Component mounting device, and component mounting system

Abstract

To provide a component mounting device capable of precisely mounting a component with high quality onto a substrate with downward curvature.SOLUTION: A disclosed component mounting device has a nozzle that pushes a component onto a substrate based on the loaded air pressure. The component mounting device includes: a press head that is capable of raising and lowering relative to a substrate; a lifting unit that raises and lowers the press head; an air pressure adjustment unit that adjusts the air pressure applied to the nozzle: a measuring unit that measures physical quantities that change in relation to the operation of the nozzle; and a control unit that controls the lifting unit, and the air pressure adjustment unit. The control unit is configured so as to raise and lower the press head until the height of the bottom surface of the component held by the press head reaches a first limit setting height based on a predetermined motion pattern to lower the press head, determine whether a physical quantity measured by the measurement unit is equal to or greater than a threshold value, and when the height of the bottom surface of the component held by the press head reaches the first limit setting height and the physical quantity is not greater than the threshold, lower the press head so that the height of the bottom surface of the component held by the press head positions to be lower than the first limit setting height.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present disclosure relates to a component mounting device and a component mounting system that mounts a component at a mounting position. [Background technology]

[0002] For example, Patent Document 1 discloses an electronic component mounting device that can mount electronic components without applying impact force to the electronic components even when the board is warped. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2007-266334 Summary of the Invention [Problem to be solved by the invention]

[0004] However, the device described in Patent Document 1 still has room for improvement in terms of mounting components on a board with high quality when the board has a downward warp that is convex downward.

[0005] In view of the above-mentioned problems, the present disclosure provides a component mounting device and a component mounting system that can mount components with high quality on a board that has a downward bow. [Means for solving the problem]

[0006] The component mounting device according to the present disclosure comprises: a press head having a nozzle for pressing a component against a substrate based on the applied air pressure, the press head being capable of moving up and down relative to the substrate; an elevation unit that raises and lowers the pressing head; an air pressure adjusting unit that adjusts the air pressure applied to the nozzle; a measurement unit that measures a physical quantity that changes in relation to the operation of the nozzle; a control unit that controls the lifting unit and the air pressure adjusting unit; Equipped with The control unit raising and lowering the press head based on a predetermined operation pattern for lowering the press head so that the height of the lower surface of the component held by the press head reaches a first limit setting height; determining whether the physical quantity measured by the measurement unit is equal to or greater than a threshold value; When the height of the lower surface of the component held by the press head reaches the first limit setting height and the physical quantity is not equal to or greater than the threshold value, the press head is lowered below the first limit setting height.

[0007] The component mounting system according to the present disclosure comprises: a press head having a nozzle for pressing a component against a substrate based on the applied air pressure, the press head being capable of moving up and down relative to the substrate; an elevation unit that raises and lowers the pressing head; an air pressure adjusting unit that adjusts the air pressure applied to the nozzle; a measurement unit that measures a physical quantity that changes in relation to the operation of the nozzle; a control unit that controls the lifting unit and the air pressure adjusting unit; Equipped with The control unit raising and lowering the press head based on a predetermined operation pattern for lowering the press head until the height of the lower surface of the component held by the press head reaches a first limit setting height; determining whether the physical quantity measured by the measurement unit is equal to or greater than a threshold value; When the height of the lower surface of the part held by the pressing head reaches the first limit setting height and the physical quantity is not equal to or greater than the threshold value, the pressing head is lowered so that the height of the lower surface of the part held by the pressing head is positioned below the first limit setting height. [Effects of the Invention]

[0008] According to the present disclosure, it is possible to provide a component mounting device and a component mounting system that can mount components with high quality on a board that has bowed downward. [Brief explanation of the drawings]

[0009] [Figure 1] 1 is a schematic plan view of an example of a component mounting device according to a first embodiment of the present disclosure; [Figure 2] FIG. 1 is a schematic block diagram showing a main configuration of a component mounting device according to a first embodiment of the present disclosure. [Figure 3] FIG. 1 is a schematic diagram illustrating an internal configuration of a pressing head of a component mounting device according to a first embodiment of the present disclosure. [Figure 4] FIG. 1 is a schematic diagram illustrating an internal configuration of a pressing head of a component mounting device when a component is mounted according to a first embodiment of the present disclosure. [Figure 5] 1 is a flow diagram of component mounting by the component mounting device according to the first embodiment of the present disclosure; [Figure 6] FIG. 10 is a graph showing the trajectory of the nozzle and the change in air pressure applied to the nozzle when the component mounting device according to the first embodiment of the present disclosure moves the pressing head up and down in a predetermined operation pattern on a board that is not warped. [Figure 7] FIG. 10 is a graph showing the trajectory of the nozzle and the change in air pressure applied to the nozzle when the component mounting device according to the first embodiment of the present disclosure raises and lowers the press head on a board that has undergone downward warping. [Figure 8] FIG. 10 is a graph showing the trajectory of the nozzle and the change in air pressure applied to the nozzle when the component mounting device according to the first embodiment of the present disclosure raises and lowers the pressure head to a board located at a height lower than the second limit setting height. [Figure 9] FIG. 10 is a schematic block diagram showing a main configuration of a component mounting system according to a second embodiment of the present disclosure. [Figure 10] 1 is a schematic block diagram showing the main configuration of a component mounting device according to a first modification; DETAILED DESCRIPTION OF THE INVENTION

[0010] (Background to this disclosure) The electronic component placement device described in Patent Document 1 has a structure in which a nozzle tip for suctioning and placing electronic components is integrated with a compression spring provided at the axial center and the tip of a plunger that presses the compression spring provided at the axial center. In the device described in Patent Document 1, when a board is warped, the nozzle stroke amount is determined based on the minimum height at which the board is most downwardly convex, and electronic components are placed. Furthermore, when the actual height at which the electronic component is mounted is higher than the minimum height, the compression spring elastically deforms to absorb the force and reduce the impact on the electronic component.

[0011] However, with the device described in Patent Document 1, if the board has a downward convex bow, it may not be possible to efficiently mount components on the board. For example, if the board has a relatively large downward bow, even if the nozzle is raised and lowered based on the nozzle stroke amount determined based on the minimum height at which the board is most convex downward, the nozzle may not be pressed sufficiently into the board, making it impossible to mount components.

[0012] Therefore, the present inventors have studied a component mounting device and a component mounting system that can mount components with high quality on a board that has bowed downward, and have arrived at the present disclosure.

[0013] Hereinafter, a first embodiment according to the present disclosure will be described with reference to the accompanying drawings. In each drawing, elements are exaggerated for ease of explanation. (Embodiment 1)

[0014] Fig. 1 is a schematic plan view of an example of a component mounting device 1A according to a first embodiment of the present disclosure. In Fig. 1 and in some parts described below, two axes perpendicular to each other in a horizontal plane are shown: an X axis in the substrate transport direction (left-right direction in Fig. 1) and a Y axis perpendicular to the substrate transport direction (up-down direction in Fig. 1). Also, a Z axis is shown as an axis perpendicular to the horizontal plane. Fig. 2 is a schematic block diagram showing the main configuration of the component mounting device 1A according to the first embodiment of the present disclosure.

[0015] As shown in Figures 1 and 2, the component mounting device 1A includes a base 2, a substrate conveying mechanism 3, a component supply unit 4, an electro-pneumatic regulator 5, a head moving mechanism 7, a head unit 10, a head camera 15, a component recognition camera 16, a lifting unit 40, a contact detection unit 45, and a control unit C1.

[0016] The base 2 is a member that supports the components of the component mounting device 1 A. For example, the base 2 supports the component supply unit 4, the head moving mechanism 7, and the head unit 10.

[0017] The substrate transport mechanism 3 transports the substrate 80. For example, the substrate transport mechanism 3 transports the substrate 80 transported from upstream to the mounting position, positions it, and holds it. The substrate transport mechanism 3 also transports the substrate 80 downstream after the component mounting operation has been completed. The substrate transport mechanism 3 is disposed in the center of the base 2 along the X-axis.

