IC card and method of manufacturing IC card

Abstract

To provide an IC card allowed to inhibit an illicit use with replacement of an IC module with a comparatively simple configuration and a method of manufacturing an IC card.SOLUTION: An IC card 1 comprises a card base 2 and an IC module 70. The IC module 70 comprises a base plate 72, an external connection terminal 71, a body 74 having an IC chip, and a detachment-detection input terminal 53a. The external connection terminal 71 is provided to be exposed on a surface and provided with a detachment-detection contact 51 in a recess 9 with which the detachment-detection input terminal 53a is electrically connected. The IC chip determines that the detachment-detection circuit 50 is in a first or second state. If there is an electrical connection between the detachment-detection contact 51 and the detachment-detection input terminal 53a, determination is made as a first state while, if there is no electrical connection between the detachment-detection contact 51 and the detachment-detection input terminal 53a, determination is made as a second state. When in the first state, the IC chip restricts a part of possible processing.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present invention relates to an IC card capable of contact communication with an external device. [Background technology]

[0002] Conventionally, contact IC cards that input and output electrical signals through external connection terminals on the surface of the card and contactless IC cards that input and output electrical signals through an antenna using electromagnetic induction or the like have been widely used as IC cards. In addition to these, dual interface IC cards that combine the functions of a contact IC card and a contactless IC card with a single IC chip are also in use. In particular, contact IC cards and dual interface IC cards have a configuration in which an IC module is embedded and fixed in a predetermined recess in the card base so that the external connection terminals of the IC module are exposed on the surface of the card base.

[0003] Incidentally, since contact IC cards and dual interface IC cards have a portion of the IC module exposed, it is relatively easy to remove the IC module from the card base by, for example, dissolving the adhesive that secures the IC module to the card base. For example, suppose someone removes IC module a from IC card A, removes IC module b from another IC card B, and inserts IC module a into the card base of IC card B. This allows a malicious third party, who is not the owner of IC card A, to use a counterfeit IC card B. Because IC card B is equipped with IC module a that stores the owner's information, the malicious third party can masquerade as the owner and misuse IC card B.

[0004] In order to prevent the misuse of IC cards that can communicate with external devices through an external connection terminal by replacing the IC module as described above, for example, Patent Document 1 describes the following IC card. That is, this IC card has a magnetic material attached to a part of the IC module, and the magnetic material can be detected from the outer surface of the card to verify the authenticity of the IC module. This makes it possible to verify the authenticity of the IC chip by detecting the magnetic material attached to the IC module, thereby providing a highly secure IC card that prevents counterfeiting, data tampering, etc. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Patent Publication No. 7-306924 Summary of the Invention [Problem to be solved by the invention]

[0006] In this way, in an IC card that is capable of contact communication with an external device via an external connection terminal, it is desirable to be able to prevent misuse by replacing the IC module with a relatively simple configuration.

[0007] The present disclosure has been made in consideration of this situation, and aims to provide an IC card and a manufacturing method thereof that can prevent misuse by replacing the IC module with a relatively simple configuration in an IC card that is capable of contact communication with external devices through an external connection terminal. [Means for solving the problem]

[0008] A first configuration of an IC card capable of contact communication with an external device according to this embodiment comprises a card body and an IC module arranged in a recess of the card body, the IC module comprising a substrate, an external connection terminal formed on one surface of the substrate, an IC chip arranged on the other surface of the substrate and electrically connected to the external connection terminal, and a peeling detection input terminal electrically connected to the IC chip, the external connection terminal being arranged so as to be exposed on the surface of the card body, a peeling detection contact being a conductor being provided in the recess of the card body, and the peeling detection contact and the peeling detection input terminal being electrically connected. The IC chip determines that a peeling detection circuit constituted by the IC chip, the peeling detection input terminal, and the peeling detection contact is in a first state or a second state different from the first state, and if the peeling detection contact and the peeling detection input terminal are electrically connected, the IC chip determines that the peeling detection circuit is in the first state, and if the peeling detection contact and the peeling detection input terminal are not substantially electrically connected, the IC chip determines that the peeling detection circuit is in the second state, and when in the second state, the IC chip restricts at least some of the processes that are possible when the peeling detection circuit is in the first state.

[0009] In addition, an IC card according to a second configuration of another embodiment of the present invention may be configured such that, in the first configuration, the first state indicates a case where the internal resistance value of the peeling detection circuit is equal to or less than a predetermined value, and the second state indicates a case where the internal resistance value of the peeling detection circuit is greater than the predetermined value.

[0010] In addition, an IC card according to a third configuration of another embodiment of this invention may be configured such that, in the first or second configuration, the IC chip has a built-in switch that opens and closes a part of the peeling detection circuit, and the IC chip closes the switch immediately before determining that the peeling detection circuit is in the first state or the second state, and opens the switch in other cases.

[0011] Furthermore, an IC card according to a fourth configuration of another embodiment of this invention may be any of the first to third configurations, wherein the IC card is a dual interface IC card further capable of contactless communication with an external device, and includes an antenna arranged inside the card base, the antenna having an antenna wire and multiple ends, the multiple tips of the antenna wire and the multiple ends being electrically connected to each other, and a portion of the ends being exposed in the recess of the card base when the IC module is removed, and the IC module further includes multiple terminals arranged on the other surface of the substrate, and the multiple terminals are electrically connected to corresponding multiple ends on the surface of the end facing the opening side of the recess.

[0012] In addition, an IC card according to a fifth configuration of another embodiment of the present invention may be configured such that, in the fourth configuration, the terminals are electrically connected to the corresponding ends by a conductive adhesive layer, and the peeling detection contact and the peeling detection input terminal are electrically connected including the conductive adhesive layer made of the same material.

[0013] In addition, in the IC card according to a sixth configuration of another embodiment of the present invention, in the fifth configuration, the conductive adhesive layer may be an anisotropic conductive film (ACF).

[0014] In addition, an IC card according to a seventh configuration of another embodiment of the present invention may be an IC card according to the fourth configuration, wherein the plurality of ends are bellows portions formed by a repeated folding structure from the outer periphery of the recess toward the center by the conductive plate or the antenna wire.

[0015] In addition, an IC card according to an eighth configuration of another embodiment of the present invention may be configured such that, in the seventh configuration, the plurality of ends and the peeling detection contacts are all formed from the conductive plate of the same material, or are all formed from the bellows portion of the same material.

[0016] A method for manufacturing an IC card capable of contact communication with an external device, according to a ninth configuration of this embodiment, includes the steps of: preparing a card base; and an IC module, the IC module including a substrate, an external connection terminal formed on one side of the substrate, an IC chip disposed on the other side of the substrate and electrically connected to the external connection terminal, and a peeling detection input terminal electrically connected to the IC chip; forming a recess in the card base in which the IC module is embedded, and exposing a peeling detection contact, which is a conductor, in a portion of the recess; and a step of embedding the IC module in the recess of the card base so that the external connection terminal is exposed on the surface of the card base, and electrically connecting the peeling detection contact and the peeling detection input terminal, wherein the IC chip determines that a peeling detection circuit constituted by the IC chip, the peeling detection input terminal, and the peeling detection contact is in a first state or a second state different from the first state, and if the peeling detection contact and the peeling detection input terminal are electrically connected, the IC chip determines that the peeling detection circuit is in the first state, and if the peeling detection contact and the peeling detection input terminal are not substantially electrically connected, the IC chip determines that the peeling detection circuit is in the second state, and when in the second state, the IC chip restricts at least some of the processes that are possible when the peeling detection circuit is in the first state. [Effects of the Invention]

[0017] According to this embodiment, it is possible to provide an IC card capable of contact communication with an external device through an external connection terminal, which has a relatively simple configuration and can prevent misuse by replacing the IC module, and a method for manufacturing the same. [Brief explanation of the drawings]

[0018] [Figure 1] 1 is a plan view illustrating the structure of a dual interface IC card according to a first embodiment. [Figure 2] 1A and 1B are plan and bottom views of an IC module. [Figure 3]2 is a cross-sectional view showing a cross section taken along line AA and line BB in FIG. 1. [Figure 4] FIG. 10 is an enlarged view of the vicinity of the recess of the card base when the IC module is removed. [Figure 5] FIG. 2 is another functional block diagram illustrating the functional configuration of the IC card according to the first embodiment. [Figure 6] FIG. 3 is a flowchart showing the operation of the IC card according to the first embodiment. [Figure 7] 10 is a plan view corresponding to FIG. 2 of an IC module of a contact IC card according to a second embodiment. FIG. [Figure 8] FIG. 10 is a plan view illustrating the structure of a dual interface IC card according to a third embodiment. [Figure 9] 9 is a cross-sectional view showing a cross section taken along line CC and line DD in FIG. 8. [Figure 10] FIG. 10 is an enlarged view of the vicinity of the recess of the card base when the IC module is removed. [Figure 11] FIG. 11 is another functional block diagram illustrating the functional configuration of the CPU of the IC card according to the fourth embodiment. [Figure 12] FIG. 10 is a flowchart showing the operation of the IC card according to the fourth embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0019] An example of an IC card according to the present disclosure will be described below with reference to the drawings, etc. However, the IC card according to the present disclosure is not limited to the embodiments and examples described below.

[0020] The figures shown below are schematic illustrations. Therefore, the size and shape of each part are appropriately exaggerated to facilitate understanding. Furthermore, hatching indicating the cross section of a member is omitted as appropriate in each figure. The numerical values ​​such as dimensions of each member and the names of materials described in this specification are examples of embodiments and are not limited to these, and may be selected and used as appropriate. In this specification, terms specifying shapes or geometric conditions, such as parallel, orthogonal, and perpendicular, are intended to include not only their strict meanings but also substantially the same state.

[0021] 1. First embodiment An example of a first embodiment of an IC card according to the present disclosure will be described. The IC card 1 of this embodiment is a dual-interface IC card. For ease of explanation, an XYZ coordinate system is set for the IC card 1. First, as shown in FIGS. 1(a), 3(a), 3(b), etc., the Z axis is taken as the normal direction of the main surface of the IC card 1. The direction from the main surface on which the external connection terminals 71 of the IC module 70 are not arranged to the main surface on which the external connection terminals 71 are arranged is defined as the +Z direction or upward in the thickness direction, and the opposite direction is defined as the -Z direction or downward in the thickness direction.

[0022] When IC card 1 is viewed from the +Z direction, the line perpendicular to both short sides of IC card 1 and the Z axis is defined as the X axis. The direction from one short side closer to external connection terminal 71 toward the other short side is defined as the +X direction or rightward direction, and the opposite direction is defined as the -X direction or leftward direction. The axis perpendicular to the X and Z axes is defined as the Y axis, and the direction from one long side farther from external connection terminal 71 toward the other long side is defined as the +Y direction or upward direction, and the opposite direction is defined as the -Y direction or downward direction.

[0023] FIG. 1 is a plan view of the IC card 1 as viewed from the +Z direction. FIG. 2(a) is an enlarged view illustrating the internal configuration of the IC module 70 of the IC card 1 of FIG. 1, with the IC chip 74a, molded portion 74b, wires 75, and other components located on the -Z direction side of the external connection terminal 71, i.e., the back side of the page, indicated by dashed lines. FIG. 2(b) is a view of the IC module 70 of FIG. 2(a) as viewed from the -Z direction, i.e., the back side, without the card base 2. FIG. 3(a) is a cross-sectional view of the IC card 1 of FIG. 1 taken along line AA parallel to the X axis, as viewed from the -Y direction. FIG. 3(b) is a cross-sectional view of the IC card 1 of FIG. 1 taken along line BB parallel to the Y axis, as viewed from the +X direction. FIG. 4 is an enlarged view showing the configuration of the card base 2 of FIG. 1 without the IC module 70.

