Cooling device for cooling an electrical and / or electronic assembly

Abstract

A cooling device for cooling an electrical and / or electronic assembly (2), comprising a cover plate (3) and a base plate (4), the base plate (4) being formed as a deep-drawn part having a recess (40), the cover plate (3) and the base plate (4) being arranged such that a cooling channel (5) is formed between the cover plate (3) and the base plate (4) by the recess (40), the cover plate (3) and the base plate (4) being connected to each other in a contact area (8) outside the recess (40), a cooling fluid stream of a cooling fluid being able to flow through the cooling channel (5), the cooling device (1) further comprising at least one turbulator (6) arranged in the recess (40) of the cooling channel (5), the turbulator (6) abutting against a bottom surface (44) within the recess (40) of the base plate (4), the bottom surface (44) facing the cover plate (3), with regard to the cooling device, it is proposed that the base plate (4) has a profiling (7) in a curved region (43) at the edge of the bottom surface (44).

Description

Technical Field

[0001] The present invention relates to a cooling device for cooling an electrical and / or electronic assembly, and to an electronic device configuration.

Background Art

[0002] In a hybrid vehicle or an electric vehicle, a power module such as an inverter structure or a converter structure is used. For example, an inverter is used to operate an electric machine and supply a phase current for the electric machine. The power module can include, for example, a carrier substrate having conductor tracks, on which power semiconductors are arranged, for example, and the power semiconductors together with the carrier substrate form an electronic unit. During operation, the electronic unit generates heat, which must be dissipated to a cooling device. For this purpose, the electronic unit is thermally connected to the cooling device. It is known that the cooling device is provided with cooling channels through which a cooling fluid can flow and the cooling fluid dissipates heat from a heat sink. A so-called turbulator can be provided in the cooling channels, and the turbulator serves to improve the heat dissipation from the cooling device to the cooling fluid flowing through the cooling device. The turbulator generates a turbulent flow and enlarges the cooling surface.

Summary of the Invention

[0003] According to the present invention, a cooling device for cooling an electrical and / or electronic assembly is proposed. The cooling device includes a cover plate and a base plate, the base plate is formed as a deep-drawing part having a recess, the cover plate and the base plate are arranged such that a cooling channel is formed between the cover plate and the base plate by the recess, the cover plate and the base plate are connected to each other in a contact area outside the recess, a cooling fluid stream of a cooling fluid can flow through the cooling channel, the cooling device further includes at least one turbulator arranged in the recess of the cooling channel, the turbulator abuts against the bottom surface in the recess of the base plate, and the bottom surface faces the cover plate. The base plate has a profiling part in a curved area at the edge of the bottom surface. [Advantages of the present invention] Compared with the prior art, the cooling device having the features of the independent claims has particularly high efficiency with respect to the cooling of the electrical and / or electronic assembly to be cooled. By profiling, the bypass flow through the bypass area at the edge of the turbulator can be blocked or significantly restricted. By profiling, the recess of the base plate is enlarged. By profiling the curved area at the edge of the bottom surface, the recess of the curved area at the edge of the bottom surface is enlarged. The rounded edge of the bottom surface due to the deep drawing of the base plate loses its roundness by profiling. Thereby, the turbulator can occupy a larger area in the recess, and thus in the cooling channel. Therefore, the deep-drawn base plate is subsequently adapted to the shape of the turbulator in order to keep the distance between the turbulator and the base plate, and thus the bypass flow, as small as possible. Therefore, the turbulator enters the profiling part and occupies an advantageously large area in the cooling channel. Therefore, the lateral bypass area of the turbulator is advantageously reduced. Thereby, the bypass flow through the bypass area at the edge of the turbulator can be blocked or significantly restricted.

[0004] Further advantageous embodiments and developments of the invention are made possible by the features presented in the dependent claims.

[0005] According to an advantageous exemplary embodiment, it is contemplated that the radius in the curved region of the base plate at the edge of the bottom surface is reduced by the coining portion. Thus, the radius of the curved region at the edge of the bottom surface inside the cooling channel can advantageously be made small, and by coining inside the cooling channel, the curved region can be formed, for example, substantially at a right angle. Thus, the turbulator can advantageously penetrate deeply into the curved region and advantageously reduce the bypass flow in the bypass region.