[0018] The component supply unit 4 is a device that supplies components to a component supply position.

[0019] The component mounting device 1A is provided with two component supply units 4. The two component supply units 4 are arranged on both sides (front and back of the Y axis) of the position on the board 80 where components are to be mounted.

[0020] The component supply unit 4 includes a plurality of tape feeders 6. The plurality of tape feeders 6 are arranged along the X axis. The tape feeders 6 feed components from outside the component supply unit 4 to a component supply position.

[0021] The electro-pneumatic regulator 5 adjusts the amount of air supplied to the head unit 10, that is, the air pressure P inside the head unit 10, in accordance with the command air pressure commanded by the control unit C1.

[0022] The head moving mechanism 7 can move the components of the component mounting device 1A on the XY plane. For example, the head moving mechanism 7 can move the head unit 10 and the head camera 15 on the XY plane.

[0023] The head moving mechanism 7 includes a Y-axis table 8 and a beam 9 .

[0024] The head moving mechanism 7 includes two Y-axis tables 8. The two Y-axis tables 8 are arranged on the upper surface of the base 2 at both ends extending along the Y-axis.

[0025] The beam 9 is connected along the X axis to two Y-axis tables 8. The beam 9 can move in the Y direction by moving along the Y-axis tables 8.

[0026] When the component fed by the tape feeder 6 reaches the component supply position, the head unit 10 picks up the component.

[0027] The head unit 10 is attached to the beam 9 and is movable in the XY plane. The head unit 10 is equipped with a plurality of pressing heads 11. The pressing heads 11 are capable of moving up and down relative to the substrate 80. The pressing heads 11 pick up components that have reached the component supply position and mount the components on the substrate 80. The structure of the pressing heads 11 will be described in detail below.

[0028] Head camera 15 recognizes the position of a board mark (not shown) provided on board 80. More specifically, head camera 15, together with head unit 10, moves above board 80 positioned at the component mounting work position and recognizes the position of the board mark.

[0029] The head camera 15 is disposed on the lower side of the beam 9 and moves integrally with the head unit 10.

[0030] The component recognition camera 16 captures an image of a component held by the head unit 10. Specifically, when the head unit 10 holding a component taken out from the component supply unit 4 passes above the component recognition camera 16, the component recognition camera 16 captures an image of the component from below.

[0031] The component recognition camera 16 is disposed between the board transport mechanism 3 and the component supply unit 4.

[0032] Taking into consideration the recognition results of the board 80 by the head camera 15 and the recognition results of the components by the component recognition camera 16, the mounting positions of the components on the board 80 are corrected.

[0033] The lifting unit 40 raises and lowers the pressing head 11 of the head unit 10. For example, the lifting unit 40 includes a motor and a ball screw driven by the motor. The ball screw is connected to the pressing head 11. The lifting unit 40 raises and lowers the pressing head 11 connected to the ball screw by rotating the ball screw using the motor. For example, the lifting unit 40 may include an encoder to obtain information on the raised and lowered position of the pressing head 11. Furthermore, the lifting unit 40 may output the raised and lowered position of the pressing head 11 obtained by the encoder to the control unit C1.

[0034] The contact detection unit 45 detects when a component held by the press head 11 comes into contact with the substrate 80. For example, the contact detection unit 45 is attached to a nozzle 30 (described later) of the press head 11. The contact detection unit 45 is, for example, a pressure sensor. Information detected by the contact detection unit 45 is output to the control unit C1.

[0035] The control unit C1 controls each unit included in the component mounting device 1A. The control unit C1 includes a general-purpose processor such as a CPU or MPU that executes a program to realize a predetermined function. The control unit C1 is not limited to a unit that realizes a predetermined function through the cooperation of hardware and software, but may also be a hardware circuit designed specifically to realize a predetermined function. For example, the control unit C1 may include a memory, and realize a function by executing a program stored in the memory with a processor.

[0036] (Pressing head configuration) The configuration of the pressing head 11 will now be described in more detail.

[0037] Fig. 3 is a schematic diagram showing the internal configuration of the press head 11 of the component mounting device 1A of this embodiment. Fig. 4 is a schematic diagram showing the internal configuration of the press head 11 of the component mounting device 1A of this embodiment when mounting a component.

[0038] As shown in FIGS. 3 and 4, the pressing head 11 includes a housing 20, an air supply hose 21, a balloon 22, a piston 23, a cylinder 24, and a nozzle 30.

[0039] The housing 20 houses a balloon 22, a piston 23, and a cylinder 24.

[0040] The air supply hose 21 is connected to the top of the housing 20 and is a hose member that supplies air from the electropneumatic regulator 5 to the balloon 22.

[0041] The balloon 22 is an inflatable bag-shaped member. When air is supplied to the balloon 22 through the air supply hose 21, the air pressure P inside the balloon 22 changes, causing the balloon 22 to expand.

[0042] The piston 23 receives a downward force in response to the air pressure P inside the balloon 22. The piston 23 is a rod-shaped member, and is disposed inside the housing 20 so as to abut against the lower end of the balloon 22.

[0043] The cylinder 24 holds the piston 23 so that it can move along the Z axis.

[0044] Nozzle 30 is attached to the lower end of piston 23 and sucks and holds component 85. Nozzle 30 presses component 85 against substrate 80 as pressure head 11 descends relative to substrate 80. A contact member 31 that comes into contact with the upper surface of component 85 is attached to the tip of nozzle 30. A suction opening 32 of nozzle 30 opens on the lower surface of contact member 31. When a vacuum source (not shown) connected to suction opening 32 is activated while contact member 31 is in contact with the upper surface of component 85, component 85 is sucked onto contact member 31.

[0045] As shown in Figure 4, during component mounting, the press head 11 descends toward the substrate 80, and the component 85 held by the nozzle 30 comes into contact with the substrate 80. As the piston 23 is pushed back toward the balloon 22, the air pressure inside the balloon 22 rises from air pressure P to air pressure P + ΔP. In this state, the piston 23 receives a force from above due to air pressure P + ΔP, and also receives a reaction force N from the substrate 80 from below. The reaction force N is in balance with the air pressure P + ΔP. Furthermore, the reaction force N corresponds to the load that the component 85 receives. In other words, the air pressure P + ΔP corresponds to the load that the component 85 receives.

[0046] As shown in FIGS. 3 and 4, the pressing head 11 is connected to an electropneumatic regulator 5 .

[0047] The electropneumatic regulator 5 is configured to adjust the air pressure P applied to the nozzle 30 in accordance with the input voltage V. The electropneumatic regulator 5 includes an air pressure adjustment unit 51 and a measurement unit 52.

[0048] The air pressure adjusting unit 51 adjusts the air pressure P applied to the nozzle 30. For example, the air pressure adjusting unit 51 may include a plurality of valves and actuators connected to the respective valves. The valves of the air pressure adjusting unit 51 may be connected to an air supply source to supply air to the inside of the balloon 22. Alternatively, the valves of the air pressure adjusting unit 51 may be connected to the outside air to exhaust air from the inside of the balloon 22. For example, when the command air pressure P0 is determined by the control unit C1, the air pressure adjusting unit 51 adjusts the air pressure P so that the air pressure P inside the balloon 22 reaches the command air pressure P0, which is proportional to the command voltage. The air pressure adjusting unit 51 receives an input of a command voltage proportional to the command air pressure, which is the air pressure P applied to the nozzle 30, from the control unit C1.

[0049] The measurement unit 52 measures a physical quantity that changes in association with the operation of the nozzle 30. For example, the physical quantity that changes in association with the operation of the nozzle 30 includes air pressure. In this embodiment, the measurement unit 52 measures the air pressure P inside the balloon 22. For example, the measurement unit 52 may start measuring the physical quantity that changes in association with the operation of the nozzle 30 when the contact detection unit 45 detects that the substrate 80 has come into contact with the component 85 held by the nozzle 30. Also, for example, the measurement unit 52 is an air pressure sensor. The measurement unit 52 outputs a voltage V based on the air pressure P to the control unit C1. The control unit C1 controls the lifting unit 40 and the air pressure adjustment unit 51 based on the voltage V output from the measurement unit 52.

