Lid member, manufacturing method thereof, and light emitting device

Abstract

To provide a lid member that can reduce the size of an electronic device such as a light emitting device and has excellent airtight sealing properties.SOLUTION: A lid member includes: a frame-shaped light-blocking member having an upper surface, a lower surface, and an inner surface connecting the inner edge of the upper surface with the inner edge of the lower surface; and a light-transmitting member joined to the upper surface side of the light-blocking member and closing an opening in the light-blocking member. The inner surface has a first region that, when viewed from above, extends closer to the center of the upper surface opening defined by the inner edge of the upper surface than the inner edge of the upper surface, and the inner surface has a second region that, when viewed from below, extends closer to the center of the lower surface opening defined by the inner edge of the lower surface than the inner edge of the lower surface, and a metal film is provided on the lower surface, the metal film not reaching the inner surface.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present disclosure relates to a cover member, a method for manufacturing the same, and a light emitting device. [Background technology]

[0002] Cover members used as lids for electronic devices such as light-emitting devices are known. For example, a cover member including a spacer having a through hole and a cover disposed on the spacer so as to close the through hole of the spacer can be known (see, for example, Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 2019-62029 Summary of the Invention [Problem to be solved by the invention]

[0004] The present disclosure aims to provide a lid member that enables miniaturization of electronic devices such as light-emitting devices and provides excellent airtight sealing, a method for manufacturing the same, and a light-emitting device having the lid member. [Means for solving the problem]

[0005] A cover member according to one embodiment of the present disclosure comprises a frame-shaped light-blocking member having an upper surface, a lower surface, and an inner surface connecting the inner edge of the upper surface with the inner edge of the lower surface, and a light-transmitting member joined to the upper surface side of the light-blocking member and closing an opening in the light-blocking member, wherein the inner surface has a first region that, when viewed from above, extends closer to the center of the upper surface opening defined by the inner edge of the upper surface than the inner edge of the upper surface, and the inner surface has a second region that, when viewed from below, extends closer to the center of the lower surface opening defined by the inner edge of the lower surface than the inner edge of the lower surface, and a metal film is provided on the lower surface, the metal film not reaching the inner surface.

[0006] A method for manufacturing a lid member according to one embodiment of the present disclosure includes the steps of: preparing a plate-shaped light-blocking member; providing a metal film on a first main surface of the light-blocking member, the metal film having a first opening that exposes the first main surface; providing a coating film on a second main surface of the light-blocking member at a position that overlaps with the first opening when viewed from the first main surface side, the coating film having a second opening that exposes the second main surface; etching the light-blocking member from the first main surface side and the second main surface side to form a through hole that penetrates from the first opening to the second opening; and arranging a plate-shaped light-transmitting member on the second main surface of the light-blocking member to cover the through hole. In the step of forming the through hole, the through hole is formed by a first recess formed from the metal film side and a second recess formed from the coating film side penetrating through to form the through hole.

[0007] A light-emitting device according to one embodiment of the present disclosure includes a substrate, a light-emitting element arranged on an upper surface of the substrate, and a lid member according to one embodiment of the present disclosure, wherein the lower surface of the light-shielding member is joined to the outer periphery of the upper surface of the substrate, and the light-emitting element is sealed by the substrate and the lid member. [Effects of the Invention]

[0008] According to an embodiment of the present disclosure, it is possible to provide a lid member that enables miniaturization of an electronic device such as a light-emitting device and that provides excellent airtight sealing, a method for manufacturing the same, and a light-emitting device having the lid member. [Brief explanation of the drawings]

[0009] [Figure 1] FIG. 2 is a cross-sectional view illustrating the cover member according to the first embodiment. [Figure 2] 2 is a top view of a light-shielding member that constitutes the cover member shown in FIG. 1. FIG. [Figure 3] 2 is a bottom view of a light-shielding member that constitutes the cover member shown in FIG. 1. FIG. [Figure 4] 2 is a partial cross-sectional view of a light-shielding member that constitutes the cover member shown in FIG. 1. FIG. [Figure 5A]1A and 1B are top views (1) illustrating a method for manufacturing the lid member according to the first embodiment. [Figure 5B] FIG. 10 is a top view (2) illustrating the method for manufacturing the lid member according to the first embodiment. [Figure 5C] FIG. 10 is a cross-sectional view (3) illustrating the method for manufacturing the lid member according to the first embodiment. [Figure 5D] FIG. 4 is a cross-sectional view (4) illustrating the method for manufacturing the lid member according to the first embodiment. [Figure 5E] FIG. 5 is a cross-sectional view (5) illustrating the method for manufacturing the lid member according to the first embodiment. [Figure 5F] FIG. 6 is a cross-sectional view (6) illustrating the method for manufacturing the lid member according to the first embodiment. [Figure 5G] FIG. 7 is a cross-sectional view (7) illustrating the method for manufacturing the lid member according to the first embodiment. [Figure 5H] FIG. 8 is a cross-sectional view (8) illustrating the method for manufacturing the lid member according to the first embodiment. [Figure 6A] FIG. 1 is a top view (1) showing a first modified example of the method for manufacturing the lid member according to the first embodiment. [Figure 6B] FIG. 10 is a cross-sectional view (2) showing a first modified example of the method for manufacturing the lid member according to the first embodiment. [Figure 6C] FIG. 10 is a cross-sectional view (3) showing a first modified example of the method for manufacturing the lid member according to the first embodiment. [Figure 6D] FIG. 4 is a cross-sectional view (4) showing a first modified example of the method for manufacturing the lid member according to the first embodiment. [Figure 6E] FIG. 5 is a cross-sectional view (5) showing a first modified example of the method for manufacturing the lid member according to the first embodiment. [Figure 6F] FIG. 6 is a cross-sectional view (6) showing a first modified example of the method for manufacturing the lid member according to the first embodiment. [Figure 7] FIG. 10 is a cross-sectional view showing a second modified example of the method for manufacturing the lid member according to the first embodiment. [Figure 8] FIG. 1 is a cross-sectional view (1) illustrating a light emitting device according to a second embodiment. [Figure 9] FIG. 10 is a cross-sectional view (2) illustrating the light emitting device according to the second embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0010] Hereinafter, a description of an embodiment of the invention will be given with reference to the drawings. In the following description, terms indicating specific directions or positions (e.g., "upper," "lower," and other terms including these terms) will be used as necessary. However, the use of these terms is intended to facilitate understanding of the invention with reference to the drawings, and the meaning of these terms does not unduly limit the technical scope of the present invention. For example, when the term "upper surface" is used, it does not necessarily mean that the invention must always be used facing upward. Furthermore, parts with the same reference numerals appearing in multiple drawings indicate the same or equivalent parts or components.

