Substrate holding device, substrate processing apparatus, article manufacturing method, and control method

Abstract

To provide a technique that is advantageous for detecting a reference relative position with high accuracy.SOLUTION: A substrate holding device includes a chuck having a holding surface for holding a substrate, pins that protrude from the holding surface to support the substrate, a drive unit that drives the chuck and the pins relatively, and a control unit that controls command values that are sequentially given to the drive unit in an operation of causing the pins to protrude from the holding surface and transferring the substrate on the holding surface onto the pins, and the control unit detects a reference relative position, which is the relative position between the chuck and the pins when the pins begin to contact the substrate on the holding surface during the operation, on the basis of a differential value of the command value.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present invention relates to a substrate holding device, a substrate processing apparatus, an article manufacturing method, and a control method. [Background technology]

[0002] Substrate processing apparatuses that process substrates for manufacturing semiconductor devices and the like are required to reduce the load on the substrate and achieve high productivity. For example, in substrate processing apparatuses, pins that protrude from the substrate holding surface of the chuck and support the substrate may be provided to load and unload the substrate from the chuck that holds the substrate. In the operation of transferring the substrate from the chuck to the pins, increasing the relative driving speed between the chuck and the pins can be advantageous in terms of productivity, but it can also increase the load on the substrate, such as when the pins collide with the substrate at high speed. One method for achieving both reduced substrate load and high productivity is to control the relative driving speed between the chuck and the pins to decrease just before contact between the pins and the substrate begins during the operation. To achieve such control, it is desirable to accurately detect the relative position between the chuck and the pins when contact between the pins and the substrate begins during the operation (hereinafter, sometimes referred to as the reference relative position). Patent documents 1 and 2 describe methods for detecting the reference relative position. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent No. 4685041 [Patent Document 2] Patent No. 6244317 Summary of the Invention [Problem to be solved by the invention]

[0004] With the recent diversification of device manufacturing methods (processes), substrate processing apparatuses may handle substrates of various types (sizes, thicknesses, materials). With the methods described in Patent Documents 1 and 2, it may be difficult to accurately detect the reference relative position depending on the type of substrate, such as a thin substrate.

[0005] Therefore, an object of the present invention is to provide an advantageous technique for detecting a reference relative position with high accuracy. [Means for solving the problem]

[0006] In order to achieve the above object, one aspect of the present invention provides a substrate holding device comprising: a chuck having a holding surface for holding a substrate; pins that protrude from the holding surface to support the substrate; a drive unit that drives the chuck and the pins relatively; and a control unit that controls command values ​​that are sequentially given to the drive unit in an operation of causing the pins to protrude from the holding surface and transferring the substrate on the holding surface onto the pins, wherein the control unit detects a reference relative position, which is the relative position between the chuck and the pins when the pins begin to contact the substrate on the holding surface during the operation, based on a differential value of the command value.

[0007] Further objects and other aspects of the present invention will become apparent from the following description of preferred embodiments with reference to the accompanying drawings. [Effects of the Invention]

[0008] According to the present invention, for example, it is possible to provide an advantageous technique for detecting a reference relative position with high accuracy. [Brief explanation of the drawings]

[0009] [Figure 1] 1 is a schematic diagram showing an example of the configuration of an exposure apparatus according to an embodiment of the present invention; [Figure 2] FIG. 1 is a diagram illustrating a configuration example of a transport unit; [Figure 3] Schematic diagram showing an example of the configuration of a substrate holding unit [Figure 4] FIG. 1 is a diagram showing an example of a control block diagram of a substrate holding unit. [Figure 5] FIG. 10 is a schematic diagram illustrating the transition of a command value during a pin protruding operation in the first embodiment and the positional relationship between the chuck and the pin. [Figure 6] Flowchart showing a method for detecting a reference relative position in a pin protruding operation [Figure 7] FIG. 10 is a diagram showing an example of a command value, a differential value, and a negative ratio of the differential value per unit time during a pin protruding operation. [Figure 8] FIG. 10 is a schematic diagram illustrating the transition of a command value during a pin protruding operation in the second embodiment and the positional relationship between the chuck and the pin. [Figure 9] Schematic diagram showing an example of the configuration of a substrate holding unit [Figure 10] FIG. 10 is a diagram showing the transition of the command value acquired by the information acquisition operation. DETAILED DESCRIPTION OF THE INVENTION

[0010] Hereinafter, embodiments will be described in detail with reference to the accompanying drawings. Note that the following embodiments do not limit the scope of the invention claimed. Although multiple features are described in the embodiments, not all of these multiple features are necessarily essential to the invention, and multiple features may be combined arbitrarily. Furthermore, in the accompanying drawings, the same reference numerals are used to designate the same or similar components, and redundant explanations will be omitted.

[0011] In this specification and the accompanying drawings, directions are indicated in an XYZ coordinate system, with the XY plane being a direction parallel to the surface (holding surface) of the chuck that holds the substrate. The directions parallel to the X, Y, and Z axes in the XYZ coordinate system are the X direction, Y direction, and Z direction, respectively, and rotation around the X axis, rotation around the Y axis, and rotation around the Z axis are referred to as θX, θY, and θZ, respectively. Control and drive (movement) about the X axis, Y axis, and Z axis refer to control or drive (movement) in the direction parallel to the X axis, direction parallel to the Y axis, and direction parallel to the Z axis, respectively. Furthermore, control or drive about the θX axis, θY axis, and θZ axis refer to control or drive in the direction parallel to the X axis, rotation around the Y axis, and axis parallel to the Z axis, respectively.

[0012] First Embodiment A substrate processing apparatus according to a first embodiment of the present invention will be described. In this embodiment, an exposure apparatus, which is one type of lithography apparatus used to manufacture semiconductor devices, liquid crystal display devices, etc., will be described as an example of a substrate processing apparatus for processing substrates. The exposure apparatus is an apparatus that performs exposure processing by exposing a substrate to light using a step-and-scan method or a step-and-repeat method to transfer a pattern from an original onto the substrate.

[0013] Here, the substrate processing apparatus according to the present invention is not limited to an exposure apparatus, and may be another type of lithography apparatus, such as an imprint apparatus or a drawing apparatus. The imprint apparatus is an apparatus that performs an imprint process in which an imprint material supplied onto a substrate is brought into contact with a mold and curing energy is applied to the imprint material, thereby forming a pattern of a cured material onto the substrate, to which the pattern of the mold has been transferred. The drawing apparatus is an apparatus that performs a drawing process in which a pattern (latent image pattern) is formed on the substrate by drawing on the substrate with a charged particle beam (electron beam) or a laser beam. Furthermore, the substrate processing apparatus according to the present invention may be an apparatus other than a lithography apparatus, such as various precision processing apparatuses or various precision measurement apparatuses. The precision processing apparatus is an apparatus that performs a processing process to process a substrate. The precision measurement apparatus is an apparatus that performs a measurement process to measure a substrate.

