IC modules and smart card-related manufactured products

Abstract

The present disclosure relates to a carrier tape, an IC module, and a smart card device. According to one embodiment, a manufactured article includes a non-conductive substrate having a front surface and a back surface, and a plurality of through holes extending from the front surface to the back surface; a smart card contact area disposed on the front surface of the substrate and having a plurality of conductive pads that are insulated from each other and close the front-side ends of the through holes; a plurality of through-hole solder pads disposed on the back surface of the substrate at the back-side ends of the through holes, and a plurality of conductive traces disposed on the back surface of the substrate and electrically coupled to the through-hole solder pads respectively; and a solder mask that at least partially overlaps the conductive traces.

Description

Technical Field

[0001]

[0001] Embodiments of the present invention relate to an integrated circuit (IC) module having a direct chip attachment, a smart card or a smart device incorporating such an IC module, a carrier tape for manufacturing such a module, and a method of manufacturing such a carrier tape, IC module, and smart card or smart device.

Background Art

[0002]

[0002] Dual-interface smart cards incorporate an IC module having both a direct contact interface and a non-contact interface (hereinafter, a "dual-interface integrated circuit module"). While there are various arrangements of dual-interface IC modules and dual-interface smart cards and methods of manufacturing them, it is necessary to provide options that are useful in the art and address known problems with existing arrangements.

Summary of the Invention

Problems to be Solved by the Invention

[0003]

[0003] According to a first aspect, a non-conductive substrate having a front surface and a back surface and a plurality of through holes extending from the front surface to the back surface; a smart card contact region disposed on the front surface of the substrate, having a plurality of conductive pads that are insulated from each other and close the front-side ends of the through holes; a plurality of through-hole solder pads disposed on the back surface of the substrate at the back-side ends of the through holes, and a plurality of conductive traces disposed on the back surface of the substrate and conductively coupled to the through-hole solder pads respectively; a solder mask that at least partially overlaps the conductive traces; A manufactured product is provided.

[0004]

[0004] In one embodiment of the first aspect, the manufactured article further comprises a first solder configured to be disposed within the through-holes of the first subset and on the through-hole solder pads of the first subset, and to conductively couple the conductive pads of the first subset to the conductive traces of the first subset.

[0005]

[0005] In one embodiment of the first aspect, the manufactured article of the first embodiment further comprises an integrated circuit (IC) chip, and the IC chip is conductively coupled to the conductive pads of the first subset by being conductively coupled to the conductive traces of the first subset by direct chip attachment.

[0006]

[0006] In one embodiment of the first aspect, the manufactured article further comprises an underfill material interposed between the IC chip and the back surface of the substrate and / or a sealing material provided on the IC chip. Substantially no underfill material, solder mask, and / or sealing material is present at the end portion on the back surface side of the through-hole.

[0007]

[0007] In one embodiment of the first aspect, the manufactured article further comprises a second solder disposed within the through-holes of the second subset and on the through-hole solder pads of the second subset. The solder pads of the second subset and the second solder cooperate to provide a plurality of antenna connection pads. The IC chip is conductively coupled to the through-hole solder pads of the second subset via the conductive traces of the second subset. The manufactured article further comprises an antenna, and the antenna is conductively coupled to the IC chip by being conductively coupled to the antenna connection pads.

[0008]

[0008] In one embodiment of the first aspect, the manufactured article comprises a biometric authentication circuit conductively coupled to the IC chip, and / or Further comprising a light emitting diode (LED) circuit including at least one LED module and a second antenna conductively coupled thereto. The second antenna is configured to be inductively coupled to a non-contact reader to activate the at least one LED module.

[0009]

[0009] In one embodiment of the first aspect, the manufactured product further comprises surface mount solder pads disposed on the back surface of the substrate and conductively coupled to the through-hole solder pads of the first subset via the conductive traces of the first subset. The IC chip is disposed under the smart card contact area and is conductively coupled to the surface mount solder pads.

[0010]

[0010] In one embodiment of the first aspect, the through-holes of the second subset are located non-opposite to the IC chip.

[0011]

[0011] In one embodiment of the first aspect, at least some of the conductive pads are arranged in an array of rows and columns, and the through-holes of the second subset are arranged in different rows and columns.

[0012]

[0012] In one embodiment of the first aspect, one of the through-holes of the second subset is arranged at the position of the C6 pin compliant with ISO7816.

[0013]

[0013] In one embodiment of the first aspect, the IC chip is arranged offset with respect to the smart card contact area.

[0014]

[0014] In one embodiment of the first aspect, the substrate is dimensioned according to ID-1 size, half of ID-1 size, and one-fourth of ID-1 size compliant with ISO7810.

[0015]

[0015] In one embodiment of the first aspect, the substrate, the smart card contact area, the through-hole solder pad, the conductive trace, the solder mask, the first solder, and the second solder are provided as a printed circuit board.

[0016]

[0016] In one embodiment of the first aspect, the conductive trace includes a module antenna that at least partially surrounds the through-hole solder pad.

[0017]

[0017] According to the second aspect, a smart card is provided that includes a laminate core having a plurality of laminate layers, and one of the laminate layers includes the manufactured product according to any of the above embodiments.

[0018]

[0018] According to the third aspect, a step of electrically coupling the integrated circuit (IC) chip to the contact pins by electrically coupling the IC chip to the conductive traces of the first subset of the manufactured product according to any of the above embodiments; providing an underfill material between the IC chip and the substrate and providing a sealing material on the IC chip, in the step of providing the underfill material and the sealing material, substantially preventing the underfill material, the solder mask, and / or the sealing material from being present at the end portion on the back side of the through-hole; A method for manufacturing an IC module is provided.

[0019]

[0019] According to the fourth aspect, a method for manufacturing a smart card is provided that includes a step of electrically coupling an antenna to the IC chip by electrically coupling the antenna to the antenna connection pad of the manufactured product according to any of the above embodiments.

[0020]

[0020] According to the fifth aspect, a step of forming a hole in a non-conductive substrate to provide a through-hole extending from the front surface to the back surface of the substrate; A step of plating a smart card contact area having a plurality of conductive pads that are insulated from each other and close an end portion on the front surface side of the through hole on the front surface of the substrate; A step of plating a through hole solder pad disposed at an end portion on the back surface side of the through hole on the back surface of the substrate; A step of plating a plurality of conductive traces electrically coupled to the through hole solder pad on the back surface of the substrate; A step of applying a solder mask that at least partially overlaps the conductive trace; A method for manufacturing a manufactured product is provided, which includes the above steps.

[0021]

[0021] In one embodiment of the fifth aspect, the method further includes a step of depositing a first solder in the through holes of the first subset and on the through hole solder pads of the first subset, and the first solder is configured to electrically couple the conductive pads of the first subset to the conductive traces of the first subset through the through hole solder pads of the first subset.

[0022]

[0022] In one embodiment of the fifth aspect, the method A step of depositing a second solder in the through holes of the second subset and on the solder pads of the second subset to enable the through hole solder pads of the second subset and the second solder to cooperate to provide a plurality of antenna connection pads; A step of depositing a third solder on a plurality of surface mount solder pads at an end of the conductive trace located far from the through hole solder pad; A step of disposing an integrated circuit (IC) chip on the back surface of the substrate; A step of electrically coupling the IC chip to the conductive pads of the first subset and the IC chip to the through hole solder pads of the second subset through the conductive traces of the first subset by reflowing at least the first solder, the second solder, and the third solder; The method further includes the above steps.

[0023]

[0023] In one embodiment of the fifth aspect, the method further comprises: providing an underfill material interposed between the IC chip and the substrate; providing a sealing material on the IC chip; maintaining a state in which the underfill material, the solder mask, and / or the sealing material are substantially absent at the end portion on the back side of the through hole. The method further comprises the above steps.

[0024]

[0024] In one embodiment of the fifth aspect, the IC chip is conductively coupled to the solder pads of the second subset via the conductive traces of the second subset, and the method further comprises conductively coupling an antenna to the IC chip by conductively coupling the antenna to the antenna connection pads.

[0025]

[0025] According to the sixth aspect, there is provided an integrated circuit (IC) module for a smart card having both a contact interface and a non-contact interface. The IC module includes: a non-conductive substrate having a plurality of through holes extending from a front surface to a back surface, including a first subset of through holes, a second subset of through holes, and a third subset of through holes; a plurality of conductive pads including a first subset of conductive pads respectively arranged to block the first subset of through holes, and a second subset of conductive pads arranged to block the second subset of through holes and the third subset of through holes, the plurality of conductive pads forming a smart card contact area disposed on the front surface of the substrate; an IC chip disposed on the back surface of the substrate; a plurality of conductive elements crossing the first subset of through holes and the third subset of through holes and conductively coupling the first subset of conductive pads and the second subset of conductive pads to the IC chip. Sealing material deposited in the through holes of the first subset and the through holes of the third subset, and further deposited on the IC chip and the conductive element, comprising The through holes of the second subset are separated from the through holes of the third set by the substrate, The through holes of the second subset are positioned non-opposite to the IC chip.