[0011] Furthermore, in this disclosure, polygons such as triangles and quadrilaterals are referred to as polygons, including shapes in which the corners of the polygons have been processed, such as by rounding, chamfering, corner removal, or rounding. Shapes in which processing has been applied not only to the corners (edges of the sides) but also to the middle portions of the sides are also referred to as polygons. In other words, shapes in which partial processing has been applied while retaining the polygon as a base are included in the interpretation of "polygon" described in this disclosure.

[0012] The same applies to words that represent specific shapes, such as trapezoids, circles, and irregularities, not just polygons. The same also applies when dealing with the sides that form the shape. In other words, even if the corners or middle part of a side have been processed, the interpretation of "side" includes the processed part. Note that when distinguishing a "polygon" or "side" that has no processing from a processed shape, the word "strict" is added, for example, "strict quadrangle."

[0013] Furthermore, the embodiments shown below are illustrative of a lid member and other components for embodying the technical concept of the present invention, and are not intended to limit the present invention. Furthermore, unless otherwise specified, the dimensions, materials, shapes, relative positions, and other details of the components described below are intended for illustrative purposes only and are not intended to limit the scope of the present invention. Furthermore, the content described in one embodiment may also be applied to other embodiments and modified examples. Furthermore, the size and positional relationships of components shown in the drawings may be exaggerated for clarity. Furthermore, to avoid overly complex drawings, schematic diagrams may be used in which some elements are omitted, or end views may be used as cross-sectional views showing only the cut surface.

[0014] First Embodiment Fig. 1 is a cross-sectional view illustrating a cover member according to a first embodiment. Fig. 2 is a top view of a light-shielding member that constitutes the cover member shown in Fig. 1. Fig. 3 is a bottom view of the light-shielding member that constitutes the cover member shown in Fig. 1.

[0015] The lid member 1 according to the first embodiment has a light-blocking member 10 and a light-transmitting member 20. In the example shown in the figure, the lid member 1 further has a metal film 30. It is noted that the lid member 1 does not necessarily have to have the metal film 30.

[0016] (Light-shielding member 10) The light-shielding member 10 is a frame-shaped member having an upper surface 11, a lower surface 12, and an inner surface 13 connecting the inner edge 11a of the upper surface 11 and the inner edge 12a of the lower surface 12. The light-shielding member is made of, for example, silicon. The thickness of the light-shielding member 10 is not particularly limited, but is, for example, about 0.3 mm to 1 mm. Here, "light-shielding property" refers to the property of not transmitting light, and indicates that the transmittance of light having an arbitrary peak wavelength is 20% or less. In addition to the light-shielding property, light-shielding property may also be achieved by utilizing absorption or reflection properties.

[0017] The light-blocking member 10 has, for example, a rectangular frame shape when viewed from above. The inner edge 11a of the upper surface 11 has, for example, a rectangular shape when viewed from above. An upper surface opening 15a is defined by the inner edge 11a of the upper surface 11. The inner edge 12a of the lower surface 12 has, for example, a rectangular shape when viewed from below. A lower surface opening 16a is defined by the inner edge 12a of the lower surface 12. The inner edge 11a of the upper surface 11 and the inner edge 12a of the lower surface 12 are, for example, in positions that overlap when viewed from above and below. It should be noted that unless specifically stated to exclude squares, the term "rectangle" may also include squares.

[0018] The outer edge of the upper surface 11 is, for example, a rectangle surrounding the inner edge 11a when viewed from above. The outer edge of the lower surface 12 is, for example, a rectangle surrounding the inner edge 12a when viewed from below. The outer edges of the upper surface 11 and the lower surface 12 are, for example, positioned to overlap when viewed from above and below. The light-shielding member 10 has an outer surface 14 that connects the outer edge of the upper surface 11 and the outer edge of the lower surface 12. The light-shielding member 10 has one or more outer surfaces 14, and in the example shown, the light-shielding member 10 has four rectangular outer surfaces 14.

[0019] In the illustrated example, the lower surface 12 is parallel to the upper surface 11. The lower surface 12 does not have to be parallel to the upper surface 11. In the illustrated example, each outer surface 14 is perpendicular to the upper surface 11. Each outer surface 14 does not have to be perpendicular to the upper surface 11.

[0020] The inner surface 13 has a first region 13a that extends toward the center 15c of the top opening 15a beyond the inner edge 11a of the top surface 11 in a top view. The first region 13a is, for example, a region that extends toward the center 15c of the top opening 15a beyond the inner edge 11a of the top surface 11 over the entire length of the inner edge 11a of the top surface 11 in a top view. The light-blocking member 10 has one or more inner surfaces 13, and in the illustrated example, the light-blocking member 10 has four inner surfaces 13. The first region 13a may be present on only one inner surface 13, or may be present on each of the multiple inner surfaces 13.

[0021] Furthermore, the inner surface 13 has a second region 13b that extends toward the center 16c of the lower surface opening 16a beyond the inner edge 12a of the lower surface 12 in a bottom view. The second region 13b is, for example, a region that extends toward the center 16c of the lower surface opening 16a beyond the inner edge 12a of the lower surface 12 over the entire length of the inner edge 12a of the lower surface 12 in a bottom view. The second region 13b may be present on only one inner surface 13, or may be present on each of multiple inner surfaces 13.

[0022] The inner surface 13 has a curved shape, for example, when viewed in a cross section perpendicular to the upper surface 11 of the light-shielding member 10. The inner surface 13 may include a part of a straight line when viewed in a cross section perpendicular to the upper surface 11 of the light-shielding member 10. For ease of explanation, the first region 13a and the second region 13b are shown as dot patterns in Figures 2 and 3.