[0006] According to an advantageous exemplary embodiment, it is contemplated that the coining portion forms a particularly right-angled shape in the curved region at the edge of the bottom surface. Thus, a turbulator that itself has a curved portion in a region facing the curved region of the base plate, for example, can advantageously penetrate deeply into the coining portion and the bypass region.

[0007] According to an advantageous exemplary embodiment, a solder material is provided between the turbulator and the base plate in the coining portion, and it is contemplated that the turbulator is connected to the base plate by the solder material in the coining portion. Advantageously, the solder material can be easily drawn into the minimized gap between the turbulator and the base plate in the coining portion by capillary action. Thus, advantageously, the bypass flow between the turbulator and the base plate in the coining portion can be reduced.

[0008] The cooling device according to any one of claims 1 to 4, characterized in that the gap between the turbulator and the base plate in the coining portion is completely filled with a solder material. Thus, the region between the turbulator and the bottom region in the coining portion is completely closed and blocked with respect to the bypass flow of the cooling fluid bypassing the turbulator. The solder material can advantageously be easily drawn into the gap by capillary action.

[0009] In a region where the cover plate is separated from the base plate, a solder material is provided between the cover plate and the base plate, and / or in a region outside the embossed portion, a solder material is provided between the turbulator and the base plate. The cooling device according to any one of claims 1 to 5, characterized in that. Therefore, for example, an extra solder material in the cooling device that is not required for the mutual connection of the base plate, the cover plate, and the turbulator further closes the bypass region in the cooling channel. Therefore, more cooling fluid flows through the turbulator, and less cooling fluid bypasses the turbulator, and the cooling device improves the efficiency of cooling an electrical and / or electronic assembly. Here too, the solder material can advantageously be easily drawn into the corresponding gap by capillary action.

[0010] The turbulator is made of a bent sheet metal, and the sheet metal has a curved portion having the radius of the turbulator in the region of the turbulator facing the curved region of the base plate. The cooling device according to any one of claims 1 to 6, characterized in that. Such a turbulator can advantageously be easily manufactured, for example, by cutting and forming the sheet metal, such as punching and bending, in the same way as the cover plate and the base plate.

[0011] According to an advantageous exemplary embodiment, it is contemplated that the radius of the curved region of the base plate at the edge of the bottom surface is smaller than the radius of the turbulator in the region of the turbulator facing the curved region of the base plate. Therefore, the turbulator can advantageously penetrate deeply into the embossed portion, contact the base plate in the bottom surface and side surface regions of the base plate, and / or be fixed to the base plate, for example, soldered.

[0012] The cooling device according to any one of claims 1 to 8, wherein the profiling section is recessed with respect to the bottom surface at the edge of the bottom surface. Accordingly, a notch is punched in the bottom surface at the edge of the bottom surface. Thereby, advantageously, it is possible to prevent overlap between components and ensure that the turbulator can enter the profiling section. Accordingly, further, an enlarged gap can be formed between the turbulator and the base plate in the profiling section, and this gap can be advantageously well filled with a solder material.

[0013] Furthermore, this cooling device can be included in an electronic device configuration, which further includes at least one electrical and / or electronic assembly to be cooled, and the electronic components are arranged on a cover plate or a base plate.

[0014] Exemplary embodiments of the present invention are shown in the drawings and will be described in more detail in the following description.

Brief Description of the Drawings

[0015]

Figure 1

Figure 2

Figure 3

Modes for Carrying Out the Invention

[0016] FIG. 30 shows a cross-sectional view through an exemplary embodiment of an electronic device configuration 50. The electronic device configuration 50 includes a cooling device 1 and an electrical and / or electronic assembly on the cooling device 1. FIG. 32 shows an enlarged partial view of the exemplary embodiment of the cooling device 1 in FIG. 30. FIG. 33 shows a second exemplary embodiment of the cooling device 1.

