Wiring circuit board

Abstract

To provide a wiring circuit board that can improve the degree of freedom in circuit design.SOLUTION: A wiring circuit board 1 includes a first insulating layer 2, a first circuit pattern 3, a metal support layer 4, and a second circuit pattern 7 that is independent from the first circuit pattern 3. The metal support layer 4 is disposed on the opposite side of the first insulating layer 2 from the first circuit pattern 3 in the thickness direction. The metal support layer 4 is insulated from the first circuit pattern 3 by the first insulating layer 2 and supports the first circuit pattern 3 and the first insulating layer 2. The second circuit pattern 7 includes a first terminal 71. The first terminal 71 has a metal layer 711 that is continuous with the metal support layer 4.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a printed circuit board. [Background technology]

[0002] Conventionally, a wired circuit board has been known that has a metal support layer, an insulating base layer arranged on one side of the metal support layer, and a conductor layer arranged on one side of the insulating base layer (see, for example, Patent Document 1 below). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 2020-188189 Summary of the Invention [Problem to be solved by the invention]

[0004] In the wired circuit board described in Patent Document 1, further improvement in the degree of freedom in circuit design is being considered.

[0005] The present invention provides a printed circuit board that can improve the degree of freedom in circuit design. [Means for solving the problem]

[0006] The present invention [1] includes a wired circuit board comprising an insulating layer, a first circuit pattern arranged on one side of the insulating layer in a thickness direction of the insulating layer, a metal support layer arranged on the opposite side of the insulating layer in the thickness direction from the first circuit pattern, insulated from the first circuit pattern by the insulating layer, and supporting the first circuit pattern and the insulating layer, and a second circuit pattern independent of the first circuit pattern, wherein the second circuit pattern has a first terminal having a metal layer continuous with the metal support layer.

[0007] According to this configuration, the first terminal of the second circuit pattern has a metal layer that is continuous with the metal support layer.

[0008] Therefore, by utilizing the metal support layer that supports the first circuit pattern, the second circuit pattern can be designed independently from the first circuit pattern.

[0009] As a result, the degree of freedom in circuit design can be improved.

[0010] Furthermore, since the metal layer of the first terminal is continuous with the metal support layer, the reduction in rigidity of the metal support layer due to the formation of the second circuit pattern can be suppressed compared to when a portion of the metal support layer is separated from the metal support layer to form the second circuit pattern.

[0011] The present invention [2] includes the wired circuit board according to the above [1], wherein the first terminal further has a metal terminal covering layer that covers the metal layer.

[0012] According to this configuration, the metal layer can be protected by the terminal covering layer.

[0013] The present invention [3] includes the wired circuit board of the above [2], further comprising a metallic covering layer that covers the metal support layer, and the terminal covering layer is continuous with the covering layer.

[0014] According to this configuration, the metal support layer can be protected by the covering layer.

[0015] Furthermore, the terminal covering layer can be formed simultaneously with the covering layer, which can prevent an increase in the number of steps.

[0016] The present invention [4] includes the wired circuit board of any one of [1] to [3] above, further comprising a conductor layer disposed between the insulating layer and the metal support layer in the thickness direction and having a higher conductivity than that of the metal support layer.

[0017] The present invention [5] includes the wired circuit board according to the above [4], wherein the first terminal further has a terminal conductor layer continuous with the conductor layer.

[0018] According to this configuration, a conductor layer having high conductivity is provided between the insulating layer and the metal support layer, and the conductor layer can be used to design a second circuit pattern that is independent from the first circuit pattern.

[0019] As a result, the degree of freedom in circuit design can be improved, and the conductive performance of the second circuit pattern can be improved.

[0020] The present invention [6] includes the wired circuit board according to the above [5], wherein the first terminal further has a metal terminal covering layer that covers the terminal conductor layer.

[0021] According to this configuration, the terminal conductor layer can be protected by the terminal covering layer.

[0022] The present invention [7] includes the wired circuit board according to the above [6], further comprising a metallic covering layer that covers the metal support layer, and the terminal covering layer is continuous with the covering layer.

[0023] According to this configuration, the metal support layer can be protected by the covering layer.

[0024] Furthermore, the terminal covering layer can be formed simultaneously with the covering layer, which can prevent an increase in the number of steps.

[0025] The present invention [8] includes the wired circuit board of any one of [5] to [7] above, wherein the second circuit pattern is arranged on one side of the insulating layer in the thickness direction and further comprises a second terminal electrically connected to the conductor layer.

