Waveguide device

Abstract

To provide a spatial modulator that is at high speed, and operates in the phase of light or multiple characteristics.SOLUTION: A spatial light modulation (SLM) device comprises: at least one light input section; at least one light output section; multiple waveguides that are disposed in an array of receivers and / or emitters while the respective waveguides are coupled to at least one light input section; and at least one light modulation element for modulating light that is transmitted through at least one of the multiple waveguides. The waveguides and the light modulation elements are integrated in at least one common module in a state in which one of the light input sections or the light output sections has an interface to a free spatial area in which one portion is occupied by a vacuum, gas, liquid, and / or solid medium.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates generally to waveguide devices and optical systems comprising waveguide devices, and in particular embodiments to optical correlation-based processing systems. [Background technology]

[0002] Conventional optical information processing systems consist of displays and cameras that operate in a free-space environment to exploit the physical properties and interactions of light propagation in that environment, such as reflection, refraction, and diffraction. This includes systems in which air is replaced by other gases (such as nitrogen), by the complete removal of the gas (by creating a vacuum), or by the insertion of a liquid (such as an index-matching fluid) or a solid (such as index-matching glass). Such changes are made to overcome problems caused by air currents, heat, vibrations, etc. in real-world operating environments.

[0003] Microdisplay devices, such as liquid crystal displays (LCDs) and digital micromirror displays (DMDs), are typically used to input or change data in these conventional systems. Such devices contain arrays of pixels and typically operate by modulating light transmission (each pixel in the device acts like a shutter), reflection (each pixel changes the direction and / or nature of incident light), or diffraction (each pixel diffracts incident light).

[0004] More recently, self-emissive microdisplay devices have been developed, such as organic and inorganic light-emitting diode (OLED and micro-LED) displays, in which each electrically controllable pixel generates its own light. For display applications requiring coherent light, such as the use of optical information processing or computing, both non-emissive and self-emissive displays have their own drawbacks. Because non-emissive displays rely on the mechanical movement of liquid materials or solid structures, their switching speeds can be very limited, theoretically resulting in speeds much slower than solid-state electrical signal modulation. Existing self-emissive displays emit incoherent light and cannot be used in system designs requiring optical coherence. Therefore, it is desirable to have a new display type that can both emit coherent light at high speeds and be modulated.

[0005] Similarly, cameras and sensors are used in these conventional systems to convert the results of optical processing systems into electrical signals for use in conventional electrical computing systems. Such sensors are typically photodetector arrays or imaging sensors (cameras) fabricated with complementary metal-oxide semiconductor (CMOS) or charge-coupled device (CCD) technology. However, the majority of these sensors are typically designed for use in cinematography or astronomy, where light intensity is more important than light phase, whereas optical phase, with its higher information-carrying capacity, is preferred in optical information processing systems. Similarly, the speed at which standard sensors operate is often very slow (typically one to two orders of magnitude slower) relative to the memory technology available in conventional computing systems, due in part to the intended operating application (human-centric devices such as film and cinema cameras) and in part to the chip implementation. Therefore, photodetector arrays that are fast and operate on the phase or multiple properties of light are highly desirable. Summary of the Invention

[0006] According to a first independent aspect, there is provided an SLM (Spatial Light Modulating) device as claimed in claim 1. Optionally, the SLM device may be self-luminous.

[0007] This aspect of the invention relates to the modulation of light (particularly phase, but optionally intensity, amplitude, and / or polarization) for purposes of information transmission and / or processing, in which multiple light emitting, modulating, and / or detecting components or devices are combined in various configurations, with or without conventional optical components or devices, to form an optical information processing system. Devices according to this aspect comprise one or more optical waveguides that carry light for purposes of modulation, transmission, and / or detection (either phase, intensity, amplitude, polarization, or combinations thereof). At least one (and preferably all) of the waveguides may be modulated or affected by in-line, adjacent, or confining components, such as electro-optic, thermo-optic, or other adjacent waveguides, with the purpose of changing or maintaining the properties of the light, including phase, intensity, amplitude, and / or polarization, as the light passes through the waveguide and device.

[0008] The device according to at least one independent aspect of the invention is a light modulation or pass-through device, in which phase-, intensity-, amplitude- and / or polarization-modulated optical waveguides are arranged in an array of emitters to form a light-emitting or self-emitting spatial light modulator or display device.

[0009] Optical modulation can be achieved by modulating a material or materials within, adjacent to, or confining the optical waveguide, either passively through the physical design of the waveguide or actively through an electrically controlled modulator, which alters the refractive index of the waveguide or creates interference within the waveguide to produce the desired modulation. Such modulating materials or components can include, but are not limited to, those that induce linear (Pockels) effects, such as thermo-optic phase shifters, those that induce second-order (Kerr) effects, such as electro-optic polymers, or those that induce other nonlinear effects. Modulation components can also include gain components, such as linear, planar, or volumetric waveguide amplifiers, including evanescently coupled pump amplifiers. A light source can be split into multiple paths from the original light source, for example, by coupling it on- or off-device to each emission waveguide of the device via a branching or fan-out waveguide array. This allows the emission to maintain the coherence properties of the original light source, if desired, such as when the original light source is a fiber-coupled laser diode. The waveguides and phase modulating elements may be formed, for example, using lithographic techniques. The emitting elements may optionally be followed in the optical path by a microlens (lenslet) array, which is used to capture the emitted light from each waveguide and project it onto a collimating stage.

[0010] Optionally, all radiating element waveguides branch off from a single waveguide that is coupled to an on-device or off-device light source via waveguides or fibers. Each waveguide may have any number of modulating or mixing components, as described for the core modulation device. The radiating surface may be planar, hemispherical, or some other non-planar shape.

[0011] In a further independent aspect, there is provided a receiver-transmitter SLM device according to any of the aspects defined in the following claims, whereby the device has at least two arrays of elements, one for receiving light and one for emitting light. The number of elements in the receiving array may or may not be equal to the number of elements in the emitting array. Each of the receiving and / or transmitting elements may be coupled to its own external fiber optic cable, allowing modulated light to enter and / or exit the device by fiber rather than free space. At least one waveguide connects the receiving elements to the emitting elements and may or may not have any number of modulation components as described above for the first independent aspect. The receiving array may or may not be in the same spatial plane, a perpendicular plane, an opposite plane, or some other configuration relative to the transmitting array, including non-planar arrangements or orientations.

[0012] In a variation of the receiver-transmitter device, the number of receive array elements is equal to the number of transmit array elements, with or without waveguide modulation or mixing components within the device. A second variation of the receiver-transmitter device, in which the number of receive array elements is less than the number of transmit array elements, may or may not be configured to expand the input to a larger array, with or without waveguide modulation or mixing components within the device. A third variation of the receiver-transmitter device, in which the number of receive array elements exceeds the number of transmit array elements, may or may not be configured to shrink the large-side array to a smaller-side array, with or without waveguide modulation or mixing components within the device, and the waveguides may or may not allow light in one or more waveguides to interact or affect light in one or more waveguides within the device.

[0013] In a subsidiary combination of single-source-emitter and receiver-transmitter SLM device variations, data enters the receiver array element by element via free space or coupled fiber and modulates a single-source branched waveguide array internal to the device. After modulation, light exits the device from a modulated single-source branched waveguide transmitter array. The internal waveguide array may or may not have modulation or mixing components as described above for the core, single-source-emitter and receiver-transmitter devices.

[0014] In a further independent aspect, there is provided a light detection device as set out in any of the appropriate claims. The light detection device may include a receiver waveguide coupled receiving element as described by the receiver-transmitter device. The internal waveguide may or may not include a modulation or mixing component as described for the first device and its variants.

[0015] In a further variation of the photodetector device, a photodetector array device, each waveguide terminates in an electro-optic photodetector, and all waveguides may or may not have modulation or mixing components as described for all other devices and variations.

[0016] In an elementary interferometer device, which is a variation of the photodetector device, the light source used as the data carrier for the system is branched as described for the single source emitter SLM device and coupled to the receiver element waveguide array via an interferometric or differential element such as a Mach-Zehnder interferometer, or a differential detector element which determines the phase shift between the original light source and the light received by each element waveguide in the device. All waveguides may or may not have modulation or mixing components as described for all other devices and variations.

[0017] In a further variation of the optical detection device, a hybrid amplitude-phase detection device is a combination of the first and second variations, where each component waveguide is terminated by a hybrid detection device that may or may not split the waveguide into one or more separate detectors that measure multiple optical properties, such as, but not limited to, a detector that measures the amplitude or intensity of the light, a detector that measures the phase of the light, a detector that measures the polarization of the light, or a detector that measures any combination of optical properties, all possible detectors measuring a known value (such as a known constant value), a previous value, or their values ​​relative to the original light source. All waveguides may or may not have modulation or mixing components as described for all other devices and variations.

[0018] In a further subsidiary aspect, there is provided an optical system comprising a self-luminous SLM device, wherein each one of a plurality of waveguides shares a common optical axis with at least one other device through a region of free space, which may be, for example, a gas, liquid, solid or vacuum.

[0019] Optionally, the optical system comprises at least one lens of focal length f and any number of additional optical elements. Optionally, the optical system comprises at least one assembly of focal length f and any number of additional optical elements. The free-space optical path length between two connected devices may be equal to 2f. Optionally, the total free-space optical path length between three consecutively connected devices is equal to 4f. Alternatively, the free-space optical path length between two connected devices is at least 2f. Optionally, the total free-space optical path length between three consecutively connected devices is at least 4f.

[0020] Any device that performs light detection may detect the phase of light, the amplitude of light, the polarization of light, the intensity of light, both the phase and amplitude of light, both the phase and intensity of light, both the phase and polarization of light, both the amplitude and polarization of light, both the intensity and polarization of light, the phase, amplitude and polarization of light, and the phase, intensity and polarization of light.

[0021] Essentially, a first independent embodiment describes a spatial light modulation device for modulating and passing light on to subsequent stages in the system, and at least one further independent embodiment describes a light detection device for terminating the system and converting information from the optical domain to the electrical domain. Variations of these two devices may constitute components within an optical information processing system.

[0022] Variations of the independent aspects defined in the claims may be used to replace one or more components in a conventional optical information processing system. A single light source emitter may be used in place of a conventional display device (such as a television, computer, or projector display) or as the first stage of a conventional optical information processing system, replacing both the light source and the first spatial light modulator in the system. Similarly, a receiver-transmitter SLM device may be used as the first stage of a light modulator / optical information processing system. A light detector device may be used as the last stage of a conventional optical information processing system, replacing a camera or imaging sensor array, where the input light source is a laser or other coherent light source that can be coupled to the light detector device.

[0023] These displays and sensor arrays can be used together to form compact optical information processing systems. Different combinations of these display and camera devices offer different advantages, potentially replacing some or all of the components of conventional optical information processing systems. In their preferred configurations, optical information processing systems offer significant improvements in speed, resolution, and accuracy over conventional systems, and potentially replacing conventional electronic computing architectures entirely.

[0024] <Further Aspects> In a further independent aspect, a spatial light modulating SLM device comprises one or more optical inputs, one or more optical outputs, a plurality of waveguides arranged in an array of receivers and / or emitters, each waveguide coupled to one or more optical inputs, and at least one light modulating element for modulating light passing through at least one of the plurality of waveguides, the waveguides and the light modulating element being integrated into at least one common module, with one of the optical inputs or optical outputs interfacing with a free space region partially occupied by a vacuum, gas, liquid and / or solid medium. Preferably, the module has electro-optical interconnects for connection to a processing system. Preferably, the at least one light modulating element is in-line with at least one of the plurality of waveguides. Preferably, the at least one light modulating element is a waveguide adjacent to at least one of the plurality of waveguides. Optionally, the at least one light modulating element confines at least one of the plurality of waveguides.

[0025] Preferably, the at least one light-modulating element comprises one or more of the following: a thermo-optic phase shifter, an electro-optic polymer, at least one gain element, and / or an evanescently coupled pump amplifier. Optionally, the light input is external to the device and coupled to each of the plurality of waveguides via a branching element. In a further embodiment, the device further comprises a further waveguide array for splitting the light input into multiple optical paths. In a further embodiment, the device further comprises a microlens array for capturing modulated light after passing through at least one of the plurality of waveguides and projecting the captured modulated light toward a free-space region partially occupied by a vacuum, gas, liquid, and / or solid medium. In a further subsidiary aspect, the multiple waveguides branch off from a single waveguide coupled to the light input. In a further subsidiary aspect, a module integrates multiple waveguides and has an emitting surface and / or a receiving surface. In a further subsidiary aspect, at least one of the multiple waveguides has a planar emitting surface and / or a planar receiving surface. Optionally, at least one of the plurality of waveguides has a non-planar light emitting surface and / or a non-planar light receiving surface.In a further subsidiary aspect, the SLM device is self-emissive.

[0026] In a further independent aspect, an embodiment provides an optical processing system comprising a plurality of SLM devices according to any of the aspects disclosed herein, wherein at least two SLM devices communicate via a common free-space region partially occupied by a vacuum, gas, liquid, and / or solid medium. In a subsidiary aspect, at least one lens is optically located between the at least two SLM devices. In a further subsidiary aspect, at least one of the SLM devices interfaces with an electro-optical carrier. In a further subsidiary aspect, the optical processing system comprises at least one lens with a focal length f and any number of additional optical elements. Preferably, the optical processing system comprises at least one assembly with a focal length f and any number of additional optical elements. Preferably, the free-space optical path length between two connected devices is equal to 2f. Further optionally, the free-space optical path length between two connected devices is at least 2f. Further optionally, the free-space optical path length between two connected devices is one or more of at least f, less than f, and equal to f. Further optionally, the total free-space optical path length between three consecutively connected devices is equal to 4f. Still further optionally, the total free-space optical path length between three consecutively connected devices is at least 4f. In a further aspect, the total free-space optical path length between three consecutively connected devices is one or more of at least f, less than f, and equal to f. In a further subsidiary aspect, one or more of the above devices perform optical detection and detect one or more of the following: optical phase, optical amplitude, optical polarization, optical intensity, both optical phase and amplitude, both optical phase and intensity, both optical phase and polarization, both optical amplitude and polarization, both optical intensity and polarization, intensity and polarization which may optionally be detected simultaneously, a combination of optical phase, amplitude and polarization, and a combination of optical phase, intensity and polarization.

[0027] In a further broad aspect, an embodiment provides an optical correlator comprising a plurality of SLM devices according to any one of the aspects described herein, wherein at least two of the SLM devices communicate via a common free space region partially occupied by a vacuum, gas, liquid and / or solid medium.

[0028] In a further broad aspect, a receiver-transmitter SLM device comprises a first plurality of elements arranged in an array of emitters, a second plurality of elements arranged in an array of receivers, and an array of waveguides coupling the array of emitters and the array of receivers, the array of emitters, the array of receivers, and the array of waveguides being integrated in a common module. Preferably, the module has electro-optical interconnects for connection to a processing system. More preferably, the first plurality of elements are coupled to respective optical fibers for enabling modulated light to exit the device. Optionally, the second plurality of elements are coupled to respective optical fibers for enabling modulated light to enter the device. In a further subsidiary aspect, the receiver-transmitter SLM device further comprises at least one light modulating element for modulating light passing through at least one waveguide. In a further subsidiary aspect, the at least one light modulating element is in-line with the at least one waveguide. In a further subsidiary aspect, the at least one light-modulating element is a waveguide adjacent to the at least one waveguide. In a further subsidiary aspect, the at least one light-modulating element confines part or all of the at least one waveguide. Preferably, the at least one light-modulating element comprises one or more of the following: a thermo-optic modulator, an electro-optic modulator, an acousto-optic modulator, a mechanical modulator, at least one gain element, optionally the at least one gain element comprises an evanescently coupled pump amplifier. Optionally, the array of emitters is coplanar with the array of receivers. More preferably, the array of emitters is in a plane perpendicular to the array of receivers. Optionally, the array of emitters is in a plane opposite to the array of receivers. In a further subsidiary aspect, the number of emitters is equal to, greater than, or less than the number of receivers.

[0029] In a further broad aspect, an embodiment provides a system comprising at least one SLM device according to any one of the aspects described herein and at least one receiver-transmitter SLM device according to any one of the aspects described herein, configured to provide an optical input by receiving light at an array of receivers of the receiver-transmitter SLM device, and wherein multiple waveguides of the self-emissive spatial light modulating SLM device branch off from a single waveguide coupled to the optical input.

[0030] In a further broad aspect, the photodetector device comprises an array of inputs, an array of outputs, and a plurality of waveguides optically disposed between the array of inputs and the array of outputs, wherein the array of inputs, the array of outputs, and the plurality of waveguides are integrated into a common module, and a photodetector is configured to convert modulated light from the optical domain to the electrical domain. Optionally, the photodetector device further comprises at least one light-modulating element for modulating light passing through at least one of the plurality of waveguides. Optionally, the photodetector device comprises at least one of the plurality of waveguides terminating in one or a combination of the following: an interferometric photodetector, an electro-optic photodetector, and / or a differential photodetector. Optionally, one or more of the waveguides are split into a plurality of detectors for measuring a plurality of optical properties. In a further subsidiary aspect, the photodetector detects light by one or more of the following: detecting the phase of the light, detecting the amplitude of the light, detecting the polarization of the light, detecting the intensity of the light, detecting both the phase and amplitude of the light, detecting both the phase and intensity of the light, detecting both the phase and polarization of the light, detecting both the amplitude and polarization of the light, detecting both the intensity and polarization of the light (optionally the intensity and polarization can be detected simultaneously), detecting a combination of the phase, amplitude and polarization of the light, and detecting a combination of the phase, intensity and polarization of the light.

[0031] In a further broad aspect, an embodiment provides a display device comprising an SLM device according to any one of the aspects described herein.

[0032] In a further broad aspect, an SLM light detection device comprises one or more light inputs, one or more light outputs, a plurality of waveguides arranged in an array of receivers and / or emitters, each waveguide coupled to one or more light inputs, and at least one light modulating element for modulating light passing through at least one of the plurality of waveguides, the waveguides and the light modulating element being integrated into at least one common module, with one of the light inputs or light outputs interfacing with a free space region partially occupied by a vacuum, gas, liquid and / or solid medium, the device further comprising one or more light detecting elements for converting the modulated light from the optical domain to the electrical domain, the light detecting element operating together with a plurality of waveguide elements of the waveguide or other plurality of waveguides, the plurality of waveguide elements being arranged to form an array of receivers.

[0033] In a further broad aspect, embodiments of the invention relate to an SLM light detection device.

[0034] In a further broad aspect, a receiver-transmitter photodetector device comprises a first plurality of elements arranged in an array of emitters, a second plurality of elements arranged in an array of receivers, and at least one waveguide coupling at least one of the first plurality of elements to at least one of the second plurality of elements, the device further comprising one or more photodetector elements for converting modulated light from the optical domain to the electrical domain, the photodetector elements operating in conjunction with one or more of the first plurality of elements or one or more of a further plurality of elements, the further plurality of elements arranged as part of the array of receivers or as a further array of receivers.

[0035] In a further broad aspect, an embodiment describes an optical information processing system including at least one SLM device according to any one of the aspects described herein.

[0036] In a further broad aspect, an embodiment describes an optical information processing system including at least one SLM photodetector device according to any of the aspects described herein.

[0037] In a further broad aspect, an embodiment describes an optical information processing system including at least one receiver-transmitter photodetection device according to any preceding aspect.

[0038] In a further broad aspect, an embodiment describes an optical information processing system including at least one receiver-transmitter SLM device and a photodetector device according to any of the preceding suitable aspects.

[0039] In a further broad aspect, an optical information processing system is described that includes at least one SLM and an optical detection device according to any of the preceding suitable aspects.

[0040] In a further broad aspect, an optical system comprising at least one SLM device according to any one of the preceding aspects, wherein each one of the emission or reception surfaces of any given SLM shares a common optical axis with at least one other emission or reception surface via a free space region partially occupied by a vacuum, gas, liquid and / or solid medium.

[0041] Advantageously, many of these embodiments offer a significantly reduced pixel count and consequently lower resolution when compared to liquid crystal SLM arrays or panels, although the integrated waveguides provide a fast integrated solution.

[0042] Aspects of the present invention will now be described with reference to the drawings. [Brief explanation of the drawings]

