Probe with planar non-biased spring element for contacting electronic components, method for making same, and method for using same - Patents.com

Abstract

A probe array for contacting electronic components includes a plurality of probes for making contact between two electronic circuit elements and an array plate mounting and retention structure. The probes may include a lower retention feature protruding from a probe body with a size and configuration that limits the longitudinal extent to which the probes can be inserted into plate probe holes of the array plate, and an upper retention feature that can be made to combine with the probe body to achieve a lateral configuration that is sized to pass through the holes and then resiliently return to a configuration that cannot pass through the holes to retain the probes and array plate together.

Description

[Technical field]

[0001] [Related Applications] This application claims priority to and benefit of the filing date of U.S. patent application Ser. No. 18 / 295,721, filed April 4, 2023, and U.S. Provisional Patent Application No. 63 / 328,661, filed April 7, 2022, the entire disclosures of which are hereby incorporated by reference in their entireties.

[0002] Embodiments of the invention relate to microprobes (e.g., for use in water level testing or socket testing of integrated circuits, or for use in making electrical connections to PCBs or other electronic components), and more particularly to pin-like microprobes (i.e., microprobes having a vertical or longitudinal height that is greater than their width (e.g., in some embodiments, 5 times greater, in other embodiments, 10 times greater, and in still other embodiments, 20 times greater) or button-like probes in which the spring elements have a planar configuration when in an unactuated state. In some embodiments, the microprobes are produced, at least in part, by electrochemical manufacturing methods, and more particularly by multi-layer, multi-material electrochemical manufacturing methods, where in some embodiments, a plurality of probes are used while secured in an array format that includes one or more plates with through holes that engage features on the probes and / or other array retention structures. [Background technology]

[0003] probe Many electrical contact probe and pin configurations have been commercially used or proposed, some of which may qualify as prior art and others of which may not. Such pins, probes, and methods of making are described, for example, in Patent Publication Nos. U.S. 2005-0104609, U.S. 2006-0006888, U.S. 2005-0184748, U.S. 2006-0108678, U.S. 2006-0238209, and in Patent Nos. U.S. 7,640,651, U.S. 7,265,565, U.S. 7,412,767, U.S. 7,273,812, U.S. 10,215,775, and U.S. 11,262,383.

[0004] Electrochemical fabrication techniques for forming three-dimensional structures from multiple adhesive layers have been or are being purchased commercially from Microfabrica® Inc. (formerly MEMGen Corporation) of Van Nuys, Calif., under the process names EFAB and MICA FREEFORM.

[0005] Various electrochemical fabrication techniques are described in US Pat. No. 6,027,630, issued Feb. 22, 2000 to Adam Cohen.

[0006] Another method for forming microstructures using electrochemical fabrication techniques is taught in U.S. Pat. No. 5,190,637 to Henry Guckel, entitled "Formation of Microstructures by Multilevel Deep X-Ray Lithography Using Sacrificial Metal Layers."

[0007] Electrochemical manufacturing provides the capability to form prototype and commercial quantities of small objects, parts, structures, devices, and the like at reasonable cost and in reasonable time. Indeed, electrochemical manufacturing enables the formation of many structures that were previously impossible to produce. Electrochemical manufacturing opens up the possibility for new designs and products in many industrial sectors. Electrochemical manufacturing provides this new capability, and while it is understood that electrochemical manufacturing techniques can be combined with known designs and structures in various fields to produce new structures, specific uses of electrochemical manufacturing provide designs, structures, capabilities, and / or mechanisms that are not known or apparent in view of the state of the art.

[0008] There is a need in various fields for microdevices having improved features, reduced manufacturing times, reduced manufacturing costs, simplified manufacturing processes, greater versatility in device design, improved material choices, improved material properties, more cost-effective and lower risk production of such devices, and / or greater independence between geometric configuration and selected manufacturing process. Summary of the Invention

[0009] It is an object of some embodiments of the invention to provide improved probe arrays comprising probes including compliant elements formed from a plurality of compliant modules that include a planar but non-linear (i.e., not straight) spring configuration (i.e., the spring configuration is not a straight bar with no bends or angles, but has some two-dimensional configuration in the plane of at least one layer that provides a bend or curvature) when in an unactuated state, where the plane of the spring is perpendicular to and provides compliance along the longitudinal axis of the probe, and where the compliant modules are stacked in a continuous manner. A probe with a non-linear spring configuration may provide a linear spring return force or a non-linear return force when actuated.

[0010] In a further aspect of the invention, a probe array includes: (1) a plurality of probes for contacting between two electronic circuit elements, each probe including: (a) (i) at least one relatively stiff standoff having first and second ends spaced apart longitudinally; (ii) at least one first compliant element including a two-dimensional substantially planar spring when unbiased, the first compliant element providing compliance in a direction substantially perpendicular to the planar configuration, wherein a first portion of the first compliant element is operatively coupled to the at least one standoff and a second portion of the first compliant element is operatively coupled to a first distal arm that is compliantly movable relative to the standoff, wherein when the first compliant element is unbiased, the first distal arm directly or indirectly secures a first distal end extending longitudinally beyond the first end of the at least one standoff; and (iii) at least one second compliant element including a spring, the second compliant element providing compliance in a direction substantially perpendicular to the planar configuration. (1) providing an actuator for a probe assembly, comprising: (a) a first portion of a second compliant element operatively coupled to the at least one standoff; and (b) a second portion of the second compliant element operatively coupled to a second distal arm compliantly movable relative to the standoff; and wherein when the second compliant element is not biased, the second distal arm directly or indirectly secures a second distal end extending longitudinally beyond an end of the second end of the at least one standoff; and wherein the first portions of the first and second compliant elements are longitudinally spaced apart from one another; and wherein when at least one of the first and second distal ends is biased towards the other, the second portions of the first and second compliant elements longitudinally move in a manner selected from the group consisting of: (A) moving closer together; and (B) moving further apart; (2) at least one array plate comprising a plurality of holes for receiving and holding probes; and wherein the at least one array plate is configured to receive the probes from beneath the array plate;wherein each of the plurality of probes further comprises at least one lower retention feature and at least one upper retention feature, the at least one lower retention feature configured to engage a bottom portion of the array plate when the probe is inserted into an opening in the array plate and the at least one upper retention feature configured to engage at least one top surface region of the plate; wherein the at least one lower retention feature includes at least one laterally extending feature protruding from the body of the respective probe with a size and configuration that limits a longitudinal extent over which the respective probe can be inserted into the hole of the array plate; and wherein the at least one upper retention feature includes at least one laterally compressible spring element at a level above the lower retention feature and longitudinally spaced from the lower retention feature by a gap at least as large as a thickness of the longitudinal engagement portion of the array plate, wherein the at least one upper retention feature can be made to achieve, in combination with the probe body, a lateral configuration that is sized to pass through the hole and thereafter resiliently return to a configuration that cannot pass through the hole to retain the probe and the array plate together;

[0011] Many variations of the above-described embodiments of the invention exist and will become apparent to those of ordinary skill in the art upon consideration of the teachings herein.

[0012] Other aspects of the invention will be understood by those skilled in the art upon consideration of the teachings herein. Other aspects of the invention may involve combinations of the aspects described above. These other aspects of the invention may provide various combinations of the aspects presented above, as well as other configurations, structures, functional relationships, and processes not specifically described above but taught by other specific teachings described herein, by the teachings of the specification as a whole, or by teachings incorporated herein by reference. [Brief description of the drawings]

[0013] [Figure 1A]10A-10C generally depict the formation of a first layer of a structure using adhesion mask plating, where a blanket deposition of a second material covers both the deposition locations of the first material and the openings between the first material itself. [Figure 1B] 10A-10C generally depict the formation of a first layer of a structure using adhesion mask plating, where a blanket deposition of a second material covers both the deposition locations of the first material and the openings between the first material itself. [Figure 1C] 10A-10C generally depict the formation of a first layer of a structure using adhesion mask plating, where a blanket deposition of a second material covers both the deposition locations of the first material and the openings between the first material itself. [Figure 1D] 10A-10C generally depict the formation of a first layer of a structure using adhesion mask plating, where a blanket deposition of a second material covers both the deposition locations of the first material and the openings between the first material itself. [Figure 1E] 10A-10C generally depict the formation of a first layer of a structure using adhesion mask plating, where a blanket deposition of a second material covers both the deposition locations of the first material and the openings between the first material itself. [Figure 1F] 10A-10C generally depict the formation of a first layer of a structure using adhesion mask plating, where a blanket deposition of a second material covers both the deposition locations of the first material and the openings between the first material itself.

[0014] [Figure 1G] 1 depicts the completion of formation of the first layer resulting in planarization of the deposited material to a desired level.

[0015] [Figure 1H] 1 depicts the state of the process after formation of multiple layers of the structure. [Figure 1I] 1 depicts the state of the process after release of the structure from the sacrificial material.

