Wide-coverage light-emitting driving package, backlight unit, and display apparatus

Abstract

To provide: a wide-coverage light-emitting driving package having a wide light irradiation area; and a backlight unit and a display device.SOLUTION: The wide-area light-emitting driving package may include: a substrate; a terminal layer formed on one surface of the substrate; a wiring layer formed on the opposite surface of the substrate and electrically connected to the terminal layer through through-electrodes; at least one light-emitting element mounted on a portion of the wiring layer and disposed at a peripheral region of the substrate; a driving element mounted on another portion of the wiring layer, disposed at a central region of the substrate, and configured to drive the light-emitting element; and a protective member covering and protecting the light-emitting element and the driving element.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a wide-area light-emitting driving package, a backlight unit, and a display device, and more particularly to a wide-area light-emitting driving package, a backlight unit, and a display device having a wide light irradiation area. [Background technology]

[0002] Generally, a conventional light emitting device package has one light emitting device (LED) mounted on a substrate and molded with a molding material. When such a single focus light emitting device package is used in a backlight unit, the light irradiation area is narrow. To solve this problem, a separate optical lens capable of refracting or diffusing light is attached to the light path.

[0003] However, the use of such a separate optical lens increases the number of parts and production processes, significantly reducing the cost and productivity of the product, and also causes light loss due to diffusion and refraction at the interface of the optical lens, significantly reducing light efficiency. Furthermore, when configuring a backlight, the focal length becomes longer, increasing the required optical distance (OD), resulting in a thicker backlight unit. Furthermore, when configuring a backlight unit with the same area, the number of light emitting device packages required increases significantly, making it difficult to achieve optical uniformity.

[0004] In addition, in a backlight unit using such a conventional light emitting device package, in addition to the light emitting device packages, separate driving elements such as a driver IC for driving the light emitting device packages are mounted on a printed circuit board. This makes the wiring layer of the printed circuit board very complicated, and since the wiring layer must be configured in multiple layers, the complexity of the circuit of the printed circuit board increases, and the manufacturing cost of the printed circuit board also increases. In addition, the number of parts such as driving elements increases, which significantly increases the unit price of the product and the costs of manufacturing processes such as bonding. In addition, there are many problems, such as the occurrence of distortion of the directivity angle due to position deviation during assembly of the above-mentioned optical lens.

[0005] Meanwhile, backlight units using conventional light emitting device packages mount the light emitting device and driving device on a single printed circuit board on the same plane, which results in a large package or circuit configuration, resulting in an increase in the cost of raw materials. Summary of the Invention [Problem to be solved by the invention]

[0006] The present invention has been made to solve many problems, including those mentioned above, and aims to provide a wide-area light-emitting driving package, a backlight unit, and a display device that can achieve a high light intensity and a wide beam angle by forming a multi-focus package in which a plurality of micro LEDs are arranged around a driving element, and that can reduce the number of components, thereby lowering the unit cost of the product and significantly improving productivity. However, these problems are merely examples, and the scope of the present invention is not limited thereto. [Means for solving the problem]

[0007] To solve the above problems, a wide-range light-emitting driving package according to the concept of the present invention may include a substrate, a terminal layer formed on one side of the substrate, a wiring layer formed on the other side of the substrate and electrically connected to the terminal layer using a through electrode, at least one light-emitting element mounted on a part of the wiring layer and positioned at an outer position of the substrate, a driving element mounted on another part of the wiring layer and positioned at a central position of the substrate to drive the light-emitting element, and a protective member covering and protecting the light-emitting element and the driving element.

[0008] Furthermore, according to the present invention, a plurality of the light emitting elements may be symmetrically arranged in a diagonal or cross direction around the driving element for wide coverage of the optical path.

[0009] In addition, according to the present invention, the light emitting elements may be arranged in the front left, front right, rear left, and rear right directions around the driving element, or may be two or more LEDs arranged in the front, back, left, and right directions, respectively.

[0010] According to the present invention, the light emitting element may include at least one of a red LED, a green LED, a blue LED, a white LED, and a combination thereof.

