Modular multi-chamber processing tool with link chambers for ultra-high vacuum processes - Patents.com

Abstract

Provided herein are embodiments of a link chamber for use in a multi-chamber processing tool or a multi-chamber processing system. In some embodiments, a link chamber for use in a multi-chamber processing tool includes a link chamber body having a plurality of facets extending between a bottom plate and a top plate, at least seven of the plurality of facets having a chamber opening for forming a plurality of chamber openings, the plurality of chamber openings being sized to pass a substrate therethrough, and each of the plurality of chamber openings being configured to be coupled to a slit valve, a load lock chamber, a cover plate, a processing chamber, or a second link chamber body.

Description

[Technical field]

[0001] FIELD OF THE DISCLOSURE Embodiments of the present disclosure generally relate to substrate processing apparatus. [Background technology]

[0002] The fabrication of semiconductor devices typically involves performing a series of procedures on substrates or "wafers," such as silicon substrates, glass plates, etc. These steps may include polishing, deposition, etching, photolithography, thermal treatments, etc. Typically, many different processing steps may be performed in a single processing system or "tool" that includes multiple processing chambers. However, other processes may be performed at other processing locations within the fabrication facility, thus requiring the substrate to be transported from one processing location to another within the fabrication facility. Depending on the type of semiconductor device being fabricated, a relatively large number of processing steps may be performed at many different processing locations within the fabrication facility.

[0003] Substrates are conventionally transported from one processing location to another in substrate carriers, such as sealed pods, cassettes, containers, etc. Such transport of substrates typically requires exposing the substrates to room air, or at least to non-vacuum conditions, either of which can expose the substrates to undesirable environments (e.g., oxidizing species) and / or contaminants.

[0004] Accordingly, the inventors have provided embodiments of an improved multi-chamber processing tool for minimizing exposure of substrates to undesirable environments during transfer of the substrate between processing systems. Summary of the Invention

[0005] An embodiment of a link chamber for use in a multi-chamber processing tool is provided herein. In some embodiments, a link chamber for use in a multi-chamber processing tool includes a link chamber body having a plurality of facets extending between a bottom plate and a top plate, at least seven of the plurality of facets have chamber openings for forming a plurality of chamber openings, the plurality of chamber openings being sized to pass a substrate therethrough, and each of the plurality of chamber openings is configured to be coupled to a slit valve, a load lock chamber, a cover plate, a processing chamber, or a second link chamber body.

[0006] In some embodiments, a multi-chamber processing tool includes a factory interface (FI) having one or more load ports configured to accept a substrate; a link chamber coupled to the FI and including a plurality of facets extending between a bottom plate and a top plate, at least seven of the plurality of facets having chamber openings for forming a plurality of chamber openings, the bottom plate including one or more pump ports, and the bottom plate including a plurality of valve openings proximate to corresponding ones of the chamber openings; a plurality of processing chambers coupled to the link chamber via respective ones of the chamber openings; one or more load lock chambers coupled to the link chamber via respective ones of the chamber openings; and a link robot disposed in the link chamber and configured to facilitate transfer of a substrate from the FI to the plurality of processing chambers via the one or more load lock chambers.

[0007] In some embodiments, a multi-chamber processing tool includes a factory interface (FI) having one or more load ports configured to accept a substrate; a link chamber coupled to the FI and including a plurality of facets extending between a bottom plate and a top plate, at least seven of the plurality of facets having chamber openings for forming a plurality of similarly sized chamber openings, the bottom plate including one or more pump ports, and the bottom plate including a plurality of valve openings proximate to corresponding ones of the chamber openings; a plurality of processing chambers coupled to the link chamber via respective ones of the chamber openings; one or more load lock chambers coupled to the link chamber via respective ones of the chamber openings; and a link robot disposed in the link chamber and configured to facilitate transfer of a substrate from the FI to the plurality of processing chambers via the one or more load lock chambers.

[0008] Other and further embodiments of the present disclosure are described below.

