Wiring circuit board

Abstract

To provide a wiring circuit board in which the occurrence of a crack in a conductor pattern can be suppressed in a vicinity of an end part of a wiring part.SOLUTION: A wiring circuit board 1 includes a wiring part 3, and a first support part 2A that supports one end part of the wiring part 3. A metal support layer 11 of the wiring part 3 includes a first edge E1 corresponding to an edge on one side, and a second edge E2 corresponding to an edge on the other side. A conductor pattern 13 of the wiring part 3 includes a main body part 13A disposed apart from the first support part 2A, and a first part 13B disposed between the first support part 2A and the main body part 13A. The main body part 13A includes a third edge E3 corresponding to an edge on one side, and a fourth edge E4 corresponding to an edge on the other side. The first part 13B includes a fifth edge E5 corresponding to an edge on one side, and a sixth edge E6 corresponding to an edge on the other side. The fifth edge R5 is disposed between the third edge E3 and the first edge E1.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a printed circuit board. [Background technology]

[0002] BACKGROUND ART Conventionally, a wired circuit board is known that includes a metal support layer, an insulating base layer disposed on the upper surface of the metal support layer, and wiring disposed on the upper surface of the insulating base layer (see, for example, Patent Document 1 below). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 2019-212679 Summary of the Invention [Problem to be solved by the invention]

[0004] In a wired circuit board such as that described in Patent Document 1, when a first portion of the wired circuit board is fixed to a first electronic component and a second portion separated from the first portion is fixed to a second electronic component, if the first electronic component moves in the thickness direction of the wired circuit board relative to the second electronic component, the wired circuit board may bend in the thickness direction of the wired circuit board near the first portion or the second portion.

[0005] This may cause stress to concentrate on the wiring arranged in the curved portion, which may cause cracks in the wiring.

[0006] The present invention provides a wired circuit board that can suppress the occurrence of cracks in a conductor pattern near the end of a wiring portion. [Means for solving the problem]

[0007] The present invention [1] provides a method for manufacturing a semiconductor device comprising: a wiring portion extending in a first direction; and a first support portion supporting one end of the wiring portion; the wiring portion having a metal support layer, a conductor pattern disposed on one side of the metal support layer in a thickness direction of the metal support layer, and an insulating layer disposed between the metal support layer and the conductor pattern in the thickness direction; the metal support layer having a first edge which is an edge on one side and a second edge which is an edge on the other side in a second direction perpendicular to both the thickness direction and the first direction; the conductor pattern being a main body portion disposed away from the first support portion in the first direction; the third edge of the main body portion is disposed between the center of the metal support layer and the first edge of the metal support layer in the second direction, and the fifth edge of the first portion is disposed between the center of the metal support layer and the first edge of the metal support layer in the second direction, and the fifth edge of the first portion is disposed between the third edge and the first edge in the second direction.

[0008] With this configuration, the fifth edge of the first portion is disposed between the third edge and the first edge in the second direction. In other words, the fifth edge of the first portion is disposed closer to the first edge of the metal support layer in the second direction than the third edge of the main body portion.

[0009] This allows the stress concentrated on the first portion to be dispersed to one side in the second direction relative to the main body portion.

[0010] As a result, it is possible to prevent stress near one end of the wiring portion from concentrating on the first portion, and to prevent cracks from occurring in the conductor pattern near one end of the wiring portion.

[0011] The present invention [2] includes the wired circuit board of [1] above, in which the fourth edge of the main body portion is positioned between the center of the metal support layer and the second edge of the metal support layer in the second direction, and the sixth edge of the first portion is positioned between the fourth edge and the second edge in the second direction.

[0012] With this configuration, the sixth edge of the first portion is disposed between the fourth edge and the second edge in the second direction. In other words, the sixth edge of the first portion is disposed closer to the second edge of the metal support layer in the second direction than the fourth edge of the main body portion.

[0013] This allows the stress concentrated on the first portion to be dispersed to the other side in the second direction relative to the main body portion.

[0014] As a result, it is possible to further prevent stress near one end of the wiring portion from concentrating on the first portion, and to further prevent cracks from occurring in the conductive pattern near one end of the wiring portion.

[0015] The present invention [3] includes the wired circuit board of [1] or [2] above, wherein the conductor pattern has wiring, and the width of the wiring in the first portion is wider than the width of the wiring in the main body portion.

[0016] According to this configuration, the width of the wiring in the first portion can be made wider than the width of the wiring in the main body portion, thereby dispersing stress concentrated on the wiring in the first portion.

[0017] As a result, cracks can be prevented from occurring in the wiring near one end of the wiring portion.

[0018] The present invention [4] includes the wired circuit board of [1] or [2] above, wherein the conductor pattern has a first wiring and a second wiring arranged at a distance from the first wiring in the second direction, and the distance between the first wiring and the second wiring in the first portion is wider than the distance between the first wiring and the second wiring in the main body portion.

[0019] With this configuration, the distance between the first wiring and the second wiring in the first portion is wider than the distance between the first wiring and the second wiring in the main body portion, thereby dispersing stress concentrated on the wiring (first wiring and second wiring) in the first portion.

