Component mounting device, and component mounting system

Abstract

To provide a component mounting device capable of mounting a component onto the substrate with downward curvature with high quality.SOLUTION: A disclosed component mounting device includes: a shaft that is movable in a vertical direction; a nozzle that is included in the shaft for holding the component; a lifting unit that moves by applying a current or voltage to raise and lower the shaft; and a control unit that controls the shaft. The control unit controls the shaft to raise and lower based on a predetermined motion pattern to lower the same until the height of the bottom surface of the component held by the nozzle reaches the first limit setting height, obtains the physical quantity that changes in relation to the load on the shaft, determine whether the physical quantity is greater than or equal to a threshold value, and when the height of the bottom surface of the component held by the nozzle reaches the first limit setting height and the physical quantity is not greater than the threshold, lower the shaft so that the height of the bottom surface of the component held by the nozzle positions lower than the first limit setting height.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present disclosure relates to a component mounting device and a component mounting system that mounts a component at a mounting position. [Background technology]

[0002] For example, Patent Document 1 discloses an electronic component mounting device that can mount electronic components without applying impact force to the electronic components even when the board is warped. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2007-266334 Summary of the Invention [Problem to be solved by the invention]

[0004] However, the device described in Patent Document 1 still has room for improvement in terms of mounting components on a board with high quality when the board has a downward warp that is convex downward.

[0005] In view of the above-mentioned problems, the present disclosure provides a component mounting device and a component mounting system that can mount components with high quality on a board that has a downward bow. [Means for solving the problem]

[0006] The component mounting device according to the present disclosure comprises: A shaft that is movable in the up and down direction; a nozzle provided on the shaft and for holding a part; an elevating unit that is driven by application of a current or a voltage and moves the shaft up and down; a control unit that controls the lifting unit; Equipped with The control unit raising and lowering the shaft based on a predetermined operation pattern that lowers the shaft until the height of the lower surface of the part held by the nozzle reaches a first limit setting height; Acquire a physical quantity that changes in relation to a load applied to the shaft; determining whether the physical quantity is equal to or greater than a threshold value; When the height of the lower surface of the part held by the nozzle reaches the first limit setting height and the physical quantity is not greater than or equal to the threshold value, the shaft is lowered so that the height of the lower surface of the part held by the nozzle is positioned below the first limit setting height.

[0007] The component mounting system according to the present disclosure comprises: A shaft that is movable in the up and down direction; a nozzle provided on the shaft for holding a part; an elevating unit that is driven by application of a current or a voltage and moves the shaft up and down; a control unit that controls the lifting unit; Equipped with The control unit raising and lowering the shaft based on a predetermined operation pattern that lowers the shaft until the height of the lower surface of the part held by the nozzle reaches a first limit setting height; Acquire a physical quantity that changes in relation to a load applied to the shaft; determining whether the physical quantity is equal to or greater than a threshold value; When the height of the lower surface of the part held by the nozzle reaches the first limit setting height and the physical quantity is not greater than or equal to the threshold value, the shaft is lowered so that the height of the lower surface of the part held by the nozzle is positioned below the first limit setting height. [Effects of the Invention]

[0008] According to the present disclosure, it is possible to provide a component mounting device and a component mounting system that can mount components with high quality on a board that has bowed downward. [Brief explanation of the drawings]

[0009] [Figure 1] 1 is a schematic plan view of an example of a component mounting device according to a first embodiment of the present disclosure; [Figure 2] FIG. 1 is a schematic block diagram showing a main configuration of a component mounting device according to a first embodiment of the present disclosure. [Figure 3] FIG. 1 is a schematic diagram illustrating an internal configuration of a lifting head of a component mounting device according to a first embodiment of the present disclosure. [Figure 4] 1 is a flow diagram of component mounting by the component mounting device according to the first embodiment of the present disclosure; [Figure 5] FIG. 10 is a graph showing the trajectory of the nozzle and the change in the current value for driving the lifting unit when the component mounting device according to the first embodiment of the present disclosure lifts and lowers the shaft in a predetermined operation pattern on a board that is not warped. [Figure 6] FIG. 10 is a graph showing the trajectory of the nozzle and the change in the current value for driving the lifting unit when the component mounting device according to the first embodiment of the present disclosure lifts and lowers the shaft relative to a board that has undergone downward warping. [Figure 7] FIG. 10 is a graph showing the trajectory of the nozzle and the change in the current value for driving the lifting unit when the component mounting device according to the first embodiment of the present disclosure lifts and lowers the shaft relative to a board located at a height lower than the second limit setting height. [Figure 8] FIG. 10 is a schematic block diagram showing a main configuration of a component mounting system according to a second embodiment of the present disclosure. [Figure 9] 1 is a schematic block diagram showing the main configuration of a component mounting device according to a first modification; [Figure 10] FIG. 10 is a graph showing the trajectory of the nozzle and the change in the load acting on the shaft when the component mounting device of the first modification moves the shaft up and down in a predetermined operation pattern on a board that is not warped. [Figure 11] FIG. 10 is a graph showing the trajectory of the nozzle and the change in the load acting on the shaft when the component mounting device of the first modification moves the shaft up and down relative to a board that has undergone downward warping. [Figure 12]10 is a schematic block diagram showing the main configuration of a component mounting device according to a second modification; DETAILED DESCRIPTION OF THE INVENTION

[0010] (Background to this disclosure) The electronic component placement device described in Patent Document 1 has a structure in which a nozzle tip for suctioning and placing electronic components is integrated with a compression spring provided at the axial center and the tip of a plunger that presses the compression spring provided at the axial center. In the device described in Patent Document 1, when a board is warped, the nozzle stroke amount is determined based on the minimum height at which the board is most downwardly convex, and electronic components are placed. Furthermore, when the actual height at which the electronic component is mounted is higher than the minimum height, the compression spring elastically deforms to absorb the force and reduce the impact on the electronic component.

[0011] However, with the device described in Patent Document 1, if the board has a downward convex bow, it may not be possible to efficiently mount components on the board. For example, if the board has a relatively large downward bow, even if the nozzle is raised and lowered based on the nozzle stroke amount determined based on the minimum height at which the board is most convex downward, the nozzle may not be pressed sufficiently into the board, making it impossible to mount components.

[0012] Therefore, the present inventors have studied a component mounting device and a component mounting system that can mount components with high quality on a board that has bowed downward, and have arrived at the present disclosure.

[0013] Hereinafter, a first embodiment according to the present disclosure will be described with reference to the accompanying drawings. In each drawing, elements are exaggerated for ease of explanation. (Embodiment 1)

[0014] Fig. 1 is a schematic plan view of an example of a component mounting device 1A according to a first embodiment of the present disclosure. In Fig. 1 and in some parts described below, two axes perpendicular to each other in a horizontal plane are shown: an X axis in the substrate transport direction (left-right direction in Fig. 1) and a Y axis perpendicular to the substrate transport direction (up-down direction in Fig. 1). Also, a Z axis is shown as an axis perpendicular to the horizontal plane. Fig. 2 is a schematic block diagram showing the main configuration of the component mounting device 1A according to the first embodiment of the present disclosure.

[0015] As shown in Figures 1 and 2, the component mounting device 1A includes a base 2, a substrate conveying mechanism 3, a component supply unit 4, a head moving mechanism 7, a head unit 10, a head camera 15, a component recognition camera 16, and a control unit C1.

[0016] The base 2 is a member that supports the components of the component mounting device 1 A. For example, the base 2 supports the component supply unit 4, the head moving mechanism 7, and the head unit 10.

[0017] The substrate transport mechanism 3 transports the substrate 80. For example, the substrate transport mechanism 3 transports the substrate 80 transported from upstream to the mounting position, positions it, and holds it. The substrate transport mechanism 3 also transports the substrate 80 downstream after the component mounting operation has been completed. The substrate transport mechanism 3 is disposed in the center of the base 2 along the X-axis.

[0018] The component supply unit 4 is a device that supplies components to a component supply position.

[0019] The component mounting device 1A is provided with two component supply units 4. The two component supply units 4 are arranged on both sides (front and back of the Y axis) of the position on the board 80 where components are to be mounted.

[0020] The component supply unit 4 includes a plurality of tape feeders 6. The plurality of tape feeders are arranged along the X axis. The tape feeders 6 feed components from outside the component supply unit 4 to a component supply position.

[0021] The head moving mechanism 7 can move the components of the component mounting device 1A on the XY plane. For example, the head moving mechanism 7 can move the head unit 10 and the head camera 15 on the XY plane.

[0022] The head moving mechanism 7 includes a Y-axis table 8 and a beam 9 .

