Carrier for a micro control environment having a pedestal

Abstract

The present invention provides a component carrier (200) comprising a component support part (210) for carrying one or more components (20) to be processed in a component processing apparatus such as a press sintering apparatus, and a method thereof. The component support part (210) includes one or more positioning openings (213) formed through the component support part (210) from the upper surface (210a) to the bottom surface (210b) of the component support part, and one or more movable pedestals (212) respectively associated with the one or more positioning openings (213). Each movable pedestal (212) is received within the associated positioning opening (213), and the lower end (212b) of each pedestal is exposed to the bottom surface (210b) of the component support part in order to contact a heat source for heating the pedestal (212) and the respective component when in contact with the pedestal (212).

Description

Technical Field

[0001]

[0001] The present invention relates to a component carrier for carrying components. The present invention further relates to a kit including a component carrier, a gas-impermeable sealing foil, and a downward holding plate. The present invention also relates to a processing apparatus including a component carrier. The present invention further relates to a processing method for processing components.

Background Art

[0002]

[0002] The sintering process is used to fabricate components by creating a good bond between a device such as a semiconductor device like a power IC and its substrate or carrier. First, the device to be sintered is placed on its substrate or carrier with a sintering material therebetween. Subsequently, pressure is applied using an actuator that applies pressure to the relevant components and the sintering material while, for example, the device, the sintering material, and the substrate or carrier are heated from about 250°C to 300°C. The sintering process enables the production of components characterized by a strong bond, particularly between the device and the substrate or carrier.

[0003]

[0003] The device to be processed may be related to chips, DBCs, spacers, heat sinks, sensors, power ICs, flip chips, MEMs, etc. Usually, a part of the product to be sintered is made of a highly conductive material such as silver or copper and is not coated with a protective coating. Such metal parts exposed to the high temperature of the sintering process oxidize rapidly when surrounded by an oxygen-containing atmosphere. The oxides formed on the metal parts degrade the quality of the components, i.e., reduce their conductivity. Furthermore, at the high temperature of the sintering process, impurities that may contaminate the components themselves are released from the sintering material. To avoid these problems, the components are generally sintered in a closed chamber in which an atmosphere containing mostly an inert gas such as nitrogen is generated. For the purpose of generating this inert atmosphere, an inert gas is introduced into the chamber to flush out impurities and oxygen.

[0004]

[0004] The sintering process generally includes three stages, namely a preheating stage in which the parts are preheated, a processing stage in which the parts are heated at the sintering temperature while pressure is applied, and a cooling stage in which the parts are cooled (air-cooled) to room temperature. These three stages can be carried out in the same processing chamber or in a separate processing chamber. In either case, the atmosphere must be changed at each stage by introducing an inert gas into the chamber and thereby expelling the previously existing atmosphere. Usually, since the processing chamber has a fairly large volume, changing the atmosphere three times results in a very time-consuming process that can last longer than the sintering process itself.

[0005]

[0005] In the above, the sintering process was referred to. However, when processing parts, there are many more processes that require heating the parts to a high temperature. In such methods, oxides may be formed on the parts to be processed, which may lead to defects and quality problems of the parts themselves. Therefore, the limitations, difficulties and drawbacks of the above-described sintering method also equally apply fully to such other processing methods.

Summary of the Invention

[0006]

[0006] An object of the present invention is to reduce the cycle time for processing parts.

[0007]

[0007] Another or alternative object of the present invention is to reduce the contamination level of the processed parts.

[0008]

[0008] Yet another or alternative object of the present invention is to prevent undesirable chemical reactions, particularly oxidation, during the processing of parts due to the presence of oxygen or impurities in the atmosphere surrounding the parts.

[0009]

[0009] Still another or alternative object of the present invention is to reduce the amount of inert gas used to generate an inert atmosphere during processing in a processing apparatus.

[0010]

[0010] In one aspect, the present invention provides a component carrier having a component support portion for carrying one or more components to be processed in a component processing apparatus such as a press sintering apparatus. The component support portion is one or more positioning openings formed through the component support portion from the upper surface to the bottom surface of the component support portion, each positioning opening defining a component position for holding the component to be processed, the component held in the component position being exposed on the upper surface of the component support portion, and one or more movable pedestals respectively associated with the one or more positioning openings. Each movable pedestal moves along direction A between the upper surface and the bottom surface of the component support portion during operation for the purpose of carrying and thermally contacting each component during processing of the component, so as to contact and disengage from the component held in the component position defined by the positioning opening, and is received in the associated positioning opening. The lower end of each pedestal is exposed on the bottom surface of the component support portion for thermally contacting a heat source for heating the pedestal and each component when contacting the pedestal during operation.

[0011]

[0011] In one embodiment, the component support portion includes a receiving recess associated with the positioning opening. The receiving recess is recessed with respect to the upper surface of the component support portion, and the one or more positioning openings are disposed within the receiving recess.

[0012]

[0012] In one embodiment, the upper surface of the component support portion completely surrounds the receiving recess.

