Substrate pressing device, screen printer, and substrate pressing method

Abstract

To inhibit increase in size of a device.SOLUTION: A substrate pressing device includes: a substrate lower receiving part 17 for supporting a substrate 70 having a first major surface 70a formed with a plurality of solder precoat portions and a second major surface 70b opposite to the first major surface 70a; a pressing part 54 for pressing the first major surface 70a of the substrate 70 supported by the substrate lower receiving part 17; and a control unit. The substrate lower receiving part 17 has: a plurality of lower receiving members 24; and a plurality of switching parts 29 which are provided corresponding to the lower receiving members 24 respectively. Each switching part 29 is switched between a first state in which the corresponding lower receiving member 24 prevents displacement of the substrate 70 by a pressing force of the pressing part 54 and a second state in which the corresponding lower receiving member 24 allows the displacement of the substrate 70 by the pressing force of the pressing part 54. The control unit may switch states of the switching parts 29 individually and changes the switching parts 29 to be brought into the first state and the switching parts 29 to be brought into the second state along with the progress of pressing work by the pressing part 54.SELECTED DRAWING: Figure 7

Description

[Technical Field]

[0001] The present disclosure relates to a substrate pressing device, a screen printing device, and a substrate pressing method. [Background technology]

[0002] Conventionally, a technique for pressing a solder precoat formed on a substrate has been known (for example, Patent Document 1). Patent Document 1 discloses "a mounting substrate manufacturing method for soldering terminals of electronic components to lands on a substrate, the method comprising: a paste placement step of placing solder paste on the lands; a melting and solidification step of melting and solidifying the solder paste to form a solder precoat on the lands; a destruction step of destroying residue covering the surface of the precoat by pressing a tool against the precoat; a flux placement step of placing flux on the precoat; a component mounting step of mounting the electronic component on the substrate with the terminals of the electronic component aligned with the precoat; and a reflow step of heating the substrate to melt the precoat and solder the terminals to the lands." [Prior art documents] [Patent documents]

[0003] [Patent Document 1] International Publication No. 2022 / 054384 Summary of the Invention [Problem to be solved by the invention]

[0004] The number of solder precoats formed on a substrate varies depending on the type of product. When there are a large number of solder precoats, the force pressing the substrate needs to be increased in order to press them with sufficient pressure, and the equipment used for this needs to have high rigidity. Equipment with high rigidity is generally large and expensive. In this situation, one of the objectives of the present disclosure is to prevent the equipment from becoming too large. [Means for solving the problem]

[0005] One aspect of the present disclosure relates to a substrate pressing device, the substrate pressing device including: a substrate support portion that supports a second main surface of a substrate having a first main surface on which a plurality of solder precoats are formed and an opposite second main surface; a pressing portion that presses the first main surface of the substrate supported by the substrate support portion; and a control portion, the substrate support portion having a plurality of support members that each support the second main surface and a plurality of switching portions provided for each of the support members, each of the switching portions switching between a first state in which the corresponding support member prevents displacement of the substrate due to the pressing force of the pressing portion and a second state in which the corresponding support member allows displacement of the substrate due to the pressing force of the pressing portion; and the control portion individually switching between the states of the switching portions and the second state as the pressing operation by the pressing portion progresses.

[0006] Another aspect of the present disclosure relates to a screen printing apparatus, the screen printing apparatus including a substrate pressing mechanism that presses a plurality of solder precoats formed on a substrate having a first main surface on which the plurality of solder precoats are formed and a second main surface opposite the first main surface, a screen printing mechanism that applies flux to the plurality of solder precoats, and a control unit, the substrate pressing mechanism including a substrate support part that supports the second main surface of the substrate, and a pressing part that presses the first main surface of the substrate supported by the substrate support part, the substrate support part including a plurality of support members that each support the second main surface. and a plurality of switching units provided for each of the plurality of lower support members, each of the plurality of switching units switching between a first state in which the corresponding lower support member prevents displacement of the substrate due to the pressing force of the pressing unit, and a second state in which the corresponding lower support member allows displacement of the substrate due to the pressing force of the pressing unit, and the control unit is capable of individually switching the states of the plurality of switching units, and changes between the switching unit that sets the substrate to the first state and the switching unit that sets the substrate to the second state as the pressing operation by the pressing unit progresses.

[0007] Another aspect of the present disclosure relates to a substrate pressing method, the substrate pressing method being performed by a substrate pressing device including: a substrate under-receiving portion that supports a second main surface of a substrate having a first main surface on which a plurality of solder precoats are formed and an opposite second main surface; and a pressing portion that presses the first main surface of the substrate supported by the substrate under-receiving portion, the substrate under-receiving portion having a plurality of under-receiving members each supporting the second main surface, the method including a pressing step of pressing the first main surface with the pressing portion while the substrate is supported by some of the plurality of under-receiving members, and changing the under-receiving members supporting the substrate as the pressing step progresses. [Effects of the Invention]

[0008] According to the present disclosure, it is possible to prevent the device from becoming large. [Brief explanation of the drawings]

[0009] [Figure 1] 1 is a front view schematically showing the configuration of a screen printing apparatus according to a first embodiment. [Figure 2] FIG. 2 is a plan view schematically showing the configuration of a substrate holding table. [Figure 3] FIG. 2 is a front view schematically showing the configuration of a board receiving portion. [Figure 4] FIG. 2 is a front view schematically showing the configuration of a main part of a switching unit. [Figure 5] FIG. 2 is a diagram for explaining a carrying-in step in the screen printing method of the first embodiment. [Figure 6] 10A and 10B are diagrams for explaining a holding step and a pressing step. [Figure 7] 10A and 10B are diagrams for explaining an example of an operation of a switching unit in a pressing step. [Figure 8] 10A and 10B are diagrams for explaining an example of the operation of the switching unit in a pressing step for a small substrate. [Figure 9] FIG. 10 is a diagram for explaining a positioning step and a printing step. [Figure 10] FIG. 10 is a front view schematically showing the configuration of a board receiving portion of the second embodiment. [Figure 11] FIG. 11 is a front view schematically showing the configuration of a board receiving portion of a third embodiment. [Figure 12] 13A and 13B are diagrams for explaining an example of the operation of the switching unit in the pressing step of the third embodiment. [Figure 13] 10A and 10B are front views schematically showing the configuration of the substrate receiving portion of the fourth embodiment, in which (a) shows the receiving member in a raised position, and (b) shows the receiving member in a lowered position. [Figure 14] 13A and 13B are diagrams for explaining an example of the operation of the switching unit in the pressing step of the fourth embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0010] The following describes examples of embodiments of a substrate pressing device, a screen printing device, and a substrate pressing method according to the present disclosure. However, the present disclosure is not limited to the examples described below. While the following description may use specific numerical values ​​and materials, other numerical values ​​and materials may be used as long as the effects of the present disclosure are achieved.

