Manufacturing method for multilayer ceramic electronic component

Abstract

To provide a manufacturing method for a multilayer ceramic electronic component in which minute debris is removed to suppress deterioration of reliability.SOLUTION: A manufacturing method for multilayer ceramic electronic component includes the steps of preparing a storage pallet 22 having a first surface 7a with a plurality of recesses 23 opening therein, and a lid 24 for covering the first surface 7a, the lid 24 having a base and a plurality of protrusions 20 provided on the base, storing a laminate chip 2 in each of the plurality of recesses 23, covering the plurality of recesses 23 with the lid 24 by bringing the plurality of protrusions 20 into contact with the first surface 7a of the storage pallet 22 storing the laminate chips 2, passing a cleaning airflow through the space between the first surface 7a and the second surface 7b, removing the laminate chips 2 from each recess 23 and firing them to produce a plurality of laminates 21, and forming an external electrode 3 on each of the plurality of laminates 21.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present disclosure relates to a method for manufacturing a multilayer ceramic electronic component. [Background technology]

[0002] A conventional method for manufacturing multilayer ceramic electronic components is described, for example, in Patent Document 1. This conventional technique describes an alignment method for aligning multiple chip components using a non-magnetic jig with multiple recesses. The chip components have a pair of main surfaces facing the stacking direction of the internal electrodes, a pair of end faces facing in a longitudinal direction perpendicular to the stacking direction, and a pair of side surfaces facing in a width direction perpendicular to the stacking direction and the longitudinal direction, and from which the internal electrodes are exposed. The method for manufacturing such chip components includes arranging the chip components in each of the recesses formed in a first direction, placing a cover member that covers the openings of each recess on the jig on which the multiple chip components are arranged, to create an alignment case with multiple closed spaces for housing each chip component, and moving a magnet along the surface of the alignment case facing in the first direction to align the multiple chip components so that each pair of side surfaces faces in the first direction. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 2019-175901 Summary of the Invention [Problem to be solved by the invention]

[0004] The prior art of Patent Document 1 described above has a problem in that when chip components are housed in an arrangement case, it is impossible to remove minute debris, such as cutting debris generated when cutting a laminate precursor formed by stacking green sheets or abrasion debris generated during vibration feeding, in a closed space. It is even more difficult to remove the minute debris by removing the cover member from the jig. Furthermore, if a protective layer is attached and fired while such minute debris remains attached to the cut surfaces of the individual pieces, it may cause a decrease in the reliability of the chip components. Therefore, there is a need for a method for manufacturing highly reliable multilayer ceramic electronic components that can remove minute debris. [Means for solving the problem]

[0005] A method for manufacturing a laminated ceramic electronic component according to the present disclosure includes the steps of: preparing a storage pallet having a first surface on which a plurality of recesses open; and a lid for covering the first surface of the storage pallet, the lid having a base and a second surface facing the first surface of the base with a plurality of protrusions; storing laminate chips in each of the plurality of recesses; covering the plurality of recesses with the lid by bringing the plurality of protrusions into contact with the first surface of the storage pallet storing the laminate chips; passing a cleaning airflow through a space between the first surface of the storage pallet and the second surface of the lid; removing the laminate chips from each recess of the storage pallet after passing the cleaning airflow and firing them to produce a plurality of laminates; and forming external electrodes on each of the plurality of laminates. [Effects of the Invention]

[0006] According to the method for manufacturing a multilayer ceramic electronic component according to the present disclosure, it is possible to prevent microscopic debris from adhering to the laminate chip, fire the laminate chip without allowing microscopic debris to adhere, and obtain a multilayer ceramic electronic component that can suppress a decrease in reliability. [Brief explanation of the drawings]