[0024] As shown in FIG. 1 , IC card 1 has a generally rectangular thin plate shape with rounded corners in a plan view from the +Z direction. Furthermore, an IC module 70 including an external connection terminal 71 is disposed on the surface of the dual-interface IC card on the +Z direction side, slightly to the upper left of the center, i.e., closer to the -X direction and closer to the +Y direction than the center. As shown in FIGS. 1 , 3(a), and 3(b), IC module 70 is embedded in a recess 9 formed in card base 2, and is disposed so that the surface of external connection terminal 71 on the +Z direction side is substantially flush with the surface of card base 2 on the +Z direction side. This configuration of IC card 1 complies with ISO / IEC 7816-1, an international IC card standard. Furthermore, as shown in FIG. 1 , each external terminal section of external connection terminal 71 is defined in accordance with ISO / IEC 7816-2 and ISO / IEC 7816-3 standards.

[0025] This standard specifies the following external terminals: C1 terminal (supply voltage input terminal), C2 terminal (reset signal input terminal), C3 terminal (clock signal input terminal), C5 terminal (signal ground terminal), and C7 terminal (serial data input or output terminal). Note that the C6 terminal is a standard or individual use terminal that is not normally used, and the C4 and C8 terminals are unused terminals reserved for future use. Note that the C1, C2, C3, C5, and C7 terminals may be abbreviated as VCC, RST, CLK, GND, and I / O, respectively.

[0026] 2(b), a plurality of pads 74p are formed on the IC chip 74a, and each of the plurality of pads 74p on the IC chip 74a is electrically connected to each of the terminals C1, C2, C3, C5, and C7 of the external connection terminals 71 via conductive wires 75. Two of the pads 74p on the IC chip 74a other than those mentioned above are electrically connected, via conductive wires 75, to antenna connection terminals 73a and 73b formed on the surface of the substrate 72 opposite to the external connection terminals 71. Furthermore, pads 74q and 74r on the IC chip 74a other than those mentioned above are electrically connected, via conductive wires 75, to peeling detection input terminals 53a and 53b formed on the surface of the substrate 72 opposite to the external connection terminals 71.

[0027] As shown in FIG. 1 and FIG. 3(a), the antenna connecting terminal 73a is electrically connected to the conductive first plate 110 via the conductive adhesive layer 11. The first plate 110 is welded to one end of the antenna wire 83. Furthermore, although not shown in FIG. 3(a), the antenna connecting terminal 73b is also electrically connected to the conductive second plate 120 via the conductive adhesive layer 11, and the second plate 120 is welded to the other end of the antenna wire 83. As a result, the antenna connecting terminals 73a and 73b are electrically connected to both ends of the antenna wire 83, respectively.

[0028] 1 and 3(b), the peeling detection input terminal 53a is electrically connected to the peeling detection contact 51, which is a conductive plate, via the conductive adhesive layer 11. Furthermore, although not shown in FIG. 3(b), the peeling detection input terminal 53b is also electrically connected to the peeling detection contact 51, which is a conductive plate, via the conductive adhesive layer 11. In other words, the peeling detection input terminals 53a and 53b are electrically connected to the same peeling detection contact 51 via the conductive adhesive layer 11, and therefore the peeling detection input terminals 53a and 53b are mutually conductive.

[0029] As a result, the pads 74p of the IC chip 74a and the antenna connecting terminals 73a and 73b are electrically connected to each other via the wires 75, and the antenna connecting terminal 73a is electrically connected to one end of the antenna 80 via the conductive adhesive layer 11 and the first plate 110. The antenna connecting terminal 73b is electrically connected to the other end of the antenna 80 via the conductive adhesive layer 11 and the second plate 120. As a result, the IC chip 74a and the antenna 80 can form a closed communication circuit.

[0030] On the other hand, pad 74q of IC chip 74a and peeling detection input terminal 53a are electrically connected via wire 75, and pad 74r and peeling detection input terminal 53b are electrically connected via wire 75. Furthermore, peeling detection input terminals 53a and 53b are electrically connected to peeling detection contact 51 via conductive adhesive layer 11, respectively.

[0031] Here, Fig. 5(a) is a functional block diagram showing the functional configuration of IC card 1, and Fig. 5(b) is a functional block diagram showing the detailed functional configuration of CPU 210 in Fig. 5(a). Also, Fig. 6 is a flow diagram showing the operation of IC card 1.

[0032] As shown in FIG. 5(a), the IC card 1 includes a detachment detection circuit 50 that detects whether the IC module 70 has been detached from the card body 2. The detachment detection circuit 50 is composed of an IC chip 74a and external wiring connected to pads 74q and 74r of the IC chip 74a. As shown in FIG. 5(b), the CPU 210 of the IC chip 74a includes a resistance measurement unit 310 that measures the internal resistance of the detachment detection circuit 50 or measures or detects an open / short circuit in the detachment detection circuit 50. The CPU 210 also includes a continuity determination unit 320 that determines whether the IC chip 74a has been detached from the card body 2 based on the measurement and detection results of the resistance measurement unit 310.

[0033] When the peeling detection contact 51 and the peeling detection input terminals 53a and 53b are electrically connected, the continuity determination unit 320 of the IC chip 74a determines that the peeling detection circuit 50 is in a first state. The first state indicates a normal state in which the IC module 70 is not detached from the card body 2. On the other hand, when the peeling detection contact 51 and the peeling detection input terminals 53a and 53b are not substantially electrically connected due to, for example, the IC module 70 being peeled off from the card body 2, the IC chip 74a determines that the peeling detection circuit 50 is in a second state. The second state indicates a state in which the IC module 70 is detached from the card body 2 or an abnormal state in which the IC module 70 is embedded in another card body after being detached from the card body 2. Note that the term "substantially not electrically connected" is not limited to cases in which the two objects are completely electrically insulated from each other, but also includes cases in which the resistance or potential difference between them exceeds a predetermined resistance or potential difference, or the current value between them is below a predetermined current value.

[0034] When the IC chip 74a is in the second state, it can restrict at least some of the processes that are possible when the peeling detection circuit 50 is in the first state. For example, when the IC chip 74a is in the second state, it can prohibit processes that are possible in the first state, such as dispensing cash of a predetermined amount or more and purchasing processes. Also, when the IC chip 74a is in the second state, it can prohibit either or both of contact communication and contactless communication, which are possible in the first state.

[0035] Thus, IC card 1, which is a dual interface IC card of the first embodiment, includes card base 2 and IC module 70 arranged in recess 9 of card base 2. IC module 70 includes substrate 72, external connection terminal 71 formed on one surface of substrate 72, and IC chip 74a arranged on the other surface of substrate 72 and electrically connected to external connection terminal 71, and peeling detection input terminals 53a and 53b electrically connected to the IC chip.

[0036] External connection terminal 71 is arranged so as to be exposed on the surface of card body 2. Furthermore, peeling detection contact 51, which is an electrical conductor, is provided in recess 9 of card body 2. Peeling detection contact 51 is electrically connected to peeling detection input terminals 53a and 53b. IC chip 74a determines whether peeling detection circuit 50, which is made up of IC chip 74a, peeling detection input terminals 53a and 53b, and peeling detection contact 51, is in a first state or a second state different from the first state.

[0037] When the peel detection contact 51 and the peel detection input terminals 53a and 53b are electrically connected, the IC chip 74a determines that the peel detection circuit 50 is in the first state. When the peel detection contact 51 and the peel detection input terminals 53a and 53b are not substantially electrically connected, the IC chip 74a determines that the peel detection circuit 50 is in the second state. When the IC chip 74a is in the second state, the IC chip 74a restricts at least some of the processes that are possible when the peel detection circuit 50 is in the first state. A case in which the peel detection contact 51 and the peel detection input terminals 53a and 53b are not substantially electrically connected may occur, for example, when the IC module 70 is peeled off the card base 2.

[0038] As described above, the IC card 1 according to the first embodiment has a relatively simple configuration, including the peeling detection input terminals 53a and 53b provided on the IC module 70 side, the peeling detection contact 51 provided on the card base 2 side, and the peeling detection circuit 50 including the IC chip 74a. This configuration makes it relatively easy to prevent misuse by replacing the IC module.

[0039] The configuration of the IC card 1 of this embodiment and the manufacturing method thereof will be described in detail below.

[0040] (a) Card base The card base 2 refers to the card body excluding the IC module 70 that constitutes the IC card 1. As shown in Figures 3(a) and 3(b), the card base 2 typically has a configuration in which an over-sheet layer 8, a core layer 7, antenna holding layers 6 and 5, a core layer 4, and an over-sheet layer 3 are laminated in this order from one end on the -Z direction side in the thickness direction. In addition, an antenna 80 is arranged between the antenna holding layers 6 and 5, and includes an antenna wire 83 wound in a loop shape and formed from a coated conductor wire or the like, and a plate-shaped end portion 100.

[0041] The card base 2 may refer to both the card before the recess 9 is formed and the card after the recess 9 is formed, and may refer to both the card without the antenna 80 and the card including the antenna 80. In addition, both ends of the antenna wire 83 of the antenna 80 are electrically connected to the first plate 110 on the −X direction side and the second plate 120 on the +X direction side, which are arranged along the X axis direction.

[0042] For ease of explanation, the present embodiment will be described assuming that the antenna wire 83 of the antenna 80 is a single, unbranched conductor wound into a loop, but the present disclosure is not limited to this and includes antenna wires 83 that are appropriately branched and have three or more ends. Furthermore, three or more plate-like end portions 100 can also be arranged depending on the number of ends of the antenna wire 83.

[0043] The layer structure of the card base 2 is not limited to the above, and may be a three-layer structure of an over-sheet layer, an antenna holding layer, and an over-sheet layer, or a two-layer structure of an antenna holding layer and an antenna holding layer. Alternatively, the layer structure of the card base 2 may be a multi-layer structure of eight or more layers, such as an over-sheet layer, a core layer, an inner layer, an antenna holding layer, an antenna holding layer, an inner layer, a core layer, and an over-sheet layer. Furthermore, printing or an embedded magnetic stripe may be applied to the surface of the over-sheet layer 3 or 8 of the card base 2 opposite the core layer 4 or 7, or printing may be applied to the surface of the core layer 4 or 7 adjacent to the over-sheet layer 3 or 8.

[0044] From the standpoint of conforming to standards such as ISO / IEC 7816-1, the thickness of the card base 2 is preferably 0.76 mm or more and 0.84 mm or less, but may be outside this range.

[0045] (i) Core layer The core layer is also referred to as the inner layer. A wide variety of white or colored plastic sheets can be used for the core layers 4 and 7, including the following single films or composite films: polyethylene terephthalate (PET), PET-G (terephthalic acid-cyclohexanedimethanol-ethylene glycol copolymer), polyvinyl chloride, vinyl chloride-vinyl acetate copolymer, polycarbonate, polyamide, polyimide, cellulose diacetate, cellulose triacetate, polystyrene, ABS, polyacrylic ester, polypropylene, polyethylene, polyurethane, etc. The thickness of the core layers 4 and 7 can be selected appropriately taking into account the overall thickness of the card, but can be, for example, approximately 0.10 mm or more and 0.38 mm or less.

