Method of manufacturing wiring board

Abstract

To provide a method of manufacturing a wiring board capable of improving a performance of a wiring board.SOLUTION: A method of manufacturing a wiring board includes the steps of: preparing a first substrate 10 which has a first face 10a and a second face 10b and in which a through hole 11 is disposed, a second substrate 20 which is disposed on the side of the second face 10b of the first substrate 10 separately from the second face 10b, and a seal material 30 which is disposed between the first substrate 10 and the second substrate 20 so as to enclose an opening 11b of the through hole 11 on the side of the second face 10b of the first substrate 10 and seals the opening 11b of the through hole 11; forming a conductive material layer 40 on the first face 10a of the first substrate 10 so as to cover the opening 11a of the through hole 11 on the side of the first face 10a under a first pressure; and filling the through hole 11 with a conductive material of the conductive material layer 40 by means of a pressure difference between the side of the first face 10a of the first substrate 10 and the side of the second face 10b of the first substrate 10 under a second pressure which is larger than the first pressure.SELECTED DRAWING: Figure 5

Description

[Technical Field]

[0001] The present invention relates to a method for manufacturing a wiring board. [Background technology]

[0002] Patent Document 1 (Japanese Patent Laid-Open Publication No. 2003-229659) describes a method for manufacturing an electronic component in which the process of forming a through-hole electrode is improved. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2003-229659 Summary of the Invention [Problem to be solved by the invention]

[0004] On the other hand, there is a demand for further improvement in the performance of wiring boards, and therefore it is necessary to provide a method for manufacturing a wiring board that can improve the performance of the wiring board.

[0005] Other objects and novel features will become apparent from the description of this specification and the accompanying drawings. [Means for solving the problem]

[0006] A method for manufacturing a wiring board according to one embodiment includes the steps of: (a) preparing a first substrate having a first surface and a second surface opposite the first surface, the first substrate having a through hole penetrating the first surface and the second surface; a second substrate disposed on the second surface side of the first substrate at a distance from the second surface; and a sealing material disposed between the first substrate and the second substrate so as to surround the opening of the through hole on the second surface side of the first substrate, the sealing material sealing the opening of the through hole on the second surface side together with the second substrate; (b) forming a conductive material layer on the first surface of the first substrate under a first pressure so as to cover the opening of the through hole on the first surface side; and (c) filling the through hole with the conductive material of the conductive material layer under a second pressure greater than the first pressure due to a pressure difference between the first surface side of the first substrate and the second surface side of the first substrate. [Brief explanation of the drawings]

[0007] [Figure 1] FIG. 1 is a flowchart showing a method for manufacturing a wiring board according to an embodiment. [Figure 2] FIG. 2 is a plan view illustrating the steps of a method for manufacturing a wiring board according to an embodiment. [Figure 3] FIG. 3 is a cross-sectional view taken along line AA in FIG. [Figure 4] 4A to 4C are cross-sectional views illustrating steps in a method for manufacturing a wiring board according to an embodiment. [Figure 5] FIG. 5 is a cross-sectional view illustrating a process of a method for manufacturing a wiring board according to an embodiment. [Figure 6] FIG. 6 is a cross-sectional view illustrating a process of a method for manufacturing a wiring board according to an embodiment. [Figure 7] FIG. 7 is a cross-sectional view illustrating a process of a method for manufacturing a wiring board according to an embodiment. [Figure 8] FIG. 8 is a cross-sectional view illustrating a process of a method for manufacturing a wiring board according to an embodiment. [Figure 9] FIG. 9 is a cross-sectional view of a wiring board according to an embodiment. [Figure 10] 10A to 10C are cross-sectional views illustrating steps in a method for manufacturing a wiring board according to the study example. [Figure 11] 11A to 11C are cross-sectional views illustrating steps in a method for manufacturing a wiring board according to another embodiment. [Figure 12] FIG. 12 is a cross-sectional view of a wiring board according to an embodiment. [Figure 13] FIG. 13 is a cross-sectional view of a wiring board according to an embodiment. [Figure 14] FIG. 14 is a cross-sectional view showing an example of use of the wiring board of FIG. DETAILED DESCRIPTION OF THE INVENTION