[0026]

[0026] In one embodiment of the sixth aspect, at least some of the conductive pads are arranged in an array of rows and columns, and the through holes of the second subset are arranged in different rows and columns.

[0027]

[0027] In one embodiment of the sixth aspect, one of the conductive pads of the second subset includes a region crossing a plurality of rows and columns.

[0028]

[0028] In one embodiment of the sixth aspect, the sealing material is further deposited in at least one of the through holes of the second subset.

[0029]

[0029] In one embodiment of the sixth aspect, at least one of the through holes of the second subset is adapted to receive the sealing material.

[0030]

[0030] In one embodiment of the sixth aspect, one of the conductive pads of the second subset is arranged at the position of the C6 pin compliant with ISO7816.

[0031]

[0031] According to the seventh aspect, a smart card having both a contact interface and a non-contact interface is provided. The smart card is a card body having an opening and an antenna, any of the integrated circuit (IC) modules of the above-described embodiments disposed within the opening; a pair of antenna connection elements disposed within the through-holes of the second subset and electrically coupling the antenna to the conductive pads of the second subset; and comprising.

[0032]

[0032] In one embodiment of the seventh aspect, each of the antenna connection elements comprises a rigid conductive bump or solder bump, a conductive disk, a flexible conductive bump made of a conductive adhesive, or a part of the antenna.

[0033]

[0033] In one embodiment of the seventh aspect, each of the through-holes of the second subset is adapted to receive at most one conductive element.

[0034]

[0034] According to an eighth aspect, a single-sided plated integrated circuit (IC) carrier tape suitable for use in a smart card having both a contact interface and a non-contact interface is provided. The IC carrier tape includes a non-conductive substrate having a plurality of through-holes including a first subset of through-holes, a second subset of through-holes, and a third subset of through-holes extending from a front surface to a back surface adapted for placement of an IC chip; a first subset of the conductive pads disposed to block the first subset of the through-holes respectively, and a second subset of the conductive pads disposed to block the second subset of the through-holes and the third subset of the through-holes, and having a plurality of conductive pads including a smart card contact area disposed on the front surface of the substrate; and comprising the first subset of the through-holes and the third subset of the through-holes are adapted to receive a plurality of conductive elements that electrically couple the first subset of the conductive pads and the second subset of the conductive pads to the IC chip; The through holes of the first subset, the through holes of the third subset, the IC chip, and the conductive element are compatible with the acceptance of the encapsulant. The through holes of the second subset are separated from the through holes of the third set by the substrate. The through holes of the second subset are positioned non-opposite to the IC chip.

[0035]

[0035] In one embodiment of the eighth aspect, the conductive pads are arranged in an array of rows and columns, and the through holes of the second subset are provided in some of the conductive pads arranged in different rows and columns.

[0036]

[0036] In one embodiment of the eighth aspect, one region of the conductive pads of the second subset crosses a plurality of rows and columns.

[0037]

[0037] In one embodiment of the eighth aspect, at least one of the through holes of the second subset is compatible with the acceptance of the encapsulant.

[0038]

[0038] In one embodiment of the eighth aspect, one of the conductive pads of the second subset is arranged at the position of the C6 pin compliant with ISO7816.

Brief Description of the Drawings

[0039]

Figure 1A

[0039] A front view of a carrier tape or an IC module according to one embodiment is shown.

Figure 1B

[0040] A rear view of the carrier tape of FIG. 1A is shown.

Figure 1C

[0041] A rear view of the IC module of FIG. 1A is shown.

Figure 1D

[0042] It is a cross-sectional view along the 1D-1D line.

Figure 1E

[0043] It is another rear view of the IC module.

Figure 1F

[0044] It is a cross-sectional view along the 1F-1F line.

Figure 1G

[0045] The rear view of the carrier tape having the module antenna according to one embodiment is shown.

Figure 2A

[0046] The card structure having the laminate core array is shown. In this figure, only the IC module is shown, and other components are omitted to avoid obscurity.

Figure 2B

[0047] The circuit board inlay removed from the card structure according to one embodiment is shown.

Figure 2C

[0048] It is a side view of the circuit board inlay of FIG. 2B.

Figure 2D

[0049] The circuit board inlay removed from the card structure according to other embodiments is shown.

Figure 2E

[0050] The circuit board inlay removed from the card structure according to other embodiments is shown.

Figure 2F

[0051] The circuit board inlay removed from the card structure according to other embodiments is shown.

Figure 2G

[0052] The perspective rear view of the circuit board inlay of FIG. 2F is shown.

Figure 3A

[0053] An example of an exploded view of a smart card provided in the ID-1 size is shown.

Figure 3B

[0054] An example of an exploded view of a smart card provided in half the size of ID-1 is shown.

Figure 3C

[0055] An example of an exploded view of a smart card provided in 1 / 4 the size of ID-1 is shown.

Figure 4

[0056] FIG. 4A shows the PCB board provided in half the size of ID-1, and FIG. 4B shows the PCB board provided in 1 / 4 the size of ID-1.

Figure 5A

[0057] Shows a front view of a carrier tape or an IC module according to an embodiment.

Figure 5B

[0058] Shows a back view of the carrier tape of FIG. 5A.

Figure 5C

[0059] Shows a back view of the IC module of FIG. 5A.

Figure 6A

[0060] Is a manufacturing flow sequence of the IC module.

Figure 6B

[0061] Is a manufacturing flow sequence of the smart card.

Figure 7A

[0062] Shows a front view of a carrier tape or an IC module according to an embodiment.

Figure 7B

[0063] Shows a perspective view of the IC module of FIG. 7A according to an embodiment as seen from the front.

Figure 7C

[0064] Shows a perspective view of the IC module of FIG. 7A according to an embodiment as seen from the front.

DETAILED DESCRIPTION OF THE INVENTION

[0040]

[0065] In the following description, numerous specific details are set forth in order to provide a thorough understanding of various exemplary embodiments of the present invention. However, one of ordinary skill in the art will understand that the embodiments of the present invention may be practiced without some or all of these specific details. It is to be understood that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the scope of the present invention. In the drawings, reference signs or reference numerals, etc., indicate the same or similar functions or features across multiple drawings.

[0041]

[0066] The embodiments described in the description of one of the devices or methods are equally applicable to other devices or methods. Similarly, the embodiments described in the description of the device are equally applicable to the method, and vice versa.

[0042]

[0067] The features described in the description of one embodiment can be similarly applied to the same or similar features in other embodiments. The features described in the description of one embodiment can be similarly applied to other embodiments even if they are not explicitly described in other embodiments. Further, the additions and / or combinations and / or alternatives as described for the features in the description of one embodiment can be similarly applied to the same or similar features in other embodiments.

[0043]

[0068] It should be understood that the articles "the", "said", and "this" used in connection with a feature or element include reference to one or more features or elements. The term "and / or" includes any and all combinations of one or more related features or elements. The terms "comprising", "including", and "having" are intended to be construed broadly and mean that there may be additional features or elements other than the recited features or elements. Identifiers such as "first", "second", "third", etc. are used merely as labels (reference signs) and are not intended to impose numerical requirements on their objects, nor are they to be construed as imposing a relative position or time series between limitations. Furthermore, terms such as "front", "back", "upper", "lower", "side", "lower side", "upper side", "above", "on top of" used herein are merely for the purpose of simplifying the description and may indicate the orientation of the features or elements shown in the drawings. It should be understood that any orientation of the features described herein is within the scope of the present invention.

[0044]

[0069] The phrase "conductive coupling" and related phrases include reference to the transfer of electrical energy or current between elements by physical contact or by a conductive medium. The phrase "inductive coupling" and related phrases include reference to the transfer of electrical energy or current between elements by electromagnetic induction or by a common changing magnetic field, i.e., without physical contact between the elements.

[0045]

[0070] The phrase "printed circuit board" may refer to a non-conductive substrate on which conductive traces and / or circuits are disposed within and / or on the substrate to form current paths. Electronic components are soldered onto the substrate, particularly onto conductive pads connected to the circuit board.

[0046]

[0071] According to some aspects of the present invention, a manufactured article, namely, a carrier tape for an IC module, is provided. FIGS. 1A and 1B show non-limiting embodiments of the carrier tape described below.

[0047]

[0072] FIGS. 1A and 1B show a front view and a back view, respectively, of a carrier tape 10 that can be provided as a printed circuit board (PCB).

[0048]

[0073] The carrier tape 10 includes a non-conductive substrate 11 having a front or contact surface (also referred to as the first surface) and a back or bonding surface (also referred to as the second surface), a plurality of through holes 13, 14 extending through the substrate 11 (e.g., from the front surface to the back surface), and conductive layers (e.g., conductive pads, conductive traces, and solder pads) provided on the front and back surfaces by plating and / or etching or the like.

