Light-emitting device

Abstract

To provide a light-emitting device in which a plurality of light-emitting elements are connected in series using wire wiring for electrical connection between the light-emitting elements, and in which even when one light-emitting element fails, power can be supplied to the other light-emitting elements.SOLUTION: A light emitting device includes a first base member to which a first light emitting element is bonded and a second base member to which a second light emitting element is bonded, first and second protective elements, and a plurality of wirings. The wirings include a first wiring having one end bonded to one of the first or second light emitting elements or the base member on which the light emitting element is placed, a second wiring having one end bonded to one of the first or second light emitting elements or the base member on which the one light emitting element is placed and the other end bonded to the other light emitting element or the base member on which the other light emitting element is placed, a third wiring having one end bonded to the first protective element or the base member on which the first protective element is placed, and a fourth wiring having one end bonded to the second protective element or the base member on which the second protective element is placed.SELECTED DRAWING: Figure 5

Description

[Technical Field]

[0001] The present invention relates to a light emitting device. [Background technology]

[0002] Patent Document 1 discloses that in a light emitting device in which multiple light emitting elements are connected in series and driven with a constant current, a Zener diode connected in parallel to the light emitting elements is used as a bypass current path in the event of an open mode failure. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent Publication No. 2020-21761 Summary of the Invention [Problem to be solved by the invention]

[0004] However, Patent Document 1 does not disclose a specific form for connecting a plurality of light-emitting elements with wires, so there is room for improvement in the manner in which wires are connected when wires are used. [Means for solving the problem]

[0005] Furthermore, the light emitting device disclosed in the embodiment includes a plurality of light emitting elements, each including at least a first light emitting element and a second light emitting element, each having a p-electrode and an n-electrode; a first base member to which at least the first light emitting element is bonded and a second base member to which the second light emitting element is bonded, and includes a plurality of base members on which the plurality of light emitting elements are mounted, a plurality of protection elements including at least a first protection element and a second protection element to protect the plurality of light emitting elements, and a plurality of wirings, the plurality of wirings including one or more first wirings having one end bonded to one of the first light emitting element or the second light emitting element or the base member on which the one light emitting element is mounted, and one or more second wirings having one end bonded to one of the first light emitting element or the second light emitting element or the base member on which the one light emitting element is mounted and the other end bonded to the other light emitting element or the base member on which the other light emitting element is mounted. a third wiring having one end joined to the first protection element or a base member on which the first protection element is placed, and a fourth wiring having one end joined to the second protection element or a base member on which the second protection element is placed, and a first current path is formed which passes through the one or more first wirings and the one or more second wirings and is a current path through which current flows from the n-electrode of the first light-emitting element to the p-electrode of the second light-emitting element; a second current path is formed which passes through the third wiring and is a current path through which current flows from the first protection element to the p-electrode of the second light-emitting element; and a third current path which passes through the third wiring and the fourth wiring but does not pass through the one or more first wirings and the one or more second wirings and is a current path through which current flows from the first protection element to the second protection element.

[0006] Furthermore, the light emitting device disclosed in the embodiment includes a plurality of light emitting elements including at least a first light emitting element and a second light emitting element, each having a first surface and a second surface opposite to the first surface; a first base member to which at least the first surface of the first light emitting element is bonded and a second base member to which the first surface of the second light emitting element is bonded, a plurality of base members on which the plurality of light emitting elements are mounted, a plurality of protection elements including at least a first protection element and a second protection element to protect the plurality of light emitting elements, and a plurality of wirings, wherein the plurality of wirings include one or more first wirings having one end bonded to the second surface of one of the first light emitting elements or the second light emitting element, and one or more second wirings having one end bonded to the base member on which the one light emitting element is mounted and the other end bonded to the second surface of the other of the first light emitting element or the second light emitting element or the base member on which the other light emitting element is mounted. a second wiring, a third wiring having one end joined to the first protection element, and a fourth wiring having one end joined to the second protection element, and a first current path is formed, the first current path passing through the one or more first wirings and the one or more second wirings but not through the third wiring and the fourth wiring, and being a current path through which a current flows from the first light-emitting element to the second light-emitting element; a second current path passing through the third wiring and not through any of the one or more first wirings or the one or more second wirings that are joined to the second surface of the first light-emitting element, and being a current path through which a current flows from the first protection element to the second light-emitting element; and a third current path passing through the third wiring and the fourth wiring but not through the one or more first wirings and the one or more second wirings, and being a current path through which a current flows from the first protection element to the second protection element. [Effects of the Invention]

[0007] By using wire wiring for electrical connection between multiple light-emitting elements, it is possible to provide a light-emitting device that can supply power to the other light-emitting elements even if one of the multiple light-emitting elements connected in series fails. [Brief explanation of the drawings]

[0008] [Figure 1] FIG. 1 is a perspective view of the light emitting device according to the first embodiment. [Figure 2] FIG. 2 is a top view corresponding to FIG. [Figure 3] FIG. 3 is a cross-sectional view of the light emitting device taken along line III-III in FIG. [Figure 4] FIG. 4 is a cross-sectional view of the light emitting device taken along line IV-IV in FIG. [Figure 5] FIG. 5 is a top view illustrating the internal structure of the light emitting device according to the first embodiment. [Figure 6A] FIG. 6A is a top view illustrating a part of the light emitting device according to the first embodiment, for explaining how wiring is joined. [Figure 6B] FIG. 6B is another top view showing a part of the light emitting device according to the first embodiment, for explaining how wiring is joined. [Figure 6C] FIG. 6C is another top view showing a part of the light emitting device according to the first embodiment, for explaining how wiring is joined. [Figure 7] FIG. 7 is a top view illustrating the state of wiring connection in the light emitting device according to the first modification. [Figure 8] FIG. 8 is a top view illustrating the state of wiring connection in the light emitting device according to the second modification. [Figure 9] FIG. 9 is a top view illustrating the state of wiring connection in a light emitting device according to a third modified example. [Figure 10] FIG. 10 is a top view illustrating the state of wiring connection in a light emitting device according to a fourth modification. [Figure 11] FIG. 11 is a top view illustrating the state of wiring connection in a light emitting device according to a fifth modified example. [Figure 12] FIG. 12 is a top view illustrating the state of wiring connection in a light emitting device according to a sixth modified example. [Figure 13] FIG. 13 is a perspective view of the light emitting device according to the second embodiment. [Figure 14] FIG. 14 is a top view of the light emitting device according to the second embodiment. [Figure 15] FIG. 15 is a top view illustrating the internal structure of the light emitting device according to the second embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0009] In this specification and claims, polygons such as triangles and quadrilaterals are referred to as polygons, including shapes in which the corners of the polygons have been rounded, chamfered, corner-cut, rounded, etc. Furthermore, shapes in which processing has been applied not only to the corners (edges of the sides) but also to the middle portions of the sides are also referred to as polygons. In other words, shapes in which partial processing has been applied while retaining the polygonal base are included in the interpretation of "polygon" described in this specification and claims.

[0010] The same applies to words that describe specific shapes, such as trapezoids, circles, and irregularities, not just polygons. The same also applies when dealing with the sides that form the shape. In other words, even if the corners or middle part of a side are processed, the interpretation of "side" includes the processed part. Note that when distinguishing a "polygon" or "side" that has no processing from a processed shape, the word "strict" is added, for example, "strict quadrangle."

[0011] Furthermore, in this specification or the claims, expressions such as up and down, left and right, front and back, front and back, front and back, etc. merely describe relationships such as relative positions, orientations, directions, etc., and do not necessarily correspond to the relationships when in use.

[0012] Furthermore, in this specification or the claims, when there are multiple equivalents to a certain element and each is to be expressed separately, the element may be distinguished by adding "first" or "second" to the beginning of the element. Furthermore, when the objects or viewpoints distinguished between this specification and the claims are different, the same notation may not refer to the same object between the specification and the claims.

[0013] For example, if there are objects in this specification that are distinguished by appending "first," "second," and "third," and the claims are written to refer only to the "first" and "third" in this specification, they may be distinguished by appending "first" and "second" in the claims for ease of reading. In this case, the objects appended with "first" and "second" in the claims refer to the objects appended with "first" and "third" in this specification.