[0046] (ii) Antenna support layer The antenna holding layer, like the core layer, is also referred to as the inner layer. Antenna holding layers 5 and 6 have the function of sandwiching and holding antenna 80, and a wide variety of plastic sheets can be used, similar to those used for core layers 4 and 7. Antenna holding layers 5 and 6 may be made of the same material as core layers 4 and 7, or may be made of a different material. The thickness of antenna holding layers 5 and 6 can be selected appropriately taking into account the overall thickness of the card, but can be, for example, approximately 0.10 mm or more and 0.38 mm or less.

[0047] (iii) Oversheet layer The over-sheet layers 3 and 8 are typically made of the same material as the core layer and antenna holding layer, but a transparent material with a thickness of approximately 0.05 mm or more and 0.18 mm or less is often used. From the viewpoint of preventing curling when the laminate of the core layer, antenna holding layer, and over-sheet layer is integrated by heat pressing or the like, it is preferable that the over-sheet layers 3 and 8 have the same thickness, but they do not necessarily have to be the same. This also applies to the core layers 4 and 7 and the antenna holding layers 5 and 6 described above.

[0048] The material of the over-sheet layer may be any material that is heat-adhesive. However, even if the over-sheet layer itself is not heat-adhesive, the core layer and the over-sheet layer can be integrated by additionally forming a layer of a known adhesive that generates adhesive force when heated between them. Furthermore, when IC card 1 is used as a magnetic card, a magnetic stripe may be embedded in advance in one or both of over-sheet layers 3 and 8 by thermal transfer or the like on the main surface opposite to both or one of core layers 4 and 7.

[0049] (iv) Antenna sheet In this embodiment, as described below, an antenna 80 is formed on one surface of the antenna holding layer 5 or 6, and both ends of an antenna wire 83 constituting the antenna 80 are electrically connected to a first plate 110 and a second plate 120, which are plate-shaped conductive end portions 100. Formation of the antenna 80 on the antenna holding layer 5 or 6 is performed, for example, as follows. First, the first plate 110 and the second plate 120 are adhered and fixed to the surface of the antenna holding layer 6 facing the antenna holding layer 5 before lamination by applying heat and pressure or the like. At this time, an adhesive may be applied to the surface of the antenna holding layer 6 before the first plate 110 and the second plate 120 are placed. The first plate 110 and the second plate 120 are aligned in the left-right direction at the intended position for mounting the IC module 70, and are positioned so that portions of the plates overlap the antenna connection terminals 73a and 73b of the IC module 70 when placed.

[0050] Thereafter, the tip of the antenna wire 83 is welded to either the first plate 110 or the second plate 120. Then, starting from this point, a predetermined heat pressure is applied to the antenna wire 83, and the antenna wire 83, which is a coated conductor covered with an insulating material, is embedded in the surface of the antenna holding layer 6 by a wire winding former. That is, while applying a predetermined heat pressure to the antenna wire 83, an antenna supply head is drawn into a loop shape as shown in FIG. 1, and the antenna wire 83 supplied from the antenna supply head is sequentially embedded in the antenna holding layer 6. The antenna wire 83 that has been embedded is cut, and the tip of the cut antenna wire 83 is used as the end point and welded to the other of the first plate 110 or the second plate 120.

[0051] The starting and ending ends of the antenna wire 83 are electrically connected to either the first plate 110 or the second plate 120 by welding. In this way, an antenna holding layer 6 (antenna sheet 12) on which the antenna 80 is formed is obtained. The intermediate product in which the antenna 80 is embedded in the antenna holding layer 5 or 6 is sometimes referred to as the antenna sheet 12. The antenna sheet 12 can be distributed on the market by itself as a component for manufacturing an IC card 1. Alternatively, a commercial model may exist in which a sheet material such as an antenna holding layer is supplied to a processor, who processes it into an antenna sheet 12 and delivers it to the supplier.

[0052] (v) Antenna In the antenna 80 formed on the antenna holding layer 5 or 6, the antenna connection terminals 73a and 73b of the IC module 70 are electrically connected to the first plate 110 and the second plate 120, which are a pair of ends 100 to which the multiple tips of the antenna wire 83 are electrically connected. As a result, the IC chip 74a and the antenna 80 provided in the IC module 70 form a communication circuit for contactless communication. The communication circuit may be one that performs close-proximity communication using, for example, the 13.56 MHz HF frequency band specified in ISO / IEC 18092, ISO / IEC 144443, or the like. Alternatively, it may be one that performs communication using other frequency bands, such as the 920 MHz UHF frequency band, the 125 kHz LF frequency band, or the 2.45 GHz microwave frequency band.

[0053] When IC card 1 is held over an external device such as a reader / writer, the magnetic field and radio waves generated by the reader / writer generate electromotive force and current in the communication circuit, which then supplies power to IC chip 74a. This enables IC chip 74a to be driven, enabling contactless transmission and reception of information with the reader / writer, and reading and rewriting of information from and to the memory.

[0054] The antenna wire 83 constituting the antenna 80 is typically formed of a coated conductor wire in which the periphery of a copper wire is coated with an insulating material. Alternatively, copper alloy wires such as Cu-Ni, Cu-Cr, Cu-Zn, Cu-Sn, and Cu-Be, or various metal wires and metal alloy wires such as iron, stainless steel, and aluminum, can also be selected. By using a coated conductor wire, the IC card 1 can be manufactured more inexpensively than, for example, a copper foil etching method. However, the IC card 1 of the present disclosure may also use an antenna wire formed by a copper foil etching method, a metal foil punching method, or the like.

[0055] The diameter of the antenna wire 83 is not particularly limited as long as it can ensure the characteristics as a contactless communication circuit, but it can be, for example, 0.03 mm or more and 0.30 mm or less, and preferably 0.05 mm or more and 0.15 mm or less. By setting the diameter in the latter range, durability against heat pressure during embedding and external forces due to cutting can be improved, and good communication characteristics can be ensured.

[0056] (vi) Ends (first plate and second plate) Next, the configuration of the first plate 110 and the second plate 120, which are the conductive end portion 100, will be described in detail. The first plate 110 and the second plate 120 are both substantially rectangular plate-like members in a plan view along the Z-axis direction, which is the normal direction to the main surface of the IC card 1. As shown in Fig. 4, the first plate 110 and the second plate 120 have, in the plan view, a region that overlaps with the first recess 91, i.e., a region that is exposed from the card base 2, and a region that is located outside the first recess 91 and is embedded inside the card base 2.

[0057] 4 , in the outer periphery 93 of the recess 9 in the plan view, the straight lines that overlap the edge 93a on the −X direction side along the Y axis and the edge 93b on the +X direction side along the Y axis are defined as lines m1 and m2, respectively. In this case, the region of the first plate 110 on the +X direction side of the line m1 is exposed from the card base 2 in the first recess 91, and the region of the second plate 120 on the −X direction side of the line m2 is covered by the card base 2. Similarly, the region of the second plate 120 on the −X direction side of the line m2 is exposed from the card base 2 in the first recess 91, and the region of the second plate 120 on the +X direction side of the line m2 is covered by the card base 2.

[0058] Taking the first plate 110 as an example, the width along the X-axis direction of the first plate exposed from the card base 2 in the first recess 91 is W12, the same as the width of the first recess 91, and is narrower than the width W11 including the width of the portion covered by the card base 2. The vertical width along the Y-axis direction of the first plate exposed from the card base 2 in the first recess 91 is W2. While the sizes and ratios of W12, W11, and W2 are arbitrary, it is preferable that the area of ​​the antenna connection terminal 73a when the IC module 70 is placed be included within the area of ​​the vertical width W2 and horizontal width W12 of the first plate 110. This ensures a stable contact area for electrical connection between the antenna connection terminal 73a and the first plate 110. The same applies to the second plate 120. In this way, the multiple antenna connection terminals 73a, 73b are electrically connected to the corresponding multiple end portions 100 (first plate 110 and second plate 120) on the surfaces of the end portions 100, which are the first plate 110 and the second plate 120, facing the opening side of the recess 9 of the card base 2.

[0059] Furthermore, since the first plate 110 and the second plate 120 are partially covered by the card base 2 in this manner, the first plate 110 and the second plate 120 are more effectively held against external forces such as the cutting resistance of the end mill blade when forming the recess 9. This prevents the plates from accidentally peeling off from the card base 2 and becoming misaligned.

[0060] The first plate 110 and the second plate 120 may have a laminated structure including at least two layers: a first member and a second member laminated on the +Z direction side of the first member. In this case, it is preferable that the second member is a member that is less susceptible to oxidation than the first member. A member that is less susceptible to oxidation can be rephrased as a metal having a lower ionization tendency than the first member, for example, when both the first member and the second member are metals. Examples of such metals include aluminum, iron, nickel, or copper for the first member, and silver, palladium, platinum, or gold for the second member.

[0061] Considering the ease of material procurement, cost, processability, electrical properties, etc., it is preferable to use highly conductive copper for the first member and silver plating for the second member among the above listed materials. By using copper, which can ensure sufficient conductivity, as the first member and silver plating, which is resistant to oxidation and easily exposes the metal interface when the resin layer is cut with an end mill, for the second member, it is possible to obtain good electrical properties and processability while suppressing increases in cost.

[0062] On the other hand, the first plate 110 and the second plate 120 may be configured as a single member only, without having the above-mentioned two-layer or three-layer or more laminated structure. In this case, the single member is limited to a conductive member, and for example, the above-mentioned members exemplified as the first member and the second member, or alloys thereof, etc. can be used. Preferably, copper, aluminum, stainless steel, or the like, which have high conductivity, can be selected. Using a single member makes it easier to obtain and process materials, and also leads to cost reduction.

[0063] In this embodiment, as described above, a configuration will be described in which the multiple ends of the antenna wire 83 are welded to the pair of end portions 100, that is, the first plate 110 and the second plate 120, but the ends of the antenna wire 83 do not necessarily need to be connected to such plates. As will be described later, for example, by configuring the multiple ends of the antenna wire 83 to be folded back multiple times in a zigzag shape, a meander shape, or a bellows shape, the antenna wire 83 can perform the same function as the above-mentioned plates.

[0064] (vii) Peel detection contact Next, the configuration of the conductive peeling detection contact 51 will be described in detail. Like the first plate 110 and the second plate 120 described above, the peeling detection contact 51 is a plate-like member that is substantially rectangular in plan view along the Z-axis direction, which is the normal direction to the main surface of the IC card 1. Typically, the peeling detection contact 51 has the same material and thickness as the first plate 110 and the second plate 120. As shown in FIG. 4 , in plan view, the peeling detection contact 51 has a region that overlaps with the first recess 91, i.e., a region that is exposed from the card base 2, and a region that is located outside the first recess 91 and is embedded inside the card base 2.

[0065] 4, a line that overlaps with a side 93c along the X-axis of the outer periphery 93 of the recess 9 in the plan view is defined as a line m3. In this case, the area of ​​the peeling detection contact 51 on the +Y direction side of the line m3 is exposed from the card base 2 in the first recess 91, and the area on the −Y direction side of the line m3 is covered by the card base 2.

