Method of loading semiconductor device with fine bumps into insert

Abstract

To provide a method of loading a semiconductor device with fine bumps into an insert.SOLUTION: The present invention relates to a method of loading a semiconductor device with a plurality of fine bumps on a bottom surface thereof into an insert having guide grooves formed on a top surface thereof in which the fine bumps are respectively accommodated. A method of loading a semiconductor device with fine bumps into an insert according to one embodiment of the present invention includes: a step in which a first vision module captures a bottom image of the semiconductor device picked up by a picker; a step in which a second vision module captures a top image of the insert; and a step in which the picker loads the semiconductor device onto the insert based on the bottom image and the top image.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a method for loading semiconductor devices having fine bumps onto an insert. [Background technology]

[0002] HBM (High Bandwidth Memory) was developed in response to the demand for increased memory bandwidth, primarily driven by high-performance applications such as computers and graphics processing units. While the existing GDDR (Graphics Double Data Rate) memory technology was widely used in high-performance graphics cards and systems, it was reaching its limits due to increasing bandwidth requirements. Therefore, memory manufacturers needed a new technology that could provide higher bandwidth and process data more efficiently.

[0003] To meet these demands, HBM employs an innovative design that creates a stack of memory chips. HBM uses vertically stacked memory chips to achieve high bandwidth, while occupying less space and consuming less power. These characteristics have led to HBM gaining attention as memory bandwidth and power efficiency become increasingly important in high-performance computing and graphics processing systems.

[0004] On the other hand, HBM requires testing in die form before packaging. HBM dies have many more contacts than conventional memory, and many contacts are provided at a fine pitch in a limited area. However, conventional test handlers have difficulty making fine-pitch contacts to test HBM. Summary of the Invention [Problem to be solved by the invention]

[0005] SUMMARY OF THE INVENTION An object of the present invention is to provide a method for aligning and loading fine pitch devices onto an insert for testing.

[0006] The objects of the present invention are not limited to those mentioned above, and other objects not mentioned will be clearly understood by those skilled in the art from the following description. [Means for solving the problem]

[0007] A method for loading a semiconductor device having fine bumps onto an insert according to an embodiment of the present invention relates to a method for loading a semiconductor device having a plurality of fine bumps on a bottom surface onto an insert having guide grooves formed on an upper surface in which the fine bumps are respectively accommodated.

[0008] A method for loading a semiconductor device having fine bumps onto an insert according to one embodiment of the present invention includes a step in which a first vision module captures a bottom image of the semiconductor device picked up by a picker, a step in which a second vision module captures a top image of the insert, and a step in which the picker loads the semiconductor device onto the insert based on the bottom image and the top image.

[0009] The step of loading the semiconductor device onto the insert includes the steps of: determining the position of a reference bump that serves as a reference among the plurality of fine bumps in the bottom image; determining the position of a reference groove that accommodates the reference bump among the plurality of guide grooves in the top image; determining the amount of movement and rotation for the semiconductor device based on the position of the reference bump and the position of the reference groove; and transferring the semiconductor device to the upper side of the insert based on the determined amount of movement, and placing the semiconductor device onto the insert in an aligned posture based on the determined amount of rotation.

[0010] In the step of determining the positions of the reference bumps, the actual position and orientation of the semiconductor device are determined based on the positions of the reference bumps on the bottom image.

[0011] In the step of determining the position of the reference groove, the actual position and posture of the insert on which the semiconductor device is loaded are determined based on the position of the reference groove on the top surface image.

[0012] In the step of determining the positions of the reference bumps, the actual position of the semiconductor device is determined based on the positions of the reference bumps on the bottom image and the accurately set photographing position of the first vision module.

[0013] In the step of determining the position of the reference groove, the actual position of the insert is determined based on the position of the reference groove on the top image and the accurately set photographing position of the second vision module.

[0014] In the step of determining the amount of movement and rotation of the semiconductor device, the amount of movement of the semiconductor device is determined based on a coordinate difference between the actual position of the semiconductor device and the actual position of the insert.

[0015] In the step of determining the position of the reference bump, the actual orientation of the semiconductor device is determined based on a first angle that the reference bump shown in the bottom image has with respect to a reference point on the bottom image.

[0016] In the step of grasping the position of the reference groove, the actual posture of the insert is grasped based on a second angle that the reference groove shown in the top surface image has with respect to a reference point on the top surface image.

[0017] In the step of determining the amount of movement and rotation of the semiconductor device, the amount of rotation of the semiconductor device is determined based on the difference between the first angle and the second angle.

[0018] The step of loading the semiconductor device onto the insert includes the steps of: determining the positions of dummy bumps formed separately from the plurality of fine bumps in the bottom image; determining the positions of dummy bump grooves formed separately from the plurality of guide grooves to accommodate the dummy bumps in the top image; determining the amount of movement and rotation for the semiconductor device based on the positions of the dummy bumps and the positions of the dummy bump grooves; and transporting the semiconductor device to the upper side of the insert based on the determined amount of movement, and placing the semiconductor device onto the insert in an aligned posture based on the determined amount of rotation.

[0019] In the step of determining the positions of the dummy bumps, the actual position and orientation of the semiconductor device are determined based on the positions of the dummy bumps on the bottom image.

[0020] In the step of determining the positions of the dummy bump grooves, the actual position and posture of the insert on which the semiconductor device is to be placed are determined based on the positions of the dummy bump grooves on the top surface image.

[0021] The dummy bumps are formed to be larger than the fine bumps and have a lower end shape corresponding to the shape of the fine bumps.

[0022] The dummy bumps are located outside the area where the fine bumps are located on the bottom surface of the semiconductor device.

[0023] The method further includes the step of having a plurality of the pickers arranged in a predetermined arrangement pick up a plurality of the semiconductor devices.

[0024] In the step of the first vision module capturing the bottom surface image, the bottom surface of a representative semiconductor device picked up by a representative picker among the plurality of pickers is captured.

[0025] In the step of determining the amounts of movement and rotation of the semiconductor devices, amounts of movement and rotation for the remaining semiconductor devices are determined based on the amounts of movement and rotation for the representative semiconductor device.

[0026] In the step of the first vision module capturing the bottom image, the bottom image is captured while light from an illumination is irradiated onto the bottom surface of the semiconductor device.

[0027] In the step of the second vision module capturing the top surface image, the top surface image is captured with light from an illumination illuminating the top surface of the insert.

[0028] In the step of placing the semiconductor device in the insert in the aligned position, a fixing member of the insert presses the placed semiconductor device downward, thereby fixing the position of the semiconductor device.

[0029] In the step of placing the semiconductor device into the insert in the aligned position, the floating board on which the guide groove is formed and the semiconductor device are pressed downward by the fixing member, and the insert terminals housed inside the guide grooves come into contact with the fine bumps that have been moved downward.

[0030] Other details of the invention are included in the detailed description and drawings. [Effects of the Invention]

[0031] According to the embodiment of the present invention, at least the following effects are obtained.

[0032] The picker can place the fine-pitch devices in the precise positions of the insert, thereby improving the reliability of test results in tests on semiconductor products with fine pitches.

[0033] Furthermore, by automatically loading the semiconductor products at precise positions within the insert and fixing the positions, the time required for aligning semiconductor products having fine pitches can be effectively reduced.

[0034] The effects of the present invention are not limited to the above-mentioned examples, and more diverse effects are included within the present specification. [Brief explanation of the drawings]

[0035] [Figure 1] 1 shows a test tray that can be used in a method for loading semiconductor devices having fine bumps onto an insert according to one embodiment of the present invention. [Figure 2] 1 shows an insert that can be used in a method for loading a semiconductor device having fine bumps onto an insert according to one embodiment of the present invention. [Figure 3] FIG. 3 is an exploded perspective view of the insert shown in FIG. 2. [Figure 4] 3 shows diagrammatically electrical contacts that can be provided on the insert of FIG. 2; [Figure 5] 1 is a flow chart of a method for loading a semiconductor device having fine bumps onto an insert according to an embodiment of the present invention. [Figure 6] 1 conceptually illustrates a pickup module and a vision module that can be used in a method for loading a semiconductor device having fine bumps onto an insert according to one embodiment of the present invention. [Figure 7] 1 is a flowchart illustrating a first embodiment of a "step in which a picker loads a semiconductor device onto an insert" included in a method for loading a semiconductor device having fine bumps onto an insert according to one embodiment of the present invention. [Figure 8] 10 shows that a bottom image is captured by a first vision module at a first capturing position in a step in which a picker according to a first embodiment of the present invention loads a semiconductor device into an insert. [Figure 9]10 shows that a top image is captured by the second vision module at a second capturing position in the step where the picker of the first embodiment of the present invention loads the semiconductor device into the insert. [Figure 10] 10 shows an example of a bottom image taken in a step in which a picker according to a first embodiment of the present invention loads semiconductor devices onto an insert. [Figure 11] 10A and 10B show exemplary top images captured in a step in which a picker according to a first embodiment of the present invention loads semiconductor devices onto an insert. [Figure 12] 10 shows that in the step in which the picker of the first embodiment loads the semiconductor devices onto the insert, the semiconductor devices have been moved to the upper side of the insert in an aligned position. [Figure 13] 10 illustrates a state in which a picker is tightly attached to the upper side of an insert according to an embodiment of the present invention. [Figure 14] 10 illustrates a state in which a semiconductor device is seated on a floating board after an insert according to an embodiment of the present invention is switched to an open state. [Figure 15] 10 shows that the insert is switched to a closed state after the picker according to the embodiment of the present invention loads the semiconductor device. [Figure 16] 10 is a flowchart illustrating a second embodiment of the "step of a picker loading a semiconductor device onto an insert" included in a method of loading a semiconductor device having fine bumps onto an insert according to one embodiment of the present invention. [Figure 17] 10 shows that a bottom image is captured by a first vision module at a first capturing position in a step in which a picker of a second embodiment of the present invention loads a semiconductor device into an insert. [Figure 18] 10 shows that a top image is captured by the second vision module at a second capturing position in a step in which the picker of the second embodiment of the present invention loads the semiconductor device into the insert. [Figure 19]10 conceptually illustrates a bottom image captured in a step in which a picker according to a second embodiment of the present invention loads semiconductor devices onto an insert. [Figure 20] 10A and 10B show exemplary top view images taken in a step in which a picker according to a second embodiment of the present invention loads semiconductor devices onto an insert. DETAILED DESCRIPTION OF THE INVENTION

[0036] The advantages and features of the present invention, as well as methods for achieving them, will become apparent from the following detailed description of the embodiments in conjunction with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, and may be embodied in various different forms. The embodiments are provided solely to complete the disclosure of the present invention and to fully convey the scope of the invention to those skilled in the art. The present invention is defined by the scope of the claims.