[0050] The load applied to the part 85 is proportional to the voltage V in the electropneumatic regulator 5 and the air pressure P inside the balloon 22 .

[0051] (Configuration of control unit) The configuration of the control unit C1 will now be described in more detail.

[0052] 2, the control unit C1 is electrically connected to the board transport mechanism 3, the component supply unit 4, the electro-pneumatic regulator 5, the pressing head 11, the head camera 15, the component recognition camera 16, the lifting unit 40, and the contact detection unit 45. The control unit C1 controls these components.

[0053] In controlling the component mounting operation, the control unit C1 raises and lowers the press head 11 based on a predetermined operation pattern L1 that lowers the press head 11 until the height of the bottom surface of the component 85 held by the press head 11 reaches a first limit setting height HL1. The control unit C1 acquires a physical quantity measured by the measurement unit 52 and determines whether the physical quantity is equal to or greater than a threshold value P1. When the height of the bottom surface of the component 85 held by the press head 11 reaches the first limit setting height HL1 and the physical quantity is not equal to or greater than the threshold value P1, the control unit C1 lowers the press head 11 so that the height of the bottom surface of the component 85 held by the press head 11 is positioned below the first limit setting height HL1.

[0054] Specifically, the control unit C1 includes a component mounting processing unit 60, a physical quantity appropriateness determining unit 62, an air pressure command unit 64, and a storage unit .

[0055] During component mounting, the component mounting processing unit 60 controls the operations of the board transport mechanism 3, the component supply unit 4, the head camera 15, and the component recognition camera 16 to align the component 85 with the board 80. For example, the component mounting processing unit 60 controls the press head 11 to align the position and orientation of the component 85 with the mounting position on the surface of the board 80, and mounts the component 85 at the mounting position on the board 80. For example, the component mounting processing unit 60 controls the lifting unit 40 to raise and lower the press head 11 based on a predetermined operation pattern L1 that lowers the press head 11 until the height of the bottom surface of the component 85 held by the press head 11 reaches a first limit setting height HL1. The component mounting processing unit 60 lowers the press head 11 when the height of the bottom surface of the component 85 held by the press head 11 reaches the first limit setting height HL1 and the physical quantity that changes in conjunction with the operation of the nozzle 30 is not equal to or greater than a threshold value P1.

[0056] The physical quantity adequacy determination unit 62 determines whether or not the physical quantity measured by the measurement unit 52 is equal to or greater than a physical quantity threshold value P1 stored in the storage unit 70. For example, the physical quantity adequacy determination unit 62 determines whether or not the air pressure P applied to the nozzle 30 during component mounting is equal to or greater than the threshold value P1.

[0057] The air pressure command unit 64 commands the air pressure to be applied to the nozzle 30 to the air pressure adjustment unit 51 of the electro-pneumatic regulator 5. In this embodiment, the air pressure commanded by the air pressure command unit 64 is referred to as the command air pressure. Specifically, the air pressure command unit 64 converts the command air pressure into a command voltage and inputs the command voltage to the air pressure adjustment unit 51 of the electro-pneumatic regulator 5.

[0058] The storage unit 70 is a recording medium that records various information. The storage unit 70 is realized, for example, by a flash memory, a solid-state device (SSD), a hard disk, or other storage device, or by an appropriate combination thereof. For example, the storage unit 70 stores a production program 71, an operation pattern L1, a physical quantity threshold value P1, a first limit setting height HL1, a second limit setting height HL2, and push-in times TP1 and TP2. The storage unit 70 also stores information on the type, mounting position, mounting order, and load capacity of the component 85, as well as the type, thickness, and size of the board 80.

[0059] Operation pattern L1 is a predetermined movement of press head 11 during component mounting. In operation pattern L1, control unit C1 lowers press head 11 until the height of the bottom surface of component 85 held by press head 11 reaches a predetermined height (first limit setting height HL1) for component mounting. When the height of the bottom surface of component 85 held by press head 11 reaches first limit setting height HL1, press head 11 presses component 85 into board 80 at the predetermined component mounting position for a predetermined pressing time TP1, thereby performing component mounting. After component mounting, press head 11 rises.

[0060] The physical quantity threshold P1 is the magnitude of the physical quantity at which the component 85 can be placed on the substrate 80. For example, the threshold P1 is determined to be the magnitude of the physical quantity at which the component 85 can be placed on the substrate 80 with good quality. For example, the threshold P1 is the magnitude of the physical quantity at which the component 85 can be placed with good quality while being pressed into the substrate 80. For example, the physical quantity is proportional to the load on the component 85 when the component 85 is placed on the substrate 80. In this embodiment, the threshold P1 will be described as the threshold of the air pressure P applied to the nozzle 30.

[0061] The first limit setting height HL1 is a predetermined height of the bottom surface of the component 85 held by the press head 11 when component mounting is performed based on the operation pattern L1. The first limit setting height HL1 may be the lowest height of the bottom surface of the component 85 held by the press head 11 during operation pattern L1. For example, the first limit setting height HL1 is lower than the height of the top surface of the unwarped substrate 80 and higher than the height of the bottom surface of the substrate 80. The first limit setting height HL1 may be a height that is lower than the height H1 of the top surface of the substrate 80 by a predetermined distance D1. For example, the predetermined distance D1 is 0.20 mm or more and 0.40 mm or less. Preferably, the predetermined distance D1 is 0.25 mm or more and 0.35 mm or less. More preferably, the predetermined distance D1 may be 0.29 mm or more and 0.31 mm or less.

[0062] The second limit setting height HL2 is the lowest height to which the press head 11 can descend when the press head 11 moves up and down without following the operation pattern L1. That is, the second limit setting height HL2 is the limit value for the height to which the press head 11 can descend when the press head 11 is lowered so that the height of the lower surface of the component 85 held by the press head 11 is positioned below the first limit setting height HL1. The second limit setting height HL2 is lower than the first limit setting height HL1. For example, the second limit setting height HL2 is lower than the minimum height, which is the height of the lowest part of the upper surface of the board 80 on which the component 85 is mounted. For example, the second limit setting height HL2 is lower than the height of the upper surface of the most downwardly convex part of the board 80 that has a downward bow. When the height of the lower surface of the component 85 held by the pressing head 11 reaches a first limit setting height HL1 and the physical quantity that changes in association with the operation of the nozzle 30 is not equal to or greater than a threshold value P1, the control unit C1 controls the pressing head 11 to be able to descend so that the height of the lower surface of the component 85 held by the pressing head 11 is positioned up to a second limit setting height HL2.

[0063] The second limit setting height HL2 may be higher than the minimum height of the upper surface of the substrate 80. For example, the lowering of the press head 11 may be limited by a mechanical restriction. Therefore, the minimum height of the upper surface of the substrate 80 may be lower than the height of the lower surface of the component 85 held by the press head 11 when the lowering of the press head 11 is limited by the mechanical restriction. In this case, the second limit setting height HL2 may be set to the height of the lower surface of the component 85 held by the press head 11 when the lowering of the press head 11 is limited by the mechanical restriction. Furthermore, for example, the second limit setting height HL2 may be determined from information about the substrate 80 stored in the memory unit 70 of the control unit C1.

[0064] The pressing time TP1 is the time during which the pressing head 11 moves up and down based on a predetermined operation pattern L1, and when the physical quantity measured by the measuring unit 52 becomes equal to or greater than a threshold value P1, the pressing head 11 stops descending. For example, it is the time during which the pressing head 11 stops descending when the air pressure P applied to the nozzle 30 becomes equal to or greater than the threshold value P1. During the pressing time TP1, the control unit C1 regulates the air pressure P applied to the nozzle 30.