[0023] At least a part of the inner edge of the light-shielding member 10 when viewed from above does not overlap with the inner edge 11a of the upper surface 11. In the example shown, the entire inner edge of the light-shielding member 10 when viewed from above does not overlap with the inner edge 11a of the upper surface 11. At least a part of the inner edge of the light-shielding member 10 when viewed from below does not overlap with the inner edge 12a of the lower surface 12. In the example shown, the entire light-shielding member 10 when viewed from below does not overlap with the inner edge 12a of the lower surface 12.

[0024] The inner surface 13 is not provided outside the inner edge 11a of the upper surface 11 when viewed from above. The inner surface 13 is not provided outside the inner edge 12a of the lower surface 12 when viewed from below.

[0025] The maximum width from the inner edge 11a of the upper surface 11 to the inner edge of the light-shielding member 10 when viewed from above is the same as the maximum width from the inner edge 12a of the lower surface 12 to the inner edge of the light-shielding member 10 when viewed from below. Here, "the same" is a concept that includes a difference of within 5 μm.

[0026] The width length, which is the shortest distance from the outer edge to the inner edge 11a of the upper surface 11 when viewed from above, and the width length, which is the shortest distance from the outer edge to the inner edge 12a of the lower surface 12 when viewed from below, may be the same or different.

[0027] The light-shielding member 10 can also be called a frame member. Furthermore, when it is called the light-shielding member 10, it is a member that has light-shielding properties, but when it is called a frame member, it is not a member that necessarily has light-shielding properties.

[0028] (Translucent member 20) The light-transmitting member 20 has an upper surface and a lower surface. The light-transmitting member 20 has, for example, a flat plate shape. The upper surface and the lower surface may be parallel or not. The light-transmitting member 20 also has one or more side surfaces connecting the upper surface and the lower surface. The one or more side surfaces connect to the outer edge of the upper surface and the outer edge of the lower surface. The light-transmitting member 20 is, for example, a rectangular parallelepiped or a cube. In this case, both the upper surface and the lower surface of the light-transmitting member 20 are rectangular, and the light-transmitting member 20 has four rectangular side surfaces. The light-transmitting member 20 does not have to be a rectangular parallelepiped or a cube. In other words, the light-transmitting member 20 is not limited to a rectangular shape when viewed from above, and can have any shape when viewed from above, such as a circle, an ellipse, or a polygon. Here, "light-transmitting" refers to a transmittance of 80% or more for incident light. Note that the light-transmitting member 20 does not necessarily have to have a transmittance of 80% or more for all wavelengths of light. Furthermore, the light-transmitting member 20 may have a non-light-transmitting region (a region that does not have light-transmitting properties) in part. The light-transmitting member 20 is made of, for example, glass. The light-transmitting member 20 may also be made of a light-transmitting material such as sapphire or quartz.

[0029] (Cover member 1) In the cover member 1, the light-transmitting member 20 is bonded to the upper surface 11 of the light-shielding member 10 to close the opening of the light-shielding member 10. When the light-shielding member 10 is made of silicon and the light-transmitting member 20 is made of glass, the light-shielding member 10 can be anodically bonded to the light-transmitting member 20, for example. The light-transmitting member 20 may be bonded to the upper surface 11 of the light-shielding member 10 via an adhesive. For example, a metal adhesive can be used for bonding. Examples of the metal adhesive include AuSn and metal paste. A resin adhesive may also be used for bonding.

[0030] A metal film 30 may be provided on the lower surface 12 of the light-shielding member 10. As the metal film 30, for example, Ti / Pt / Au (a metal film laminated in this order of Ti, Pt, and Au) can be used. In this case, the thickness of each of Ti, Pt, and Au can be, for example, 0.05 μm or more and 2 μm or less. As the metal film 30, Ni / Au (a metal film laminated in this order of Ni and Au), Cr / Pt / Au (a metal film laminated in this order of Cr, Pt, and Au), etc. may also be used.

[0031] When using the manufacturing method of the lid member 1 described below, the metal film 30 is formed only on the lower surface 12 of the light-shielding member 10. Furthermore, the metal film 30 provided on the lower surface 12 is formed only on the lower surface 12. In other words, the metal film 30 provided on the lower surface 12 does not reach the inner surface 13 or the outer surface 14. Furthermore, the metal film 30 is formed up to a position very close to the inner edge 12a of the lower surface 12, but does not reach the inner surface 13. Here, "not reaching the inner surface 13" includes a state in which 95% or more of the inner surface 13 is not covered by the metal film 30. The distance from the metal film 30 to the inner edge 12a of the lower surface 12 is, for example, 0 to 1 μm. Since the metal film 30 provided on the lower surface 12 does not reach the inner surface 13 or the outer surface 14, when the lid member 1 is bonded to a substrate 110 and used as a light-emitting device, it is possible to prevent the metal adhesive 140 from reaching the inner surface 13 or the outer surface 14. If the metal adhesive 140 reaches at least one of the inner surface 13 and the outer surface 14, the amount of metal adhesive 140 on the lower surface 12 may be insufficient, reducing the airtightness of the space surrounded by the lid member 1 and the substrate 110. Since the metal film 30 does not reach the inner surface 13 or the outer surface 14, the airtightness of the space surrounded by the lid member 1 and the substrate 110 can be improved.

[0032] In the cover member 1, the inner surface 13 of the light-blocking member 10 has a first region 13a extending from the inner edge 11a of the upper surface 11 toward the center 15c of the upper opening 15a in a top view, and a second region 13b extending from the inner edge 12a of the lower surface 12 toward the center 16c of the lower opening 16a in a bottom view. This structure eliminates the narrow width on either the upper surface 11 side or the lower surface 12 side of the light-blocking member 10 and the wide width toward the other side, as in conventional cover members having only the first or second region. As a result, the cover member 1 can be made smaller in width when compared with conventional cover members assuming the narrowest width between the opposing inner surfaces 13 to be the same size as conventional cover members. In this way, when the cover member 1 is used in an electronic device such as a light-emitting device, the electronic device can be made smaller in width. Note that the inner surface of the "conventional cover member" here is, for example, a flat surface with a certain inclination angle. Here, the "width" refers to the length in a direction parallel to the upper surface in a cross-sectional view in a direction perpendicular to the upper surface.