[0007] [Figure 1]1 is a perspective view showing an example of a multilayer ceramic capacitor 1 manufactured by a method for manufacturing a multilayer ceramic electronic component according to an embodiment of the present disclosure. [Figure 2] FIG. 2 is a perspective view showing a laminate chip of the multilayer ceramic capacitor shown in FIG. [Figure 3] 1 is a flowchart illustrating a method for manufacturing a multilayer ceramic capacitor. [Figure 4A] 10 is a perspective view showing a method of storing a plurality of stacked chips in a recess of a storage pallet. FIG. [Figure 4B] 10 is a perspective view showing a method of storing a plurality of stacked chips in a recess of a storage pallet. FIG. [Figure 4C] 10 is a perspective view showing a state in which stacked chips are stored in a recess of a storage pallet. FIG. [Figure 4D] FIG. 2 is a perspective view showing a storage pallet and a lid body. [Figure 4E] FIG. 10 is a cross-sectional view showing minute debris in a recess. [Figure 4F] FIG. 10 is a cross-sectional view showing the state in which the lid is attached to the storage pallet. [Figure 4G] 10 is a cross-sectional view showing a state in which a cleaning air current flows between the storage pallet and the lid when the storage pallet and the lid are inverted. FIG. [Figure 4H] FIG. 10 is a cross-sectional view showing a state in which the laminated chip is rolled in a magnetic field. [Figure 4I] FIG. 10 is a cross-sectional view showing the stacked chip after being displaced within the recess. [Figure 5] FIG. 10 is a perspective view showing a storage pallet and a lid used in a method for manufacturing a multilayer ceramic electronic component according to another embodiment of the present disclosure. [Figure 6] FIG. 10 is a plan view showing the contact position of the lid body with the storage pallet. [Figure 7A] FIG. 2 is a cross-sectional view of the storage pallet and the lid. [Figure 7B] 10 is a cross-sectional view showing a state in which the stacked chip is displaced within the space of the recessed portion. FIG. [Figure 8] FIG. 10 is an exploded perspective view showing a storage pallet and a lid body used in a third embodiment of the present disclosure. [Figure 9] 9 is an enlarged cross-sectional view of a portion of the storage pallet and lid of the third embodiment shown in FIG. 8. FIG. [Figure 10] FIG. 10 is an exploded perspective view showing a storage pallet and a lid body used in a fourth embodiment of the present disclosure. [Figure 11] FIG. 1 is an enlarged cross-sectional view of a portion showing a storage pallet and a lid; DETAILED DESCRIPTION OF THE INVENTION

[0008] Hereinafter, with reference to the drawings, the configuration of a multilayer ceramic capacitor will be described as an example of a multilayer ceramic electronic component manufactured by the manufacturing method for a multilayer ceramic electronic component according to the present disclosure. The manufacturing method for a multilayer ceramic electronic component according to the present disclosure is not limited to multilayer ceramic capacitors, and can also be applied to the manufacture of multilayer piezoelectric elements, multilayer thermistor elements, multilayer chip coils, ceramic multilayer substrates, and the like. The drawings referred to below are schematic, and the dimensional ratios and the like in the drawings do not necessarily correspond to the actual ones. For convenience, this specification assumes an XYZ Cartesian coordinate system with a first axis X, a second axis Y, and a third axis Z. In the following description, the first axis X will be referred to as the first direction X, the second axis Y will be referred to as the second direction Y, and the third direction Z will also be referred to as the third direction Z.

[0009] FIG. 1 is a perspective view showing an example of a multilayer ceramic capacitor 1 manufactured by a manufacturing method for a multilayer ceramic electronic component according to an embodiment of the present disclosure, and FIG. 2 is a perspective view showing a laminate 21 of the multilayer ceramic capacitor 1 shown in FIG. 1. The multilayer ceramic capacitor 1, which is an example of a multilayer ceramic electronic component, includes a laminate 21 formed by firing a laminate chip 2. The laminate 21 has a substantially rectangular parallelepiped shape. The laminate 21 has a first main surface 7a and a second main surface 7b facing each other, a first end surface 8a and a second end surface 8b that are perpendicular to the first main surfaces 7a and 7b and that face each other, and a first side surface 9a and a second side surface 9b that are perpendicular to the first surface 7a and the second surface 7b and the first end surface 8a and the second end surface 8b and that face each other.

[0010] The laminate 21 is manufactured by firing the laminate chip 2 described below. The laminate chip 2 is made by stacking a plurality of ceramic green sheets (hereinafter simply referred to as "green sheets"), each having a conductive film that constitutes the patterned internal electrodes 5 formed on the dielectric layer 4, to produce a laminate sheet, and then cutting this laminate sheet into individual pieces (see FIG. 4A described below) in a lattice pattern.

[0011] The dielectric layer 4 is made of an insulating material, such as a ceramic powder containing a dielectric material such as BaTiO3, CaTiO3, SrTiO3, BaZrO3, or CaZrO3, or a mixture thereof, as its main component. An organic vehicle is added to the powder to prepare a ceramic slurry. A ceramic green sheet is then produced using a sheet forming method such as a doctor blade method or a die coater method. The thickness of the green sheet may be, for example, approximately 0.5 to 10 μm. In this specification, the term "main component" refers to the component with the highest component ratio in the material or member of interest. The component ratio may be expressed as a content concentration (mol%).

[0012] The laminate 21 is formed by alternately stacking a plurality of dielectric layers 4 and a plurality of internal electrodes 5. The conductive film material for forming the internal electrodes 5 may be a base metal such as nickel (Ni) or copper (Cu), which allows for a high degree of lamination and reduces manufacturing costs. Nickel (Ni) may also be used, as it allows for simultaneous firing of the internal electrodes 5 and the dielectric layers 4. The thickness of the internal electrodes 5 may be approximately 0.1 μm to 1.0 μm, or approximately 0.4 μm to 0.5 μm. The internal electrodes 5 are exposed at a first end face 8a and a second end face 8b according to polarity.