[0065] The pressing time TP2 is the time during which the lowering of the pressing head 11 is stopped when the height of the bottom surface of the component 85 held by the pressing head 11 is lower than the first limit setting height HL1 and the physical quantity measured by the measuring unit 52 is equal to or greater than the threshold value P1. During the pressing time TP2, the control unit C1 regulates the air pressure P applied to the nozzle 30.

[0066] For example, the pressing time TP2 may be different from the pressing time TP1. For example, the pressing time TP2 may be equal to or shorter than the pressing time TP1. For example, the pressing time TP2 may be determined based on the amount of descent of the bottom surface of the component 85 held by the pressing head 11 from the first limit setting height HL1. For example, the pressing time TP2 may be determined based on information about the substrate 80 or the component 85 stored in the memory unit 70.

[0067] The pressing time TP2 may be equal to the pressing time TP1.

[0068] An example of the operation of the component mounting device 1A will be described.

[0069] FIG. 5 is a flow diagram of component mounting by the component mounting device 1A according to the first embodiment of the present disclosure.

[0070] As shown in FIG. 5, the component mounting operation includes a component holding step (S11), an air pressure adjusting step (S12, S13), a first component lowering step (S14, S15), a first height determining step (S16), a second component lowering step (S17), a physical quantity determining step (S18), a third component lowering step (S19), a second height determining step (S20), a component pressing step (S21), and a component releasing step (S22).

[0071] First, in the component holding step, the control unit C1 holds the component 85 by the pressing head 11 (S11). For example, the control unit C1 moves the pressing head 11 to above the component supply unit 4, and causes the nozzle 30 to suck and hold the upper surface of the component 85 at the component supply position.

[0072] Next, in the air pressure adjusting step, the control unit C1 determines the command air pressure P0 (S12). For example, the command air pressure P0 may be determined based on information about the parts 85 stored in the storage unit .

[0073] Next, the control unit C1 adjusts the air pressure P in the balloon 22 based on the command air pressure P0 in accordance with the command air pressure P0 (S13). Specifically, the control unit C1 converts the command air pressure P0 into a command voltage and inputs the command voltage P0 to the electro-pneumatic regulator 5. In accordance with the input command voltage, the air pressure adjustment unit 51 adjusts the air pressure P inside the balloon 22 to the command air pressure P0. When the air pressure P reaches the command air pressure P0, the adjustment of the air pressure P by the air pressure adjustment unit 51 may be terminated. Note that if the air pressure P inside the balloon 22 significantly deviates from the command air pressure P0 after reaching the command air pressure P0, the air pressure P inside the balloon 22 may be readjusted to the command air pressure P0.

[0074] Subsequently, in the first component lowering step, the control unit C1 aligns the substrate 80 with the component 85 based on the production program 71 (S14).

[0075] Next, the pressing head 11 starts to descend (S15). The control unit C1 lowers the pressing head 11 based on a predetermined operation pattern L1 that lowers the pressing head 11 until the height of the lower surface of the component 85 held by the pressing head 11 reaches the first limit setting height HL1.

[0076] Next, in a height determination step, the control unit C1 determines whether the height of the bottom surface of the component 85 held by the press head 11 has reached a first limit setting height HL1 (S16). For example, the control unit C1 obtains the height of the press head 11 using the encoder of the lifting unit 40. The control unit C1 also reads the first limit setting height HL1 from the storage unit 70 and compares the height of the bottom surface of the component 85 held by the press head 11 with the first limit setting height HL1. For example, the control unit C1 calculates the difference between the height of the bottom surface of the component 85 held by the press head 11 and the first limit setting height HL1, and determines whether the difference is zero.

[0077] In step S16, if the control unit C1 determines that the height of the lower surface of the component 85 held by the pressing head 11 has not reached the first limit setting height HL1 (if the determination is No), the component mounting operation proceeds to step S17. In step S16, if the control unit C1 determines that the height of the lower surface of the component 85 held by the pressing head 11 has reached the first limit setting height HL1 (if the determination is Yes), the component mounting operation proceeds to step S18.

[0078] If the determination result in step S16 is No, in the second component lowering step, the control unit C1 further lowers the press head 11 (S17). Subsequently, the control unit C1 returns the component mounting operation to step S16. The component mounting operation repeats steps S16 and S17 until the control unit C1 determines that the height of the bottom surface of the component 85 held by the press head 11 has reached the first limit setting height HL1.

[0079] Next, in a physical quantity determination step, the control unit C1 acquires the physical quantity measured by the measurement unit 52 and determines whether the physical quantity is equal to or greater than a threshold value P1 (S18). For example, the control unit C1 acquires the magnitude of the air pressure P inside the balloon 22 measured by the measurement unit 52. The control unit C1 also reads out the threshold value P1 of the physical quantity from the storage unit 70 and compares the magnitude of the air pressure P with the threshold value P1. For example, the control unit C1 calculates the difference between the threshold value P1 and the magnitude of the air pressure P inside the balloon, and determines whether the magnitude of the air pressure P is equal to or greater than the threshold value P1 based on the difference.

[0080] In step S18, if the control unit C1 determines that the physical quantity measured by the measurement unit 52 is not equal to or greater than the threshold value P1 (if the determination is No), the component mounting operation proceeds to step S19. In step S18, if the control unit C1 determines that the physical quantity P measured by the measurement unit 52 is equal to or greater than the threshold value P1 (if the determination is Yes), the component mounting operation proceeds to step S21.

[0081] If the determination result in step S18 is No, in the third component lowering step, the control unit C1 further lowers the pressing head 11 (S19).

[0082] Next, in a second height determination step, the control unit C1 determines whether the height of the bottom surface of the component 85 held by the press head 11 is located at a second limit setting height HL2 (S20). For example, the control unit C1 obtains the height of the press head 11 using the encoder of the lifting unit 40. The control unit C1 also reads the second limit setting height HL2 from the storage unit 70 and compares the height of the bottom surface of the component 85 held by the press head 11 with the second limit setting height HL2. For example, the control unit C1 calculates the difference between the height of the bottom surface of the component 85 held by the press head 11 and the second limit setting height HL2, and determines whether the difference is zero.

[0083] In step S20, if the control unit C1 determines that the height of the lower surface of the component 85 held by the press head 11 is not at the second limit setting height HL2 (if the determination is No), the component mounting operation continues to lower the press head 11, and returns to step S18. In step S20, if the control unit C1 determines that the height of the lower surface of the component 85 held by the press head 11 is at the second limit setting height HL2 (if the determination is Yes), the control unit C1 outputs an ERROR. For example, the control unit C1 may output the ERROR as a signal to an external device.

[0084] In the component pressing step, the control unit C1 stops the descent of the press head 11 during pressing times TP1 and TP2 and regulates the air pressure P applied to the nozzle 30 (S21). For example, when the height of the bottom surface of the component 85 held by the press head 11 reaches the first limit setting height HL1 and the physical quantity measured by the measurement unit 52 is equal to or greater than the threshold value P1, the control unit C1 stops the descent of the press head 11 during the pressing time TP1 and regulates the air pressure P applied to the nozzle 30. When the height of the bottom surface of the component 85 held by the press head 11 is below the first limit setting height HL1 and the physical quantity is equal to or greater than the threshold value P1, the control unit C1 stops the descent of the press head 11 during the pressing time TP2 and regulates the air pressure P applied to the nozzle 30.

[0085] Subsequently, in the component release step, the control unit C1 raises the pressing head 11 (S22).

[0086] Next, an example of the operation of the pressing head 11 when the determination result in step S18 is Yes will be described with reference to Fig. 6. For example, the determination result in step S18 is Yes when the component mounting device 1A mounts the component 85 on the substrate 80 that is not warped or is relatively small in warp.

[0087] FIG. 6 is a graph showing the trajectory of the nozzle 30 and the change in the air pressure P applied to the nozzle 30 when the component mounting device 1A of the first embodiment of the present disclosure raises and lowers the pressing head 11 in a predetermined operation pattern L1 on a substrate 80 that is not warped.

