Wireless IC metal card with a clad metal structure and method for manufacturing the same

Abstract

The wireless IC metal card according to an embodiment of the present invention includes a first metal layer that houses a wireless IC chip on an upper surface, an antenna layer that is disposed in a partial region on a lower surface of the first metal layer and is electrically connected to the wireless IC chip, a second metal layer that is disposed below the first metal layer with the antenna layer interposed therebetween, and a third metal layer that is disposed below the second metal layer, and the first metal layer, the second metal layer, and the third metal layer are joined to each other to form a clad metal structure.

Description

Technical Field

[0001] The present invention relates to a metal card and a method for manufacturing the metal card. More specifically, the present invention relates to a wireless IC metal card having a clad metal structure and a method for manufacturing the same.

Background Art

[0002] Generally, credit cards can be used not only instead of cash, but recently, they have been developed as smart cards incorporating IC chips capable of recording a large amount of information, and are actively used not only for settlement but also as various membership cards and the like.

[0003] In such a smart card market, efforts have been made to develop special cards using various materials. In particular, efforts have been made to develop credit cards made of metal materials differentiated for VIP customers, and metal cards have been provided to special customers by realizing high-quality credit cards with a metallic luster.

[0004] In particular, recently, a method of manufacturing a metal card by using a thin film metal sheet or thinly coating metal powder has been proposed. However, such a thin film metal card is vulnerable to bending and warping, and also has a problem of poor durability such as corrosion.

[0005] Also, at present, using duralumin, which is used as a material for manufacturing aircraft, on the surface of a metal card has been proposed. This has the characteristics of being light and strong. However, due to its difficulty in processing, the manufacturing cost is high, and it is difficult to perform processing such as patterning. Therefore, from the aspects of ease of use and design, inconvenience in the manufacturing process is caused. Also, because it is too light, it is difficult to actually give a metallic weight feeling, and it is currently difficult to distinguish it from plastic cards.

[0006] Furthermore, when the wireless IC card is made of a metal material, an antenna layer connected to the wireless IC chip is provided, but there is a problem that the communication performance is also reduced due to the interference of radio waves by the metal material.

[0007] Therefore, at present, efforts are desired to develop a high-quality metal card that overcomes the limitations of such metal cards, is easy to process, can well express aesthetic feeling in terms of design, provides the unique weight of metal, and also has durability and corrosion resistance.

Summary of the Invention

Problems to be Solved by the Invention

[0008] The present invention was created to solve the above problems, and by providing a wireless IC metal card having a clad metal structure formed by joining multiple metal layers and a manufacturing method thereof, it overcomes the communication limitations of metal cards, is easy to process, can well express aesthetic feeling in terms of design, and provides a high-quality metal card that has the unique weight of metal and also has durability and corrosion resistance.

Means for Solving the Problems

[0009] The wireless IC metal card according to an embodiment of the present invention for solving the above problems includes a first metal layer that houses a wireless IC chip on an upper surface, an antenna layer that is disposed in a partial region on a lower surface of the first metal layer and is electrically connected to the wireless IC chip, a second metal layer that is disposed below the first metal layer with the antenna layer interposed therebetween, and a third metal layer that is disposed below the second metal layer, and the first metal layer, the second metal layer, and the third metal layer are joined to each other to form a clad metal structure.

[0010] Also, a method for manufacturing a wireless IC metal card according to an embodiment of the present invention for solving the above problems includes a step of providing a first metal layer for accommodating a wireless IC chip on an upper surface, a step of disposing an antenna layer electrically connected to the wireless IC chip in a partial region on a lower surface of the first metal layer, a step of disposing a second metal layer below the first metal layer with the antenna layer interposed therebetween, a step of disposing a third metal layer below the second metal layer, and a step of forming a clad metal structure accompanying joining of the first metal layer, the second metal layer, and the third metal layer by aligning and pressing the first metal layer, the second metal layer, and the third metal layer to join them to each other.

Effect of the Invention

[0011] According to an embodiment of the present invention, a wireless IC metal card can include a clad metal structure of a first metal layer, a second metal layer, and a third metal layer formed by being joined to each other, and an antenna layer electrically connected to the wireless IC chip can be configured to be positioned between the first metal layer and the second metal layer. Therefore, it supports the configuration of a joined body of multiple metal material layers in various forms using the first metal layer, the second metal layer, and the third metal layer, and enables processing of the wireless IC metal card using the same.

[0012] Thereby, the wireless IC metal card according to an embodiment of the present invention can easily perform surface processing and express a good aesthetic sense in terms of design by forming a composite joined body using the structuring of clad metal of various metal materials. However, the intermediate layer can provide the weight peculiar to the metal, and while overcoming the communication limit of the metal card by the connection configuration of the antenna between the layers, it is possible to quickly and easily develop a high-quality metal card capable of enhancing durability and corrosion resistance by performing pre-treatment for each layer.