[0013] The external electrodes 3 may be made of a sintered body of metal and glass, for example, a composition obtained by sintering copper (Cu) powder or a powder of an alloy of copper and another metal, for example, a base metal such as nickel (Ni), with glass powder. Furthermore, a metal plating layer such as Ni plating or Sn plating may be applied to the surface.

[0014] As shown in FIG. 2, the multilayer ceramic capacitor 1 includes a protective layer 6. The protective layer 6 is located on a first side surface 9a and a second side surface 9b of the laminate 21. The protective layer 6 electrically insulates the internal electrodes 5 of different polarities exposed on the side surfaces 9a and 9b. The protective layer 6 also mechanically protects the outer portions of the internal electrodes 5 exposed on the side surfaces 9a and 9b. The laminate 21 before firing, which does not have the protective layer 6 disposed on each side surface 9a and 9b, is also referred to as a laminate chip 2.

[0015] The protective layer 6 is made of an insulating material. The protective layer 6 may be made of a ceramic material whose main component is, for example, barium titanate (BaTiO3), calcium titanate (CaTiO3), strontium titanate (SrTiO3), barium zirconate (BaZrO3), or calcium zirconate (CaZrO3). The protective layer 6 may be made of the same ceramic material as the ceramic material that constitutes the dielectric layer 4. The protective layer 6 may have a thickness in the second direction Y of, for example, about 5 μm to 30 μm.

[0016] The multilayer ceramic capacitor 1 includes external electrodes 3 that cover the first end face 8a and the second end face 8b and are polarity connected to the internal electrodes 5. The external electrodes 3 are used for electrical connection to an external substrate or an external device.

[0017] The external electrode 3 is composed of a first external electrode 3a and a second external electrode 3b. The first external electrode 3a is located on a first end surface 8a of the laminate 21. The first external electrode 3a is electrically connected to the internal electrode 5 exposed at the first end surface 8a. The second external electrode 3b is located on a second end surface 8b of the laminate 21. The second external electrode 3b is electrically connected to the internal electrode 5 exposed at the second end surface 8b. The first external electrode 3a and the second external electrode 3b may be partially located on the main surfaces 7a and 7b, as shown in FIG. 1, for example. Alternatively, the first external electrode 3a and the second external electrode 3b may be partially located on the side surfaces 9a and 9b, as shown in FIG. 1, for example.

[0018] The first external electrode 3a and the second external electrode 3b may be formed of a single conductive layer or multiple conductive layers. In this embodiment, the first external electrode 3a and the second external electrode 3b may be formed of a two-layer structure having a base layer and an outer layer.

[0019] The underlayer is in contact with the laminate 21 and is connected to the internal electrodes 5 exposed at the first end face 8a and the second end face 8b. The underlayer may be made of a sintered body of metal and glass, for example, a composition obtained by firing copper (Cu) powder or an alloy powder of copper and another metal, such as a base metal such as nickel (Ni), with glass powder. Alternatively, the underlayer may be formed using a thin-film formation technique such as plating, sputtering, or vapor deposition, or a thick-film formation technique such as screen printing or gravure printing. Alternatively, the underlayer may be formed of a conductive resin. The metal material used for the underlayer may be, for example, a metal such as Ni, Cu, Ag, Pd, or Au, or an alloy made of these metals.

[0020] The outer layer covers the base layer. The outer layer may be formed using a thin film formation technique such as electroless plating or electrolytic plating. The outer layer is made of a metal material. The metal material used for the outer layer may be, for example, a metal such as Ni, Sn, Cu, or Au, or an alloy made of these metals. The outer layer may be made of a single plated layer or multiple plated layers.

[0021] The aforementioned multilayer ceramic capacitor 1 can be produced by stacking a plurality of ceramic green sheets on which internal electrode patterns made primarily of ferromagnetic metal are printed to produce a laminate sheet, cutting the laminate sheet along the short side direction perpendicular to the stacking direction of the plurality of ceramic green sheets to produce a plurality of laminate blocks, cutting the plurality of laminate blocks along the long side direction perpendicular to the short side direction to produce a plurality of laminate chips 2, and firing the plurality of laminate chips 2.

[0022] FIG. 3 is a flowchart illustrating a method for manufacturing a multilayer ceramic capacitor 1. FIG. 4A is a perspective view showing multiple laminate chips 2. FIG. 4B is a perspective view showing a method for storing multiple laminate chips 2 in recesses 23 of a storage pallet 22. FIG. 4C is a perspective view showing the state in which the laminate chips 2 are stored in the recesses 23 of the storage pallet 22. FIG. 4D is a perspective view showing the storage pallet 22 and the lid 24. FIG. 4E is a cross-sectional view showing minute debris in the recesses 23. FIG. 4F is a cross-sectional view showing the state in which the lid 24 is attached to the storage pallet 22. FIG. 4G is a cross-sectional view showing the state in which the storage pallet 22 and the lid 24 are inverted and a cleaning airflow flows between the storage pallet 22 and the lid 24. FIG. 4H is a cross-sectional view showing the state in which the laminate chip 2 is being rolled in a magnetic field. FIG. 4I is a cross-sectional view showing the laminate chip 2 after displacement within the recesses 23. FIGS. 4A to 4I are shown schematically for ease of illustration.