[0013]

[0013] In one embodiment, the component support portion is a carrying member configured to fit within the receiving recess and having one or more receiving openings corresponding to the one or more component positions when the carrying member is disposed within the receiving recess. Each receiving opening holds one of the one or more components and is configured to enable the upper end of each movable pedestal to contact the component.

[0014]

[0014] In one embodiment, the carrier member includes a carrier element configured to project toward the inside of each receiving opening and carry one or more components.

[0015]

[0015] In one embodiment, the component carrier includes a downward holding mask configured to be attached to the upper surface of the component support portion. The downward holding mask includes one or more mask openings configured to allow access to the components, and the mask openings correspond to positions relative to the component positions defined by the positioning openings of the component support portion.

[0016]

[0016] In one embodiment, the downward holding mask further includes a positioning pin configured to project from the bottom surface of the downward holding mask and fit into a positioning hole formed in the upper surface of the component support portion.

[0017]

[0017] In one embodiment, a gas inlet and a gas outlet are provided within the receiving recess. The gas inlet and the gas outlet are each fluidly connected to a gas inlet connection portion and a gas outlet connection portion via one or more gas ducts. The gas inlet connection portion is configured to be connected to a gas source, and the gas outlet connection portion is configured to be connected to a gas discharge port to provide a continuous gas flow to one or more components.

[0018]

[0018] In one embodiment, the component carrier is configured to hold a gas-impermeable foil, sheet, or film that completely covers the one or more components being carried and forms a closed void for the one or more components.

[0019]

[0019] In one embodiment, when the downward holding mask is attached to the upper surface of the component support portion, the gas-impermeable foil, sheet, or film is clamped between the downward holding mask and the upper surface of the component support portion.

[0020]

[0020] In another aspect, the present invention provides a component carrier for carrying one or more components to be processed, optionally in a component processing apparatus such as the press sintering apparatus according to any one of the preceding claims, the component carrier comprising: a component support portion having one or more positioning openings formed in an upper surface of the component support portion within the component support portion, each positioning opening defining a component position within the positioning opening for holding a component to be processed, and the component held in the component position within the positioning opening being exposed on the upper surface of the component support portion; a component support portion; two gas inlet connection portions in fluid communication with the positioning openings of the component support portion for passing gas from a gas source connected to one of the gas inlet connection portions in use to the positioning openings for the purpose of purging the positioning openings, each gas inlet connection portion being configured to be closed when not connected to the gas source.

[0021]

[0021] In one embodiment, the component support portion comprises a gas duct connected to each positioning opening to provide a fluid connection between the gas inlet connection portion and the positioning opening.

[0022]

[0022] In one embodiment, the component support portion comprises two gas outlet connection portions in fluid communication with the positioning openings of the component support portion for passing gas from the positioning openings to a gas outlet connected to one of the gas outlet connection portions in use for the purpose of purging the positioning openings, each gas outlet connection portion being configured to be closed when not connected to the gas outlet.

[0023]

[0023] In another aspect, the present invention provides a method for processing components in a processing apparatus, the method comprising using a component carrier.

[0024]

[0024] Further features and advantages of the present invention will become apparent from the description of the present invention by way of non-limiting and non-exclusive embodiments. These embodiments should not be construed as limiting the scope of protection. Those skilled in the art will understand that they can conceive of other alternative forms and equivalent embodiments of the present invention and implement them without departing from the scope of the present invention. Embodiments of the present invention are described with reference to the accompanying drawings, and like or the same reference numerals indicate like, same, or corresponding parts.

Brief Description of the Drawings

[0025]

Figure 1

Figure 2A

Figure 2B

Figure 3A

Figure 3B

Figure 4A

Figure 4B

Figure 5A

Figure 5B

Figure 6A

Figure 6B

Figure 7A

Figure 7B

Figure 7C

DETAILED DESCRIPTION OF THE INVENTION

[0026]

[0025] FIG. 1 schematically shows a component processing apparatus 10 according to an embodiment of the present invention. A component processing apparatus 10, such as a sintering apparatus or a packaging apparatus for sintering or packaging components, includes a preheating station 11 for preheating components, a processing station 12 for processing components, and a cooling station 13 for cooling components after processing. The processing apparatus 10 further includes a transfer device for carrying one or more components 20.1, 20.2 to be processed and transferring the products 20.1, 20.2 through different stations 11, 12, and 13 of the processing apparatus, that is, a gripping device, a robot arm, a crane, a linear X-Y table, etc. connected to a transfer conveyor. For example, one or more components 20.1, 20.2 to be processed, such as a power IC provided together with a sintering material between the power IC and a substrate on a carrier or a substrate, are arranged and placed on a component carrier 200. The transfer device 14 sequentially transfers the carrier 200 carrying one or more components 20.1, 20.2 to the stations 11, 12, and 13 of the processing apparatus 10.