[0016] [Diagram 2]1 depicts an isometric view of an exemplary spring or compliant module having two connected spring elements, a base, and a connecting support or standoff that can be used in or as a probe.

[0017] [Diagram 3] 1 depicts an isometric view of a second exemplary spring or compliant module that may be used in or as a probe similar to the module of FIG. 2, except that the two spring elements are thicker and therefore provide a greater spring constant than the element of FIG.

[0018] [Figure 4A] 1 provides various views of a probe according to another embodiment of the present invention, where the probe is formed from two back-to-back modules that share a common base having an annular configuration that also functions as a standoff. [Figure 4B1] 1 provides various views of a probe according to another embodiment of the present invention, where the probe is formed from two back-to-back modules that share a common base having an annular configuration that also functions as a standoff. [Figure 4B2] Various views are provided of a probe according to another embodiment of the present invention, where the probe is formed from two back-to-back modules that share a common base having an annular configuration that also functions as a standoff. [Figure 4C1] Various views are provided of a probe according to another embodiment of the present invention, where the probe is formed from two back-to-back modules that share a common base having an annular configuration that also functions as a standoff. [Figure 4C2] Various views are provided of a probe according to another embodiment of the present invention, where the probe is formed from two back-to-back modules that share a common base having an annular configuration that also functions as a standoff. [Figure 4D1]Various views are provided of a probe according to another embodiment of the present invention, where the probe is formed from two back-to-back modules that share a common base having an annular configuration that also functions as a standoff. [Figure 4D2] Various views are provided of a probe according to another embodiment of the present invention, where the probe is formed from two back-to-back modules that share a common base having an annular configuration that also functions as a standoff. [Figure 4D3] Various views are provided of a probe according to another embodiment of the present invention, where the probe is formed from two back-to-back modules that share a common base having an annular configuration that also functions as a standoff. [Figure 4D4] Various views are provided of a probe according to another embodiment of the present invention, where the probe is formed from two back-to-back modules that share a common base having an annular configuration that also functions as a standoff.

[0019] [Figure 4E1] 4A-4D4 provide side views of the probe showing 17 sample layer levels in which the probe may be fabricated, where not all layers have a unique configuration.

[0020] [Fig. 4E2-A] A cross-sectional configuration is shown in both a top view (view -A) and an isometric view (view -B) of the unique configuration of layers L1 to L17, showing views of layers L1 and L17. [Fig. 4E2-B] A diagram of layers L1 and L17 is shown. [Fig. 4E3-A] A diagram of layers L2, L4, L6 and L8 is shown. [Fig. 4E3-B] A diagram of layers L2, L4, L6 and L8 is shown. [Fig. 4E4-A] A diagram of layers L3 and L7 is shown. [Fig. 4E4-B] A diagram of layers L3 and L7 is shown. [Fig. 4E5-A] A diagram of layer L5 is shown. [Fig. 4E5-B] A diagram of layer L5 is shown. [Fig. 4E6-A] A diagram of layer L9 is shown. [Fig. 4E6-B] A diagram of layer L9 is shown. [Fig. 4E7-A] A diagram of layers L10, L12, L14 and L16 is shown. [Fig. 4E7-B] A diagram of layers L10, L12, L14 and L16 is shown. [Fig. 4E8-A] A diagram of layers L11 and L15 is shown. [Fig. 4E8-B] A diagram of layers L11 and L15 is shown. [Fig. 4E9-A] A diagram of layer L13 is shown. [Fig. 4E9-B] A diagram of layer L13 is shown.

[0021] [Figure 5A1] Providing side views, FIGS. 5A1-5C5 show an exemplary probe and single array plate mounting and retention configuration according to another embodiment of the invention that uses a foldable spring clip or retention element to secure the probe to the array plate, where the spring clip folds upon insertion into a through hole in the plate and then automatically unfolds once passage through the hole is complete, locking the spring clip to the plate.

[0022] [Figure 5A2] Providing an isometric view, Figures 5A1-5A4 are all from the same rotational orientation about the Z or longitudinal axis of an exemplary probe, which has similarities to the probe of the series of Figures 4, with the main exception that the central base of the probe of the series of Figures 4 is replaced by two longitudinally spaced apart retaining elements in the form of a lower retaining ring and a pair of upper foldable spring elements that can be made to pass through openings in the retaining plate and then re-extend to secure the probe to the retaining plate between the longitudinally spaced apart retaining elements. [Figure 5A3] Provides an isometric view. [Figure 5A4] Provide a top view.

[0023] [Figure 5A5] It is the same as that shown in FIGS. 5A1 to 5A4, but provides a side view of the probe from different rotational orientations around the Z-axis. [Figure 5A6] Provides an isometric view. [Figure 5A7] Provides an isometric view. [Figure 5A8] Provides a similar view from a third rotational orientation around the Z-axis. [Figure 5A9] Provides a similar view from a third rotational orientation around the Z-axis. [Figure 5A10] Provides a similar view from a third rotational orientation around the Z-axis.

[0024] [Figure 5B1] Provides a top view of a fragment of an array plate having a single through-hole through which the upper portion of the probe of FIGS. 5A1 to 5A10 can be longitudinally inserted to engage and at least temporarily connect the probe and the plate, with different rotational orientations around the Z-axis. [Figure 5B2] Provides an isometric view of a fragment of an array plate having a single through-hole through which the upper portion of the probe of FIGS. 5A1 to 5A10 can be longitudinally inserted to engage and at least temporarily connect the probe and the plate, with different rotational orientations around the Z-axis. [Figure 5B3] Provides an isometric view of a fragment of an array plate having a single through-hole through which the upper portion of the probe of FIGS. 5A1 to 5A10 can be longitudinally inserted to engage and at least temporarily connect the probe and the plate, with different rotational orientations around the Z-axis.

[0025] [Figure 5C1] Provides an isometric view of the probe of FIGS. 5A1 to 5A10 loaded onto the plate of FIGS. 5B1 to 5B3 and fixed together after such loading, where the loading is implemented via relative longitudinal and rotational movements. [Figure 5C2]5A1-5A10 are provided as isometric views of the probes of FIGS. 5A1-5A10 loaded onto the plates of FIGS. 5B1-5B3 and secured together after such loading, where loading is implemented via relative longitudinal and rotational movement. [Figure 5C3] 5A1-5A10 are provided as side views of the probes of FIGS. 5A1-5A10 loaded onto the plates of FIGS. 5B1-5B3 and secured together after such loading, where loading is implemented via relative longitudinal and rotational movement. [Figure 5C4] 5A1-5A10 are provided as isometric views of the probes of FIGS. 5A1-5A10 loaded onto the plates of FIGS. 5B1-5B3 and secured together after such loading, where loading is implemented via relative longitudinal and rotational movement. [Figure 5C5] 5A1-5A10 are provided as top views of the probes of FIGS. 5A1-5A10 loaded onto the plates of FIGS. 5B1-5B3 and secured together after such loading, where loading is implemented via relative longitudinal and rotational movement.

[0026] [Figure 6A1] 5A-5C provide side views of a probe similar to the series of FIG. 5A, except that the retention spring elements are recessed toward the body of the probe at each end, and the maximum lateral extension occurs toward the center of the retention spring, rather than extending all the way to the compressible ends of the spring. [Figure 6A2] 5A-5C provide isometric views of a probe similar to the series of FIG. 5A-5C, except that the retention spring elements are recessed toward the body of the probe at each end, and the maximum lateral extension occurs toward the center of the retention spring, rather than extending all the way to the compressible ends of the spring. [Figure 6A3] 5A provides a top view of a probe similar to the series of FIG. 5A except that the retention spring elements are recessed toward the body of the probe at each end and the maximum lateral extension occurs toward the center of the retention spring rather than extending all the way to the compressible ends of the spring. [Figure 6A4]5A-5C provide isometric views of a probe similar to the series of FIG. 5A-5C, except that the retention spring elements are recessed toward the body of the probe at each end, and the maximum lateral extension occurs toward the center of the retention spring, rather than extending all the way to the compressible ends of the spring. [Figure 6A5] 5A-5C provide isometric views of a probe similar to the series of FIG. 5A-5C, except that the retention spring elements are recessed toward the body of the probe at each end, and the maximum lateral extension occurs toward the center of the retention spring, rather than extending all the way to the compressible ends of the spring. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0027] Electrochemical Manufacturing Overview 1A-1I show side views of various states in an exemplary multi-layer, multi-material electrochemical manufacturing process. FIGS. 1A-1G show various stages in the formation of a single layer of a multi-layer manufacturing process in which a second metal is deposited on a first metal and into openings in the first metal such that the first and second metals form part of the layer. In FIG. 1A, a side view of a substrate 82 is shown having a surface 88 on which a patternable photoresist 84 is disposed as shown in FIG. 1B. In FIG. 1C, the pattern in the resist resulting from curing, exposing, and developing the resist is shown. Patterning of the photoresist 84 results in openings or apertures 92(a)-92(c) that extend from a surface 86 of the photoresist through the thickness of the photoresist to a surface 88 of the substrate 82. In FIG. 1D, a metal 94 (e.g., nickel) is shown electroplated into the openings 92(a)-92(c). In FIG. 1E, the photoresist has been removed (i.e., chemically or otherwise stripped) from the substrate, exposing areas of the substrate 82 not covered with the first metal 94. In FIG. 1F, a second metal 96 (e.g., silver) is shown blanket electroplated over the entire exposed portion of the substrate 82 (conductive) and over the first metal 94 (also conductive). FIG. 1G depicts the completed first layer of the structure resulting from exposing the first metal and planarizing the first and second metals to a height that sets the thickness for the first layer. In FIG. 1H, the results of repeating the process steps shown in FIGS. 1B-1G multiple times to form a multi-layer structure, each layer being made of two materials. In most applications, one of these materials is removed to produce a desired three-dimensional structure 98 (e.g., a component or device) or multiple such structures, as shown in FIG. 1I.

