includes, for example, multiple gears 155A and a ball screw mechanism (not shown) that transmit the driving force of the driving part 120, and moves the movable part 152 in the vertical direction based on the driving of the driving part 120. When the pallet 61 is carried in, the movable part 152 is placed in the position shown in Fig. 4, and when pressing, it moves upward from the position shown in Fig. 4. Note that the drive source that moves the movable part 152 is not limited to a servo motor, and may be, for example, a fluid pressure cylinder such as an air cylinder or a hydraulic cylinder.

[0029] After forming the circuit board 159 on the pallet 61 and mounting the electronic components thereon, the control device 28 controls the transport device 20 to transport the pallet 61 to the pressing unit 26. The control device 28 releases the holding device 62 from holding the pallet 61, and controls a carry-in device (not shown) arranged near the pressing unit 26 to move the pallet 61 carrying the circuit board 159 forward in the direction of arrow 161 in FIG. 4, and load the pallet 61 from the base 60 onto the pallet placement section 152A. After the pressing is completed, the control device 28 controls the carry-in device to move the pallet 61 backward, and loads the pallet 61 from the pallet placement section 152A onto the base 60.

[0030] A holding portion 153 is attached to the upper ends of the four support columns 158. A component mounting member 163 and a clamping mechanism 164 are attached to the holding portion 153. The component mounting member 163 is fixed to the underside of the holding portion 153, and a pressing member 165 is attached to the component mounting member 163. The clamping mechanism 164 is operated by a user to switch between a state in which the pressing member 165 is clamped to the underside of the component mounting member 163 and attached, and a state in which the clamp is released so that the pressing member 165 can be removed. The pressing member 165 attached to the component mounting member 163 is positioned in a position facing the circuit board 159 placed on the pallet placement portion 152A in the vertical direction.

[0031] Heater 121 is attached, for example, to component mounting member 163 and pallet mounting portion 152A of movable portion 152. Heater 121 is, for example, an electric heating wire, connected to drive circuit 142 (see FIG. 2) via a power supply wire (not shown), and heats pressing member 165 and pallet mounting portion 152A. Heater 121 heats circuit board 159 and electronic components when pressing member 165 presses the electronic components. As a result, as will be described later, the conductive paste and thermosetting resin are heated, and the electronic components are electrically connected to and fixed on circuit board 159.

[0032] The pressing member 165 includes a base member 168 and an elastic member 169. The base member 168 is a plate-shaped member made of metal such as steel. The base member 168 is clamped by a clamping mechanism 164 and attached to the component mounting member 163. The elastic member 169 is formed of a plate-shaped rubber sheet made of, for example, silicone rubber, and is adhered to the lower surface of the base member 168. The elastic member 169 may be formed of a single rubber sheet or multiple rubber sheets (e.g., two sheets) stacked vertically. The base member 168 presses the electronic component toward the circuit board 159 via the elastic member 169. Note that the elastic member 169 is not limited to rubber, and may be other elastically deformable materials such as urethane. The method of attaching the elastic member 169 to the base member 168 is not limited to adhesive bonding, and may be other methods such as bolts, magnets, or cable ties. A low-friction sheet 170 may be disposed between the elastic member 169 and the circuit board 159 to suppress deformation and displacement when pressed.

[0033] The low-friction sheet 170 is formed of a material with a low coefficient of friction, i.e., a material with good slipperiness, such as PTFE (polytetrafluoroethylene), fluororesin, ultra-high molecular weight polyethylene, or MC nylon (registered trademark). The low-friction sheet 170 is attached to the base member 168 by brackets provided on both left and right sides, and is clamped to the component mounting member 163 by a clamp mechanism 164. In this embodiment, two low-friction sheets 170 are arranged so as to overlap each other (see FIG. 12). The number of low-friction sheets 170 may be one, or three or more. The two low-friction sheets 170 are attached so as to cover the lower surface of the elastic member 169, for example, with a predetermined slack. Both sides of the low-friction sheet 170 have a low coefficient of friction, and the friction coefficient of each of the two sides of the low-friction sheet 170 is lower than the friction coefficient of the lower surface of the elastic member 169, for example.

[0034] (Formation of circuit board 159) Next, an example of a process for forming a circuit board 159 will be described. In the following description, devices controlled by the control device 28 may be simply described by their device names. For example, the statement "the stage 52 moves below the second modeling unit 23" means that "the stage 52 moves below the second modeling unit 23 by controlling the electromagnetic motor 38 of the X-axis slide mechanism 30 and the electromagnetic motor 56 of the Y-axis slide mechanism 32 based on the control of the control device 28."

[0035] When the forming operation starts, first, the stage 52 moves below the second forming unit 23. For example, a release film 211 is attached to the pallet 61 of the stage 52. The circuit board 159, which is the object, is formed on this release film 211. The release film 211 is a film whose adhesiveness decreases at a predetermined temperature or higher, making it easier to peel off from the pallet 61. The predetermined temperature at which the adhesiveness decreases is, for example, a temperature higher than the temperature at which the pressing unit 26 presses the circuit board 159. For example, after all the manufacturing steps, including pressing, are completed, the user can easily remove the circuit board 159 from the board forming apparatus 10 by removing the pallet 61 from the board forming apparatus 10 and heating the release film 211. Note that the circuit board 159 may be formed directly on the pallet 61 without using the release film 211.

[0036] As shown in FIG. 5 , the second modeling unit 23 forms a resin laminate 252 on the release film 211 of the pallet 61. The second modeling unit 23 forms the resin laminate 252 by repeatedly discharging an ultraviolet curable resin from the inkjet head 88 and irradiating the discharged ultraviolet curable resin with ultraviolet rays using an irradiation device 92. More specifically, in the second printing section 84 of the second modeling unit 23, the inkjet head 88 discharges the ultraviolet curable resin in a thin film form onto the upper surface of the release film 211. Next, after the ultraviolet curable resin is discharged in a thin film form, the planarizing device 90 of the curing section 86 planarizes the ultraviolet curable resin so that the film thickness of the ultraviolet curable resin is uniform. Then, the irradiation device 92 irradiates the thin film of ultraviolet curable resin with ultraviolet rays. As a result, a thin film resin layer 253 is formed on the release film 211.