[0008] Hereinafter, each embodiment of the present invention will be described with reference to the drawings. The disclosure is merely an example, and appropriate modifications that a person skilled in the art can easily conceive while maintaining the gist of the invention are naturally included within the scope of the present invention. Furthermore, in order to clarify the explanation, the drawings may show the width, thickness, shape, etc. of each part schematically compared to the actual embodiment, but these are merely examples and are not intended to limit the interpretation of the present invention. Furthermore, in this specification and each drawing, elements similar to those described above with reference to the previous drawings will be designated by the same reference numerals, and detailed descriptions may be omitted as appropriate.

[0009] In this application, the description of the embodiments will be divided into multiple sections, etc., for convenience, as necessary. However, unless otherwise expressly stated, these are not mutually independent and separate, and regardless of the order of description, they are each part of a single example, one being a partial detail of the other, or a partial or complete modification, etc. Furthermore, as a general rule, repeated explanations of similar parts will be omitted. Furthermore, each component in the embodiments is not essential unless otherwise expressly stated, there is a theoretical limit to the number, or it is clearly not essential from the context.

[0010] In the accompanying drawings, hatching may be omitted even in cross sections if it would be too complicated or if the distinction from voids is clear. In relation to this, background contour lines may be omitted even in the case of holes that are closed in plan view if it is clear from the description, etc. Furthermore, hatching or dot patterns may be added even in cases where the drawing is not a cross section to clearly indicate that the hole is not a void or to clearly indicate the boundary of the area.

[0011] <<Wiring Board Manufacturing Method>> A method for manufacturing a wiring board according to one embodiment will be described. FIG. 1 is a diagram showing a flowchart of the method for manufacturing a wiring board according to one embodiment. The method for manufacturing a wiring board according to one embodiment includes a step S101 of preparing a material, a step S103 of forming a conductive material layer, and a step S104 of filling the through holes with the conductive material. As shown in FIG. 1, the method for manufacturing a wiring board according to one embodiment further includes a step S102 of reducing pressure, a step S105 of removing the conductive material, and a cutting step S106.

[0012] <Step S101: Preparing Materials> Fig. 2 is a plan view illustrating a step S101 of preparing materials in a method for manufacturing a wiring board according to one embodiment. Fig. 3 is a cross-sectional view taken along line AA in Fig. 2. In the step S101 of preparing materials, a base material 10, a base material 20, and a sealant 30 are prepared.

[0013] (Base material 10) As shown in FIGS. 2 and 3, the substrate 10 has an upper surface 10a, a lower surface 10b, a side surface 10c, and a through hole 11. The upper surface 10a is substantially parallel to the lower surface 10b. The side surface 10c is provided between the upper surface 10a and the lower surface 10b. The side surface 10c is substantially perpendicular to the upper surface 10a and the lower surface 10b. When the upper surface 10a is viewed in plan, the upper surface 10a has substantially the same shape as the lower surface 10b. The through hole 11 has an upper opening 11a, a lower opening 11b, and a sidewall 11c. The through hole 11 is formed to penetrate the upper surface 10a and the lower surface 10b. As shown in FIG. 2, the upper opening 11a and the lower opening 11b of the through hole 11 are circular. In this embodiment, the hole diameter w1 of the upper opening 11a is the same as the hole diameter w1 of the lower opening 11b. The side wall 11c of the through hole 11 is cylindrical. The side wall 11c is substantially perpendicular to the upper surface 10a and the lower surface 10b. The depth t1 of the through hole is the same as the thickness of the substrate 10. The thickness of the substrate 10 is the thickness in the direction perpendicular to the upper surface 10a of the substrate 10. As shown in FIG. 2, a plurality of through holes 11 are formed.