[0014] Hereinafter, embodiments for carrying out the present invention will be described with reference to the drawings. However, although the illustrated embodiments embody the technical ideas of the present invention, they do not limit the present invention. Furthermore, in the following description, the same names and symbols indicate the same or similar components, and redundant explanations may be omitted as appropriate. Note that the size and positional relationship of components shown in each drawing may be exaggerated for clarity of explanation.

[0015] First Embodiment A light emitting device according to a first embodiment will be described. FIG. 1 is a perspective view of a light emitting device 1, which is an example of a light emitting device according to the first embodiment. FIG. 2 is a top view of the light emitting device 1. FIG. 3 is a cross-sectional view of the light emitting device 1 taken along line III-III in FIG. 2. FIG. 4 is a cross-sectional view of the light emitting device 1 taken along line IV-IV in FIG. 2. FIG. 5 is a top view of the light emitting device 1 from which some components have been removed in order to explain the internal structure. FIG. 6A is a top view illustrating the state of wiring bonding in relation to the electrical connection of a plurality of light emitting elements 20 arranged side by side in a first direction in the light emitting device 1. The arrow "I" in FIG. 6A indicates the direction in which current flows.

[0016] The light emitting device 1 includes a plurality of components including a base 10, a plurality of light emitting elements 20, a plurality of base members 30, one or a plurality of light reflecting members 40, a plurality of protective elements 50, a plurality of wirings 60, a sealing member 70, and a lens member 80. The light emitting device 1 may further include other components.

[0017] Next, each component will be described. (Base 10) The substrate 10 has a base 12 and a sidewall 14 that protrudes upward from the base 12. The base 12 and the sidewall 14 form a concave shape in which the inside of the sidewall 14 is recessed. It can also be said that the substrate 10 has a recess 10a that defines the concave shape.

[0018] The base 12 has a protrusion 12a. The protrusion 12a is surrounded by the sidewall 14. The protruding portion of the protrusion 12a is included in the recess 10a. The top surface of the protrusion 12a is lower than the top surface of the recess 10a. The top surface of the protrusion 12a is the mounting surface on which other components are mounted. Since the base 12 has a shape that has the protrusion 12a, warping of the mounting surface can be suppressed even when the base 12 and the sidewall 14 are made of different materials. Note that the shape of the substrate 10 is not limited to this and may be, for example, flat.

[0019] The base 10 has a plurality of wiring portions 14a. The wiring portions 14a have an inner wiring region provided inside the recess 10a and an outer wiring region provided outside the recess. The inner wiring region and the outer wiring region of the wiring portions 14a are electrically connected. The inner wiring region is bonded to components arranged in the recess 10a.

[0020] The wiring portion 14a is provided on the side wall 14. For example, the wiring portion 14a can be provided by a lead pin that penetrates the side wall 14. The base 10 can have one or more wiring portions 14a on each of the opposing wall surfaces of the side wall 14.

[0021] The substrate 10 can be made of a metal material such as iron, an iron alloy, or copper. It can also be made of a ceramic material such as AlN, SiC, or SiN. The substrate 10 can also be formed by bonding the base 12 and the sidewall 14 made of different materials. Metal lead pins can be used for the wiring portion 14a.

[0022] (Light emitting element 20) The light-emitting element 20 has a light-emitting surface from which light is emitted. For example, a semiconductor laser element can be used as the light-emitting element 20. The light-emitting element 20 has an upper surface, a lower surface, and one or more side surfaces. One side surface of the light-emitting element 20 is the light-emitting surface. Note that the light-emitting surface of the light-emitting element 20 may be on another surface.

[0023] The light-emitting element 20 has a first surface 21 and a second surface 22 opposite to the first surface 21. The first surface 21 or the second surface 22 can be a bonding surface to be bonded to another component. The lower surface of the light-emitting element 20 is the first surface 21, and the upper surface of the light-emitting element 20 is the second surface 22. The first surface 21 and the second surface 22 are not light-emitting surfaces. However, they may be light-emitting surfaces.

[0024] The light-emitting element 20 has a p-electrode and an n-electrode. For example, in the light-emitting element 20, the p-electrode is provided on the first surface 21, and the n-electrode is provided on the second surface 22. Alternatively, for example, in the light-emitting element 20, the n-electrode is provided on the first surface 21, and the p-electrode is provided on the second surface 22. Alternatively, for example, in the light-emitting element 20, the p-electrode and the n-electrode are provided on the first surface 21.

[0025] The light emitting element 20 has an emission peak wavelength in the range of 320 nm to 530 nm, typically in the range of 430 nm to 480 nm. For example, a semiconductor element including a nitride semiconductor can be used as such a light emitting element 20. Examples of nitride semiconductors that can be used include GaN, InGaN, and AlGaN. The emission peak wavelength of the light emitting element 20 is not limited to this wavelength range.

[0026] Here, we will explain a semiconductor laser element, which is an example of the light emitting element 20. Light (laser light) emitted from a semiconductor laser element has a spread, and forms an elliptical far-field pattern (hereinafter referred to as "FFP") on a plane parallel to the light emitting end face. Here, FFP refers to the shape and light intensity distribution of the emitted light at a position away from the emitting end face.

[0027] The light passing through the center of the elliptical shape of the FFP, in other words, the light with peak intensity in the light intensity distribution of the FFP, is called the light traveling along the optical axis. Also, the optical path of the light traveling along the optical axis is called the optical axis of that light. Also, in the light intensity distribution of the FFP, the light with a peak intensity of 1 / e 2 Light having an intensity equal to or greater than (e is Napier's number) is called "main" light.

[0028] In the elliptical shape of the FFP of light emitted from the semiconductor laser element, the minor axis direction of the ellipse is referred to as the slow axis direction of the FFP, and the major axis direction is referred to as the fast axis direction of the FFP. A semiconductor laser element in which the stacking direction of multiple layers including an active layer constituting the semiconductor laser element is the same as the fast axis direction of the FFP can be used as the light emitting element 20.

[0029] Based on the light intensity distribution of the FFP of the semiconductor laser element, 1 / e 2 The angular width at an intensity corresponding to this is called the divergence angle of the light of the semiconductor laser element. In a semiconductor laser element, the divergence angle of the light in the fast axis direction is larger than the divergence angle of the light in the slow axis direction.

[0030] (Base member 30) The base member 30 has a bottom surface, a top surface, and one or more side surfaces. The base member 30 has the smallest width in the vertical direction. The base member 30 is configured in the shape of a rectangular parallelepiped. However, the shape does not have to be limited to a rectangular parallelepiped.

[0031] The base member 30 can be a submount on which other components are placed. The base member 30 can also be used for electrical connection. The base member 30 has a conductive region for electrical connection. The base member 30 has a bonding region 31 and a conductive region 32 that is electrically connected to the bonding region 31. The bonding region 31 and the conductive region 32 are formed on the same surface of the base member 30. Other components can be placed on this surface of the base member 30. The other components are bonded at the bonding region 31. The conductive region 32 and the other components bonded to the bonding region 31 can be electrically connected.

[0032] The bonding region 31 and the conductive region 32 are connected. In other words, the bonding region 31 and the conductive region 32 can be defined as regions that divide one region. Note that the base member 30 may have a conductive region 32 that is not connected to the bonding region 31. In this case, for example, the conductive region 32 that is not connected to the bonding region 31 and the conductive region 32 that is connected to the bonding region 31 can be electrically connected via wiring.

[0033] The base member 30 may have a plurality of bonding regions 31. The plurality of bonding regions 31 are formed on the same surface of the base member 30. The conductive region 32 may be electrically connected to the plurality of bonding regions 31. The plurality of bonding regions 31 may include bonding regions 31 that are connected to the conductive region 32 and bonding regions 31 that are not connected to the conductive region 32.

[0034] The base member 30 is formed using, for example, silicon nitride, aluminum nitride, or silicon carbide. However, other materials may also be used. The conductive region 32 of the base member 30 may be formed by providing, for example, Ti / Pt / Au. The bonding region 31 of the base member 30 may be formed by providing, for example, Pt / AuSn in a portion of the region provided with Ti / Pt / Au.