[0011] In addition, according to the present invention, the terminal layer includes a pad portion formed at an outer corner portion of the lower surface of the substrate, and an extension portion extending from the pad portion so as to fade in to a center portion of the lower surface of the substrate, and the wiring layer may include a first wiring portion, a portion of which is electrically connected to a pad through electrode formed on at least one of the pad portions and another portion of which is connected to the driving element, a second wiring portion, a portion of which is electrically connected to an extension through electrode formed on the extension portion and another portion of which is connected to the driving element, and a third wiring portion, a portion of which is connected to the driving element, another portion of which is connected to each of the plurality of light emitting elements, and still another portion of which is electrically connected to the pad through electrode.

[0012] In addition, according to the present invention, the third wiring portion may be formed in a spiral shape that is angular or rounded overall and gradually widens in area so that it can extend from the driving element through all of the light emitting elements to the pad through electrode.

[0013] In addition, according to the present invention, the light emitting device is a micro LED or a mini LED, the driving device is a driver IC having one or more channels for driving the micro LED, and the protective member is molded on the wiring layer and includes at least one component selected from the group consisting of silicone, epoxy, a fluorescent layer, quantum dots, a translucent material, and combinations thereof.

[0014] In addition, according to the present invention, the protective member may include at least one of a planar molding member having at least a flat light-emitting surface, a single concentric molding member formed in a circular or polygonal shape with multiple concentric points centered on one point, a prism molding member that is partitioned into areas corresponding to each of the light-emitting elements and disperses light, a multiple concentric molding member that is formed in a circular or polygonal shape with multiple concentric points centered on each of the light-emitting elements, and combinations thereof.

[0015] Meanwhile, a backlight unit according to the concept of the present invention for solving the above problems may include a wide-range light-emitting driving package.

[0016] Meanwhile, a display device according to the concept of the present invention for solving the above problems may include a wide-range light-emitting driving package. [Effects of the Invention]

[0017] According to one embodiment of the present invention configured as described above, a multi-focus package in which a plurality of micro LEDs are arranged around a driving element can be formed, thereby achieving high light intensity and a wide beam angle, reducing the number of components to reduce product unit cost and manufacturing costs and significantly improving productivity, minimizing the complexity of the circuit on the printed circuit board when applied to a backlight unit, widening the light irradiation area to improve light efficiency, significantly reducing the number of components required, reducing the thickness of the product, and preventing component deviation and beam angle distortion by using a molding member as a lens to integrate the components. Of course, these effects do not limit the scope of the present invention. [Brief explanation of the drawings]

[0018] [Figure 1] 1 is a perspective view of a wide-area light-emitting driving package according to some embodiments of the present invention; [Figure 2] 2 is a bottom view of the wide-area light-emitting driving package of FIG. 1. [Figure 3] 2 is a plan view showing the wide-area light-emitting driving package of FIG. 1. FIG. [Figure 4] 2 is a cross-sectional view showing the wide-area light-emitting driving package of FIG. 1; [Figure 5] 10 is an external perspective view showing a wide-area light-emitting driving package according to some other embodiments of the present invention; FIG. [Figure 6] 10 is an external perspective view showing a wide-area light-emitting driving package according to still another embodiment of the present invention; FIG. [Figure 7] 10 is an external perspective view showing a wide-area light-emitting driving package according to still another embodiment of the present invention; FIG. [Figure 8] 1 is a plan view illustrating a light irradiation area of ​​a wide-area light-emitting driving package according to some embodiments of the present invention. [Figure 9] 1 is a plan view illustrating a backlight unit according to some embodiments of the present invention. [Figure 10] 1 is a plan view of a display device according to some embodiments of the present invention; [Figure 11] 1A-1D are cross-sectional views illustrating a step-by-step process for manufacturing a wide-area light-emitting driving package according to some embodiments of the present invention. [Figure 12] 1A-1D are cross-sectional views illustrating a step-by-step process for manufacturing a wide-area light-emitting driving package according to some embodiments of the present invention. [Figure 13] 1A to 1C are cross-sectional views illustrating a manufacturing process for a wide-area light-emitting driving package according to some embodiments of the present invention. [Figure 14] 1 is a flowchart illustrating a method for manufacturing a large area light emitting driving package according to some embodiments of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0019] Various preferred embodiments of the present invention will now be described in detail with reference to the accompanying drawings.

[0020] The embodiments of the present invention are provided to more completely explain the present invention to those skilled in the art, and the following embodiments may be modified into various other forms, and the scope of the present invention is not limited to the following embodiments. Rather, these embodiments are provided to make the present disclosure more complete and complete, and to fully convey the concept of the present invention to those skilled in the art. In addition, the thickness and size of each layer in the drawings are exaggerated for convenience and clarity of explanation.