[0017] The cooling device 1 is provided, for example, for cooling an electrical and / or electronic assembly 2 such as a power circuit. The electrical and / or electronic assembly 2 may be, for example, a power circuit such as an inverter structure or a converter structure of a hybrid vehicle or an electric vehicle. The electrical and / or electronic assembly 2 can be configured, for example, as a power module and includes, for example, a carrier substrate having conductor tracks, on which power semiconductors are arranged, for example, and the power semiconductors together with the carrier substrate form an electronic unit. During operation, the electrical and / or electronic assembly 2 generates heat, and this heat must be dissipated to the cooling device 1. For this purpose, the electrical and / or electronic assembly 2 is arranged on the mounting surface of the cooling device 1, for example, a cover plate 3 or a base plate 4. One or more layers can be arranged between the cooling device 1 and the electrical and / or electronic assembly 2 for fixing the electrical and / or electronic assembly 2 to the heat sink 1 and thermally connecting it. For example, a copper coating can be applied to the mounting surface of the cover plate 3 facing the electrical and / or electronic assembly 2. A plurality of electrical and / or electronic assemblies 2 can also be arranged, for example, side by side on the cover plate 3 of the cooling device 1. Thus, each electrical and / or electronic assembly 2 is thermally connected to the cooling device 1 and fixed to the cooling device 1.

[0018] The base plate 4 and the cover plate 3 form the outer wall of the cooling device 1. The base plate 4 forms the lower side of the cooling device 1. The cover plate 3 forms the upper side of the cooling device 1. The base plate 4 and the cover plate 3 can be made of, for example, a material having high thermal conductivity, such as a metal, such as aluminum. The base plate 4 and the cover plate 3 are made of sheet metal. The base plate 4 and / or the cover plate 3 each have, for example, a certain thickness. The base plate 4 and the cover plate 3 can have, for example, the same thickness. However, the base plate 4 and the cover plate 3 may have different thicknesses.

[0019] A recess 40 is formed in the base plate 4. Accordingly, the base plate 4 is substantially formed in a trough shape. The cover plate 3 is disposed on the base plate 4 such that the recess 40 of the base plate 4 is covered by the cover plate 3. The base plate 4 and the cover plate 3 are arranged relative to each other such that a cooling channel 5 is formed between the base plate 4 and the cover plate 3 by the recess 40. The cooling channel 5 extends between the base plate 4 and the cover plate 3. The base plate 4 and the cover plate 3 form walls that define the cooling channel 5. The base plate 4 is formed as a deep drawing part. For example, an edge 41 of the base plate 4 formed in one plane is connected to an edge 31 of the cover plate 3. The region where the base plate 4 is connected to the cover plate 3 is called a contact region 8. The edge 41 of the base plate 4 extends over the entire circumference of the recess 40 of the base plate 4. The edge 41 of the base plate 4 is placed, for example, directly on the edge 31 of the cover plate 3 or with an intermediate layer interposed therebetween. The edge 41 of the base plate 4 is firmly connected to the edge 31 of the cover plate 3, particularly by soldering. The edge 41 of the base plate 4 can also be connected to the edge 31 of the cover plate 3 directly or with one or more intermediate layers or intermediate elements interposed therebetween, and particularly can be soldered. The edge 41 of the base plate 4 is connected to the edge 31 of the cover plate 3, for example, by a brazing method. The edge 41 of the base plate 4 is completely connected to the edge 31 of the cover plate 3 over the entire circumference, particularly by soldering.

[0020] In the region of the recess 40, the base plate 4 is spaced apart from the cover plate 3, a cavity that can allow fluid to flow is formed between the base plate 4 and the cover plate 3, and the cooling channel 5 extends in the cavity. Here, like in this exemplary embodiment, the edge 41 of the base plate 40 can extend flatly in the first plane. Further, for example, the plate portion 42 of the base plate 40 that forms the bottom of the recess 40 can extend in a second plane that extends particularly parallel to the first plane. Thus, the edge 41 of the base plate 40 and the plate portion 42 of the base plate 4 are arranged planar and parallel to each other. The cover plate 3 can be formed, for example, planar or as a deep-drawn part. The recess 40, and thus the cooling channel 5, can be formed elongated with respect to the base plate 4, particularly at least partially rectangular. The cooling channel 5 extends at least partially along the longitudinal direction. Preferably, the cooling channel 5 has an elongated region that particularly has a rectangular geometry when viewed on the plate plane of the cover plate 3, and this region extends along the longitudinal direction defined particularly by a straight line.