[0026] According to this configuration, the first terminal and the second terminal can be electrically connected via the conductor layer.

[0027] This allows transmission of an electric signal or supply of electric power between the first terminal and the second terminal via the conductor layer.

[0028] The present invention [9] includes the wired circuit board of any one of the above [1] to [4], wherein the second circuit pattern is arranged on one side of the insulating layer in the thickness direction and further comprises a second terminal electrically connected to the metal support layer.

[0029] According to this configuration, the first terminal and the second terminal can be electrically connected via the metal support layer.

[0030] This allows electrical signals to be transmitted or power to be supplied between the first terminal and the second terminal via the metal support layer.

[0031] The present invention

[10] includes the wired circuit board of any one of the above [1] to [9], wherein one surface of the first terminal in the thickness direction is exposed from the insulating layer.

[0032] According to this configuration, one surface of the first terminal in the thickness direction can be used as a bonding surface with the electronic component. [Effects of the Invention]

[0033] According to the wired circuit board of the present invention, the degree of freedom in circuit design can be improved. [Brief explanation of the drawings]

[0034] [Figure 1] Fig. 1 is a plan view showing one embodiment of the wired circuit board of the present invention, in which the second insulating layer, the covering layer, and the edge covering layer are omitted. [Figure 2] Fig. 2A is a cross-sectional view taken along line AA of the printed circuit board shown in Fig. 1. Fig. 2B is a cross-sectional view taken along line BB of the printed circuit board shown in Fig. 1. [Figure 3]3A to 3C are process diagrams showing the manufacturing process of the wired circuit board shown in FIG. 1, where FIG. 3A shows the conductor layer forming process, FIG. 3B shows the first insulating layer forming process, and FIG. 3C shows the conductor pattern forming process. [Figure 4] Figures 4A to 4C are process diagrams showing the manufacturing process of a wired circuit board, following Figure 3C, where Figure 4A shows the second insulating layer forming process, Figure 4B shows the outer shape processing process, and Figure 4C shows the coating layer forming process. [Figure 5] FIG. 5 is a cross-sectional view of a modified example (1) of the printed circuit board. [Figure 6] FIG. 6 is a cross-sectional view of a modified example (2) of the printed circuit board. [Figure 7] FIG. 7 is a cross-sectional view of a modified example (3) of the printed circuit board. [Figure 8] FIG. 8 is a cross-sectional view of a modified example (4) of the printed circuit board. [Figure 9] FIG. 9 is a cross-sectional view of a modified example (5) of the printed circuit board. [Figure 10] FIG. 10 is a cross-sectional view of a modified example (6) of the printed circuit board. [Figure 11] FIG. 11 is a cross-sectional view of a modified example (7) of the printed circuit board. [Figure 12] 12A and 12B show a modified example (8) of the wired circuit board, where FIG. 12A is a cross-sectional view corresponding to the AA cross-sectional view of FIG. 2A, and FIG. 12B is a cross-sectional view corresponding to the BB cross-sectional view of FIG. 2A. [Figure 13] FIG. 13 is a cross-sectional view of a modified example (9) of the printed circuit board. [Figure 14] FIG. 14 is a cross-sectional view of a modified example (10) of the printed circuit board. [Figure 15] FIG. 15 is a plan view of a modified example (11) of the printed circuit board. [Figure 16] FIG. 16 is a plan view of a modified example (12) of the printed circuit board. [Figure 17] FIG. 17 is a plan view of a modified example (13) of the printed circuit board. [Figure 18] FIG. 18 is a plan view of a modified example (14) of the printed circuit board. DETAILED DESCRIPTION OF THE INVENTION

[0035] 1. Wiring circuit board As shown in FIG. 1, in this embodiment, the wired circuit board 1 extends in a first direction and a second direction. The first direction is the direction in which the multiple terminals 31A and 31B are arranged. The terminals 31A and 31B will be described later. The second direction is perpendicular to the first direction. The shape of the wired circuit board 1 is not limited to this embodiment.

[0036] As shown in FIG. 2A, the wired circuit board 1 includes a first insulating layer 2 as an example of an insulating layer, a first circuit pattern 3 (see FIG. 1), a metal support layer 4, a conductor layer 5, a coating layer 6, a second circuit pattern 7 (see FIG. 1), and a second insulating layer 8.

[0037] (1) First insulating layer The first insulating layer 2 insulates the metal support layer 4 and the conductor layer 5 from the first circuit pattern 3. The first insulating layer 2 is made of a resin. Examples of resins include polyimide, maleimide, epoxy resin, polybenzoxazole, and polyester. The first insulating layer 2 has through holes 21.