[0009]

[0013] Embodiments of the present disclosure, briefly summarized above and discussed in more detail below, can be understood by reference to the exemplary embodiments of the present disclosure as represented in the accompanying drawings. The accompanying drawings, however, depict only typical embodiments of the present disclosure and therefore should not be considered as limiting the scope, since the present disclosure may admit of other equally effective embodiments. [Brief description of the drawings]

[0010] [Figure 1] 1 is a schematic top view of a multi-chamber processing tool having a link chamber in accordance with at least some embodiments of the present disclosure. [Diagram 2] 1 is a schematic top view of a multi-chamber processing tool having a link chamber in accordance with at least some embodiments of the present disclosure. [Diagram 3]1 is a schematic perspective view of a link chamber according to at least some embodiments of the present disclosure. [Figure 4] FIG. 13 is a perspective view of a link chamber body according to at least some embodiments of the present disclosure. [Diagram 5] 1 is a schematic top view of multiple connected multi-chamber processing tools having link chambers in accordance with at least some embodiments of the present disclosure. [Figure 6] 1 is a schematic top view of a multi-chamber processing tool coupled to a second processing tool in accordance with at least some embodiments of the present disclosure. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0011] For ease of understanding, the same reference numbers have been used, where possible, to designate identical elements common to the drawings. The drawings are not drawn to scale and may be simplified for clarity. Elements and features of one embodiment may be beneficially incorporated in other embodiments without further elaboration.

[0012] Provided herein are embodiments of link chambers for use in a multi-chamber processing tool. The link chamber includes multiple facets for modular and customizable coupling to a factory interface and multiple processing chambers to form a multi-chamber processing tool. The link chambers provided herein are generally configurable to facilitate coupling to multiple processing chambers, such as deposition chambers, etch chambers, cleaning chambers, degassing chambers, metrology chambers, or any other suitable chambers for ultra-high vacuum processing. Thus, the link chambers described herein advantageously provide a central hub for passing substrates from the factory interface to multiple processing chambers via the link chamber. The link chambers are configured to provide a smaller footprint and lower cost than typical multi-chamber architectures.

[0013] Link chambers may be used to support systems with various degrees of complexity. The link chambers provided herein are also advantageously configured to be coupled to one or more other link chambers or one or more other multi-chamber processing tools via transfer vias disposed therebetween to support more complex substrate processing while minimizing floor space and processing downtime. Thus, the link chambers provided herein facilitate forming a link between a multi-chamber processing tool or multiple multi-chamber processing tools for any desired substrate process. In some embodiments, the desired substrate process may be an ultra-high vacuum metallization process, e.g., a copper interconnect process. However, any suitable process requiring a vacuum or ultra-high vacuum environment may be performed using the tools provided herein.

[0014] FIG. 1 illustrates a schematic top view of a multi-chamber processing tool having a link chamber according to at least some embodiments of the present disclosure. The multi-chamber processing tool 100 includes a plurality of facets 114. In some embodiments, the plurality of facets 114 includes at least seven facets. Each of the facets 114 has a chamber opening (see the plurality of chamber openings 304 in FIG. 3 ) connectable to or coupled to a load lock chamber 130, one of the plurality of processing chambers 110 (the plurality of processing chambers 110A-110F shown in FIG. 1 ), or a transfer via (see the transfer via 508 in FIG. 5 ). The link chamber 104 includes a transfer robot 106 disposed therein. In some embodiments, the transfer robot 106 is operable to transfer one or more substrates 112 between the load lock chamber 130 and the plurality of processing chambers 110, between the plurality of processing chambers 110. In some embodiments, the transfer robot 106 is configured to transfer one or more substrates 112 between the plurality of processing chambers 110 and the transfer via 508.

[0015] The multi-chamber processing tool 100 includes a factory interface (FI) 120 having one or more load ports 122 configured to receive one or more substrates 112. The link chamber 104 is coupled to the FI 120 via one or more load lock chambers 130. The one or more substrates 112 may be transferred from the FI 120 to the one or more load lock chambers 130 via an FI robot 124 disposed on the FI 120. In some embodiments, the one or more load lock chambers 130 include one load lock chamber as shown in FIG. 1. In some embodiments, the one or more load lock chambers 130 include a substrate transfer mechanism configured to move the one or more substrates 112 from a position proximate the FI 120 to a position proximate the link chamber 104. The one or more load lock chambers 130 are generally vacuum chambers coupled to respective vacuum pumps that facilitate the transfer of the one or more substrates 112 from the ambient pressure of the FI 120 to the vacuum pressure of the link chamber 104. The one or more load lock chambers 130 may be coupled to respective vacuum pumps.

[0016] In some embodiments, the substrate transfer mechanism is a substrate carousel 136 as shown in FIG. The substrate carousel 136 may generally comprise one or more substrate supports 134 configured to rotate and move one or more substrates 112 within the load lock chamber. In some embodiments, the one or more substrate supports 134 are coupled to a base plate 132. In some embodiments, the substrate carousel 136 comprises three substrate supports that rotate about a rotation axis 138.

