Method, apparatus, device, and medium for constructing a measurement database based on a design layout

Abstract

The present application provides a method, an apparatus, an electronic device, and a computer-readable storage medium for constructing a measurement database based on a design layout. The method for constructing a measurement database based on the design layout includes the steps of: selecting an actual pattern to be measured in the design layout; obtaining an SEM image of the actual pattern at the actual position of the silicon wafer; obtaining all measurement data of the SEM image; and storing the measurement data to obtain a measurement database. According to an embodiment of the present application, the constructed measurement database can store a large amount of measurement data obtained from the actual pattern of the chip and the pattern environment around the measurement data.

Description

Technical Field

[0001] This application belongs to the field of chip production and manufacturing, and particularly relates to a method and apparatus for constructing a measurement database based on a design layout, an electronic device, and a computer-readable storage medium.

Background Art

[0002] Currently, in the chip production and manufacturing process, for the line width measurement data generated in the production process, a database is usually constructed based on the design line width, design interval, and design pitch (pitch) to store and monitor the data. Here, the pitch is the distance between the centers of two "cells" on the board surface.

[0003] Measurements based on general design line widths, design intervals, and design pitches (pitches) are all to measure various dedicated design test patterns. Hereinafter, the measurements of some general test patterns will be described.

[0004] (1) Measurement of the design line width, design interval, and design pitch of Hole / Islan (hole / island)

[0005] Normal Hole / Island measurements are generally measured based on the design line width of the Hole or Island (a1, b1 shown in FIG. 1), the design pitch (p1, p2 shown in FIG. 1), and the design interval (s1 shown in FIG. 1). The obtained data is also stored, used, and monitored based on these design values.

[0006] (2) Measurement of the design line width, design interval, and design pitch of Line / Space (line / space)

[0007] Normal Line / Space measurements are generally measured based on the design width of the Line or Space (w1, w2 shown in FIG. 2), the design pitch (p1 shown in FIG. 2), and the design interval (s1 shown in FIG. 2). The obtained data is also stored, used, and monitored based on these design values.

[0008] Now, after the measurement of the designed line width or the designed interval is completed, generally, the measured values are stored in a database, and then, based on the designed line width or the designed interval, the designed pitch is added and stored, and the measurement data is used and monitored. Reference can be made to FIG. 3.

[0009] In the prior art, since the measurement is performed on the test pattern, and the designed line width, the designed interval, and the designed pitch of the test pattern are fixed values, data can be stored based on the designed line width, the designed interval, and the designed pitch.

[0010] However, in the prior art, the measurement data of the actual pattern of the silicon wafer cannot be stored. In the actual pattern of the silicon wafer, a plurality of types of designed line widths, designed intervals, and designed pitches usually exist simultaneously. Therefore, when only relying on the designed line width, the designed interval, and the designed pitch to store the measurement data, the influence of the pattern surrounding environment on the measured line width value and interval value cannot be covered.

[0011] In the actual pattern of the silicon wafer, in the design layout pattern of a small block, various line width design values, interval design values, and pitch design values are included, and the actual line width value and interval value are affected by the patterns existing around.

[0012] As shown in FIG. 4, the line width w1 at the central part in FIG. 4 is affected not only by the adjacent line width w2 and the interval s1, but also by the non - adjacent line width w3 and the interval s2. Also, the line width w4 and the intervals s3 and s4 in other directions also affect w1.

[0013] Therefore, storing data only based on the designed line width, the designed interval, and the designed pitch is insufficient for storing the data of the actual chip pattern, and all the pattern information affecting the line width cannot be stored.

[0014] In addition, it is also difficult to store data based on the designed line width, designed interval, and designed pitch, that is, to store together the line width values and interval values in each chip manufacturing layer of the actual pattern on the same silicon wafer. The continuous upgrade of chip production technology requires more attention to the mutual influence between each chip manufacturing layer. At the same silicon wafer position, it becomes increasingly important to store and manage collectively the measurement data in each manufacturing layer of the actual chip pattern.

[0015] In view of this, the present application is proposed.

Summary of the Invention

[0016] Embodiments of the present application provide a method, an apparatus, an electronic device, and a computer-readable storage medium for constructing a measurement database based on a design layout. The constructed measurement database can store a large amount of measurement data obtained from the actual pattern of a chip and the pattern environment around the measurement data.

[0017] According to a first aspect, embodiments of the present application provide a method for constructing a measurement database based on a design layout. The method for constructing a measurement database based on a design layout includes: selecting an actual pattern to be measured in the design layout; acquiring a scanning electron microscope (SEM) image of the actual pattern at the actual position on the silicon wafer; acquiring all measurement data of the SEM image; storing the measurement data to obtain a measurement database.