[0021] Throughout the specification, when a component, such as a film, region, or substrate, is referred to as being "on," "connected," "stacked," or "coupled" to another component, it can be interpreted as meaning that the component is directly "on," "connected," "stacked," or "coupled" to the other component, or that there may be additional components intervening therebetween. On the other hand, when a component is referred to as being "directly on," "directly connected," or "directly coupled" to another component, it is interpreted as meaning that there are no additional components intervening therebetween. Like numbers refer to like components. As used herein, the term "and / or" includes any one of the listed items, and all combinations of one or more.

[0022] In this specification, terms such as "first" and "second" are used to describe various members, components, regions, layers, and / or portions, but it is clear that these members, components, regions, layers, and / or portions should not be limited by these terms. These terms are used only to distinguish one member, component, region, layer, or portion from another region, layer, or portion. Thus, a "first" member, component, region, layer, or portion described in detail below can be referred to as a "second" member, component, region, layer, or portion without departing from the teachings of the present invention.

[0023] FIG. 1 is a perspective view showing a wide-area light-emitting driving package 100 according to some embodiments of the present invention, FIG. 2 is a bottom view showing the wide-area light-emitting driving package 100 of FIG. 1, FIG. 3 is a plan view showing the wide-area light-emitting driving package 100 of FIG. 1, and FIG. 4 is a cross-sectional view showing the wide-area light-emitting driving package 100 of FIG. 1.

[0024] First, as shown in Figures 1 to 4, a wide-area light-emitting driving package 100 according to some embodiments of the present invention can be broadly divided into a substrate 10, a terminal layer 20, a wiring layer 30, a light-emitting element 40, a driving element 50 and a protective member 60.

[0025] The substrate 10 may be, for example, a substrate or board such as a single-layer or multi-layer printed circuit board, a ceramic substrate, or a metal substrate, at least a portion of which is made of an insulating material, and may be a plate-like structure having sufficient strength and durability to support the light-emitting element 40, the driving element 50, and the protective member 60.

[0026] However, the substrate 10 is not necessarily limited to that shown in the drawings, and may be formed in a wide variety of three-dimensional shapes depending on the specifications, type, or shape of each package.

[0027] The terminal layer 20 may be, for example, a type of conductive layer formed on one surface, i.e., the lower surface, of the substrate 10 .

[0028] More specifically, the terminal layer 20 may be a conductive layer including pad portions 21 such as power terminals Vdd, power terminals Vss, digital input terminals Din, and digital output terminals Dout formed at the outer corners of the lower surface of the substrate 10, as shown in FIG. 2, and extension portions 22 extending from the pad portions 21 so as to fade in to the center portion of the lower surface of the substrate 10.

[0029] However, the shape and type of the terminal layer 20 are not necessarily limited to those shown in the drawings, and a wide variety of other shapes and types of terminal layers may be applied.

[0030] The wiring layer 30 may be, for example, a conductive layer formed on the other surface, i.e., the upper surface, of the substrate 10 and electrically connected to the terminal layer 20 using a through electrode T.

[0031] More specifically, the wiring layer 30 may include, for example, as shown in FIG. 3, a first wiring portion 31, a portion of which is electrically connected to the pad through electrode T1 formed at the power terminal Vss of the pad portion 21, and another portion of which is connected to the driving element 50; a second wiring portion 32, a portion of which is electrically connected to the extension through electrodes T2 formed at the power terminal Vdd, the digital input terminal Din, and the digital output terminal Dout formed at the extension portion 22, respectively, and another portion of which is connected to the driving element 50; and a third wiring portion 33, a portion of which is connected to the driving element 50, another portion of which is connected to a plurality of light-emitting elements 40, and still another portion of which is electrically connected to the pad through electrode T1.

[0032] Here, the third wiring part 33 may be formed in a spiral shape with gradually widening range, having an angular or rounded shape overall, so that it can be extended from the driving element 50 through all of the light emitting elements 40 to the pad through electrode T1, thereby improving the integration density of the package.

[0033] However, the shape and type of the wiring layer 30 are not necessarily limited to those shown in the drawings, and a wide variety of other shapes and types of terminal layers may be applied.

