Display substrate, method for manufacturing the same, and display device

Abstract

The present application discloses a display substrate, a manufacturing method thereof, and a display device, which belong to the field of display technology. The display substrate includes a substrate body, support pillars, and a protection structure. In any direction parallel to the substrate body, the width of the first surface of the support pillar is substantially the same as the width of the second surface, and it can be ensured that the second surface of the substrate body is flat. In this way, in the process of cellulating two display substrates, the surface of the support pillar on one display substrate that is away from the substrate body of this display substrate can effectively contact the surface of the support pillar on the other display substrate that is away from the substrate body of this display substrate, and the contact area when these two support pillars contact can be determined. In this way, by accurately calculating the cellulation pressure when these two display substrates are cellulated, it can be ensured that the cellulation effect of these two display substrates is good.

Description

Technical Field

[0001] This application relates to the field of display technologies, and particularly to a display substrate, a method for manufacturing the same, and a display device.

Background Art

[0002] With the development of display technologies, especially the rapid development of virtual reality (VR) technology and augmented reality (AR) technology, the requirements for the display effect of display panels are increasing.

[0003] A display panel can include an array substrate and a color filter substrate arranged opposite to each other, and a liquid crystal layer located between the array substrate and the color filter substrate. Here, usually, a plurality of columnar support pillars are further installed between the array substrate and the color filter substrate. The support pillars can play a role in supporting the array substrate and the color filter substrate, thereby ensuring the thickness uniformity of the liquid crystal display panel.

[0004] However, the structure of the support pillars in the current display panel is poor, so the support effect of the support pillars on the display panel is deteriorated, and the display effect of the display panel is deteriorated.

Summary of the Invention

Means for Solving the Problems

[0005] Embodiments of this application provide a display substrate, a method for manufacturing the same, and a display device. The problem that the display effect of the display panel of the prior art is poor can be solved, and the technical solution is as follows.

[0006] A first aspect provides a display substrate, the display substrate includes a substrate body, a plurality of support pillars located on the substrate body, and the support pillars have a first surface contacting the substrate body and a second surface disposed opposite to the first surface. In any direction parallel to the substrate body, the ratio of the width of the first surface to the width of the second surface is 0.8 or more and 1.2 or less.

[0007] As one option, in any direction parallel to the substrate body, the ratio of the absolute value of the difference between the width of the first surface and the width of the second surface to the width of the first surface is 0.4 or less.

[0008] As one option, the support pillar includes a first portion and a second portion that are stacked perpendicular to the substrate body and along a direction away from the substrate body, and the orthographic projection of the second portion onto the substrate body is located within the orthographic projection of the first portion onto the substrate body. The side surface of the first portion is a plane, and the side surface of the second portion is an arc-shaped concave surface.

[0009] As one option, the absolute value of the difference between the width of the first surface and the width of the second surface is 0.8 microns or less.

[0010] As one option, the range of the angle between the side surface of the first portion and the surface of the first portion close to the substrate body is 85° to 90°.

[0011] As one option, in the direction perpendicular to the side surface of the first portion, the range of the maximum depth of the arc-shaped concave surface is 0.1 micron to 0.2 micron.

[0012] As one option, in the direction perpendicular to the substrate body, the range of the ratio of the thickness of the second portion to the thickness of the first portion is 1 / 7 to 1 / 6.

[0013] As one option, the display substrate further includes a protection structure located on the side of the support pillar away from the substrate body, and the orthographic projection of the support pillar onto the substrate body is located within the orthographic projection of the protection structure onto the substrate body. The material of the protection structure is different from the material of the support pillar.

[0014] As one of the options, the material hardness of the protection structure is greater than that of the support pillar.

[0015] As one of the options, the material of the protection structure includes inorganic materials, and the material of the support pillar includes organic materials.

[0016] As one of the options, the material of the protection structure includes at least one of a metal conductive material, a transparent conductive material, and an inorganic insulating material.

[0017] As one of the options, in the direction perpendicular to the substrate body, the thickness range of the support pillar is 0.8 micrometers to 1.5 micrometers.

[0018] As one of the options, the display substrate is an array substrate, and the substrate body includes a first substrate, a thin-film transistor located on the first substrate, a planarization layer, a pixel electrode, and an auxiliary support pillar. The thin-film transistor has a source and a drain. The planarization layer is located on the side of the thin-film transistor away from the first substrate, and the planarization layer has a connection via, and at least a part of the source or the drain is located within the connection via. The pixel electrode is located on the side of the planarization layer away from the first substrate, and a part of the pixel electrode is located within the connection via and wraps around the source or the drain. The support pillar is located outside the connection via, and the support pillar and the auxiliary support pillar are of an integral structure, and the auxiliary support pillar is located within the connection via.

[0019] As one of the options, in the direction perpendicular to the first substrate, the relationship between the height H of the support pillar and the width W of the surface of the support pillar away from the first substrate satisfies 1 / 5W ≦ H ≦ 1 / 2W.

[0020] As one of the options, the thin film transistor further includes an active layer that is wrapped around the source and the drain. The substrate body further includes a light shielding structure located on a side close to the first substrate of the thin film transistor, and a buffer layer located between the light shielding structure and the thin film transistor. The orthographic projection of the active layer onto the first substrate is located within the orthographic projection of the light shielding layer onto the first substrate, and the orthographic projection of the support pillar onto the first substrate is located within the orthographic projection of the light shielding structure onto the first substrate.

[0021] As one of the options, the substrate body further includes a passivation layer located on a side away from the first substrate of the pixel electrode, and a common electrode located on a side away from the first substrate of the passivation layer. A part of the passivation layer is located within the connection via, and within the connection via, the support pillar is located on a side away from the first substrate of the passivation layer. The orthographic projection of the common electrode onto the first substrate does not overlap with the orthographic projection of the connection via onto the first substrate.

[0022] As one of the options, the source and the drain in the thin film transistor are installed in different layers.

[0023] As one of the options, the width of the surface of the support pillar away from the first substrate is 4.5 microns or less.

[0024] As one of the options, the display substrate is a color filter substrate, and the substrate body includes a second substrate, and a color resist layer and a black matrix located on the second substrate. The support pillar is located on a side away from the second substrate of the black matrix, and the orthographic projection of the support pillar onto the second substrate is located within the orthographic projection of the black matrix onto the second substrate.

[0025] As one option, the width of the surface of the support pillar away from the second substrate is 2 microns or less.

[0026] A second aspect provides a method for manufacturing a display substrate, the method including forming a plurality of support pillars on a substrate body, the support pillars having a first surface in contact with the substrate body and a second surface disposed opposite the first surface, In any direction in the direction parallel to the substrate body, the ratio of the width of the first surface to the width of the second surface is 0.8 or more and 1.2 or less.

[0027] As one option, forming a plurality of support pillars on the substrate body includes forming a support film layer and a protective film layer that cover the entire substrate body on the substrate body in sequence, and the etching rate of the material for creating the protective thin film is smaller than the etching rate of the material for creating the support film layer, performing a patterning process on the support film layer and the protective film layer simultaneously to obtain support pillars created from the support film layer and a protective structure created from the protective film layer, including The orthographic projection of the support pillar onto the substrate body is located within the orthographic projection of the protective structure onto the substrate body.

[0028] As one option, the method further includes removing the protective structure after performing a patterning process on the support film layer and the protective film layer simultaneously.