[0043] [Figure 1] 1 shows a schematic diagram of a 2f system with one input device and one output device. [Figure 2] 1 shows a schematic diagram of a 4f system with one input device and one output device. [Figure 3] 1 shows a schematic diagram of a 4f system with one input device, one filter device and one output device. [Figure 4]1 shows a schematic diagram of a 4f system with two input devices, one filter device and one output device. [Figure 5] 5 shows a schematic diagram of a configuration of the system shown in FIG. 4 in which each input has an independent external laser providing the carrier signal and / or pump energy. [Figure 6] 5 shows a schematic diagram of a configuration of the system shown in FIG. 4 in which all inputs share the same external laser providing the carrier signal and / or pump energy. [Figure 7] 5 shows a schematic diagram of a configuration of the system shown in FIG. 4 in which all inputs share a laser on the same device that provides the carrier signal and / or pump energy. [Figure 8] 4 shows a schematic diagram of a configuration of the system shown in FIG. 3 in which the input has an external laser providing the carrier signal and / or pump energy. [Figure 9] 4 shows a schematic diagram of the configuration of the system shown in FIG. 3, where the input has a laser on the device providing the carrier signal and / or pump energy. [Figure 10] 2 shows a schematic diagram of a configuration of the system shown in FIG. 1 in which the input has an external laser providing the carrier signal and / or pump energy. [Figure 11] 2 shows a schematic diagram of a configuration of the system shown in FIG. 1 in which the input has a laser on the device providing the carrier signal and / or pump energy. [Figure 12] 5 shows a schematic diagram of the configuration of the system shown in FIG. 4, with each input having a laser on a separate device providing the carrier signal and / or pump energy. [Figure 13] 5 shows a schematic diagram of the configuration of the system shown in FIG. 4, in which the data lines provide both carrier and data signals. [Figure 14] 4 shows a schematic diagram of the configuration of the system shown in FIG. 3, in which the data lines provide both carrier and data signals. [Figure 15] 2 shows a schematic diagram of a configuration of the system shown in FIG. 1 in which the data lines provide both carrier and data signals; [Figure 16a]6 shows a top view of a schematic diagram of a possible structure of the configuration shown in FIG. 5, in which all devices and their receiving and emitting surfaces are parallel to the top surface of their shared carrier chip. [Figure 16b] 6 shows a side view of a schematic diagram of a possible structure of the configuration shown in FIG. 5, in which all devices and their receiving and emitting surfaces are parallel to the top surface of their shared carrier chip. [Figure 17a] 6 shows a top view of a schematic diagram of a possible structure of the configuration shown in FIG. 5, in which all devices are composed of multiple chips and all light receiving and emitting surfaces of the devices are perpendicular to the top surface of their shared carrier chip. [Figure 17b] 6 shows a side view of a schematic diagram of a possible structure of the configuration shown in FIG. 5, in which all devices are composed of multiple chips and all light receiving and emitting surfaces of the devices are perpendicular to the top surface of their shared carrier chip. [Figure 18a] 5 shows a top view of a schematic diagram of a possible structure of the configuration shown in FIG. 5 in which all devices are composed of multiple chips, all light-receiving and light-emitting surfaces of the devices are perpendicular to the top surface of their shared carrier chip, and all device components and waveguide networks are integrated into the carrier chip except for the light-receiving and light-emitting chips. [Figure 18b] 5 shows a side view of a schematic diagram of a possible structure of the configuration shown in FIG. 5 in which all devices are composed of multiple chips, all light-receiving and light-emitting surfaces of the devices are perpendicular to the top surface of their shared carrier chip, and all device components and waveguide networks are integrated into the carrier chip except for the light-receiving and light-emitting chips. [Figure 19a] Schematic top view of a possible structure of the configuration shown in FIG. 5 is shown, in which all devices are composed of multiple chips, all light-receiving and light-emitting surfaces of the devices are parallel to the top surface of their shared carrier chip, and all device components and waveguide networks are integrated into the carrier chip except for the light-receiving and light-emitting chips. [Figure 19b]5 shows a side view of a schematic diagram of a possible structure of the configuration shown in FIG. 5 in which all devices are composed of multiple chips, all light-receiving and light-emitting surfaces of the devices are parallel to the top surface of their shared carrier chip, and all device components and waveguide networks are integrated into the carrier chip except for the light-receiving and light-emitting chips. [Figure 20a] 6 shows a top view of a schematic diagram of a possible structure of the configuration shown in FIG. 5, where all devices are integrated on their shared carrier chip and all light receiving and emitting surfaces are parallel to the top surface of their shared carrier chip. [Figure 20b] 6 shows a side view of a schematic diagram of a possible structure of the configuration shown in FIG. 5, where all devices are integrated on their shared carrier chip and all light receiving and emitting surfaces are parallel to the top surface of their shared carrier chip. [Figure 21a] 6 shows a top view of a schematic diagram of a possible structure of the configuration shown in FIG. 5, in which all devices are a single monolithic component and all light receiving and emitting surfaces are perpendicular to the top surface of their shared carrier chip. [Figure 21b] 6 shows a side view of a schematic diagram of a possible structure of the configuration shown in FIG. 5, in which all devices are a single monolithic component and all light receiving and emitting surfaces are perpendicular to the top surface of their shared carrier chip. [Figure 22a] 6 shows a top view of a schematic diagram of a possible structure of the configuration shown in FIG. 5, in which all devices are composed of multiple components stacked parallel to the top surface of their shared carrier chip, and all aggregated light receiving and emitting surfaces are perpendicular to the top surface of their shared carrier chip. [Figure 22b] 6 shows a side view of a schematic diagram of a possible structure of the configuration shown in FIG. 5, in which all devices are composed of multiple components stacked parallel to the top surface of their shared carrier chip, and all aggregated light receiving and emitting surfaces are perpendicular to the top surface of their shared carrier chip. [Figure 23a] 6 shows a top view of a schematic diagram of a possible structure of the configuration shown in FIG. 5, in which all devices are composed of multiple components stacked vertically on the top surface of their shared carrier chip, and all aggregated light receiving and emitting surfaces are perpendicular to the top surface of their shared carrier chip. [Figure 23b] 6 shows a side view of a schematic diagram of a possible structure of the configuration shown in FIG. 5, in which all devices are composed of multiple components stacked vertically on the top surface of their shared carrier chip, and all aggregated light receiving and emitting surfaces are perpendicular to the top surface of their shared carrier chip. [Figure 24a] 6 shows a top view of a schematic diagram of a possible structure of the configuration shown in FIG. 5, in which all devices and free space regions are integrated on their shared carrier chip, and all light receiving and emitting surfaces are parallel to the top surface of their shared carrier chip. [Figure 24b] 6 shows a side view of a schematic diagram of a possible structure of the configuration shown in FIG. 5, in which all devices and free space regions are integrated on their shared carrier chip, and all light receiving and emitting surfaces are parallel to the top surface of their shared carrier chip. [Figure 25a] 6 shows a top view of a schematic diagram of a possible structure of the configuration shown in FIG. 5, in which all devices and free space regions are integrated on their shared carrier chip, and all light receiving and emitting surfaces are perpendicular to the top surface of their shared carrier chip. [Figure 25b] 6 shows a side view of a schematic diagram of a possible structure of the configuration shown in FIG. 5, in which all devices and free space regions are integrated on their shared carrier chip, and all light receiving and emitting surfaces are perpendicular to the top surface of their shared carrier chip. [Figure 26a] 9 shows a top view of a schematic diagram of a possible structure of the configuration shown in FIG. 8, in which all devices and all receiving and emitting surfaces are parallel to the top surface of their shared carrier chip. [Figure 26b] 9 shows a side view of a schematic diagram of a possible structure of the configuration shown in FIG. 8, in which all devices and all receiving and emitting surfaces are parallel to the top surface of their shared carrier chip. [Figure 27a] 9 shows a top view of a schematic diagram of a possible structure of the configuration shown in FIG. 8, in which all devices are composed of multiple chips and all light receiving and emitting surfaces of the devices are perpendicular to the top surface of their shared carrier chip. [Figure 27b]9 shows a side view of a schematic diagram of a possible structure of the configuration shown in FIG. 8, in which all devices are composed of multiple chips and all light receiving and emitting surfaces of the devices are perpendicular to the top surface of their shared carrier chip. [Figure 28a] 9 shows a top view of a schematic diagram of a possible structure of the configuration shown in FIG. 8 in which all devices are composed of multiple chips, all light-receiving and light-emitting surfaces of the devices are perpendicular to the top surface of their shared carrier chip, and all device components and waveguide networks are integrated into the carrier chip except for the light-receiving and light-emitting chips. [Figure 28b] 9 shows a side view of a schematic diagram of a possible structure of the configuration shown in FIG. 8 in which all devices are composed of multiple chips, all light-receiving and light-emitting surfaces of the devices are perpendicular to the top surface of their shared carrier chip, and all device components and waveguide networks are integrated into the carrier chip except for the light-receiving and light-emitting chips. [Figure 29a] 9 shows a top view of a schematic diagram of a possible structure of the configuration shown in FIG. 8 in which all devices are composed of multiple chips, all light-receiving and light-emitting surfaces of the devices are parallel to the top surface of their shared carrier chip, and all device components and waveguide networks are integrated into the carrier chip except for the light-receiving and light-emitting chips. [Figure 29b] 9 shows a side view of a schematic diagram of a possible structure of the configuration shown in FIG. 8 in which all devices are composed of multiple chips, all light-receiving and light-emitting surfaces of the devices are parallel to the top surface of their shared carrier chip, and all device components and waveguide networks are integrated into the carrier chip except for the light-receiving and light-emitting chips. [Figure 30a] 9 shows a top view of a schematic diagram of a possible structure of the configuration shown in FIG. 8, in which all devices are integrated on their shared carrier chip and all light receiving and emitting surfaces are parallel to the top surface of their shared carrier chip. [Figure 30b] 9 shows a side view of a schematic diagram of a possible structure of the configuration shown in FIG. 8, in which all devices are integrated on their shared carrier chip and all light receiving and emitting surfaces are parallel to the top surface of their shared carrier chip. [Figure 31a]9 shows a top view of a schematic diagram of a possible structure of the configuration shown in FIG. 8, in which all devices are a single monolithic component and all light receiving and emitting surfaces are perpendicular to the top surface of their shared carrier chip. [Figure 31b] 9 shows a side view of a schematic diagram of a possible structure of the configuration shown in FIG. 8, in which all devices are a single monolithic component and all light receiving and emitting surfaces are perpendicular to the top surface of their shared carrier chip. [Figure 32a] 9 shows a top view of a schematic diagram of a possible structure of the configuration shown in FIG. 8, in which all devices are composed of multiple components stacked parallel to the top surface of their shared carrier chip, and all aggregated light receiving and emitting surfaces are perpendicular to the top surface of their shared carrier chip. [Figure 32b] 9 shows a side view of a schematic diagram of a possible structure of the configuration shown in FIG. 8, in which all devices are composed of multiple components stacked parallel to the top surface of their shared carrier chip, and all aggregated light receiving and emitting surfaces are perpendicular to the top surface of their shared carrier chip. [Figure 33a] 9 shows a top view of a schematic diagram of a possible structure of the configuration shown in FIG. 8, in which all devices are composed of multiple components stacked vertically on the top surface of their shared carrier chip, and all aggregated light receiving and emitting surfaces are perpendicular to the top surface of their shared carrier chip. [Figure 33b] 9 shows a side view of a schematic diagram of a possible structure of the configuration shown in FIG. 8, in which all devices are composed of multiple components stacked vertically on the top surface of their shared carrier chip, and all aggregated light receiving and emitting surfaces are perpendicular to the top surface of their shared carrier chip. [Figure 34a] 9 shows a top view of a schematic diagram of a possible structure of the configuration shown in FIG. 8, in which all devices and free space regions are integrated on their shared carrier chip, and all light receiving and emitting surfaces are parallel to the top surface of their shared carrier chip. [Figure 34b] 9 shows a side view of a schematic diagram of a possible structure of the configuration shown in FIG. 8, in which all devices and free space regions are integrated on their shared carrier chip, and all light receiving and emitting surfaces are parallel to the top surface of their shared carrier chip. [Figure 35a]9 shows a top view of a schematic diagram of a possible structure of the configuration shown in FIG. 8, in which all devices and free space regions are integrated on their shared carrier chip, and all light receiving and emitting surfaces are perpendicular to the top surface of their shared carrier chip. [Figure 35b] 9 shows a side view of a schematic diagram of a possible structure of the configuration shown in FIG. 8, in which all devices and free space regions are integrated on their shared carrier chip, and all light receiving and emitting surfaces are perpendicular to the top surface of their shared carrier chip. [Figure 36a] 11 shows a top view of a schematic diagram of a possible structure of the configuration shown in FIG. 10, where all devices and their receiving and emitting surfaces are parallel to the top surface of their shared carrier chip. [Figure 36b] 11 shows a side view of a schematic diagram of a possible structure of the configuration shown in FIG. 10, where all devices and their receiving and emitting surfaces are parallel to the top surface of their shared carrier chip. [Figure 37a] 11 shows a top view of a schematic diagram of a possible structure of the configuration shown in FIG. 10, where all devices are composed of multiple chips and all light receiving and emitting surfaces of the devices are perpendicular to the top surface of their shared carrier chip. [Figure 37b] 11 shows a side view of a schematic diagram of a possible structure of the configuration shown in FIG. 10, where all devices are composed of multiple chips and all light receiving and emitting surfaces of the devices are perpendicular to the top surface of their shared carrier chip. [Figure 38a] 11 shows a top view of a schematic diagram of a possible structure of the configuration shown in FIG. 10 in which all devices are composed of multiple chips, all light-receiving and light-emitting surfaces of the devices are perpendicular to the top surface of their shared carrier chip, and all device components and waveguide networks are integrated into the carrier chip except for the light-receiving and light-emitting chips. [Figure 38b] 11 shows a side view of a schematic diagram of a possible structure of the configuration shown in FIG. 10 in which all devices are composed of multiple chips, all light-receiving and light-emitting surfaces of the devices are perpendicular to the top surface of their shared carrier chip, and all device components and waveguide networks are integrated into the carrier chip except for the light-receiving and light-emitting chips. [Figure 39a]11 shows a top view of a schematic diagram of a possible structure of the configuration shown in FIG. 10 in which all devices are composed of multiple chips, all light-receiving and light-emitting surfaces of the devices are parallel to the top surface of their shared carrier chip, and all device components and waveguide networks are integrated into the carrier chip except for the light-receiving and light-emitting chips. [Figure 39b] 11 shows a side view of a schematic diagram of a possible structure of the configuration shown in FIG. 10 in which all devices are composed of multiple chips, all light-receiving and light-emitting surfaces of the devices are parallel to the top surface of their shared carrier chip, and all device components and waveguide networks are integrated into the carrier chip except for the light-receiving and light-emitting chips. [Figure 40a] 11 shows a top view of a schematic diagram of a possible structure of the configuration shown in FIG. 10, where all devices are integrated on their shared carrier chip and all light receiving and emitting surfaces are parallel to the top surface of their shared carrier chip. [Figure 40b] 11 shows a side view of a schematic diagram of a possible structure of the configuration shown in FIG. 10, in which all devices are integrated on their shared carrier chip and all light receiving and emitting surfaces are parallel to the top surface of their shared carrier chip. [Figure 41a] 11 shows a top view of a schematic diagram of a possible structure of the configuration shown in FIG. 10 in which all devices are single monolithic components and all light receiving and emitting surfaces are perpendicular to the top surface of their shared carrier chip. [Figure 41b] 11 shows a side view of a schematic diagram of a possible structure of the configuration shown in FIG. 10 in which all devices are a single monolithic component and all light receiving and emitting surfaces are perpendicular to the top surface of their shared carrier chip. [Figure 42a] 11 shows a top view of a schematic diagram of a possible structure of the configuration shown in FIG. 10, in which all devices are composed of multiple components stacked parallel to the top surface of their shared carrier chip, and all aggregated light receiving and emitting surfaces are perpendicular to the top surface of their shared carrier chip. [Figure 42b]A side view of a schematic diagram of a possible structure of the configuration shown in Figure 10 is shown, in which all devices are composed of multiple components stacked parallel to the top surface of their shared carrier chip, and all aggregated light-receiving and emitting surfaces are perpendicular to the top surface of their shared carrier chip. [Figure 43a] 11 shows a top view of a schematic diagram of a possible structure of the configuration shown in FIG. 10, in which all devices are composed of multiple components stacked vertically on the top surface of their shared carrier chip, and all aggregated light receiving and emitting surfaces are perpendicular to the top surface of their shared carrier chip. [Figure 43b] A side view of a schematic diagram of a possible structure of the configuration shown in Figure 10 is shown, in which all devices are composed of multiple components stacked vertically on the top surface of their shared carrier chip, and all aggregated light-receiving and emitting surfaces are perpendicular to the top surface of their shared carrier chip. [Figure 44a] 11 shows a top view of a schematic diagram of a possible structure of the configuration shown in FIG. 10 in which all devices and free space regions are integrated on their shared carrier chip, and all light receiving and emitting surfaces are parallel to the top surface of their shared carrier chip. [Figure 44b] A side view of a schematic diagram of a possible structure of the configuration shown in Figure 10, in which all devices and free space regions are integrated into their shared carrier chip, and all light receiving and emitting surfaces are parallel to the top surface of their shared carrier chip. [Figure 45a] 11 shows a top view of a schematic diagram of a possible structure of the configuration shown in FIG. 10 in which all devices and free space regions are integrated on their shared carrier chip, and all light receiving and emitting surfaces are perpendicular to the top surface of their shared carrier chip. [Figure 45b] A side view of a schematic diagram of a possible structure of the configuration shown in Figure 10, in which all devices and free space regions are integrated on their shared carrier chip, and all light receiving and emitting surfaces are perpendicular to the top surface of their shared carrier chip. [Figure 46] 1 shows a schematic diagram of a general compound optical system comprised of one or more subsystem components, which may be any and / or possible compound optical system, structure, configuration, system, device and / or variations thereof. [Figure 47] A schematic diagram of a possible configuration of the composite system shown in Figure 46, having four subsystem components, is shown. [Figure 48] 1 shows a schematic diagram of a possible computer peripheral incorporating a hybrid optical system. [Figure 49] 49 shows a schematic diagram of a compound optical system according to the peripheral shown in FIG. 48 and a possible computer peripheral incorporating the compound optical system with the functionality of electrical and / or memory components. [Figure 50] 1 shows a schematic diagram of a possible computer motherboard incorporating a composite optical system. [Figure 51] 1 shows a schematic diagram of a possible smartphone motherboard incorporating a composite optical system. [Figure 52] 1 shows a schematic diagram of a possible processor incorporating an electrical processing unit and a complex optical system. [Figure 53] 53 shows a schematic diagram of a possible computer motherboard incorporating the electro-optical processor shown in FIG. 52. [Figure 54] 1 shows a schematic diagram of a possible electro-optical computer motherboard incorporating a hybrid optical system. [Figure 55] 1 shows a schematic diagram of a possible electro-optical high performance computing system made up of one or more electrical and / or electro-optical computer servers. [Figure 56] A schematic diagram of a basic waveguide array device is shown. [Figure 57] A schematic diagram of the basic waveguide array device is shown together with a close-up view of the waveguide array. [Figure 58] A schematic diagram of the basic waveguide array device is shown, along with a close-up view of the internal waveguide network. [Figure 59] 1 shows a schematic diagram of a photodetector device with a close-up view of the waveguide array and the internal waveguide network. DETAILED DESCRIPTION OF THE INVENTION

[0044] In one example, an optical information processing system may comprise one or more variations of devices according to the independent aspects described herein, and the devices may be configured as a 2f optical information processing system (e.g., a coupled correlation system) as shown in FIG. 1 , a 4f optical information processing system (e.g., a matched filter correlation system) as shown in FIGS. 2 and 3 , and / or any other combination of components and / or devices. The components and / or devices of an optical information processing system may be separated by free space, a gas (e.g., nitrogen), a liquid (e.g., an index-matching liquid), a solid (e.g., an index-matching glass), or a vacuum. One or more light sources may be used as data carriers and / or modulators along with one or more devices in the system. System embodiments may be freestanding, part of a larger system (concatenated with conventional optical, electrical, or electro-optical systems, or with the same or other configurations of systems), or integrated into an optical fiber communication system (e.g., integrated into an optical fiber transmission line for in-line analysis, processing, or modulation). For 2f, 4f, and / or free-space optical systems, the systems described herein may be fully internally analog and may simultaneously detect the phase of the light or both the amplitude and phase. Similarly, embodiments employ waveguide emitting arrays with light receiving (light detecting) arrays to implement optical information processing systems. The possibility of compact waveguides combined into compact arrays of waveguides allows, in certain embodiments, these optical information processing systems to be concentrated into small form factors similar to those of current chip-scale devices such as central processing unit (CPU) chips, field programmable gate array (FPGA) chips, and graphics processing unit (GPU) chips.

[0045] For the specific device, system, configuration, composite system, and / or variant embodiments thereof disclosed herein, waveguide refers to an optical waveguide, i.e., a waveguide capable of propagating light, including, but not limited to, wires, ribs, slots, buried channels, strip-loaded optical pipes, fibers, and the like, preferably with design wavelengths of 100 nm to 1 mm, and telecommunication wavelengths ranging from 850 to 1625 nm, with a preference for visible light wavelengths of approximately 380 to 750 nm for compatibility with conventional display and camera systems. The telecommunication wavelength of 1550 nm is a preferred target wavelength for embodiments of the present invention because it is an important wavelength used in communications and allows the potential for direct coupling into optical information processing systems with existing fiber infrastructure to perform in-line functions such as network monitoring or routing, analysis or filtering, encryption or decryption, encoding or decoding, compression or decompression, or numerous other possible functions (all of which can be implemented using conventional mathematical models or artificial intelligence methods). Furthermore, waveguides are more likely to be designed for single-mode propagation, which makes fiber compact and more predictable. This is because waveguides propagate only a single mode of light, making defects very noticeable when zero propagation occurs. Therefore, at the preferred communications wavelength of 1550 nm, where the waveguide satisfies the single-mode propagation condition, the primary waveguide diameter of interest in at least some embodiments of the present invention is between 100 and 1000 nm. There are many materials from which the waveguides described herein can be fabricated, including, but not limited to, silicon, germanium, gallium arsenide, and indium phosphate; preferred materials are low-loss and compatible with conventional electronic chip lithography methods to increase ease of integration with existing chips and platforms and minimize cost. For the preferred design wavelength of 1550 nm, a silicon-on-insulator (e.g., silicon on silicon dioxide) rib waveguide design can support single-mode propagation with zero birefringence at a rib diameter of 277 nm and an etch depth of 360 nm.To ensure there is no crosstalk between the waveguides, it is envisioned that the waveguides will be separated by a distance of at least 1-2 times the largest rib dimension (although shorter separations are feasible). Thus, when considering a 2D array of waveguides, such as those in the receiving and / or emitting array embodiments, the array will optionally have a pixel pitch of 720 nm to 1080 nm. The larger pixel pitch will be used to calculate the waveguide array resolution for the exemplary systems described herein, but will be rounded to 1 μm for simplicity of explanation.

[0046] Because the optical components of the system operate passively at the speed of light in preferred embodiments, the modulators, detectors, and other electro-optical elements coupled to the waveguide networks of any device, system, configuration, composite system, and / or variations thereof disclosed herein may, in certain embodiments, be components that limit the maximum possible data throughput. Thus, the intended operating speed of the system may, in certain embodiments, be equal to the operating speed of the slowest system component. Depending on the devices involved, operating speeds are often between 20 MHz and 30 GHz, although slower or faster operating speeds are contemplated.

[0047] The schematic diagrams of all devices, systems, configurations, structures, composite systems, and / or variations thereof shown in Figures 1-55 are not intended to limit the scope of the present invention, but rather to illustrate the basic components that may be incorporated into each device, system, configuration, structure, composite system, and / or variation embodiment. Accordingly, the drawings do not necessarily depict the actual dimensions, scale, or location of any component, device, system, configuration, structure, composite system, and / or variation unless expressly stated herein. Similarly, unless expressly stated, there may be additional elements, components, and / or devices comprising a given device, system, configuration, structure, composite system, and / or variation relative to those shown in any drawing and / or described herein.

[0048] FIG. 56 shows a simplified diagrammatic device 5604 encompassing an embodiment of a building block or module that may be employed in any of the embodiments of a spatial light modulation device, a receiver-transmitter device, and / or variations thereof. In a broad aspect, the device may be a receiver-transmitter SLM device comprising a first plurality of elements arranged in an array of emitters, a second plurality of elements arranged in an array of receivers, and at least one waveguide coupling at least one of the first plurality of elements to at least one of the second plurality of elements. In a further broad aspect, the device may be a receiver or transmitter SLM device. In a subsidiary aspect, the device optionally comprises the first plurality of elements coupled to respective optical fibers for allowing modulated light to exit the device. In a further subsidiary aspect, the second plurality of elements are optionally coupled to respective optical fibers for allowing modulated light to enter the device. In a further subsidiary aspect, the device further optionally comprises at least one light modulation element for modulating light passing through at least one waveguide. In a further subsidiary aspect, the at least one light modulating element is in-line with the at least one waveguide. In a further subsidiary aspect, the at least one light modulating element is a waveguide adjacent to the at least one waveguide. Preferably, the modulating element and the waveguide are confined to a silicon chip. In a further subsidiary aspect, the at least one light modulating element optionally confines part or all of the at least one waveguide. In a further subsidiary aspect, the at least one light modulating element is one or a combination of a thermo-optic modulator, an electro-optic modulator, an acousto-optic modulator, and / or a mechanical modulator. In a further subsidiary aspect, the at least one light modulating element optionally includes at least one gain component. In a further subsidiary aspect, the at least one gain component optionally comprises an evanescently coupled pump amplifier. In a further subsidiary aspect, the array of emitters is coplanar with the array of receivers. In a further subsidiary aspect, the array of emitters is in a plane perpendicular to the array of receivers. In a further subsidiary aspect, the array of emitters is in a plane opposite to the array of receivers.In a further subsidiary aspect, the number of emitters is equal to, greater than, or less than the number of receivers.

[0049] Preferably, these devices have an internal waveguide network (see FIG. 58) comprised of one or more optical waveguides that carry light for purposes of modulation (either phase, intensity, amplitude, polarization, or a combination thereof), transmission, and / or detection of the light carried therein. Each waveguide can be modulated or influenced by in-line, adjacent, or confining components, such as electro-optics, thermal-optics, or other adjacent waveguides, to alter or maintain the properties of the light, including phase, intensity, amplitude, and / or polarization, as the light passes through the waveguide and device. Similarly, the devices have one or more waveguide-coupled array faces (see FIG. 57) that allow the waveguide network to be externally connected. Device 5604 illustrates a device with two faces, optional faces 5606 and 5608, which may be used to receive light from an external light source, such as via optional face 5606, or to emit light, such as via face 5608. There is no limit to the number of elements in the waveguide array on any given face. Similarly, the number of elements in any given waveguide array may not be equal to the number of elements in any other waveguide array face.

[0050] Figure 57 shows device 5604 in a simplified schematic diagram showing a close-up of the waveguide array face. The description of device 5604 in Figure 57 is similar to that given in Figure 56, with the following additional, optional detail: Internal waveguides 5712 are terminated at face 5608 so that light within internal waveguides 5712 may emit through face 5608 in an emitting configuration or be received from face 5608 in a receiving configuration. Each waveguide termination is optionally coupled to a microlens 5722 that assists in coupling light into and / or out of the waveguide.

[0051] Figure 58 illustrates device 5604 in a simplified schematic diagram showing a close-up of internal waveguide 5712. A description of the embodiment of device 5604 in Figure 58 may be similar to that provided in Figures 56 and 57, with the following additional details. Internal waveguide 5712 is optionally terminated in a waveguide array 5608 so that light within internal waveguide 5712 may radiate through or be received from waveguide array face 5608 in a radiating configuration. Each waveguide termination is optionally coupled to a microlens 5722 that assists in coupling light into and / or out of the waveguide. Modulator 5832 is representative of any in-line, adjacent, or confining component that may alter or maintain the properties of light within the waveguide, including phase, intensity, amplitude, and / or polarization, by electro-optics, thermal-optics, acousto-optics, or any other modulation means. Any waveguide in the network of internal waveguides 5712 may have any number of modulators, such as modulator 5832. If the device has multiple waveguide array planes, an internal waveguide network interconnects the planes to perform the desired modulation of the received light. In certain embodiments, both the waveguides and the modulators are integrated into the same block, module, or chip, which may optionally be made of silicon. The block or module, in certain embodiments, is arranged to emit or receive light from free space through a space having a gas or liquid suitable for optical communication between modules or blocks of the type in question.

[0052] FIG. 59 illustrates a simplified example of a photodetector device 5904 for converting light to an electrical signal. In a broad, independent aspect, an embodiment comprises a photodetector device for converting modulated light from the optical domain to the electrical domain, the device comprising a plurality of waveguide elements arranged to form an array of receivers. Optionally, the photodetector device further comprises at least one light-modulating element for modulating light passing through at least one of the plurality of waveguides. In a further subsidiary aspect, at least one of the plurality of waveguides terminates in one or more interferometric photodetectors, one or more electro-optic photodetectors, and / or one or more differential photodetectors. In a further subsidiary aspect, the device further comprises an optical input, the optical input coupled to the at least one waveguide element. In a further subsidiary aspect, the coupling is via an interferometric or differential element. In a further subsidiary aspect, at least another one of the plurality of waveguides is optionally split into multiple detectors for measuring multiple optical properties. In a further subsidiary aspect, the optical detection device performs optical detection by one or more of the following: detecting the phase of the light, detecting the amplitude of the light, detecting the polarization of the light, detecting the intensity of the light, detecting both the phase and amplitude of the light, detecting both the phase and intensity of the light, detecting both the phase and polarization of the light, detecting both the amplitude and polarization of the light, detecting both the intensity and polarization of the light, and optionally the intensity and polarization can be detected simultaneously by optical detection by detecting the phase, amplitude and polarization of the light, optical detection by detecting the phase, intensity and polarization of the light.