[0014] The substrate 10 is preferably made of glass. That is, the substrate 10 is a glass substrate. The substrate 10 may be made of a substrate in which a plurality of substrates are laminated. The material of the substrate 10 is preferably made of a material that is substantially impermeable to gas. In addition to a glass substrate, a quartz substrate, a sapphire substrate, a resin substrate, or the like can also be used as the substrate 10.

[0015] (Base material 20) As shown in FIG. 3 , the substrate 20 is spaced apart from the substrate 10. The substrate 20 has an upper surface 20a, a lower surface 20b, and a side surface 20c. The upper surface 20a and the lower surface 20b are flat. The upper surface 20a is substantially parallel to the lower surface 20b. The substrate 20 is substantially parallel to the substrate 10. The side surface 20c is provided between the upper surface 20a and the lower surface 20b. The side surface 20c is substantially perpendicular to the upper surface 20a and the lower surface 20b. When viewed in plan, the upper surface 20a has substantially the same shape as the lower surface 20b. When viewed in plan, the upper surface 20a of the substrate 20 has substantially the same shape as the lower surface 10b of the substrate 10. The substrate 20 is preferably made of glass. That is, the substrate 20 is a glass substrate. The substrate 20 is preferably made of a material that is substantially gas impermeable. In addition to a glass substrate, the substrate 20 may also be made of a quartz substrate, a sapphire substrate, a resin substrate, or the like.

[0016] (Sealant 30) As shown in FIG. 3 , the sealing material 30 is provided between the substrate 10 and the substrate 20. The sealing material 30 has an upper surface 30a, a lower surface 30b, an outer surface 30c, and an inner surface 30d. The sealing material 30 is provided so as to follow the side surface of the substrate 10. The sealing material 30 is provided in a circumferential shape. The upper surface 30a of the sealing material 30 is in contact with the lower surface 10b of the substrate 10. The lower surface 30b of the sealing material 30 is in contact with the upper surface 20a of the substrate 20. The outer surface 30c and the inner surface 30d are provided between the upper surface 30a and the lower surface 30b. The outer surface 30c is provided in the same plane as the side surface 10c of the substrate 10. The outer surface 30c is provided in the same plane as the side surface 20c of the substrate 20. The inner surface 30d is provided opposite the outer surface 30c. The inner surface 30d is parallel to the outer surface 30c. When the lower surface 10b of the substrate 10 is viewed from above, the sealant 30 is provided so as to surround the lower opening 11b of at least one through-hole 11. The sealant is preferably made of a material that is substantially impermeable to gas. The sealant is made of, for example, a resin. The resin is, for example, a photosensitive resin.

[0017] As shown in FIG. 3, an internal region IN is formed by the upper surface 20a of the substrate 20, the inner surface 30d of the sealing material 30, and a surface parallel to the lower surface 10b of the substrate 10. A penetration region TH is formed by a surface including the upper surface 10a of the substrate 10 and parallel to the upper surface 10a, a surface including the lower surface 10b of the substrate 10 and parallel to the lower surface 10b, and the sidewall 11c of the through hole 11. The outside of the region formed by the surface including the upper surface 10a of the substrate 10 and parallel to the upper surface 10a, the side surface 10c of the substrate 10, the outer surface 30c of the sealing material 30, the side surface 20c of the substrate 20, and the lower surface 20b of the substrate 20 is referred to as an external region OUT. As shown in FIG. 3, the internal region IN is connected to the penetration region TH. The external region OUT is connected to the penetration region TH. In other words, the internal region IN is connected to the external region OUT via the penetration region TH. This allows the movement of substances between the internal region IN and the external region OUT via the penetration region TH. Furthermore, substances in the internal region IN cannot move to the external region OUT without passing through the penetration region TH. Furthermore, the sealing material 30, together with the substrate 20, seals the lower surface 10b side of the penetration region TH. In other words, even if substances in the penetration region TH move out of the penetration region TH from the lower surface 10b side, they cannot move to the external region OUT.