[0033] Fig. 4 is a partial cross-sectional view of a light-shielding member that constitutes the cover member shown in Fig. 1. As shown in Fig. 4, in a cross-sectional view perpendicular to the upper surface 11 of the light-shielding member 10, the inner surface 13 has a first connection point P1 that connects to the upper surface 11, a second connection point P2 that connects to the lower surface 12, and an intersection point P4 that passes through a midpoint P3 of a first line L1 that passes through the first connection point P1 and the second connection point P2 and intersects with a second line L2 that is perpendicular to the first line L1.

[0034] The angle α between the line L3 passing through the first connection point P1 and the intersection point P4 and the top surface 11, and the angle β between the line L4 passing through the second connection point P2 and the intersection point P4 and the bottom surface 12 are preferably 55 degrees or greater and less than 90 degrees. In this range, the length of the line segment connecting the intersection point P4 and the midpoint P3 can be shortened, resulting in the inner surface 13 having a shape similar to a plane perpendicular to the top surface 11. This allows for a large space inside the inner surface 13. Furthermore, when a certain width is required for the space inside the lid member 1, the shape of the inner surface 13 having a shape similar to a plane perpendicular to the top surface 11 allows for further miniaturization of the width of the light-blocking member 10. In this way, when the lid member 1 is used in an electronic device such as a light-emitting device, the width of the electronic device can be further miniaturized. For example, the length of each side of the inner edges 11a and 12a can be several millimeters, and the length of the line segment connecting the intersection point P4 and the midpoint P3 can be less than 300 μm.

[0035] 4, in the region including the first connection point P1 and surrounded by the lines L1, L2, and the inner surface 13, the area of ​​the region surrounded by the lines L1, L2, and L3 is larger than the area of ​​the remainder. Also, in the region including the second connection point P2 and surrounded by the lines L1, L2, and the inner surface 13, the area of ​​the region surrounded by the lines L1, L2, and L4 is larger than the area of ​​the remainder.

[0036] (Method of manufacturing the cover member 1) A method for manufacturing the lid member 1 according to the first embodiment will be described with reference to Figures 5A to 5H. Figures 5A to 5H are top views and cross-sectional views illustrating the method for manufacturing the lid member according to the first embodiment.

[0037] [Step of preparing light-blocking member] First, as shown in FIG. 5A, a plate-shaped light-shielding member 10W is prepared. The light-shielding member 10W is, for example, a silicon substrate having a first main surface 10m formed of a {100} plane. Here, the {100} plane refers to all planes between the (100) plane, one of the crystal lattice planes in a diamond structure, which is a stable crystal structure of silicon at room temperature and normal pressure, and its equivalent crystal plane. The equivalent crystal plane refers to an equivalent crystal plane defined by Miller indices. An off-angle of about ±2 degrees is allowed for the first main surface of the silicon substrate relative to the {100} plane. The off-angle is preferably ±1 degree, more preferably ±0.2 degrees.

[0038] The size and thickness of the light-shielding member 10W can be adjusted as appropriate depending on the intended use of the lid member to be obtained, etc. It is preferable to obtain multiple lid members 1 from one light-shielding member 10W, and for this reason, the light-shielding member 10W preferably has a length and / or width of several centimeters to several tens of centimeters.

[0039] In the light-shielding member 10W, the second main surface opposite to the first main surface 10m is preferably also composed of a {100} plane. That is, the light-shielding member 10W preferably has a second main surface parallel to the first main surface 10m. The thickness of the light-shielding member 10W is preferably uniform, but may vary in some areas. The thickness of the light-shielding member 10W can be, for example, 100 to several thousand μm, e.g., 500 to 2000 μm.

[0040] [Process for forming metal film] Next, as shown in FIGS. 5B and 5C, a metal film 30 having first openings 32 that expose the first main surface 10m is provided on the first main surface 10m of the light-shielding member 10W. In FIG. 5B, for ease of explanation, the metal film 30 is shown with a dot pattern. Specifically, for example, a mask is provided on the first main surface 10m of the light-shielding member 10W to cover the areas where the first openings 32 are to be formed. Then, the metal film 30 is formed through the mask by a sputtering method or the like, and the mask is then removed. Here, as an example, the first openings 32 are rectangular in top view.

[0041] The metal film 30 may be, for example, Ti / Pt / Au (a metal film laminated in this order with Ti, Pt, and Au). In this case, the thickness of each of the Ti, Pt, and Au may be, for example, 0.05 μm or more and 2 μm or less. The metal film 30 may also be, for example, Ni / Au (a metal film laminated in this order with Ni and Au), or Cr / Pt / Au (a metal film laminated in this order with Cr, Pt, and Au).

[0042] Note that Fig. 5B is a plan view, and Fig. 5C is a cross-sectional view taken along the line VC-VC in Fig. 5B. In the following description, a partial cross-sectional view corresponding to part A surrounded by a dashed line in Fig. 5C will be used.

[0043] [Step of providing a coating film] Next, as shown in FIG. 5D , a coating film 40 having a second opening 42 exposing the second main surface 10n is formed on the second main surface 10n of the light-shielding member 10W at a position overlapping the first opening 32 when viewed from the first main surface 10m. The coating film 40 is not particularly limited as long as it is resistant to the etching solution used in the through-hole formation process. For example, a silicon oxide film or a silicon nitride film can be used. Silicon oxide films and silicon nitride films are easier to remove after the etching process than metal films 30, facilitating bonding to the light-transmitting member 20W. Specifically, for example, a mask is provided on the second main surface 10n of the light-shielding member 10W to cover the area where the second opening 42 is to be formed. The coating film 40 is then formed through the mask by sputtering, CVD, or the like, and the mask is then removed. The shape of the second opening 42 is preferably the same as the shape of the first opening 32, but is not limited thereto.

[0044] [Process for forming through holes] Next, as shown in FIGS. 5E and 5F , the light-shielding member 10W is etched from the first main surface 10m side and the second main surface 10n side using the metal film 30 and the coating film 40 as an etching mask, to form through-holes 18 that penetrate from the first openings 32 to the second openings 42. Isotropic etching can be used for this etching process. Wet etching is preferably used. Using wet etching allows multiple light-shielding members 10W to be etched simultaneously, enabling efficient production.