[0038] (2) First circuit pattern The first circuit pattern 3 is disposed on one side of the first insulating layer 2 in the thickness direction of the first insulating layer 2. The thickness direction is perpendicular to the first direction and the second direction. The first circuit pattern 3 is disposed on one surface of the first insulating layer 2 in the thickness direction.

[0039] 1, the first circuit pattern 3 has a plurality of terminals 31A, 31B, a plurality of terminals 32A, 32B, and a plurality of wirings 33A, 33B. The terminals 31A, 31B are aligned in a first direction. The terminal 31B is spaced apart from the terminal 31A in the first direction. The terminals 31A, 31B each extend in the first direction and the second direction. The terminals 31A, 31B each have a substantially rectangular shape.

[0040] 2B, each of the terminals 31A and 31B has a conductor layer 311. Each of the terminals 31A and 31B may have a coating layer 312, if necessary.

[0041] Conductive layer 311 is disposed on one surface of first insulating layer 2 in the thickness direction. Conductive layer 311 is made of a metal. Examples of metals include copper, silver, gold, iron, aluminum, chromium, and alloys thereof. From the viewpoint of obtaining good electrical properties, conductive layer 311 is preferably made of copper.

[0042] The covering layer 312 covers the surface of the conductor layer 311. In this embodiment, the covering layer 312 covers a central portion (a portion not covered with the second insulating layer 8) of one surface of the conductor layer 311 in the thickness direction. The covering layer 312 has a surface layer 312A. The surface layer 312A is made of a metal different from that of the conductor layer 311. The surface layer 312A is made of, for example, gold. The covering layer 312 preferably has an intermediate layer 312B. The covering layer 312 does not necessarily have to have the intermediate layer 312B. The intermediate layer 312B is disposed between the conductor layer 311 and the surface layer 312A. The intermediate layer 312B is made of a metal different from that of the conductor layer 311 and the surface layer 312A. The intermediate layer 312B is made of, for example, nickel.

[0043] As shown in FIG. 1, terminal 32A is disposed at a distance from terminal 31A in the second direction. Terminal 32B is disposed at a distance from terminal 31B in the second direction. Terminals 32A and 32B are aligned in the first direction. Terminal 32B is disposed at a distance from terminal 32A in the first direction. Each of terminals 32A and 32B has, for example, a substantially rectangular shape. The description of terminals 32A and 32B is the same as the description of terminals 31A and 31B. Therefore, the description of terminals 32A and 32B will be omitted.

[0044] The wiring 33A electrically connects the terminal 31A and the terminal 32A. One end of the wiring 33A is connected to the terminal 31A. Specifically, one end of the wiring 33A is connected to the conductor layer 311 of the terminal 31A (see FIG. 2A). The other end of the wiring 33A is connected to the terminal 32A. Specifically, the other end of the wiring 33A is connected to the conductor layer 311 of the terminal 32A (see FIG. 2A).

[0045] The wiring 33B electrically connects the terminal 31B and the terminal 32B. One end of the wiring 33B is connected to the terminal 31B. The other end of the wiring 33B is connected to the terminal 32B.

[0046] The wirings 33A and 33B are made of the same material as the conductor layer 311.

[0047] (3) Metal support layer As shown in Figures 2A and 2B, the metal support layer 4 is disposed on the other side of the first insulating layer 2 in the thickness direction. The metal support layer 4 is disposed on the opposite side of the first insulating layer 2 from the first circuit pattern 3 in the thickness direction. The metal support layer 4 is insulated from the first circuit pattern 3 by the first insulating layer 2. The metal support layer 4 supports the first circuit pattern 3 and the first insulating layer 2. The entire metal support layer 4 overlaps the first insulating layer 2 in the thickness direction. Examples of materials for the metal support layer 4 include stainless steel and copper alloys.