[0029] A third aspect provides a display device, the display device including the display substrate described in the first aspect and a power supply component that supplies power to the display substrate.

[0030] The technical solutions provided in the embodiments of the present application include at least the following beneficial effects.

[0031] The display substrate includes a substrate body and support pillars. In any direction parallel to the substrate body, the width of the first surface of the support pillar is substantially the same as the width of the second surface, ensuring that the second surface of the substrate body is flat. In this way, in the process of cellulating two display substrates, the surface of the support pillar on one display substrate away from the substrate body of this display substrate and the surface of the support pillar on the other display substrate away from the substrate body of this display substrate can effectively contact, and the contact area when the two support pillars contact can be determined. In this way, the cellulation pressure when cellulating the two display substrates can be accurately calculated, ensuring a good cellulation effect for the two display substrates. In this way, subsequently, after assembling the two display substrates in the display device, a good display effect of the display device can be ensured. Also, when the cellulation effect of the two display substrates is good, the problem of damage to the display substrate caused by excessive cellulation pressure in the cellulation process can be avoided, and the problem of excessive gap between the two display substrates caused by too small cellulation pressure in the cellulation process can also be avoided.

[0032] To more clearly explain the technical solution in the embodiments of the present application, hereinafter, the drawings necessary for the description of the embodiments will be briefly described. However, the drawings in the following description are only some embodiments of the present application. It is obvious that for those skilled in the art, other drawings can be obtained based on these drawings without creative labor.

Brief Description of the Drawings

[0033]

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Embodiments for Carrying Out the Invention

[0034] To make the objectives, technical solutions, and advantages of the present application clearer, the embodiments of the present application will be described in more detail below with reference to the drawings.

[0035] A display panel usually has sub-pixels for realizing a display function and support pillars for supporting the display panel. The higher the density of the sub-pixels in the display panel, the more capable the display panel is of realizing a higher-resolution display. For example, for the display panels in VR display devices and AR display devices, since the pixel density (Pixels Per Inch, abbreviated as PPI) in the display panel is high, the display panel can provide a more realistic display scene for users.

[0036] When the display panel is a liquid crystal display panel, refer to FIG. 1, which is a schematic structural diagram of a liquid crystal display panel. The liquid crystal display panel 00 can include an array substrate 01 and a color filter substrate 02 arranged opposite to each other, and a liquid crystal layer 03 and support pillars 04 located between the array substrate 01 and the color filter substrate 02. Here, since the support pillars 04 can play a role in supporting the array substrate 01 and the color filter substrate 02, the thickness uniformity of the liquid crystal display panel 00 is ensured, and in the process of cell formation of the array substrate 01 and the color filter substrate 02, it is possible to avoid damage to the surfaces of the array substrate 01 and the color filter substrate 02. Here, subsequently, after assembling the backlight on the side away from the display surface of the liquid crystal display panel 00, an electrical signal can be applied to the array substrate 01 and the color filter substrate 02 so that the liquid crystal molecules in the liquid crystal layer 03 can respond to the electrical signal. In this way, after the light rays emitted from the backlight pass through the liquid crystal display panel 00, the liquid crystal display panel 00 can display an image.

[0037] The support pillars 04 can include a first support pillar 041 and a second support pillar 042. The first support pillar 041 is located on the side of the array substrate 01 close to the color filter substrate 02, and the second support pillar 042 is located on the side of the color filter substrate 02 close to the array substrate 01. In this way, in the process of cell formation of the array substrate 01 and the color filter substrate 02, the surface of the first support pillar 041 away from the array substrate 01 can contact the surface of the second support pillar 042 away from the color filter substrate 02. In this way, the first support pillar 041 and the second support pillar 042 can provide a supporting effect on the liquid crystal display panel 00. Here, based on the contact area between the first support pillar 041 and the second support pillar 042, the arrangement density of the first support pillar 041 and the second support pillar 042, and the pressure that each of the first support pillar 041 and the second support pillar 042 can withstand, the liquid crystal display panel 00 can determine the pressure required when the array substrate 01 and the color filter substrate 02 perform cell formation, thereby ensuring that the array substrate 01 and the color filter substrate 02 can accurately perform cell formation.

[0038] The resolution of a typical LCD device is generally not more than 300 PPI, so the dimensions of the first support pillar 041 and the second support pillar 042 are large, and in some related art, the first support pillar 041 may have a maximum width of 10 μm or more in a cross section perpendicular to the substrate body, and the surface close to the color film substrate has a flat structure, i.e., is approximately parallel to the substrate body. However, the present inventor found that in actual production, as the PPI of the LCD panel 00 is constantly improved, especially for high PPI display devices, for example in the VR / AR display field, there is a high requirement for the resolution of the display device, which needs to be greater than 1200 PPI, so the area and size of a single pixel are rapidly reduced, and in order to ensure the aperture ratio and transmittance of the display device, the dimensions of the first support pillar 041 and the second support pillar 042 in the LCD panel 00 need to be further reduced, for example, the maximum width of the first support pillar needs to be less than 5 μm. Refer to FIG. 2, which is a schematic diagram of the actual shape of the first support pillar. In related art, photolithography-curing process is often used to manufacture the support pillars, and in order to improve the PPI, it is necessary to reduce the overall size of the first support pillars, that is, to reduce the area of the orthogonal projection of the first support pillars onto the substrate body, but due to limitations imposed by factors such as process precision, material properties used to manufacture the support pillars, and small pixel pitch, after the first support pillars 041 are manufactured on the array substrate 01 by the primary patterning process, the surface of the first support pillars 041 that is separated from the array substrate 01 is arc-shaped, and a relatively flat surface shape cannot be formed. Similarly, after the second support pillars 042 are manufactured on the color film substrate 02 by the primary patterning process, the surface of the second support pillars 042 that is separated from the color film substrate 02 is also arc-shaped.Thus, in the process of cell formation between the array substrate 01 and the color filter substrate 02, it is difficult to determine the contact area between the first support pillar 041 and the second support pillar 042. As a result, it is difficult to determine the cell formation pressure between the array substrate 01 and the color filter substrate 02. Moreover, since both the opposing surfaces of the first support pillar 041 and the second support pillar 042 are arc-shaped, compared with flat surfaces, the contact area between the two is too small, and the cell formation effect between the array substrate 01 and the color filter substrate 02 in the liquid crystal display panel 00 deteriorates.

[0039] For example, the gap between the array substrate 01 and the color filter substrate 02 after cell formation is large, and this large gap inhibits the efficient operation of liquid crystal molecules in the liquid crystal layer 03, making it impossible to achieve a high refresh rate display of the liquid crystal display panel 00, and deteriorating the display effect of the liquid crystal display panel 00.

[0040] Before explaining the structural principle of the display substrate provided in the embodiments of the present application, first, the usage scenario related to the display substrate provided in the embodiments of the present application will be explained. Usually, a display panel has two display substrates arranged opposite to each other, and the space between these two display substrates is supported by support pillars. Here, the display panel may be a liquid crystal display panel or an organic light-emitting diode display panel, etc. The present application will be schematically explained by taking the case where the display panel is a liquid crystal display panel as an example. When the display panel is a liquid crystal display panel, the two display substrates arranged opposite to each other in the display panel are an array substrate and a color filter substrate, respectively.