[0014] 1 is a schematic diagram showing an example configuration of an exposure apparatus 100 according to this embodiment. The exposure apparatus 100 includes an illumination optical system 104 that illuminates an original 109 with light from a light source 101, a projection optical system 110, a first drive unit 112, a second drive unit 113, a substrate holder 116, a laser interferometer 118, and a third drive unit 119. The exposure apparatus 100 also includes an alignment measurement system 124, a focus measurement system 140, a main controller 103, an illumination system controller 108, a projection system controller 114, a substrate drive controller 120, a substrate transport unit 130, and a main memory unit 123. Here, the illumination optical system 104 and the projection optical system 110 may be understood to constitute a processing unit that processes a substrate 115 held by the substrate holder 116.

[0015] The light source 101 emits (outputs) light in multiple wavelength bands as exposure light. The illumination optical system 104 includes, for example, a shaping optical system (not shown) and an optical integrator (not shown). The illumination optical system 104 further includes a light shielding plate 105, a half mirror 106, and a photosensor 107.

[0016] Light entering the illumination optical system 104 from the light source 101 is shaped into a predetermined shape (beam shape) via a shaping optical system. The light shaped by the shaping optical system enters an optical integrator. The optical integrator forms multiple secondary light sources for illuminating the original 109 with a uniform illuminance distribution. A light shielding plate 105 is disposed on the optical path of the illumination optical system 104 and forms a desired illumination area on the original 109. A half mirror 106 is disposed on the optical path of the illumination optical system 104 and reflects (extracts) a portion of the light (exposure light) illuminating the original 109. A photosensor 107 is disposed on the optical path of the light reflected by the half mirror 106 and detects the intensity of the light (exposure energy). An illumination system control unit 108 controls each unit of the illumination optical system 104 (e.g., driving the light shielding plate 105) under the control of the main control unit 103.

[0017] The original 109 (mask) has a pattern to be transferred onto the substrate 115 (e.g., a circuit pattern of a semiconductor device), and is illuminated by the illumination optical system 104. The projection optical system 110 is configured, for example, as a refractive system or a catadioptric system. The projection optical system 110 projects (forms) an image of the pattern on the original 109 onto one shot area on the substrate 115, which is coated with photoresist (photosensitive agent), at a predetermined projection magnification β (e.g., β=½). The projection optical system 110 includes an aperture stop 111. The aperture stop 111 is disposed on the pupil plane of the projection optical system 110, i.e., the Fourier transform plane with respect to the original 109, and includes a substantially circular opening.

[0018] The first driver 112 includes a motor and drives the aperture stop 111 to change the diameter of the opening of the aperture stop 111. This allows the numerical aperture (NA) of the projection optical system 110 to be set to a predetermined value. The second driver 113 drives (moves) an optical element that constitutes part of the lens system of the projection optical system 110 along the optical axis of the projection optical system 110. This makes it possible to suppress a decrease in various aberrations of the projection optical system 110 and reduce distortion errors while maintaining a good projection magnification β. The projection system controller 114, under the control of the main controller 103, controls each component of the projection optical system 110 (the aperture stop 111 and optical elements) using the first driver 112 and the second driver 113.

[0019] As described above, the substrate 115 is coated with a photoresist, and the pattern of the original 109 is transferred (projected) onto the substrate 115. As the substrate 115, for example, a wafer or a glass plate can be used.

[0020] The substrate holding unit 116 (substrate holding device) has a chuck that holds the substrate 115, and is configured to be movable in three dimensions (specifically, X, Y, and Z directions). The third drive unit 119 includes a motor and the like, and drives the substrate holding unit 116. In this embodiment, the direction along the optical axis of the projection optical system 110 is defined as the Z direction (Z axis), and the directions perpendicular to the optical axis of the projection optical system 110 are defined as the X direction (X axis) and the Y direction (Y axis). A detailed configuration example of the substrate holding unit 116 will be described later.

[0021] The position of substrate holding part 116 is measured by using laser interferometer 118 to detect the distance to mirror 117 (reflecting mirror) fixed to substrate holding part 116. Alignment measurement system 124 measures the positional deviation between substrate 115 and substrate holding part 116. Under the control of main control part 103, substrate drive control part 120 controls the movement (drive) of substrate holding part 116 by third drive part 119 based on the measurement results of laser interferometer 118 and alignment measurement system 124.

[0022] The focus measurement system 140 includes a projection optical system 121 and a detection optical system 122, and measures the position of the substrate 115 in the direction along the optical axis of the projection optical system 110 (Z direction), i.e., the height of the surface of the substrate 115. The projection optical system 121 emits (projects) multiple light beams consisting of light (non-exposure light) that does not expose the photoresist applied to the substrate 115. The multiple light beams emitted from the projection optical system 121 are obliquely incident on different positions on the substrate 115, reflected by the substrate 115, and enter the detection optical system 122.

[0023] The detection optical system 122 is provided with a plurality of light receiving elements onto which the plurality of light beams reflected by the substrate 115 are respectively incident. The plurality of light receiving elements in the detection optical system 122 are arranged so that the light receiving surface of each light receiving element and the reflection point of each light beam on the substrate 115 are approximately conjugate via the imaging optical system. Therefore, a positional deviation of the substrate 115 in a direction along the optical axis of the projection optical system 110 is measured as a positional deviation of light incident on each light receiving element (light receiving surface) of the detection optical system 122.

[0024] The substrate transport unit 130 is a transport mechanism that transports the substrate 115. As shown in Fig. 2, the substrate transport unit 130 can include, for example, a port 201, a first hand 202, a pre-alignment unit 203, and a second hand 204. Details of the substrate transport unit 130 will be described later along with the substrate transport operation in the substrate transport unit 130.

[0025] Main memory unit 123 stores various programs, data, and the like necessary to operate exposure apparatus 100. For example, main memory unit 123 stores various types of information used in exposure processing. Examples of the various types of information include layout information. The layout information is information about multiple shot areas on substrate 115 where exposure processing is performed, and can include, for example, information indicating the arrangement (layout) of the multiple shot areas and information indicating the order of substrate processing for the multiple shot areas.

