Mounting data creation method and mounting data creation device

Abstract

To provide a mounting data creation method and the like that can create mounting data that allows a component without pins to be mounted on a board with higher accuracy.SOLUTION: A mounting data creation method includes: a component information acquisition step of acquiring component information including information indicating the outer shape of the component; a board information acquisition step of acquiring board information including information indicating an area on the board where the component is to be placed; and a creation step (Steps S21 to S26) of creating mounting data for the component mounting device 20 to mount the component on the board on the basis of the outer shape of the component and the area on the board where the component is to be placed.SELECTED DRAWING: Figure 4

Description

[Technical Field]

[0001] The present disclosure relates to a mounting data creation method and a mounting data creation device. [Background technology]

[0002] Conventionally, mounting data creation methods for creating mounting data for mounting components on a board have been known. For example, Patent Document 1 discloses a mounting data creation method that calculates virtual position information of a first pin defined in association with polarity mark information in a comparison component, compares the virtual position information of the first pin with position information of the first pin of the comparison component included in CAD data used for board design, and determines from the comparison result whether the comparison component included in the mounting data is in a normal state. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2016-42524 Summary of the Invention [Problem to be solved by the invention]

[0004] However, the mounting data creation method of Patent Document 1 has the problem that it is not possible to determine whether a component that does not have a pin or polarity mark that serves as a position reference is in a normal state, and therefore it is not possible to mount the component on the board with high accuracy.

[0005] Therefore, the present disclosure provides a mounting data creation method and the like that can create mounting data that allows components that do not have pins or polarity marks that serve as positional references to be mounted on a board with higher accuracy. [Means for solving the problem]

[0006] A mounting data creation method according to one aspect of the present disclosure includes a component information acquisition step of acquiring component information including information indicating the outer shape of the component, a board information acquisition step of acquiring board information including information indicating an area on the board where the component is to be placed, and a creation step of creating mounting data for a component mounting device to mount the component on the board based on the outer shape and the area.

[0007] In addition, an implementation data creation device according to one aspect of the present disclosure includes a component information acquisition unit that acquires component information including information indicating the outer shape of the component, a board information acquisition unit that acquires board information including information indicating the area on the board where the component is to be placed, and a creation unit that creates implementation data for a component mounting device to mount the component on the board based on the outer shape and the area.

[0008] These comprehensive or specific aspects may be realized as a system, a method, an integrated circuit, a computer program, or a computer-readable recording medium such as a CD-ROM, or may be realized as any combination of the system, the method, the integrated circuit, the computer program, and the recording medium. The recording medium may also be a non-transitory recording medium. [Effects of the Invention]

[0009] The mounting data creation method and the like of the present disclosure can create mounting data that allows components that do not have pins or polarity marks that serve as positional references to be mounted on a board with greater accuracy.

[0010] Further advantages and effects of one aspect of the present disclosure will become apparent from the specification and drawings. Such advantages and / or effects are provided by some embodiments and features described in the specification and drawings, but not all of them necessarily need to be provided to obtain one or more identical features. [Brief explanation of the drawings]

[0011] [Figure 1]FIG. 1 is a block diagram showing a functional configuration of a component mounting system according to an embodiment. [Figure 2] FIG. 2 is a block diagram showing the functional configuration of the management device and the component mounting device of the component mounting system of FIG. [Figure 3] FIG. 3 is a flowchart illustrating an example of the operation of the management device of FIG. [Figure 4] FIG. 4 is a flowchart showing an example of the operation subsequent to the operation of FIG. [Figure 5] FIG. 5 is an explanatory diagram for explaining the operation of FIG. [Figure 6] FIG. 6 is a flowchart showing an example of the operation subsequent to the operation of FIG. [Figure 7] FIG. 7 is a first explanatory diagram for explaining the operation of FIG. [Figure 8] FIG. 8 is a second explanatory diagram for explaining the operation of FIG. [Figure 9] FIG. 9 is a flowchart showing an example of the operation subsequent to the operation of FIG. [Figure 10] FIG. 10 is a first explanatory diagram for explaining the operation of FIG. [Figure 11] FIG. 11 is a second explanatory diagram for explaining the operation of FIG. [Figure 12] FIG. 12 is a flowchart showing an example of the operation subsequent to the operation of FIG. [Figure 13] FIG. 13 is a flowchart showing an example of the operation subsequent to the operation of FIG. [Figure 14] FIG. 14 is a first explanatory diagram for explaining the operations of FIGS. 12 and 13. In FIG. [Figure 15] FIG. 15 is a second explanatory diagram for explaining the operations of FIGS. [Figure 16] FIG. 16 is a flowchart showing an example of the operation subsequent to the operation of FIG. [Figure 17] FIG. 17 is a flowchart showing an example of the operation subsequent to the operation of FIG. [Figure 18]FIG. 18 is a first explanatory diagram for explaining the operations of FIGS. 16 and 17. In FIG. [Figure 19] FIG. 19 is a second explanatory diagram for explaining the operations of FIGS. 16 and 17. In FIG. [Figure 20] FIG. 20 is a flowchart showing an example of the operation subsequent to the operation of FIG. [Figure 21] FIG. 21 is a flowchart showing an example of the operation subsequent to the operation of FIG. [Figure 22] FIG. 22 is a first explanatory diagram for explaining the operation of FIGS. 20 and 21. In FIG. [Figure 23] FIG. 23 is a second explanatory diagram for explaining the operations of FIGS. 20 and 21. In FIG. [Figure 24] FIG. 24 is a flowchart showing an example of the operation subsequent to the operation of FIG. [Figure 25] FIG. 25 is a flowchart showing an example of the operation subsequent to the operation of FIG. [Figure 26] FIG. 26 is a first explanatory diagram for explaining the operations of FIGS. 24 and 25. In FIG. [Figure 27] FIG. 27 is a second explanatory diagram for explaining the operations of FIGS. 24 and 25. In FIG. DETAILED DESCRIPTION OF THE INVENTION

[0012] A mounting data creation method according to one aspect of the present disclosure includes a component information acquisition step of acquiring component information including information indicating the outer shape of the component, a board information acquisition step of acquiring board information including information indicating an area on the board where the component is to be placed, and a creation step of creating mounting data for a component mounting device to mount the component on the board based on the outer shape and the area.

[0013] This allows the component mounting device to create mounting data for mounting a component on a board based on the component's outer shape and the area on the board where the component will be placed, so even for components that do not have pins or polarity marks that serve as positional references, mounting data can be created that allows them to be mounted on a board with greater accuracy.

[0014] Furthermore, in an implementation data creation method according to one aspect of the present disclosure, the component information includes information indicating the number of component electrodes provided on the component, and the board information includes information indicating the number of board electrodes provided in the area, and in the creation step, if the number of component electrodes is 0 and the number of board electrodes is 1, the implementation data may be created by adjusting the position at which the component is placed based on the outline and the area, and adjusting the angle at which the component is placed based on a first area where the component and the area overlap.

[0015] This allows mounting data to be created by adjusting the position at which the component is placed based on the outer shape of the component and the area on the board where the component is to be placed, and adjusting the angle at which the component is placed based on the first area where the component overlaps with that area.As a result, even for components that do not have pins or polarity marks that serve as positional references, mounting data can be created that allows the component to be mounted on the board with greater precision.