[0027]

[0026] In the first stage, the carrier 200 is transferred onto the preheating platform 111 of the preheating station 11, where one or more parts 20.1, 20.2 are preheated. At least a part of the preheating platform 111 includes a heating element configured to heat up to about 300 °C and transfer heat to the parts 20.1 and 20.2. When the product reaches a predetermined temperature lower than the temperature of the heating element, the part carrier 200 is transferred by the transfer device 14 onto the heating platform 121 of the processing station 12, where one or more parts 20.1, 20.2 are heated to their processing temperature and processed by applying pressure. At least a part of the heating platform 121 includes a heating element configured to heat up to about 300 °C and rapidly transfer heat to the parts 20.1 and 20.2. Pressure is applied by a press tool 120 included in the processing station 12, which is configured and arranged to apply force to the parts 20.1 and 20.2 held by the carrier 200 by lowering the movable insert members 120.1 and 120.2 respectively associated with each of the parts 20.1 and 20.2. Optionally, instead of comprising the movable insert members 120.1 and 120.2 associated with each of the parts 20.1 and 20.2, the press tool 120 comprises a single movable insert member having a large surface configured to descend onto all the parts held on the part carrier 200 so as to apply pressure to all the parts at once. The movable insert member may be any kind of solid means movable along one direction, configured and arranged to receive a force or pressure at one end and transmit the force or pressure to an element arranged at the other end. After processing, the part carrier 200 is transferred by the transfer device 14 onto the support platform 131 of the cooling station 13, where one or more processed parts 20.1 and 20.2 are cooled. Finally, the part carrier 200 holding one or more parts 20.1 and 20.2 is transferred outside the processing device 10 by the transfer device 14 for further handling.

[0028]

[0027] FIG. 2A shows a schematic perspective view of the component carrier 200 used in the component processing apparatus 10. FIG. 2B shows a cross-sectional view of the component carrier 200 of FIG. 2A with components attached. The cross-section shown in FIG. 2B is obtained by projecting the component carrier 200 of FIG. 2A onto the plane B in the mounting configuration.

[0029]

[0028] The component carrier 200 includes a component support portion 210 having a substantially flat upper surface 210a facing in a first direction A1 toward the press tool 120 when the component carrier 200 is at the processing station 12, and a bottom surface 210b facing in a second direction A2 opposite to the first direction A1.

[0030]

[0029] Positioning openings 213 that respectively define the component positions are formed in the upper surface 210a of the component support portion 210 so as to communicate the upper surface 210a and the bottom surface 210b of the component support portion 210. The component carrier 200 is configured to carry components corresponding to each component position.

[0031]

[0030] When each component is carried on the component carrier, it is exposed on the upper surface 210a of the component support portion 210, and when the component carrier 200 is at the processing station 12, that is, during the processing of the component 20, the insert member of the press tool 120 can approach the component and apply a force to the component.

[0032]

[0031] The component carrier 200 further includes a movable pedestal 212 slidably mounted in the positioning opening 213. The movable pedestal 212 is configured to move along a line A perpendicular to the upper surface 210a.

[0033]

[0032] The movable pedestal 212 is made of a thermally conductive material and is configured to contact or separate from the component 20 during different processing stages of the component. Further, the lower end 212b of each movable pedestal 212 facing the second direction A2 is configured to contact a heat source attached to one or more stations of the processing apparatus 10, that is, the lower end 212b of each movable pedestal 212 is configured to contact the preheating platform 111 of the preheating station 11 or the heating platform 121 of the processing station 12.

[0034]

[0033] When the movable pedestal 212 contacts the heat source and also contacts the component, heat is transferred to the component 20 by contact, similar to when the component carrier 200 is at the processing station 12. Conversely, when the movable pedestal 212 contacts the heat source but does not contact the component, heat is transferred to the component 20 by radiation or convection, similar to when the component carrier 200 is at the preheating station 11.

[0035]

[0034] The movable pedestal 212 is further configured to carry the component 20 at the upper end 212a of the movable pedestal 212 while the component 20 is not in contact with the component support portion 210, that is, during processing at the processing station 12 of the processing apparatus 10. The function of the movable pedestal during the entire processing of the component will be described in detail later.

[0036]

[0035] FIG. 3A shows a schematic perspective view of a component carrier 200 used in a component processing apparatus 10 according to various examples of the present invention. FIG. 3B shows a cross-section of the component carrier 200 of FIG. 3A obtained by projecting the component carrier 200 of FIG. 3A onto plane B in the mounting configuration.

[0037]

[0036] The component carrier 200 includes a component support portion 210 similar to the component support portion 210 of the component carrier 200 in FIGS. 2A and 2B. Regarding the component support portion 210 in FIGS. 2A and 2B, the component support portion 210 of this embodiment further includes a receiving recess 211 formed on the upper surface 210a of the component support portion 210. Optionally, the upper surface 210a completely surrounds the receiving recess 211 as shown in FIGS. 3A and 3B.

[0038]

[0037] Similar to the component carrier 200 of FIGS. 2A and 2B, the movable pedestal 212 is slidably attached to a positioning opening 213 formed in the bottom surface 211a of the receiving recess 211. For a detailed description of the component carrier 200 and its functions, refer to the description of the component carrier 200 disclosed in connection with FIGS. 2A and 2B.

[0039]

[0038] In one embodiment, the component support portion 210 of FIGS. 3A and 3B is configured to receive a support member 220 in the bottom surface 211a of the receiving recess 211.

