Manufacturing method of electronic assembly and electronic assembly

Abstract

A method for manufacturing an electronics assembly (100) comprising obtaining or creating (210) an electronics module (10) comprising a first circuit (12) on a first surface on a first side of a circuit board (11), at least one electronic component (12) on the circuit board (11) electrically connected to the first circuit (13), and at least one first connection portion (14) on the first surface and / or an adjacent side surface at the periphery of the circuit board (11), the at least one first connection portion (14) being electrically connected to or included within the first circuit (12). The method also includes disposing (220) the electronics module (10) on a second substrate (21), preferably a thermoformable film or sheet made of a plastic material, the second substrate (21) having a second connection portion (22) connected to a second circuit (23) on a surface of the second substrate (21), the second surface of the circuit board (11) being on a second side opposite the first surface and facing the second substrate (21); and disposing (230) a conductive adhesive (16) on and extending between the first connection portion (14) and the second connection portion (22) to electrically connect the electronics module (10) to the second circuit (23) via the conductive adhesive (16).

Description

[Technical field]

[0001] The present invention relates generally to functional integrated structures or electronic assemblies incorporating various functional features such as electronic, mechanical, optical elements, etc. In particular, but not exclusively, the present invention relates to connecting electronic modules or subassemblies to a substrate to produce such structures or assemblies. [Background technology]

[0002] For example, in the field of electronics and electronic products, there are a variety of different stacked assemblies and multi-layer structures in the context of different functional ensembles. For example, the motivation behind functional integration with electronics, mechanical features, or optical features can be as diverse as the relevant use context. Size savings, weight savings, cost savings, or simply efficient integration of components are relatively often pursued, for which the resulting solution ultimately exhibits multi-layered nature. The relevant use scenarios can then relate to product packaging or casings, visual design of device housings, wearable electronics, personal electronic devices, displays, detectors or sensors, vehicle interiors, antennas, labels, and vehicle electronics, etc.

[0003] Electronics, such as electronic components, ICs (integrated circuits), and conductors, may generally be provided on the substrate elements by a number of different techniques. For example, prefabricated electronics, such as various surface mounted devices (SMDs), may be mounted on the substrate surface that will ultimately form the inner or outer interface layer of the multi-layer structure. In addition, techniques that fall under the term "printed electronics" may be applied to actually produce electronics directly and additively on the substrate concerned. The term "printed" in this context refers to various printing techniques that can produce electronics / electrical elements from the printed matter, including but not limited to screen printing, flexographic printing, and inkjet printing, through a substantially additive printing process. The substrates used may be, but are not necessarily, flexible and the printed material organic.

[0004] Moreover, the concept of injection molded structural electronics (IMSE) involves building functional devices and their parts in the form of multi-layer structures or assemblies, which encapsulate the electronic functionality as seamlessly as possible. A characteristic of IMSE is also that the electronics are usually manufactured in a true 3D (non-planar) form according to a 3D model of the intended product, part, or generally the entire design. To achieve the desired 3D arrangement of the electronics on the 3D substrate and in the associated end product, the electronics may still be provided on an initially planar substrate, such as a film, using two-dimensional (2D) methods of electronics assembly. The substrate, which already houses the electronics, may then be formed and overmolded into the desired three-dimensional, i.e. 3D, shape, for example by a suitable plastic material that covers and embeds the underlying elements, such as the electronics, thus protecting and potentially hiding the elements from the environment. Further layers and elements may naturally be added to the construction.

[0005] It has often been difficult to obtain robust functionally integrated structures or assemblies in which both the mechanical and especially the electrical connections, as well as other functionalities, are achieved in a reliable and cost-effective solution. Typically, the connections are made by attaching the components and / or subassemblies to the substrate from below, i.e. between the components and / or subassemblies and the substrate to which they are connected. The electrical connection means, such as connectors and / or pads, used for the connections are located "under" the components and / or subassemblies, which can make the assembly production method complex, laborious and expensive. Summary of the Invention

[0006] SUMMARY OF THE PRESENT EMBODIMENT An object of the present invention is to at least alleviate one or more of the above mentioned drawbacks associated with known solutions in terms of integrated electronic assemblies including electronic modules or subassemblies and in particular their connections.

[0007] The object of the invention is achieved by a method for manufacturing an electronic assembly and by an electronic assembly as defined by the respective independent claims.

[0008] According to a first aspect, there is provided a method for manufacturing an electronics assembly. The method includes obtaining or making an electronics module, the electronics module comprising a first circuit on a first surface of a first side of a circuit board, at least one electronic component on the circuit board electrically connected to the first circuit, and at least one first connection on the first surface and / or on an adjacent side surface of the periphery of the circuit board, the at least one first connection being electrically connected to or included within the first circuit. The method further includes disposing the electronics module on a second substrate, such as a thermoformable film or sheet made of a plastic material, the second substrate including a second connection connected to the second circuit on the surface of the second substrate, the second surface of the circuit board being on a second side opposite the first surface and facing the second substrate. Furthermore, the method includes disposing a conductive adhesive on and extending between the first and second connections for electrically connecting the electronics module to the second circuit via the conductive adhesive.

[0009] The circuit board or at least a portion thereof may be one selected from the group consisting of a printed circuit board (PCB), any low temperature co-fired ceramic circuit board, a FR4 circuit board, a flexible PCB, a rigid-flex PCB.

[0010] In many embodiments, the circuit board may be rigid or at least partially rigid, such as a PCB, any low temperature co-fired ceramic circuit board, an FR4 circuit board, or the like.

[0011] The conductive bonding material may be one selected from the group consisting of a solder material such as molten solder or stencil printed solder, a conductive adhesive, a conductive ink, a conductive tape or film, such as an asymmetric conductive tape or film, or an anisotropic conductive film (ACF).

[0012] In various embodiments, the conductive bonding material may be at least initially jettable, preferably flowable, such as a conductive adhesive or ink, or a molten or stencil printed solder material, and disposing the conductive bonding material may include jetting the conductive bonding material onto the first connection portion and the second connection portion.

[0013] In various embodiments, the first connection portion may comprise one or more conductive pads at a periphery on a first surface of the first side of the circuit board.

[0014] Alternatively or additionally, the first connection portion may include one or several castellated ends or plated ends or semi-holes.

[0015] Furthermore, the first connection may comprise one or several vias or plated holes.

[0016] In various embodiments, positioning the electronics module may include attaching the electronics module to a second substrate with a second adhesive, preferably an electrically non-conductive adhesive, provided on a second side of the electronics module.

[0017] In various embodiments, the method may include applying a conformal coating, encapsulant, or glob top layer onto the first surface for embedding at least one electronic component.

[0018] Additionally, the method may include forming, such as by thermoforming, the second substrate, at least locally, from a planar shape to assume a non-planar shape, such as a convex and / or concave portion, or a 3D shape, before or after disposing the electronics module on the second substrate. Forming the second substrate may preferably, but not necessarily, occur after disposing the electronics module on the second substrate. In some embodiments, forming may occur prior to said disposing.

[0019] The method may, in some embodiments, include providing a trench in the second substrate that includes or is a depression or indentation, the trench having a shape and lateral size such that the electronics module fits laterally into the trench. Further, the trench may be provided by thermoforming the second substrate.

[0020] In various embodiments, the circuit board may include a rigid portion and a flex portion attached to one another, with the at least one first connection configured at the periphery of the flex portion.

[0021] In some embodiments, the at least one electronic component may be a connector for providing an electrical connection between an external entity and the first circuit.

[0022] Furthermore, the method may include disposing a third substrate, such as on a thermoformable film or sheet, preferably made of a plastic material, on an opposite side of the electronics module from the second substrate.

[0023] Furthermore, the method may include forming the third substrate, such as by thermoforming, instead of or in addition to forming the second substrate, before or after providing the molding material layer, at least locally, from a planar shape to a non-planar shape, such as a convex and / or concave portion, or a 3D shape. Thus, the molding material layer may be first provided on the second substrate, and then the third substrate may be provided on the molding material layer, or the molding material layer may be provided between the second and third substrates.

[0024] Additionally, in some embodiments, the at least one electronic component may be a segmented display, such as a 7-segment, 8-segment, or 16-segment display.