[0048] (4) Conductor layer The conductor layer 5 is disposed on the other side of the first insulating layer 2 and on one side of the metal support layer 4 in the thickness direction. In other words, the conductor layer 5 is disposed between the first insulating layer 2 and the metal support layer 4 in the thickness direction. The conductor layer 5 contacts the other surface of the first insulating layer 2 and the one surface of the metal support layer 4 in the thickness direction. The conductor layer 5 is disposed on the opposite side of the first insulating layer 2 from the first circuit pattern 3 in the thickness direction. The conductor layer 5 is insulated from the first circuit pattern 3 by the first insulating layer 2. The conductor layer 5 extends from one end to the other end of the metal support layer 4 in the first direction as shown in FIG. 2A, and extends from one end to the other end of the metal support layer 4 in the second direction as shown in FIG. 2B. The conductor layer 5 does not have a wiring pattern. The entire conductor layer 5 overlaps the first insulating layer 2 in the thickness direction. The conductor layer 5 overlaps, in the thickness direction, the entire first circuit pattern 3. The conductivity of the conductor layer 5 is higher than the conductivity of the metal support layer 4. The conductor layer 5 is made of, for example, copper.

[0049] Preferably, a bonding layer is disposed between the metal support layer 4 and the conductor layer 5 to bond the metal support layer 4 and the conductor layer 5. The bonding layer is made of a metal. Examples of materials for the bonding layer include chromium, nickel, titanium, and alloys thereof.

[0050] Preferably, a protective metal layer is disposed between the conductor layer 5 and the first insulating layer 2 to protect the conductor layer 5. The protective metal layer is made of a metal. Examples of materials for the protective metal layer include chromium, nickel, titanium, and alloys thereof.

[0051] The bonding layer and the protective metal layer are not shown.

[0052] (5) Covering layer The coating layer 6 coats the metal support layer 4. Specifically, the coating layer 6 coats the entire other surface S1 of the metal support layer 4 in the thickness direction. The coating layer 6 also coats the entire end face S2 of the metal support layer 4 and the entire end face S3 of the conductor layer 5. In this embodiment, the end face S3 of the conductor layer 5 is continuous with the end face S2 of the metal support layer 4 in the thickness direction. The end face S3 of the conductor layer 5 is discontinuous with the end face of the first insulating layer 2. The coating layer 6 has a surface layer 61. The coating layer 6 preferably has an intermediate layer 62. The coating layer 6 does not necessarily have the intermediate layer 62. The intermediate layer 62 is disposed between the metal support layer 4 and the surface layer 61, and between the conductor layer 5 and the surface layer 61. The coating layer 6 is made of a metal. Specifically, the surface layer 61 is made of a metal different from the metal support layer 4 and the conductor layer 5. The surface layer 61 is made of, for example, gold. The intermediate layer 62 is made of a metal different from the metal support layer 4, the conductor layer 5, and the surface layer 61. The intermediate layer 62 is made of, for example, nickel.

[0053] (6) Second circuit pattern 1, the second circuit pattern 7 is independent from the first circuit pattern 3. The second circuit pattern 7 includes a first terminal 71 and a second terminal 72. The first terminal 71 and the second terminal 72 are electrically connected via the conductor layer 5 (see FIG. 2A), so that the second circuit pattern 7 functions as an electric circuit independent from the first circuit pattern 3.

[0054] (6-1) 1st terminal In this embodiment, the first terminal 71 is disposed at one end of the wired circuit board 1 in the second direction. The first terminal 71 has a rectangular column shape extending in the second direction. The position and shape of the first terminal 71 are not limited to this embodiment.

[0055] As shown in FIG. 2A, the first terminal 71 is continuous with the metal support layer 4. Therefore, the first terminal 71 is electrically connected to the metal support layer 4. The first terminal 71 does not overlap with the first insulating layer 2 in the thickness direction. In this embodiment, the first terminal 71 is disposed on one side of the end face of the first insulating layer 2 in the second direction. Therefore, one side surface of the first terminal 71 in the thickness direction is exposed from the first insulating layer 2. The first terminal 71 also does not overlap with the second insulating layer 8 in the thickness direction.

[0056] The first terminal 71 includes a metal layer 711 , a terminal conductor layer 712 , and a terminal covering layer 713 .

[0057] The metal layer 711 is continuous with the metal support layer 4. The metal layer 711 is a single layer together with the metal support layer 4. The metal layer 711 is made of the same material as the metal support layer 4. In this embodiment, the metal layer 711 extends from one end of the metal support layer 4 to one side (outside) in the second direction.

[0058] The terminal conductor layer 712 is disposed on one side of the metal layer 711 in the thickness direction. The terminal conductor layer 712 is disposed on one surface of the metal layer 711 in the thickness direction. The terminal conductor layer 712 is continuous with the conductor layer 5. The terminal conductor layer 712 is a single layer together with the conductor layer 5. The terminal conductor layer 712 is made of the same material as the conductor layer 5. In this embodiment, the terminal conductor layer 712 extends from one end of the conductor layer 5 to one side (outside) in the second direction.