[0026] The main controller 103 may be configured by a computer (information processing device) including a processor such as a CPU (Central Processing Unit) and a memory. The main controller 103 comprehensively controls each part of the exposure apparatus 100 via the illumination system controller 108, the projection system controller 114, and the substrate drive controller 120. In the present embodiment, the main controller 103 may also be configured to control the substrate transport unit 130. Here, the main controller 103 may be configured by, for example, a PLD (abbreviation for Programmable Logic Device) such as an FPGA (abbreviation for Field Programmable Gate Array), an ASIC (abbreviation for Application Specific Integrated Circuit), a general-purpose computer with an embedded program, or a combination of all or part of these.

[0027] Next, the substrate transport operation of the substrate transport unit 130 will be described with reference to Fig. 2. Fig. 2 is a view (plan view) of the substrate transport unit 130 as seen from above (+Z direction), and schematically shows an example configuration of the substrate transport unit 130. Note that Fig. 2 also shows the substrate holder 116.

[0028] The substrate holding unit 116 may include a chuck 206 having a holding surface that holds the substrate 115, and pins 205 that protrude from the holding surface of the chuck 206 and support (hold) the substrate 115. In this embodiment, a plurality of pins 205 (three in FIG. 2 ) are provided and are normally housed within the chuck 206. When the substrate 115 is supplied to the substrate holding unit 116, or when the substrate 115 is retrieved from the substrate holding unit 116, the chuck 206 and the pins 205 are driven relatively to each other so that the pins 205 protrude from the holding surface of the chuck 206. The relative driving of the chuck 206 and the pins 205 may be performed by driving the chuck 206 relative to the pins 205, or by driving the pins 205 relative to the chuck 206. Alternatively, the driving may be performed by driving both the pins 205 and the chuck 206 relative to each other. In this embodiment, an example will be described in which the chuck 206 and the pin 205 are driven relatively by driving the chuck 206 with respect to the pin 205.

[0029] The substrate 115 is loaded into the exposure apparatus 100 via a port 201 connected to an external device in a device manufacturing factory. The port 201 may be understood as a port where a container (e.g., a FOUP (Front Opening Unify Pod)) containing the substrate 115 is disposed. The substrate 115 loaded into the exposure apparatus 100 is transported by a first hand 202 to a pre-alignment unit 203 that performs pre-alignment (coarse positioning) of the substrate 115. After pre-alignment in the pre-alignment unit 203, the substrate 115 is supplied (transported) by a second hand 204 onto a substrate holder 116 disposed at a supply location 207. Specifically, the substrate 115 is supplied (passed) onto the pins 205 by the second hand 204 in a state where the pins 205 protrude from the holding surface of a chuck 206. Then, by reducing the amount of protrusion of the pins 205 from the holding surface of the chuck 206 and storing the pins 205 inside the chuck 206, the substrate 115 on the pins 205 is placed on the holding surface of the chuck 206, and the substrate 115 is held by the holding surface. After storing the pins 205 in the chuck 206, or in parallel with the operation of storing the pins 205 in the chuck 206, the substrate holding unit 116 moves to a position where the exposure process is performed on the substrate 115.

[0030] When the exposure process for the substrate 115 is completed, the substrate holding unit 116 holding the substrate 115 moves to the recovery location 208. Then, the first hand 202 recovers the substrate 115 from the substrate holding unit 116 arranged at the recovery location 208. Specifically, after the substrate holding unit 116 moves to the recovery location 208, or in parallel with this movement, the pins 205 are protruded from the holding surface of the chuck 206. As a result, the substrate 115 is separated from the holding surface of the chuck 206 and is supported by the pins 205. The substrate 115 supported by the pins 205 is recovered from the pins 205 by the first hand 202 and transported to the port 201.

[0031] Next, an example of the configuration and operation of the substrate holding unit 116 will be described. Fig. 3 is a schematic diagram showing an example of the configuration of the substrate holding unit 116 of this embodiment. The substrate holding unit 116 may include a chuck 206 having a holding surface 206a that holds the substrate 115, pins 205 that protrude from the holding surface 206a and are capable of supporting the substrate 115, and a drive unit 301 that drives the chuck 206 and the pins 205 relative to each other. The drive unit 301 of this embodiment may include an actuator configured to drive the chuck 206 relative to the pins 205.

[0032] The substrate holding unit 116 may also include a stage 302 that supports the chuck 206, a base 303 to which the pins 205 are fixed, a support member 304 that supports the stage 302, a control unit 305, a memory unit 306, and a measurement unit 307. The support member 304 may be configured, for example, by an air spring that supports the stage 302 by air pressure, and may be disposed between the stage 302 and the base 303. The support member 304 may also be understood as a member that supports the chuck 206 supported by the stage 302 and the pins 205 fixed to the base 303. The measurement unit 307 measures the relative positions of the chuck 206 and the pins 205 in the Z direction. In this embodiment, the measurement unit 307 may be configured to measure the position of the chuck 206 in the Z direction.

[0033] The control unit 305 controls command values ​​(signals) sequentially supplied to the driving unit 301 in an operation of causing the pins 205 to protrude from the holding surface 206a of the chuck 206 and transferring the substrate 115 on the holding surface 206a onto the pins 205 (hereinafter, this may be referred to as a pin protruding operation). The control unit 305 may be configured as a separate entity from the main control unit 103 so as to include a processor such as a CPU (Central Processing Unit), or may be configured as a part of the main control unit 103. The memory unit 306 stores the command values ​​sequentially supplied from the control unit 305 to the driving unit 301. The memory unit 306 may be configured as a separate entity from the main memory unit 123, or may be configured as a part of the main memory unit 123.

[0034] In the pin protruding operation, the driving unit 301 drives the chuck 206 (stage 302) in the −Z direction (negative direction of the Z axis). At this time, the support member 304 supports the weight of the stage 302, the chuck 206, and the substrate 115 by air pressure, like a rubber balloon, and changes the support position of the stage 302 by expanding or contracting in accordance with the movement of the stage 302. The support member 304 can be controlled so that the driving unit 301 does not generate a force to support the stage 302, the chuck 206, and the substrate 115, but generates only a force to drive the chuck 206 (stage 302). When the Z position (position in the Z direction) of the holding surface 206a of the chuck 206 moves further toward the −Z direction than the top of the pin 205, the pin 205 protrudes from the holding surface 206a of the chuck 206, and the substrate 115 is supported by the pin 205. By such pin protruding operation, the substrate 115 on the holding surface 206a of the chuck 206 is handed over (transferred) onto the pins 205.

[0035] Here, the command values ​​sequentially given from the control unit 305 to the driving unit 301 in the pin protruding operation are, for example, current command values, but may also be voltage command values. The command values ​​can be controlled based on a target relative position (target relative coordinate) between the chuck 206 and the pins 205 in the Z direction, which in this embodiment is a target position (target coordinate) of the chuck 206 in the Z direction. The command values ​​can be sequentially stored in the storage unit 306 in association with the time (driving time) during which the driving unit 301 drives the chuck 206 and the pins 205, or with measurement values ​​of the relative positions of the chuck 206 and the pins 205.