[0018] Optionally, the step of acquiring all measurement data of the SEM image includes: determining a target measurement point based on the coordinate position information of the design layout; generating all measurement boxes within a preset measurement range based on the design layout and preset measurement conditions; Generating a measurement recipe file based on the target measurement points and all measurement boxes, Aligning the SEM image with the design layout and obtaining the alignment result, Measuring the SEM image based on the alignment result and the measurement recipe file and obtaining measurement data.

[0019] Optionally, the step of storing measurement data to obtain a measurement database includes Grouping patterns based on the design layout and obtaining the grouping result, Storing corresponding measurement data based on the grouping result to obtain a measurement database.

[0020] Optionally, storing corresponding measurement data based on the grouping result to obtain a measurement database includes storing corresponding measurement data based on the grouping result, the designed line width, the designed interval, and the designed pitch to obtain a measurement database, where the measurement data includes the designed line width, the designed interval, the designed pitch, and the design layout information.

[0021] Optionally, storing corresponding measurement data based on the grouping result, the designed line width, the designed interval, and the designed pitch to obtain a measurement database includes storing corresponding measurement data based on the grouping result, the designed line width, the designed interval, and the order of the designed pitch to obtain a measurement database.

[0022] Optionally, storing corresponding measurement data based on the grouping result, the designed line width, the designed interval, and the order of the designed pitch to obtain a measurement database includes determining each layer in the pattern of each group based on the grouping result, For each layer, storing corresponding measurement data based on the order of the designed line width, designed interval, and designed pitch, and obtaining a measurement database.

[0023] Optionally, grouping patterns based on the design layout and obtaining the grouping result Grouping patterns based on the design layout, and determining a database number corresponding to the patterns of each group.

[0024] Optionally, after storing the measurement data and obtaining the measurement database, the method further obtaining measurement data of a new additional pattern; determining whether the new additional pattern is the same as the pattern corresponding to each database number; if the pattern corresponding to one database number is the same as the new additional pattern, storing the measurement data of the new additional pattern in the measurement data record corresponding to the database number.

[0025] Optionally, after determining whether the new additional pattern is the same as the pattern corresponding to each database number, the method further if the patterns corresponding to all database numbers are all different from the new additional pattern, generating a new database number for the new additional pattern; storing the measurement data of the new additional pattern in the measurement data record corresponding to the new database number.

[0026] Optionally, after obtaining the measurement data of the new additional pattern, the method further searching, comparing, and updating the existing patterns in the measurement database based on the measurement data of the new additional pattern.

[0027] Optionally, grouping patterns based on the design layout to obtain a grouping result includes grouping measurement points that are located at different positions within one chip product but have the same pattern into the same group.

[0028] Optionally, grouping patterns based on the design layout to obtain a grouping result includes grouping measurement points that have the same pattern between different chip products into the same group.

[0029] As a second aspect, an embodiment of the present application provides an apparatus for constructing a measurement database based on a design layout, including a pattern selection module that selects an actual pattern to be measured in the design layout, an SEM image acquisition module that acquires an SEM image of the actual pattern at the actual position of the silicon wafer, a measurement data acquisition module that acquires all measurement data of the SEM image, and a measurement database construction module that stores the measurement data to obtain a measurement database.

[0030] Optionally, the measurement data acquisition module is configured to determine a target measurement point based on the coordinate position information of the design layout, generate all measurement boxes within a preset measurement range based on the design layout and preset measurement conditions, generate a measurement recipe file based on the target measurement point and all measurement boxes, align the SEM image with the design layout to obtain an alignment result, and measure the SEM image based on the alignment result and the measurement recipe file to obtain measurement data.

[0031] Optionally, the measurement database construction module includes a pattern grouping unit that groups patterns based on the design layout to obtain a grouping result, A measurement database construction unit that stores corresponding measurement data based on the grouping result and obtains a measurement database.

[0032] Optionally, the measurement database construction unit is configured to store corresponding measurement data based on the grouping result, the designed line width, the designed interval, and the designed pitch, and obtain a measurement database. Here, the measurement data includes the designed line width, the designed interval, the designed pitch, and the designed layout information.

[0033] Optionally, the measurement database construction unit is configured to store corresponding measurement data based on the grouping result, the designed line width, the designed interval, and the designed pitch in the order before and after, and obtain a measurement database.