[0011] (Substrate pressing device) The substrate pressing device according to the present disclosure is a device for pressing a substrate on which a plurality of solder precoats have been formed, and includes a substrate receiving portion, a pressing portion, and a control portion.

[0012] The substrate support portion supports a second main surface of a substrate having a first main surface on which a plurality of solder precoats are formed and a second main surface opposite the first main surface. The substrate may be supported by the substrate support portion with the first main surface facing upward and the second main surface facing downward. The substrate may have a plurality of lands, at least some of which may be formed with solder precoats. The solder precoats may be formed by applying solder paste to the lands and then melting and solidifying the solder paste.

[0013] The pressing unit presses the first main surface of the substrate supported by the substrate support unit. The pressing unit may press the multiple solder precoats formed on the first main surface by pressing the first main surface of the substrate. This flattens the tops of the multiple solder precoats, and when an electronic component is mounted thereon, it is possible to prevent the electronic component from shifting in position. The pressing unit may have a pressing roller that rolls to press the first main surface. Alternatively, the pressing unit may have a pressing plate that descends relative to the substrate to press the first main surface. The configuration of the pressing unit is not particularly limited as long as it can apply the desired pressing force to the first main surface of the substrate.

[0014] The board under-receiving portion has a plurality of under-receiving members and a plurality of switching portions.

[0015] Each of the multiple support members supports the second main surface of the substrate. When the second main surface of the substrate is divided into multiple non-overlapping regions, each of the multiple support members may support a different region of the second main surface. Each support member may be a block-shaped member. Each support member may have a flat upper surface (or support surface) extending horizontally. The upper surfaces of the multiple support members may have the same area or different areas. The upper surfaces of the multiple support members may have the same shape or different shapes. The shape of each of the upper surfaces of the multiple support members may be rectangular, or the collective shape of the upper surfaces of the multiple support members may be rectangular as a whole. The number of support members may be two or more, and may be an odd or even number, but an even number of four or more is preferable.

[0016] A plurality of switching units are provided for each of the plurality of support members. Each switching unit switches between a first state and a second state. In the first state, each switching unit functions to prevent the corresponding support member from displacing the board due to the pressing force of the pressing unit. In the second state, each switching unit functions to allow the corresponding support member to displace the board due to the pressing force of the pressing unit. Here, "preventing displacement of the board" not only means that the board is not displaced (or deformed) at all, but also includes suppressing displacement (or deformation) of the board so as not to release the pressing force of the pressing unit to the extent that the solder precoat is crushed by the pressing force of the pressing unit. Furthermore, "allowing displacement of the board" means that the board can displace (or deform) so as to release the pressing force of the pressing unit to the extent that the solder precoat is not crushed by the pressing force of the pressing unit. For example, some of the plurality of switching units can be in the first state, and the remaining units can be in the second state. At this time, the pressing force of the pressing portion is concentrated on the lower support member corresponding to the switching portion in the first state. For example, 90% or more of the pressing force is received by the lower support member corresponding to the switching portion in the first state.

[0017] The control unit can individually switch the states of the multiple switching units. The control unit may have a calculation device and a storage device storing a program executable by the calculation device. The control unit changes the switching unit that sets the switching unit to the first state and the switching unit that sets the switching unit to the second state as the pressing operation by the pressing unit progresses. Here, in the pressing operation, the pressing unit may press the substrate multiple times. An operation in which such pressing is performed once is considered to be a unit operation, and the control unit may change the switching unit that sets the switching unit to the first state and the switching unit that sets the switching unit to the second state between unit operations. For example, the change may be made each time a unit operation is performed once, or each time a unit operation is performed multiple times.

[0018] In a board pressing device having the above-described configuration, when the pressing unit presses the board, displacement of the board is prevented only by the lower support member corresponding to the switching unit in the first state. Therefore, by setting some of the switching units to the first state and the remaining switching units to the second state, the pressing force of the pressing unit crushes only the solder precoat on the portion of the board supported by the lower support member corresponding to the switching unit in the first state. For example, if there are four lower support members that evenly support the board, by setting the switching unit corresponding to one of them to the first state and the switching units corresponding to the remaining three to the second state and pressing the board, the pressing force can be concentrated on one-quarter of the first main surface of the board, crushing the solder precoat in that area. Then, by repeating this operation four times while changing the switching unit set to the first state, the solder precoat on the entire board can be crushed. In this case, the pressing force required for one operation is approximately one-quarter of the pressing force required to crush the solder precoat on the entire board at once. Since multiple solder precoats can be crushed without requiring a large pressing force, the rigidity of the board pressing device does not need to be that high. Therefore, the size of the board pressing device can be prevented from increasing. Note that although an example in which there are four lower support members has been described, the effects described in this paragraph can be obtained regardless of the number of lower support members, as long as there are multiple lower support members.

[0019] Each of the multiple switching units may have a locking unit that, in a first state, locks the support member so that it does not descend even when subjected to the pressing force of the pressing unit, and, in a second state, releases the support member so that it descends when subjected to the pressing force of the pressing unit. In this case, each support member may abut against the second main surface of the board in both the first state and the second state. The locking unit may be, for example, a link mechanism or the like that structurally locks the support member, or an air cylinder or the like that functionally locks the support member. In a portion of the board corresponding to a locked support member, the solder precoat may be crushed by the pressing force of the pressing unit. In a portion of the board corresponding to a released (or unlocked) support member, the pressing force of the pressing unit is used to lower the support member, and the solder precoat is not crushed.

[0020] The substrate support portion may have a support base that is disposed below the plurality of support members and holds the plurality of support members so that they can be raised and lowered individually. The locking portion may be disposed between the plurality of support members and the support base. Only one support base may be provided, or multiple support bases may be provided. The support base may have sufficient rigidity so that it does not deform or displace even when subjected to the pressing force of the pressing portion. The support base may be fixed in a predetermined position.

[0021] The substrate support portion may have a biasing means for biasing the plurality of support members individually upward. In this case, all of the plurality of support members can be maintained in contact with the second main surface of the substrate. The biasing means may be, for example, a spring such as a coil spring or a leaf spring, or an element such as an air cylinder whose biasing force is adjustable. The biasing force of the biasing means may be set smaller than the pressing force of the pressing portion. At least one biasing means may be provided for each of the support members.