[0023] In the manufacturing method of the multilayer ceramic capacitor 1 of this embodiment, manufacturing operations for the multilayer ceramic capacitor 1 begin in step S0 of FIG. 3 . In step S1, a storage pallet 22 having a plurality of recesses 23 and a lid 24 facing the first surface 22a of the storage pallet 22, where the recesses 23 are open, are prepared with a gap ΔL (see FIG. 4F ) between them. This gap ΔL may be, for example, 0.4 mm to 0.55 mm for components with external dimensions of 1.0 mm × 0.5 mm × 0.5 mm, or 0.25 mm to 0.4 mm for components with external dimensions of 0.6 mm × 0.3 mm × 0.3 mm. The storage pallet 22 may be integrally molded from, for example, acrylic resin or carbonate, or the plurality of recesses 23 may be formed by cutting a non-magnetic flat plate material such as acrylic resin, carbonate, or a metal plate. The lid 24 may be made of the same material as the storage pallet 22, or may be made by etching or electrical discharge machining a non-magnetic stainless steel plate.

[0024] As shown in Fig. 4B, a plurality of laminate chips 2 shown in Fig. 4A, which have been produced by cutting a laminate block into individual pieces, are supplied from container 25 to recesses 23 of storage pallet 22. In step S2, the plurality of laminate chips 2 supplied from container 25 to storage pallet 22 are accommodated in the spaces of recesses 23 in random orientations, as shown in Fig. 4C. Therefore, although the spaces of the plurality of recesses 23 can individually accommodate a plurality of laminate chips 2 in a short period of time, the orientation of each laminate chip 2 is not constant, but rather they are accommodated in random orientations.

[0025] Next, proceeding to step S3, a lid 24 is attached to the storage pallet 22, in which the laminated chips 2 are accommodated in the spaces within the recesses 23, to cover the openings of the recesses 23, as shown in FIG. 4D. The lid 24 has a flat substrate 26 and a plurality of protrusions 20 provided on a surface 24a of the substrate 26 facing the storage pallet 22. Each of the protrusions 20 is formed as a plurality of ridges that contact one surface 22a of the storage pallet 22 when the lid 24 is attached to the storage pallet 22. The cross section perpendicular to the longitudinal direction of each of the protrusions 20 is not limited to being rectangular. As shown in FIG. 4F, each of the protrusions 20 may have a configuration that extends parallel to the longitudinal direction (second direction Y) of each recess 23, has a base 20a1 with a rectangular cross section, and has a tip 20b that is connected to the tip of the base 20a1 and has a tapered cross section.

[0026] Therefore, when the lid 24 is attached to the storage pallet 22, an air hole 28 extending parallel to the two parallel side surfaces 26a, 26b of the base plate 26 (i.e., in the second direction X) is formed between adjacent tip ends 20b of the multiple protrusions 20. This air hole 28 includes the space between the inner surfaces 22c facing each other across the space in each recess 23, and the space between the storage pallet 22 and the lid 24.

[0027] The height dimension h (see Figure 4D) of each protrusion 20 is equal to the dimension ΔL of the gap between the first surface 22a of the storage pallet 22 and the second surface 24a of the lid body 24 (see Figures 4F and 4G).

[0028] When the lid 24 is not attached to the storage pallet 22, fine debris 29 may enter the space within the recess 23, as shown in FIG. 4E. The fine debris 29 is either cutting debris generated when cutting the laminate precursor, which is made up of stacked green sheets, or abrasion debris generated during vibration transfer. When the fine debris 29 enters the space within the recess 23, some of the fine debris 29 remains in the space within the recess 23, sandwiched between the laminate chip 2 and the inner surface of the recess 23, as shown in FIG. 4F. In this state, the process proceeds to step S5, where the storage pallet 22 and the lid 24 are inverted upside down, as shown in FIG. 4G. This separates the laminate chip 2 from the bottom surface 23 of the recess 23, releasing the sandwiched fine debris 29. In this state, the process proceeds to step S4, where a cleaning airflow is passed between the first surface 22a of the storage pallet 22 and the lid 24, as shown by arrow D1.