[0034] Optionally, the measurement database construction unit determines each layer in the pattern of each group based on the grouping result, and for each layer, stores corresponding measurement data based on the order before and after the designed line width, the designed interval, and the designed pitch, and is configured to obtain a measurement database.

[0035] Optionally, the pattern grouping unit is configured to group patterns based on the designed layout and determine a database number corresponding to the pattern of each group.

[0036] Optionally, the device further includes a measurement data acquisition module for acquiring measurement data of a new additional pattern, a pattern determination module for determining whether the new additional pattern is the same as the pattern corresponding to each database number, and further includes a measurement database construction unit that stores the measurement data of the new additional pattern in the measurement data record corresponding to the database number when the pattern corresponding to one database number is the same as the new additional pattern.

[0037] Optionally, the apparatus a database number generation module that generates one new database number for the new additional pattern if all patterns corresponding to all database numbers are different from the new additional pattern, and further includes a measurement database construction unit that stores the measurement data of the new additional pattern in the measurement data record corresponding to the new database number.

[0038] Optionally, the apparatus further includes a measurement database construction unit that searches, compares, and updates the existing patterns in the measurement database based on the measurement data of the new additional pattern.

[0039] Optionally, the pattern grouping unit is configured to group measurement points that are located at different positions within one chip product but have the same pattern into the same group.

[0040] Optionally, the pattern grouping unit is configured to group measurement points that have the same pattern in different chip products into the same group.

[0041] As a third aspect, an embodiment of the present application provides an electronic device including a processor and a memory storing computer program instructions, wherein when the processor executes the computer program instructions, a measurement database construction method based on the design layout shown in the first aspect is realized.

[0042] In a fourth aspect, an embodiment of the present application provides a computer-readable storage medium storing computer program instructions, and when the computer program instructions are executed by a processor, a measurement database construction method based on the design layout shown in the first aspect is realized.

[0043] The method, apparatus, electronic device, and computer-readable storage medium for constructing a measurement database based on a design layout according to an embodiment of the present application can store a large amount of measurement data obtained from the actual pattern of a chip and the pattern environment around the measurement data in the constructed measurement database.

[0044] The method for constructing a measurement database based on the design layout includes the steps of selecting an actual pattern to be measured in the design layout, obtaining an SEM image of the actual pattern at the actual position of the silicon wafer, obtaining all measurement data of the SEM image, and storing the measurement data to obtain a measurement database.

[0045] As can be seen from this, the method selects an actual pattern to be measured in the design layout, obtains an SEM image of the actual pattern at the actual position of the silicon wafer, and can further obtain a large amount of measurement data and the pattern environment around the measurement data from the actual pattern of the chip.

Brief Description of the Drawings

[0046] To more clearly explain the specific embodiments of the present invention or the technical solutions in the prior art, the drawings required to be used in the following description of the specific embodiments or the prior art will be briefly described below. Obviously, the drawings in the following description are some embodiments of the present application, and those skilled in the art can also obtain other drawings based on these drawings without creative labor.

[0047]

Figure 1

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Embodiments for Carrying Out the Invention

[0048] Hereinafter, the features and exemplary embodiments of each aspect of the present application will be described in detail. To more clearly understand the object, technical solution and advantages of the present application, the present application will be further described in more detail with reference to the drawings and specific embodiments below. As can be understood, the specific embodiments described here are only intended to interpret the present application and do not limit the present application. For those skilled in the art, the present application can be implemented without some of these specific details. The following description of the embodiments is only provided to show examples of the present application to better understand the present application.

[0049] Note that in this specification, relative terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply the existence of such an actual relationship or order between these entities or operations. Also, the term "comprising", "including" or any other variation thereof is intended to cover non-exclusive inclusion, such that a process, method, article or device comprising a list of elements includes not only those elements but also other elements not expressly listed or elements inherent to such a process, method, article or device. Without more limitations, an element limited by the phrase "comprising..." does not exclude the presence of other like elements in the process, method, article or apparatus comprising the element.

[0050] In order to solve the problems of the prior art, embodiments of the present application provide a method, apparatus, electronic device and computer-readable storage medium for constructing a measurement database based on a design layout. First, the method for constructing a measurement database based on a design layout according to the embodiments of the present application will be described below.

[0051] FIG. 5 is a schematic flowchart of a method for constructing a measurement database based on a design layout according to an embodiment of the present application. As shown in FIG. 5, the method for constructing a measurement database based on the design layout includes the following steps.

[0052] In S501, an actual pattern to be measured in the design layout is selected.

[0053] However, this actual pattern is not a test pattern.

[0054] In S502, a scanning electron microscope (SEM) image of the actual pattern at the actual position of the silicon wafer is obtained.