[0025] Additionally, the third substrate may be attached to the first surface of the circuit board and / or the at least one electronic component by a third adhesive, such as a clear adhesive or film.

[0026] Alternatively or additionally, the method may include removing a portion of the second substrate to expose the circuit board for disposing at least one electronic component on the exposed portion of the second surface.

[0027] Additionally, a third substrate may be attached to the first surface of the circuit board by a third adhesive, such as an anisotropic conductive adhesive or film.

[0028] In one embodiment, the method may include placing a display in the space left by the removed portion of the third substrate.

[0029] The circuit board may include a cavity on the first surface, and the method may include removing a portion of the third substrate to expose the cavity for placing one or more electronic components, such as a passive infrared sensor, in the cavity.

[0030] In some embodiments, the method may include attaching a second circuit board to a third board on a side facing or that will face the electronics module, the second circuit board having a through hole, and removing a portion of the third board to expose the through hole for placing one or more electronic components, such as a passive infrared sensor, in a cavity defined by the through hole and the circuit board.

[0031] In various embodiments, the method may include molding, preferably injection molding, a material such as a thermoplastic onto a side of the second substrate having the electronics module and at least partially embedding the electronics module.

[0032] The method may also include removing a portion of the second substrate after disposing the electronics module to at least partially expose an opposing side of the electronics module to the at least one electronics component.

[0033] In some embodiments, the at least one electronics component may include one or more capacitive sensing elements, such as electrodes, and the electronics module may further include a ground plane on an opposite side to the one or more capacitive sensing elements.

[0034] In some other embodiments, the at least one electronic component may include one or more inductive sensors, or force or pressure sensing elements.

[0035] In various embodiments, the method may include disposing a guard ring over the circuit board and around the at least one electronic component, the guard ring optionally including a cover on an opposite side to the circuit board, and the circuit board may further include an antenna element, such as a printed antenna or a ceramic antenna.

[0036] Alternatively or additionally, the method may include providing a potting material in a space defined by the guard ring and the circuit board, and optionally the cover.

[0037] In various embodiments, the guard ring may be a reflector or may have a reflective inner surface.

[0038] Alternatively or additionally, the cover may be a diffuser, such as made from a diffusing material.

[0039] The electronics module may, in various embodiments, further include an electrical energy storage device, such as a battery.

[0040] In one embodiment, the method may include disposing a gas sensor on a circuit board and removing a portion of a third board to provide a gas vent in fluid communication with the gas sensor.

[0041] In one embodiment, the method may include disposing an audio device on a circuit board. Alternatively, the method may include disposing a haptic actuator, such as a linear resonant actuator (LRA) or an eccentric resonant motor (ERM).

[0042] According to a second aspect, an electronics assembly is provided. The electronics assembly comprises a second substrate, preferably a thermoformable film or sheet made of a plastic material, the second substrate comprising a second connection connected to a second circuit on a surface of the second substrate. The electronics assembly also comprises an electronics module comprising a first circuit on a first surface of a first side of the circuit substrate, at least one electronic component on the circuit substrate electrically connected to the first circuit, and at least one first connection on the first surface and / or on an adjacent side surface of the periphery of the circuit substrate, the at least one first connection being electrically connected to or included within the first circuit. The second surface of the circuit substrate is on a second side opposite the first surface and faces the second substrate. The electronics assembly further comprises a conductive bonding material, e.g., one selected from the group consisting of solder material, molten or stencil printed solder, conductive adhesive, conductive ink, and conductive tape, disposed over and extending between the first and second connecting portions to electrically connect the electronics module to a second circuit via the conductive bonding material.

[0043] The electronics assembly may preferably include a layer of molded material, such as an injection molded material, that embeds the electronics module.

[0044] The molding material layer may generally comprise at least one material selected from the group consisting of, for example, polymers, organic materials, biomaterials, composite materials, thermoplastic materials, thermoset materials, elastomeric resins, PC, PMMA, ABS, PET, copolyesters, copolyester resins, nylon (PA, polyamide), PP (polypropylene), TRU (thermoplastic polyurethane), polystyrene (GPPS), TPSiV (thermoplastic silicone vulcanizate), and MS resins. The molding material layer may be transparent, translucent, or opaque.

[0045] The electronics assembly may also include a third substrate, preferably on an opposite side of the electronics module to the second substrate, and a molding material layer may be disposed between the third substrate and the second substrate.

[0046] In some embodiments, there may be no molding material at the location of the electronics module because the electronics module extends from the second substrate to contact at least some layers other than the third substrate or the molding material layer that contacts the third substrate.

[0047] The at least one electronic component may be a microcontroller, an integrated circuit, a transistor, a resistor, a capacitor, an inductor, a diode, a photodiode, a light emitting diode, a semiconductor switch, an electromechanical component, an electro-optical component, a radiation emitting component, a light emitting component, an LED (light emitting diode), an OLED (organic LED), a side shooting LED or other light source, a top shooting LED or other light source, a bottom shooting LED or other light source, a radiation detecting component, a light detecting or light sensitive component, a photodiode, a phototransistor, a photovoltaic device, a sensor, a microcontroller, a microcomputer, a memory, a memory card, a memory device, a memory card ... The device may comprise at least one component selected from the group consisting of a micromechanical component, a switch, a touch switch, a touch panel, a proximity switch, a touch sensor, an air sensor, a temperature sensor, a pressure sensor, a moisture sensor, a gas sensor, a proximity sensor, a capacitive switch, a capacitive sensor, a projected capacitive sensor or switch, a single-electrode capacitive switch or sensor, a capacitive button, a multi-electrode capacitive switch or sensor, a self-capacitance sensor, a mutual-capacitance sensor, an inductive sensor, a sensor electrode, a micromechanical component, a UI element, a user input element, a vibration element, a sound generation element, a communication element, a transmitter, a receiver, a transceiver, an antenna, an infrared (IR) receiver or transmitter, a wireless communication element, a wireless tag, a radio tag, a tag reader, a data processing element, a microprocessor, a microcontroller, a digital signal processor, a signal processor, a programmable logic chip, an ASIC (application specific integrated circuit), a data storage element, and an electronic subassembly.

[0048] In various embodiments, possible additional layers or generally features may be added to the electronics assembly by molding, lamination or suitable coating (e.g. vapor deposition) procedures, without forgetting other possible positioning or fastening techniques. The layers may be of protective, instructional and / or aesthetic value (graphics, colors, figures, text, numerical data, etc.) and may contain, for example, textile, leather or rubber materials instead of or in addition to additional plastics. Additional elements such as electronics, modules, module internals or parts, and / or optical components may be placed and fastened to the outer surface(s) of the structure, for example, the outer surface of an included film or molded layer, depending on the embodiment. The necessary material may be molded / cut. For example, a diffuser may be made from a light conductor material that locally irradiates the laser. If a connector is provided, the connector of the multi-layer structure may be connected to a desired external connection element, such as an external connector of an external device, system or structure, for example, an external connector of a host device. For example, these two connectors may together form a plug-and-socket type connection and interface. As used herein, the multi-layer structure may also be generally positioned and attached to a larger ensemble, such as an electronic device, such as a personal communication device, a computer, a home device, an industrial device, or a vehicle, for example in an embodiment where the multi-layer structure forms part of the vehicle exterior or interior, such as the dashboard.

[0049] The present invention provides a method for manufacturing an electronics assembly and an electronics assembly. The present invention has an advantage over known solutions in that the electronics module can be attached directly to the film, since only a mechanical attachment, if any, between the module and the film is required. Such adhesion can be strong, which allows the module to be placed even directly under the injection molding gate when the injection molding material is applied to embed the module. Direct attachment also shortens the thermal path to the component surface, improving heat dissipation and increasing power per module. Finally, electrical connections can be established through the edge or top of the module. Thus, optimal properties can be obtained for both the mechanical and electrical connections, resulting in an overall more robust and cost-effective structure.

[0050] In many cases, the electrical connection may be made with a conductive adhesive or ink, which can be dispensed to also cover some of the pads on the circuit board. For example, by using a single ink, the different materials used in the assembly can be minimized if the contact pads and / or traces are made with the same ink, which makes the assembly more reliable and easier to meet functional safety requirements for example.