[0053] Returning to Figure 59, surface 5906 is a light receiving surface having an array of coupled waveguide elements shown in a close-up view. In certain embodiments, the description of surface 5906 is the same as that given for surface 5608 in Figures 56-58. Similarly, in certain embodiments, the description of internal waveguide 5964 is the same as that given for internal waveguide 5712 in Figures 56-58. The description of microlens 5922 may also be the same as that given for microlens 5722 in Figures 56-58 in certain embodiments. The light detection device 5904 and the internal waveguide 5964 are coupled to a photodetector component 5982, which can be one or more electro-optical or optical components including, but not limited to, a detector component that measures the amplitude or intensity of light, a detector component that measures the phase of light, a detector component that measures the polarization of light, or a detector component that measures any combination of light properties; all possible detector components can measure these values ​​relative to a known value (such as a known constant value), a previous value, or an original light source, and can include interferometric or differential components such as a Mach-Zehnder interferometer or differential detector element that determines the relative difference between a reference light source and the light received by the internal waveguide 5964. In certain embodiments, both the waveguide and the photodetector are integrated into a common block, module, or chip, preferably a silicon-containing chip. The block or module is, in certain embodiments, arranged to emit or receive light from free space through a space having a gas or liquid suitable for optical communication between the types of modules or blocks of interest.

[0054] 1 illustrates a system 102, which may be an embodiment of an optical information system. In a further broad aspect, an embodiment of the present invention provides an optical processing system comprising a plurality of SLM devices, each comprising one or more optical inputs, one or more optical outputs, and a plurality of waveguides arranged in an array of receivers and / or emitters, each waveguide coupled to one or more optical inputs and at least one optical modulation element for modulating light passing through at least one of the plurality of waveguides. The waveguides and the optical modulation elements are integrated into at least one common module, with one of the optical inputs or optical outputs having an interface with a free-space region partially occupied by a vacuum, gas, liquid, and / or solid medium. At least two SLM devices communicate via a common free-space region partially occupied by a vacuum, gas, liquid, and / or solid medium.

[0055] In a subsidiary aspect according to the broad aspect, at least one of the SLM devices is configured such that at least one light modulating element is in-line with at least one of the plurality of waveguides. Optionally, at least one of the SLM devices is configured such that at least one light modulating element is a waveguide adjacent to at least one of the plurality of waveguides. In a further subsidiary aspect, at least one of the SLM devices comprises at least one light modulating element confining at least one of the plurality of waveguides. In a further subsidiary aspect, the at least one light modulating element for at least one of the SLM devices is selected from the group consisting of a thermo-optic phase shifter, an electro-optic polymer, and at least one gain component that is optionally an evanescently coupled pump amplifier. In a further subsidiary aspect, an optical input for at least one of the SLM devices is coupled to each of the plurality of waveguides via a branching element. In a further subsidiary aspect, at least one of the SLM devices further comprises an additional waveguide array for splitting the optical input into multiple optical paths. In a further subsidiary aspect, at least one of the SLM devices further comprises a microlens array for capturing modulated light after passing through at least one of the plurality of waveguides and projecting the captured modulated light towards a free space region partially occupied by a vacuum, gas, liquid and / or solid medium. In a further subsidiary aspect, at least one of the SLM devices is configured such that its plurality of waveguides branch off from a single waveguide coupled to the light input. In a further subsidiary aspect, at least one of the SLM devices is configured such that at least one of its plurality of waveguides has a planar light emitting surface and / or a planar light receiving surface. In a further subsidiary aspect, at least one of the SLM devices is configured such that at least one of its plurality of waveguides has a non-planar light emitting surface and / or a non-planar light receiving surface. In a further subsidiary aspect, at least one of the SLM devices is self-luminous.

[0056] In a further subsidiary aspect, the optical processing system optionally comprises at least one lens of focal length f and any number of additional optical elements. In a further subsidiary aspect, the optical processing system optionally comprises at least one assembly of focal length f and any number of additional optical elements. In a further subsidiary aspect, the free-space optical path length between two connected devices is equal to 2f. In a further subsidiary aspect, the free-space optical path length between two connected devices can be at least 2f. In a further subsidiary aspect, the free-space optical path length between two connected devices can be one or more of at least f, less than f, and equal to f. In a further subsidiary aspect, the total free-space optical path length between three consecutively connected devices is equal to 4f. In a further subsidiary aspect, the total free-space optical path length between three consecutively connected devices is at least 4f. In a further subsidiary aspect, the total free-space optical path length between three successively connected devices is one or more of at least f, less than f, or equal to f. In a further subsidiary aspect, the optical detection device is optionally configured to detect one or more of the following: optical phase, optical amplitude, optical polarization, optical intensity, both optical phase and amplitude, both optical phase and intensity, both optical phase and polarization, both optical amplitude and polarization, both optical intensity and polarization, intensity and polarization optionally detected simultaneously, optical phase, amplitude and polarization, and / or optical phase, intensity and polarization.

[0057] For example, system 102 is a single processing device system including one of any variation of a spatial light modulator device (input device 104) and one of any variation of a light detector device (output device 106). The input device may, for example, take the form of a transmitter device of FIGS. 56 and 57. The output device may, for example, take the form of a receiver device of FIG. 59. One or both of the input and output devices may incorporate light modulation elements, which may, for example, be embedded in silicon photonics as shown in FIG. 58. The input device 104 and the output device 106 are separated from each other along their common optical axis by a distance 2f by a region of free space 108. Other embodiments contemplate, instead of free space, a space occupied by a gas or liquid suitable for optical communication between modules or blocks of the type in question. The term device may, in certain embodiments, take the form of an integrated chip or portion of a chip that itself incorporates a waveguide and / or modulator arrangement as described in any one of the other embodiments. A Fourier transform lens 110 is positioned between the input device 104 and the output device 106 at a distance f along their common optical axis. Input data is received by the input device 104 via electrical wiring, optical fiber, or free space (not shown) and used to modulate light within the input device 104. Modulated light 112 is emitted from the input device 104, received by the lens 110, and focused into a light receiving array (not shown) of the output device 106. Output data is transferred from the system 102 using electrical wiring, optical fiber, or free space (not shown) connected to the output device 106 at an output stage of the system 102. The system 102 mirrors the functionality of a conventional "2f" optical Fourier transform configuration. Variations of the simplest system 102 include replacing the air in the free space 108 with a gas (e.g., nitrogen), a liquid (e.g., an index-matching fluid), a solid (e.g., an index-matching glass), or a vacuum. One further variation of the simplest system and all its variations includes zero or more lenses, beam splitters, polarizers, wave plates, waveguides, fibers, microlens arrays, or other optical components between the input device 104 and the output device 106, in certain embodiments, along a common optical axis.

[0058] One configuration of system 102 is a linear arithmetic system, where linear elementary mathematical operations such as addition, multiplication, etc. are performed on input data before modulation of the light within input device 104, or on modulated light after modulation with input data within input device 104 before emission. A second configuration of system 102 is a nonlinear arithmetic system, where nonlinear elementary mathematical operations such as quadratic, cubic, etc. are performed on input data before modulation of the light within input device 104, or on modulated light after modulation with input data within input device 104 before emission from device 104. A fourth configuration of system 102 shown in FIG. 2 is system 102b, a "do nothing" or buffer system, where light within input device 104 is directly modulated with input data without additional modulation, emitted as modulated light 112, passes through Fourier transform lens 110 followed by Fourier transform lens 210, and is received by output device 106 as collimated light 212, which is converted to an electrical signal without further modulation. System 102b may, in certain embodiments, be similar to system 102, except for the increased 4f optical path length between input device 104 and output device 106 and the addition of a second Fourier transform lens 210 along the common optical axis of input device 104 and output device 106. A fifth configuration of system 102 features any combination or variation of the configuration or capabilities of input device 104 and / or output device 106. All variations of system 102 apply to all configurations of system 102. For the avoidance of doubt, the transmitter device may take the form of an integrated waveguide unit described in any of Figures 56-58, while the receiver device may take the form of the integrated waveguide unit of Figure 59. The receiver device may also take the form of the integrated waveguide units of Figures 56-58 in their appropriate configurations.

[0059] A multi-processing device system, which is an optical information system with higher capabilities than system 102, includes one or more of any of the variations of spatial light modulator devices and any of the variations of light detection devices (output devices) arranged in any relative configuration with respect to each other. The SLM device and the output device may be separated from each other by free space in certain embodiments. There may be a Fourier transform lens between the SLM and the output device. Input data is received by the input stage of the system via electrical wiring, optical fiber, or free space and used to modulate light within the input device of the system. Output data is transferred from the system using one or more of the following groups: electrical wiring, optical fiber, or free space connected to an output device in the output stage of the system. System variations include one or more substitutions of inter-device free-space air gaps with gas (e.g., nitrogen), liquid (e.g., index-matching fluid), solid (e.g., index-matching glass), or vacuum; such substitution of air for another medium in one region of free space may not occur in any other region of free space, and may not be the same as the substitution in any other region of free space. Further variations of the system and all its variations include zero or more lenses, beam splitters, polarizers, wave guides, waveguides, fibers, microlens arrays or other optical components.

[0060] FIG. 3 illustrates a relatively simple form of a multi-processing device system, system 302. System 302 is a dual-processing device system including input device 104 and filter device 304 (both input device 104 and filter device 304 are any variation of a spatial light modulator device, which may be of the type shown in FIGS. 56-58 ), and output device 106 (any variation of a light-detecting device, which may be of the type shown in FIG. 59 ). Input device 104 and filter device 304 are separated from one another along their common optical axis by a distance 2f, by a region of free space 108. Similarly, filter device 304 and output device 106 are separated from one another along their common optical axis by a distance 2f, by a region of free space 308. Fourier transform lens 110 is positioned a distance f between input device 104 and filter device 304 along their common optical axis. Similarly, Fourier transform lens 210 is positioned a distance f between filter device 304 and output device 106 along their common optical axis. Because the focused light 114 received by the filter device 304 travels internally before being emitted into free space 308 as modulated divergent light 214, the optical axis shared by the input device 104 and the filter device 304 in free space 108 and the optical axis shared by the filter device 304 and the output device 106 in free space 308 do not need to be the same (i.e., the two optical axes can be different).

[0061] Input data is received by input device 104 of system 302 via electrical wiring, optical cable, or free space (not shown) and used to modulate light within input device 104 of system 302. Modulated light 112 is emitted from input device 104 and received by lens 110, becoming focused light 114, which is then incident on a light receiving array (not shown) of filter device 304. Filter data is received by filter device 304 of system 302 via electrical wiring, optical cable, or free space (not shown) and used to modulate light within filter device 304 of system 302. Modulated divergent light 214 is emitted from filter device 304 and received by lens 210, becoming collimated light 212, which is then incident on a light receiving array (not shown) of output device 106. Output data is transferred from system 302 using electrical wiring, optical fiber, or free space (not shown) connected to output device 106 in the output stage of system 302.

[0062] System 302 reflects the functionality of a conventional 4f optical Fourier transform configuration. For this and any of the other embodiments, further variations of the embodiment include the substitution of a gas (e.g., nitrogen), a liquid (e.g., index-matching fluid), a solid (e.g., index-matching glass), or a vacuum for air in free space 108 and / or any other free space (e.g., free space 308), and such substitution of air for another medium in one region of free space may not occur in any other region of free space, and may not be the same as the substitution in any other region of free space. The system of any embodiment and all variations thereof may include zero or more lenses, beam splitters, polarizers, wave guides, waveguides, fibers, microlens arrays, or other optical components along a common optical axis between input device 104 and any other device (e.g., filter device 304) and / or along a common axis between any device (e.g., filter device 304) and output device 106.

[0063] One configuration of system 302 is a linear arithmetic system, where linear elemental mathematical operations such as addition, multiplication, etc. are performed on input data before modulation of light in input device 104 or on modulated light after modulation with input data in input device 104 before emission, and / or on filter data before modulation of light in filter device 304 or on modulated light after modulation with filter data in filter device 304 before emission. A second configuration of system 302 is a non-linear arithmetic system, where non-linear elemental mathematical operations such as second order, third order, etc. are performed on input data before modulation of light in input device 104 or on modulated light after modulation with input data in input device 104 before emission, and / or on filter data before modulation of light in filter device 304 or on modulated light after modulation with filter data in filter device 304 before emission. A third configuration of system 302 is a "do nothing" or buffer system, in which the light in input device 104 is directly modulated by the input data without any additional modulation before emission, and filter device 304 performs no modulation of the light as it passes through filter device 304 and is emitted as divergent light 214. This configuration is similar to system 102b except for the insertion of filter device 304 (which performs no modulation, simply relays data between the receiving and emitting surfaces) at a distance 2f between input device 104 and filter device 304. A fourth configuration of system 302 features any combination or variation of the configurations or capabilities of input device 104, filter device 304, and / or output device 106. All variations of system 302 apply to all configurations of system 302.

[0064] In certain embodiments, the transmitter, filter, and receiver devices may comprise waveguides and / or modulators integrated into a common block, module, or chip. Blocks or modules arranged in certain embodiments to emit / receive light in any of the blocks may interface and be contiguous with free space or adjacent to a gas or liquid space suitable for optical communication between modules or blocks of the type in question.

[0065] FIG. 4 illustrates a more advanced form of multi-processing device system, system 402. System 402 is a two-input, dual-processing device system that expands the functionality of system 302 by adding an additional input device 404 (input device 404 is any variation of a spatial light modulator device). Both input device 104 and input device 404 are positioned such that each of their emitting surfaces provides an input to filter device 304 through a separate Fourier transform lens. Both input devices may take the form of integrated waveguide units as described with respect to FIGS. 56-58, while the output device may similarly take the form of an integrated waveguide unit as described with respect to FIG. 59. System 402 enables simultaneous optical Fourier transform calculations on two different sets of input data, both of which are combined within filter device 304 as described. Input device 104 and filter device 304 are separated from each other along their common optical axis by a distance 2f by a region of free space 108. Similarly, input device 404 and filter device 304 are separated from one another along their common optical axis by a distance 2f by a region of free space 408. Similarly, filter device 304 and output device 106 are separated from one another along their common optical axis by a distance 2f by a region of free space 308. Fourier transform lens 110 is disposed a distance f along their common optical axis between input device 104 and filter device 304. Similarly, Fourier transform lens 410 is disposed a distance f along their common optical axis between input device 404 and filter device 304. Similarly, Fourier transform lens 210 is disposed a distance f along their common optical axis between filter device 304 and output device 106.Because the focused light 114 and focused light 414 received by the filter device 304 travel internally before being emitted into free space 308 as modulated divergent light 214, the optical axis shared by the input device 104 and the filter device 304 in free space 108, the optical axis shared by the input device 404 and the filter device 304 in free space 408, and the optical axis shared by the filter device 304 and the output device 106 in free space 308 do not have to be the same optical axis (i.e., these optical axes can be different).

[0066] Input data is received by input device 104 of system 402 via electrical wiring, optical cable, or free space (not shown) and used to modulate light within input device 104 of system 402. Modulated light 112 is emitted from input device 104, received by lens 110, and becomes focused light 114, which then enters the light receiving array (not shown) of filter device 304. Similarly, additional input data, which may or may not be the same input data received by input device 104, is received by input device 404 of system 402 via electrical wiring, optical cable, or free space (not shown) and used to modulate light within input device 404 of system 402. Modulated light 412 is emitted from input device 404, received by lens 410, and becomes focused light 414, which then enters the light receiving array (not shown) of filter device 304. The focused light 114 and focused light 414 received by filter device 304 are combined within filter device 304 (i.e., filter device 304 modulates the light received from focused light 114 within filter device 304 with the light received from focused light 414). Modulated divergent light 214 is emitted from filter device 304 and received by lens 210, becoming collimated light 212, which is then incident on a light receiving array (not shown) of output device 106. Output data is transferred from system 402 using electrical wiring, optical fiber, or free space (not shown) connected to output device 106 at the output stage of system 402.

[0067] System 402 mirrors the functionality of a conventional 4f optical Fourier transform configuration. The simplest variations of system 402 include substitutions of air for a gas (such as nitrogen), a liquid (such as an index-matching fluid), a solid (such as index-matching glass), or a vacuum in free space 108, free space 308, and / or free space 408; such substitutions of air for other media in one region of free space may not occur in any other region of free space, and may not be the same as substitutions in any other region of free space. Further variations of system 402 and all its variations include zero or more lenses, beam splitters, polarizers, wave guides, waveguides, fibers, microlens arrays, or other optical components along a common optical axis between input device 104 and filter device 304, along a common optical axis between input device 404 and filter device 304, and / or along a common axis between filter device 304 and output device 106.

[0068] One configuration of system 402 is a linear arithmetic system, in which linear element mathematical operations such as addition, multiplication, etc. are performed on input data before modulation of light in input device 104 or on modulated light after modulation by input data in input device 104 before emission, on input data before modulation of light in input device 404 or on modulated light after modulation by input data in input device 404 before emission, and / or on received light before modulation of light in filter device 304 or on modulated light after modulation by filter data in filter device 304 before emission. A second configuration of system 402 is a nonlinear arithmetic system, in which second-order, third-order, etc. nonlinear elemental mathematical operations are performed on the input data before modulation of the light in the input device 104 or on the modulated light after modulating with the input data in the input device 104 before emission from the device 104, on the input data before modulation of the light in the input device 404 or on the modulated light after modulating with the input data in the input device 404 before emission, and / or on the received light before modulation of the light in the filter device 304 or on the modulated light after modulation with the filter data in the filter device 304 before emission. A third configuration of system 402 is a “do nothing” or buffer system, in which the light in the input device 104 is directly modulated by the input data without any additional modulation before emission, the input device 404 emits no light or emits uniformly modulated light, and the filter device 304 performs no modulation of the light as it passes through the filter device 304 and is emitted as divergent light 214. The fourth configuration of system 402, which is the simplest, features any combination or variation of the configuration or capabilities of input device 104, input device 404, filter device 304, and / or output device 106. All variations of system 402 apply to all configurations of system 402. The configuration of a multi-processing device system can include any number of combinations or variations of any of the configurations of a single or multiple device processing device system.

[0069] In an embodiment of an optical information processing system, input data is received via one or more fiber optic cables directly coupled to a waveguide at an input stage of the system and output to one or more fiber optic cables at an output stage of the system, allowing the system to operate at speeds up to and including fiber optic transmission speeds. The input and output stages include one or more of any variation of spatial light modulator devices arranged in any relative configuration relative to each other. Similarly, between the input and output stages are any number of any variation of spatial light modulator devices arranged in any relative configuration relative to each other. In variations of this system, devices such as multiplexers and / or demultiplexers that encode and / or decode data in a format suitable for transmission over fiber optic cables may be present at the output and / or input sides of the system, respectively.

[0070] In certain embodiments, the filter device may comprise waveguides and / or modulators integrated into a common block, module, or chip. Blocks or modules arranged in certain embodiments to emit / receive light in any of the blocks may be interfaced and contiguous with free space or adjacent with a gas or liquid space suitable for optical communication between modules or blocks of the type in question. In further embodiments, the filter device incorporates multiple input interfaces and one or more output interfaces.

[0071] 5 shows a configuration 502 of system 402 in which both input devices have separate external lasers that provide data-carrying light and / or pump energy for light-induced signal amplification. External laser 504 generates coherent light and transmits it to input device 104 via light guide 506, which may be a waveguide, optical fiber, plasmonic waveguide, or any other light propagation medium. Input data (not shown) used internally by input device 104 to modulate the light provided to light guide 506 is provided via input data line 508, which may be electrical wiring, optical fiber, waveguide, and / or any other data-carrying medium. Similarly, control data (not shown) used to control and / or modify the operational behavior of input device 104 and / or retrieve status, statistics, and / or other information from input device 104 is transmitted to and / or from input device 104 via input control lines 510, which may be electrical wires, optical fibers, waveguides, and / or any other data carrying medium. Similarly, external laser 514 generates coherent light and transmits it to input device 404 via light guide 516, which may be a waveguide, optical fiber, plasmonic waveguide, or any other light propagation medium. Input devices 104 and 404 may take the form of the devices of Figures 56-58, while output device 104 may take the form of the output device of Figure 59. Devices 104, 404, and 106 may be integrated into a common silicon photonics system or chip.

[0072] Input data (not shown) used internally by input device 404 to modulate the light provided to light guide 516 is provided via input data lines 518, which may be electrical wires, optical fibers, waveguides, and / or any other data carrying medium. Similarly, control data (not shown) used to control and / or modify the operational behavior of input device 404 and / or retrieve status, statistics, and / or other information from input device 404 is transmitted to and / or from input device 404 via input control lines 520, which may be electrical wires, optical fibers, waveguides, and / or any other data carrying medium. A reference light guide 526 may optionally be connected to the output device 106 to provide a reference signal used by the output device 106 in determining how the collimated light 212 ( FIG. 4 ) has changed relative to the original laser light properties as the modulated light propagated through the system 402; the light guide 526 may be a waveguide, optical fiber, plasmonic waveguide, or any other light propagation medium. Output data (not shown) is transmitted from the output device 106 in the configuration 502 via output data lines 528, which may be electrical wiring, optical fiber, waveguides, and / or any other data carrying medium. Similarly, control data (not shown) used to control and / or modify the operational behavior of the output device 106 and / or retrieve status, statistics, and / or other information from the output device 106 is transmitted to and / or from the output device 106 via output control lines 530, which may be electrical wiring, optical fiber, waveguides, and / or any other data carrying medium. Filter data (not shown) is transmitted to filter device 304 (FIG. 4) in configuration 502 via filter data line 538, which may be electrical wiring, optical fiber, waveguide, and / or any other data carrying medium.Similarly, control data (not shown) used to control and / or modify the operational behavior of filter device 304 ( FIG. 4 ) and / or retrieve status, statistics, and / or other information from filter device 304 ( FIG. 4 ) is transmitted to and / or from filter device 304 ( FIG. 4 ) via filter control lines 540, which may be electrical wires, optical fibers, waveguides, and / or any other data-carrying medium. Filter device 304 ( FIG. 4 ) may have an internal on-device laser (not shown) and / or an external laser (not shown) that provides data-carrying light for filter device 304 ( FIG. 4 ) and / or pump energy for light-induced signal amplification.

[0073] In one variation of configuration 502, instead of providing a data-carrying signal, laser 504 provides pump energy to amplify signals received via fiber and / or waveguide input data lines 508 that may or may not be directly coupled to the optical receiving elements or optical receiving array (not shown) of input device 104; per optical receiving element in the optical receiving array (not shown) of input device 104, there may be one or fewer fibers or waveguides coupled to input device 104, or one or more fibers or waveguides, and there may be any number of optical receiving elements in the optical receiving array of input device 104. In a second variation of configuration 502, instead of providing a data-carrying signal, laser 514 provides pump energy to amplify signals received via fiber and / or waveguide input data lines 518, which may or may not be directly coupled to the optical receiving elements or optical receiving array (not shown) of input device 404; there may be one or fewer fibers or waveguides coupled to input device 404 per optical receiving element in the optical receiving array (not shown), and there may be any number of optical receiving elements in the optical receiving array of input device 404. A third variation combines the first and second variations of configuration 502. Any of the variations of configuration 502 may be combined to form a new variation of configuration 502. In certain embodiments, the device may include waveguides and / or modulators integrated into a common block, module, or chip. The blocks or modules arranged in certain embodiments to emit / receive light in any of the blocks may be interfaces, contiguous with free space or adjacent to a gas or liquid space suitable for optical communication between modules or blocks of the type in question. In certain embodiments, the laser is integral with the block, module or chip, but in preferred embodiments may be located external to the block. In certain embodiments, the laser is input via a waveguide that is partially external to the block.

[0074] 6 shows configuration 602 of system 402, in which the same external laser provides pump energy for data-carrying light and / or optically induced signal amplification for both devices. The description of configuration 602 is the same as configuration 502, except that light guide 516 now transmits light from laser 504, branching directly from light guide 506. The light between light guide 506, light guide 516, and / or optional reference light guide 526 can be split in any ratio. All other descriptions of devices and variations for configuration 502 apply to configuration 602.

[0075] In one variation of configuration 602, instead of providing a data-carrying signal, the laser 504 supplies pump energy to amplify signals received via fiber and / or waveguide input data lines 508 that may or may not be directly coupled to the optical receiving elements or optical receiving array (not shown) of the input device 104; per optical receiving element in the optical receiving array (not shown) of the input device 104, there may be one or fewer fibers or waveguides coupled to the input device 104, or one or more fibers or waveguides, and there may be any number of optical receiving elements in the optical receiving array of the input device 104. In a second variation of configuration 602, instead of providing a data-carrying signal, the laser 504 provides pump energy to amplify signals received via fiber and / or waveguide input data lines 518, which may or may not be directly coupled to the optical receiving elements or optical receiving array (not shown) of the input device 404; there may be one or fewer fibers or waveguides coupled to the input device 404 per optical receiving element in the optical receiving array (not shown), and there may be any number of optical receiving elements in the optical receiving array of the input device 404. A third variation combines the first and second variations of configuration 602. Any of the variations of configuration 602 may be combined to form a new variation of configuration 602. In certain embodiments, one or more devices may include waveguides and / or modulators that are integrated into a common or multiple blocks, modules, or chips. Blocks or modules arranged in certain embodiments to emit / receive light in any of the blocks may be interfaces, contiguous with free space or adjacent to gas or liquid spaces suitable for optical communication between modules or blocks of the type in question.