[0020] As a result, cracks can be prevented from occurring in the wiring near one end of the wiring portion.

[0021] The present invention [5] includes the wired circuit board of [4] above, wherein the width of each of the first wiring and the second wiring in the first portion is wider than the width of each of the first wiring and the second wiring in the main body portion.

[0022] With this configuration, the width of each of the first wiring and second wiring in the first portion can be made wider than the width of each of the first wiring and second wiring in the main body portion, thereby dispersing stress concentrated on the wiring (first wiring and second wiring) in the first portion.

[0023] As a result, cracks can be further prevented from occurring in the wiring near one end of the wiring portion.

[0024] The present invention [6] includes the wired circuit board of any one of the above [1] to [5], wherein the thickness of the first portion is thinner than the thickness of the main body portion.

[0025] With this configuration, it is possible to reduce the bending moment applied to the first portion.

[0026] As a result, cracks can be further prevented from occurring in the conductive pattern near one end of the wiring portion.

[0027] The present invention [7] includes the wired circuit board of any one of [1] to [6] above, further comprising a second support portion that supports the other end of the wiring portion, wherein the conductor pattern is arranged between the second support portion and the main body portion in the first direction, and further comprising a second portion connected to the second support portion, the second portion having a seventh edge that is an edge on one side in the second direction and an eighth edge that is an edge on the other side, and the seventh edge of the first portion is arranged between the third edge and the first edge in the second direction.

[0028] With this configuration, the seventh edge of the second portion is disposed between the third edge and the first edge in the second direction. In other words, the seventh edge of the second portion is disposed closer to the first edge of the metal support layer in the second direction than the third edge of the main body portion.

[0029] This allows the stress concentrated on the second portion to be dispersed to one side in the second direction relative to the main body portion.

[0030] As a result, it is possible to prevent stress near the other end of the wiring portion from concentrating on the first portion, and to prevent cracks from occurring in the conductive pattern near the other end of the wiring portion.

[0031] The present invention [8] includes a wired circuit board comprising a wiring portion extending in a first direction and a first support portion supporting one end of the wiring portion in the first direction, the wiring portion having an insulating layer and a conductor pattern arranged on one side of the insulating layer in the thickness direction of the insulating layer, the conductor pattern having a main portion arranged away from the first support portion in the first direction and a first portion arranged between the first support portion and the main portion in the first direction and connected to the first support portion, the thickness of the first portion being thinner than the thickness of the main portion.

[0032] With this configuration, it is possible to reduce the bending moment applied to the first portion.

[0033] As a result, cracks can be prevented from occurring in the conductor pattern near one end of the wiring portion.

[0034] The present invention [9] includes the wired circuit board of the above [8], further comprising a second support portion that supports the other end of the wiring portion, the conductor pattern being arranged between the second support portion and the main body portion in the first direction and further comprising a second portion connected to the second support portion, the thickness of the second portion being thinner than the thickness of the main body portion.

[0035] With this configuration, the bending moment applied to the second portion can be reduced.

[0036] As a result, cracks can be prevented from occurring in the conductive pattern near the other end of the wiring portion. [Effects of the Invention]

[0037] According to the wired circuit board of the present invention, it is possible to prevent cracks from occurring in the conductor pattern near the end of the wiring portion. [Brief explanation of the drawings]

[0038] [Figure 1] Fig. 1 is a plan view of a first embodiment of the wired circuit board of the present invention, in which the second insulating layer is omitted. [Figure 2] Fig. 2A is a cross-sectional view taken along line AA of the wired circuit board shown in Fig. 1. Fig. 2B is a cross-sectional view taken along line BB of the wired circuit board shown in Fig. 1. Fig. 2C is a cross-sectional view taken along line CC of the wired circuit board shown in Fig. 1. [Figure 3] FIG. 3 is an explanatory diagram for explaining the mounting state of the wired circuit board shown in FIG. 2A. [Figure 4] FIG. 4 is a plan view showing a modified example (1) of the first embodiment. [Figure 5] FIG. 5 is a plan view showing a modified example (3) of the first embodiment. [Figure 6] FIG. 6 is a plan view showing a modified example (4) of the first embodiment. [Figure 7] FIG. 7 is a plan view showing a modified example (5) of the first embodiment. [Figure 8] FIG. 8 is a plan view showing a modified example (6) of the first embodiment. [Figure 9] FIG. 9 is a plan view showing a modified example (7) of the first embodiment. [Figure 10] FIG. 10 is an explanatory diagram for explaining the mounting state of the wired circuit board shown in FIG. [Figure 11] FIG. 11 is a plan view of a second embodiment of the wired circuit board of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0039] 1. First embodiment As shown in FIG. 1, the wired circuit board 1 includes a plurality of support portions 2 (first support portions 2A and second support portions 2B in this embodiment) and a wiring portion 3.

[0040] The first support portion 2A and the second support portion 2B are arranged at a distance from each other. The shapes of the first support portion 2A and the second support portion 2B are not limited. The first support portion 2A supports one end portion of the wiring portion 3. Terminals 131A and 131B of the conductor pattern 13, which will be described later, may be arranged on the first support portion 2A. The second support portion 2B supports the other end portion of the wiring portion 3. Terminals 132A and 132B of the conductor pattern 13, which will be described later, may be arranged on the second support portion 2B.