[0049]

[0074] The through-holes 13, 14 include the through-holes 13 of the first subset and the through-holes 14 of the second subset. Each of the through-holes 13, 14 has opposing openings or opposing ends (e.g., the front-side end and the back-side end), and the opposing openings or opposing ends are respectively located on the front and back surfaces of the non-conductive substrate 11. The through-holes 13, 14 may be provided with different dimensions and / or shapes. In some non-limiting examples, the through-holes 14 of the second subset have a larger dimension or area than the through-holes 13 of the first subset. For example, the diameter of the through-holes 13 of the first subset can be about 0.6 mm to about 0.9 mm, and the diameter of the through-holes 14 of the second subset can be about 2.0 mm. However, in other non-limiting examples, the through-holes 14 of the second subset may have the same dimension or area as the through-holes 13 of the first subset. In still other non-limiting examples, some through-holes may have the same dimension or area, and some other through-holes may have different dimensions or areas. The through-holes 13 of the first subset and / or the through-holes 14 of the second subset can have one or more shapes (e.g., regular shapes, irregular shapes). Non-limiting examples include circles, rounded rectangles, L-shapes, ellipses, polygons, combinations of regularly shaped or overlapping regularly shaped connected to each other. The shapes of the through-holes 13 of the first subset and / or the through-holes 14 of the second subset may be the same or different.

[0050]

[0075] The through-holes 13 of the first subset are also referred to as chip-bonding holes configured to receive a conductive element (e.g., solder) configured to conductively couple to the IC chip 31. The through-holes 14 of the second subset are also referred to as heat-transfer holes configured to accommodate a heat-transfer medium (e.g., solder).

[0051]

[0076] The smart card contact area 16 is disposed on the front surface of the substrate 11 and completely closes the front-side ends of the through holes 13 and 14. The smart card contact area 16 includes a plurality of conductive pads 17 and 18, and at least some of the plurality of conductive pads 17 and 18 are electrically insulated from each other. The conductive pads 17 and 18 can have sizes, shapes, and arrangements conforming to the standards of the International Organization for Standardization (ISO) regarding the manufacture of smart cards. The dimensions of the smart card contact area 16 can be approximately 85.60 mm × 53.98 mm in accordance with the ISO7810 standard. The conductive pads 17 and 18 can be made of a metal (for example, copper or nickel). The conductive pads 17 and 18 include a first subset of conductive pads 17 and a second subset of conductive pads 18. Each of the first subset of conductive pads 17 includes an outer surface and an inner surface. During operation, the outer surface is electrically connected to a contact-type smart card reader or an electronic terminal to enable signal transmission between the card reader and an IC chip electrically connected to the smart card contact area 16, while the inner surface is accessible through a corresponding through hole to allow a conductive element (for example, solder) disposed in the through hole to be electrically connected to the conductive pad. However, each of the second subset of conductive pads 18 may not be in electrical contact with a contact-type smart card reader or an electronic terminal.

[0052]

[0077] For example, the first subset of conductive pads 17 can be arranged according to the positions of the C1 pin, C2 pin, C3 pin, C5 pin, C6 pin, and C7 pin of ISO7816. Therefore, these can also be referred to as contact pads. The second subset of conductive pads 18 can be arranged between C1 and C5, between C3 and C7, and / or at other positions. Alternatively, in some other embodiments (not shown), the second subset of conductive pads 18 may be arranged according to the positions of the C4 pin and C8 pin of ISO7816. The second subset of conductive pads 18 can also be referred to as heat transfer pads.

[0053]

[0078] On the back surface of the non-conductive substrate 11, a plurality of solder pads 21, 22, 23, 24, a plurality of conductive traces 25, 26, and a solder mask ink 27 are arranged. The solder pads 21, 22, 23, 24 include, for example, seven through-hole solder pads 21, 22 as shown in FIG. 1B and, for example, seven surface-mount solder pads 23, 24 as shown in FIG. 1B. In particular, the through-hole solder pads 21, 22 are arranged (e.g., adjacent) at the end portions on the back surface side of the respective through-holes 13, 14. The through-hole solder pads 21, 22 include a first subset of through-hole solder pads 21 arranged at the end portions on the back surface side of the first subset of through-holes 13 and a second subset of through-hole solder pads 22 arranged at the end portions on the back surface side of the second subset of through-holes 14. The surface-mount solder pads 23, 24 include a first subset of surface-mount solder pads 23 and a second subset of surface-mount solder pads 24.

[0054]

[0079] The conductive traces 25, 26 electrically connect the through-hole solder pads 21, 22 to the surface-mount solder pads 23, 24, respectively. The conductive traces 25, 26 include a first subset of conductive traces 25 electrically connected between the first subset of through-hole solder pads 21 and the first subset of surface-mount solder pads 23 and a second subset of conductive traces 26 electrically connected between the second subset of through-hole solder pads 22 and the second subset of surface-mount solder pads 24.

[0055]

[0080] The solder mask ink 27 is deposited on the back surface of the substrate 11 and defines a non-solder region and / or a solder region. In particular, the solder mask ink 27 may be deposited on at least a part of the conductive traces 25, 26 and / or at least a part of the solder pads 21, 22, 23, 24, or may overlap at least a part of the conductive traces 25, 26 and / or the solder pads 21, 22, 23, 24. Therefore, the solder mask ink is at least partially or mostly absent from the solder pads 21, 22, 23, 24.

[0056]

[0081] As a preparation for manufacturing the IC module 30, the first solder 33, the second solder 34, and the third solder 35 may be provided on the carrier tape 10.

[0057]

[0082] The first solder 33 can be disposed (e.g., deposited) within the through-holes 13 of the first subset and on the through-hole solder pads 21 of the first subset, and can be configured to electrically couple the conductive pads 17 of the first subset to the conductive traces 25 of the first subset after reflow.

[0058]

[0083] The second solder 34 can be disposed (e.g., deposited) within the through-holes 14 of the second subset and on the through-hole solder pads 22 of the second subset. The solder pads 22 of the second subset and the second solder 34 can cooperate to provide a plurality of antenna connection pads (collectively 22, 34).

[0059]

[0084] The third solder can be disposed (e.g., deposited) on the surface mount solder pads 23, 24.

[0060]

[0085] According to some aspects of the present invention, a manufactured article (e.g., an IC module) having a direct chip attachment is provided. FIGS. 1C - 1F show non-limiting embodiments of the IC module 30 fabricated on the carrier tape 10 of FIGS. 1A and 1B.

[0061]

[0086] FIGS. 1A and 1C show a front view and a rear view of the IC module 30, respectively. FIG. 1D is a cross-sectional view taken along line 1D - 1D of FIG. 1C. FIG. 1E shows another rear view of the IC module 30. FIG. 1F is a cross-sectional view taken along line 1F - 1F of FIG. 1E.

[0062]

[0087] On the back surface of the carrier tape 10, an IC chip 31 is mounted on the carrier tape 10 by direct chip attachment. The IC chip 31 is conductively coupled to a first subset of conductive pads 17 (e.g., C1, C2, C3, C5, and C7). In particular, the IC chip 31 is conductively coupled to the surface mount solder pads 23 of the first subset via a third reflow solder 35 on the surface mount solder pads 23. The surface mount solder pads 23 of the first subset are conductively coupled to the conductive traces 25 of the first subset. The conductive traces 25 of the first subset are conductively coupled to the through-hole solder pads 21 of the first subset. The through-hole solder pads 21 of the first subset are conductively coupled to the conductive pads 17 of the first subset via a reflowed first solder 33 disposed within the through-holes 13 of the first subset. In other words, a current path is configured between the IC chip 31 and each of the conductive pads 17 of the first subset such that the IC module 30 is activated (e.g., to perform a card transaction) when the smart card contact region 16 is disposed in electrical contact with a reader.

[0063]

[0088] Furthermore, the IC chip 31 is conductively coupled to the surface mount solder pads 24 of the second subset via a third reflow solder 35 on the surface mount solder pads 24. The surface mount solder pads 24 of the second subset are conductively coupled to the conductive traces 18 of the second subset, which are conductively coupled to the through-hole solder pads 22 of the second subset.

[0064]

[0089] The antenna connection pads 22, 34 face the second subset of conductive pads (heat transfer pads) 18. The antenna connection pads 22, 34 may be larger than other solder pads to ensure sufficient area for holding enough solder to connect the antenna. In each of the antenna connection pads, the reflowed second solder 34 within the through-holes 14 of the second subset may be arranged in contact with the heat transfer pad 18 located on the front surface of the substrate 11. The function of this heat transfer pad 18 is to improve heat transfer during the reflow process of connecting the antenna to the antenna connection pads 22, 34, and it is not intended to form a current path from the IC chip 31 to the antenna 41.

[0065]

[0090] In the IC module 30, an underfill material 37 may be provided in the gap between the first surface of the IC chip 31 and the back surface of the carrier tape 10. The underfill material 37 is for preventing damage to the chip due to mechanical stress. The encapsulant 28 may be deposited on the IC chip 31 (for example, on the second surface opposite to the first surface of the IC chip 31). The regions covered by the underfill material 37, the solder mask 27, and / or the encapsulant 28 may not extend to the through-holes 13, 14, their reflow solder 33, 34, or the through-hole solder pads 21, 22, and may not overlap with them. In other words, the underfill material 37, the solder mask 27, and / or the encapsulant 28 are substantially absent from the through-holes 13, 14, their reflow solder 33, 34, and the through-hole solder pads 21, 22. It should be noted that in some non-limiting examples, the underfill material 37, the solder mask 27, and / or the encapsulant 28 may not be deposited on the IC chip 31.