[0076] 7 shows configuration 702 of system 402 in which an internal on-device laser 704 provides pump energy for data-carrying light and / or optically induced signal amplification for both input devices. The description of configuration 702 is the same as configuration 602, except that here the laser light is generated from an on-device laser 704, which may be a diode laser, VCSEL, or any other chip-scale laser device mounted, bonded, attached, embedded, or fabricated within or on input device 104 to provide light to input device 104 via waveguide network 706. The integrated input device 104 may be configured according to the embodiments of FIGS. 55-58, while the output device 106 may be configured according to the embodiment of FIG. 59. Laser light from on-device laser 704 is transmitted to light guide 516 and optional reference light guide 526 via a branch of waveguide network 706 to waveguide coupler 708 and ultimately to light guide 516 and optional reference light guide 526; waveguide coupler 708 can be any device or component capable of coupling a waveguide to light guide 516 and / or optional reference light guide 526, such as a waveguide-fiber coupler or a waveguide-waveguide coupler. Light between waveguide network 706, light guide 516 and / or optional reference light guide 526 can be split in any ratio. All other descriptions of devices and variations for configuration 602 apply to configuration 702.

[0077] In one variation of configuration 702, instead of providing a data-carrying signal, laser 704 provides pump energy to amplify signals received via fiber and / or waveguide input data lines 508 that may or may not be directly coupled to the optical receiving elements or optical receiving array (not shown) of input device 104; per optical receiving element in the optical receiving array (not shown) of input device 104, there may be one or fewer fibers or waveguides coupled to input device 104, or one or more fibers or waveguides, and there may be any number of optical receiving elements in the optical receiving array of input device 104. In a second variation of configuration 702, instead of providing a data-carrying signal, the laser 704 provides pump energy to amplify signals received via fiber and / or waveguide input data lines 518, which may or may not be directly coupled to the optical receiving elements or optical receiving array (not shown) of the input device 404; there may be one or fewer fibers or waveguides coupled to the input device 404 per optical receiving element in the optical receiving array (not shown), and there may be any number of optical receiving elements in the optical receiving array of the input device 404. A third variation combines the first and second variations of configuration 702. Any of the variations of configuration 702 may be combined to form a new variation of configuration 702. In certain preferred embodiments, one or more devices may include waveguides and / or modulators integrated into a common or multiple blocks, modules, or chips to provide a silicon photonics integrated waveguide and modulator solution. Blocks or modules arranged in certain embodiments to emit / receive light in any of the blocks may be interfaces, contiguous with free space or adjacent to gas or liquid spaces suitable for optical communication between modules or blocks of the type in question.

[0078] 8 illustrates a configuration 802 of system 302 in which an external laser provides pump energy for data-carrying light and / or optically induced signal amplification. Configuration 802 is similar to configuration 502, except that there is no secondary input device because the core optical information processing system is system 302 in configuration 802. For configuration 802, an external laser 504 generates coherent light and transmits it to input device 104 via light guide 506, which may be a waveguide, optical fiber, plasmonic waveguide, or any other optical propagation medium. Input data (not shown) used internally by input device 104 to modulate the light provided to light guide 506 is provided via input data line 508, which may be electrical wiring, optical fiber, waveguide, and / or any other data-carrying medium. Similarly, control data (not shown) used to control and / or modify the operational behavior of input device 104 and / or retrieve status, statistics, and / or other information from input device 104 is transmitted to and / or from input device 104 via input control lines 510, which may be electrical wires, optical fibers, waveguides, and / or any other data carrying medium. Input device 104 and output device 106 may be configured as integrated waveguide arrays as described with reference to FIGS. 56-59. A reference light guide 526 may optionally be connected to output device 106 to provide a reference signal used by output device 106 in determining how collimated light 212 ( FIG. 3 ) has changed relative to the original laser light properties as modulated light propagated through system 302; light guide 526 may be a waveguide, optical fiber, plasmonic waveguide, or any other light propagation medium. Output data (not shown) is transmitted from output device 106 in configuration 802 via output data line 528, which may be electrical wiring, optical fiber, waveguide, and / or any other data carrying medium.Similarly, control data (not shown) used to control and / or modify the operational behavior of output device 106 and / or retrieve status, statistics, and / or other information from output device 106 is transmitted to and / or from output device 106 via output control lines 530, which may be electrical wiring, optical fibers, waveguides, and / or any other data carrying medium.

[0079] Filter data (not shown) is transmitted to filter device 304 ( FIG. 3 ) in configuration 802 via filter data lines 538, which may be electrical wiring, optical fiber, waveguides, and / or any other data-carrying medium. Similarly, control data (not shown) used to control and / or modify the operational behavior of filter device 304 ( FIG. 3 ) and / or retrieve status, statistics, and / or other information from filter device 304 ( FIG. 3 ) is transmitted to and / or from filter device 304 ( FIG. 3 ) via filter control lines 540, which may be electrical wiring, optical fiber, waveguides, and / or any other data-carrying medium. Filter device 304 ( FIG. 3 ) may have an internal on-device laser (not shown) and / or an external laser (not shown) that provides data-carrying light for filter device 304 ( FIG. 3 ) and / or pump energy for light-induced signal amplification.

[0080] In one variation of configuration 802, instead of providing a data-carrying signal, laser 504 provides pump energy to amplify signals received via fiber and / or waveguide input data lines 508 that may or may not be directly coupled to optical receiving elements or an optical receiving array (not shown) of input device 104; there may be one or fewer fibers or waveguides coupled to input device 104 per optical receiving element in the optical receiving array (not shown), and there may be any number of optical receiving elements in the optical receiving array of input device 104. Any variation of configuration 802 may be combined to form a new variation of configuration 802. In certain embodiments, one or more devices may include waveguides and / or modulators that are integrated into a common or multiple blocks, modules, or chips, preferably a silicon photonics chip. Blocks or modules arranged in certain embodiments to emit / receive light in any of the blocks may be interfaces, contiguous with free space or adjacent to gas or liquid spaces suitable for optical communication between modules or blocks of the type in question.

[0081] 9 shows configuration 902 of system 302 in which an internal on-device laser 704 provides pump energy for data-carrying light and / or optically induced signal amplification for both input devices. The description of configuration 902 is the same as configuration 802, except that here the laser light is generated from an on-device laser 704, which may be a diode laser, VCSEL, or any other chip-scale laser device mounted, bonded, attached, embedded, or fabricated within or on input device 104 to provide light to input device 104 via waveguide network 706. For the avoidance of doubt, in a preferred embodiment, the input and output devices may be configured according to the embodiments of FIGS. 56-59. Laser light from on-device laser 704 is transmitted to optional reference light guide 526 via a branch of waveguide network 706 to optional waveguide coupler 708 and finally to optional reference light guide 526; optional waveguide coupler 708 can be any device or component capable of coupling a waveguide to optional reference light guide 526, such as a waveguide-to-fiber coupler or a waveguide-to-waveguide coupler. The light between the branches in waveguide network 706 and / or optional reference light guide 526 can be split in any ratio. All other descriptions of devices and variations for configuration 802 apply to configuration 902.

[0082] In one variation of configuration 902, instead of providing a data-carrying signal, laser 704 provides pump energy to amplify signals received via fiber and / or waveguide input data lines 508, which may or may not be directly coupled to the optical receiving elements or optical receiving array (not shown) of input device 104; there may be one or fewer fibers or waveguides coupled to input device 104 per optical receiving element in the optical receiving array (not shown), and there may be any number of optical receiving elements in the optical receiving array of input device 104. In another variation of configuration 902, input device 104 does not have optional waveguide coupler 708. Any variation of configuration 902 may be combined to form a new variation of configuration 902. In certain embodiments, one or more devices may include waveguides and / or modulators that are integrated into a common or multiple blocks, modules, or chips. Blocks or modules arranged in certain embodiments to emit / receive light in any of the blocks may be interfaces, contiguous with free space or adjacent to gas or liquid spaces suitable for optical communication between modules or blocks of the type in question.

[0083] 10 illustrates a configuration 1002 of system 102 in which an external laser provides pump energy for data-carrying light and / or optically induced signal amplification. Configuration 1002 is similar to configuration 802, except that there is no filter device because the core optical information processing system is system 102 in configuration 1002. For configuration 1002, an external laser 504 generates coherent light and transmits it to input device 104 via light guide 506, which may be a waveguide, optical fiber, plasmonic waveguide, or any other optical propagation medium. Input data (not shown) used internally by input device 104 to modulate the light provided to light guide 506 is provided via input data line 508, which may be electrical wiring, optical fiber, waveguide, and / or any other data-carrying medium. Similarly, control data (not shown) used to control and / or modify the operational behavior of input device 104 and / or retrieve status, statistics, and / or other information from input device 104 is transmitted to and / or from input device 104 via input control lines 510, which may be electrical wiring, optical fiber, waveguides, and / or any other data-carrying medium. A reference light guide 526 may optionally be connected to output device 106 to provide a reference signal used by output device 106 in determining how focused light 114 ( FIG. 1 ) has changed relative to the original laser light properties as modulated light propagated through system 102; light guide 526 may be a waveguide, optical fiber, plasmonic waveguide, or any other light-propagating medium. Output data (not shown) is transmitted from output device 106 in configuration 1002 via output data lines 528, which may be electrical wiring, optical fiber, waveguides, and / or any other data-carrying medium. Similarly, control data (not shown) used to control and / or modify the operational behavior of output device 106 and / or retrieve status, statistics, and / or other information from output device 106 is transmitted to and / or from output device 106 via output control lines 530, which may be electrical wiring, optical fibers, waveguides, and / or any other data carrying medium.

[0084] In one variation of configuration 1002, instead of providing a data-carrying signal, laser 504 provides pump energy to amplify signals received via fiber and / or waveguide input data lines 508, which may or may not be directly coupled to the optical receiving elements or optical receiving array (not shown) of input device 104; there may be one or fewer fibers or waveguides coupled to input device 104 per optical receiving element in the optical receiving array (not shown), and there may be any number of optical receiving elements in the optical receiving array of input device 104. Any variation of configuration 1002 may be combined to form a new variation of configuration 1002. Input device 104 and output device 106 may be configured as units described with reference to Figures 56-59. In certain embodiments, one or more devices may include waveguides and / or modulators integrated into a common or multiple blocks, modules, or chips. Blocks or modules arranged in certain embodiments to emit / receive light in any of the blocks may be interfaces, contiguous with free space or adjacent to gas or liquid spaces suitable for optical communication between modules or blocks of the type in question.

[0085] 11 shows configuration 1102 of system 102 in which an internal on-device laser 704 provides pump energy for data-carrying light and / or optically induced signal amplification for both input devices. The description of configuration 1102 is the same as configuration 1002, except that here the laser light is generated from an on-device laser 704, which may be a diode laser, VCSEL, or any other chip-scale laser device mounted, bonded, attached, embedded, or fabricated within or on input device 104 to provide light to input device 104 via waveguide network 706. Laser light from on-device laser 704 is transmitted to optional reference light guide 526 via a branch of waveguide network 706 to optional waveguide coupler 708 and ultimately to optional reference light guide 526; optional waveguide coupler 708 can be any device or component capable of coupling a waveguide to optional reference light guide 526, such as a waveguide-to-fiber coupler or a waveguide-to-waveguide coupler. Light between branches in waveguide network 706 and / or optional reference light guide 526 can be split in any ratio. All other descriptions of devices and variations for configuration 1002 apply to configuration 1102.

[0086] In one variation of configuration 1102, instead of providing a data-carrying signal, laser 704 provides pump energy to amplify signals received via fiber and / or waveguide input data lines 508, which may or may not be directly coupled to the optical receiving elements or optical receiving array (not shown) of input device 104; there may be one or fewer fibers or waveguides coupled to input device 104 per optical receiving element in the optical receiving array (not shown), and there may be any number of optical receiving elements in the optical receiving array of input device 104. In another variation of configuration 1102, input device 104 does not have optional waveguide coupler 708. Any variation of configuration 1102 may be combined to form a new variation of configuration 1102. In certain embodiments, one or more devices may include waveguides and / or modulators that are integrated into a common or multiple blocks, modules, or chips. One or more of the devices may take the form of those described with reference to Figures 56 to 59. Blocks or modules arranged in certain embodiments to emit / receive light in any of the blocks may interface and be contiguous with free space or adjacent to a gas or liquid space suitable for optical communication between modules or blocks of the type in question.

[0087] 12 shows configuration 1202 of system 402 in which both input devices have their own internal on-device lasers that provide data-carrying light and / or pump energy for light-induced signal amplification. The description of configuration 1202 is the same as configuration 502, except that here laser light is generated from on-device laser 704 for input device 104 and from on-device laser 1214 for input device 404. On-device laser 704 may be a diode laser, VCSEL, or any other chip-scale laser device mounted, bonded, attached, embedded, or fabricated in or on input device 104 to provide light to input device 104 via waveguide network 706. Similarly, on-device laser 1214 may be a diode laser, VCSEL, or any other chip-scale laser device mounted, bonded, attached, embedded, or fabricated in or on input device 404 to provide light to input device 404 via waveguide network 1216. Laser light from on-device laser 704 is transmitted to optional reference light guide 526 via a branch of waveguide network 706 to optional waveguide coupler 708 and ultimately to optional reference light guide 526; optional waveguide coupler 708 can be any device or component capable of coupling a waveguide to optional reference light guide 526, such as a waveguide-to-fiber coupler or a waveguide-to-waveguide coupler. Light between branches in waveguide network 706 and / or optional reference light guide 526 can be split in any ratio. All other descriptions of devices and variations for configuration 502 apply to configuration 1202.

[0088] In one variation of configuration 1202, instead of providing a data-carrying signal, laser 704 supplies pump energy to amplify signals received via fiber and / or waveguide input data lines 508 that may or may not be directly coupled to the optical receiving elements or optical receiving array (not shown) of input device 104; per optical receiving element in the optical receiving array (not shown) of input device 104, there may be one or fewer fibers or waveguides coupled to input device 104, or one or more fibers or waveguides, and there may be any number of optical receiving elements in the optical receiving array of input device 104. In a second variation of configuration 1202, instead of providing a data-carrying signal, laser 1214 provides pump energy to amplify signals received via fiber and / or waveguide input data lines 518, which may or may not be directly coupled to the optical receiving elements or optical receiving array (not shown) of input device 404; there may be as few as one fiber or waveguide coupled to input device 404 or as many as one fiber or waveguide per optical receiving element in the optical receiving array (not shown) of input device 404, and there may be any number of optical receiving elements in the optical receiving array of input device 404. In a third variation of configuration 1202, input device 104 does not have optional waveguide coupler 708. Any variation of configuration 1202 may be combined to form a new variation of configuration 1202. Any of the devices may preferably be of the type described with reference to FIGS. 56-59.

[0089] 13 shows configuration 1302 of system 402 in which laser light is received by input data line 508, input data line 518, and / or filter data line 538. The description of configuration 1302 is the same as configuration 1202, except that there are no internal lasers in any of input device 104, input device 404, and filter device 304 (FIG. 4). Input data line 508 may or may not be directly coupled to a light receiving element or light receiving array (not shown) of input device 104, there may be fewer than one fiber or waveguide coupled to input device 104, or there may be more than one fiber or waveguide coupled to input device 104 per light receiving element in the light receiving array of input device 104, and there may be any number of light receiving elements in the light receiving array of input device 104. Similarly, the input data lines 518 may or may not be directly coupled to the light receiving elements or light receiving array (not shown) of the input device 404, and there may be as few as one fiber or waveguide coupled to the input device 404 or as many as one fiber or waveguide coupled to the input device 404 per light receiving element in the light receiving array of the input device 404, and there may be any number of light receiving elements in the light receiving array of the input device 404. The filter data lines 538 may or may not be directly coupled to the light receiving elements or light receiving array (not shown) of the filter device 304 (FIG. 4), and there may be as few as one fiber or waveguide coupled to the filter device 304 (FIG. 4) per light receiving element in the light receiving array of the filter device 304 (FIG. 4), and there may be any number of light receiving elements in the light receiving array of the filter device 304. The filter data lines 538 need not carry light, but instead may be electrical wiring or any other data carrying medium. All other descriptions of devices and variations for configuration 1202 apply to configuration 1302. Any of the devices may preferably be of the type described with reference to Figures 56-59.

[0090] 14 shows a configuration 1402 of system 302 in which laser light is received into the system via input data lines 508 and / or filter data lines 538. The description of configuration 1402 is the same as configuration 902, except that there are no internal lasers in either input device 104 or filter device 304 (FIG. 3). Input data lines 508 may or may not be directly coupled to a light receiving element or light receiving array (not shown) of input device 104, there may be fewer than one fiber or waveguide coupled to input device 104, or there may be more than one fiber or waveguide per light receiving element in the light receiving array of input device 104, and there may be any number of light receiving elements in the light receiving array of input device 104. The filter data lines 538 may or may not be directly coupled to the light receiving elements or light receiving array (not shown) of the filter device 304 (FIG. 3), and there may be as few as one fiber or waveguide coupled to the filter device 304 (FIG. 3) or as many as one fiber or waveguide per light receiving element in the light receiving array of the filter device 304 (FIG. 3), and there may be any number of light receiving elements in the light receiving array of the filter device 304 (FIG. 3). The filter data lines 538 need not carry light but instead may be electrical wiring or any other data carrying medium. All other descriptions of devices and variations for configuration 902 apply to configuration 1402. Any of the devices may preferably be of the type described with reference to FIGS. 56-59.

[0091] FIG. 15 shows configuration 1502 of system 102 in which laser light is received by the system via input data lines 508. The description of configuration 1502 is the same as configuration 1102, except that there is no internal laser in input device 104. Input data lines 508 may or may not be directly coupled to the light receiving elements or light receiving array (not shown) of input device 104, there may be fewer than one fiber or waveguide coupled to input device 104, or there may be more than one fiber or waveguide per light receiving element in the light receiving array of input device 104, and there may be any number of light receiving elements in the light receiving array of input device 104. All other descriptions of devices and variations for configuration 1102 apply to configuration 1502. Any of the devices may preferably be of the type described with reference to FIGS. 56-59.

[0092] Any variations of any configuration of any system or device can be combined to form additional variations of the configurations and / or systems. Furthermore, any number of any variations, configurations, systems, or devices can be interconnected to form more complex variations, configurations, or systems. The described systems and system configurations can be constructed using electrically separate components and devices and separate optical systems, such as those traditionally constructed on an optical workbench. However, the systems and system configurations may also be constructed using methods that allow interconnection between some or all electrical and / or optical components using electrical, optical, or electro-optical transport devices with functionality similar to that of a printed circuit board providing electrical interconnection for packaged electrical components and devices, including printed circuit boards supporting optical interconnection and / or transport chips, hereafter referred to as transport chips. Such interconnected components may be on the same transport chip with their free-space receiving and emitting surfaces parallel to their electro-optical surfaces, perpendicular to their electro-optical surfaces, or in some other orientation. In all cases, the optical components will compensate for the orientation of the various components and devices through the use of mirrors, beam splitters, and / or other optical components. Some examples of system configurations constructed using this transfer-chip method are provided in Figures 16a-19b, 21a-23b, 26a-29b, 31a-33b, 36a-39b, and 41a-43b. Furthermore, systems and system configurations may be constructed using the same fabrication process, such as e-beam or optical lithography microfabrication on the same wafer, thereby creating a single chip with one or more components that are then optically connected using optical components such as lenses, mirrors, and beam splitters. Some examples of system configurations in which components and devices are fabricated as a single chip are provided in Figures 20a-20b, 30a-30b, and 40a-40b. Furthermore, with advanced die stacking or three-dimensional (3D) microfabrication techniques, systems and system configurations can be fabricated in their entirety, including the optics, into a single solid 3D chip or device.Some examples of system configurations where the entire system configuration is fabricated as a single 3D chip are provided in Figures 24a-25b, 34a-35b, and 44a-45b. Potential implementations of systems and system configurations are not limited to the various structures described herein.

[0093] 16a and 16b show a structure 1602 of configuration 502 (FIG. 5) in which all devices and their light-receiving and light-emitting surfaces are oriented parallel to the top surface of the carrier chip 1604. All components and devices of configuration 502 are incorporated into structure 1602. Similarly, the description of configuration 502 applies to structure 1602, except for additional details and components described below. The carrier chip 1604 provides electrical and / or optical interconnections between itself and the input device 104, the filter device 304, the input device 404, and / or the output device 106, and the carrier chip 1604 may provide a printed circuit board, an integrated chip, a chip carrier, an interposer, or any other electrical and / or optical interconnection platform. The lasers 504 and 514 may be mounted, bonded, attached, incorporated, or fabricated within or on the carrier chip 1604. Light guide 506, light guide 516, and / or optional light guide 526 may be waveguides on or within carrier chip 1604. Input data, filter data, output data, and control data (not shown) for all devices connected to and / or including carrier chip 1604 is transmitted to carrier chip 1604 via carrier chip data lines 1608 and carrier chip control lines 1610, which may be electrical wiring (including but not limited to pin grid arrays, ball grid arrays, or other chip carriers), optical fibers, waveguides, and / or any other data or energy propagation medium, whose terminals, connectors, and / or connection surfaces may be located on one or more faces and / or edges of carrier chip 1604. The electro-optical network 1674 can carry electrical and / or optical signals throughout the transport chip 1604 and between the transport chip data lines 1608, the transport chip control lines 1610, and / or between the input devices 104, the filter devices 304, the input devices 404, and / or the output devices 106, and the electro-optical network 1674 can include electrical wiring, optical fibers, waveguides, and / or any other data and / or energy propagation medium.

[0094] The input device 104 is connected to the transport chip 1604 at an electrical and / or optical contact surface 1662, which is a physical interface between the input device 104 and the transport chip 1604 and may provide power, electrical data, optical data, and / or control data from the transport chip 1604 to the input device 104. Input and control data (not shown) may be provided to the input device 104 via the contact surface 1662 via input data lines 508 and input control lines 510 that are connected to an electro-optical network 1674.

[0095] Similarly, the input device 404 is connected to the transport chip 1604 at an electrical and / or optical interface (not shown), which is a physical interface between the input device 404 and the transport chip 1604 and may provide power, electrical data, optical data, and / or control data from the transport chip 1604 to the input device 404. The input and control data (not shown) may be provided to the input device 404 via input data lines 518 ( FIG. 5 ) and input control lines 520 ( FIG. 5 ) that are connected to the electro-optical network 1674, and via the interface (not shown) with the transport chip 1604.

[0096] The filter device 304 is connected to the delivery chip 1604 at electrical and / or optical contact 1664, which is a physical interface between the filter device 304 and the delivery chip 1604 and may provide power, electrical data, optical data, and / or control data from the delivery chip 1604 to the filter device 304. Filter and control data (not shown) may be provided to the filter device 304 by the contact 1664 via filter data lines 538 and filter control lines 540, which are connected to an electro-optical network 1674.

[0097] The output device 106 is connected to the transport chip 1604 at electrical and / or optical contact surface 1666, which is a physical interface between the output device 106 and the transport chip 1604 and may provide power, electrical data, optical data, and / or control data from the transport chip 1604 to the output device 106. Output data (not shown) may be received by contact surface 1662 from the output device 106 via output data lines 528, and control data (not shown) may be received by contact surface 1662 from the output device 106 via output control lines 530. Both output data lines 528 and output control lines 530 are connected to an electro-optical network 1674. The transport chip 1604 may perform any pre- or post-processing of the data transmitted over the electro-optical network 1674, including, but not limited to, modulation of light transmitted by optical waveguides and / or mathematical operations on electrical signals transmitted by wires in the electro-optical network 1674.

[0098] Propagation and / or modulation of light within input device 104 as described for configuration 502 and its variations occurs within waveguide network 706. Input data (not shown) may be received by input device 104 via optional light-receiving surface 1612 and / or via contact surface 1662. Optional light-receiving surface 1612 is comprised of an array of optical waveguides coupled to waveguide network 706, arranged in any of the configurations and / or variations described for the waveguide array of device 5604 (FIGS. 56-58). Similarly, input device 104 includes an emitting surface 1616 that emits light propagated by and / or modulated within waveguide network 706 into free space 108, where emitting surface 1616 is comprised of an array of optical waveguides coupled to waveguide network 706, arranged in any of the configurations and / or variations described for the waveguide array of device 5604 (FIGS. 56-58).

[0099] Similarly, propagation and / or modulation of light within input device 404 as described for configuration 502 and its variations occurs within waveguide network 1216. Input data (not shown) may be received by input device 404 via optional light-receiving surface 1622 and / or via its interface with carrier tip 1604 (not shown). Optional light-receiving surface 1622 is comprised of an array of optical waveguides coupled to waveguide network 1216 and arranged in any of the configurations and / or variations described for the waveguide array of device 5604 (FIGS. 56-58). Similarly, input device 404 includes an emitting surface 1626 that emits light propagated by and / or modulated within waveguide network 1216 into free space 408, where emitting surface 1626 is comprised of an array of optical waveguides coupled to waveguide network 1216 and arranged in any of the configurations and / or variations described for the waveguide array of device 5604 (Figures 56-58).