[0036] FIG. 4 shows an example of a control block diagram of the substrate holding unit 116. In the substrate holding unit 116 of this embodiment, the position of the chuck 206 in the Z direction is measured by the measurement unit 307, and the measurement result is supplied to the subtraction unit 305a. The subtraction unit 305a calculates the deviation between the position of the chuck 206 measured by the measurement unit 307 and a target position, and supplies the deviation to the PID compensator 305b. The PID compensator 305b calculates a command value (e.g., a current command value) to be supplied to the driver 301 so as to reduce the deviation supplied from the subtraction unit 305. The driver 301 drives the chuck 206 in accordance with the command value. The command value is associated with the drive time or the position of the chuck 206 measured by the measurement unit 307 and stored in the memory unit 306. The subtraction unit 305a and the PID compensator 305b can form part of the control unit 305.

[0037] FIG. 5 is a schematic diagram illustrating the transition of the command value during the pin protruding operation and the positional relationship between the chuck 206 and the pins 205. FIG. 5(a) shows the transition of the command value during the pin protruding operation, with the horizontal axis representing the drive time and the vertical axis representing the command value. The "drive time" on the horizontal axis represents the elapsed time from when the chuck 206 starts to be driven in the -Z direction while the pins 205 are housed in the chuck 206, and corresponds to the relative positions of the chuck 206 and the pins 205 in the Z direction. FIGS. 5(b) to 5(d) show the positional relationship between the chuck 206 and the pins 205 in sections A to D of FIG. 5(a). In the substrate holder 116 of this embodiment, when a command value in the positive direction is given to the drive unit 301, a force is generated that moves the chuck 206 in the +Z direction (the positive direction of the Z axis). On the other hand, when a command value in the negative direction is given to the driving unit 301, a force is generated that tends to move the chuck 206 in the -Z direction (negative direction of the Z axis).

[0038] In section A of FIG. 5( a), as shown in FIG. 5( b), the upper end of the pin 205 is positioned further toward the −Z direction than the holding surface 206a (upper surface) of the chuck 206. A command value for driving the chuck 206 in the −Z direction is given to the driver 301. In this embodiment, the command value is controlled so that the chuck 206 and the pin 205 are driven relatively at a constant speed, i.e., so that the chuck 206 is driven at a constant speed in the −Z direction. In other words, when the chuck 206 is driven at a constant speed, the command value is controlled to be constant. During the driving of the chuck 206, vibrations occur in the driver 301 due to resistance caused by slight dust or friction present in the drive path of the chuck 206 or in the contact portion between the driver 301 and the chuck 206. As a result, slight random fluctuations may occur in the command value as the driver 301 attempts to restore the displacement caused by the vibrations.

[0039] The substrate 115 is held by the chuck 206 so as not to slip off the chuck 206. Therefore, as shown in FIG. 5( c), when the pin 205 starts to come into contact with the substrate 115 on the chuck 206 (holding surface 206 a), the pin 205 is pressed against the substrate 115 on the chuck 206. When the pin 205 is pressed against the substrate 115, a position change caused by the force of the substrate 115 trying to push back the pin 205 is added to the command value of the driving unit 301. This position change becomes larger the deeper the pin 205 is pressed against the substrate 115. Because the chuck 206 is driven at a constant speed by the driving unit 301, the pin 205 is pressed deeper against the substrate 115 over time, and the command value can become larger so that a correspondingly larger force is generated. Therefore, as shown in section B of FIG. 5(a), after time t1 when the pin 205 starts to come into contact with the substrate 115 on the chuck 206, the command value gradually changes in the negative direction.

[0040] When the substrate 115 is thin, if the pins 205 are pressed against the substrate 115 on the chuck 206 more than a certain pressure, the substrate 115 is deformed by the pressure of the pins 205, and the substrate 115 gradually separates (peels off) from the chuck 206, and air flows in through the separated portion. During this time, the force with which the substrate 115 on the chuck 206 pushes back the pins 205 gradually weakens, and the command value gradually changes in the positive direction, as shown in section C of FIG. 5( a). Here, in the case of a substrate 115 having a standard thickness (e.g., 775 μm) as typified by the SEMI standard, if the pins 205 are pressed against the substrate 115 on the chuck 206 more than a certain pressure, the substrate 115 will be forcefully separated from the chuck 206. In this case, the command value may fluctuate significantly up and down by the amount of the position change due to the force of the separation (not shown in FIG. 5( a)).

[0041] As shown in Fig. 5(d), when the substrate 115 is completely separated from the chuck 206 and handed over to the pins 205, a command value for driving the chuck 206 at a constant speed in the -Z direction is given to the driving unit 301. Therefore, as shown in section D in Fig. 5(a), the command value becomes constant after time t2 when the chuck 206 and the substrate 115 are separated. Note that in section D, the command value may differ from that in section A because it is not necessary to generate a force equivalent to the weight of the substrate 115.

[0042] Incidentally, exposure apparatus 100 (substrate processing apparatus) is required to reduce the load on substrate 115 and achieve high productivity. In the pin protruding operation of substrate holder 116, increasing the relative driving speed between chuck 206 and pins 205 can be advantageous in terms of productivity, but this can also increase the load on substrate 115, such as when pins 205 collide with substrate 115 at high speed. Therefore, to achieve both reduced load on substrate 115 and high productivity, it is advisable to control pin protruding operation so as to reduce the relative driving speed between chuck 206 and pins 205 immediately before contact between pins 205 and substrate 115 begins. To achieve this control, it is desirable to accurately detect the relative position between chuck 206 and pins 205 when contact between pins 205 and substrate 115 begins during pin protruding operation (hereinafter, sometimes referred to as the reference relative position). Therefore, in this embodiment, the reference relative position is detected based on the differential value of the command value sequentially given to driver 301 during pin protruding operation. The reference relative position may be understood as the relative position between the chuck 206 and the pin 205 when the heights (positions in the Z direction) of the holding surface 206a of the chuck 206 and the upper ends of the pins 205 match.

[0043] A method for detecting the reference relative position during the pin protruding operation will be described below. FIG. 6 is a flowchart showing a method for detecting the reference relative position during the pin protruding operation. The flowchart in FIG. 6 can be executed by the control unit 305. Since the reference relative position exists in the intervals A to B in FIG. 5(a), it is preferable to monitor the command values ​​given to the driving unit 301, particularly in the intervals A to B, and detect the reference relative position based on the derivatives of the command values. Note that in this embodiment, an example is described in which the reference relative position is detected in real time during the pin protruding operation, but the reference relative position may also be detected after the pin protruding operation is completed. Also, in this embodiment, an example is described in which the derivative of the command value is the derivative of the command value with respect to time, but it may also be the derivative of the command value with respect to the position of the chuck 206 (or the relative position between the chuck 206 and the pin 205).