[0022] The locking unit may include an air cylinder. Each of the multiple switching units may be configured to switch between a first state and a second state depending on the pressure supplied to the air cylinder. In this case, by supplying a pressure equal to or greater than a predetermined value to the air cylinder, the corresponding switching unit may switch to the first state. On the other hand, by reducing the pressure supplied to the air cylinder to less than the predetermined value, the corresponding switching unit may switch to the second state.

[0023] Each of the multiple switching units may have a moving unit that, in the first state, moves the support member to an elevated position where it receives the pressing force of the pressing unit, and, in the second state, moves the support member to a lowered position below the substrate. In this case, the support member corresponding to the switching unit in the first state abuts against the second main surface of the substrate in the elevated position, while the support member corresponding to the switching unit in the second state is spaced downward from the second main surface of the substrate in the lowered position. The moving unit may have, for example, an air cylinder that moves the support member up and down. The air cylinder may be configured to apply an upward force to the support member that is greater than the pressing force (i.e., downward force) of the pressing unit in the first state.

[0024] The pressing unit may have a pressing roller that rotates about a rotation axis extending in a first horizontal direction. The plurality of support members may be aligned along the first horizontal direction. The pressing roller may roll in a second horizontal direction perpendicular to the first horizontal direction while rotating about the rotation axis, thereby crushing the plurality of solder precoats on the substrate.

[0025] The control unit may switch the states of the multiple switching units so that the substrate is supported by a combination of at least two of the support members located on either side of the center line, the combination changing as the pressing operation progresses, using a straight line that passes through the center point of the substrate in the first horizontal direction and extends perpendicular to the first horizontal direction as a center line. In this case, the pressing force of the pressing unit can be applied to the substrate in a more balanced manner than when the substrate is supported by support members only on one side or only on the other side of the center line. Therefore, when pressing the substrate, the tool used for pressing (e.g., a pressing roller) or the substrate is less likely to tilt, and the multiple solder precoats can be substantially evenly crushed.

[0026] The control unit may switch the states of the multiple switching units between the first state and the second state so that the board is supported by the support members at positions symmetrical with respect to the center line. In this case, the pressing force of the pressing unit can be applied to the board in a more balanced manner, thereby more evenly crushing the multiple solder precoats. To support the board at positions symmetrical with respect to the center line, for example, multiple support members can be arranged symmetrically with respect to the center line. In this case, both an even number of support members and an odd number of support members can be arranged. In the former case, the same number of support members can be arranged on either side of the center line. In the latter case, one support member can be arranged on the center line and the same number of support members can be arranged on both sides of it.

[0027] (Screen printing equipment) The screen printing apparatus according to the present disclosure presses a substrate on which a plurality of solder precoats have been formed, and applies flux to the solder precoats on the pressed substrate. The screen printing apparatus according to the present disclosure includes a substrate pressing mechanism, a screen printing mechanism, and a control unit. Note that in this specification, the term "screen printing apparatus" may be read as "substrate pressing device" because, as described above, the screen printing apparatus also has the function of pressing the substrate.

[0028] The substrate pressing mechanism has a configuration basically similar to that of the substrate pressing device described above. Specifically, the substrate pressing mechanism is a substrate pressing mechanism that presses multiple solder precoats on a substrate having a first main surface on which multiple solder precoats are formed and a second main surface opposite the first main surface, and includes a substrate support portion that supports the second main surface of the substrate and a pressing portion that presses the first main surface of the substrate supported by the substrate support portion. The substrate support portion includes multiple support members that each support the second main surface, and multiple switching portions provided for each of the multiple support members. Each of the multiple switching portions switches between a first state in which the corresponding support member prevents displacement of the substrate due to the pressing force of the pressing portion and a second state in which the corresponding support member allows displacement of the substrate due to the pressing force of the pressing portion.

[0029] The screen printing mechanism applies flux to the plurality of solder precoats. The screen printing mechanism may apply flux to the plurality of solder precoats using a screen printing method. The plurality of solder precoats may be a plurality of solder precoats on a substrate pressed by the substrate pressing mechanism.

[0030] The control unit can individually switch the states of the multiple switching units, and the control unit changes between the switching units that are set to the first state and the switching units that are set to the second state as the pressing operation by the pressing unit progresses.

[0031] In the screen printing apparatus according to the present disclosure, the rigidity of the substrate pressing mechanism does not need to be very high, so the substrate pressing mechanism can be prevented from becoming large, and therefore the screen printing apparatus can be prevented from becoming large.

[0032] (Substrate pressing method) A substrate pressing method according to the present disclosure is a method for pressing a substrate on which a plurality of solder precoats have been formed. The substrate pressing method according to the present disclosure is carried out by a substrate pressing device that includes a substrate support portion that supports the second main surface of a substrate having a first main surface on which a plurality of solder precoats have been formed and a second main surface opposite the first main surface, and a pressing portion that presses the first main surface of the substrate supported by the substrate support portion, the substrate support portion having a plurality of support members that each support the second main surface. The substrate pressing method according to the present disclosure includes a pressing step.

[0033] In the pressing step, the first main surface is pressed by the pressing portion while the substrate is supported by some of the plurality of lower support members, and the lower support members supporting the substrate are changed as the pressing step progresses.

[0034] The substrate pressing method according to the present disclosure also does not require the rigidity of the substrate pressing device to be very high, and therefore can prevent the device from becoming too large.

[0035] As described above, according to the present disclosure, by pressing the substrate while switching multiple lower support members between the first state and the second state, it is possible to reduce the rigidity required for the device and prevent it from becoming larger.

[0036] Below, examples of a substrate pressing device, a screen printing device, and a substrate pressing method according to the present disclosure will be described in detail with reference to the drawings. The components and steps described above can be applied to the components and steps of the example substrate pressing device, screen printing device, and substrate pressing method described below. The components and steps of the example substrate pressing device, screen printing device, and substrate pressing method described below can be modified based on the above description. Furthermore, the matters described below may be applied to the above-described embodiment. Among the components and steps of the example substrate pressing device, screen printing device, and substrate pressing method described below, components and steps that are not essential to the substrate pressing device, screen printing device, and substrate pressing method according to the present disclosure may be omitted. Note that the diagrams shown below are schematic and do not accurately reflect the shapes and numbers of actual components.

[0037] First Embodiment A first embodiment of the present disclosure will be described. First, the configuration of a screen printing apparatus 10 according to the present embodiment will be described, followed by a screen printing method executed by the screen printing apparatus 10. Note that the screen printing method according to the present embodiment includes a step of pressing a substrate 70, and in this sense, it may be interpreted as a "substrate pressing method."