[0041] Referring to FIG. 3, FIG. 3 is a schematic structural diagram of the display substrate provided in the embodiments of the present application. The display substrate 000 may include a substrate body 100 and a plurality of support pillars 200 located on the substrate body 100. Here, the support pillar 100 has a first surface in contact with the substrate body 100 and a second surface disposed opposite to the first surface.

[0042] Here, in any direction parallel to the substrate body 100, the ratio of the width of the first surface to the width of the second surface is 0.8 or more and 1.2 or less.

[0043] In this case, in any direction parallel to the substrate body 100, the width of the first surface and the width of the second surface of the support pillar 100 are substantially the same, and it can be ensured that the second surface of the substrate body 100 is a flat surface. In this way, in the process of cellulating the two display substrates 000, the surface of the support pillar 200 on one display substrate 000 that is away from the substrate body 100 of this display substrate 000 can effectively contact the surface of the support pillar 200 on the other display substrate 000 that is away from the substrate body 100 of this display substrate 000, and the contact area when these two support pillars 200 are in contact can be determined. In this way, by accurately calculating the cellulation pressure when these two display substrates 000 are cellulated, it can be ensured that the cellulation effect of these two display substrates 000 is good. In this way, after subsequently assembling these two display substrates 000 into a display device, it can be ensured that the display effect of the display device is good. Also, when the cellulation effect of the two display substrates 000 is good, it is possible to avoid the problem of damage to the display substrate 000 caused by excessive cellulation pressure in the cellulation process, and it is also possible to avoid the problem of excessive gaps between the two display substrates 000 caused by too small cellulation pressure in the cellulation process.

[0044] As one of the options, in any direction parallel to the substrate body 100, the ratio of the absolute value of the difference between the width of the first surface and the width of the second surface to the width of the first surface is 0.4 or less.

[0045] In the embodiments of the present application, the support pillar includes a first portion and a second portion that are stacked perpendicular to the substrate body and along the direction away from the substrate body, and the orthographic projection of the second portion onto the substrate body is located within the orthographic projection of the first portion onto the substrate body. Here, the side surface of the first portion is a flat surface, and the side surface of the second portion is an arc-shaped concave surface.

[0046] As an option, the absolute value of the difference between the width of the first surface and the width of the second surface is 0.8 microns or less.

[0047] As an option, the angular range between the side surface of the first portion and the surface close to the substrate body of the first portion is 85° to 90°.

[0048] As an option, in the direction perpendicular to the side surface of the first portion, the range of the maximum depth of the arc-shaped concave surface is 0.1 micron to 0.2 micron.

[0049] As an option, in the direction perpendicular to the substrate body, the range of the ratio of the thickness of the second portion to the thickness of the first portion is 1 / 7 to 1 / 6.

[0050] As an option, in the direction perpendicular to the substrate body, the range of the thickness of the support pillar is 0.8 micron to 1.5 microns.

[0051] In the embodiment of the present application, as shown in FIG. 3, the display substrate further includes a protection structure 300 located on the side of the support pillar 200 away from the substrate body 100. Here, the orthographic projection of the support pillar 200 onto the substrate body 100 is located within the orthographic projection of the corresponding protection structure 300 onto the substrate body 100. Here, the material of the protection structure 300 is different from the material of the support pillar 200.

[0052] As an option, the material hardness of the protection structure 300 is greater than the material hardness of the support pillar 200.

[0053] Exemplarily, the material of the protection structure 300 includes an inorganic material, and the material of the support pillar 200 includes an organic material.

[0054] Note that the support pillars 200 and the protection structure 300 of the display substrate 000 are formed by adopting a primary patterning process. Exemplarily, first, a support film layer and a protection film layer are sequentially formed on the substrate body 100, and a photoresist thin film can be applied. Then, by performing one exposure and development on the photoresist thin film applied to the display substrate 000, a photoresist pattern can be obtained. After that, an etching process is adopted to etch the portions of the support film layer and the protection film layer where the photoresist pattern is not adhered. Finally, by peeling the photoresist on the display substrate 000, the support pillars 200 can be formed in the display substrate 000, and the protection structure 300 located on the support pillars 200 can be formed. Here, after etching the support film layer, the support pillars 200 can be formed, and after etching the protection film layer, the protection structure 300 can be formed.

[0055] In the embodiment of the present application, the etching rate of the etching substance (etching gas or etching liquid) with respect to the material for creating the protection structure 300 is smaller than the etching rate with respect to the material for creating the support pillar 200. Thus, in the process of forming the support pillar 200 and the protection structure 300 by adopting a primary patterning process, the etching rate of the etching substance with respect to the protection film layer is small, and the etching rate of the etching substance with respect to the support film layer is large. Therefore, after the etching by the etching substance for the portion where the photoresist pattern of the protection film layer is not attached is completed, the patterned protection structure 300 can be formed on the display substrate 000, and the patterned protection structure 300 can be used as a mask so that the support film layer can form the support pillar 200 under the protection of the protection structure 300. In this process, since the protection structure 300 can protect the support pillar 200, the surface of the support pillar 200 away from the substrate body 100 becomes a flat surface. Thus, even if the protection structure 300 on the support pillar 200 is removed subsequently, the two display substrates 000 can also ensure effective contact between the two support pillars 200 between the two display substrates 000 in the process of cell formation.

[0056] Also, since the etching rate of the etching substance with respect to the protection film layer is small, when the protection structure 300 on the substrate body 100 is formed by a primary patterning process, the probability that the surface of the protection structure 300 away from the substrate body 100 is arc-shaped is low. Thus, in the process of cell formation of the two display substrates 000, the surface of the protection structure 300 on one display substrate 000 away from the substrate body 100 of this display substrate 000 can effectively contact the surface of the protection structure 300 on the other display substrate 000 away from the substrate body 100 of this display substrate 000, thereby ensuring good cell formation effect of the two display substrates 000. Thus, subsequently, after assembling the two display substrates 000 in the display device, it can be ensured that the display effect of the display device is good.

[0057] In the present application, the protective structure 300 can be made of at least one of a metal conductive material, a transparent conductive material, and an inorganic insulating material. Here, when the protective structure 300 is made of a metal conductive material, the metal conductive material may be one or more of aluminum, molybdenum, copper, titanium, and an aluminum neodymium alloy. When the protective structure 300 is made of a transparent conductive material, the transparent conductive material may be any one or more of indium gallium zinc oxide (IGZO), amorphous or polycrystalline zinc oxide (ZnO), indium zinc oxide (IZO), indium tin oxide (ITO), zinc tin oxide (ZTO), indium zinc tin oxide (IZTO), indium gallium zinc tin oxide (IGZTO), and indium gallium oxide (IGO). When the protective structure 300 is made of an inorganic insulating material, the inorganic insulating material may be at least one of silicon nitride SiNx (x>0) and silicon oxide SiOy (y>0). Note that SiNx refers to a substance containing a nitrogen element in terms of composition, and in the range where silicon with a concentration range of 10 atomic% to 50 atomic% and hydrogen with a concentration range of 5 atomic% to 25 atomic% are included, each element is included at an arbitrary concentration so that the total is 100 atomic%. SiOy refers to a substance containing an oxygen element in terms of composition, and in the range where silicon with a concentration range of 10 atomic% to 50 atomic% and hydrogen with a concentration range of 1 atomic% to 25 atomic% are included, each element is included at an arbitrary concentration so that the total is 100 atomic%. In some embodiments, the protective structure 300 includes a silicon nitride material and a silicon oxide material.