[0017] In some embodiments, the plurality of processing chambers 110 includes six processing chambers. In some embodiments, the plurality of processing chambers 110 includes four deposition chambers, e.g., processing chambers 110A-110D, and two cleaning chambers, e.g., processing chambers 110E-110F. In some embodiments, the four deposition chambers are physical vapor deposition (PVD) chambers. In some embodiments, the four deposition chambers are any suitable combination of PVD chambers, chemical vapor deposition (CVD) chambers, or atomic layer deposition (ALD) chambers. In some embodiments, the plurality of processing chambers 110 are vacuum chambers coupled to respective vacuum pumps.

[0018] FIG. 2 illustrates a schematic top view of a multi-chamber processing tool 100 having a link chamber 104 in accordance with at least some embodiments of the present disclosure. In some embodiments, as shown in FIG. 2, the one or more load lock chambers 130 comprise two load lock chambers coupled at a first end to respective facets of the plurality of facets 114 and coupled at a second end to the FI 120. In some embodiments, the plurality of processing chambers 110 includes four processing chambers. In some embodiments, the substrate transfer mechanism comprises a load lock transfer robot 210. In some embodiments, the substrate transfer mechanism comprises a servo controlled shutter 220. In some embodiments, the servo controlled shutter 220 comprises a shutter 224 coupled to a servo motor 226. The servo motor 226 may be coupled to the shutter 224 via an arm 228, and rotation of the servo motor 226 moves the shutter 224 toward or away from the link chamber 104.

[0019] 1 and 2, in some embodiments, slit valves 115 are disposed at the interface between the plurality of processing chambers 110 and the link chamber 104 and at the interface between the load lock chamber 130 and the link chamber 104 and are configured to selectively seal one or more of the plurality of facets 114. In some embodiments, one or more of the slit valves 115 include a linear motion actuator that moves a slit valve door to selectively seal or open a slit opening to facilitate transfer of one or more substrates 112 through the slit opening. In some embodiments, one or more of the slit valves 115 include an "L" motion actuator that moves a slit valve door in an "L" motion (vertical and horizontal motion) to selectively seal or open the slit opening to facilitate transfer of one or more substrates 112 through the slit opening.

[0020] A slit valve 115 can individually isolate the link chamber 104 from the multiple processing chambers 110 and the one or more load lock chambers 130. A vacuum pump 160, such as a cryopump, turbopump, or the like, can be coupled to the link chamber 104 via a pump port 108 for pumping down the link chamber 104. The vacuum pump 160 is operable to maintain a vacuum level in the link chamber 104. In some embodiments, the link chamber 104 includes two pump ports 108, one pump port coupled to a cryopump and a second pump port coupled to a turbopump.

[0021] In some embodiments, the link chamber 104 includes a controller 150 coupled to the link chamber 104 and operable to receive data from the multiple processing chambers 110 and provide instructions to the multi-chamber processing tool 100 for processing commands related to the processing and transfer of one or more substrates 112. The controller 150 comprises a centralized server that can perform predictive modeling, such as machine learning, artificial intelligence, and / or deep learning, to improve the throughput and efficiency of the multi-chamber processing tool 100 and any tools or systems linked to the multi-chamber processing tool 100, such as a second multi-chamber processing tool having a second link chamber (e.g., second multi-chamber processing tool 502) or a second processing tool (e.g., second processing tool 602). In some embodiments, the controller 150 is configured to communicate with a second controller 550 of the second multi-chamber processing tool 502 or a second controller 650 of the second processing tool 602. The controller 150 is operable to receive and / or transmit data from the second controller 550, 650, apply predictive modeling to the data, and provide instructions to the second controller 550, 650 corresponding to processing commands for processing in the processing chambers of the linked first multi-chamber processing tool 100 and second processing tools 502, 602 and for transferring one or more substrates from these processing chambers.

[0022] The controller 150 generally includes a central processing unit (CPU) 152 with one or more processors, a memory 154, and support circuits 156. The CPU 152 may be any form of general-purpose computer processor that can be used in an industrial environment. The support circuits 156 are conventionally coupled to the CPU 152 and may include cache, clock circuits, input / output subsystems, power supplies, and the like. Software routines, such as the methods described herein, are stored in the memory 154 and, when executed by the CPU 152, can transform the CPU 152 into a special-purpose computer (controller 150). The software routines may also be stored and / or executed by a second controller (not shown) located remotely from the multi-chamber processing tool 100.