[0041] The wiring portion 3 is disposed between the first support portion 2A and the second support portion 2B. The wiring portion 3 extends in a first direction. More specifically, the wiring portion 3 has a width in the second direction and extends in the first direction. The first direction is the direction in which the wires 133A and 133B of the conductor pattern 13, which will be described later, extend. The first direction is perpendicular to the thickness direction of the wired circuit board 1. The second direction is perpendicular to both the thickness direction and the first direction. One end of the wiring portion 3 is connected to the first support portion 2A. The other end of the wiring portion 3 is connected to the second support portion 2B. The shape of the wiring portion 3 is not limited. The wiring portion 3 may be linear or curved. At least a portion of the wires 133A and 133B of the conductor pattern 13, which will be described later, is disposed on the wiring portion 3.

[0042] As shown in FIG. 2A, the wired circuit board 1 has a metal support layer 11, a first insulating layer 12 as an example of an insulating layer, a conductor pattern 13, and a second insulating layer .

[0043] (1) Metal support layer The metal support layer 11 is disposed on the support portion 2 (first support portion 2A and second support portion 2B) and the wiring portion 3. That is, the wiring portion 3 has the metal support layer 11. The metal support layer 11 supports the first insulating layer 12, the conductive pattern 13, and the second insulating layer 14. The metal support layer 11 is made of metal. Examples of materials for the metal support layer 11 include copper, nickel, cobalt, iron, and alloys thereof. Examples of alloys include copper alloys and stainless steel. A preferred material for the metal support layer 11 is a copper alloy.

[0044] The metal support layer 11 has a thickness of, for example, 15 μm to 100 μm, or preferably 20 μm to 90 μm.

[0045] As shown in FIGS. 2A and 2B, the metal support layer 11 of the wiring unit 3 extends in the first direction and the second direction. Specifically, the metal support layer 11 of the wiring unit 3 has a width in the second direction and extends in the first direction. As shown in FIG. 2B, the metal support layer 11 of the wiring unit 3 has a first edge E1 and a second edge E2 in the second direction. The first edge E1 is an edge on one side of the metal support layer 11 in the second direction. The second edge E2 is an edge on the other side of the metal support layer 11 in the second direction. Specifically, the metal support layer 11 has a first surface S1 and a second surface S2 in the thickness direction. The first surface S1 is a surface on one side of the metal support layer 11 in the thickness direction. The second surface S2 is a surface on the other side of the metal support layer 11 in the thickness direction. The first edge E1 is an edge on one side of the first surface S1 in the second direction. The second edge E2 is the edge on the other side of the first surface S1 in the second direction.

[0046] Each of the first edge E1 and the second edge E2 extends in a first direction from one end of the wiring portion 3 to the other end of the wiring portion 3.

[0047] The first surface S1 of the metal support layer 11 may be covered with a protective metal layer. Examples of materials for the protective metal layer include chromium, nickel, titanium, and alloys thereof. The protective metal layer is, for example, a sputtering layer formed by sputtering.

[0048] (2) First insulating layer As shown in FIG. 2A, the first insulating layer 12 is disposed on the support portion 2 (first support portion 2A, second support portion 2B) and the wiring portion 3. That is, the wiring portion 3 has the first insulating layer 12. The first insulating layer 12 is disposed on one side of the metal support layer 11 in the thickness direction. The first insulating layer 12 is disposed on the first surface S1 of the metal support layer 11 in the thickness direction. The first insulating layer 12 is disposed between the metal support layer 11 and the conductive pattern 13 in the thickness direction. The first insulating layer 12 insulates the metal support layer 11 from the conductive pattern 13. The first insulating layer 12 is made of a resin. Examples of resins include polyimide, maleimide, epoxy resin, polybenzoxazole, and polyester. Preferably, the first insulating layer 12 is made of a polyimide.

[0049] The thickness of the first insulating layer 12 is in the range of, for example, 1 μm to 30 μm, or preferably 3 μm to 25 μm.

[0050] (3) Conductor pattern The conductive pattern 13 is disposed on one side of the first insulating layer 12 in the thickness direction. The conductive pattern 13 is disposed on one surface of the first insulating layer 12 in the thickness direction. The conductive pattern 13 is disposed on the opposite side of the metal support layer 11 with respect to the first insulating layer 12 in the thickness direction. The conductive pattern 13 is made of a metal. Examples of metals include copper, silver, gold, iron, aluminum, chromium, and alloys thereof. From the viewpoint of obtaining good electrical properties, copper is preferable. The shape of the conductive pattern 13 is not limited.

[0051] 1, the conductor pattern 13 is disposed on the support portion 2 (first support portion 2A, second support portion 2B) and the wiring portion 3. That is, the wiring portion 3 has the conductor pattern 13. In the wiring portion 3, the conductor pattern 13 has a main portion 13A, a first portion 13B, and a second portion 13C.