[0040]

[0039] The support member 220 is a substantially flat element configured to carry one or more components 20 and is configured to fit into the receiving recess 211 of the component support portion 210. One or more receiving openings 221 are formed in the support member 220 corresponding to the component positions defined by the positioning openings 213 of the component support portion 210.

[0041]

[0040] When the support member 220 is fitted into the receiving recess 211, the position of the receiving opening 221 corresponds to the position of the positioning opening 213 formed in the bottom surface 211a of the receiving recess 211, i.e., the component position. In this embodiment, the components are carried at the positions of the receiving openings 221 of the support member 220, i.e., each receiving opening 221 of the support member 220 defines a component position for carrying one component.

[0042]

[0041] Optionally, the component 20 is carried on support protrusions 222 that project towards the inside of each receiving opening 221. The support protrusions 222 are typically arranged corresponding to the four edges of the receiving opening 221. However, those skilled in the art will understand that the protrusions can be formed at any position within the associated receiving opening without changing the scope of the present invention.

[0043]

[0042] The holding protrusion 222 is configured such that when the holding member 220 is fitted into the receiving recess 211 of the component support portion 210, the height of the held component measured along the axis A does not exceed the height of the upper surface 210a of the component support portion 210.

[0044]

[0043] By using the holding member 220 to hold the component 20, more accurate and stable positioning of the component on the component carrier 200 becomes possible.

[0045]

[0044] In another embodiment, the component carrier 200 of FIGS. 3A and 3B further includes a downward holding mask 230 configured to be attached to the upper surface 210a of the component support portion 210. The downward holding mask 230 includes one or more mask openings 231 configured to allow the insert member of the press tool 120 to approach and apply force to the component when the component carrier 200 is within the processing station 12, i.e., during processing of the component.

[0046]

[0045] When the downward holding mask is attached to the upper surface 210a of the component support portion 210, the position of the one or more mask openings 231 corresponds to the component position defined by the positioning opening 213 formed in the bottom surface 211a of the receiving recess 211.

[0047]

[0046] The downward holding mask 230 guides the insert member of the press tool 120 to approach and apply force to the component 20. The presence of the downward holding mask 230 also prevents force from being applied to the component when the component carrier 200 is misaligned with the press tool 120 of the processing station 12. In fact, if the mask opening 231 is not aligned with the insert member of the press tool 120 due to misalignment of the component carrier 200 when provided in the processing station 12 of the processing apparatus 10, the upper surface of the downward holding mask 230 functions as a stop element against the movement of the insert member towards the component 20 to be processed.

[0048] When the holding member 220 is used to hold a component, when the downward holding mask 230 is attached to the upper surface 210a of the component support portion 210 and thereby covers the holding member 220 fitted in the receiving recess 211, the weight of the downward holding mask 230 prevents the holding member 220 from moving along the vertical direction A. To provide further stability to the holding member 220, the downward holding mask 230 may be fixed to the component support portion 210 by screws, bolts or any other suitable fastening means.

[0049] When the component carrier 200 including the component support portion 210, the holding member 220 and the downward holding mask 230 is in the mounting configuration, the mask opening 231 of the downward holding mask 230, the receiving opening 221 of the holding member 220, and the positioning opening 213 of the component support portion 210 are aligned so that their positions substantially coincide.

[0050] FIG. 4A shows a schematic perspective view of a component carrier 200 used in the component processing apparatus 10 according to various examples of the present invention. FIG. 4B shows a cross-section of the component carrier 200 of FIG. 4A obtained by projecting the component carrier 200 of FIG. 4A onto the plane B in the mounting configuration. The component carrier 200 of FIGS. 4A and 4B is the same as the component carrier 200 of FIGS. 3A and 3B referred to.

[0051] In addition to the features of the component carrier 200 of FIGS. 3A and 3B, the component carrier 200 of FIGS. 4A and 4B is formed on the bottom surface 211a of the receiving recess 211 and further includes a recess gas inlet 214 configured to allow introduction of a gas, usually nitrogen, N 2 and other inert gases into the receiving recess 211.

[0052] Also, a recess gas outlet 215 is formed on the bottom surface 211a of the receiving recess 211 and is configured to allow extraction of gas from the receiving recess.

[0053]

[0052] The recess gas inlet 214 is provided on the first side surface 200a of the component support portion 210, the recess gas outlet 215 is provided on the second side surface 200b of the component support portion 210, and the first side surface 200a faces the second side surface 200b. Optionally, the recess gas inlet and / or the recess gas outlet includes a plurality of gas inlet nozzles and / or gas outlet nozzles (not shown) distributed along the side surface of the bottom surface 211a of the receiving recess 211.

[0054]

[0053] The component support portion 210 can further include a carrier gas inlet connection portion 216 and a carrier gas outlet connection portion 217 that are disposed on the upper surface 210a of the component support portion 210 and are configured to be connected to the gas source and the gas discharge port of the processing apparatus 10, respectively.