[0023] The memory 154 may be in the form of a non-transitory computer-readable storage medium containing instructions that, when executed by the CPU 152, facilitate the operation of the multi-chamber processing tool 100. The instructions in the memory 154 are in the form of a program product, such as a program that implements the methods of the present principles. The program code may conform to any one of several different programming languages. In one example, the present disclosure may be implemented as a program product stored on a computer-readable storage medium for use with a computer system. The program of the program product defines the functions of the aspects (including the methods described herein). Exemplary computer-readable storage media include, but are not limited to, non-writable storage media in which information is permanently stored (e.g., a read-only memory device in a computer, such as a CD-ROM disk readable by a CD-ROM drive, a flash memory, a ROM chip, or any type of solid-state non-volatile semiconductor memory), and writeable storage media in which changeable information is stored (e.g., a floppy disk in a diskette drive, or a hard disk drive, or any type of solid-state random access semiconductor memory). Such computer-readable storage media, when carrying computer-readable instructions that direct the functions of the methods described herein, are aspects of the present principles.

[0024] 3 shows a schematic perspective view of a link chamber body 310 according to at least some embodiments of the present disclosure. The link chamber 104 generally includes a link chamber body 310 having a plurality of facets 114 extending between a bottom plate 306 and a top plate 308. In some embodiments, the link chamber body 310 has an octagonal shape. In some embodiments, the controller 150 is coupled to the link chamber body 310 on a side 312 of the link chamber body 310 that does not include one of the plurality of facets 114. Each of the plurality of facets 114 includes a chamber opening for forming a plurality of chamber openings 304. The plurality of chamber openings 304 are sized to pass a substrate. In some embodiments, the plurality of chamber openings 304 are similarly sized.

[0025] Each of the plurality of chamber openings 304 is configured to be coupled to a slit valve (e.g., slit valve 115), a load lock chamber (e.g., load lock chamber 130), a processing chamber (e.g., processing chamber 110), a cover plate (e.g., cover plate 410), or a transfer via (e.g., transfer via 508). In some embodiments, each of the plurality of facets 114 includes a seal groove 320 disposed about the chamber opening 304 and configured to receive a seal.

[0026] The bottom plate 306 and the top plate 308 and the plurality of facets 114 collectively define an interior volume 302 of the link chamber 104. In some embodiments, the bottom plate 306 includes a central opening 318 to accommodate the transfer robot 106. In some embodiments, one or more pump ports 108 are disposed through the bottom plate 306. In some embodiments, the one or more pump ports 108 are disposed radially outward of the central opening 318.

[0027] In some embodiments, the bottom plate 306 includes a plurality of actuator openings 326 adjacent corresponding ones of the plurality of chamber openings 304 and configured to pass actuators of one or more slit valves 115. In the case of a slit valve having a linear motion actuator, the bottom plate 306 includes an actuator opening 326A that extends substantially parallel to the vertical axis 350 of the link chamber body. In the case of a slit valve having an "L" motion actuator, the bottom plate 306 includes an angled actuator opening 326B that extends at an angle other than 90 degrees to the vertical axis 350 of the link chamber body 310.

[0028] In some embodiments, the top plate 308 includes one or more recesses 330 proximate each of the plurality of chamber openings 304. In some embodiments, the one or more recesses 330 include two recesses for each of the plurality of chamber openings 304. In some embodiments, each of the one or more recesses 330 includes a fastener opening 332 extending from the one or more recesses 330 to an outer sidewall 338 of the link chamber body 310. The fastener opening 332 can facilitate coupling the link chamber to a chamber component, such as one or more slit valves 115, any of the chambers disclosed herein, or a cover plate 410. In some embodiments, the link chamber body 310 includes a lower recess 354 to facilitate coupling a chamber component of the link chamber 104, such as one or more slit valves 115, any of the chambers disclosed herein, or a cover plate 410. In some embodiments, the top plate 308 includes a lid opening 342. The lid opening 342 can be selectively sealed via a lid (see lid 402 ) removably coupled to the top plate 308 to facilitate access to the interior volume 302 .