[0066] The vertical width along the Y-axis direction of the peeling detection contact 51 exposed from the card base 2 in the first recess 91 is W32, the same as the vertical width of the first recess 91, and is narrower than the horizontal width W31 including the portion covered by the card base 2. Furthermore, the horizontal width along the X-axis direction of the peeling detection contact 51 exposed from the card base 2 in the first recess 91 is W4. The sizes and ratios of W32, W31, and W4 are arbitrary, but it is preferable that the area of ​​the peeling detection input terminals 53a and 53b when the IC module 70 is placed be included within the area of ​​the vertical width W32 and horizontal width W4 of the peeling detection contact 51. This is because a stable contact area for electrical connection between the peeling detection input terminals 53a and 53b and the peeling detection contact 51 can be obtained.

[0067] Also, similar to the first plate 110 and the second plate 120, a portion of the peeling detection contact 51 is covered by the card base 2, which enhances the effect of holding the peeling detection contact 51 against external forces such as the cutting resistance of the end mill blade when forming the recess 9. This prevents the plate from accidentally peeling off from the card base 2 and becoming misaligned.

[0068] The peeling detection contact 51 may have the same material configuration, thickness, and the like as the first plate 110 and the second plate 120 described above. By configuring the peeling detection contact 51 in this manner as the first plate 110 and the second plate 120, the burden of material preparation and the manufacturing process can be reduced compared to providing the peeling detection contact 51 on the card base 2 using a different material or a different process. Meanwhile, the peeling detection contact 51 does not have to be a metal plate like the first plate 110 and the second plate 120. For example, the peeling detection contact 51 may be formed by transferring aluminum foil to the card base 2, or by printing or applying ink or paste containing metal particles such as aluminum powder or silver particles to the card base 2. Furthermore, the peeling detection contact 51 may be formed by adhering a graphite film to the card base 2. Configuring the peeling detection contact 51 in this manner reduces the cost of the material itself that provides the peeling detection contact 51.

[0069] (b) IC module Next, each of the main components of the IC module 70 will be described mainly with reference to Figures 2(a), 2(b) and 3(a) and 3(b). The IC module 70 is embedded in a recess 9 formed in the card base 2, and antenna connection terminals 73a and 73b of the IC module 70 are electrically connected to the first plate 110 and the second plate 120 of the antenna 80, respectively, via a conductive adhesive layer 11. This allows the formation of a communication circuit for contactless communication.

[0070] Furthermore, peeling detection input terminals 53a and 53b of IC module 70 are electrically connected to peeling detection contact 51 via conductive adhesive layer 11, thereby forming peeling detection circuit 50 in which IC chip 74a, peeling detection input terminals 53a and 53b, and peeling detection contact 51 form a closed circuit. Meanwhile, IC chip 74a can communicate with a contact-type reader / writer or the like through external connection terminal 71 provided on IC module 70.

[0071] The substrate 72 is made by bonding copper foil to the front and back of a flexible insulating resin film such as glass epoxy resin or polyimide resin with an adhesive, and leaving the copper foil on the front and back of the resin film so as to form a predetermined pattern. Specifically, an external connection terminal 71 is formed on one copper foil surface of the resin film, and antenna connection terminals 73a and 73b and peel detection input terminals 53a and 53b are formed on the other copper foil surface. Specifically, a photosensitive material is applied to one and the other copper foil surfaces of the resin film, a film plate with a predetermined pattern is placed on it, exposed to light, and the non-photosensitive portions are removed by etching.

[0072] This forms a substrate 72 with some copper foil remaining in a predetermined pattern on the front and back surfaces of the resin film. In addition, bonding holes 76, which are through holes for wire bonding to external connection terminals 71, are provided in advance in a plurality of locations on the substrate 72.

[0073] As shown in Figures 1 and 2(a), the external connection terminal 71 is defined as each external terminal section defined by the ISO / IEC 7816-2 standard. Specifically, as previously mentioned, the external connection terminal 71 is defined as having the C1 terminal (supply voltage input terminal), C2 terminal (reset signal input terminal), C3 terminal (clock signal input terminal), C5 terminal (signal ground terminal), and C7 terminal (serial data input or output terminal). The C6 terminal is a standard or individual use terminal that is not normally used, and the C4 and C8 terminals are unused terminals reserved for future use. These terminal areas are defined by insulating grooves 71a. Specifically, the external connection terminal 71 has a predetermined pattern of terminal areas formed of copper foil or the like on one side of an insulating substrate 72, and the insulating grooves 71a are areas where the copper foil is interrupted, exposing the substrate 72.

[0074] As shown in FIG. 2(a), the C1 through C4 terminals are partitioned from top to bottom in the area on the left side of the external connection terminal 71 when viewed from the +Z direction, and the C5 through C8 terminals are partitioned from top to bottom in the area on the right side. While the C5 terminal extends downward toward the center of the external connection terminal 71, this arrangement is not necessary; an area insulated from any of the C1 through C8 terminals may be partitioned. Note that in FIG. 2(a), the IC chip 74a, molded portion 74b, bonding hole 76, pads 74p, 74q, and 74r, antenna connection terminals 73a and 73b, and peel detection input terminals 53a and 53b are positioned further back in the page than the external connection terminal 71 and are shown with dashed lines. However, to clearly distinguish between the wire 75 and the lead-out lines, all of the lead-out lines are shown with solid lines.

[0075] 2(b), the outline of molded portion 74b is shown with a dashed line, and the outlines of IC chip 74a, bonding holes 76, wires 75, pads 74p, 74q, 74r, antenna connection terminals 73a, 73b, and peel detection input terminals 53a and 53b hidden inside molded portion 74b should also be dashed lines. However, for ease of viewing, these are all shown with solid lines, assuming that molded portion 74b does not exist.

[0076] The surface of IC chip 74a facing away from substrate 72 is a circuit surface, and is provided with a circuit pattern, a plurality of pads 74p which are electrodes, as well as pads 74q and 74r on the surface. At locations corresponding to each section of external connection terminal 71, the back surface of external connection terminal 71 can be seen from the -Z direction side through bonding holes 76 which are holes formed in substrate 72. That is, pads 74p of IC chip 74a and predetermined sections of external connection terminal 71 can be electrically connected to each other by connecting them with wires 75 such as gold wires through bonding holes 76.

[0077] Furthermore, on the surface of the substrate 72 opposite the external connection terminal 71, a pair of antenna connection terminals 73a and 73b, which are conductive regions that are approximately H-shaped in plan view, are arranged on both left and right sides of the IC chip 74a. Similarly, on the surface of the substrate 72 opposite the external connection terminal 71, a pair of peeling detection input terminals 53a and 53b, which are conductive regions that are approximately rectangular in plan view, are arranged below the IC chip 74a, i.e., on the -Y direction side. The multiple antenna connection terminals 73a, 73b are electrically connected to the corresponding multiple end parts 100 (the first plate 110 and the second plate 120) on the surfaces of the first plate 110 and the second plate 120, which are end parts 100, that face the opening side of the recess 9 of the card base 2.

[0078] Taking FIG. 2(a) as an example, multiple pads 74p on IC chip 74a are connected to terminals C1, C2, C3, C5, C7, and C8, respectively, by wires 75. Other pads 74p on IC chip 74a are also connected to antenna connection terminals 73a and 73b by wires 75. Other pads 74q on IC chip 74a are also connected to peeling detection input terminal 53a by wires 75, and pad 74r is also connected to peeling detection input terminal 53b by wires 75. These bonding holes 76 and wires 75 are covered and protected by molded portion 74b. In this embodiment, seven pads 74p are provided on IC chip 74a, but the number and arrangement are merely an example and any number and arrangement may be used.

[0079] In the IC module 70 of this embodiment, two pads 74q and 74r on the IC chip 74a are electrically connected to a pair of peeling detection input terminals 53a and 53b formed on the substrate 72. At this point, the IC chip 74a and the peeling detection input terminals 53a and 53b form an open circuit rather than a closed circuit. However, as described above, when the IC module 70 is embedded in the recess 9 of the card base 2, if the conductive peeling detection contacts 51 facing the peeling detection input terminals 53a and 53b are exposed at predetermined positions in the recess 9, the following occurs. That is, the peeling detection input terminals 53a and 53b are electrically connected to the peeling detection contacts 51, respectively, so that the IC chip 74a and the peeling detection input terminals 53a and 53b form a peeling detection circuit 50, which is a closed circuit.

[0080] In this case, the closed circuit indicates that the circuit formed outside the IC chip 74a from pads 74q to 74r is closed, assuming that pads 74q and 74r of the IC chip 74a are closed inside the IC chip 74a. However, strictly speaking, as shown in another embodiment described later, pads 74q and 74r of the IC chip 74a may be opened by a switch or the like in the internal circuit of the IC chip 74a.

[0081] On the other hand, suppose a malicious third party removes IC module 70 from IC card 1 and embeds it in a recess in the base of another card. In this case, if there is no conductive portion in the recess facing peeling detection input terminals 53a and 53b at a predetermined position, the IC chip 74a and peeling detection input terminals 53a and 53b cannot form peeling detection circuit 50, which is a closed circuit. Conversely, peeling detection circuit 50 is normally in an open state. Therefore, if the open / closed state of peeling detection circuit 50 can be determined as a function of IC chip 74a of IC module 70, it can be determined whether IC card 1 is a legitimate card.

[0082] An IC chip body 74 is disposed on the surface of the substrate 72 opposite to the surface on which the external connection terminals 71 are formed. The IC chip body 74 is composed of an IC chip 74a adhered and fixed to the substrate 72 with an adhesive, bonding wires 75 for connection, and a molded portion 74b made of sealing resin for protecting these. The IC chip 74a includes a CPU for controlling both contact and contactless communication operations, and storage devices such as RAM, ROM, EEPROM, and flash memory. The IC chip 74a also includes various circuits, such as an interface circuit for decoding input signals and generating output signals for contact and contactless communication, and a power generation circuit. Note that these various circuits may be provided as elements separate from the IC chip 74a.

[0083] The molded portion 74b is provided as a protruding portion that covers the IC chip 74a and the wires 75 to protect them from external force loads and environmental loads. The molded portion 74b is made of an ultraviolet curable resin, a thermosetting resin, or the like.

[0084] The thickness of the IC chip body 74 depends on the thickness of the IC chip 74a provided therein and the shape of the bonded wires, but can be, for example, 0.45 mm to 0.75 mm. The total thickness of the IC module 70 can be, for example, 0.35 mm to 1.0 mm, and preferably 0.40 mm to 0.65 mm. By keeping the thickness within the latter range, the maximum depth of the recess 9 can be 0.7 mm or less, and the overall thickness of the IC card 1 can be kept to 0.84 mm or less, as defined by the ISO / IEC 7816-1 standard.

[0085] Next, the functionality of the IC chip 74a will be described. FIG. 5(a) is a functional block diagram showing the functional configuration of the IC card 1. FIG. 5(b) is a functional block diagram showing the functional configuration of the resistance measurement unit 310 and the continuity determination unit 320, particularly, provided in the CPU 210. FIGS. 5(c) and 5(d) are schematic diagrams showing an example of an equivalent circuit of the peeling detection circuit 50 including the internal circuitry of the IC chip 74a. As shown in FIG. 5(a), the IC card 1 includes at least the IC chip 74a, an external connection terminal 71, and an antenna 80. In addition to the CPU 210, the IC chip 74a includes at least the peeling detection circuit 50, a memory 230, a contact interface unit 220, and a contactless interface unit 240.