[0018] <Decompression step S102> FIG. 4 is a cross-sectional view illustrating a depressurizing step S102 in a method for manufacturing a wiring substrate according to one embodiment. In the depressurizing step S102, the pressure inside the internal region IN and the penetrating region TH is set to a pressure P1. In this embodiment, the pressure in the internal region IN and the penetrating region TH is reduced to a pressure P1 lower than the pressure in the internal region IN and the penetrating region TH in step S101. The pressure P1 is, for example, lower than atmospheric pressure. The pressure P1 is preferably lower than 85,000 Pa, and more preferably 100 Pa or more and 10,000 Pa or less. The pressure P1 does not need to be lower than the pressure in the internal region IN and the penetrating region TH in step S101. However, it is generally difficult to maintain a high pressure state. Therefore, the pressure P1 is preferably lower than the pressure in the internal region IN and the penetrating region TH in step S101.

[0019] 4, in step S102, the substrate 10, the substrate 20, and the sealant 30 are placed in a vacuum chamber 50. The vacuum chamber 50 can change the pressure inside the vacuum chamber 50. The vacuum chamber 50 sets the external region OUT located inside the vacuum chamber 50 to pressure P1. As a result, the insides of the internal region IN and the through region TH connected to the external region OUT also become pressure P1.

[0020] <Step S103 of forming a conductive material layer> FIG. 5 is a cross-sectional view illustrating step S103 of forming a conductive material layer in a method for manufacturing a wiring board according to one embodiment. In step S103 of forming a conductive material layer, a conductive material layer 40 is formed on the upper surface 10a of the substrate 10 under pressure P1. As shown in FIG. 5, the conductive material layer 40 is formed on a surface parallel to the upper surface 10a of the substrate 10. The conductive material layer 40 has an upper surface 40a and a lower surface 40b. The lower surface 40b of the conductive material layer 40 is in contact with the upper surface 10a of the substrate 10. The lower surface 40b of the conductive material layer 40 also covers the upper opening 11a of the through hole. The lower surface 40b of the conductive material layer 40 is formed so as to block the location where the penetration region TH connects with the external region OUT. This prevents substances in the internal region IN from migrating to the external region. After the conductive material layer 40 is formed, the pressure in the internal region IN and the penetration region TH remains at pressure P1. The conductive material layer 40 is preferably made of a material that is substantially impermeable to gas. The conductive layer 40 is formed, for example, from a conductive paste. The conductive layer 40 is formed, for example, by printing the conductive paste onto the upper surface 10a of the substrate 10.

[0021] <Step S104 of filling the through holes with the conductive material of the conductive material layer> 6 is a cross-sectional view illustrating step S104 of filling the through holes with the conductive material of the conductive material layer in a method for manufacturing a wiring board according to one embodiment. In step S104 of filling the through holes with the conductive material of the conductive material layer, the pressure P2 in the outer region OUT is set to be greater than the pressure inside the inner region IN and the penetrating region TH. Therefore, a force is applied from the upper opening 11a side of the through hole 11 to the lower opening 11b side (in the direction of the arrow in FIG. 6). This causes a portion of the conductive material constituting the conductive material layer 40 to enter the penetrating region TH. As a result, the conductive material is filled in the penetrating region TH. By step S104, the conductive material layer 40 is formed not only on the upper surface 10a of the substrate 10 but also in the penetrating region TH.