[0037] Furthermore, the embodiments described herein are described with reference to cross-sectional views and / or schematic diagrams that are ideal examples of the present invention. Therefore, the shapes of the illustrative views may be modified due to manufacturing techniques and / or tolerances. Furthermore, the components in the drawings shown in the present invention may be slightly enlarged or reduced in size for the convenience of explanation. The same reference numerals refer to the same components throughout the specification.

[0038] Hereinafter, the term "semiconductor device" refers to a semiconductor product having a plurality of bumps arranged at a fine pitch on its bottom surface. The semiconductor device may be a finished product or a semi-finished product. For example, the semiconductor device may be a high-bandwidth memory (HBM). Herein, the term "bump" refers to a terminal protruding from the bottom surface of the semiconductor product.

[0039] Furthermore, the directions of up / down / front / back / left / right mentioned below are merely used to facilitate understanding of the positions of other elements using one reference point, and the present invention is not limited to such directions. For example, it is obvious that the invention may be installed and / or operated in directions different from those described below in the course of actual use, and the present invention is to be construed as including such embodiments.

[0040] Furthermore, the coordinates of the grooves / bumps referred to below are the center coordinates of the grooves / bumps, or the coordinates of the boundary points, or the coordinates of the points indicating the grooves / bumps that the user has preset based on specific criteria.

[0041] Hereinafter, the present invention will be described with reference to the drawings illustrating a method for loading a semiconductor device having fine bumps onto an insert according to an embodiment of the present invention.

[0042] For ease of understanding, a test tray and an insert that can be used in a method for loading semiconductor devices having fine bumps onto an insert according to an embodiment of the present invention will be described first with reference to FIGS.

[0043] FIG. 1 shows a test tray that can be used in a method for loading semiconductor devices having fine bumps onto an insert according to one embodiment of the present invention.

[0044] Referring to FIG. 1, a test tray 1 usable in one embodiment of the present invention is configured to allow a plurality of semiconductor devices to be transported while being loaded on inserts 100. The plurality of semiconductor devices are configured to be loaded on the inserts 100 and seated in a test apparatus so that they can be tested. The test can be performed using equipment known as a "handler," which tests performance under specific temperature conditions and classifies the devices according to grade. Methods of testing semiconductor devices using handlers have been well known in the art, and therefore, a description thereof will be omitted.

[0045] A plurality of inserts 100 can be provided on sub-trays 10 provided in a plurality on the test tray 1. A plurality of sub-trays 10 can be configured and detachably connected to the test tray 1. If necessary, a test can be performed with one or more sub-trays 10 connected to the test tray 1.

[0046] If necessary, the test tray 1 can wait in a separate location, and only the subtray 10 can be transported to a position where the semiconductor devices are loaded or unloaded. The subtray 10 can be coupled to the test tray 1 after the semiconductor devices to be tested are loaded onto the inserts 100, and can be separated from the test tray 1 and transported separately to unload the semiconductor devices after the test is completed. At this time, a well-known selective fastening element can be used to couple and release the subtray 10 and test tray 1.

[0047] The subtray 10 is configured to accommodate a predetermined number of inserts 100. A semiconductor device may be loaded onto each of the inserts 100. The loaded semiconductor devices may be in electrical contact with the inserts 100. Each of the inserts 100 may be electrically connected to a board forming the bottom surface of the subtray 10. To this end, the board forming the bottom of the subtray 10 may have tray terminals electrically connected to the inserts 100. The tray terminals may be formed on the surface of the bottom of the subtray 10 where each insert 100 is seated.

[0048] In addition, the tray terminals can be electrically connected to test terminals formed on the bottom surface of the sub-tray 10. When the test tray 1 is seated in the test equipment, the sockets of the test equipment and the test terminals come into electrical contact, through which the inserts 100 can be electrically connected to the test equipment. As a result, the semiconductor devices are electrically connected to the test equipment through the inserts 100 and the sub-tray 10, and can exchange signals.

[0049] However, the above-described sub-tray configuration can be selectively applied. For example, the sub-tray can be omitted and modified so that multiple insert modules can directly contact the test tray 1. Alternatively, the sub-tray itself can be modified to be used as the test tray.

[0050] The insert 100 is configured to reliably fix the position of the semiconductor device during transport and / or testing of the test tray 1. When the semiconductor device is fixed in the insert 100, the bumps of the semiconductor device can each be brought into electrical contact with the electrical contact means of the insert 100.

[0051] Continuing with the description with reference to Figures 2 and 3, Figure 2 shows an insert that can be used in a method for loading a semiconductor device having fine bumps onto an insert according to one embodiment of the present invention, and Figure 3 is an exploded perspective view of the insert shown in Figure 2.

[0052] As shown in FIGS. 2-3, the insert 100 usable in one embodiment of the present invention may include an upper block 310, a lower block 320, a securing member 330, and an electrical contact portion 200.

[0053] The upper block 310 may be configured to be coupled to the lower block 320 in the vertical direction. In this case, the upper block 310 may be configured to be able to move up and down a predetermined height relative to the lower block 320 in the coupled state. Although not shown, a known elastic member may be disposed between the upper block 310 and the lower block 320 to elastically support the upper block 310 relative to the lower block 320. For example, the elastic member may be a coil spring.

[0054] Meanwhile, the fixing member 330 may be configured so that a pivot angle relative to the lower block 320 can be adjusted according to the distance between the upper block 310 and the lower block 320. For example, the fixing member 330 may have a lower end branched into two so that the angle can be adjusted according to the height of the upper block 310. One of the branched ends may be connected to the upper block 310 so that the angle can be adjusted, and the other may be connected to the lower block 320 so that the angle can be adjusted.

[0055] With this structure, when the upper block 310 is raised to its maximum, the free ends of the fixing members 330 can be rotated to their maximum extent downwards of the insert 100. In this state, the free ends of the fixing members 330 can press downwards on the top surfaces of the semiconductor devices loaded inside the insert 100. In contrast, when the upper block 310 is lowered to its maximum extent, the free ends can be rotated in a direction that allows them to be in maximum contact with the inner wall of the insert 100. In this state, the gap between the pair of fixing members 330 becomes larger than the width of the semiconductor devices, allowing the semiconductor devices to be removed from the insert 100.

[0056] The fixing members 330 are provided in pairs and configured symmetrically to each other, and may form a circular space between them when the upper block 310 is in a closed state with the upper block 310 fully raised. To this end, the free end of the fixing member 330 may be recessed in a semicircular shape.

[0057] Meanwhile, the electrical contact portion 200 may be configured to be in electrical contact with the semiconductor device loaded on the insert 100 when the fixing member 330 presses the semiconductor device (closed state). The electrical contact portion 200 may form the bottom of the lower block 320 (the surface on which the semiconductor device is seated) on its upper surface, and the bottom of the insert 100 (the surface that is seated on the subtray) on its bottom surface. When the insert 100 is coupled to the subtray, the electrical contact portion 200 may be in electrical contact with the tray terminals formed on the board through terminals exposed at its lower end.

[0058] An electrical contact according to an embodiment of the present invention will now be described with reference to Fig. 4. Fig. 4 schematically illustrates an electrical contact that can be installed in the insert of Fig. 2.

[0059] As shown in FIG. 4, the electrical contact 200 according to an embodiment of the present invention may include a floating board 240, a terminal board 250, a circuit board 220, and a fixed board 230.

[0060] The floating board 240 is a plate-shaped member that provides a surface on which a semiconductor device is seated by an insert. The floating board 240 may be installed above the terminal board 250 so that its height can be adjusted relative to the terminal board 250. Although not shown, the floating board 240 may be elastically supported by various elastic members known in the art. For example, an elastic member that elastically supports the floating board 240 upward may be disposed between the floating board 240 and the terminal board 250. Alternatively, an elastic member may be disposed between the floating board 240 and the circuit board 220 in consideration of the narrow gap between the floating board 240 and the terminal board 250. In this case, the floating board 240 and the circuit board 220 may be larger than the terminal board 250. For example, the elastic member may be a coil spring.

[0061] Meanwhile, the floating board 240 may be formed to be slightly smaller than the size of the pocket of the upper block. Here, the pocket may refer to the internal space of the upper block. Therefore, the floating board 240 can be slightly swung horizontally (front, back, left, right) as well as up and down while being elastically supported. This swung motion allows the guide grooves 241 to move in precise alignment with the fine bumps when the semiconductor device is seated on the floating board 240.

[0062] Meanwhile, a plurality of guide grooves 241 may be drilled on the upper surface of the floating board 240 to accommodate the respective fine bumps formed on the bottom surface of the semiconductor device. The guide grooves 241 may be formed to a size and depth corresponding to the fine bumps, with an upper end having a constant inner diameter and a lower end having a shape in which the inner diameter decreases as the depth increases. In this case, the deepest part of the guide grooves 241 may have an inner diameter of approximately 0.2 mm. The insert terminals 210 of the terminal board 250 may be accommodated inside the guide grooves 241.