[0059] The terminal covering layer 713 covers the terminal conductor layer 712. Specifically, the terminal covering layer 713 covers the entire one-side surface S11 of the terminal conductor layer 712 in the thickness direction. The terminal covering layer 713 also covers the entire other-side surface S12 of the metal layer 711 in the thickness direction, the entire end face S13 of the terminal conductor layer 712, and the entire end face S14 of the metal layer 711. In this embodiment, the end face S13 of the terminal conductor layer 712 is continuous with the end face S14 of the metal layer 711 in the thickness direction. The terminal covering layer 713 has a surface layer 713A. The terminal covering layer 713 preferably has an intermediate layer 713B. The terminal covering layer 713 does not necessarily have to have the intermediate layer 713B. The intermediate layer 713B is disposed between the metal layer 711 and the surface layer 713A and between the terminal conductor layer 712 and the surface layer 713A. The terminal coating layer 713 is continuous with the coating layer 6. More specifically, the surface layer 713A is continuous with the surface layer 61 of the coating layer 6. The intermediate layer 713B is continuous with the intermediate layer 62 of the coating layer 6. The surface layer 713A is made of a metal different from the metal layer 711 and the terminal conductor layer 712. The surface layer 713A is made of the same material as the surface layer 61 of the coating layer 6. The surface layer 713A is made of, for example, gold. The intermediate layer 713B is made of a metal different from the metal layer 711, the terminal conductor layer 712, and the surface layer 713A. The intermediate layer 713B is made of the same material as the intermediate layer 62 of the coating layer 6. The intermediate layer 713B is made of, for example, nickel. In other words, the terminal coating layer 713 is made of a metal.

[0060] (6-2) 2nd terminal 1, in this embodiment, the second terminal 72 is disposed at the other end of the wired circuit board 1 in the second direction. The second terminal 72 has a substantially rectangular shape. The position and shape of the second terminal 72 are not limited to this embodiment.

[0061] 2A, the second terminal 72 is disposed on one side of the first insulating layer 2 in the thickness direction. The second terminal 72 is electrically connected to the terminal conductor layer 712 through the through hole 21 of the first insulating layer 2.

[0062] The second terminal 72 has a conductor layer 721, similar to the terminal 31A of the first circuit pattern 3. The second terminal 72 may have a covering layer 722, if necessary.

[0063] The conductor layer 721 is disposed on one surface of the first insulating layer 2 in the thickness direction. The conductor layer 721 is made of the same material as the terminal 31A of the first circuit pattern 3.

[0064] The covering layer 722 covers the surface of the conductor layer 721. In this embodiment, the covering layer 722 covers a central portion (a portion not covered with the second insulating layer 8) of one surface of the conductor layer 721 in the thickness direction. The covering layer 722 has a surface layer 722A. The surface layer 722A is made of, for example, gold. The covering layer 722 preferably has an intermediate layer 722B. The covering layer 722 does not necessarily have to have the intermediate layer 722B. The intermediate layer 722B is disposed between the conductor layer 721 and the surface layer 722A. The intermediate layer 722B is made of, for example, nickel.

[0065] (7) Second insulating layer The second insulating layer 8 is disposed on one side of the first insulating layer 2 in the thickness direction. The second insulating layer 8 is disposed on one surface of the first insulating layer 2 in the thickness direction. The second insulating layer 8 is made of a resin. Examples of resins include polyimide, maleimide, epoxy resin, polybenzoxazole, and polyester. The second insulating layer 8 covers the wiring 33A and 33B (see FIG. 1). The second insulating layer 8 may cover the peripheral portions of the terminals 31A, 31B, 32A, 32B, and the second terminal 72. The second insulating layer 8 does not cover the central portions of the terminals 31A, 31B, 32A, 32B, and the second terminal 72.

[0066] 2. Manufacturing method of printed circuit board Next, a method for manufacturing the wired circuit board 1 will be described.

[0067] The method for manufacturing the wired circuit board 1 includes a conductor layer forming step (see FIG. 3A), a first insulating layer forming step (see FIG. 3B), a conductor pattern forming step (see FIG. 3C), a second insulating layer forming step (see FIG. 4A), an outer shape processing step (see FIG. 4B), and a cover layer forming step (see FIG. 4C).

[0068] (1) Conductor layer formation process As shown in FIG. 3A, in the conductor layer forming step, a conductor layer P is formed on the entire surface of a metal substrate M by, for example, electrolytic plating.