[0045] In the process of forming the through hole, first recess 18a formed from the metal film 30 side and second recess 18b formed from the coating film 40 side penetrate each other to form through hole 18. Fig. 5E shows a state during etching, specifically, the state just before first recess 18a and second recess 18b are formed and penetrate each other. Fig. 5F shows the state after etching has been continued from the state shown in Fig. 5E, and the etching has been completed to form through hole 18.

[0046] That is, in the process of forming the through hole, the first recess 18a and the second recess 18b are penetrated, and further, by continuing the etching process after penetration, the inner surface where the inner surface 13m of the first recess 18a and the inner surface 13n of the second recess 18b are connected at the time of penetration through the first recess 18a and the second recess 18b is further etched in the width direction, and the inner surface 13 of the cover member is formed.

[0047] When the light-shielding member 10W is a silicon substrate whose first main surface 10m is a {100} plane, the step of forming the through-hole 18 includes forming a first recess 18a having an inner side surface 13m formed by a {111} plane inclined relative to the {100} plane, and a second recess 18b having an inner side surface 13n formed by a {111} plane inclined relative to the {100} plane, as shown in Fig. 5E. The first recess and the second recess 18b are shaped like truncated quadrangular pyramids facing each other.

[0048] By continuing the etching process after the etching penetrates through the first recess 18a and the second recess 18b, inner side surface 13m of first recess 18a made of {111} plane and inner side surface 13n of second recess 18b made of {111} plane are etched in the width direction, forming curved inner side surface 13 in a cross section perpendicular to first main surface 10m, as shown in Fig. 5F. By making inner side surface 13 curved, it is possible to ensure a larger space inside inner side surface 13 compared to when it is linear.

[0049] When the light-shielding member 10W is a silicon substrate, anisotropic etching can be performed using, for example, a potassium hydroxide (KOH) aqueous solution as an etching solution. In this case, if the first main surface 10m of the light-shielding member 10W is a {100} plane, inner surfaces 13m and 13n formed of flat {111} planes are formed during etching, as shown in FIG. 5E. The angle θ1 between the first main surface 10m and the inner surface 13m, and the angle θ2 between the second main surface 10n and the inner surface 13n, are approximately 54.7°. A tetramethylammonium hydroxide (TMAH) aqueous solution or a sodium hydroxide (NaOH) aqueous solution can also be used as the etching solution.

[0050] Thus, in the step of forming the through holes, etching masks having openings facing each other are provided on each of the first main surface 10m and the second main surface 10n of the light-shielding member 10. Then, etching is performed on the light-shielding member 10W from the first main surface 10m side and the second main surface 10n side, and the through holes 18 are formed by the first recesses 18a formed on the first main surface 10m side and the second recesses 18b formed on the second main surface 10n side penetrating each other.

[0051] Therefore, unlike conventional etching performed from only one side, the width of the light-shielding member 10W is narrow on either the first main surface 10m side or the second main surface 10n side and then widens toward the other side. As a result, the cover member 1 can be made smaller in width when compared with conventional cases where the width of the narrowest part between the opposing inner surfaces 13 is the same as that of conventional cases. In this way, when the cover member 1 is used in an electronic device such as a light-emitting device, the electronic device can be made smaller in width.

[0052] Furthermore, a metal film 30 is used as the etching mask on the first main surface 10m side of the light-shielding member 10W, rather than a silicon oxide film or the like. When a silicon oxide film or the like is used as the etching mask on the first main surface 10m side, continuing the etching process after penetration results in the formation of a first recess 18a with an opening larger than the opening in the silicon oxide film or the like. In contrast, when a metal film 30 is used as the etching mask on the first main surface 10m side, continuing the etching process after penetration can form a first recess 18a with approximately the same size as the opening in the metal film 30. After the first recess 18a is formed, the distance from the metal film 30 to the inner edge of the first main surface 10m is, for example, 0 to 1 μm. In this way, using a metal film 30 as the etching mask on the first main surface 10m side makes it easier to form the first recess 18a with the designed size.

[0053] [Step of placing a light-transmitting member] Next, as shown in FIG. 5G, a plate-shaped light-transmitting member 20W that covers the through-holes 18 is disposed on the second main surface 10n of the light-shielding member 10W. Specifically, the light-transmitting member 20W is disposed and bonded to the second main surface 10n of the light-shielding member 10W by, for example, anodic bonding. Room-temperature bonding or hydrophilic bonding can also be used as a method for bonding the second main surface 10n of the light-shielding member 10W to the light-transmitting member 20W. Note that a step of removing the coating film 40 may be included between the step of forming the through-holes 18 and the step of disposing the light-transmitting member 20W. Removing the coating film 40 can increase the bonding strength between the second main surface 10n of the light-shielding member 10W and the light-transmitting member 20W.

[0054] [Cutting process] 5H, after the step of arranging the light-transmitting member 20W, the light-shielding member 10W, the light-transmitting member 20W, and the metal film 30 are cut. As a result, the light-shielding member 10W and the light-transmitting member 20W are separated into individual light-shielding members 10 and light-transmitting members 20, and a plurality of cover members 1 are formed. For example, a blade, a laser, or the like can be used for cutting.

[0055] In this way, with the manufacturing method of the lid member 1, even if the etching process is continued after penetration, excessive etching in the width direction can be suppressed, making it easy to control the etching. Furthermore, with the lid member 1 manufactured by this method, even if the etching process is continued after penetration, the shape of the side surface does not become the thinnest in the center, so sufficient strength can be maintained.

[0056] (First modified example of the method for manufacturing the lid member according to the first embodiment) As shown in FIGS. 6A and 6B , the step of forming the metal film 30 may include forming a plurality of first openings 32 in the first main surface 10m of the light-shielding member 10W, and forming grooves 34 that are arranged to surround each of the first openings 32 and expose the first main surface 10m. The first openings 32 and the grooves 34 may be formed simultaneously or at different times. The metal film 30 that forms the first openings 32 and the metal film 30 that forms the grooves 34 may be made of the same material or different materials. After the step of disposing the light-transmitting member 20W, the method further includes a step of cutting the light-shielding member 10W and the light-transmitting member 20W along the grooves 34 at the positions of the dashed lines C, as shown in FIG. 6E .