[0052] (3-1) Main body part The main body portion 13A is positioned away from the first support portion 2A in the first direction. As shown in FIG. 2B , the main body portion 13A has a third edge E3 and a fourth edge E4 in the second direction. The third edge E3 is an edge on one side of the main body portion 13A in the second direction. The third edge E3 is positioned between the center C of the metal support layer 11 and the first edge E1 of the metal support layer 11 in the second direction. The fourth edge E4 is an edge on the other side of the main body portion 13A in the second direction. The fourth edge E4 of the main body portion 13A is positioned between the center C of the metal support layer 11 and the second edge E2 of the metal support layer 11 in the second direction.

[0053] The distance D2 between the third edge E3 and the fourth edge E4 in the second direction is shorter than the distance D1 between the first edge E1 and the second edge E2 in the second direction. The ratio (D2 / D1) of the distance D2 to the distance D1 is, for example, 90 / 100 or less, preferably 50 / 100 or less. The ratio (D2 / D1) is, for example, 5 / 100 or more.

[0054] (3-2) Part 1 1, the first portion 13B is disposed at one end of the wiring portion 3. The first portion 13B is disposed between the first support portion 2A and the main body portion 13A in the first direction. The first portion 13B is connected to the first support portion 2A.

[0055] In the first direction, the length L1 of the first portion 13B is, for example, 0.1% to 25% of the total length L0 of the wiring portion 3, preferably 1% to 25%, and more preferably 5% to 25%.

[0056] As shown in FIG. 2C, the first portion 13B has a fifth edge E5 and a sixth edge E6 in the second direction. The fifth edge E5 is an edge on one side of the first portion 13B in the second direction. The fifth edge E5 is disposed between the third edge E3 (see FIG. 2B) and the first edge E1 in the second direction. The sixth edge E6 is an edge on the other side of the first portion 13B in the second direction. The sixth edge E6 is disposed between the fourth edge E4 (see FIG. 2B) and the second edge E2 in the second direction.

[0057] The distance D3 between the fifth edge E5 and the sixth edge E6 in the second direction is shorter than the distance D1 between the first edge E1 and the second edge E2 in the second direction. The distance D3 is longer than the distance D2 (see FIG. 2B) between the third edge E3 and the fourth edge E4 in the second direction. The ratio (D3 / D1) of the distance D3 to the distance D1 is greater than the ratio (D2 / D1) of the distance D2 to the distance D1. The ratio (D3 / D1) is, for example, 10 / 100 or more, preferably 60 / 100 or more. The ratio (D3 / D1) is, for example, 100 / 100 or less.

[0058] (3-3)Second part 1, second portion 13C is disposed at the other end of wiring portion 3. Second portion 13C is disposed between second support portion 2B and main body portion 13A in the first direction. Second portion 13C is connected to second support portion 2B.

[0059] In the first direction, the length L2 of the second portion 13C is, for example, 0.1% to 25%, preferably 1% to 25%, and more preferably 5% to 25% of the total length L0 of the wiring portion 3. The length L2 of the second portion 13C may be the same as the length L1 of the first portion 13B. The length L2 of the second portion 13C may be different from the length L1 of the first portion 13B.

[0060] The second portion 13C has a seventh edge E7 and an eighth edge E8 in the second direction. The seventh edge E7 is an edge on one side of the second portion 13C in the second direction. The seventh edge E7 is disposed between the third edge E3 and the first edge E1 in the second direction. The eighth edge E8 is an edge on the other side of the second portion 13C in the second direction. The eighth edge E8 is disposed between the fourth edge E4 and the second edge E2 in the second direction.

[0061] The distance D4 between the seventh edge E7 and the eighth edge E8 in the second direction is shorter than the distance D1 between the first edge E1 and the second edge E2 in the second direction. The distance D4 is longer than the distance D2 between the third edge E3 and the fourth edge E4 in the second direction. The distance D4 may be the same as the distance D3 between the fifth edge E5 and the sixth edge E6 in the second direction. The distance D4 may be different from the distance D3. The ratio (D4 / D1) of the distance D4 to the distance D1 is greater than the ratio (D2 / D1) of the distance D2 to the distance D1. The ratio (D4 / D1) of the distance D4 to the distance D1 may be the same as the ratio (D3 / D1) of the distance D3 to the distance D1. The ratio (D4 / D1) may be different from the ratio (D3 / D1). The ratio (D4 / D1) is, for example, 10 / 100 or more, preferably 60 / 100 or more. The ratio (D4 / D1) is, for example, 100 / 100 or less.

[0062] (3-4) Details of the conductor pattern The conductive pattern 13 has a plurality of terminals 131A and 131B, a plurality of terminals 132A and 132B, and a plurality of wirings 133A and 133B.

[0063] (3-4-1) Terminal The terminals 131A and 131B are arranged on the first support portion 2A. Each of the terminals 131A and 131B has a substantially rectangular shape. In this embodiment, the terminals 131A and 131B are aligned in the second direction. The terminals 131A and 131B are arranged at an interval from each other in the second direction. Note that the direction in which the terminals 131A and 131B are aligned is not limited to the second direction.