[0029] FIG. 4 illustrates a perspective view of the link chamber 104 according to at least some embodiments of the present disclosure. In some embodiments, the link chamber 104 includes a lid 402 coupled to the top plate 308 of the link chamber body 310. In some embodiments, the lid 402 is pivotally coupled to the top plate 308. In some embodiments, a support device 408 is coupled to the lid 402 and the top plate 308 to facilitate opening and closing the lid 402. In some embodiments, the lid 402 includes a handle 428 for manually opening and closing the lid 402. In some embodiments, the support device 408 is coupled to the top plate 308 at a first location 432. In some embodiments, the support device 408 is coupled to the top plate 308 at a second location 434. In some embodiments, the top plate 308 includes fastener openings 438 at the first location 432 and the second location 434 such that the support device 408 may be coupled to the top plate 308 at various locations as desired.

[0030] In some embodiments, the one or more slit valves 115 are coupled to the link chamber body 310 via fasteners 440 or pins extending through the fastener openings 332. In some embodiments, the one or more slit valves 115 include fastener recesses 470 corresponding to the location of the one or more recesses 330. In some embodiments, the link chamber 104 includes a recess cover 416 configured to cover the one or more recesses 330 and any exposed fasteners or pins. The one or more slit valves 115 may also be mounted in the lower recess 354 to further secure the one or more slit valves 115. Each of the one or more slit valves 115 may include an actuator 422 configured to move the slit valve door 454 to selectively open and close a slit opening 456 for passing a substrate therethrough. In some embodiments, any unused facets of the plurality of facets 114 may be covered with a cover plate 410.

[0031] FIG. 5 illustrates a schematic top view of multiple connected multi-chamber processing tools with link chambers according to at least some embodiments of the present disclosure. In some embodiments, the multi-chamber processing tool 100 is coupled to a second multi-chamber processing tool 502 having a second link chamber 504 to facilitate more complex processing. In some embodiments, the second link chamber 504 is similar or the same as the link chamber 104 described above. A plurality of second processing chambers 510 may be coupled to the second link chamber 504. In some embodiments, the second FI 520 is coupled to the second link chamber 504 via one or more second load lock chambers 530. A second controller 550 may be coupled to the second link chamber 504 and configured to operatively control the second multi-chamber processing tool 502. In some embodiments, the second controller 550 may be configured to communicate with the controller 150 of the multi-chamber processing tool 100. In some embodiments, the controller 150 is configured to operatively control the multi-chamber processing tool 100 and the second multi-chamber processing tool 502 .

[0032] In some embodiments, the multi-chamber processing tool 100 is coupled to the second multi-chamber processing tool 502 via a transfer via 508 coupled to one of the chamber openings 304 and a corresponding chamber opening of the second link chamber 504. In some embodiments, more than two link chambers can be coupled together in a similar manner to expand processing capabilities. In some embodiments, the transfer via 508 includes a substrate alignment device 506 disposed in one or more of the staging positions. The substrate alignment device 506 is configured to orient features (i.e., wafer notches) on one or more substrates 112 in the correct orientation for processing in the processing chambers of the multi-chamber processing tool 100 and the second multi-chamber processing tool 502. In some embodiments, the transfer via 508 may be angled to advantageously reduce floor space when multiple processing tools are coupled. In some embodiments, the transfer via 508 is coupled to a vacuum pump 560 for applying a pressure to the transfer via 508.

[0033] FIG. 6 illustrates a schematic top view of a multi-chamber processing tool 100 coupled to a second processing tool 602 in accordance with at least some embodiments of the present disclosure. In some embodiments, the link chamber 104 of the multi-chamber processing tool 100 may be coupled to the second processing tool 602 via a transfer via 508. In some embodiments, the second processing tool 602 may include an Endura2 mainframe or an Endura3 mainframe available from Applied Materials, Inc. of Santa Clara, California. In some embodiments, the second processing tool 602 may comprise any suitable mainframe having multiple processing chambers. The second processing tool 602 may generally include an FI 620 coupled to one or more transfer chambers 608 via one or more load lock chambers 630. The one or more transfer chambers 608 have multiple processing chambers 610 coupled to them. Substrates may be transferred between the FI 620, the transfer chamber 608, and the multiple processing chambers 610 via a transfer robot (not shown) located in one or more of the FI 620 and the one or more transfer chambers 608. One or more substrates 112 may be transferred from the multi-chamber processing tool 100 to the second processing tool 602 through the transfer via 508 to advantageously enhance processing while minimizing floor space. The second processing tool 602 may include a second controller 650 configured to operatively control the second processing tool 602 and to communicate with the controller 150 of the multi-chamber processing tool 100. In some embodiments, the controller 150 is configured to operatively control the multi-chamber processing tool 100 and the second processing tool 602.