[0044] In step S11, the control unit 305 acquires the command values ​​(which may be understood as a command value sequence) sequentially given to the driving unit 301 during the pin protruding operation. As described above, the command values ​​are sequentially stored in the memory unit 306 during the pin protruding operation. Therefore, the control unit 305 can acquire, from the memory unit 306, the command values ​​sequentially given to the driving unit 301 during the pin protruding operation.

[0045] In step S12, the control unit 305 calculates a derivative of the command value acquired in step S11. As described above, vibrations occur in the drive unit 301 due to resistance caused by slight dust particles or friction present in the drive path of the chuck 206 or in the contact portion between the drive unit 301 and the chuck 206, which can cause slight random fluctuations in the command value. Therefore, the derivative of the command value alternates between positive and negative values. The derivative calculated in step S12 can be stored in the storage unit 306 in association with the command value.

[0046] In section A of FIG. 5(a), the command value remains almost constant despite slight variations due to vibration, and the derivative value is generally close to zero. In section B of FIG. 5(a), the command value changes negatively, and the derivative value is generally negative. In section C of FIG. 5(a), the command value changes positively, and the derivative value is generally positive. In section D of FIG. 5(a), the command value remains almost constant, and the derivative value is generally close to zero. Here, the command value may be smoothed using a moving average or other process and stored in the storage unit 306, and the derivative value may be calculated for the smoothed command value.

[0047] In step S13, the control unit 305 calculates the positive / negative ratio of the differential value per unit time. The positive / negative ratio is the ratio between a positive value and a negative value. For example, in the present embodiment, when the driving unit 301 drives the chuck 206 relative to the pin 205, the control unit 305 may calculate the rate at which the differential value becomes negative per unit time as the positive / negative ratio. On the other hand, when the pin 205 is driven relative to the chuck 206, the control unit 305 may calculate the rate at which the differential value becomes positive per unit time as the positive / negative ratio.

[0048] When detecting the reference relative position in real time, the unit time may be understood as a predetermined time immediately preceding the pin protruding operation. The unit time is preferably set to be longer than the period of vibration generated by the relative drive between the chuck 206 and the pin 205. The unit time is preferably set to be shorter than the time (separation time) required from when the pin 205 contacts the substrate 115 on the chuck 206 (holding surface 206a) to when the chuck 206 and the substrate 115 separate during the pin protruding operation. The period of vibration and the separation time can be obtained in advance through experiments, simulations, etc. A shorter unit time speeds up the timing for detecting the reference relative position, but increases the possibility of erroneous detection. Therefore, the unit time is preferably set so that the number of command value samples included in the unit time is 10 or more.

[0049] In section A of FIG. 5(a), the positive and negative derivative values ​​per unit time are approximately equal in proportion. That is, the positive / negative ratio is about 50%. In this embodiment, since the chuck 206, which is the driven object, is driven at a constant speed, even if a change in the command value occurs due to vibration, the command value returns to a constant value. That is, when a positive change occurs in the command value due to vibration, a negative change occurs in the command value immediately thereafter. Similarly, when a negative change occurs in the command value, a positive change occurs in the command value immediately thereafter. As a result, the positive / negative ratio of the derivative value per unit time is about 50%.

[0050] In section B of FIG. 5(a), the command value changes to a negative value, so the proportion of negative values ​​in the differential value per unit time increases. In section C of FIG. 5(a), the command value changes to a positive value, so the proportion of positive values ​​in the differential value per unit time increases. In sections B to C, the command value may fluctuate due to vibration, but the force with which substrate 115 pushes back pins 205 is greater than the amount of fluctuation in the command value due to vibration, so the influence of the fluctuation in the command value due to vibration on the proportion of positive and negative values ​​in the differential value per unit time is small. In section D of FIG. 5(a), the command value is constant, so the proportion of positive and negative values ​​in the differential value per unit time is approximately the same. In section D, the command value returns to a constant value as in section A, so the proportion of positive and negative values ​​in the differential value per unit time remains the same.

[0051] In step S14, the control unit 305 determines whether the ratio of the positive to negative derivative values ​​calculated in step S13 exceeds a threshold value. In this embodiment, to drive the chuck 206 relative to the pin 205, the control unit 305 determines whether the rate at which the derivative values ​​become negative per unit time exceeds a threshold value. On the other hand, when driving the pin 205 relative to the chuck 206, the control unit 305 determines whether the rate at which the derivative values ​​become positive per unit time exceeds a threshold value. If the ratio of the positive to negative derivative values ​​does not exceed the threshold value, the process returns to step S11. If the ratio of the positive to negative derivative values ​​exceeds the threshold value, the process proceeds to step S15.

[0052] In step S15, the control unit 305 determines (detects) a reference relative position based on the timing at which the positive / negative ratio of the differential value exceeds a threshold. For example, the control unit 305 may determine the relative position between the chuck 206 and the pin 205 measured at that timing as the reference relative position. The relative position between the chuck 206 and the pin 205 may be measured using, for example, the measurement unit 307.

[0053] The determined reference relative position may be stored in the memory unit 306. The reference relative position stored in the memory unit 306 may be used in sequence control of the substrate holder 116 or in subsequent pin protrusion operations (i.e., pin protrusion operations newly performed after the reference relative position is detected). The reference relative position stored in the memory unit 306 may be the relative position between the chuck 206 and the pins 205 at the timing when the first or last sample of the command value samples in the unit time for which the positive / negative ratio of the differential value is calculated is acquired. When the reference relative position is determined based on the first sample, the contact force between the substrate 115 and the pins 205 is weak, thereby reducing damage to the substrate 115 due to contact of the pins 205. On the other hand, when the reference relative position is determined based on the last sample, the substrate 115 and the pins 205 are in sufficient contact with each other, thereby reducing the possibility of horizontal displacement of the substrate 115. Furthermore, setting the threshold to a low value can speed up the timing of detecting the reference relative position, but increases the possibility of false detection. Therefore, the threshold value may be set to, for example, 80% or more of the negative rate of the differential value per unit time or the positive rate of the differential value per unit time.

[0054] 7 shows an example of (a) the command value, (b) the derivative value, and (c) the negative rate of the derivative value per unit time during the pin protrusion operation. Fig. 7 may be understood as a more detailed view of the final part of section A and the initial part of section B (i.e., the part around time t1) in Fig. 5(a).