[0086] An electrical signal input through the external connection terminal 71 is converted by the contact interface unit 220 into information that can be interpreted by the IC chip 74a and input to the IC chip 74a. In the IC chip 74a, the CPU 210 reads, writes, calculates, etc. data while using the memory 230, and outputs some information as a result of these processes to the contact interface unit 220. The contact interface unit 220 converts this information into a predetermined electrical signal intended for an external device such as a contact reader / writer, and outputs it from the external connection terminal 71. As described above, the memory 230 is composed of the EEPROM 231, which is a rewritable nonvolatile memory, the RAM 232, which is a volatile memory for temporary storage, the ROM 233, which is a non-rewritable nonvolatile memory, etc. The EEPROM 231 may be replaced with a flash memory, etc.

[0087] Furthermore, the electrical signal input through the antenna 80 is converted by the contactless interface unit 240 into information that can be interpreted by the IC chip 74a and input to the IC chip 74a. In the IC chip 74a, the CPU 210 reads, writes, calculates, etc. data while using the memory 230, and outputs some information as a result of these processes to the contactless interface unit 240. The contactless interface unit 240 converts this information into a predetermined electrical signal intended for an external device such as a contactless reader / writer, and outputs it from the antenna 80.

[0088] Meanwhile, the peel detection circuit 50 is configured as a predetermined circuit including peel detection input terminals 53a and 53b. Examples of equivalent circuits are shown in Figures 5(c) and 5(d). If the equivalent circuit of the peel detection circuit 50 were as shown in Figure 5(c), the external wiring from pad 74q to pad 74r of the IC chip 74a would be connected without any resistor between them. Therefore, pads 74q and 74r of the IC chip 74a of the peel detection circuit 50 would be short-circuited, and the potential difference would be approximately zero. Because the internal circuit of the IC chip 74a has an internal resistance R1, assuming a power supply V, a current I1 of I1 = V / R1 would flow through the peel detection circuit 50. If the external wiring from pad 74q to pad 74r of the IC chip 74a were to be broken, the pads 74q and 74r of the IC chip 74a of the peel detection circuit 50 would be open, the potential difference would be infinite, and no current would flow through the peel detection circuit 50.

[0089] Furthermore, when the equivalent circuit of the peel detection circuit 50 is as shown in FIG. 5(d), the external wiring from pad 74q to pad 74r of the IC chip 74a is connected with an external resistor R2 sandwiched therebetween. Therefore, a predetermined potential difference V1 is established between pads 74q and 74r of the IC chip 74a of the peel detection circuit 50. At this time, a current I2 of I2 = V / (R1 + R2) flows through the peel detection circuit 50. If the external wiring from pad 74q to pad 74r of the IC chip 74a is broken, the pads 74q and 74r of the IC chip 74a of the peel detection circuit 50 become open, the potential difference becomes infinite, and no current flows through the peel detection circuit 50. On the other hand, if the IC module 70 is replaced with a different card base, the value of I2 changes due to changes in the internal resistance of the peel detection contact 51 itself and the resistance of the connection between the peel detection input terminals 53a and 53b and the peel detection contact 51.

[0090] The resistance measurement unit 310 of the CPU 210 detects and measures the open or short state of the detachment detection circuit 50, or the potential difference, current value, etc. at a predetermined portion of the detachment detection circuit 50. Furthermore, the continuity determination unit 320 determines whether the IC module 70 is in a legitimate state (i.e., not detached from the card body 2) or in an unauthorized state (i.e., detached from the card body 2) based on the information from the resistance measurement unit 310. For example, the continuity determination unit 320 determines that the IC module 70 is in a legitimate state if, as a result of measurement by the resistance measurement unit 310, the pads 74q and 74r are shorted or the potential difference between the two pads is equal to or less than a predetermined value. On the other hand, if the pads 74q and 74r are open or the potential difference between the two pads exceeds a predetermined value, the continuity determination unit 320 can determine that the IC module 70 is in an unauthorized state (i.e., once detached).

[0091] (c) Conductive adhesive layer After forming a recess 9 for embedding an IC module 70 in the card base 2 by cutting or the like using an end mill, the conductive adhesive layer 11 is embedded and fixed in the recess 9, electrically and mechanically connecting the IC module 70. As shown in FIG. 3(a), the conductive adhesive layer 11 is a liquid or tape-like member that is disposed so as to be sandwiched between the first plate 110, the second plate 120 (not shown), the substrate 72 of the IC module 70, and the antenna connection terminals 73a and 73b formed on the substrate 72. As shown in FIG. 3(b), the conductive adhesive layer 11 is a liquid or tape-like member that is disposed so as to be sandwiched between the peeling detection contact 51, the substrate 72 of the IC module 70, and the peeling detection input terminal 53a and the peeling detection input terminal 53b (not shown) formed on the substrate 72.

[0092] The conductive adhesive layer sandwiched between the first plate 110, the second plate 120, and the antenna connection terminals 73a, 73b and the conductive adhesive layer sandwiched between the peel detection contact 51 and the peel detection input terminals 53a, 53b do not necessarily have to be made of the same material. For example, the former may be a tape-like material and the latter a liquid material, or the components of the former and latter conductive adhesive layers may be different. However, by making the components and configuration of the former and latter conductive adhesive layers the same, the burden of material preparation and formation processes for the conductive adhesive layers can be reduced.

[0093] The conductive adhesive layer 11 may be applied or attached in advance to the surface of the substrate 72 of the IC module 70 opposite the external connection terminal 71, or may be applied or attached to the bottom surface of the recess 9 of the card base 2 after cutting.

[0094] A typical conductive adhesive layer 11 also serves as a mechanical connection between the IC module 70 and the cut card base 2, and may be applied or attached to the entire back surface of the substrate 72 or to a portion of the recess 9 that corresponds to the first recess 91. In this way, the electrical connection between the IC chip 74a and the antenna 80 and the mechanical connection between the IC module 70 and the card base 2 can be achieved with the same type of conductive adhesive layer 11, which contributes to simplification of the process.

[0095] However, the conductive adhesive layer 11 may be applied and stuck to the back surface of the substrate 72 so as to cover only the areas of the antenna connection terminals 73a and 73b, and another adhesive that does not have conductivity may be applied and stuck to the rest of the back surface of the substrate 72. This is because the conductivity of the other adhesive does not need to be taken into consideration, making it easier to select an adhesive that is advantageous for mechanical connection.

[0096] The conductive adhesive layer 11, which can be used for both electrical and mechanical connection, can be anisotropic conductive film (ACF) or anisotropic conductive paste (ACP). Alternatively, conductive paste or solder paste, which is epoxy resin with silver particles dispersed as a filler, can also be used. Among these, ACF can be thermally laminated to the entire back surface of the substrate 72 of the IC module 70. The IC module 70 can then be embedded in the recess 9 of the card base 2 after being cut, and then heat-pressed at a predetermined temperature and load. This facilitates electrical connection between the IC chip 74a and the antenna 80. Furthermore, mechanical connection of the IC module 70 to the card base 2 can be achieved at the same time, simplifying the process of mounting the IC module 70 on the card base 2.

[0097] The electrical connection between the IC chip 74a and the antenna 80 and the mechanical connection between the IC module 70 and the card base 2 when an ACF is used as the conductive adhesive layer 11 can be explained as follows, based on FIG. 3(a). The conductive adhesive layer 11 has a structure in which conductive particles 11a, each consisting of spherical resin or metal particles surrounded by a metal film, are dispersed in an adhesive 11b, which is a binder containing an adhesive component. The conductive particles may be resin coated with nickel or gold, or solder particles. Various solder particles, such as SnPb-based, SnAgCu-based, SnCu-based, SnZnBi-based, SnAgInBi-based, and SnZnAl-based, as well as alloys of these with other metals, can be used. These structures are similar when an ACP is used.

[0098] Here, thermal pressure is applied to the substrate 72 from the +Z direction to the -Z direction so as to compress the conductive adhesive layer 11, which is arranged so as to be sandwiched between the first plate 110 electrically connected to the tip of the antenna wire 83, the substrate 72 of the IC module 70, and the antenna connection terminal 73a formed on the substrate 72.

[0099] As a result, strong thermal pressure is applied to a particularly narrow portion of the conductive adhesive layer 11, which is sandwiched between the antenna holding layer 5 and the antenna connecting terminal 73a. The conductive particles 11a of the conductive adhesive layer 11 in this portion are pressed against the first plate 110 exposed from the antenna holding layer 5 and the antenna connecting terminal 73a along the thickness direction of the conductive adhesive layer 11. Furthermore, if the conductive particles 11a are small, the conductive particles 11a overlap in a daisy chain manner from the first plate 110 to the antenna connecting terminal 73a along the thickness direction of the conductive adhesive layer 11. In other words, the exposed first plate 110 and the antenna connecting terminal 73a are electrically connected via the conductive particles 11a.

[0100] On the other hand, between the antenna holding layer 5 and the substrate 72 in the region where the antenna connecting terminal 73a is not present, the conductive particles 11a are not compressed to the extent that they are pressed by the first plate 110 and the antenna connecting terminal 73a along the thickness direction of the conductive adhesive layer 11, or to the extent that they overlap in a daisy chain manner. However, the adhesive force of the adhesive 11b generated by the thermal pressure mechanically connects the antenna holding layer 5 and the substrate 72. One possible reason for the adhesive force of the adhesive 11b is a wedge effect that occurs when the adhesive 11b penetrates into minute irregularities on the surfaces of the antenna holding layer 5 and the substrate 72.

[0101] As described above, in IC module 70, antenna connection terminals 73a and 73b facing each other and first plate 110 and second plate 120 are electrically connected to each other via, for example, ACF. The ACF is arranged in a region along the outer periphery 93 of recess 9 so as to overlap with first recess 91 in a plan view along the Z-axis direction.

[0102] The above-mentioned explanation of the electrical and mechanical connection via ACF between the mutually opposing antenna connection terminals 73a and 73b and the first plate 110 and the second plate 120 also applies to the explanation of Fig. 3(b). That is, the same applies to the electrical and mechanical connection via ACF between the mutually opposing peel detection input terminals 53a and 53b and the peel detection contact 51 in Fig. 3(b).

[0103] Incidentally, electrically connecting the opposing peeling detection input terminals 53a and 53b and the peeling detection contact 51 via an ACF has the following advantages: As described above, the ACF applies heat and pressure to the conductive adhesive layer 11 from above and below, so that the conductive particles 11a of the conductive adhesive layer 11 are pressed by the peeling detection input terminals 53a and 53b and the peeling detection contact 51 along the thickness direction of the conductive adhesive layer 11. As a result, the conductive particles 11a, which are originally roughly spherical, are pressed along the vertical direction, and as a result, they become elliptical in cross section, long in the left-right direction and short in the vertical direction.

[0104] If IC card 1 is used in the above state, conductive adhesive layer 11 can maintain good conductivity only in its thickness direction, maintaining good electrical connection between opposing peel detection input terminals 53a and 53b and peel detection contact 51. However, if external force or heat is applied to peel IC module 70 from card base 2 and it is embedded in another card, the conductive adhesive layer 11 remaining on IC module 70 will no longer be able to maintain conductivity in its thickness direction. This is because conductive particles 11a, once deformed by external force, have shrunk in the thickness direction, and will not deform further even if pressure is applied again, and are more likely to be destroyed by the pressure.