[0034] In addition, although not shown, the wide-area light-emitting driving package 100 according to some embodiments of the present invention may further include an underfill material filled between the substrate 10 and the light-emitting element 40 or between the substrate 10 and the driving element 50, a conductive adhesive material applied on the wiring layer 30, etc.

[0035] The light emitting element 40 is, for example, a light output element mounted on a portion of the wiring layer 30 and disposed at an outer periphery of the substrate 10. More specifically, for example, the light emitting element 40 may include at least one of a red LED, a green LED, a blue LED, a white LED, or a combination thereof to form a backlight, or may be a micro LED or a mini LED that can form one display pixel using a red LED, a green LED, and a blue LED.

[0036] The light emitting device 40 may be, for example, a flip-chip type LED (Light Emitting Diode) having first and second pads formed on its bottom surface. However, the light emitting device 40 is not necessarily limited to the flip-chip type, and may also be a non-flip type LED including inorganic light emitting chips of various colors having pads formed on its top surface. The light emitting device 40 may be any type of LED, including a general LED, a mini LED, or a micro LED.

[0037] In addition, light emitting devices in which bonding wires are applied to the terminals or in which bonding wires are applied only to the first or second terminals, horizontal and vertical light emitting devices, etc. may all be applied, but a flip chip configuration may be preferable in order to realize miniaturization and ultra-thinning of the product.

[0038] The driving element 50 may be, for example, a driver IC with one or more channels that is mounted on another portion of the wiring layer 30 and is disposed at the center of the substrate 10 to drive the light emitting element 40 .

[0039] More specifically, the driving element 50 may include, for example, at least one display driver integrated circuit (DDIC).

[0040] That is, the driving element 50 may be a driving component such as a driver IC with one or more channels that is electrically connected to the light emitting element 40 and drives the light emitting element 40 .

[0041] The driving element 50 includes a driving circuit therein, and the driving circuit may be formed in various forms to supply power to the light emitting element 40, control the driving voltage, process a feedback signal, control the brightness of the light emitting element 40 when it is driven, or correct the light intensity of the light emitting element 40 to match the reference light intensity of another light emitting element.

[0042] However, the driving element 50 is not necessarily limited to the one shown in the drawings, and may be formed in a wide variety of three-dimensional shapes depending on the specifications, type, or shape of each package.

[0043] Here, as shown in Figures 1 to 4, for example, a plurality of light emitting elements 40 may be symmetrically arranged diagonally or crosswise around the driving element 50 to achieve wide coverage of the optical path using an overlapping light divergence angle K.

[0044] 3, the light emitting element 40 may be two or more LEDs (four in the drawing) arranged on the front left, front right, rear left, and rear right sides of the driving element 50. However, the arrangement of the light emitting element 40 is not necessarily limited to that shown in the drawing, and although not shown, the light emitting element 40 may also be two or more LEDs arranged on the front, back, left, and right sides of the driving element 50.

[0045] The protective member 60 may be, for example, a kind of light-transmitting member that covers and protects the light-emitting element 40 and the driving element 50 .

[0046] More specifically, the protective member 60 may include at least one light-transmitting component or light-converting component selected from the group consisting of silicone, epoxy, a fluorescent layer, quantum dots, a light-transmitting material, and combinations thereof, which are molded onto the wiring layer 30.

[0047] Therefore, when a power signal, a power supply signal, a digital input signal, etc. are input via the terminal layer 20 formed on the underside of the substrate 10, each electrical signal is transmitted to the wiring layer 30 formed on the upper surface of the substrate 10 via the through electrode T, and each such input signal can first be input to the driving element 50.

[0048] Next, the drive signal of the drive element 50 is applied to the four light-emitting elements 40 via the wiring layer 30 by each input signal, and is diverged over a wide area by a multi-focus light source having a multiple light divergence angle K, and a digital output signal can be output again via the wiring layer 30, the through electrode T and the terminal layer 20.

[0049] FIG. 5 is an external perspective view showing a wide-range light-emitting driving package 200 according to some other embodiments of the present invention, FIG. 6 is an external perspective view showing a wide-range light-emitting driving package 300 according to yet another embodiment of the present invention, and FIG. 7 is an external perspective view showing a wide-range light-emitting driving package 400 according to some yet another embodiment of the present invention.