[0029] For efficient cleaning, the depth g of the recess 23 may be made as small as possible and ΔL may be made as large as possible, as shown in Figure 4G. The depth g of the recess 23 and the height h of the protrusion 20 may be any dimension that does not interfere with the rotation of the stacked chip 2 when aligned. ΔL may be equal to or less than the smaller of the width and thickness of the stacked chip 2. If ΔL is too large, there is a risk that the stacked chip 2 will be blown away through the air vent 28 when the stacked chip 2 is turned over and cleaning air is introduced.

[0030] The flow direction D1 of the cleaning airflow is parallel to the extension direction of each protrusion 20. The cleaning airflow may also be configured such that clean air at room temperature is sprayed from a nozzle member and supplied between the storage pallet 22 and the lid 24. The cleaning airflow supplied between the storage pallet 22 and the lid 24 may be sucked in from the opposite side to the spraying position.

[0031] 4G, the storage pallet 22 and the lid 24 are turned upside down to separate the stack chips 2 from the bottom surface 23b, thereby releasing the minute debris 29 trapped between the stack chips 2 and the bottom surface 23b and allowing a cleaning airflow to pass through the gap between the stack chips 2 and the bottom surface 23b. This airflow ensures that the minute debris 29 trapped between the stack chips 2 and the bottom surface 23b is discharged from the storage pallet 22 and the lid 24.

[0032] Next, as shown in Fig. 4H, the storage pallet 22 and the lid 24 are turned upside down and returned to their original state, and the set of the lid 24 and the storage pallet 22 is inserted into the magnetic field of the magnet 30, and as shown in Fig. 4I, the orientation of the laminate chip 2 is changed so that the first side surface 9a faces upward, i.e., faces the lid 24. Fig. 4H shows the state in which the laminate 21 has been rotated so that the orientation of the internal electrode 5, which is a ferromagnetic material, is along the magnetization direction of the magnetic field.

[0033] The storage pallet 22 and lid 24 are used for the laminate chip 2 before the protective layer 6 is attached before firing. Since the protective layer 6 is not attached to the laminate chip 2, the internal electrodes 5 are exposed from the side surfaces 9a and 9b. Such a laminate chip 2 is stored in the storage pallet 22, the lid 24 is attached to the storage pallet 22, the chip is turned over, and a cleaning airflow is sprayed onto the laminate chip 2, thereby preventing fine debris from adhering to the laminate chip 2.

[0034] 4H, while the laminate 21 is rotating, it may scrape against the inner wall facing the space within the recess 23, generating minute debris 29. In such a case, in step S6, cleaning airflow may be sprayed or sucked again to clean the minute debris 29. The cleaning method may be the same as in step S4.

[0035] Next, in step S7, the lid 24 is removed from the storage pallet 22 to open each recess 23, and then in step S8, a protective layer 6 is formed on the laminate chip 2 from which the fine debris 29 has been removed, and then the laminate is fired. As described above, external electrodes 3 are formed on the fired laminate 21, and the manufacturing process of the laminate ceramic capacitor 1 is completed in step S7.

[0036] In a second embodiment of the present disclosure, the multiple protrusions 20 may be configured to spray cleaning airflow onto the first surface 22a of the storage pallet 22 alternately in a first flow direction D1 parallel to the first direction X and a second flow direction D2 (second direction Y) perpendicular to the first flow direction D1, as shown in Figures 5 and 6 described below.

[0037] 5 and 6, the protrusions 20 may be protruding protrusions 20a that are supported by contacting with the intersection regions 127 where the recesses 23 are not formed and the intermediate regions 128 between the intersection regions 127 in the second direction Y. The shape of the protrusions 20a may be, for example, a substantially hemispherical shape, a conical shape, a truncated conical shape, or a polygonal truncated pyramid shape.

[0038] By adopting this configuration, when the lid 24 is attached to the storage pallet 22, each of the multiple protrusions 20a is supported in contact with the intersection region 127 and the intermediate region 128, thereby reducing the contact area of ​​the protrusions 20a with the first surface 22a. If the contact area is large, minute debris 29 is likely to become trapped in the contact area. If minute debris 29 becomes trapped in the contact area, the size of the space between the recess 23 and the lid 24 will change, affecting the directional alignment of the stacked chips 2 in the next process and potentially causing a large deviation in the alignment direction. It is desirable that the protrusions 20a have a shape that tapers toward the tip.