[0105] For these reasons, by using ACF as the conductive adhesive layer 11 for electrical connection of the peel detection input terminals 53a and 53b and the peel detection contact 51, it becomes more difficult to commit fraud by applying external force or heat to peel the IC module 70 from the card base 2 and embedding it in another card. The same effect can be achieved with an ACP, which uses a similar principle to achieve electrical connection.

[0106] (d) IC card operation Next, the operation of the IC card 1 will be described. Fig. 6 is a flow diagram showing the operation of the IC card 1. First, the IC chip 74a is started up by power being supplied to the IC chip 74a from either the external connection terminal 71 or the antenna 80 (step S401 in Fig. 6). Thereafter, the resistance measuring unit 310 of the CPU 210 of the IC chip 74a detects and measures the open or short state of the peeling detection circuit 50, or the potential difference, current value, etc. at a predetermined portion of the peeling detection circuit 50, as described above (step S402).

[0107] Next, the continuity determination unit 320 of the CPU 210 of the IC chip 74a checks whether the peeling detection circuit 50 is short-circuited or whether the potential difference between predetermined pads in the peeling detection circuit 50 is equal to or less than a predetermined value (step S403). As a result, if the peeling detection circuit 50 is short-circuited or the potential difference between predetermined pads in the peeling detection circuit 50 is equal to or less than the predetermined value, the continuity determination unit 320 determines that the IC card 1 is a genuine card (step S404). Note that, in a configuration in which the peeling detection circuit 50 measures the current value in the circuit, if the current value is equal to or greater than a predetermined value, the continuity determination unit 320 determines that the IC card 1 is a genuine card. This is essentially the same as determining whether the potential difference between predetermined pads is equal to or less than a predetermined value.

[0108] Thus, when there is a short circuit or the potential difference between predetermined pads in the peeling detection circuit 50 is equal to or less than a predetermined value (the current value is equal to or greater than a predetermined value), the peeling detection circuit 50 may be said to be in the first state. Then, normal communication is performed in accordance with a signal from the reader / writer (step S405). That is, the IC card 1 continues normal operation. The peeling detection circuit 50 being in the first state means that the peeling detection input terminals 53a and 53b of the peeling detection circuit 50 and the peeling detection contact 51 are substantially electrically connected. That is, this means that the peeling detection input terminals 53a and 53b and the peeling detection contact 51 are completely conductive, or the resistance or potential difference between them is equal to or less than a predetermined resistance or potential difference, or the current value between them is equal to or greater than a predetermined current value.

[0109] On the other hand, if the peeling detection circuit 50 is in an open state or the potential difference between predetermined pads in the peeling detection circuit 50 exceeds a predetermined value, the continuity determination unit 320 determines that the IC card 1 is a fraudulent card that was once peeled off for some reason and then fraudulently attached to another card substrate (step S406). At this time, the peeling detection circuit 50 may be referred to as being in a second state. The peeling detection circuit 50 being in the second state means that the peeling detection input terminals 53a and 53b of the peeling detection circuit 50 are not substantially electrically connected to the peeling detection contact 51. In other words, this means that the peeling detection input terminals 53a and 53b are completely disconnected from the peeling detection contact 51, or the resistance or potential difference between them exceeds a predetermined resistance or potential difference, or the current between them is below a predetermined current value.

[0110] Then, in response to the signal from the reader / writer, the continuity determination unit 320 restricts at least some of the processes that the IC card 1 can perform as normal processes (step S407). As a method for restricting this, for example, the IC card 1 may not respond to signals from the reader / writer, or may respond normally only to some specific commands and not respond to other commands. Alternatively, instead of not responding, the IC card 1 may send an error signal indicating that normal response is not possible.

[0111] Various specific examples are available for the IC chip 74a to restrict, in the second state, at least some of the operations permitted when the peel detection circuit 50 is in the first state. For example, in the second state, the IC chip 74a may be able to check the deposit amount, point balance, and available balance, which are permitted in the first state, but may be unable to withdraw cash, withdraw cash, make credit card payments, or use points. Alternatively, the IC chip 74a may be able to use a certain amount or a certain number of points, but may not be able to use transactions exceeding that amount. Alternatively, the personal authentication function may be completely unavailable for certain procedures, or may be available only for certain procedures, but not for any procedures beyond that. Furthermore, in the second state, the IC chip 74a may prohibit either or both of contact communication and contactless communication, which are permitted in the first state.

[0112] (e) IC card manufacturing method Next, an example of a method for manufacturing the IC card 1, which is a dual interface IC card, using the card base 2, IC module 70, and conductive adhesive layer 11 described above will be described.

[0113] First, the first plate 110 and the second plate 120, which are plate-shaped end portions 100, are bonded to the surface of either the antenna holding layer 5 or 6 on the side not adjacent to the core layer 4 or 7. Both may be bonded and fixed to the surface of the antenna holding layer 5 or 6 via an adhesive. Furthermore, the peeling detection contact 51 is bonded to the same surface of the antenna holding layer 5 or 6 as the surface to which the first plate 110 and the second plate 120 are bonded. Like the first plate 110 and the second plate 120, the peeling detection contact 51 may also be bonded and fixed to the corresponding surface of the antenna holding layer 5 or 6 via an adhesive. The first plate 110, the second plate 120, and the peeling detection contact 51 can all be made of the same material and have the same configuration.

[0114] Next, the coated conductor coated with an insulating member is used as the antenna wire 83 and is embedded by a winding machine into the formation surface of the antenna holding layer 5 or 6 on which the end portion 100 is formed, with the start point being either the first plate 110 or the second plate 120 and the end point being the other. Here, the winding machine welds the tip of the antenna wire 83 to the first plate 110 and the second plate 120 at the start and end points of the antenna wire 83.

[0115] 1 while applying a predetermined heat and pressure to the antenna holding layer 6, and the antenna wire 83 supplied from the antenna supply head is successively embedded in the antenna holding layer 6. In this case, the antenna holding layer 6 may be referred to as a first substrate.

[0116] Next, as shown in Figures 3(a) and 3(b), over-sheet layer 8, core layer 7, antenna holding layers 6 and 5, core layer 4, and over-sheet layer 3 are stacked in this order from bottom to top in the thickness direction. Then, the laminate of large sheets with cards arranged vertically and horizontally in multiple faces is sandwiched between stainless steel plates from above and below in the thickness direction, and heat and pressure are applied to the laminate via the stainless steel plates. At this time, for example, antenna 80 is formed in advance on the surface of antenna holding layer 6 so that it is sandwiched between antenna holding layers 5 and 6. At this time, antenna holding layer 5, which is positioned opposite antenna holding layer 6 as the first substrate and is stacked on the first substrate so as to sandwich antenna 80, may be referred to as the second substrate.

[0117] By undergoing this heat pressing process, a large-sized sheet-unit card base can be obtained in which each layer of the laminate, including the first substrate and the second substrate, is integrated. Furthermore, if any of the oversheet layer, core layer, and antenna-holding layer has heat resistance that prevents heat fusion at a predetermined temperature, an adhesive sheet that heat fused at a predetermined temperature is sandwiched between the layers, or an adhesive is applied. Then, by subjecting these to a heat pressing process, an integrated large-sized sheet-unit card base can be obtained.

[0118] The large-sized card substrate obtained as described above, on which the cards are arranged in a multi-faceted array, is punched out by a punching machine into card substrates 2 that meet the ISO / IEC 7816-1 card size. Furthermore, recesses 9 for embedding IC modules 70 are formed in the card substrate 2 by cutting using an end mill. This results in the cut card substrate 2. The recesses 9 are configured in two stages: a first recess 91 with a first depth for accommodating the flat substrate 72 of the IC module 70, and a second recess 92 with a second depth deeper than the first recess 91 for accommodating the convex IC chip body 74. Furthermore, the first plate 110, the second plate 120, and the surface of the peel detection contact 51 are exposed at the bottom of the first recess 91 of the card substrate 2.

[0119] Meanwhile, separate from the manufacturing of the card base 2 and the cutting process for forming the recesses 9, the conductive adhesive layer 11 is attached to the IC module 70. The IC module 70 is typically a module tape in which the IC module 70 is continuously formed on a long tape in one or two rows. A tape-shaped ACF is attached to the surface of this module tape opposite the surface on which the external connection terminals 71 are formed, while applying a certain amount of heat and pressure. The module tape with the ACF attached is then punched out with a punching machine into a roughly rectangular IC module 70 with rounded corners, thereby obtaining the IC module 70 with the conductive adhesive layer 11 attached.

[0120] Next, an IC module 70 with a conductive adhesive layer 11 attached thereto is embedded in the card base 2 with the recess 9 formed therein, and a predetermined heat block is pressed against the external connection terminal 71, applying a predetermined heat pressure toward the card base 2 for a predetermined time. This melts the conductive adhesive layer 11 made of ACF, thereby establishing electrical connections between the antenna connection terminals 73a and 73b of the IC module 70 and the first plate 110 and the second plate 120. This also establishes electrical connections between the peel detection input terminals 53a and 53b of the IC module 70 and the peel detection contact 51. This also establishes mechanical connections between the IC module 70 and the card base 2. The application time and heat pressure conditions for the ACF vary depending on the type and composition of the ACF. For example, the application time and heat pressure conditions can be between 0.5 seconds and 10.0 seconds, the temperature between 150°C and 250°C, and the pressure between 20 MPa and 100 MPa.

[0121] (f) Regarding the IC card of the first embodiment To summarize the above, the IC card 1 of the first embodiment is a dual-interface IC card capable of contact communication with an external device and contactless communication with an external device. The IC card 1 includes a card base 2 and an IC module 70 disposed in a recess 9 of the card base 2. The IC module 70 includes a substrate 72, an external connection terminal 71 formed on one surface of the substrate 72, and an IC chip 74a disposed on the other surface of the substrate 72 and electrically connected to the external connection terminal 71, and peeling detection input terminals 53a and 53b electrically connected to the IC chip 74a.

[0122] External connection terminal 71 is arranged so as to be exposed on the surface of card base 2, and peeling detection contact 51, which is an electrical conductor, is provided in recess 9 of card base 2, and peeling detection contact 51 is electrically connected to peeling detection input terminals 53a and 53b. IC chip 74a determines whether peeling detection circuit 50, which is made up of IC chip 74a, peeling detection input terminals 53a and 53b, and peeling detection contact 51, is in a first state or a second state different from the first state.

[0123] When the peeling detection contact 51 and the peeling detection input terminals 53a and 53b are electrically connected, the IC chip 74a determines that the peeling detection circuit 50 is in the first state. When the peeling detection contact 51 and the peeling detection input terminals 53a and 53b are not substantially electrically connected, the IC chip 74a determines that the peeling detection circuit 50 is in the second state. In the second state, the IC chip 74a restricts at least some of the processes that are possible when the peeling detection circuit 50 is in the first state. A case in which the peeling detection contact 51 and the peeling detection input terminals 53a and 53b are not substantially electrically connected may occur, for example, when the IC module 70 is peeled off the card base 2.

[0124] The IC card 1 of the first embodiment has the above-described configuration, making it possible to provide an IC card and a method for manufacturing the same that can prevent misuse through replacement of IC modules with a relatively simple configuration.

[0125] 2. Second embodiment Next, an IC card according to a second embodiment of the present disclosure will be described.