[0016] In addition, in a mounting data creation method according to one aspect of the present disclosure, the component information includes information indicating the number of component electrodes provided on the component, information indicating the positions of the component electrodes, and information indicating whether an illumination mode for capturing an image of the component is transillumination; the board information includes information indicating the number of board electrodes provided in the region and information indicating the positions of the board electrodes; and in the creation step, when the number of component electrodes is 1 and the number of board electrodes is 1, if the illumination mode is transillumination, the mounting data may be created by adjusting a position at which the component is placed based on the outline and the region, and adjusting an angle at which the component is placed based on a first area where the component and the region overlap and a second area where the component electrodes and the board electrodes overlap; and when the illumination mode is not transillumination, the mounting data may be created by adjusting a position at which the component is placed based on the position of the component electrode and the position of the board electrode, and adjusting an angle at which the component is placed based on the first area and the second area.

[0017] According to this, when the illumination mode for capturing an image of a component is transmitted illumination, the position of the component is adjusted based on the outer shape of the component and the area on the board where the component is to be placed, and the angle at which the component is placed is adjusted based on a first area where the component overlaps with that area and a second area where the component electrodes overlap with the board electrodes, thereby enabling the creation of mounting data that allows even components that do not have pins to be mounted on a board with greater accuracy.Furthermore, when the illumination mode for capturing an image of a component is not transmitted illumination, the position of the component is adjusted based on the positions of the component electrodes and the board electrodes, and the angle at which the component is placed is adjusted based on the first area and the second area, thereby enabling the creation of mounting data that allows even components that do not have pins or polarity marks that serve as positional references to be mounted on a board with greater accuracy.

[0018] In addition, in a mounting data creation method according to an aspect of the present disclosure, the component information includes information indicating the number of component electrodes provided on the component, information indicating the positions of the component electrodes, and information indicating whether an illumination mode for capturing an image of the component is transmitted illumination; the board information includes information indicating the number of board electrodes provided in the region and information indicating the positions of the board electrodes; and in the creation step, when the number of component electrodes is 1 and the number of board electrodes is 2 or more, if the illumination mode is transmitted illumination, the component is arranged based on the outer shape and the region. and adjusting a position at which the component is placed based on a first area where the component and the region overlap, a second area where the component electrode and the board electrode overlap, and the number of the board electrodes that overlap with the component electrode, to create the mounting data; and when the illumination mode is not the transmitted illumination, adjusting a position at which the component is placed based on the positions of the component electrodes and the board electrodes, and adjusting an angle at which the component is placed based on the first area, the second area, and the number of the board electrodes that overlap with the component electrode, to create the mounting data.

[0019] According to this, when the illumination mode for capturing an image of a component is transillumination, the position of the component is adjusted based on the outer shape of the component and the area on the board where the component is to be placed, and the angle at which the component is placed is adjusted based on a first area where the component overlaps with that area, a second area where the component electrode overlaps with the board electrode, and the number of board electrodes that overlap with the component electrode, thereby enabling the creation of mounting data that allows even components that do not have pins to be mounted on a board with greater accuracy.Furthermore, when the illumination mode for capturing an image of a component is not transillumination, the position of the component is adjusted based on the positions of the component electrodes and the board electrodes, and the angle at which the component is placed is adjusted based on the first area, the second area, and the number of board electrodes that overlap with the component electrode, thereby enabling the creation of mounting data that allows even components that do not have pins or polarity marks that serve as positional references to be mounted on a board with greater accuracy.

[0020] In addition, in a mounting data creation method according to an aspect of the present disclosure, the component information includes information indicating the number of component electrodes provided on the component, information indicating the positions of the component electrodes, and information indicating whether an illumination mode for capturing an image of the component is transmitted illumination; the board information includes information indicating the number of board electrodes provided in the region and information indicating the positions of the board electrodes; and in the creation step, when the number of component electrodes is two or more and the number of board electrodes is one, if the illumination mode is transmitted illumination, the component is arranged based on the outer shape and the region. and adjusting a position at which the component is placed based on the positions of the component electrodes and the board electrodes, and adjusting an angle at which the component is placed based on a first area where the component and the region overlap, a second area where the component electrodes and the board electrodes overlap, and the number of the component electrodes that overlap with the board electrodes, to create the mounting data; and when the illumination mode is not the transmitted illumination, adjusting a position at which the component is placed based on the positions of the component electrodes and the board electrodes, and adjusting an angle at which the component is placed based on the first area, the second area, and the number of the component electrodes that overlap with the board electrodes to create the mounting data.

[0021] According to this, when the illumination mode for capturing an image of a component is transillumination, the position of the component is adjusted based on the outer shape of the component and the area on the board where the component is to be placed, and the angle at which the component is placed is adjusted based on a first area where the component overlaps with that area, a second area where the component electrodes overlap with the board electrodes, and the number of component electrodes that overlap with the board electrodes, thereby enabling the creation of mounting data that allows even components that do not have pins to be mounted on a board with greater accuracy.Furthermore, when the illumination mode for capturing an image of a component is not transillumination, the position of the component is adjusted based on the positions of the component electrodes and the board electrodes, and the angle at which the component is placed is adjusted based on the first area, the second area, and the number of component electrodes that overlap with the board electrodes, thereby enabling the creation of mounting data that allows even components that do not have pins or polarity marks that serve as positional references to be mounted on a board with greater accuracy.

[0022] In addition, in an implementation data creation method according to one aspect of the present disclosure, the component information may include information indicating the coordinates of the center position of the outline, and the board information may include information indicating the coordinates of the center position of the area, and in the creation step, the position at which the component is placed may be adjusted so that the center position of the outline and the center position of the area are the same.

[0023] This adjusts the position of the component so that the center of the component's outline is the same as the center of the area on the board where the component is to be placed, so that even components that do not have pins or polarity marks to serve as positional references can be mounted on the board with greater precision.

[0024] In addition, an implementation data creation device according to one aspect of the present disclosure includes a component information acquisition unit that acquires component information including information indicating the outer shape of the component, a board information acquisition unit that acquires board information including information indicating the area on the board where the component is to be placed, and a creation unit that creates implementation data for a component mounting device to mount the component on the board based on the outer shape and the area.

[0025] This provides the same effects as the above mounting data creation method.

[0026] Hereinafter, the embodiments will be specifically described with reference to the drawings.

[0027] The embodiments described below are all comprehensive or specific examples. The numerical values, shapes, materials, components, component placement and connection configurations, steps, and step order shown in the following embodiments are merely examples and are not intended to limit the present disclosure. Furthermore, among the components in the following embodiments, components that are not recited in independent claims are described as optional components. Furthermore, each drawing is a schematic diagram and is not necessarily an exact illustration. Furthermore, the same components are designated by the same reference numerals in each drawing.

[0028] (Embodiment) 1 is a block diagram showing the functional configuration of a component mounting system 100 according to an embodiment of the present invention. The functional configuration of the component mounting system 100 will be described with reference to FIG.

[0029] The component mounting system 100 is a system for mounting components on a substrate. For example, the components may be electronic components that are electrically connected to the substrate, or components that are not electrically connected to the substrate. For example, a component that is not electrically connected to the substrate may be a shield case that is mounted on the substrate to cover the substrate electrodes. As shown in FIG. 1, the component mounting system 100 includes a management device 10, a plurality of component mounting devices 20, and a communication network 30.

[0030] The management device 10 manages the mounting of components on a board. In this embodiment, the management device 10 is an example of a mounting data creation device. Each of the multiple component mounting devices 20 mounts components on a board. For example, each of the multiple component mounting devices 20 mounts components on a board after solder for component bonding has been printed on the board. Each of the multiple component mounting devices 20 is connected to the management device 10 via a communication network 30.

[0031] Fig. 2 is a block diagram showing the functional configuration of the management device 10 and the component mounting device 20 of the component mounting system 100 of Fig. 1. The functional configuration of the management device 10 and the component mounting device 20 will be described with reference to Fig. 2.

[0032] As shown in FIG. 2, the management device 10 includes a mounting data creation unit 11, a storage unit 12, an operation input unit 16, a display unit 17, and a communication unit 18.