[0057] In this case, it is preferable to provide a step of forming a coating film 50 on the metal film 30 to cover the groove portion 34 without covering the first opening portion 32, as shown in Fig. 6C, between the step of forming the metal film 30 and the step of forming the through hole 18. Then, a step of removing the coating film 50 on the metal film 30 is further provided between the step of forming the through hole 18 and the cutting step, as shown in Fig. 6D.

[0058] In this way, by cutting the light-shielding member 10W and the light-transmitting member 20W along the grooves 34, it is not necessary to cut the metal film 30. This eliminates the generation of burrs and improves yield, as shown in FIG. 6F . Furthermore, when cutting by dicing, the blade life can be extended. Furthermore, by providing a step of forming the coating film 40 that covers the grooves 34 without covering the first openings 32, the grooves 34 can be etched while covered by the coating film 40 in the step of forming the through holes 18, and therefore the grooves 34 are not etched. Therefore, the risk of the metal film 30 peeling off from the grooves 34 in the step of forming the through holes 18 can be reduced.

[0059] (Second modified example of the method for manufacturing the lid member according to the first embodiment) If the grooves 34 are not formed in the step of forming the metal film 30, after the step of forming the through holes 18 shown above the arrow in Fig. 7, grooves 34 that are arranged to surround each first opening 32 and expose the first main surface 10m may be formed in the metal film 30 as shown below the arrow in Fig. 7. In this case, after the step of arranging the light-transmissive member 20W, a step of cutting the light-blocking member 10W and the light-transmissive member 20W along the grooves 34, as in Fig. 6E, is further included. The grooves 34 can be formed by, for example, laser processing.

[0060] In this method, the grooves 34 are not present in the step of forming the through holes 18. Therefore, there is no risk of the metal film 30 peeling off in the step of forming the through holes 18. Therefore, there is no need to provide a step of forming a coating film 50 as shown in FIG. 6C. Furthermore, by cutting the light-shielding member 10W and the light-transmitting member 20W along the grooves 34, it is not necessary to cut the metal film 30, so no burrs are generated and the yield is improved. Furthermore, when cutting by dicing, the life of the blade can be extended.

[0061] Second Embodiment The second embodiment shows an example of a light emitting device including the lid member according to the first embodiment. Fig. 8 is a cross-sectional view illustrating the light emitting device according to the second embodiment. As shown in Fig. 8, the light emitting device 100 according to the second embodiment has a substrate 110, a light emitting element 120, and the lid member 1 according to the first embodiment.

[0062] (Substrate 110) The substrate 110 has an upper surface and a lower surface. The upper surface and the lower surface may or may not be parallel. The substrate 110 also has one or more side surfaces connecting the upper surface and the lower surface. The one or more side surfaces connect the outer edge of the upper surface to the outer edge of the lower surface. The substrate 110 is, for example, a rectangular parallelepiped or a cube. In this case, both the upper surface and the lower surface of the substrate 110 are rectangular, and the substrate 110 has four rectangular side surfaces. For example, the substrate 110 may be a plate-like shape having any shape when viewed from above.

[0063] The substrate 110 contains, for example, an insulating material. The substrate 110 can be formed, for example, with ceramics as the main material. For example, aluminum nitride, silicon nitride, aluminum oxide, or silicon carbide can be used as the ceramic. The main material forming the substrate 110 may also be a conductive material. For example, metals such as aluminum, gold, silver, copper, tungsten, iron, nickel, cobalt, or alloys thereof, and composite materials such as diamond and copper-diamond can be used.

[0064] (Light emitting element 120) The light emitting element 120 is, for example, a semiconductor laser element. The semiconductor laser element may be an edge-emitting laser or a vertical-cavity surface-emitting laser (VCSEL). The light emitting element 120 is not limited to a semiconductor laser element, and may be, for example, a light emitting diode (LED) or an organic light emitting diode (OLED).

[0065] The light-emitting element 120 may be a light-emitting element that emits visible light. Examples of light-emitting elements that emit visible light include light-emitting elements that emit blue light, green light, and red light. Here, the light-emitting elements that emit blue light, green light, and red light refer to light-emitting elements that emit light with peak emission wavelengths in the ranges of 405 nm to 494 nm, 495 nm to 570 nm, and 605 nm to 750 nm, respectively. Examples of the light-emitting element 120 that emits blue light or green light include semiconductor laser elements containing nitride semiconductors. Examples of nitride semiconductors that can be used include GaN, InGaN, and AlGaN. Examples of the light-emitting element 120 that emits red light include semiconductor laser elements containing InAlGaP-based, GaInP-based, GaAs-based, and AlGaAs-based semiconductors.

[0066] It should be noted that the emission peak of the light emitted from the light-emitting element 120 is not limited to this. For example, the light emitted from the light-emitting element 120 may be visible light other than the colors described above, and a light-emitting element that emits ultraviolet light, infrared light, or the like other than visible light may be used.

[0067] (Light emitting device 100) In the light emitting device 100, the light emitting element 120 is disposed on the upper surface of the substrate 110. The light emitting element 120 can be disposed, for example, so that the light emitting surface faces the lower surface of the light-transmitting member 20. A metal film 130 is provided on the outer periphery of the upper surface of the substrate 110, for example, so as to surround the light emitting element 120 when viewed from above. The metal film 130 can have a configuration similar to that of the metal film 30, for example.

[0068] The lower surface 12 of the light-shielding member 10 constituting the lid member 1 is bonded to the outer periphery of the upper surface of the substrate 110. More specifically, the metal film 30 provided on the lower surface 12 of the light-shielding member 10 and the metal film 130 provided on the outer periphery of the upper surface of the substrate 110 are bonded by a metal adhesive 140. An example of the metal adhesive 140 is AuSn.

[0069] As a result, a sealed space surrounded by the substrate 110 and the lid member 1 is formed, and the light emitting element 120 is disposed in this sealed space. This sealed space may be formed in an airtight sealed state. By hermetically sealing this sealed space, organic matter and the like are less likely to collect on the light emitting surface of the light emitting element 120.