[0023] The head moving mechanism 7 includes two Y-axis tables 8. The two Y-axis tables 8 are arranged on the upper surface of the base 2 at both ends extending along the Y-axis.

[0024] The beam 9 is connected along the X axis to two Y-axis tables 8. The beam 9 can move in the Y direction by moving along the Y-axis tables 8.

[0025] When the component fed by the tape feeder 6 reaches the component supply position, the head unit 10 picks up the component.

[0026] The head unit 10 is attached to the beam 9 and is movable in the XY plane. The head unit 10 includes a plurality of lifting heads 11. The lifting heads 11 pick up components and mount them at the component mounting positions. For example, the lifting heads 11 pick up components that have reached the component supply position and mount the components on the substrate 80. The structure of the lifting heads 11 will be described in detail below.

[0027] Head camera 15 recognizes the position of a board mark (not shown) provided on board 80. More specifically, head camera 15, together with head unit 10, moves above board 80 positioned at the component mounting work position and recognizes the position of the board mark.

[0028] The head camera 15 is disposed on the lower side of the beam 9 and moves integrally with the head unit 10.

[0029] The component recognition camera 16 captures an image of a component held by the head unit 10. Specifically, when the head unit 10 holding a component taken out from the component supply unit 4 passes above the component recognition camera 16, the component recognition camera 16 captures an image of the component from below.

[0030] The component recognition camera 16 is disposed between the board transport mechanism 3 and the component supply unit 4.

[0031] Taking into consideration the results of recognition of the board 80 by the head camera 15 and the results of recognition of the components by the component recognition camera 16, the mounting positions of the components on the board 80 are corrected.

[0032] The control unit C1 controls each unit included in the component mounting device 1A. The control unit C1 includes a general-purpose processor such as a CPU or MPU that executes a program to realize a predetermined function. The control unit C1 is not limited to a unit that realizes a predetermined function through the cooperation of hardware and software, but may also be a hardware circuit designed specifically to realize a predetermined function. For example, the control unit C1 may include a memory, and realize a function by executing a program stored in the memory with a processor.

[0033] (Lifting head configuration) The configuration of the lifting head 11 will now be described in more detail.

[0034] FIG. 3 is a schematic diagram showing the internal configuration of the lifting head 11 of the component mounting device 1A according to the first embodiment of the present disclosure.

[0035] As shown in FIG. 3, the lifting head 11 includes a shaft 23, a nozzle 30, and a lifting unit 40.

[0036] The shaft 23 is movable in the vertical direction (Z-axis direction). The shaft 23 is a rod-shaped member. The shaft 23 is a rod-shaped member, and at least a portion of the shaft 23 includes a magnet. At least a portion of the shaft 23 is formed into a rod shape by fixing a plurality of cylindrical permanent magnets, each having a magnetic pole formed at both axial ends, coaxially arranged so that like poles face each other. Each of the plurality of magnets included in at least a portion of the shaft 23 is a hollow cylindrical permanent magnet of relatively equal length, and each end of the axial end is magnetized as an S pole and an N pole. The permanent magnets are stacked concentrically in the axial direction and fixed to at least a portion of the shaft 23 so that the S pole and N pole face each other in the axial direction.

[0037] The nozzle 30 is provided on the shaft 23 and holds the component 85. For example, the nozzle 30 is installed at the lower end of the shaft 23 and sucks and holds the component 85. For example, the nozzle 30 sucks the component 85 at the component supply position, and as the shaft 23 descends relative to the substrate 80, the nozzle 30 presses the component 85 against the substrate 80.

[0038] A contact member 31 that contacts the upper surface of component 85 is provided at the tip of nozzle 30. A suction opening 32 of nozzle 30 opens on the lower surface of contact member 31. When a vacuum source (not shown) connected to suction opening 32 is activated while contact member 31 is in contact with the upper surface of component 85, component 85 is sucked onto contact member 31.

[0039] The lifting unit 40 moves the shaft 23 in the vertical Z-axis direction. For example, the lifting unit 40 has a mechanism that is driven by application of current or voltage. For example, the lifting unit 40 is an actuator. The lifting unit 40 is controlled by a control unit C1. The control unit C1 controls the driving of the lifting unit 40 by applying a current to the lifting unit 40.

[0040] The lifting unit 40 includes a housing 20 and a coil 45 .

[0041] The housing 20 houses the coil 45. For example, the housing 20 is made of a magnetic material. For example, the housing 20 is made of iron.

[0042] Coil 45 is arranged to surround at least a portion of shaft 23. Coil 45 is configured by winding a coil wire to define an internal space. At least a portion of shaft 23 is arranged in the internal space of coil 45. For example, at least a portion of shaft 23 including a magnet is arranged in the internal space of coil 45. When a current flows through coil 45, a magnetic field is generated inside coil 45. When a magnetic field is generated inside coil 45, a repulsive force acts between coil 45 and the north pole or south pole of shaft 23, causing shaft 23 to move in the Z-axis direction. The movement direction of shaft 23 in the Z-axis direction can be controlled by the direction of the current flowing through coil 45.

[0043] For example, the lifting unit 40 may be equipped with an encoder. For example, the encoder may be a linear encoder that can detect linear distance. For example, the lifting unit 40 is equipped with an encoder to detect the position and / or amount of movement of the shaft 23. The lifting position and / or amount of movement of the shaft 23 obtained by the encoder may be output to the control unit C1.

[0044] In this embodiment, the lifting unit 40 has a mechanism that is driven by application of a current, but this is not limiting. For example, the lifting unit 40 may have a mechanism that is driven by application of a voltage.

[0045] (Regarding the control section) The configuration of the control unit C1 will now be described in more detail.

[0046] 2, the control unit C1 is electrically connected to the board transport mechanism 3, the component supply unit 4, the lifting head 11, the head camera 15, and the component recognition camera 16. The control unit C1 controls these components.

[0047] In controlling the component mounting operation, the control unit C1 raises and lowers the shaft 23 based on a predetermined operation pattern L1 that lowers the shaft 23 until the height of the lower surface of the component 85 held by the nozzle 30 reaches a first limit setting height HL1. The control unit C1 acquires a physical quantity that changes in relation to the load on the shaft 23 and determines whether the physical quantity is equal to or greater than a threshold value I1. When the height of the lower surface of the component 85 held by the nozzle 30 reaches the first limit setting height HL1 and the physical quantity is not equal to or greater than the threshold value I1, the control unit C1 lowers the shaft 23 so that the height of the lower surface of the component 85 held by the nozzle 30 is positioned below the first limit setting height HL1.

[0048] Specifically, the control unit C1 includes a component mounting processing unit 60, a physical quantity appropriateness determining unit 62A, a lift control unit 66, and a storage unit .

[0049] In mounting components, component mounting processing unit 60 controls the operations of board transport mechanism 3, component supply unit 4, head camera 15, and component recognition camera 16 to align components 85 with board 80. For example, component mounting processing unit 60 controls shaft 23 to align the position and orientation of component 85 with the mounting position on the surface of board 80, and mounts component 85 at the mounting position on board 80.

[0050] The physical quantity adequacy determination unit 62A determines whether or not a physical quantity that changes in relation to the load on the shaft 23 is equal to or greater than a physical quantity threshold value I1 stored in the storage unit 70. In this embodiment, the physical quantity is a current value I that drives the lifting unit 40. For example, the physical quantity adequacy determination unit 62A obtains information on the current value I of the current that flows through the coil 45 of the lifting unit 40 from the lifting control unit 66. The physical quantity adequacy determination unit 62A determines whether or not the current value I is equal to or greater than the threshold value I1 during component mounting.

[0051] The lift control unit 66 controls the driving of the lift unit 40. In this embodiment, the lift control unit 66 controls the current applied to the coil 45 of the lift unit 40. The lift control unit 66 regulates the current value of the current applied to the coil 45 depending on the position of the shaft 23. For example, the lift control unit 66 applies a current flowing in a first direction (positive direction) to the coil 45 to lower the shaft 23. The lift control unit 66 also applies a current flowing in a second direction (negative direction) opposite to the first direction to the coil 45 to raise the shaft 23. The lift control unit 66 also adjusts the direction and / or value of the current applied to the coil 45 to adjust the lift speed of the shaft 23. The lift control unit 66 also adjusts the current value applied to the coil 45 based on the determination result of the physical quantity appropriateness determination unit 62A.