[0066]

[0091] According to some aspects of the present invention, the IC module 30 is incorporated into a manufactured product (e.g., a smart card or a smart device 40). As such an IC module, the above-described IC module 30 or other IC modules not described in this specification can be provided. For non-limiting embodiments of the smart card or the smart device 40, reference will be made to the IC module 30 of FIGS. 1C to 1F for description.

[0067]

[0092] In the smart card or smart device 40, each of the antenna connection pads 22 and 34 of the IC module 30 is conductively coupled to an antenna 41 (e.g., a card antenna, a metal coil) via an antenna connection element (e.g., the reflowed second solder 22) provided on the antenna connection pads 22 and 34. Due to such a conductive coupling, the antenna 41 is conductively coupled to the IC chip 31 via the antenna connection pads 22 and 34 and the second subset of conductive traces 26 (see the cross-sectional view along the 1F-1F line). In particular, the IC chip 31 is conductively coupled to the surface mount solder pads 24 of the second subset via the reflowed third solder 35 on the surface mount solder pads 24, and the surface mount solder pads 24 of the second subset are conductively coupled to the second subset of conductive traces 26 that are conductively coupled to the antenna connection pads 22 and 34. In other words, a current path is configured between the antenna 41 and the IC chip 31, and such a path does not include the second subset of conductive pads (heat transfer pads) 18. Due to the above-described heat transfer function, there may be contact between the reflowed second solder 34 disposed in the through holes 14 of the second subset and the second subset of conductive pads (heat transfer pads) 18, but due to the difference in electrical conductivity between the second subset of conductive traces 26 and the reflowed second solder 34 in the through holes 14 of the second subset, and also due to the open circuit at the second subset of conductive pads (heat transfer pads) 18, essentially no current flows between the antenna 41 and the second subset of conductive pads (heat transfer pads) 18. Therefore, the current induced in the antenna 41 is expected to flow in the order of from the antenna 41 to the antenna connection pads 22 and 34, then to the second subset of conductive traces 26, then to the corresponding one of the surface mount solder pads 24 of the second subset, and then to the IC chip 31.

[0068]

[0093] Note that the above carrier tape and IC module can be modified to include an antenna. FIG. 1G shows a non-limiting embodiment of a carrier tape 101 that is substantially similar to the examples of FIGS. 1B-1F, except that two antenna connection pads and at least a portion of the conductive traces associated therewith have been replaced with an antenna 81 (hereinafter, the "module antenna"). The module antenna 81 can be formed in the same manner as the conductive traces. The module antenna 81 may completely surround (shown) or partially surround (not shown) the through-hole solder pads 21, 22, the surface-mount solder pads 23, 24, and / or the conductive traces 25, 26 that interconnect the through-hole solder pads 21, 22 and the surface-mount solder pads 23, 24. The module antenna 81 includes a first end having a surface-mount solder pad 24 that electrically couples to an IC chip (not shown) when the IC chip is properly placed on the carrier tape 101 and reflowed to fabricate the IC module. The module antenna 81 includes a second end having a through-hole solder pad 22, and the second end 22 is electrically coupled to provide the module antenna as an antenna loop. This electrical coupling can be provided by a conductive trace (not shown) disposed under or embedded in the back surface of the substrate 11. A solder mask (not shown) is deposited on the back surface of the substrate 11 and may at least partially overlap the conductive traces 25, 26 and / or at least partially overlap the through-hole solder pads 21, 22 and the surface-mount solder pad 23. Note that the solder mask may be similar to the solder mask 27 provided in connection with the embodiments of FIGS. 1B-1F.

[0069]

[0094] A non-limiting embodiment of a smart card or smart device 40 will be described with reference to FIGS. 2A-2G.

[0070]

[0095] Figure 2A shows a card structure having a laminate core array 40. The laminate core 40 can include a plurality of stacked laminate layers. The plurality of stacked laminate layers can include an upper overlay 1, a first substrate 2 (e.g., polyvinyl chloride (PVC) material), a circuit board inlay 3 or a second substrate (e.g., PCB), a third substrate 4 (e.g., PVC material), a fourth substrate 5 (e.g., polyethylene terephthalate glycol (PETG) material), a fifth substrate 6 (e.g., PVC material), and a lower overlay 7. The laminate core 40 includes at least one IC module 30 (shown) housed within a cavity of the laminate core, and other components (not shown).

[0071]

[0096] Note that the card structure may include fewer or more layers, or the above-described layers may be replaced or changed.

[0072]

[0097] FIG. 2B shows the circuit board inlay 3 or the second substrate (e.g., the above-mentioned PCB) removed from the card structure, and FIG. 2C shows a schematic side view of FIG. 2B. The PCB 3 includes a card circuit 42 disposed on the PCB substrate 11 for performing card transactions and data communication operations. The card circuit 42 includes a conductor pattern 43 (e.g., a smart card contact area, a conductive trace) that can be formed by dry etching a metallization layer (e.g., aluminum) plated on the substrate 11. The card circuit 42 includes at least one IC chip 31, a smart card contact area 16, a plurality of conductive traces that conductively couple the smart card contact area 16 to the IC chip 31, and an antenna (or a first antenna) 41 conductively coupled to the IC chip 31. Since the IC chip 31 is disposed under the smart card contact area 16 as shown in FIGS. 1D and 1F, it is not shown in FIGS. 2B and 2C. The first antenna 41 may be provided above / below the substrate 11 or above / below another layer, and / or the first antenna 41 may be provided in a different form factor and / or at a different position. As shown in FIGS. 2B and 2C, the card circuit 42 may further include at least one central processing unit (CPU) chip 43 and a capacitor 44 for operating the card circuit and the biometric authentication circuit.

[0073]

[0098] At least some of the conductive pads 17 in the smart card contact area 16 provide contact-type signal transmission with a contact-type card reader, and the first antenna 41 provides non-contact signal transmission to a non-contact card reader. The smart card contact area 16 can have dimensions and a layout that conform to ISO or other industry standards. The smart card contact area 16 can be provided in a regular shape (e.g., rectangular, square), a deformed regular shape (e.g., a rectangle with rounded corners, a square with rounded corners), or an irregular or customized shape (e.g., a logo, a trademark, a symbol, a character), as long as the pin placement positions in the smart card contact area 16 conform to ISO or other industry standards. The irregular or customized shape may be a pattern including a regular shape and / or a deformed regular shape, a representation of a known or imaginary object.

[0074]

[0099] The PCB 3 may include a light-emitting diode (LED) circuit 52, and the LED circuit 52 can be formed on at least a part of the front or back surface of the PCB substrate 11, and can be configured to turn on the LED module 53 and execute non-contact signal transmission, for example, when the card 40 is brought into a predetermined proximity range of a non-contact card reader.

[0075]

[0100] The LED circuit 52 may include an induction circuit provided or formed on the front or back surface of the PCB substrate 11. The induction circuit may include a conductor pattern (e.g., a conductive trace, an antenna) that can be formed by dry etching a metallization layer plated on the PCB substrate 11. The induction circuit includes at least one LED module 53 and a second antenna 51 that is conductively coupled thereto and is a metal or an inductor coil. During operation, when the smart card 40 is brought into a predetermined proximity range of the non-contact card reader and non-contact signal transmission is executed, the second antenna 51 is inductively coupled to the oscillating magnetic field of the card reader and may also be inductively coupled to the first antenna 41 of the card circuit 42 in some cases. Due to this inductive coupling, a current is generated in the induction circuit, and the LED module 53 operates. At the same time, the first antenna 41 is inductively coupled to the oscillating magnetic field of the card reader to generate a current in the card circuit 42, and the IC chip 31 and other components included in the card circuit 42 operate.

[0076]

[0101] The PCB substrate 11 may include a biometric authentication circuit 62. The biometric authentication circuit 62 can be at least partially provided or formed on the front or back surface of the PCB substrate 11 and can be conductively coupled to the IC chip 31 via a conductive trace provided or formed on the PCB substrate 11. Also, it can be configured to detect (e.g., read or receive) biometric authentication data and provide the detected biometric authentication data to the card reader and / or the IC chip of the card circuit 42. The biometric authentication circuit 62 includes a conductor pattern (e.g., a conductive trace) that can be formed on the PCB substrate 11 by dry etching a metallization layer (e.g., aluminum) plated on the PCB substrate 11. The biometric authentication circuit 62 includes at least one biometric authentication IC chip 63 (e.g., a fingerprint sensor control chip), a biometric authentication data sensor 64 (e.g., a fingerprint sensor) conductively coupled to the biometric authentication IC chip 63, a plurality of conductive traces having at least one conductive trace that conductively couples the biometric authentication sensor to the biometric authentication IC chip, and optionally at least one capacitor.