[0055]

[0054] The carrier gas inlet connection portion 216 is provided on the first side surface 200a of the component support portion 210, and the carrier gas outlet connection portion 217 is provided on the second side surface 200b of the component support portion 210. Those skilled in the art will understand that in alternative embodiments, the carrier gas inlet connection portion 216 and the carrier gas outlet connection portion 217 can be disposed on the bottom surface 210b of the component support portion without changing the scope of the present invention, and that the carrier gas inlet connection portion 216 and the carrier gas outlet connection portion 217 can be disposed on the second side surface 200b and the first side surface 200a of the component support portion 210, respectively. Further, the number of the carrier gas inlet connection portions 216 and the number of the carrier gas outlet connection portions 217 are not limited to one, as shown in FIGS. 4A and 4B.

[0056]

[0055] One or more gas ducts 218 formed within the component support portion 210 are configured to provide a fluid connection between the carrier gas inlet connection portion 216 and the recess gas inlet 214, and between the recess gas outlet 215 and the carrier gas outlet connection portion 217. When gas is introduced into the carrier gas inlet connection portion 216, the gas flows through the gas duct 218 and enters the receiving recess 211 through the recess gas inlet 214 as a gas flow (not shown) to the gas outlet 215 through the receiving recess. The gas flow then exits the receiving recess 211 through the recess gas outlet 215 and flows through the gas duct 222 towards the carrier gas outlet connection portion 217.

[0057]

[0056] To confine the gas within the receiving recess 211, a gas-impermeable foil, sheet or film 250, such as Teflon, is provided and mounted on the upper surface 210a of the component support portion 210 to completely cover the component carrier 200 or ultimately the component 20 carried on the carrier member 220.

[0058]

[0057] When the component carrier 200 includes a downward holding mask 230, the downward holding mask is further configured to hold a gas-impermeable foil, sheet or film 250, such as Teflon, such that the gas-impermeable foil, sheet or film 250 completely covers the component carried on the component carrier or ultimately the carrier member 220. When the downward holding mask 230 is mounted on the component support portion 210, the gas-impermeable foil, sheet or film is clamped between the downward holding mask 230 and the upper surface 210a of the component support portion 210. In this case, the gas-impermeable foil, sheet or film 250 and the downward holding mask 230 itself function as a sealing element to prevent leakage of the gas introduced into the receiving recess 211. Further, the gas is confined within the receiving recess 211 by a movable pedestal 212 attached to the positioning opening 213 of the component support portion.

[0059]

[0058] Since the component 20 is not sealably supported on the component carrier 200 or ultimately on the support member 220, i.e., on the support protrusion 222, the gas supplied to the receiving recess 211 freely circulates throughout the periphery of the component, i.e., within the space included between the component and the sealing foil, film or sheet 250, and within the space included between the component and the movable pedestal 212.

[0060]

[0059] The gas is supplied to the component before the component carrier 200 enters the processing station 12, i.e., when the movable pedestal 212 and the component 20 are not in contact with each other. Thus, it is possible to create an atmosphere mainly composed of an inert gas throughout the periphery of the component 20 by the inert gas flowing from the recess gas inlet 214 to the recess gas outlet 215. Furthermore, due to the presence of the inert gas flow, it is possible to extract oxygen and impurities that can adversely affect the normal processing of the component 20 and that can be harmful to the environment outside the component carrier 200.

[0061]

[0060] FIGS. 5A and 5B show cross-sections of the component carrier 200 shown in FIG. 4B during the preheating stage and the processing stage of the process, respectively. In FIG. 5A, the component carrier 200 is provided on the preheating platform 111 of the preheating station 11, and in FIG. 5B, the component carrier 200 is provided on the heating platform 121 of the heating station 12.

[0062]

[0061] In a method for processing a component, one or more components 20 are provided on the component carrier 200. Each component is arranged at a component position corresponding to the associated positioning opening 213 of the component support 210.

[0063]

[0062] Optionally, one or more components 20 are provided on the support member 220 of the component carrier 200. Each component is arranged at a component position corresponding to the associated receiving opening 221 of the support member 220. If the support protrusion 222 is present, the component is provided on the support protrusion 222. Then, the support member 220 is provided on the receiving recess 211 of the component support 210.

[0064]

[0063] When the component is supported by either the component carrier 200 or the support member 220, a gas-impermeable foil, sheet or film 250 is provided and attached to the upper surface 210a of the component support portion 210 so as to completely cover the component 20.

[0065]

[0064] Optionally, a downward holding mask 230 is provided on the gas-impermeable foil, sheet or film 250 and finally fixed on the upper surface 210a of the component support portion 210 by fastening means, i.e., screws, bolts, etc. The weight of the downward holding mask 230 and / or the fastening of the downward holding mask 230 to the component support portion 210, and the presence of the sealing foil, film or sheet 250 provide sealing properties to the receiving recess 211.

[0066]

[0065] Alternatively, the sealing property of the receiving recess 211 is ensured by the presence of a sealing element, i.e., an O-ring, etc., extending along the entire circumference of the upper surface 210a between the upper surface 210a of the component support portion 210 and the gas-impermeable foil, sheet or film 250.