[0038] (Screen printing equipment) The screen printing apparatus 10 of this embodiment is an apparatus that presses the first main surface 70a of a substrate 70, which has a first main surface 70a and an opposite second main surface 70b on which a plurality of solder precoats (not shown) are formed, and applies flux F to the solder precoats on the pressed substrate 70. As shown in FIG. 1 , the screen printing apparatus 10 includes a base 11, an alignment table 12, a substrate holding table lifting unit 13, a substrate holding table 14, a pressing unit 54, a printing unit 58, and a control unit 63. The substrate holding table 14 and the pressing unit 54 form a substrate pressing mechanism, and the substrate holding table 14 and the printing unit 58 form a screen printing mechanism.

[0039] The base 11 is an element that serves as the foundation of the screen printing apparatus 10, and is installed on the floor of a factory, etc. The base 11 supports the alignment table 12, the substrate holding table 14, and the like.

[0040] The alignment table 12 is supported by the base 11 and moves the substrate holding table 14 in the horizontal direction relative to the base 11. The alignment table 12 is also capable of rotating the substrate holding table 14 around a vertical axis. Through such horizontal movement and rotation, the alignment table 12 achieves alignment between the substrate 70 held by the substrate holding table 14 and the printing unit 58.

[0041] The substrate holding table lifting unit 13 is supported by the alignment table 12 and supports the substrate holding table 14 so that it can be raised and lowered. The substrate holding table lifting unit 13 may raise and lower the substrate holding table 14, for example, between a lowered position when the pressing unit 54 presses the substrate 70 and an upper position when the printing unit 58 prints the flux F on the substrate 70.

[0042] The substrate holding table 14 is supported by the substrate holding table lifting section 13, and holds a substrate 70 on which a plurality of solder precoats are formed. The configuration of the substrate holding table 14 will be described in detail later.

[0043] The pressing unit 54 is supported by a frame (not shown) or the like included in the screen printing apparatus 10, and presses the first main surface 70a (or upper surface) of the substrate 70 held on the substrate holding table 14. The pressing unit 54 is disposed above the substrate holding table 14. The pressing unit 54 includes a pressing roller 55 that presses the substrate 70, a pressing head 56 that supports the pressing roller 55 and applies a pressing force (or a vertically downward force) to it, and a pressing roller moving unit 57 that moves the pressing head 56 in the horizontal direction. The pressing roller 55 rotates about a rotation axis extending in a first horizontal direction HD1 (a direction perpendicular to the plane of the paper in FIG. 1). The pressing roller moving unit 57 extends in a second horizontal direction HD2 (a left-right direction in FIG. 1) that is perpendicular to the first horizontal direction HD1, and moves the pressing roller 55 in the second horizontal direction HD2.

[0044] The printing unit 58 is supported by a frame (not shown) or the like provided in the screen printing apparatus 10, and applies the flux F to the pressed substrate 70 using a screen printing method. The printing unit 58 is disposed above the pressing unit 54. The printing unit 58 has a screen mask 59 having a plurality of openings (not shown) for printing, and a print head 61 that moves the flux F supplied to the screen mask 59 over the screen mask 59. The print head 61 has at least one squeegee 62, and moves the flux F over the screen mask 59 using the squeegee 62.

[0045] The control unit 63 controls the operation of each component included in the screen printing apparatus 10. The control unit 63 in this embodiment is provided inside the base 11, but is not limited to this. The control unit 63 includes a calculation device and a storage device storing a program executable by the calculation device (for example, a program for executing the substrate pressing method of this embodiment). The control unit 63 changes between a switching unit 29 (described below) that sets the switching unit 29 to the first state and a switching unit 29 that sets the switching unit 29 to the second state as the pressing operation by the pressing unit 54 progresses. The control unit 63 may select a lower support member 24 (described below) that does not descend even when subjected to the pressing force of the pressing unit 54 by individually switching each of the multiple switching units 29 between the first state and the second state.

[0046] 1 to 4, the configuration of the substrate holding table 14 will be described in detail. The substrate holding table 14 includes a lifting base 15, a lower support lifting section 16, a substrate lower support section 17, a substrate transport section 49, and a clamp member 53.

[0047] The lifting base 15 is an element that serves as the base of the substrate holding table 14, and supports each component of the substrate holding table 14. The lifting base 15 is supported by the substrate holding table lifting unit 13 so that it can be raised and lowered.

[0048] Lower support lifting unit 16 is supported by lifting base 15 and supports substrate lower support unit 17 so that it can be raised and lowered. Lower support lifting unit 16 may raise and lower substrate lower support unit 17, for example, between an elevated position when pressing unit 54 presses substrate 70 and a lowered position when substrate transport unit 49 loads and unloads substrate 70.

[0049] The substrate receiving portion 17 supports the second main surface 70b (or the lower surface) of the substrate 70. The substrate receiving portion 17 has a receiving base 18, a plurality of receiving members 24, a plurality of switching units 29, a plurality of biasing means 48, and a control unit 63.

[0050] The support base 18 is supported by the support lifting unit 16 so as to be able to move up and down, and supports a plurality of support members 24 and a plurality of switching units 29. The support base 18 is disposed below the plurality of support members 24, and holds the plurality of support members 24 so as to be able to move up and down individually via lifting guides 21. The lifting guides 21 have a cylindrical guide member 22 fixed to the support base 18, and a guide rod 23 that is inserted through the guide member 22 and guided in the up and down direction by the guide member 22. The upper end of the guide rod 23 is connected to the underside of the corresponding support member 24.

[0051] Each of the multiple (six in this example) support members 24 supports the second main surface 70b of the substrate 70. The multiple support members 24 are arranged side by side along a first horizontal direction HD1 (a direction perpendicular to the plane of the paper in FIG. 1 or a left-right direction in FIG. 2). Each support member 24 is a block-shaped member extending in a second horizontal direction HD2 (a left-right direction in FIG. 1 or a top-bottom direction in FIG. 2). A plurality of suction ports 25 used to suck the substrate 70 are formed on the upper surface of each support member 24. Each support member 24 has a flange 26, the upper surface of which abuts against the lower surface of a stopper 19 erected on the support base 18. This prevents each support member 24 from rising above a predetermined height. The number of support members 24 is preferably an even number, but may be an odd number.