[0039] 4G, the storage pallet 22 and the lid 24 with the laminate chips 2 stored therein are inverted upside down to release the fine debris 29 trapped between the laminate chips 2 and the storage pallet 22. However, in another embodiment, as shown in FIG. 4H, the storage pallet 22 and the lid 24 storing the laminate chips 2 are placed in a magnetic field formed by a magnet 30, and the laminate chips 2 are changed in position within the recess 23 by the action of magnetic force so that either the first side surface 9a or the second side surface 9b faces the lid 24. The magnet 30 is, for example, a permanent magnet having magnetic poles at both ends 30a, 30b in the direction of arrow D3. The magnetic field lines of the magnet 30 act on the internal electrodes 5 of the laminate chip 2, and a rotational torque is applied to the laminate chip 2, which is stored in the space of the recess 23 with the internal electrodes 5 facing laterally, about an axis parallel to the first direction X, which is its longitudinal axis, to rotate the laminate chip 2. This allows the laminate chip 2 to be positioned so that the first side surface 9a or the second side surface 9b faces upward, i.e., in a direction facing the lid 24. The laminate chip 2 is changed in position so that the first side surface 9a or the second side surface 9b faces upward because a magnetic force acts on the internal electrodes 5 of the laminate chip 2 in the direction in which the largest magnetic force acts on the internal electrodes 5.

[0040] According to this embodiment, adhesion of minute debris 29 to the laminate chip 2 is prevented, and the laminate chip 2 is not fired with minute debris 29 attached, so that a multilayer ceramic capacitor 1 with low reliability can be obtained.

[0041] FIG. 5 is a perspective view showing a storage pallet 22 and a lid 124 used in a manufacturing method for a multilayer ceramic electronic component according to a second embodiment of the present disclosure. As with the first embodiment, these are used in both or either of steps S4 and S6 of FIG. 3. FIG. 6 is a partial plan view showing the contact position of the lid 124 with the storage pallet 22. FIG. 7A is a cross-sectional view showing the storage pallet 22 and the lid 124 in an inverted state, and FIG. 7B is a cross-sectional view showing the laminate chip 2 displaced within the space of the recess 23. Note that portions corresponding to those in the previous embodiment are designated by the same reference numerals, and redundant description will be omitted. The manufacturing method for a multilayer ceramic electronic component according to this embodiment uses a storage pallet 22 having multiple recesses 23 and a lid 124. The lid 124 has a flat substrate 26 and multiple elliptical cylindrical protrusions 120 provided on a second surface 124a of the substrate 26.

[0042] The multiple recesses 23 are positioned in a matrix on the first surface 22a at intervals in the first direction D1 and the second direction D2 perpendicular to the first direction D1. When the lid 124 is attached to the storage pallet 22, the multiple protrusions 120 are in contact with intersection regions 127 that intersect the first direction D1 and the second direction D2 and intermediate regions 128 between adjacent intersection regions 127 in the area of ​​the first surface 22a where no recesses 23 are formed. As a result, even if the lid 124 is pressed against the storage pallet 22 with a large force, the pressing force acting from the protrusions 120 on the intersection regions 127 and the intermediate regions 128 is distributed to the first partition wall 31 and the second partition wall 32, thereby reducing deformation of the first partition wall 31 and the second partition wall 32.

[0043] Unlike the longitudinal protrusions 20 of the previous embodiment, each protrusion 120 has a convexly curved surface, such as a hemispherical or semi-elliptical protrusion. Only the tip of each protrusion 20 contacts the first surface 22a of the first partition 31 and the second partition 32 that separate the recesses 23 of the storage pallet 22. The storage pallet 22 and the lid 124 containing the stack chips 2 do not necessarily need to be inverted 180° when cleaning the fine debris 29; as long as the stack chips 2 in the recesses 23 move within the recesses 23, they may be tilted, for example, by about 30°. By moving the stack chips 2 within the recesses 23, the fine debris 29 trapped between the stack chips 2 and the inner surface of the recesses 23 can be released and reliably removed.

[0044] The recesses 23 are arranged in a matrix with a width ΔB between them in a first direction D1 parallel to the first surface 22a and a second direction D2 parallel to the first surface 22a and perpendicular to the first direction D1. The protrusions 120 are in contact with each other at an intersection surface where a band-shaped first circumferential surface portion extending parallel to the first direction D1 of the first surface 22a intersects with a band-shaped second circumferential surface portion extending in the second direction D2. This makes it possible to suppress deformation of the first partition wall 31 and the second partition wall 32.

[0045] The multiple protrusions 120 are protrusions having a convexly curved surface. The curved surface may be, for example, a hemispherical surface. The curved surface is not limited to a hemispherical surface, and may be appropriately selected from quadratic curved surfaces such as a semi-ellipsoid. The smaller the contact area between the first surface 22a of the storage pallet 22 and each protrusion 120, the less likely it is that minute debris will get caught in the contact area, changing the spatial size of the recess 23 and affecting the directional alignment of the stacked chip 2 in the next process.

[0046] The direction of the cleaning airflow may be only one direction D1, or may be an airflow from multiple directions, including one direction D1 and other directions at a predetermined angle to one direction D1, or may be an intermittent airflow. By generating turbulence within the recess 23, there are no areas that are not hit by the airflow, making it possible to more efficiently remove the fine debris 29. The combination and conditions are set appropriately according to the dimensions of the recess 23 and the dimensions of the stacked chip 2, etc.