[0035] (Light reflecting member 40) The light reflecting member 40 has a light reflecting surface 41. The light reflecting surface 41 has a reflectance of, for example, 90% or more for the peak wavelength of the irradiated light. The light reflectance here can be 100% or less, or less than 100%.

[0036] The light reflecting member 40 can be formed from a main material such as glass or metal, which forms its exterior. The main material is preferably a heat-resistant material, such as glass, such as quartz or BK7 (borosilicate glass), metal, such as aluminum, or Si. The light reflecting surface can be formed from a metal, such as Ag or Al, or a dielectric multilayer film, such as Ta2O5 / SiO2, TiO2 / SiO2, or Nb2O5 / SiO2. The main material refers to the material with the largest proportion when multiple materials are used, but refers to the material that accounts for the largest proportion when only one material is used.

[0037] (protective element 50) The protective element 50 is a circuit element that prevents a specific element (e.g., the light-emitting element 20) from being destroyed by excessive current flowing through it. The protective element 50 has an upper surface and a lower surface. A typical example of the protective element 50 is a constant voltage diode such as a Zener diode. For example, a Si diode can be used as the Zener diode.

[0038] (Wiring 60) The wiring 60 is made of a conductor having a linear shape with joints at both ends. In other words, the wiring 60 has joints at both ends of the linear portion that are joined to other components. The wiring 60 is used for electrical connection between two components. For example, a metal wire can be used as the wiring 60. Examples of metals include gold, aluminum, silver, copper, etc.

[0039] (Sealing member 70) The sealing member 70 has an upper surface and a lower surface. The sealing member 70 is translucent from the upper surface to the lower surface. Here, being translucent means that the transmittance of the main light incident thereon is 80% or more.

[0040] The sealing member 70 may be partially light-transmitting. For example, the sealing member 70 may have a non-light-transmitting frame body having one or more openings, and one or more light-transmitting members that cover the one or more openings of the frame body.

[0041] The main material of the sealing member 70 can be a light-transmitting material such as glass, sapphire, or quartz. The main material of the frame can be a metal, for example, and the light-transmitting member can be any of the above-mentioned light-transmitting materials.

[0042] (lens member 80) Lens member 80 has an upper surface and a lower surface. Lens member 80 has a plurality of lens surfaces. The plurality of lens surfaces are formed on the upper surface side of lens member 80. It can be said that the upper surface of lens member 80 is configured to include a plurality of lens surfaces. In lens member 80, the portion forming each lens surface will be referred to as lens portion 81.

[0043] The lens member 80 may have a plurality of lens surfaces arranged in an array. The lens member 80 may have a plurality of lens surfaces arranged in a matrix. The plurality of lens surfaces may include at least three or more lens surfaces. The plurality of lens surfaces may include at least three or more lens surfaces arranged side by side. The lens member 80 may be formed using a light-transmitting material such as glass or synthetic quartz.

[0044] (Light-emitting device 1) Next, the light emitting device 1 will be described. In the light emitting device 1, each of the plurality of light emitting elements 20 is mounted on a base member 30. One or more light emitting elements 20 are mounted on one base member 30. A first surface 21 of the light emitting element 20 is bonded to a bonding region 31 of the base member 30. A conductive region 32 of the base member 30 is electrically connected to the light emitting element 20 bonded to the bonding region 31. In the example of the light emitting device 1 shown in the figure, one light emitting element 20 is mounted on each of the plurality of base members 30. Furthermore, an edge-emitting semiconductor laser element having a side surface as a light emitting surface is used as the light emitting element 20.

[0045] For example, the p-electrode of the light-emitting element 20 is bonded to the bonding region 31. Alternatively, for example, the n-electrode of the light-emitting element 20 is bonded to the bonding region 31. Alternatively, for example, the p-electrode and the n-electrode of the light-emitting element 20 are bonded to the bonding regions 31 of different base members 30, respectively.

[0046] In the light emitting device 1, the base member 30 on which the light emitting element 20 is mounted is disposed on the mounting surface of the base 10. The base member 30 is mounted on the mounting surface of the base 10 on the surface opposite to the surface on which the light emitting element 20 is mounted. A plurality of base members 30 are disposed on the mounting surface of the base 10.

[0047] The light emitting device 1 may include three or more base members 30 on which the light emitting elements 20 are mounted. The light emitting device 1 may also include ten or more base members 30 on which the light emitting elements 20 are mounted. In the illustrated example of the light emitting device 1, 20 base members 30 on which the light emitting elements 20 are mounted are arranged.

[0048] In the light emitting device 1, a plurality of light emitting elements 20 are arranged on the mounting surface of the base 10. The light emitting elements 20 are arranged on the mounting surface of the base 10 via a base member 30. The plurality of light emitting elements 20 are arranged inside the recess 10a.

[0049] The light emitting device 1 includes a plurality of base members 30 arranged in a first direction in top view. The plurality of base members 30 are arranged at equal intervals in the first direction. The plurality of base members 30 arranged in the first direction are arranged with the same orientation in top view. In the illustrated example of the light emitting device 1, the direction indicated by "1D" is the same as the first direction.

[0050] The light emitting device 1 includes a plurality of base members 30 arranged in a second direction perpendicular to the first direction in top view. The plurality of base members 30 are arranged at equal intervals in the second direction. The plurality of base members 30 arranged in the second direction are arranged with the same orientation in top view. In the illustrated example of the light emitting device 1, the direction indicated by "2D" is the same as the second direction. In the illustrated example of the light emitting device 1, 20 base members are arranged in a 4x5 matrix.

[0051] The light emitting elements 20 mounted on the base members 30 aligned in the first direction have their light emitting surfaces facing the same direction. The light emitting elements 20 mounted on the base members 30 aligned in the first direction are provided on the same virtual plane. The light emitting elements 20 mounted on the base members 30 aligned in the second direction have their light emitting surfaces facing the same direction. In the illustrated example of the light emitting device 1, the optical axes of the light emitted from the light emitting surfaces of the light emitting elements 20 (semiconductor laser elements) are parallel to the second direction.

[0052] The multiple base members 30 are arranged in a matrix in the first and second directions. The number of base members 30 lined up in the first direction may be two or more. The number of base members 30 lined up in the second direction may be one or more. Note that when the number of base members 30 lined up in the second direction is one, the number of base members 30 lined up in the first direction may be three or more.

[0053] In the light emitting device 1, a base member 30 on which no light emitting element 20 is mounted may be arranged. A pair of base members 30 on which no light emitting element 20 is mounted is arranged corresponding to the plurality of base members 30 aligned in the first direction. Base members 30 on which no light emitting element 20 is mounted are arranged at positions away in the first direction from the base members 30 located at both ends of the plurality of base members 30 aligned in the first direction. Base members 30 on which no light emitting element 20 is mounted are arranged outside the base members 30 aligned in a matrix.

[0054] In the light emitting device, the light reflecting member 40 is disposed on the mounting surface of the base 10. One or more light reflecting members 40 are disposed on the mounting surface of the base 10. The light reflecting members 40 are disposed so that the light reflecting surfaces 41 face the light emitting surfaces of the light emitting elements 20.

[0055] A light reflecting member 40 can be individually disposed for each of the plurality of light emitting elements 20. In this case, the light emitting device 1 includes a plurality of light reflecting members 40, the number of which is equal to or greater than the number of the light emitting elements 20.

[0056] Light emitted from a plurality of light-emitting elements 20 aligned in the first direction may be reflected by one light-reflecting member 40. In this case, the distance between both ends of the light-reflecting member 40 in the first direction is greater than the distance between two light-emitting elements 20 located at both ends of the plurality of light-emitting elements 20 aligned in the first direction.

[0057] When the number of base members 30 aligned in the second direction is two or more, the plurality of light-emitting elements 20 and the plurality of light-reflecting members 40 are arranged alternately in the second direction. That is, a light-reflecting member 40 is arranged between two light-emitting elements 20 aligned in the second direction, and a light-emitting element 20 is arranged between two light-reflecting members 40 aligned in the second direction.