[0052] A plurality of (six in this example) switching units 29 are provided for each of the plurality of lower support members 24. That is, the plurality of switching units 29 are provided in one-to-one correspondence with the plurality of lower support members 24. Each of the plurality of switching units 29 switches between a first state in which the corresponding lower support member 24 prevents displacement of the substrate 70 due to the pressing force of the pressing unit 54, and a second state in which the corresponding lower support member 24 allows displacement of the substrate 70 due to the pressing force of the pressing unit 54. Each switching unit 29 has at least one locking unit 31 and a lock operating unit 39.

[0053] At least one locking section 31 (four per switching section 29 in this example) is disposed between the plurality of support members 24 and the support base 18. Each locking section 31 includes a first bearing 32 connected to the support member 24, a second bearing 33 connected to the support base 18, a first link 37 rotatably connected to the first bearing 32 via a first shaft 34, and a second link 38 rotatably connected to the second bearing 33 via a second shaft 35. The first link 37 and the second link 38 are rotatably connected to each other via a third shaft 36. The first link 37 has a circular first through hole 37a through which the third shaft 36 is inserted, and the second link 38 has an oval second through hole 38a through which the third shaft 36 is inserted.

[0054] The lock operating unit 39 has a function of operating the locking unit 31 to switch the switching unit 29 between the first state and the second state. The lock operating unit 39 has a connecting bar 41 that connects the multiple locking units 31 together, and an actuator 42 that moves the connecting bar 41. The connecting bar 41 connects the third shafts 36 of the multiple locking units 31 to each other. The actuator 42 moves the connecting bar 41 in the second horizontal direction HD2. The actuator 42 is configured, for example, by an electric or hydraulic actuator or motor.

[0055] 4(a), when the connecting bar 41 is moved to the left in the figure by the actuator 42, the first shaft 34, the second shaft 35, and the third shaft 36 are aligned vertically. In this state, even if the pressing force of the pressing portion 54 acts on the corresponding lower support member 24, the first link 37 and the second link 38 receive the pressing force, and as a result, the corresponding lower support member 24 does not descend (first state). Therefore, the solder precoat in the area of ​​the substrate 70 supported by the corresponding lower support member 24 is crushed by the pressing portion 54.

[0056] 4(b), when the actuator 42 moves the connecting bar 41 to the right in the figure, the third shaft 36 is positioned to the right of the line connecting the first shaft 34 and the second shaft 35. In this state, when the pressing force of the pressing portion 54 acts on the corresponding lower support member 24, the first link 37 rotates counterclockwise about the first shaft 34 and the second link 38 rotates clockwise about the second shaft 35, and the third shaft 36 is displaced further to the right, thereby releasing the pressing force and lowering the corresponding lower support member 24 (second state). Therefore, the solder precoat in the area of ​​the substrate 70 supported by the corresponding lower support member 24 is not crushed by the pressing portion 54.

[0057] The multiple switching units 29 switch between a first state and a second state such that the substrate 70 is supported by the support member 24 on both sides of a center line CL (see FIG. 2) that passes through the center point of the substrate 70 in the first horizontal direction HD1 and extends perpendicular to the first horizontal direction HD1. Preferably, the multiple switching units 29 switch between the first state and the second state such that the substrate 70 is supported by the support member 24 at positions symmetrical with respect to the center line CL.

[0058] The multiple (six in this example) biasing means 48 are configured with air cylinders in this example, and individually bias the multiple lower support members 24 upward. The multiple biasing means 48 are provided in one-to-one correspondence with the multiple lower support members 24. The biasing force (or vertically upward force) of each biasing means 48 is set to be smaller than the pressing force (or vertically downward force) of the pressing portion 54. Therefore, when the lower support base 18 is raised, the biasing force of the biasing means 48 presses each lower support member 24 against the substrate 70, while when a pressing force is applied to the substrate 70, the lower support member 24 corresponding to the second state switching portion 29 is displaced downward by the pressing force.

[0059] The board transport unit 49 transports the board 70 in a first horizontal direction HD1. The board transport unit 49 has a board guide 51 extending in the first horizontal direction HD1 and a transport conveyor 52 attached to the board guide 51. The board guide 51 guides the board 70 along the first horizontal direction HD1. The transport conveyor 52 transports the board 70 along the first horizontal direction HD1.

[0060] A pair of clamp members 53 are provided to clamp the substrate 70 at a predetermined position. Each clamp member 53 is provided at the upper end of the corresponding substrate guide 51 and is configured to move toward or away from each other. The pair of clamp members 53 allows the substrate 70 to move between them while spaced apart. Meanwhile, the pair of clamp members 53 move toward each other with the substrate 70 positioned at a predetermined position between them to clamp the substrate 70 by sandwiching its sides. The second main surface 70b of the substrate 70 is attracted by a suction mechanism (not shown) via the suction port 25 of the lower support member 24, and the pair of clamp members 53 clamp the substrate 70 by sandwiching its sides. This prevents the substrate 70 from moving unexpectedly when pressing the substrate 70 or applying flux F to the solder precoat.

[0061] (Screen printing method) Next, the screen printing method of this embodiment will be described with reference to Figures 5 to 7. The screen printing method of this embodiment is a method in which a substrate 70 is pressed to crush the solder precoat formed on the substrate, and then flux F is applied to the crushed solder precoat using a screen printing method. The screen printing method of this embodiment can be performed, for example, by the above-mentioned screen printing apparatus 10, and includes a loading step, a holding step, a pressing step, an alignment step, and a printing step.

[0062] 5, in the carrying-in process, with the substrate receiving portion 17 lowered, the substrate 70 is carried to a predetermined position by the substrate carrying portion 49. At this time, the substrate 70 is guided by the substrate guide 51 and carried by the carrying conveyor 52 along the first horizontal direction HD1.

[0063] In the holding step, as shown in Fig. 6, the substrate support portion 17 is raised (upward arrow in Fig. 6), and the substrate 70 is lifted from the transport conveyor 52 by the plurality of support members 24. Then, the substrate 70 is sucked by suction via the suction port 25, and the side surfaces of the substrate 70 are sandwiched and clamped by the pair of clamp members 53 (pair of inward arrows on the left and right in Fig. 6). In this way, the substrate 70 is held.

[0064] In the pressing step (pressing operation), as indicated by the double-headed arrows extending left and right in FIG. 6 , the first main surface 70 a (or the upper surface) of the held substrate 70 is pressed by the pressing roller 55 of the pressing unit 54. The pressing step (pressing operation) is completed by performing an operation (hereinafter referred to as a unit operation) of moving the pressing roller 55 from one board guide 51 side toward the other board guide 51 side while pressing it against the first main surface 70 a multiple times. At this time, as shown in FIG. 7 , in the pressing step, the lower support member 24 that receives the pressing force of the pressing unit 54 is changed as the pressing operation progresses. Note that in FIG. 7 , the lower support member 24 that receives the pressing force of the pressing unit 54, i.e., the lower support member 24 that prevents displacement of the substrate 70, is indicated by an upward-pointing outline arrow, and the switching unit 29 in the first state is indicated by dot hatching.