[0126] The IC card of the second embodiment is a contact IC card that does not have a contactless communication function but only a contact communication function. Figure 7 is an enlarged view illustrating the internal configuration of an IC module 70a used in the IC card of this embodiment, and corresponds to Figure 2(a). As in Figure 2(a), the IC chip 74a, molded part 74b, wires 75, etc., which are arranged on the -Z direction side of the external connection terminal 71, i.e., on the back side of the paper, are indicated by dashed lines.

[0127] In the IC module 70a, there are no pair of antenna connection terminals 73a and 73b, which are conductive areas that are approximately H-shaped in plan view, on either side of the IC chip 74a on the side opposite the external connection terminal 71 of the substrate 72. However, on the side opposite the external connection terminal 71 of the substrate 72, there are a pair of peeling detection input terminals 53a and 53b, which are conductive areas that are approximately rectangular in plan view, located below the IC chip 74a, i.e., on the -Y direction side.

[0128] 7 as an example, a plurality of pads 74p of IC chip 74a are connected to each of terminals C1, C2, C3, C5, and C7 by wires 75. A pad 74q other than the above on IC chip 74a is connected to peeling detection input terminal 53a by wires 75, and a pad 74r is connected to peeling detection input terminal 53b by wires 75. That is, IC module 70a of this embodiment differs from IC module 70 of the first embodiment only in that it does not have antenna connection terminals 73a and 73b, but is otherwise the same.

[0129] In the IC module 70a of this embodiment, similarly to the first embodiment, two pads 74q and 74r of the IC chip 74a are electrically connected to a pair of peeling detection input terminals 53a and 53b formed on the substrate 72. At this point, the IC chip 74a and the peeling detection input terminals 53a and 53b form an open circuit rather than a closed circuit, because there is no wiring electrically connecting the peeling detection input terminals 53a and 53b.

[0130] However, suppose that the IC card has a peeling detection contact 51 similar to that in the first embodiment in the recess 9 of the card base 2. In this case, when the IC module 70a is embedded in the recess 9 of the card base 2, if the conductive peeling detection contact 51 facing the peeling detection input terminals 53a and 53b is exposed at a predetermined position in the recess 9, the peeling detection input terminals 53a and 53b are electrically connected to the peeling detection contact 51. This allows the IC chip 74a and the peeling detection input terminals 53a and 53b to form a peeling detection circuit 50, which is a closed circuit.

[0131] On the other hand, suppose that the IC module 70a is removed from the IC card 1 and embedded in a recess of another card base. If there are no conductive portions in the recess facing the peeling detection input terminals 53a and 53b at the predetermined positions, the IC chip 74a and the peeling detection input terminals 53a and 53b do not form a closed circuit, i.e., the peeling detection circuit 50, which is an open circuit. Therefore, if the IC chip 74a of the IC module 70a can determine the open / closed state of the peeling detection circuit 50, i.e., whether the peeling detection circuit 50 is in the first state or the second state, it can be determined whether the IC card 1 is a genuine card. In other words, even with the contact-type IC card of the second embodiment, peeling of the IC module 70a can be detected using the same principle as with the dual-interface IC card of the first embodiment.

[0132] 3. Third embodiment Next, an example of an IC card according to a third embodiment of the present disclosure will be described. The IC card 1a of this embodiment is a dual-interface IC card similar to that of the first embodiment. However, the IC card 1a of this embodiment differs from the first embodiment in that the end portions, to which the antenna connection terminals 73a and 73b of the IC module 70 are electrically connected, are not conductive plates but bellows portions in which the antenna wire 83 is arranged in a bellows shape. The IC card 1a of this embodiment also differs from the first embodiment in that the end portions, to which the antenna connection terminals 73a and 73b of the IC module 70 are electrically connected, are not conductive plates but bellows portions in which wiring similar to the antenna wire 83 is arranged in a bellows shape. The bellows portions and the bellows portions of the bellows portions and the bellows portions of the bellows portions are formed by repeatedly folding back the antenna wire 83, which is a coated conductor or the like. This structure is also called a zigzag or meander shape.

[0133] Fig. 8 is a plan view of IC card 1a corresponding to Fig. 1, viewed from the +Z direction. Fig. 9(a) is a cross-sectional view of IC card 1 of Fig. 8 taken along line CC parallel to the X axis, viewed from the -Y direction, corresponding to Fig. 3(a). Fig. 9(b) is a cross-sectional view of IC card 1 of Fig. 8 taken along line DD parallel to the Y axis, viewed from the +X direction, corresponding to Fig. 3(b). Fig. 10 is an enlarged view corresponding to Fig. 4, showing the configuration of card base 2a from which IC module 70 has been removed in Fig. 8.

[0134] 8 and 9(a), antenna connecting terminal 73a is electrically connected to first bellows portion 130, which is end portion 100a formed by a repeated folding structure of antenna wire 83 from the outer periphery toward the center of recess 9 of card base 2a, via conductive adhesive layer 11. Furthermore, although not shown in FIG. 9(a), antenna connecting terminal 73b is also electrically connected to second bellows portion 140, which is end portion 100a and has the same configuration as first bellows portion 130, via conductive adhesive layer 11. As a result, antenna connecting terminals 73a and 73b are electrically connected to both ends of antenna wire 83, respectively.

[0135] 8 and 9(b), the peeling detection input terminal 53a is electrically connected to the peeling detection contact 52, which is a bellows portion formed by a repeated folding structure from the outer periphery toward the center of the recess 9 of the card base 2a, using a coated conductor wire similar to the antenna wire 83, via the conductive adhesive layer 11. The peeling detection contact 52 has a configuration similar to that of the first bellows portion 130, etc. Furthermore, although not shown in FIG. 9(b), the peeling detection input terminal 53b is also electrically connected to the peeling detection contact 52, which is also made of the same bellows portion, via the conductive adhesive layer 11. That is, the peeling detection input terminals 53a and 53b are electrically connected to the same peeling detection contact 51 via the conductive adhesive layer 11, and therefore the peeling detection input terminals 53a and 53b are mutually conductive.

[0136] 2(a) of the first embodiment, multiple pads 74p of IC chip 74a and antenna connecting terminals 73a and 73b are electrically connected to each other via wires 75. Furthermore, antenna connecting terminal 73a is electrically connected to one end of antenna 80a via conductive adhesive layer 11 and first bellows portion 130. Furthermore, antenna connecting terminal 73b is electrically connected to the other end of antenna 80a via conductive adhesive layer 11 and second bellows portion 140. As a result, IC chip 74a and antenna 80a can form a closed communication circuit.

[0137] Meanwhile, pad 74q of IC chip 74a and peeling detection input terminal 53a are electrically connected via wire 75, and pad 74r and peeling detection input terminal 53b are electrically connected via wire 75. Furthermore, peeling detection input terminals 53a and 53b are electrically connected to peeling detection contact 52 via conductive adhesive layer 11. This allows for the formation of a peeling detection circuit 50a similar to peeling detection circuit 50 of the first embodiment.

[0138] The IC card 1a of this embodiment differs from the IC card 1 of the first embodiment only in the physical shapes of the first plate 110 and second plate 120 constituting the end portion 100 and the peeling detection contact 51. That is, in the IC card 1a of this embodiment, the first bellows portion 130 and second bellows portion 140 constituting the end portion 100a and the peeling detection contact 52 are not made of conductive plates but are made of a folded structure consisting of the antenna wire 83 and similar wiring. However, the effects and functions relating to peeling detection of the IC card 1a are the same as those of the IC card 1, and therefore a description thereof will be omitted.

[0139] Next, an example of a method for manufacturing the IC card 1a will be briefly described, focusing on the differences from the IC card 1.

[0140] First, a coated conductor coated with an insulating member is used as the antenna wire 83 on the surface of either the antenna holding layer 5 or 6 on the side not adjacent to the core layer 4 or 7, and the first bellows portion 130 and the second bellows portion 140 are formed at both ends of the antenna wire 83. The antenna wire 83 is embedded using a winding machine, starting from the side where either the first bellows portion 130 or the second bellows portion 140 of the antenna wire 83 is located and ending from the side where the other is located. The first bellows portion 130 and the second bellows portion 140 are formed by moving the head of the winding machine in a zigzag manner in the Y-axis direction while moving it in the X-axis direction.

[0141] After forming either the first bellows portion 130 or the second bellows portion 140, a predetermined heat and pressure is applied to the antenna holding layer 6 while an antenna supply head is drawn into a loop shape as shown in Fig. 8. Then, the antenna wires 83 supplied from the antenna supply head are embedded sequentially into the antenna holding layer 6. Thereafter, the other of the first bellows portion 130 or the second bellows portion 140 is formed to complete the formation of the antenna 80a.

[0142] Furthermore, on the same surface of the antenna holding layer 5 or 6 as the surface on which the first bellows portion 130 and the second bellows portion 140 are formed, an additional peeling detection contact 52 is formed using an antenna wire 83 that is separate from the antenna 80a and independent of the antenna 80a. As with the first bellows portion 130 and the second bellows portion 140, the peeling detection contact 52 is also formed by moving the head of the winding forming machine in a zigzag pattern in the X-axis direction while moving it in the Y-axis direction. The first bellows portion 130, the second bellows portion 140, and the peeling detection contact 52 can all be made of the same material and have the same configuration. The other steps are the same as those in the first embodiment, so a description thereof will be omitted.

[0143] In the present embodiment, the first bellows portion 130 and the second bellows portion 140 are formed by moving the head of the winding forming machine in a zigzag pattern along the Y-axis while moving it in the X-axis direction. The peel detection contact 52 is formed by moving the head of the winding forming machine in a zigzag pattern along the X-axis while moving it in the Y-axis direction. That is, in the first bellows portion 130 and the second bellows portion 140, the folds of the bellows concaves and convexes are formed along the Y-axis, i.e., along the outer periphery of the recessed portion 9, and the repeating direction of the folds is along the X-axis, i.e., from the outer periphery toward the center of the recessed portion 9. However, the first bellows portion 130 and the second bellows portion 140 of the present disclosure are not limited thereto. For example, the folds of the bellows concaves and convexes may be formed along the X-axis, i.e., from the outer periphery toward the center of the recessed portion 9, and the repeating direction of the folds may be formed along the Y-axis, i.e., along the outer periphery of the recessed portion 9 and from the outer periphery toward the center of the recessed portion 9.

[0144] Similarly, the peel detection contact 52 is formed so that the folds of the bellows' concave and convex portions are formed in a direction along the X-axis, i.e., in a direction along the outer periphery of the recess 9, and the direction in which the folds repeat is a direction along the Y-axis, i.e., in a direction from the outer periphery toward the center of the recess 9. However, the peel detection contact 52 of the embodiment of the present disclosure is not limited to this, and the folds of the bellows' concave and convex portions may be formed in a direction along the Y-axis, i.e., in a direction from the outer periphery toward the center of the recess 9, and the direction in which the folds repeat is a direction along the X-axis, i.e., in a direction along the outer periphery of the recess 9.

[0145] The IC card 1a of the third embodiment has the above-described configuration, and like the first and second embodiments, it is possible to provide an IC card and a manufacturing method thereof that can prevent misuse by replacing the IC module with a relatively simple configuration. Furthermore, in this embodiment, by forming only a portion of the antenna wire 83 into a bellows-like shape, it is possible to easily establish electrical continuity between the antenna 80a and the IC chip 74a and form the peeling detection circuit 50a. In other words, in this embodiment, there is no need to prepare any extra material other than the antenna wire 83, and the end portion 100a and the peeling detection contact 52 can be formed using the same processing method, thereby reducing costs and shortening processing time.