[0051] Various other advantages will become apparent to those skilled in the art based on the following detailed description.

[0052] The term "several" as used herein may refer to any positive integer starting from 1, i.e., 1, at least 1, or several.

[0053] The term "plurality" can refer to any positive integer starting with 2, i.e., 2, at least 2, or greater than 2.

[0054] The terms "first," "second," and "third" are used herein to distinguish one element from other elements and do not dictate any special priority or ordering therebetween unless expressly stated otherwise.

[0055] The exemplary embodiments of the invention presented herein should not be interpreted as posing limitations on the applicability of the appended claims. The verb "comprises" is used herein as an open limitation that does not exclude the presence of unrecited features. Features recited in dependent claims can be freely combined with each other, unless expressly stated otherwise.

[0056] The novel features which are believed to be characteristic of the invention are set forth with particularity in the appended claims, but the invention itself, both as to its structure and its method of operation, together with additional objects and advantages thereof, will best be understood from the following description of specific embodiments when read in connection with the accompanying drawings.

[0057] Some embodiments of the present invention are illustrated by way of example, and not by way of limitation, in the figures of the accompanying drawings. [Brief description of the drawings]

[0058] [Figure 1] 1 illustrates, in schematic form, an electronics assembly. [Diagram 2] 1 illustrates, in schematic form, an electronics assembly. [Diagram 3] 1 illustrates, in schematic form, an electronics module. [Figure 4] 1 illustrates, in schematic form, an electronics assembly. [Diagram 5] 1 illustrates, in schematic form, an electronics assembly. [Figure 6A] 1 illustrates, in schematic form, an electronics assembly. [Figure 6B] 1 illustrates, in schematic form, an electronics assembly. [Figure 7A]1 illustrates, in schematic form, an electronics assembly. [Figure 7B] 1 illustrates, in schematic form, an electronics assembly. [Figure 8A] 1 illustrates, in schematic form, an electronics assembly. [Figure 8B] 1 illustrates, in schematic form, an electronics module with a connector. [Figure 9] 1 illustrates, in schematic form, an electronics assembly. [Figure 10A] 1 illustrates, in schematic form, an electronics assembly. [Figure 10B] 1 illustrates, in schematic form, an electronics assembly. [Figure 10C] 1 illustrates, in schematic form, an electronics assembly. [Figure 11A] 1 illustrates, in schematic form, an electronics assembly. [Figure 11B] 1 illustrates, in schematic form, an electronics assembly. [Figure 11C] 1 illustrates, in schematic form, an electronics module. [Figure 11D] 1 illustrates, in schematic form, an electronics module. [Figure 11E] 1 illustrates, in schematic form, an electronics module. [Figure 11F] 1 illustrates, in schematic form, an electronics module. [Figure 11G] 1 illustrates, in schematic form, an electronics module. [Figure 12] 1 illustrates, in schematic form, an electronics assembly. [Figure 13A] 1 illustrates, in schematic form, an electronics assembly. [Figure 13B] 1 illustrates, in schematic form, an electronics assembly. [Figure 13C] 1 illustrates, in schematic form, an electronics assembly. [Figure 14] 1 illustrates, in schematic form, an electronics module. [Figure 15A] 1 illustrates, in schematic form, an electronics assembly. [Figure 15B] 1 illustrates, in schematic form, an electronics assembly. [Figure 16A] 1 illustrates, in schematic form, an electronics assembly. [Figure 16B] 1 illustrates, in schematic form, an electronics assembly. [Figure 16C] 1 illustrates, in schematic form, an electronics assembly. [Figure 17A] 1 illustrates, in schematic form, an electronics assembly. [Figure 17B] 1 illustrates, in schematic form, an electronics assembly. [Figure 17C] 1 illustrates, in schematic form, an electronics assembly. [Figure 17D] 1 illustrates, in schematic form, an electronics assembly. [Figure 17E] 1 illustrates, in schematic form, an electronics assembly. [Figure 18] 1 illustrates, in schematic form, an electronics assembly. [Figure 19] FIG. 1 is a flow diagram of a method for manufacturing an electronic assembly. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0059] 1 generally illustrates an electronics assembly 100. The electronics assembly 100 may include a second substrate 21, preferably a thermoformable film or sheet of a plastic material or the like, with a second connection 22 connected to or included within a second circuit 23 on a surface of the second substrate 21. The second circuit 23 may also include active and / or passive electronic components, electromechanical components, optical components, semiconductor devices, as well as conductive pads, traces, and the like.

[0060] Additionally, electronics assembly 100 may include electronics module 10. Electronics module may include a first circuit 13 on a first surface at a first side of circuit board 11, at least one electronic component 12 on circuit board 11 electrically connected to first circuit 13, and at least one first connection 14 on the first surface and / or on an adjacent side surface of the periphery of circuit board 11, at least one first connection 14 electrically connected to or included within first circuit 13. Furthermore, a second surface of circuit board 11 is on a second side opposite to the first surface as seen in FIG. 1 and faces second substrate 21.

[0061] The electronics assembly 100 also includes a conductive bonding material 16, such as a material selected from the group consisting of solder, conductive adhesive, conductive ink, and conductive tape, disposed on and extending between the first connection portion 14 and the second connection portion 22 to electrically connect the electronics module 10 to a second circuit 23 via the conductive bonding material 16.

[0062] 1, the conductive bonding material 16 is illustrated as being at least initially jettable, and preferably flowable, such as a conductive adhesive or ink, or a meltable or stencil printable solder material, but instead of such materials, for example, a conductive tape could be utilized to extend between the first connection portion 14 and the second connection portion 22, with the electrical connection being made via the tape.

[0063] 1, at least one first connection portion 14 may be disposed on a first surface, i.e., "above" the circuit board. Thus, conductive bonding material 16 may extend from a first surface, e.g., above, at least one first connection portion 14 and contact second connection portion 22. Conductive bonding material 16 may additionally contact an adjacent side of circuit board 11 (as shown and described in connection with FIG. 2 and various other figures herein) and may not include or define a portion of first connection portion 14.

[0064] 1 further illustrates an optional feature of a conformal coating 18, or encapsulant or glob top layer, on the first surface and at least one electronic component 12, and optionally embedding a portion of the circuit board 11 around the component 12. The conformal coating 18 may be positioned to provide adhesion to a molding material layer, such as a resin, to avoid damage to the electronic component 12 on the circuit board 11 due to thermal expansion and / or CTE (coefficient of thermal expansion) mismatch, etc. The conformal coating 18 may be applied to the surface layer of the circuit board 11 after the electronics module 10 is placed or assembled on the second substrate 21. This may be done with conventional printed circuit board (PCB) production equipment. The material of the conformal coating 18 may be, for example, but not limited to, a plastic spray acrylate. The conformal coating 18 may alternatively or additionally be optically transparent, such as completely transparent, translucent, opaque, etc. This is particularly useful where the electronics module 10 is or comprises an optical device(s) / component(s).

[0065] Furthermore, as an optional feature, the use of adhesive 24 between electronics module 10 and second substrate 21 is shown. Adhesive 24 may be an electrically non-conductive adhesive that is provided or dispensed on the second side of electronics module 10 or on second substrate 21. Adhesive 24, i.e., the second adhesive (preferably different from the conductive adhesive of conductive bonding material 16 in some examples), may include or consist of, for example, but is not limited to, a cyanoacrylate structural adhesive. In some embodiments, adhesive 24 may include a thermal buffering agent, such as rubber.

[0066] FIG. 2 illustrates, in schematic form, an electronics assembly 100. The electronics assembly 100 is similar in many respects to that illustrated in FIG. 1, but differs in at least one first connection 14. In this case, the at least one first connection 14 extends to, or is substantially completely present on, an adjacent side of the circuit board 11. As shown in FIG. 2, the conductive adhesive 16 need only be placed in contact with the adjacent side to establish an electrical connection between the first connection 14 and the second connection 22. Although only the overlapping, but initially dispensable, preferably flowable, conductive adhesive 16 is visible, in some embodiments, a conductive tape may be utilized instead.