[0088] 6(A) and 6(B), the press head 11 operates according to operation pattern L1 stored in the memory unit 70. For example, in operation pattern L1, when the height of the lower surface of the component 85 held by the press head 11 reaches a predetermined height (H0) (T1) in the first component lowering step (S15), the control unit C1 may control the descent speed of the press head 11 to slow down.

[0089] When the height of the bottom surface of the component 85 held by the press head 11 reaches the first limit setting height HL1 (T3) and the air pressure P is equal to or greater than the threshold value P1, the control unit C1 stops the press head 11 for a pressing time TP1 (S21). The pressing time TP1 is a predetermined time in the operation pattern L1 from when the air pressure P becomes equal to or greater than the threshold value P1 (T3). For example, the control unit C1 controls the elevation of the lifting unit 40 to stop the press head 11. For example, while the press head 11 is stopped, the control unit C1 regulates the air pressure P applied to the nozzle 30. For example, while the press head 11 is stopped, the control unit C1 obtains a measurement result from the measurement unit 52 of the electro-pneumatic regulator 5. The control unit C1 then calculates the difference between the measurement result obtained from the measurement unit 52 and the threshold value P1 stored in the memory unit 70. If the control unit C1 determines that there is a difference between the measurement result of the measurement unit 52 and the threshold value P1, the control unit C1 inputs a voltage based on the threshold value P1 to the air pressure adjustment unit 51 of the electro-pneumatic regulator 5. In response to the input voltage, the air pressure adjustment unit 51 adjusts the air pressure P inside the balloon 22 to the threshold value P1. When the air pressure P reaches the threshold value P1, the adjustment of the air pressure P by the air pressure adjustment unit 51 may be terminated. Note that if the air pressure P significantly deviates from the threshold value P1 after reaching the threshold value P1, the control unit C1 may readjust the air pressure P to the threshold value P1. For example, if the error between the air pressure P and the threshold value P1 is not within ±8%, the control unit C1 may readjust the air pressure P to the threshold value P1. Preferably, for example, if the error between the air pressure P and the physical quantity threshold value P1 is not within ±5%, the control unit C1 may readjust the air pressure P to the threshold value P1. More preferably, for example, when the error between the air pressure P and the threshold value P1 is not within ±3%, the control unit C1 may readjust the air pressure P so that it becomes equal to the threshold value P1.

[0090] After the pressing time TP1 has elapsed (T4), the control unit C1 raises the pressing head 11 (S22).

[0091] Next, an example of the operation of the pressing head 11 when the determination result in step S18 is No will be described with reference to Fig. 7. For example, the determination result in step S18 is No when the component mounting device 1A mounts the component 85 on the board 80 that has a downward warp.

[0092] FIG. 7 is a graph showing the trajectory of the nozzle 30 and the change in the air pressure P applied to the nozzle 30 when the component mounting device 1A of the first embodiment of the present disclosure raises and lowers the pressing head 11 relative to the substrate 80 that has undergone downward warping.

[0093] As shown in FIGS. 7(A) and 7(B), the pressing head 11 operates according to an operation pattern L1 stored in the storage unit .

[0094] When the height of the underside of the part 85 held by the pressing head 11 reaches the first limit setting height HL1 (T3), if the air pressure P is not equal to or greater than the threshold value P1, the control unit C1 controls the raising and lowering of the pressing head 11 without following the operation pattern L1.

[0095] The control unit C1 lowers the pressing head 11 so that the height of the lower surface of the component 85 held by the pressing head 11 is positioned further below the first limit setting height HL1 (S19).

[0096] The control unit C1 stops the pressing head 11 for a pressing time TP2 (S21) from the time when the air pressure P reaches the threshold value P1 (T13).

[0097] After the pressing time TP2 has elapsed (T14), the control unit C1 raises the pressing head 11 (S22).

[0098] An example of the component mounting operation of the press head 11 when the determination result in step S20 is Yes will be described with reference to FIG.

[0099] FIG. 8 is a graph showing the trajectory of the nozzle 30 and the change in the air pressure P applied to the nozzle 30 when the component mounting device 1A according to the first embodiment of the present disclosure raises and lowers the pressing head 11 to the substrate 80 located at a height lower than the second limit setting height HL2.

[0100] As shown in Figures 8(A) and 8(B), when the height H2 of the mounting position of the component 85 on the substrate 80 is lower than the second limit setting height HL2, the height of the lower surface of the component 85 held by the pressing head 11 is positioned at the second limit setting height HL2 before the air pressure P reaches or exceeds the threshold value P1.

[0101] The control unit C1 outputs an ERROR signal when it determines that the height of the lower surface of the component 85 held by the press head 11 is at the second limit setting height HL2. For example, the control unit C1 may output an ERROR signal when the height of the lower surface of the component 85 held by the press head 11 is at the second limit setting height HL2 (T23), or may output an ERROR signal after T23. For example, the component mounting device 1A may or may not stop while the control unit C1 is outputting an ERROR signal. For example, the component mounting device 1A may be provided with an ERROR board ejection mechanism that ejects a board 80 for which an ERROR signal has been issued. The ejection mechanism allows the component mounting operation to continue without stopping the component mounting device 1A. For example, the ejection mechanism may be provided with a counter, and the component mounting device 1A may stop when multiple ERROR boards are ejected consecutively from the ejection mechanism. For example, the component mounting device 1A may stop when five ERROR boards are ejected consecutively from the ejection mechanism.

[0102] The control unit C1 may or may not stop the press head 11 when the height of the bottom surface of the component 85 held by the press head 11 reaches the second limit setting height HL2. For example, the control unit C1 may raise the press head 11 after a stop time TP3 has elapsed from T23 (T24), as in the trajectory L2B of the nozzle 30. For example, the press head 11 may be raised when the height of the bottom surface of the component 85 held by the press head 11 reaches the second limit setting height HL2 (T23), as in the trajectory L3 of the nozzle 30. In other words, the stop time TP3 may be 0 seconds.

[0103] The component mounting device 1A according to the first embodiment of the present disclosure can provide the following effects.

[0104] The component mounting device 1A includes a press head 11 having a nozzle 30, a lifting unit 40, an air pressure adjusting unit 51, and a control unit C1. The nozzle 30 presses a component 85 against a substrate 80 using an applied air pressure P. The press head 11 can be raised and lowered relative to the substrate 80. The lifting unit 40 raises and lowers the press head 11. The air pressure adjusting unit 51 adjusts the air pressure P applied to the nozzle 30. The measurement unit 52 measures a physical quantity that changes in association with the operation of the nozzle 30. The control unit C1 controls the lifting unit 40 and the air pressure adjusting unit 51. The control unit C1 raises and lowers the press head 11 based on a predetermined operation pattern L1 that lowers the press head 11 until the height of the bottom surface of the component 85 held by the press head 11 reaches a first limit setting height HL1. The control unit C1 determines whether the physical quantity measured by the measurement unit 52 is equal to or greater than a threshold value P1. When the height of the lower surface of the part 85 held by the pressing head 11 reaches the first limit setting height HL1 and the physical quantity is not equal to or greater than the threshold value P1, the control unit C1 lowers the pressing head 11 so that the height of the lower surface of the part 85 held by the pressing head 11 falls below the first limit setting height HL1.

[0105] With this configuration, the component mounting device 1A can mount components 85 with high quality on the board 80 that has a downward warp.

[0106] The control unit C1 may control the pressing head 11 to be able to descend so that, when the height of the lower surface of the part 85 held by the pressing head 11 reaches a first limit setting height HL1 and the air pressure P inside the balloon 22 is not equal to or greater than the physical quantity threshold P1, the height of the lower surface of the part 85 held by the pressing head 11 is positioned up to a second limit setting height HL2 that is lower than the first limit setting height HL1.

[0107] With this configuration, the component mounting device can lower the press head 11 and mount the component 85 at a height suitable for mounting the component 85 even on a substrate 80 that has a downward warp.