[0100] Propagation and / or modulation of light within filter device 304 as described for configuration 502 and its variations occurs within waveguide network 1634. Filter data (not shown) may be received by filter device 304 from free space 108 via receiving surface 1632, from free space 408 via receiving surface 1642, and / or via contact surface 1664. Receiving surface 1632 and receiving surface 1642 each comprise an array of optical waveguides coupled to waveguide network 1634, arranged in any of the configurations and / or variations described for the waveguide array of device 5604 (FIGS. 56-58), and both arrays may include different numbers of receiving waveguide elements. Similarly, filter device 304 includes an emission surface 1636 that emits light propagated by and / or modulated within waveguide network 1634 into free space 308, where emission surface 1636 is comprised of an array of optical waveguides coupled to waveguide network 1634 and arranged in any of the configurations and / or variations described for the waveguide array of device 5604 (Figures 56-58).

[0101] The propagation, modulation, and / or detection of light in output device 106 as described for configuration 502 and its variations occurs within waveguide network 1654. Output data (not shown) may be received by output device 106 via light receiving surface 1652. Light receiving surface 1652 may be comprised of an array of optical waveguides coupled to waveguide network 1654, arranged in any of the configurations and / or variations described for the waveguide array of device 5604 (FIGS. 56-58). Similarly, output device 106 may include an optional emitting surface 1656 that emits light propagated by and / or modulated within waveguide network 1654. Emitting surface 1656 may be comprised of an array of optical waveguides coupled to waveguide network 1654, arranged in any of the configurations and / or variations described for the waveguide array of device 5604 (FIGS. 56-58).

[0102] In one variation of structure 1602, input device 104 has an optional light receiving surface 1612 whose light receiving array is coupled to an off-device waveguide or array of waveguides (not shown) that provides input data, such as from another optical system, and light receiving surface 1612 may have any number of waveguides in its light receiving array. In a second variation of structure 1602, input device 104 has an optional light receiving surface 1612 whose light receiving array is coupled to an off-device fiber or array of fibers (not shown) that provides input data, such as from another optical system, and light receiving surface 1612 may have any number of waveguides in its light receiving array. In a third variation of structure 1602, input device 104 has an optional light receiving surface 1612 whose light receiving array is coupled to free space (not shown) that provides input data, such as from another optical system, and light receiving surface 1612 may have any number of waveguides in its light receiving array.

[0103] In a fourth variation of structure 1602, input device 104 has an optional light-receiving surface 1612 as described in the first, second, and / or third variations of structure 1602, and input data for input device 104 is received solely via light-receiving surface 1612. In a fifth variation of structure 1602, input device 104 has an optional light-receiving surface 1612 as described in the first, second, and / or third variations of structure 1602, and input data for input device 104 is received solely via light-receiving surface 1612 and / or input data lines 508. In a sixth variation of structure 1602, input device 104 does not have optional light-receiving surface 1612, and input data is provided solely via input data lines 508 from carrier tip 1604.

[0104] In a seventh variation of structure 1602, input device 404 has an optional light receiving surface 1622 whose light receiving array is coupled to an off-device waveguide or array of waveguides (not shown) that provides input data from, e.g., another optical system, and light receiving surface 1622 may have any number of waveguides in its light receiving array. In an eighth variation of structure 1602, input device 404 has an optional light receiving surface 1622 whose light receiving array is coupled to an off-device fiber or array of fibers (not shown) that provides input data from, e.g., another optical system, and light receiving surface 1622 may have any number of waveguides in its light receiving array. In a ninth variation of structure 1602, input device 404 has an optional light receiving surface 1622 whose light receiving array is coupled to free space (not shown) that provides input data from, e.g., another optical system, and light receiving surface 1622 may have any number of waveguides in its light receiving array.

[0105] In a tenth variation of structure 1602, input device 404 has an optional light-receiving surface 1622 as described in the seventh, eighth, and / or ninth variations of structure 1602, and input data for input device 404 is received only via light-receiving surface 1622. In an eleventh variation of structure 1602, input device 404 has an optional light-receiving surface 1622 as described in the seventh, eighth, and / or ninth variations of structure 1602, and input data for input device 404 is received only via light-receiving surface 1622 and / or input data lines 518 ( FIG. 5 ). In a twelfth variation of structure 1602, input device 404 does not have optional light-receiving surface 1622, and input data is provided only via input data lines 518 ( FIG. 5 ) from carrier tip 1604.

[0106] In a thirteenth variation of structure 1602, output device 106 has an optional emitting surface 1656 whose emitting array is coupled to an off-device waveguide or array of waveguides (not shown) that provides output data to other optical systems, etc., and emitting surface 1656 may have any number of waveguides in its emitting array. In a fourteenth variation of structure 1602, output device 106 has an optional emitting surface 1656 whose emitting array is coupled to an off-device fiber or array of fibers (not shown) that provides output data to other optical systems, etc., and emitting surface 1656 may have any number of waveguides in its emitting array. In a fifteenth variation of structure 1602, output device 106 has an optional emitting surface 1656 whose emitting array is coupled to free space (not shown) that provides output data to other optical systems, etc., and emitting surface 1656 may have any number of waveguides in its emitting array.

[0107] In a sixteenth variation of structure 1602, output device 106 has optional emitting surface 1656 as described in the thirteenth, fourteenth, and / or fifteenth variations of structure 1602, and input data for output device 106 is received only via emitting surface 1656. In a seventeenth variation of structure 1602, output device 106 has optional emitting surface 1656 as described in the thirteenth, fourteenth, and / or fifteenth variations of structure 1602, and output data for output device 106 is transmitted via emitting surface 1656 and / or output data line 528. In an eighteenth variation of structure 1602, output device 106 does not have optional emitting surface 1656, and output data is transmitted only via output data line 528 to transport tip 1604.

[0108] In a 19th variation of structure 1602, which may be combined with any of variations 1-18 of structure 1602 or any other variation, the basic configuration is configuration 602 (FIG. 6) with only one laser source, external laser 504, with light guide 516 and optional reference light guide 526 branching off from light guide 506. In a 20th variation of structure 1602, which may be combined with any of variations 1-18 of structure 1602 or any other variation, the basic configuration is configuration 702 (FIG. 7) with only one laser source, internal laser 704 coupled to waveguide network 706, with light guide 516 and optional reference light guide 526 coupled to waveguide network 706 via waveguide coupler 708. In a 21st variation of structure 1602, which may be combined with any of variations 1-18 of structure 1602 or any other variation, the basic configuration is configuration 1202 ( FIG. 12 ) with two laser sources: internal laser 704 coupled to waveguide network 706 and internal laser 1214 coupled to waveguide network 1216, with optional reference light guide 526 coupled to waveguide network 706 via waveguide coupler 708. In a 22nd variation of structure 1602, which may be combined with any of variations 1-18 of structure 1602 or any other variation, the basic configuration is configuration 1302 ( FIG. 13 ) without an on-configuration laser source, with optional reference light guide 526 coupled to waveguide network 706 via waveguide coupler 708. Any variation of structure 1602 may be combined to form a new variation of structure 1602.

[0109] 17a and 17b show structure 1702 of configuration 502 (FIG. 5) in which all device receiving and emitting surfaces are oriented perpendicular to the top surface of delivery chip 1604. The description and variations of structure 1702 are the same as the description and variations of structure 1602, except that the input, filter, and output devices are split across multiple smaller device chips.

[0110] The input device 104 is comprised of a base control chip 1714, an optional light-receiving chip 1712, and an emitting chip 1716. The base control chip 1714 includes the waveguide 706 and interfaces with the transport chip 1604 via contact surface 1662. The optional light-receiving chip 1712 includes the optional light-receiving surface 1612 and interfaces with the base control chip 1714 via contact surface 1762, which provides an electro-optical interconnection between the optional light-receiving chip 1712 and the base control chip 1714. Similarly, the emitting chip 1716 includes the emitting surface 1616 and interfaces with the base control chip 1714 via contact surface 1764, which provides an electro-optical interconnection between the emitting chip 1716 and the base control chip 1714.

[0111] Similarly, input device 404 is comprised of a base control chip 1724, an optional light-receiving chip 1722, and an emitting chip 1726. Base control chip 1724 includes waveguides 1216 and interfaces with transport chip 1604 via electro-optical contacts (not shown). Optional light-receiving chip 1722 includes optional light-receiving surface 1622 and interfaces with base control chip 1724 via contacts (not shown) that provide electro-optical interconnection between optional light-receiving chip 1722 and base control chip 1714. Similarly, emitting chip 1726 includes emitting surface 1626 and interfaces with base control chip 1724 via contacts (not shown) that provide electro-optical interconnection between emitting chip 1726 and base control chip 1724.

[0112] Filter device 304 is comprised of a base control chip 1734, a receiver chip 1732, a receiver chip 1742, and an emitter chip 1736. Base control chip 1734 includes waveguides 1634 and interfaces with transmitter chip 1604 via contact surface 1664. Receiver chip 1732 includes receiver surface 1632 and interfaces with base control chip 1734 via contact surface 1772, which provides an electro-optical interconnection between receiver chip 1732 and base control chip 1734. Similarly, receiver chip 1742 includes receiver surface 1642 and interfaces with base control chip 1734 via contact surface 1776, which provides an electro-optical interconnection between receiver chip 1742 and base control chip 1734. The emitting chip 1736 includes the emitting surface 1636 and interfaces with the base control chip 1734 via a contact surface 1774 , which provides an electrical and optical interconnection between the emitting chip 1736 and the base control chip 1734 .

[0113] The output device 106 is comprised of a base control chip 1754, a light receiving chip 1752, and an optional light emitting chip 1756. The base control chip 1754 includes a waveguide 1654 and interfaces with the transport chip 1604 via a contact surface 1666. The light receiving chip 1752 includes a light receiving surface 1652 and interfaces with the base control chip 1754 via a contact surface 1782, which provides an electro-optical interconnection between the light receiving chip 1752 and the base control chip 1754. Similarly, the optional light emitting chip 1756 includes an optional light emitting surface 1656 and interfaces with the base control chip 1754 via a contact surface 1784, which provides an electro-optical interconnection between the optional light emitting chip 1756 and the base control chip 1754.

[0114] All variations of structure 1602 apply to structure 1702, with the following exceptions: Any variation of structure 1702 with optional light-receiving surface 1612 also has optional light-receiving chip 1712, and any variation without optional light-receiving surface 1612 does not have optional light-receiving chip 1712. Similarly, any variation of structure 1702 with optional light-receiving surface 1622 also has optional light-receiving chip 1722, and any variation without optional light-receiving surface 1622 does not have optional light-receiving chip 1722. Finally, any variation of structure 1702 with optional emitting surface 1656 also has optional emitting chip 1756, and any variation without optional emitting surface 1656 does not have optional emitting chip 1756. Any variations of structure 1702 may be combined to form new variations of structure 1702.

[0115] 18a and 18b show structure 1802 of configuration 502 (FIG. 5) in which all device light receiving and emitting surfaces are oriented perpendicular to the top surface of carrier chip 1604 and portions of each input device, filter device, and output device are integrated into carrier chip 1604. The description and variations of structure 1802 are the same as the description and variations of structure 1702, except that the components and functions of the control chip according to structure 1702 are integrated into carrier chip 1604 for structure 1802.

[0116] For input device 104, the components and functions of control chip 1714, including portions of waveguide 706, are integrated into transport chip 1604, thereby eliminating contact surface 1662. Optional receiver chip 1712 interfaces with transport chip 1604 via contact surface 1762, which provides electro-optical interconnection between optional receiver chip 1712, transport chip 1604, and waveguide network 706. Similarly, emitter chip 1716 interfaces with transport chip 1604 via contact surface 1764, which provides electro-optical interconnection between emitter chip 1716, transport chip 1604, and waveguide network 706.

[0117] Similarly, for input device 404, the components and functionality of control chip 1724, including portions of waveguide 1216, are integrated into transport chip 1604. Optional receiver chip 1722 interfaces with transport chip 1604 via electro-optical contacts (not shown) that provide electro-optical interconnections between optional receiver chip 1722, transport chip 1604, and waveguide network 1216. Similarly, emitter chip 1726 interfaces with transport chip 1604 via electro-optical contacts (not shown) that provide electro-optical interconnections between emitter chip 1726, transport chip 1604, and waveguide network 1216.

[0118] For filter device 304, the components and functions of control chip 1734, including portions of waveguide 1634, are integrated into transport chip 1604, thereby eliminating contact surface 1664. Receiver chip 1732 interfaces with transport chip 1604 via contact surface 1772, which provides electro-optical interconnections between receiver chip 1732, transport chip 1604, and waveguide network 1634. Similarly, receiver chip 1742 interfaces with transport chip 1604 via contact surface 1776, which provides electro-optical interconnections between receiver chip 1742, transport chip 1604, and waveguide network 1634. Emitting chip 1736 interfaces with transport chip 1604 via contact surface 1774, which provides electro-optical interconnections between emitter chip 1736, transport chip 1604, and waveguide network 1634.

[0119] For output device 106, the components and functions of control chip 1754, including portions of waveguide 1654, are integrated into transport chip 1604, thereby eliminating contact surface 1666. Receiver chip 1752 interfaces with transport chip 1604 via contact surface 1782, which provides electro-optical interconnection between receiver chip 1752, transport chip 1604, and waveguide network 1654. Similarly, optional emitter chip 1756 interfaces with transport chip 1604 via contact surface 1784, which provides electro-optical interconnection between optional emitter chip 1756, transport chip 1604, and waveguide network 1654.

[0120] All variations of structure 1702 apply to structure 1802. Any variations of structure 1802 can be combined to form new variations of structure 1802.

[0121] 19a and 19b show structure 1902 of configuration 502 (FIG. 5) in which portions of each input device, filter device, and output device are integrated into transport chip 1604 with all device receiving and emitting surfaces oriented parallel to the top surface of transport chip 1604. Descriptions and variations of structure 1902 are the same as descriptions and variations of structure 1802, except that optional receiving chip 1712, emitting chip 1716, optional receiving chip 1722, emitting chip 1726, receiving chip 1732, emitting chip 1736, receiving chip 1742, receiving chip 1752, and optional emitting chip 1756 are oriented parallel to the top surface of transport chip 1604 with all device receiving and emitting surfaces oriented parallel to the top surface of transport chip 1604. Structure 1902 is similar to structure 1602, except that portions of input device 104, input device 404, filter device 304, and output device 106 are integrated into transport chip 1604. All variations of structure 1802 apply to structure 1902. Any variations of structure 1902 can be combined to form new variations of structure 1902.

[0122] 20a and 20b show structure 2002 of configuration 502 (FIG. 5) in which all input, filter, and output devices are integrated into the carrier chip 1604 with all device receiving and emitting surfaces oriented parallel to the top surface of the carrier chip 1604. The description and variations of structure 2002 are the same as those of structure 1902, except that all components of input device 104, input device 404, filter device 304, and output device 106 are mounted, bonded, attached, integrated, embedded, or fabricated within the carrier chip 1604, eliminating optional receiving chip 1712, emitting chip 1716, optional receiving chip 1722, emitting chip 1726, receiving chip 1732, emitting chip 1736, receiving chip 1742, receiving chip 1752, and optional emitting chip 1756. All variations of structure 1602 apply to structure 2002. Any of the variations of structure 2002 can be combined into new variations of structure 2002.

[0123] 21a and 21b show structure 2102 of configuration 502 (FIG. 5) in which all device light receiving and emitting surfaces are oriented perpendicular to the top surface of the transport chip 1604. The description and variations of structure 2102 are the same as those of structure 1602, except that the input device 104, input device 404, filter device 304, and output device 106 are interfaced with the transport chip 1604 such that the optional light receiving surface 1612, emitting surface 1616, optional light receiving surface 1622, emitting surface 1626, light receiving surface 1632, emitting surface 1636, light receiving surface 1642, light receiving surface 1652, and optional emitting surface 1656 are oriented perpendicular to the top surface of the transport chip 1604. All variations of structure 1602 apply to structure 2102. Any variations of structure 2102 can be combined to form new variations of structure 2102.

[0124] 22a and 22b show structure 2202 of configuration 502 (FIG. 5) in which all input, filter, and output devices are constructed from multi-layer chips with all device light receiving and emitting surfaces oriented perpendicular to the top surface of carrier chip 1604. The description and variations of structure 2202 are the same as the description and variations of structure 2102, except that input device 104, input device 404, filter device 304, and output device 106 are constructed from multiple chips stacked parallel to the top surface of carrier chip 1604.

[0125] The input device 104 is comprised of a chip stack 2212 that includes an optional light receiving surface 1612, a waveguide network 706, and an emitting surface 1616. Each chip in the chip stack 2212 is comprised of an optional light receiving array (not shown) of one or more rows of light receiving surfaces 1612, an emitting array (not shown) of one or more rows of emitting surfaces 1616, and the necessary electro-optical components and / or parts of the waveguide network 706 that provide the required functionality for the input device 104 for the portion of the optional light receiving surface 1612 and emitting surface 1616 in each chip and interconnect with adjacent chips via contact surfaces 2262 between each chip in the chip stack 2212. There are as many chips in the chip stack 2212 as necessary to construct the optional light receiving surface 1612 and emitting surface 1616 for the required dimensions of the input device 104. The chip stack 2212 interfaces with the carrier chip 1604 via the contact surface 1662 as described for the input device 104 of the structure 1604 and its variations.

[0126] Similarly, input device 404 is comprised of a chip stack 2222 that includes an optional light receiving surface 1622, a waveguide network 1216, and an emitting surface 1626. Each chip in chip stack 2222 is comprised of an optional light receiving array (not shown) of one or more rows of light receiving surfaces 1622, an emitting array (not shown) of one or more rows of emitting surfaces 1626, and the necessary electro-optical components and / or parts of waveguide network 1216 that provide the required functionality for input device 404 for the portion of optional light receiving surface 1622 and emitting surface 1626 in each chip and interconnect with adjacent chips via electro-optical contacts (not shown) between each chip in chip stack 2222. There are as many chips in chip stack 2222 as necessary to construct optional light receiving surface 1622 and emitting surface 1626 for the required dimensions of input device 404. Chip stack 2222 interfaces with transport chip 1604 via an electro-optical contact surface (not shown) as described for structure 1604 and its variant input device 404 .

[0127] Filter device 304 is comprised of a chip stack 2232 that includes a light receiving surface 1632, a light receiving surface 1642, a waveguide network 1634, and an emitting surface 1636. Each chip in chip stack 2232 is comprised of one or more rows of light receiving arrays (not shown) on light receiving surface 1632, one or more rows of light receiving arrays (not shown) on light receiving surface 1642, one or more rows of emitting arrays (not shown) on emitting surface 1636, and the necessary electro-optical components and / or parts of waveguide network 1634 that provide the functionality required for filter device 304 for the portions of light receiving surface 1632, light receiving surface 1642, and emitting surface 1636 within each chip and interconnect with adjacent chips via contact surfaces 2264 between each chip in chip stack 2232. Chip stack 2232 has the number of chips necessary to construct light receiving surface 1632, light receiving surface 1642, and light emitting surface 1636 for the dimensions required for filter device 304. Chip stack 2212 interfaces with delivery chip 1604 via contact surface 1664 as described for structure 1604 and its variant filter device 304.

[0128] The output device 106 is comprised of a chip stack 2252 that includes a light receiving surface 1652, a waveguide network 1654, and an optional emitting surface 1656. Each chip in the chip stack 2252 is comprised of one or more rows of a light receiving array (not shown) of light receiving surfaces 1652, an optional row of an emitting array (not shown) of emitting surfaces 1656, and the necessary electro-optical components and / or parts of the waveguide network 1654 that provide the required functionality for the output device 106 for the portion of the light receiving surface 1652 and optional emitting surface 1656 in each chip and interconnect with adjacent chips via contact surfaces 2266 between each chip in the chip stack 2252. There are as many chips in the chip stack 2252 as necessary to construct the light receiving surface 1652 and optional emitting surface 1656 for the required size of the output device 106. The chip stack 2252 interfaces with the transport chip 1604 via the contact surface 1666 as described for the output device 106 of the structure 1604 and its variations.

[0129] All variations of structure 2102 apply to structure 2202. Any variations of structure 2202 can be combined to form new variations of structure 2202.

[0130] 23a and 23b show structure 2302 of configuration 502 (FIG. 5) in which all input, filter, and output devices are composed of multiple chips stacked vertically on the top surface of transport chip 1604, with all device light receiving and emitting surfaces oriented perpendicular to the top surface of transport chip 1604. The description and variations of structure 2302 are the same as those of structure 2102, except that input device 104, input device 404, filter device 304, and output device 106 are composed of multiple chips stacked vertically on the top surface of transport chip 1604. Furthermore, filter device 304 of structure 2302 does not have light receiving surface 1642 and also includes additional sub-device components 2338 designed to mix and / or modulate light received from free space 108 and free space 408 at contact surface 2342 of chip stack 2232 for transmission to light receiving surface 1632. The sub-device component 2338 may be a beam splitter, a waveguide device, a composite stack of waveguide devices or components, or a waveguide system including, but not limited to, any of the aforementioned devices, systems and / or variations thereof.

[0131] The input device 104 is comprised of a chip stack 2212 that includes an optional light receiving surface 1612, a waveguide network 706, and an emitting surface 1616. Each chip in the chip stack 2212 is comprised of an optional light receiving array (not shown) of one or more rows of light receiving surfaces 1612, an emitting array (not shown) of one or more rows of emitting surfaces 1616, and the necessary electro-optical components and / or parts of the waveguide network 706 that provide the required functionality for the input device 104 for the portion of the optional light receiving surface 1612 and emitting surface 1616 in each chip and interconnect with adjacent chips via contact surfaces 2262 between each chip in the chip stack 2212. There are as many chips in the chip stack 2212 as necessary to construct the optional light receiving surface 1612 and emitting surface 1616 for the required dimensions of the input device 104. The chip stack 2212 interfaces with the carrier chip 1604 via the contact surface 1662 as described for the input device 104 of the structure 1604 and its variations.

[0132] Similarly, input device 404 is comprised of a chip stack 2222 that includes optional light receiving surfaces 1622, waveguide network 1216, and emitting surfaces 1626. Each chip in chip stack 2222 is comprised of an optional light receiving array (not shown) of light receiving surfaces 1622, one or more rows of emitting array (not shown) of emitting surfaces 1626, and the necessary electro-optical components and / or parts of waveguide network 1216 that provide the required functionality for input device 404 for the portions of optional light receiving surface 1622 and emitting surface 1626 in each chip and interconnect with adjacent chips via electro-optical contacts (not shown) between each chip in chip stack 2222. There are as many chips in chip stack 2222 as necessary to construct optional light receiving surface 1622 and emitting surface 1626 for the required dimensions of input device 404. Chip stack 2222 interfaces with transport chip 1604 via an electro-optical contact surface (not shown) as described for structure 1604 and its variant input device 404 .

[0133] The filter device 304 is comprised of a chip stack 2232 that includes a light receiving surface 1632, a waveguide network 1634, and an emitting surface 1636. Each chip in the chip stack 2232 comprises one or more light receiving arrays (not shown) of the light receiving surface 1632, one or more emitting arrays (not shown) of the emitting surface 1636, and the necessary electro-optical components and / or parts of the waveguide network 1634 that provide the required functionality of the filter device 304 for the portion of the light receiving surface 1632 and the emitting surface 1636 in each chip and interconnect with adjacent chips via contact surfaces 2264 between each chip in the chip stack 2232. The chip stack 2232 contains the number of chips necessary to construct the light receiving surface 1632 and the emitting surface 1636 for the required dimensions of the filter device 304. Chip stack 2212 interfaces with delivery chip 1604 via contact surface 1664 as described for structure 1604 and its variant filter device 304 .

[0134] The output device 106 is comprised of a chip stack 2252 that includes a light receiving surface 1652, a waveguide network 1654, and an optional emitting surface 1656. Each chip in the chip stack 2252 is comprised of one or more light receiving arrays (not shown) of light receiving surfaces 1652, one or more optional emitting arrays (not shown) of emitting surfaces 1656, and the necessary electro-optical components and / or parts of the waveguide network 1654 that provide the required functionality of the output device 106 for the portion of the light receiving surface 1652 and optional emitting surface 1656 in each chip and interconnect with adjacent chips via contact surfaces 2266 between each chip in the chip stack 2252. There are as many chips in the chip stack 2252 as necessary to construct the light receiving surface 1652 and optional emitting surface 1656 for the required dimensions of the output device 106. The chip stack 2252 interfaces with the transport chip 1604 via the contact surface 1666 as described for the output device 106 of the structure 1604 and its variations.

[0135] All variations of structure 2102 apply to structure 2302. Any variations of structure 2302 can be combined to form new variations of structure 2302.

[0136] 24a and 24b show structure 2402 of configuration 502 (FIG. 5) in which all input devices, filter devices, output devices and free space regions are integrated into carrier chip 1604 with all device light receiving and emitting surfaces oriented parallel to the top surface of carrier chip 1604. Descriptions and variations of structure 2402 are the same as descriptions and variations of structure 2002, except that all components of free space 108, free space 308, free space 408, optional free space 2408, optional free space 2418 and optional free space 2458 are mounted, bonded, attached, integrated, embedded or fabricated within carrier chip 1604. Optional free space 2408, optional free space 2418, and / or optional free space 2458 are regions of air or other gas (such as nitrogen), liquid (such as index-matching fluid), solid (such as index-matching glass), or vacuum, and contain zero or more lenses, beam splitters, polarizers, wave guides, waveguides, fibers, microlens arrays, or other optical components. Optional free space 2408 provides optical connection between optional light-receiving surface 1612 and the surface of transport chip 1604, allowing interconnection of input device 104 with other devices, configurations, structures, and / or variations thereof. All optical elements within free space 2408 share a common optical axis with optional light-receiving surface 1612. Similarly, optional free space 2418 provides optical connection between optional light receiving surface 1622 and the face of transport chip 1604, allowing interconnection of input device 404 with other devices, configurations, structures, and / or variations thereof. All optical elements within free space 2418 share a common optical axis with optional light receiving surface 1622. Optional free space 2458 provides optical connection between optional emitting surface 1656 and the face of transport chip 1604, allowing interconnection of output device 106 with other devices, configurations, structures, and / or variations thereof. All optical elements within free space 2458 share a common optical axis with optional emitting surface 1656. All variations of structure 2002 apply to structure 2402. Any variations of structure 2402 can be combined to form new variations of structure 2402.