[0052] The storage unit 70 is a recording medium for recording various information. The storage unit 70 is realized, for example, by a flash memory, a solid-state device (SSD), a hard disk, or other storage device, or by an appropriate combination thereof. For example, the storage unit 70 stores a production program 71, an operation pattern L1, a physical quantity threshold I1, a first limit setting height HL1, a second limit setting height HL2, and push-in times TP1 and TP2. The storage unit 70 also stores information on the type, mounting position, mounting order, and load capacity of the component 85, as well as the type, thickness, and size of the board 80.

[0053] Operation pattern L1 refers to a predetermined movement of shaft 23 during component mounting. In operation pattern L1, control unit C1 lowers shaft 23 until the height of the bottom surface of component 85 held by nozzle 30 reaches a predetermined height (first limit setting height HL1) for component mounting. When the height of the bottom surface of component 85 held by nozzle 30 reaches first limit setting height HL1, control unit C1 presses component 85 into board 80 at a predetermined component mounting position for a predetermined pressing time TP1, thereby completing component mounting. After component mounting, control unit C1 raises shaft 23.

[0054] The physical quantity threshold I1 is the magnitude of the physical quantity at which the component 85 can be placed on the substrate 80. For example, the threshold I1 is determined to be the magnitude of the physical quantity at which the component 85 can be placed on the substrate 80 with good quality. For example, the threshold I1 is the magnitude of the physical quantity at which the component 85 can be placed with good quality while being pressed into the substrate 80. In this embodiment, the threshold I1 is the threshold value of the current value I that drives the lifting unit 40. For example, the threshold I1 is the magnitude of the current value I that lowers the shaft 23 until the height of the bottom surface of the component 85 held by the nozzle 30 reaches a height at which the component 85 can be placed with good quality while being pressed into the substrate 80.

[0055] In addition, when the lifting unit 40 is configured to be driven by voltage, the physical quantity related to the load on the shaft 23 may be the voltage value that drives the lifting unit 40, and the threshold value I1 may be the voltage value.

[0056] The first limit setting height HL1 is a predetermined height of the bottom surface of the component 85 held by the nozzle 30 when component mounting is performed based on the operation pattern L1. The first limit setting height HL1 may be the lowest height of the bottom surface of the component 85 held by the nozzle 30 during operation pattern L1. For example, the first limit setting height HL1 is lower than the height of the top surface of the unwarped substrate 80 and higher than the height of the bottom surface of the substrate 80. The first limit setting height HL1 may be a height that is lower than the height H1 of the top surface of the substrate 80 by a predetermined distance D1. For example, the predetermined distance D1 is 0.20 mm or more and 0.40 mm or less. Preferably, the predetermined distance D1 is 0.25 mm or more and 0.35 mm or less. More preferably, the predetermined distance D1 may be 0.29 mm or more and 0.31 mm or less.

[0057] The second limit setting height HL2 is the lowest height to which the shaft 23 can descend when the shaft 23 moves up and down without following the operation pattern L1, and is the lowest height to which the shaft 23 can descend the underside of the component 85 held by the nozzle 30. That is, the second limit setting height HL2 is the limit value for the height to which the shaft 23 can descend when the shaft 23 is lowered so that the height of the underside of the component 85 held by the nozzle 30 is lower than the first limit setting height HL1. The second limit setting height HL2 is lower than the first limit setting height HL1. For example, the second limit setting height HL2 is lower than the minimum height, which is the height of the lowest part of the top surface of the board 80 on which the component 85 is mounted. For example, the second limit setting height HL2 is lower than the height of the top surface of the most downwardly convex part of the board 80 that has a downward bow. When the height of the underside of the part 85 held by the nozzle 30 reaches a first limit setting height HL1 and the physical quantity that changes in relation to the load on the shaft 23 is not greater than a threshold value I1, the control unit C1 controls the shaft 23 to be able to descend until the height of the underside of the part 85 held by the nozzle 30 is positioned at a second limit setting height HL2.

[0058] The second limit setting height HL2 may be higher than the minimum height of the upper surface of the substrate 80. For example, the lowering of the shaft 23 may be limited by a mechanical restriction. Therefore, the minimum height of the upper surface of the substrate 80 may be lower than the height of the lower surface of the component 85 held by the nozzle 30 when the lowering of the shaft 23 is limited by the mechanical restriction. In this case, the second limit setting height HL2 may be set to the height of the lower surface of the component 85 held by the nozzle 30 when the lowering of the shaft 23 is limited. Furthermore, for example, the second limit setting height HL2 may be determined from information about the substrate 80 stored in the memory unit 70 of the control unit C1.

[0059] The pushing time TP1 is the time during which the shaft 23 is raised and lowered based on a predetermined operation pattern L1, and the descent of the shaft 23 is stopped when a physical quantity that changes in relation to the load on the shaft 23 becomes equal to or greater than a threshold value I1. For example, when the current value I that drives the lifting unit 40 becomes equal to or greater than the threshold value I1, the pushing time TP1 is the time during which the descent of the shaft 23 is stopped and the shaft 23 is maintained at the height at which it stopped. During the pushing time TP1, the control unit C1 regulates the current value I.

[0060] The pushing time TP2 is the time during which the lowering of the shaft 23 is stopped when the height of the bottom surface of the component 85 held by the nozzle 30 is lower than the first limit setting height HL1 and the physical quantity that changes in response to the load on the shaft 23 is equal to or greater than the threshold value I1. During the pushing time TP2, the control unit C1 regulates the current value I that drives the lifting unit 40.

[0061] For example, the pressing time TP2 may be different from the pressing time TP1. For example, the pressing time TP2 may be equal to or shorter than the pressing time TP1. For example, the pressing time TP2 may be determined based on the amount of descent of the shaft 23 from the first limit setting height HL1 to the height of the lower surface of the component 85 held by the nozzle 30. For example, the pressing time TP2 may be determined based on information about the substrate 80 or the component 85 stored in the memory unit 70.

[0062] The pressing time TP2 may be equal to the pressing time TP1.

[0063] An example of the operation of the component mounting device 1A will be described.

[0064] FIG. 4 is a flow diagram of component mounting by the component mounting device 1A according to the first embodiment of the present disclosure.

[0065] As shown in FIG. 4, the component mounting operation includes a component holding step (S11), a first component lowering step (S12, S13), a first height determination step (S14), a second component lowering step (S15), a physical quantity determination step (S16), a third component lowering step (S17), a second height determination step (S18), a component pressing step (S19), and a component release step (S20).

[0066] First, in the component holding step, the control unit C1 holds the component 85 using the lifting head 11 (S11). For example, the control unit C1 moves the lifting head 11 to above the component supply unit 4, and causes the nozzle 30 to suck and hold the upper surface of the component 85 at the component supply position.

[0067] Subsequently, in the first component lowering step, the control unit C1 aligns the substrate 80 with the component 85 based on the production program 71 (S12).

[0068] Next, the shaft 23 starts to be lowered (S13). The control unit C1 lowers the shaft 23 based on a predetermined operation pattern L1 that lowers the shaft 23 until the height of the lower surface of the component 85 held by the nozzle 30 reaches the first limit setting height HL1.

[0069] Next, in a height determination step, the control unit C1 determines whether the height of the bottom surface of the component 85 held by the nozzle 30 has reached a first limit setting height HL1 (S14). For example, the control unit C1 obtains the height of the bottom surface of the component 85 held by the nozzle 30 using the encoder of the lifting unit 40. The control unit C1 also reads the first limit setting height HL1 from the storage unit 70 and compares the height of the bottom surface of the component 85 held by the nozzle 30 with the first limit setting height HL1. For example, the control unit C1 calculates the difference between the height of the bottom surface of the component 85 held by the nozzle 30 and the first limit setting height HL1, and determines whether the difference is zero.

[0070] In step S14, if the control unit C1 determines that the height of the lower surface of the component 85 held by the nozzle 30 has not reached the first limit setting height HL1 (if the determination is No), the process proceeds to step S15. In step S14, if the control unit C1 determines that the height of the lower surface of the component 85 held by the nozzle 30 has reached the first limit setting height HL1 (if the determination is Yes), the component mounting operation proceeds to step S16.

[0071] If the determination result in step S14 is No, in the second component lowering step, the control unit C1 further lowers the shaft 23 (S15). Subsequently, the control unit C1 returns the component mounting operation to step S16. The component mounting operation repeats steps S14 and S15 until the control unit C1 determines that the height of the bottom surface of the component 85 held by the nozzle 30 has reached the first limit setting height HL1.

[0072] Next, in a physical quantity determination step, the control unit C1 acquires a physical quantity that changes in relation to the load on the shaft 23, and determines whether the physical quantity is equal to or greater than a threshold value I1 (S16). In this embodiment, the physical quantity is the current value I of the current that drives the lifting unit 40, so the control unit C1 acquires the current value I from the lifting control unit 66 that suppresses the lifting unit 40, and determines whether the current value I is equal to or greater than the threshold value I1.