[0064] The terminals 132A and 132B are arranged on the second support portion 2B. Each of the terminals 132A and 132B has a substantially rectangular shape. The terminals 132A and 132B are aligned in the second direction. The terminals 132A and 132B are arranged at an interval from each other in the second direction. Note that the direction in which the terminals 132A and 132B are aligned is not limited to the second direction.

[0065] (3-4-2) Wiring At least a portion of each of the wirings 133A and 133B is arranged in the wiring section 3. That is, the conductor pattern 13 of the wiring section 3 has wiring 133A as an example of a first wiring and wiring 133B as an example of a second wiring. Each of the wirings 133A and 133B extends in a first direction in the wiring section 3. The wirings 133A and 133B are aligned in a second direction in the wiring section 3. The wirings 133A and 133B are arranged at an interval from each other in the second direction.

[0066] The wiring 133A electrically connects the terminal 131A and the terminal 132A. One end of the wiring 133A is connected to the terminal 131A. The other end of the wiring 133A is connected to the terminal 132A. The wiring 133A is disposed between the center C (see FIGS. 2A and 2B) of the metal support layer 11 and the first edge E1 (see FIGS. 2A and 2B) of the metal support layer 11 in the second direction. Of the multiple wirings 133A and 133B, the wiring 133A is closest to the first edge E1 in the second direction. In this embodiment, the wiring 133A has a main body portion 1331A, a first wide portion 1332A, a first connecting portion 1333A, a second wide portion 1334A, and a second connecting portion 1335A.

[0067] The main body portion 1331A is disposed in the main body portion 13A of the conductive pattern 13. One edge of the main body portion 1331A in the second direction is the third edge E3 of the main body portion 13A.

[0068] The first wide portion 1332A is disposed in the first portion 13B of the conductive pattern 13. One edge of the first wide portion 1332A in the second direction is the fifth edge E5 of the first portion 13B. The width W2 (dimension in the second direction) of the first wide portion 1332A is wider than the width W1 of the main body 1331A.

[0069] The first connecting portion 1333A is disposed on the first support portion 2A. The first connecting portion 1333A is disposed between the first wide portion 1332A and the terminal 131A. The first connecting portion 1333A is connected to the terminal 131A. In this embodiment, the width of the first connecting portion 1333A is the same as the width W1 of the main body portion 1331A. The width of the first connecting portion 1333A may be the same as the width W2 of the first wide portion 1332A.

[0070] The second wide portion 1334A is disposed in the second portion 13C of the conductive pattern 13. One edge of the second wide portion 1334A in the second direction is the seventh edge E7 of the second portion 13C. The width W3 of the second wide portion 1334A is wider than the width W1 of the main body 1331A. The width W3 of the second wide portion 1334A may be the same as the width W2 of the first wide portion 1332A. The width W3 of the second wide portion 1334A may be different from the width W2 of the first wide portion 1332A.

[0071] The second connecting portion 1335A is disposed on the second support portion 2B. The second connecting portion 1335A is disposed between the second wide portion 1334A and the terminal 132A. The second connecting portion 1335A is connected to the terminal 132A. In this embodiment, the width of the second connecting portion 1335A is the same as the width W1 of the main body portion 1331A. The width of the second connecting portion 1335A may be the same as the width W3 of the second wide portion 1334A.

[0072] The wiring 133B electrically connects the terminal 131B and the terminal 132B. One end of the wiring 133B is connected to the terminal 131B. The other end of the wiring 133B is connected to the terminal 132B. The wiring 133B is disposed at a distance from the wiring 133A in the second direction. The wiring 133B is disposed in the second direction between the center C (see FIGS. 2A and 2B) of the metal support layer 11 and the second edge E2 (see FIGS. 2A and 2B) of the metal support layer 11. Of the multiple wirings 133A and 133B, the wiring 133B is closest to the second edge E2 in the second direction. In this embodiment, the wiring 133B has a main body 1331B, a first wide portion 1332B, a first connecting portion 1333B, a second wide portion 1334B, and a second connecting portion 1335B.

[0073] The main body portion 1331B is disposed in the main body portion 13A of the conductive pattern 13. The other edge of the main body portion 1331B in the second direction is the fourth edge E4 of the main body portion 13A.

[0074] The first wide portion 1332B is disposed in the first portion 13B of the conductive pattern 13. The other edge of the first wide portion 1332B in the second direction is the sixth edge E6 of the first portion 13B. The width of the first wide portion 1332B is wider than the width of the main body 1331B.

[0075] The first connecting portion 1333B is disposed on the first support portion 2A. The first connecting portion 1333B is disposed between the first wide portion 1332B and the terminal 131B. The first connecting portion 1333B is connected to the terminal 131B. In this embodiment, the width of the first connecting portion 1333B is the same as the width of the main body portion 1331B. The width of the first connecting portion 1333B may also be the same as the width of the first wide portion 1332B.

[0076] The second wide portion 1334B is disposed in the second portion 13C of the conductive pattern 13. The other edge of the second wide portion 1334B in the second direction is the eighth edge E8 of the second portion 13C. The width of the second wide portion 1334B is wider than the width of the main body portion 1331B. The width of the second wide portion 1334B may be the same as the width of the first wide portion 1332B. The width of the second wide portion 1334B may be different from the width of the first wide portion 1332B.