[0063] The terminal board 250 may be disposed below the floating board 240, and may have a plurality of insert terminals 210 protruding upward from an upper surface thereof. In addition, the terminal board 250 may have lower ends of the insert terminals 210 exposed at a bottom surface thereof.

[0064] The number of insert terminals 210 corresponds to the number of fine bumps, and each can be inserted into the guide groove 241. In an open state where the semiconductor device is not pressed by a fixing member, the insert terminals 210 can be accommodated in the deep lower end of the guide groove 241. When the insert is switched to a closed state, the floating board 240, which is pressed by the fixing member, descends, and the upper end of the insert terminals 210 rises relative to the floating board 240 to a height adjacent to the upper end of the guide groove 241. As a result, the insert terminals 210 can be in electrical contact with the fine bumps accommodated in the guide groove 241.

[0065] Meanwhile, the circuit board 220 may be disposed below the terminal board 250. The circuit board 220 may be formed with pitch expansion circuits that are electrically connected to the lower ends of the insert terminals 210. In this case, the spacing between contacts (hereinafter referred to as top contact terminals) located on the top surface of the circuit board 220 in the pitch expansion circuits may correspond to the spacing between the insert terminals 210. In addition, the spacing between contacts (hereinafter referred to as bottom contact terminals) that are extended from each of the top contact terminals and exposed on the bottom surface of the circuit board 220 may be wider than the spacing between the top contact terminals.

[0066] Meanwhile, the fixing board 230 is a board including external terminals 231 electrically connected to the bottom contact terminals, and is a plate-shaped member forming the bottom surface of the insert. The spacing between the external terminals 231 is similar to the spacing between the bottom contact terminals. The upper end of each external terminal 231 may be exposed on the upper surface of the fixing board 230, and the lower end may be exposed on the bottom surface of the fixing board 230. The upper end of the external terminal 231 may be in electrical contact with the bottom contact terminals. In contrast, the lower end of the external terminal 231 may be in electrical contact with a tray terminal or a socket of a test device.

[0067] The insert used in the present invention has such a structure, and has the advantage that the intervals between the terminals formed on the socket can be set wider than the intervals between the bumps on the semiconductor device.

[0068] Based on the above description, a method for mounting a semiconductor device having fine bumps on an insert according to an embodiment of the present invention will now be described. For ease of explanation, the same reference numerals will be used to designate the same or similar parts as those described above, and descriptions of common parts will be omitted.

[0069] FIG. 5 is a flow chart of a method for loading a semiconductor device having fine bumps onto an insert according to one embodiment of the present invention.

[0070] As shown in FIG. 5, a method for loading a semiconductor device having fine bumps onto an insert according to one embodiment of the present invention may include a step (S100) of a picker picking up the semiconductor device, a step (S200) of a first vision module capturing a bottom image of the semiconductor device, a step (S300) of a second vision module capturing a top image of the insert, and a step (S400) of the picker loading the semiconductor device onto the insert.

[0071] In the step S100 of picking up the semiconductor device by the picker, a picker configured to be able to pick and place the semiconductor device picks up the semiconductor device. At this time, the picker may be provided in the handler apparatus and be capable of transporting the semiconductor device from a pick position to a place position. At this time, the place position is a position where the above-mentioned sub-tray, test tray, and / or insert waits to receive the semiconductor device.

[0072] For example, the picker may be configured to hold the semiconductor device using air pressure. As an example, the picker may have a suction cup at a lower portion and be capable of applying negative pressure to the semiconductor device while the suction cup is in close contact with the semiconductor device. Such a picker may use a conventionally known technique, and therefore a detailed description thereof will be omitted.

[0073] In this step, the picker can pick up at least one semiconductor device from the picking position. At this time, the semiconductor devices picked up at one time can be stacked on the same sub-tray. Meanwhile, the user can set the picker's operation so that the picker picks up the exact center of the semiconductor device in this step. However, this is an ideal setting, and in reality, errors occur when the semiconductor device is transported to the picking position and picked up by the picker. Due to such errors, the actual position and posture of the picker when the picker picks up the semiconductor device may differ slightly from the ideal prediction.

[0074] For ease of understanding, the pickup position is a position where a picker driven by a drive device within the system performs a pickup operation, and can be preset to accurate coordinates. Therefore, the pickup position is always the same. The semiconductor device to be picked up can be loaded into the pickup position in advance. Ideally, the prepared semiconductor device should be positioned at the pickup position without error, but it is extremely difficult to always transport the semiconductor device without even the slightest error during the semiconductor device transportation process.

[0075] Although such a small error does not cause any problem in picking up the semiconductor device during the picking operation of the picker at the picking position, such an error can cause the actual position and posture of the semiconductor device picked up by the picker to vary slightly each time.

[0076] Meanwhile, when the semiconductor device is picked up by the picker, the bottom surface from which the fine bumps protrude may be exposed downward, that is, the picker may pick up the semiconductor device by holding the top surface of the semiconductor device.

[0077] In step S200, the first vision module captures an image of the bottom surface of the semiconductor device picked up by the picker. To this end, the first vision module may include a camera module for capturing images and an illumination module for obtaining a clear image. For example, the illumination module may include a coaxial illumination module that irradiates light coaxially with the optical axis of the camera and / or a ring illumination module that is arranged in a ring shape surrounding the camera module.

[0078] Hereinafter, the position where the bottom image is captured by the first vision module is referred to as the first capturing position. To efficiently form the picker's movement line, the first capturing position can be set between the pickup position and the place position. In this case, the first vision module can be positioned so as to view the upper side at the bottom of the path along which the picker moves from the pickup position to the place position.

[0079] When the picker reaches the first imaging position, it can be set to stop for a while to capture a bottom image. At this time, the first vision module is fixed and the user can use this to determine the coordinates of the first imaging position. That is, because the position of the first vision module is accurately identified within the system, the coordinates of the first imaging position where the picker will stop can be accurately determined in advance. The first imaging position set in this way can be used to determine the actual position and orientation of the semiconductor device through the bottom image.

[0080] Specifically, since the first vision module and the first photographing position are fixed, each coordinate of the bottom image always photographs the same position in real space. For ease of understanding, the plane on which the semiconductor device is located on the bottom image is referred to as the XY plane. At this time, a specific coordinate of the bottom image always indicates an object located at the same coordinate on the XY plane in real space.

[0081] In step S300, the second vision module photographs the insert from above. Thus, a top-side image of the insert can be acquired. The top-side image can include the top of the upper block, the floating board, and the fixing member, which form the top of the insert. Alternatively, the top-side image can be acquired by focusing on the floating board portion of the insert.

[0082] Similar to the first vision module, the second vision module can include a camera module for taking pictures and a lighting module for clear images. For example, the lighting module can include a coaxial lighting module that irradiates light coaxially with the optical axis of the camera and / or a ring lighting module that is arranged in a ring shape surrounding the camera module.

[0083] The second vision module can be configured to view the insert above the insert waiting in the place location, for example, the second vision module can be configured to reach the above of the insert via a path that intersects with the picker, or can be configured to move with the picker.

[0084] Meanwhile, the place position corresponds to the current position of the insert where the semiconductor device is actually loaded. Therefore, the place position is a preset position within the system, and ideally, it should always be the same. However, in reality, during the process of preparing the subtray and / or insert, it is extremely difficult to load the subtray and / or insert into the same position every time without even a slight error. Therefore, the actual place position will change slightly each time.

[0085] In contrast, the position captured by the second vision module is always a specific and constant position. This is because the second vision module is always moved to the same position by a drive device within the system. Hereinafter, the position to which the second vision module moves to capture an image of the insert will be referred to as the second imaging position. In other words, the second imaging position is accurately set in advance by the user, and the accurately set second imaging position can be used to determine the actual position and posture of the insert.

[0086] Specifically, as with the bottom image, specific coordinates on the top image always correspond to the same coordinates on the XY plane in real space, so the user can see the insert on the top image and understand its actual position and posture.

[0087] In step S400, the picker loads the semiconductor device onto the insert, and determines the actual positions and orientations of the semiconductor device and the insert based on the bottom and top images, and places the semiconductor device onto the insert in an aligned orientation, where the aligned orientation is an orientation in which the fine bumps formed on the semiconductor device can be accommodated in the corresponding guide grooves formed on the insert.

[0088] Here, the actual position of the semiconductor device can be determined by the XY coordinates of a representative point having the semiconductor device at the first photographing position, for example, the representative point being the center coordinate of the semiconductor device, or at least one of the fine bumps of the semiconductor device, or a separate alignment means.

[0089] In addition, the actual attitude of the semiconductor device may be expressed as a first angle indicating how rotated the semiconductor device is when picked up. Information regarding the actual attitude may be grasped through the position of a representative point displayed on the bottom image. Meanwhile, in order to adjust the attitude (angle) of the semiconductor device, the picker may be configured to be rotatable about a central axis when picking up the semiconductor device. The attitude of the semiconductor device may be corrected by rotating the picker.

[0090] The actual position of the insert indicates the place position and can be grasped as the XY coordinate values ​​of the representative point of the insert when photographed by the second vision module at the second photographing position, where the representative point is the center coordinate of the insert, or at least one of the guide grooves of the insert, or a separate alignment means.

[0091] In addition, the actual orientation of the insert may be expressed by a second angle indicating how much the insert has been rotated. Information regarding the actual orientation may be grasped through the position of a representative point displayed on the top image. In the above example, the picker rotates the semiconductor device, but an example in which a stage on which a sub-tray is seated rotates instead of the picker is also possible.

[0092] In this step, the semiconductor devices are loaded onto the insert in an aligned position as follows.