[0047] FIG. 8 is an exploded perspective view showing a storage pallet 22 and a lid 224 used in a third embodiment of the present disclosure, and FIG. 9 is an enlarged cross-sectional view of a portion of the storage pallet 22 and the lid 224 of the third embodiment shown in FIG. 8. Note that portions corresponding to those in the previous embodiment are designated by the same reference numerals. The storage pallet 22 of this embodiment has multiple recesses 23. The lid 224 has a flat base 226 and multiple protrusions 220 protruding from a second surface 224a of the base 226. Each protrusion 220 is formed as a ridge extending in the second direction Y at an interval C1 in the first direction X. In a cross section perpendicular to the longitudinal direction, each protrusion 220 has a rectangular base 220a and a triangular tip 220b connected to the base 220a and tapering toward the tip. The interval C1 between the protrusions 220 in the first direction X may be the same as the intervals B1, B2 between the recesses 23 of the storage pallet 22 in the above-described embodiment.

[0048] The bottom surface 224a1 between the protrusions 220 of the lid 224 is curved convexly toward the flat third surface 224b on which the protrusions 220 of the substrate 226 are not formed. The convexly curved shape may be, for example, an arc shape in a cross section perpendicular to the longitudinal direction.

[0049] By using the storage pallet 22 and lid body 224 of the third embodiment described above, when the lid body 224 is attached to the storage pallet 22 and a cleaning airflow is supplied in the first direction X from between the storage pallet 22 and the lid body 224, the bottom surface 224a1 generates a rotating flow from part of the cleaning airflow in the space within the recess 23 and in the space between the lid body 224 and the storage pallet 22, making it possible to more reliably remove fine debris trapped between each stack chip 2 and the inner surface of the recess 23 and between each stack chip 2 and the lid body 24.

[0050] FIG. 10 is an exploded perspective view showing a storage pallet 22 and a lid 324 used in a fourth embodiment of the present disclosure, and FIG. 11 is an enlarged cross-sectional view of a portion of the storage pallet 22 and the lid 324. Note that portions corresponding to those in the previous embodiments are designated by the same reference numerals. The storage pallet 22 of this embodiment has multiple recesses 23. The lid 324 has multiple tapered protrusions 320 protruding from a second surface 324a of a flat base plate 326. The multiple protrusions 320 are formed by multiple protrusions spaced apart from one another in a grid pattern in the first direction X and the second direction Y. Between adjacent rows of protrusions in the second direction Y, grooves 329 are formed, each having a convexly curved bottom surface 328 on the side opposite to the protruding side of each protrusion, and extending in the second direction Y. The bottom surface 328 of each groove 329 may be formed, for example, by a portion of a cylindrical surface.

[0051] By using the configuration of the fourth embodiment, with the lid 324 attached to the storage pallet 22, a gap corresponding to the height h of each protrusion 320 is formed between the storage pallet 22 and the lid 324, and a cleaning airflow can be supplied through this gap in the first direction D1 and the second direction D2 to remove fine debris 29. Furthermore, because the lid 324 has a recessed groove 329, when the storage pallet 22 and the lid 324 are turned upside down, as shown in Fig. 11, the cleaning airflow in the second direction D2 can easily rotate the stack chips 2 along the bottom surface 328 that forms part of the cylindrical shape that defines the recessed groove 329, thereby releasing and removing fine debris 29 trapped between the stack chips 2 and the lid 324.

[0052] Storage pallet 22 may be composed of recess 23 and a bottom member that serves as the bottom surface, or these may be composed of multiple members. By configuring it with multiple members, the depth of the recess can be adjusted to be appropriate for the height of stacked chip 2, or to be appropriate for processes such as transferring stacked chip 2, air flow cleaning, rotation for directional alignment, and fixing to an adhesive sheet after rotation.

[0053] According to this embodiment, adhesion of minute debris to the stacked chip 2 can be prevented, and a decrease in reliability can be suppressed.

[0054] The present disclosure can be implemented in the following configurations (1) to (7).

[0055] (1) preparing a storage pallet having a first surface with a plurality of recesses opening therein, and a lid for covering the first surface of the storage pallet, the lid having a base and a second surface facing the first surface of the base with a plurality of protrusions; a step of accommodating a stacked chip in each of the plurality of recesses; a step of contacting the plurality of protrusions with the first surface of a storage pallet storing the stacked chips and covering the plurality of recesses with the lid; passing a cleaning airflow through a space between the first surface of the storage pallet and the second surface of the lid; After passing the cleaning airflow, the laminate chips are removed from the recesses of the storage pallet and fired to produce a plurality of laminates; and forming external electrodes on each of the plurality of laminates.

[0056] (2) The method for producing a multilayer ceramic electronic component according to the above configuration (1), wherein the storage pallet is inverted with the lid attached when the cleaning airflow is passed through.