[0058] In an embodiment of the present application, when the protective structure 300 is made of a metal conductive material, since the metal conductive material usually does not transmit light, the protective structure 300 on the display substrate 000 can shield some interference light rays. Exemplarily, after subsequently assembling two celled display substrates 000 into a liquid crystal display panel, the protective structure 300 can shield some interference light rays incident from the external environment and some interference light rays reflected from thin film transistors on the array substrate. In this way, the display effect of the liquid crystal display panel can be improved.

[0059] In the present application, when the protection structure 300 is made of a transparent electrode material and the display substrate 000 has a common electrode, the protection structure 300 and the common electrode are installed in the same layer and are made of the same material. That is, the protection structure 300 and the common electrode can be manufactured through a primary patterning process. Here, the primary patterning process usually includes photoresist coating, exposure, development, etching, and photoresist stripping. In this way, the manufacturing process of the display substrate 000 can be simplified.

[0060] In an embodiment of the present application, referring to FIG. 4, FIG. 4 is a schematic diagram of the actual structure of the support pillar in the display substrate provided by the embodiment of the present application. The range of the angle α between the side surface of the support pillar 200 and the surface away from the substrate body 100 of the support pillar 200 in the display substrate 000 is 90° to 95°. Here, since the angle between the side surface of the support pillar 200 and the surface away from the substrate body 100 of the support pillar 200 is an obtuse angle, the width of the surface away from the substrate body 100 of the support pillar 200 is large. Therefore, the contact area between the support pillar 200 and the surface of the protection structure 300 close to the substrate body 100 can be increased. In this way, even if the protection structure 300 on the support pillar 200 is removed, during the process of cell formation of the two display substrates 000, effective contact between the two support pillars 200 between the two display substrates 000 can also be ensured.

[0061] In the present application, when the display panel formed after cell formation of the two display substrates 000 is a liquid crystal display panel, the display substrate 000 may be an array substrate or a color filter substrate. For the convenience of description hereinafter, when the display substrate 000 is an array substrate, the support pillar 200 in the display substrate 000 can be referred to as the first support pillar 201, and when the display substrate 000 is a color filter substrate, the support pillar 200 in the display substrate 000 can be referred to as the second support pillar 202. The embodiments of the present application will describe these two situations respectively.

[0062] For the first situation, when the display substrate 000 is the array substrate in the liquid crystal display panel, referring to FIG. 5, FIG. 5 is a schematic diagram of the film layer structure of the display substrate provided in the embodiment of the present application. The display substrate 000 is an array substrate, and the substrate body 100 includes a first sub-substrate 101, a thin-film transistor 102 located on the first sub-substrate 101, a planarization layer 103, a pixel electrode 104, and an auxiliary support pillar 110.

[0063] Here, the thin-film transistor 102 includes a source 1021 and a drain 1022. Here, the thin-film transistor 102 further includes a gate 1023, and the gate 1023 is arranged to be insulated from the source 1021 and the drain 1022. The thin-film transistor 102 is a top-gate type thin-film transistor. In other possible implementation forms, the thin-film transistor 102 may be a bottom-gate type thin-film transistor, and the embodiments of the present application are not limited thereto.

[0064] The planarization layer 103 is located on the side of the thin-film transistor 102 away from the first sub-substrate 101, and the planarization layer 103 has a connection via V, and at least a part of the source 1021 or the drain 1022 is located in the connection via V.

[0065] The pixel electrode 104 is located on the side of the planarization layer 103 away from the first sub-substrate 101, and a part of the pixel electrode 104 is located in the connection via V and wraps around the source 1021 or the drain 1022. Here, FIG. 5 shows the situation where the drain 1022 and the pixel electrode 104 in the thin-film transistor 102 are wrapped in the connection via V.

[0066] In an embodiment of the present application, at least a part of the support pillar 200 is located outside the connection via V, and the support pillar 200 and the auxiliary support pillar 100 have an integral structure, and the auxiliary support pillar 110 can be located within the connection via V. In this way, the orthographic projection of the first support pillar 201 onto the first substrate 101 is located within the orthographic projection of the pixel electrode 104 onto the first substrate 101, and the orthographic projection of the first support pillar 201 onto the first substrate 101 overlaps with the drain 1022 in the thin film transistor 102.

[0067] As an option, in a direction perpendicular to the first substrate 101, the relationship between the height H of the support pillar 200 and the width W of the surface of the support pillar 200 away from the first substrate 101 satisfies 1 / 5W ≤ H ≤ 1 / 2W.

[0068] In the present application, as shown in FIG. 5, the thin film transistor 102 further includes an active layer 1024 that is wrapped with the source 1021 and wrapped with the drain 1022. Here, the source 1021 and the drain 1022 in the thin film transistor 102 are wrapped with the active layer 1024 via vias. Also, the active layer 1024 and the gate are insulated and arranged via a gate insulating layer 1025.

[0069] The substrate body 100 can further include a light-shielding structure 105 located on the side of the first substrate 101 close to the thin film transistor 102, and a buffer layer 106 located between the light-shielding structure 105 and the thin film transistor 102. Here, the light-shielding structure 105 can be made of a metal material.

[0070] Here, the orthographic projection of the active layer 1024 onto the first substrate 101 is located within the orthographic projection of the light-shielding layer 105 onto the first substrate 101, and the orthographic projection of the first support pillar 201 onto the first substrate 101 is located within the orthographic projection of the light-shielding structure 105 onto the first substrate 101. In this way, subsequently, after assembling the display substrate 000 onto a backlight, the light-shielding structure 105 can shield the interference light emitted from the backlight and the interference light in the environment so that the active layer 1024 in the thin-film transistor 102 is not affected by the interference light and can operate normally.

[0071] In an embodiment of the present application, as shown in FIG. 5, the substrate body 100 may further include a passivation layer 107 located on the side away from the first substrate 101 of the pixel electrode 104, and a common electrode 108 located on the side away from the first substrate 101 of the passivation layer 107.

[0072] Here, a part of the passivation layer 107 is located within the connection via V, and within the connection via V, the first support pillar 201 is located on the side away from the first substrate 101 of the passivation layer 107.

[0073] The orthographic projection of the common electrode 108 onto the first substrate 101 does not overlap with the orthographic projection of the connection via V onto the first substrate 101. In this way, the connection via V in the substrate body 100 does not affect the common electrode 108.

[0074] In an embodiment of the present application, the source 1021 and the drain 1022 in the thin-film transistor 102 are disposed in different layers. The substrate body 100 may further include a first insulating layer 109 located between the gate 1023 and the source 1021, and a second insulating layer 1010 located between the source 1021 and the drain 1022. In this way, the source 1021 and the drain 1022 are disposed in different layers via the second insulating layer 1010. Here, the gate insulating layer 1025 and the first insulating layer 109 have vias communicating with each other, and the source 1021 in the thin-film transistor 102 and the active layer 1024 can be wrapped via the vias communicating with each other in the gate insulating layer 1025 and the first insulating layer 109. The gate insulating layer 1025, the first insulating layer 109, and the second insulating layer 1010 also have vias communicating with each other, and the drain 1022 in the thin-film transistor 102 and the active layer 1024 can be wrapped via the vias communicating with each other in the gate insulating layer 1025, the first insulating layer 109, and the second insulating layer 1010.