[0033] The storage unit 12 is a storage device such as a memory, and stores CAD data 13, component data 14, and mounting data 15. In this embodiment, the CAD data 13 is an example of board information, and the component data 14 is an example of component information. The CAD data 13 is design data used for board design and created by CAD. It includes the types of components to be mounted on each type of board, their mounting position coordinates, and other information, such as information indicating the area on the board where the components are to be placed, information indicating the number of board electrodes provided in that area, information indicating the positions of the board electrodes, and information indicating the coordinates of the center of the area. The component data 14 includes component specifications, such as the size of the target component, including information indicating the outer shape of the component, information indicating the number of component electrodes provided on the component, information indicating the positions of the component electrodes, information indicating whether the illumination mode for capturing an image of the component is transillumination, and information indicating the coordinates of the center of the outer shape of the component. For example, when the illumination mode is transillumination, a transillumination unit (not shown) is turned on, and illumination light from the transillumination unit is emitted obliquely in the vertical and horizontal directions. When a component held by a component holding nozzle (not shown) in component mounting apparatus 20 moves above a component recognition camera (not shown), the transmitted illumination unit lights up a reflector (not shown) of a moving head (not shown) in component mounting apparatus 20. This illuminates the component. In response to this lighting, at least one of the center camera (not shown) and the side camera (not shown) captures an image of the component.

[0034] The operation input unit 16 is an input device such as a touch panel for performing operation input and data input. The display unit 17 is a display device such as a liquid crystal panel for displaying a guide screen when inputting using the operation input unit 16 and various notification screens. The communication unit 18 is a communication interface, and the management device 10 communicates with the component mounting device 20 and the like via the communication unit 18 and the communication network 30.

[0035] The mounting data creation unit 11 creates mounting data 15 for mounting components on a board. For example, the mounting data 15 is production data used for component mounting by the component mounting device 20, and includes a work sequence indicating the order of operations in the component mounting work, mounting coordinate data 15a, and the like. The mounting coordinate data 15a is data indicating the position of a component mounting point on the board and is stored as NC data indicating position coordinates in the machine coordinate system of the component mounting device 20. In this embodiment, the mounting data creation unit 11 is an example of a component information acquisition unit, an example of a board information acquisition unit, and an example of a creation unit. The mounting data creation unit 11 acquires component data 14 and CAD data 13, and creates mounting data 15 for the component mounting device 20 to mount components on the board. The mounting data creation unit 11 includes a simulation execution unit 11a that uses the created mounting data 15 to simulate the mounting work. If the simulation by the simulation execution unit 11a determines that the mounting data 15 needs to be corrected, the mounting data creation unit 11 corrects the mounting data 15. For example, the mounting data creation unit 11 is configured by a processor or the like.

[0036] The component mounting device 20 includes a communication unit 21, a device control unit 22, a mechanism driving unit 23, an operation input unit 24, a display unit 25, and a storage unit 26.

[0037] The communication unit 21 is a communication interface, and the component mounting device 20 communicates with the management device 10 and the like via the communication unit 21 and the communication network 30. The device control unit 22 controls the operation of the component mounting device 20 based on data necessary for executing component mounting work, such as mounting data 15, transmitted from the management device 10 and stored in the memory unit 26. The mechanism drive unit 23 is controlled by the device control unit 22 and drives the board transport mechanism and the component mounting mechanism. The operation input unit 24 is an input device such as a touch panel, and is used to input operations and data to the component mounting device 20. The display unit 25 is a display device such as a liquid crystal panel, and displays a guide screen when inputting using the operation input unit 24, as well as various notification screens.

[0038] Fig. 3 is a flowchart showing an example of the operation of the management device 10 in Fig. 1. With reference to Fig. 3, an example of the operation of the management device 10 will be described.

[0039] 3, the mounting data creation unit 11 determines whether the number of board electrodes is two or more and the number of component electrodes is two or more (step S1). Note that, before step S1, the mounting data creation unit 11 acquires component data 14 (component information acquisition step) and CAD data 13 (board information acquisition step).

[0040] If the number of board electrodes is two or more and the number of component electrodes is two or more (Yes in step S1), the mounting data creation unit 11 performs correction processing (step S2). Here, the mounting data creation unit 11 performs normal correction processing, such as correction processing by aligning the board electrodes and component electrodes, or correction processing using polarity marks, which has been conventionally performed.

[0041] If the number of board electrodes is not two or more and the number of component electrodes is not two or more (No in step S1), the mounting data creation unit 11 determines whether the number of board electrodes is zero (step S3).

[0042] If the number of board electrodes is 0 (Yes in step S3), the mounting data creating unit 11 processes it as "no board electrodes" (step S4).

[0043] If the number of board electrodes is not 0 (No in step S3), the mounting data creating unit 11 determines whether the number of board electrodes is 1 or not (step S5).

[0044] If the number of board electrodes is 1 (Yes in step S5), the mounting data creation unit 11 determines whether the number of component electrodes is 0 (step S6).

[0045] If the number of component electrodes is 0 (Yes in step S6), the mounting data creation unit 11 performs the process of step S21 in FIG.

[0046] If the number of component electrodes is not 0 (No in step S6), the mounting data creating unit 11 determines whether the number of component electrodes is 1 or not (step S7).

[0047] If the number of component electrodes is 1 (Yes in step S7), the mounting data creation unit 11 determines whether the illumination mode is transmitted illumination (step S8).

[0048] If the illumination mode is transmitted illumination (Yes in step S8), the mounting data creation unit 11 performs the process of step S31 in FIG.

[0049] If the illumination mode is not transmitted illumination (No in step S8), the mounting data creation unit 11 performs the process of step S41 in FIG.

[0050] If the number of component electrodes is not 1 (No in step S7), the mounting data creation unit 11 determines whether the illumination mode is transmitted illumination or not (step S9).

[0051] If the illumination mode is transmitted illumination (Yes in step S9), the mounting data creation unit 11 performs the process of step S91 in FIG.

[0052] If the illumination mode is not transmitted illumination (No in step S9), the mounting data creation unit 11 performs the process of step S111 in FIG.

[0053] If the number of board electrodes is not 1 (No in step S5), the mounting data creation unit 11 determines whether the number of component electrodes is 0 (step S10).

[0054] If the number of component electrodes is 0 (Yes in step S10), the mounting data creation unit 11 performs correction processing (step S11). Here, the mounting data creation unit 11 performs correction processing that has been conventionally performed when there are no component electrodes.

[0055] If the number of component electrodes is not 0 (No in step S10), the mounting data creation unit 11 determines whether the illumination mode is transmitted illumination (step S12).

[0056] If the illumination mode is transmitted illumination (Yes in step S12), the mounting data creation unit 11 performs the process of step S51 in FIG.

[0057] If the illumination mode is not transmitted illumination (No in step S12), the mounting data creation unit 11 performs the process of step S71 in FIG.

[0058] Fig. 4 is a flowchart showing an example of an operation subsequent to the operation of Fig. 3. Fig. 5 is an explanatory diagram for explaining the operation of Fig. 4. An example of an operation subsequent to the operation of Fig. 3 will be described with reference to Fig. 4 and Fig. 5. Here, a case where the number of component electrodes is 0 and the number of board electrodes is 1 will be described.

[0059] 4, the mounting data creating unit 11 determines whether or not there is a component guide (step S21). The component guide indicates an area on the board where components are to be placed.

[0060] If a component guide is present (Yes in step S21), the mounting data creating unit 11 moves the position of the component so that the center position of the component outline and the center position of the component guide are aligned (step S22).

[0061] The mounting data creation unit 11 calculates a first area where the component and the component guide overlap at each angle (0 degrees, 90 degrees) (step S23).