[0073] In step S16, if the control unit C1 determines that the physical quantity is not equal to or greater than the threshold value I1 (if the determination is No), the component mounting operation proceeds to step S17. In step S16, if the control unit C1 determines that the physical quantity is equal to or greater than the threshold value I1 (if the determination is Yes), the component mounting operation proceeds to step S19, which indicates a component pressing step.

[0074] If the determination result in step S16 is No, in the third component lowering step, the control unit C1 further lowers the shaft 23 (S17).

[0075] Next, in a second height determination step, the control unit C1 determines whether the height of the lower surface of the component 85 held by the nozzle 30 is located at a second limit setting height HL2 (S18). For example, the control unit C1 obtains the height of the lower surface of the component 85 held by the nozzle 30 using the encoder of the lifting unit 40. The control unit C1 also reads the second limit setting height HL2 from the memory unit 70 and compares the height of the lower surface of the component 85 held by the nozzle 30 with the second limit setting height HL2. For example, the control unit C1 calculates the difference between the height of the lower surface of the component 85 held by the nozzle 30 and the second limit setting height HL2, and determines whether the difference is zero.

[0076] In step S18, if the control unit C1 determines that the height of the lower surface of the component 85 held by the nozzle 30 is not at the second limit setting height HL2 (if the determination is No), the component mounting operation continues to lower the shaft 23, and the process returns to step S16. In step S17, if the control unit C1 determines that the height of the lower surface of the component 85 held by the nozzle 30 is at the second limit setting height HL2 (if the determination is Yes), the control unit C1 outputs an ERROR. For example, the control unit C1 may output the ERROR as a signal to an external device.

[0077] In the component pressing step, the control unit C1 stops the descent of the shaft 23 during the pressing times TP1 and TP2 (S19). For example, when the height of the bottom surface of the component 85 held by the nozzle 30 reaches the first limit setting height HL1 and a physical quantity that changes in response to the load on the shaft 23 is equal to or greater than the threshold value I1, the control unit C1 stops the descent of the shaft 23 during the pressing time TP1. The control unit C1 also maintains the shaft 23 at the position it was in when the physical quantity reached the threshold value I1. The control unit C1 stops the descent of the shaft 23 during the pressing time TP2 and regulates the current value I that drives the lifting unit 40. For example, the control unit C1 maintains the current value I at the threshold value I1.

[0078] Subsequently, in the component release step, the control unit C1 raises the shaft 23 (S20).

[0079] Next, an example of the operation of shaft 23 when the determination result in step S14 is Yes will be described with reference to Fig. 5. For example, the determination result in step S16 is Yes when component mounting device 1A mounts component 85 on board 80 that is not warped or has a relatively small warp.

[0080] FIG. 5 is a graph showing the trajectory of the nozzle 30 and the change in the current value I that drives the lifting unit 40 when the component mounting device 1A of the first embodiment of the present disclosure raises and lowers the shaft 23 in a predetermined operation pattern L1 on a substrate 80 that is not warped.

[0081] As shown in FIGS. 5(A) and 5(B), the shaft 23 operates according to the operation pattern L1 stored in the storage unit 70.

[0082] In the first component lowering step (S13), the control unit C1 controls the current applied to the lifting unit 40 to lower the shaft 23 based on the operation pattern L1. The control unit C1 applies a current in a first direction (positive direction) to the coil 45 of the lifting unit 40. When the shaft 23 has lowered until the height of the lower surface of the component 85 held by the nozzle 30 reaches a predetermined height (H0) (T1), the control unit C1 controls the lowering speed of the shaft 23 to slow down. Specifically, the control unit C1 reduces the current value I of the current applied to the lifting unit 40 to slow down the lowering speed of the shaft 23. The control unit C1 also applies a current to the coil 45 in a second direction (negative direction) opposite to the first direction, and increases the current value I of the current flowing in the second direction.

[0083] When the bottom surface of component 85 held by nozzle 30 comes into contact with substrate 80 (T2), an upward reaction force is generated on shaft 23. Control unit C1 controls lift unit 40 to further lower shaft 23 in order to press component 85 onto substrate 80. For example, control unit C1 applies a current in a first direction (positive direction) to coil 45 of lift unit 40, thereby increasing the current value I of the current flowing in the first direction.

[0084] When the height of the bottom surface of the component 85 held by the nozzle 30 reaches the first limit setting height HL1 (T3) and the current value I is equal to or greater than the threshold value I1, the control unit C1 stops the shaft 23 for a push-in time TP1 (S19). The push-in time TP1 is a predetermined time in the operation pattern L1 from when the current value I becomes equal to or greater than the threshold value I1 (T3). For example, while the shaft 23 is stopped, the control unit C1 regulates the current value I of the current applied to the lifting unit 40. For example, while the shaft 23 is stopped, the control unit C1 maintains the current value I at the threshold value I1.

[0085] After the pushing time TP1 has elapsed (T4), the control unit C1 raises the shaft 23 (S20). For example, the control unit C1 applies a current in the second direction (negative direction) to the coil 45 of the lifting unit 40, and increases the current value I of the current flowing in the second direction.

[0086] Next, an example of the operation of shaft 23 when the determination result in step S16 is No will be described with reference to Fig. 6. For example, the determination result in step S16 is No when component mounting device 1A mounts component 85 on board 80 that has a downward warp.

[0087] FIG. 6 is a graph showing the trajectory of the nozzle 30 and the change in the current value I that drives the lifting unit 40 when the component mounting device 1A of the first embodiment of the present disclosure raises and lowers the shaft 23 relative to the substrate 80 that has a downward warp.

[0088] As shown in FIGS. 6(A) and 6(B), the shaft 23 operates according to the operation pattern L1 stored in the storage unit 70.

[0089] When the height of the lower surface of the part 85 held by the nozzle 30 reaches the first limit setting height HL1 (T3), if the current value I is not greater than or equal to the threshold value I1, the control unit C1 controls the raising and lowering of the shaft 23 without following the operation pattern L1.

[0090] The first limit setting height HL1 is the minimum height in the predetermined operation pattern L1. At the first limit setting height HL1, the current value I of the current applied to the coil 45 of the lifting / lowering unit 40 is approximately 0 A. When the height of the lower surface of the component 85 held by the nozzle 30 reaches the first limit setting height HL1 (T3) and the current value I has not reached or exceeded the threshold value I1, the control unit C1 lowers the shaft 23 so that the lower surface of the component 85 held by the nozzle 30 is positioned further below the first limit setting height HL1 (S17). To lower the shaft 23 further, the control unit C1 applies a current in a first direction (positive direction) to the coil 45 of the lifting / lowering unit 40, increasing the current value I of the current flowing in the first direction.

[0091] When the lower surface of component 85 held by nozzle 30 comes into contact with substrate 80 (T12), an upward reaction force is generated on shaft 23. Control unit C1 further lowers shaft 23 to push component 85 into substrate 80. Control unit C1 applies a current in a first direction (positive direction) to coil 45 of lifting unit 40, increasing the current value I of the current flowing in the first direction.

[0092] When the current value I reaches the threshold value I1 (T13), the control unit C1 stops the shaft 23 for a push-in time TP2 (S19).

[0093] After the pushing time TP2 has elapsed (T14), the control unit C1 raises the shaft 23 (S20).

[0094] An example of the component mounting operation of the lifting head 11 when the determination result in step S18 is Yes will be described with reference to FIG.

[0095] FIG. 7 is a graph showing the trajectory of the nozzle 30 and the change in the current value I that drives the lifting unit 40 when the component mounting device of the first embodiment of the disclosure raises and lowers the shaft 23 relative to the substrate 80 that is located at a height lower than the second limit setting height HL2.

[0096] As shown in Figures 7(A) and 7(B), when the height of the mounting position of component 85 on substrate 80 is lower than second limit setting height HL2, the height of the lower surface of component 85 held by nozzle 30 will be at second limit setting height HL2 before the physical quantity that changes in relation to the load on shaft 23 reaches threshold value I1.

[0097] The control unit C1 outputs an ERROR signal when it determines that the height of the lower surface of the component 85 held by the nozzle 30 is at the second limit setting height HL2. For example, the control unit C1 may output an ERROR signal when the height of the lower surface of the component 85 held by the nozzle 30 is at the second limit setting height HL2 (T23), or may output an ERROR signal after T23. For example, the component mounting device 1A may or may not stop while the control unit C1 is outputting an ERROR signal. For example, the component mounting device 1A may be provided with an ERROR board ejection mechanism that ejects a board 80 for which an ERROR signal has been issued. The ejection mechanism allows the component mounting operation to continue without stopping the component mounting device 1A. For example, the ejection mechanism may be provided with a counter, and the component mounting device 1A may stop when multiple ERROR boards are ejected consecutively from the ejection mechanism. For example, the component mounting device 1A may stop when five ERROR boards are ejected consecutively from the ejection mechanism.