[0077]

[0102] Referring to FIGS. 2A and 3A - 3C, the overlay 1 and the first substrate 2 may be provided with at least one opening for accommodating the smart card contact area 16 and / or the biometric sensor 64. In particular, when the laminated layers are laminated, the smart card contact area 16 and / or the biometric sensor 64 protrude from the opening. The smart card contact area 16 and / or the biometric sensor 64 and a part of the PCB substrate 11 may substantially fill the openings of the overlay 1 and the first substrate 2. The smart card contact area 16 and / or the biometric sensor 64 may be substantially flush with the outer surface of the overlay 1, i.e., the laminate core 40. The first substrate 2 and / or other substrates within the laminate core 40 may be provided with at least one opening or cavity for accommodating the LED module 53.

[0078]

[0103] In FIGS. 2B and 2C, the PCB 3 includes the card circuit 42, the LED circuit 52, and the biometric authentication circuit 62. Thus, the PCB substrate 11 may be substantially larger than the smart card contact area 16, or approximately equal to the size of the final smart card or smart device, as shown in FIGS. 3A - 3C and FIGS. 4A - 4B, for example. In some other examples, the smart card may include the card circuit and either the LED circuit or the biometric authentication circuit. In yet other examples, the PCB 3 may include the card circuit, as shown in FIGS. 2D and 2E.

[0079]

[0104] In FIGS. 2B and 2C, the card circuit 42, the first antenna 41, the LED circuit 52, and / or the biometric authentication circuit 62 are provided on the same surface of the same PCB substrate 11. In some other examples, at least one of these, or a part of any of the circuits, may be provided on a different surface of the PCB substrate 11 or on at least one different substrate.

[0080]

[0105] In FIGS. 2B - 2C, the IC chips 31, 43, 63 are not provided with a sealing material. In some other examples, at least one of the IC chips may be provided with a sealing material.

[0081]

[0106] In FIGS. 2B to 2C, the PCB 3 includes a plurality of IC chips. In some other examples, the PCB 3 may include one or more IC chips.

[0082]

[0107] In FIGS. 2B to 2C, the IC chips 31, 43, 63 are provided on the same surface of the same PCB substrate 11. In some other examples, at least one of the IC chips may be provided on a different surface of the PCB substrate 11 or on at least one different substrate.

[0083]

[0108] In FIGS. 2B to 2C, the first antenna 41 is provided substantially along the periphery of the smart card or smart device and surrounds the remaining circuitry. In some other examples, the first antenna 41 may be provided in other dimensions or form factors.

[0084]

[0109] In FIGS. 2B to 2D, the IC chip 31 is provided on the back surface of the smart card contact area 16, that is, directly below the smart card contact area 16. In some other embodiments, as shown in FIG. 2E, the IC chip 31 may be disposed offset with respect to the smart card contact area 16. In FIG. 2E, the IC chip 31 is not disposed directly on the back surface of the smart card contact area 16 or directly on the back surface of the smart card contact area 16. Instead, the IC chip 31 is disposed away from the smart card contact area 16 and does not overlap with the smart card contact area 16. In particular, the IC chip 31 may be directly attached to solder pads that are disposed away from the smart card contact area 16 and do not overlap with the smart card contact area 16. The solder pads are conductively coupled to the smart card contact area 16 via conductive traces provided on the PCB substrate 11. A part of the conductive traces is directly below the smart card contact area 16, and a part of the conductive traces is offset with respect to the smart card contact area 16. By offsetting the smart card contact area 16 with respect to the IC chip 31, they are displaced and have a non-overlapping relationship. In other words, in FIG. 2E, the area on the PCB substrate 11 defined by the smart card contact area 16 and the area on the PCB substrate 11 defined by the IC chip 31 are displaced along a direction crossing the plane defined by the end of the PCB substrate 11 and do not overlap. By offsetting the smart card contact area 16 with respect to the IC chip 31, it is possible to make the smart card contact area 16 into any shape including geometric and non-geometric shapes. Even if the smart card contact area 16 interfaces with a contact type reader and is repeatedly used, the risk of damaging the IC chip 31 is reduced.

[0085]

[0110] In the embodiment of FIG. 2E, the conductive traces formed on the PCB substrate 11 conductively couple the IC chip 31 to the antenna 41, and FIG. 2E may differ from the embodiments of FIGS. 1B - 1F in that it may not include antenna connection pads under the smart card contact area 16. In other words, FIG. 2E may not include a second subset of through - holes, a second subset of through - hole solder pads, a second subset of conductive traces, and a second subset of surface - mount solder pads. In the embodiment of FIG. 2E, the PCB 3 includes a card circuit. In some other examples, the PCB 3 may further include an LED and / or a biometric authentication circuit.

[0086]

[0111] FIG. 2F shows a PCB 3 that is substantially the same as FIG. 2D, but the IC module 301 of FIG. 2F incorporates the carrier tape 101 of FIG. 1G and is configured to inductively couple to the card antenna 41 during operation. That is, the card antenna 41 is disposed inductively close to the module antenna 81. In other words, in a smart card or smart device incorporating the PCB 3 of FIG. 2F, the module antenna 81 is not conductively or physically coupled to the card antenna 41. During operation, when the smart card is brought into a predetermined proximity range of a contactless card reader and contactless signal transmission is performed, the module antenna 81 inductively couples to the oscillating magnetic field of the card reader and the card antenna 41. This inductive coupling generates an electric current that activates the IC chip of the IC module 301. FIG. 2F shows a front view of the PCB 3, and FIG. 2G shows a perspective rear view of the PCB 3 of FIG. 2F.

[0087]

[0112] FIG. 3A shows an example of a smart card provided in an ID - 1 size (e.g., 85.60 mm × 53.98 mm) compliant with the ISO 7810 standard or a similar standard.

[0088]

[0113] FIG. 3B shows an example of a smart card provided in a size that is half of ID - 1. Thus, one ID - 1 size can accommodate two smart cards.

[0089]

[0114] Figure 3C shows an example of a smart card provided as one quarter the size of ID-1. Thus, one ID-1 size can accommodate four smart cards.

[0090]

[0115] Thus, the PCB substrate 11 in the examples shown in FIGS. 3A-3C can be sized according to the ID-1 size, half the ID-1 size, or one quarter the ID-1 size.

[0091]

[0116] The smart card may be of other dimensions or form factors. For example, the smart card or smart device may be provided as a plug-in subscriber identity module (SIM) device, a SIM card.

[0092]

[0117] Note that the smart cards or smart devices described above may be provided or incorporated into various applications including, but not limited to, banking, finance, payment, identification, health, telecommunication, communication, storage.

[0093]

[0118] FIGS. 4A and 4B show large sheets each having a plurality of PCBs 3 sized half the ID-1 size and one quarter the ID-1 size, respectively. The plurality of PCBs 3 can provide the circuit board inlay 3 or the second substrate of FIG. 2E. The circuit board inlay 3 or the second substrate is laminated between other layers and laminated to provide a plurality of laminate cores and diced to provide a plurality of smart cards or smart devices.

[0094]

[0119] In some embodiments, a carrier tape and an IC module having antenna connection pads positioned non-opposite to the IC chip, or antenna connection pads disposed on an adjacent surface of the IC chip or smart card contact area can be provided.

[0095]

[0120] Figures 5A to 5C show non-limiting embodiments similar to the examples of Figures 1B to 1F, but one of the antenna connection pads is arranged, for example, under the position of the C6 pin compliant with ISO7816.

[0096]

[0121] Figure 5A shows a front view of the carrier tape 10 or the IC module 30, Figure 5B shows a back view of the carrier tape 10 of Figure 5A, and Figure 5C shows a back view of the IC module 30 fabricated on the carrier tape 10 of Figure 5B. For comparison, in the carrier tape of Figure 1B and the IC module of Figure 1C, it can be seen that the antenna connection pads 22, 34 are provided under a second subset of conductive pads 18 including a conductive pad between the positions of the C1 pin and the C5 pin and another conductive pad between the positions of the C3 pin and the C7 pin. However, in the carrier tape 10 of Figures 5A and 5B and the IC module 30 of Figures 5A and 5C, the antenna connection pads 22, 34 are provided under a second subset of conductive pads 18 including a conductive pad between the positions of the C3 pin and the C7 pin or a conductive pad (not shown) between the positions of the C1 pin and the C5 pin and another conductive pad at the position of the C6 pin. Alternatively, in some other embodiments (not shown), at least one of the second subset of conductive pads 18 may be arranged according to the positions of the C4 or C8 pins of ISO7816.

[0097]

[0122] Note that the hole dimensions of the second subset of through-holes 14 may be substantially different from each other (shown in Figures 5B and 5C) or may be substantially the same (not shown).

[0098]

[0123] Note that the conductive pads 17, 18 can be arranged in an array of rows and columns, and the second subset of through-holes 14 are provided in some of the conductive pads arranged in different rows and columns.

[0099]

[0124] According to another aspect of the present invention, a method of manufacturing an IC module having a direct chip attachment is provided. FIG. 6A shows a non-limiting flow sequence of a manufacturing method capable of fabricating the carrier tape of FIGS. 1A and 1B.

[0100]

[0125] In block 601, an IC chip is provided or fabricated. This block may include chip redistribution layer (RDL) processing and bump wafer processing known to those skilled in the art of fabricating IC chips.

[0101]

[0126] In block 602, a carrier tape (or a printed circuit board, PCB) as shown in FIGS. 1A and 1B is fabricated. The features of the carrier tape or PCB described above are also applicable here and will not be repeatedly described.