[0075] In the present application, the orthographic projection of the pixel electrode 104 onto the first substrate 101 is the size of the sub-pixel in the display substrate 000. The position where the thin-film transistor 102 is disposed in the display substrate 000 is a part that controls the operation of the sub-pixel in the display substrate 000. In this way, in order to ensure that the display sub-pixel in the display substrate 000 is large, the orthographic projection area of the thin-film transistor 102 in the display substrate 000 onto the first substrate 101 is small. In this way, in order to avoid the situation of a short circuit occurring between the source 1021 and the drain 1022, the source 1021 and the drain 1022 in the thin-film transistor 102 are disposed in different layers. Thereby, the thin-film transistor 102 in the display substrate 000 can operate normally.

[0076] In an embodiment of the present application, the width of the surface of the support pillar 200 on the display substrate 000 away from the first substrate 101 is 4.5 microns or less. When the display substrate 000 is an array substrate, the width of the surface of the first support pillar 201 on the display substrate 000 away from the first substrate 101 is 4.5 microns or less.

[0077] Regarding the second situation, when the display substrate 000 is a color filter substrate in a liquid crystal display panel, referring to FIG. 6, FIG. 6 is a schematic diagram of the film layer structure of another display substrate provided in an embodiment of the present application. The display substrate 000 is a color filter substrate, and the substrate body 100 may include a second substrate 1011, a color resist layer 1012 and a black matrix 1013 located on the second substrate 1011.

[0078] Here, the support pillar 200 is located on the side of the black matrix 1013 away from the second substrate 1011, and the orthographic projection of the support pillar 200 onto the second substrate 1011 is located within the orthographic projection of the black matrix 1013 onto the second substrate 1011. After the two display substrates 000 are celled, the black matrix 1013 can shield the interfering light rays incident from the environment, thereby improving the display effect of the display panel formed by these two display substrates 000. Here, the color resist layer 1012 may be composed of a red color resist block 1012R, a green color resist block 1012G and a blue color resist block 1012B. In this way, subsequently, after these two display substrates 000 are assembled in a display device, the light rays can pass through each color resist block in the color resist layer 1012, so that the display device can display a colorful screen.

[0079] In an embodiment of the present application, the width of the surface of the support pillar 200 away from the second substrate 1011 is 2 microns or less. When the display substrate 000 is a color filter substrate, the width of the surface of the second support pillar 202 on the display substrate 000 away from the second substrate 1011 is 2 microns or less.

[0080] Regarding the above two types of display substrates 000, one display substrate 000 which is a color filter substrate and the other display substrate 000 which is an array substrate are celled, and then a liquid crystal layer is injected between the two celled display substrates 000, whereby a liquid crystal display panel can be formed. In order to more clearly view the liquid crystal display panel formed after the two display substrates 000 are celled, reference is made to FIG. 7, which is a schematic structural diagram after the two display substrates provided in the embodiment of the present application are celled. Here, the surface of the first support pillar 201 on the array substrate away from the array substrate and the surface of the second support pillar 202 on the color filter substrate away from the color filter substrate are in close contact. In this way, the first support pillar 201 and the second support pillar 202 act on each other to form a support pillar 200 that provides a support action to the liquid crystal display panel. Also, in the process of celling the array substrate and the color filter substrate, the first support pillar 201 and the second support pillar 202 can also prevent damage to the structures in the array substrate and the color filter substrate, thereby improving the display effect of the liquid crystal display panel.

[0081] Note that the width of the surface of the first support pillar 201 on the array substrate away from the first substrate 101 is larger than the width of the surface of the second support pillar 202 on the color filter substrate away from the second substrate 1011. In this way, in the process of celling the array substrate and the color filter substrate, by only adjusting the position of the second support pillar 202 on the color filter substrate, it can be ensured that the contact area between the surface of the first support pillar 201 away from the array substrate and the surface of the second support pillar 202 away from the color filter substrate is large.

[0082] From the above, an embodiment of the present application provides a display substrate including a substrate body, support pillars, and a protection structure. The protection structure is installed on the support pillars of the display substrate, and the surface of the protection structure away from the substrate body is a flat surface. Therefore, in the process of cellulating two display substrates, the surface of the protection structure on one display substrate away from the substrate body of this display substrate can effectively contact the surface of the protection structure on the other display substrate away from the substrate body of this display substrate, and the contact area when these two protection structures contact can be determined. In this way, when cellulating these two display substrates, by accurately calculating the cellulation pressure, it can be ensured that the cellulation effect of these two display substrates is good. In this way, subsequently, after assembling these two display substrates into a display device, it can be ensured that the display effect of the display device is good. Also, when the cellulation effect of two display substrates is good, the problem of damage to the display substrate caused by excessive cellulation pressure in the cellulation process can be avoided, and the problem of excessive gap between the two display substrates caused by too small cellulation pressure in the cellulation process can also be avoided.

[0083] In an embodiment of the present application, referring to FIGS. 8 and 9, FIG. 8 is a schematic diagram of the film layer structure of another display substrate provided in the embodiment of the present application, and FIG. 9 is a schematic diagram of the film layer structure of another display substrate provided in the embodiment of the present application. The display substrate 000 can include a substrate body 100 and a plurality of support pillars 200 located on the substrate body 100.

[0084] Here, the range of the angle α between the side surface of the support pillar 200 and the surface of the support pillar 200 away from the substrate body 100 is 90° - 95°.

[0085] Regarding the specific structure and beneficial effects of the display substrate 000 shown in FIGS. 8 and 9, reference can be made to the relevant content in the above embodiment, and the present application omits a detailed description thereof.

[0086] Here, the display substrate 000 shown in FIG. 8 may be an array substrate, and its structure is basically the same as the substrate structure shown in FIG. 5. The difference is only that it is necessary to remove the protection structure 300 in the process of forming the display substrate 000 shown in FIG. 8. Similarly, the display substrate 000 shown in FIG. 9 may be a color filter substrate, and its structure is basically the same as the substrate structure shown in FIG. 6. The difference is only that it is necessary to remove the protection structure 300 in the process of forming the display substrate 000 shown in FIG. 9. In the present application, the array substrate shown in FIG. 8 and the color filter substrate shown in FIG. 9 can also be celled in the same way to form a liquid crystal display panel. Referring to FIG. 10, FIG. 10 is a schematic diagram of the structure after celling of the other two display substrates provided in the embodiment of the present application. The surface of the first support pillar 201 away from the first substrate 101 and the surface of the second support pillar 202 away from the second substrate 201 can effectively contact, and the contact area when the two contact can be calculated. In this way, by being able to calculate the celling pressure during celling of the array substrate and the color filter substrate, it is ensured that the celling effect of the array substrate and the color filter substrate is good.

[0087] The embodiment of the present application further provides a method for manufacturing a display substrate. The method includes forming a plurality of support pillars on a substrate body. The support pillars have a first surface in contact with the substrate body and a second surface disposed opposite to the first surface. Here, in any direction parallel to the substrate body, the ratio of the width of the first surface to the width of the second surface is 0.8 or more and 1.2 or less.