[0137] 25a and 25b show structure 2502 of configuration 502 (FIG. 5) in which all input devices, filter devices, output devices and free space regions are integrated into the carrier chip 1604 with all device receiving and emitting surfaces oriented perpendicular to the top surface of the carrier chip 1604. The description and variations of structure 2502 are the same as the description and variations of structure 2102, except that all components of input device 104, input device 404, filter device 304, output device 106, free space 108, free space 308 and free space 408 are mounted, bonded, attached, integrated, embedded or fabricated within the carrier chip 1604, thereby eliminating contact surface 1662, contact surface 1664 and contact surface 1666. Optional light receiving surface 1612, optional light receiving surface 1622, and optional emitting surface 1656 are located on the sides of delivery chip 1604 so that they may optionally interconnect with other devices, configurations, structures, and / or variations thereof via free space regions, waveguides, fibers, microlens arrays, or other light delivery media (not shown). All variations of structure 2102 apply to structure 2502. Any variations of structure 2502 may be combined to form new variations of structure 2502.

[0138] 26a and 26b show structure 2602 of configuration 802 (FIG. 8) in which all devices and their light-receiving and light-emitting surfaces are oriented parallel to the top surface of carrier chip 1604. All components and devices of configuration 802 are incorporated into structure 2602. Similarly, the description of configuration 802 applies to structure 2602, except for additional details and components described below. Carrier chip 1604 provides electrical and / or optical interconnections between itself and input devices 104, filter devices 304, and / or output devices 106, and may provide a printed circuit board, integrated chip, chip carrier, interposer, or any other electrical and / or optical interconnection platform. Laser 504 may be mounted, bonded, attached, embedded, or fabricated within or on carrier chip 1604. Light guide 506 and / or optional light guide 526 may be a waveguide on or within carrier chip 1604. Input data, filter data, output data, and control data (not shown) for all devices connected to and / or including carrier chip 1604 may be transmitted to carrier chip 1604 via carrier chip data lines 1608 and carrier chip control lines 1610, which may be electrical wiring (including but not limited to pin grid arrays, ball grid arrays, or other chip carriers), optical fibers, waveguides, and / or any other data carrying or energy propagation medium, whose terminals, connectors, and / or connection surfaces may be located on one or more faces and / or edges of carrier chip 1604. The electro-optical network 1674 can carry electrical and / or optical signals throughout the transport chip 1604 and between the transport chip data lines 1608, the transport chip control lines 1610, and / or between the input devices 104, the filter devices 304, and / or the output devices 106, and the electro-optical network 1674 can include electrical wiring, optical fibers, waveguides, and / or any other data and / or energy propagation medium.

[0139] The input device 104 is connected to the delivery chip 1604 at electrical and / or optical contact surface 1662, which is a physical interface between the input device 104 and the delivery chip 1604 and may provide power, electrical data, optical data, and / or control data from the delivery chip 1604 to the input device 104. Input and control data (not shown) may be provided to the input device 104 via the contact surface 1662 via input data lines 508 and input control lines 510, which are connected to an electro-optical network 1674. The filter device 304 is connected to the delivery chip 1604 at electrical and / or optical contact surface 1664, which is a physical interface between the filter device 304 and the delivery chip 1604 and may provide power, electrical data, optical data, and / or control data from the delivery chip 1604 to the filter device 304. Filter and control data (not shown) may be provided to the filter device 304 via filter data lines 538 and filter control lines 540, which are connected to an electro-optical network 1674, via contact surface 1664. The output device 106 is connected to the transport chip 1604 at electrical and / or optical contact surface 1666, which is a physical interface between the output device 106 and the transport chip 1604 and may provide power, electrical data, optical data, and / or control data from the transport chip 1604 to the output device 106. Output data (not shown) may be received from the output device 106 via output data lines 528 via contact surface 1662, and control data (not shown) may be sent to or received from the output device 106 via output control lines 530 via contact surface 1662. Both output data lines 528 and output control lines 530 are connected to the electro-optical network 1674. The transport chip 1604 may perform pre- or post-processing of any data transmitted over the electro-optical network 1674, including, but not limited to, modulation of light carried by optical waveguides and / or mathematical operations on electrical signals carried by wires in the electro-optical network 1674.

[0140] Propagation and / or modulation of light within input device 104 as described for configuration 802 and its variations occurs within waveguide network 706. Input data (not shown) may be received by input device 104 via optional light-receiving surface 1612 and / or via contact surface 1662. Optional light-receiving surface 1612 is comprised of an array of optical waveguides coupled to waveguide network 706, arranged in any of the configurations and / or variations described for the waveguide array of device 5604 (FIGS. 56-58). Similarly, input device 104 includes an emitting surface 1616 that emits light propagated by and / or modulated within waveguide network 706 into free space 108, where emitting surface 1616 is comprised of an array of optical waveguides coupled to waveguide network 706, arranged in any of the configurations and / or variations described for the waveguide array of device 5604 (FIGS. 56-58).

[0141] Propagation and / or modulation of light within filter device 304 as described for configuration 802 and its variations occurs within waveguide network 1634. Filter data (not shown) may be received by filter device 304 via receiving surface 1632 and / or from free space 108 via contact surface 1664. Receiving surface 1632 is comprised of an array of optical waveguides coupled to waveguide network 1634, which may be arranged in any of the configurations and / or variations described for the waveguide array of device 5604 (FIGS. 56-58) and may include different numbers of receiving waveguide elements. Similarly, filter device 304 includes an emitting surface 1636 that emits light propagated by and / or modulated within waveguide network 1634 into free space 308, where emitting surface 1636 is comprised of an array of optical waveguides coupled to waveguide network 1634 and arranged in any of the configurations and / or variations described for the waveguide array of device 5604 (Figures 56-58).

[0142] The propagation, modulation, and / or detection of light in output device 106 as described for configuration 802 and its variations occurs within waveguide network 1654. Output data (not shown) may be received by output device 106 via light receiving surface 1652. Light receiving surface 1652 may be comprised of an array of optical waveguides coupled to waveguide network 1654, arranged in any of the configurations and / or variations described for the waveguide array of device 5604 (FIGS. 56-58). Similarly, output device 106 may include an optional emitting surface 1656 that emits light propagated by and / or modulated within waveguide network 1654. Emitting surface 1656 may be comprised of an array of optical waveguides coupled to waveguide network 1654, arranged in any of the configurations and / or variations described for the waveguide array of device 5604 (FIGS. 56-58).

[0143] In one variation of structure 2602, the input device 104 has an optional light receiving surface 1612 whose light receiving array is coupled to an off-device waveguide or array of waveguides (not shown) that provides input data, such as from another optical system, and the light receiving surface 1612 may have any number of waveguides in its light receiving array. In a second variation of structure 2602, the input device 104 has an optional light receiving surface 1612 whose light receiving array is coupled to an off-device fiber or array of fibers (not shown) that provides input data, such as from another optical system, and the light receiving surface 1612 may have any number of waveguides in its light receiving array. In a third variation of structure 2602, the input device 104 has an optional light receiving surface 1612 whose light receiving array is coupled to free space (not shown) that provides input data, such as from another optical system, and the light receiving surface 1612 may have any number of waveguides in its light receiving array.

[0144] In a fourth variation of structure 2602, the input device 104 has an optional light-receiving surface 1612 as described in the first, second, and / or third variations of structure 2602, and input data for the input device 104 is received only via the light-receiving surface 1612. In a fifth variation of structure 2602, the input device 104 has an optional light-receiving surface 1612 as described in the first, second, and / or third variations of structure 2602, and input data for the input device 104 is received only via the light-receiving surface 1612 and / or the input data lines 508. In a sixth variation of structure 2602, the input device 104 does not have the optional light-receiving surface 1612, and input data is provided only via the input data lines 508 from the carrier tip 1604.

[0145] In a seventh variation of structure 2602, output device 106 has an optional emitting surface 1656 whose emitting array is coupled to an off-device waveguide or array of waveguides (not shown) that provides output data to other optical systems, etc., and emitting surface 1656 may have any number of waveguides in its emitting array. In an eighth variation of structure 2602, output device 106 has an optional emitting surface 1656 whose emitting array is coupled to an off-device fiber or array of fibers (not shown) that provides output data to other optical systems, etc., and emitting surface 1656 may have any number of waveguides in its emitting array. In a ninth variation of structure 2602, output device 106 has an optional emitting surface 1656 whose emitting array is coupled to free space (not shown) that provides output data to other optical systems, etc., and emitting surface 1656 may have any number of waveguides in its emitting array.

[0146] In a tenth variation of structure 2602, output device 106 has optional emitting surface 1656 as described in the seventh, eighth, and / or ninth variations of structure 2602, and input data for output device 106 is received only via emitting surface 1656. In an eleventh variation of structure 2602, output device 106 has optional emitting surface 1656 as described in the seventh, eighth, and / or ninth variations of structure 2602, and output data for output device 106 is transmitted via emitting surface 1656 and / or output data line 528. In a twelfth variation of structure 2602, output device 106 does not have optional emitting surface 1656, and output data is transmitted only via output data line 528 to transport tip 1604.

[0147] In a thirteenth variation of structure 2602, which may be combined with any of variations 1-12 of structure 2602 or any other variation, the basic configuration is configuration 902 ( FIG. 9 ) in which there is only one laser source, internal laser 704, coupled to waveguide network 706, and an optional reference light guide 526 may be coupled to waveguide network 706 via optional waveguide coupler 708. In a fourteenth variation of structure 2602, which may be combined with any of variations 1-12 of structure 2602 or any other variation, the basic configuration is configuration 1402 ( FIG. 14 ) in which there is no on-configuration laser source, and an optional reference light guide 526 may be coupled to waveguide network 706 via optional waveguide coupler 708. Any variation of structure 2602 may be combined to form a new variation of structure 2602.

[0148] 27a and 27b show structure 2702 of configuration 802 (FIG. 8) in which all device receiving and emitting surfaces are oriented perpendicular to the top surface of delivery chip 1604. The description and variations of structure 2702 are the same as those of structure 2602, except that the input, filter, and output devices are split across multiple smaller device chips.

[0149] The input device 104 is comprised of a base control chip 1714, an optional light-receiving chip 1712, and an emitting chip 1716. The base control chip 1714 includes the waveguide 706 and interfaces with the transport chip 1604 via contact surface 1662. The optional light-receiving chip 1712 includes the optional light-receiving surface 1612 and interfaces with the base control chip 1714 via contact surface 1762, which provides an electro-optical interconnection between the optional light-receiving chip 1712 and the base control chip 1714. Similarly, the emitting chip 1716 includes the emitting surface 1616 and interfaces with the base control chip 1714 via contact surface 1764, which provides an electro-optical interconnection between the emitting chip 1716 and the base control chip 1714.

[0150] Filter device 304 is comprised of a base control chip 1734, a receiving chip 1732, and an emitting chip 1736. Base control chip 1734 includes waveguides 1634 and interfaces with transport chip 1604 via contact surface 1664. Receiver chip 1732 includes receiving surface 1632 and interfaces with base control chip 1734 via contact surface 1772, which provides an electro-optical interconnection between receiver chip 1732 and base control chip 1734. Emitting chip 1736 includes emitting surface 1636 and interfaces with base control chip 1734 via contact surface 1774, which provides an electro-optical interconnection between emitter chip 1736 and base control chip 1734.

[0151] The output device 106 is comprised of a base control chip 1754, a light receiving chip 1752, and an optional light emitting chip 1756. The base control chip 1754 includes a waveguide 1654 and interfaces with the transport chip 1604 via a contact surface 1666. The light receiving chip 1752 includes a light receiving surface 1652 and interfaces with the base control chip 1754 via a contact surface 1782, which provides an electro-optical interconnection between the light receiving chip 1752 and the base control chip 1754. Similarly, the optional light emitting chip 1756 includes an optional light emitting surface 1656 and interfaces with the base control chip 1754 via a contact surface 1784, which provides an electro-optical interconnection between the optional light emitting chip 1756 and the base control chip 1754.

[0152] All variations of structure 2602 apply to structure 2702, with the following exceptions: Any variation of structure 2702 that has optional light-receiving surface 1612 also has optional light-receiving tip 1712, and any variation that does not have optional light-receiving surface 1612 does not have optional light-receiving tip 1712. Similarly, any variation of structure 2702 that has optional emitting surface 1656 also has optional emitting tip 1756, and any variation that does not have optional emitting surface 1656 does not have optional emitting tip 1756. Any variations of structure 2702 can be combined to form new variations of structure 2702.

[0153] 28a and 28b show structure 2802 of configuration 802 (FIG. 8) in which all device light receiving and emitting surfaces are oriented perpendicular to the top surface of carrier chip 1604 and portions of each input device, filter device, and output device are integrated into carrier chip 1604. The description and variations of structure 2802 are the same as the description and variations of structure 2702, except that the components and functions of the control chip according to structure 2702 are integrated into carrier chip 1604 for structure 2802.

[0154] For input device 104, the components and functions of control chip 1714, including portions of waveguide 706, are integrated into transport chip 1604, thereby eliminating contact surface 1662. Optional receiver chip 1712 interfaces with transport chip 1604 via contact surface 1762, which provides electro-optical interconnection between optional receiver chip 1712, transport chip 1604, and waveguide network 706. Similarly, emitter chip 1716 interfaces with transport chip 1604 via contact surface 1764, which provides electro-optical interconnection between emitter chip 1716, transport chip 1604, and waveguide network 706.

[0155] For filter device 304, the components and functions of control chip 1734, including portions of waveguide 1634, are integrated into transport chip 1604, thereby eliminating contact surface 1664. Receiver chip 1732 interfaces with transport chip 1604 via contact surface 1772, which provides electro-optical interconnection between receiver chip 1732, transport chip 1604, and waveguide network 1634. Emitting chip 1736 interfaces with transport chip 1604 via contact surface 1774, which provides electro-optical interconnection between emitter chip 1736, transport chip 1604, and waveguide network 1634.

[0156] For output device 106, the components and functions of control chip 1754, including portions of waveguide 1654, are integrated into transport chip 1604, thereby eliminating contact surface 1666. Receiver chip 1752 interfaces with transport chip 1604 via contact surface 1782, which provides electro-optical interconnection between receiver chip 1752, transport chip 1604, and waveguide network 1654. Similarly, optional emitter chip 1756 interfaces with transport chip 1604 via contact surface 1784, which provides electro-optical interconnection between optional emitter chip 1756, transport chip 1604, and waveguide network 1654.

[0157] All variations of structure 2702 apply to structure 2802. Any variations of structure 2802 can be combined to form new variations of structure 2802.

[0158] 29a and 29b show structure 2902 of configuration 802 (FIG. 8) in which portions of each input device, filter device, and output device are integrated into the transport chip 1604 with all device light receiving and emitting surfaces oriented parallel to the top surface of the transport chip 1604. The description and variations of structure 2902 are the same as those of structure 2802, except that the optional light receiving chip 1712, emitting chip 1716, light receiving chip 1732, emitting chip 1736, light receiving chip 1752, and optional emitting chip 1756 are oriented parallel to the top surface of the transport chip 1604 with all device light receiving and emitting surfaces oriented parallel to the top surface of the transport chip 1604. Structure 2902 is similar to structure 2602, except that portions of input device 104, filter device 304, and output device 106 are integrated into the transport chip 1604. All variations of structure 2802 apply to structure 2902. Any of the variations of structure 2902 can be combined into new variations of structure 2902.

[0159] 30a and 30b show structure 3002 of configuration 802 (FIG. 8) in which all input, filter, and output devices are integrated into the carrier chip 1604 with all device receiving and emitting surfaces oriented parallel to the top surface of the carrier chip 1604. The description and variations of structure 3002 are the same as those of structure 2902, except that all components of the input devices 104, filter devices 304, and output devices 106 are mounted, bonded, attached, integrated, embedded, or fabricated within the carrier chip 1604, eliminating the optional receiving chip 1712, emitting chip 1716, receiving chip 1732, emitting chip 1736, receiving chip 1752, and optional emitting chip 1756. All variations of structure 2602 apply to structure 3002. Any variations of structure 3002 can be combined to form new variations of structure 3002.

[0160] 31a and 31b show structure 3102 of configuration 802 (FIG. 8) in which all device light receiving and emitting surfaces are oriented perpendicular to the top surface of the transport chip 1604. The description and variations of structure 3102 are the same as those of structure 2602, except that the input device 104, filter device 304, and output device 106 are interfaced with the transport chip 1604 such that the optional light receiving surface 1612, emitting surface 1616, light receiving surface 1632, emitting surface 1636, light receiving surface 1652, and optional emitting surface 1656 are oriented perpendicular to the top surface of the transport chip 1604. All variations of structure 2602 apply to structure 3102. Any variations of structure 3102 can be combined to form new variations of structure 3102.

[0161] 32a and 32b show structure 3202 of configuration 802 (FIG. 8) in which all input, filter, and output devices are constructed from multi-layer chips with all device receiving and emitting surfaces oriented perpendicular to the top surface of carrier chip 1604. The description and variations of structure 3202 are the same as the description and variations of structure 3102, except that input devices 104, filter devices 304, and output devices 106 are constructed from multiple chips stacked parallel to the top surface of carrier chip 1604.

[0162] The input device 104 is comprised of a chip stack 2212 that includes an optional light receiving surface 1612, a waveguide network 706, and an emitting surface 1616. Each chip in the chip stack 2212 is comprised of an optional light receiving array (not shown) of one or more rows of light receiving surfaces 1612, an emitting array (not shown) of one or more rows of emitting surfaces 1616, and the necessary electro-optical components and / or parts of the waveguide network 706 that provide the required functionality for the input device 104 for the portion of the optional light receiving surface 1612 and emitting surface 1616 in each chip and interconnect with adjacent chips via contact surfaces 2262 between each chip in the chip stack 2212. There are as many chips in the chip stack 2212 as necessary to construct the optional light receiving surface 1612 and emitting surface 1616 for the required dimensions of the input device 104. The chip stack 2212 interfaces with the carrier chip 1604 via the contact surface 1662 as described for the input device 104 of the structure 1604 and its variations.

[0163] The filter device 304 is comprised of a chip stack 2232 that includes a light receiving surface 1632, a waveguide network 1634, and an emitting surface 1636. Each chip in the chip stack 2232 is comprised of one or more rows of a light receiving array (not shown) in the light receiving surface 1632, one or more rows of an emitting array (not shown) in the emitting surface 1636, and the necessary electro-optical components and / or parts of the waveguide network 1634 that provide the required functionality for the filter device 304 for the portion of the light receiving surface 1632 and the emitting surface 1636 in each chip and interconnect with adjacent chips via contact surfaces 2264 between each chip in the chip stack 2232. The chip stack 2232 has the number of chips necessary to construct the light receiving surface 1632 and the emitting surface 1636 for the required dimensions of the filter device 304. Chip stack 2212 interfaces with delivery chip 1604 via contact surface 1664 as described for structure 1604 and its variant filter device 304 .

[0164] The output device 106 is comprised of a chip stack 2252 that includes a light receiving surface 1652, a waveguide network 1654, and an optional emitting surface 1656. Each chip in the chip stack 2252 is comprised of one or more rows of a light receiving array (not shown) of light receiving surfaces 1652, an optional row of an emitting array (not shown) of emitting surfaces 1656, and the necessary electro-optical components and / or parts of the waveguide network 1654 that provide the required functionality for the output device 106 for the portion of the light receiving surface 1652 and optional emitting surface 1656 in each chip and interconnect with adjacent chips via contact surfaces 2266 between each chip in the chip stack 2252. There are as many chips in the chip stack 2252 as necessary to construct the light receiving surface 1652 and optional emitting surface 1656 for the required size of the output device 106. The chip stack 2252 interfaces with the transport chip 1604 via the contact surface 1666 as described for the output device 106 of the structure 1604 and its variations.

[0165] All variations of structure 3102 apply to structure 3202. Any variations of structure 3202 can be combined to form new variations of structure 3202.

[0166] 33a and 33b show structure 3302 of configuration 802 (FIG. 8) in which all device light receiving and emitting surfaces are oriented perpendicular to the top surface of the transport chip 1604 and all input, filter, and output devices are composed of multiple chips stacked vertically on the top surface of the transport chip 1604. The description and variations of structure 3302 are the same as the description and variations of structure 3102, except that the input devices 104, filter devices 304, and output devices 106 are composed of multiple chips stacked vertically on the top surface of the transport chip 1604.

[0167] The input device 104 is comprised of a chip stack 2212 that includes an optional light receiving surface 1612, a waveguide network 706, and an emitting surface 1616. Each chip in the chip stack 2212 is comprised of an optional light receiving array (not shown) of one or more rows of light receiving surfaces 1612, an emitting array (not shown) of one or more rows of emitting surfaces 1616, and the necessary electro-optical components and / or parts of the waveguide network 706 that provide the required functionality for the input device 104 for the portion of the optional light receiving surface 1612 and emitting surface 1616 in each chip and interconnect with adjacent chips via contact surfaces 2262 between each chip in the chip stack 2212. There are as many chips in the chip stack 2212 as necessary to construct the optional light receiving surface 1612 and emitting surface 1616 for the required dimensions of the input device 104. The chip stack 2212 interfaces with the carrier chip 1604 via the contact surface 1662 as described for the input device 104 of the structure 1604 and its variations.

[0168] The filter device 304 is comprised of a chip stack 2232 that includes a light receiving surface 1632, a waveguide network 1634, and an emitting surface 1636. Each chip in the chip stack 2232 comprises one or more light receiving arrays (not shown) of the light receiving surface 1632, one or more emitting arrays (not shown) of the emitting surface 1636, and the necessary electro-optical components and / or parts of the waveguide network 1634 that provide the required functionality of the filter device 304 for the portion of the light receiving surface 1632 and the emitting surface 1636 in each chip and interconnect with adjacent chips via contact surfaces 2264 between each chip in the chip stack 2232. The chip stack 2232 contains the number of chips necessary to construct the light receiving surface 1632 and the emitting surface 1636 for the required dimensions of the filter device 304. Chip stack 2212 interfaces with delivery chip 1604 via contact surface 1664 as described for structure 1604 and its variant filter device 304 .

[0169] The output device 106 is comprised of a chip stack 2252 that includes a light receiving surface 1652, a waveguide network 1654, and an optional emitting surface 1656. Each chip in the chip stack 2252 is comprised of one or more light receiving arrays (not shown) of light receiving surfaces 1652, one or more optional emitting arrays (not shown) of emitting surfaces 1656, and the necessary electro-optical components and / or parts of the waveguide network 1654 that provide the required functionality of the output device 106 for the portion of the light receiving surface 1652 and optional emitting surface 1656 in each chip and interconnect with adjacent chips via contact surfaces 2266 between each chip in the chip stack 2252. There are as many chips in the chip stack 2252 as necessary to construct the light receiving surface 1652 and optional emitting surface 1656 for the required dimensions of the output device 106. The chip stack 2252 interfaces with the transport chip 1604 via the contact surface 1666 as described for the output device 106 of the structure 1604 and its variations.

[0170] All variations of structure 3102 apply to structure 3302. Any variations of structure 3302 can be combined to form new variations of structure 3302.

[0171] 34a and 34b show structure 3402 of configuration 802 (FIG. 8) in which all input devices, filter devices, output devices, and free space regions are integrated into the transport chip 1604 with all device light receiving and emitting surfaces oriented parallel to the top surface of the transport chip 1604. The description and variations of structure 3402 are the same as the description and variations of structure 3002, except that all components of free space 108, free space 308, optional free space 2408, and optional free space 2458 are mounted, bonded, attached, integrated, embedded, or fabricated within the transport chip 1604. Optional free space 2408 and / or optional free space 2458 may be regions of air or other gas (such as nitrogen), liquid (such as an index-matching fluid), solid (such as an index-matching glass), or vacuum, and may contain zero or more lenses, beam splitters, polarizers, wave guides, waveguides, fibers, microlens arrays, or other optical components. Optional free space 2408 provides optical connection between optional light receiving surface 1612 and the face of transport chip 1604, allowing interconnection of input device 104 with other devices, configurations, structures, and / or variations thereof. All optical elements within free space 2408 share a common optical axis with optional light receiving surface 1612. Similarly, optional free space 2458 provides optical connection between optional emitting surface 1656 and the face of transport chip 1604, allowing interconnection of output device 106 with other devices, configurations, structures, and / or variations thereof. All optical elements within free space 2458 share a common optical axis with optional emitting surface 1656. All variations of structure 3002 apply to structure 3402. Any variations of structure 3402 can be combined to form new variations of structure 3402.