[0021] Within the recess 40 of the base plate 4, the base plate 4 has a coining portion 7. In the coining portion 7, the base plate 4 is deformed by coining. The base plate 4 is coined inside the recess. The coining portion 7 is disposed at the edge of the bottom surface 44 of the base plate. The bottom surface 44 of the base plate 4 extends particularly flatly to the plate portion 42. The bottom surface 44 is the surface of the base plate 4 facing the cooling channel 5 and the cover plate 3. The bottom surface 44 forms the bottom of the cooling channel 5 in the base plate 4. The coining portion 7 is disposed at the edge of the bottom surface 44. The edge of the bottom surface 44 is a region where the base plate 4 is deformed from the plane of the bottom surface 44 in the direction of the cover plate 3. The edge of the bottom surface 44 is disposed within the curved region 43 of the base plate 4, and in the curved region 43, the base plate 4 is bent in the direction of the cover plate 3 at the edge of the planar plate portion 42. By the coining portion 7, the radius R4 of the curved region 43 inside the recess 40 is reduced compared to the radius of the curved region 43 before coining. The recess 40, and thus also the cooling channel 5, is enlarged within the curved region 43 by the coining portion 7. The coining portion 7 is coined, for example, as a substantially rectangular corner in the curved region 43. At the edge of the bottom surface 44, for example, a right-angled shape is coined in the curved region 43 of the base plate 4. Thus, the planar plate portion 42 transitions to the curved region 43 of the base plate 4 at an angle, particularly a right angle, at the edge of the bottom surface 44 inside the recess 40. The bottom surface 44 is disposed at an angle, particularly substantially at a right angle, with respect to the side surface connected to the bottom surface 44 inside the recess 40. The bending radius R4 of the base plate 4 between the bottom surface 44 and the side surface is reduced by the coining portion 7. By the coining portion 7, an angle, particularly a substantially right angle, is coined in the curved region 43 of the base plate 4. The coining portion 7 can be connected flatly to the bottom surface 44, for example, as in the first exemplary embodiment of the cooling device 1 in FIG. 2. Thus, the bottom surface 44 is expanded by the coining portion 7. However, the coining portion 7 can also be recessed with respect to the bottom surface 44 and formed, for example, as a notch at the edge of the bottom surface 44. This is shown in the second exemplary embodiment of the cooling device 1 in FIG. 3.

[0022] For example, an intermediate plate can also be arranged between the cover plate 3 and the base plate 4. For example, such an intermediate plate can provide an additional distance above the base plate 4 to adapt the height of the cooling channel 5. Alternatively, as in the illustrated exemplary embodiment, the cover plate 3 and the first plate portion 41 of the base plate 4 can also be in direct contact.

[0023] Furthermore, the cooling device 1 includes an inflow opening (not shown) through which a cooling fluid can be supplied to the cooling channel 5 of the cooling device 1. Furthermore, the cooling device 1 is provided with an outflow opening through which the cooling fluid can flow out of the cooling channel 5 and the cooling device 1. The cooling fluid can be, for example, water. The inflow opening and / or the outflow opening can be formed, for example, by the opening of the recess 40 of the base plate 4. The opening can be, for example, a through hole in the base plate 4. An inflow nozzle can also be arranged or formed at the inflow opening. Similarly, an outflow nozzle can be arranged or formed at the outflow opening. A cooling fluid stream of the cooling fluid can flow through the cooling channel 5 from the inflow opening to the outflow opening. The cooling fluid can flow into the cooling channel 5 through the inflow opening of the cooling device 1 and flow out of the cooling channel 5 of the cooling device 1 again through the outflow opening of the cooling device 1. The cooling channel 5 is formed to allow the cooling fluid to flow through the cooling device 1. The cooling channel 5 in the cooling device 1 extends from the inflow opening to the outflow opening within the cooling device 1. A cooling fluid stream of the cooling fluid can flow through the cooling channel 5 along the longitudinal direction from the inflow opening to the outflow opening.