[0022] If the pressure inside the internal region IN and the through region TH after step S103 is P1, the pressure P2 is made higher than the pressure P1. For example, a method of making the pressure P2 higher than the pressure P1 is to provide the conductive material layer 40 on the upper surface 10a of the substrate 10 at a pressure P1 lower than atmospheric pressure, and then set the pressure inside the vacuum chamber 50 to atmospheric pressure. After filling is complete, the pressure P2 in the external region OUT is preferably equal to or higher than the pressure inside the internal region IN and the through region TH. "After filling is complete" refers to after the conductive material has stopped moving. The pressure P2 is preferably about atmospheric pressure. The pressure P2 is preferably 85,000 Pa or higher.

[0023] <Step S105 of removing conductive material> 7 is a cross-sectional view illustrating step S105 of removing the conductive material in the method for manufacturing a wiring board according to one embodiment. In step S105 of removing the conductive material, after step S104, a portion of the conductive material layer 40 is removed. That is, a portion of the conductive material constituting the conductive material layer 40 is removed. As shown in FIG. 7, the conductive material layer 40 is removed so that the upper surface 10a of the substrate 10 is exposed. In addition, a portion of the conductive material layer 40 is removed so that the conductive material remains in the penetration region TH. The removal method is, for example, chemical mechanical polishing (CMP).

[0024] <Cutting step S106> 8 is a cross-sectional view illustrating a cutting step S106 in the method for manufacturing a wiring board according to one embodiment. In the cutting step S106, a portion of the base material 10 is cut to separate it from the base material 20 and the sealant 30. As shown in FIG. 8, when the top surface 10a of the base material 10 is viewed in plan, the portion where the sealant 30 is not provided is cut with a cutting device 60, thereby separating the portion of the base material 10. The cutting method is, for example, a cutting method using a blade.

[0025] FIG. 9 is a cross-sectional view of a wiring board manufactured by the wiring board manufacturing method according to this embodiment. As shown in FIG. 9, the wiring board 1 can be divided into individual pieces in step S106. The wiring board 1 has a base material 100 and through electrodes 400. The base material 100 has an upper surface 100a, a lower surface 100b, a side surface 100c, and through holes 110. A portion of the upper surface 10a of the base material 10 becomes the upper surface 100a of the base material 100. A portion of the lower surface 10b of the base material 10 becomes the lower surface 100b of the base material 100. The cut surface of the base material 10 in cutting step S106 becomes the side surface 100c of the base material 100. The through electrodes 400 have an upper surface 400a, a lower surface 400b, and sidewalls 400c. The conductive material of the conductive material layer 40 filled in the through regions TH in step S105 becomes the through electrodes 400 of the wiring board 1. An upper surface 400a of the through electrode 400 is provided on the same plane as the upper surface 100a of the base material 100. A lower surface 400b of the through electrode 400 is provided on the same plane as the lower surface 100b of the base material 100.

[0026] Next, the features and effects of the method for manufacturing a wiring board according to this embodiment will be described. In recent years, integrated circuits have become smaller and more complex as their performance has improved. These integrated circuits are provided with connection terminals for inputting power supplies and logic signals required for circuit operation from external devices (chips). However, as integrated circuits become smaller and more complex, the connection terminals on the integrated circuits are now arranged at an extremely narrow pitch. The pitch of the connection terminals is several to several tens of times smaller than the pitch of the connection terminals on the chip.

[0027] As described above, when connecting an integrated circuit and a chip having different connection terminal pitches, an interposer is used as an intermediate substrate to convert the pitch size of the connection terminals. In an interposer, an integrated circuit is mounted on the wiring arranged on one side of the substrate, and a chip is mounted on the wiring arranged on the other side. The wiring arranged on both sides of the substrate are connected to each other by through electrodes that penetrate the substrate.

[0028] In addition, as interposers, TSV (Through-Silicon Via), which is a through electrode substrate using a silicon substrate, and TGV (Through-Glass Via), which is a through electrode substrate using a glass substrate, have been developed.