[0055] In S503, all measurement data of the SEM image are obtained.

[0056] In some embodiments, all measurement data of the SEM image can be automatically obtained.

[0057] In some embodiments, obtaining all measurement data of the SEM image includes determining a target measurement point based on the coordinate position information of the design layout, generating all measurement boxes within a preset measurement range based on the design layout and preset measurement conditions, generating a measurement recipe file based on the target measurement point and all measurement boxes, aligning the SEM image with the design layout to obtain an alignment result, and measuring the SEM image based on the alignment result and the measurement recipe file to obtain measurement data.

[0058] In S504, the measurement data is stored to obtain a measurement database.

[0059] In some embodiments, storing the measurement data to obtain a measurement database includes grouping patterns based on the design layout to obtain a grouping result, and storing corresponding measurement data based on the grouping result to obtain a measurement database.

[0060] In some embodiments, storing corresponding measurement data based on the grouping result to obtain a measurement database includes storing corresponding measurement data based on the grouping result, design line width, design interval, and design pitch to obtain a measurement database, where the measurement data includes design line width, design interval, design pitch, and design layout information.

[0061] In some embodiments, storing corresponding measurement data based on grouping results, design line widths, design spacings, and design pitches to obtain a measurement database is including storing corresponding measurement data based on the order of grouping results, design line widths, design spacings, and design pitches to obtain a measurement database.

[0062] Specifically, as shown in FIG. 6, the stored measurement values can be stored in the order of "pattern grouping - design line width and design spacing - design pitch", and the data in the database can be queried and used according to pattern grouping, design line width and design spacing, and design pitch.

[0063] In some embodiments, storing corresponding measurement data based on the order of grouping results, design line widths, design spacings, and design pitches to obtain a measurement database is including determining each layer in the patterns of each group based on the grouping results, and for each layer, storing corresponding measurement data based on the order of design line widths, design spacings, and design pitches to obtain a measurement database.

[0064] Since the measurement database based on the layout can include multi-layer layout information, the measurement data of different chip manufacturing layers can be stored in the same design pattern group, and the relationship between the mutual influence of the line width data between layers and the yield rate can be monitored better.

[0065] In the manufacturing process of the tip chip, the chip manufacturing layer of the same layer is realized to transfer the design layout to the silicon wafer in two or more exposures. In the process of multiple exposures, the layer to be exposed later is affected by the layer formed by exposure on the silicon wafer. In this case, storing the line width measurement values after two or more exposure processes of the same design pattern together can improve the immediacy and effectiveness of monitoring, which is meaningful for the monitoring and adjustment of the exposure process.

[0066] Also, in chip manufacturing, the line width of the Metal layer (metal layer) and the opening diameter of Contact / Via (contact / via) may also affect the performance of the Metal-Via (metal via) connection together. When the line width of the Metal layer and the aperture diameter of Contact / Via both become narrow at the same time, the risk of the Metal-Via connection failing is high. When the aperture diameter of Contact / Via becomes narrow, if the line width of the Metal layer in the previous layer is sufficient, the risk of failure is low, and it is considered possible to avoid the cost loss caused by excessive rework without the need for rework in the photolithography process of Contact / Via. Therefore, as shown in FIG. 7, by storing the measurement data of multiple layers of the same pattern together, the accuracy and effectiveness of process monitoring can be improved, the yield rate can be improved, and the effect of reducing costs can be achieved.

[0067] In some embodiments, grouping the patterns based on the design layout to obtain the grouping result includes grouping the patterns based on the design layout and determining the database number corresponding to the pattern of each group.

[0068] In some embodiments, after storing the measurement data to obtain the measurement database, the method further obtains the measurement data of the new additional pattern, determines whether the new additional pattern is the same as the pattern corresponding to each database number, If the pattern corresponding to a database number is the same as the new additional pattern, storing the measurement data of the new additional pattern in the measurement data record corresponding to the database number is included.

[0069] In some embodiments, after determining whether the new additional pattern is the same as the pattern corresponding to each database number, the method further If the patterns corresponding to all database numbers are all different from the new additional pattern, generating a new database number for the new additional pattern and storing the measurement data of the new additional pattern in the measurement data record corresponding to the new database number are included.

[0070] Specifically, first, patterns are grouped based on the design layout, and each group of patterns has a corresponding database number. When new measurement pattern data is added, the new measurement pattern needs to be compared with the numbered patterns in the database. If the new measurement pattern is the same as an existing measurement pattern, the new measurement data is added to the data record of the existing pattern and stored as one new measurement data of the existing pattern. If all new measurement patterns are different from the existing measurement patterns, the database generates a new measurement pattern number for storing this new measurement pattern. Also, the new measurement data is stored in the measurement data record of the new measurement pattern.