[0093] An information processing device, which is communicable with the first vision module and the second vision module, first receives the bottom image and the top image, respectively, and determines the actual positions and orientations of the semiconductor device and the insert based on the received images. In this case, the information processing device is a computer device having a program non-temporarily recorded thereon, which is configured to execute each step of the method according to an embodiment of the present invention.

[0094] The information processing device determines the amount of movement required to move the semiconductor device directly above the insert and the amount of rotation the semiconductor device must be aligned to be loaded onto the insert. At this time, the state in which the semiconductor device is rotated by the determined amount of rotation is the position in which the semiconductor device is aligned with the insert.

[0095] The picker can then move and rotate the semiconductor device in the XY plane based on the movement and rotation amounts. Alternatively, the rotation can be implemented by a stage, and the insert itself can be rotated so that the semiconductor device has an aligned posture relative to the insert. At this time, the order of the movement and rotation in the XY coordinates is irrelevant. That is, the semiconductor device can be moved by the movement amount and then rotated by the rotation amount, or alternatively, the semiconductor device can be rotated by the rotation amount and then moved by the movement amount.

[0096] Hereinafter, a method for simultaneously aligning a plurality of semiconductor devices in a method for loading semiconductor devices having fine bumps onto an insert according to an embodiment of the present invention will be described with reference to Fig. 6. Fig. 6 conceptually illustrates a pickup module and a vision module that can be used in a method for loading semiconductor devices having fine bumps onto an insert according to an embodiment of the present invention.

[0097] 6, the pickup module 3000 used in the present invention may include a plurality of pickers 2000 so as to be able to pick up a plurality of semiconductor devices 1000 at one time. The pickup module 3000 may be movable on the XY plane using a conventionally known structure and may be capable of moving up and down in the Z-axis direction. The pickup module 3000 moves to a position directly above a set pickup position and then descends to pick up a plurality of semiconductor devices 1000 positioned at the pickup position at one time.

[0098] Meanwhile, the number and arrangement of the pickers 2000 may correspond to the number and arrangement of the inserts mounted on the sub-trays used in the system. For example, if the inserts are mounted in a 2x4 arrangement as in the example of FIG. 1, the pickers 2000 may also be mounted at the bottom of the pickup module 3000 in the same number and arrangement.

[0099] Therefore, when the pickup module 3000 shown in FIG. 6 is used in the method according to an embodiment of the present invention, in the step (S100) in which the picker picks up the semiconductor devices, multiple pickers 2000 arranged in an arrangement corresponding to the arrangement of the inserts pick up the semiconductor devices 1000 at once.

[0100] In this case, semiconductor devices 1000 are loaded onto user trays formed to correspond to the sub-trays and wait at the pickup position. Grooves for loading the semiconductor devices 1000 are formed on the user trays, and the grooves of the user trays may be spaced apart at the same intervals as the intervals between the pickers 2000 and / or inserts. The grooves of the user trays may also have a shape that matches the shape of the semiconductor devices 1000. This allows the semiconductor devices 1000 to be loaded onto the user trays without shaking. Therefore, the semiconductor devices 1000 placed on one user tray may have the same error when picked up. That is, an error occurs when the user tray is misaligned at the pickup position, and this error may occur equally for each of the loaded semiconductor devices 1000.

[0101] 6 is used, an embodiment of the present invention captures a bottom image of only the semiconductor device 1000A held by one picker 2000A among the plurality of pickers 2000, and based on this, can apply the same or similar amounts of movement and rotation to all the remaining pickers 2000 and semiconductor devices 1000. As an example, the picker 2000A serving as the reference for alignment is either one of the pickers 2000 located at the front or rear of the pickup module 3000. Hereinafter, to distinguish it from the other pickers 2000, the picker 2000A serving as the reference for alignment will be referred to as the representative picker 2000A, and the semiconductor device 1000A held by the representative picker 2000A will be referred to as the representative semiconductor device 1000A.

[0102] In this case, in step S200 in which the first vision module captures an image of the bottom surface of the semiconductor device, the representative semiconductor device 1000A moves to the first imaging position, and the first vision module 4100 images the bottom surface of the representative semiconductor device 1000A. Figure 6 shows a situation in which the first vision module 4100 and the representative picker 2000A are aligned at the first imaging position.

[0103] Once the first vision module 4100 has completed capturing an image, the pickup module 3000 moves forward toward where the sub-tray is located. At this time, a second vision module 4200 may be installed in front of the pickup module 3000. As a result, the second vision module 4200 moves together with the pickup module 3000 and can move ahead of the picker 2000. This structure allows the second vision module 4200 to naturally reach the insert first as the picker 2000 moves to the place position, thereby efficiently forming the movement line of the pickup module 3000.

[0104] When the second vision module 4200 reaches the set second photographing position, the pickup module 3000 stops again, and the second vision module 4200 can begin photographing. At this time, the second photographing position is a position directly above where the insert on which the representative semiconductor device 1000A is to be loaded is ideally located. Therefore, when the pickup module 3000 of FIG. 6 is used, the second vision module 4200 reaches the second photographing position first as the pickup module 3000 advances, and the step (S300) in which the second vision module photographs a top surface image of the insert can naturally be performed. Similarly, in this step, a top surface image of the insert on which the representative semiconductor device 1000A is to be loaded can be acquired.

[0105] In step S400, in which the picker loads the semiconductor devices onto the insert, the amount of movement and rotation required for the representative semiconductor device 1000A to be inserted into the insert in an appropriate posture is determined. At this time, the information processing device calculates and determines the additional amount of movement of the semiconductor device 1000A, taking into account the distance the pickup module 3000 has already advanced past the first photographing position.

[0106] At this time, since the pickup position, the first photographing position, and the second photographing position are accurately set, the information processing device can calculate the XY movement amount based on the difference between the coordinates of the representative semiconductor device 1000A in the bottom image and the coordinates of the insert in the top image. Alternatively, the information processing device can add the distance the pickup module 3000 has advanced to the coordinates of the representative semiconductor device 1000A in the bottom image and then calculate the additional distance to be moved to the insert shown in the top image.

[0107] Meanwhile, the remaining semiconductor devices 1000 held at the same time have the same or similar errors as the representative semiconductor device 1000A, and therefore require adjustments of the same or similar amounts of movement and rotation as the representative semiconductor device 1000A. At this time, since all pickers 2000 are mounted at predetermined intervals on one pickup module 3000, the remaining semiconductor devices 1000 also move the same amount of movement as the representative semiconductor device 1000A during the process of aligning the representative semiconductor device 1000A with the corresponding insert. Thereafter, when the representative picker 2000A and the other pickers 2000 rotate by the rotation amount, all semiconductor devices 1000 are aligned with the corresponding insert. Thereafter, the pickup module 3000 descends and loads a plurality of semiconductor devices 1000 onto the sub-tray, thereby completing the loading operation.

[0108] Although the above example illustrates the case where the alignment operation for all semiconductor devices 1000 is performed based on one representative semiconductor device 1000A, the present invention is not necessarily limited to this example. That is, the picker can be set to perform the alignment operation individually for each of the semiconductor devices 1000A in principle. That is, when the remaining semiconductor devices 1000 are aligned based on the representative semiconductor device 1000A, this can be used only in certain cases where the loading errors of the semiconductor devices 1000 are the same or similar to each other.

[0109] A first embodiment of the step (S400) in which a picker loads semiconductor devices onto an insert will be described below with reference to Figures 7 to 12. Figure 7 is a flowchart illustrating a first embodiment of the "step of a picker loading semiconductor devices onto an insert" included in a method for loading semiconductor devices having fine bumps onto an insert according to an embodiment of the present invention.

[0110] As shown in FIG. 7, the step of the picker according to the first embodiment loading a semiconductor device into an insert may include a step of determining the position of a reference bump in a bottom image (S1410), a step of determining the position of a reference groove in a top image (S1420), a step of determining the amount of movement and rotation for the semiconductor device (S1430), and a step of placing the semiconductor device into the insert in an aligned position (S1440).

[0111] First, in step S1410 of determining the position of a reference bump in a bottom image, the position of a reference bump among a plurality of fine bumps is determined in the bottom image. As described above, a plurality of bumps (terminals) may protrude from the bottom surface of a semiconductor device. A user may set a fine bump among the fine bumps that is easily identified by an information processing device in the bottom image as the reference bump. For example, the reference bump may be set to a fine bump located at a corner of the plurality of fine bumps.

[0112] In this step, the information processing device recognizes the reference bumps in the bottom image and determines the actual position of the semiconductor device. That is, in this embodiment, the position of the semiconductor device can be identified through the positions of the reference bumps. At this time, the algorithm for recognizing a specific object in an image has been disclosed in the past, so a description thereof will be omitted. Meanwhile, the reference bump does not necessarily have to be set to one, but multiple reference bumps may be set. In this case, in this step, the information processing device can determine the positions of all reference bumps that can be recognized in the bottom image.

[0113] Meanwhile, when some of the reference bumps cannot be recognized, the information processing device can process the subsequent steps based on the recognized reference bumps.Furthermore, when some of the recognized reference bumps are incorrectly recognized, the information processing device can ignore information about the corresponding reference bumps and process the subsequent steps based on the correctly recognized reference bumps.

[0114] In this case, whether or not the reference bump has been recognized incorrectly can be determined, for example, based on the distance from other components. For example, if the distance from the outer boundary of the semiconductor device or a specific component or feature point to the reference bump is pre-recorded in the information processing device, the information processing device can determine that only the reference bump located within a predetermined distance range from the reference point has been recognized correctly. On the other hand, if the recognized reference bump is located outside the predetermined distance range, the information processing device can ignore the reference bump.

[0115] As another example, the information processing device may record distance information from the center of the semiconductor device to the point where the reference bump is located. In this case, if the distance between the actually recognized reference bump and the center point differs from the recorded distance information by a predetermined value or more, it can be determined that the reference bump has been erroneously recognized.