[0029] However, as integrated circuits become smaller and more complex, the aspect ratio of through-holes (through-hole depth t1 relative to hole diameter w1) in TSVs and TGVs increases, resulting in poor embedding of the through-hole electrodes. Poor embedding of the through-hole electrodes can potentially prevent electrical connection between the wiring patterns on both sides of the substrate. Even if electrical connection between the wiring patterns is barely ensured, the through-hole electrodes can only be formed in a portion of the through-hole. In such cases, current concentrates in the through-hole electrodes formed in a portion of the through-hole, leading to problems such as destruction of the through-hole electrodes due to excessive self-heating. In other words, as described above, poor embedding of the through-hole electrodes leads to the problem of reduced performance of the wiring substrate.

[0030] As shown in Figure 10, one method for forming a through electrode is to fill a through hole with a conductive material formed on a substrate by mechanical pressure. However, with this method, if the aspect ratio of the through hole is large, it becomes difficult to push the conductive material into the through hole. This makes it difficult to fill the through hole with the conductive material. This may result in poor embedding of the through electrode.

[0031] On the other hand, in the method for manufacturing a wiring board according to this embodiment, after forming the conductive material layer 40 on the upper surface 10a of the substrate 10, the pressure in the outer region OUT is made greater than the pressure in the inner region IN. As a result, the pressure in the inner region IN is made smaller than the pressure in the outer region OUT. As a result, the conductive material formed on the outer region OUT side of the substrate is not only pushed from the outer region OUT side but also pulled from the inner region IN side. Therefore, compared to methods in which conductive material is filled by mechanical pressure from only one direction, a greater force can be applied to the conductive material. As a result, the conductive material can be more reliably filled into the through holes. This also allows the conductive material to be more reliably filled into through holes with a large aspect ratio. As a result, the performance of the wiring board can be further improved.

[0032] (Variation) FIG. 11 is a cross-sectional view showing a process of irradiating the interior of a substrate with laser light. A method for manufacturing a wiring substrate according to an embodiment may further include a process of forming a through-hole in the substrate 10. Here, a method for manufacturing a glass interposer using a glass substrate as a through-hole electrode substrate will be described. In the example shown in FIG. 11, a laser is irradiated onto the substrate 10, thereby altering the material of the substrate 10 in the region where the through-hole is to be formed, thereby forming an altered region 10t. Here, laser light 71 emitted from a light source 70 is incident on the upper surface 10a of the substrate 10. The laser light 71 is focused on the region inside the substrate 10 where the through-hole is to be formed. At the position where the laser light 71 is focused, high energy is supplied to the substrate 10, altering the material of the substrate 10. The pulse width, wavelength, energy, etc. of the laser are appropriately set depending on the composition and absorption coefficient of the material used for the substrate. After the altered region 10t is formed, the altered region is etched. A photochemical reaction occurs in the region of the glass substrate irradiated with the laser light. As a result, at least one of defects and a loose glass structure in the high-temperature region is formed in the region irradiated with the laser light. The defects and loose glass structure are more easily etched by a predetermined etching solution than the glass substrate in the region not irradiated with the laser light. In other words, by immersing the entire substrate 10 in the chemical solution, the altered region is selectively etched or at a faster rate than the unaltered region. As a result, through holes can be formed in the substrate 10.

[0033] In step S104 of filling the through holes with a conductive material, the shape of the through electrode can be changed by controlling the pressure difference between the pressure in the outer region OUT and the pressure in the inner region IN. The pressure difference between the pressure in the outer region OUT and the pressure in the inner region IN is defined as the pressure in the outer region OUT minus the pressure in the inner region IN. FIG. 12 is a cross-sectional view of a wiring board manufactured by a wiring board manufacturing method according to one embodiment. Increasing the pressure difference increases the force acting in the direction from the upper opening 110a of the through hole 110 toward the lower opening 110b. As a result, the conductive material is formed beyond a plane parallel to the lower surface 10b of the substrate 10. As a result, as shown in FIG. 12, the through electrode 400 is formed to extend downward from the lower surface 100b of the substrate 100.