[0055] In section I of Fig. 7, the command value fluctuates slightly due to vibration, and the positive and negative derivatives of the command value are present in roughly equal proportions, with the negative proportion of the derivative per unit time being approximately 50%. In section J of Fig. 7, the substrate 115 approaches the pins 205, and the suction pressure used by the pins 205 to hold the substrate 115 pulls the substrate 115 and the chuck 206 toward the pins 205, causing the command value to temporarily increase in the positive direction. In section K of Fig. 7, the command value changes to the negative direction, causing the proportion of negative derivatives per unit time to increase.

[0056] 7, the control unit 305 determines whether the negative rate of the differential value per unit time exceeds a threshold value. If the negative rate of the differential value per unit time exceeds the threshold value, the control unit 305 determines the relative position between the chuck 206 and the pin 205 measured at that timing as the reference relative position.

[0057] As described above, in this embodiment, the reference relative position is detected based on the differential value of the command value sequentially given to the driving unit 301 during the pin protruding operation. More specifically, the reference relative position is detected based on the ratio of positive to negative of the differential value per unit time. This makes it possible to detect the reference relative position with high accuracy, thereby achieving both reduced load on the substrate 115 and high productivity.

[0058] For example, in the subsequent pin protruding operation, the relative driving speed between the chuck 206 and the pins 205 can be reduced based on the detected reference relative position just before the pins 205 start to come into contact with the substrate 115. This can contribute to high productivity of the exposure apparatus 100. Also, just before the pins 205 start to come into contact with the substrate 115, the chuck 206 can release its hold on the substrate 115 and the pins 205 can start to suck the substrate 115. This allows the substrate 115 to be transferred from the chuck 206 onto the pins 205 without forcibly separating the substrate 115 from the chuck 206 while the substrate 115 is being held by the chuck 206, thereby reducing the load on the substrate 115.

[0059] Second Embodiment A second embodiment of the present invention will be described. In the above first embodiment, an example in which the chuck 206 is driven relative to the pin 205 has been described, but in the second embodiment, an example in which the pin 205 is driven relative to the chuck 206 will be described. Note that this embodiment basically follows on from the first embodiment, and can follow the first embodiment except for the matters mentioned below.

[0060] FIG. 8 is a schematic diagram illustrating the transition of the command value during the pin protruding operation and the positional relationship between the chuck 206 and the pins 205. FIG. 8(a) shows the transition of the command value during the pin protruding operation, with the horizontal axis representing the drive time and the vertical axis representing the command value. The "drive time" on the horizontal axis represents the elapsed time from when the drive of the pins 205 in the +Z direction begins while the pins 205 are housed in the chuck 206, and corresponds to the relative positions of the chuck 206 and the pins 205 in the Z direction. FIGS. 8(b) to 8(d) also show the positional relationship between the chuck 206 and the pins 205 in sections E to H in FIG. 8(a). In the substrate holder 116 of this embodiment, when a command value in the positive direction is given to the drive unit 301, a force is generated that moves the pins 205 in the +Z direction (the positive direction of the Z axis). On the other hand, when a command value in the negative direction is given to the driving unit 301, a force is generated that tends to move the pin 205 in the −Z direction (negative direction of the Z axis).

[0061] In section E of FIG. 8( a), as shown in FIG. 8( b), the upper end of the pin 205 is positioned further toward the −Z direction than the holding surface 206a (upper surface) of the chuck 206, and a command value for driving the pin 205 in the +Z direction is given to the driver 301. In this embodiment, the command value is controlled so that the chuck 206 and the pin 205 are driven relatively at a constant speed, i.e., so that the pin 205 is driven at a constant speed in the +Z direction. In other words, when the chuck 206 is driven at a constant speed, the command value is controlled to be constant. Here, while the pin 205 is being driven, vibrations occur in the driver 301 due to resistance caused by slight dust or friction present in the drive path of the pin 205 or in the contact portion between the driver 301 and the pin 205. As a result, slight random fluctuations may occur in the command value as the driver 301 attempts to restore the displacement caused by the vibrations.

[0062] The substrate 115 is held by the chuck 206 so as not to slip off the chuck 206. Therefore, as shown in FIG. 8( c), when the pin 205 starts to come into contact with the substrate 115 on the chuck 206 (holding surface 206 a), the pin 205 is pressed against the substrate 115 on the chuck 206. When the pin 205 is pressed against the substrate 115, a position change caused by the force of the substrate 115 trying to push back the pin 205 is added to the command value of the driving unit 301. This position change becomes larger the deeper the pin 205 is pressed against the substrate 115. Because the pin 205 is driven at a constant speed by the driving unit 301, the pin 205 is pressed deeper into the substrate 115 over time, and the command value can become larger so that a correspondingly larger force is generated. Therefore, as shown in section F of FIG. 8(a), after time t3 when contact between the pin 205 and the substrate 115 on the chuck 206 begins, the command value gradually changes in the positive direction.

[0063] When the substrate 115 is thin, if the pins 205 are pressed against the substrate 115 on the chuck 206 more than a certain pressure, the substrate 115 is deformed by the pressure of the pins 205, and the substrate 115 gradually separates (peels off) from the chuck 206, and air flows in through the separated portion. During this time, the force with which the substrate 115 on the chuck 206 pushes back the pins 205 gradually weakens, and the command value gradually changes in the negative direction, as shown in section G of FIG. 8( a). Here, in the case of a substrate 115 having a standard thickness (e.g., 775 μm) as typified by the SEMI standard, if the pins 205 are pressed against the substrate 115 on the chuck 206 more than a certain pressure, the substrate 115 will be forcefully separated from the chuck 206. In this case, the command value may fluctuate significantly up and down by the amount of the position change due to the force of the separation (not shown in FIG. 8( a)).

[0064] As shown in Fig. 8(d), when the substrate 115 is completely separated from the chuck 206 and handed over to the pins 205, a command value for driving the pins 205 at a constant speed in the +Z direction is given to the driving unit 301. Therefore, as shown in section H in Fig. 8(a), the command value becomes constant after time t4 when the chuck 206 and the substrate 115 are separated. Note that in section H, the command value may differ from that in section D because it is not necessary to generate a force equivalent to the weight of the substrate 115.

[0065] A method for detecting the reference relative position during pin protrusion operation will be described below. The method for detecting the reference relative position in this embodiment can be performed according to the flowchart in FIG. 6 described above in the first embodiment. Since the reference relative position exists in the intervals E to F in FIG. 8(a), it is preferable to monitor the command values ​​given to the drive unit 301 in particular in the intervals E to F and detect the reference relative position based on the derivative values ​​of those command values. Note that in this embodiment, an example will be described in which the reference relative position is detected in real time during the pin protrusion operation, but the reference relative position may also be detected after the pin protrusion operation has ended.