[0024] The cooling device 1 further includes at least one turbulator 6. The turbulator 6 is disposed within the cooling channel 5. The turbulator 6 is disposed in a turbulator region 56 that extends along the longitudinal direction of the cooling channel 5. The turbulator 6 is disposed between the cover plate 3 and the base plate 4. The turbulator 6 can extend completely through the cooling channel 5 from the cover plate 3 to the base plate 4. In particular, the turbulator 6 is in indirect and / or direct heat transfer contact with the cover plate 3 and the base plate 4. The turbulator 6 is fixed to the cover plate 3 and / or the base plate 4, for example, by soldering. The turbulator 6 abuts against the base plate 4 at the bottom surface 44 and / or is connected to, in particular soldered to, the bottom surface 44. The turbulator 6 extends on the bottom surface 44. The turbulator 6 extends into the embossing portion 7. Through the turbulator 6, the cooling fluid flows longitudinally, for example, parallel to a plate portion 42 of the cover plate 3 and / or the base plate 4 that is formed in a planar shape. The turbulator 6 has a structure that increases the surface area, induces the flow, and transfers heat. The turbulator 6 is made of, for example, a metal with excellent thermal conductivity, such as aluminum. The turbulator 6 can also be provided with a coating, for example. The turbulator 6 can be formed as a structured plate, for example. In order to achieve the highest possible cooling efficiency, as large a portion as possible of the flow cross-section of the cooling channel 5 between the base plate 4 and the cover plate 3 is occupied by the turbulator 6. The turbulator 6 extends substantially planar-parallel to the cover plate 3 and / or to a planar plate portion 42 of the base plate 4, for example. The turbulator 6 has a substantially planar extent that is the same as the mounting surface of the cover plate 3 on which the electrical and / or electronic assembly 2 is disposed, for example.

[0025] The turbulator 6 is made of, for example, a single piece. The turbulator 6 is made of sheet metal by, for example, cutting and deforming, particularly punching and bending. The turbulator 6 is provided to generate a turbulent flow in the cooling fluid. The turbulator 6 is structured to generate a turbulent flow in the cooling fluid. In the turbulator 6, for example, a plurality of turbulent regions are formed at an angle with respect to the flow direction of the cooling fluid passing through the cooling channel 5, particularly the longitudinal direction. The turbulent regions serve to generate vortices in the cooling fluid flowing through the cooling channel 5. Thereby, heat can be dissipated particularly effectively. The turbulent regions can be formed, for example, in a wavy or zigzag shape, or can also be formed as convex and / or concave portions that are periodically repeated within the turbulator. The turbulent regions of the turbulator 6 can be formed, for example, by cutting and forming the sheet metal from which the turbulator 6 is made, such as punching and bending.

[0026] In order to achieve high cooling efficiency, as large a portion as possible of the flow cross-section of the cooling channel 5 is covered by the turbulator 6. Since the base plate 4 is a deep-drawing part, a drawing gradient and a radius at the edge of the recess 40 are required for the blanking process during deep drawing. These radii caused by deep drawing are reduced by the coining part 7. The turbulator 6 is arranged below the electrical and / or electronic assembly 2. At the edge of the cooling channel 5, a bypass region 55 is located laterally next to the turbulator 6 and between the turbulator 6, the base plate 4, and the cover plate 3. The bypass region 55 is located beside the electrical and / or electronic assembly 2 when viewed in the plane of the mounting surface for the electrical and / or electronic assembly 2. In the bypass region 55, the cooling channel 5 is formed to taper. In the bypass region 55, no vortex of the cooling fluid stream occurs. By means of the coining part 7, the turbulator 6 can enter the coining part 7 without changing its spread from the base plate 4 to the cover plate 3 and occupy the advantageously large portion of the cooling channel 5. In the region of the turbulator 6 facing the curved region 43 of the base plate 4, the turbulator 6 is bent and has a radius R6 of the turbulator. The radius R4 indicates the radius of the curved region 43 at the edge of the bottom surface 44. The radius R6 of the turbulator 6 is larger than the radius R4 of the curved region 43 at the edge of the bottom surface 44. Therefore, the turbulator 6 can enter deeply into the coining part 7 and occupy the advantageously large portion of the cooling channel 5.