[0172] 35a and 35b show structure 3502 of configuration 802 (FIG. 8) in which all input devices, filter devices, output devices and free space regions are integrated into the carrier chip 1604 with all device light receiving and emitting surfaces oriented perpendicular to the top surface of the carrier chip 1604. The description and variations of structure 3502 are the same as the description and variations of structure 3102, except that all components of input devices 104, filter devices 304, output devices 106, free space 108 and free space 308 are mounted, bonded, attached, integrated, embedded or fabricated within the carrier chip 1604, thereby eliminating contact surface 1662, contact surface 1664 and contact surface 1666. Optional receiving surface 1612 and optional emitting surface 1656 are located on the sides of delivery chip 1604 so that they may optionally interconnect with other devices, configurations, structures, and / or variations thereof via free space regions, waveguides, fibers, microlens arrays, or other light propagation media (not shown). All variations of structure 3102 apply to structure 3502. Any variations of structure 3502 may be combined to form new variations of structure 3502.

[0173] 36a and 36b show structure 3602 of configuration 1002 (FIG. 10) in which all devices and their light-receiving and light-emitting surfaces are oriented parallel to the top surface of carrier chip 1604. All components and devices of configuration 1002 are incorporated into structure 3602. Similarly, the description of configuration 1002 applies to structure 3602, except for additional details and components described below. Carrier chip 1604 provides electrical and / or optical interconnections between itself and input devices 104 and / or output devices 106, and may provide a printed circuit board, integrated chip, chip carrier, interposer, or any other electrical and / or optical interconnection platform. Laser 504 may be mounted, bonded, attached, embedded, or fabricated within or on carrier chip 1604. Light guide 506 and / or optional light guide 526 may be a waveguide on or within carrier chip 1604. Input, output, and control data (not shown) for all devices connected to and / or including carrier chip 1604 is transmitted to carrier chip 1604 via carrier chip data lines 1608 and carrier chip control lines 1610, which may be electrical wiring (including but not limited to pin grid arrays, ball grid arrays, or other chip carriers), optical fibers, waveguides, and / or any other data carrying or energy propagation medium, whose terminals, connectors, and / or connection surfaces may be located on one or more surfaces and / or edges of carrier chip 1604. The electro-optical network 1674 can carry electrical and / or optical signals throughout the transport chip 1604 and between the transport chip data lines 1608, the transport chip control lines 1610, and / or to and from the input devices 104 and / or the output devices 106, and the electro-optical network 1674 can include electrical wiring, optical fibers, waveguides, and / or any other data and / or energy propagation medium.

[0174] The input device 104 is connected to the transport chip 1604 at electrical and / or optical contact surface 1662, which is a physical interface between the input device 104 and the transport chip 1604 and may provide power, electrical data, optical data, and / or control data from the transport chip 1604 to the input device 104. Input and control data (not shown) may be provided to the input device 104 via the contact surface 1662 via input data lines 508 and input control lines 510, which are connected to an electro-optical network 1674. The output device 106 is connected to the transport chip 1604 at electrical and / or optical contact surface 1666, which is a physical interface between the output device 106 and the transport chip 1604 and may provide power, electrical data, optical data, and / or control data from the transport chip 1604 to the output device 106. Output data (not shown) may be received from output device 106 via output data lines 528 through contact surface 1662, and control data (not shown) may be sent to and received from output device 106 via output control lines 530 through contact surface 1662. Both output data lines 528 and output control lines 530 are connected to electro-optical network 1674. Transport chip 1604 may perform pre- or post-processing of any data transmitted over electro-optical network 1674, including, but not limited to, modulation of light carried by optical waveguides and / or mathematical operations on electrical signals carried by wires in electro-optical network 1674.

[0175] Propagation and / or modulation of light within input device 104 as described for configuration 1002 and its variations occurs within waveguide network 706. Input data (not shown) may be received by input device 104 via optional light-receiving surface 1612 and / or via contact surface 1662. Optional light-receiving surface 1612 is comprised of an array of optical waveguides coupled to waveguide network 706, arranged in any of the configurations and / or variations described for the waveguide array of device 5604 (FIGS. 56-58). Similarly, input device 104 includes an emitting surface 1616 that emits light propagated by and / or modulated within waveguide network 706 into free space 108, where emitting surface 1616 is comprised of an array of optical waveguides coupled to waveguide network 706, arranged in any of the configurations and / or variations described for the waveguide array of device 5604 (FIGS. 56-58).

[0176] The propagation, modulation, and / or detection of light in output device 106 as described for configuration 1002 and its variations occurs within waveguide network 1654. Output data (not shown) may be received by output device 106 via light receiving surface 1652. Light receiving surface 1652 may be comprised of an array of optical waveguides coupled to waveguide network 1654, arranged in any of the configurations and / or variations described for the waveguide array of device 5604 (FIGS. 56-58). Similarly, output device 106 may include an optional emitting surface 1656 that emits light propagated by and / or modulated within waveguide network 1654. Emitting surface 1656 may be comprised of an array of optical waveguides coupled to waveguide network 1654, arranged in any of the configurations and / or variations described for the waveguide array of device 5604 (FIGS. 56-58).

[0177] In one variation of structure 3602, the input device 104 has an optional light receiving surface 1612 whose light receiving array is coupled to an off-device waveguide or array of waveguides (not shown) that provides input data, such as from another optical system, and the light receiving surface 1612 may have any number of waveguides in the light receiving array. In a second variation of structure 3602, the input device 104 has an optional light receiving surface 1612 whose light receiving array is coupled to an off-device fiber or array of fibers (not shown) that provides input data, such as from another optical system, and the light receiving surface 1612 may have any number of waveguides in the light receiving array. In a third variation of structure 3602, the input device 104 has an optional light receiving surface 1612 whose light receiving array is coupled to free space (not shown) that provides input data, such as from another optical system, and the light receiving surface 1612 may have any number of waveguides in the light receiving array.

[0178] In a fourth variation of structure 3602, the input device 104 has an optional light-receiving surface 1612 as described in the first, second, and / or third variations of structure 3602, and input data for the input device 104 is received only via the light-receiving surface 1612. In a fifth variation of structure 3602, the input device 104 has an optional light-receiving surface 1612 as described in the first, second, and / or third variations of structure 3602, and input data for the input device 104 is received only via the light-receiving surface 1612 and / or the input data lines 508. In a sixth variation of structure 3602, the input device 104 does not have the optional light-receiving surface 1612, and input data is provided only via the input data lines 508 from the carrier tip 1604.

[0179] In a seventh variation of structure 3602, output device 106 has an optional emitting surface 1656 whose emitting array is coupled to an off-device waveguide or array of waveguides (not shown) that provides output data to other optical systems, etc., and emitting surface 1656 may have any number of waveguides in its emitting array. In an eighth variation of structure 3602, output device 106 has an optional emitting surface 1656 whose emitting array is coupled to an off-device fiber or array of fibers (not shown) that provides output data to other optical systems, etc., and emitting surface 1656 may have any number of waveguides in its emitting array. In a ninth variation of structure 3602, output device 106 has an optional emitting surface 1656 whose emitting array is coupled to free space (not shown) that provides output data to other optical systems, etc., and emitting surface 1656 may have any number of waveguides in its emitting array.

[0180] In a tenth variation of structure 3602, output device 106 has optional emitting surface 1656 as described in the seventh, eighth, and / or ninth variations of structure 3602, and input data for output device 106 is received only via emitting surface 1656. In an eleventh variation of structure 3602, output device 106 has optional emitting surface 1656 as described in the seventh, eighth, and / or ninth variations of structure 3602, and output data for output device 106 is transmitted via emitting surface 1656 and / or output data line 528. In a twelfth variation of structure 3602, output device 106 does not have optional emitting surface 1656, and output data is transmitted only via output data line 528 to transport tip 1604.

[0181] In a thirteenth variation of structure 3602, which may be combined with any of variations 1-12 of structure 3602 or any other variation, the basic configuration is configuration 1102 ( FIG. 11 ) in which there is only one laser source, an internal on-device laser 704 coupled to waveguide network 706, and an optional reference light guide 526 may be coupled to waveguide network 706 via optional waveguide coupler 708. In a fourteenth variation of structure 3602, which may be combined with any of variations 1-12 of structure 3602 or any other variation, the basic configuration is configuration 1502 ( FIG. 15 ) in which there is no on-configuration laser source, and an optional reference light guide 526 may be coupled to waveguide network 706 via optional waveguide coupler 708. Any variation of structure 3602 may be combined to form a new variation of structure 3602.

[0182] 37a and 37b show structure 3702 of configuration 1002 (FIG. 10) in which all device receiving and emitting surfaces are oriented perpendicular to the top surface of transport chip 1604. The description and variations of structure 3702 are the same as those of structure 3602, except that the input and output devices are split across multiple smaller device chips.

[0183] The input device 104 is comprised of a base control chip 1714, an optional light-receiving chip 1712, and an emitting chip 1716. The base control chip 1714 includes the waveguide 706 and interfaces with the transport chip 1604 via contact surface 1662. The optional light-receiving chip 1712 includes the optional light-receiving surface 1612 and interfaces with the base control chip 1714 via contact surface 1762, which provides an electro-optical interconnection between the optional light-receiving chip 1712 and the base control chip 1714. Similarly, the emitting chip 1716 includes the emitting surface 1616 and interfaces with the base control chip 1714 via contact surface 1764, which provides an electro-optical interconnection between the emitting chip 1716 and the base control chip 1714.

[0184] Output device 106 is comprised of a base control chip 1754, a light receiving chip 1752, and an optional light emitting chip 1756. Base control chip 1754 includes waveguides 1654 and interfaces with transport chip 1604 via contact surface 1666. Light receiving chip 1752 includes light receiving surface 1652 and interfaces with base control chip 1754 via contact surface 1782, which provides an electro-optical interconnection between light receiving chip 1752 and base control chip 1754. Similarly, optional light emitting chip 1756 includes optional light emitting surface 1656 and interfaces with base control chip 1754 via contact surface 1784, which provides an electro-optical interconnection between optional light emitting chip 1756 and base control chip 1754. All variations of structure 3602 apply to structure 3702 except as follows.

[0185] Any variation of structure 3702 that has optional light-receiving surface 1612 also has optional light-receiving tip 1712, and any variation that does not have optional light-receiving surface 1612 does not have optional light-receiving tip 1712. Similarly, any variation of structure 3702 that has optional emitting surface 1656 also has optional emitting tip 1756, and any variation that does not have optional emitting surface 1656 does not have optional emitting tip 1756. Any variation of structure 3702 can be combined into a new variation of structure 3702.

[0186] 38a and 38b show structure 3802 of configuration 1002 (FIG. 10) in which all device light receiving and emitting surfaces are oriented perpendicular to the top surface of carrier chip 1604 and portions of each input device, filter device, and output device are integrated into carrier chip 1604. The description and variations of structure 3802 are the same as the description and variations of structure 3702, except that the components and functions of the control chip according to structure 3702 are integrated into carrier chip 1604 for structure 3802.

[0187] For input device 104, the components and functions of control chip 1714, including portions of waveguide 706, are integrated into transport chip 1604, thereby eliminating contact surface 1662. Optional receiver chip 1712 interfaces with transport chip 1604 via contact surface 1762, which provides electro-optical interconnection between optional receiver chip 1712, transport chip 1604, and waveguide network 706. Similarly, emitter chip 1716 interfaces with transport chip 1604 via contact surface 1764, which provides electro-optical interconnection between emitter chip 1716, transport chip 1604, and waveguide network 706.

[0188] For output device 106, the components and functions of control chip 1754, including portions of waveguide 1654, are integrated into transport chip 1604, thereby eliminating contact surface 1666. Receiver chip 1752 interfaces with transport chip 1604 via contact surface 1782, which provides electro-optical interconnection between receiver chip 1752, transport chip 1604, and waveguide network 1654. Similarly, optional emitter chip 1756 interfaces with transport chip 1604 via contact surface 1784, which provides electro-optical interconnection between optional emitter chip 1756, transport chip 1604, and waveguide network 1654.

[0189] All variations of structure 3702 apply to structure 3802. Any variations of structure 3802 can be combined to form new variations of structure 3802.

[0190] 39a and 39b show structure 3902 of configuration 1002 (FIG. 10) in which portions of each input device and output device are integrated into the carrier chip 1604 with all device light receiving and emitting surfaces oriented parallel to the top surface of the carrier chip 1604. The description and variations of structure 3902 are the same as those of structure 3802, except that the optional light receiving chip 1712, emitting chip 1716, light receiving chip 1752, and optional emitting chip 1756 are oriented parallel to the top surface of the carrier chip 1604 with all device light receiving and emitting surfaces oriented parallel to the top surface of the carrier chip 1604. Structure 3902 is similar to structure 3602, except that portions of the input devices 104 and output devices 106 are integrated into the carrier chip 1604. All variations of structure 3802 apply to structure 3902. Any variations of structure 3902 can be combined to form new variations of structure 3902.

[0191] 40a and 40b show structure 4002 of configuration 1002 (FIG. 10) in which all input and output devices are integrated into the carrier chip 1604 with all device receiving and emitting surfaces oriented parallel to the top surface of the carrier chip 1604. The description and variations of structure 4002 are the same as those of structure 3902, except that all components of the input devices 104 and output devices 106 are mounted, bonded, attached, integrated, embedded, or fabricated within the carrier chip 1604, thereby eliminating optional receiving chip 1712, emitting chip 1716, receiving chip 1752, and optional emitting chip 1756. All variations of structure 3602 apply to structure 4002. Any variations of structure 4002 can be combined to form new variations of structure 4002.

[0192] 41a and 41b show structure 4102 of configuration 1002 (FIG. 10) in which all device light receiving and emitting surfaces are oriented perpendicular to the top surface of the transport chip 1604. The description and variations of structure 4102 are the same as those of structure 3602, except that the input device 104 and the output device 106 are interfaced with the transport chip 1604 such that the optional light receiving surface 1612, the emitting surface 1616, the light receiving surface 1652, and the optional emitting surface 1656 are oriented perpendicular to the top surface of the transport chip 1604. All variations of structure 3602 apply to structure 4102. Any variations of structure 4102 can be combined to form new variations of structure 4102.

[0193] 42a and 42b show structure 4202 of configuration 1002 (FIG. 10) in which all input and output devices are constructed of multi-layer chips with all device receiving and emitting surfaces oriented perpendicular to the top surface of carrier chip 1604. The description and variations of structure 4202 are the same as the description and variations of structure 4102, except that input devices 104 and output devices 106 are constructed of multiple chips stacked parallel to the top surface of carrier chip 1604.

[0194] The input device 104 is comprised of a chip stack 2212 that includes an optional light receiving surface 1612, a waveguide network 706, and an emitting surface 1616. Each chip in the chip stack 2212 is comprised of an optional light receiving array (not shown) of one or more rows of light receiving surfaces 1612, an emitting array (not shown) of one or more rows of emitting surfaces 1616, and the necessary electro-optical components and / or parts of the waveguide network 706 that provide the required functionality for the input device 104 for the portion of the optional light receiving surface 1612 and emitting surface 1616 in each chip and interconnect with adjacent chips via contact surfaces 2262 between each chip in the chip stack 2212. There are as many chips in the chip stack 2212 as necessary to construct the optional light receiving surface 1612 and emitting surface 1616 for the required dimensions of the input device 104. The chip stack 2212 interfaces with the carrier chip 1604 via the contact surface 1662 as described for the input device 104 of the structure 1604 and its variations.

[0195] The output device 106 is comprised of a chip stack 2252 that includes a light receiving surface 1652, a waveguide network 1654, and an optional emitting surface 1656. Each chip in the chip stack 2252 is comprised of one or more rows of a light receiving array (not shown) of light receiving surfaces 1652, an optional row of an emitting array (not shown) of emitting surfaces 1656, and the necessary electro-optical components and / or parts of the waveguide network 1654 that provide the required functionality for the output device 106 for the portion of the light receiving surface 1652 and optional emitting surface 1656 in each chip and interconnect with adjacent chips via contact surfaces 2266 between each chip in the chip stack 2252. There are as many chips in the chip stack 2252 as necessary to construct the light receiving surface 1652 and optional emitting surface 1656 for the required size of the output device 106. The chip stack 2252 interfaces with the transport chip 1604 via the contact surface 1666 as described for the output device 106 of the structure 1604 and its variations.

[0196] All variations of structure 4102 apply to structure 4202. Any variations of structure 4202 can be combined to form new variations of structure 4202.

[0197] 43a and 43b show structure 4302 of configuration 1002 (FIG. 10) in which all device light receiving and emitting surfaces are oriented perpendicular to the top surface of carrier chip 1604 and all input and output devices are composed of multiple chips stacked vertically on the top surface of carrier chip 1604. The description and variations of structure 4302 are the same as the description and variations of structure 4102, except that input devices 104 and output devices 106 are composed of multiple chips stacked vertically on the top surface of carrier chip 1604.

[0198] The input device 104 is comprised of a chip stack 2212 that includes an optional light receiving surface 1612, a waveguide network 706, and an emitting surface 1616. Each chip in the chip stack 2212 is comprised of an optional light receiving array (not shown) of one or more rows of light receiving surfaces 1612, an emitting array (not shown) of one or more rows of emitting surfaces 1616, and the necessary electro-optical components and / or parts of the waveguide network 706 that provide the required functionality for the input device 104 for the portion of the optional light receiving surface 1612 and emitting surface 1616 in each chip and interconnect with adjacent chips via contact surfaces 2262 between each chip in the chip stack 2212. There are as many chips in the chip stack 2212 as necessary to construct the optional light receiving surface 1612 and emitting surface 1616 for the required dimensions of the input device 104. The chip stack 2212 interfaces with the carrier chip 1604 via the contact surface 1662 as described for the input device 104 of the structure 1604 and its variations.

[0199] The output device 106 is comprised of a chip stack 2252 that includes a light receiving surface 1652, a waveguide network 1654, and an optional emitting surface 1656. Each chip in the chip stack 2252 is comprised of one or more light receiving arrays (not shown) of light receiving surfaces 1652, one or more optional emitting arrays (not shown) of emitting surfaces 1656, and the necessary electro-optical components and / or parts of the waveguide network 1654 that provide the required functionality of the output device 106 for the portion of the light receiving surface 1652 and optional emitting surface 1656 in each chip and interconnect with adjacent chips via contact surfaces 2266 between each chip in the chip stack 2252. There are as many chips in the chip stack 2252 as necessary to construct the light receiving surface 1652 and optional emitting surface 1656 for the required dimensions of the output device 106. The chip stack 2252 interfaces with the transport chip 1604 via the contact surface 1666 as described for the output device 106 of the structure 1604 and its variations.

[0200] All variations of structure 4102 apply to structure 4302. Any variations of structure 4302 can be combined to form new variations of structure 4302.

[0201] 44a and 44b show structure 4402 of configuration 1002 (FIG. 10) in which all input devices, output devices, and free space regions are integrated into carrier chip 1604, with all device light receiving and emitting surfaces oriented parallel to the top surface of carrier chip 1604. Descriptions and variations of structure 4402 are the same as those of structure 4002, except that all components of free space 108, optional free space 2408, and optional free space 2458 are mounted, bonded, attached, integrated, embedded, or fabricated within carrier chip 1604. Optional free space 2408 and / or optional free space 2458 may be regions of air or other gas (such as nitrogen), liquid (such as index-matching fluid), solid (such as index-matching glass), or vacuum, and may contain zero or more lenses, beam splitters, polarizers, wave guides, waveguides, fibers, microlens arrays, or other optical components. Optional free space 2408 provides optical connection between optional light receiving surface 1612 and the face of transport chip 1604, allowing interconnection of input device 104 with other devices, configurations, structures, and / or variations thereof. All optical elements within free space 2408 share a common optical axis with optional light receiving surface 1612. Similarly, optional free space 2458 provides optical connection between optional emitting surface 1656 and the face of transport chip 1604, allowing interconnection of output device 106 with other devices, configurations, structures, and / or variations thereof. All optical elements within free space 2458 share a common optical axis with optional emitting surface 1656.

[0202] All variations of structure 4002 apply to structure 4402. Any variations of structure 4402 can be combined to form new variations of structure 4402.

[0203] 45a and 45b show structure 4502 of configuration 1002 (FIG. 10) in which all input devices, output devices, and free space regions are integrated into the carrier chip 1604, with all device light receiving and emitting surfaces oriented perpendicular to the top surface of the carrier chip 1604. The description and variations of structure 4502 are the same as the description and variations of structure 4102, except that all components of the input devices 104, output devices 106, and free space 108 are mounted, bonded, attached, integrated, embedded, or fabricated within the carrier chip 1604, thereby eliminating contact surfaces 1662 and 1666. The optional light receiving surface 1612 and optional emitting surface 1656 are located on the side of the carrier chip 1604 so that they may optionally interconnect with other devices, configurations, structures, and / or variations thereof via free space regions, waveguides, fibers, microlens arrays, or other optical propagation media (not shown).

[0204] All variations of structure 4102 apply to structure 4502. Any variations of structure 4502 can be combined to form new variations of structure 4502.

[0205] Possible configurations of the configurations shown in Figures 5-15 are not limited to those shown in Figures 16a-45b and may vary from those configurations in terms of the physical dimensions, number of elements, components, devices, and / or systems, and / or the layout or location of elements, components, devices, and / or systems, such as to improve manufacturing efficiency and / or to enable the configurations to meet form factor requirements, including, but not limited to, more compact and / or modular designs. Similarly, possible configurations of the illustrated configurations may vary from those configurations in their external interfaces and / or packaging, such as to support electrical and / or optical interconnection on any surface and / or face of the possible configuration with other devices, systems, configurations, and / or structures. Possible configurations may include, but are not limited to, zero or more electrical wires, pins and / or pads, optical fibers, waveguides, couplers, and / or any other light or energy propagation medium and / or connector to facilitate such interconnection.

[0206] All possible structures, configurations, systems, devices, and / or variations thereof can be connected to a complex system to perform various tasks. In a given complex system, there can be any number of connected structures, configurations, systems, devices, and / or variations thereof. Data enters and / or exits a complex system as electrical and / or optical information. Data that enters a complex system in a given format (i.e., encoded, compressed, modulated, etc.) or by a given transport type (i.e., electrical, optical, etc.) need not exit the complex system by the same format or transport type. Similarly, data within a complex system may move between electrical and / or optical domains during processing as the data moves between components of the complex system. Data may be modified and / or modulated by other data and / or signals.

[0207] FIG. 46 illustrates composite system 4604, a generic composite optical system having one or more subsystem components (not shown), which may be any and / or possible composite optical system, structure, configuration, system, device, and / or variations thereof. The subsystem components (not shown) may be interconnected via electrical wiring, optical fibers, waveguides, free space regions (including, but not limited to, vacuum, gas, liquid, or solid free space regions), and / or any other data-carrying or energy-propagating medium (not shown). Input data is received via interconnect 4614 and output via interconnect 4615, which may be one or more of electrical wiring, optical fibers, waveguides, free space regions (including, but not limited to, vacuum, gas, liquid, or solid free space regions), and / or any other data-carrying or energy-propagating medium. Interconnects 4614 and 4615 need not include multiple data or energy propagating components of the same type, and composite system 4604 may be, but is not limited to, a printed circuit board having subsystem components (not shown) mounted, adhered, attached, and / or connected to its surface, a chip having subsystem components (not shown) mounted, adhered, attached, embedded, and / or fabricated in or on its surface, or a collection of independent subsystem components (not shown) related by their contribution to the requirements of composite system 4604. Such independent subsystem components (not shown) may be physically remote from one another.

[0208] FIG. 47 illustrates composite system 4704, a possible configuration of composite system 4604 having four subsystem components. Subsystems 4711-4714 may be any and / or possible structures, configurations, systems, devices, and / or variations thereof connected by interconnects 4722-4724. Interconnects 4722-4724 may be one or more electrical wires, optical fibers, waveguides, free space regions (including, but not limited to, vacuum, gas, liquid, or solid free space regions), and / or any other data-carrying or energy-propagating medium. Input data is received via interconnect 4721 and output via interconnects 4725-4726, which may be one or more electrical wires, optical fibers, waveguides, free space regions (including, but not limited to, vacuum, gas, liquid, or solid free space regions), and / or any other data-carrying or energy-propagating medium.

[0209] Various forms of optical information processing systems (including, but not limited to, one or more of these devices, configurations, structures, composite systems, and / or variations thereof) may be used to replace some or all portions of a given information processing, analysis, and / or learning application device and / or system, including, but not limited to, those designed for artificial intelligence, pattern recognition (audio, image, video, etc.), data pre / post processing, high frequency trading, information and computer security, encryption and / or decryption, compression and / or decompression, encoding and / or decoding, and / or conventional computing system devices and / or components, including, but not limited to, the complete replacement of conventional electrical computing systems.

[0210] For traditional computing system components, optical information processing systems may be used to replace electrical, optical, or electro-optical networking systems, storage systems, and / or data processing systems as optical networking systems, optical storage systems, and optical information processing systems, any combination of which may be used to form an optical computing system. Variations of optical computing systems include electrical and / or optical data communication systems for communicating with other computing systems.