[0067] FIG. 3 illustrates, in schematic form, an electronics module 10. The electronics module 10 is shown in a perspective view. As can be seen, the circuit board 11 may optionally include vias, such as through-holes, blind, or buried vias, as known to those skilled in the art. However, as shown in FIG. 3, at least one, and preferably a plurality of, first connection portion(s) 14 may define or include one or several castellated or plated ends or semi-holes 17.

[0068] Additionally, in some embodiments, the shape of the circuit board 11 may be circular, elliptical, oval, etc., that does not define any edge angles (an "edge" is an acute angle of 90 degrees or less, preferably 120 degrees or less, and most preferably 135 degrees or less). A circular shape is well suited for overmolding, such as injection molding, without the need to assemble the parts in a special orientation. A circular shape, in particular, may also reduce the need for multiple molding flow simulations, since the circuit board 11 is symmetrical, thus essentially having the same effect on the flow regardless of its position. However, in some embodiments, the shape may follow or correspond to a specific, more complex shape, such as an icon.

[0069] 3, the circuit board 11, e.g., PCB, has a diameter of 10 mm and defines or comprises 24 castellation end connections 17. As can be appreciated, the diameter can be any, for example ranging from about 3 mm up to 100 mm. However, the diameter is preferably such that the electronics module 10 defines functional units such as electronic components. A 20 mm diameter circuit board 11 may comprise 48, etc.

[0070] The size of the castellation edge or plated edge or semi-hole 17 may be, for example, in the range of 0.2 to 5 millimeters, 0.7, 1.5, 2.4, 3.6, or 4.2 mm, etc. In some preferred embodiments, the size may be less than 1 mm or up to 1 mm.

[0071] It should further be understood that the number of first connections 14, in this case castellated ends or plated ends or semi-holes 17, may range anywhere from 1 up to 50 or more. For example, the number of first connections may range from 4 to 36. The electronics module 10 shown in FIG. 3 may operate, for example, capacitive sensors and LEDs. It may also be arranged to communicate with other ICs (integrated circuits), for example via a serial bus.

[0072] Since there are no connection pads underneath the electronics module 10, it can be directly assembled to a second substrate (e.g., using a jettable cyanoacrylate with a rubber bumper for increased resistance to impact and thermal cycling). The second substrate 21 can be, for example, a (FR700) polycarbonate film. The adhesion is strong, which allows the module 10 to also be placed directly underneath an injection molding gate when an injection molding layer is added onto the electronics module 10, as described below for some embodiments.

[0073] In various embodiments, a thin circuit board (e.g., having a thickness of 0.2 to 0.6 mm) such as a PCB may be used because the circuit board 11 is attached to the second substrate 21. In addition, the direct attachment shortens the thermal path, improving heat dissipation and allowing for increased power per module.

[0074] As mentioned above, the electrical connection by the conductive bonding material 16 may in some embodiments be made using a conductive ink. In various embodiments, a conductive ink, such as a stretchable conductive ink, is advantageous, which may be made of the same material as the conductive traces of the second connection portion 22 and, optionally, the traces of the second circuit 23.

[0075] If the conductive bonding material 16 is an ink or the like that has fluidity at least initially, it can be discharged so as to cover a part of the first connection portion 14 on the circuit board 11 as well.

[0076] In some embodiments, the viscosity of the ink may be less than 100 Pa·s at 25° C., for example in the range of 10 or 15 to 35 or 60 Pa·s.

[0077] Figure 4 illustrates, in schematic form, an electronics assembly 100. The electronics assembly 100 is similar to that illustrated in Figure 1 and will be described in that context, except that the embodiments according to Figures 2 and 3 are similar.

[0078] As can be seen, the electronics assembly 100 may further include a molding material layer 41, such as an injection molded material, that embeds the electronics module 10. The molding material layer 41 may be made of, for example, a thermoplastic material.

[0079] 4 further illustrates an optional third substrate 31, such as a flexible film or sheet of a thermoformable material, such as plastic. The third substrate 31 may be laminated onto a molding material layer 41, which is preferably injection molded between the second substrate 21 and the third substrate 31.

[0080] Fig. 5 illustrates, in a schematic manner, the electronics assembly 100. The electronics assembly 100 is "above" showing the electronics module 10 on the circuit board 11. Fig. 5 also shows an additional connector on the second substrate 21. The additional connector is connected to or is included within a second circuit 23 on the second substrate 21. The second circuit 23 may be printed on the surface of the second substrate 21, for example by screen printing, inkjet printing, etc. Other printing methods may also be used.

[0081] 6A and 6B illustrate, in a schematic manner, an electronics assembly 100. FIG. 6A shows a perspective view of the assembly 100, and FIG. 6B shows a cross-sectional side view. Moreover, the assembly 100 is similar to that shown in FIG. 5, but the electronics module 10 is arranged in a trench 15 or hole, which is clearly visible in FIG. 6B. Thus, the assembly 100, and in particular the second substrate 21, may comprise a trench 15, which includes a depression or is a depression or recess, relative to the second substrate 21, the trench 15 having a shape and a lateral size such that the electronics module 10 fits laterally into the trench 15. Moreover, the trench 15 may be provided by thermoforming the second substrate 21. The trench 15 may preferably have a shape that follows the shape of the module 10, i.e. a shape that follows the outer shape of the module 10. In FIG. 6, the trench 15 is circular, but it may also have protrusions at the location of the castellations 17. The trench 15 is preferably a snug fit for the module 10, i.e., the trench 15 is only slightly larger than the circuit board 11 in the lateral direction. Thus, the electronics module 10 can be assembled in the trench 15 after the thermoforming process of the substrate 21. By placing the electronics module 10 in the trench 15, the structure can have a substantially flat or uniform surface once the electronics module 10 fills the trench 15, as shown in FIG. 6B. This can avoid or at least reduce the probability of cracking or breaking the substrate 21 and / or the electronics module 10 during the injection molding process, since the surface on which the injection molding is performed is essentially flat or uniform. However, the trench 15 is not necessarily as deep as the thickness of the electronics module 10 or the circuit board 11. The trench 15 can be deeper or less deep.

[0082] Thus, an electronics module 10 having first connections 14 such as castellations 17 may be placed on a thermoformed substrate 21 having trenches with snap-on electromechanical connections. Placing the electronics module 10 in a trench provides protection from damage due to thermal cycling and moisture, and allows for a low profile overall assembly 100.

[0083] A thicker circuit board 11, for example 0.6-1.6 mm, may be used to provide a larger surface area for connecting directly between the first connection portion 14 and the second connection portion 22 via the conductive bonding material 16. In one embodiment, a "vertical" conductive tape may be utilized between the first connection portion 14 and the second connection portion 22.

[0084] In some embodiments, the connections 14, 22 may be coated with graphite to improve the durability of the connection areas.

[0085] In some embodiments, the trench may be filled with a protective coating similar to a conformal coating or similar filling material.

[0086] 7A and 7B show, in schematic form, an electronics assembly 10. The circuit board 11 may comprise a rigid portion 11A and a flex portion 11B attached to each other, with at least one first connection portion 14 being included in the periphery of the flex portion 11B. For electrical connection between the first connection portion 14 and the second connection portion 22, a conductive bonding material 16 as described above, and optionally castellations 17, may be used. For attaching the module 10 to the second substrate 21 and / or the third substrate 31 (e.g., with an anisotropic conductive film), an adhesive 24, such as an electrically non-conductive adhesive, may be used.

[0087] As can be seen, in the electronics module 11, a few traces or conductive lines may be easily established from the relatively small rigid portion 11A. In FIG. 7B, the conductive bonding material 16 may preferably be a conductive adhesive, such as an anisotropic conductive adhesive or film. The electronics component 12 may be, for example, an integrated circuit. In some embodiments, the electronics module 10 may be a large IMSE part, acting as an analog front end, for example, right next to a sensor. Digital control and power may be provided externally.

[0088] In some embodiments, such electronics modules 10 may be used on both the second substrate 21 and the third substrate 31, optionally near the edges of the substrates 21, 31 to provide connectors or connector-like arrangements.

[0089] Additionally, electronics assemblies 100 such as those shown in Figures 7A and 7B may be utilized in conjunction with touch pads, capacitive sliders, button matrices, capacitive buttons, and inductive buttons.