[0116] In step S1420 of determining the position of a reference groove in a top image, the position of a reference groove among a plurality of guide grooves is determined in the top image. At this time, the reference groove is a guide groove in which a reference bump is accommodated.

[0117] In this step, the information processing device recognizes the reference groove in the top image and determines the actual position of the insert. That is, in this embodiment, the position of the insert can be identified through the position of the reference groove. At this time, determining the position of the reference groove inside the insert or floating board shown in the top image can be achieved using a conventionally disclosed algorithm, just like determining the position of the reference bump in the bottom image, so redundant description will be omitted.

[0118] The information processing device is configured to search for a number of reference grooves corresponding to the reference bumps, and in this case, if there are any erroneously recognized reference grooves, they can be ignored. The appropriateness of the recognition of the reference grooves can also be grasped based on the distance between the previously recorded reference grooves and the center point of the floating board, or the distance between the reference grooves and other specific members or features of the insert, etc.

[0119] At this time, the information processing device can only determine the positions of the reference grooves corresponding to the reference bumps that are recognized as appropriate. If there is no reference groove corresponding to a reference bump that was recognized appropriately in the previous step among the reference grooves recognized in this step, the step of capturing a top image (S300) can be performed again.

[0120] At this time, the corresponding reference bumps and reference grooves can be determined by comparing the positions of the reference bumps with respect to the center coordinates of the semiconductor device shown in the bottom image with the positions of the reference grooves with respect to the center coordinates of the floating board shown in the top image. For example, it can be determined that the reference bumps and the reference grooves spaced apart at similar positions with respect to the center coordinates correspond to each other.

[0121] In the step of determining the amount of movement and rotation for the semiconductor device (S1430), the amount of movement and rotation are determined based on the positions of the reference bumps and the reference grooves. In this step, the amount of movement of the picker can be determined based on the coordinates of the reference bumps on the bottom image and the coordinates of the reference grooves on the top image. Also, in this step, the amount of rotation by which the semiconductor device needs to be rotated to be aligned with the insert is determined based on the orientation of the semiconductor device on the bottom image and the orientation of the insert on the top image. That is, the amount of rotation can indicate the angle by which the semiconductor device should be rotated relative to the insert so that the angle of the reference groove relative to the center coordinates of the insert and the angle of the reference bump relative to the center of the semiconductor device are the same in the top image.

[0122] The step of placing the semiconductor devices in the inserts in an aligned position (S1440) can be performed by the picker transferring the semiconductor devices to the upper side of the inserts based on the determined movement and rotation amounts, rotating the semiconductor devices, and then descending to load them onto the inserts. At this time, as described above, the picker can rotate by the rotation amount and then move by the movement amount, or the stage supporting the sub-tray, other than the picker, can also rotate.

[0123] Continuing the description with reference to Figure 8, Figure 8 shows that in the step in which the picker of the first embodiment of the present invention loads a semiconductor device into an insert, a bottom image is captured by the first vision module at a first capturing position.

[0124] 8, a plurality of fine bumps 1001 are protruded from the bottom surface of the semiconductor device 1000, some of which may be set as reference bumps 1002. When the semiconductor device 1000 is held by the picker 2000, the bottom surface may be photographed by the first vision module 4100.

[0125] At this time, the first vision module 4100 may use coaxial lighting and / or ring lighting to illuminate the bottom surface of the semiconductor device 1000 so that shadows are not generated in the bottom surface image due to differences in height caused by the fine bumps 1001 on the bottom surface of the semiconductor device 1000. As a result, the image acquired in the step (S200) of the first vision module capturing the bottom surface image of the semiconductor device may have dark areas due to shadows minimized. Such lighting may have the effect of ensuring a good recognition rate of the reference bumps 1002.

[0126] Meanwhile, FIG. 9 shows that in the step where the picker of the first embodiment of the present invention loads the semiconductor device onto the insert, a top image is captured by the second vision module at the second capturing position.

[0127] 9, a plurality of guide grooves 241 are formed on the upper surface of the floating board 240 of the insert 100, and among them, the guide grooves 241 located at positions corresponding to the reference bumps may be set as reference grooves 242. Each guide groove 241 is formed to a size corresponding to the fine bumps, and may have a shape in which the inner diameter of the lower end portion becomes increasingly narrower so that the positions of the fine bumps are aligned during the process of being seated.

[0128] Meanwhile, in step S300 in which the second vision module captures a top image of the insert, the second vision module 4200 may capture the top image while illuminating the insert 100 with light so that the guide groove 241 is clearly visible in the top image. For example, the second vision module 4200 may use coaxial lighting and / or ring lighting to illuminate the top surface of the floating board 240. This allows the guide groove 241 to be clearly visible in the top image without being hidden by shadows, etc. Such lighting may have the effect of ensuring a good recognition rate for the reference groove 242.

[0129] An example of a method for determining the actual position and orientation of a semiconductor device based on reference bumps will now be described with reference to Fig. 10. Fig. 10 exemplarily illustrates a bottom image captured during a step in which a picker according to a first embodiment of the present invention loads a semiconductor device onto an insert.

[0130] As described above, the information processing device can determine the actual position and orientation of the semiconductor device based on the position R1 of the reference bump shown on the bottom image LI. The center point C1 of the bottom image LI has the same X and Y coordinates as the optical axis of the first vision module. Furthermore, each coordinate of the bottom image LI always has the same X and Y coordinates in real space. This is because the first shooting position is always the same. Therefore, the coordinates of the position R1 of the reference bump on the bottom image LI are used to determine the coordinates of the semiconductor device in real space.

[0131] That is, according to the present invention, the actual position of the semiconductor device can be determined only from the coordinates of the reference bump R1 or only from the position in the image of the mark that can be identified by a separately provided information processing device.

[0132] Meanwhile, the information processing device may recognize a first angle of the reference bump R1 with respect to a predetermined reference point shown in the bottom image LI as the actual attitude of the semiconductor device. For example, the reference point may be set to the center coordinate of the semiconductor device shown in the bottom image LI. In this case, the first angle is the angle between a line connecting the coordinate R1 of the reference bump and the center coordinate of the semiconductor device and a line with a slope of 0. For example, the first angle may be determined based on the slope of the line connecting the coordinate R1 of the reference bump and the center coordinate of the semiconductor device.

[0133] At this time, the center coordinates of the semiconductor device can be determined by a known method. For example, the center coordinates can be obtained by an information processing device recognizing boundary points of the semiconductor device shown in the bottom image LI and averaging the coordinates of the corresponding points. Alternatively, a separate mark for determining the center coordinates can be displayed on the semiconductor device.

[0134] An example of a method for determining the actual position and orientation of an insert based on a reference groove will now be described with reference to Fig. 11. Fig. 11 exemplarily illustrates a top view image captured during a step in which a picker according to a first embodiment of the present invention loads semiconductor devices onto an insert.

[0135] The information processing device can determine the actual position and orientation of the insert based on the position R2 of the reference groove shown in the top image TI. The center point C2 of the top image TI has the same X and Y coordinates as the optical axis of the second vision module. Furthermore, each coordinate of the top image TI always has the same X and Y coordinates in real space. This is because the second shooting position is always the same. Therefore, the coordinates of the position R2 of the reference groove on the top image TI are used to determine the coordinates of the insert in real space.

[0136] That is, according to the present invention, the actual position of the insert can be grasped only from the coordinates of the reference groove R2 or only from the position in the image of the mark that can be identified by a separately provided information processing device.

[0137] Meanwhile, the information processing device can recognize the second angle of the reference groove R2 relative to a predetermined reference point shown in the top-view image TI as the actual posture of the insert. For example, the reference point can be set to the center coordinate of the insert and / or floating board shown in the top-view image TI (hereinafter, referred to as the center coordinate of the insert). In this case, the second angle is the angle between a line connecting the coordinate R2 of the reference groove and the center coordinate of the insert and a line with a slope of 0. For example, the second angle can be determined based on the slope of the line connecting the coordinate R2 of the reference groove and the center coordinate of the insert.

[0138] At this time, the center coordinates of the insert can be determined by a known method. For example, the center coordinates can be obtained by an information processing device recognizing boundary points of the insert and / or floating board shown in the top image TI and averaging the coordinates of the corresponding points. Alternatively, a separate mark for determining the center coordinates can be displayed on the insert and / or floating board.

[0139] Hereinafter, a method for moving semiconductor devices to the upper side of an insert in an aligned position according to a first embodiment of the present invention will be described with reference to Fig. 12. Fig. 12 shows that the semiconductor devices have been moved to the upper side of the insert in an aligned position in the step in which the picker of the first embodiment loads the semiconductor devices onto the insert.

[0140] The amount of movement of the semiconductor device 1000 is determined based on the difference between the actual positions of the reference bumps 1002 grasped in the bottom image on the XY plane and the actual positions of the reference grooves 242 grasped in the top image.

[0141] For example, to determine the amount of movement, the information processing device may calculate the difference between the coordinates of the reference bump 1002 shown in the bottom image and the coordinates of the reference groove 242 shown in the top image, and then convert the calculated difference into a distance value in real space. The information processing device may then add the distance value in real space to the amount of movement that should have been made, to finally determine the amount of movement. In this case, the amount of movement that should have been made is the amount of movement that the picker 2000 should have made when the semiconductor device 1000 and the insert 100 are in ideal positions.

[0142] As another example, the information processing device may convert the position of the reference bump 1002 shown in the bottom image into X and Y coordinates in real space, convert the position of the reference groove 242 shown in the top image into X and Y coordinates in real space, and then calculate the movement amount based on the difference between the converted coordinates. At this time, the difference in distance between the first and second photographing positions may be subtracted from the movement amount.