[0028] Various embodiments of various aspects of the invention relate to the formation of three-dimensional structures from materials that may be partially or fully electrochemically deposited or non-electrochemically deposited (as shown in the examples of FIGS. 1A-1I and as described in various patent applications incorporated herein by reference). Some of these structures may be formed from a single build level formed from one or more types of deposited materials, while others are formed from multiple build layers (e.g., 2 or more layers, more preferably 5 or more layers, and most preferably 10 or more layers) each including at least two types of materials. In some embodiments, layer thicknesses may be as small as 1 micron or as large as 50 microns. In other embodiments, thinner layers may be used, while in other embodiments, thicker layers may be used. In some embodiments, microscale structures have lateral features with minimum feature sizes on the order of microns to tens of microns, located with precision at the 0.1 to 10 micron level. In other embodiments, structures with less precision in feature placement and / or larger minimum features may be formed. In still other embodiments, greater precision and smaller minimum feature sizes may be desirable. In this application, mesoscale and millimeter scale have the same meaning and refer to devices that may have one or more dimensions that may extend in the range of 0.5 to 50 millimeters or greater, and features that are located with precision in the range of microns to 100 microns, with minimum feature sizes on the order of tens of microns to hundreds of microns.

[0029] Various embodiments, alternatives, and techniques disclosed herein may form multi-layer structures using a single patterning technique for all layers, or using different patterning techniques for different layers. For example, various embodiments of the present invention may perform selective patterning operations using conformal contact masks and masking operations (i.e., operations using a mask that is in contact with but not bonded to the substrate), proximity masks and masking operations (i.e., operations using a mask that selectively protects at least a portion of the substrate by being in proximity to the substrate even when not in contact), non-conformal masks and masking operations (i.e., masks and operations based on masks whose contact surfaces are significantly non-conformal), and / or bonded masks and masking operations (masks and operations using a mask that is not only in contact with, but is bonded to, the substrate on which selective deposition or etching occurs). Conformal contact masks, proximity masks, and non-conformal contact masks share the property of being pre-formed and brought to or near the surface to be treated (i.e., the exposed portion of the surface to be treated). These masks can generally be removed without damaging the mask or the surface to which they were in contact or near. Adhesion masks are generally formed on and bonded to the surface to be processed (i.e., the portion of that surface to be masked) such that they cannot be completely destroyed or separated from the surface without damage beyond any point of reuse. Adhesion masks can be formed in a number of ways, including (1) application of photoresist, selective exposure of the photoresist, and then development of the photoresist, (2) selective transfer of a pre-patterned masking material, and / or (3) direct formation of the mask by computer-controlled deposition of material. In some embodiments, the adhesion mask material can be used as a sacrifice for a layer, or can be used only as a masking material that is replaced by another material (e.g., a dielectric or conductive material) before completion of the formation of the layer, where the replacement material is considered the sacrificial material of the respective layer. The masking material may or may not be planarized before or after depositing material into the voids or openings contained therein.

[0030] Patterning operations may be used in selectively depositing materials and / or in selectively etching materials. The selectively etched regions may be selectively filled with a different desired material or filled via blanket deposition, or the like. In some embodiments, layer-by-layer stacking may involve simultaneous formation of portions of multiple layers. In some embodiments, depositions made in association with some layer levels may result in deposition in regions associated with other layer levels (i.e., regions that reside within top and bottom boundary levels that define different layer geometries). Such use of selective etching and / or interlaced material deposition in association with multiple layers is currently described in U.S. Patent Application Serial No. 10 / 434,519 (now U.S. Patent No. 7,252,861), entitled "Method and Apparatus for Electrochemically Fabricating Structures Through Selective Etching and Filling of Interlaced Layers or Voids," filed May 7, 2003 by Smalley. The referenced application is incorporated herein by reference.

[0031] Temporary substrates on which structures may be formed may be of the sacrificial type (i.e., destroyed or damaged during separation of the deposited materials to such an extent that they cannot be reused) or of the non-sacrificial type (i.e., not destroyed or excessively damaged, i.e., not damaged to such an extent that they cannot be reused, e.g., a sacrificial or release layer is located between the substrate and the initial layer of the structure to be formed). Non-sacrificial substrates may be considered reusable with little or no rework (e.g., re-planarizing one or more selected surfaces or applying a release layer, and the like), although for a variety of reasons they may or may not be reused.

[0032] Definitions of various terms and concepts (whether relating to the device itself, particular methods for making the device, or particular methods for using the device) that may be used in understanding embodiments of the present invention will be understood by those of skill in the art. Some such terms and concepts are described herein, while other such terms are addressed in various patent applications to which this application claims priority and / or which are incorporated by reference herein (e.g., U.S. Patent Application Serial No. 16 / 584,818).

[0033] As used herein, "longitudinal" refers to the long dimension of a probe, the end-to-end dimension of a probe, or the tip-to-tip dimension of a probe. Longitudinal may refer to a generally straight line extending from one end of a probe to another end of the probe, or it may refer to a curved or stepped path that has an incline or even changes direction along the height of the probe. When referring to a probe array, or to probes loaded in an array configuration, the longitudinal dimension may refer to a particular direction in which the probes in the array are oriented or extend, but may also simply refer to the overall height of the array, beginning with a plane that includes the first end, tip or base of the plurality of probes and extending perpendicular to a plane that includes the second end, tip or top of the probes. The context of use will usually make clear what is meant, especially to those skilled in the art. It is intended that the interpretation applied to the terms herein be as narrow as is justified by the details of the description provided or the context in which the terms are used. However, if such a narrow interpretation is not justified, the broadest reasonable interpretation is intended to apply.

[0034] The term "lateral" as used herein is related to the term longitudinal. In the context of stacking layers, the lateral direction refers to a direction within each layer, or two perpendicular directions within each layer (i.e., one or more directions that lie in the plane of the layers that are substantially perpendicular to the stacking direction of the layers). When referring to a probe array, the lateral direction generally has a similar meaning, and the lateral dimension is generally a dimension that lies in a plane that is parallel to the plane of the top or bottom of the array (i.e., substantially perpendicular to the longitudinal dimension). When referring to the probe itself, the lateral dimension may be perpendicular to the overall longitudinal axis of the probe, the local longitudinal axis of the probe (local lateral dimension), or simply a similar dimension as described for the array or layer. The context of use will usually make clear what is meant, especially to those skilled in the art. It is intended that the interpretation applied to the terms herein be as narrow as is justified by the details of the description provided or the context in which the terms are used. If such a narrow interpretation is not justified, the broadest reasonable interpretation is intended to apply.

[0035] As used herein, "substantially parallel" means parallel or nearly parallel, i.e., within 15° of parallel, more preferably within 10° of parallel, even more preferably within 5° of parallel, and most preferably within 1° of parallel. When the term is used without clarification, it should be interpreted as within 15° of parallel. When used with a specific clarification, the term should be interpreted according to the specific clarification.

[0036] As used herein, "substantially perpendicular" or "substantially normal" means perpendicular or close to perpendicular, i.e., within 15° of perpendicular, more preferably within 10° of perpendicular, even more preferably within 5° of perpendicular, and most preferably within 1° of perpendicular. When the term is used without clarification, it should be interpreted as within 15° of perpendicular. When used with a specific clarification, the term should be interpreted according to the specific clarification.