[0027] As shown, the cooling device 1 can further provide solder material 20 at various locations. The solder material 20 can be drawn into narrow locations within the cooling device 1, for example, by capillary action. The solder material 20 can be disposed, for example, within and / or in the region of the swaging portion 7 between the turbulator 6 and the base plate 4. Here, for example, the gap between the turbulator 6 and the base plate 4, particularly within the swaging portion 7, can be filled with the solder material 20. Also, regions within the cooling device 1 where the cover plate 3 is spaced apart from the base plate 4 can be filled with the solder material 20. Further, the solder material 20 can be provided in the region between the base plate 4 and the turbulator 6 outside the swaging portion 7. The solder material 20 closes locations where the cooling fluid might flow around the turbulator 6. Thus, the bypass flow of the cooling fluid around the turbulator 6 is reduced or prevented, and the cooling efficiency of the electrical and / or electronic assembly 2 by the cooling device 1 is improved.

[0028] Of course, further exemplary embodiments, as well as combinations of the illustrated exemplary embodiments, are possible.

Claims

1. A cooling device for cooling an electrical and / or electronic assembly (2), comprising a cover plate (3) and a base plate (4), wherein the base plate (4) is formed as a deep-drawn part having a recess (40), and the cover plate (3) and the base plate (4) are arranged such that a cooling channel (5) is formed between the cover plate (3) and the base plate (4) by the recess (40), and the cover plate (3) and the base plate (4) are connected to each other in a contact region (8) outside the recess (40), and a cooling fluid stream of a cooling fluid can flow through the cooling channel (5), and the cooling device (1) further comprises at least one turbulator (6) arranged in the recess (40) of the cooling channel (5), and the turbulator (6) abuts against a bottom surface (44) in the recess (40) of the base plate (4), and the bottom surface (44) faces the cover plate (3). The cooling device, wherein the base plate (4) has a profiling part (7) in a curved region (43) at an edge of the bottom surface (44).

2. The cooling device according to claim 1, wherein a radius (R4) in the curved region (43) of the base plate (4) at the edge of the bottom surface (44) is reduced by the profiling part (7).

3. The cooling device according to claim 1 or 2, wherein the profiling part (7) forms a particularly right-angled shape in the curved region (43) at the edge of the bottom surface (44).

4. The cooling device according to any one of claims 1 to 3, wherein a solder material (20) is provided between the turbulator (6) and the base plate (4) in the profiling part (7), and the turbulator (6) is connected to the base plate by the solder material (20) in the profiling part (7).

5. The cooling device according to any one of claims 1 to 4, characterized in that a gap between the turbulator (6) and the base plate (4) in the embossing section (7) is completely filled with a solder material (20).

6. In a region where the cover plate (3) is separated from the base plate (4), a solder material (20) is provided between the cover plate (3) and the base plate (4), and / or in a region outside the embossing section (7), a solder material (20) is provided between the turbulator (6) and the base plate (4). The cooling device according to any one of claims 1 to 5, characterized by this.

7. The cooling device according to any one of claims 1 to 6, characterized in that the turbulator (6) is made of bent sheet metal, and the sheet metal has a curved portion having a radius (R6) of the turbulator (6) in a region of the turbulator (6) facing the curved region (43) of the base plate (4).

8. The cooling device according to claim 7, characterized in that a radius (R4) of the curved region (43) of the base plate (4) at an edge of the bottom surface (44) is smaller than a radius (R6) of the turbulator (6) in a region of the turbulator (6) facing the curved region (43) of the base plate (4).

9. The cooling device according to any one of claims 1 to 8, characterized in that the embossing section (7) is recessed with respect to the bottom surface (44) at the edge of the bottom surface (44).

10. A cooling device (1) according to any one of claims 1 to 9, An electronic device configuration including at least one electrical and / or electronic assembly (2) to be cooled, wherein the electrical and / or electronic assembly (2) is arranged on the cover plate (3) or the base plate (4). Electronic device configuration.

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