Brief Description of the Drawings

[0013]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Embodiments for Carrying Out the Invention

[0014] The following content merely exemplifies the principles of the present invention. Therefore, those skilled in the art can invent various devices and methods that realize the principles of the present invention and are included in the concept and scope of the present invention, even if they are not explicitly described or illustrated in this specification. Note that all conditional terms and embodiments listed in this specification are, in principle, only explicitly intended for the purpose of enabling the understanding of the concept of the present invention, and should not be construed as being limited to the specifically listed embodiments and states.

[0015] For example, throughout the specification, if a part is "connected" to another part, this includes not only the case where it is "directly connected", but also the case where it is "indirectly connected" with other members interposed therebetween. Note that when a part "comprises" a certain component, this means that, unless otherwise specified, it does not exclude other components, and it may further comprise other components.

[0016] Also, it should be understood that all the detailed descriptions listing specific embodiments are intended to include structural and functional equivalents of such matters, not only for the principles, aspects and embodiments of the present invention, but also for those currently known and those to be developed in the future, that is, all elements invented to perform the same function regardless of structure.

[0017] The above-described objects, features and advantages should become even more apparent from the following detailed description taken in conjunction with the accompanying drawings, whereby those of ordinary skill in the technical field to which the present invention pertains should be able to easily implement the technical idea of the present invention. Note that when it is recognized that a specific description of known techniques related to the present invention may obscure the gist of the present invention, the detailed description thereof is omitted.

[0018] FIG. 1 is a view showing the front surface of a wireless IC card according to an embodiment of the present invention, and FIG. 2 is an exploded perspective view of the wireless IC card according to an embodiment of the present invention.

[0019] Referring to FIGS. 1 and 2, as the wireless IC card 100 according to an embodiment of the present invention, a credit card having a wireless IC chip 112 mounted on the front surface can be exemplified, and characters for identifying the card company and the like may be formed (printed or marked or etched, NC processed, laser processed, etc.) on the front and back surfaces by various methods.

[0020] Further, the wireless IC card 100 according to the embodiment of the present invention includes a first metal layer 110 that houses a wireless IC chip 112 on its upper surface, an antenna layer 120 that is disposed in a partial region on the lower surface of the first metal layer 110 and is electrically connected to the wireless IC chip 112, and a second metal layer 130 that is disposed below the first metal layer 110 with the antenna layer 120 interposed therebetween and a third metal layer 140 that is disposed below the second metal layer 130. The first metal layer 110, the second metal layer 130, and the third metal layer 140 can be joined to each other to form a clad metal structure.

[0021] Here, the clad metal is a structure that is difficult to be artificially peeled off and is formed such that the structures of the bonding interface penetrate each other, and the bonding force becomes stronger as time passes.

[0022] Here, the second metal layer 130 located in the middle may be different from the metal materials of the first metal layer 110 and the third metal layer 140 and may be formed such that its weight is even higher than the weight of the first metal layer 110 and the weight of the third metal layer 140.

[0023] Further, the thickness of the second metal layer 130 may be formed to be even thicker than the first metal layer 110 and the third metal layer 140, and its weight may be formed to be even higher than the weight of the first metal layer 110 and the weight of the third metal layer 140.

[0024] According to such a combination of the materials and weights of the first metal layer 110, the second metal layer 130, and the third metal layer 140, it is possible to realize a metal processing method that enables various surface treatments while improving the sense of weight.

[0025] That is, each of the metal layers 110, 130, and 140 of the wireless IC card 100 according to the embodiment of the present invention can be selected in consideration not only of the material specific to the metal card but also of durability, wear degree, degree of deformation, etc. to withstand the processing steps.

[0026] Thereby, for example, the metal card can be manufactured from at least one or more metal materials of conductors having conductivity such as super titanium, scandium, titanium, duralumin, stainless steel (SUS), aluminum-based, copper-based, etc. that have good elastic restoring force.

[0027] Preferably, the first metal layer 110 and the third metal layer 140 are formed from one of aluminum or duralumin, and the second metal layer 130 may be formed from one of cupronickel or stainless steel.

[0028] In the case of aluminum-based, due to its high softness, there is an aspect that surface processing using a roll pattern or the like is easy, and the layer of the surface-processed aluminum material can be prevented from corrosion by performing anodizing treatment before bonding.

[0029] Also, preferably, the first metal layer 110 and the third metal layer 140 are formed from a stainless steel material, and the second metal layer 130 may be formed from a cupronickel material.

[0030] In the case of a stainless steel material, it has high durability and is easy to form patterns using NC processing or the like.

[0031] Also, when the second metal layer 130 is composed of a cupronickel material, a high weight can be provided, and it is also possible to adjust the thickness to further increase the weight.

[0032] As one embodiment, a metal card with SUS as the base layer may be corrosion-resistant and a material that can be heat-treated. Heat treatment refers to an operation process of heating a metal to a certain temperature and improving certain desired properties and metal structure according to the cooling rate.