[0058] A major portion of the light emitted from the light-emitting element 20 is reflected by the light-reflecting surface 41. The reflected light changes its traveling direction and can travel, for example, upward. By disposing the light-reflecting member 40, it is possible to emit light upward from the light-emitting device 1 while disposing a light-emitting surface on the side surface of the light-emitting element 20. For example, if the light-emitting element 20 is an edge-emitting semiconductor laser element, the light-emitting surface of the light-emitting element 20 can be a major heat source for the heat emitted from the light-emitting element 20, so by bringing the light-emitting surface closer to the base member 30 or the base 10, it is possible to improve heat dissipation.

[0059] In the light emitting device 1, a protective element 50 is disposed on the mounting surface of the base 10. A plurality of protective elements 50 are disposed on the mounting surface. The protective elements 50 are not directly mounted on the mounting surface. Alternatively, they may be directly mounted. The protective elements 50 may be mounted on a base member 30.

[0060] The multiple protective elements 50 are arranged corresponding to the multiple light-emitting elements 20, respectively. Each protective element 50 is arranged near the corresponding light-emitting element 20. For example, each protective element 50 is placed on the base member 30 on which the corresponding light-emitting element 20 is placed. When a protective element 50 is arranged near the corresponding light-emitting element 20, the corresponding light-emitting element 20 among the multiple light-emitting elements 20 is arranged in a position closest to this protective element 50. In the example of the light-emitting device 1 shown in the figure, one protective element 50 is placed on each of the multiple base members 30.

[0061] The protective element 50 is bonded to a bonding region 31 of the base member 30. This bonding region 31 is different from the bonding region 31 to which the light emitting element 20 is bonded. The conductive region 32 of the base member 30 is electrically connected to the protective element 50 bonded to the bonding region 31. The conductive region 32 of the base member 30 is electrically connected to the bonding region 31 to which the protective element 50 is bonded and the bonding region 31 to which the light emitting element 20 is bonded.

[0062] In the illustrated example of the light emitting device 1, the protective element 50 is arranged to be aligned with the light emitting element 20 in the first direction. The length of the protective element 50 in the second direction is smaller than the length of the light emitting element 20 in the second direction. In top view, the protective element 50 is arranged between two imaginary straight lines that pass through both ends of the light emitting element 20 in the second direction and are parallel to the first direction.

[0063] The number of protective elements 50 included in the light emitting device 1 is the same as the number of the plurality of light emitting elements 20 arranged in the first direction. Note that the light emitting device 1 may include other protective elements in addition to the protective element 50. In the illustrated example of the light emitting device 1, the light emitting device 1 does not include any protective elements other than the protective element 50, and the number of protective elements 50 included in the light emitting device 1 is the same as the number of light emitting elements 20 included in the light emitting device 1.

[0064] In the light emitting device 1, a plurality of wirings 60 are used to enable power supply from the outside to the light emitting element 20. The light emitting element 20 is electrically connected to the wiring portion 14a by the plurality of wirings 60. The plurality of wirings 60 includes one or more wirings 60 having one end joined to the inner wiring region.

[0065] The plurality of light-emitting elements 20 are electrically connected in series by the plurality of wirings 60. The plurality of light-emitting elements 20 arranged side by side in the first direction are electrically connected in series by the plurality of wirings 60. Of the plurality of light-emitting elements 20, the plurality of light-emitting elements 20 arranged side by side in the first direction are electrically connected in series. The plurality of light-emitting elements 20 arranged side by side in the second direction are not electrically connected in series. The plurality of light-emitting elements 20 arranged side by side in the second direction are electrically connected in parallel.

[0066] The multiple protection elements 50 are electrically connected in series by the multiple wirings 60. The multiple protection elements 50 arranged side by side in the first direction are electrically connected in series by the multiple wirings 60. Of the multiple protection elements 50, the multiple protection elements 50 arranged side by side in the first direction are electrically connected in series. The multiple protection elements 50 arranged side by side in the second direction are not electrically connected in series. The multiple protection elements 50 arranged side by side in the second direction are electrically connected in parallel.

[0067] In a top view, the distance between the light emitting element 20 mounted on the base member 30 and the protective element 50 corresponding to this light emitting element 20 is shorter than the distance between this base member 30 and the base member 30 arranged adjacent to this base member 30. For example, the longer distance can be more than twice the shorter distance. Also, for example, the longer distance can be 50 times or less the shorter distance.

[0068] The load on the wiring 60 when a current flows is smaller as the wiring 60 is shorter. Therefore, when the protective element 50 is located close to the light-emitting element 20, it is possible to achieve an electrical connection by connecting the light-emitting element 20 and the protective element 50 with a wiring. On the other hand, in the example of the light-emitting device 1 shown in the figure, there is no wiring joining the light-emitting element 20 and the protective element 50.

[0069] In a top view, the distance between the light emitting element 20 mounted on the base member 30 and the protective element 50 corresponding to this light emitting element 20 is shorter than the length of the wiring 60 joined to this protective element 50. For example, the length of this wiring 60 can be more than twice this distance. Also, for example, the length of this wiring 60 can be more than three times this distance. Also, for example, the length of this wiring 60 can be less than 50 times this distance.

[0070] The plurality of light-emitting elements 20 arranged side by side in the first direction are also electrically connected to the corresponding plurality of protective elements 50 by the plurality of wirings 60. For one of two adjacent light-emitting elements 20, the plurality of wirings 60 provide a current path that passes through the other light-emitting element 20, and a current path that does not pass through the other light-emitting element 20 but passes through the protective element 50 corresponding to the other light-emitting element 20. In this manner, even if one of the plurality of light-emitting elements 20 fails, power supply to the other light-emitting elements 20 can be maintained by the current path that passes through the protective element 50 corresponding to the failed light-emitting element 20. The specific arrangement of the plurality of wirings 60 will be described below.

[0071] The multiple wirings 60 include one or more wirings 60A, one of whose ends is located within one of the two base members 30 in a top view. The other end of the wiring 60A is located within the other base member 30 in a top view. The two base members 30 are arranged side by side in the first direction. One of the ends of the wiring 60A is bonded to either the base member 30 or the light-emitting element 20. The other end is bonded to either the base member 30 or the light-emitting element 20.

[0072] The multiple wirings 60 include one or more wirings 60B, one of whose ends is located within one of the two base members 30 in a top view. The other end of the wiring 60B is located within the other base member 30 in a top view. The two base members 30 are arranged side by side in the first direction. One of the ends of the wiring 60B is joined to either the base member 30 or the protective element 50. The other end is joined to the base member 30.

[0073] The plurality of wirings 60 includes one or more wirings 60C joined to the wiring portion 14a and the base member 30 on which the light-emitting element 20 is not placed. The plurality of wirings 60 includes one or more wirings 60D joined to the base member 30 on which the light-emitting element 20 is not placed and the base member 30 on which the light-emitting element 20 is placed, or to the light-emitting element 20 or the protective element 50 placed on this base member 30.

[0074] In the illustrated example of the light-emitting device 1, the following wires are provided along the current path: a wire 60C joined to one of the pair of wiring portions 14a and the base member 30 on which the light-emitting element 20 is not placed; a wire 60D joined to the base member 30 on which the light-emitting element 20 is not placed and the conductive region 32 of the base member 30 on which the light-emitting element 20 is placed; one or more wires A joined to the second surface 22 of the light-emitting element 20 placed on the base member 30 arranged adjacent to each other that has the closer current path and the conductive region 32 of the base member 30 that has the farthest current path; a wire 60D joined to the second surface 22 of the light-emitting element 20 and the base member 30 on which the light-emitting element 20 is not placed; and a wire 60C joined to the base member 30 on which the light-emitting element 20 is not placed and the other of the pair of wiring portions 14a.

[0075] Furthermore, in the illustrated example of the light emitting device 1, one or more wires B are provided that are joined to the upper surface of the protective element 50 placed on the base member 30 that has the closer current path out of two adjacently arranged base members 30, and to the conductive region 32 of the base member 30 that has the farther current path, and a wire 60D that is joined to the upper surface of the protective element 50 and to a base member 30 on which no light emitting element 20 is placed. This ensures that, as paths for current to flow from one base member 30 to the other base member 30, there is a path that passes through the light emitting element 20 placed on one base member 30 and a path that passes through the protective element 50 placed on one base member 30.