[0050] The protective member 60 may be, for example, a flat molding member 61 having at least a flat light-emitting surface, as shown in FIGS.

[0051] However, the protective member 60 is not necessarily limited to those shown in the drawings, and may include, for example, a single concentric molding member 62 formed in a circular or polygonal shape with multiple concentric portions centered on one point as shown in FIG. 5, a prism-type molding member 63 partitioned into areas corresponding to each light-emitting element 40 and dispersing light in multiple directions as shown in FIG. 6, or a multiple concentric molding member 64 formed in a circular or polygonal shape with multiple concentric portions centered on multiple points corresponding to each light-emitting element 40 as shown in FIG.

[0052] Therefore, according to the present invention, a multi-focal package is formed by arranging two or more light emitting elements 40, i.e., a large number of micro LEDs, around the driving element 50, thereby achieving high light intensity and a wide beam angle. Furthermore, by integrating the lens function into the molding member, the number of parts can be reduced, which reduces the unit price of the product and manufacturing costs and greatly improves productivity.

[0053] FIG. 8 is a plan view showing a light irradiation area A of a wide-area light-emitting driving package 100 according to some embodiments of the present invention.

[0054] 8, the light irradiation area A of the wide-area light-emitting driving package 100 according to some embodiments of the present invention can fully cover the backlight area B, so that the thickness of a single backlight unit can be reduced while still achieving a sufficient backlight effect with only the wide-area light-emitting driving package 100. In addition, when a backlight unit is applied, the complexity of the circuit on the printed circuit board can be minimized, the light irradiation area is widened, light efficiency is improved, and the number of components required can be significantly reduced. Furthermore, the molding member acts as a lens, integrating each component and preventing component deviation and distortion of the directivity angle.

[0055] FIG. 9 is a plan view illustrating a backlight unit 1000 according to some embodiments of the present invention.

[0056] As shown in FIG. 9, a backlight unit 1000 according to some embodiments of the present invention may be mounted on a bar-type or fork-type printed circuit board 1002 in which the above-mentioned wide-area light-emitting driving packages 100 to 400 are formed inside a rectangular frame 1001.

[0057] Therefore, the backlight unit 1000 of the present invention can minimize the circuit complexity of the printed circuit board 1002, widen the light irradiation area, improve light efficiency, and significantly reduce the number of components required. Furthermore, the molding member acts as a lens, integrating each component and preventing component deviation and distortion of the directivity angle.

[0058] FIG. 10 is a plan view of a display device 2000 according to some embodiments of the present invention.

[0059] As shown in FIG. 10, a display device 2000 according to some embodiments of the present invention may be configured such that a plurality of the above-mentioned wide-area light-emitting driving packages 100 to 400 form pixels and are arranged in M ​​rows and N columns to form a display screen as a whole.

[0060] Therefore, the display device 2000 of the present invention has a wide viewing angle, providing good visibility, and does not require additional driver ICs, thereby reducing the number of parts and processes, reducing the unit cost of the product, and significantly improving productivity.

[0061] 11-13 are cross-sectional views illustrating the steps of manufacturing a large area light emitting driving package 100 according to some embodiments of the present invention.

[0062] As shown in Figures 11 to 13, the manufacturing process of a wide-area light-emitting driving package 100 according to some embodiments of the present invention will be described step by step. First, as shown in Figure 11, a substrate 10 can be prepared having a terminal layer 20 formed on one side and a wiring layer 30 electrically connected to the terminal layer 20 using a through electrode T formed on the other side.

[0063] Next, as shown in FIG. 12, at least one light-emitting element 40 arranged at the outer periphery of the substrate 10 can be mounted on a part of the wiring layer 30, and a driving element 50 arranged at the center of the substrate 10 to drive the light-emitting element 40 can be mounted on another part of the wiring layer 30.

[0064] 13, a protective member 60 for covering and protecting the light emitting element 40 and the driving element 50 is molded, and the package can be separated by cutting along cutting lines CL.

[0065] FIG. 14 is a flow chart illustrating a method for manufacturing a large area emission driving package according to some embodiments of the present invention.