[0143] On the other hand, if it is necessary to rotate the semiconductor device 1000, the information processing device can reflect the change in X and Y coordinates due to the rotation in advance in the amount of movement. That is, when the semiconductor device 1000 is rotated, the X and Y coordinates of the reference bumps 1002 are changed by the rotation, so the information processing device can determine the amount of movement taking this into consideration.

[0144] For example, the information processing device may first calculate the XY coordinates (hereinafter referred to as "aligned coordinates") of the reference bump 1002 when the semiconductor device 1000 is rotated in an aligned position based on the coordinates of the actual reference bump 1002 captured in the bottom image. Then, the information processing device may determine the amount of movement as described above based on the difference between the aligned coordinates in the bottom image and the coordinates of the reference groove 242 in the top image.

[0145] In contrast, the amount of rotation can be determined based on the difference between the first angle and the second angle. In this case, the information processing device can calculate the angle of rotation by taking into account the position of the actual rotation axis, rather than simply determining the difference between the first angle and the second angle based on the amount of rotation.

[0146] Specifically, as described above, the rotation center axis of the semiconductor device 1000 is the central axis of the cylindrical picker 2000. Since the difference between the first and second angles is calculated based on the angle relative to the central coordinate of the semiconductor device 1000, the angle of rotation based on the central axis of the picker 2000 must be determined during actual rotation. To this end, the information processing device can calculate the difference between the first and second angles and then determine the alignment coordinates in the bottom image. The alignment coordinates can be calculated as coordinates at a point obtained by rotating the coordinates of the reference bump shown in the bottom image by the difference between the first and second angles based on the center point of the semiconductor device. The information processing device then calculates the angle between the line connecting the center point of the bottom image (C1 in FIG. 10) and the alignment coordinates and the line connecting the center point of the bottom image and the actual coordinate R1 of the reference bump shown in the bottom image, and sets this as the rotation amount.

[0147] Hereinafter, a process of loading semiconductor devices into the insert in the step S1440 of placing semiconductor devices into the insert in an aligned position according to an embodiment of the present invention will be described with reference to FIGS.

[0148] Fig. 13 shows a state in which a picker is tightly attached to the upper side of an insert according to an embodiment of the present invention. In contrast, Fig. 14 shows a state in which a semiconductor device is seated on a floating board after the insert according to an embodiment of the present invention has been switched to an open state. Furthermore, Fig. 15 shows a state in which the insert according to an embodiment of the present invention has been switched to a closed state after the picker has loaded the semiconductor device.

[0149] The picker 2000 used in one embodiment of the present invention may include a push shaft 2100 for pushing the upper block 310, and a suction shaft 2200 disposed on the same central axis inside the push shaft 2100. In this case, the operation of picking up and placing the semiconductor device 1000 may be performed based on the air pressure of the suction shaft 2200. In addition, the rotation of the semiconductor device 1000 may be implemented by the rotation of the suction shaft 2200.

[0150] The push shaft 2100 is a hollow tubular member. When the picker 2000 and the insert 100 are coaxially aligned with each other, the push shaft 2100 can be located above the upper block 310, and the suction shaft 2200 can be located above the floating board 240. In this case, the push shaft 2100 and the suction shaft 2200 can be provided so that their heights can be adjusted relative to each other.

[0151] 13, after the semiconductor devices are corrected to an aligned position, the picker module descends and the picker 2000 comes into contact with the insert 100. As the picker module continues to descend, the push shaft 2100 presses the upper block 310, as shown in FIG. 14, switching the insert 100 to an open state.

[0152] At the same time as or immediately after this, the suction shaft 2200 descends, allowing the semiconductor device 1000 to be tightly attached to the floating board 240. Thereafter, as shown in FIG. 15 , when the push shaft 2100 ascends, the height of the upper block 310 increases and the fixing members 330 are switched to the closed state again. At this time, the suction shaft 2200 is accommodated in the circular groove between the fixing members 330 and is not in contact with the fixing members 330. When the fixing members 330 are completely switched to the closed state, the negative pressure of the suction shaft 2200 is released, and the semiconductor device 1000 and the suction shaft 2200 can be separated.

[0153] Meanwhile, the semiconductor device 1000 is pressed downward by the pressure of the fixing member 330, and the position thereof can be fixed to the insert 100. At this time, the floating board 240 and the semiconductor device 1000 are fixed in a state where their heights are lowered by the fixing member 330, and in this state, the insert terminals 210 are in electrical contact with the fine bumps.

[0154] A second embodiment of the step (S400) of the picker loading the semiconductor device onto the insert will be described below with reference to Figures 16 to 20. Figure 16 is a flowchart for describing a second embodiment of the "step of the picker loading the semiconductor device onto the insert" included in the method of loading semiconductor devices having fine bumps onto the insert according to one embodiment of the present invention. To avoid redundant explanation, the explanation of the same parts as in the first embodiment will be simplified.

[0155] In this case, in the case of the method according to the second embodiment, the step (S100) of the picker picking up the semiconductor device, the step (S200) of the first vision module capturing an image of the bottom surface of the semiconductor device, and the step (S300) of the second vision module capturing an image of the top surface of the insert can be performed in the same or similar manner.

[0156] The biggest difference between the first and second embodiments is that the reference used to align the semiconductor device to the insert is not the fine bumps and guide grooves, but the separately provided dummy bumps and grooves for the dummy bumps.

[0157] In this case, the dummy bumps are bumps formed separately from the fine bumps on the semiconductor device. The dummy bumps are not formed for signal transmission of the semiconductor device, but may be formed on the bottom surface of the semiconductor device simply for positioning purposes. To facilitate positioning, the dummy bumps may be larger than the fine bumps. Similar to the reference bumps, the positions and number of the dummy bumps may be varied according to the user's convenience.

[0158] The dummy bump grooves are grooves formed on the floating board to accommodate dummy bumps. The dummy bump grooves are simply used to accommodate and align the dummy bumps, and no insert terminals are disposed therein. Like the dummy bumps, the dummy bump grooves may be larger than the guide grooves. Also, like the reference grooves, the positions and number of the dummy bump grooves may be formed to correspond to the positions and number of the dummy bumps.

[0159] Continuing with the description with reference to FIG. 16, in the second embodiment of the present invention, the step of the picker loading the semiconductor device into the insert may include a step of determining the position of the dummy bumps in a bottom image (S2410), a step of determining the position of the grooves for the dummy bumps in a top image (S2420), a step of determining the amount of movement and rotation for the semiconductor device (S2430), and a step of placing the semiconductor device into the insert in an aligned position (S2440).

[0160] In step S2410, the positions of the dummy bumps in the bottom image are determined. At this time, the user can appropriately adjust the positions and number of the dummy bumps formed on the semiconductor device in consideration of the shape of the semiconductor device and the recognition rate of the dummy bumps.

[0161] For example, dummy bumps may be formed outside an area where fine bumps are densely packed on the bottom surface of a semiconductor device. Generally, fine bumps formed on a semiconductor device are densely packed. Dummy bumps may be formed outside the outermost bumps of the densely packed bumps. The reason for forming them in this manner is to space the dummy bumps far away from the fine bumps so that the dummy bumps do not interfere with the electrical contact between the fine bumps and the insert terminals. Meanwhile, the dummy bumps may be removed from the semiconductor device once testing is complete.

[0162] Alternatively, multiple dummy bumps may be formed, in which case the information processing device can grasp the set number of dummy bumps in the bottom image. Although there are various modifications, when multiple dummy bumps are formed, each dummy bump may be formed at a corner of the semiconductor device. This is to prevent the semiconductor device from tilting to one side when the dummy bumps are inserted into the dummy bump grooves.

[0163] Meanwhile, in order to improve the recognition rate of the dummy bumps in the step S2410 of detecting the positions of the dummy bumps in the bottom image, the dummy bumps may be formed in a color that is distinguishable from the semiconductor device and the fine bumps.

[0164] In addition, the dummy bumps may be formed to have a different shape from the fine bumps when viewed from above, so that the recognition rate of the dummy bumps can be improved in step S2410 where the positions of the dummy bumps are detected in the bottom image.

[0165] For example, the upper end of the dummy bump may be larger than the lower end and have a cross-sectional shape different from that of the fine bump. Conversely, the lower end of the dummy bump may be formed to correspond to the shape of the fine bump. This shape allows the dummy bump to be distinguished from the fine bump in a bottom image by the shape of the upper end, and also allows the dummy bump to align the fine bump with the guide groove. That is, because the shape of the end of the dummy bump is the same or similar to that of the fine bump, the alignment between the dummy bump and the dummy bump groove has the accuracy to align the fine bump with the guide groove. In this case, depending on the size of the end, the dummy bump can align semiconductor devices with a fine pitch of 0.01 to 0.02 mm.

[0166] In addition, the dummy bumps may be formed larger than the fine bumps so that the recognition rate of the dummy bumps can be improved in step S2410, in which the positions of the dummy bumps are identified in the bottom image. Specifically, the dummy bumps have larger maximum diameters and protruding lengths than the fine bumps. Similarly, the shape of the bottom ends of the dummy bumps may correspond to the shape of the fine bumps. Therefore, during the process of mounting the semiconductor device, the dummy bumps can be received in the dummy bump grooves before the fine bumps are received in the guide grooves. As a result, the floating board can be aligned with the guide grooves first due to the dummy bumps.

[0167] In step S2410 of determining the positions of dummy bumps in the bottom image, the information processing device recognizes the dummy bumps in the bottom image and determines the actual position of the semiconductor device. That is, in this embodiment, the position of the semiconductor device can be identified through the positions of the dummy bumps. At this time, the algorithm for recognizing a specific object in an image has been disclosed in the past, so a description thereof will be omitted.