[0065] 7, first, the pressing force of the pressing unit 54 is received by the two lower support members 24 at both ends in the figure. Specifically, by switching the switching units 29 corresponding to the two lower support members 24 at both ends to the first state, the two lower support members 24 prevent (downward) displacement of the board 70 due to the pressing force of the pressing roller 55, and by switching the switching units 29 corresponding to the remaining four lower support members 24 to the second state, the four lower support members 24 allow (downward) displacement of the board 70 due to the pressing force of the pressing roller 55. As a result, the solder precoat in the areas of the board 70 supported by the two lower support members 24 at both ends is crushed.

[0066] 7, the lower support members 24 that receive the pressing force of the pressing unit 54 are changed to the two lower support members 24 that are second from both ends in the figure. Specifically, by switching the switching units 29 corresponding to the two lower support members 24 to the first state, the two lower support members 24 prevent the (downward) displacement of the board 70 due to the pressing force of the pressing roller 55, and by switching the switching units 29 corresponding to the remaining four lower support members 24 to the second state, the four lower support members 24 allow the (downward) displacement of the board 70 due to the pressing force of the pressing roller 55. As a result, the solder precoat in the areas of the board 70 that are supported by the two lower support members 24 that are second from both ends is crushed.

[0067] Finally, as shown in the lower part of FIG. 7 , the support members 24 that receive the pressing force of the pressing unit 54 are changed to the two support members 24 that are third from both ends (or the center) in the figure. Specifically, by switching the switching units 29 corresponding to the two support members 24 to the first state, the two support members 24 prevent the (downward) displacement of the board 70 due to the pressing force of the pressing roller 55. At the same time, by switching the switching units 29 corresponding to the remaining four support members 24 to the second state, the four support members 24 allow the (downward) displacement of the board 70 due to the pressing force of the pressing roller 55. As a result, the solder precoat in the area of ​​the board 70 supported by the two support members 24 that are third from both ends is crushed. In the pressing process shown in FIG. 7 , the control unit 63 switches the switching units 29 corresponding to the two support members 24 located on either side of the center line CL to the first state. The control unit 63 changes the combination of the two lower support members 24 positioned on either side of the center line CL as the pressing work progresses. The order in which the multiple switching units 29 are switched to the first state can be selected as appropriate, other than the order described here. Furthermore, it is preferable to change the lower support members 24 that receive the pressing force of the pressing unit 54 between unit operations. In other words, after one or more unit operations are completed, the state of the switching units 29 is switched several times to complete the pressing process.

[0068] Another example of the pressing step is shown in FIG. 8. This example deals with a substrate 70 that is smaller than the substrate 70 in FIG. 7, i.e., a substrate 70 that can be entirely supported by four support members 24. First, as shown in the upper part of FIG. 8, the switching units 29 corresponding to the two support members 24 that are second from both ends in the figure are switched to a first state, thereby preventing the two support members 24 from displacing (downward) the substrate 70 due to the pressing force of the pressing roller 55. At the same time, the switching units 29 corresponding to the remaining four support members 24 are switched to a second state, thereby allowing the four support members 24 to displace (downward) the substrate 70 due to the pressing force of the pressing roller 55. As a result, the solder precoat in the regions of the substrate 70 that are supported by the two support members 24 that are second from both ends is crushed.

[0069] 8, by switching the switching units 29 corresponding to the third (or central) two lower support members 24 from both ends in the figure to the first state, the two lower support members 24 prevent (downward) displacement of the board 70 due to the pressing force of the pressure roller 55, and by switching the switching units 29 corresponding to the remaining four lower support members 24 to the second state, the four lower support members 24 allow (downward) displacement of the board 70 due to the pressing force of the pressure roller 55. As a result, the solder precoat in the areas of the board 70 supported by the two lower support members 24 third from both ends is crushed.

[0070] Although not shown in the figures, for example, when performing the pressing process on a substrate of the same size as the substrate 70 in Figure 7, if a small pressing force is sufficient, it is possible to switch the switching units 29 corresponding to all of the lower support members 24 to the first state and simultaneously press all of the solder precoats provided on the substrate 70.

[0071] 9, in the alignment process, the substrate holding table 14 is raised (upward arrow in FIG. 9) and the held substrate 70 is aligned with the screen mask 59. At this time, the horizontal and angular positions of the substrate 70 are adjusted using the alignment table 12, thereby aligning the solder precoats on the substrate 70 so that they are positioned directly below the openings in the screen mask 59.

[0072] 9, in the printing process, flux F is supplied to screen mask 59 and moved over screen mask 59 by squeegee 62 of printing unit 58, so that flux F is applied to the solder precoat on substrate 70 through the openings in screen mask 59 (rightward arrow in FIG. 9). After application of flux F is complete, although not shown, substrate holding table 14 is lowered, substrate 70 is released from its hold, substrate support unit 17 is lowered, and substrate 70 is carried out.

[0073] Second Embodiment A second embodiment of the present disclosure will be described. The screen printing apparatus 10 of this embodiment differs from the first embodiment in the configuration of the multiple urging means 48. Specifically, as shown in FIG. 10, each urging means 48 of this embodiment is composed of a coil spring provided between the corresponding lower support member 24 and the lower support base 18. A shaft 27 extending from the lower surface of the lower support member 24 is inserted into the hollow of the coil spring, and a stopper 28 is provided at the lower end of the shaft 27 to engage with the lower support base 18 and regulate the raised position of the lower support member 24. The other configurations are the same as those of the first embodiment.

[0074] Third Embodiment A third embodiment of the present disclosure will be described. The screen printing apparatus 10 of this embodiment differs from the first embodiment in the configuration of the switching unit 29. The following mainly describes the differences from the first embodiment.

[0075] 11, each switching unit 29 (or each locking unit 31) in this embodiment is configured with an air cylinder 43 and a switching valve 44. Each switching unit 29 is configured to switch between a first state and a second state depending on the pressure supplied to the air cylinder.