[0033] Furthermore, when manufacturing the wireless IC card 100, the SUS can be processed by performing a heat treatment process so as to improve strength and resilience.

[0034] On the other hand, as described above, the first metal layer 110 and the third metal layer 140 may be made of aluminum. A metal card with the front and back made of aluminum has the characteristics of being light and highly durable, and is easier to process compared to other materials and can be manufactured in a variety of shapes. Since the aluminum material can be subjected to a variety of surface treatments and has excellent usability, it is easy to apply a variety of patterns and characters such as patterns to a metal card made of aluminum.

[0035] On the other hand, as shown in FIG. 2, the wireless IC card 100 according to the embodiment of the present invention includes a first metal layer 110, a wireless IC chip 112, an antenna layer 120, a second metal layer 130, and a third metal layer 140.

[0036] First, in order to accommodate the wireless IC chip 112 in the first metal layer 110 of the wireless IC card 100 according to the embodiment of the present invention, an IC chip accommodation portion 111 may be formed by opening a certain area of the first metal layer 110 so as to accommodate the wireless IC chip 112.

[0037] Here, the IC chip accommodation portion 111 may be formed by opening the first metal layer 110 by an area and depth corresponding to the position and shape of the wireless IC chip 112 by performing punching, etching, NC processing, etc. on the first metal layer 110.

[0038] Then, in the first metal layer 110 according to the embodiment of the present invention, a slit portion 150 is formed by being cut open from one side of the IC chip accommodating portion 111 in the direction of the outer edge of the wireless IC card 100. While reducing the hindrance to the shielding of the wireless signal of the metal card, at least one of the metal layers 110, 130, 140 is configured in a shape that extends the winding pattern of the antenna layer 120.

[0039] Accordingly, the slit portion 150 includes a first slit portion 150a formed by being cut open from one side of the IC chip accommodating portion 111 in the direction of the outer edge of the first metal layer 110, and corresponding to the first slit portion 150a, a second slit portion 150b formed by being cut open in the direction of the outer edge of the second metal layer 130, and corresponding to the second slit portion 150b, a third slit portion 150c formed by being cut open in the direction of the outer edge of the third metal layer 140. Slit portions 150a, 150b, 150c may be formed for each of the metal layers 110, 130, 140.

[0040] As shown in FIG. 2, in the embodiment of the present invention, it is exemplified that the cut widths and directions of the slit portions 150a, 150b, 150c are the same. However, for adjusting the wireless characteristics, wireless sensitivity, and resonance frequency, the cut widths and directions of one or more slit portions may be formed to be different from those of other slit portions.

[0041] For example, the slit portions 150a, 150b, 150c may be formed to have a preset width corresponding to the width of the IC chip accommodating portion 111 up to the outer edge of the wireless IC card 100. Slit structures having various shapes such as a straight line, a zigzag, a diagonal line, and a sawtooth structure may be formed to be the same as or different from each other for each of the slit portions 150a, 150b, 150c.

[0042] And the preset width may be set to be narrower, wider, or equal to the width of the IC chip accommodating portion 111.

[0043] Here, the slit portions 150a, 150b, and 150c may be regions formed by cutting in the outer edge direction of the wireless IC card 100 so that the first metal layer 110, the second metal layer 130, and the third metal layer 140 do not shield the wireless signal. In the slit portions 150a, 150b, and 150c, a finishing member made of a material having electrical insulation may be inserted into at least one of the remaining spaces formed by the respective slit portions 150a, 150b, and 150c.

[0044] For example, as the finishing member, a reinforcing pin or joint of a PVC material, a rubber reinforcing material, etc. may be inserted to maintain the overall shape and durability of the wireless IC card 100, and it is also possible to prevent dust from accumulating in the remaining space.

[0045] Here, due to the cut structure of the slit portions 150a, 150b, and 150c, each of the metal layers 110, 130, and 140 of the wireless IC card 100 will have a predetermined inductance corresponding to the wireless magnetic signal. Thereby, when one end or the other end of the antenna of the antenna layer 120 according to the embodiment of the present invention is connected to the first metal layer 110, the second metal layer 130, and the third metal layer 140, it can function as one winding coil provided in the antenna layer 120.

[0046] Therefore, the first metal layer 110, the second metal layer 130, and the third metal layer 140 themselves can be utilized as the coil of one of the antenna layers 120. Thereby, while improving the transmission and reception performance of the wireless antenna of the wireless IC card 100, the wireless IC metal card can be efficiently manufactured without separately providing a shielding layer or the like.

[0047] Then, the antenna layer 120 may be disposed in a certain area on the lower surface of the first metal layer 110 and may be electrically connected to the wireless IC chip 112, enabling the transmission and reception of wireless signals with an external device such as a card reader.