[0077] The second connecting portion 1335B is disposed on the second support portion 2B. The second connecting portion 1335B is disposed between the second wide portion 1334B and the terminal 132B. The second connecting portion 1335B is connected to the terminal 132B. In this embodiment, the width of the second connecting portion 1335B is the same as the width of the main body portion 1331B. The width of the second connecting portion 1335B may also be the same as the width of the second wide portion 1334B.

[0078] (4) Second insulating layer As shown in FIG. 2B, the second insulating layer 14 covers all of the wirings 133A and 133B. The second insulating layer 14 is disposed on the first insulating layer 12 in the thickness direction. As shown in FIG. 2A, the second insulating layer 14 does not cover the terminals 131A, 131B, 132A, and 132B. The second insulating layer 14 is made of a resin. Examples of resins include polyimide, maleimide, epoxy resin, polybenzoxazole, and polyester. Preferably, the second insulating layer 14 is made of polyimide.

[0079] 2. Mounting condition of wiring circuit board Next, the mounting state of the wired circuit board 1 will be described.

[0080] 3, the wired circuit board 1 is fixed to the electronic components at the support portions 2. For example, the first support portion 2A is fixed to the first electronic component P1, and the second support portion 2B is fixed to the second electronic component P2. The wiring portion 3 is disposed between the first electronic component P1 and the second electronic component P2.

[0081] When the first electronic component P1 moves relative to the second electronic component P2 in the thickness direction of the wired circuit board 1, one end of the wiring portion 3 and the other end of the wiring portion 3 bend in the thickness direction.

[0082] At this time, stress near one end of the wiring part 3 is concentrated on the first part 13B, and stress near the other end of the wiring part 3 is concentrated on the second part 13C.

[0083] 1, in the conductor pattern 13, the fifth edge E5 of the first portion 13B is disposed closer to the first edge E1 of the metal support layer 11 in the second direction than the third edge E3 of the main body portion 13A. This allows the stress concentrated on the wiring 133A to be dispersed to one side in the second direction relative to the main body portion 13A.

[0084] Similarly, the sixth edge E6 of the first portion 13B is disposed closer in the second direction to the second edge E2 of the metal support layer 11 than the fourth edge E4 of the main body portion 13A, thereby dispersing the stress concentrated on the wiring 133B to the other side in the second direction relative to the main body portion 13A.

[0085] As a result, stress near the end of the wiring portion 3 can be prevented from concentrating on the wirings 133A and 133B, and cracks can be prevented from occurring in the wirings 133A and 133B near the end of the wiring portion 3.

[0086] 3. Effects (1) According to the wired circuit board 1, as shown in Fig. 1, the fifth edge E5 of the first portion 13B is disposed between the third edge E3 and the first edge E1 in the second direction. In other words, the fifth edge E5 of the first portion 13B is disposed closer to the first edge E1 of the metal support layer 11 in the second direction than the third edge E3 of the main body portion 13A.

[0087] This allows the stress concentrated on the first portion 13B to be dispersed to one side in the second direction relative to the main body portion 13A.

[0088] As a result, stress near one end of the wiring portion 3 can be prevented from concentrating on the first portion 13B, and cracks can be prevented from occurring in the conductive pattern 13 near one end of the wiring portion 3.

[0089] (2) According to the wired circuit board 1, as shown in Fig. 1, the sixth edge E6 of the first portion 13B is disposed between the fourth edge E4 and the second edge E2 in the second direction. In other words, the sixth edge E6 of the first portion 13B is disposed closer to the second edge E2 of the metal support layer 11 in the second direction than the fourth edge E4 of the main body portion 13A.

[0090] This allows the stress concentrated on the first portion 13B to be dispersed to the other side in the second direction relative to the main body portion 13A.

[0091] As a result, the stress near one end of the wiring portion 3 can be further prevented from concentrating on the first portion 13B, and cracks can be further prevented from occurring in the conductive pattern 13 near one end of the wiring portion 3.

[0092] (3) According to the wired circuit board 1, as shown in FIG. 1, the conductor pattern 13 of the wiring portion 3 has wirings 133A and 133B, and the width W2 of each of the wirings 133A and 133B in the first portion 13B is wider than the width W1 of each of the wirings 133A and 133B in the main body portion 13A.

[0093] Therefore, the width W2 of each of the wirings 133A and 133B in the first portion 13B can be made wider than the width W1 of each of the wirings 133A and 133B in the main body portion 13A, thereby dispersing the stress concentrated on each of the wirings 133A and 133B in the first portion 13B.

[0094] As a result, cracks can be prevented from occurring in the wirings 133A and 133B near one end of the wiring portion 3.

[0095] (4) According to the wired circuit board 1, as shown in Fig. 1, the seventh edge E7 of the second portion 13C is disposed between the third edge E3 and the first edge E1 in the second direction. In other words, the seventh edge E7 of the second portion 13C is disposed closer to the first edge E1 of the metal support layer 11 in the second direction than the third edge E3 of the main body portion 13A.

