Test mechanism for OTA testing of angled DUTs in DUT sockets

Abstract

The present invention relates to a test mechanism for OTA testing of an angled device under test, the test mechanism comprising a carrier structure, the test mechanism comprising a device under test socket coupled to the carrier structure, the device under test socket configured to establish electrical contact with an inner surface of the angled device under test or a connector provided on the inner surface of the angled device under test.

Description

[Technical Field]

[0001] The embodiments of the present invention particularly relate to a test mechanism for OTA (Over The Air) testing using a device under test socket.

[0002] An embodiment of the present invention relates to a socket for OTA testing of an L-shaped antenna of a package module using automatic test equipment. [Background technology]

[0003] Background of the Invention A test setup can be used to test a device under test (e.g., an antenna-in-package) that can receive and / or emit electromagnetic radiation. Typically, the device under test has a flat shape with two opposing surfaces so that the device under test can be mounted in a device under test socket (e.g., an OTA socket for radiated near-field testing of an antenna-in-package device) with one surface facing the device under test socket and the other surface facing away from the device under test socket. For example, the device under test can be oriented so that the surface of the device under test with the antenna faces away from the device under test socket. Summary of the Invention [Problem to be solved by the invention]

[0004] However, the shape of an angled device under test need not be planar. For example, the device under test may have an angular shape, such as an L-shape. Furthermore, an angular-shaped device may be configured to emit and / or receive electromagnetic radiation on at least one outer surface. For example, an angular-shaped device under test may have one or more antenna arrays (or other antennas) on one or two outer surfaces. As a result, an angled device under test may have connectors and / or dies on inner surfaces that are typically less accessible.

[0005] Angle devices under test pose challenges with respect to mating with the socket, electrical contact with the socket, and orientation of the device under test, all of which can affect test efficiency, accuracy, and repeatability.

[0006] Therefore, there is a need for a testing mechanism that improves the trade-off between testing efficiency, accuracy, and reproducibility. [Means for solving the problem]

[0007] One embodiment of the present invention is directed to a test mechanism for OTA testing of an angled (e.g., L-shaped) device under test (e.g., an L-shaped antenna-in-package device under test). The test mechanism includes a carrier structure (e.g., a PCB test fixture or load board), and the test mechanism includes a device under test socket coupled to the carrier structure (e.g., the PCB test fixture or load board) (e.g., directly or using an extender assembly and / or a PCB interposer between the carrier structure and the device under test). The device under test socket is configured to establish electrical contact with an inner surface of the angled (e.g., L-shaped) device under test (e.g., an inner surface of the angled (e.g., L-shaped) device under test opposite a second outer surface of the angled (e.g., L-shaped) device under test) or a connector provided on the inner surface of the angled (e.g., L-shaped) device under test.

[0008] The device under test socket couples the angle device under test to the test mechanism. Additionally, electrical contact allows for the transmission (unidirectional or bidirectional) of at least one of power, one or more control signals, measurement signals, or signals between the test mechanism and the device under test coupled to the device under test socket. Because electrical contact is established with the inner surface of the angle device under test, the outer surface may be oriented away from the device under test socket. This orientation allows for testing the angle device under test by itself (e.g., testing energy consumption during radiation or interaction between antenna arrays in the angle device under test) and for testing the angle device under test with one or more external antenna structures (e.g., using a measurement antenna to wirelessly receive signals transmitted by the angle device under test and / or using a test antenna to transmit signals wirelessly received by the angle device under test). The design of the device under test socket advantageously allows for the provision of one or more antenna arrays (or one or more other antennas, such as one or more single antennas) contained on one or more of the outer surfaces of the device under test for such one or more external antenna structures (e.g., one or more test antenna structures). As a result, one or more external antenna structures (e.g., for testing one or more antennas or antenna arrays of a device under test, or one or more transmit paths of a device under test, or one or more receive paths of a device under test) can be provided such that the angled antenna device is between the device under test socket and the one or more external antenna structures. Further, an outer surface of the angled device under test can be mechanically contacted to hold the device under test coupled to the device under test socket (e.g., by pressing the device under test into the device under test socket).

[0009] According to one embodiment, the device under test socket is configured to position the angled (e.g., L-shaped) device under test so that a first outer surface (e.g., a surface constituting a radiation structure) of the angled (e.g., L-shaped) device under test is spaced apart from a surface (e.g., a main surface) of the carrier structure (e.g., a load board) and so that a surface normal of the first outer surface of the angled (e.g., L-shaped) device under test is parallel to the surface (e.g., a main surface) of the carrier structure (e.g., a load board) within a tolerance of ±15 degrees.

[0010] It is recognized that the design of the device under test socket can support the device under test such that a surface normal of the first outer surface of the device under test is substantially parallel to the surface of the carrier structure. As a result, one or more antennas, or antenna arrays, that may be provided on the first outer surface of the device under test can have a transmission direction (e.g., a main lobe) that is at least substantially parallel to the surface of the carrier structure. As a result, the position of an antenna structure (e.g., a test antenna for testing the device under test) can be selected along the surface of the carrier structure. Such an arrangement of the antenna structure (e.g., of a test antenna) can be mechanically advantageous, as the carrier structure can act as a carrier for the antenna structure. For example, the surface of the carrier structure can be used as a guide to determine the position and / or orientation of the antenna structure.