[0062] The mounting data creating unit 11 determines whether or not there are multiple angles at which the first area is maximum (step S24).

[0063] If there are not a plurality of angles at which the first area is maximum (No in step S24), the mounting data creating unit 11 adopts the angle at which the first area is maximum (step S25).

[0064] If there are multiple angles at which the first area is maximized (Yes in step S24), the mounting data creation unit 11 uses the smallest angle among the multiple angles at which the first area is maximized (step S26).

[0065] For example, as shown in FIG. 5, when there is a component guide 2 (see (a) of FIG. 5), the mounting data creation unit 11 moves the component so that the center position 1a of the component's outline 1 and the center position 2a of the component guide 2 are in the same position (see (b) of FIG. 5).

[0066] The mounting data creation unit 11 calculates a first area where the component overlaps with the component guide 2 at 0 degrees (no rotation) (see (c) of Figure 5) when the component is moved so that the center position 1a of the outline 1 and the center position 2a of the component guide 2 are in the same position, and calculates a first area where the component overlaps with the component guide 2 when rotated 90 degrees around the center position 1a (see (d) of Figure 5), and adopts the angle (90 degrees) that maximizes the first area among these angles.

[0067] As described above, mounting data creation unit 11 creates mounting data 15 for component mounting device 20 to mount components on a board based on the outer shape of the component and the area on the board where the component is to be placed (creation step). Specifically, in the creation step, when the number of component electrodes is 0 and the number of board electrodes is 1, mounting data creation unit 11 adjusts the position at which the component is to be placed based on the outer shape of the component and the area on the board where the component is to be placed, and adjusts the angle at which the component is to be placed based on a first area where the component and the area overlap, thereby creating mounting data 15 (steps S21 to S26).

[0068] By using the mounting data 15, the component mounting device 20 can mount the component on the board in the state shown in FIG. 5(d).

[0069] Fig. 6 is a flowchart showing an example of an operation subsequent to the operation of Fig. 3. Fig. 7 is a first explanatory diagram for explaining the operation of Fig. 6. Fig. 8 is a second explanatory diagram for explaining the operation of Fig. 6. An example of an operation subsequent to the operation of Fig. 3 will be described with reference to Figs. 6 to 8. Here, a case will be described in which the number of component electrodes is 1 and the number of board electrodes is 1, and the illumination mode is transmissive illumination.

[0070] As shown in FIG. 6, the mounting data creating unit 11 determines whether or not there is a component guide (step S31).

[0071] If a component guide is present (Yes in step S31), the mounting data creating unit 11 moves the position of the component so that the center position of the component outline and the center position of the component guide coincide with each other (step S32).

[0072] The mounting data creation unit 11 calculates a first area where the component and the component guide overlap at each angle (0 degrees, 90 degrees, 180 degrees, 270 degrees) (step S33).

[0073] The mounting data creation unit 11 calculates the second area where the component electrodes and the board electrodes overlap at each angle (0 degrees, 90 degrees, 180 degrees, 270 degrees) (step S34).

[0074] The mounting data creating unit 11 determines whether there are a plurality of angles at which the first area is maximum (step S35).

[0075] If there are not a plurality of angles at which the first area is maximum (No in step S35), the mounting data creating unit 11 adopts the angle at which the first area is maximum (step S36).

[0076] If there are multiple angles at which the first area is maximum (Yes in step S35), the mounting data creation unit 11 determines whether there are multiple angles at which the second area is maximum among the multiple angles at which the first area is maximum (step S37).

[0077] If there are not a plurality of angles at which the second area is maximized (No in step S37), the mounting data creating unit 11 adopts the angle at which the second area is maximized (step S38).

[0078] If there are multiple angles at which the second area is maximized (Yes in step S37), the mounting data creation unit 11 uses the smallest angle among the multiple angles at which the second area is maximized (step S39).

[0079] 7, when a component guide 2 is present (see (a) of FIG. 7), the mounting data creation unit 11 moves the component so that the center position 1a of the component's outline 1 and the center position 2a of the component guide 2 are aligned (see (b) of FIG. 7). In this embodiment, the outline 1 and the component guide 2 are the same size.

[0080] The mounting data creation unit 11 calculates the first area where the component and the component guide 2 overlap at 0 degrees (no rotation) (see (c) of Figure 7) when the component is moved so that the center position 1a of the outline 1 and the center position 2a of the component guide 2 are in the same position, calculates the first area where the component and the component guide 2 overlap when rotated 90 degrees around the center position 1a (see (d) of Figure 7), calculates the first area where the component and the component guide 2 overlap when rotated 180 degrees around the center position 1a (see (e) of Figure 7), and calculates the first area where the component and the component guide 2 overlap when rotated 270 degrees around the center position 1a (see (f) of Figure 7), and adopts the angle (90 degrees, 270 degrees) that maximizes the first area among these angles.

[0081] As shown in FIG. 8, the mounting data creation unit 11 calculates the second area where the component electrode 1b and the board electrode 2b overlap at each of the multiple angles at which the first area is maximized, and adopts the angle (90 degrees) at which the second area is maximized from among the multiple angles at which the first area is maximized.

[0082] As described above, mounting data creation unit 11 creates mounting data 15 for component mounting device 20 to mount a component on a board based on the outer shape of the component and the area on the board where the component is to be placed (creation step). Specifically, in the creation step, when the number of component electrodes is 1 and the number of board electrodes is 1 and the illumination mode is transmitted illumination, mounting data creation unit 11 adjusts the position at which the component is to be placed based on the outer shape of the component and the area on the board where the component is to be placed, and adjusts the angle at which the component is to be placed based on a first area where the component overlaps with the area and a second area where the component electrode overlaps with the board electrode, thereby creating mounting data 15 (steps S31 to S39).

[0083] By using the mounting data 15, the component mounting device 20 can mount the component on the board in the state shown in FIG. 8(d).

[0084] Fig. 9 is a flowchart showing an example of an operation subsequent to the operation in Fig. 3. Fig. 10 is a first explanatory diagram for explaining the operation in Fig. 9. Fig. 11 is a second explanatory diagram for explaining the operation in Fig. 9. An example of an operation subsequent to the operation in Fig. 3 will be described with reference to Figs. 9 to 11. Here, a case will be described in which the number of component electrodes is 1 and the number of board electrodes is 1, and the illumination mode is not transmissive illumination.

[0085] As shown in FIG. 9, the mounting data creating unit 11 determines whether or not there is a component guide (step S41).

[0086] If there is a component guide (Yes in step S41), the mounting data creation unit 11 moves the position of the component so that the center position of the component electrode and the center position of the board electrode are aligned (step S42).

[0087] The mounting data creation unit 11 calculates the second area where the component electrodes and the board electrodes overlap at each angle (0 degrees, 90 degrees, 180 degrees, 270 degrees) (step S43).

[0088] The mounting data creation unit 11 calculates a first area where the component and the component guide overlap at each angle (0 degrees, 90 degrees, 180 degrees, 270 degrees) (step S44).

[0089] The mounting data creating unit 11 determines whether there are a plurality of angles at which the second area is maximum (step S45).

[0090] If there are not a plurality of angles at which the second area is maximum (No in step S45), the mounting data creating unit 11 adopts the angle at which the second area is maximum (step S46).

[0091] If there are multiple angles at which the second area is maximum (Yes in step S45), the mounting data creation unit 11 determines whether there are multiple angles at which the first area is maximum among the multiple angles at which the second area is maximum (step S47).

[0092] If there are not a plurality of angles at which the first area is maximum (No in step S47), the mounting data creating unit 11 adopts the angle at which the first area is maximum (step S48).