[0037] Next, the inkjet head 88 ejects a thin film of ultraviolet curable resin onto the thin film resin layer 253. Then, a planarizing device 90 flattens the thin film of ultraviolet curable resin, and an irradiation device 92 irradiates the ejected thin film of ultraviolet curable resin with ultraviolet light, thereby laminating thin film resin layers 253 on thin film resin layers 253. In this manner, the ejection of ultraviolet curable resin onto the thin film resin layer 253 and the irradiation of ultraviolet light are repeated, and a plurality of resin layers 253 are laminated, thereby forming a resin laminate 252.

[0038] Next, once the resin laminate 252 is formed, the stage 52 moves below the first modeling unit 22. Then, in the first printing unit 72 of the first modeling unit 22, the inkjet head 76 ejects metal ink 260 in a linear pattern according to the circuit pattern onto the upper surface of the resin laminate 252, as shown in FIG. 6. Subsequently, in the baking unit 74 of the first modeling unit 22, the infrared irradiation device 78 irradiates infrared rays onto the metal ink 260 ejected according to the circuit pattern. This bakes the metal ink 260, and wiring 262 is formed on the upper surface of the resin laminate 252. Note that, although three wirings 262 are formed in FIG. 6, to distinguish between these three wirings 262, the wiring on the left side in FIG. 6 will be referred to as wiring 262A, the central wiring as wiring 262B, and the right wiring as wiring 262C.

[0039] Next, when the wiring 262 is formed on the resin laminate 252, the stage 52 moves to below the second modeling unit 23. Then, in the second modeling unit 23, the inkjet head 88 ejects the ultraviolet curing resin in the form of a thin film so that the ends of the three wirings 262 are exposed. Next, after the ultraviolet curing resin has been ejected in the form of a thin film, the ultraviolet curing resin is flattened in the curing unit 86 so that the film thickness of the ultraviolet curing resin becomes uniform. Then, the irradiation device 92 irradiates the thin film of ultraviolet curing resin with ultraviolet rays. As a result, a resin layer 256 is formed on the resin laminate 252, as shown in FIG. 7.

[0040] Next, the inkjet head 88 dispenses a thin film of ultraviolet curable resin only onto the resin layer 256. That is, the inkjet head 88 dispenses the ultraviolet curable resin onto the resin layer 256 so that the ends of the three wirings 262 are exposed. The thin film of ultraviolet curable resin is then flattened by a planarization device 90, and an irradiation device 92 irradiates the dispensed thin film of ultraviolet curable resin with ultraviolet light, thereby laminating a resin layer 256 on top of the resin layer 256. In this manner, the dispensing of the ultraviolet curable resin onto the resin layer 256 and the irradiation of ultraviolet light are repeated, and a plurality of resin layers 256 are laminated, thereby forming a resin laminate 257. As a result, the resin laminate 257 is formed on the resin laminate 252, and the step between the resin laminate 252 and the resin laminate 257 functions as a cavity 254.

[0041] Here, as shown in FIG. 13 (described later), when the electronic component 270 is mounted, the electronic component 270 is pressed toward the resin laminate 252. FIG. 15 shows a side view of the electronic component 270. FIG. 16 is a bottom view of the electronic component 270, illustrating the position of a support portion 276 relative to a component body 271 (described later). As shown in FIGS. 15 and 16, the electronic component 270 is, for example, a small outline diode (SOD) and includes a thin, plate-like component body 271 and a pair of leads 272. The component body 271 has a rectangular shape in a plan view. Each of the pair of leads 272 is, for example, a gull-wing type lead, and is extended outward from the center of each of the two short sides of the component body 271. The pair of leads 272 have the same shape and are located opposite each other with the component body 271 sandwiched therebetween. The pair of leads 272 are extended in opposite directions from the component body 271, forming a symmetrical structure. 15 and 16, each of the pair of leads 272 is pulled out from the component body 271 to the outside in the left-right direction in FIGS. 15 and 16, and is pulled out in a direction along the edge of the long side of the component body 271. Each of the pair of leads 272 gradually slopes downward as it moves outward from the pulled-out position, and then bends in a direction parallel to the bottom surface of the component body 271. The lower ends 272A (the tip portions after bending) of the pair of leads 272 are at the same height as the lower end 271A of the component body 271.

[0042] 15 and 16 is merely an example. For example, the electronic component 270 may be another type of electronic component, such as a small outline transistor (SOT) or a small outline package (SOP). Therefore, the number of leads 272 is not limited to two. Furthermore, the leads 272 are not limited to a gull-wing type, and may be of other types, such as a flat type or a J-type. Furthermore, the lower ends 272A of the leads 272 and the lower end 272A of the component body 271 may be at different heights. For example, the electronic component 270 may be configured such that the lower ends 272A of the leads 272 are positioned lower than the lower end 272A of the component body 271.

[0043] When the leads 272 of the electronic component 270 are brought into contact with uncured conductive paste 266 (see FIG. 8 ), and the electronic component 270 is pressed by the pressing member 165 of the pressing unit 26 and heated by the heater 121, the leads 272 and the wiring 262 are electrically connected by the cured conductive paste 266. However, when the electronic component 270 is pressed against the resin laminate 252, the electronic component 270 may tilt. Furthermore, misalignment between the leads 272 and the wiring 262 may occur. In particular, an electronic component 270 having only two leads 272, such as an SOD, is less balanced than an electronic component 270 having three or more leads 272, and is more likely to tilt when pressed. In addition, in this embodiment, an elastic member 169 is used as the pressing member 165. The elastic member 169 deforms when it comes into contact with the electronic component 270 when pressed (see FIG. 13 ). As a result, when pressing electronic components 270 of different heights, the elastic member 169 elastically deforms, allowing the electronic components 270 of different heights to be pressed appropriately. Furthermore, the elastic deformation can prevent damage to the electronic components 270 due to pressing. However, the force applied from the elastic member 169 to the component body 271 may be transmitted as a force other than a force pressing the component body 271 straight downward due to deformation of the elastic member 169. Furthermore, heating by the heater 121 during pressing may cause the elastic member 169 to deform due to thermal expansion. This deformation may also cause part of the pressing force of the elastic member 169 to be directed obliquely downward rather than directly downward. Therefore, when a deformable member such as the elastic member 169 is brought into contact with the electronic component 270 and pressed, the electronic component 270 may tilt. This may result in poor electrical connection.

[0044] Therefore, in this embodiment, before placing electronic component 270 on top surface 252A of resin laminate 252, conductive paste 266 is discharged onto a portion of the region below component body 271 and hardened to form a support portion. The formed support portion supports component body 271 from below, thereby preventing electronic component 270 from tilting. In the following explanation, conductive paste 266 hardened on wiring 262 and electrically connecting wiring 262 and leads 272 will be referred to as a bump. Furthermore, hardened conductive paste 266 placed below component body 271 and supporting component body 271 from below will be referred to as a support portion.