[0102]

[0127] In particular, block 602 includes a step of opening holes in a non-conductive substrate to provide through-holes extending from the front surface to the back surface of the substrate, a step of plating a smart card contact area having a plurality of conductive pads insulated from each other and closing the front-side ends of the through-holes on the front surface of the substrate, a step of plating through-hole solder pads disposed at the back-side ends of the through-holes on the back surface of the substrate, a step of plating a plurality of conductive traces conductively coupled to the through-hole solder pads on the back surface of the substrate, and a step of applying a solder mask that at least partially overlaps the conductive traces.

[0103]

[0128] In block 603, solder is applied to the carrier tape by solder paste printing or the like. Thus, in each of the carrier tapes, a first solder is deposited on a first subset of through-holes and a first subset of through-hole solder pads, a second solder is deposited on a second subset of through-holes and a second subset of through-hole solder pads, and a third solder is deposited on surface mount solder pads.

[0104]

[0129] In block 604, the IC chip is placed or mounted on the carrier tape. In particular, for each of the carrier tapes, the IC chip is mounted on the solder on the surface mount solder pads.

[0105]

[0130] In block 605, by reflowing the solder deposited in block 603, for each of the carrier tapes, the IC chip is conductively coupled (e.g., bonded or attached) to the surface mount solder pads. After reflow, the through holes are at least substantially filled with reflow solder, and reflow solder is provided on the through hole solder pads.

[0106]

[0131] In block 606, the IC chip is underfilled (e.g., an epoxy material is provided to the IC chip), the gap between each of the IC chips and the back surface of each of the PCBs is filled, and the underfill material is cured by heat curing or the like. Thereby, a direct chip attachment IC module is manufactured. A sealing material may be provided or deposited on the IC chip.

[0107]

[0132] In block 607, plasma cleaning of the IC module is performed to remove contaminants from the PCB.

[0108]

[0133] In block 608, the sheet including the above-described IC module is cut or punched into a desired dimension (e.g., a small piece).

[0109]

[0134] In block 609, the small pieces are connected to fabricate a carrier tape of an elongated small piece.

[0110]

[0135] In block 610, the IC module is tested.

[0111]

[0136] In block 611, the IC module is visually inspected.

[0112]

[0137] In block 612, the elongated or connected small pieces are packaged in a reel or the like.

[0113]

[0138] It should be noted that the above manufacturing method may have fewer steps, or may have more steps. Furthermore, the above steps may be replaced, omitted, changed, and / or combined.

[0114]

[0139] According to some aspects of the present invention, there is provided a method of manufacturing a circuit board inlay, such as the circuit inlay 3 shown in FIGS. 2B, 2D, and 2E. The circuit inlay 3 based on FIGS. 2B and 2D may not include the IC module 13 that is electrically coupled to the circuit inlay in the steps described below. On the other hand, the circuit inlay 3 based on FIG. 2E may be manufactured with the IC module 31. The manufacturing method, which is not limited, incorporates the manufacturing method described with reference to FIG. 6A or a part thereof. In particular, the dimensions of the non-conductive substrate provided by the manufacturing method of FIG. 6A may approximate the dimensions of the smart card contact area conforming to ISO7816, or may be a multiple of the dimensions of the smart card contact area (for example, the size of the final card or device, close to the ID-1 size). Further, conductive layers such as traces and pads may be provided on and / or formed on the front and / or back surfaces of the circuit board inlay in order to provide a card circuit, an LED circuit, and / or a biometric authentication circuit. Thus, the circuit board inlay may be equivalent to the carrier tape in such an example.

[0115]

[0140] According to some aspects of the present invention, there is provided a method of manufacturing a smart card or a smart device. FIG. 6B is a non-limiting flow sequence of a manufacturing method capable of manufacturing a smart card from the IC modules of FIGS. 1A, 1C to 1F, 5A, and 5C, as described below.

[0116]

[0141] In block 613, a circuit board inlay (without an IC module) may be placed in a stacked array by interposing it between other substrate layers and / or overlays, and laminated as known to those skilled in the art to produce a laminate core. The laminate core may be milled to provide a first cavity for receiving an IC module. In the cavity, the laminate core may be further milled to provide a plurality of second cavities smaller than the first cavity, and an antenna portion or an end of the antenna (e.g., a card antenna embedded in the laminate core) may be exposed.

[0117]

[0142] In block 614, the exposed antenna portion or antenna end is placed on the second solder on the antenna connection pad or as close as possible to the second solder.

[0118]

[0143] In block 615, the antenna is conductively coupled to the antenna connection pad by reflowing the second solder. In particular, heat is applied to a second subset of conductive pads (heat transfer pads) facing the antenna connection pad. The applied heat is transferred to the reflow solder of the antenna connection pad through the second subset of conductive pads (heat transfer pads) and the reflow solder in the through-holes of the second subset.

[0119]

[0144] When the reflow solder of the antenna connection pad melts, the melted solder is coupled or joined to the antenna portion arranged in contact with the melted solder. When the melted solder cools, the antenna connection pad is conductively coupled (e.g., firmly joined) to the antenna. Thereby, the antenna is conductively coupled to the IC chip. In other words, an electrical path from the antenna to the IC chip is configured through the antenna connection pad, the second subset of conductive traces, and the second subset of surface mount solder pads. Heat and / or pressure is applied to the laminate core to embed the IC module in the laminate core, particularly in the circuit board inlay, to provide a smart card or a smart device.

[0120]

[0145] According to some aspects of the present invention, carrier tapes and other embodiments of IC modules are provided having antenna connection pads positioned non-opposite to the IC chip, or antenna connection pads disposed on an adjacent surface of the IC chip or smart card contact area. FIGS. 7A-7C show non-limiting embodiments in which one of the antenna connection pads is located at the position of the C6 pin.

[0121]

[0146] FIG. 7A shows a perspective front view seen from the contact surface of a single-sided plated IC carrier tape 710 having a smart card contact area 716 including a plurality of conductive pads 717, 718 (e.g., six ISO-specified contact pads). FIG. 7B shows a perspective front view of an IC module 730 incorporating the carrier tape 710 of FIG. 7A according to one embodiment. FIG. 7C shows a perspective front view of an IC module 730 incorporating the carrier tape 710 of FIG. 7A according to another embodiment. In FIGS. 7A-7C, the dashed lines / dashed arrows indicate components that can be seen only from the rear view seen from the bonding surface of the carrier tape 710.

[0122]

[0147] The carrier tape 710 includes a non-conductive substrate 711 having a front or contact surface (also referred to as the first surface) and a back or bonding surface (also referred to as the second surface), a plurality of through-holes extending through the substrate 711 (e.g., from the front surface to the back surface), and conductive pads 717, 718 provided on the front and back surfaces by plating and / or etching or the like.

[0123]

[0148] The through-holes 713, 714, 715 include the through-holes 713 of the first subset, the through-holes 714 of the second subset, and the through-holes 715 of the third subset. Each of the through-holes 713, 714, 715 has opposing openings or opposing ends (e.g., the front-side end and the back-side end), and the opposing openings or opposing ends are respectively located on the front and back surfaces of the non-conductive substrate 711. The through-holes 713, 714, 715 may be provided with different dimensions and / or different shapes. In some non-limiting embodiments, the through-holes 714 of the second subset have a larger dimension or area than the through-holes 713 of the first subset. For example, the diameter of the through-holes 713 of the first subset can be about 0.6 mm to about 0.9 mm, and the diameter of the through-holes 714 of the second subset can be about 2.0 mm. However, in other non-limiting examples, the through-holes 714 of the second subset may have the same dimension or area as the through-holes 713 of the first subset. In still other non-limiting examples, some through-holes may have the same dimension or area, and some other through-holes may have different dimensions or areas. The through-holes 713 of the first subset, the through-holes 714 of the second subset, and / or the through-holes 715 of the third subset can have one or more shapes (e.g., regular shapes, irregular shapes). Non-limiting examples include circles, rounded rectangles, L-shapes, ellipses, polygons, combinations of regularly-shaped or overlapping regularly-shaped shapes connected to each other. The shapes of the through-holes 713 of the first subset, the through-holes 714 of the second subset, and / or the through-holes 715 of the third subset may be the same or different.

[0124]

[0149] The first subset of through-holes 713 located at the positions of C1 pin, C2 pin, C3 pin, C5 pin, and C7 pin are also referred to as chip bonding holes, and each of the holes 713 is configured to receive a conductive element 738 (e.g., wire bond) that electrically couples to the IC chip. The second subset of through-holes 714 are also referred to as antenna bonding holes, and each of the holes 714 is configured to receive an antenna wire / antenna terminal, or an antenna connection element that is electrically coupled to the antenna wire / antenna terminal. The third subset of through-holes 715 are also referred to as chip-antenna connection pad bonding holes, and each of the holes 715 is configured to receive a conductive element 739 (e.g., wire bond) that electrically couples the IC chip to the antenna connection pad 722. The second subset of through-holes 714 are separated from the third subset of through-holes 715 by the non-conductive substrate 711.