[0093] If there are multiple angles at which the first area is maximized (Yes in step S47), the mounting data creation unit 11 uses the smallest angle among the multiple angles at which the first area is maximized (step S49).

[0094] For example, as shown in FIG. 10, when there is a component guide 2 (see (a) of FIG. 10), the mounting data creation unit 11 moves the component so that the center position 1c of the component electrode 1b and the center position 2c of the board electrode 2b are in the same position (see (b) of FIG. 10).

[0095] The mounting data creation unit 11 calculates the second area where the component electrode 1b and the board electrode 2b overlap at 0 degrees (no rotation) (see FIG. 10(c)) when the component is moved so that the center position 1c of the component electrode 1b and the center position 2c of the board electrode 2b are in the same position, calculates the second area where the component electrode 1b and the board electrode 2b overlap at 90 degrees (see FIG. 10(d)) around the center position 1c, calculates the second area where the component electrode 1b and the board electrode 2b overlap at 180 degrees (see FIG. 10(e)) around the center position 1c, and calculates the second area where the component electrode 1b and the board electrode 2b overlap at 270 degrees (see FIG. 10(f)) around the center position 1c, and uses the angle (90 degrees, 270 degrees) that maximizes the second area among these angles.

[0096] As shown in FIG. 11, the mounting data creation unit 11 calculates the first area where the component and the component guide 2 overlap at each of the multiple angles at which the second area is maximized, and adopts the angle (90 degrees) at which the first area is maximized from among the multiple angles at which the second area is maximized.

[0097] As described above, mounting data creation unit 11 creates mounting data 15 for component mounting device 20 to mount a component on a board based on the outer shape of the component and the area on the board where the component is to be placed (creation step). Specifically, in the creation step, if the number of component electrodes is 1 and the number of board electrodes is 1 and the illumination mode is not transmitted illumination, mounting data creation unit 11 adjusts the position at which the component is to be placed based on the positions of the component electrodes and the board electrodes, and adjusts the angle at which the component is to be placed based on the first area and the second area, thereby creating mounting data 15 (steps S41 to S49).

[0098] By using the mounting data 15, the component mounting device 20 can mount the component on the board in the state shown in FIG. 11(d).

[0099] Fig. 12 is a flowchart showing an example of an operation subsequent to the operation of Fig. 3. Fig. 13 is a flowchart showing an example of an operation subsequent to the operation of Fig. 12. Fig. 14 is a first explanatory diagram for explaining the operation of Figs. 12 and 13. Fig. 15 is a second explanatory diagram for explaining the operation of Figs. 12 and 13. An example of an operation subsequent to the operation of Fig. 3 will be described with reference to Figs. 12 to 15. Here, a case will be described in which the number of component electrodes is 1 and the number of board electrodes is 2 or more, and the illumination mode is transmitted illumination.

[0100] As shown in FIG. 12, the mounting data creating unit 11 determines whether or not there is a component guide (step S51).

[0101] If a component guide is present (Yes in step S51), the mounting data creating unit 11 moves the position of the component so that the center position of the component outline and the center position of the component guide coincide with each other (step S52).

[0102] The mounting data creation unit 11 calculates a first area where the component and the component guide overlap at each angle (0 degrees, 90 degrees, 180 degrees, 270 degrees) (step S53).

[0103] The mounting data creation unit 11 calculates the number of board electrodes that overlap with the component electrodes at each angle (0 degrees, 90 degrees, 180 degrees, 270 degrees) (step S54).

[0104] The mounting data creation unit 11 calculates the second area where the component electrodes and the board electrodes overlap at each angle (0 degrees, 90 degrees, 180 degrees, 270 degrees) (step S55).

[0105] As shown in FIG. 13, the mounting data creating unit 11 determines whether there are a plurality of angles at which the first area is maximum (step S56).

[0106] If there are not a plurality of angles at which the first area is maximum (No in step S56), the mounting data creating unit 11 adopts the angle at which the first area is maximum (step S57).

[0107] If there are multiple angles at which the first area is maximum (Yes in step S56), the mounting data creation unit 11 determines whether there are multiple angles at which the number of board electrodes overlapping with component electrodes is maximum among the multiple angles at which the first area is maximum (step S58).

[0108] If there are not multiple angles at which the number of board electrodes overlapping with the component electrodes is the maximum (No in step S58), the mounting data creation unit 11 adopts the angle at which the number of board electrodes overlapping with the component electrodes is the maximum (step S59).

[0109] If there are multiple angles among the multiple angles at which the first area is largest that have the largest number of board electrodes overlapping with component electrodes (Yes in step S58), the mounting data creation unit 11 determines whether there are multiple angles among the multiple angles at which the number of board electrodes overlapping with component electrodes is largest that have the largest second area (step S60).

[0110] If there are not a plurality of angles at which the second area is maximized (No in step S60), the mounting data creating unit 11 adopts the angle at which the second area is maximized (step S61).

[0111] If there are multiple angles at which the second area is maximized (Yes in step S60), the mounting data creation unit 11 uses the smallest angle among the multiple angles at which the second area is maximized (step S62).

[0112] For example, as shown in FIG. 14, when there is a component guide 2 (see (a) of FIG. 14), the mounting data creation unit 11 moves the component so that the center position 1a of the component's outline 1 and the center position 2a of the component guide 2 are in the same position (see (b) of FIG. 14).

[0113] The mounting data creation unit 11 calculates the first area where the component and the component guide 2 overlap at 0 degrees (no rotation) (see (c) of Figure 14) when the component is moved so that the center position 1a of the outline 1 and the center position 2a of the component guide 2 are in the same position, calculates the first area where the component and the component guide 2 overlap when rotated 90 degrees around the center position 1a (see (d) of Figure 14), calculates the first area where the component and the component guide 2 overlap when rotated 180 degrees around the center position 1a (see (e) of Figure 14), and calculates the first area where the component and the component guide 2 overlap when rotated 270 degrees around the center position 1a (see (f) of Figure 14), and adopts the angle (90 degrees, 270 degrees) that maximizes the first area among these angles.

[0114] As shown in FIG. 15, the mounting data creation unit 11 calculates the number of board electrodes 2b that overlap with the component electrodes 1b at each of the multiple angles at which the first area is maximized, and adopts the angle (90 degrees) at which the number is maximized among the multiple angles at which the first area is maximized.

[0115] As described above, mounting data creation unit 11 creates mounting data 15 for component mounting device 20 to mount a component on a board based on the outer shape of the component and the area on the board where the component is to be placed (creation step). Specifically, in the creation step, if the number of component electrodes is one and the number of board electrodes is two or more and the illumination mode is transmitted illumination, mounting data creation unit 11 adjusts the position at which the component is to be placed based on the outer shape of the component and the area on the board where the component is to be placed, and adjusts the angle at which the component is to be placed based on a first area where the component overlaps with the area, a second area where the component electrodes overlap with the board electrodes, and the number of board electrodes that overlap with the component electrodes, thereby creating mounting data 15 (steps S51 to S62).

[0116] By using the mounting data 15, the component mounting device 20 can mount the component on the board in the state shown in FIG. 15(d).

[0117] Fig. 16 is a flowchart showing an example of an operation subsequent to the operation of Fig. 3. Fig. 17 is a flowchart showing an example of an operation subsequent to the operation of Fig. 16. Fig. 18 is a first explanatory diagram for explaining the operation of Figs. 16 and 17. Fig. 19 is a second explanatory diagram for explaining the operation of Figs. 16 and 17. An example of an operation subsequent to the operation of Fig. 3 will be described with reference to Figs. 16 to 19. Here, a case will be described in which the number of component electrodes is 1 and the number of board electrodes is 2 or more, and the illumination mode is not transmissive illumination.