[0071] In some embodiments, after obtaining the measurement data of the new additional pattern, the method further includes performing search, comparison, and update on the existing patterns in the measurement database based on the measurement data of the new additional pattern.

[0072] In some embodiments, grouping patterns based on the design layout to obtain the grouping result is Grouping measurement points that are located at different positions within a single chip product but have the same pattern into the same group.

[0073] In some embodiments, grouping the patterns based on the design layout to obtain grouping results includes grouping measurement points with the same pattern among different chip products into the same group.

[0074] Based on the pattern grouping method shown in the above embodiments, the line width control uniformity within the chip and the line width control uniformity between products can be better compared and monitored.

[0075] As described above, according to the measurement database constructed by the present application, a large amount of measurement values obtained from the actual pattern of the chip and the pattern environment around the measurement values can be stored. The conventional measurement database can only store the designed line width or interval and the designed pitch of the measurement points when storing the measurement values on the actual pattern, and cannot store the pattern environment around the measurement points. However, it is necessary to consider the influence of the surrounding patterns on the measurement values on the actual pattern of the chip.

[0076] FIG. 8 is a schematic structural diagram of an apparatus for constructing a measurement database based on a design layout according to an embodiment of the present application. As shown in FIG. 8, the apparatus for constructing a measurement database based on the design layout includes a pattern selection module 801 for selecting an actual pattern to be measured in the design layout, an SEM image acquisition module 802 for acquiring an SEM image of the actual pattern at the actual position of the silicon wafer, a measurement data acquisition module 803 for acquiring all measurement data of the SEM image, and a measurement database construction module 804 for storing the measurement data to obtain a measurement database.

[0077] In some embodiments, the measurement data acquisition module 803 determines target measurement points based on the coordinate position information of the design layout, generates all measurement boxes within a preset measurement range based on the design layout and preset measurement conditions, generates a measurement recipe file based on the target measurement points and all measurement boxes, aligns the SEM image with the design layout, obtains the alignment result, and measures the SEM image based on the alignment result and the measurement recipe file to obtain measurement data.

[0078] In some embodiments, the measurement database construction module 804 includes a pattern grouping unit that groups patterns based on the design layout and obtains a grouping result, and a measurement database construction unit that stores corresponding measurement data based on the grouping result and obtains a measurement database.

[0079] In some embodiments, the measurement database construction unit is configured to store corresponding measurement data based on the grouping result, the designed line width, the designed interval, and the designed pitch, and obtain a measurement database, and the measurement data includes the designed line width, the designed interval, the designed pitch, and the design layout information.

[0080] In some embodiments, the measurement database construction unit stores corresponding measurement data based on the grouping result, the designed line width, the designed interval, and the order of the designed pitch, and obtains a measurement database.

[0081] In some embodiments, the measurement database construction unit determines each layer in the pattern of each group based on the grouping result, and for each layer, stores corresponding measurement data based on the order of the designed line width, the designed interval, and the designed pitch, and obtains a measurement database.

[0082] In some embodiments, the pattern grouping unit groups patterns based on the design layout and determines a database number corresponding to each group of patterns.

[0083] In some embodiments, the apparatus includes a measurement data acquisition module 803 that acquires measurement data of new additional patterns, a pattern determination module that determines whether a new additional pattern is the same as the pattern corresponding to each database number, and further includes a measurement database construction unit that stores the measurement data of the new additional pattern in the measurement data record corresponding to the database number when the pattern corresponding to one database number is the same as the new additional pattern.

[0084] In some embodiments, the apparatus includes a database number generation module that generates a new database number for a new additional pattern when the patterns corresponding to all database numbers are different from the new additional pattern, and further includes a measurement database construction unit that stores the measurement data of the new additional pattern in the measurement data record corresponding to the new database number.

[0085] In some embodiments, the apparatus further includes a measurement database construction unit that performs search, comparison, and update on the existing patterns in the measurement database based on the measurement data of the new additional pattern.

[0086] In some embodiments, the pattern grouping unit groups measurement points that are located at different positions within one chip product but have the same pattern into the same group.

[0087] In some embodiments, the pattern grouping unit groups measurement points that have the same pattern among different chip products into the same group.

[0088] Each module in the device shown in FIG. 8 has the function of implementing each step in FIG. 5, can achieve its corresponding technical effect, and for the sake of brevity, the description is omitted here.