[0125]

[0150] The smart card contact area 716 is disposed on the front surface of the substrate 711 and completely closes the front-side ends of the through holes 713, 714, 715. The smart card contact area 716 includes a plurality of conductive pads 717, 718, and at least some of the plurality of conductive pads 717, 718 are electrically insulated from each other. The conductive pads 717, 718 can have sizes, shapes, and arrangements compliant with the standards of the International Organization for Standardization (ISO) regarding smart card manufacturing. The dimensions of the smart card contact area 716 can be approximately 85.60 mm × 53.98 mm in accordance with the ISO7816 standard. The conductive pads 717, 718 can be made of a metal (e.g., copper, nickel). The conductive pads 717, 718 include a first subset of conductive pads 717 and a second subset of conductive pads 718. Each of the conductive pads 717 in the first subset 717 includes an outer surface and an inner surface. During operation, the outer surface is electrically connected to a contact-type smart card reader or an electronic terminal to enable signal transmission between the card reader and an IC chip electrically connected to the smart card contact area 716, while the inner surface is accessible through a corresponding through hole to enable an electrically conductive element 738 (e.g., a wire) disposed in the through hole to be electrically connected to the conductive pad 717. However, each of the conductive pads 718 in the second subset 718 may not be electrically connected to a contact-type smart card reader or an electronic terminal. Different from FIGS. 1A to 1F where the conductive pads 18 in the second subset serve as heat transfer pads, the conductive pads 718 in the second subset in FIGS. 7A to 7C are not used for heat transfer and may be used as electrical conductors.

[0126]

[0151] The conductive pads 717 of the first subset can be arranged according to the positions of the C1 pin, C2 pin, C3 pin, C5 pin, and C7 pin of ISO7816. The conductive pads 718 of the second subset include a conductive pad between the positions of the C3 pin and the C7 pin or a conductive pad between the positions of the C1 pin and the C5 pin (not shown) and other conductive pads at the C6 pin position. Alternatively, in some other embodiments (not shown), at least one of the conductive pads 718 of the second subset may be arranged according to the position of the C4 pin or the position of the C8 pin compliant with ISO7816.

[0127]

[0152] In the embodiments of FIGS. 7A to 7C, the conductive pads 717 and 718 may be arranged in an array of rows and columns. In this case, the through holes 714 of the second subset are provided in a part of the conductive pads arranged in different rows and columns. As shown, one region of the conductive pads 718 of the second subset crosses a plurality of rows and columns.

[0128]

[0153] In particular, on the front surface of the carrier tape 710 or the front surface of the IC module 730, C1, C2, C3, C5, C6, and C7, which are six ISO-specified contact (conductive) pads, are provided. The first antenna connection pad 718 is composed of one conductive pad between C1 and C5, and the second antenna connection pad 718 can be composed of a combination of an ISO-specified contact pad not conventionally used, that is, an ISO-specified contact pad at the position of the C6 pin, and another conductive pad between C3 and C7. In other words, the plurality of conductive pads constituting the second antenna connection pad are conductively coupled.

[0129]

[0154] As shown in FIGS. 7B and 7C, the conductive pads 717 of the first subset block the front-end portion on the front side of the through holes 713 of the first subset, and the conductive pads 718 of the second subset block the front-end portions on the front side of the through holes 714 of the second subset and the through holes 715 of the third subset.

[0130]

[0155] As shown in FIGS. 7B and 7C, the encapsulant 728 is provided or deposited on the back or bonding surface of the substrate 711. In particular, the encapsulant 728 is deposited within the first subset of through-holes 713 and within the third subset of through-holes 715, and further on the IC chip 731 and on conductive elements such as wire bonds (see dashed lines 738, 739 from the IC chip 731 to each of the holes 713, 715) that cross the first subset of through-holes 713 and the third subset of through-holes 715. However, the encapsulant 728 may or may not be deposited within the second subset of through-holes 714, so the encapsulation region may vary depending on the embodiment.

[0131]

[0156] In the IC module 730 of FIG. 7B, the encapsulant 728 is deposited within the second subset of through-holes 714, i.e., within both antenna bonding holes 714, and each of the holes 714 is partially encapsulated and partially unencapsulated. Thus, the connection to the antenna 741 in the card body (not shown) will cross the unencapsulated portion of the antenna bonding hole 714.

[0132]

[0157] In the IC module 730 of FIG. 7C, the encapsulant 728 is deposited only within one of the second subset of through-holes 714, i.e., within one antenna bonding hole 714, and this hole 714 is partially encapsulated and partially unencapsulated. Thus, the connection to the antenna 741 in the card body (not shown) will cross the unencapsulated portion of this antenna bonding hole 714. The other one of the second subset of through-holes, i.e., the other antenna bonding hole, has no encapsulant, i.e., the other antenna bonding hole is unencapsulated. Thus, the other connection to the antenna 741 in the card body (not shown) will cross the completely unencapsulated antenna bonding hole 714.

[0133]

[0158] In other embodiments (not shown) of the IC module, the encapsulant is deposited on the back surface of the substrate without being deposited in any of the second subset of through-holes 714. In other words, there is no encapsulant in both antenna bonding holes 714, that is, both antenna bonding holes 714 are not encapsulated.

[0134]

[0159] In both FIGS. 7B and 7C, at each of the antenna connection pads 718 or the antenna bonding pads, the antenna bonding holes 714 and the third subset of through-holes 715 (e.g., L-shaped bonding holes, elongated bonding holes, and / or bonding holes of other suitable shapes) end at the antenna connection pad 718. The antenna 741 in the card body is conductively coupled to the IC chip 731 via an antenna connection element disposed within the antenna bonding hole and also via a conductive element 739 disposed within the third subset of through-holes 715. Each of the antenna connection elements may comprise a rigid conductive bump or solder bump, a conductive disk, a flexible conductive bump made of a conductive adhesive, or may include a portion of the antenna 741.

[0135]

[0160] Accordingly, each of the antenna bonding holes 714 is configured to allow a maximum of only one conductive element (e.g., a single wire or connection element) that connects the antenna 741 to the antenna connection pad 718. There are no other wires or other electrical connections in each of the antenna bonding holes 714 that connect the IC chip 731 to the antenna connection pad 718.

[0136]

[0161] According to another aspect of the present invention, another embodiment of a smart card having both a contact interface and a non-contact interface and incorporating the IC module of FIG. 7B or FIG. 7C is provided. The smart card includes a card body having an opening and an antenna 741, an IC module 730 of FIG. 7B or FIG. 7C disposed within the opening, and an antenna connection element disposed within the antenna bonding hole 714 of the IC module 730 and electrically coupling the antenna 741 to the antenna connection pad 718. The card body may include a laminate core of a substrate layer, and the antenna may be interposed between the substrate layers (e.g., disposed on any of the layers).

[0137]

[0162] Embodiments of the present invention provide several advantages, including but not limited to the following.

[0138]

[0163] The embodiments of FIGS. 1A - 1F provide alternative means for existing smart card substrates, carrier tapes, and IC modules. Additionally, alternative manufacturing processes that incorporate surface mount technology on high - density substrates to improve productivity are also provided.

[0139]

[0164] The embodiments of FIGS. 1G, 2F, and 2G provide alternative means for eliminating conductive coupling through the physical connection between the IC chip and the card antenna, resulting in improved reliability and lifespan of the smart card.

[0140]

[0165] The embodiments of FIGS. 2A - 2E provide alternative means for the connection design of the smart card contact area.

[0141]

[0166] The embodiments of FIGS. 5A - 5C provide alternative means for the antenna connection design that utilizes the bonding holes of unused pins, and further provide alternative means for the embedding process of integrating the IC module with the card body structure.

[0142]

[0167] The embodiments of FIGS. 7A to 7C provide an alternative means of antenna connection design that utilizes the bonding holes of unused pins, and also enables the use of a single-sided plated carrier tape in the assembly process, thereby achieving cost reduction through a significant reduction in the raw materials for the bonding direction design.

[0143]

[0168] It should be understood that the above-described embodiments and features are to be considered as illustrative and not restrictive. Many other embodiments will be apparent to those skilled in the art upon considering the specification and implementation of the present invention. Furthermore, specific terms are used for the purpose of clarifying the description and are not intended to limit the embodiments disclosed in the present invention.

Claims

1. A non-conductive substrate having a front surface and a back surface, and a plurality of through holes extending from the front surface to the back surface; A smart card contact area disposed on the front surface of the substrate, having a plurality of conductive pads that are insulated from each other and close the ends of the through holes on the front surface side; A plurality of through hole solder pads disposed on the back surface of the substrate at the ends of the through holes on the back surface side, and a plurality of conductive traces disposed on the back surface of the substrate and conductively coupled to the through hole solder pads respectively; A solder mask that at least partially overlaps the conductive traces; A manufactured product comprising the above.

2. Further comprising a first solder disposed in the first subset of the through holes and on the first subset of the through hole solder pads, and configured to conductively couple the first subset of the conductive pads to the first subset of the conductive traces; The manufactured product according to Claim 1.