[0045] In this embodiment, the use of a conductive paste 266 with a low elastic modulus allows the leads 272 and the wiring 262 to be electrically connected well via the bumps, and the support portion can support the component body 271. Specifically, the elastic modulus of the bumps and the support portion, i.e., the elastic modulus of the conductive paste 266 when hardened, is, for example, 0.2 GPa or less. The elastic modulus is a physical property that indicates the resistance to deformation and is a general term for the proportional constant between stress and strain in elastic deformation. The smaller the elastic modulus, the easier an object is to elastically deform. By using a conductive paste with a low elastic modulus, even if the resin laminate 252 warps due to heat during molding, generating stress in the resin laminate 252, the generated stress can be alleviated by the bumps, ensuring conductivity between the wiring 262 and the leads 272.

[0046] However, if the uncured conductive paste 266 comes into contact with the leads 272 and the electronic component 270 is pressed by the pressing member 165, the conductive paste 266 on the wiring 262 may be crushed, resulting in a thinner bump after curing and a reduced conformability of the bump, which may make it difficult to ensure proper conductivity. Therefore, in this embodiment, the conductive paste 266 is cured and elastically exerted before the electronic component 270 is mounted. This prevents the bump from being crushed too much when pressed against the leads 272, ensuring the bump thickness and conformability. Furthermore, the conductive paste 266 is again ejected onto the cured bump, thereby improving adhesion between the leads 272 and the bump.

[0047] More specifically, when the resin laminate 257 is formed on the resin laminate 252, the stage 52 moves below the third modeling unit 24. Then, in the third printing unit 100 of the third modeling unit 24, the dispenser 106 dispenses the conductive paste 266 onto both end portions of the wiring 262B and onto the end portions of the wiring 262A and the wiring 262C that face both end portions of the wiring 262B, as shown in Fig. 8. The positions where the conductive paste 266 is dispensed are an example of the intended mounting position of the present disclosure.

[0048] Furthermore, the dispenser 106 dispenses the conductive paste 266 onto the upper surface 252A of the resin laminate 252 between the wirings 262 (inside the cavities 254). The positions where the conductive paste 266 is dispensed are an example of a portion of the intended arrangement region of the present disclosure. The conductive paste 266 dispensed onto the upper surface 252A hardens and functions as a support portion. For this reason, the conductive paste 266 dispensed onto the upper surface 252A is referred to as conductive paste 266A to distinguish it from the conductive paste 266 dispensed onto the wirings 262 and functioning as a bump.

[0049] FIG. 16 shows the dispensed positions of the conductive paste 266A (support portion 276). As shown in FIG. 16, the electronic component 270 of this embodiment has a pair of leads 272 provided on each of the two short sides of the component body 271. When the electronic component 270 is placed, the conductive paste 266A is dispensed onto a portion of the bottom surface 271B of the component body 271 that is close to the short sides. That is, the conductive paste 266A is dispensed onto a position on the top surface 252A that faces in the up-down direction the portion close to the short sides of the component body 271, within the planned placement area where the mounting unit 27 will place the component body 271 of the electronic component 270 in a subsequent process. The conductive paste 266A is dispensed onto an area of ​​the planned placement area that is along the short sides of the component body 271 and includes approximately both ends of the short sides.

[0050] 8 (an example of the first and second application steps of the present disclosure), the amount of conductive paste 266A dispensed per unit area is the same as the amount of conductive paste 266 dispensed per unit area. For example, the amount of conductive paste 266A dispensed per unit time from dispenser 106 and the number of scanning operations (number of layers) performed by dispenser 106 are the same as the amount of conductive paste 266 dispensed per unit time and the number of scanning operations. Therefore, the conductive paste 266A on upper surface 252A is dispensed in the same amount per unit area as the conductive paste 266 on wiring 262. Because the thickness of wiring 262 is extremely thin, as shown by the dashed line in FIG. 8, if the conductive paste 266A on upper surface 252A and the conductive paste 266 on wiring 262 are dispensed in the same amount, the heights of the two conductive pastes 266, 266A from upper surface 252A will be approximately the same. This allows the hardened bump 275 and the support portion 276 to support the electronic component 270 at the same height. Furthermore, there is no need to change the amount of conductive paste 266, 266A dispensed per unit time or the number of scans for each conductive paste 266, 266A, i.e., for each position where the conductive paste is dispensed. For convenience of explanation, the thickness of the wiring 262 is illustrated as thick in FIG. 8 and other figures. Furthermore, the amount of conductive paste 266, 266A dispensed per unit time, the number of scans, the moving speed of the stage 52, and the like may be adjusted taking the thickness of the wiring 262 into consideration. For example, the number of scans of the conductive paste 266A may be increased compared to the number of scans of the conductive paste 266 by the thickness of the wiring 262. This allows the heights of the conductive pastes 266, 266A from the upper surface 252A to be more reliably consistent. Alternatively, the height adjustment may be performed using the conductive paste 266B, which will be described later.

[0051] After discharging the conductive pastes 266 and 266A in this manner, the control device 28 heats the resin laminate 252 using the heater 66 built into the base 60 (an example of a curing process of the present disclosure). The heating temperature is, for example, a temperature (e.g., 80°C) at which the conductive pastes 266 and 266A harden. As a result, the conductive paste 266 is heated and hardened through the resin laminate 252, thereby forming a bump 275 (see FIG. 9) on the wiring 262. Furthermore, the conductive paste 266A is heated and hardened through the resin laminate 252, thereby forming a support portion 276 on the upper surface 252A. The support portion 276 is formed in the cavity 254 at a position (position shown in FIG. 16) where the component body 271 is to be disposed. Furthermore, the position of the upper end of the bump 275 and the position of the upper end of the support portion 276 are at approximately the same height (see the dashed line in FIG. 8).

[0052] Next, as shown in FIG. 9 , the dispenser 106 of the third printing unit 100 dispenses the conductive paste 266 onto the bumps 275 and the support portions 276 (an example of a third applying step of the present disclosure). In the following description, the conductive paste 266 dispensed onto the bumps 275 and the support portions 276 after hardening may be referred to as conductive paste 266B. The control device 28 controls, for example, so that the same amount of conductive paste 266B is dispensed per unit area onto the bumps 275 and the support portions 276. The heights of the bumps 275 and the support portions 276 after the conductive paste 266B has been dispensed, i.e., the heights of the bumps 275 and the support portions 276 including the conductive paste 266B from the upper surface 252A, are approximately the same height, as indicated by the dashed lines in FIG. 9 .