[0090] FIG. 8A generally illustrates an electronics assembly 100. FIG. 8B generally illustrates an electronics module 10 with a connector 51. At least one electronics component 12 may, in some embodiments, be a connector 51 for electrically connecting between an external entity and the first circuit 13, preferably the connector 51 extending through a hole in the second substrate 21. Additionally, there may be other electronics components 12 on the opposite side of the circuit substrate 11, as shown in FIGS. 8A and 8B. An external conductor 59 connectable to the connector 51 is also shown.

[0091] Furthermore, the first electrical connection portion 14 may advantageously comprise castellations 17. The connector 51 may comprise pins 52 etc. and a connector housing 55.

[0092] In some embodiments, the second circuit 23 may comprise a substrate 61, such as a rigid substrate. There may be further electronic components 62, such as high power LEDs, disposed on the further substrate 61.

[0093] In various embodiments, connector 51 may have, for example, 2 to 8 pins or terminals, with a pitch ranging from 0.5 mm to 3 mm, for example, but may have up to 40 pins or more with a smaller pitch and / or multi-row connectors may be used.

[0094] In one embodiment, the top surface of the module 10, i.e., the side opposite the connector 51, may be used for various purposes, such as power noise filtering, power boost using a capacitor, USB-UART (Universal Asynchronous Transmitter / Receiver) or USB-I2C (Inter-Integrated Circuit communication), USB-SPI (Serial Peripheral Interface) for consumer products, CAN (Controller Area Network)-UART, LIN (Local Interconnect Network)-UART for automotive applications, LED driver (MOS) FET, etc.

[0095] In some embodiments, the thickness of the circuit board 11 may be greater than 0.6 mm to provide a secure platform for the connector 51 .

[0096] Additionally, circuit board 11 may include holes for mounting pins of connector 51, if used with the selected connector model. These holes may be utilized to hold module 10 in place during the injection molding process.

[0097] In one embodiment, after connector 51 is attached to circuit board 11, it may be secured and protected with an encapsulant.

[0098] In some embodiments, the electronics module 10 may be created by cutting open or removing a portion of the second substrate 21. The adhesive 24 may then be dispensed onto the substrate 21. The circuit board 11 may then be assembled without the connector 51. The substrate 21 may then be optionally thermoformed, if desired. An injection molding material layer 41 may then be provided to embed the circuit board 11 and electronics components 12. Finally, the connector 51 may be attached to the circuit board 11 through the opening in the second substrate 21, such as by using heat, infrared light, or hot air to solder the connector 51 to the circuit board 51. The connector 51 may be further secured with an adhesive.

[0099] In some embodiments, the injection molded layer 41 may alternatively be provided before removing a portion of the second substrate 21 to locate the connector 51 .

[0100] In various embodiments, there may be such an electronics module 10 having connectors 51 on both the second substrate 21 and the third substrate 31, if present.

[0101] 9 generally illustrates electronics assembly 100. At least one electronics component 12 may be a segment display, such as a 7-segment, 8-segment, or 16-segment display, in some embodiments. Additionally, optionally, a third substrate 31 may be attached to a surface of the segment display opposite circuit board 11, as shown in FIG. 9, by an optically clear adhesive, film, tape, or the like. Additionally, third substrate 31 may be attached to a first surface of circuit board 11 by a third adhesive 71, such as an adhesive or film or tape.

[0102] 10A-10C illustrate, in schematic form, an electronics assembly 100. In FIG. 10A, an assembly 100 similar to FIG. 2 is shown, for example also including a third substrate 31 and a molding material layer 41. FIG. 10B shows a similar assembly, but with a portion of the second substrate 21 removed to expose the circuit board 11 for placement of at least one electronics component 12 on the exposed portion of the second surface 21. FIG. 10C shows the electronics assembly of FIG. 10B from the opposite side of the second substrate 21 relative to the electronics module 10. FIG. 10C shows further connections 76, such as pads, for connecting the electronics component 12. The cavities or exposed openings may be filled with a conformal coating or other filler 73, for example an adhesive.

[0103] In the process described in connection with Figures 10A and 10B, for example, IC chips and other expensive electronic components are assembled after the components are manufactured and pass qualification testing. The method / process also increases the usable surface area of ​​an in-mold circuit board, such as a PCB, because electronic components can now also be assembled on the bottom side of the module 10. Thus, in Figure 10B, for example, the electronic components 12 on a first surface can be less expensive and more robust, while the opposite "bottom" surface can have more expensive and fragile components 12.

[0104] 11A and 11B generally illustrate an electronics assembly 100. In particular, a capacitive value device / structure is illustrated in Figs. 11A and 11B. Thus, at least one electronics component 12 may include one or more capacitive sensing elements, such as electrodes 81. Figs. 11C-11F illustrate an associated electronics module 10.

[0105] In various embodiments, the electronics module 10 may include a ground plane 84 on an opposite side to one or more of the capacitive sensing elements 81, 81A, 81B, specifically the self-capacitive 81, RX 81A, and TX 81B electrodes. There may also be a shielding element 82 within the module 10.

[0106] In these embodiments, the module 10 may be utilized to bring the capacitive electrodes 81, 81A, 81B into close proximity with the surface that is the third substrate 31. In various embodiments, the thickness of the circuit board 11 may be about half or more than half the thickness of the molding material layer 41.

[0107] In the embodiment shown in FIG. 11C, a circuit board 11 having a self-capacitance electrode 81 and a ground plane 84 may be used to prevent erroneous touching from the second board 21 side. Alternatively, the ground plane 84 may be provided on the second board 21 at a position corresponding to the module 10.

[0108] Instead of a capacitive sensing element there may be a suitable inductive or force sensing element, such as those described above in relation to the capacitive sensing element.

[0109] 11D shows the module 10 in a mutual capacitance "scoop" structure, i.e., there is an RX 81A electrode in the center and a TX electrode 81B on either side of it. In addition, there is also a ground 84 on the circuit board 11 or on the second board 21 on the opposite side of the circuit board 11.

[0110] 11E illustrates a module 10 with a projected capacitive structure. The RX electrodes 81A and TX electrodes 81B may be wired differently to the module 10 to prevent false touches. The RX electrodes 81A may be hatched for better performance.

[0111] 11F illustrates a module 10 with capacitive buttons / electrodes 81 with a shield electrode 82 for water tolerant touch. A guard electrode can also be used when running water is present.

[0112] FIG. 11G illustrates that other electronic components 12, such as LEDs, may also be present on the circuit board 11.

[0113] Fig. 12 illustrates, in a schematic manner, an electronics assembly 100. The electronics assembly 100 may comprise an electronics module 10, in particular its circuit board 11, which extends through a layer of molding material 41 between the second board 21 and the second board 31 in order to provide a reliable and high density connection between the two boards 21, 31. The electronics module 10 may be sandwiched between the two boards 21, 31. The module 10 may be assembled to the other of the boards 21, 31, for example in an SMT process, and then connected to the circuits 13, 22 by conductive adhesives or inks, or by soldering or conductive tape. The electrical and / or mechanical connection to the other of the boards 21, 31 may be made during the injection molding process, for example using an anisotropic conductive adhesive or film.

[0114] Additionally, in some embodiments, electronic components 12, as shown in dashed lines on top of circuit board 11, may be disposed in cavities on the first surface of circuit board 11.

[0115] In various embodiments, as already described above, electronic components 12 such as fragile IC chips may be added after molding as a post-processing step by removing portions of the second substrate 21 or into prefabricated openings therein. The openings may be filled with a conformal coating 18 or other filler 73.

[0116] The circuit board 11 may also include via(s) 91 extending through the circuit board 11 that may be used for connection between the boards 21, 31. As can be seen, the first connection 14 may also extend through the circuit board 11 in the thickness direction.

[0117] In some embodiments, silicone rubber mold inserts can be used to better tolerate dimensional variations in the circuit board 11 during the molding process.

[0118] 13A-13C generally illustrate an electronics assembly 100. In various embodiments, the circuit board 11 may include a cavity 19 on a first surface thereof, as briefly described above.