[0067]

[0066] When the component carrier 200 that supports the component 20 is attached, the component carrier 200 is provided to different stations of the processing apparatus 10 for processing as described above.

[0068]

[0067] During the entire process, the component carrier 200 creates an inert gas atmosphere and a continuous gas flow F around the product by being continuously connected to a gas source and a gas outlet. This connection is maintained even during the transfer between the stations of the processing apparatus 10. The inert gas, usually nitrogen N 2 is introduced from the gas source through the carrier gas inlet connection portion 216 into the receiving recess 211 and extracted from the receiving recess 211 through the carrier gas outlet connection portion 217. In this way, as described above, the inert gas flows in the gas duct 218 to the recess gas inlet 214 and thus enters the receiving recess 211.

[0069]

[0068] The gas flow passes over, under, and along component 20, carrying away impurities generated by the component and removing oxygen present in the receiving recess 211. The gas flow exits the receiving recess 211 through the recess gas outlet 215 and flows towards the carrier gas outlet connection 217.

[0070]

[0069] As a result, during all processing steps and during transfer between stations of the processing apparatus 10, the atmosphere surrounding the component mainly consists of an inert gas, namely N 2 which contains. This prevents oxidation of the (metal) component part and can remove impurities released from the component itself.

[0071]

[0070] When the component carrier 200 is attached and the gas connection is established, the component carrier 200 is transferred to the preheating station 11 of the processing apparatus 10. As a result, the bottom surface 210b of the component support 210 is placed on the preheating plate 111 of the preheating station 11 as shown in FIG. 5A.

[0072]

[0071] The preheating plate 111 includes at least one preheating plate opening 112 arranged corresponding to the positioning opening 213 of the component support 210. The at least one preheating plate opening 112 is configured to enable the movable pedestal 212 to remain non - contact with the component and to enable contact between the lower end 212b of the movable pedestal 212 and the heating element 113 arranged below the preheating plate 111.

[0073]

[0072] The heating element 113 is configured to heat from about 250°C to 300°C and transfer heat to the thermally conductive movable pedestal 212. Optionally, the heating element 113 is configured to heat to a temperature lower than 250°C to 300°C to prevent the thermally conductive movable pedestal 212 from reaching a temperature higher than the temperature required in the preheating stage. As a result, when the component carrier 200 is carried on the preheating plate 111, a space is defined between each movable pedestal 212 and the component 20 associated therewith, and the movable pedestal 212 is heated to a temperature lower than the temperature of the heating element 113 according to the time spent by the component carrier 200 in the preheating station 11. Heat is transferred to the component 20 by convection and / or radiation from the movable pedestal 212, and the component 20 is heated to a desired predetermined temperature lower than the temperature of the movable pedestal / heating element.

[0074]

[0073] When the component 20 reaches a predetermined temperature, the component carrier 200 is transferred to the processing station, and as a result, the bottom surface 210b of the component support portion 210 is provided on the heating plate 121. The heating plate 121 includes a heating portion 121a configured to heat from about 250°C to 300°C. The heating plate 121 is configured such that when the component carrier 200 is provided at the processing station 12, the position of the heating portion 121a of the heating plate 121 corresponds to the position of the movable pedestal 212 of the component carrier 200.

[0075]

[0074] When the component carrier 200 is provided on the heating plate 121, as shown in FIG. 5B, the movable pedestal 212 is pushed toward and contacts the component 20. In the movement toward the component 20, the movable pedestal 212 contacts the component 20, and then the component is slightly lifted and supported by the upper end 212a of the movable pedestal 212. The thermally conductive movable pedestal 212 contacts the heating portion 121a of the heating plate 121 and is rapidly heated to the temperature of the heating portion 121a of about 250°C to 300°C, and heat is transferred to the component 20 by the contact, and the component 20 rapidly reaches the same temperature.

[0076]

[0075] To process the components, pressure is applied to the components by a press tool 120 included in the processing station 12 and configured and arranged to lower and contact a movable insert member with each component and apply pressure to the component by applying pressure. The component 20 is maintained under pressure and temperature conditions until the component is processed. The component generally includes two elements, such as a device, such as a semiconductor device like a power IC, and its substrate or carrier, and the two elements are bonded during sintering by applying pressure and temperature to a sintered material disposed between the two elements.

[0077]

[0076] After processing, the component carrier 200 is transferred to the cooling station 13 for cooling. Thereafter, the component carrier 200 is transferred outside the processing apparatus 10 for further handling.

[0078]

[0077] FIGS. 6A and 6B show perspective views of a component carrier 200 used in the component processing apparatus 10. For clarity, in FIG. 6A, the downward holding mask 230 and the foil 250 are shown separately from the rest of the component carrier 200, and FIG. 6B shows the component carrier 200 with the downward holding mask 230 attached. FIGS. 7A and 7B show cross-sections of the component carrier 200 of FIGS. 6A and 6B along different axes.

[0079]

[0078] The functions and features of the component carrier 200 in FIGS. 6A, 6B, 7A and 7B are the same as the functions and features of the component carrier 200 shown in the referenced FIGS. 4A and 4B.