[0037] As used herein, "substantially planar," when referring to a surface, refers to a surface that is intended to be planar, but as one of ordinary skill in the art would understand, there may be some imperfections (i.e., when referring to millimeter and microscale devices, such as the main device embodiments described herein, imperfections that may deviate from planarity by up to 1-5 microns, but often by substantially less than a micron). When the term is used without clarification, it should be interpreted as having imperfections that deviate from planarity by 5 microns or less. When used with a specific clarification, the term should be interpreted according to the specific clarification. When referring to a structure, the term does not refer to an infinitely thin structure, but rather to one formed with substantially planar top and bottom surfaces, such as the top and bottom surfaces of each layer, or a group of successively formed layers of a structure formed using a multi-material, multi-layer electrochemical manufacturing method, particularly when each layer undergoes a planarization operation such as lapping, fly-cutting, chemical mechanical planarization, spinning coating, and the like. In some cases, a substantially planar structure may also imply that the height or thickness of the structure or an element of the structure is small compared to the size of the structure in the two perpendicular dimensions (i.e., the ratio of the vertical footprint to the thickness is greater than 25, preferably greater than 50, more preferably greater than 100, and most preferably greater than 200). When the term is used in relation to a structure without clarification, it should be interpreted as meeting the criteria of a substantially planar surface for both the upper and lower surfaces. In some contexts, a ratio requirement may also be applied, i.e. a ratio of at least 25. When the term is used in relation to a structure with a specific clarification, it should be interpreted according to the specific clarification.

[0038] "Relatively stiff" as used herein refers to a comparison of stiffness between two structural elements when the two structural elements are subjected to processing loads or stresses, where the relatively stiff structural element should experience at least 2 times, more preferably 5 times, and most preferably 10 times less deflection or strain compared to the other structural element. When the term is used in reference to a structural element without clarification, it should be interpreted as meeting the 2 times requirement. When the term is used in reference to a structural element with a specific clarification, it should be interpreted according to the specific clarification.

[0039] "Non-linear configuration" as used herein, particularly when applied to physical structures or elements, refers to a configuration that is not a straight rod-like configuration. A non-linear configuration is one that is two or three dimensional in nature with features that include one or more bends or curves. For example, a planar, non-linear structure can be a flat, helical structure. Non-linear configuration as used herein, when referring to a spring, does not refer to a force-deflection relationship unless such a relationship is specifically and explicitly indicated. Probe with planar spring module

[0040] The planar springs or planar compliant elements of the present invention can be formed in a number of different ways and can take on a number of different configurations. In general, the compliant elements include planar springs having portions that extend from a standoff to a tip or tip arm in a cantilever or bridge fashion (e.g., two or more springs originating at different lateral standoff locations and connecting to a common tip arm - here commonly referred to as a cantilever or cantilevers) across a gap or open area into which the spring may deflect during normal operation. These compliant portions generally have a two-dimensional non-linear configuration in a lateral plane and a thickness (e.g., longitudinal) extending perpendicular to the plane, where the two-dimensional configuration may be in the form of a beam structure with a curved or angled configuration, the length being much greater than its width, e.g., at least 5, 10, 20, or even 50 times or more in some variations, where the thickness is generally less than the length of the beam, e.g., at least 5, 10, 20, or even 50 times or more in some variations, or less than the lateral dimension of the spring element, e.g., 2, 5, 10, or even 20 times or more in some variations. In some embodiments, the plane of such configuration may be parallel to a layer plane (e.g., XY plane) when the probe or module is formed from multiple adhesive layers. The thickness of the spring (e.g., Z direction) may be the thickness of a single layer or may be the thickness of multiple layers. In some embodiments, the compliant element comprises multiple spaced planar spring elements.

[0041] In some embodiments, the compliant elements may include planar spring elements that are connected to such end elements at intermediate locations as well as to one another at standoff or tip structures. In some such embodiments, the planar spring elements may start out at one end (e.g., the standoff or tip arm) as one or more thick springs with a relatively high spring constant, and then be provided with a reduced spring constant by removal of some intermediate spring material between the top and bottom of the initial spring structure, such that what starts out as a small number of thicker planar compliant elements (e.g., 1, 2, or 3 elements) transitions to a larger number of thinner planar elements, with some initial planar elements splitting into 2, 3, 4, 5 or more planar but thinner elements before reaching the other end (e.g., the tip arm of the standoff), so that, for example, the spring constant, force requirements, excess travel, stress, strain, current carrying capacity, overall size, and other operating parameters can be tailored to meet the requirements of a given application.

[0042] Reference numbers are included in many of FIGS. 2-5E2, where like numbers are used to denote similar structures or features in different embodiments.

[0043] An exemplary spring module is shown in Figures 2-3. Figure 2 depicts an isometric view of an exemplary spring module 200 with two non-flexible spring elements 221-1 and 221-2, a base 201 spaced apart from the spring elements, and a connecting support (e.g., standoff or bridge) 211 bridging the longitudinal module gap MG between the spring elements and the base. In the example of Figure 2, each of the two spring elements takes the form of a planar, radially extending helix, extending from the radially displaced bridge 211 to a centrally or axially located tip element 231 via a downwardly extending portion of the tip structure. The springs are longitudinally spaced apart by a gap SG. In this example, the bridge 211 connects one end of each spring element together, while the tip element 231 connects the other ends of the spring elements together via an extending portion of the tip structure. The tip elements 231 are formed with a desired width TW and a desired tip height TH extending above the upper spring, with each spring element formed with a desired material, beam thickness or spring height SH, beam width or spring width SW, spacing CS between the spring coils, and coiled beam length that allows the spring to deflect a desired amount without exceeding the elastic deflection limits of the structure and associated material from which it is formed, while providing a desired fixed or variable spring force over its deflection range. In particular, the tip length may be such that a desired compression of the module tip toward the base may occur without the base, bridge, and spring elements interfering with one another. In some embodiments, for example, the maximum travel distance for the tip of each module may be as little as 5 μm (μm=microns) or less, or as much as 500 μm (e.g., 25 μm, 50 μm, 100 μm, or 200 μm) or more. For example, in some embodiments the maximum travel distance per module may be between 25 μm and 200 μm, while in other example embodiments the maximum travel distance per module may be between 50 μm and 150 μm. In some embodiments the maximum tip travel distance may be set by a hard stop such as a spring or a flexure of the tip contacting the base, a stop structure on the base, or in some cases a surface contacting the tip that contacts the upper portion of the bridge (e.g., a surface of an adjacent module).In other embodiments, the maximum travel distance may be determined by a compliant spring or tip portion contacting a soft stop or compliance reducing structure. The force to achieve maximum deflection (or travel) may be as little as 0.1 grams to as much as 20 grams or more. In some embodiments, a force target of 0.5 grams may be appropriate. In other embodiments, 1 gram, 2 grams, 4 grams, 8 grams, or more may be appropriate. In some embodiments, the module height MH (longitudinal dimension) may be targeted to 50 μm or less, while in other embodiments, the module height may be targeted to 500 μm or more. In some embodiments, the overall module radial diameter or width MW may be 100 μm or less or 400 μm or more (e.g., 150 μm, 200 μm, or 250 μm). The spring beam elements or beam elements of the module may have a spring height SH of 1 μm or less to 100 μm or more (e.g., 10, 20, 30, or 40 μm) and a beam or spring width SW of 1 μm or less to 100 μm or more (e.g., 10, 20, 30, or 40 μm). The tips may have a uniform or varying shape (e.g., cylindrical, rectangular, conical, polygonal, or other configuration or combination of configurations). The tips that connect to the spring beams generally have a cross-sectional width TW that is greater than the width SW of the beam or beams to which they connect.

[0044] Figure 3 depicts an isometric view of a second exemplary spring module 300 that is similar to the module of Figure 2, except that the two spring elements are thicker, and therefore provide a greater spring constant than the elements of Figure 2. Viewed from another perspective, the example of Figure 3 requires more force for a given deflection, and therefore reaches the yield strength of the combined materials and structural geometry (e.g., reaches the elastic deflection limit) at a smaller deflection than the example of Figure 2.

[0045] In other embodiments, the spring modules may take different forms than those shown in Figures 2 or 3. For example, (1) a module may have a single spring element or more than two spring elements; (2) each of the spring elements may have variations in one or more of the following ranges: width, thickness, length, or rotation; (3) the spring elements may vary over the length of the element; (4) the spring elements may have configurations other than Euler spirals, such as rectangular spirals, rectangular spirals with rounded corners, S-shaped configurations, or C-shaped configurations; (5) individual spring elements may connect to more than a single bridge connection, such as bridge connection points located at 180 degrees, 120 degrees, or 90 degrees of the module; (6) the bridge connections may be on different bridges; (7) the base element may have a smaller radial extent than the spring / bridge connection so that when the modules are stacked, when the module tip is sufficiently compressed, the base of a higher module may extend below the upper extent of a lower adjacent module; (8) the module base may be replaced with an additional spring that, by flexure, allows compression of the module spring from both directions, and (9) the probe tip may not be laterally centered with respect to the overall lateral configuration of the module (i.e., not coincident with, or even collinear with, the main axis of compression or the main build axis when formed layer by layer).