[0119] In various embodiments, a portion of the third substrate 31 may be removed to expose the cavity 19 for placement of one or more electronic components 12, such as a passive infrared sensor, in the cavity 19. Optionally, the third substrate 31 may be attached to the circuit board 11 at a first side thereof on a surface portion outside the cavity 19 by a third adhesive. An optional lens 93, such as a Fresnel and / or high density polyethylene (HDPE) lens, covers the electronic components 12, such as an infrared sensor, because such sensors operate at wavelengths around 7-14 micrometers that are blocked by many thermoplastics, such as polycarbonate and acrylic. Thus, care must be taken to ensure that the sensor operates properly.

[0120] In various embodiments, after the molding material layer 41 is provided between the substrates 21, 31, the cavity 19 may be exposed by removing a portion of the third substrate.

[0121] 13B illustrates the use of two circuit boards 11, 11C, instead of using a circuit board 11 with a cavity 19. Thus, a second circuit board 11C may be attached to the third board 31 on the side facing or to be facing the electronics module 10, and the second circuit board 11C may be provided with through holes. On the other hand, the second circuit board 11C may be directly attached to the circuit board 11 or may be additionally attached.

[0122] 13C shows an embodiment in which the circuit board 11 is attached to an upper substrate, in this case the second substrate 21. A cavity is provided by an opening in the second substrate 21. In some embodiments, a lens 93 may be used. Alternatively, the electronics component 12, such as an infrared sensor, may comprise a thin lens, which can fit into the small hole defined by the opening in the second substrate 21.

[0123] Figure 14 illustrates, in schematic form, an electronics module 10. The module 10 may include a protective ring 6 on a circuit board 11 and around at least one electronic component 12, and optionally a cover 8 on the opposite side relative to the circuit board 11. These are further illustrated in Figures 15A and 15B. In various embodiments, the ring 6 and cover 8 may be manufactured as a single piece.

[0124] 15A and 15B diagrammatically illustrate an electronics assembly 100. The electronics component 12 in these figures is preferably a radio module for wireless communication. Thus, the circuit board 11 may be provided with an antenna element 95 or elements 95, such as a printed antenna or a ceramic antenna.

[0125] Thus, electronic components 12, which may be delicate, may be placed in the module 10 assembled between the substrates 21, 31. The side walls of the guard ring 6 are able to withstand high molding pressures, especially if they are low.

[0126] Figure 15A shows a module 10 that provides a protective pocket for sensitive components 12. The antenna 95 may be a printed antenna, a ceramic antenna, or a capacitively coupled antenna that takes advantage of a large surface area, as shown in Figure 15A.

[0127] In some embodiments, the ring 6 and cover 8 may be attached to different substrates 21, 31 and then mated together during injection molding.

[0128] In some embodiments, as shown in FIG. 15B, a potting material or other filler material 73 may be provided in the space defined by the guard ring 6 and the circuit board 11, and optionally the cover 8.

[0129] 16A-16C generally illustrate an electronics assembly 100. The electronics module 10 may further include an electrical energy storage device 29, such as a battery. There may also be a vent 33 for equalizing pressure and / or providing ventilation to the space that includes the electrical energy storage device 29. There may also be a protective vent tape 34 disposed at the vent opening.

[0130] In some embodiments, there may be an optional inductive loop 37 or the like through which electrical energy may be wirelessly transmitted to the module 10. Alternatively, a charging port 38 may be provided, as shown in Figure 16B. This may be done in a manner similar to that described above in relation to Figures 8A and 8B for connector 51.

[0131] In some embodiments, the module 10 may include a photovoltaic cell 39 for providing charge to the electrical energy storage device 29. The photovoltaic cell 39 may be disposed between the module 10 and a third substrate 31. In these cases, the third substrate 31 may be transparent, or may include a transparent window or simply an opening in a position corresponding to the photovoltaic cell 39. There may be a transparent adhesive, film, or tape between the third substrate 31 and the photovoltaic cell 39.

[0132] Figures 17A-17E generally illustrate an electronics assembly 100. The electronics component 12 is a gas sensor in Figure 17A and an audio device in Figures 17B-17E.

[0133] 17A, a gas sensor is disposed on the circuit board 11 with a gas vent in fluid communication with the gas sensor through an opening in the third board 31. As shown in FIG.

[0134] The gas sensor may be a barometric pressure sensor, a gas compound level sensor (CO, CO2, O2, H2O, VOC), a particle / smoke sensor, etc.

[0135] In various embodiments, the gas sensor may be placed in a cavity on the first surface of the circuit board 11 or a guard ring 6 may be utilized. If a ring 6 is used, the guard ring 6 may be assembled / attached to the third substrate 31 by adhesive or the like. The circuit board 11 may be attached to the second substrate 21 and the two parts may be brought together during molding. The two parts may be attached to each other before molding or even before attachment to the substrate.

[0136] In some embodiments, a breathable film 49 may be utilized in the opening of the third substrate 31 .

[0137] 17B-17E, electrical component 12 may be an audio device such as a speaker, microphone, or audio transducer, or an ultrasonic transceiver, buzzer, etc. These devices can be used to implement features such as tactile, distance measurement (backing radar), warning devices (fire alarms), and speakers.

[0138] 17B illustrates an electronic assembly 100 with a transducer that operates based on reflecting or vibrating sound across the entire device surface, so no holes are required in the third substrate 31.

[0139] 17C illustrates electronic assembly 100 with an audio device in a cavity on the first surface of circuit board 11. Also, third board 31 has a small opening through which audio signals or sound can exit assembly 100.

[0140] 17C illustrates an embodiment in which the audio device includes an integrated grill or foam cover 77. The cover 77 advantageously fits, preferably tightly, into the opening in the third substrate 31.

[0141] FIG. 17D illustrates a ported speaker design that improves bass frequency response by having a channel 78 within the circuit board 11 that extends from the audio device through the second board 21, thereby acting as a sort of bass reflex.

[0142] FIG. 17E illustrates another ported speaker design in which a channel 78 extends within the circuit board 11 through a second board 31 .

[0143] With respect to all of Figures 17A-17E, the holes or openings in the third substrate 31 and / or the second substrate 21 may be created before or after the injection molding process.

[0144] FIG. 18 illustrates, in schematic form, an electronics assembly 100. In FIG. 18, the module 10 defines or includes a cavity on a first surface of a circuit board 11. A display 89 may be present in an opening in the third substrate 31, such as a space left by removing a portion of the third substrate 31. Additionally, a display flex 88 may be present to allow the display 89 to be powered and controlled. The display flex 88 may be connected to the electronics components 12 on the circuit board 11 and may include a controller for the display, such as ICs and memory.

[0145] Again, the cavity may be created by having a cavity on the circuit board, or by a guard ring 6, or by having a further circuit board 11C as described in relation to Figure 13B.

[0146] In various embodiments, a display 89 can be placed in the space after injection molding and electrically connected to the component 12. The assembly 100 can also include a bezel 87 to hide the seam.

[0147] FIG. 19 shows a flow diagram of a method for manufacturing the electronics assembly 100.

[0148] Step or item 200 refers to the start-up stage of the method, where suitable equipment and components are obtained and the system is assembled and configured for operation.

[0149] Step or item 210 refers to obtaining or creating 210 an electronics module 10 comprising a first circuit 13 on a first surface on a first side of a circuit board 11, at least one electronic component 12 on the circuit board 11 electrically connected to the first circuit 13, and at least one first connection 14 on the first surface and / or an adjacent side of the periphery of the circuit board 11, the at least one first connection 14 being electrically connected to or included within the first circuit. The first circuit 13 may comprise traces and / or contact pads, or circuit pattern(s), and may be made additively, such as printing, or by subtractive methods, such as etching.

[0150] Step or item 220 refers to placing the electronics module 10 on a second substrate 21, such as, for example, a thermoformable film or sheet, preferably made of a plastic material, the second substrate 21 comprising second connections 22 connected to a second circuit 23 on a surface of the second substrate 21, the second surface of the circuit substrate 11 being on a second side opposite the first surface and facing the second substrate 21. The second circuit 23 may comprise traces and / or contact pads, or circuit pattern(s), and may preferably be made additively, such as by printing, or by a subtractive method, such as by etching.