[0098] When the height of the lower surface of the component 85 held by the nozzle 30 reaches the second limit setting height HL2 (T23), the control unit C1 stops the descent of the shaft 23 and then raises it. For example, the control unit C1 raises the shaft 23 after a stop time TP3 has elapsed from T23 (T24), as indicated by the nozzle 30 trajectory L2B. The control unit C1 applies a current to the coil 45 of the lifting unit 40 to maintain the height of the lower surface of the component 85 held by the nozzle 30 during the stop time TP3. For example, the lifting head 11 is provided with a spring to prevent the nozzle 30 from lowering due to gravity. The spring lifts the shaft 23 upward, changing the height of the lower surface of the component 85 held by the nozzle 30. Therefore, a current is applied in a first direction (positive direction) to the coil 45 of the lifting unit 40 to prevent the height of the lower surface of the component 85 held by the nozzle 30 from changing. Note that the shaft 23 may be raised without providing the pause time TP3 from the time when the height of the lower surface of the component 85 held by the nozzle 30 reaches the second limit setting height HL2 (T23). In other words, the pause time TP3 may be 0 seconds.

[0099] The component mounting device 1A according to the first embodiment of the present disclosure can provide the following effects.

[0100] The component mounting device 1A includes a shaft 23 that is movable in the vertical direction, a nozzle 30 attached to the shaft 23 and configured to hold a component 85, an elevator unit 40 that is driven by application of current or voltage to raise and lower the shaft 23, and a control unit C1 that controls the elevator unit 40. The control unit C1 raises and lowers the shaft 23 based on a predetermined operation pattern L1 that lowers the shaft 23 until the height of the lower surface of the component 85 held by the nozzle 30 reaches a first limit setting height HL1. The control unit C1 acquires a physical quantity that changes in relation to the load on the shaft 23 and determines whether the physical quantity is equal to or greater than a threshold value I1. When the height of the lower surface of the component 85 held by the nozzle 30 reaches the first limit setting height HL1 but the physical quantity is not equal to or greater than the threshold value I1, the control unit C1 lowers the shaft 23 so that the height of the lower surface of the component 85 held by the nozzle 30 is below the first limit setting height HL1.

[0101] With this configuration, the component mounting device 1A can mount components 85 with high quality on the board 80 that has a downward warp.

[0102] When the height of the underside of the part 85 held by the nozzle 30 reaches a first limit setting height HL1 and the physical quantity that changes in relation to the load on the shaft 23 is not greater than a threshold value I1, the control unit C1 may control the shaft 23 to be able to descend until the height of the underside of the part 85 held by the nozzle 30 is positioned at a second limit setting height HL2 that is lower than the first limit setting height HL1.

[0103] With this configuration, the component mounting device 1A can lower the shaft 23 and mount the component 85 at a height suitable for mounting the component 85 even on a substrate 80 that has a downward warp.

[0104] The second limit setting height HL2 may be a height lower than the minimum height, which is the height of the lowest part of the upper surface of the board 80 on which the component 85 is mounted.

[0105] By defining the second limit setting height HL2 in this way, components can be mounted with a predetermined push-in amount even on a board 80 that has a large downward warp.

[0106] The control unit C1 may stop the lowering of the shaft 23 when the height of the lower surface of the part 85 held by the nozzle 30 is located at a height lower than the first limit setting height HL1 and the physical quantity that changes in association with the load on the shaft 23 reaches the threshold value I1. Then, the control unit C1 may maintain the shaft 23, during the pushing time TP2, at the position of the shaft 23 when the physical quantity that changes in association with the load on the shaft 23 reached the threshold value I1.

[0107] With this configuration, components 85 can be placed with a predetermined push-in amount on board 80. Furthermore, by providing push-in time TP2, components can be placed with higher quality.

[0108] When the height of the bottom surface of the component 85 held by the nozzle 30 reaches the first limit setting height HL1 and the physical quantity is equal to or greater than the threshold value I1, the control unit C1 may maintain the shaft 23 at the position it was at when the physical quantity reached the threshold value I1, for the pushing time TP1. When the height of the bottom surface of the component 85 held by the nozzle 30 is located at a height lower than the first limit setting height HL1 and the physical quantity reaches the threshold value I1, the control unit C1 may maintain the shaft 23 at the position it was at when the physical quantity reached the threshold value I1, for the pushing time TP2. The pushing time TP1 and the pushing time TP2 may be different.

[0109] By making the pressing time TP1 and the pressing time TP2 different, it is possible to mount components with a pressing time that corresponds to the state of warpage of the substrate 80. This allows for higher quality component mounting.

[0110] The physical quantity that changes in relation to the load on the shaft 23 may include a current value or a voltage value that drives the lifting unit 40. For example, the physical quantity that changes in relation to the load on the shaft 23 may include a current value or a voltage value that is applied to the coil 45 included in the lifting unit 40.

[0111] In this way, by converting the physical quantity that changes in relation to the load on the shaft 23 into a current value or voltage value that drives the lifting unit 40, it may be possible to directly control the lifting and lowering operation of the shaft 23.

[0112] The lifting unit 40 may include a coil 45 that surrounds at least a portion of the shaft 23. At least a portion of the shaft 23 may include a magnet.

[0113] With this configuration, even if the shaft 23 is raised and lowered at a relatively high speed, the control unit C1 may be able to control the raising and lowering of the shaft 23 to a more accurate raised and lowered position.

[0114] In the present embodiment, an example has been described in which component mounting device 1A includes board transport mechanism 3, component supply unit 4, head moving mechanism 7, head camera 15, and component recognition camera 16, but the present invention is not limited to this. For example, component mounting device 1A does not necessarily have to include board transport mechanism 3, component supply unit 4, head moving mechanism 7, head camera 15, and / or component recognition camera 16.

[0115] Although the component mounting device 1A is provided with the control unit C1 in the above example, the present invention is not limited to this. For example, the control unit C1 may be provided in a device separate from the component mounting device 1A.

[0116] Although the component mounting device 1A has been described as an example in which the component 85 is mounted on the non-warped substrate 80 using the predetermined operation pattern L1, the present invention is not limited to this. For example, the component mounting device 1A may mount the component 85 on the substrate 80 with a relatively small warp using the predetermined operation pattern L1.

[0117] Although the example in which the head unit 10 includes a plurality of lifting heads 11 has been described, the present invention is not limited to this. For example, the head unit 10 may include one lifting head 11.

[0118] Although the description has been given of the lifting head 11 including at least a portion of the shaft 23, this is not necessarily the case. Also, although the description has been given of a rod-shaped member at least a portion of which is a magnet, the shaft 23 does not necessarily have to be a rod-shaped member at least a portion of which is a magnet. For example, the shaft 23 does not necessarily have to be an integrated rod-shaped member included in both the lifting head 11 and the lifting unit 40. For example, the shaft included in the lifting head 11 and the shaft included in the lifting unit 40 may be separate. For example, the shaft included in the lifting unit 40 may include a magnet. For example, the magnet-containing shaft of the lifting unit 40 may be positioned in a position surrounded by the coil 45 and be movable in the Z-axis direction. For example, as the shaft of the lifting unit 40 moves in the Z-axis direction, the shaft of the lifting head 11 may move in conjunction with the shaft of the lifting unit 40 in conjunction with the shaft of the lifting unit 40.

[0119] Although an example has been described in which the lifting unit 40 includes at least a portion of the shaft 23, the housing 20, and the coil 45, the present invention is not limited to this. For example, the lifting unit 40 does not have to include the shaft 23, the housing 20, and the coil 45. For example, the lifting unit 40 may be a mechanism that raises and lowers the lifting head 11 by driving a motor. For example, the lifting unit 40 includes a motor and a ball screw driven by the motor. The ball screw may be connected to the lifting head 11. The lifting unit 40 may raise and lower the lifting head 11 connected to the ball screw by rotating the ball screw using the motor.

[0120] It has been explained that information on the elevation position of shaft 23 may be obtained by providing an encoder in lifting unit 40, but this is not limited to an encoder. For example, information on the elevation position of shaft 23 may be obtained by providing a magnetic sensor in lifting unit 40 and obtaining the position of shaft 23 including the magnet.