[0076] In the illustrated example of the light emitting device 1, a plurality of wirings 60A are joined to the second surfaces 22 of the plurality of light emitting elements 20. The number of wirings 60 joined to the light emitting elements 20 is greater than the number of wirings 60 joined to the corresponding protective elements 50. The wirings 60 joined to the corresponding protective elements 50 are thicker than the wirings 60 joined to the light emitting elements 20. If a light emitting element 20 fails, the current that would have flowed through the path passing through the light emitting element 20 will pass through the protective elements 50. Therefore, by making the wirings 60 thicker since there are fewer wirings 60, a stable current path can be ensured.

[0077] Instead of one wiring 60 being joined to the light emitting element 20 mounted on one base member 30 and the conductive region 32 of the other base member 30, two wirings 60 may be used, with the first wiring 60 being joined to the two base members 30 and the second wiring 60 being joined to the base member 30 and the light emitting element 20. In the light emitting device 1, the wiring 60A joined to two adjacent base members 30 may have one end joined to one base member 30 and the other end joined to the other base member 30 or the light emitting element 20 mounted on the other base member 30.

[0078] In the illustrated example of the light emitting device 1, the protective element 50 to which one end of the wiring 60B is joined is disposed closer to the base member 30 to which the other end of the wiring 60B is joined than to the light emitting element 20 mounted on the base member 30 on which the protective element 50 is mounted. In a top view, the wiring 60B joined to the protective element 50 mounted on the base member 30 is shorter than the wiring 60A joined to the light emitting element 20 mounted on the base member 30. By making the wiring 60 related to the protective element 50 shorter than the wiring 60 related to the light emitting element 20, the current load on the wiring 60 related to the protective element 50 can be reduced.

[0079] In the illustrated example of the light emitting device 1, the wiring 60B does not overlap the light emitting element 20 in a top view. Therefore, the wiring 60B does not pass directly above the light emitting element 20. When the light emitting element 20 and the protective element 50 are mounted on the base member 30, for example, if the wiring 60B to which the protective element 50 is joined is arranged to pass directly above the light emitting element 20, the wiring 60B may also be damaged or cut when the light emitting element 20 fails. This situation can be avoided by arranging the wiring 60B and the light emitting element 20 so that they do not overlap in a top view.

[0080] The wiring 60A can be bonded so as not to overlap the protective element 50 in top view. FIG. 6B is a schematic top view showing a state in which the wiring 60A is arranged so as not to overlap the protective element 50 in top view. In FIG. 6A, the wiring 60 can be bonded in the same manner as in FIG. 6B. As shown in FIG. 6B, none of the multiple wirings 60A bonded to the light-emitting element 20 overlaps the protective element 50 in top view. Therefore, the wiring 60A does not pass directly above the protective element 50.

[0081] In top view, the protection element 50 is arranged in a region sandwiched between an imaginary line that passes through one end of the wiring 60A and is parallel to the second direction, and an imaginary line that passes through the other end and is parallel to the second direction. The multiple wirings 60 include wirings 60A having one end joined to a light-emitting element 20, and the distance from the other end to the protection element 50 corresponding to this light-emitting element 20 is shorter than the distance from the other end to this light-emitting element 20.

[0082] If a part of the wiring 60A is arranged in a position overlapping the outer edge of the protective element 50 in a top view, this wiring 60A may lead to an erroneous determination when a visual inspection is performed to determine whether the protective element 50 is properly arranged. In other words, even if the protective element 50 is mounted in an appropriate position, the overlapping wiring 60A may lead to a determination that the protective element 50 is not properly mounted. Therefore, by arranging the wiring 60A so that it does not overlap the protective element 50 in a top view, such an erroneous determination can be suppressed.

[0083] In the illustrated example of the light emitting device 1, the protective element 50 is disposed in a position close to the light emitting surface of the light emitting element 20. Of the side surface that becomes the light emitting surface of the light emitting element 20 (hereinafter referred to as the first side surface) and the side surface opposite to the first side surface of the light emitting element 20 (hereinafter referred to as the second side surface), the protective element 50 is disposed in a position close to the first side surface. This allows the wiring 60A to be joined to the light emitting element 20 at a position sufficiently distant from the first side surface, thereby preventing the light emitting element 20 from suddenly dying.

[0084] The multiple wirings 60A joined to the light emitting element 20 are arranged in a position closer to the second side surface than the protective element 50 in a top view. The wiring 60A joined to the light emitting element 20 at a position closest to the first side surface among the multiple wirings 60A is 250 μm or more away from the first side surface.

[0085] If the distance to the first side surface is too close, the light emitting element 20 will frequently die suddenly, and if it is too far, the light emitting characteristics or temperature characteristics of the light emitting element 20 will deteriorate, so the wiring 60A closest to the first side surface is preferably at a distance of 250 μm to 550 μm from the first side surface. Fig. 6C shows an example of a light emitting device 1 in which the position of wiring 60A is closer to the second side surface than in Fig. 6B, and both satisfy the condition of this numerical range.

[0086] The multiple wirings 60A are joined to the light emitting element 20 at predetermined intervals. The multiple wirings 60A include at least three wirings 60A. The distance to the first side surface of the wiring 60A closest to the first side surface is greater than the predetermined interval between the wirings 60A and is also greater than the distance to the second side surface of the wiring 60A closest to the second side surface.

[0087] When the top surface of the base member 30 is divided into two regions by a virtual line that passes through the midpoints of the first and second side surfaces of the light emitting element 20 and is parallel to the first direction, the protective element 50 corresponding to the light emitting element 20 is arranged in the region closer to the first side surface. No protective element 50 is arranged in the region closer to the second side surface, and one or more wirings 60A whose joints with the light emitting element 20 are present in this region.

[0088] The direction of current flow may be reversed in the light emitting device 1. In this case, in the illustrated example of the light emitting device 1, the following are provided along the current path: a wiring 60C joined to one of the pair of wiring portions 14a and the base member 30 on which the light emitting element 20 is not placed, a wiring 60D joined to the base member 30 on which the light emitting element 20 is not placed and the second surface 22 of the light emitting element 20, one or more wirings A joined to the conductive region 32 of the base member 30 on which the current path is closer of two adjacent base members 30 and the second surface 22 of the light emitting element 20 placed on the base member 30 on which the current path is farther, a wiring 60D joined to the conductive region 32 of the base member 30 on which the light emitting element 20 is placed and the base member 30 on which the light emitting element 20 is not placed, and a wiring 60C joined to the base member 30 on which the light emitting element 20 is not placed and the other of the pair of wiring portions 14a.

[0089] Furthermore, in the example of the light-emitting device 1 shown in the figure, one or more wires B are provided that are joined to the conductive region 32 of the base member 30 having the closer current path out of two adjacently arranged base members 30 and to the upper surface of the protective element 50 placed on the base member 30 having the farther current path, and a wire 60D that is joined to the conductive region 32 of the base member 30 on which the protective element 50 is placed and to the base member 30 on which the light-emitting element 20 is not placed.

[0090] Here, the electrical connection by the plurality of wirings 60 will be described for two light-emitting elements 20 included in the plurality of light-emitting elements 20 aligned in the first direction. Therefore, these two light-emitting elements 20 are referred to as the first light-emitting element and the second light-emitting element, respectively, and the base member 30 on which the first light-emitting element is placed is referred to as the first base member, and the base member 30 on which the second light-emitting element is placed is referred to as the second base member. Furthermore, the two protective elements 50 included in the plurality of protective elements 50 are referred to as the first protective element and the second protective element, respectively. In this case, the following can be said about the light-emitting device 1.

[0091] The plurality of wirings 60 includes a first wiring having one end joined to the second surface 22 of one of the first light-emitting elements 20 or the second light-emitting element. The plurality of wirings 60 includes a second wiring having one end joined to the base member 30 on which one of the light-emitting elements 20 is placed and the other end joined to the second surface 22 of the other of the first light-emitting elements 20 or the second light-emitting element. The plurality of wirings 60 includes a third wiring having one end joined to the first protective element. The plurality of wirings 60 includes a fourth wiring having one end joined to the second protective element.