[0118] As shown in FIG. 16, the mounting data creating unit 11 determines whether or not there is a component guide (step S71).

[0119] If a component guide is present (Yes in step S71), the mounting data creation unit 11 moves the position of the component so that the center position of the component electrode coincides with the center positions of the multiple board electrodes (step S72). The center positions of the component electrodes are included in the component data 14. The center positions of the multiple board electrodes are the center positions of all the multiple board electrodes, and are included in the CAD data 13.

[0120] The mounting data creation unit 11 calculates the number of board electrodes that overlap with the component electrodes at each angle (0 degrees, 90 degrees, 180 degrees, 270 degrees) (step S73).

[0121] The mounting data creation unit 11 calculates the second area where the component electrodes and the board electrodes overlap at each angle (0 degrees, 90 degrees, 180 degrees, 270 degrees) (step S74).

[0122] The mounting data creation unit 11 calculates a first area where the component and the component guide overlap at each angle (0 degrees, 90 degrees, 180 degrees, 270 degrees) (step S75).

[0123] As shown in FIG. 17, the mounting data creation unit 11 determines whether there are a plurality of angles at which the number of board electrodes overlapping with component electrodes is the maximum (step S76).

[0124] If there are not multiple angles at which the number of board electrodes overlapping with the component electrodes is the maximum (No in step S76), the mounting data creation unit 11 adopts the angle at which the number of board electrodes overlapping with the component electrodes is the maximum (step S77).

[0125] If there are multiple angles at which the number of board electrodes overlapping with the component electrodes is the largest (Yes in step S76), the mounting data creation unit 11 determines whether there are multiple angles at which the second area is the largest among the multiple angles at which the number of board electrodes overlapping with the component electrodes is the largest (step S78).

[0126] If there are not a plurality of angles at which the second area is maximized (No in step S78), the mounting data creating unit 11 adopts the angle at which the second area is maximized (step S79).

[0127] If there are multiple angles at which the second area is maximum (Yes in step S78), the mounting data creation unit 11 determines whether there are multiple angles at which the first area is maximum among the multiple angles at which the second area is maximum (step S80).

[0128] If there are not a plurality of angles at which the first area is maximum (No in step S80), the mounting data creating unit 11 adopts the angle at which the first area is maximum (step S81).

[0129] If there are multiple angles at which the first area is maximized (Yes in step S80), the mounting data creation unit 11 uses the smallest angle among the multiple angles at which the first area is maximized (step S82).

[0130] For example, as shown in Figure 18, when there is a component guide 2 (see (a) of Figure 18), the mounting data creation unit 11 moves the component so that the center position 1c of the component electrode 1b and the center positions 2c of multiple board electrodes 2b are in the same position (see (b) of Figure 18).

[0131] The mounting data creation unit 11 calculates the second area where the component electrodes 1b and 2b overlap at 0 degrees (no rotation) (see FIG. 18(c)) when the component is moved so that the center position 1c of the component electrode 1b and the center positions 2c of the multiple board electrodes 2b are in the same position, calculates the second area where the component electrodes 1b and 2b overlap at 0 degrees (no rotation) (see FIG. 18(c)), calculates the second area where the component electrodes 1b and 2b overlap at 90 degrees around the center position 1c (see FIG. 18(d)), calculates the second area where the component electrodes 1b and 2b overlap at 180 degrees around the center position 1c (see FIG. 18(e)), and calculates the second area where the component electrodes 1b and 2b overlap at 270 degrees around the center position 1c (see FIG. 18(f)). Of these angles, the angle (90 degrees, 270 degrees) that maximizes the number of board electrodes 2b that overlap with the component electrode 1b and maximizes the second area is used.

[0132] As shown in FIG. 19, the mounting data creation unit 11 calculates the first area where the component and component guide 2 overlap at each of a plurality of angles at which the number of board electrodes 2b overlapping with the component electrodes 1b is the largest and the second area is the largest, and adopts the angle (90 degrees) at which the first area is the largest among the plurality of angles at which the number of board electrodes 2b overlapping with the component electrodes 1b is the largest and the second area is the largest.

[0133] As described above, based on the outer shape of the component and the area on the board where the component is to be placed, mounting data creation unit 11 creates mounting data 15 for component mounting device 20 to mount the component on the board (creation step). Specifically, in the creation step, if the number of component electrodes is one and the number of board electrodes is two or more and the illumination mode is not transmitted illumination, mounting data creation unit 11 adjusts the position at which the component is to be placed based on the positions of the component electrodes and the board electrodes, and adjusts the angle at which the component is to be placed based on the first area, the second area, and the number of board electrodes that overlap with the component electrode, thereby creating mounting data 15 (steps S71 to S82).

[0134] By using the mounting data 15, the component mounting device 20 can mount the component on the board in the state shown in FIG. 19(d).

[0135] Fig. 20 is a flowchart showing an example of an operation subsequent to the operation of Fig. 3. Fig. 21 is a flowchart showing an example of an operation subsequent to the operation of Fig. 20. Fig. 22 is a first explanatory diagram for explaining the operation of Figs. 20 and 21. Fig. 23 is a second explanatory diagram for explaining the operation of Figs. 20 and 21. An example of an operation subsequent to the operation of Fig. 3 will be described with reference to Figs. 20 to 23. Here, a case will be described in which the number of component electrodes is two or more and the number of board electrodes is one, and the illumination mode is transmitted illumination.

[0136] As shown in FIG. 20, the mounting data creating unit 11 determines whether or not there is a component guide (step S91).

[0137] If a component guide is present (Yes in step S91), the mounting data creating unit 11 moves the position of the component so that the center position of the component outline and the center position of the component guide are aligned (step S92).

[0138] The mounting data creation unit 11 calculates a first area where the component and the component guide overlap at each angle (0 degrees, 90 degrees, 180 degrees, 270 degrees) (step S93).

[0139] The mounting data creation unit 11 calculates the number of component electrodes that overlap with the board electrodes at each angle (0 degrees, 90 degrees, 180 degrees, 270 degrees) (step S94).

[0140] The mounting data creation unit 11 calculates the second area where the component electrodes and the board electrodes overlap at each angle (0 degrees, 90 degrees, 180 degrees, 270 degrees) (step S95).

[0141] As shown in FIG. 21, the mounting data creating unit 11 determines whether there are a plurality of angles at which the first area is maximum (step S96).

[0142] If there are not a plurality of angles at which the first area is maximized (No in step S96), the mounting data creating unit 11 adopts the angle at which the first area is maximized (step S97).

[0143] If there are multiple angles at which the first area is maximized (Yes in step S96), the mounting data creation unit 11 determines whether there are multiple angles at which the number of component electrodes overlapping with board electrodes is maximized among the multiple angles at which the first area is maximized (step S98).

[0144] If there are not multiple angles at which the number of component electrodes overlapping with the board electrodes is the maximum (No in step S98), the mounting data creation unit 11 adopts the angle at which the number of component electrodes overlapping with the board electrodes is the maximum (step S99).

[0145] If there are multiple angles at which the number of component electrodes overlapping with the board electrodes is the largest (Yes in step S98), the mounting data creation unit 11 determines whether there are multiple angles at which the second area is the largest among the multiple angles at which the number of component electrodes overlapping with the board electrodes is the largest (step S100).

[0146] If there are not a plurality of angles at which the second area is maximized (No in step S100), the mounting data creating unit 11 adopts the angle at which the second area is maximized (step S101).

[0147] If there are multiple angles at which the second area is maximized (Yes in step S100), the mounting data creation unit 11 uses the smallest angle among the multiple angles at which the second area is maximized (step S102).

[0148] For example, as shown in FIG. 22, when there is a component guide 2 (see (a) of FIG. 22), the mounting data creation unit 11 moves the component so that the center position 1a of the component's outline 1 and the center position 2a of the component guide 2 are in the same position (see (b) of FIG. 22).