[0089] FIG. 9 is a schematic structural diagram of an electronic device according to an embodiment of the present application.

[0090] The electronic device may include a processor 901 and a memory 902 storing computer program instructions.

[0091] Specifically, the above-mentioned processor 901 may include a central processing unit (CPU), or an application specific integrated circuit (ASIC), or may be configured as one or more integrated circuits for implementing the embodiments of the present application.

[0092] The memory 902 includes and acquires a large-capacity memory for data or instructions. For example, without limitation, the memory 902 includes and acquires a hard disk drive (HDD), a flexible disk drive, a flash memory, an optical disk, a magneto-optical disk, a magnetic tape, or a universal serial bus (USB) drive, or a combination of two or more of these. Appropriately, the memory 902 may include a removable (or fixed) medium. Appropriately, the memory 902 may be inside or outside the electronic device. In a specific embodiment, the memory 902 is a non-volatile fixed memory and acquires it.

[0093] In one embodiment, the memory 902 may be a Read Only Memory (ROM). In one embodiment, the ROM may be a mask-programmed ROM, a Programmable ROM (PROM), an Erasable PROM (EPROM), an Electrically Erasable PROM (EEPROM), an Electrically Rewritable ROM (EAROM), or a flash memory, or a combination of two or more of these.

[0094] The processor 901 reads and executes the computer program instructions stored in the memory 902 to implement a measurement database construction method based on the design layout of any of the above embodiments.

[0095] In one example, the electronic device may further include a communication interface 903 and a bus 910. As shown in FIG. 9, the processor 901, the memory 902, and the communication interface 903 are connected by using the bus 910 and communicate with each other.

[0096] The communication interface 903 is mainly configured to implement communication between the modules, devices, units, and / or devices in the embodiments of the present application.

[0097] Bus 910 includes hardware, software, or both, and couples components of an electronic device together. For example, the bus can include, but is not limited to, an Accelerated Graphics Port (AGP) or other graphics bus, an Extended Industry Standard Architecture (EISA) bus, a Front Side Bus (FSB), a Hyper Transport (HT) interconnect, an Industry Standard Architecture (ISA) bus, an InfiniBand interconnect, a Low pin count (LPC) bus, a memory bus, a Micro Channel Architecture (MCA) bus, a Peripheral Component Interconnect (PCI) bus, a PCI-Express (PCI-E) bus, a Serial Advanced Technology Attachment (SATA) bus, a Video Electronics Standards Association Local Bus (VLB) bus, or other suitable bus or a combination of two or more of these. Where appropriate, bus 910 can include one or more buses. Although the embodiments of the present application have been described and illustrated with specific buses, the present application contemplates any suitable bus or interconnect.

[0098] Also, referring to the method for constructing a measurement database based on the design layout in the above embodiment, the embodiments of the present application can be implemented by providing a computer-readable storage medium. A computer program instruction is stored in the computer-readable storage medium, and when the computer program instruction is executed by a processor, the method for constructing a measurement database based on any of the design layouts of the above embodiments is implemented.

[0099] It should be noted that it is necessary to clarify that this application is not limited to the specific configurations and processes described above. For the sake of brevity, detailed descriptions of known methods are omitted here. In the above embodiments, some specific steps were illustrated and described as examples. However, the method process of this application is not limited to the specific steps described and illustrated. After those skilled in the art understand the spirit of this application, various changes, modifications, and additions can be made, or the order between steps can be changed.

[0100] The functional modules shown in the above structural block diagrams may be implemented as hardware, software, firmware, or a combination thereof. When implemented in hardware, for example, it may be an electronic circuit, an application-specific integrated circuit (ASIC), appropriate firmware, a plug-in, a function card, etc. When implemented in software, the elements of this application are programs or code segments for performing necessary tasks. The program or code segment may be stored in a device-readable medium, or may be transmitted via a transmission medium or a communication link by a data signal included in a carrier wave. The "device-readable medium" may include any medium capable of storing or transmitting information. Examples of the device-readable medium include electronic circuits, semiconductor memory devices, ROM, flash memory, erasable ROM (EROM), flexible disks, CD-ROMs, optical disks, hard disks, optical fiber media, radio frequency (RF) links, etc. The code segment can be downloaded via computer networks such as the Internet and intranets.

[0101] It should be noted that the exemplary embodiments referred to in this application describe some methods or systems based on a series of steps or devices. However, this application is not limited to the order of the above steps. That is, the steps may be executed according to the order described in the embodiments, may be different from the order in the embodiments, or multiple steps may be executed simultaneously.