[0092] By joining the multiple wirings 60, a current path is formed that passes through the first wiring and the second wiring but does not pass through the third wiring and the fourth wiring. This current path is a current path through which a current flows from the first light-emitting element to the second light-emitting element.

[0093] Furthermore, by joining the multiple wirings 60, a current path passing through the third wiring is formed. This current path is a current path through which current flows from the first protection element to the second light-emitting element. Furthermore, this current path does not pass through the wiring 60 of the first wiring or the second wiring that is joined to the second surface 22 of the first light-emitting element. Furthermore, this current path may pass through the wiring 60 of the first wiring or the second wiring that is joined to the second surface 22 of the second light-emitting element.

[0094] Furthermore, a current path is formed that passes through the third wiring and the fourth wiring but does not pass through the first wiring and the second wiring. This current path is a current path through which a current flows from the first protection element to the second protection element.

[0095] In the light emitting device 1, the sealing member 70 is bonded to the base 10. The lower surface of the sealing member 70 is bonded to the upper surface of the base 10. The sealing member 70 is bonded to the upper surface of the recess 10a of the base 10. The sealing member 70 is bonded to the top surface of the base 10.

[0096] A sealed space is formed by bonding the base body 10 and the sealing member 70 together. The light emitting element 20 is confined in this sealed space. An airtight sealed space can also be formed by bonding the base body 10 and the sealing member 70 together in a predetermined gas atmosphere. By confining the light emitting element 20 in the sealed space in this manner, dust collection on the light emitting surface of the light emitting element 20 can be suppressed, and a decrease in light emitting efficiency can be suppressed.

[0097] The light reflected by the light reflecting member 40 passes through the sealing member 70. The main part of the light passes through the light-transmitting part of the sealing member 70 and is emitted from the sealing member 70.

[0098] In the light emitting device 1, the lens member 80 is located above the plurality of light emitting elements 20. The lens member 80 is disposed above the sealing member 70. The lens member 80 is bonded to the sealing member 70. The lens member 80 is bonded using, for example, a UV-curable adhesive. When a UV-curable adhesive is used, the mounting position of the lens member 80 can be adjusted and then bonded at a desired position.

[0099] The lens member 80 is arranged so that light emitted from each light emitting element 20 passes through each lens surface and is emitted.

[0100] In this way, it is possible to manufacture a light emitting device 1 that emits multiple beams of light. Furthermore, it is possible to realize a light emitting device that can supply power to the other light emitting elements even if one of the multiple light emitting elements connected in series fails.

[0101] <Modification> Next, modified examples of the light emitting device 1 will be described. Figs. 7 to 11 are each a top view of the light emitting device 1 showing an example of a modified example. As with Fig. 6A, these are top views showing the state of wiring bonding for electrical connection of a plurality of light emitting elements 20 arranged side by side in the first direction. Also, the arrow "I" in each figure indicates the direction of current flow.

[0102] Each of the modified examples differs from the first embodiment in the positions of the light-emitting element and the protective element for electrical connection, the manner of wiring connection, etc. However, there are some points in common with the first embodiment. Furthermore, the other points of the light-emitting device 1 in each of the modified examples are the same as those already described. Below, the points that differ from the first embodiment for each of the modified examples will be explained.

[0103] <First Modification> 7 is a diagram relating to a first modified example. In the illustrated first modified example of the light emitting device 1, the conductive area 32 of the base member 30 to which one end of the wiring 60A or 60B is joined is larger than that of the light emitting device 1 of the first embodiment. By ensuring a wider conductive area 32, joining of the wiring 60 becomes easier.

[0104] In the illustrated first modified example of the light emitting device 1, the protective element 50 to which one end of the wiring 60B is joined is disposed farther from the base member 30 to which the other end of the wiring 60B is joined than the light emitting element 20 mounted on the base member 30 on which the protective element 50 is mounted. In a top view, the wiring 60B joined to the protective element 50 mounted on the base member 30 is longer than the wiring 60A joined to the light emitting element 20 mounted on the base member 30. By arranging them in this manner, a wide area can be secured when joining the wiring 60 to the base member 30. Note that in the illustrated first modified example of the light emitting device 1, the wiring 60B overlaps the light emitting element 20 in a top view.

[0105] <Second Modification> 8 is a drawing relating to a second modified example. The illustrated second modified example of the light emitting device 1 further includes a base member 302 compared to the light emitting device 1 of the first embodiment. The same number of base members 302 as the number of protective elements 50 included in the light emitting device 1 are provided. Each base member 302 corresponds to each protective element 50. Also, as in the first modified example, the conductive region 32 of the base member 30 to which one end of the wiring 60A or wiring 60B is joined is larger than that of the light emitting device 1 of the first embodiment.

[0106] In both the first embodiment and the second modified example, one end of the wiring 60B is joined to either the base member 30 or the protective element 50. On the other hand, in the first embodiment, the other end is joined to the base member 30 on which the light emitting element 20 and the protective element 50 are placed, but in the second modified example, the other end is joined to the base member 302 on which the light emitting element 20 and the protective element 50 are not placed.

[0107] In the second modified example, the plurality of wirings 60 does not include a wiring 60D that is joined to a base member 30 on which a light-emitting element 20 is not placed and a protective element 50 that is placed on a base member 30 on which a light-emitting element 20 is placed. Instead, the plurality of wirings 60 includes a wiring 60D that is joined to a base member 30 on which a light-emitting element 20 is not placed and a base member 302 on which a light-emitting element 20 and a protective element 50 are not placed.

[0108] The plurality of wirings 60 include one or more wirings 60E, one of both ends of which is located inside the base member 302 in a top view. The other end of the wiring 60E is located inside the base member 30 in a top view. One of both ends of the wiring 60E is joined to the base member 302. The other end is joined to the base member 30.

[0109] In the second variant of the light emitting device 1 shown in the figure, one or more wiring sets are provided, where one wiring set includes a wiring B joined to the upper surface of a protective element 50 placed on the base member 30 of two adjacent base members 30 that has a closer current path, and the base member 302 corresponding to this protective element 50, and one or more wiring E joined to this base member 302 and the conductive region 32 of the base member 30 that has the farther current path.

[0110] Along the current path, one or more wiring sets are provided: wiring B joined to the upper surface of the protective element 50 placed on the base member 30 and the conductive region 32 of the base member 302 corresponding to this protective element 50; and wiring 60D joined to this base member 302 and a base member 30 on which no light-emitting element 20 is placed.

[0111] In the second modified example, the wiring 60 joined to the protective element 50 can be made shorter than that in the first embodiment. As a result, in the second modified example, the thickness of the wiring 60 joined to the protective element 50 can be made thinner than that in the first embodiment. Therefore, the wiring 60 joined to the light emitting element 20 and the wiring 60 joined to the protective element 50 can be made the same thickness, or the wiring 60 joined to the protective element 50 can be made thinner.

[0112] In the second variant, similar to the first embodiment, the wiring 60B does not overlap the light-emitting element 20 when viewed from above, and similar to the first variant, the conductive area 32 of the base member 30 to which one end of the wiring 60A or wiring 60B is joined is larger than that of the light-emitting device 1 of the first embodiment.

[0113] In the light emitting device 1 of the second modified example, the direction of current flow may be reversed. In this case, the wiring set is composed of a wiring B joined to the upper surface of the protective element 50 mounted on the base member 30 having the closer current path out of two adjacent base members 30, and the base member 302 corresponding to this protective element 50, and one or more wirings E joined to this base member 30 and the base member 302 corresponding to the protective element 50 mounted on the base member 30 having the farther current path. Also, one or more wiring sets, wiring B joined to the upper surface of the protective element 50 mounted on the base member 30 and the conductive region 32 of the base member 302 corresponding to this protective element 50, and wiring 60D joined to this base member 302 and a base member 30 on which no light emitting element 20 is mounted, are provided along the current path.

[0114] The plurality of wirings 60 includes, in addition to the first to fourth wirings, a fifth wiring having one end joined to the base member 302 corresponding to the first protection element, and a sixth wiring having one end joined to the base member 302 corresponding to the second protection element.