[0053] Furthermore, the control device 28 controls the amount of conductive paste 266B dispensed per unit area so that it is less than the amount of conductive paste 266, 266A dispensed. For example, the control device 28 reduces the amount of conductive paste 266B dispensed per unit time by setting the amount of conductive paste 266B dispensed per unit time to be the same as that of conductive paste 266, 266A, and increasing the moving speed of the stage 52, i.e., the relative speed between the stage 52 and the dispenser 106. This prevents the conductive paste 266B from spilling out of the bump 275 or the support portion 276. The control device 28 may adjust the amount of conductive paste dispensed by controlling the amount of conductive paste dispensed per unit time or the number of operations of the dispenser 106. Alternatively, the amount of conductive paste dispensed by the dispenser 106 may be set to be the same as that of conductive paste 266, 266A.

[0054] In this way, when the conductive paste 266B is dispensed onto the bumps 275 and the support portions 276, the stage 52 moves below the fourth modeling unit 25. Then, in the fourth printing unit 110 of the fourth modeling unit 25, the dispenser 116 dispenses the thermosetting resin 277 onto the upper surface 252A of the resin laminate 252 between the ends of the two opposing wirings 262A and B, as shown in FIG. 10 , and dispenses the thermosetting resin 277 onto the upper surface 252A between the ends of the two opposing wirings 262B and C (an example of a thermosetting resin application process of the present disclosure).

[0055] Then, once the thermosetting resin 277 has been dispensed, the stage 52 moves to below the mounting unit 27. The mounting unit 27 supplies electronic components 270 (see FIG. 15 ) using the tape feeder 134, and holds the electronic components 270 with the suction nozzles of the mounting head 136. The mounting head 136 is moved by the moving device 138, and mounts the electronic components 270 held by the suction nozzles so that they are electrically connected to the wiring 262, as shown in FIG. 11 (this is an example of an electronic component placement process of the present disclosure).

[0056] Specifically, for example, as shown in electronic component 270 on the right side of FIG. 11 , leads 272 are positioned so as to contact from above uncured conductive paste 266B dispensed onto bumps 275. In other words, bumps 275 are positioned (shaped) at planned mounting positions for leads 272 (electronic component 270) that are set in advance by the control program of mounting unit 27 or the like. Furthermore, component body 271 of electronic component 270 is positioned so as to contact from above uncured conductive paste 266B on support portion 276 formed between wirings 262B and 262C. In other words, support portion 276 is positioned (shaped) at a part of planned mounting positions for component body 271 (electronic component 270) that are set in advance by the control program of mounting unit 27 or the like.

[0057] The component body 271 also comes into contact with uncured thermosetting resin 277 dispensed between the wirings 262B and 262C. The thermosetting resin 277 fills gaps between the component body 271 and the resin laminate 252 (such as gaps between the support portions 276), sealing the gap between the lower surface of the component body 271 and the upper surface 252A of the resin laminate 252. The thermosetting resin 277 is also enclosed between the metallic support portions 276 and the bumps 275, insulating the two metal members. This prevents short-circuiting between the support portions 276 and the bumps 275.

[0058] Once electronic component 270 has been mounted in this manner, stage 52 moves below pressing unit 26. Pallet 61 carrying resin laminate 252 is transported forward in the front-to-rear direction as shown by arrow 161 in FIG. 4, and is carried into pallet placement section 152A of pressing unit 26. As shown in FIG. 12, pressing member 165 is positioned so as to face electronic component 270 placed on resin laminate 252 in the vertical direction. At this time, two low-friction sheets 170 are positioned with a predetermined amount of slack, and are positioned, for example, slightly below elastic member 169 in the vertical direction, and are spaced apart from elastic member 169.

[0059] Control device 28 drives drive unit 120 to raise movable unit 152 and move pallet 61 toward pressing member 165. As shown in FIG. 13 , electronic component 270 mounted on resin laminate 252 is pressed against base member 168 disposed above, via elastic member 169 and two low-friction sheets 170 (an example of the pressing process of the present disclosure). Electronic component 270 is pressed toward resin laminate 252 by base member 168. Leads 272 are pressed against bumps 275 via uncured conductive paste 266B, and come into close contact with bumps 275. At this time, because bumps 275 have cured before electronic component 270 is mounted, electronic component 270 is not crushed too much when pressed, and the thickness does not become too thin, ensuring a predetermined thickness. In this way, by hardening conductive paste 266 before mounting electronic component 270, it is possible to ensure the thickness of bump 275 and the conformability of bump 275. Therefore, by ensuring a predetermined thickness with lower bump 275 and also forming upper conductive paste 266B as a bump, it is possible to ensure adhesion between lead 272 and bump 275 (wiring 262).

[0060] Furthermore, the component body 271 is supported by a plurality of support portions 276 formed below. Because the support portions 276 are also hardened before the electronic component 270 is attached, they can support the component body 271 from below while elastically deforming with a low elastic modulus. As a result, even if a force other than a pressing force directed directly downward acts on the component body 271, the support portions 276 support the component body 271, preventing the electronic component 270 from tilting or shifting in position.

[0061] Furthermore, electronic component 270 is pressed by elastic member 169 with low-friction sheet 170 sandwiched between elastic member 169 and electronic component 270. This allows pressing member 165 and electronic component 270 to slide relatively with low-friction sheet 170, thereby reducing the force acting in a direction different from the pressing direction (vertical direction), and enabling more appropriate pressing of electronic component 270 arranged on resin laminate 252. As a result, low-friction sheet 170 can also suppress tilting or displacement of electronic component 270 due to pressing.

[0062] Furthermore, when electronic component 270 is pressed, heater 121 applies heat, and conductive paste 266B on bump 275 is heated and hardened while being compressed between bump 275 and lead 272. When conductive paste 266B hardens, it exhibits conductivity. When conductive paste 266B is heated in a compressed state, metal particles contained in conductive paste 266B adhere to each other, increasing the conductivity. As a result, lead 272 is electrically connected to and fixed to wiring 262 via hardened conductive paste 266B and bump 275.