3. Further comprising an integrated circuit (IC) chip, The IC chip is conductively coupled to the first subset of the conductive pads by being conductively coupled to the first subset of the conductive traces by direct chip attachment; The manufactured product according to Claim 2.

4. Further comprising an underfill material interposed between the IC chip and the back surface of the substrate and / or a sealing material provided on the IC chip, At the ends of the through holes on the back surface side, there is substantially no underfill material, solder mask, and / or sealing material; The manufactured product according to Claim 3.

5. A second solder disposed in the second subset of the through holes and on the second subset of the through hole solder pads, And an antenna, The second subset of the through hole solder pads and the second solder cooperate to provide a plurality of antenna connection pads. The IC chip is conductively coupled to the second subset of the through hole solder pads through the second subset of the conductive traces; The antenna is conductively coupled to the IC chip by being conductively coupled to the antenna connection pads; The manufactured product according to Claim 4.

6. A biometric authentication circuit conductively coupled to the IC chip, and / or Further comprising a light emitting diode (LED) circuit including at least one LED module and a second antenna conductively coupled thereto. The second antenna is configured to be inductively coupled to a non-contact reader to activate the at least one LED module. The manufactured product according to claim 5.

7. Further comprising surface mount solder pads disposed on the back surface of the substrate and conductively coupled to the through-hole solder pads of the first subset via the conductive traces of the first subset. The IC chip is disposed under the smart card contact area and is conductively coupled to the surface mount solder pads. The manufactured product according to any one of claims 3 to 6.

8. The through-holes of the second subset are positioned non-opposite to the IC chip. The manufactured product according to any one of claims 3 to 7.

9. At least some of the conductive pads are arranged in an array of rows and columns. The through-holes of the second subset are arranged in different rows and columns. The manufactured product according to any one of claims 3 to 7.

10. One of the through-holes of the second subset is arranged at the position of the C6 pin compliant with ISO7816. The manufactured product according to any one of claims 3 to 8.

11. The IC chip is arranged offset with respect to the smart card contact area. The manufactured product according to claim 3.

12. The substrate is dimensioned according to an ID-1 size, half of the ID-1 size, or one-fourth of the ID-1 size compliant with ISO7810. The manufactured product according to any one of claims 3 to 11.

13. The substrate, the smart card contact area, the through-hole solder pads, the conductive traces, the solder mask, the first solder, and the second solder are provided as a printed circuit board. The manufactured product according to any one of claims 1 to 12.

14. The conductive trace includes a module antenna that at least partially surrounds the through-hole solder pads. The manufactured product according to claim 1 or 2.

15. Comprising a laminate core having a plurality of laminate layers. One of the laminate layers comprises the manufactured product according to any one of claims 3 to 14. Smart card.

16. Connecting the integrated circuit (IC) chip to the conductive traces of the first subset of the manufactured product of claim 1 or 2 to conductively couple the IC chip to the contact pins; Providing an underfill material between the IC chip and the substrate and providing a sealing material on the IC chip; In the step of providing the underfill material and the sealing material, the end portion on the back side of the through hole is made substantially free of the underfill material, the solder mask, and / or the sealing material. A method of manufacturing an IC module.

17. Comprising the step of conductively coupling an antenna to the IC chip by conductively coupling the antenna to the antenna connection pads of any one of claims 5 to 13. A method of manufacturing a smart card.

18. Drilling holes in a non-conductive substrate to provide through holes extending from the front surface to the back surface of the substrate; Plating a smart card contact area having a plurality of conductive pads that are mutually insulated and close the end portion on the front side of the through hole on the front surface of the substrate; Plating a through hole solder pad disposed at the end portion on the back side of the through hole on the back surface of the substrate; Plating a plurality of conductive traces conductively coupled to the through hole solder pad on the back surface of the substrate; Applying a solder mask that at least partially overlaps the conductive trace; Comprising A method of manufacturing a manufactured product.

19. Further comprising the step of depositing a first solder in the through holes of the first subset and on the through hole solder pads of the first subset, The first solder is configured to conductively couple the conductive pads of the first subset to the conductive traces of the first subset through the through hole solder pads of the first subset. The manufacturing method according to claim 18.

20. Depositing a second solder in the through holes of the second subset and on the through hole solder pads of the second subset to enable the through hole solder pads of the second subset and the second solder to cooperate to provide a plurality of antenna connection pads; Depositing a third solder on a plurality of surface mount solder pads at the ends of the conductive traces at a position far from the through hole solder pads. A step of arranging an integrated circuit (IC) chip on the back surface of the substrate; A step of electrically connecting the IC chip to the conductive pads of the first subset and the IC chip to the through-hole solder pads of the second subset through at least reflowing the first solder, the second solder, and the third solder, thereby electrically coupling the IC chip to the conductive pads of the first subset and the IC chip to the through-hole solder pads of the second subset via the conductive traces of the first subset; further comprising; The manufacturing method according to claim 18.

21. A step of providing an underfill material interposed between the IC chip and the substrate; A step of providing a sealing material on the IC chip; A step of maintaining a state in which the underfill material, the solder mask, and / or the sealing material are substantially absent at the end portions on the back surface side of the through-holes; further comprising; The manufacturing method according to claim 20.

22. The IC chip is electrically coupled to the through-hole solder pads of the second subset via the conductive traces of the second subset, further comprising a step of electrically coupling the antenna to the IC chip by electrically coupling the antenna to the antenna connection pads; The manufacturing method according to claim 21.

23. A non-conductive substrate including through-holes of a first subset, through-holes of a second subset, and through-holes of a third subset, and having a plurality of through-holes extending from a front surface to a back surface; A plurality of conductive pads including conductive pads of a first subset respectively arranged to block the through-holes of the first subset and conductive pads of a second subset arranged to block the through-holes of the second subset and the through-holes of the third subset, and having a smart card contact area arranged on the front surface of the substrate; An IC chip arranged on the back surface of the substrate; A plurality of conductive elements crossing the through-holes of the first subset and the through-holes of the third subset and electrically coupling the conductive pads of the first subset and the conductive pads of the second subset to the IC chip; A sealing material deposited in the through-holes of the first subset and the through-holes of the third subset and further deposited on the IC chip and the conductive elements; comprising; The through holes of the second subset are separated from the through holes of the third subset by the substrate, The through holes of the second subset are located non-opposite to the IC chip, An integrated circuit (IC) module for a smart card having both a contact interface and a non-contact interface.

24. At least some of the conductive pads are arranged in an array of rows and columns, and the through holes of the second subset are arranged in different rows and columns. The IC module according to claim 23.

25. One of the conductive pads of the second subset includes a region that crosses a plurality of rows and columns. The IC module according to claim 23.

26. The encapsulant is further deposited in at least one of the through holes of the second subset. The IC module according to any one of claims 23 to 25.

27. At least one of the through holes of the second subset is adapted to receive the encapsulant. The IC module according to any one of claims 23 to 26.

28. One of the conductive pads of the second subset is arranged at the position of the C6 pin conforming to ISO7816. The IC module according to any one of claims 23 to 27.

29. A card body having an opening and an antenna, The integrated circuit (IC) module according to any one of claims 23 to 28 disposed in the opening, A pair of antenna connection elements disposed in the through holes of the second subset and electrically connecting the antenna to the conductive pads of the second subset. A smart card having both a contact interface and a non-contact interface, comprising:

30. Each of the antenna connection elements includes a rigid conductive bump or solder bump, a conductive disk, a flexible conductive bump made of a conductive adhesive, or a part of the antenna. The smart card according to claim 29.

31. Each of the through holes of the second subset is adapted to receive at most one of the conductive elements. The smart card according to any one of claims 23 to 27.

32. A non-conductive substrate including through-holes of a first subset, through-holes of a second subset, and through-holes of a third subset, and having a plurality of through-holes extending from a front surface to a back surface conforming to the arrangement of IC chips. A first subset of conductive pads arranged to block the through-holes of the first subset respectively, and a second subset of conductive pads arranged to block the through-holes of the second subset and the through-holes of the third subset, having a plurality of conductive pads including, and a smart card contact area arranged on the front surface of the substrate. Comprising. The through-holes of the first subset and the through-holes of the third subset are adapted to receive a plurality of conductive elements that conductively couple the conductive pads of the first subset and the conductive pads of the second subset to the IC chip. The through-holes of the first subset, the through-holes of the third subset, the IC chip, and the conductive elements are adapted to receive a sealing material. The through-holes of the second subset are separated from the through-holes of the third subset by the substrate. The through-holes of the second subset are located non-opposite to the IC chip. A single-sided plated integrated circuit (IC) carrier tape suitable for use in a smart card having both a contact interface and a non-contact interface.

33. The conductive pads are arranged in an array of rows and columns, and the through-holes of the second subset are provided in some of the conductive pads arranged in different rows and columns. The carrier tape according to claim 32.

34. One region of the conductive pads of the second subset crosses a plurality of rows and columns. The carrier tape according to claim 33.

35. At least one of the through-holes of the second subset is adapted to receive the sealing material. The carrier tape according to any one of claims 32 to 34.

36. One of the conductive pads of the second subset is arranged at the position of a C6 pin conforming to ISO 7816. The carrier tape according to any one of claims 32 to 35.

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