[0066] As shown in Figures 1 to 14, a manufacturing method for a wide-area light-emitting driving package according to some embodiments of the present invention may include the steps of: (a) preparing a substrate 10 having a terminal layer 20 formed on one side and a wiring layer 30 formed on the other side, the wiring layer 30 being electrically connected to the terminal layer 20 using a through electrode T; (b) mounting at least one light-emitting element 40 disposed at the outer periphery of the substrate 10 on a part of the wiring layer 30, and mounting a driving element 50 disposed at the center of the substrate 10 to drive the light-emitting element 40 on another part of the wiring layer 30; and (c) molding a protective member 60 that covers and protects the light-emitting element 40 and the driving element 50.

[0067] Although the present invention has been described with reference to the embodiments shown in the drawings, these are merely illustrative, and those skilled in the art will recognize that various modifications and equivalent embodiments are possible. Therefore, the true technical scope of the present invention should be determined by the technical spirit of the appended claims. [Explanation of symbols]

[0068] 10 Substrate 20 terminal layer 21 Pad section 22 Extension 30 wiring layer 31 1st wiring section 32 2nd wiring section 33 Third wiring section T Through electrode T1 through-pad electrode T2 extended through electrode 40 Light-emitting element K Light divergence angle 50 drive element 60 Protective material 61 Flat molding components 62 Single concentric molding member 63 Prism-type molding material 64 Multiple concentric molding members 100, 200, 300, 400 Wide range light emission driving package A Light irradiation area B Backlight area CL cutting line 1000 Backlight Unit 1001 frames 1002 printed circuit board 2000 display device

Claims

1. substrate, a terminal layer formed on one surface of the substrate; a wiring layer formed on the other surface of the substrate and electrically connected to the terminal layer using a through electrode; At least one light emitting element mounted on a portion of the wiring layer and disposed at an outer periphery of the substrate; a driving element mounted on another portion of the wiring layer and disposed at a central position of the substrate, the driving element driving the light-emitting element; and a protective member that covers and protects the light emitting element and the driving element; A wide range of light-emitting drive packages including:

2. The wide-area light-emitting driving package according to claim 1 , wherein a plurality of the light-emitting elements are symmetrically arranged in a diagonal or cross direction around the driving element for wide coverage of the light path.

3. The wide-range light-emitting driving package according to claim 2, wherein the light-emitting element is two or more LEDs arranged in the front left, front right, rear left, and rear right directions around the driving element, or arranged in the front, back, left, and right directions.

4. The wide-area light-emitting driving package according to claim 3 , wherein the light-emitting element comprises at least one of a red LED, a green LED, a blue LED, a white LED, and a combination thereof.

5. The terminal layer is a pad portion formed at an outer corner portion of the lower surface of the substrate; and an extension portion extending from the pad portion so as to be able to fade into a central portion of the lower surface of the substrate; The wiring layer is a first wiring portion, one portion of which is electrically connected to a through-pad electrode formed on at least one of the pad portions, and another portion of which is connected to the driving element; a second wiring portion, one portion of which is electrically connected to an extended through electrode formed on the extension portion and the other portion of which is connected to the driving element; and a third wiring portion, one portion of which is connected to the driving element, another portion of which is connected to the plurality of light emitting elements, and still another portion of which is electrically connected to the through-pad electrode; 10. The broad-area light-emitting driving package of claim 1, comprising:

6. 6. The wide-area light-emitting driving package of claim 5, wherein the third wiring portion is formed in a spiral shape that is gradually widened and has an angular or rounded shape overall so that it can extend from the driving element through all of the light-emitting elements to the pad through electrode.

7. the light emitting element is a micro LED or a mini LED; The driving element is a driver IC having one or more channels for driving the micro LED; The wide-area light-emitting driving package of claim 1 , wherein the protective member is molded on the wiring layer and includes at least one of silicone, epoxy, a fluorescent layer, quantum dots, a translucent material, and combinations thereof.

8. 8. The wide-area light-emitting driving package of claim 7, wherein the protective member comprises at least one of a planar molding member having at least a flat light-emitting surface, a single concentric molding member formed in a circular or polygonal shape with multiple concentric points centered on one point, a prism-type molding member that disperses light while being partitioned into areas corresponding to each of the light-emitting elements, a multiple concentric molding member that is formed in a circular or polygonal shape with multiple concentric points centered on each of the light-emitting elements, and combinations thereof.

9. A backlight unit comprising the broad-area light-emitting driving package of any one of claims 1 to 8.

10. A display device comprising the broad range light emitting driving package of any one of claims 1 to 8.

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