[0076] Specifically, as shown in FIG. 12 , a high-pressure air supply pipe 45 and a low-pressure air supply pipe 46 are connected to each switching unit 29 via a switching valve 44. High-pressure air is supplied to the high-pressure air supply pipe 45 by a high-pressure supply means (not shown). Low-pressure air is supplied to the low-pressure air supply pipe 46 by a low-pressure supply means (not shown). The switching valve 44 is configured to be switchable by the control unit 63 between a high-pressure flow path that connects the high-pressure air supply pipe 45 to the air cylinder 43 and a low-pressure flow path that connects the low-pressure air supply pipe 46 to the air cylinder 43. When the corresponding switching valve 44 switches to the high-pressure flow path, each switching unit 29 switches to a first state that prevents displacement of the substrate 70 due to the pressing force of the pressing unit 54. On the other hand, when the corresponding switching valve 44 switches to the low-pressure flow path, each switching unit 29 switches to a second state that allows displacement of the substrate 70 due to the pressing force of the pressing unit 54. In the state illustrated in FIG. 12, the two switching units 29 at both ends in the figure are in the first state, while the remaining four switching units 29 are in the second state.

[0077] Fourth Embodiment A fourth embodiment of the present disclosure will be described. The screen printing apparatus 10 of this embodiment differs from the first embodiment in the configuration of the switching unit 29. The following mainly describes the differences from the first embodiment.

[0078] As shown in FIG. 13, each switching unit 29 in this embodiment is composed of an air cylinder 43 and a switching valve 44, which function as a moving unit that raises and lowers the support member 24. Each switching unit 29 is configured to switch between a first state and a second state depending on the pressure supplied to the air cylinder. When the switching unit 29 is in the first state, as shown in FIG. 13(a), the corresponding support member 24 moves to the raised position and supports the substrate 70. On the other hand, when the switching unit 29 is in the second state, as shown in FIG. 13(b), the corresponding support member 24 moves to the lowered position and does not support the substrate 70. The air cylinder 43 in this embodiment is an example of a moving unit.

[0079] As shown in FIG. 14 , each switching unit 29 is connected to a high-pressure air supply pipe 45 and an open pipe 47 via a switching valve 44. High-pressure air is supplied to the high-pressure air supply pipe 45 by a high-pressure supply means (not shown). The open pipe 47 is open to the atmosphere. The switching valve 44 is configured to be switchable by the control unit 63 between a high-pressure flow path that connects the high-pressure air supply pipe 45 to the air cylinder 43 and an open flow path that connects the open pipe 47 to the air cylinder 43. When the corresponding switching valve 44 switches to the high-pressure flow path, each switching unit 29 switches to a first state that prevents displacement of the substrate 70 due to the pressing force of the pressing unit 54. On the other hand, when the corresponding switching valve 44 switches to the open flow path, each switching unit 29 switches to a second state that allows displacement of the substrate 70 due to the pressing force of the pressing unit 54. 14, the two switching units 29 at both ends are in the first state, while the remaining four switching units 29 are in the second state. In this embodiment, the moving unit uses an air cylinder 43, but a feed mechanism or cam mechanism driven by a motor may also be used.

[0080] <<Notes>> The above description of the embodiments discloses the following techniques. (Technology 1) a substrate support portion that supports a second main surface of a substrate having a first main surface on which a plurality of solder precoats are formed and a second main surface opposite the first main surface; a pressing portion that presses the first main surface of the substrate supported by the substrate receiving portion; A control unit; Equipped with The substrate receiving portion is a plurality of support members each supporting the second main surface; a plurality of switching portions provided for the plurality of lower support members, and each of the plurality of switching units switches between a first state in which the corresponding lower support member prevents displacement of the substrate due to the pressing force of the pressing unit and a second state in which the corresponding lower support member allows displacement of the substrate due to the pressing force of the pressing unit; The control unit can individually switch the states of the multiple switching units, and changes the switching unit that sets it to the first state and the switching unit that sets it to the second state as the pressing operation by the pressing unit progresses. (Technology 2) The substrate pressing device according to technology 1, wherein each of the plurality of switching units has a locking unit that, in the first state, locks the lower support member so that it does not descend even when subjected to the pressing force of the pressing unit, and, in the second state, releases the lower support member so that it descends when subjected to the pressing force of the pressing unit. (Technology 3) the substrate support unit has a support base that is disposed below the plurality of support members and that holds the plurality of support members so that they can be individually raised and lowered; The substrate pressing device according to Technology 2, wherein the locking portion is disposed between the plurality of support members and the support base. (Technology 4) The substrate pressing device according to Technology 3, wherein the substrate under-receiving portion has a biasing means for individually biasing the plurality of under-receiving members upward. (Technology 5) The locking portion includes an air cylinder, The substrate pressing device according to any one of Techniques 2 to 4, wherein each of the plurality of switching units is configured to switch between the first state and the second state depending on the pressure supplied to the air cylinder. (Technology 6) The substrate pressing device according to technology 1, wherein each of the plurality of switching units has a moving unit that, in the first state, moves the lower support member to an elevated position where it receives the pressing force of the pressing unit, and, in the second state, moves the lower support member to a lowered position below the substrate. (Technology 7) the pressing unit has a pressing roller that rotates around a rotation axis extending in a first horizontal direction, 7. The substrate pressing device according to any one of techniques 1 to 6, wherein the plurality of lower support members are aligned along the first horizontal direction. (Technology 8) a straight line passing through a center point of the substrate in the first horizontal direction and extending perpendicular to the first horizontal direction as a center line, The control unit switches the states of the multiple switching units so that the substrate is supported by a combination of at least two of the lower support members positioned on either side of the center line in the first horizontal direction, and the combination changes as the pressing operation progresses. (Technology 9) The substrate pressing device described in Technology 8, wherein the control unit switches the states of the multiple switching units between the first state and the second state so that the substrate is supported by the lower support member at positions symmetrical with respect to the center line. (Technology 10) a substrate pressing mechanism that presses the plurality of solder precoats on a substrate having a first main surface on which the plurality of solder precoats are formed and a second main surface opposite the first main surface; a screen printing mechanism for applying flux to the plurality of solder precoats; A control unit; Equipped with The substrate pressing mechanism includes: a substrate support portion that supports the second main surface of the substrate; a pressing portion that presses the first main surface of the substrate supported by the substrate receiving portion; Equipped with The substrate receiving portion is a plurality of support members each supporting the second main surface; a plurality of switching portions provided for the plurality of lower support members, and each of the plurality of switching units switches between a first state in which the corresponding lower support member prevents displacement of the substrate due to the pressing force of the pressing unit and a second state in which the corresponding lower support member allows displacement of the substrate due to the pressing force of the pressing unit; The control unit is capable of individually switching the states of the multiple switching units, and changes the switching unit that sets it to the first state and the switching unit that sets it to the second state as the pressing operation by the pressing unit progresses. (Technology 11) A substrate pressing method carried out by a substrate pressing device, the substrate pressing device including: a substrate receiving portion that supports a second main surface of a substrate having a first main surface on which a plurality of solder precoats are formed and a second main surface opposite the first main surface; and a pressing portion that presses the first main surface of the substrate supported by the substrate receiving portion, the substrate receiving portion having a plurality of receiving members each supporting the second main surface, a pressing step of pressing the first main surface with the pressing portion while the substrate is supported by some of the plurality of lower support members, A substrate pressing method, wherein the support member supporting the substrate is changed as the pressing step progresses. [Industrial Applicability]