[0211] FIG. 48 illustrates an exemplary computer peripheral, computer peripheral 4802, incorporating a composite optical system. A printed circuit board 4804 can carry and electrically and / or optically interconnect composite system 4806, processor 4808, optional memory 4820-4822, optional optical networking connectors 4830-4831, and optional electrical networking connectors 4840-4841, such interconnections being via one or more electrical wires, optical fibers, waveguides, free space regions (including, but not limited to, vacuum, gas, liquid, or solid free space regions), and / or any other data-carrying or energy-propagating medium. Composite system 4806 is electrically and / or optically mounted, bonded, attached, and / or connected to printed circuit board 4804, and composite system 4806 can be any variation or configuration of composite system 4604 (FIG. 46). Input and / or output data may be transferred to and / or from computer peripherals 4802 via optional optical networking connectors 4830-4831, optional electrical networking connectors 4840-4841, and / or electrical computer connector 4810. Combined system 4806 may receive and / or transmit data via optional optical networking connectors 4830-4831, optional electrical networking connectors 4840-4841, electrical computer connector 4810, optional memory 4820-4822, and / or processor 4808, and combined system 4806 may be directly connected to optional optical networking connectors 4830-4831 via optical fiber, waveguide, and / or other optical propagation medium. Additional components and / or devices in addition to those shown may be present on printed circuit board 4804. Similarly, the relative positions of components on printed circuit board 4804 may differ from those shown.

[0212] In one variation of computer peripheral 4802, optional optical networking connectors 4830-4831 are not present, and data is transferred only via optional electrical networking connectors 4840-4841 and / or electrical computer connector 4810. In a second variation of computer peripheral 4802, optional electrical networking connectors 4840-4841 are not present, and data is transferred only via optional optical networking connectors 4830-4831 and / or electrical computer connector 4810. In a third variation of computer peripheral 4802, neither optional optical networking connectors 4830-4831 nor optional electrical networking connectors 4840-4841 are present, and data is transferred only via electrical computer connector 4810. In a fourth variation of computer peripheral 4802, optional memories 4820-4822 are absent, and combined system 4806 and / or processor 4808 have the necessary memory and / or data latency capabilities to support the functional requirements of computer peripheral 4802. A fifth variation of computer peripheral 4802 combines variation 4 with any of variations 1-3.

[0213] 49 illustrates computer peripheral 4902, an exemplary computer peripheral in which the functionality of an electrical processor and / or memory components are integrated into a combined system 4906. Descriptions and variations of computer peripheral 4902 are the same as those of computer peripheral 4802, except that the functionality provided by processor 4808 and / or optional memory 4820-4822 are integrated into combined system 4906, which may be any variation or configuration of combined system 4604 (FIG. 46).

[0214] FIG. 50 illustrates an exemplary computer motherboard 5002 incorporating a composite optical system. The printed circuit board 5004 can carry and electrically and / or optically interconnect the composite system 5006, processor 5008, memory 5020, optional electrical peripheral connectors 5050-5053, and optional input / output ports 5060, such interconnections being via one or more electrical wires, optical fibers, waveguides, free space regions (including, but not limited to, vacuum, gas, liquid, or solid free space regions), and / or any other data-carrying or energy-propagating medium. The composite system 5006 may be electrically and / or optically mounted, bonded, attached, and / or connected to the printed circuit board 5004, and the composite system 5006 may be any variation or configuration of the composite system 4604 (FIG. 46). Combined system 5006 can receive and / or transmit data via processor 5008, memory 5020, optional PCI connectors 5050-5053, and / or optional input / output ports 5060. Additional components and / or devices in addition to those shown may be present on printed circuit board 5004. Likewise, the relative positions of components on printed circuit board 5004 may differ from those shown.

[0215] In one variation of computer motherboard 5002, one or more of optional electrical peripheral connectors 5050-5053 are present. In a second variation of computer motherboard 5002, none of optional electrical peripheral connectors 5050-5053 are present. In a third variation of computer motherboard 5002, optional input / output port 5060 is absent. A fourth variation of computer motherboard 5002 combines variation 3 with either variation 1 or 2.

[0216] 51 illustrates an exemplary smartphone motherboard, motherboard 5102, incorporating a composite optical system. The printed circuit board 5104 can carry and electrically and / or optically interconnect the composite system 5106, processor 5108, memory 5120, and camera 5170, such interconnections being via one or more electrical wires, optical fibers, waveguides, free space regions (including, but not limited to, vacuum, gas, liquid, or solid free space regions), and / or any other data-carrying or energy-propagating medium. The composite system 5106 may be electrically and / or optically mounted, adhered, attached, and / or connected to the printed circuit board 5104, and the composite system 5106 may be any variation or configuration of the composite system 4604 (FIG. 46). The combined system 5106 can receive and / or transmit data via the processor 5108, memory 5120, and / or camera 5170, and the combined system 5106 can be directly connected to the camera 5170 via electrical wiring, optical fiber, waveguides, and / or other light or energy propagation media. Additional components and / or devices in addition to those shown may be present on the printed circuit board 5104. Likewise, the relative positions of components on the printed circuit board 5104 may differ from that shown.

[0217] Figure 52 shows an example processor incorporating an electrical processing unit and a composite optical system, electro-optical processor 5202. A delivery chip 5204 can carry and electrically and / or optically interconnect composite system 5206 and processor 5208, such interconnection being via one or more electrical wires, optical fibers, waveguides, free space regions (including, but not limited to, vacuum, gas, liquid, or solid free space regions), and / or any other data-carrying or energy-propagating medium. Composite system 5206 may be electrically and / or optically mounted, bonded, attached, connected, embedded, and / or fabricated within or on delivery chip 5204, and composite system 5206 may be any variation or configuration of composite system 4604 (Figure 46). Similarly, the processor 5208 may be electrically and / or optically mounted, bonded, attached, connected, embedded, and / or fabricated in or on the carrier chip 5204, and the processor 5208 may include one or more central electrical processing units, graphics processing units, and / or memory components. The carrier chip 5204 may be a printed circuit board, an integrated chip, a chip carrier, an interposer, or any other electrical and / or optical interconnection platform. The carrier chip 5204 may have electrical wiring (including, but not limited to, pin grid arrays, ball grid arrays, or other chip carriers), optical fibers, waveguides, and / or any other data transport or energy propagation medium, whose terminals, connectors, and / or connection surfaces may be located on one or more surfaces and / or edges of the carrier chip 5204 to facilitate connection with printed circuit boards, sockets, devices, and / or other systems. Additional components and / or devices may be present on the carrier chip 5204 in addition to those shown. Similarly, the relative positions of components on delivery tip 5204 may differ from those shown.

[0218] Figure 53 shows an example computer motherboard incorporating an electro-optical processor, computer motherboard 5302. The description and variations of computer motherboard 5302 are the same as those of computer motherboard 5002, except that combined system 5006 and processor 5008 of computer motherboard 5002 are replaced by electro-optical processor 5307, which may be any variation or configuration of electro-optical processor 5202 (Figure 52).

[0219] FIG. 54 illustrates an exemplary electro-optical computer motherboard, electro-optical motherboard 5402, incorporating a composite optical system. A carrier chip 5404 can hold and electrically and / or optically interconnect composite system 5406, optional optical networking connectors 5430-5431, and optional electrical networking connectors 5440-5441, such interconnections being via one or more electrical wires, optical fibers, waveguides, free space regions (including, but not limited to, vacuum, gas, liquid, or solid free space regions), and / or any other data-carrying or energy-propagating medium. Composite system 5406 may be electrically and / or optically mounted, bonded, attached, connected, embedded, or fabricated within or on carrier chip 5404, and composite system 5406 may be any variation or configuration of composite system 4604 (FIG. 46). Input and / or output data can be transferred to and / or from electro-optical motherboard 5402 via optional optical networking connectors 5430-5431 and / or optional electrical networking connectors 5440-5441. Composite system 5406 can receive and / or transmit data via optional optical networking connectors 5430-5431 and / or optional electrical networking connectors 5440-5441, and composite system 5406 can be directly connected to optional optical networking connectors 5430-5431 via optical fiber, waveguide, and / or other optical propagation medium. Carrier chip 5404 can be a printed circuit board, integrated chip, chip carrier, interposer, or any other electrical and / or optical interconnection platform. Additional components and / or devices may be present on carrier chip 5404 in addition to those shown. Similarly, the relative positions of components on carrier chip 5404 may differ from those shown.

[0220] In one variation of electro-optical motherboard 5402, optional optical networking connectors 5430-5431 are not present, and data is transferred only through optional electrical networking connectors 5440-5441. In a second variation of electro-optical motherboard 5402, optional electrical networking connectors 5440-5441 are not present, and data is transferred only through optional optical networking connectors 5430-5431.

[0221] FIG. 55 illustrates an electro-optical high-performance computing system 5502, which is a server rack of connected electric and / or electro-optical computer servers. The server rack 5504 includes computer servers 5580-5586, which may be conventional electric computer servers, such as those shown in FIGS. 50, 53, and 54, or electro-optical computer servers incorporating electro-optical motherboards. The computer servers 5580-5586 are connected to each other and / or to external computer systems via electrical and / or optical networking cables. There may be additional and / or fewer computer servers, components, and / or devices in the server rack 5504 than are shown. Similarly, the relative locations of the computer servers and components in the server rack 5504 may differ from those shown.

[0222] 46-55 can be used in many different applications, including but not limited to artificial intelligence, pattern recognition (voice, image, video, etc.), pre- / post-data processing, high frequency trading, information and computer security, encryption and / or decryption, compression and / or decompression, encoding and / or decoding, and / or conventional computing system device and / or component functions. Systems sufficiently complex can completely replace conventional electrical computing systems in their entirety.

[0223] There are several potential advantages to using a composite optical information processing system for processing large amounts of information, such as in image processing and / or artificial intelligence applications. Optical information processing systems have the potential to process high-resolution image data at the same speed as low-resolution image data by eliminating the requirement for image scaling, sampling, and / or compression (limited only by the dimensions of the optical processing system's waveguide array), which is not feasible with conventional electrical processor hardware or dedicated AI chips. Furthermore, if a composite optical system is designed to handle full-resolution images (i.e., image or video data at the full resolution of a given camera), such a composite system can be used in deep learning applications without pooling. Conventional deep learning models implemented in electrical chips and devices require pooling and low-resolution tensor / matrix operations because limitations in available hardware designs make them inefficient at high resolutions. In contrast, composite optical systems are efficient regardless of resolution and / or matrix size (limited only by the dimensions of the optical processing system's waveguide emitting and / or receiving arrays).

[0224] The dimensions of the composite system array will vary depending on the target platform constraints. For a smartphone composite system such as that shown in Figure 51, the array will be 4-6 mm in diameter, which will give a resolution range of 4000 x 4000 to 6000 x 6000 pixels for a 1 μm pixel pitch (as previously described for silicon-on-insulator waveguides at a design wavelength of 1550 nm). When constrained by operating speeds of 20 MHz to 30 GHz for the electro-optical components of the system (as previously described for the modulation and photodetection components), the data throughput of the composite system will be 320 TB / s to 480 PB / s for a 4 mm array, and 720 TB / s to 1 EB / s (all calculations assume 10-bit data resolution per waveguide). On the other hand, for larger composite systems, such as those designed for use in computer peripherals like those shown in Figures 48 and 49, a 20-40 mm diameter array would provide a resolution range of 20,000 x 20,000 to 40,000 x 40,000 pixels for a 1 μm pixel pitch. Constrained by operating speeds of 20 MHz to 30 GHz for the electro-optical components of the system, the data throughput of the composite system would be 8 PB / s to 12 EB / s and 32 PB / s to 48 EB / s for a 4 mm array (all calculations assume 10-bit data resolution per waveguide). Such analysis is by way of example only and does not limit the scope of the composite systems described, but rather indicates potential operating speeds for given design assumptions.

[0225] Similarly, for artificial intelligence applications, small and large array systems may be intended for different use cases, such as large array systems being used for training systems while small array systems are used for inference systems.

[0226] For artificial intelligence applications such as deep learning, optical information processing systems can be used in 4f system configurations as optical convolutional systems to perform convolution and deconvolution operations in convolutional neural networks. An optical 4f system is effectively a single convolutional, deconvolutional, and / or nonlinear layer of a deep learning neural network. More complex optical systems can be built by chaining together multiple layers (i.e., multiple devices, systems, configurations, structures, composite systems, and / or variations thereof). A sufficiently complex system can fully implement an all-optical neural network. More complex systems can be used to perform both convolution / deconvolution and nonlinear (e.g., ReLU) operations. More complex systems can be used to perform convolution / deconvolution, nonlinear operations, and other mathematical operations such as addition and multiplication. More complex systems may be artificial neural network optical information processing systems that take raw input from sensors, process the information directly, and output decisions electrically and / or optically, operate external devices, and / or pass the information to further electrical and / or optical computing systems.

[0227] For pattern recognition, optical information processing systems can be used in a 4f system configuration as cross-correlation systems that perform cross-correlations between one or more data or combinations of data. More complex systems can be used as pattern recognition optical information processing systems that process the cross-correlation output with peak detection algorithms or with variations of artificial intelligence systems and recognize matches.

[0228] For high-frequency trading, an artificial neural network optical information processing system may be configured as an optical high-frequency trading decision system that makes trading decisions using logic learned using historical and simulated exchange data. More complex systems may be used to perform differentiation and comparison operations between multiple data sources during the decision-making process. More complex systems may be used to detect and adapt to time-varying trading patterns. More complex systems may be used to learn competitor trading algorithms and react heuristically. More complex systems may combine any number of variations of the optical high-frequency trading decision system to create a more robust decision-making system. More complex systems may combine any variation of the artificial neural network optical information processing system with any variation of the optical computing system to create an all-optical high-frequency trading system.

[0229] For information and computer security, the artificial neural network optical information processing system can be configured as an optical information security system that analyzes information provided indirectly or directly by sensors, networks, and memory storage systems to perform network, computer, and system security and defense operations, authentication and authorization operations, and other information security tasks.

[0230] With respect to data pre-processing / post-processing, the optical information processing system may be configured as an optical data processing system that performs various mathematical operations such as scaling, filtering, segmenting, etc. to pre-process and / or post-process information for use in other optical information processing system variants and / or computer systems.

[0231] Regarding encryption / decryption, the optical information processing system and / or the artificial neural network optical information processing system can be configured as an encryption / decryption system.

[0232] With respect to compression / decompression, the optical information processing system and / or the artificial neural network optical information processing system may be configured as a compression / decompression system.

[0233] Regarding encoding / decoding, the optical information processing system and / or the artificial neural network optical information processing system may be configured as an encoding / decoding system.

[0234] In certain aspects, the term "communicate" is broadly interpreted to include both one-way communication and any number of potential types of communication, such as two-way communication, which, when referring to optical communication, may simply include the transfer of data, signals, or light from a first optical element to another optical element.

Claims

1. 1. A spatial light modulation device (SLM device), comprising: one or more optical inputs; one or more optical outputs; a plurality of waveguides arranged in an array of receivers and / or emitters, each waveguide coupled to one or more of said optical inputs; at least one light modulating element for modulating light passing through at least one of the plurality of said waveguides; wherein the waveguides and the light modulating elements are integrated in at least one common module, with one of the light input or light output having an interface with a free space region partially occupied by a vacuum, gas, liquid and / or solid medium.

2. 10. The SLM device of claim 1, wherein the module has electro-optical interconnects for connection to a processing system.

3. 3. The SLM device of claim 1, wherein at least one of the light modulating elements is in-line with at least one of the plurality of waveguides.

4. 4. The SLM device of claim 1, wherein at least one of the light modulating elements is a waveguide adjacent to at least one of the plurality of waveguides.

5. 5. The SLM device of claim 1, wherein at least one of the light modulating elements confines at least one of the plurality of waveguides.

6. 6. An SLM device according to claim 1, wherein at least one of the light modulation elements comprises one or more of the following: a thermo-optic phase shifter, an electro-optic polymer, at least one gain component and / or an evanescently coupled pump amplifier.

7. 7. An SLM device according to claim 1, wherein the optical input is external to the device and coupled to each of a plurality of the waveguides via a branching element.

8. 8. An SLM device according to any one of claims 1 to 7, further comprising a further waveguide array for splitting the light input into a plurality of optical paths.

9. 9. The SLM device of claim 1, further comprising a microlens array for capturing modulated light after passing through at least one of the plurality of waveguides and projecting the captured modulated light towards a free space region partially occupied by a vacuum, gas, liquid and / or solid medium.

10. 10. An SLM device according to claim 1, wherein a plurality of said waveguides branch off from a single waveguide coupled to said optical input.

11. 11. The SLM device according to claim 1, wherein the module integrates a plurality of waveguides and has a light emitting surface and / or a light receiving surface.

12. 12. The SLM device according to claim 1, wherein at least one of the plurality of waveguides has a planar light emitting surface and / or a planar light receiving surface.

13. 13. An SLM device according to any one of the preceding claims, wherein at least one of the plurality of waveguides has a non-planar light emitting surface and / or a non-planar light receiving surface.

14. 14. The SLM device according to any one of claims 1 to 13, which is a self-emissive SLM device.

15. 15. An optical processing system comprising a plurality of SLM devices according to any one of claims 1 to 14, wherein at least two SLM devices communicate via a common free space region partially occupied by a vacuum, gas, liquid and / or solid medium.

16. The optical processing system of claim 15 , wherein at least one lens is optically positioned between the at least two SLM devices.

17. 17. The optical processing system of claim 15 or 16, wherein at least one of the SLM devices interfaces with an electro-optical carrier.

18. 18. An optical processing system according to any one of claims 15 to 17, comprising at least one lens of focal length f and any number of additional optical elements.

19. 18. An optical processing system according to any one of claims 15 to 17, comprising at least one assembly of focal length f and any number of additional optical elements.

20. 18. The optical processing system of claim 15, wherein the optical path length of the free space region between two connected devices is equal to 2f.

21. 18. The optical processing system of claim 15, wherein the optical path length of the free space region between two connected devices is at least 2f.

22. 18. The optical processing system of claim 15, wherein the optical path length of the free space region between two connected devices is one or more of at least f, less than f, and equal to f.

23. 18. The optical processing system of claim 15, wherein the total optical path length of the free space region between three consecutively connected devices is equal to 4f.

24. 18. The optical processing system of claim 15, wherein the total optical path length of the free space region between three consecutively connected devices is at least 4f.

25. 18. The optical processing system of claim 15, wherein a total optical path length in the free space region between three consecutively connected devices is one or more of at least f, less than f, and equal to f.

26. 18. The optical processing system of claim 15, wherein one or more of the SLM devices perform light detection and detect one or more of the following: phase of light, amplitude of light, polarization of light, intensity of light, both phase and amplitude of light, both phase and intensity of light, both phase and polarization of light, both amplitude and polarization of light, both intensity and polarization of light, optionally intensity and polarization detected simultaneously, a combination of phase, amplitude and polarization of light, and a combination of phase, intensity and polarization of light.

27. 15. An optical correlator comprising a plurality of SLM devices according to any one of claims 1 to 14, wherein at least two SLM devices communicate via a common free space region partially occupied by a vacuum, gas, liquid and / or solid medium.

28. A receiver-transmitter SLM device comprising: a first plurality of elements arranged in an array of radiators; a second plurality of elements arranged in the receiver array; an array of waveguides coupling the array of emitters and the array of receivers; wherein the array of emitters, the array of receivers and the array of waveguides are integrated in a common module.

29. 30. The receiver-transmitter SLM device of claim 28, wherein the module has an electro-optical interconnect for connection to a processing system.

30. 30. A receiver-transmitter SLM device according to claim 28 or 29, wherein the first plurality of elements are coupled to respective optical fibers for enabling modulated light to exit the receiver-transmitter SLM device.

31. 31. A receiver-transmitter SLM device as described in any one of claims 28 to 30, wherein the second plurality of elements are coupled to respective optical fibers for enabling modulated light to enter the receiver-transmitter SLM device.

32. 32. A receiver-transmitter SLM device according to any one of claims 28 to 31, further comprising at least one light modulating element for modulating light passing through at least one said waveguide.

33. 33. The receiver-transmitter SLM device of claim 32, wherein at least one of said light modulating elements is in-line with at least one of said waveguides.

34. 34. A receiver-transmitter SLM device according to claim 32 or 33, wherein at least one said light modulating element is a waveguide adjacent to at least one said waveguide.

35. 35. A receiver-transmitter SLM device according to any one of claims 32 to 34, wherein at least one said light modulating element confines part or all of at least one said waveguide.

36. 36. A receiver-transmitter SLM device according to any one of claims 32 to 35, wherein at least one said light modulation element comprises one or more of the following: a thermo-optic modulator, an electro-optic modulator, an acousto-optic modulator, a mechanical modulator, at least one gain component, optionally wherein said at least one gain component comprises an evanescently coupled pump amplifier.

37. A receiver-transmitter SLM device according to any one of claims 28 to 36, wherein the array of emitters is coplanar with the array of receivers.

38. 37. A receiver-transmitter SLM device according to any one of claims 28 to 36, wherein the array of emitters lies in a plane perpendicular to the array of receivers.

39. 37. A receiver-transmitter SLM device according to any one of claims 28 to 36, wherein the array of emitters is in a plane opposite to the array of receivers.

40. 40. A receiver-transmitter SLM device according to any one of claims 28 to 39, wherein the number of emitters is equal to, greater than, or less than the number of receivers.

41. 41. A system comprising at least one SLM device according to any one of claims 1 to 14 and at least one receiver-transmitter SLM device according to any one of claims 28 to 40, configured to provide an optical input by receiving light at an array of receivers of the receiver-transmitter SLM device, wherein a plurality of the waveguides of the self-emissive SLM device branch off from a single waveguide coupled to the optical input.

42. 1. A photodetector device comprising: an array of inputs; an array of outputs; and a plurality of waveguides optically disposed between the array of inputs and the array of outputs, wherein the array of inputs, the array of outputs, and the plurality of waveguides are integrated into a common module, and a photodetector is provided to convert modulated light from the optical domain to the electrical domain.

43. 43. The light-sensing device of claim 42, further comprising at least one light-modulating element for modulating light passing through at least one of the plurality of waveguides.

44. 44. A photodetector device according to claim 42 or 43, wherein at least one of the plurality of waveguides terminates in one or a combination of the following: an interferometric photodetector, an electro-optic photodetector and / or a differential photodetector.

45. 45. A light detection device according to any one of claims 42 to 44, wherein one or more of the waveguides are split into multiple detectors for measuring multiple optical properties.

46. 46. ​​A light detection device according to any one of claims 42 to 45, wherein the light detector performs light detection by one or more of the following: detecting the phase of the light, detecting the amplitude of the light, detecting the polarization of the light, detecting the intensity of the light, detecting both the phase and amplitude of the light, detecting both the phase and intensity of the light, detecting both the phase and polarization of the light, detecting both the amplitude and polarization of the light, optionally the intensity and polarization can be detected simultaneously, detecting both the intensity and polarization of the light, detecting a combination of the phase, amplitude and polarization of the light, and detecting a combination of the phase, intensity and polarization of the light.

47. A display device comprising an SLM device according to any one of claims 1 to 14.

48. an SLM light detection device comprising one or more light inputs, one or more light outputs, a plurality of waveguides arranged in an array of receivers and / or emitters, each waveguide coupled to one or more of said light inputs, and at least one light modulation element for modulating light passing through at least one of said plurality of waveguides, said waveguides and said light modulation element being integrated into at least one common module, with one of said light inputs or light outputs having an interface with a free space region partially occupied by a vacuum, gas, liquid and / or solid medium; The SLM light detection device further comprises one or more light detection elements for converting the modulated light from the optical domain to the electrical domain, the light detection elements operating in conjunction with a plurality of waveguide elements of the waveguide or other plurality of the waveguides, the plurality of waveguide elements being arranged to form the array of receivers.

49. 49. An SLM light detection device according to claim 48, in accordance with any one of claims 1 to 47.

50. 1. A receiver-transmitter photodetection device comprising: a first plurality of elements arranged in an array of radiators; a second plurality of elements arranged in the receiver array; at least one waveguide coupling at least one of the first plurality of elements to at least one of the second plurality of elements; and the receiver-transmitter photodetector device further comprises one or more photodetector elements for converting modulated light from the optical domain to the electrical domain, the photodetector elements operating in conjunction with one or more of a plurality of said elements or one or more of a further plurality of elements, the plurality of said elements being arranged as part of an array of said receivers or as a further array of said receivers.

51. A receiver-transmitter photodetector device according to claim 50, in accordance with any one of claims 1 to 49.

52. 15. An optical information processing system comprising at least one SLM device according to any one of claims 1 to 14.

53. 50. An optical information processing system comprising at least one SLM photodetector device according to claim 48 or 49.

54. An optical information processing system including at least one receiver-transmitter photodetector device according to claim 50 or 51.

55. An optical information processing system comprising at least one receiver-transmitter SLM device according to any one of claims 28 to 40 and a photodetector device according to any one of claims 42 to 46.

56. 47. An optical information processing system comprising an SLM device according to any one of claims 1 to 14 and a light detection device according to any one of claims 42 to 46.

57. 15. An optical system comprising at least one SLM device according to any one of claims 1 to 14, wherein each one of the emission or reception surfaces of any given SLM shares a common optical axis with at least one other emission or reception surface through a free space region partially occupied by a vacuum, gas, liquid and / or solid medium.

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