[0102] As described above, each aspect of the present application has been described with reference to the flowcharts and / or block diagrams of the method, apparatus (system), and computer program product according to the embodiments of the present application. Each block in the flowchart and / or block diagram and combinations of blocks in the flowchart and / or block diagram may be implemented by computer program instructions. These computer program instructions may be provided to a processor of a general-purpose computer, a special-purpose computer, or other programmable data processing apparatus, so that the instructions executed by the processor of the computer or other programmable data processing apparatus can generate a machine capable of realizing the functions / operations specified in one or more blocks of the flowchart and / or block diagram. Such a processor may be a general-purpose processor, a special-purpose processor, a special application processor, or a field programmable logic circuit, but is not limited thereto. Also, each block in the block diagram and / or flowchart and combinations of blocks in the block diagram and / or flowchart may be implemented by dedicated hardware that executes the specified function or operation, or may be implemented by a combination of dedicated hardware and computer instructions.

[0103] As described above, these are merely specific embodiments of the present application. Those skilled in the art can clearly understand that, for the sake of convenience and brevity of description, for the specific operation processes of the systems, modules, and units described above, they can refer to the corresponding processes in the embodiments of the above method, and the description is omitted here. It should be clearly understood that the protection scope of the present application is not limited thereto, and those skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in the present application, and all of these modifications or substitutions should be included within the protection scope of the present application.

Claims

1. A method for constructing a measurement database based on a design layout, comprising: selecting an actual pattern to be measured in the design layout; acquiring an SEM image of the actual pattern at the actual position of the silicon wafer; acquiring all measurement data of the SEM image; storing the measurement data to obtain a measurement database. A method for constructing a measurement database based on a design layout, characterized in that it comprises the above steps.

2. The step of acquiring all measurement data of the SEM image comprises: determining a target measurement point based on the coordinate position information of the design layout; generating all measurement boxes within a preset measurement range based on the design layout and preset measurement conditions; generating a measurement recipe file based on the target measurement point and all the measurement boxes; aligning the SEM image with the design layout to obtain an alignment result; measuring the SEM image based on the alignment result and the measurement recipe file to obtain the measurement data. A method for constructing a measurement database based on a design layout according to claim 1, characterized in that it comprises the above steps.

3. The step of storing the measurement data to obtain a measurement database comprises: grouping patterns based on the design layout to obtain a grouping result; storing corresponding measurement data based on the grouping result to obtain a measurement database. A method for constructing a measurement database based on a design layout according to claim 1, characterized in that it comprises the above steps.

4. Storing corresponding measurement data based on the grouping result to obtain a measurement database comprises: storing corresponding measurement data based on the grouping result, design line width, design interval and design pitch to obtain a measurement database, wherein the measurement data includes the design line width, design interval, design pitch and design layout information. A method for constructing a measurement database based on a design layout according to claim 3, characterized in that it comprises the above steps.

5. Storing corresponding measurement data based on the grouping result, design line width, design interval and design pitch to obtain a measurement database comprises: Based on the order of the grouping result, the designed line width, the designed interval, and the designed pitch, storing the corresponding measurement data and obtaining a measurement database, A method for constructing a measurement database based on the design layout according to claim 4, characterized in that.

6. Based on the order of the grouping result, the designed line width, the designed interval, and the designed pitch, storing the corresponding measurement data and obtaining a measurement database means Based on the grouping result, determining each layer in the pattern of each group; For each layer, based on the order of the designed line width, the designed interval, and the designed pitch, storing the corresponding measurement data and obtaining a measurement database, A method for constructing a measurement database based on the design layout according to claim 5, characterized in that.

7. Grouping the patterns based on the design layout and obtaining a grouping result means Grouping the patterns based on the design layout and determining a database number corresponding to the pattern of each group, A method for constructing a measurement database based on the design layout according to claim 3, characterized in that.

8. After storing the measurement data and obtaining a measurement database, the method further includes Obtaining measurement data of a new additional pattern; Determining whether the new additional pattern is the same as the pattern corresponding to each of the database numbers; When the pattern corresponding to one of the database numbers is the same as the new additional pattern, storing the measurement data of the new additional pattern in the measurement data record corresponding to the database number, A method for constructing a measurement database based on the design layout according to claim 7, characterized in that.

9. After determining whether the new additional pattern is the same as the pattern corresponding to each of the database numbers, the method further includes When the patterns corresponding to all the database numbers are all different from the new additional pattern, generating a new database number for the new additional pattern; Storing the measurement data of the new additional pattern in the measurement data record corresponding to the new database number, A method for constructing a measurement database based on the design layout according to claim 8, characterized in that.