[0081] The present disclosure can be used for a substrate pressing device, a screen printing device, and a substrate pressing method. [Explanation of symbols]

[0082] 10: Screen printing device (substrate pressing device) 11: Foundation 12: Alignment table 13: Substrate holding table lifting unit 14: Substrate holding table (substrate pressing mechanism, screen printing mechanism) 15: Lifting base 16: Lower support lifting section 17: Board support part 18: Support base 19: Stopper 21: Lifting guide 22: Guide member 23: Guide rod 24: Lower support member 25: Suction port 26: Tsuba section 27: Shaft 28: Stopper 29: Switching section 31: Rock Club 32: First bearing 33: Second bearing 34: First shaft 35: Second shaft 36: Third shaft 37: First link 37a: 1st through hole 38: Second link 38a: Second through hole 39: Lock operation section 41: Connecting bar 42: Actuator 43: Air cylinder (moving part) 44: Switching valve 45: High pressure air supply pipe 46: Low pressure air supply pipe 47:Open pipe 48: energizing means 49: Substrate transport unit 51: PCB guide 52: Transport conveyor 53: Clamping member 54: Pressing section (substrate pressing mechanism) 55: Pressure roller 56: Pressing head 57: Pressure roller moving part 58: Printing department (screen printing mechanism) 59: Screen Mask 61: Print head 62: Squeegee 63: Control unit 70: Circuit board 70a: First main surface 70b: 2nd principal surface CL: Center line F: Flux HD1: 1st horizontal direction HD2: 2nd horizontal direction

Claims

1. a substrate support portion that supports a second main surface of a substrate having a first main surface on which a plurality of solder precoats are formed and a second main surface opposite the first main surface; a pressing portion that presses the first main surface of the substrate supported by the substrate receiving portion; A control unit; Equipped with The substrate receiving portion is a plurality of support members each supporting the second main surface; a plurality of switching portions provided for the plurality of lower support members, and each of the plurality of switching units switches between a first state in which the corresponding lower support member prevents displacement of the substrate due to the pressing force of the pressing unit and a second state in which the corresponding lower support member allows displacement of the substrate due to the pressing force of the pressing unit; The control unit can individually switch the states of the multiple switching units, and changes between the switching unit that sets the switching unit to the first state and the switching unit that sets the switching unit to the second state as the pressing operation by the pressing unit progresses.

2. 2. The substrate pressing device according to claim 1, wherein each of the plurality of switching units has a locking unit that, in the first state, locks the lower support member so that it does not descend even when subjected to the pressing force of the pressing unit, and, in the second state, releases the lower support member so that it descends when subjected to the pressing force of the pressing unit.

3. the substrate support unit has a support base that is disposed below the plurality of support members and that holds the plurality of support members so that they can be individually raised and lowered; The substrate pressing device according to claim 2 , wherein the locking portion is disposed between the plurality of support members and the support base.

4. The substrate pressing device according to claim 3 , wherein the substrate lower support portion has biasing means for individually biasing the plurality of lower support members upward.

5. The locking portion includes an air cylinder, 5. The substrate pressing device according to claim 2, wherein each of the plurality of switching units is configured to switch between the first state and the second state depending on the pressure supplied to the air cylinder.

6. 2. The substrate pressing device according to claim 1, wherein each of the plurality of switching units has a moving unit that, in the first state, moves the lower support member to an elevated position where it receives the pressing force of the pressing unit, and, in the second state, moves the lower support member to a lowered position below the substrate.

7. the pressing unit has a pressing roller that rotates around a rotation axis extending in a first horizontal direction, The substrate pressing device according to claim 1 , wherein the plurality of support members are aligned along the first horizontal direction.

8. a straight line passing through a center point of the substrate in the first horizontal direction and extending perpendicular to the first horizontal direction as a center line, 8. The substrate pressing device of claim 7, wherein the control unit switches the states of the plurality of switching units so that the substrate is supported by a combination of at least two of the lower support members positioned on either side of the center line in the first horizontal direction, and the combination changes as the pressing operation progresses.

9. The substrate pressing device according to claim 8 , wherein the control unit switches the states of the plurality of switching units between the first state and the second state so that the substrate is supported by the support member at positions symmetrical with respect to the center line.

10. a substrate pressing mechanism that presses the plurality of solder precoats on a substrate having a first main surface on which the plurality of solder precoats are formed and a second main surface opposite the first main surface; a screen printing mechanism for applying flux to the plurality of solder precoats; A control unit; Equipped with The substrate pressing mechanism includes: a substrate receiving portion that supports the second main surface of the substrate; a pressing portion that presses the first main surface of the substrate supported by the substrate receiving portion; Equipped with The substrate receiving portion is a plurality of support members each supporting the second main surface; a plurality of switching portions provided for the plurality of lower support members, and each of the plurality of switching units switches between a first state in which the corresponding lower support member prevents displacement of the substrate due to the pressing force of the pressing unit and a second state in which the corresponding lower support member allows displacement of the substrate due to the pressing force of the pressing unit; The control unit is capable of individually switching the states of the plurality of switching units, and changes between the switching unit that sets the unit to the first state and the switching unit that sets the unit to the second state as the pressing operation by the pressing unit progresses.

11. A substrate pressing method carried out by a substrate pressing device, the method comprising: a substrate receiving portion that supports a second main surface of a substrate having a first main surface on which a plurality of solder precoats are formed and a second main surface opposite the first main surface; and a pressing portion that presses the first main surface of the substrate supported by the substrate receiving portion, the substrate receiving portion having a plurality of receiving members each supporting the second main surface, a pressing step of pressing the first main surface with the pressing portion while the substrate is supported by some of the plurality of lower support members, A substrate pressing method, wherein the support member supporting the substrate is changed as the pressing step progresses.

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