[0057] (3) the plurality of recesses are arranged in a matrix on the first surface at intervals in a first direction and a second direction perpendicular to the first direction; The method for manufacturing a multilayer ceramic electronic component according to the above configuration (1) or (2), wherein, when the lid body is attached to the storage pallet, the plurality of protrusions are in contact with regions of the first surface where no recesses are formed, which intersect the first direction and the second direction and are not adjacent to any recesses.

[0058] (4) A method for manufacturing a multilayer ceramic electronic component according to the above configuration (3), wherein the cleaning airflow includes a first airflow passing through the space between the first surface of the storage pallet and the second surface of the lid in the first direction, and a second airflow passing through the space between the first surface of the storage pallet and the second surface of the lid in the second direction.

[0059] (5) The method for producing a multilayer ceramic electronic component according to the above configuration (1) or (2), wherein the tip of each of the plurality of protrusions is substantially hemispherical.

[0060] (6) The method for manufacturing a multilayer ceramic electronic component according to the above configuration (1) or (2), wherein the lid body has a recessed groove between each pair of adjacent protrusions among the plurality of protrusions, the recessed groove having a bottom surface that is convexly curved on the side opposite to the side from which the plurality of protrusions protrude.

[0061] (7) The method for manufacturing a multilayer ceramic electronic component according to the above configuration (1) or (2), wherein the plurality of protrusions are configured by a plurality of protrusions that protrude tapered from the second surface and are spaced apart from one another in a lattice pattern.

[0062] Although the embodiments of the present disclosure have been described in detail above, the present disclosure is not limited to the above-described embodiments, and various modifications and improvements are possible within the scope of the gist of the present disclosure. It goes without saying that all or part of the components constituting each of the above-described embodiments can be combined as appropriate within the scope of not contradicting each other. [Explanation of symbols]

[0063] 1. Multilayer ceramic capacitors 2. Stacked chip 3 External electrode 3a 1st external electrode 3b 2nd external electrode 4 Dielectric Layer 5 Internal electrode 6 Protective layer 7a 1st principal surface 7b Second main surface 8a 1st end face 8b 2nd end face 9a 1st side 9b Second side 20,20a,120,220,320 Protrusion 21 Laminate 22 Storage Pallet 22a 1st surface 23 Recess 24,124,224,324 Lid 24a,124a,224a,324a 2nd surface 24b Bottom 25 Container 26,226,326 boards 28 Ventilation holes 29 Microscopic debris 30 Magnet 31 1st bulkhead 32 Second bulkhead 127 Intersection Area 128 Intermediate area 329 Groove

Claims

1. A step of preparing a storage pallet having a first surface with a plurality of recesses opening therein, and a lid for covering the first surface of the storage pallet, the lid having a base and a second surface facing the first surface of the base with a plurality of protrusions; a step of accommodating a stacked chip in each of the plurality of recesses; a step of contacting the plurality of protrusions with the first surface of a storage pallet storing the stacked chips and covering the plurality of recesses with the lid; passing a cleaning airflow through a space between the first surface of the storage pallet and the second surface of the lid; After passing the cleaning airflow, the laminate chips are removed from the recesses of the storage pallet and fired to produce a plurality of laminates; and forming external electrodes on each of the plurality of laminates.

2. 2. The method for producing a multilayer ceramic electronic component according to claim 1, wherein the storage pallet is inverted with the lid attached when the cleaning airflow is passed through.

3. the plurality of recesses are arranged in a matrix on the first surface at intervals in a first direction and a second direction perpendicular to the first direction; 3. The method for manufacturing a multilayer ceramic electronic component according to claim 1, wherein, when the lid body is attached to the storage pallet, the plurality of protrusions are in contact with regions of the first surface that do not have recesses, the regions intersecting the first direction and the second direction and not adjacent to the recesses.

4. 4. The method for manufacturing a multilayer ceramic electronic component according to claim 3, wherein the cleaning airflow includes a first airflow that passes through a space between the first surface of the storage pallet and the second surface of the lid in the first direction, and a second airflow that passes through a space between the first surface of the storage pallet and the second surface of the lid in the second direction.

5. 3. The method for manufacturing a multilayer ceramic electronic component according to claim 1, wherein the tip of each of the plurality of protrusions is substantially hemispherical.

6. 3. The method for manufacturing a multilayer ceramic electronic component according to claim 1, wherein the lid body has, between each pair of adjacent protrusions among the plurality of protrusions, a recessed groove having a bottom surface that is convexly curved on a side opposite to the side from which the plurality of protrusions protrude.

7. 3. The method for manufacturing a multilayer ceramic electronic component according to claim 1, wherein the plurality of protrusions are configured by a plurality of protrusions that protrude from the second surface in a tapered shape and are spaced apart from one another in a lattice pattern.

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