[0121] Although the physical quantity that changes in relation to the load on the shaft 23 has been described as the current value or voltage value that drives the lifting unit 40, it is not limited to this. For example, the physical quantity that changes in relation to the load on the shaft 23 may be the relative difference between the shaft 23 and the nozzle 30.

[0122] Although the substrate 80 having a downward bow has been described as the substrate 80 having a warp, the substrate 80 may have an upward bow. For example, if the control unit C1 determines that the physical quantity is equal to or greater than the threshold value I1 before the height of the bottom surface of the component 85 held by the nozzle 30 reaches the first limit setting height HL1, the shaft 23 may be stopped before the height of the bottom surface of the component 85 held by the nozzle 30 reaches the first limit setting height HL1.

[0123] In this embodiment, the first limit setting height HL1 and the second limit setting height HL2 have been described as the height of the lower surface of the component 85 held by the nozzle 30 from the substrate 80, but they do not have to be the height of the lower surface of the component 85 held by the nozzle 30. For example, they may be the height of the tip of the nozzle 30.

[0124] (Embodiment 2) A component mounting system according to a second embodiment of the present disclosure will be described. In the second embodiment, the same or equivalent configurations as those in the first embodiment will be denoted by the same reference numerals. Also, in the second embodiment, descriptions that overlap with those in the first embodiment will be omitted.

[0125] FIG. 8 is a schematic block diagram showing a main configuration of a component mounting system 100A according to the second embodiment of the present disclosure.

[0126] The second embodiment differs from the first embodiment in that the component mounting system 100A includes a component mounting device 1B and a control unit C2 that is separate from the component mounting device 1B.

[0127] As shown in FIG. 8, the component mounting system 100A includes a component mounting device 1B and a control unit C2 that controls the component mounting device 1B.

[0128] The operation of the component mounting device 1B is controlled by a control unit C2. In the second embodiment, the component mounting device 1B does not include a control unit.

[0129] The component mounting device 1B includes a first communication unit 91 that communicates with the control unit C2. For example, the component mounting device 1B receives an operation command from the control unit C2 via the first communication unit 91 and operates based on the operation command. The component mounting device 1B also transmits position information of the shaft 23 and the like to the control unit C2 via the first communication unit 91.

[0130] The first communication unit 91 communicates with the control unit C2 via a network. The first communication unit 91 includes a circuit that performs communication in accordance with a predetermined communication standard (for example, LAN, Wi-Fi (registered trademark), or Bluetooth (registered trademark)).

[0131] The component mounting device 1B has the same configuration as the component mounting device 1A of the first embodiment, except that it is controlled by the control unit C2 and includes a first communication unit 91.

[0132] The control unit C2 controls the component mounting device 1B. The control unit C2 is provided in a device separate from the component mounting device 1B. The control unit C2 has a second communication unit 92 that communicates with a first communication unit 91 of the component mounting device 1B. For example, the second communication unit transmits operation commands for each component of the component mounting device 1A of the control unit C2 to the first communication unit 91. The control unit C2 also receives position information of the shaft 23 and the like from the first communication unit 91 via the second communication unit 92. The control unit C2 generates operation commands to control the component mounting device 1B based on the information received from the first communication unit 91.

[0133] The second communication unit 92 communicates with the component mounting device 1B via a network. The second communication unit 92 includes a circuit for performing communication in accordance with a predetermined communication standard (for example, LAN, Wi-Fi (registered trademark), Bluetooth (registered trademark)).

[0134] The control unit C2 has the same configuration as the control unit C1 of the first embodiment, except that it includes a second communication unit 92.

[0135] The control unit C2 is, for example, a computer. For example, the control unit C2 may be a server or a cloud.

[0136] The component mounting system 100A according to the second embodiment of the present disclosure can provide the following effects.

[0137] The component mounting system 100A includes a component mounting device 1B and a control unit C2 that is separate from the component mounting device 1B. The control unit C2 controls the operation of the component mounting device 1B.

[0138] With this configuration, the component mounting system 100A can mount components 85 with high quality on the board 80 that has a downward warp.

[0139] Because component mounting device 1B does not include control unit C2, component mounting device 1B can be made smaller than component mounting device 1A of embodiment 1. Furthermore, component mounting device 1B and control unit C2 can be disposed in different positions. Therefore, when installation space is limited, component mounting device 1B can be installed in the installation space, and control unit C2 can be installed in a separate location different from the installation space.

[0140] In the second embodiment, the number of component mounting devices 1B included in the component mounting system 100A is not limited to one, but may be two or more. In other words, the control unit C2 can control a plurality of component mounting devices 1B.

[0141] 8 is described as including the component mounting processing unit 60, the physical quantity adequacy determination unit 62A, and the storage unit 70, but is not limited thereto. For example, the component mounting processing unit 60, the physical quantity adequacy determination unit 62A, and / or the storage unit 70 may be provided in separate devices. The separate devices and the respective components of the control unit C2 may be electrically connected to each other.

[0142] Note that some of the components of the control unit C2 may be included in the component mounting device 1B. For example, the component mounting device 1B may include a physical quantity adequacy determination unit 62A. For example, the determination result of the physical quantity adequacy determination unit 62A included in the component mounting device 1B may be transmitted to the control unit C2 via the first communication unit 91. Furthermore, information on the physical quantity threshold value I1 stored in the storage unit 70 of the control unit C2 may be transmitted to the component mounting device 1B via the second communication unit 92. This may allow the physical quantity adequacy determination unit 62A to acquire the information on the physical quantity threshold value I1.

[0143] 8 is provided with the board transport mechanism 3, the component supply unit 4, the head camera 15, and the component recognition camera 16. However, the present invention is not limited to this. For example, the board transport mechanism 3, the component supply unit 4, the head camera 15, and the component recognition camera 16 may be provided in a device separate from the component mounting device 1B.

[0144] The following describes modified examples. <Variation 1>

[0145] FIG. 9 is a schematic block diagram showing the main configuration of the component mounting device of the first modification.

[0146] As shown in FIG. 9, a component mounting apparatus 1C of the first modification includes a measuring unit 50. The measuring unit 50 measures the component size.

[0147] The measuring unit 50 measures the load applied to the shaft 23. For example, the measuring unit 50 is a load cell. For example, the measuring unit 50 measures the load applied to the component 85. For example, the measurement result of the measuring unit 50 is output to the control unit C3. For example, when the component 85 is mounted on the substrate 80, the shaft 23 receives a reaction force from below by the substrate 80. Furthermore, the reaction force N corresponds to the load applied to the component 85.

[0148] The storage unit 70 of the control unit C3 stores a threshold value F1 of the load applied to the shaft 23.

[0149] The physical quantity appropriateness determining unit 62B included in the control unit C3 determines whether the load measured by the measuring unit 50 is equal to or greater than the threshold value F1.

[0150] The lift control unit 66 controls the current and / or voltage applied to the lift unit 40 based on the determination result of the physical quantity appropriateness determination unit 62B.

[0151] Note that control unit C3 differs from the control processing of control unit C1 in embodiment 1 in that it acquires the measurement result of measurement unit 50, determines whether or not the measurement result of measurement unit 50 is equal to or greater than threshold value F1 using physical quantity adequacy determination unit 62B, and controls lifting unit 40 based on the determination result. Also, it differs from the control processing of control unit C1 in embodiment 1 in that the physical quantity threshold value stored in memory unit 70 is load F applied to shaft 23. In other words, control unit C3 is the same as the control processing of control unit C1 in embodiment 1 except for the controls of measurement unit 50, physical quantity adequacy determination unit 62B, and lifting unit 40, and the physical quantity threshold value stored in memory unit 70.

[0152] An example of the operation of the component mounting device 1C will be described.

[0153] Figure 10 is a graph showing the trajectory of the nozzle 30 and the change in the load F acting on the shaft 23 when the component mounting device 1C of variant example 1 raises and lowers the shaft 23 in a predetermined operating pattern L1 on a substrate 80 that is not warped.

[0154] 10(A) and 10(B), the control unit C1 lowers the shaft 23 and places the component 85 on the substrate 80 that does not have any warpage, based on the operation pattern L1 stored in the storage unit 70. Note that the control unit C1 also raises and lowers the shaft 23 and places the component 85 on the substrate 80 that has a relatively small warpage, based on the operation pattern L1.

[0155] As the shaft 23 is lowered relative to the substrate 80, the component 85 comes into contact with the substrate 80 (T2).

[0156] When component 85 comes into contact with substrate 80, shaft 23 receives a reaction force from below due to substrate 80. When shaft 23 is further lowered, the upward reaction force that component 85 receives from substrate 80 increases in proportion to the amount of lowering of shaft 23. The reaction force that shaft 23 receives from substrate 80 corresponds to load F acting on shaft 23.