[0048] Here, the antenna layer 120 may include one or more antenna patterns formed by being wound around the IC chip housing portion 111 so as to be electrically connected to the wireless IC chip 112 and perform a communication function while transmitting and receiving wireless signals with an external device.

[0049] And the first metal layer 110 and the third metal layer 140 may be composed of a first metal material that forms a pattern and characters like a pattern on the surface of the wireless IC card 100, and the second metal layer 130 may be composed of a second metal material intended to increase the weight of the wireless IC card 100.

[0050] Also, the second metal layer 130 may be formed to be thicker than the first metal layer 110 or the third metal layer 140 so as to increase the weight of the wireless IC card 100.

[0051] Thereby, the first metal layer 110, the second metal layer 130, and the third metal layer 140 can be formed to be different in various ways according to the laminated structure and materials, and by performing the steps of applying an adhesive between the metal layers and a bonding press process, the wireless IC card 100 composed of a clad metal joined body can be manufactured.

[0052] Here, as the method of bonding between the metal layers, there is a method of bonding using a thermoplastic or thermosetting adhesive having ethylene vinyl acetate (EVA, ethylene vinyl acetate copolymer), polyolefin, polyamide, polyester, cellulose, nylon, rubber (natural synthetic) components.

[0053] As a result, Table 1 below shows various embodiments in which at least one or more metals can be used for the first metal layer 110, the second metal layer 130, and the third metal layer 140 according to the embodiments of the present invention.

[0054]

Table 1

[0055] As shown in Table 1 above, the total weight of the metal can be adjusted using the properties of the metal that can be used.

[0056] In addition, the first metal layer 110, the second metal layer 130, and the third metal layer 140 can also change the applicable metal thickness to design a metal card with a more free thickness and weight.

[0057] For example, as in the first embodiment and the second embodiment, aluminum can be used as the material for the first metal layer 110 and the third metal layer 140, and cupronickel or stainless steel can be used as the material for the second metal layer 130.

[0058] Here, in the first embodiment and the second embodiment, as the thickness ratio of the first metal layer 110, the second metal layer 130, and the third metal layer 140, preferably, 1:2:1 is applicable, and the weight ratio is preferably 1:6:1.

[0059] More specifically, the weight ratio of the first metal layer 110, the second metal layer 130, and the third metal layer 140 can be calculated as the ratio of the values obtained by multiplying the thickness of each metal layer by the specific gravity of the metal.

[0060] For example, in the first embodiment, when applying a thickness ratio of 1:2:1 for the first metal layer 110, the second metal layer 130, and the third metal layer 140, since the specific gravity of aluminum is 2.7 and the specific gravity of cupronickel is 8.8, the weight ratio of the first metal layer 110, the second metal layer 130, and the third metal layer 140 can preferably be calculated as 1:6:1.

[0061] Also, as in the third embodiment, as the material for the first metal layer 110 and the third metal layer 140, stainless steel (SUS) can be used, and as the material for the second metal layer 130, cupronickel or stainless steel can be used.

[0062] For example, in the third embodiment, a thickness ratio of 1:2:1 can be applied for the first metal layer 110, the second metal layer 130, and the third metal layer 140, and the weight ratio may be approximately 1:2:1. For example, when applying a thickness ratio of 1:2:1 for the first metal layer 110, the second metal layer 130, and the third metal layer 140, since the specific gravity of stainless steel is 7.9 and the specific gravity of cupronickel is 8.8, the weight ratio of the first metal layer 110, the second metal layer 130, and the third metal layer 140 can be calculated as approximately 1:2:1.

[0063] FIG. 3 is a diagram showing a side view of the wireless IC card according to the embodiment of the present invention.

[0064] First, referring to FIG. 3(a) as the prior art, a metal card utilizing duralumin having the characteristics of being light and having high strength has a certain area of the metal layer on the upper surface of the duralumin material having a thickness of D1 opened to accommodate the wireless IC chip. The wireless IC chip is connected to the intermediate antenna circuit, and on its lower surface, the metal layer on the lower surface of the duralumin material and the back finishing member are continuously arranged and joined. Usually, the thickness of D1 is formed to be 0.8T (0.8 mm) or more to provide a sense of weight of the metal.

[0065] However, it is by no means easy to perform pattern processing on the front and back surfaces of such a metal card due to the high hardness of duralumin. Also, when processing the IC chip accommodation part, since the thickness of the metal layer on the upper surface is thick and high energy is required to penetrate it, productivity decreases and the defect rate increases.

[0066] In contrast, referring to FIG. 3(b), in the wireless IC card 100 according to the embodiment of the present invention, the first metal layer 110 and the third metal layer 140 made of an aluminum material having a thickness of D2 can be arranged, and a certain region of the first metal layer 110 may be formed to be opened so as to accommodate the wireless IC chip 112.

[0067] And since the thickness of D2 can be formed to be thin, such as 0.2T (0.2 mm) for example, the IC chip accommodation part 111 to be opened can be formed even with very little energy by performing punching, etching, NC processing, etc., and the processing efficiency can be improved.