[0034] While the forgoing is directed to embodiments of the present disclosure, other and further embodiments of the disclosure may be devised without departing from the basic scope thereof.

Claims

1. a link chamber body having a plurality of facets extending between a bottom plate and a top plate, at least seven of the plurality of facets having chamber openings for forming a plurality of chamber openings, the plurality of chamber openings being sized to pass a substrate therethrough, each of the plurality of chamber openings being configured to be coupled to a slit valve, a load lock chamber, a cover plate, a processing chamber, or a second link chamber body; 1. A link chamber for use in a multi-chamber processing tool, comprising:

2. The link chamber of claim 1 , further comprising one or more slit valves coupled to the link chamber and configured to selectively seal one or more of the plurality of facets.

3. The link chamber of claim 1 , further comprising a transfer robot disposed in an interior volume of the link chamber body and coupled to the bottom plate.

4. The link chamber of claim 1 , further comprising one or more pump ports disposed through the bottom plate.

5. The link chamber of claim 4 , further comprising a pump coupled to the one or more pump ports.

6. A link chamber as described in any one of claims 1 to 5, wherein the bottom plate of the link chamber body includes a plurality of actuator openings adjacent to corresponding ones of the chamber openings and configured to pass an actuator of a slit valve.

7. A link chamber as described in any one of claims 1 to 5, wherein the top plate of the link chamber body includes one or more recesses adjacent each of the chamber openings, each of the one or more recesses including a fastener opening extending from the one or more recesses to an outer sidewall of the link chamber body.

8. The link chamber of any preceding claim, wherein the top plate includes a lid opening, and further comprising a lid removably coupled to the top plate.

9. a factory interface (FI) having one or more load ports configured to receive a substrate; A link chamber according to any one of claims 1 to 5, coupled to the FI; a plurality of processing chambers coupled to the link chamber via respective chamber openings; one or more load lock chambers coupled to the link chamber via respective one or more chamber openings; a link robot disposed in the link chamber and configured to facilitate transfer of the substrate from the FI to the plurality of processing chambers via the one or more load lock chambers; A multi-chamber processing tool comprising:

10. 10. The multi-chamber processing tool of claim 9, wherein the plurality of processing chambers comprises four deposition chambers and two cleaning chambers.

11. 10. The multi-chamber processing tool of claim 9, further comprising a transfer via coupled to one of the chamber openings, the transfer via being connectable to a transfer chamber of a second processing tool.

12. 10. The multi-chamber processing tool of claim 9, wherein the plurality of processing chambers comprises four processing chambers and the one or more load lock chambers comprises two load lock chambers.

13. 10. The multi-chamber processing tool of claim 9, wherein a vacuum pump is coupled to the link chamber, the plurality of processing chambers, and the one or more load lock chambers.

14. 10. The multi-chamber processing tool of claim 9, wherein the one or more load lock chambers comprises a load lock chamber, the load lock chamber comprising a substrate transfer mechanism configured to move the substrate from a position proximate to the FI to a position proximate to the link chamber.

15. 15. The multi-chamber processing tool of claim 14, wherein the substrate transfer mechanism is a substrate carousel, a load lock transfer robot, or a servo controlled shutter.

16. 10. The multi-chamber processing tool of claim 9, wherein the bottom plate includes a plurality of valve openings adjacent corresponding ones of the chamber openings.

17. 10. The multi-chamber processing tool of claim 9, wherein the plurality of processing chambers comprises six processing chambers, and the one or more load lock chambers comprises one load lock chamber having a substrate transfer mechanism configured to move the substrate from a position proximate to the FI to a position proximate to the link chamber.

18. 10. The multi-chamber processing tool of claim 9, further comprising a transfer via coupled to one of the chamber openings, the transfer via being connectable to a transfer chamber of a second processing tool.

19. 10. The multi-chamber processing tool of claim 9, further comprising a controller coupled to the link chamber and operable to receive data from the plurality of processing chambers and provide instructions to the multi-chamber processing tool for processing commands related to processing and transferring the substrate.

20. 10. The multi-chamber processing tool of claim 9, wherein the plurality of processing chambers comprises four physical vapor deposition chambers.

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