[0088] As one of the options, forming a plurality of support pillars on the substrate body is On a substrate body, a support film layer covering the entire substrate body and a protective film layer are sequentially formed, and the etching rate of the material for creating the protective thin film is smaller than the etching rate of the material for creating the support film layer. At the same time, a patterning process is performed on the support film layer and the protective film layer to obtain support pillars created from the support film layer and a protective structure created from the protective film layer. Here, the orthographic projection of the support pillars onto the substrate body is located within the orthographic projection of the protective structure onto the substrate body.

[0089] As one option, the manufacturing method further includes removing the protective structure after simultaneously performing a patterning process on the support film layer and the protective film layer.

[0090] Embodiments of the present application further provide a manufacturing method for a display substrate. The manufacturing method for the display substrate is used to manufacture the display substrate shown in the above embodiments. For example, the display substrate manufactured by the manufacturing method for the display substrate is the display substrate shown in FIG. 3. Referring to FIG. 11, FIG. 11 is a flowchart of the manufacturing method for the display substrate provided by the embodiments of the present application. The manufacturing method for the display substrate can include the following steps.

[0091] Step A1: On a substrate body, a support film layer covering the entire substrate body and a protective film layer are sequentially formed.

[0092] Step A2: Simultaneously perform a patterning process on the support film layer and the protective film layer to obtain a plurality of support pillars formed from the support film layer and a plurality of protective structures formed from the protective film layer.

[0093] Here, the plurality of support pillars and the plurality of protective structures correspond one-to-one, and the orthographic projection of the support pillars onto the substrate body is located within the orthographic projection of the corresponding protective structure onto the substrate body. In this way, the width of the surface of the protective structure away from the substrate body is large.

[0094] From the above, in the manufacturing method of the display substrate provided by the embodiments of the present application, by installing a protective film layer on the support film layer, after the primary patterning process, the orthographic projection of the support pillars formed on the substrate body onto the substrate body is located within the orthographic projection of the corresponding protective structure onto the substrate body, that is, the surface of the protective structure away from the substrate body is a plane. In this way, in the process of cellulating two display substrates, the surface of the protective structure on one display substrate away from the substrate body of this display substrate can effectively contact the surface of the protective structure on the other display substrate away from the substrate body of this display substrate. In this way, the cellulation effect of these two display substrates is good, and subsequently, after assembling these two display substrates in a display device, it can be ensured that the display effect of the display device is good.

[0095] Referring to FIG. 12, FIG. 12 is a flowchart of a manufacturing method of another display substrate provided by the embodiments of the present application. For example, the display substrate manufactured by the manufacturing method of the display substrate may be the display substrate shown in FIG. 3, FIG. 5, FIG. 6, FIG. 8, or FIG. 9. The manufacturing method of the display substrate may include the following steps.

[0096] Step B1, provide a substrate body.

[0097] In the embodiments of the present application, the display substrate may be an array substrate or a color filter substrate. Therefore, the substrate body may have a structure without support pillars in the array substrate or a structure without support pillars in the color filter substrate.

[0098] Step B2, sequentially form a support film layer and a protective film layer covering the entire substrate body on the substrate body.

[0099] In an embodiment of the present application, a support film layer is formed on a substrate body by any one of many methods such as deposition, coating, sputtering, etc. After that, a curing process can be performed on the support film layer. Then, a protective film layer is formed on the cured support film layer by any one of many methods such as deposition, coating, sputtering, etc. Here, the support film layer can be made of an organic material, and the protective film layer can be made of at least one material among a metal conductive material, a transparent conductive material, and an inorganic insulating material.

[0100] In an embodiment of the present application, referring to FIG. 13, FIG. 13 is a schematic diagram provided by the embodiment of the present application for forming a support film layer and a protective film layer on a substrate body. A support film layer 200a is formed on the substrate body, and a protective film layer 300a is formed on the support film layer 200a.

[0101] Step B3: A first photoresist layer is formed on the protective film layer, and by performing an exposure process and a development process on the first photoresist layer, a first photoresist pattern is obtained.

[0102] In an embodiment of the present application, referring to FIG. 14, FIG. 14 is a schematic diagram provided by the embodiment of the present application for forming a first photolithography pattern on a substrate body. A first photoresist layer can be coated on the protective film layer 300a of the substrate body 100. After that, by performing one exposure and development on the first photoresist layer coated on the display substrate 000, a first photoresist pattern 111 is obtained.

[0103] Step B4: An etching process is performed on the protective film layer to remove the portion of the protective film layer that is not covered by the first photoresist layer, and a plurality of protection structures are formed.

[0104] In an embodiment of the present application, referring to FIG. 15, FIG. 15 is a schematic diagram of forming a protection structure on a substrate body provided by the embodiment of the present application. By adopting an etching process to etch the portion of the display substrate 000 where the photoresist pattern is not adhered, the protection film layer 300a corresponding to the portion where the photoresist pattern is not adhered can be etched, and the patterned protection structure 300 can be formed. Also, since the etching rate of the etching substance with respect to the protection film layer 300a is low, the probability that the surface of the protection structure 300 formed by the primary patterning process away from the substrate body 100 exhibits an arc shape is low.

[0105] Step B5: Perform an etching process on the support film layer 200a to remove the portions of the support film layer not covered by the plurality of protection structures, thereby forming a plurality of support columns.

[0106] In an embodiment of the present application, referring to FIG. 16, FIG. 16 is a schematic diagram of forming support columns on a substrate body provided by the embodiment of the present application. By adopting an etching method to etch the portions of the display substrate 000 not covered by the protection structure 300, the support columns 200 can be formed. In this process, both the first photoresist layer 111 and the protection structure 300 can be used as mask plates for patterning and manufacturing the support columns 200. Since the etching rate of the etching substance with respect to the protection structure 300 is low, the protection structure 300 can provide protection for the support columns 200 such that the range of the angle between the side surface of the support columns 200 and the surface away from the substrate body 100 is 90° - 95°.

[0107] Step B6: Peel off the first photoresist pattern.

[0108] In an embodiment of the present application, referring to FIG. 17, FIG. 17 is a schematic diagram of forming support columns and a protection structure on a substrate body provided by the embodiment of the present application. By peeling off the photoresist on the display substrate 000, a plurality of support columns 200 and a plurality of protection structures 300 can be obtained.

[0109] Note that after step B6, the plurality of protection structures 300 on the plurality of support pillars 200 can be removed, or the plurality of protection structures 300 on the plurality of support pillars 200 can also not be removed. When the plurality of protection structures 300 on the plurality of support pillars 200 are removed after step B6, the structure of the display substrate manufactured by this method of manufacturing a display substrate can refer to FIG. 8 or FIG. 9. When the plurality of protection structures 300 on the plurality of support pillars 200 are not removed after step B6, the structure of the display substrate manufactured by this method of manufacturing a display substrate can refer to FIG. 3, FIG. 5 or FIG. 6.

[0110] From the above, the method for manufacturing a display substrate provided in the embodiments of the present application forms a support film layer and a protection film layer on a substrate body in sequence, and performs a primary patterning process on the substrate body having the support film layer and the protection film layer. Since the etching rate of the etching substance with respect to the protection structure is small, the surface of the protection structure away from the substrate body is a flat surface. In this way, in the process of cellulating two display substrates, the surface of the protection structure on one display substrate away from the substrate body of this display substrate can effectively contact the surface of the protection structure on the other display substrate away from the substrate body of this display substrate. Also, the surface of the support pillar away from the substrate body is also a flat surface. Therefore, even if the protection structure on the support pillar is removed, in the process of cellulating two display substrates, it is also possible to ensure that the two support pillars between the two display substrates effectively contact each other. In this way, the cellulation effect of these two display substrates is good. And subsequently, after assembling these two display substrates into a display device, it can be ensured that the display effect of the display device is good.