[0068] As a result, while being easier to process than the conventional technology, the thickness of the NC processing for forming the IC chip accommodation part 111 also decreases. Therefore, the wireless IC card 100 according to the embodiment of the present invention proposed in FIG. 3(b) can reduce the defect rate while improving productivity.

[0069] Nevertheless, in the wireless IC card 100 according to the embodiment of the present invention, a second metal layer 130 with a sense of weight is arranged between the antenna layer 120 and the third metal layer 140, so that a wireless IC card 100 with an improved sense of weight can be designed so that the user can further feel the sense of weight peculiar to metal.

[0070] In addition, by using a soft material such as aluminum for the first metal layer 110 and the third metal layer 140, it becomes easier to form patterns and characters like patterns by a rolling process, and it is also possible to achieve a variety of color tones.

[0071] FIG. 4 is a diagram for explaining corrosion and prevention of corrosion of the wireless IC card according to the embodiment of the present invention.

[0072] FIG. 4(a) is a diagram showing normal contact corrosion caused by the potential difference between two metals due to contact between dissimilar metals.

[0073] Referring to FIG. 4(a), for example, aluminum can be used for the first metal layer and the third metal layer that are joined to each other, and a copper-based material can be joined to the intermediate second metal layer to increase the weight to form a clad metal.

[0074] Here, as a result of the electrons of copper, which is negatively charged, concentrating on aluminum, which is positively charged, there is a possibility that dissimilar metal contact corrosion (galvanic corrosion) may occur due to the potential difference between two different metals at the joint of the first metal layer and the third metal layer using aluminum as the first metal, as shown in the corrosion region 10 in the figure, and there is a possibility that it may be formed with color unevenness.

[0075] As another embodiment, if stainless steel (SUS) as the first metal is used as the material for the first metal layer and the third metal layer, and copper as the second metal is used as the material for the second metal layer, as a result of the electrons of stainless steel (SUS), which is relatively negatively charged, concentrating on copper, which is positively charged, there is a possibility that dissimilar metal contact corrosion (galvanic corrosion) may occur in copper, which is the second metal layer. As a result of the electrons of stainless steel, which is the relatively negatively charged first metal or third metal, concentrating on copper, which is the positively charged second metal, there is a possibility that copper may corrode.

[0076] Thus, in order to prevent the occurrence of the contact corrosion, before laminating the first metal layer 110, the second metal layer 130, and the third metal layer 140, an anodizing treatment or other insulation treatment for insulation may be performed on the surfaces of the first metal layer 110 and the third metal layer 140 using aluminum or stainless steel.

[0077] FIG. 4(b) is a diagram showing a lamination of metals subjected to an insulation treatment to prevent contact corrosion between dissimilar metals.

[0078] For example, as shown in FIG. 4(b), the first metal layer 110 and the third metal layer 140 indicated by the dotted line are a type of aluminum coating, and an anodizing treatment for insulation is performed on the surface of aluminum to enhance the corrosion resistance of preventing contact corrosion between dissimilar metals.

[0079] Thus, when the anodized first metal layer 110 and the third metal layer 140 come into contact with the second metal layer 130 that increases the weight of the wireless IC card 100, the occurrence of an oxidation phenomenon can be reduced, the contact corrosion phenomenon between dissimilar metals can be prevented, and the possibility of discoloration due to the surrounding environment can be reduced.

[0080] In addition, the anodized aluminum can make use of the natural feeling and texture of the metal, can have a wider variety of color choices, and the color of the anodized surface can be consistently and uniformly distributed.

[0081] As another embodiment, the first metal layer 110 and the third metal layer 140 made of stainless steel (SUS) may be subjected to an insulation treatment so as to prevent contact corrosion with the second metal layer 130 made of copper.

[0082] This can prevent the phenomenon of corrosion occurring in the second metal layer 130, and a wireless IC card 100 adopting a design in which laser processing is performed on stainless steel (SUS) which is the material of the first metal layer 110 can be manufactured.

[0083] FIG. 5 is a diagram showing a corrosion state that may occur when a clad metal of a wireless IC card is applied.

[0084] Referring to FIG. 5, if aluminum is used as the material of the first metal layer 110 and the third metal layer 140 of the wireless IC card 100, and copper is used as the material of the second metal layer 130, electrons of copper which is relatively negatively charged will concentrate on aluminum which is positively charged, resulting in a possibility that aluminum may corrode.

[0085] Also, as shown in FIG. 5, there is a possibility that corrosion may occur in the first metal layer and the third metal layer using aluminum, and the wireless IC card 100 may be formed with color unevenness as a whole.

[0086] Thus, in order to prevent contact corrosion (galvanic corrosion) between dissimilar metals caused by the potential difference between two different metals, it is preferable to perform an insulation treatment such as anodizing on at least one of the two metal layers.