[0066] In step S11, the control unit 305 acquires command values ​​(command value sequence) sequentially given to the drive unit 301 during the pin protrusion operation. Next, in step S12, the control unit 305 calculates the derivatives of the command values ​​acquired in step S11. The derivatives calculated in step S12 can be stored in the memory unit 306 in association with the command values. In section E of FIG. 8(a), the command value remains almost constant despite slight changes due to vibration, and therefore the derivatives are generally close to zero. In section F of FIG. 8(a), the command value changes positively, and therefore the derivatives are generally positive. In section G of FIG. 8(a), the command value changes negatively, and therefore the derivatives are generally negative. In section H of FIG. 8(a), the command value remains almost constant, and therefore the derivatives are generally close to zero.

[0067] In step S13, the control unit 305 calculates the ratio of positive to negative derivative values ​​per unit time. In this embodiment, the driving unit 301 drives the pin 205 relative to the chuck 206, so the control unit 305 can calculate the ratio of positive to negative derivative values ​​per unit time. In section E of FIG. 8(a), the ratio of positive to negative derivative values ​​per unit time is approximately the same. That is, the ratio of positive to negative derivative values ​​is approximately 50%. In section F of FIG. 8(a), the command value changes to a positive value, so the ratio of positive to negative derivative values ​​per unit time is large. In section G of FIG. 8(a), the command value changes to a negative value, so the ratio of negative derivative values ​​per unit time is large. In section H of FIG. 8(a), the command value is constant, so the ratio of positive to negative derivative values ​​per unit time is approximately the same. In section H, the command value returns to a constant value as in section E, so the ratio of positive to negative derivative values ​​per unit time is the same.

[0068] In step S14, the control unit 305 determines whether the ratio of the positive to negative derivative values ​​calculated in step S13 exceeds a threshold value. In this embodiment, when driving the pin 205 relative to the chuck 206, the control unit 305 determines whether the rate at which the derivative values ​​are positive per unit time exceeds a threshold value. If the ratio of the positive to negative derivative values ​​does not exceed the threshold value, the process returns to step S11, and if the ratio of the positive to negative derivative values ​​exceeds the threshold value, the process proceeds to step S15.

[0069] In step S15, the control unit 305 determines (detects) the reference relative position based on the timing at which the positive / negative ratio of the differential value exceeds a threshold. For example, the control unit 305 may determine the relative position between the chuck 206 and the pin 205 measured at that timing as the reference relative position. The determined reference relative position may be stored in the storage unit 306. In this way, the reference relative position can be detected with high accuracy in this embodiment as well.

[0070] <Third embodiment> A third embodiment of the present invention will be described. In the third embodiment, an example will be described in which a reference relative position is detected taking into consideration the influence of the support member 304 on the relative driving of the chuck 206 and the pin 205 by the driving unit 301. Note that this embodiment basically inherits the first embodiment, and can follow the first embodiment except for the matters mentioned below. Also, the second embodiment may be applied instead of the first embodiment.

[0071] As described above, the support member 304 supports the weight of the stage 302, the chuck 206, and the substrate 115 using air pressure, like a rubber balloon. The support member 304 expands or contracts in response to the movement of the stage 302, thereby changing the support position of the stage 302. The force of the support member 304 to support the stage 302, the chuck 206, and the substrate 115 is basically balanced with the weight of the stage 302, the chuck 206, and the substrate 115. However, as shown in FIG. 9 , if the support member 304 is compressed to a certain extent, the support member 304 itself generates a reaction force (e.g., a bending moment) rather than air pressure, which may appear in the command value sent to the drive unit 301. The reaction force of the support member 304 is a reaction force against the drive unit 301's driving of the chuck 206 and the pin 205, depending on the relative positions of the chuck 206 and the pin 205. A method for accurately detecting the reference relative position even when such a reaction force of the support member 304 is generated will be described below.

[0072] In this embodiment, information indicating the magnitude of the reaction force of the support member 304 with respect to the relative positions of the chuck 206 and the pins 205 (hereinafter, sometimes referred to as reaction force information) is acquired in advance. For example, the control unit 305 acquires a command value by relatively driving the chuck 206 and the pins 205 at a constant speed while the chuck 206 and the pins 205 are not holding the substrate 115. A dedicated sequence may be provided for such an operation (hereinafter, information acquisition operation), but it may also be an operation of driving the chuck 206 in the −Z direction to cause the pins 205 to protrude from the chuck 206 in order to load the substrate into the substrate holding unit 116.

[0073] Fig. 10 shows the transition of the command value acquired by the information acquisition operation. As shown by the hatched portion 801 in Fig. 10, the reaction force of the support member 304 begins to be generated when the chuck 206 is driven in the -Z direction to a predetermined Z position, and tends to increase linearly as the chuck 206 is driven in the -Z direction. In other words, the hatched portion 801 in Fig. 10 corresponds to the reaction force of the support member 304. The control unit 305 extracts the hatched portion 801 in Fig. 10 and stores the hatched portion 801 in the memory unit 306 as reaction force information.

[0074] As a result, the control unit 305 can determine the reference relative position based on the reaction force information, excluding the influence of the reaction force of the support member 304. For example, in step S12 in the flowchart of FIG. 6, the control unit 305 corrects the command value acquired in step S11 based on the reaction force information. Specifically, the control unit 305 determines the reaction force of the support member 304 corresponding to the drive time at which the command value was acquired, based on the reaction force information, and corrects the command value by removing the portion of the command value that corresponds to the reaction force. The control unit 305 then calculates a derivative value of the corrected command value. The subsequent steps S13 to S15 are as described above. As a result, the influence (reaction force) of the support member 304 can be removed, and the reference relative position can be detected with high accuracy.

[0075] <Embodiment of an article manufacturing method> The article manufacturing method according to an embodiment of the present invention is suitable for manufacturing articles such as microdevices, such as semiconductor devices, and elements having microstructures. The article manufacturing method according to this embodiment includes a processing step of processing a substrate using the substrate processing apparatus described above, and a manufacturing step of manufacturing an article from the substrate processed in the processing step. Furthermore, this article manufacturing method includes other well-known processes (oxidation, film formation, vapor deposition, doping, planarization, etching, resist stripping, dicing, bonding, packaging, etc.). The article manufacturing method according to this embodiment is advantageous over conventional methods in at least one of article performance, quality, productivity, and production cost.