[0069] Specifically, first, the above-described bonding layer is formed on one surface of the substrate M in the thickness direction. The bonding layer is formed by, for example, sputtering.

[0070] Next, a conductor layer P is formed on the bonding layer by, for example, electrolytic plating.

[0071] (2) First insulating layer formation process Next, as shown in FIG. 3B, in the first insulating layer forming step, a first insulating layer 2 is formed on one surface of the conductor layer P.

[0072] More specifically, in the first insulating layer forming step, first, the protective metal layer is formed in the thickness direction on one surface of the conductor layer P. The protective metal layer is formed by, for example, sputtering.

[0073] Next, a photosensitive resin solution (varnish) is applied onto the conductor layer P and dried to form a photosensitive resin coating. Next, the photosensitive resin coating is exposed to light and developed. This results in the first insulating layer 2.

[0074] (3) Conductor pattern formation process 3C, in the conductor pattern forming step, conductor pattern 10 is formed on first insulating layer 2. Conductive pattern 10 has conductor layers 311 of terminals 31A, 31B, 32A, and 32B, wiring 33A and 33B, and conductor layer 721 of second terminal 72.

[0075] Specifically, first, a seed layer is formed on one surface of the first insulating layer 2 and one surface of the conductor layer P in the thickness direction. The seed layer is formed by, for example, sputtering. Examples of materials for the seed layer include chromium, copper, nickel, titanium, and alloys thereof.

[0076] The seed layer is then coated with a plating resist.

[0077] Next, the plating resist is exposed to light and developed, which removes the plating resist from the area where the conductive pattern 10 is to be formed, exposing the seed layer in the area where the conductive pattern 10 is to be formed. On the other hand, the plating resist remains in the area where the conductive pattern 10 is not to be formed.

[0078] Next, the conductive pattern 10 is formed on the exposed seed layer by electrolytic plating. After the electrolytic plating is completed, the plating resist is stripped off, and the seed layer exposed by the stripping of the plating resist is removed by etching.

[0079] As a result, the conductive pattern 10 is formed on the first insulating layer 2.

[0080] (4) Second insulating layer formation process Next, as shown in FIG. 4A, in the second insulating layer forming step, a second insulating layer 8 is formed on the first insulating layer 2.

[0081] More specifically, in the second insulating layer forming process, first, a photosensitive resin solution (varnish) is applied onto the conductor pattern 10, the first insulating layer 2, and the conductor layer P, and then dried to form a photosensitive resin coating.

[0082] Next, the photosensitive resin coating is exposed to light and developed, thereby forming a second insulating layer 8 on the first insulating layer 2.

[0083] (5) External shape processing process Next, as shown in FIG. 4B, in the contour processing step, the base material M and the conductor layer P are etched to form the metal support layer 4, the conductor layer 5, the metal layer 711, and the terminal conductor layer 712.

[0084] (6) Covering layer formation process Next, as shown in FIG. 4C, in the coating layer formation process, for example, electroless nickel plating and electroless gold plating are performed in sequence to simultaneously form coating layer 312, coating layer 722, coating layer 6, and terminal coating layer 713.

[0085] In this way, the above-described wired circuit board 1 is obtained.

[0086] 3. Effects (1) According to the wired circuit board 1, as shown in FIGS. 1 and 2A, the first terminal 71 of the second circuit pattern 7 has a metal layer 711 that is continuous with the metal support layer 4.

[0087] Therefore, the second circuit pattern 7 can be designed independently from the first circuit pattern 3 by utilizing the metal support layer 4 that supports the first circuit pattern 3 .

[0088] As a result, the degree of freedom in circuit design can be improved.

[0089] Furthermore, since the metal layer 711 of the first terminal 71 is continuous with the metal support layer 4, the reduction in rigidity of the metal support layer 4 due to the formation of the second circuit pattern 7 can be suppressed compared to the case where the second circuit pattern 7 is formed by separating a portion of the metal support layer 4 from the metal support layer 4.

[0090] (2) According to the wired circuit board 1, as shown in FIG. 2A, the first terminal 71 has a terminal covering layer 713 made of metal that covers the metal layer 711.

[0091] Therefore, the metal layer 711 can be protected by the terminal covering layer 713.

[0092] (3) According to the wired circuit board 1, as shown in FIG. 2A, the terminal covering layer 713 is continuous with the covering layer 6 that covers the metal support layer 4.