[0046] 4A-4D4 provide various views of a probe 3400, or portions of such a probe, formed from two back-to-back (or base-to-base) modules, where the two modules share a common base having an annular configuration, and the probe includes several different features: (1) an annular base that anchors the upper helical spring array 3421-UC and the lower helical spring array 3421-LC by their outermost lateral extents to provide a basic standoff function between the upper and lower spring arrays; or frame 3401, where base or frame 3401 has a circular exterior with an internal opening having opposing arched sides 3401-A and narrower opposing flat sides 3401-F, where the upper and lower surfaces connecting the flat sides provide attachment areas for connecting with upper and lower supports or standoffs 3411-1, 3411-2, 3412-1, and 3412-2 which support the ends of the helical spring element, while the arched areas are where the outermost cantilevered portions of the springs may reside (before deformation). (2) each of the upper and lower spring arrays begins their inward path from an opposing pair of standoffs as two longitudinally spaced, coplanar pairs of wound helical cantilevers 3421-1U and 3421-2U ​​above the base, and 3421-1L and 3421-2L below the base, and each cantilever of each element extends along their inward movement (3) the helical spring elements connecting the upper contact tips have an opposite sense of rotation to the helical spring elements connecting the lower contact tips; (4) the helical spring elements connecting the upper contact tips split into two longitudinally spaced apart cantilevers, whereby four upper cantilever elements UC1-UC4 connect each side of upper end arm 3431-UA, while four lower cantilever elements LC1-LC4 connect either side of lower end arm 3431-LA which supports contact or coupling tips 3431-U and 3431-L, respectively; (3) the sense of rotation of the helical spring elements connecting the upper contact tips has an opposite sense of rotation to the helical spring elements connecting the lower contact tips;and (4) standoffs 3411-1, 3411-2, 3412-1, and 3412-2 provide only intermediate standoff functionality between the beams of the upper spiral array and between the helical beams of the lower spiral array, and do not provide standoff functionality between the two groups of springs (that functionality is provided directly by base 3401);

[0047] Figures 4A, 4B1 and 4B2 provide a side view, an upper isometric view, and a lower isometric view of probe 3400, respectively, in which different features of the probe can be seen. Figure 4B1 provides a view of the uppermost pair of helical springs in the upper spring section of the probe, while Figure 4B2 provides a view of the lowermost pair of helical springs in the lower spring section of the probe. Figures 4A, 4B1 and 4B2 each provide a view of upper and lower tips 3431-U and 3431-L along with central base 3401. 4A, 4B1, and 4B2 also provide views of the upper and lower standoffs 3411-1 and 3411-2, as well as views of the outer portions of the longitudinally spaced upper and lower cantilever elements 3421-1U and 3421-2U ​​and 3421-1L and 3421-2L. It can also be seen that the interleaved paths of pairs of coplanar cantilever elements proceed inwardly from their respective standoffs to their respective central tips.

[0048] Figures 4C1 and 4C2 provide exploded isometric views of the probe 3400 from the top and bottom perspectives, respectively, where the bottom of the lower cantilever element and the top of the upper cantilever element are visible, as well as the top of the lower cantilever element and the bottom of the upper cantilever element, and the interior of the annular base 3401, including flat and arched sidewalls 3401-F and 3401-A. In Figures 4C1 and 4C2, the upper spring section or upper compliant element 3421-UC of the probe is spaced from the central frame or base element 3401, which is spaced from the lower spring section or lower compliant element 3421-LC of the probe. The upper tip 3431-U is visible in Figure 4C1, along with the tops of the upper and lower spring sections and the top of the central frame element. Lower tip 3431-L can be seen in Figure 4C2 along with the bottom of upper and lower spring sections 3421-UC and 3421-LC and the bottom of central frame element 3401. As can be seen by the dotted lines connecting the exploded elements, central frame element 3401 supports the outermost lateral extents of the upper and lower spring sections, and more specifically, standoffs 3411-1, 3411-2, 3412-1, and 3412-2, which support their cantilever elements.

[0049] 4D1-4D4 provide four different cutaway views of probe 3400, in which increasingly larger portions of the side of the probe have been cut away to reveal the internal structure of the probe so that the changes in the cantilever can be more easily seen and understood. As the helical element rotates inward toward the laterally central tip element, the cantilever elements transition from two longitudinally spaced cantilever elements 3421-2U ​​and 3421-1U above the base 3401 and two longitudinally spaced cantilever elements 3421-1L and 3421-2L below the base 3401 to four longitudinally spaced cantilever elements UC1 to UC4 above the base and four longitudinally spaced elements LC1 to LC4 below the base, where the beam reaches respective longitudinally movable tip arm elements 3431-UA and 3431-LA, which connect to or become tips 3431-U and 3431-L, respectively (best seen in Figure 4D3).

[0050] Figure 4E1 provides a side view of probe 3400 similar to Figure 4A, but with 17 sample layer levels L1-L17 identified, each layer having an identified thickness along the longitudinal axis of the probe (i.e., the Z-axis as shown), from which the probe may be fabricated via a multilayer fabrication process, such as a multilayer, multi-material electrochemical fabrication process, using single or multiple structural materials (along with sacrificial materials) and with a build or stack axis corresponding to the longitudinal axis of the probe. In such fabrication embodiments, the probes may be formed one at a time, although it is generally preferred to form the probes in batches of hundreds or even thousands of probes that are formed simultaneously by successive layer and layer stacking.

[0051] 4E2-A to 4E9-B show cross-sectional configurations shown in both top (-A) and isometric (-B) views for eight unique configurations of layers L1 to L17.

[0052] 4E2-A and 4E2-B show views of layers L1 and L17, where one can see the tips, which are the lower tip 3431-L for L1 and the upper tip 3431-U for layer L17.

[0053] Figures 4E3-A and 4E3-B show views of L2, L4, L6 and L8 which provide portions of planar spring spirals 3421-1L, 3421-2L and their innermost regions forming cantilever sections LC1 to LC4 (not shown), portions of the lower central tip arm 3431-LA and portions of the lower standoffs 3412-1 and 3412-2, where the double interlaced spiral configuration can be seen.

[0054] Figures 4E4-A and 4E4-B show views of L3 and L7 where incomplete helical elements 3421-1L, 3421-2L and standoffs 3412-1 and 3412-2 (similar to the features in Figures 4E3-A and 4E3-B, but without the LC1-LC4 portions) can be seen. The helical portions reflected in these figures combine with the upper and lower portions of Figures 4E3-A and 4E3-B to form a thick helical section in the outermost lateral portion of the spring, where the lower compliant element 3421-LC includes only two thick cantilever elements rather than the four thinner cantilever elements LC1-LC4 that connect to the tip arm in the innermost lateral portion of the spring.

[0055] 4E5-A and 4E5-B show views of L5 including portions of the lower tip arm 3431-LA and standoffs 3412-1 and 3412-2, which provide a connection between the 3421-1L and 3421-2L cantilever spring portions.

[0056] 4E6-A and 4E6-B show views of L9 including a ring-like base 3401 that separates and connects upper and lower compliant elements 3421-UC and 3421-LC via two portions of the base that act as standoffs, where several lateral portions of the base align and engage with springs in their standoff regions 3411-1, 3411-2, 3412-1 and 3412-2. The actual start of the inwardly rotating helix of the probe 3400 depends on how the features of L8 interface with those of L9, and similarly how the features of L9 interface with those of L10. In particular, the interface is not perpendicular to the local length of the winding helix (e.g., so that a minimal width interface is provided), but is angled such that the outer portions of the helical beam that interface with the base are supported a different amount along their length than the inner portions. In some variations, the interfaces may be provided in such a manner that the interfaces are provided perpendicular to the local length of the beam, whereby the support provided by the base (or other standoff region) provides a laterally vertical or substantially vertical transition between supported and unsupported beam regions. In particular, vertical transitions are provided in other beam to standoff regions, such as can be seen at the interfaces formed by L4 and L5, L5 and L6, L12 and L13, and L13 and L14, and in other beam splitting regions, such as L2 to L3, L3 to L4, L6 to L7, L7 to L8, L10 to L11, L11 to L12, L14 to L15, and L15 to L16, where the beam transitions extend along a lateral line substantially perpendicular to the direct or local length of the beam. Such perpendicular and non-perpendicular interfaces and their consistent or varying use may be used in tuning probe performance or operating characteristics.In particular, due to the non-vertical interface with the base and due to the interfaces provided by and between the other beams of the cantilever, the outer portion of the cantilever is provided as a single thick beam, while the inner portion of the cantilever structure starts as two beams of intermediate thickness and ends with the cantilever in the probe arm as four thinner beams. In some variations, the initial cantilever structure (exiting laterally from the base) may start as a single thick beam or multiple beams throughout their width. Other transitions along the beam length may also be configured to provide smooth or vertical transitions, or to provide variable or non-vertical transitions. 4E7-A and 4E7-B show views of L10, L12, L14 and L16, which provide (1) portions of upper planar spring helices 3421-1U and 3421-2U ​​and their innermost extensions forming cantilever portions UC1-UC4 (not shown), and (2) portions of upper central tip arm 3431-UA and upper standoffs 3411-1 and 3411-2, where the double interlaced helical configuration can be seen. These are the upper compliant element counterparts to the lower compliant element mechanism shown in FIGS. 4E3-A and 4E3-B. Comparison of these views shows that the helical rotation sense of the upper and lower compliant elements has an inverted rotation sense. This inversion of sense may be considered beneficial in some cases and unnecessary or even harmful in other cases. When the spring elements are compressed, the tips may tend to rotate in a direction opposite to the inward rotation of the helical elements, which may create a frictional or rubbing effect that may tend to break down oxide coatings or cause damage to the surfaces in contact. Reversal of the direction of friction between the lower and upper probe tips may or may not be desirable and therefore may be taken into account during initial probe design. Similarly, reversal of the relative direction of the spaced apart upper spring elements is possible, as is reversal of the direction of the spaced apart lower spring elements.