[0076] <Summary of the embodiment> The disclosure of the present specification includes at least the following substrate holding device, substrate processing device, article manufacturing method, and control method. (Item 1) a chuck having a holding surface for holding a substrate; a pin that protrudes from the holding surface and supports the substrate; a drive unit that drives the chuck and the pin relatively; a control unit that controls command values ​​to be sequentially given to the driving unit in an operation of causing the pins to protrude from the holding surface and transferring the substrate on the holding surface onto the pins; Equipped with The control unit detects a reference relative position, which is a relative position between the chuck and the pins when the pins start to contact the substrate on the holding surface during the operation, based on a differential value of the command value. (Item 2) 2. The substrate holding device according to item 1, wherein the control unit detects the reference relative position based on a ratio of positive to negative of the differential value per unit time. (Item 3) 3. The substrate holding device according to item 2, wherein the control unit detects the reference relative position based on the timing at which the ratio exceeds a threshold value. (Item 4) the drive is configured to drive the chuck relative to the pin; 4. The substrate holding device according to item 2 or 3, wherein the control unit determines the ratio as the proportion of the differential value that is negative per unit time. (Item 5) the drive is configured to drive the pin relative to the chuck; 4. The substrate holding device according to item 2 or 3, wherein the control unit determines the ratio as the proportion at which the differential value becomes positive per unit time. (Item 6) 6. The substrate holding device according to any one of items 2 to 5, wherein the unit time is set to be longer than a period of vibration generated by relative driving between the chuck and the pins, and shorter than the time required from when the pins come into contact with the substrate on the holding surface until the holding surface and the substrate are separated during the operation. (Item 7) 7. The substrate holding device according to any one of items 1 to 6, wherein the control unit controls the command value so as to drive the chuck and the pin relatively at a constant speed during the operation for detecting the reference relative position. (Item 8) a support member for supporting the chuck and the pin; the support member generates a reaction force against the relative driving of the chuck and the pin by the driving unit in accordance with the relative positions of the chuck and the pin, 8. The substrate holding device according to any one of items 1 to 7, wherein the control unit corrects the command value based on information indicating the magnitude of the reaction force with respect to the relative position between the chuck and the pin, and detects the reference relative position based on the differential value of the corrected command value. (Item 9) 9. The substrate holding device according to any one of items 1 to 8, wherein the control unit controls a relative driving speed of the chuck and the pins by the driving unit based on the reference relative position in the operation newly performed after detecting the reference relative position. (Item 10) A substrate processing apparatus for processing a substrate, A substrate holding device according to any one of items 1 to 9, a processing section for processing the substrate held by the substrate holding device; A substrate processing apparatus comprising: (Item 11) A processing step of processing a substrate using the substrate processing apparatus according to item 10; manufacturing an article from the substrate processed in the processing step; A method for manufacturing an article, comprising: (Item 12) A method for controlling a substrate holding device including a chuck having a holding surface for holding a substrate, pins protruding from the holding surface to support the substrate, and a drive unit that drives the chuck and the pins relatively, comprising: a control step of controlling command values ​​sequentially given to the driving unit in an operation of protruding the pins from the holding surface and transferring the substrate on the holding surface onto the pins; a detection step of detecting a reference relative position, which is a relative position between the chuck and the pins when the pins start to contact the substrate on the holding surface during the operation, based on a differential value of the command value; A control method comprising:

[0077] The invention is not limited to the above-described embodiments, and various changes and modifications can be made without departing from the spirit and scope of the invention. Accordingly, the following claims are appended to apprise the public of the scope of the invention. [Explanation of symbols]

[0078] 100: exposure apparatus (substrate processing apparatus), 116: substrate holder, 205: pin, 206: chuck, 301: drive unit, 304: support member, 305: control unit, 306: storage unit

Claims

1. a chuck having a holding surface for holding a substrate; a pin that protrudes from the holding surface and supports the substrate; a drive unit that drives the chuck and the pin relatively; a control unit that controls command values ​​to be sequentially given to the driving unit in an operation of causing the pins to protrude from the holding surface and transferring the substrate on the holding surface onto the pins; Equipped with The control unit detects a reference relative position, which is a relative position between the chuck and the pins when the pins start to contact the substrate on the holding surface during the operation, based on a differential value of the command value.

2. 2. The substrate holding device according to claim 1, wherein the control unit detects the reference relative position based on a ratio of positive to negative of the differential value per unit time.

3. 3. The substrate holding device according to claim 2, wherein the control unit detects the reference relative position based on the timing at which the ratio exceeds a threshold value.

4. the drive is configured to drive the chuck relative to the pin; 3. The substrate holding device according to claim 2, wherein the control unit determines the ratio as a proportion of the differential value per unit time that is negative.

5. the drive is configured to drive the pin relative to the chuck; 3. The substrate holding device according to claim 2, wherein the control unit determines the ratio as a proportion of the differential value per unit time that is positive.

6. 3. The substrate holding device according to claim 2, wherein the unit time is set to be longer than a period of vibration generated by relative drive between the chuck and the pins and shorter than the time required from when the pins come into contact with the substrate on the holding surface until the holding surface and the substrate are separated during the operation.

7. 2. The substrate holding device according to claim 1, wherein the control unit controls the command value so that the chuck and the pins are driven relatively at a constant speed in the operation for detecting the reference relative position.

8. a support member for supporting the chuck and the pin; the support member generates a reaction force against the relative driving of the chuck and the pin by the driving unit in accordance with the relative positions of the chuck and the pin, 2. The substrate holding device according to claim 1, wherein the control unit corrects the command value based on information indicating a magnitude of the reaction force with respect to a relative position between the chuck and the pin, and detects the reference relative position based on the differential value of the corrected command value.

9. 2. The substrate holding device according to claim 1, wherein the control unit controls a relative driving speed of the chuck and the pins by the driving unit based on the reference relative position in the operation newly performed after the reference relative position is detected.

10. A substrate processing apparatus for processing a substrate, A substrate holding device according to any one of claims 1 to 9; a processing section for processing the substrate held by the substrate holding device; A substrate processing apparatus comprising:

11. a processing step of processing a substrate using the substrate processing apparatus according to claim 10; manufacturing an article from the substrate processed in the processing step; A method for manufacturing an article, comprising:

12. A method for controlling a substrate holding device including a chuck having a holding surface for holding a substrate, pins protruding from the holding surface to support the substrate, and a drive unit that drives the chuck and the pins relatively, comprising: a control step of controlling command values ​​sequentially given to the driving unit in an operation of protruding the pins from the holding surface and transferring the substrate on the holding surface onto the pins; a detection step of detecting a reference relative position, which is a relative position between the chuck and the pins when the pins start to contact the substrate on the holding surface during the operation, based on a differential value of the command value; A control method comprising:

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