[0168] On the other hand, when a plurality of dummy bumps are set to be recognized, if some of the plurality of dummy bumps cannot be recognized in the bottom image, the information processing device can process the subsequent steps based only on the recognized dummy bumps. Also, if any of the recognized dummy bumps is incorrectly recognized, the information processing device can ignore information about the corresponding dummy bump and process the subsequent steps based on the correctly recognized dummy bumps.

[0169] Whether or not a dummy bump has been recognized incorrectly can be determined, for example, based on its distance from another component. For example, if the distance from the outer boundary of the semiconductor device, the nearest fine bump, or another feature point to the dummy bump is pre-recorded in the information processing device, the information processing device can determine that only dummy bumps located within a predetermined distance range from such a reference point have been recognized correctly. On the other hand, if the recognized dummy bump is located outside the predetermined distance range, the information processing device can ignore the dummy bump.

[0170] As another example, distance information from the center of the semiconductor device to the point where the dummy bump is located can be recorded in the information processing device. In this case, if the distance between the actually recognized dummy bump and the center point differs from the recorded distance information by a predetermined value or more, it can be determined that the corresponding dummy bump has been erroneously recognized.

[0171] In step S2420 of determining the positions of dummy bump grooves in the top image, the positions of the dummy bump grooves shown in the top image are determined. In this step, the information processing device recognizes the dummy bump grooves in the top image and determines the actual positions of the inserts. That is, in this embodiment, the position of the insert can be identified based on the positions of the dummy bump grooves. Here, determining the positions of the dummy bump grooves inside the insert or floating board shown in the top image can be achieved using a conventionally disclosed algorithm, just like determining the positions of the dummy bumps in the bottom image, so a redundant description will be omitted.

[0172] The information processing device is configured to search for dummy bump grooves in a number corresponding to the dummy bumps, and in this case, any erroneously recognized dummy bump grooves can be ignored. The appropriateness of the recognition of the dummy bump grooves can also be determined based on the pre-recorded distance between the dummy bump groove and the center point of the floating board, or the distance between the dummy bump groove and other specific members or features of the insert, etc.

[0173] At this time, the information processing device can only determine the positions of dummy bump grooves corresponding to dummy bumps that are recognized as appropriate. If there is no dummy bump groove corresponding to a dummy bump that was recognized appropriately in the previous step among the dummy bump grooves recognized in this step, the step of capturing a top image (S300) can be performed again.

[0174] At this time, the corresponding dummy bumps and dummy bump grooves can be identified by comparing the positions of the dummy bumps with respect to the center coordinates of the semiconductor device shown in the bottom image with the positions of the dummy bump grooves with respect to the center coordinates of the floating board shown in the top image. For example, it can be determined that dummy bumps and dummy bump grooves spaced apart at similar positions with respect to the center coordinates correspond to each other.

[0175] In the step of determining the amount of movement and rotation for the semiconductor device (S2430), the amount of movement and rotation are determined based on the positions of the dummy bumps and the dummy bump grooves. In this step, the amount of movement of the picker can be determined based on the coordinates of the dummy bumps on the bottom image and the coordinates of the dummy bump grooves on the top image. Also, in this step, the amount of rotation by which the semiconductor device needs to be rotated to be aligned with the insert is determined based on the orientation of the semiconductor device on the bottom image and the orientation of the insert on the top image. That is, the amount of rotation can indicate the angle by which the semiconductor device should be rotated relative to the insert so that the angle of the dummy bump groove with respect to the center coordinates of the insert and the angle of the dummy bump with respect to the center of the semiconductor device are the same in the top image.

[0176] The step of placing the semiconductor devices in the insert in an aligned position (S2440) can be performed by the picker transferring the semiconductor devices to the upper side of the insert based on the determined movement and rotation amounts, rotating the semiconductor devices, and then descending to load them onto the insert. At this time, as described above, the picker can rotate by the rotation amount and then move by the movement amount, or the stage supporting the sub-tray, other than the picker, can also rotate.

[0177] That is, in this embodiment, the actual position and actual posture of the semiconductor device are determined based on the coordinates in the image of the dummy bumps shown in the bottom image, and the actual position and posture of the floating board are determined based on the coordinates in the image of the dummy bump grooves shown in the top image.

[0178] That is, the coordinates of the dummy bumps in the bottom image can be used to determine the coordinates of the corresponding dummy bumps in real space and the coordinates of the semiconductor device having the dummy bumps. Also, the angle of the dummy bumps relative to the center of the semiconductor device on the bottom image can be used to determine the orientation of the semiconductor device currently picked up by the picker.

[0179] Similarly, the coordinates of the dummy bump grooves in the top image allow the coordinates of the corresponding dummy bump grooves and the coordinates of the floating board in real space to be grasped, and the angle of the dummy bump grooves with respect to the center of the floating board in the top image allows the posture of the insert currently positioned at the place position to be grasped.

[0180] Continuing the description with reference to Figure 17, Figure 17 shows that in the step in which the picker of the second embodiment of the present invention loads a semiconductor device into an insert, a bottom image is captured by the first vision module at a first capturing position.

[0181] 17, a plurality of fine bumps 1001 may protrude from the bottom surface of a semiconductor device 1000, and dummy bumps 1003 may be formed outside the outermost fine bumps 1001. However, the position of the dummy bumps 1003 is not necessarily limited to this case, and in some cases, they may be formed between the fine bumps 1001.

[0182] The bottom surface of the semiconductor device 1000 may be photographed by the first vision module 4100 while it is held by the picker 2000. At this time, the first vision module 4100 may use coaxial lighting and / or ring lighting to illuminate the bottom surface of the semiconductor device 1000 so that shadows do not appear in the bottom surface image. As a result, the image acquired in the step S200 in which the first vision module photographs the bottom surface image of the semiconductor device may have dark areas due to shadows minimized. Such lighting may have the effect of ensuring a good recognition rate of the dummy bumps 1003.

[0183] Unlike the first embodiment, the second embodiment does not require the fine bumps 1001 to be clearly shown on the bottom image. Therefore, in the second embodiment, the lighting module may be configured to irradiate only the area on the bottom surface of the semiconductor device 1000 where the dummy bumps 1003 are located, without irradiating the area where the fine bumps 1001 are located.

[0184] Meanwhile, FIG. 18 shows that a top image is captured by the second vision module at a second capturing position in the step where the picker of the second embodiment of the present invention loads the semiconductor device onto the insert.

[0185] 18, a plurality of guide grooves 241 may be formed on the upper surface of a floating board 240 of the insert 100, and grooves 243 for dummy bumps may be formed at positions corresponding to the dummy bumps. The grooves 243 for dummy bumps may be formed to have a size and depth greater than the guide grooves 241 so as to be able to accommodate the dummy bumps. At this time, similar to the relationship between the dummy bumps and the fine bumps, the lower ends of the grooves 243 for dummy bumps may be formed to have a size and inner diameter similar to those of the guide grooves 241.

[0186] Meanwhile, in step S300 in which the second vision module captures a top surface image of the insert, the second vision module 4200 may capture the top surface image while illuminating the insert 100 with light so that the dummy bump grooves 243 are clearly visible in the top surface image. For example, the second vision module 4200 may use coaxial lighting and / or ring lighting to illuminate the top surface of the floating board 240. This allows the dummy bump grooves 243 to be clearly visible in the top surface image without being hidden by shadows, etc. Such lighting may have the effect of ensuring a good recognition rate for the dummy bump grooves 243.

[0187] Unlike the first embodiment, the second embodiment does not require the guide groove 241 to be clearly visible on the top image. Therefore, in the second embodiment, the lighting module may be configured to irradiate only the area on the top surface of the insert 100 where the dummy bump groove 243 is located, without irradiating the guide groove 241.

[0188] An example of a method for determining the actual position and orientation of a semiconductor device based on dummy bumps will now be described with reference to Fig. 19. Fig. 19 conceptually illustrates a bottom image captured during a step in which a picker according to a second embodiment of the present invention loads a semiconductor device onto an insert.

[0189] As described above, the information processing device can determine the actual position and orientation of the semiconductor device based on the position R3 of the dummy bump shown on the bottom surface image LI2. The center point C3 of the bottom surface image LI2 has the same X and Y coordinates as the optical axis of the first vision module. Furthermore, each coordinate of the bottom surface image LI2 always has the same X and Y coordinates in real space. This is because the first shooting position is always the same. Therefore, the coordinates of the position R3 of the dummy bump on the bottom surface image LI2 are used to determine the coordinates of the semiconductor device in real space.

[0190] That is, according to the present invention, the actual position of the semiconductor device can be determined only from the coordinates of the dummy bump R3 or only from the position in the image of the mark that can be identified by a separately provided information processing device.

[0191] Meanwhile, the information processing device may recognize a first angle of the dummy bump R3 relative to a predetermined reference point shown in the bottom image LI2 as the actual attitude of the semiconductor device. For example, the reference point may be set to the center coordinate of the semiconductor device shown in the bottom image LI2. In this case, the first angle is the angle between a line connecting the coordinate R3 of the dummy bump and the center coordinate of the semiconductor device and a line with a slope of 0. For example, the first angle may be determined based on the slope of the line connecting the coordinate R3 of the dummy bump and the center coordinate of the semiconductor device.

[0192] At this time, the center coordinates of the semiconductor device can be determined by a known method. For example, the center coordinates can be obtained by an information processing device recognizing boundary points of the semiconductor device shown in the bottom image LI2 and averaging the coordinates of the corresponding points. Alternatively, a separate mark for determining the center coordinates can be displayed on the semiconductor device.

[0193] Hereinafter, an example of a method for determining the actual position and orientation of an insert based on the dummy bump grooves will be described with reference to Fig. 20. Fig. 20 exemplarily illustrates a top view image captured during a step in which a picker according to a second embodiment of the present invention loads a semiconductor device onto an insert.