[0087] FIG. 6 is a diagram for explaining an array pattern of an antenna layer according to an embodiment of the present invention.

[0088] Referring to FIG. 6, the antenna layer 120 is disposed on the lower surface of the first metal layer 110, can be electrically connected to the wireless IC chip 112, and can transmit and receive wireless signals with an external device such as a card reader.

[0089] Here, while the antenna layer 120 transmits and receives radio signals with an external device, it may include one or more antenna patterns formed by being wound around the IC chip housing portion 111 so as to be electrically connected to the radio IC chip 112 and perform a communication function.

[0090] And, since the antenna layer 120 can be joined and connected so that the wireless IC card 100 can form one winding of the antenna pattern, one end and the other end of each pattern may be connected to at least one of the first joining position 121 of the first metal layer 110 and the second joining position 122 of the second metal layer 130.

[0091] More specifically, one end of the first pattern may be connected to the first joining position 121 of the first metal layer 110 adjacent by an amount corresponding to a preset first distance from the slit portion 150.

[0092] And, the other end of the first pattern is electrically connected to the second joining position 122 of the second metal layer 130 or the third metal layer 140 adjacent by an amount corresponding to a preset second distance from the slit portion 150, so that the first pattern is configured to extend in a direction continuous in the winding direction of the antenna layer 120 through at least one of the first metal layer 110, the second metal layer 130, and the third metal layer 140.

[0093] Also, one end and the other end of each of the patterns can be connected to the first bonding position 121 of the first metal layer 110 and the second bonding position 122 of the second metal layer 130 or the third metal layer 140 by an electrical bonding method, and an anisotropic conductive adhesive material or the like can be used. For example, anisotropic conductive film (ACF), anisotropic conductive paste (ACP), conductive adhesive, surface mount technology (SMT), etc. can be mentioned.

[0094] Also, for such a winding connection, the first bonding position 121 may be designated in advance at a preset position such that at least a part of the first metal layer 110 provided with the first slit portion 150a constitutes the winding of the first pattern.

[0095] Furthermore, the second bonding position 122 may be designated in advance as a preset position such that at least a part of the joined body of the second metal layer 130 and the third metal layer 140 constitutes the winding of the first pattern.

[0096] Thereby, in the wireless IC metal card 100 according to the embodiment of the present invention, since the metal layers 110, 130, 140 in which each slit is formed can be used as a winding pattern extending from the antenna pattern of the antenna layer 120, the metal layers 110, 130, 140 in which each slit is formed can function as an extended antenna pattern.

[0097] Therefore, the wireless IC metal card 100 according to the embodiment of the present invention can form efficient wireless communication sensitivity by enabling its body to function as one antenna without a separate shielding layer or the like using a clad metal joined body, and can overcome the communication limit of the metal card.

[0098] FIG. 7 is a diagram for explaining the case where the bonding position of the slit portion according to the embodiment of the present invention is formed.

[0099] Referring to FIG. 7, the other end of the first pattern connected to the first bonding position 121 of the first metal layer 110 and the other end of the second pattern connected to the second bonding position 122 of the second metal layer 130 may be respectively connected to the lower end of the wireless IC chip 112.

[0100] And, the antenna layer 120 is formed such that one or more antenna patterns are wound around the IC chip accommodating portion 111. However, one end of the first pattern may be electrically connected to the first bonding position 121 of the first metal layer 110 adjacent to the first slit portion 150a by a length corresponding to a preset first distance, and may extend in a direction continuous with the winding direction of the antenna.

[0101] Here, the first bonding position 121 may be a preset position such that at least a part of the first metal layer 110 where the first slit portion 150a is provided constitutes the winding of the first pattern.

[0102] Also, the antenna layer 120 may be electrically connected to the second bonding position 122 of the second metal layer 130 adjacent to the second slit portion 150b by a length corresponding to a preset first distance at one end of the second pattern, and may extend in a direction continuous with the winding direction of the antenna.

[0103] Here, the second bonding position 122 may be a preset position such that at least a part of the second metal layer 130 where the second slit portion 150b is provided constitutes the winding of the second pattern.

[0104] More specifically, as described above, the antenna layer 120 may be connected to the first bonding position 121 of the first metal layer 110 adjacent to the slit portion 150 by a length corresponding to a preset first distance at one end of the first pattern.

[0105] And one end of the second pattern is electrically connected to a second bonding position 122 of the second metal layer 130 adjacent to the slit portion 150 by an amount corresponding to a preset second distance, and each of the first pattern and the second pattern may be configured to extend in a direction continuous in the winding direction of the antenna layer 120.

[0106] Accordingly, as shown in FIG. 7, at least a part can be joined and connected from the antenna layer 120 below the first metal layer 110 to the slit portion 150.

[0107] Here, the position and direction of the first bonding position 121 of the joined first metal layer 110 or the position and direction of the second bonding position 122 of the second metal layer 130 may be formed in a direction extending the direction of the current of the winding pattern of the antenna layer 120.