[0063] Furthermore, the thermosetting resin 277 is heated and hardened while being compressed between the resin laminate 252 and the component body 271. Furthermore, the conductive paste 266B on the support portion 276 is hardened while being compressed between the component body 271 and the support portion 276. As a result, the component body 271 is fixed to the resin laminate 252 by the thermosetting resin 277 and the support portion 276. This fixation ensures an electrical connection between the electronic component 270 and the wiring 262. The heating temperature here is a temperature (e.g., 80°C) at which the conductive paste 266B and the thermosetting resin 277 harden.

[0064] When the pressing unit 26 completes pressing, the stage 52 moves below the fourth modeling unit 25. In the fourth printing unit 110 of the fourth modeling unit 25, the dispenser 116 dispenses the thermosetting resin 280 around the electronic component 270 so as to cover the side surfaces of the component body 271 of the electronic component 270, as shown in FIG. 14 . Then, the heater 66 built in the base 60 heats the resin laminate 252. This heats and hardens the thermosetting resin 280 through the resin laminate 252. The thermosetting resin 280 hardens while covering the side surfaces of the component body 271. That is, in the electronic component 270 mounted on the resin laminate 252, the thermosetting resins 277, 280 are sealed between the upper surface of the resin laminate 252 and the lower surface of the component body 271, and harden while covering the side surfaces of the component body 271. The electronic component 270 mounted on the upper surface of the resin laminate 252 is fixed by the hardened resin. In this manner, the electronic component 270 and the wiring 262 are electrically connected by the bumps 275, and the circuit board 159 is manufactured.

[0065] (Applied area of ​​conductive paste 266A) Next, the application area of ​​the conductive paste 266A that forms the support portion 276 will be described. Forming the support portion 276 can prevent tilting of the electronic component 270. On the other hand, if the area occupied by the support portion 276 in the region below the component body 271 (an example of a planned arrangement region in the present disclosure), i.e., if the support portion 276 supporting the component body 271 is too large (too many), the support portion 276 may not be sufficiently compressed when pressed, which may result in poor conductivity. In other words, if too much conductive paste 266A is applied below the component body 271, the bump 275 and the support portion 276 may not be sufficiently compressed, which may increase the distance between the lead 272 and the bump 275 and result in poor conductivity.

[0066] Therefore, the control device 28 sets the application area of ​​the conductive paste 266A using, for example, the following calculation formula: First, the pressing force per unit area (unit pressing force) pressed by the pressing member 165 (elastic member 169) can be calculated using the following formula (Formula 1). Unit pressure [N / mm 2] = Load [N] ÷ Area of ​​elastic member 169 [mm 2 ] ...(Formula 1) The "load" in the above (Equation 1) is the total load (pressing force) applied to the pressing member 165 by the pressing unit 26. The "area of ​​the elastic member 169" is the area of ​​the lower surface (pressing surface) of the elastic member 169.

[0067] Moreover, the total load (component load) applied to electronic component 270 (component body 271) when pressed can be calculated using the following equation (2). Part load [N] = unit pressing force [N / mm 2 ] × area of ​​the upper surface of the component body 271 that comes into contact with the elastic member 169 [mm 2 ] ...(Formula 2)

[0068] The relationship between the application area of ​​the conductive paste 266, 266A and the component load can be expressed by the following formula (Formula 3). Conductive paste 266, 266A application area [mm 2 ] = component load [N] ÷ pressure required to ensure conductivity on conductive paste 266 [N / mm 2 ] ...(Formula 3) The "application area of ​​conductive paste 266, 266A" in the above (Equation 3) is the total area of ​​the region where conductive paste 266 is applied to wiring 262 in a plan view of upper surface 252A of resin laminate 252 (when upper surface 252A is viewed from above) and the region where conductive paste 266A is applied to upper surface 252A. Furthermore, the "necessary pressure on conductive paste 266 necessary to ensure conduction" is the pressure that needs to be applied to conductive paste 266 (bump 275) when pressed in order to properly electrically connect lead 272 to wiring 262 via conductive paste 266. An appropriate value for this necessary pressure can be set in advance by simulation or the like.

[0069] In addition, in a plan view of the upper surface 252A, the area where the conductive paste 266A needs to be applied below the component body 271 can be expressed by the following formula (Formula 4). The area of ​​conductive paste 266A applied under component body 271 [mm2 ] ≦ Application area of ​​conductive paste 266, 266A [mm2] - Application area of ​​conductive paste 266 [mm 2 ] ...(Formula 4) The "application area of ​​conductive paste 266" in (Equation 4) is the area of ​​conductive paste 266 applied onto wiring 262 in a plan view, and takes a different value depending on the size and number of leads 272.

[0070] For example, the memory device of the control device 28 stores parameters for each electronic component 270 to be mounted (area [mm 2 ], the application area of ​​the conductive paste 266 according to the lead 272 [mm 2 The control device 28 calculates the application area [mm ] of the conductive paste 266A below the component body 271 by substituting the parameters, the load values, and the like into the above-described formulas 1 to 4. 2 ] can be calculated. The value of the application area of ​​the conductive paste 266A may be calculated in advance and set as data in the control device 28. Furthermore, the thermosetting resin 277 of this embodiment is in a highly fluid state, such as a gel state, before it hardens. Therefore, it can be ignored in the calculation of the application area described above. However, when the thermosetting resin 277 has a high viscosity, the application area may be set taking into account the reaction force of the thermosetting resin 277 against the pressure.

[0071] Conductive paste 266, 266A application area [mm 2 16, is the total area (area in a plan view) of the four application regions where the conductive paste 266, 266A is applied. Also, the application area [mm 2 ] is the total area of ​​the two application regions where the conductive paste 266A shown in Fig. 16 is applied. The control device 28 can ensure conductivity more reliably by adjusting the application area of ​​the conductive paste 266A according to the application area calculated by the above formula.

[0072] 8 is determined based on the load applied to the component body 271 in the pressing step shown in FIG. 13 and the pressure required to apply to the conductive paste 266 in the pressing step to electrically connect the lead 272 to the wiring 262 via the conductive paste 266. This allows the amounts of conductive paste 266 and 266A to be determined based on the pressure required to press the conductive paste 266 to ensure conductivity. In other words, the required pressure can be applied by applying only the determined amount. Applying the determined amount of conductive paste 266 ensures conductivity between the electronic component 270 and the wiring 262 while suppressing tilting of the electronic component 270.