[0194] The information processing device can determine the actual position and orientation of the insert based on the position R4 of the dummy bump groove shown in the top image TI2. The center point C4 of the top image TI2 has the same X and Y coordinates as the optical axis of the second vision module. Furthermore, each coordinate of the top image TI2 always has the same X and Y coordinates in real space. This is because the second shooting position is always the same. Therefore, the coordinates of the position R4 of the dummy bump groove on the top image TI2 are used to determine the coordinates of the insert in real space.

[0195] That is, according to the present invention, the actual position of the insert can be grasped only from the coordinates of the dummy bump groove R4 or only from the position in the image of the mark that can be identified by a separately provided information processing device.

[0196] Meanwhile, the information processing device can recognize the second angle of the dummy bump groove R4 relative to a predetermined reference point shown in the top image TI2 as the actual posture of the insert. For example, the reference point can be set to the central coordinate of the insert and / or floating board shown in the top image (hereinafter referred to as the central coordinate of the insert). In this case, the second angle is the angle between a line connecting the coordinate R4 of the dummy bump groove and the central coordinate of the insert, and a line with a slope of 0. For example, the second angle can be recognized through the slope of the line connecting the coordinate R4 of the dummy bump groove and the central coordinate of the insert.

[0197] At this time, the center coordinates of the insert can be determined by a known method. For example, the center coordinates can be obtained by an information processing device recognizing boundary points of the insert and / or floating board shown in the top image TI2 and averaging the coordinates of the corresponding points. Alternatively, a separate mark for determining the center coordinates can be displayed on the insert and / or floating board.

[0198] According to an embodiment of the present invention, there is an advantage that the semiconductor device can be loaded onto the insert in an appropriate orientation by determining the actual position of the semiconductor device and the actual position of the insert through the corresponding structure of the reference bumps and reference grooves or the corresponding structure of the dummy bumps and grooves for the dummy bumps.

[0199] Specifically, if a semiconductor device having fine-pitch fine bumps with very narrow terminal spacing is misaligned during placement into an insert or socket, the bumps will not be properly seated in the corresponding grooves. This not only hinders smooth testing, but also may cause the fine bumps to come into contact with parts other than the grooves and be damaged. In consideration of this, the present invention aligns the semiconductor device to the insert by aligning the fine bumps with the guide grooves in which they are accommodated, or by using dummy bumps that allow for fine-pitch alignment, thereby enabling accurate placement of the semiconductor device in the insert. Increasing the number of reference bumps and dummy bumps can further improve alignment accuracy.

[0200] In addition, in the present invention, after the semiconductor device is placed in the insert in an aligned position (a position in which the fine bumps can be placed in the guide grooves), a fixing member fixes the semiconductor device, and the insert and the semiconductor device are electrically connected. The semiconductor device moves inside the handler while being loaded on the insert, and its position is fixed inside the insert even when testing is performed. Therefore, according to the present invention, after the semiconductor device is first loaded on the insert, the semiconductor device is moved or tested using the insert or tray. This significantly reduces the burden of ensuring precision alignment when moving and testing the semiconductor device after loading.

[0201] Meanwhile, according to the second embodiment of the present invention, since the dummy bumps come into contact with the insert first, it is possible to minimize the load applied to the fine bumps compared to the first embodiment. That is, according to the second embodiment, the floating board is first swung by the dummy bumps, and then the fine bumps are accommodated in the guide grooves, so that the fine bumps and the guide grooves come into contact in a more aligned state.

[0202] Those skilled in the art will understand that the present invention can be embodied in other specific forms without changing the technical spirit or essential features thereof. Therefore, the above-described embodiments should be understood to be merely illustrative in all respects and not limiting. The scope of the present invention is defined by the claims below rather than the above detailed description, and all modifications and variations derived from the meaning and scope of the claims and their equivalents should be construed as being within the scope of the present invention. [Explanation of symbols]

[0203] 1 test tray 10 Sub-tray 100 inserts 200 Electrical contact 210 Insert terminal 220 Circuit Board 230 Fixed Board 231 External terminal 240 Floating Board 241 Guide groove 250 Terminal Board 310 Upper Block 320 Lower Block 330 Fixing member 1000 semiconductor devices 2000 Picker 3000 Pickup Module 4100 First Vision Module 4200 Second Vision Module

Claims

1. A method for loading a semiconductor device having a plurality of fine bumps on a bottom surface onto an insert having guide grooves formed on an upper surface thereof, each of which accommodates one of the fine bumps, comprising: a first vision module capturing an image of the bottom surface of the semiconductor device picked up by the picker; a second vision module capturing an image of the top surface of the insert; and A method for loading a semiconductor device having fine bumps into an insert, comprising: the step of: the picker loading the semiconductor device into the insert based on the bottom image and the top image.

2. The step of loading the semiconductor device onto the insert comprises: a step of determining the position of a reference bump among the plurality of fine bumps in the bottom surface image; determining, from the top image, the position of a reference groove in which the reference bump is received among the plurality of guide grooves; determining a translation and rotation amount for the semiconductor device based on the positions of the reference bumps and the positions of the reference grooves; and 2. The method for loading a semiconductor device having fine bumps onto an insert as described in claim 1, comprising the steps of: transferring the semiconductor device onto the insert based on the determined amount of movement; and placing the semiconductor device onto the insert in an aligned position based on the determined amount of rotation.

3. In the step of determining the position of the reference bump, The actual position and orientation of the semiconductor device are determined based on the positions of the reference bumps on the bottom image; In the step of grasping the position of the reference groove, 3. The method for loading a semiconductor device having fine bumps onto an insert according to claim 2, wherein the actual position and orientation of the insert on which the semiconductor device is loaded are determined based on the position of the reference groove on the top image.

4. In the step of determining the positions of the reference bumps, an actual position of the semiconductor device is determined based on the positions of the reference bumps on the bottom image and a photographing position of the first vision module that is accurately set; In the step of determining the position of the reference groove, the actual position of the insert is determined based on the position of the reference groove on the top image and the accurately set photographing position of the second vision module; 4. The method for loading a semiconductor device having fine bumps onto an insert according to claim 3, wherein in the step of determining the amount of movement and rotation of the semiconductor device, the amount of movement of the semiconductor device is determined based on a coordinate difference between the actual position of the semiconductor device and the actual position of the insert.

5. In the step of determining the position of the reference bump, an actual posture of the semiconductor device is determined based on a first angle that the reference bump shown in the bottom surface image has with respect to a reference point on the bottom surface image; In the step of grasping the position of the reference groove, an actual posture of the insert is grasped based on a second angle that the reference groove shown in the top surface image has with respect to a reference point on the top surface image; 4. The method for loading a semiconductor device having fine bumps onto an insert according to claim 3, wherein in the step of determining the amount of movement and rotation of the semiconductor device, the amount of rotation of the semiconductor device is determined based on the difference between the first angle and the second angle.

6. The step of loading the semiconductor device onto the insert comprises: determining positions of the plurality of fine bumps and dummy bumps formed separately from the bottom image; determining positions of dummy bump grooves formed to accommodate the dummy bumps separately from the plurality of guide grooves in the top view image; determining a translation amount and a rotation amount for the semiconductor device based on the positions of the dummy bumps and the positions of the dummy bump grooves; and 2. The method for loading a semiconductor device having fine bumps onto an insert as described in claim 1, comprising the steps of: transferring the semiconductor device onto the insert based on the determined amount of movement; and placing the semiconductor device onto the insert in an aligned position based on the determined amount of rotation.

7. In the step of determining the positions of the dummy bumps, The actual position and orientation of the semiconductor device are determined based on the positions of the dummy bumps on the bottom image; In the step of determining the position of the dummy bump groove, 7. The method for loading a semiconductor device having fine bumps onto an insert as described in claim 6, wherein the actual position and posture of the insert on which the semiconductor device is loaded are determined based on the position of the dummy bump grooves on the top image.

8. 8. The method of loading a semiconductor device having fine bumps onto an insert according to claim 7, wherein the dummy bumps are formed to be larger than the fine bumps and have a shape of a lower end corresponding to a shape of the fine bumps.

9. 8. The method for loading a semiconductor device having fine bumps onto an insert according to claim 7, wherein the dummy bumps are located outside an area where the plurality of fine bumps are located on the bottom surface of the semiconductor device.

10. The method for loading semiconductor devices having fine bumps onto an insert according to claim 1 , further comprising the step of: picking up a plurality of said semiconductor devices with a plurality of said pickers arranged in a predetermined arrangement.

11. In the step of the first vision module capturing the bottom image, A bottom surface of a representative semiconductor device picked up by a representative picker among the plurality of pickers is photographed; In the step of determining the amount of movement and rotation of the semiconductor device, The method for loading semiconductor devices having fine bumps onto an insert according to claim 10, wherein amounts of movement and rotation for the remaining semiconductor devices are determined based on amounts of movement and rotation for the representative semiconductor device.

12. In the step of the first vision module capturing the bottom image, 2. The method for loading a semiconductor device having fine bumps onto an insert according to claim 1, wherein the bottom image is taken with light from an illumination illuminating the bottom surface of the semiconductor device.

13. The step of the second vision module capturing the top view image includes:

2. The method for loading a semiconductor device having fine bumps onto an insert according to claim 1, wherein the top surface image is taken with light from an illumination illuminating the top surface of the insert.

14. The step of placing the semiconductor device in the insert in the aligned position comprises:

2. The method for loading a semiconductor device having fine bumps onto an insert according to claim 1, wherein a fixing member of the insert presses the placed semiconductor device downward to fix the position of the semiconductor device.

15. The step of placing the semiconductor device in the insert in the aligned position comprises:

15. The method for loading a semiconductor device having fine bumps onto an insert according to claim 14, wherein the floating board on which the guide grooves are formed and the semiconductor device are pressed downward by the fixing member, and the insert terminals accommodated inside the guide grooves come into contact with the fine bumps that have been moved downward.

Images