[0080]

[0079] The component carrier 200 in FIGS. 6A and 6B includes a plurality of members stacked on top of each other, namely a component support portion 210, a carrier member 220, and a downward holding mask 230. The component support portion 210, the carrier member 220, and the downward holding mask 230 may be held together by their weights or fixed to each other by fastening means 207, such as screws or bolts, when the component carrier 200 is in the mounted configuration.

[0081]

[0080] The component support portions 210 of the component carrier 200 in FIGS. 6A, 6B, 7A, and 7B further include additional first lateral regions 211b.1 and second lateral regions 211b.2 on the first side surface 200a and the second side surface 200b of the component carrier 200, respectively. The additional first lateral region 211b.1 and the second lateral region 211b.2 are recessed with respect to the upper surface 210a of the component support portion 210 and are configured to enable the attachment of the carrier gas inlet connection portion and the carrier gas outlet connection portion. The component carrier 200 includes a first carrier gas inlet connection portion 216 and a first carrier gas outlet connection portion 217 provided in the proximal first lateral region 211b.1 of each of the first portion 200a and the second portion 200b of the component carrier 200. A second carrier gas inlet connection portion 216' and a second carrier gas outlet connection portion 217' are provided in the proximal second lateral region 211b.2 of each of the second portion 200b and the first portion 200a of the component carrier 200.

[0082]

[0081] Similar to the description of the component carrier 200 in FIGS. 4A and 4B, the first carrier gas inlet connection portion 216 and the second carrier gas inlet connection portion 216' are configured to enable the introduction of gas into the receiving recess 211, and the first carrier gas outlet connection portion 217 and the second carrier gas outlet connection portion 217' are configured to enable the extraction of gas from the receiving recess 211. The first and second carrier gas inlet connection portions 216, and the first and second carrier gas outlet connection portions 217 are each configured to connect to a gas source and a gas discharge port.

[0083]

[0082] In FIGS. 6A and 6B, the component carrier 200 is configured to carry eight components, that is, the carrying member 220 includes eight receiving openings 221, the component support portion 210 includes eight positioning openings 213 and eight movable pedestals 212, and the downward holding mask 230 includes eight mask openings 231. However, those skilled in the art will understand that a number of components to be processed different from eight can be implemented in the component carrier 200 without changing the scope of the present invention.

[0084]

[0083] The movable pedestal 212, which is made of a thermally conductive material and includes an upper part 212a and a lower part 212b, is slidably mounted within each positioning opening 213 of the component support part 210. Regarding the function (i.e., movement) and features of the movable pedestal 220, reference is made to the description made in connection with any of the previous figures. The upper end 212a of the movable pedestal is larger in dimension than the associated positioning opening, but the lower end 212b of the movable pedestal 212 is configured to fit and slide within the associated positioning opening 213. The upper end 212a of the movable pedestal 212 faces the component carried by the supporting protrusion 222. When the movable pedestal moves away from the component 20, the upper end 212a of the movable pedestal 212 engages the bottom surface 211a of the receiving recess 211 surrounding each positioning opening 213, as shown in FIGS. 7A and 7B, thereby preventing the movable pedestal 212 from slipping out of the associated positioning opening 213.

[0085]

[0084] The component support part 210 optionally includes a support element 224 provided on the bottom surface 210b of the component support part 210 and configured to support the component carrier 200 when the component carrier 200 is provided on the surface. Further, the first and second carrier gas inlet connection parts 216, and the first and second carrier gas outlet connection parts 217 further include a mechanical valve 260 (only shown for the gas outlet connection part) that enables control of the gas flow to and / or from the receiving recess 211. When the component carrier 200 is not connected to a gas source or a gas discharge port, the valve spring 261 maintains the valve 260 in the closed position, thus preventing the passage of gas to and / or from the receiving recess 211. Conversely, when the component carrier 200 is connected to a gas source or a gas discharge port, the valve spring 261 is pushed down, thereby opening the valve 260 and thus enabling the passage of gas to and / or from the receiving recess 211. The component carrier 200 is connected to a gas source or a gas discharge port when the gas source or the gas discharge port of the processing apparatus 10 is respectively connected to the carrier gas inlet / outlet.

[0086] Optionally, the gas inlet 216 has inlet nozzles on both the upper surface 210a of the component support 210 and the bottom surface 210b of the component support 210. In this case, the valve 260 is used to determine whether the gas is allowed to pass through the nozzles located on the upper surface 210a or the bottom surface 210b of the component support 210. The mechanism of the function of the valve 260 for controlling whether the gas flow is allowed to pass through the nozzles located on the upper surface 210a or the bottom surface 210b of the component support 210 is the same as the function of the valve 260 described above.

[0087] Similar to the component carrier 200 of FIGS. 4A and 4B, a sealing foil, film or sheet of a gas-impermeable material 250, such as Teflon, is clamped between the downward holding mask 230 and the upper surface 210a of the component support 210. With respect to the downward holding plate 230 disclosed in connection with FIGS. 4A and 3B, the downward holding mask 230 further includes positioning pins 233 that project from the bottom surface 230b of the downward holding plate 230 towards the upper surface 210a of the component support 210. The positioning pins 233 are configured to fit into positioning holes 223 formed in the upper surface 210a of the component support 210, enabling accurate positioning of the downward holding plate 230 on the component support 210. The downward holding mask 230 has a substantially planar shape including a curved edge portion 234 that facilitates positioning of the downward holding mask 230 on the component support 210 substantially around the entire perimeter.