[0073] 8, the total area of ​​the area where conductive paste 266 is applied on resin laminate 252 (wiring 262) and the area where conductive paste 266A is applied on top surface 252A of one electronic component 270 is the value obtained by dividing the load applied to component body 271 in the pressing step by the required pressure per unit area (Equation 3, Equation 4). This makes it possible to calculate the total area from the load and the required pressure. The component load [N] to be pressed in advance and the required pressure per unit area [N / mm 2 ], the total area can be calculated. The application area of ​​conductive paste 266 can be determined depending on the number of leads 272, the shape of wiring 262, etc. Therefore, the required application area of ​​conductive paste 266A can be determined by subtracting the application area of ​​conductive paste 266 from the total area.

[0074] 16, conductive paste 266A is applied to each of the four edges on the underside of component body 271, located below a pair of opposing edges (edges on two short sides) on upper surface 252A of resin laminate 252. This allows the edges of component body 271 to be supported from below by support 276, preventing tilting of component body 271. Together with bumps 275 below a pair of leads 272, component body 271 can be supported at multiple locations, preventing tilting when pressed.

[0075] 8 and 9, the amount of conductive paste 266A dispensed per unit area is the same as the amount of conductive paste 266 dispensed per unit area. This allows the heights of conductive pastes 266 and 266A dispensed at different positions to be the same, and the heights of bumps 275 and support portions 276 from upper surface 252A after hardening to be the same. Electronic component 270 can be supported at the same height and at multiple points, preventing tilting or other problems from occurring when pressed.

[0076] 15 and 16, the electronic component 270 of this embodiment has a pair of leads 272, each of which is drawn out in a different direction from the component body 271. An electronic component 270 provided with only a pair of leads 272 is more likely to be unbalanced than an electronic component 270 provided with three or more leads 272. For this reason, when mounting an electronic component 270 with two leads 272, such as a diode, it is extremely effective to form a support portion 276 to support the component body 271 from below.

[0077] Control device 28 also applies thermosetting resin 277 below component body 271 (see FIG. 10 ). Then, during pressing, control device 28 heats and hardens thermosetting resin 277 while pressing electronic component 270, and fixes electronic component 270 to resin laminate 252 with thermosetting resin 277. This allows the position of electronic component 270 to be fixed relative to resin laminate 252 while ensuring good electrical conduction between leads 272 and wiring 262 through pressing. Furthermore, thermosetting resin 277 can insulate support portion 276 (conductive paste 266A) formed below component body 271 from leads 272 and conductive paste 266 on leads 272.

[0078] Furthermore, control device 28 applies conductive paste 266B onto bump 275 after conductive paste 266 has hardened (see FIG. 9). Conductive paste 266B comes into contact with lead 272 when electronic component 270 is arranged, and hardens when pressed. As a result, when lead 272 is pressed while conductive paste 266B is still unhardened, conductive paste 266B and lead 272 come into close contact with each other. Then, when conductive paste 266B is hardened by heating with heater 121, bump 275 is formed in close contact with lead 272. It is possible to appropriately ensure electrical continuity between wiring 262 and lead 272.

[0079] The pressing unit 26 also includes an elastic member 169 that contacts and presses the electronic component 270, and a movement mechanism 155 that raises the circuit board 159 during pressing and presses the electronic component 270 against the resin laminate 252 using the elastic member 169. By using the elastic member 169 for pressing, electronic components 270 of different heights can be appropriately pressed (see FIG. 13 ). However, deformation of the elastic member 169 during pressing may cause a risk that the direction of part of the force applied from the elastic member 169 to the electronic component 270 may differ from the direction (downward) that presses the electronic component 270 directly below toward the resin laminate 252. In other words, there is a risk that not all of the force applied during pressing acts as a force that presses the electronic component 270 straight toward the resin laminate 252. In contrast, in this embodiment, the component body 271 is supported from below by a support portion 276. This allows the elastic member 169 to press the electronic components 270 of different heights, while the support portion 276 can prevent the electronic components 270 from tilting or the like.

[0080] 2, controller 140 of control device 28 has first dispenser 281, second dispenser 282, curing unit 283, electronic component placement unit 284, pressing unit 285, thermosetting resin dispenser 286, and third dispenser 287. First dispenser 281 is a functional unit that applies conductive paste 266 to intended mounting positions of leads 272 on wiring 262 formed on upper surface 252A of resin laminate 252. Second dispenser 282 is a functional unit that applies conductive paste 266A to part of the intended placement area of ​​component body 271 of electronic component 270 on upper surface 252A. Curing unit 283 is a functional unit that hardens conductive pastes 266, 266A. Electronic component placement unit 284 is a functional unit that places electronic component 270 at a position where lead 272 is placed on conductive paste 266 applied by first application unit 281 and component body 271 is placed on conductive paste 266A applied by second application unit 282. Pressing unit 285 is a functional unit that presses electronic component 270 placed by electronic component placement unit 284 against resin laminate 252 to attach electronic component 270 to resin laminate 252. Thermosetting resin application unit 286 is a functional unit that applies thermosetting resin 277 to a portion of the area on top surface 252A of resin laminate 252 where component body 271 is to be placed. Third application unit 287 is a functional unit that applies conductive paste 266B on conductive paste 266 that has been applied by first application unit 281 and cured by curing unit 283.

[0081] The relationship between the contents of the present disclosure and the terminology used in the above embodiments is as follows: In the above embodiments, the board forming apparatus 10 is an example of an electronic component mounting apparatus. The pressing unit 26 is an example of a pressing device. The mounting unit 27 is an example of a placement device. The heater 66 is an example of a curing device. The third printing unit 100 is an example of a coating device. The resin laminate 252 is an example of an insulating layer. The conductive pastes 266, 266A, and 266B are examples of conductive fluids. The process performed by the first coating unit 281 is an example of a first coating process or a first coating treatment. The process performed by the second coating unit 282 is an example of a second coating process or a second coating treatment. The process performed by the curing unit 283 is an example of a curing process or a curing treatment. The process performed by the electronic component placement unit 284 is an example of an electronic component placement process or an electronic component placement treatment. The process performed by the pressing unit 285 is an example of a pressing process or a pressing treatment. The process performed by the thermosetting resin applying unit 286 is an example of a thermosetting resin applying process. The process performed by the third applying unit 287 is an example of a third applying process.

[0082] As described above, the above embodiment provides the following effects. Control device 28 in one aspect of this embodiment applies conductive paste 266 onto wiring 262 formed on upper surface 252A of resin laminate 252, applies conductive paste 266A to an area on upper surface 252A where component body 271 is to be disposed, and hardens the applied conductive pastes 266, 266A ( FIG. 8 ). Control device 28 then places electronic component 270 at a position where leads 272 are disposed on bumps 275 and component body 271 is disposed on supports 276 ( FIG. 11 ). Control device 28 then presses electronic component 270 against resin laminate 252 to mount electronic component 270 on resin laminate 252 ( FIG. 13 ).