[0151] Step or item 230 refers to disposing a conductive bonding material 16 on and extending between the first connection portion 14 and the second connection portion 22 to electrically connect the electronics module 10 to the second circuit 23 via the conductive bonding material 16. Thus, in various embodiments, the connection is preferably made between the top and / or side surface of the circuit board 11 having at least one or more first connection portion(s) 14 and second connection portion 22, preferably disposed on the top surface of the second board 21. In various embodiments, the conductive bonding material 16 may be one selected from the group consisting of a solder material such as molten solder or stencil printed solder, a conductive adhesive, a conductive ink, a conductive tape or film, such as an asymmetric conductive tape or film, or an anisotropic conductive film (ACF).

[0152] In some embodiments, the conductive bonding material 16 may be at least initially jettable, preferably flowable, such as a conductive adhesive or ink, or a molten or stencil printed solder material, and disposing the conductive bonding material 16 includes jetting the conductive bonding material 16 onto the first connection portion 14 and the second connection portion 22.

[0153] Execution of the method may end at step or item 299.

[0154] In various embodiments, the first connection portion 14 may comprise one or more conductive pads around the periphery on a first surface of the first side of the circuit board 11 .

[0155] Alternatively or additionally, the first connection portion 14 may include one or several castellated or plated ends or semi-holes 17. These may be located on the periphery.

[0156] Additionally, the connection portion 14 may include one or more vias or plated holes, such as to facilitate establishing an electrical connection with the conductive bonding material 16 .

[0157] Positioning 220 of the electronics module 10 may include attaching the electronics module 10 to a second substrate 21 by a second adhesive 24, preferably an electrically non-conductive adhesive such as an anisotropic conductive adhesive or film (ACF), provided on a second side of the electronics module 10.

[0158] In various embodiments, the method may include applying a conformal coating 18 over the first surface to at least partially embed the at least one electronic component 12 .

[0159] In some embodiments, the method may include forming, such as by thermoforming, the second substrate 21 from a planar shape, at least locally, to assume a non-planar shape, such as a convex and / or concave portion, or a 3D shape, before or after disposing the electronics module 10 on the second substrate 21. The non-planar shape may be a trench 15 and / or other non-planar shape(s).

[0160] As mentioned above, the method may include providing a trench 15 in the second substrate 21, the trench 15 including or being a depression or indentation, the trench 15 having a shape and lateral size such that the electronics module 10 fits laterally into the trench 15, preferably such that at least two side edges of the electronics module 10 laterally contact corresponding side surfaces of the trench 15. Additionally, the trench 15 may be provided by thermoforming the second substrate 21.

[0161] In various embodiments, the method may include obtaining or creating a circuit board 11 having a rigid portion 11A and a flex portion 11B attached to one another. Additionally, optionally, at least one first connection portion 14 may be included on the periphery of the flex portion 11B.

[0162] In some embodiments, the method may include at least one electronic component 12 that is a connector 51 for electrically connecting between an external entity and the first circuit 13, preferably the connector 51 extending through a hole in the second substrate 21.

[0163] Further, the method may include disposing a third substrate 31, such as on a thermoformable film or sheet, preferably made of a plastic material, on an opposite side of the electronics module 10 from the second substrate 21. Additionally, optionally, the method may include that the at least one electronics component is a segment display, such as a 7-segment, 8-segment, or 16-segment display, and the third substrate 31 may be attached to a surface of the segment display on an opposite side of the display than the circuit board 11.

[0164] In various embodiments, the third substrate 31 may be attached to the first surface of the circuit board 11 and / or to at least one electronic component 12, such as a segmented display, by a third adhesive, such as a transparent adhesive or a transparent adhesive film or a transparent adhesive tape, or a non-transparent one.

[0165] In various embodiments, the method may include removing a portion of the second substrate 21 to expose the circuit board 11 for disposing at least one electronic component 12 on the exposed portion of the second surface.

[0166] In some embodiments, the method may include providing a circuit board 11 as including a cavity 19 or creating a cavity 19 on a first surface, the method including removing a portion of a third substrate 31 to expose the cavity 19 for disposing one or several electronic components 12, such as a passive infrared sensor, in the cavity 19. Additionally, optionally, the method may include attaching a second circuit board 11C to the third substrate 31, the second circuit board 11C comprising a through hole, on a side facing or to be facing the electronics module 10, and further optionally removing a portion of the third substrate 31 to expose the through hole for disposing one or several electronic components 12, such as a passive infrared sensor, in the cavity 19 defined by the through hole and the circuit board 11.

[0167] As described above, the method may preferably include molding, preferably injection molding, a material onto a side of the second substrate 21 having the electronics module 10, and at least partially embedding the electronics module 10 beneath the molding material, such as between the molding material and the second substrate 21.

[0168] The method may also include, in some embodiments, providing at least one electronics component 12 that includes one or more capacitive sensing elements, such as electrodes. Additionally, the electronics module 10 may include a ground plane on an opposite side to the one or more capacitive sensing elements.

[0169] In various embodiments, the method may include disposing a guard ring 6 over the circuit board 11 and around at least one electronic component 12. The guard ring 6 may optionally include a cover 8 on an opposite side to the circuit board 11. Thus, a cavity 19 may be formed therein.

[0170] In some embodiments, the circuit board 11 may include an antenna element, such as a printed or ceramic antenna, on a surface thereof, etc. Alternatively or additionally, the method may include providing a potting material in a space or cavity 19 defined by the guard ring 6 and the circuit board 11, and optionally the cover 8.

[0171] In various embodiments, electronics module 10 may further include an electrical energy storage device, such as a battery. The electrical energy storage device may be disposed on a surface of circuit board 11, or alternatively on a surface of cover 8, if present. In some embodiments, the method may further include disposing a gas vent through circuit board 11 and second substrate 21.

[0172] In some embodiments, the method may include placing a gas sensor on a circuit board 11 and removing a portion of a third board 31 to provide a gas vent 33 in fluid communication with the gas sensor.

[0173] In one embodiment, the method may include disposing an audio device on the circuit board 11. Alternatively, the method may include disposing a haptic actuator, such as a linear resonant actuator (LRA) or an eccentric resonant motor (ERM).

[0174] In some embodiments, the method may include placing a display in the space left by the removed portion of the third substrate 31 .

[0175] Additionally, the first circuit 13 and the second circuit 23 may be any of a microcontroller, an integrated circuit, a transistor, a resistor, a capacitor, an inductor, a diode, a photodiode, a light emitting diode, a semiconductor switch, an electromechanical component, an electro-optical component, a radiation emitting component, a light emitting component, an LED (light emitting diode), an OLED (organic LED), a side shooting LED or other light source, a top shooting LED or other light source, a bottom shooting LED or other light source, a radiation detecting component, a light detecting or light sensitive component, a photodiode, a phototransistor, a photovoltaic device, a sensor, a micro The electronics component may be selected from the group consisting of a mechanical component, a switch, a touch switch, a touch panel, a proximity switch, a touch sensor, an air sensor, a temperature sensor, a pressure sensor, a moisture sensor, a gas sensor, a proximity sensor, a capacitive switch, a capacitive sensor, a projected capacitive sensor or switch, a single-electrode capacitive switch or sensor, a capacitive button, a multi-electrode capacitive switch or sensor, a self-capacitance sensor, a mutual-capacitance sensor, an inductive sensor, a sensor electrode, a micromechanical component, a UI element, a user input element, a vibration element, a sound generation element, a communication element, a transmitter, a receiver, a transceiver, an antenna, an infrared (IR) receiver or transmitter, a wireless communication element, a wireless tag, a radio tag, a tag reader, a data processing element, a microprocessor, a microcontroller, a digital signal processor, a signal processor, a programmable logic chip, an ASIC (application specific integrated circuit), a data storage element, and an electronic subassembly.

[0176] In various embodiments, the electrically conductive elements of the circuitry, such as conductive traces, conductors, pads, etc., may comprise at least one material selected from the group consisting of conductive inks, conductive nanoparticle inks, copper, steel, iron, tin, aluminum, silver, gold, platinum, conductive adhesives, carbon fibers, alloys, silver alloys, zinc, brass, titanium, solder, and any components thereof. The conductive materials used are optically opaque, semi-transparent, and / or transparent at a desired wavelength, such as at least a portion of visible light, such that radiation, such as visible light, is masked or reflected therefrom, absorbed therefrom, or transmitted therethrough.