[0070] For example, when an edge-emitting laser is used as the light-emitting element 120, it is preferable to place it in a hermetically sealed space because organic matter and the like easily collects on the light-emitting edge surface. Also, when a light-emitting element 120 that emits light with a wavelength shorter than green is used as the light-emitting element 120, it is preferable to place it in a hermetically sealed space because organic matter and the like easily collects on the light-emitting surface. Therefore, when an edge-emitting laser that emits light with a wavelength shorter than green is used as the light-emitting element 120, it is particularly preferable to place it in a hermetically sealed space.

[0071] The light-transmitting member 20 constituting the cover member 1 transmits light emitted from the light-emitting element 120 and emits it to the outside. The lower surface of the light-transmitting member 20 serves as a light incident surface onto which the light emitted from the light-emitting element 120 is incident. The upper surface of the light-transmitting member 20 serves as a light exit surface from which the light incident on the light incident surface is emitted to the outside of the light-emitting device 100.

[0072] 9, the light emitting element 120 may be disposed on the substrate 110 so that, for example, the emission end surface 120a faces the inner surface 13 of the light-shielding member 10. In this case, a reflecting member 125 that reflects light emitted from the light emitting element 120 toward the light incident surface of the light-transmitting member 20 is disposed on the substrate 110 between the emission end surface 120a of the light emitting element 120 and the inner surface 13 of the light-shielding member 10. The reflecting member 125 may have, for example, a 45-degree inclined surface on which a metal film is formed.

[0073] Since the light emitting device 100 uses the cover member 1 that is compact in the width direction, the entire light emitting device 100 can also be compact in the width direction. The light emitting device 100 can be used, for example, in an in-vehicle headlight. Furthermore, the light emitting device 100 is not limited to this, and can also be used as a light source for lighting, projectors, head-mounted displays, backlights for other displays, etc. The same applies to the light emitting device 100A.

[0074] Although the preferred embodiments have been described in detail above, the present invention is not limited to the above-described embodiments, and various modifications and substitutions can be made to the above-described embodiments without departing from the scope of the claims.

[0075] In addition to the above-described embodiments, the following supplementary notes are also disclosed. [Appendix 1] a frame-shaped light-blocking member having an upper surface, a lower surface, and an inner surface connecting an inner edge of the upper surface and an inner edge of the lower surface; a light-transmitting member bonded to an upper surface side of the light-blocking member and closing an opening of the light-blocking member, the inner surface has, in a top view, a first region that extends further toward a center of an upper surface opening defined by the inner edge of the upper surface than an inner edge of the upper surface; the inner surface has, in a bottom view, a second region that extends further toward a center of a bottom opening defined by the inner edge of the bottom surface than an inner edge of the bottom surface; a metal film is provided on the lower surface; The metal film does not reach the inner surface of the cover member. [Appendix 2] the first region is a region that extends, in a top view, along the entire length of an inner edge of the top surface toward the center of the top surface opening beyond the inner edge of the top surface, The cover member according to claim 1, wherein the second region is a region that extends, in a bottom view, along the entire length of the inner edge of the bottom surface and toward the center of the bottom opening beyond the inner edge of the bottom surface. [Appendix 3] 3. The cover member according to claim 1, wherein the inner surface is curved in a cross-sectional view perpendicular to the upper surface of the light-shielding member. [Appendix 4] In a cross-sectional view in a direction perpendicular to the upper surface of the light-blocking member, the inner surface has a first connection point connected to the top surface; a second connection point connected to the lower surface; an intersection point where a first line passing through the first connection point and the second connection point intersects with a second line that passes through a midpoint of the first line and is perpendicular to the first line; and the angle formed by the top surface and a straight line passing through the first connection point and the intersection point; and The angle formed by the line passing through the second connection point and the intersection point and the lower surface is 4. The cover member according to any one of claims 1 to 3, wherein the angle is greater than or equal to 55 degrees and less than 90 degrees. [Appendix 5] the light-blocking member is made of silicon, 5. The cover member according to any one of claims 1 to 4, wherein the light-transmitting member is made of glass. [Appendix 6] 6. The lid member according to claim 5, wherein the distance from the metal film to the inner edge of the lower surface is 0 to 1 μm. [Appendix 7] A substrate; a light-emitting element disposed on an upper surface of the substrate; and a cover member according to any one of Supplementary Notes 1 to 6, the lower surface of the light-blocking member is bonded to the outer periphery of the upper surface of the substrate, The light emitting device, wherein the light emitting element is sealed by the substrate and the lid member. [Appendix 8] A step of preparing a plate-shaped light-blocking member; providing a metal film on a first main surface of the light-shielding member, the metal film having a first opening formed therein that exposes the first main surface; providing a covering film having a second opening exposing the second main surface formed on a second main surface of the light-shielding member at a position overlapping with the first opening when viewed from the first main surface side; performing an etching process on the light-shielding member from the first main surface side and the second main surface side to form a through-hole that penetrates from the first opening to the second opening; and disposing a plate-shaped light-transmitting member on the second main surface of the light-blocking member to close the through-hole, In the step of forming the through hole, A method for manufacturing a lid member, wherein the through hole is formed by penetrating a first recess formed from the metal film side and a second recess formed from the coating film side. [Appendix 9] 9. The method for manufacturing a cover member according to claim 8, further comprising the step of removing the coating film between the step of forming the through hole and the step of arranging the light-transmitting member. [Appendix 10] In the step of forming the through hole, The method for manufacturing a lid member according to Appendix 8 or 9, wherein the etching process is continued after the first recess and the second recess are penetrated, thereby further etching the inner surface where the inner surface of the first recess and the inner surface of the second recess are connected at the time of penetration between the first recess and the second recess, thereby forming the inner surface of the lid member. [Appendix 11] the light-shielding member is a silicon substrate having the first main surface formed of a {100} plane, In the step of forming the through hole, a first recess having a {111} plane inclined relative to the {100} plane formed therein and a second recess having a {111} plane inclined relative to the {100} plane formed therein; The method for manufacturing a cover member according to any one of appendixes 8 to 10, wherein the etching process is continued after the penetration, so that the {111} plane of the first recess and the {111} plane of the second recess are etched, thereby forming a curved inner side surface in a cross-sectional view perpendicular to the first main surface. [Appendix 12] In the step of forming the metal film, the metal film is formed so as to open a plurality of the first openings in the first main surface of the light-shielding member, and to have grooves that are arranged to surround each of the first openings and expose the first main surface; 12. The method for manufacturing a cover member according to any one of claims 8 to 11, further comprising, after the step of arranging the light-transmitting member, a step of cutting the light-blocking member and the light-transmitting member along the groove portion. [Appendix 13] forming a coating film on the metal film between the step of forming the metal film and the step of forming the through hole, the coating film covering the groove portion without covering the first opening portion; 13. The method for manufacturing a cover member according to claim 12, further comprising the step of removing the coating film on the metal film between the step of forming the through hole and the step of cutting. [Explanation of symbols]