[0083] According to this, when pressing unit 26 presses electronic component 270 against resin laminate 252, component body 271 can be supported from below by support portion 276 formed of hardened conductive paste 266A. Therefore, even if part of the force applied to electronic component 270 during pressing acts in a direction that tilts electronic component 270, tilting or misalignment can be suppressed by supporting component body 271 with support portion 276. As a result, leads 272 and wiring 262 can be electrically connected satisfactorily via bumps 275.

[0084] The contents of the present disclosure are not limited to the above-described embodiments, but can be implemented in various forms with various modifications and improvements based on the knowledge of those skilled in the art. For example, in the above embodiment, the moving mechanism 155 moves the movable part 152 (insulating layer) to perform the pressing, but this is not limiting. For example, a moving mechanism that lowers the pressing member 165 may be provided so that the pressing member 165 is pressed against the circuit board 159 from above. Alternatively, the pressing may be performed by moving both the component mounting member 163 and the movable part 152. Therefore, the pressing may be performed by moving at least one of the pressing member 165 and the circuit board 159, with the low-friction sheet 170 sandwiched therebetween. Furthermore, the pressing unit 26 may not have the elastic member 169 . Furthermore, the pressing unit 26 may not be provided with the low-friction sheet 170 .

[0085] Furthermore, the materials used in the manufacturing process, and the content and order of the processes described above are merely examples, and may be changed as appropriate depending on the object to be manufactured. For example, as shown in Fig. 16, in the above embodiment, the conductive paste 266A is applied to two locations along the short side of the underside 271B of the component body 271, but this is not limited to this. For example, as shown in Fig. 17, the conductive paste 266A may be applied to two locations along the long side of the underside 271B. In the example shown in Fig. 17, the conductive paste 266A is applied along the long side from one end of the long side to the position that will become the other end of the long side. 18, conductive paste 266A may be applied to positions beneath all corners (four corners in the case of FIG. 18) of component body 271. In the example shown in FIG. 18, conductive paste 266A is applied to square regions near each corner. In both of the cases shown in FIGS. 17 and 18, the component body 271 can be supported at multiple locations together with the bumps 275 below the pair of leads 272, thereby preventing tilting or other problems during pressing. Alternatively, the application methods shown in FIGS. 16, 17, and 18 may be combined. For example, the conductive paste 266A may be applied to the bottom of all four sides (long sides and short sides) of the bottom surface 271B to form the support portions 276. Alternatively, the support portion 276 may be formed in the center of the bottom surface 271B. Therefore, the positions where the support portions 276 are formed can be changed as appropriate depending on the positions and shapes of the component body 271 and the leads 272. In particular, it is preferable to support the electronic component 270 at three different positions, including the bumps 275 below the leads 272, and at three or more positions that are offset from one another in the XY coordinate system parallel to the top surface 252A.

[0086] In the above embodiment, the lower end 271A of the component body 271 and the lower end 272A of the lead 272 are at the same height, and the bump 275 and the support portion 276 are at the same height. However, this is not limited to this. For example, even if the lower end 271A and the lower end 272A are at different heights, as long as the difference in height is on the order of a few tenths of a micron, the gap between them is filled during pressing, and there is little impact. Specifically, for example, if the lower end 272A is positioned lower than the lower end 271A, the distance between the bump 275 and the lead 272 is shorter than the distance between the support portion 276 and the component body 271. However, when pressing begins, the bump 275 and the lead 272 come into contact first, compressing the bump 275, and the component body 271 soon comes into contact with the support portion 276. In other words, there is little substantial impact in terms of supporting the component body 271. On the other hand, if there is a large difference in height between bottom end 271A and bottom end 272A, it is also possible to adjust the heights of bump 275 and support portion 276. That is, if bottom end 272A of lead 272 is located significantly lower than bottom end 271A of component body 271, the gap may be adjusted by making support portion 276 relatively higher than bump 275. Furthermore, the shape of the wiring in the present disclosure is not particularly limited. For example, the wiring may be a rectangular external terminal. The application amounts of conductive paste 266, 266A may be determined by a method other than the required pressure. For example, the application amounts may be determined by the ratio of the application areas of conductive paste 266 and conductive paste 266A.

[0087] Furthermore, although in the above embodiment, conductive paste 266B is applied onto support portion 276, it is not necessary to apply it. That is, after conductive paste 266A that will become support portion 276 is hardened, conductive paste 266B does not have to be applied to support portion 276, as with bump 275. This is because there is no need to ensure conductivity for support portion 276. Furthermore, in the above embodiment, the thermosetting resin 277 is applied under the component body 271, but this does not have to be applied. Furthermore, in the above embodiment, the support portion 276 is formed of the conductive paste 266, but other materials may also be used. For example, the support portion 276 may be formed of the metal ink 260 discharged by the first printing unit 72. Alternatively, the support portion 276 may be formed of the ultraviolet curable resin discharged by the second modeling unit 23. In this case, the metal ink 260 or the ultraviolet curable resin may be cured before the electronic component 270 is mounted on the circuit board 159. Therefore, the fluid that forms the support portion 276 may be a different fluid from the fluid that forms the bumps 275. Furthermore, before the electronic component 270 is mounted, the thermosetting resin 277 is discharged onto the resin laminate 252, and after the electronic component 270 is mounted, the thermosetting resin 280 is discharged onto the resin laminate 252. However, the thermosetting resin 277 and the thermosetting resin 280 may be discharged onto the resin laminate 252 after the electronic component 270 is mounted.

[0088] Although the resin laminate 252 is used as the insulating layer in the present disclosure, the present disclosure is not limited to this. The insulating layer in the present disclosure may be a layer formed of an insulating material other than resin or other insulating material containing resin. In the above embodiment, heaters 121 are provided on both part mounting member 163 and movable part 152, but heaters 121 may be provided on only one of them. Also, heating may be performed by installing a halogen heater or a hot air device at a position separate from part mounting member 163 or movable part 152. In the above embodiment, the resin laminate 252 and the wiring 262 are formed by three-dimensional additive manufacturing, but the method is not limited to this. For example, the insulating layer may be manufactured using a spin coating method, a spray method, a film lamination method, or the like. Furthermore, the wiring may be manufactured using, for example, etching or plating processing. Furthermore, in the above embodiment, the conductive paste 266 is used as the conductive fluid that electrically connects the wiring 262 and the lead 272 of the electronic component 270, but various fluids can be used as long as they exhibit conductivity. Furthermore, in the above embodiment, a thermosetting resin is used as the curable resin for fixing the electronic component 270, but an ultraviolet curable resin, a thermoplastic resin, or the like can also be used. Furthermore, in the above embodiment, the conductive paste 266 is dispensed by the dispenser 106, but it may be transferred by a transfer device or the like. Furthermore, the conductive paste 266 may be printed by screen printing.