[0177] Typically, prefabricated components, including various SMD or other electronic components, may be attached to the contact areas on the substrate(s), for example by solder and / or adhesive. For example, light source(s) of selected technology (e.g. LEDs) and packaging may be provided here, as well as, for example, different elements of control electronics, communication, sensing, connection (e.g. connectors), hosting (circuit board(s), carrier(s), etc.) and / or power supply (e.g. batteries), depending on the embodiment. For example, suitable pick-and-place or other mounting devices may be utilized for that purpose. Alternatively or additionally, printed electronics techniques may be applied to actually manufacture at least a part of the components, such as OLEDs, directly on the substrate(s), in particular on the film(s) or sheet(s).

[0178] In various embodiments, possible additional layers or general features may be added to the electronics assembly 100 by molding, lamination, or suitable coating (e.g., vapor deposition) procedures, without forgetting other possible positioning or fastening techniques. The layers may be of protective, instructional and / or aesthetic value (graphics, colors, figures, text, numerical data, etc.) and may contain, for example, textile, leather, or rubber materials instead of or in addition to additional plastics. Additional elements such as electronics, modules, module internals or parts, and / or optical components may be placed and fastened to the outer surface(s) of the structure, for example, the outer surface of an included film or molded layer, depending on the embodiment. The necessary material may be molded / cut. For example, a diffuser may be made from a light conductor material that locally irradiates the laser. If a connector is provided, the connector of the multi-layer structure may be connected to a desired external connection element, such as an external connector of an external device, system, or structure, for example, an external connector of a host device. For example, these two connectors may together form a plug-and-socket type connection and interface. As used herein, the multi-layer structure may also be generally positioned and attached to a larger ensemble, such as an electronic device, such as a personal communication device, a computer, a home device, an industrial device, or a vehicle, for example in an embodiment where the multi-layer structure forms part of the vehicle exterior or interior, such as the dashboard.

[0179] The scope of the present invention is determined by the appended claims and their equivalents. Those skilled in the art will appreciate that the disclosed embodiments have been constructed for illustrative purposes only, and that other arrangements applying many of the principles described above can be readily prepared to best suit each potential usage scenario.

Claims

1. A method for manufacturing an electronics assembly (100), comprising: Obtaining or creating (210) an electronics module (10), the electronics module (10) comprising: a first circuit (13) on a first surface of a first side of the circuit board (11); - at least one electronic component (12) on said circuit board (11) and electrically connected to said first circuit (13); and - at least one first connection (14) on said first surface and / or on an adjacent side at the periphery of said circuit board (11), said at least one first connection (14) being electrically connected to or included within said first circuit (13); Obtaining or creating (210); disposing (220) the electronics module (10) on a second substrate (21), the second substrate (21) including a second connection portion (22) connected to a second circuit (23) on a surface of the second substrate (21), the second surface of the circuit board (11) being on a second side opposite the first surface and facing the second substrate (21); and disposing (230) a conductive bonding material (16) on and extending between the first connection portion (14) and the second connection portion (22) to electrically connect the electronics module (10) to the second circuit (23) through the conductive bonding material (16).

2. The method of claim 1 , wherein the conductive bonding material is one selected from the group consisting of a solder material, a conductive adhesive, a conductive ink, a conductive tape or film.

3. 3. The method of claim 1, wherein the conductive bonding material is at least initially dispensable, and wherein the disposing of the conductive bonding material comprises dispensing the conductive bonding material onto the first connection portion and the second connection portion.

4. The method of claim 1 , wherein the first connection comprises one or more conductive pads at the periphery on the first surface of the first side of the circuit board.

5. The method of claim 1 , wherein the first connection portion includes one or several castellated edges or plated edges or semi-holes.

6. The method of claim 1 , wherein the first connection comprises one or several vias or plated holes.

7. The method of claim 1 , wherein the positioning of the electronics module includes attaching the electronics module to the second substrate with a second adhesive on the second side of the electronics module.

8. The method of claim 1 , further comprising applying a conformal coating, encapsulant, or a topcoat layer onto the first surface to embed at least the electronic component.

9. 10. The method of claim 1, further comprising, before or after the placement of the electronics module on the second substrate, forming the second substrate, at least locally, from a planar shape to a non-planar shape or a 3D shape.

10. The method of claim 1, comprising providing a trench in the second substrate, the trench having a shape and lateral size such that the electronics module fits laterally into the trench.

11. The method of claim 10 , wherein the trench is provided by thermoforming the second substrate.

12. The method of claim 1 , wherein the circuit board comprises a rigid portion and a flex portion attached to one another, and wherein at least one first connection is included in the periphery of the flex portion.

13. The method of claim 1 , wherein the at least one electronic component is a connector for making an electrical connection between an external entity and the first circuit.

14. The method of claim 1, comprising positioning a third substrate on the opposite side of the electronics module relative to the second substrate.

15. 15. The method of claim 14, wherein the at least one electronic component is a segmented display, and the third substrate is attached to a surface of the segmented display on the opposite side of the segmented display from the circuit board.

16. 16. The method of claim 14 or 15, wherein the third substrate is attached to the first surface of the circuit board and / or to the at least one electronic component by a third adhesive.

17. 10. The method of claim 1, further comprising removing a portion of the second substrate to expose the circuit board for disposing the at least one electronic component on the exposed portion of the second surface.

18. 15. The method of claim 14, wherein the circuit board includes a cavity on the first surface, the method including removing a portion of the third substrate to expose the cavity for placing one or more electronic components in the cavity.

19. attaching a second circuit board to the third substrate on the side facing or coming to face the electronics module, the second circuit board comprising through holes; 20. The method of claim 18, further comprising removing a portion of the third substrate to expose the through-holes for placing one or more electronic components in a cavity defined by the through-holes and the circuit board. 。

20. The method of claim 1 , further comprising molding a material onto a side of the second substrate having the electronics module, and at least partially embedding the electronics module.

21. The method of claim 1 , wherein the at least one electronic component comprises one or more capacitive, inductive, or force-sensing elements.

22. 22. The method of claim 21, wherein the electronics module comprises a ground plane on an opposite side to the one or more capacitive, inductive, or force-sensing elements.

23. The method of claim 1 , further comprising placing a guard ring on the circuit board and around the at least one electronic component.

24. 24. The method of claim 23, wherein the circuit board comprises an antenna element.

25. 25. The method of claim 23 or 24, comprising providing a potting material in a space defined by the guard ring and the circuit board.

26. The method of claim 1 , wherein the electronics module further comprises an electrical energy storage device.

27. 15. The method of claim 14, comprising: disposing a gas sensor on the circuit board; and removing a portion of the third substrate to provide a gas vent in fluid communication with the gas sensor.

28. The method of claim 14 , further comprising disposing an audio device on the circuit board.

29. 15. The method of claim 14, further comprising placing a display in the space left by the removed portion of the third substrate.

30. The method of claim 1 , wherein the circuit board is a printed circuit board, rigid, or comprises at least a rigid portion.

31. 1. An electronics assembly comprising: a second substrate, the second substrate comprising a second connection portion connected to a second circuit on a surface of the second substrate; 1. An electronics module comprising: a first circuit on a first surface of the first side of the circuit board; at least one electronic component on the circuit board electrically connected to the first circuit; and at least one first connection portion on said first surface and / or on an adjacent side surface at the periphery of said circuit board, said at least one first connection portion being electrically connected to or included in said first circuit; Equipped with a connection part, a second surface of the circuit board on a second side opposite the first surface and facing the second substrate; an electronics module; a conductive bonding material disposed on and extending between the first connection portion and the second connection portion to electrically connect the electronics module to the second circuit via the conductive bonding material; and An electronics assembly comprising:

32. 32. The electronics assembly of claim 31, comprising a molding compound layer that embeds the electronics module.

33. 33. An electronics assembly according to claim 31 or 32, comprising a third substrate on an opposite side of the electronics module to the second substrate.

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