[0149] The mounting data creation unit 11 calculates the first area where the component and the component guide 2 overlap at 0 degrees (no rotation) (see (c) of Figure 22) when the component is moved so that the center position 1a of the outline 1 and the center position 2a of the component guide 2 are in the same position, calculates the first area where the component and the component guide 2 overlap when rotated 90 degrees around the center position 1a (see (d) of Figure 22), calculates the first area where the component and the component guide 2 overlap when rotated 180 degrees around the center position 1a (see (e) of Figure 22), and calculates the first area where the component and the component guide 2 overlap when rotated 270 degrees around the center position 1a (see (f) of Figure 22), and adopts the angle (90 degrees, 270 degrees) that maximizes the first area from these angles.

[0150] As shown in Figure 23, the mounting data creation unit 11 adopts the angle (90 degrees) at which the number of component electrodes 1b overlapping with board electrodes 2b is the largest among the multiple angles at which the first area where the component and component guide 2 overlap is the largest.

[0151] As described above, mounting data creation unit 11 creates mounting data 15 for component mounting device 20 to mount a component on a board based on the outer shape of the component and the area on the board where the component is to be placed (creation step). Specifically, in the creation step, if the number of component electrodes is two or more and the number of board electrodes is one, and the illumination mode is transmitted illumination, mounting data creation unit 11 adjusts the position at which the component is to be placed based on the component outer shape and the area on the board where the component is to be placed, and adjusts the angle at which the component is to be placed based on a first area where the component overlaps with the area, a second area where the component electrodes overlap with the board electrodes, and the number of component electrodes overlapping with the board electrodes, thereby creating mounting data 15 (steps S91 to S102).

[0152] By using the mounting data 15, the component mounting device 20 can mount the component on the board in the state shown in FIG. 23(d).

[0153] Fig. 24 is a flowchart showing an example of an operation subsequent to the operation of Fig. 3. Fig. 25 is a flowchart showing an example of an operation subsequent to the operation of Fig. 24. Fig. 26 is a first explanatory diagram for explaining the operation of Figs. 24 and 25. Fig. 27 is a second explanatory diagram for explaining the operation of Figs. 24 and 25. An example of an operation subsequent to the operation of Fig. 3 will be described with reference to Figs. 24 to 27. Here, a case will be described in which the number of component electrodes is two or more and the number of board electrodes is one, and the illumination mode is not transmissive illumination.

[0154] As shown in FIG. 24, the mounting data creating unit 11 determines whether or not there is a component guide (step S111).

[0155] If there is a component guide (Yes in step S111), the mounting data creation unit 11 moves the position of the component so that the center positions of the component electrodes and the center positions of the board electrodes coincide with each other (step S112).

[0156] The mounting data creation unit 11 calculates the number of component electrodes that overlap with the board electrodes at each angle (0 degrees, 90 degrees, 180 degrees, 270 degrees) (step S113).

[0157] The mounting data creation unit 11 calculates the second area where the component electrodes and the board electrodes overlap at each angle (0 degrees, 90 degrees, 180 degrees, 270 degrees) (step S114).

[0158] The mounting data creation unit 11 calculates a first area where the component and the component guide overlap at each angle (0 degrees, 90 degrees, 180 degrees, 270 degrees) (step S115).

[0159] As shown in FIG. 25, the mounting data creation unit 11 determines whether there are a plurality of angles at which the number of component electrodes overlapping with board electrodes is the maximum (step S116).

[0160] If there are not multiple angles at which the number of component electrodes overlapping with the board electrodes is the maximum (No in step S116), the mounting data creation unit 11 adopts the angle at which the number of component electrodes overlapping with the board electrodes is the maximum (step S117).

[0161] If there are multiple angles at which the number of component electrodes overlapping with the board electrodes is the largest (Yes in step S116), the mounting data creation unit 11 determines whether there are multiple angles at which the second area is the largest among the multiple angles at which the number of component electrodes overlapping with the board electrodes is the largest (step S118).

[0162] If there are not a plurality of angles at which the second area is maximized (No in step S118), the mounting data creating unit 11 adopts the angle at which the second area is maximized (step S119).

[0163] If there are multiple angles at which the second area is maximum (Yes in step S118), the mounting data creation unit 11 determines whether there are multiple angles at which the first area is maximum among the multiple angles at which the second area is maximum (step S120).

[0164] If there are not multiple angles at which the first area is maximized among the multiple angles at which the second area is maximized (No in step S120), the mounting data creation unit 11 uses the angle at which the first area is maximized (step S121).

[0165] If there are multiple angles at which the first area is maximized (Yes in step S120), the mounting data creating unit 11 uses the smallest angle among the multiple angles at which the first area is maximized (step S122).

[0166] For example, as shown in Figure 26, when a component guide 2 is present (see Figure 26(a)), the mounting data creation unit 11 moves the component so that the center position 1c of the multiple component electrodes 1b and the center position 2c of the board electrodes 2b are aligned (see Figure 26(b)). The center position 1c of the multiple component electrodes 1b is the center position 1c of the entire multiple component electrodes 1b and is included in the component data 14. The center position 2c of the board electrodes 2b is included in the CAD data 13.

[0167] The mounting data creation unit 11 calculates the second area where the component electrodes 1b and the board electrodes 2b overlap at 0 degrees (no rotation) (see FIG. 26(c)) when the component is moved so that the central positions 1c of the multiple component electrodes 1b and the central positions 2c of the board electrodes 2b are in the same position, calculates the second area where the component electrodes 1b and the board electrodes 2b overlap at 0 degrees (no rotation) (see FIG. 26(c)), calculates the second area where the component electrodes 1b and the board electrodes 2b overlap at 90 degrees around the central position 1c (see FIG. 26(d)), calculates the second area where the component electrodes 1b and the board electrodes 2b overlap at 180 degrees around the central position 1c (see FIG. 26(e)), and calculates the second area where the component electrodes 1b and the board electrodes 2b overlap at 270 degrees around the central position 1c (see FIG. 26(f)). Of these angles, the angle (90 degrees, 270 degrees) that maximizes the number of component electrodes 1b overlapping with the board electrodes 2b and maximizes the second area is used.

[0168] As shown in FIG. 27, the mounting data creation unit 11 calculates the first area where the component overlaps with the component guide 2 at each angle where the number of component electrodes 1b overlapping with the board electrodes 2b is the largest and the second area is the largest, and adopts the angle (90 degrees) where the first area is the largest among the multiple angles where the number of component electrodes 1b overlapping with the board electrodes 2b is the largest and the second area is the largest.

[0169] As described above, based on the outer shape of the component and the area on the board where the component is to be placed, mounting data creation unit 11 creates mounting data 15 for component mounting device 20 to mount the component on the board (creation step). Specifically, in the creation step, if the number of component electrodes is two or more and the number of board electrodes is one, and the illumination mode is not transmitted illumination, mounting data creation unit 11 adjusts the position at which the component is to be placed based on the positions of the component electrodes and the board electrodes, and adjusts the angle at which the component is to be placed based on the first area, the second area, and the number of component electrodes that overlap with the board electrodes, thereby creating mounting data 15 (steps S111 to S122).

[0170] By using the mounting data 15, the component mounting device 20 can mount the component on the board in the state shown in FIG. 27(d).

[0171] As described above, the management device 10 can create mounting data for the component mounting device 20 to mount a component on a board based on the outer shape of the component and the area on the board where the component will be placed, so that even for components that do not have pins, mounting data can be created that allows them to be mounted on a board with greater accuracy.