[0093] Therefore, the metal support layer 4 can be protected by the covering layer 6.

[0094] Furthermore, the terminal covering layer 713 can be formed simultaneously with the covering layer 6, thereby suppressing an increase in the number of steps.

[0095] (4) As shown in Figures 2A and 2B, the wired circuit board 1 has a conductor layer 5. The conductor layer 5 is disposed between the first insulating layer 2 and the metal support layer 4 in the thickness direction. The first terminal 71 further has a terminal conductor layer 712 that is continuous with the conductor layer 5.

[0096] Therefore, a conductor layer 5 having high conductivity is provided between the first insulating layer 2 and the metal support layer 4, and this conductor layer 5 can be used to design a second circuit pattern 7 independent of the first circuit pattern 3.

[0097] As a result, the degree of freedom in circuit design can be improved, and the conductive performance of the second circuit pattern 7 can be improved.

[0098] (5) According to the wired circuit board 1, as shown in FIG. 2A, the terminal covering layer 713 covers not only the metal layer 711 but also the terminal conductor layer 712.

[0099] Therefore, the terminal covering layer 713 can also protect the terminal conductor layer 712 .

[0100] (6) According to the wired circuit board 1, as shown in Figures 1 and 2A, the second circuit pattern 7 includes a second terminal 72. The second terminal 72 is disposed on one side of the first insulating layer 2 in the thickness direction and is electrically connected to the conductor layer 5 through the through hole 21.

[0101] Therefore, the first terminal 71 and the second terminal 72 can be electrically connected via the conductor layer 5.

[0102] This allows transmission of an electric signal or supply of electric power between the first terminal 71 and the second terminal 72 via the conductor layer 5.

[0103] (7) According to the wired circuit board 1, one surface of the first terminal 71 in the thickness direction is exposed from the first insulating layer 2, as shown in FIGS.

[0104] Therefore, one surface of the first terminal 71 in the thickness direction can be used as a bonding surface with an electronic component.

[0105] 4. Variations In the modified example, the same components as those in the above-described embodiment are denoted by the same reference numerals, and the description thereof will be omitted.

[0106] (1) As shown in Fig. 5, the wired circuit board 1 may not have the conductor layer 5 and the terminal conductor layer 712. In this case, the metal support layer 4 contacts the other surface of the first insulating layer 2 in the thickness direction. The second terminal 72 is electrically connected to the metal support layer 4 through the through hole 21 of the first insulating layer 2.

[0107] This allows the first terminal 71 and the second terminal 72 to be electrically connected via the metal support layer 4.

[0108] (2) As shown in Fig. 6, the wired circuit board 1 does not need to have the covering layer 6. The terminal covering layer 713 covers one surface S11 of the terminal conductor layer 712 in the thickness direction, but does not need to cover the other surface S12 of the metal layer 711 in the thickness direction, the end face S13 of the terminal conductor layer 712, and the end face S14 of the metal layer 711.

[0109] When the wired circuit board 1 does not have the covering layer 6, the covering layer forming step may be carried out after the second insulating layer forming step and before the outer shape processing step.

[0110] (3) As shown in Fig. 7, the wired circuit board 1 may not have the conductor layer 5, the terminal conductor layer 712, and the covering layer 6. The terminal covering layer 713 may cover one surface of the metal layer 711 in the thickness direction, but may not cover the other surface S12 of the metal layer 711 in the thickness direction and the end face S14 of the metal layer 711.

[0111] (4) As shown in FIG. 8, when the wired circuit board 1 does not have the covering layer 6, the end surface S3 of the conductor layer 5 may be covered with the first insulating layer 2.

[0112] (5) The end face S2 of the metal support layer 4 may be discontinuous with the end face S3 of the conductor layer 5. Specifically, as shown in FIG. 9, the end face S2 of the metal support layer 4 may be located more inward than the end face S3 of the conductor layer 5. The end face S3 of the conductor layer 5 may be continuous with the end face of the first insulating layer 2. The end face S14 of the metal layer 711 may be discontinuous with the end face S13 of the terminal conductor layer 712. The end face S14 of the metal layer 711 may be located more inward than the end face S13 of the terminal conductor layer 712.

[0113] (6) As shown in FIG. 10, the end face S13 of the terminal conductor layer 712 may be disposed further inward than the end face S14 of the metal layer 711.

[0114] (7) As shown in FIG. 11, the end face S3 of the conductor layer 5 may be disposed further inward than the end face S2 of the metal support layer 4.