[0108] And the first metal layer 110, the second metal layer 130, and the third metal layer 140 may be configured to function like a single coil, and wireless signals can be transmitted and received with an external device such as a card reader on both sides of the wireless IC card 100.

[0109] In addition, good antenna characteristics can be obtained without separately providing a shielding layer on the wireless IC card 100 or going through a complicated manufacturing process.

[0110] FIG. 8 is a flowchart for explaining a method of manufacturing a wireless IC card according to an embodiment of the present invention.

[0111] FIG. 8 is a flowchart showing a first embodiment and a second embodiment of a method of manufacturing a wireless IC card according to an embodiment of the present invention.

[0112] As a first embodiment, first, a pattern such as a design is applied to the surfaces of the first metal layer 110 and the third metal layer 140 of the aluminum material by a rolling process (S101).

[0113] Then, an IC chip accommodation portion 111 is processed in a certain region of the first metal layer 110 (S103).

[0114] Here, the IC chip accommodation portion 111 may be formed by opening the first metal layer 110 by an amount corresponding to the area and depth corresponding to the position and shape of the wireless IC chip 112 by performing punching, etching, NC machining, etc. on the first metal layer 110.

[0115] Also, the first metal layer 110 and the third metal layer 140 of the aluminum material have the characteristic of high softness, and it is possible to realize patterns such as various designs.

[0116] After that, a slit portion 150 is processed from one side of the IC chip accommodation portion 111 in the direction of the outer edge of the wireless IC card 100 (S107).

[0117] Here, the slit portion 150 may include a first slit portion 150a formed by cutting from one side of the IC chip accommodation portion 111 in the direction of the outer edge of the first metal layer 110, a second slit portion 150b formed by cutting in the direction of the outer edge of the second metal layer 130 so as to face the first slit portion 150a, and a third slit portion 150c formed by cutting in the direction of the outer edge of the third metal layer 140 so as to face the second slit portion 150b.

[0118] Furthermore, the slit portions 150a, 150b, and 150c may be formed to have a preset width corresponding to the width of the IC chip accommodating portion 111 up to the outer edge of the wireless IC card 100, and the preset width may be set to be narrower than, wider than, or equal to the width of the IC chip accommodating portion 111.

[0119] After that, anodizing for insulation treatment is performed on the first metal layer 110 and the third metal layer 140 (S107).

[0120] Here, in order to prevent contact corrosion occurring in the first metal layer 110 and the third metal layer 140 due to the potential difference between the first metal layer 110 and the third metal layer 140 using aluminum and the second metal layer 130, an anodizing treatment for insulation may be performed.

[0121] Then, a metal adhesive for forming a clad metal is applied between the wireless IC chip 112, the first metal layer 110, the antenna layer 120, the second metal layer 130, and the third metal layer 140, and press processing is performed after aligning them in order (S109).

[0122] On the other hand, as a second embodiment, first, an IC chip accommodating portion 111 is processed in a certain region of the first metal layer 110 made of a stainless steel material (S201).

[0123] Here, the IC chip accommodating portion 111 may be formed by opening the first metal layer 110 by an amount corresponding to the area and depth corresponding to the position and shape of the wireless IC chip 112 by performing punching, etching, or NC processing on the first metal layer 110.

[0124] After that, a slit portion 150 is processed from one side of the IC chip accommodating portion 111 in the direction of the outer edge of the wireless IC card 100 (S203).

[0125] Here, as described above, the slit portion 150 includes a first slit portion 150a formed by cutting from one side of the IC chip accommodating portion 111 in the direction of the outer edge of the first metal layer 110, a second slit portion 150b formed by cutting in the direction of the outer edge of the second metal layer 130 so as to face the first slit portion 150a, and a third slit portion 150c formed by cutting in the direction of the outer edge of the third metal layer 140 so as to face the second slit portion 150b. Each of the slit portions 150a, 150b, and 150c may be provided.

[0126] Then, a design is applied to the surfaces of the first metal layer 110 and the third metal layer 140 (S205).

[0127] Here, since stainless steel, which is the material of the first metal layer 110 and the third metal layer 140, is difficult to apply a pattern by a rolling process like the aluminum material of the first embodiment, it is preferable to apply a design by a laser process.

[0128] After that, an insulation treatment is performed on the first metal layer 110 and the third metal layer 140 (S207).

[0129] Here, the first metal layer 110 and the third metal layer 140 using a stainless steel material may be subjected to an insulation treatment to prevent contact corrosion with the second metal layer 130 using another metal.

[0130] Then, as in step S109 described above, an adhesive for forming a clad metal is applied between the wireless IC chip 112, the first metal layer 110, the antenna layer 120, the second metal layer 130, and the third metal layer 140, and they are aligned in order and subjected to a pressing process (S109).