[0089] The contents of the present disclosure are not limited to the dependency relationships set forth in the claims. For example, this specification also discloses the technical idea of ​​changing "the electronic component mounting method according to claim 1 or claim 2" in claim 4 to "the electronic component mounting method according to any one of claims 1 to 3." For example, this specification also discloses the technical idea of ​​changing "the electronic component mounting method according to claim 1 or claim 2" in claim 5 to "the electronic component mounting method according to any one of claims 1 to 4." For example, this specification also discloses the technical idea of ​​changing "the electronic component mounting method according to claim 1 or claim 2" in claim 6 to "the electronic component mounting method according to any one of claims 1 to 5." For example, this specification also discloses the technical idea of ​​changing "the electronic component mounting method according to claim 1 or claim 2" in claim 7 to "the electronic component mounting method according to any one of claims 1 to 6." This specification also discloses the technical idea of, for example, changing "the electronic component mounting method according to claim 1 or claim 2" in claim 8 to "the electronic component mounting method according to any one of claims 1 to 7." This specification also discloses the technical idea of, for example, changing "the electronic component mounting method according to claim 1 or claim 2" in claim 9 to "the electronic component mounting method according to any one of claims 1 to 8." [Explanation of symbols]

[0090] 10 substrate forming apparatus (electronic component mounting apparatus), 26 pressing unit (pressing device), 27 mounting unit (placement device), 28 control device, 66 heater (curing device), 100 third printing unit (applicator), 155 moving mechanism, 169 elastic member, 252 resin laminate (insulating layer), 252A upper surface, 262, 262A, 262B, 262C wiring, 266, 266A, 266B conductive paste (conductive fluid), 270 electronic component, 271B lower surface, 272 lead, 277 thermosetting resin, 281 first application unit, 282 second application unit, 283 curing unit, 284 electronic component placement unit, 285 pressing unit, 286 thermosetting resin application unit, 287 third application unit.

Claims

1. 1. An electronic component mounting method for mounting an electronic component having leads on an insulating layer, comprising: a first application step of applying a conductive fluid to a position on the wiring formed on the upper surface of the insulating layer where the lead is to be attached; a second application step of applying the conductive fluid to a portion of a region on the upper surface where a component body of the electronic component is to be arranged; a curing step of curing the conductive fluid; an electronic component placement step of placing the electronic component at a position where the leads are placed on the conductive fluid applied in the first application step and the component body is placed on the conductive fluid applied in the second application step; a pressing step of pressing the electronic components arranged in the electronic component arrangement step against the insulating layer to attach the electronic components to the insulating layer; An electronic component mounting method comprising:

2. The amount of the conductive fluid applied in the second application step is 2. The electronic component mounting method according to claim 1, wherein the pressure is determined based on the load applied to the component body in the pressing step and the required pressure that needs to be applied to the conductive fluid in the pressing step in order to electrically connect the lead to the wiring via the conductive fluid applied in the first application step.

3. The total area of ​​the area where the conductive fluid is applied to the upper surface of the insulating layer in the first application step and the area of ​​the area where the conductive fluid is applied to the upper surface of the insulating layer in the second application step is 3. The electronic component mounting method according to claim 2, wherein the load applied to the component body in the pressing step is a value obtained by dividing the load by the required pressure per unit area.

4. In the second coating step, 3. The electronic component mounting method according to claim 1, wherein the conductive fluid is applied to each of the positions below at least a pair of opposing edges on the upper surface of the insulating layer, among the plurality of edges on the lower surface of the component body.

5. In the second coating step, 3. The electronic component mounting method according to claim 1, wherein the conductive fluid is applied to the upper surface of the insulating layer at least at positions that are located below all corners of the lower surface of the component body.

6. In the second coating step, 3. The electronic component mounting method according to claim 1, wherein the amount of the conductive fluid applied per unit area in the second application step is the same as the amount of the conductive fluid applied per unit area in the first application step.

7. The electronic component is A pair of the leads is provided, Each of the pair of leads is 3. The electronic component mounting method according to claim 1, wherein the wires are pulled out in different directions from the component body.

8. a thermosetting resin application step of applying a thermosetting resin to a portion of the intended arrangement region of the component body on the upper surface of the insulating layer, In the pressing step, 3. The electronic component mounting method according to claim 1, further comprising the steps of: heating and curing the thermosetting resin while pressing the electronic component against the insulating layer, thereby fixing the electronic component to the insulating layer with the thermosetting resin.

9. a third applying step of applying the conductive fluid on the conductive fluid that has been applied in the first applying step and cured in the curing step; In the electronic component placement step, bringing the lead into contact with the conductive fluid applied in the third application step; In the pressing step, 3. The electronic component mounting method according to claim 1, wherein the conductive fluid applied in the third application step is cured while the electronic component is pressed against the insulating layer.

10. an applicator that applies a conductive fluid; a curing device for curing the conductive fluid; a placement device for placing electronic components; a pressing device that presses the electronic component; a control device; Equipped with An electronic component mounting apparatus that mounts the electronic component having leads on an insulating layer, The control device a first application process for controlling the application device to apply the conductive fluid to positions on the wiring formed on the upper surface of the insulating layer where the leads are to be attached; a second application process of controlling the application device to apply the conductive fluid to a portion of an area on the upper surface where a component body of the electronic component is to be arranged; a curing process of controlling the curing device to harden the conductive fluid; an electronic component placement process that controls the placement device to place the electronic component at a position where the leads are placed on the conductive fluid applied in the first application process and the component body is placed on the conductive fluid applied in the second application process; a pressing process of controlling the pressing device to press the electronic components placed by the electronic component placement process against the insulating layer to mount the electronic components on the insulating layer; An electronic component placement machine that performs

11. The pressing device is an elastic member that contacts the electronic component and presses the electronic component; a moving mechanism that moves at least one of the elastic member and the insulating layer during the pressing process, and presses the electronic component against the insulating layer with the elastic member; The electronic component placement machine of claim 10, further comprising:

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