[0115] (8) As shown in Fig. 12A, in the second direction, the end face S3 of the conductor layer 5 may be located more inward than the end face S2 of the metal support layer 4 and may be covered by the first insulating layer 2. In this case, as shown in Fig. 12B, in the first direction, the end face S3 of the conductor layer 5 may also be located more inward than the end face S2 of the metal support layer 4 and may be covered by the first insulating layer 2.

[0116] (9) As shown in Figure 13, in variant example (8) (see Figure 12A), the terminal covering layer 713 covers one side surface S11 of the terminal conductor layer 712 in the thickness direction and the end face S13 of the terminal conductor layer 712, and does not need to cover the other side surface S12 of the metal layer 711 in the thickness direction and the end face S14 of the metal layer 711.

[0117] (10) As shown in FIG. 14, in the above-described embodiment (see FIG. 2A), the terminal covering layer 713 may cover one side surface S11 of the terminal conductor layer 712 in the thickness direction and an end face S13 of the terminal conductor layer 712, but may not cover the other side surface S12 of the metal layer 711 in the thickness direction and an end face S14 of the metal layer 711.

[0118] (11) The positions of the first terminal 71 and the second terminal 72 are not limited to those in the above embodiment. As shown in Fig. 15, the second terminal 72 may be aligned with the terminals 32A and 32B in the first direction.

[0119] (12) As shown in FIG. 16, the first terminal 71 may be aligned with the terminals 31A and 31B in the first direction, and the second terminal 72 may be aligned with the terminals 32A and 32B in the first direction.

[0120] (13) As shown in Fig. 17, the wired circuit board 1 may have a predetermined width in the second direction and extend in the first direction. The second terminal 72 may be aligned with the terminals 31A and 31B in the first direction. The first terminal 71 may be spaced apart from the second terminal 72 in the first direction. The first terminal 71 may be located at the other end of the wired circuit board 1 in the second direction.

[0121] (14) As shown in Fig. 18, the first terminal 71 may be disposed between the terminal 31A and the terminal 32A in the second direction. In other words, the first terminal 71 is aligned with the wirings 33A and 33B in the first direction. The first terminal 71 is disposed on the opposite side of the wiring 33A from the wiring 33B in the first direction.

[0122] (15) In the above modifications (1) to (14), the degree of freedom in circuit design can be improved, just like in the above embodiment. [Explanation of symbols]

[0123] 1 Wiring circuit board 3 First circuit pattern 4 Metal support layer 5 Conductor layer 6 Covering layer 7 Second circuit pattern 71 1st terminal 72 2nd terminal 711 Metal layer 712 Terminal conductor layer 713 Terminal coating layer

Claims

1. an insulating layer; a first circuit pattern disposed on one side of the insulating layer in a thickness direction of the insulating layer; a metal support layer disposed on an opposite side of the insulating layer to the first circuit pattern in the thickness direction, insulated from the first circuit pattern by the insulating layer, and supporting the first circuit pattern and the insulating layer; a second circuit pattern independent of the first circuit pattern; Equipped with The second circuit pattern includes a first terminal having a metal layer continuous with the metal support layer.

2. The printed circuit board according to claim 1 , wherein the first terminal further includes a metal terminal covering layer that covers the metal layer.

3. Further provided is a metallic covering layer that covers the metallic support layer, The wired circuit board according to claim 2 , wherein the terminal covering layer is continuous with the covering layer.

4. The wired circuit board according to claim 1 , further comprising a conductor layer disposed between the insulating layer and the metal support layer in the thickness direction, the conductor layer having a higher conductivity than a conductivity of the metal support layer.

5. The printed circuit board according to claim 4 , wherein the first terminal further includes a terminal conductor layer continuous with the conductor layer.

6. The wired circuit board according to claim 5 , wherein the first terminal further includes a metal terminal covering layer that covers the terminal conductor layer.

7. Further provided is a metallic covering layer that covers the metallic support layer, The wired circuit board according to claim 6 , wherein the terminal covering layer is continuous with the covering layer.

8. The second circuit pattern is The wired circuit board according to claim 5 , further comprising a second terminal disposed on one side of the insulating layer in the thickness direction and electrically connected to the conductor layer.

9. The second circuit pattern is The wired circuit board according to claim 1 , further comprising a second terminal disposed on one side of the insulating layer in the thickness direction and electrically connected to the metal support layer.

10. The printed circuit board according to claim 1 , wherein one surface of the first terminal in the thickness direction is exposed from the insulating layer.

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