[0157] When the height of the lower surface of the component 85 held by the nozzle 30 reaches the first limit setting height HL1 (T3), if the load F applied to the shaft 23 is equal to or greater than the threshold value F1, the control unit C3 stops the shaft 23 (S19). The control unit C3 also controls the current and / or voltage applied to the lifting unit 40 so that the load F applied to the shaft 23 is maintained at the threshold value F1 during the push-in time TP1.

[0158] After the pushing time TP1 has elapsed (T4), the control unit C3 raises the shaft 23 (S20).

[0159] The operation of component mounting device 1C for mounting component 85 on warped substrate 80 will be described.

[0160] FIG. 11 is a graph showing the trajectory of the nozzle 30 and the change in the load F applied to the shaft 23 when the component mounting device 1C of the first modification moves the shaft 23 up and down relative to the substrate 80 that has developed downward warping.

[0161] As shown in FIGS. 11(A) and 11(B), the shaft 23 operates according to the operation pattern L1 stored in the storage unit 70.

[0162] When the height of the underside of the part 85 held by the nozzle 30 reaches the first limit setting height HL1 (T3), if the load F applied to the shaft 23 has not reached the physical quantity threshold F1, the control unit C1 controls the raising and lowering of the shaft 23 without following the operation pattern L1.

[0163] The control unit C3 lowers the shaft 23 from the first limit setting height HL1 until the load F applied to the shaft 23 reaches or exceeds a threshold value F1 (S17). For example, the control unit C3 acquires the load F applied to the shaft 23 measured by the measurement unit 50 and compares it with the threshold value F1 stored in the memory unit 70. For example, the control unit C3 calculates the difference between the magnitude of the load F applied to the shaft 23 and the threshold value F1, and determines whether the load F applied to the shaft 23 is equal to or greater than the physical quantity threshold value F1 based on the difference.

[0164] The control unit C3 stops the shaft 23 for a pushing time TP2 from the time when the load F applied to the shaft 23 becomes equal to or greater than the threshold value F1 (T13) (S19).

[0165] After the pushing time TP2 has elapsed (T14), the control unit C1 raises the shaft 23 (S20).

[0166] When the downward bowing of the substrate 80 is large and the minimum height of the upper surface of the substrate 80 is lower than the second limit setting height HL2, the load F applied to the shaft 23 does not reach the threshold value F1. Furthermore, when the component 85 held by the nozzle 30 does not come into contact with the substrate 80, the load F applied to the shaft 23 does not change significantly from the load F0 applied to the shaft 23 when the lifting head 11 starts to descend (T1).

[0167] According to the component mounting device 1C of the first modification, the following effects can be achieved.

[0168] The physical quantity that changes in relation to the load on the shaft 23 may include the load F that is applied to the shaft 23 .

[0169] By defining the physical quantity that changes in relation to the load on the shaft 23 in this way, the component mounting device 1A can perform high-quality component mounting even when, for example, the change in the current or voltage applied to the lifting section 40 is minute and difficult to obtain as a physical quantity value.

[0170] The component mounting device 1C includes a measurement unit 50 that measures the load applied to the shaft 23. The control unit C3 may acquire the measurement results of the measurement unit 50 and adjust the current or voltage that drives the lifting unit 40 based on the measurement results.

[0171] With this configuration, the component 85 can be mounted on the substrate 80 with a more appropriate amount of pressing.

[0172] In the first modification, the component mounting device 1C is described as being the component mounting device 1A of the first embodiment of the present disclosure further including the height detection sensor 19 and the update unit 68. However, the component mounting system 100A of the second embodiment of the present disclosure may be provided with a measurement unit 50.

[0173] Although the physical quantity measured by the measuring unit 50 has been described as the load F acting on the shaft 23, this is not limiting. For example, the physical quantity measured by the measuring unit 50 may be the relative difference between the shaft 23 and the nozzle 30. For example, the measuring unit 50 may measure the relative difference between the shaft 23 and the nozzle 30 after the component 85 held by the nozzle 30 comes into contact with the substrate 80.

[0174] It is also possible to provide a contact detection unit in the lifting head 11 and, after detecting that the component 85 has come into contact with the board 80, measure the load F applied to the shaft 23 by the measuring unit 50.

[0175] <Variation 2> FIG. 12 is a schematic block diagram showing the main configuration of a component mounting device 1D of the second modification.

[0176] 12, a component mounting device 1D of the second modification includes a height detection sensor 19. In addition, a control unit C4 of the component mounting device 1D includes an updating unit 68.

[0177] The height detection sensor 19 detects the height of the upper surface of the substrate 80. For example, the height detection sensor 19 detects the minimum height, which is the lowest height of the upper surface of the substrate 80. For example, the height detection sensor 19 may detect the height of a position on the substrate 80 where the component 85 is to be placed.

[0178] The height detection sensor 19 may detect the minimum height, which is the lowest height of the upper surface of each of the plurality of substrates 80, or for each type of the plurality of substrates 80. For example, the height detection sensor 19 may detect the height for each production lot of the substrates 80. When the lot number of the substrate 80 on which the production lot number is printed changes, the height detection sensor 19 may detect the minimum height of the substrate 80.

[0179] The control unit C4 has a configuration in which an update unit 68 is further provided in addition to the control unit C1 of the component mounting device 1A in the first embodiment.

[0180] The updating unit 68 updates the second limit setting height HL2 based on the result of detection by the height detection sensor 19. For example, the updating unit 68 may update the second limit setting height HL2 at the timing of detection by the height detection sensor 19. For example, the updating unit 68 may update the second limit setting height HL2 when a production lot number printed on the board 80 changes. For example, when the minimum height of the board 80 detected by the height detection sensor 19 is located at a height lower than the height of the bottom surface of the component 85 held by the nozzle 30 when the lowering of the shaft 23 is limited, the updating unit 68 may update the second limit setting height HL2 to the height of the bottom surface of the component 85 held by the nozzle 30 when the lowering of the shaft 23 is limited.

[0181] According to the component mounting device 1D of the second modification, the following effects can be achieved.

[0182] The component mounting device 1D is a component mounting device that further includes a height detection sensor 19 that detects the height of the upper surface of the substrate 80 in addition to the component mounting device 1A described in the first embodiment. The control unit C4 may update the second limit setting height HL2 based on the result detected by the height detection sensor 19.

[0183] With this configuration, the component mounting device 1D can mount components 85 with higher quality on the board 80 that has a downward warp.

[0184] The height detection sensor 19 may detect the minimum height, which is the lowest height of the upper surface of each of the plurality of substrates 80 or for each type of the plurality of substrates 80 .

[0185] This configuration allows components 85 to be mounted with higher quality. For example, detecting the minimum height of the top surface of each of the multiple boards 80 using the height detection sensor 19 allows the second limit setting height HL2 to be determined more accurately than not detecting the minimum height of the top surface of the board 80 using the height detection sensor 19. Therefore, components 85 can be mounted with higher quality on the boards 80, even when warpage occurs due to individual differences between the multiple boards 80. Furthermore, the positions at which warpage occurs and the amount of warpage displacement may be similar for multiple boards 80. For example, boards 80 from the same lot or type may be similar. In this case, detecting the minimum height of the boards 80 for each lot or type of multiple boards 80 using the height detection sensor 19 allows height detection to be performed more efficiently than detecting the height for each board 80. In other words, by detecting the minimum height of the boards 80 for each lot or type of multiple boards 80, the component mounting device 1D can mount components 85 on the boards 80 with high quality and efficiency.

[0186] In the second modification, the component mounting device 1D has been described as being the component mounting device 1A of the first embodiment of the present disclosure further equipped with the height detection sensor 19 and the update unit 68. However, the component mounting system 100A of the second embodiment of the present disclosure may further be provided with the height detection sensor 19 and the update unit 68.

[0187] The control unit C3 may detect the minimum height of the upper surface of the substrate 80 using the height detection sensor 19 and update the first limit setting height HL1 based on the minimum height. For example, when the lot or type of the substrate 80 changes, the first limit setting height HL1 may be updated based on the minimum height of the upper surface of the substrate 80 detected by the height detection sensor 19.

[0188] As used herein, terms such as "first," "second," etc. are used for descriptive purposes only and should not be understood as expressing or implying the relative importance or ranking of technical features. Features qualified as "first" and "second" expressly or imply the inclusion of one or more of such features.

[0189] Although the present disclosure has been fully described in connection with the preferred embodiments with reference to the accompanying drawings, various changes and modifications will be apparent to those skilled in the art, and such changes and modifications are to be understood as included within the scope of the present invention as defined by the appended claims unless they depart therefrom.