[0111] Referring to FIG. 18, FIG. 18 is a flowchart of another method for manufacturing a display substrate provided in the embodiments of the present application. The protection structure in this display substrate is made of a transparent conductive material, and this display substrate has a common electrode. Exemplarily, this display substrate may be an array substrate, and the common electrode in the array substrate is formed simultaneously with the protection structure. In this case, the method for manufacturing the display substrate may include the following steps.

[0112] Step C1: Provide a substrate body.

[0113] In an embodiment of the present application, the substrate body may not include the structure of support pillars and the structure of common electrodes on the array substrate.

[0114] Step C2: Sequentially form a support film layer and a protective film layer that cover the entire substrate body on the substrate body.

[0115] This step C2 can refer to the above step B2, but the material for creating the protective film layer here needs to select a transparent conductive material.

[0116] Step C3: Form a second photoresist layer on the protective film layer, and perform an exposure process and a development process on the second photoresist layer to obtain a second photoresist pattern.

[0117] Here, the second photoresist pattern has a first photoresist region, a second photoresist region, and a photoresist complete removal region. The thickness of the photoresist in the first photoresist region is greater than the thickness of the photoresist in the second photoresist region, and there is no photoresist in the photoresist complete removal region.

[0118] In an embodiment of the present application, the process of forming the second photoresist layer may include using a grayscale photomask to perform an exposure process and a development process on the second photoresist layer so as to retain the photoresist covering the support pillars and the protective structure and the photoresist covering the common electrodes, and remove the photoresist in other regions. Here, the photoresist covering the common electrodes is the photoresist in the first photoresist region, and the photoresist located on the support pillars and the protective structure is the photoresist in the second photoresist region.

[0119] Here, the photoresist, also known as the light resist, is a carrier medium for photolithographic imaging. Its function is to utilize the principle of photochemical reactions to convert the diffracted and filtered optical information in the photolithographic system into chemical energy and complete the copying of the mask pattern.

[0120] Exemplarily, referring to FIG. 19, FIG. 19 is a schematic structural diagram of a grayscale photomask provided in an embodiment of the present application. The grayscale photomask 010 can have a non-light-transmitting region 01a, a semi-light-transmitting region 01b, and a light-transmitting region 01c. Here, the light transmittance of the non-light-transmitting region 01a is smaller than that of the semi-light-transmitting region 01b, and the light transmittance of the semi-light-transmitting region 01b is smaller than that of the light-transmitting region 01c. Taking the material of the photoresist layer as a positive photoresist as an example, after performing exposure treatment and development treatment on the photoresist layer, the photoresist within the first photoresist region and the second photoresist region can be retained, and the photoresist within the photoresist complete removal region can be removed, and the thickness of the photoresist within the first photoresist region is larger than that of the photoresist within the second photoresist region. Here, the non-light-transmitting region in the grayscale photomask 010 corresponding to the first photoresist region is 01a, the semi-light-transmitting region in the grayscale photomask 010 corresponding to the second photoresist region is 01b, and the light-transmitting region in the grayscale photomask 010 corresponding to the photoresist complete removal region is 01c.

[0121] It should be noted that the embodiment of the present application is to schematically explain by taking the material of the photoresist thin film as a positive photoresist as an example. In an implementation form as one of other options, the material of the photoresist thin film may be a negative photoresist, and the embodiment of the present application does not limit this.

[0122] Exemplarily, referring to FIG. 20, FIG. 20 is a schematic structural diagram of a display substrate at the end of step C3. The gray-scale photomask 010 is adopted to perform exposure and development processes on the photoresist layer 222 so as to retain the photoresist in the first photoresist region 222a and the second photoresist region 222b and remove the photoresist in the photoresist complete removal region 222c. Moreover, the photoresist thickness in the first photoresist region 222a is greater than the photoresist thickness in the second photoresist region 222b.

[0123] Step C4: Simultaneously perform an etching process on the protective film layer and the support film layer to remove the portions corresponding to the photoresist complete removal region in the protective film layer and the support film layer, thereby forming a common electrode, a support pillar, and a protection structure.

[0124] Here, the photoresist in the first photoresist region covers the common electrode, and the photoresist in the second photoresist region covers the protection structure.

[0125] In the embodiment of the present application, referring to FIG. 21, FIG. 21 is a schematic diagram of forming a support pillar and a protection structure on a substrate body provided in the embodiment of the present application. The first photoresist region 222a covers the common electrode 108, and the second photoresist region 222b covers the protection structure 300 and the support pillar 200.

[0126] Step C5: Remove the photoresist in the second photolithography region and perform an etching process on the protection structure corresponding to the second photoresist region so as to remove the protection structure on the support pillar.

[0127] In the embodiment of the present application, step C5 may include the following steps.

[0128] Step C501: Adopt dry etching to remove the photoresist in the second photoresist region 222b and thin the photoresist in the first photoresist region.

[0129] In the present application, a display substrate on which a common electrode and a protection structure are formed is placed in a dry etching chamber, and by passing an ashing gas, the ashing gas can remove the photoresist in the second photoresist region and thin the photoresist in the first photoresist region. Here, by reacting with the photoresist using the ashing gas, the photoresist on the substrate is removed. For example, the ashing gas can include a mixed gas of oxygen gas and sulfur hexafluoride.

[0130] Exemplarily, referring to FIG. 22, FIG. 22 is a schematic structural diagram of a display substrate at the end of step C501. Dry etching is employed to remove the photoresist in the second photoresist region 222b and thin the photoresist in the first photoresist region 222a. In this way, photoresist only exists in the first photoresist region 222a, and there is no photoresist on the protection structure 300 in the second photoresist region 222b.

[0131] Step C502: By employing dry etching to remove a portion of the protection structure corresponding to the second photoresist region, support pillars are formed.

[0132] In the present application, by employing dry etching to remove a portion of the protection structure corresponding to the second photoresist region, support pillars can be formed in the second photoresist region on the substrate body, and a common electrode can be formed in the first photoresist region on the substrate body.

[0133] Exemplarily, referring to FIG. 23, FIG. 23 is a schematic structural diagram of a display substrate at the end of step C502. By employing dry etching to remove a portion of the protection structure 300 corresponding to the second photoresist region 222b, support pillars 200 are formed in the second photoresist region 222b on the substrate body 100, and a common electrode 108 is formed in the first photoresist region 222a on the substrate body 100.

[0134] From the above, the method for manufacturing a display substrate provided in the embodiments of the present application forms a support film layer and a protective film layer in sequence on a substrate body, and performs a primary patterning process on the substrate body having the support film layer and the protective film layer. Since the protective structure is made of a transparent conductive material and this display substrate has a common electrode, the primary patterning process can be adopted to form the support pillars and the common electrode simultaneously. Here, the surface of the support pillar away from the substrate body is a flat surface. In this way, in the process of cellulating two display substrates, the surface of the protective structure on one display substrate away from the substrate body of this display substrate and the surface of the protective structure on the other display substrate away from the substrate body of this display substrate can effectively contact each other. In this way, the cellulating effect of these two display substrates is good. Also, since the support pillars and the common electrode are formed by the primary patterning process, the manufacturing process of the display substrate can be simplified.