[0034] FIG. 13 is a cross-sectional view of a wiring board manufactured by a wiring board manufacturing method according to one embodiment. By reducing the pressure difference, the force acting in the direction from the upper opening 110a of the through hole 110 to the lower opening 110b is reduced. As a result, a region not filled with conductive material is generated on the lower opening 110b side of the penetration region TH. As a result, as shown in FIG. 13, the lower surface 400b of the through electrode 400 is located above the lower surface 100b of the base material 100. When the wiring board 1B is viewed from the lower surface 100b side of the base material 100, a recess is formed by the sidewall 110c of the through hole 110 in the base material 100 and the lower surface 400b of the through electrode 400.

[0035] Fig. 14 is a cross-sectional view showing an example of use of the wiring board of Fig. 13. The up-down direction of the wiring board shown in Fig. 14 is opposite to the up-down direction of the wiring board shown in Fig. 13. As shown in Fig. 14, the depressions in the wiring board 1B can function as voids for fixing the solder balls 80.

[0036] Within the scope of the concept of the present invention, a person skilled in the art may conceive of various modifications and alterations, and it is understood that these modifications and alterations also fall within the scope of the present invention. For example, to the above-described embodiments, a person skilled in the art may appropriately add, delete, or modify components, or add, omit, or change conditions of steps, and these modifications are also included within the scope of the present invention as long as they maintain the gist of the present invention.

[0037] Furthermore, other effects and advantages brought about by the aspects described in this embodiment that are clear from the description in this specification or that can be appropriately thought of by a person skilled in the art are naturally understood to be brought about by the present invention. [Explanation of symbols]

[0038] 1, 1B wiring board 10 Base material 10a Top 10b Bottom side 10c side 10t altered area 11 Through-hole 11a Upper opening 11b Lower opening 11c Side wall 20 Base material 20a Upper surface 20b Lower surface 20c Side surface 30 Sealing material 30a Upper surface 30b Lower surface 30c Outer surface 30d Inner surface 40 Conductive material layer 40a Upper surface 40b Lower surface 50 Vacuum chamber 60 Cutting device 70 Light source 71 Laser beam 80 Solder ball 100 Base material 100a Upper surface 100b Lower surface 100c Side surface 110 Through-hole 110a Upper opening 110b Lower opening 110c Side wall 400 Through-hole electrode 400a Upper surface 400b Lower surface 400c Side wall IN Inner region OUT Outer region TH Through region

Claims

1. (a) preparing a first base material having a first surface and a second surface opposite to the first surface, and having a through hole penetrating the first surface and the second surface; a second base material provided on the second surface side of the first base material at a distance from the second surface; and a sealing material provided between the first base material and the second base material so as to surround an opening of the through hole on the second surface side of the first base material; (b) forming a conductive material layer on the first surface of the first substrate under a first pressure so as to cover the opening of the through hole on the first surface side; (c) filling the through holes with the conductive material of the conductive material layer by a pressure difference between the first surface side of the first base material and the second surface side of the first base material under a second pressure greater than the first pressure; A method for manufacturing a wiring board having the above structure.

2. In claim 1, The method for manufacturing a wiring substrate, wherein the first base material is made of glass.

3. In claim 1, The method for manufacturing a wiring substrate, wherein the conductive material is a conductive paste.

4. In claim 1, The method for manufacturing a wiring substrate, wherein the first pressure is 100 Pa or more and 10,000 Pa or less.

5. In claim 1, The method for manufacturing a wiring substrate, wherein the second pressure is 85,000 Pa or more.

6. In claim 1, (d) after the step (c), removing a portion of the conductive material layer; A method for manufacturing a wiring board having the above structure.

7. In claim 1, Furthermore, (e) after the step (c), a step of cutting the first base material; A method for manufacturing a wiring board having the above structure.

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