[0146] 4. Fourth embodiment Next, an example of an IC card according to a fourth embodiment of the present disclosure will be described. The IC card according to this embodiment is a dual-interface IC card similar to that of the first embodiment, except that an IC chip 74c with additional functions is used instead of the IC chip 74a. The IC card according to this embodiment may also be the contact IC card according to the second embodiment or the dual-interface IC card according to the third embodiment.

[0147] Fig. 11(a) is a functional block diagram showing the functional configuration of the CPU of the IC chip 74c built into the IC module of the IC card of this embodiment. Fig. 11(b) is another explanatory diagram of the IC card of this embodiment. Figs. 11(b) and 11(c) are schematic diagrams showing an example of an equivalent circuit of the peeling detection circuit 50b including the internal circuit of the IC chip 74c. Fig. 12 is a flow chart showing the operation of the IC card of this embodiment.

[0148] The configurations of the IC module and card base of this embodiment are the same as those shown in, for example, FIGS. 2(a), 2(b), and 4, except that the IC chip 74a is replaced with the IC chip 74c and the peeling detection circuit 50 is replaced with the peeling detection circuit 50b. In this case, the equivalent circuit diagram of the peeling detection circuit 50b including the IC chip 74c is shown in FIGS. 11(b) and 11(c). The functional configuration of the CPU 210a is the same as that of the first embodiment, except that an internal switch control unit 330 is newly added, as shown in FIG. 11(a). FIG. 11(b) shows the equivalent circuit diagram of FIG. 5(c) with an internal switch SW1 added, while FIG. 11(c) shows the equivalent circuit diagram of FIG. 5(d) with an internal switch SW1 added.

[0149] In this embodiment, the IC chip 74c includes an internal switch SW1 in the peel detection circuit 50b. The internal switch SW1 serves to open and close part of a series circuit formed by the power supply V, internal resistor R1, and external circuitry connected via pads 74q and 74r that make up the peel detection circuit 50b. A known element with a contactless ON / OFF function, such as a transistor or FET, can be used as the internal switch.

[0150] In the IC card of this embodiment, the internal switch control unit 330 closes the internal switch SW1 only when the resistance measurement unit 310 detects and measures the open or short state of the peeling detection circuit 50b, or the potential difference or current value at a predetermined portion of the peeling detection circuit 50b. That is, it issues an instruction to turn the internal switch SW1 ON. Otherwise, the internal switch SW1 is opened. That is, it issues an instruction to turn the internal switch SW1 OFF.

[0151] If the internal switch SW1 of the peel detection circuit 50b is not provided or is always ON, it is possible to measure the internal resistance between the pads 74q and 74r of the IC chip 74c by applying a probe to the pads 74q and 74r. This may identify the threshold values ​​of the resistance, potential difference, and current value that the continuity determination unit 320 uses to determine whether the peel detection circuit 50b is in the first state or the second state.

[0152] However, in this embodiment, the internal switch SW1 is closed only when the resistance measurement unit 310 detects and measures the potential difference, current value, etc. at a predetermined location in the peel detection circuit 50. As a result, for example, when the IC chip 74c is not operating, even if a probe is placed on the pads 74q and 74r of the IC chip 74c, it is impossible to measure the internal resistance between the two pads, making it difficult for the continuity determination unit 320 to identify the threshold value used for determination.

[0153] Next, the operation of the IC card of this embodiment will be described, focusing on differences from the operation of the IC card 1 of the first embodiment. FIG. 12 is a flow chart showing the operation of the IC card of this embodiment. First, the IC chip 74c is activated when power is supplied to the IC chip 74c from either the external connection terminal 71 or the antenna 80 (step S421 in FIG. 12). Next, at a predetermined timing, the IC chip 74c turns on the internal switch SW1 provided in the peeling detection circuit 50b of the IC chip 74c in response to an instruction from the internal switch control unit 330 of the CPU 210a (step S422). The predetermined timing is the timing immediately before the IC chip 74c determines that the peeling detection circuit 50b is in the first state or the second state, and is the timing at which the IC chip 74c detects and measures the open or short state of the peeling detection circuit 50b, or the potential difference, current value, etc. at a predetermined portion of the peeling detection circuit 50b.

[0154] Thereafter, the open or short state of the peel detection circuit 50, or the potential difference, current value, etc. at predetermined portions of the peel detection circuit 50 are detected and measured (step S423). Then, the continuity determination unit 320 of the CPU 210a of the IC chip 74c checks whether the peel detection circuit 50b is in a short state or whether the potential difference between predetermined pads in the peel detection circuit 50b is equal to or less than a predetermined value (step S424). If the short state or the potential difference between predetermined pads in the peel detection circuit 50b is equal to or less than the predetermined value (the current value is equal to or greater than a predetermined value), the peel detection circuit 50b is determined to be in the first state, and normal communication is performed in accordance with a signal from the reader / writer (steps S424, S425, S426).

[0155] On the other hand, if the peeling detection circuit 50b is in an open state or the potential difference between predetermined pads in the peeling detection circuit 50b exceeds a predetermined value, the continuity determination unit 320 determines that the card is an unauthorized card and that the peeling detection circuit 50b is in the second state.Then, at least some of the processes that the IC card can perform as normal processes are restricted (steps S424, S427, S428).

[0156] After the above-mentioned steps S426 and S428, i.e., after the steps of performing normal communication and restricting at least some of the processing of the IC card in accordance with a signal from the reader / writer, the IC chip 74c performs the following processing. The IC chip 74c turns off the internal switch SW1 provided in the peeling detection circuit 50b of the IC chip 74c in response to an instruction from the internal switch control unit 330 of the CPU 210a (step S422). In other words, the IC chip 74c turns off the internal switch SW1 immediately after the continuity determination unit 320 determines the state of the peeling detection circuit 50b (i.e., whether it is in the first state or the second state).

[0157] In this manner, in this embodiment, the internal switch SW1 is turned ON only when the IC chip 74c measures, detects, and determines the state of the peeling detection circuit 50b, thereby enabling efficient and accurate determination of whether the IC card is a legitimate card or an unauthorized card. Furthermore, by turning the internal switch SW1 OFF when the IC chip 74c does not measure, detect, or determine the state of the peeling detection circuit 50b, it is possible to enhance security by preventing measurement of the circuit characteristics of the peeling detection circuit 50b from the outside. [Explanation of symbols]

[0158] 1, 1a IC card 2, 2a Card base 3, 8 oversheet layers 4, 7 Core layer 5, 6 Antenna support layer 9 Recess 11 Conductive adhesive layer 11a Conductive particles 11b Adhesive 12 Antenna sheet 50, 50a, 50b Peel detection circuit 51, 52 Peel detection contact 53a, 53b Peel detection input terminals 70, 70a IC module 71 External connection terminal 71a Insulation groove 72 PCB 73a, 73b Antenna connection terminals 74 IC chip body 74a, 74c IC chip 74b molded part 74p, 74q, 74r pads 75 wire 76 Bonding Hole 80, 80a antenna 83 Antenna Wire 91 First recess 92 Second recess 93 Outer circumference Areas 93a, 93b, and 93c 100, 100a end 110 First Plate 120 Second Plate 130 First bellows section 140 Second bellows section 210, 210a CPUs 220 Contact interface part 230 memory 231 EEPROM 232 RAM 233 ROM 240 Non-contact interface unit 310 Resistance measurement unit 320 Continuity determination section 330 Internal switch control section

Claims

1. An IC card capable of contact communication with an external device, A card base; an IC module disposed in a recess of the card base, the IC module comprises a substrate, an external connection terminal formed on one surface of the substrate, an IC chip disposed on the other surface of the substrate and electrically connected to the external connection terminal, and a peeling detection input terminal electrically connected to the IC chip; the external connection terminals are arranged so as to be exposed on the surface of the card base, a peeling detection contact, which is an electrical conductor, is provided in the recess of the card base, and the peeling detection contact and the peeling detection input terminal are electrically connected; the IC chip determines that a peeling detection circuit constituted by the IC chip, the peeling detection input terminal, and the peeling detection contact is in a first state or a second state different from the first state; When the peeling detection contact and the peeling detection input terminal are electrically connected, the IC chip determines that the peeling detection circuit is in a first state, When the peel detection contact and the peel detection input terminal are not substantially electrically connected, the IC chip determines that the peel detection circuit is in a second state; In the second state, the IC chip limits at least some of the processes that are possible when the peeling detection circuit is in the first state.

2. 2. The IC card according to claim 1, wherein the first state indicates that the internal resistance value of the peel detection circuit is equal to or less than a predetermined value, and the second state indicates that the internal resistance value of the peel detection circuit is greater than the predetermined value.

3. the IC chip has a built-in switch that opens and closes a part of the peeling detection circuit, 2. The IC card of claim 1, wherein the IC chip closes the switch immediately before determining that the peeling detection circuit is in the first state or the second state, and otherwise opens the switch.

4. the IC card is a dual interface IC card that is further capable of contactless communication with an external device, an antenna disposed inside the card base; the antenna includes an antenna wire and a plurality of ends, the plurality of tips of the antenna wire and the plurality of ends are electrically connected to each other, and a portion of the ends is exposed in the recess of the card base when the IC module is removed; the IC module further includes a plurality of terminals arranged on the other surface of the substrate; 2. The IC card according to claim 1, wherein the plurality of terminals are electrically connected to the corresponding plurality of end portions on a surface of the end portion facing the opening of the recess.

5. 5. The IC card according to claim 4, wherein the plurality of terminals are electrically connected to the corresponding plurality of ends by a conductive adhesive layer, and the peeling detection contact and the peeling detection input terminal are electrically connected including the conductive adhesive layer made of the same material.

6. The IC card according to claim 5 , wherein the conductive adhesive layer is an anisotropic conductive film (ACF).

7. 5. The IC card according to claim 4, wherein the plurality of end portions are bellows portions formed by a structure in which the conductive plate or the antenna wire is repeatedly folded back from the outer periphery of the recess toward the center.

8. 8. The IC card according to claim 7, wherein the plurality of end portions and the peel detection contact are all formed on the conductive plate made of the same material, or are all formed on the bellows portion made of the same material.

9. A method for manufacturing an IC card capable of contact communication with an external device, comprising: A card base; An IC module, preparing a substrate, an external connection terminal formed on one surface of the substrate, and an IC module disposed on the other surface of the substrate, the IC module including an IC chip electrically connected to the external connection terminal and a peeling detection input terminal electrically connected to the IC chip; forming a recess in the card base for embedding the IC module, and exposing a peeling detection contact, which is a conductor, in a part of the recess; embedding the IC module in the recess of the card body so that the external connection terminal is exposed on the surface of the card body, and electrically connecting the peeling detection contact and the peeling detection input terminal; the IC chip determines that a peeling detection circuit constituted by the IC chip, the peeling detection input terminal, and the peeling detection contact is in a first state or a second state different from the first state; When the peeling detection contact and the peeling detection input terminal are electrically connected, the IC chip determines that the peeling detection circuit is in a first state, When the peel detection contact and the peel detection input terminal are not substantially electrically connected, the IC chip determines that the peel detection circuit is in a second state; In the method for manufacturing an IC card, when the IC chip is in the second state, the IC chip limits at least some of the processes that can be performed when the peeling detection circuit is in the first state.

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