[0115] By joining the multiple wirings 60, a current path is formed that passes through the first wiring and the second wiring but does not pass through the third wiring, the fourth wiring, the fifth wiring, and the sixth wiring. This current path is a current path through which a current flows from the first light-emitting element to the second light-emitting element.

[0116] Furthermore, by joining the multiple wirings 60, a current path passing through the third wiring and the fifth wiring is formed. This current path is a current path through which a current flows from the first protection element to the second light-emitting element. Moreover, this current path does not pass through the wiring 60 of the first wiring or the second wiring that is joined to the second surface 22 of the first light-emitting element. Moreover, this current path may pass through the wiring 60 of the first wiring or the second wiring that is joined to the second surface 22 of the second light-emitting element.

[0117] Furthermore, a current path is formed that passes through the third wiring, the fourth wiring, the fifth wiring, and the sixth wiring but does not pass through the first wiring or the second wiring. This current path is a current path through which a current flows from the first protection element to the second protection element.

[0118] <Third Modification> 9 is a diagram relating to a third modified example. The third modified example of the light emitting device 1 shown in the figure is further different from the light emitting device 1 of the first embodiment in that the protective element 50, which was placed on the base member 30 in the light emitting device 1 of the second modified example, is placed on a corresponding base member 302. In the light emitting device 1 of the third modified example, the light emitting element 20 and the protective element 50 are placed on different base members, which can improve yield.

[0119] Below, differences from the light emitting device 1 of the first embodiment will be explained, but many of the differences between the third modified example and the first embodiment overlap with the contents described in the second modified example and the first embodiment. The overlapping points with the contents described in the second modified example are clear when comparing the illustrated third modified example with the explanation of the second modified example above, and will not be described again here.

[0120] In the third modification, one end of the wiring 60B is joined to the base member 302, and the other end is joined to the protection element 50 placed on the base member 302.

[0121] In the third variant of the light-emitting device 1 shown in the figure, one or more wiring sets are provided, where one wiring set includes a wiring B connected to the base member 30 of two adjacent base members 30 that has a closer current path and a protective element 50 that corresponds to the light-emitting element 20 placed on this base member 30 and is placed on the base member 302, and one or more wiring E connected to this base member 302 and the conductive region 32 of the base member 30 that has the farther current path.

[0122] Along the current path, one or more wiring sets are provided: wiring B joined to the conductive region 32 of the base member 30 on which the light-emitting element 20 is placed and the upper surface of the protective element 50 corresponding to this light-emitting element 20; and wiring 60D joined to the base member 302 on which the protective element 50 is placed and the base member 30 on which the light-emitting element 20 is not placed.

[0123] In the light-emitting device 1 of the third modified example, the direction of current flow may be reversed. In this case, the wiring set is composed of a wiring B joined to the conductive region 32 of the base member 30 having the closer current path out of two adjacent base members 30 and the upper surface of the protective element 50 corresponding to the light-emitting element 20 mounted on this base member 30, and one or more wirings E joined to this base member 30 and a base member 302 on which the protective element 50 corresponding to the light-emitting element 20 mounted on the base member 30 having the farther current path is mounted. Also, one or more wiring sets, wiring B joined to the conductive region 32 of the base member 30 on which the light-emitting element 20 is mounted and the upper surface of the protective element 50 corresponding to this light-emitting element 20, and wiring 60D joined to the base member 302 on which the protective element 50 is mounted and a base member 30 on which no light-emitting element 20 is mounted, are provided along the current path.

[0124] <Fourth Modification> 10 is a diagram of a fourth modified example. In the illustrated fourth modified example of the light emitting device 1, the protective element 50 has both electrodes on its lower surface, and the electrodes are bonded to two bonding regions 31 of the base member 30. Therefore, it differs from the light emitting device 1 of the first embodiment in that the wiring 60 is not bonded to the upper surface of the protective element 50.

[0125] In the illustrated fourth modified example of the light emitting device 1, the multiple wirings 60 include one or more wirings 60B, one end of which is located within one of the two base members 30 in a top view. The other end of the wiring 60B is located within the other base member 30 in a top view. The two base members 30 are arranged side by side in the first direction. One end of the wiring 60B is joined to a conductive region 32 in the base member 30, which is electrically connected to a bonding region 31 to which one of the electrodes of the protection element 50 is joined. The other end is joined to a conductive region 32 in the base member 30, which is electrically connected to a bonding region 31 to which the other of the electrodes of the protection element 50 is joined.

[0126] Furthermore, in the illustrated example of the light emitting device 1, there are provided one or more wirings B joined to the conductive region 32 electrically connected to the bonding region 31 to which one electrode of the protective element 50 mounted on the base member 30 having the closer current path out of two adjacently arranged base members 30 is bonded, and the conductive region 32 electrically connected to the bonding region 31 to which the other electrode of the protective element 50 mounted on the base member 30 having the farther current path is bonded, and a wiring 60D joined to the conductive region 32 electrically connected to the bonding region 31 to which one electrode of the protective element 50 is bonded and to a base member 30 on which no light emitting element 20 is mounted. The conductive region 32 electrically connected to the bonding region 31 to which the other electrode of the protective element 50 is bonded is also electrically connected to the bonding region 31 to which the light emitting element 20 is bonded.

[0127] The direction of current flow may be reversed in the light emitting device 1. In this case, the conductive region 32 electrically connected to the junction region 31 to which one electrode of the protection element 50 is joined is also electrically connected to the junction region 31 to which the light emitting element 20 is joined.

[0128] The first and second wirings included in the plurality of wirings 60 are similar to those in the light emitting device 1 of the first embodiment, but the third and fourth wirings differ as follows: The plurality of wirings 60 includes a third wiring, one of both ends of which is joined to a conductive region 32 electrically connected to a bonding region 31 to which one electrode of the first protection element is joined. The plurality of wirings 60 includes a fourth wiring, one of both ends of which is joined to a conductive region 32 electrically connected to a bonding region 31 to which one electrode of the second protection element is joined.

[0129] <Fifth Modification> 11 is a diagram relating to a fifth modified example. In the illustrated fifth modified example of the light emitting device 1, the protective element 50 is mounted on the base member 30 at a position farther in the second direction from the light emitting surface of the light emitting element 20 mounted on the base member 30 than the side surface opposite to the light emitting surface of the light emitting element 20. The position of the protective element 50 mounted on the base member 30 relative to the light emitting element 20 differs from that of the light emitting device 1 of the first embodiment.

[0130] By disposing the protective element 50 in such a position, it is possible to reduce the width in the first direction of the base member 30. In addition, the wiring 60 joined to the protective element 50 can be joined so as not to pass directly above the light emitting element 20.

[0131] <Sixth Modification> 12 is a diagram relating to a sixth modified example. In the illustrated sixth modified example of the light emitting device 1, the plurality of wirings 60 includes a wiring 60F having one end joined to the light emitting element 20 and the other end joined to the conductive region 32 within the base member 30 on which the light emitting element 20 and the protective element 50 are arranged. The plurality of wirings 60 also includes a wiring 60G having one end joined to the protective element 50 and the other end joined to the conductive region 32 within the base member 30 on which the light emitting element 20 and the protective element 50 are arranged. The plurality of wirings 60 also includes a wiring 60H connecting adjacent base members 30.

[0132] In the sixth modification, two wires 60 are used, with the first wire 60 joined to the two base members 30 and the second wire 60 joined to the base member 30 and the light emitting element 20, thereby electrically connecting the light emitting element 20 to the adjacent base member 30. Similarly, two wires 60 are used, with the first wire 60 joined to the two base members 30 and the second wire 60 joined to the base member 30 and the protective element 50, thereby electrically connecting the protective element 50 to the adjacent base member 30.

[0133] Compared to the light-emitting device 1 of the first embodiment, in the light-emitting device 1 of the sixth variant, the length of the wiring 60 connected to the light-emitting element 20 and the length of the wiring 60 connected to the protective element 50 can be shortened, thereby reducing the current load on the wiring 60.