[0108] The second limit setting height HL2 may be a height lower than the minimum height, which is the height of the lowest part of the upper surface of the board 80 on which the component 85 is mounted.

[0109] By defining the second limit setting height HL2 in this way, components can be mounted with a predetermined push-in amount even on a board 80 that has a large downward warp.

[0110] Component mounting apparatus 1A may further include a contact detection unit 45 that detects that component 85 held by nozzle 30 has come into contact with substrate 80. When measurement unit 52 detects that substrate 80 has come into contact with component 85 held by nozzle 30, it may start measuring physical quantity P that changes in relation to the operation of nozzle 30.

[0111] With this configuration, the air pressure P inside the balloon 22 can be measured by the measuring unit 52 over a fixed period of time and the control unit C1 can make a determination, improving the efficiency of the control unit C1. Also, it is possible to detect that the substrate 80 is warped upward and that the component 85 held by the nozzle 30 has come into contact with the substrate 80 before reaching the first limit setting height HL1. Therefore, even if the substrate 80 is warped upward, component mounting can be performed with a predetermined physical amount.

[0112] When the air pressure P reaches a threshold value P1 and the height of the underside of the component 85 held by the pressing head 11 is lower than the first limit setting height HL1, the control unit C1 stops the descent of the pressing head 11 for the pressing time TP2 and regulates the air pressure P applied to the nozzle 30.

[0113] With this configuration, components 85 can be placed with a predetermined push-in amount on board 80. Furthermore, by providing push-in time TP2, components can be placed with higher quality.

[0114] When the height of the bottom surface of the component 85 held by the press head 11 reaches the first limit setting height HL1 and the physical quantity P is equal to or greater than the threshold value P1, the control unit C1 stops the descent of the press head 11 and regulates the air pressure P applied to the nozzle 30 for a pressing time TP1. When the physical quantity P reaches the threshold value P1 at a position where the height of the bottom surface of the component 85 held by the press head 11 is lower than the first limit setting height HL1, the control unit C1 stops the descent of the press head 11 and regulates the air pressure P applied to the nozzle 30 for a pressing time TP2. The pressing times TP1 and TP2 may be different.

[0115] By making the pressing time TP1 and the pressing time TP2 different, it is possible to mount components with a pressing time that corresponds to the state of warpage of the substrate 80. This allows for higher quality component mounting.

[0116] The physical quantity that changes in relation to the operation of the nozzle 30 may include the air pressure P that is applied to the nozzle 30 .

[0117] By using the air pressure P applied to the nozzle 30 as a physical quantity that changes in relation to the operation of the nozzle 30, the control unit C1 can control the lifting and lowering movement in accordance with the movement of placing the component 85 on the substrate 80.

[0118] In the present embodiment, an example has been described in which component mounting device 1A includes board transport mechanism 3, component supply unit 4, head moving mechanism 7, head camera 15, component recognition camera 16, and contact detection unit 45, but the present invention is not limited to this. For example, component mounting device 1A does not necessarily have to include board transport mechanism 3, component supply unit 4, head moving mechanism 7, head camera 15, component recognition camera 16, and / or contact detection unit 45.

[0119] Although the component mounting device 1A is provided with the control unit C1 in the above example, the present invention is not limited to this. For example, the control unit C1 may be provided in a device separate from the component mounting device 1A.

[0120] Although the example in which the head unit 10 includes a plurality of pressing heads 11 has been described, the present invention is not limited to this. For example, the head unit 10 may include one pressing head 11.

[0121] Although the lifting unit 40 has been described as including a motor and a ball screw driven by the motor, the present invention is not limited to this. For example, the lifting unit 40 may include a linear motor, and the pressing head 11 may be raised and lowered by the linear motor.

[0122] Although the contact detection unit 45 has been described as being attached to the nozzle 30 provided in the press head 11, this is not limiting. For example, the contact detection unit 45 may be provided inside the press head 11. For example, contact of the component 85 held by the press head 11 with the substrate 80 may be detected based on the relative position difference between the piston 23 and the nozzle 30 provided in the press head 11.

[0123] Although the component mounting device 1A has been described as an example in which the component 85 is mounted on the non-warped substrate 80 using the predetermined operation pattern L1, the present invention is not limited to this. For example, the component mounting device 1A may mount the component 85 on the substrate 80 with a relatively small warp using the predetermined operation pattern L1.

[0124] Although the air pressure P inside the balloon 22 has been described as the physical quantity that changes in relation to the operation of the nozzle 30, the physical quantity that changes in relation to the operation of the nozzle 30 is not limited to this. For example, the physical quantity that changes in relation to the operation of the nozzle 30 may be the relative difference between the piston 23 provided in the pressing head 11 and the nozzle 30.

[0125] In step S13 of the component mounting operation, there may be an error between the air pressure P in the balloon 22 based on the command air pressure P0 and the actually adjusted air pressure P inside the balloon 22. For example, the error between the air pressure P in the balloon 22 based on the command air pressure P0 and the actually adjusted air pressure P inside the balloon 22 may be ±8% or less. Preferably, the error between the air pressure P in the balloon 22 based on the command air pressure P0 and the actually adjusted air pressure P inside the balloon 22 may be ±5% or less. More preferably, the error between the air pressure P in the balloon 22 based on the command air pressure P0 and the actually adjusted air pressure P inside the balloon 22 may be ±3% or less.

[0126] Although the substrate 80 having a downward warp has been described as the substrate 80 having a warp, the substrate 80 may have an upward warp. For example, if the control unit C1 determines that the physical quantity is equal to or greater than the threshold value P1 before the height of the bottom surface of the component 85 held by the press head 11 reaches the first limit setting height HL1, the press head 11 may be stopped before the height of the bottom surface of the component 85 held by the press head 11 reaches the first limit setting height HL1.

[0127] In this embodiment, the first limit setting height HL1 and the second limit setting height HL2 have been described as the height of the lower surface of the component 85 held by the press head 11 from the substrate 80, but they do not have to be the height of the component 85 held by the press head 11. For example, they may be the height of the tip of the nozzle 30.

[0128] (Embodiment 2) A component mounting system according to a second embodiment of the present disclosure will be described. In the second embodiment, the same or equivalent configurations as those in the first embodiment will be denoted by the same reference numerals. Also, in the second embodiment, descriptions that overlap with those in the first embodiment will be omitted.

[0129] FIG. 9 is a schematic block diagram showing a main configuration of a component mounting system 100A according to the second embodiment of the present disclosure.

[0130] The second embodiment differs from the first embodiment in that the component mounting system 100A includes a component mounting device 1B and a control unit C2 that is separate from the component mounting device 1B.

[0131] As shown in FIG. 9, the component mounting system 100A includes a component mounting device 1B and a control unit C2 that controls the component mounting device 1B.

[0132] The component mounting device 1B is controlled by a control unit C2 in its operation. In the second embodiment, the component mounting device 1B does not include a control unit.

[0133] Component mounting device 1B includes a first communication unit 91 that communicates with control unit C2. For example, component mounting device 1B receives an operation command from control unit C2 via first communication unit 91 and operates based on the operation command. Furthermore, component mounting device 1B transmits, via first communication unit 91 to control unit C2, height information of press head 11, height information of the bottom surface of component 85 held by press head 11, detection results of contact detection unit 45, measurement results of measurement unit 52, and the like.

[0134] The first communication unit 91 communicates with the control unit C2 via a network. The first communication unit 91 includes a circuit that performs communication in accordance with a predetermined communication standard (for example, LAN, Wi-Fi (registered trademark), or Bluetooth (registered trademark)).

[0135] The component mounting device 1B has the same configuration as the component mounting device 1A of the first embodiment, except that it is controlled by the control unit C2 and includes a first communication unit 91.