[0057] Figures 4E8-A and 4E8-B show views of layers L11 and L15 where one can see the incomplete helical elements 3421-1U and 3421-2U ​​and the connection regions of standoffs 3411-1 and 3411-2 that bridge portions of the helix in Figures 4E7-A and 4E7-B to form a thicker helical section at the outermost lateral portion of the spring, where the upper compliant element 3421-UC includes only two thick elements rather than the four thinner elements that connect the tip arms 3431-UA at the innermost lateral region of the helix. Figures 4E8-A and 4E8-B provide the counterpart of the upper compliant element to the lower compliant element shown in Figures 4E4-A and 4E4-B.

[0058] Figures 4E9-A and 4E9-B show views of layers including portions of upper tip arm 3431-UA and standoffs 3411-1 and 3411-2L13 that provide connections between cantilevers 3421-1U and 3421-2U. Figures 4E9-A and 4E9-B provide images of portions of an upper compliant element that are counterparts to the counterparts of the lower compliant element seen in Figures 4E5-A and 4E5-B.

[0059] Many additional variations of the probes of FIGS. 4A-4E9-B are possible and will be apparent to those of skill in the art upon review of the teachings herein, including, for example, (1) variations in materials; (2) the number of turns or partial turns that each spring element incorporates, the number of interleaved springs used at each longitudinal level, the number of longitudinally spaced springs used (e.g., even, odd, and the like), the number and locations of longitudinal beam transitions that occur along the length of the helix, the direction of rotation that successive helices take (e.g., clockwise-counterclockwise-clockwise-counterclockwise-clockwise, clockwise-counterclockwise-counterclockwise-clockwise, and the like), tip shape, and the width and thickness of the cantilever beam. (3) the use of standoffs that space one or both of the upper and lower spring modules from the annular frame; (4) the use of standoffs closer to the central portion of the probe rather than the periphery of the probe; (5) the use of different types of frames or base structures and / or openings in such frames and base structures; (6) the use of spring structures that are a single helix at a given longitudinal level or more than two interlaced helices at a given longitudinal level rather than a pair of coplanar interlaced helices supported by different standoffs, and (7) variations obtained from the features of other embodiments and aspects described herein and variations thereof.

[0060] 5A1-5C5 show an exemplary probe 3500 and single array plate 3540 mounting and retention configuration according to another embodiment of the invention using a foldable spring clip or retention element 3503 in combination with an additional longitudinally displaced retention element in the form of a retaining ring or base 3501 that secures the probe to the array plate, where the spring clip 3503 folds upon insertion into a through hole 3541 in the plate and then automatically extends once passage through the hole is complete, locking the spring clip together to the plate.

[0061] The probe 3500 comprises a compliant structure including a standoff having longitudinally spaced first and second ends, a first compliant element including a two-dimensional substantially planar spring, and a second compliant element including a spring. Alternatively, both the first compliant element and the second compliant element include respective two-dimensional substantially planar springs.

[0062] More specifically, the first compliant element provides compliance in a direction substantially perpendicular to the planar configuration, where a first portion of the first compliant element is operatively coupled to the at least one standoff and a second portion of the first compliant element is operatively coupled to a first distal arm that is resiliently moveable relative to the at least one standoff, where the first distal arm directly or indirectly secures a first distal end 3531-U that extends longitudinally beyond a first end of the at least one standoff when the first compliant element is unbiased.

[0063] Additionally, the second compliant element provides compliance in a direction substantially perpendicular to the planar configuration, where a first portion of the second compliant element is operatively coupled to the at least one standoff and a second portion of the second compliant element is operatively coupled to a second distal arm that is resiliently moveable relative to the at least one standoff, where the second distal arm directly or indirectly secures a second distal end 3531-L that extends longitudinally beyond a second end of the at least one standoff when the second compliant element is unbiased.

[0064] 5A1-5A4 provide a side view (FIG. 5A1), two isometric views (FIGS. 5A2-5A3), and a top view (FIG. 5A4), all from the same rotational orientation about the Z or longitudinal axis of an exemplary probe 3500, which has similarities to the probe 3400 of the series of FIG. 4, with the main exception that the central base of the probe of the series of FIG. 4 is replaced with two longitudinally spaced apart retaining elements in the form of a lower retaining ring 3501 and a pair of upper foldable spring elements 3503 that can be made to pass through openings 3541 in a retaining plate 3540 and then re-extend to secure the probe to the retaining plate between the longitudinally spaced apart retaining elements. In this manner, the lower retaining ring 3501 acts as a lower retaining mechanism and the upper foldable spring elements 3503 acts as an upper retaining mechanism.

[0065] Figures 5A5-5A7 provide a side view (Figure 5A5) and two isometric views (Figures 5A6-5A7) of probe 3500 identical to those shown in Figures 5A1-5A4 but from different rotational orientations about the Z axis, while Figures 5A8-5A10 provide similar views from a third rotational orientation about the Z axis.

[0066] Probe 3500 of FIGS. 5A1-5A10 includes a body portion 3504 and mounting or retaining structures 3501 and 3503. Body portion 3504 includes a spring module that supports the contact tip and a standoff that supports the spring module. Retaining ring 3501 in this embodiment functions not only as a retaining structure for the probe and plate, but also as a stabilizing structure that secures the standoff for the spring module in the intended configuration. In general, body portion 3504 may be considered to be exclusive of laterally extending peripheral features such as structure 3503 whose primary purpose is mounting or alignment. Depending on the location of ring-like structure 3501 and the purpose it serves, it may or may not be counted as part of a separate body portion. In this embodiment, for probe stability, base 3501 may be considered to be part of the probe body, but for mounting and retaining purposes, it may be considered to be excluded from the probe body. In this embodiment, the top of the retaining ring is intended to provide a lower stop against which the bottom of the array plate abuts during mounting, while the bottom of the retaining spring 3503 acts as an upper stop for movement of the array plate once mounting occurs. In this embodiment, the retaining spring 3503 includes a base end 3503-B that attaches the spring to the body of the probe, and an opposed, resiliently movable end 3503-E that can be compliantly and laterally compressed towards the body of the probe to allow the probe to be fully inserted into the array through-hole, and then resiliently extended to inhibit unintended probe release from the array plate. In this manner, when the probe 3500 is inserted into the opening of the corresponding plate guide hole 3541 in the array plate 3540 and the retention spring engages the upper surface region of the array plate, the lower retention ring 3501 engages the bottom of the array plate 3540, the terms top and bottom being used to refer to the representation in the figures, in particular, the bottom of the array plate is located in the opposite direction to the local axis z, while the top surface of the array plate is aligned in the direction of the local axis z.

[0067] Figures 5B1-5B3 provide a top view (Figure 5B1) and two isometric views (Figures 5B2-5B3) with different rotational orientations about the Z axis of a fragment of an array plate having a single through hole 3541 into which the upper portion of the probe of Figures 5A1-5A10 can be inserted longitudinally to engage and at least temporarily connect the probe and plate.

[0068] 5C1-5C5 provide side (FIG. 5C3), isometric (FIGS. 5C1, 5C2, and 5C4), and top (FIG. 5C5) views of the probes of FIGS. 5A1-5A10 loaded onto the plates of FIGS. 5B1-5B3 and secured together after such loading, where loading is implemented via relative longitudinal and rotational movement.