[0096] This allows the stress concentrated on the second portion 13C to be dispersed to one side in the second direction relative to the main body portion 13A.

[0097] As a result, stress near the other end of the wiring portion 3 can be prevented from concentrating on the second portion 13C, and cracks can be prevented from occurring in the conductive pattern 13 near the other end of the wiring portion 3.

[0098] 4. Modification of the First Embodiment A description will be given of a modified example of the first embodiment. In the modified example, the same members as those in the first embodiment are given the same reference numerals, and the description thereof will be omitted.

[0099] 4, the distance D11 between the wiring 133A and the wiring 133B in the first portion 13B may be wider than the distance D12 between the wiring 133A and the wiring 133B in the main body portion 13A. In this case, the width W2 of each of the wirings 133A and 133B in the first portion 13B may be the same as the width W1 of each of the wirings 133A and 133B in the main body portion 13A.

[0100] According to this modification, the distance D11 between the wiring 133A and the wiring 133B in the first portion 13B is wider than the distance D12 between the wiring 133A and the wiring 133B in the main body portion 13A, thereby dispersing the stress concentrated on the wirings 133A and 133B in the first portion 13B.

[0101] As a result, cracks can be prevented from occurring in the wirings 133A and 133B near the ends of the wiring portion 3.

[0102] (2) In the above-described modification (1), the width W2 of each of the wirings 133A and 133B in the first portion 13B may be wider than the width W1 of each of the wirings 133A and 133B in the main body portion 13A.

[0103] According to this modification, the width W2 of each of the wirings 133A and 133B in the first portion 13B is made wider than the width W1 of each of the wirings 133A and 133B in the main body portion 13A, thereby dispersing the stress concentrated on the wirings 133A and 133B in the first portion 13B.

[0104] As a result, cracks occurring in the wirings 133A and 133B near the ends of the wiring portion 3 can be further suppressed.

[0105] (3) As shown in FIG. 5, the distance D11 between the wiring 133A and the wiring 133B in the first portion 13B may be the same as the distance D12 between the wiring 133A and the wiring 133B in the main body portion 13A, and the width W2 of each of the wirings 133A and 133B in the first portion 13B may also be the same as the width W1 of each of the wirings 133A and 133B in the main body portion 13A.

[0106] In this case, the first portion 13B of the conductive pattern 13 includes a dummy wiring 133C arranged on one side of the wiring 133A in the second direction, and a dummy wiring 133D arranged on the other side of the wiring 133A in the second direction. A fifth edge E5 of the first portion 13B is an edge on one side of the dummy wiring 133C in the second direction, and a sixth edge E6 of the first portion 13B is an edge on the other side of the dummy wiring 133D in the second direction.

[0107] (4) The wired circuit board 1 may have three or more supporting portions 2. For example, as shown in Fig. 6, the wired circuit board 1 may have a third supporting portion 2C in addition to the first supporting portion 2A and the second supporting portion 2B described above. In this case, the wired circuit board 1 has a plurality of wiring portions 3A and 3B.

[0108] Each of the wirings 133A and 133B extends from the first support portion 2A, through the third support portion 2C, to the second support portion 2B. A middle portion of each of the wirings 133A and 133B is disposed on the third support portion 2C.

[0109] The third support portion 2C is disposed between the first support portion 2A and the second support portion 2B in the first direction. In other words, the third support portion 2C is disposed between the first support portion 2A and the second support portion 2B in the first direction. The third support portion 2C supports the other end portion of the wiring portion 3A and one end portion of the wiring portion 3B. The wiring portions 3A and 3B have the same structure as the wiring portion 3 in the first embodiment.

[0110] In this modification, the middle portions of the wirings 133A and 133B can be supported by the third support portion 2C.

[0111] (5) As shown in FIG. 7 , the terminals 131A and 131B do not have to be arranged on the first support portion 2A. The first support portion 2A may be arranged at a position different from that of the terminals 131A and 131B in the first direction. The first support portion 2A may be arranged between the terminals 131A and 131B and the wiring portion 3 in the first direction. The first support portion 2A may be arranged away from the terminals 131A and 131B in the first direction. The terminals 132A and 132B do not have to be arranged on the second support portion 2B. The second support portion 2B may be arranged at a position different from that of the terminals 132A and 132B in the first direction. The second support portion 2B may be arranged between the terminals 132A and 132B and the wiring portion 3 in the first direction. The second support portion 2B may be arranged away from the terminals 132A and 132B in the first direction. Each of the first support portion 2A and the second support portion 2B may have a through hole 20. A fastener such as a screw or a pin passes through the through hole 20.

[0112] (6) The terminal 131A may have multiple conductor layers. Specifically, as shown in FIG. 8, the terminal 131A may have a first conductor layer 1311 and a second conductor layer 1312. The first conductor layer 1311 is disposed on the first insulating layer 12. The wiring 133A is connected to the first conductor layer 1311. Examples of the material for the first conductor layer 1311 include the same material as the above-described conductor pattern 13. The second conductor layer 1312 is disposed on the first conductor layer 1311. The second conductor layer 1312 may be made of the same material as the first conductor layer 1311. The second conductor layer 1312 may be made of a different material (e.g., solder) from the first conductor layer 1311.