[0135] Embodiments of the present application further provide a display device. The display device may be any product or component having a display function, such as a mobile phone, a tablet, a television, a display, a notebook computer, a digital photo frame, a navigator, etc. The display device may include a power supply component and a display substrate. Here, the display substrate may be the display substrate in the above embodiments.

[0136] In the embodiments of the present application, the display substrate may be a display substrate in an organic light-emitting diode display panel or a display substrate in a liquid crystal display panel.

[0137] It may be the case. And it can be understood that when an element or layer is said to be "on" another element or layer, it may be directly on top of the other element or there may be intermediate layers. Also, when an element or layer is said to be "under" another element or layer, it may be directly under the other element or there may be one or more intermediate layers or elements. Further, when a layer or element is said to be "between" two layers or two elements, it may be the only layer between the two layers or two elements, or there may be one or more additional intermediate layers or elements. In this specification, similar reference numerals indicate similar elements.

[0138] In the present application, the terms "first" and "second" are used for illustrative purposes only and should not be construed as indicating relative importance. The term "plurality" means two or more unless explicitly limited otherwise.

[0139] The above are only selectable embodiments of the present application and are not used to limit the present application. Any modifications, equivalent substitutions, improvements, etc. made in the spirit and principles of the present application should all be included within the protection scope of the present application.

Description of Reference Numerals

[0140] 100 Substrate body 200 Support pillar 300 Protection structure

Claims

1. A substrate body, a plurality of support pillars located on the substrate body, and including, the support pillar has a first surface in contact with the substrate body and a second surface disposed opposite to the first surface, in any direction parallel to the substrate body, the ratio of the width of the first surface to the width of the second surface is 0.8 or more and 1.2 or less, a display substrate.

2. In any direction parallel to the substrate body, the ratio of the absolute value of the difference between the width of the first surface and the width of the second surface to the width of the first surface is 0.4 or less, The display substrate according to Claim 1.

3. The support pillar includes a first portion and a second portion laminated along a direction perpendicular to the substrate body and away from the substrate body, and the orthographic projection of the second portion on the substrate body is located within the orthographic projection of the first portion on the substrate body, the side surface of the first portion is a plane, and the side surface of the second portion is an arc-shaped concave surface, The display substrate according to Claim 1.

4. The absolute value of the difference between the width of the first surface and the width of the second surface is 0.8 microns or less, The display substrate according to Claim 3.

5. The range of the angle between the side surface of the first portion and the surface of the first portion close to the substrate body is 85° to 90°, The display substrate according to Claim 3.

6. In the direction perpendicular to the side surface of the first portion, the range of the maximum depth of the arc-shaped concave surface is 0.1 micron to 0.2 micron, The display substrate according to Claim 3.

7. In the direction perpendicular to the substrate body, the range of the ratio of the thickness of the second portion to the thickness of the first portion is 1 / 7 to 1 / 6, The display substrate according to Claim 3.

8. The display substrate further includes a protection structure located on the side of the support pillar away from the substrate body, and the orthographic projection of the support pillar on the substrate body is located within the orthographic projection of the protection structure on the substrate body, the material of the protection structure is different from the material of the support pillar, The display substrate according to Claim 1.

9. The material hardness of the protection structure is greater than the material hardness of the support pillar, The display substrate according to Claim 8.

10. The material of the protection structure includes an inorganic material, and the material of the support pillar includes an organic material, The display substrate according to Claim 9.

11. The material of the protection structure includes at least one of a metal conductive material, a transparent conductive material, and an inorganic insulating material, The display substrate according to Claim 10.

12. In a direction perpendicular to the substrate body, the thickness range of the support pillar is 0.8 microns to 1.5 microns. The display substrate according to claim 7.

13. The display substrate is an array substrate, and the substrate body includes a first substrate, a thin film transistor located on the first substrate, a planarization layer, a pixel electrode, and an auxiliary support pillar. The thin film transistor has a source and a drain. The planarization layer is located on a side of the thin film transistor away from the first substrate, and the planarization layer has a connection via, and at least a part of the source or the drain is located in the connection via. The pixel electrode is located on a side of the planarization layer away from the first substrate, and a part of the pixel electrode is located in the connection via and overlaps with the source or the drain. The support pillar is located outside the connection via, and the support pillar and the auxiliary support pillar are of an integral structure, and the auxiliary support pillar is located in the connection via. The display substrate according to any one of claims 1 to 12.

14. In a direction perpendicular to the first substrate, the relationship between the height H of the support pillar and the width W of a surface of the support pillar away from the first substrate satisfies 1 / 5W ≤ H ≤ 1 / 2W. The display substrate according to claim 12.

15. The thin film transistor further includes an active layer that overlaps with the source and overlaps with the drain. The substrate body further includes a light-shielding structure located on a side of the thin film transistor close to the first substrate, and a buffer layer located between the light-shielding structure and the thin film transistor. The orthographic projection of the active layer onto the first substrate is located within the orthographic projection of the light-shielding layer onto the first substrate, and the orthographic projection of the support pillar onto the first substrate is located within the orthographic projection of the light-shielding structure onto the first substrate. The display substrate according to claim 13.

16. The substrate body further includes a passivation layer located on a side of the pixel electrode away from the first substrate, and a common electrode located on a side of the passivation layer away from the first substrate. A part of the passivation layer is located within the connection via, and within the connection via, the support pillar is located on the side away from the first substrate of the passivation layer. The orthographic projection of the common electrode onto the first substrate does not overlap with the orthographic projection of the connection via onto the first substrate. The display substrate according to claim 13.

17. The source and the drain in the thin film transistor are provided in different layers. The display substrate according to any one of claims 14 to 16.

18. The width of the surface of the support pillar away from the first substrate is 4.5 microns or less. The display substrate according to claim 13.

19. The display substrate is a color filter substrate, and the substrate body includes a second substrate, a color resist layer and a black matrix located on the second substrate. The support pillar is located on the side away from the second substrate of the black matrix, and the orthographic projection of the support pillar onto the second substrate is located within the orthographic projection of the black matrix onto the second substrate. The display substrate according to any one of claims 1 to 12.

20. The width of the surface of the support pillar away from the second substrate is 2 microns or less. The display substrate according to claim 19.

21. Forming a plurality of support pillars on the substrate body, The support pillar has a first surface in contact with the substrate body and a second surface disposed opposite to the first surface. In any direction parallel to the substrate body, the ratio of the width of the first surface to the width of the second surface is 0.8 or more and 1.2 or less. A method for manufacturing a display substrate.

22. Forming a plurality of support pillars on the substrate body includes: Forming a support film layer and a protective film layer that cover the entire substrate body on the substrate body in sequence, and the etching rate of the material for creating the protective thin film is smaller than the etching rate of the material for creating the support film layer. Performing a patterning process on the support film layer and the protective film layer simultaneously to obtain support pillars created from the support film layer and a protective structure created from the protective film layer. including The orthographic projection of the support pillar onto the substrate body is located within the orthographic projection of the protective structure onto the substrate body. The method according to claim 21.

23. The method further includes removing the protection structure after simultaneously performing a patterning process on the support film layer and the protection film layer, The method according to claim 22.

24. A display device including the display substrate according to any one of claims 1 to 20 and a power supply component that supplies power to the display substrate.

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