[0069] FIG. 5C1 provides an isometric view of the probe 3500 of FIGS. 5A1-5A6 in preparation for loading the probe into the aperture by relative movement of the array plate in the direction indicated by arrow 3545, the orientation (about the z-axis) and tilt (front to back) of FIG. 5A2 aligned laterally beneath the aperture 3541 in the array plate 3540 of FIGS. 5B1-5B3, where lateral alignment allows the array plate to slide past the upper portion of the probe body by longitudinal movement alone, whereas relative rotational movement of the plate and probe, as indicated by arrows 3545-CW and 3545-CCW in FIG. 5C2 associated with continued downward pressure, may fold the retention springs 3503, thus allowing the plate to move beneath these spring elements, which may re-extend as shown, inhibiting unintended movement of the plate in the opposite longitudinal direction. The retaining probe or coupled probe and plate can be seen from different perspectives in Figures 5C3-5C5. For example, in the side view of Figure 5C3, the plate can be seen to be located longitudinally between the retaining ring 3501 and the retaining spring 3503. In this example, the body of the probe is substantially circular, as is the opening in the array plate, so the orientation of the probe about the z-axis is not defined; however, in other embodiments, alternative configurations can be used to specifically orient the probe and plate to a desired set of orientation possibilities, or even a single possible orientation.

[0070] 6A1-6A5 provide a side view (FIG. 6A1), three isometric views (FIGS. 6A2, 6A4, and 6A5), and a top view (FIG. 6A3) of the probe that is similar to the series of FIG. 5, except that the retention spring element 3603 is recessed toward the body of the probe 3600 at each end 3603-B, 3603-E, and the greatest lateral extension occurs toward the center of the retention spring 3600 rather than extending all the way to the compressible ends of the spring.

[0071] Many alternatives to the embodiments of Figures 5A1-5C5 and 6A1-6A5 are possible, such as: (1) changing the aperture shape from that presented to some other configuration, such as a symmetrical oval, square, rectangle, triangle, or some other simple or complex polygonal or closed curve configuration that may or may not be symmetrical and may or may not limit probe loading to a single rotational or even directional orientation to ensure that the probe and plate are correctly side up during loading; (2) changing the shape of the probe body, retention spring, and / or retention ring, or even replacing the retaining ring with multiple isolation tabs similar or different to the other retention springs, or even another set of retention springs; (3) changing the number of retention springs while maintaining uniformity in spacing; (4) using non-uniform spacing or even asymmetric configurations of retention springs; (5) using retention springs in combination with one or more tabs and notches in the plate to set the initial or even final loading orientation;(6) For example, (a) a retaining spring carrying a laterally inserted, longitudinally extending element in the opposite direction of the retaining ring that the tool can contact and push laterally inward to move the retaining spring inward for loading, such that full longitudinal positioning is not required for rotational movement (after which release of the tool allows the spring to resiliently move outward to provide retention); (b) the use of some laterally inserted secondary element, which may or may not provide compliance of its own, disposed between the main retaining spring element and the retaining ring, which resides within an opening in the array plate and provides pressure against the inner wall of the array plate, allowing the main retaining spring to provide longitudinal locking of the probe to the array plate while providing lateral centering of the probe within the hole; (c) an extension similar to (a), but with secondary elements extending toward and away from the retaining ring, whereby lateral movement of the probe in one direction pushing against the secondary element may allow sufficient displacement of the retaining spring and the probe itself to allow a different or opposite movement of the probe into the array opening. (7) the use of a retention spring that allows for a reduction in lateral size via forced longitudinal displacement rather than direct lateral displacement, such that sufficient longitudinal displacement results in sufficient lateral displacement to allow for completion of loading; (8) the holes or openings in the array plate may include steps, protrusions, notches, and the like, or countersunk portions that may provide enhanced engagement to the probes, rather than straight longitudinally extending through holes; (9) the probes may include other features to enhance engagement with the plate, such as rotational stops, friction elements, position biasing springs, or spring latches that engage array plate features to fixedly secure the probes, for example, to improve retention, longitudinal alignment, and the like; (10) in some embodiments, the retention springs and probe bodies may be configured to allow for pre-load compression (e.g., latch or bi-stable compression) that may be released after loading;(11) When all the probes in a probe or multi-probe plate are properly positioned and oriented to provide position locking, compression, or release of pre-compression retention springs, a single array plate may be replaced by two or more adjacent plates that may be shifted laterally relative to one another; and (12) other variations as described with respect to other embodiments described herein. In most practical implementations, the array plates each include a plurality of through-holes in a desired array pattern. In some variations, the array plate may be limited to a dielectric material while the probes may be limited to a conductive material. In other variations, the array plate may include probes that include conductive elements (e.g., traces) that provide electrical contact to some or all of the probes, and dielectric elements that provide electrical isolation of different elements in a single probe or between adjacent probes.; Further comments and conclusions

[0072] Although many embodiments have been presented above, many additional embodiments are possible without departing from the spirit of the present invention. Some of these additional embodiments may be based on a combination of the teachings herein with various teachings incorporated herein by reference. Some fabrication embodiments may use a multi-layer electrochemical deposition process and others may not. Some embodiments may use a combination of selective and blanket deposition processes and others may use neither, while still others may use a combination of different processes. For example, some embodiments may not use any blanket deposition process and / or they may not use a planarization process in the formation of successive layers. Some embodiments may use a selective deposition process or a blanket deposition process for some layers that is not an electrochemical deposition process. Some embodiments may use, for example, nickel (Ni), nickel phosphorus (Ni-P), nickel cobalt (NiCo), gold (Au), copper (Cu), tin (Sn), silver (Ag), zinc (Zn), solder, rhodium (Rh), rhenium (Re), beryllium copper (BeCu), tungsten (W), rhenium tungsten (ReW), aluminum copper (AlCu), palladium (Pd), palladium cobalt (PdCo), platinum (Pt), molybdenum (Mo), manganese (Mn), steel, P7 alloy, brass, chromium (Cr), chromium, chromium copper (CrCu), other palladium alloys, copper silver alloys as structural or sacrificial materials, while other embodiments may use different materials. Some of the above materials may be used preferentially for their spring properties, for example, while others may be used for their enhanced electrical conductivity, their wear resistance, their barrier properties, their thermal properties (e.g., yield strength or high heat conductivity at high temperatures), while some may be selected for their bonding characteristics, their separability from other substances, or even other characteristics of interest in the desired application or use.Other embodiments may use different materials or combinations of different materials as structural, sacrificial, or patterning materials, including dielectrics (e.g., ceramics, plastics, photoresists, polyimides, glasses, ceramics, or other polymers), other metals, semiconductors, and the like. Some embodiments may use, for example, copper, tin, zinc, solder, photoresist, or other substances as sacrificial materials. Some embodiments may use different structural materials in different layers or in different portions of a single layer. Some embodiments may remove sacrificial materials, while others may not. Some embodiments may form probe structures, while others may use the spring modules of the present invention for non-probe purposes (e.g., to bias other operating devices with a desired spring force or for compliant engagement).

[0073] It is also understood that probe elements of some embodiments of the invention may be formed by processes quite different from those described herein, and it is not intended that structural aspects of the invention need to be formed exclusively by processes taught herein or by processes that become evident from the teachings herein.

[0074] Although headers have been provided in various portions of this specification, the headers are not intended to be used to limit the application of teachings found in one portion of the specification from their application to other portions of the specification. For example, alternatives noted in the context of one embodiment are intended to apply to all embodiments to the extent that features of the different embodiments facilitate such application and do not contradict or eliminate any of the benefits of the embodiment employed.

[0075] Any aspect of the invention described herein is intended to represent a description of an independent invention that the applicant believes to be a full and complete description of the invention that may be written as an independent claim, without the need to incorporate additional limitations or elements from other embodiments or aspects described herein for interpretation or clarification, other than as expressly recited in the written independent claim. Any variations of the aspects described herein are also understood to represent separate and distinct features that, if written, would form a separate independent claim and that may be added separately to the independent claim or added as a dependent claim to further define the invention claimed by the respective dependent claim.

[0076] Numerous further embodiments and alternatives in the design and use of the embodiments of the present invention will be apparent to those skilled in the art in view of the teachings herein. As such, it is not intended that the invention be limited to the specific exemplary embodiments, alternatives, and uses described above. Rather, it is intended to be limited only by the scope of the claims set forth below.