[0076] 1 Cover member 10,10W Light-shielding material 10m First main surface 10n Second principal surface 11 Top side 11a, 12a Inner edge 12 Bottom side 13 Inner surface 13a 1st area 13b Second area 13m inner surface 13n inner surface 14 External surface 15a Top side opening 15c,16c center 16a Bottom side opening 18 Through holes 18a First recess 18b Second recess 20,20W Translucent material 30 Metal Film 32 First Opening 34 Groove 40,50 Coating membrane 42 Second opening 100,100A light emitting device 110 Substrate 115 Submount 120 Light-emitting element 120a Output end face 125 Reflective material 130 Metal Film 140 Metal Adhesive

Claims

1. a frame-shaped light-blocking member having an upper surface, a lower surface, and an inner surface connecting an inner edge of the upper surface and an inner edge of the lower surface; a light-transmitting member bonded to an upper surface side of the light-blocking member and closing an opening of the light-blocking member, the inner surface has, in a top view, a first region that extends further toward a center of an upper surface opening defined by the inner edge of the upper surface than an inner edge of the upper surface; the inner surface has, in a bottom view, a second region that extends further toward a center of a bottom opening defined by the inner edge of the bottom surface than an inner edge of the bottom surface; a metal film is provided on the lower surface; The metal film does not reach the inner surface of the cover member.

2. the first region is a region that extends, in a top view, along the entire length of an inner edge of the top surface toward a center of the top surface opening beyond the inner edge of the top surface, The cover member according to claim 1 , wherein the second region is a region that extends along the entire length of an inner edge of the lower surface toward the center of the lower opening beyond the inner edge of the lower surface in a bottom view.

3. The cover member according to claim 1 , wherein the inner side surface is curved in a cross section perpendicular to the upper surface of the light-shielding member.

4. In a cross-sectional view in a direction perpendicular to the upper surface of the light-blocking member, the inner surface has a first connection point connected to the top surface; a second connection point connected to the lower surface; an intersection point where a first line passing through the first connection point and the second connection point intersects with a second line that passes through a midpoint of the first line and is perpendicular to the first line; and an angle formed between the top surface and a straight line passing through the first connection point and the intersection point; and The angle formed by the line passing through the second connection point and the intersection point and the lower surface is The lid member according to claim 1 , wherein the angle is equal to or greater than 55 degrees and less than 90 degrees.

5. the light-blocking member is made of silicon, The cover member according to claim 1 , wherein the light-transmitting member is made of glass.

6. The lid member according to claim 1 , wherein the distance from the metal film to the inner edge of the lower surface is equal to or greater than 0 μm and equal to or less than 1 μm.

7. A substrate; a light-emitting element disposed on an upper surface of the substrate; The cover member according to any one of claims 1 to 6, the lower surface of the light-blocking member is bonded to the outer periphery of the upper surface of the substrate, The light emitting device, wherein the light emitting element is sealed by the substrate and the lid member.

8. A step of preparing a plate-shaped light-blocking member; providing a metal film on a first main surface of the light-shielding member, the metal film having a first opening formed therein that exposes the first main surface; providing a coating film having a second opening exposing the second main surface at a position on the second main surface of the light-shielding member that overlaps with the first opening when viewed from the first main surface side; performing an etching process on the light-shielding member from the first main surface side and the second main surface side to form a through hole that penetrates from the first opening to the second opening; and disposing a plate-shaped light-transmitting member on the second main surface of the light-blocking member to close the through-hole, In the step of forming the through hole, A method for manufacturing a lid member, wherein the through hole is formed by penetrating a first recess formed from the metal film side and a second recess formed from the coating film side.

9. The method for manufacturing a cover member according to claim 8 , further comprising a step of removing the coating film between the step of forming the through-hole and the step of arranging the light-transmitting member.

10. In the step of forming the through hole, The etching process is continued after the first recess and the second recess are penetrated, 9. The method for manufacturing a lid member according to claim 8, further comprising etching an inner surface where the inner surface of the first recess and the inner surface of the second recess are connected at the time when the first recess and the second recess are penetrated, thereby forming an inner surface of the lid member.

11. the light-shielding member is a silicon substrate having the first main surface formed of a {100} plane, In the step of forming the through hole, a first recess having a {111} plane inclined relative to the {100} plane formed therein and a second recess having a {111} plane inclined relative to the {100} plane formed therein; 9. The method for manufacturing a cover member according to claim 8, wherein the etching process is continued after the penetration, so that the {111} plane of the first recess and the {111} plane of the second recess are etched to form curved inner surfaces in a cross-sectional view perpendicular to the first main surface.

12. In the step of forming the metal film, the metal film is formed so as to open a plurality of the first openings in the first main surface of the light-shielding member, and to have grooves that are arranged to surround each of the first openings and expose the first main surface; The method for manufacturing a cover member according to claim 8 , further comprising the step of cutting the light-blocking member and the light-transmitting member along the groove portion after the step of arranging the light-transmitting member.

13. forming a coating film on the metal film between the step of forming the metal film and the step of forming the through hole, the coating film covering the groove portion without covering the first opening portion; The method for manufacturing a cover member according to claim 12 , further comprising the step of removing the coating film on the metal film between the step of forming the through-holes and the step of cutting.

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