[0172] (Other embodiments, etc.) Although the implementation data creation method according to one or more aspects has been described above based on the embodiments, the present disclosure is not limited to these embodiments. As long as the modifications do not deviate from the spirit of the present disclosure, modifications that would occur to those skilled in the art may also be included within the scope of the present disclosure.

[0173] In the above-described embodiments, each component may be configured with dedicated hardware, or may be realized by executing a software program suitable for each component. Each component may be realized by a program execution unit such as a CPU (Central Processing Unit) or a processor reading and executing a software program recorded on a recording medium such as a hard disk or semiconductor memory. Here, the software that realizes the devices and the like of the above-described embodiments is a program that causes a computer to execute each step included in the flowcharts shown in Figures 3, 4, 6, 9, 12, 13, 16, 17, 20, 21, 24, and 25.

[0174] The following cases are also included in this disclosure:

[0175] (1) Each of the above devices is specifically a computer system consisting of a microprocessor, ROM, RAM, hard disk unit, display unit, keyboard, mouse, etc. A computer program is stored in the RAM, ROM, or hard disk unit. Each device achieves its function when the microprocessor operates in accordance with the computer program. Here, a computer program is composed of a combination of multiple instruction codes that indicate commands for a computer to achieve a predetermined function.

[0176] (2) Some or all of the components constituting each of the above devices may be configured as a single system LSI (Large Scale Integration). A system LSI is an ultra-multifunctional LSI manufactured by integrating multiple components on a single chip, and specifically, is a computer system configured including a microprocessor, ROM, RAM, etc. A computer program is stored in the RAM or ROM. The system LSI achieves its functions when the microprocessor operates in accordance with the computer program.

[0177] (3) Some or all of the components constituting each of the above devices may be configured as an IC card or a standalone module that can be attached to each device. The IC card or module is a computer system composed of a microprocessor, ROM, RAM, etc. The IC card or module may include the above-mentioned ultra-multifunctional LSI. The IC card or module achieves its functions when the microprocessor operates according to a computer program. The IC card or module may be tamper-resistant.

[0178] (4) The present disclosure may be embodied as the methods described above, a computer program for implementing these methods on a computer, or a digital signal comprising the computer program.

[0179] The present disclosure may also be the computer program or the digital signal recorded on a computer-readable recording medium, such as a flexible disk, hard disk, CD-ROM, MO, DVD, DVD-ROM, DVD-RAM, BD (Blu-ray (registered trademark) Disc), semiconductor memory, etc. Alternatively, the present disclosure may be the digital signal recorded on such a recording medium.

[0180] Furthermore, the present disclosure may involve transmitting the computer program or the digital signal via a telecommunications line, a wireless or wired communication line, a network such as the Internet, data broadcasting, or the like.

[0181] The present disclosure may also be a computer system including a microprocessor and a memory, the memory storing the computer program, and the microprocessor operating in accordance with the computer program.

[0182] The program or the digital signal may also be implemented by another independent computer system by recording it on the recording medium and transferring it, or by transferring it via the network or the like.

[0183] (5) The above-described embodiments and other embodiments may be combined. [Industrial Applicability]

[0184] The present disclosure can be used for a mounting data creation method for creating mounting data for mounting components on a board. [Explanation of symbols]

[0185] 10 Management device 11 Mounting Data Creation Department 11a Simulation execution unit 12,26 Storage part 13 CAD data 14 Parts data 15 Implementation data 15a Mounting coordinate data 16,24 Operation input section 17,25 Display section 18,21 Communications Department 20 Component mounting equipment 22 Device control section 23 Mechanism drive unit 30 Communication Network 100 Component Mounting System

Claims

1. a part information acquisition step of acquiring part information including information indicating the outer shape of the part; a board information acquisition step of acquiring board information including information indicating an area on the board where the component is to be placed; a creating step of creating mounting data for a component mounting device to mount the component on the board based on the outer shape and the area. How to create implementation data.

2. the component information includes information indicating the number of component electrodes provided on the component, the substrate information includes information indicating the number of substrate electrodes provided in the region; In the creating step, when the number of component electrodes is 0 and the number of board electrodes is 1, the mounting data is created by adjusting the position at which the component is placed based on the outer shape and the area, and adjusting the angle at which the component is placed based on a first area where the component and the area overlap. The mounting data creating method according to claim 1 .

3. the component information includes information indicating the number of component electrodes provided on the component, information indicating positions of the component electrodes, and information indicating whether an illumination mode for capturing an image of the component is transmitted illumination; the substrate information includes information indicating the number of substrate electrodes provided in the region and information indicating positions of the substrate electrodes; In the creating step, when the number of the component electrodes is 1 and the number of the board electrodes is 1, when the illumination mode is the transmitted illumination, adjusting the position at which the component is to be placed based on the outer shape and the area, and adjusting the angle at which the component is to be placed based on a first area where the component and the area overlap and a second area where the component electrodes and the board electrodes overlap, thereby creating the mounting data; if the illumination mode is not the transmitted illumination, the position at which the component is to be placed is adjusted based on the positions of the component electrodes and the positions of the board electrodes, and the angle at which the component is to be placed is adjusted based on the first area and the second area, thereby creating the mounting data. The mounting data creating method according to claim 1 .

4. the component information includes information indicating the number of component electrodes provided on the component, information indicating positions of the component electrodes, and information indicating whether an illumination mode for capturing an image of the component is transmitted illumination; the substrate information includes information indicating the number of substrate electrodes provided in the region and information indicating positions of the substrate electrodes; In the creating step, when the number of the component electrodes is one and the number of the board electrodes is two or more, when the illumination mode is the transmitted illumination, adjusting a position at which the component is to be placed based on the outer shape and the region, and adjusting an angle at which the component is to be placed based on a first area where the component overlaps with the region, a second area where the component electrodes overlap with the board electrodes, and the number of the board electrodes that overlap with the component electrodes, thereby creating the mounting data; when the illumination mode is not the transmitted illumination, the position at which the component is placed is adjusted based on the positions of the component electrodes and the positions of the board electrodes, and the mounting data is created by adjusting the angle at which the component is placed based on the first area, the second area, and the number of board electrodes that overlap with the component electrodes. The mounting data creating method according to claim 1 .

5. the component information includes information indicating the number of component electrodes provided on the component, information indicating positions of the component electrodes, and information indicating whether an illumination mode for capturing an image of the component is transmitted illumination; the substrate information includes information indicating the number of substrate electrodes provided in the region and information indicating positions of the substrate electrodes; In the creating step, when the number of the component electrodes is two or more and the number of the board electrodes is one, when the illumination mode is the transmitted illumination, adjusting a position at which the component is to be placed based on the outer shape and the region, and adjusting an angle at which the component is to be placed based on a first area where the component overlaps with the region, a second area where the component electrodes overlap with the board electrodes, and the number of the component electrodes that overlap with the board electrodes, thereby creating the mounting data; when the illumination mode is not the transmitted illumination, the position at which the component is placed is adjusted based on the positions of the component electrodes and the positions of the board electrodes, and the angle at which the component is placed is adjusted based on the first area, the second area, and the number of the component electrodes that overlap with the board electrodes, thereby creating the mounting data. The mounting data creating method according to claim 1 .

6. the part information includes information indicating coordinates of a center position of the outer shape, the substrate information includes information indicating coordinates of a center position of the region, In the creating step, the position of the component is adjusted so that the center of the outline and the center of the region are aligned. The mounting data creating method according to any one of claims 2 to 5.

7. a part information acquisition unit that acquires part information including information indicating the outer shape of the part; a board information acquisition unit that acquires board information including information indicating an area on the board where the component is to be placed; a creation unit that creates mounting data for a component mounting device to mount the component on the board based on the outer shape and the area, Mounting data creation device.

Images