[0190] (Outline of the embodiment) (1) A component mounting device according to the present disclosure includes a shaft movable in an up-down direction, a nozzle attached to the shaft for holding a component, an elevator unit driven by application of current or voltage to raise and lower the shaft, and a control unit for controlling the elevator unit. The control unit raises and lowers the shaft based on a predetermined operation pattern for lowering the shaft until the height of the underside of the component held by the nozzle reaches a first limit setting height, acquires a physical quantity that varies in relation to a load on the shaft, determines whether the physical quantity is equal to or greater than a threshold value, and, when the height of the underside of the component held by the nozzle reaches the first limit setting height and the physical quantity is not equal to or greater than the threshold value, lowers the shaft so that the height of the underside of the component held by the nozzle is below the first limit setting height.

[0191] (2) In the component mounting device of (1), when the height of the lower surface of the component held by the nozzle reaches the first limit setting height and the physical quantity is not equal to or greater than the threshold value, the shaft may be controlled to be able to descend until the height of the lower surface of the component held by the nozzle is positioned at a second limit setting height that is lower than the first limit setting height.

[0192] (3) In the component mounting device of (2), the second limit setting height may be lower than a minimum height, which is the height of the lowest part of the upper surface of the board on which the component is to be mounted.

[0193] (4) In any one of the component mounting devices (1) to (3), the control unit may stop the descent of the shaft when the height of the underside of the component held by the nozzle is located at a height lower than the first limit setting height and the physical quantity reaches the threshold value, and may maintain the shaft at the height of the underside of the component held by the nozzle when the physical quantity reached the threshold value during the pushing time.

[0194] (5) In the component mounting device of any one of (1) to (3), when the height of the lower surface of the component held by the nozzle reaches the first limit setting height and the physical quantity is equal to or greater than the threshold, the control unit maintains the shaft at the position of the shaft when the physical quantity reached the threshold for a first push-down time. When the height of the lower surface of the component held by the nozzle is lower than the first limit setting height and the physical quantity reaches the threshold, the control unit maintains the shaft at the position of the shaft when the physical quantity reached the threshold for a second push-down time. The first push-down time and the second push-down time may be different.

[0195] (6) In the component mounting device of any one of (1) to (5), a current value or a voltage value for driving the lifting unit may be included.

[0196] (7) In the component mounting device of (6), the lifting unit may include a coil surrounding at least a portion of the shaft. At least a portion of the shaft may include a magnet.

[0197] (8) In the component mounting device of any one of (1) to (7), the physical quantity may include a load acting on the shaft.

[0198] (9) In the component mounting device of (8), a measuring unit may be provided to measure the load, and the control unit may acquire the measurement results of the measuring unit and adjust the current or the voltage that drives the lifting unit based on the measurement results.

[0199] (10) In the component mounting device of (3), a height detection sensor may be further provided for detecting the height of the upper surface of the substrate, and the control unit may update the second limit setting height based on the result detected by the height detection sensor.

[0200] (11) In the component mounting device of (10), the height detection sensor may detect the minimum height for each of the plurality of boards or for each type of the plurality of boards.

[0201] (12) A component mounting system according to the present disclosure includes a shaft movable in an up-down direction, a nozzle attached to the shaft for holding a component, an elevator unit driven by application of current or voltage to raise and lower the shaft, and a control unit for controlling the elevator unit. The control unit raises and lowers the shaft based on a predetermined operation pattern for lowering the shaft until the height of the underside of the component held by the nozzle reaches a first limit setting height, acquires a physical quantity that varies in relation to a load on the shaft, determines whether the physical quantity is equal to or greater than a threshold value, and, when the height of the underside of the component held by the nozzle reaches the first limit setting height and the physical quantity is not equal to or greater than the threshold value, lowers the shaft so that the height of the underside of the component held by the nozzle is below the first limit setting height. [Industrial Applicability]

[0202] The component mounting device and component mounting system of the present disclosure are useful for mounting components on a warped substrate. [Explanation of symbols]

[0203] 1A, 1B, 1C, 1D Component placement equipment 2 bases 3. Substrate transport mechanism 4. Parts Supply Department 6 Tape Feeder 7 Head movement mechanism 8 Y-axis table 9 Beam 10 Head Unit 11 Lifting head 15 Head Camera 16 Parts Recognition Camera 19 Height detection sensor 20 Case 23 Shaft 30 nozzles 31 Contact member 32 Suction opening 40 Lifting section 45 coils 50 Measurement section 60 Parts mounting processing section 62A, 62B Physical quantity appropriateness judgment unit 66 Lift control section 68 Update section 70 Memory section 71 Production Program 80 boards 85 parts 91 First Communications Department 92 Second Communications Department 100A component mounting system C1, C2, C3, C4 control section L1 Operation Pattern HL1 First limit setting height HL2 Second limit setting height TP1, TP2 push-in time TP3 stop time I1, F1 Threshold of physical quantity

Claims

1. A shaft that is movable in the up and down direction; a nozzle provided on the shaft for holding a part; an elevating unit that is driven by application of a current or a voltage and moves the shaft up and down; a control unit that controls the lifting unit; Equipped with The control unit raising and lowering the shaft based on a predetermined operation pattern for lowering the shaft until the height of the lower surface of the part held by the nozzle reaches a first limit setting height; Acquire a physical quantity that changes in relation to a load applied to the shaft; determining whether the physical quantity is equal to or greater than a threshold value; when the height of the lower surface of the part held by the nozzle reaches the first limit setting height and the physical quantity is not equal to or greater than the threshold value, lowering the shaft so that the height of the lower surface of the part held by the nozzle is positioned below the first limit setting height; Parts mounting device.

2. when the height of the lower surface of the part held by the nozzle reaches the first limit setting height and the physical quantity is not equal to or greater than the threshold value, the control unit controls the shaft to be capable of descending until the height of the lower surface of the part held by the nozzle is positioned at a second limit setting height that is lower than the first limit setting height. The component mounting device according to claim 1 .

3. the second limit setting height is lower than a minimum height, which is the height of the lowest part of the upper surface of the board on which the component is mounted; The component mounting device according to claim 2 .

4. the control unit stops the descent of the shaft when the height of the lower surface of the part held by the nozzle is located at a height lower than the first limit setting height and the physical quantity reaches the threshold value, and maintains the shaft at the position of the shaft when the physical quantity reached the threshold value for a push-in time. The component mounting device according to claim 1 .

5. when the height of the lower surface of the part held by the nozzle reaches the first limit setting height and the physical quantity is equal to or greater than the threshold value, the control unit maintains the shaft at the position of the shaft when the physical quantity reached the threshold value, for a first push-in time; the control unit, when the height of the lower surface of the part held by the nozzle is located at a height lower than the first limit setting height and the physical quantity reaches the threshold value, maintains the shaft at the position of the shaft when the physical quantity reached the threshold value for a second push-in time; The first pressing time and the second pressing time are different. The component mounting device according to claim 1 .

6. The physical quantity includes a current value or a voltage value that drives the lifting unit. The component mounting device according to claim 1 .

7. the lifting unit includes a coil surrounding at least a portion of the shaft; At least a portion of the shaft has a magnet. The component mounting device according to claim 6.

8. The physical quantity includes a load acting on the shaft. The component mounting device according to claim 1 .

9. a measuring unit that measures the load, the control unit acquires the measurement result of the measurement unit, and adjusts the current or the voltage for driving the lifting unit based on the measurement result. The component mounting device according to claim 8.

10. a height detection sensor for detecting the height of the upper surface of the substrate; The control unit updates the second limit setting height based on the result detected by the height detection sensor. The component mounting device according to claim 3.

11. the height detection sensor detects the minimum height of each of the plurality of substrates or for each type of the plurality of substrates; The component mounting device according to claim 10.

12. A shaft that is movable in the up and down direction; a nozzle provided on the shaft for holding a part; an elevating unit that is driven by application of a current or a voltage and moves the shaft up and down; a control unit that controls the lifting unit; Equipped with The control unit raising and lowering the shaft based on a predetermined operation pattern for lowering the shaft until the height of the lower surface of the part held by the nozzle reaches a first limit setting height; Acquire a physical quantity that changes in relation to a load applied to the shaft; determining whether the physical quantity is equal to or greater than a threshold value; when the height of the lower surface of the part held by the nozzle reaches the first limit setting height and the physical quantity is not equal to or greater than the threshold value, lowering the shaft so that the height of the lower surface of the part held by the nozzle is positioned below the first limit setting height; Parts mounting equipment system.

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