[0136] The control unit C2 controls the component mounting device 1B. The control unit C2 is provided in a device separate from the component mounting device 1B. The control unit C2 includes a second communication unit 92 that communicates with a first communication unit 91 of the component mounting device 1B. For example, the second communication unit transmits operation commands for each component of the component mounting device 1A of the control unit C2 to the first communication unit 91. The control unit C2 also receives, via the second communication unit 92, information on the height of the press head 11, information on the height of the bottom surface of the component 85 held by the press head 11, the detection results of the contact detection unit 45, and the measurement results of the measurement unit 52 from the first communication unit 91. The control unit C2 generates operation commands to control the component mounting device 1B based on the information received from the first communication unit 91.

[0137] The second communication unit 92 communicates with the component mounting device 1B via a network. The second communication unit 92 includes a circuit for performing communication in accordance with a predetermined communication standard (for example, LAN, Wi-Fi (registered trademark), Bluetooth (registered trademark)).

[0138] The control unit C2 has the same configuration as the control unit C1 of the first embodiment, except that it includes a second communication unit 92.

[0139] The control unit C2 is, for example, a computer. For example, the control unit C2 may be a server or a cloud.

[0140] The component mounting system 100A according to the second embodiment of the present disclosure can provide the following effects.

[0141] The component mounting system 100A includes a component mounting device 1B and a control unit C2 that is separate from the component mounting device 1B. The control unit C2 controls the operation of the component mounting device 1B.

[0142] With this configuration, the component mounting system 100A can mount components 85 with high quality on the board 80 that has a downward warp.

[0143] Because component mounting device 1B does not include control unit C2, component mounting device 1B can be made smaller than component mounting device 1A of embodiment 1. Furthermore, component mounting device 1B and control unit C2 can be disposed in different positions. Therefore, when installation space is limited, component mounting device 1B can be installed in the installation space, and control unit C2 can be installed in a separate location different from the installation space.

[0144] In the second embodiment, the number of component mounting devices 1B included in the component mounting system 100A is not limited to one, but may be two or more. In other words, the control unit C2 can control a plurality of component mounting devices 1B.

[0145] 9 includes the component mounting processing unit 60, the physical quantity adequacy determination unit 62, and the storage unit 70. However, the present invention is not limited to this. For example, the component mounting processing unit 60, the physical quantity adequacy determination unit 62, and / or the storage unit 70 may be provided in separate devices. The separate devices may be electrically connected to the control unit C2.

[0146] Note that some of the components of the control unit C2 may be included in the component mounting device 1 B. For example, the component mounting device 1 B may include a physical quantity appropriateness determination unit 62.

[0147] 9 is provided with the board transport mechanism 3, the component supply unit 4, the electro-pneumatic regulator 5, the pressing head 11, the head camera 15, and the component recognition camera 16. However, the present invention is not limited to this. For example, the board transport mechanism 3, the component supply unit 4, the electro-pneumatic regulator 5, the pressing head 11, the head camera 15, and the component recognition camera 16 may be provided in a device separate from the component mounting device 1B.

[0148] Although the first communication unit 91 and the second communication unit 92 have been described as communicating via a network, this is not limiting. For example, the first communication unit 91 and the second communication unit 92 may be connected by wire, and transmission and reception may be performed from both sides.

[0149] The following describes modified examples. <Variation 1>

[0150] FIG. 10 is a schematic block diagram showing the main configuration of a component mounting device 1C of the first modification.

[0151] 10, a component mounting device 1C of the first modification includes a height detection sensor 19. In addition, a control unit C3 of the component mounting device 1C includes an updating unit 68.

[0152] The height detection sensor 19 detects the height of the upper surface of the substrate 80. For example, the height detection sensor 19 detects the minimum height, which is the lowest height of the upper surface of the substrate 80. For example, the height detection sensor 19 may detect the height of a position on the substrate 80 where a component 85 is to be placed.

[0153] The height detection sensor 19 may detect the minimum height, which is the lowest height of the upper surface of each of the plurality of substrates 80, or for each type of the plurality of substrates 80. For example, the height detection sensor 19 may detect the height for each production lot of the substrates 80. When the lot number of the substrate 80 on which the production lot number is printed changes, the height detection sensor 19 may detect the minimum height of the substrate 80.

[0154] The control unit C3 has a configuration in which an update unit 68 is further provided in addition to the control unit C1 of the component mounting device 1A in the first embodiment.

[0155] The updating unit 68 updates the second limit setting height HL2 based on the result of detection by the height detection sensor 19. For example, the updating unit 68 may update the second limit setting height HL2 at the timing of detection by the height detection sensor 19. For example, the updating unit 68 may update the second limit setting height HL2 when the lot number of the board 80 on which the production lot number is printed changes. For example, when the minimum height of the board 80 detected by the height detection sensor 19 is located at a height lower than the lowering limit height of the height information of the lower surface of the component 85 held by the press head 11, the updating unit 68 may update the second limit setting height HL2 as the lowering limit height of the height information of the lower surface of the component 85 held by the press head 11.

[0156] According to the component mounting device 1C of the first modification, the following effects can be achieved.

[0157] The component mounting device 1C is a component mounting device that further includes a height detection sensor 19 that detects the height of the upper surface of the substrate 80 in addition to the component mounting device 1A described in the first embodiment. The control unit C3 may update the second limit setting height HL2 based on the result detected by the height detection sensor 19.

[0158] With this configuration, the component mounting device 1C can mount components 85 with higher quality on the board 80 that has a downward warp.

[0159] The height detection sensor 19 may detect the minimum height, which is the lowest height of the upper surface of each of the plurality of substrates 80 or for each type of the plurality of substrates 80 .

[0160] This configuration allows components 85 to be mounted with higher quality. For example, detecting the minimum height of the top surface of each of the multiple boards 80 using the height detection sensor 19 allows the second limit setting height HL2 to be determined more accurately than not detecting the minimum height of the top surface of the board 80 using the height detection sensor 19. Therefore, components 85 can be mounted with higher quality on the boards 80, even when warpage occurs due to individual differences between the multiple boards 80. Furthermore, the positions at which warpage occurs and the amount of warpage displacement may be similar for multiple boards 80. For example, boards 80 from the same lot or type may be similar. In this case, detecting the minimum height of the boards 80 for each lot or type of multiple boards 80 using the height detection sensor 19 allows for more efficient height detection than detecting the height for each board 80. In other words, by detecting the minimum height of the boards 80 for each lot or type of multiple boards 80, the component mounting device 1C can mount components 85 on the boards 80 with high quality and efficiency.

[0161] In the first modification, the component mounting device 1C is described as being the component mounting device 1A of the first embodiment of the present disclosure further equipped with the height detection sensor 19 and the update unit 68. However, the component mounting system 100A of the second embodiment of the present disclosure may further be provided with the height detection sensor 19 and the update unit 68.

[0162] The control unit C3 may detect the minimum height of the upper surface of the substrate 80 using the height detection sensor 19 and update the first limit setting height HL1 based on the minimum height. For example, when the lot or type of the substrate 80 changes, the first limit setting height HL1 may be updated based on the minimum height of the upper surface of the substrate 80 detected by the height detection sensor 19.

[0163] As used herein, terms such as "first," "second," etc. are used for descriptive purposes only and should not be understood as expressing or implying the relative importance or ranking of technical features. Features qualified as "first" and "second" expressly or imply the inclusion of one or more of such features.

[0164] Although the present disclosure has been fully described in connection with the preferred embodiments with reference to the accompanying drawings, various changes and modifications will be apparent to those skilled in the art, and it is to be understood that such changes and modifications are included within the scope of the present invention as defined by the appended claims unless they depart therefrom.

[0165] (Outline of the embodiment) (1) A component mounting device disclosed herein includes a press head having a nozzle that presses a component onto a substrate based on an applied air pressure and that can be raised and lowered relative to the substrate, an elevating unit that raises and lowers the press head, an air pressure adjusting unit that adjusts the air pressure applied to the nozzle, a measuring unit that measures a physical quantity that changes in accordance with the operation of the nozzle, and a control unit that controls the elevating unit and the air pressure adjusting unit. The control unit raises and lowers the press head based on a predetermined operation pattern that lowers the press head until the height of the underside of the component held by the press head reaches a first set limit height, determines whether the physical quantity measured by the measuring unit is equal to or greater than a threshold value, and lowers the press head so that the height of the underside of the component held by the press head is below the first set limit height when the height of the underside of the component reaches the first set limit height and the physical quantity is not equal to or greater than the threshold value.