10. After obtaining the measurement data of the new additional pattern, the method further includes searching, comparing, and updating the existing patterns in the measurement database based on the measurement data of the new additional pattern. A method for constructing a measurement database based on the design layout according to claim 8, characterized in that.

11. Grouping patterns based on the design layout to obtain a grouping result, which includes dividing measurement points that are located at different positions within one chip product but have the same pattern into the same group. A method for constructing a measurement database based on the design layout according to claim 3, characterized in that.

12. Grouping patterns based on the design layout to obtain a grouping result, which includes dividing measurement points with the same pattern among different chip products into the same group. A method for constructing a measurement database based on the design layout according to claim 3, characterized in that.

13. A pattern selection module for selecting an actual pattern to be measured in the design layout, an SEM image acquisition module for acquiring an SEM image of the actual pattern at the actual position of the silicon wafer, a measurement data acquisition module for acquiring all measurement data of the SEM image, and a measurement database construction module for storing the measurement data to obtain a measurement database. A measurement database construction device based on the design layout, characterized in that.

14. The measurement data acquisition module determines a target measurement point based on the coordinate position information of the design layout, generates all measurement boxes within a preset measurement range based on the design layout and preset measurement conditions, generates a measurement recipe file based on the target measurement point and all the measurement boxes, aligns the SEM image with the design layout to obtain an alignment result, and measures the SEM image based on the alignment result and the measurement recipe file to obtain the measurement data. A measurement database construction device based on the design layout according to claim 13, characterized in that.

15. The measurement database construction module A pattern grouping unit that groups patterns based on the design layout and obtains a grouping result; A measurement database construction unit that stores corresponding measurement data based on the grouping result and obtains a measurement database, and includes: The measurement database construction device based on the design layout according to claim 13, characterized in that.

16. The measurement database construction unit stores corresponding measurement data based on the grouping result, design line width, design interval, and design pitch, and obtains a measurement database. The measurement data includes the design line width, the design interval, the design pitch, and design layout information. The measurement database construction device based on the design layout according to claim 15, characterized in that.

17. The measurement database construction unit stores corresponding measurement data based on the grouping result, the front-back order of the design line width, design interval, and design pitch, and obtains a measurement database. The measurement database construction device based on the design layout according to claim 16, characterized in that.

18. The measurement database construction unit Determines each layer in the pattern of each group based on the grouping result, For each layer, stores corresponding measurement data based on the front-back order of the design line width, design interval, and design pitch, and obtains a measurement database. The measurement database construction device based on the design layout according to claim 17, characterized in that.

19. The pattern grouping unit groups patterns based on the design layout and determines a database number corresponding to the pattern of each group. The measurement database construction device based on the design layout according to claim 15, characterized in that.

20. Furthermore, a measurement data acquisition module that acquires data of a new additional pattern, A pattern determination module that determines whether the new additional pattern is the same as the pattern corresponding to each of the database numbers, Furthermore, when a pattern corresponding to one of the database numbers is the same as the new additional pattern, a measurement database construction unit that stores the measurement data of the new additional pattern in the measurement data record corresponding to the database number, and includes: A measurement database construction apparatus based on the design layout according to claim 19, characterized in that...

21. A database number generation module that generates one new database number for a new additional pattern when all patterns corresponding to all database numbers are different from the new additional pattern, and further includes a measurement database construction unit that stores the measurement data of the new additional pattern in a measurement data record corresponding to the new database number. A measurement database construction apparatus based on the design layout according to claim 20, characterized in that...

22. further includes a measurement database construction unit that performs search, comparison, and update on existing patterns in the measurement database based on the measurement data of the new additional pattern. A measurement database construction apparatus based on the design layout according to claim 20, characterized in that...

23. The pattern grouping unit divides measurement points that are located at different positions within one chip product but have the same pattern into the same group. A measurement database construction apparatus based on the design layout according to claim 15, characterized in that...

24. The pattern grouping unit divides measurement points that have the same pattern among different chip products into the same group. A measurement database construction apparatus based on the design layout according to claim 15, characterized in that...

25. An electronic device, including a processor and a memory storing computer program instructions, wherein when the processor executes the computer program instructions, a method for constructing a measurement database based on the design layout according to any one of claims 1 to 12 is realized. An electronic device, characterized in that...

26. A computer-readable storage medium, storing computer program instructions, and when the computer program instructions are executed by a processor, a method for constructing a measurement database based on the design layout according to any one of claims 1 to 12 is realized. A computer-readable storage medium, characterized in that...

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