Claims

1. (1) A plurality of probes for making contact between two electronic circuit elements; (a) each probe comprising: (i) at least one standoff having a first end and a second end spaced longitudinally therebetween; (ii) at least one first compliant element comprising a two-dimensional substantially planar spring when unbiased, wherein the first compliant element provides compliance in a direction substantially perpendicular to a planar configuration, wherein a first portion of the first compliant element operatively couples to the at least one standoff and a second portion of the first compliant element operatively couples to a first distal arm that is resiliently moveable relative to the at least one standoff, wherein the first distal arm directly or indirectly secures a first distal end extending longitudinally beyond the first end of the at least one standoff when the first compliant element is unbiased; and (iii) at least one second compliant element comprising a spring, wherein the second compliant element provides compliance in a direction substantially perpendicular to the planar configuration, wherein a first portion of the second compliant element is operatively coupled to the at least one standoff and a second portion of the second compliant element is operatively coupled to a second distal arm that is resiliently moveable relative to the at least one standoff, wherein the second distal arm directly or indirectly secures a second distal end extending longitudinally beyond the second end of the at least one standoff when the second compliant element is not biased; wherein the first compliant element and the first portions of the second compliant element are longitudinally spaced from one another by the at least one standoff, and wherein biasing of at least one of the first distal end and the second distal end toward the other causes the second portions of the first compliant element and the second compliant element to longitudinally move in a manner selected from the group consisting of: (A) moving closer together, and (B) moving further apart; at least one compliant structure comprising: (2) an array plate with a plurality of plate probe holes for receiving and holding the probes; wherein the array plate is configured to receive probes from below the array plate; wherein at least a portion of the plurality of probes further include at least one lower retention mechanism and at least one upper retention mechanism, the at least one lower retention mechanism configured to engage a bottom portion of the array plate when the probe is inserted into an opening of the plate probe hole in the array plate, and the at least one upper retention mechanism configured to engage at least one top surface region of the array plate; wherein the at least one lower retention feature includes at least one laterally extending feature protruding from a body of each of the probes with a size and configuration that limits a longitudinal extent to which each of the probes can be inserted into the plate probe holes of the array plate; wherein said at least one upper retention feature comprises at least one laterally compressible spring element at a level above said lower retention feature and spaced longitudinally from said lower retention feature by a gap at least as large as a thickness of a longitudinal engagement portion of said array plate, wherein said at least one upper retention feature in combination with said body of said probe can be made to achieve a lateral configuration that is sized to pass through said plate probe hole and thereafter resiliently return to a configuration that cannot pass through said plate probe hole to hold said probe and said array plate together; A probe array comprising:

2. 2. The probe array of claim 1, wherein the upper retention mechanism includes at least two foldable spring elements extending laterally from the body of each of the probes, the spring elements having a width that allows passage through the openings of the plate probe holes in the array plate in a compressed configuration and a width that prevents passage through the openings of the plate probe holes in an extended configuration.

3. 3. The probe array of claim 2, wherein each of the foldable spring elements comprises a base end that attaches the foldable spring element to the body of the probe, and an opposed, resiliently movable end that can be compliantly and laterally compressed toward the body of the probe to enable full insertion of the probe into the opening of a corresponding plate probe hole, and then resiliently extended to inhibit unintended release of the probe from the array plate.

4. 2. The probe array of claim 1, wherein the upper retention mechanism includes spring elements that are recessed toward the body of the probe at each end, with maximum lateral extension occurring toward a center of the spring elements rather than extending completely to the compressible ends of the spring elements.

5. 2. The probe array of claim 1, wherein each of the probes includes a plurality of foldable spring elements positioned along a circumference of the probe in a manner selected from the group consisting of: (A) evenly spaced apart; (B) non-evenly spaced apart; or (C) asymmetrically configured.

6. The upper retention mechanism is: (A) a multi-level retention spring; (B) a retention spring having a laterally inset element extending longitudinally opposite a retaining ring such that a tool can contact the retention spring and press laterally inward to move the retention spring inward for loading, whereby no rotational movement is required for full longitudinal alignment, after which release of the tool allows the spring to resiliently move outward to provide retention; (C) a retention spring having a laterally inset secondary element located between the retention spring and the retaining ring, which resides within the opening in the array plate and provides pressure against the inner wall of the array plate to provide lateral centering of the probes in the plate probe holes, while still allowing the retention spring to provide longitudinal locking of the probes to the array plate; and (D) a retention spring having a laterally inset secondary element located between the retention spring and the retaining ring, which resides within the opening in the array plate and provides pressure against the inner wall of the array plate to provide lateral centering of the probes in the plate probe holes. (E) a retention spring with a sub-element that extends toward and away from the retaining ring, thereby pushing against the sub-element, where lateral movement of the probe in one direction may allow sufficient displacement of the retention spring and the probe itself to allow a different or opposite loading of the probe into a corresponding plate probe hole, and then a different or opposite lateral shift may be used to complete loading of an additional portion or opposite side of the probe into the array plate; or (F) a retention spring that allows a reduction in lateral size via a forced longitudinal displacement rather than a direct lateral displacement, such that upon sufficient longitudinal displacement, sufficient lateral displacement occurs to allow complete loading of the probe into the array plate. The probe array of claim 1 , selected from the group consisting of:

7. 2. The probe array of claim 1, wherein the plate probe holes of the array plate are selected from the group consisting of: (A) straight longitudinally extending through-holes; (B) through-holes including steps, protrusions, notches, and the like; and (C) through-holes including countersunk portions.

8. The probe array of claim 1 , wherein the array plate includes additional tabs and notches in the array plate for setting a loading orientation of the probes in the array plate.

9. 2. The probe array of claim 1, wherein the array plate includes two or more adjacent plates that can be shifted laterally relative to one another when the probe or all the probes in the multi-probe plate are properly positioned and oriented to provide position locking, compression, or release of retention springs prior to compression.

10. The probe array of claim 1 , wherein the lower retention feature has an annular configuration.

11. The probe array of claim 1 , wherein the lower retention mechanism includes a plurality of standoff tabs.

12. 2. The probe array of claim 1, wherein the plate probe holes have an aperture shape selected from the group consisting of: (A) ellipse, (B) square, (C) rectangle, (D) triangle, (E) simple polygon, (F) complex polygon, (G) symmetric closed curve configuration, (H) non-symmetric closed curve configuration, or (I) shape with directional orientation.

13. 1. A probe for making contact between two electronic circuit elements, comprising: (i) at least one standoff having a first end and a second end spaced longitudinally therebetween; (ii) at least one first compliant element comprising a two-dimensional substantially planar spring when unbiased, wherein the first compliant element provides compliance in a direction substantially perpendicular to a planar configuration, wherein a first portion of the first compliant element is operatively coupled to the at least one standoff and a second portion of the first compliant element is operatively coupled to a first distal arm that is resiliently moveable relative to the at least one standoff, wherein the first distal arm directly or indirectly secures a first distal end that extends longitudinally beyond the first end of the at least one standoff when the first compliant element is unbiased; and (iii) at least one second compliant element comprising a spring, wherein the second compliant element provides compliance in a direction substantially perpendicular to the planar configuration, wherein a first portion of the second compliant element is operatively coupled to the at least one standoff and a second portion of the second compliant element is operatively coupled to a second distal arm that is resiliently moveable relative to the at least one standoff, wherein the second distal arm directly or indirectly secures a second distal end extending longitudinally beyond the second end of the at least one standoff when the second compliant element is not biased. wherein the first compliant element and the first portions of the second compliant element are longitudinally spaced from one another by the at least one standoff, and wherein biasing of at least one of the first distal end and the second distal end toward the other causes the first compliant element and the second portions of the second compliant element to longitudinally move in a manner selected from the group consisting of: (A) moving closer together; and (B) moving further apart; wherein at least a portion of the probe further comprises at least one lower retention feature and at least one upper retention feature; wherein the at least one lower retention feature includes at least one laterally extending feature protruding from a body of the probe; wherein the at least one upper retention mechanism includes at least one laterally compressible spring element at a level above the lower retention mechanism and longitudinally spaced from the lower retention mechanism by a gap. A probe comprising at least one compliant structure comprising:

14. The probe of claim 13 , wherein the upper retention mechanism includes at least two foldable spring elements extending laterally from the body of the probe.

15. 15. The probe of claim 14, wherein each of the foldable spring elements includes a base end that attaches the foldable spring element to the body of the probe, and an opposed, resiliently movable end that can be compliantly and laterally compressed toward the body of the probe and then resiliently extended.

16. 14. The probe of claim 13, wherein the upper retention mechanism includes a spring element that is recessed toward the body of the probe at each end, with maximum lateral extension occurring toward a center of the spring element rather than extending fully to the compressible ends of the spring element.

17. 14. The probe of claim 13, comprising a plurality of foldable spring elements positioned along a circumference of the probe in a manner selected from the group consisting of: (A) evenly spaced, (B) non-evenly spaced, or (C) asymmetrically configured.

18. 14. The probe of claim 13, wherein the upper retention feature is selected from the group consisting of: (A) a multi-level retention spring; (B) a retention spring having a longitudinally extending element laterally interleaved in a direction opposite to a retaining ring; (C) the retention spring having a laterally interleaved sub-element located between the retention spring and the retaining ring; (D) the retention spring having a laterally interleaved sub-element located between the retention spring and the retaining ring, which has its own compliance; (E) a retention spring having a sub-element extending toward and away from the retaining ring; or (F) a retention spring that allows for a reduction in lateral size via forced longitudinal displacement rather than direct lateral displacement.

19. The probe of claim 13 , wherein the lower retention feature has an annular configuration.

20. The probe of claim 13 , wherein the lower retention mechanism includes a plurality of standoff tabs.

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