[0166] (2) In the component mounting device of (1), the control unit may control the pressing head to be able to descend when the height of the lower surface of the component held by the pressing head reaches the first limit setting height and the physical quantity is not equal to or greater than the threshold value, so that the height of the lower surface of the component held by the pressing head is positioned at a second limit setting height that is lower than the first limit setting height.

[0167] (3) In the component mounting device of (2), the second limit setting height may be lower than a minimum height, which is the height of the lowest part of the upper surface of the board on which the component is to be mounted.

[0168] (4) In any one of the component mounting devices (1) to (3), a contact detection unit may be further provided that detects that the component held by the nozzle has come into contact with the substrate, and the measurement unit may start measuring the physical quantity when it detects that the substrate has come into contact with the component held by the nozzle.

[0169] (5) In any one of the component mounting devices (1) to (4), when the height of the lower surface of the component held by the pressing head is at a position lower than the first limit setting height and the physical quantity reaches the threshold value, the control unit may stop the descent of the pressing head for a pressing time and regulate the air pressure applied to the nozzle.

[0170] (6) In the component mounting device of any one of (1) to (4), the control unit may stop the descent of the press head and regulate the air pressure applied to the nozzle for a first pressing time when the height of the lower surface of the component held by the press head reaches the first limit setting height and the physical quantity is equal to or greater than the threshold. The control unit may stop the descent of the press head and regulate the air pressure applied to the nozzle for a second pressing time when the height of the lower surface of the component held by the press head is lower than the first limit setting height and the physical quantity reaches the threshold. The first pressing time and the second pressing time may be different.

[0171] (7) In the component mounting device of (3), a height detection sensor may be further provided for detecting the height of the upper surface of the substrate, and the control unit may update the second limit setting height based on the result detected by the height detection sensor.

[0172] (8) In the component mounting device of (7), the height detection sensor may detect the minimum height for each of the plurality of boards or for each type of the plurality of boards.

[0173] (9) In the component mounting device of any one of (1) to (8), the physical quantity may include the air pressure applied to the nozzle.

[0174] (10) A component mounting system according to the present disclosure includes a press head having a nozzle that presses a component onto a substrate based on an applied air pressure and that can be raised and lowered relative to the substrate, an elevating unit that raises and lowers the press head, an air pressure adjusting unit that adjusts the air pressure applied to the nozzle, a measuring unit that measures a physical quantity that changes in relation to the operation of the nozzle, and a control unit that controls the elevating unit and the air pressure adjusting unit. The control unit raises and lowers the press head based on a predetermined operation pattern that lowers the press head until the height of the underside of the component held by the press head reaches a first set limit height, determines whether the physical quantity measured by the measuring unit is equal to or greater than a threshold value, and, when the height of the underside of the component held by the press head reaches the first set limit height and the physical quantity is not equal to or greater than the threshold value, lowers the press head so that the height of the underside of the component held by the press head is below the first set limit height. [Industrial Applicability]

[0175] The component mounting device and component mounting system of the present disclosure are useful for mounting components on a warped substrate. [Explanation of symbols]

[0176] 1A, 1B, 1C component placement equipment 2 bases 3. Substrate transport mechanism 4. Parts Supply Department 5 Electro-pneumatic regulator 6 Tape Feeder 7 Head movement mechanism 8 Y-axis table 9 Beam 10 Head Unit 11 Pressing head 15 Head Camera 16 Parts Recognition Camera 19 Height detection sensor 20 Case 21 Air supply hose 22 Balloon 23 Piston 24 cylinders 30 nozzles 31 Contact member 32 Suction opening 40 Lifting section 45 Contact detection unit 51 Air pressure adjustment unit 52 Measurement section 60 Parts mounting processing section 62 Physical quantity appropriateness judgment unit 64 Air Pressure Control Unit 68 Update section 70 Memory section 71 Production Program 80 boards 85 parts 100A, 100B component mounting system C1, C2, C3 control section L1 Operation Pattern HL1 First limit setting height HL2 Second limit setting height TP1, TP2 push-in time TP3 stop time P1 Physical quantity threshold

Claims

1. a press head having a nozzle for pressing a component against a substrate based on the applied air pressure, the press head being capable of moving up and down relative to the substrate; an elevation unit that raises and lowers the pressing head; an air pressure adjusting unit that adjusts the air pressure applied to the nozzle; a measurement unit that measures a physical quantity that changes in relation to the operation of the nozzle; a control unit that controls the lifting unit and the air pressure adjusting unit; Equipped with The control unit raising and lowering the press head based on a predetermined operation pattern for lowering the press head until the height of the lower surface of the component held by the press head reaches a first limit setting height; determining whether the physical quantity measured by the measurement unit is equal to or greater than a threshold value; when the height of the lower surface of the component held by the press head reaches the first limit setting height and the physical quantity is not equal to or greater than the threshold value, lowering the press head so that the height of the lower surface of the component held by the press head is positioned below the first limit setting height. Parts mounting device.

2. when the height of the lower surface of the component held by the press head reaches the first limit setting height and the physical quantity is not equal to or greater than the threshold value, the control unit controls the press head to be able to descend until the height of the lower surface of the component held by the press head is positioned at a second limit setting height that is lower than the first limit setting height. The component mounting device according to claim 1 .

3. the second limit setting height is lower than a minimum height, which is the height of the lowest part of the upper surface of the board on which the component is mounted; The component mounting device according to claim 2 .

4. a contact detection unit that detects when the component held by the nozzle comes into contact with the board, the measurement unit starts measuring the physical quantity when it detects that the substrate has come into contact with the component held by the nozzle. The component mounting device according to claim 1 .

5. when the physical quantity reaches the threshold value when the height of the lower surface of the component held by the press head is at a position lower than the first limit setting height, the control unit stops the descent of the press head for a press-down time and regulates the air pressure applied to the nozzle. The component mounting device according to claim 1 .

6. the control unit stops the descent of the press head and regulates the air pressure applied to the nozzle for a first press-down time when the height of the lower surface of the component held by the press head reaches the first limit setting height and the physical quantity is equal to or greater than the threshold value; when the physical quantity reaches the threshold value when the height of the lower surface of the component held by the press head is at a position lower than the first limit setting height, the control unit stops the descent of the press head and regulates the air pressure applied to the nozzle for a second press-down time; The first pressing time and the second pressing time are different. The component mounting device according to claim 1 .

7. a height detection sensor for detecting the height of the upper surface of the substrate; The control unit updates the second limit setting height based on the result detected by the height detection sensor. The component mounting device according to claim 3.

8. the height detection sensor detects the minimum height of each of the plurality of substrates or for each type of the plurality of substrates; The component mounting device according to claim 7.

9. the physical quantity includes the air pressure applied to the nozzle; The component mounting device according to claim 1 .

10. a press head having a nozzle for pressing a component against a substrate based on the applied air pressure, the press head being capable of moving up and down relative to the substrate; an elevation unit that raises and lowers the pressing head; an air pressure adjusting unit that adjusts the air pressure applied to the nozzle; a measurement unit that measures a physical quantity that changes in relation to the operation of the nozzle; a control unit that controls the lifting unit and the air pressure adjusting unit; Equipped with The control unit raising and lowering the press head based on a predetermined operation pattern for lowering the press head until the height of the lower surface of the component held by the press head reaches a first limit setting height; determining whether the physical quantity measured by the measurement unit is equal to or greater than a threshold value; when the height of the lower surface of the component held by the press head reaches the first limit setting height and the physical quantity is not equal to or greater than the threshold value, lowering the press head so that the height of the lower surface of the component held by the press head is positioned below the first limit setting height. Parts mounting system.

Images