[0088] The component carriers 200 of FIGS. 6A and 6B are used in the component processing method described in connection with FIGS. 1, 5A and 5B, which are referenced.

Claims

1. In a component processing apparatus such as a press sintering apparatus, a component carrier (200) provided with a component support part (210) for carrying one or more components (20) to be processed, wherein the component support part is, one or more positioning openings (213) formed through the component support part from the upper surface (210a) to the bottom surface (210b) of the component support part, each positioning opening defining a component position for holding a component to be processed, and the component held in the component position being exposed on the upper surface of the component support part, the positioning openings (213); one or more movable pedestals (212) respectively associated with the one or more positioning openings, each movable pedestal, during operation, moves along direction A between the upper surface and the bottom surface of the component support part for the purpose of carrying and thermally contacting each component during processing of the component, and is received in the associated positioning opening to contact and disengage from the component held in the component position defined by the positioning opening at the upper end (212a) of the movable pedestal, the lower end (212b) of each pedestal is exposed on the bottom surface (210b) of the component support part for thermally contacting a heat source for heating the pedestal and each respective component when contacting the pedestal during operation, the component carrier (200).

2. The component support part includes a receiving recess (211) associated with the positioning opening (213), the receiving recess being recessed with respect to the upper surface of the component support part, and the one or more positioning openings being disposed within the receiving recess, the component carrier according to claim 1.

3. The upper surface of the component support part completely surrounds the receiving recess, the component carrier according to claim 2.

4. The component support part is a supporting member (220), configured to fit into the receiving recess, and includes one or more receiving openings (221) corresponding to the one or more component positions when the supporting member is disposed within the receiving recess, each receiving opening holding one of the one or more components and being configured such that the upper end of each respective movable pedestal can contact the component, the component carrier according to claim 3.

5. The component carrier according to claim 4, wherein the carrier member includes a carrier element (222) configured to project toward the inside of each receiving opening and carry the one or more components.

6. The component carrier further includes a downward holding mask (230) configured to be attached to the upper surface of the component support portion, the downward holding mask including one or more mask openings (231) configured to allow access to the components, and the mask openings corresponding to positions relative to the component positions defined by the positioning openings of the component support portion. The component carrier according to any one of claims 2 to 5.

7. The component carrier according to claim 6, wherein the downward holding mask further includes a positioning pin (233) configured to project from the bottom surface (230b) of the downward holding mask and fit into a positioning hole (223) formed in the upper surface of the component support portion.

8. A gas inlet (214) and a gas outlet (215) are provided in the receiving recess, and the gas inlet and the gas outlet are each fluidly connected to a gas inlet connection portion (216) and a gas outlet connection portion (217) via one or more gas ducts (218), The gas inlet connection portion is configured to be connected to a gas source, and the gas outlet connection portion is configured to be connected to a gas discharge port, so as to provide a continuous gas flow to the one or more components. The component carrier according to any one of claims 2 to 7.

9. The component carrier is configured to hold a gas-impermeable foil, sheet or film (250) that completely covers the one or more carried components and forms a closed void for the one or more components. The component carrier according to any one of claims 3 to 8.

10. The component carrier according to claim 9, wherein when the downward holding mask is attached to the upper surface of the component support portion, the gas-impermeable foil, sheet or film is clamped between the downward holding mask and the upper surface of the component support portion.

11. Optionally, in a component processing apparatus such as a press sintering apparatus according to any one of claims 1 to 10, a component carrier (200) for carrying one or more components (20) to be processed, wherein the component carrier is A component support part (210), comprising one or more positioning openings (213) formed on the upper surface (210a) of the component support part within the component support part, each positioning opening defining a component position within the positioning opening for holding a component to be processed, and the component held at the component position within the positioning opening being exposed on the upper surface of the component support part, the component support part (210); Two gas inlet connection parts (216), in fluid communication with the positioning openings of the component support part for passing gas from a gas source connected to one of the gas inlet connection parts during use to the positioning openings for the purpose of purging the positioning openings, each gas inlet connection part being configured to be closed when not connected to the gas source, the two gas inlet connection parts (216); A component carrier (200) comprising the above.

12. The component carrier according to claim 11, wherein the component support part comprises a gas duct (218) connected to each positioning opening to provide a fluid connection between the gas inlet connection part and the positioning opening.

13. The component carrier according to claim 11 or 12, wherein the component support part comprises two gas outlet connection parts (217), in fluid communication with the positioning openings of the component support part for passing gas from the positioning openings to a gas outlet connected to one of the gas outlet connection parts during use for the purpose of purging the positioning openings, each gas outlet connection part being configured to be closed when not connected to the gas outlet.

14. A method for processing a component in a processing apparatus (10), comprising using the component carrier according to any one of claims 1 to 13.

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