[0131] In the above, the preferred embodiments of the present invention have been illustrated and described. However, the present invention is not limited to the specific embodiments described above at all. Needless to say, various modifications can be made by those having ordinary knowledge in the technical field to which the invention pertains without departing from the gist of the invention claimed in the claims. These modified embodiments should not be individually understood from the technical idea and perspective of the present invention.

Claims

1. In a wireless IC metal card, a first metal layer for accommodating a wireless IC chip on the upper surface, an antenna layer disposed in a partial region on the lower surface of the first metal layer and electrically connected to the wireless IC chip, a second metal layer disposed below the first metal layer with the antenna layer interposed therebetween, a third metal layer disposed below the second metal layer, comprising: A wireless IC metal card, wherein the first metal layer, the second metal layer, and the third metal layer are joined to each other to form a clad metal structure.

2. The wireless IC metal card according to claim 1, wherein the second metal layer is different from the metal materials of the first metal layer and the third metal layer, and is formed such that its weight is even higher than the weight of the first metal layer and the weight of the third metal layer.

3. The first metal layer and the third metal layer are formed from one of the materials of aluminum or duralumin, The wireless IC metal card according to claim 2, wherein the second metal layer is formed from one of the materials of cupronickel or stainless steel.

4. The first metal layer and the third metal layer are formed from a stainless steel material, The wireless IC metal card according to claim 2, wherein the second metal layer is formed from a cupronickel material.

5. The wireless IC metal card according to claim 1, wherein the thickness of the second metal layer is formed to be even thicker than the first metal layer and the third metal layer, and its weight is formed to be even higher than the weight of the first metal layer and the weight of the third metal layer.

6. The wireless IC metal card according to claim 5, wherein the thickness ratio of the first metal layer, the second metal layer, and the third metal layer is 1:2:

1.

7. The first metal layer includes an IC chip accommodating portion formed by opening a certain region so as to accommodate the wireless IC chip. The wireless IC metal card according to claim 1, wherein the first metal layer, the second metal layer, and the third metal layer each include a slit portion formed by cutting from the IC chip accommodating portion toward the outer edge of the wireless IC card.

8. The slit portion a first slit portion formed by cutting from one side of the IC chip accommodating portion toward the outer edge of the first metal layer; a second slit portion formed by cutting in the direction corresponding to the cutting direction of the first slit portion toward the outer edge of the second metal layer; a third slit portion formed by cutting in the direction corresponding to the cutting direction of the second slit portion toward the outer edge of the third metal layer; The wireless IC metal card according to claim 7, comprising:

9. The wireless IC metal card according to claim 7, further comprising one or more finishing members inserted into at least one of the first slit portion, the second slit portion, or the third slit portion and having electrical insulation properties.

10. The antenna layer is formed such that one or more antenna patterns are wound around the IC chip accommodating portion, and one end of the first pattern is electrically connected to a first bonding position of the first metal layer adjacent thereto by a distance corresponding to a preset first distance from the first slit portion, and extends in a direction continuous with the winding direction of the antenna; The wireless IC metal card according to claim 1, wherein the first bonding position is a preset position such that at least a part of the first metal layer where the first slit portion is provided constitutes the winding of the first pattern.

11. The antenna layer the other end of the first pattern is electrically connected to a second bonding position of the second metal layer or the third metal layer adjacent thereto by a distance corresponding to a preset second distance from the second slit portion or the third slit portion, and extends in a direction continuous with the winding direction of the antenna; The wireless IC metal card according to claim 10, wherein the second bonding position is a preset position such that at least a part of the joined body of the second metal layer and the third metal layer constitutes the winding of the first pattern.

12. In a method for manufacturing a wireless IC metal card, providing a first metal layer for accommodating a wireless IC chip on an upper surface; Placing an antenna layer electrically connected to the wireless IC chip in a partial region on the lower surface of the first metal layer; Placing a second metal layer below the first metal layer with the antenna layer sandwiched therebetween; Placing a third metal layer below the second metal layer; Aligning and pressing the first metal layer, the second metal layer, and the third metal layer to form a clad metal structure resulting from joining the first metal layer, the second metal layer, and the third metal layer to each other; A method for manufacturing a wireless IC metal card, including the above steps.

13. The step of forming the clad metal structure: The method for manufacturing a wireless IC metal card according to claim 12, further including a step of pre-applying a thermoplastic or thermosetting adhesive to a joining region between the first metal layer, the second metal layer, and the third metal layer.

14. Before the step of forming the clad metal structure: The method for manufacturing a wireless IC metal card according to claim 12, further including a step of performing patterning by a roll pattern processing method when the first metal layer or the third metal layer is made of an aluminum material.

15. Before the step of forming the clad metal structure: The method for manufacturing a wireless IC metal card according to claim 12, further including a step of performing anodizing treatment on upper and lower surfaces of the first metal layer or the third metal layer when the first metal layer or the third metal layer is made of an aluminum material and the second metal layer contains a copper material.

Images