[0113] (7) As shown in FIG. 9, the thickness T2 of the first portion 13B and the thickness of the second portion 13C may be thinner than the thickness T1 of the main body portion 13A.

[0114] In this modification, as shown in FIG. 10, when the first portion 13B and the second portion 13C are bent, the bending moment acting on the first portion 13B and the second portion 13C can be reduced.

[0115] As a result, cracks occurring in the conductive pattern 13 near the end of the wiring portion 3 can be further suppressed.

[0116] (8) The above-described modifications (1) to (7) can also achieve the same effects as those of the first embodiment.

[0117] 5. Second embodiment A second embodiment will be described below. In the second embodiment, the same members as those in the first embodiment are denoted by the same reference numerals, and the description thereof will be omitted.

[0118] 11, unlike the first embodiment, the fifth edge E5 of the first portion 13B is located at the same position as the third edge E3 of the main body portion 13A in the second direction, and the sixth edge E6 of the first portion 13B is located at the same position as the fourth edge E4 of the main body portion 13A in the second direction.

[0119] In the second embodiment, similarly to the above-described modified example (7) of the first embodiment, the thickness T2 of the first portion 13B and the thickness of the second portion 13C are thinner than the thickness T1 of the main body portion 13A.

[0120] Therefore, the bending moment applied to the first portion 13B and the second portion 13C can be reduced.

[0121] As a result, cracks can be prevented from occurring in the conductive pattern 13 near the end of the wiring portion 3. [Explanation of symbols]

[0122] 1 Wiring circuit board 2A 1st support part 2B 2nd support part 3 Wiring section 11 Metal support layer 12 First insulating layer (an example of an insulating layer) 13 Conductor pattern 13A Main body part 13B Part 1 13C Part 2 133A wiring (wiring 1) 133B wiring (wiring 2) C Central D11 Interval D12 Interval E1 1st end E2 2nd end E3 3rd end E4 4th end E5 fifth end E6, 6th end ring E7 7th End E8 Chapter 8 W1 W2 pieces W3

Claims

1. a wiring portion extending in a first direction; a first support portion that supports one end of the wiring portion; Equipped with the wiring portion includes a metal support layer, a conductor pattern disposed on one side of the metal support layer in a thickness direction of the metal support layer, and an insulating layer disposed between the metal support layer and the conductor pattern in the thickness direction; The metal support layer is a first edge that is an edge on one side and a second edge that is an edge on the other side in a second direction that is perpendicular to both the thickness direction and the first direction; The conductor pattern is a main body portion disposed apart from the first support portion in the first direction, the main body portion having a third edge that is an edge on one side and a fourth edge that is an edge on the other side in the second direction; a first portion disposed between the first support portion and the main body portion in the first direction and connected to the first support portion, the first portion having a fifth edge that is an edge on one side and a sixth edge that is an edge on the other side in the second direction; and the third edge of the main body portion is disposed between a center of the metal support layer and the first edge of the metal support layer in the second direction; The fifth edge of the first portion is disposed between the third edge and the first edge in the second direction.

2. the fourth edge of the main body portion is disposed between a center of the metal support layer and the second edge of the metal support layer in the second direction; The printed circuit board according to claim 1 , wherein the sixth edge of the first portion is disposed between the fourth edge and the second edge in the second direction.

3. the conductor pattern has wiring, The printed circuit board according to claim 1 , wherein a width of the wiring in the first portion is wider than a width of the wiring in the main body portion.

4. The conductor pattern is A first wiring; a second wiring arranged at an interval from the first wiring in the second direction; and The printed circuit board according to claim 1 , wherein a distance between the first wiring and the second wiring in the first portion is wider than a distance between the first wiring and the second wiring in the main body portion.

5. The printed circuit board according to claim 4 , wherein the width of each of the first wiring and the second wiring in the first portion is wider than the width of each of the first wiring and the second wiring in the main body portion.

6. 6. The wired circuit board according to claim 1, wherein the thickness of the first portion is smaller than the thickness of the main body portion.

7. a second support portion that supports the other end of the wiring portion, The conductor pattern is a second portion disposed between the second support portion and the main body portion in the first direction and connected to the second support portion, the second portion having a seventh edge that is an edge on one side and an eighth edge that is an edge on the other side in the second direction; The printed circuit board according to claim 1 , wherein the seventh edge of the first portion is disposed between the third edge and the first edge in the second direction.

8. a wiring portion extending in a first direction; a first support portion that supports one end of the wiring portion in the first direction; Equipped with the wiring portion includes an insulating layer and a conductor pattern disposed on one side of the insulating layer in a thickness direction of the insulating layer, The conductor pattern is a main body portion disposed apart from the first support portion in the first direction; a first portion disposed between the first support portion and the main body portion in the first direction and connected to the first support portion; and The thickness of the first portion is thinner than the thickness of the main body portion.

9. a second support portion that supports the other end of the wiring portion, The conductor pattern is a second portion disposed between the second support portion and the main body portion in the first direction and connected to the second support portion; The printed circuit board according to claim 8 , wherein the second portion has a thickness smaller than that of the main body portion.

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