[0134] Second Embodiment Next, a light emitting device according to a second embodiment will be described. FIG. 13 is a perspective view of a light emitting device 2, which is an example of a light emitting device according to the second embodiment. FIG. 14 is a top view of the light emitting device 2. FIG. 15 is a top view of the light emitting device 2, with some components removed, in order to explain the internal structure. Note that points that overlap with the explanation of the light emitting device according to the first embodiment described above may be omitted as appropriate. Based on the light emitting device 2 shown in the figure, the contents that match the explanation of the first embodiment above also apply to the light emitting device according to the second embodiment.

[0135] The light emitting device 2 includes a plurality of components including a base 10, a plurality of light emitting elements 20, a plurality of base members 30, one or a plurality of light reflecting members 40, a plurality of protective elements 50, a plurality of wirings 60, a sealing member 70, and a lens member 80. The light emitting device 2 may further include other components.

[0136] In the light emitting device 2, the base 10 has one or more step portions 16 in the recess 10a. The step portions 16 are a part that defines the recessed shape of the base 10. Here, the step portion 16 refers to a portion that is composed only of the upper surface and an inner surface that intersects with the upper surface and extends downward. The step portions 16 can also be considered to be part of the sidewall 14. The mounting surface of the base 10 is located inside the step portions 16 when viewed from above.

[0137] In the base 10 of the light emitting device 2, the wiring portion 14a is provided on the upper surface of the step portion 16. An inner wiring region of the wiring portion 14a is provided on the upper surface of the step portion 16. An outer wiring region of the wiring portion 14a is provided on the lower surface of the base 10. The inner wiring region and the outer wiring region are electrically connected via a via hole that penetrates the inside of the base 10.

[0138] In the base 10 of the light emitting device 2, the step portion 16 is formed along the inner surface of the side wall 14 facing in the first direction. Furthermore, in the base 10 of the light emitting device 2, the step portion 16 is not formed along the inner surface of the side wall 14 facing in the second direction.

[0139] The light emitting device 2 does not have a light emitting element 20 mounted thereon, and does not have a base member 30 to which the wiring 60 is joined. Therefore, the multiple wirings 60 do not include the wirings 60C and 60D in the first embodiment, but instead include wiring portion 14a and one or more wirings 60C joined to the base member 30 on which the light emitting element 20 is mounted, or to the light emitting element 20 or protective element 50 mounted on this base member 30. This allows the light emitting device 2 to be made smaller.

[0140] In the light emitting device 2, the wiring C in the second embodiment replaces the wiring 60C and wiring 60D in the first embodiment, but the other connections of the wiring 60 are the same as those described in the first embodiment. Therefore, similar to the first embodiment, each of the modified examples can also be applied to the light emitting device according to the second embodiment.

[0141] The following can be said in common to the above-described first embodiment, second embodiment, and each of the modifications of these embodiments. The plurality of wirings 60 in the light emitting device according to the embodiment include a first wiring having one end bonded to one of the first or second light emitting elements or to a base member on which the one light emitting element is mounted. The plurality of wirings 60 also include a second wiring having one end bonded to one of the first or second light emitting elements or to a base member on which the one light emitting element is mounted and the other end bonded to the other light emitting element or to a base member on which the other light emitting element is mounted. The plurality of wirings 60 also include a third wiring having one end bonded to the first protective element or to a base member on which the first protective element is mounted, and a fourth wiring having one end bonded to the second protective element or to a base member on which the second protective element is mounted. Furthermore, a current path is formed that passes through the first wiring and the second wiring and allows current to flow from the n-electrode of the first light-emitting element to the p-electrode of the second light-emitting element.Furthermore, a current path is formed that passes through the third wiring and allows current to flow from the first protection element to the p-electrode of the second light-emitting element.Furthermore, a current path is formed that passes through the third wiring and the fourth wiring but does not pass through the first wiring and the second wiring and allows current to flow from the first protection element to the second protection element.

[0142] As explained above, the present invention, which has the technical features disclosed in the specification, is not limited to the structures described in each embodiment of the specification. For example, the present invention can be applied to a light-emitting device having components not disclosed in the embodiments, and differences from the disclosed structure do not constitute grounds for the inapplicability of the present invention. Furthermore, from the perspective of the minimum components required to complete the invention, the components possessed by the light-emitting device disclosed in the embodiments may include non-essential components.

[0143] This means that the light emitting device disclosed in the embodiments of this specification includes not only the perspective of completing the invention, but also the perspective of disclosing a rational configuration that assumes one use form. While the application of the invention is not limited to the exemplary use form, there are aspects that will work effectively when applied to that use form.

[0144] For this reason, it may not be necessary for the present invention (claims) to include all of the components disclosed in one embodiment. For example, if the claims do not state some of the components of a light-emitting device disclosed in an embodiment, the claims claim that the components are not limited to those disclosed in this embodiment, and that the freedom of design by a person skilled in the art, such as substitution, omission, modification of shape, or change of material, is recognized, and the invention described in the claims is applied. [Industrial Applicability]

[0145] The light-emitting device and optical member described in the embodiment can be used in a projector. In other words, a projector can be considered one application form to which the present invention can be applied. However, the present invention is not limited to this, and can also be used as a light source for illumination, in-vehicle headlights, head-mounted displays, backlights for other displays, and the like. [Explanation of symbols]

[0146] 1, 2 Light-emitting device 10 Base 10a Recess 12 Base 12a Convex part 14 Side wall 14a Wiring section 16 Step 20 Light-emitting element 21 Page 1 22 Side 2 30, 302 base member 31 Joint area 32 Conduction area 40 Light reflecting member 41 Light reflective surface 50 Protection element 60, 60A, 60B, 60C, 60D, 60E, 60F, 60G, 60H wiring 70 Sealing member 80 Lens components 81 Lens section

Claims

1. a base having a mounting surface; a plurality of semiconductor laser elements including a first semiconductor laser element, each having a top surface, a first side surface that is a light emitting surface, and a second side surface that is a side surface opposite to the first side surface; a plurality of base members disposed on the mounting surface of the base, on which the plurality of semiconductor laser elements are mounted, respectively; a plurality of wirings including at least three first wirings joined to the top surface of the first semiconductor laser element; Equipped with the at least three first wirings are joined at predetermined intervals on the top surface of the first semiconductor laser element in a direction from the first side surface to the second side surface, the first wiring closest to the first side surface of the first semiconductor laser element is joined to the top surface of the first semiconductor laser element at a position apart from the first side surface of the first semiconductor laser element in a range of 250 μm to 550 μm, a distance from the first side surface of the first semiconductor laser element to the first wiring closest to the first side surface of the first semiconductor laser element is greater than the predetermined interval between the first wirings.

2. 2. The light-emitting device according to claim 1, wherein a distance from the first side surface of the first semiconductor laser element to the first wiring closest to the first side surface of the first semiconductor laser element is greater than a distance from the second side surface of the first semiconductor laser element to the first wiring closest to the second side surface of the first semiconductor laser element.

3. a protection element mounted on the base member on which the first semiconductor laser element is mounted, The light emitting device according to claim 2 , wherein the protective element is disposed at a position closer to the first side surface out of the first side surface and the second side surface of the first semiconductor laser element.

4. The light emitting device according to claim 3 , wherein none of the at least three first wirings joined to the top surface of the first semiconductor laser element passes through the protective element when viewed from above.

5. 2. The light-emitting device according to claim 1, wherein a distance from the first side surface of the first semiconductor laser element to the first wiring closest to the first side surface of the first semiconductor laser element is shorter than a distance from the second side surface of the first semiconductor laser element to the first wiring closest to the second side surface of the first semiconductor laser element.

6. a protection element mounted on the base member on which the first semiconductor laser element is mounted, The light emitting device according to claim 5 , wherein the protective element is disposed at a position closer to the second side surface of the first semiconductor laser element than the first side surface or the second side surface of the first semiconductor laser element.

7. The light emitting device according to claim 6 , wherein none of the at least three first wirings joined to the top surface of the first semiconductor laser element passes through the protective element when viewed from above.

8. 8. The light-emitting device according to claim 1, wherein one end of each of the at least three first wirings is joined to the top surface of the first semiconductor laser element and the other end is joined to the top surface of the base member on which another semiconductor laser element other than the first semiconductor laser element is placed.

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