[0011] Because the first outer surface is spaced apart from the surface of the carrier, interactions (such as short circuits, reflections, and interference) with the carrier surface (eg, the surface of the carrier structure) can be reduced or eliminated.

[0012] According to one embodiment, the device under test socket is configured to position the angled (e.g., L-shaped) device under test so that the second outer surface (e.g., the surface constituting the radiating structure) of the angled (e.g., L-shaped) device under test faces away from the carrier structure and the surface normal of the second outer surface of the angled (e.g., L-shaped) device under test is perpendicular to the surface of the carrier structure (e.g., the surface of the load board) within a tolerance of ±15 degrees.

[0013] Such a device under test socket design allows for efficient testing of a device under test having antenna structures on two outer surfaces. It is recognized that the device under test socket design can support the device under test such that the surface normal of the second outer surface of the device under test is substantially perpendicular to the surface of the carrier structure. As a result, one or more antennas or antenna arrays that may be provided on the second outer surface of the device under test can have a transmission direction (e.g., main lobe) that is at least substantially perpendicular to the surface of the carrier structure. However, it is recognized that it is possible, with reasonable effort, to position an external antenna (e.g., a test antenna) so that it is well aligned with the antenna structure on the second outer surface of the device under test.

[0014] It is further recognized that the design of the device under test socket described above allows a force to be applied to the second outer surface in a direction at least substantially perpendicular to the surface of the carrier structure (e.g., to hold an angled device under test).

[0015] According to one embodiment, a region of the carrier structure (e.g., load board) adjacent (e.g., with a space therebetween) to the first outer surface of the device under test (e.g., a region of the carrier structure (e.g., load board) adjacent to the projection of the outer (outward) surface normal of the first outer surface of the device under test onto the load board) is free from a power plane and / or free from a ground plane. The adjacent region may be provided in a half-space that passes through a device under test socket or device under test having the first outer surface. The adjacent region may be adjacent (e.g., with a space therebetween) to the first outer surface of an angle device under test (e.g., in a region adjacent to the projection of the outer (outward) surface normal of the first outer surface of the angle device under test onto the carrier structure (e.g., load board)).

[0016] It is recognized that power and / or ground planes can adversely affect the reception and / or transmission of electromagnetic radiation (e.g., beamforming) by the device under test. Because the adjacent area is free from power and / or ground planes, the effect on electromagnetic radiation is reduced, and the accuracy of testing the angled device under test (e.g., when the antenna structure is provided on the first outer surface) may be improved.

[0017] According to one embodiment, an area of the carrier structure (e.g., a load board) adjacent (e.g., with a space between) the first outer surface of the angle device under test (e.g., an area of the carrier structure (e.g., a load board) adjacent to the projection of the outer (outward-facing) surface normal of the first outer surface of the angle device under test onto the carrier structure (e.g., load board)) is not metallized.

[0018] It is recognized that metallization of adjacent regions can adversely affect the transmission and / or reception of electromagnetic radiation (e.g., beamforming). The absence of metallization in adjacent regions reduces the effect on electromagnetic radiation, which may improve the accuracy of testing the angle device under test.

[0019] According to one embodiment, an absorber material is provided on the carrier structure (e.g., load board) in an area adjacent (e.g., spaced apart) to a first outer surface of the angled device under test (e.g., an area adjacent to a projection of an outer (outward-facing) surface normal of the first outer surface of the angled device under test onto the carrier structure (e.g., load board)). The absorber material may include a radio frequency absorber material (e.g., a rubberized foam material rubberized with carbon and / or iron).

[0020] The absorber material reduces reflections and / or interference, which results in improved testing accuracy of the angled device under test, for example, when an antenna structure is provided on the first outer surface.

[0021] According to one embodiment, the device under test socket is configured to position the angle device under test so that the spacing between the first outer surface of the angle device under test and the carrier structure (e.g., load board) is at least two wavelengths (e.g., free space wavelengths, or wavelengths in the medium between the first outer surface of the angle device under test and the carrier structure) at the lowest operating frequency of the angle device under test (e.g., the lowest operating frequency of an antenna-in-package (AiP) module that constitutes or is included in the device under test).

[0022] It is recognized that effects on the radiation and / or reception of one or more antenna arrays that may be provided on the first outer surface and that may be caused by the carrier structure (e.g., beamforming, reflections, standing wave formation, and interference) are significantly reduced at such distances.

[0023] According to one embodiment, the device under test socket is mounted to (e.g., provided on) a daughterboard, which is mounted to a carrier structure (e.g., a PCB test fixture or a load board), and there is a gap between the daughterboard and the load board (e.g., the gap between the daughterboard and the load board is provided, for example, using stiffeners, and the electrical connection between the daughterboard and the load board is provided, for example, using electrical connectors (e.g., using array connectors for digital / power signals and optionally for IF RF signals)).

[0024] The daughter board facilitates upgrading of older test setups and changing between different device under test sockets by using different daughter boards. Furthermore, the spacing between the daughter board and the load board establishes a spacing between the angled device under test and the carrier structure (e.g., at least two wavelengths at the lowest operating frequency of the angled device under test). For example, the use of stiffeners can particularly ensure the spacing. The daughter board can also support electrical wiring, auxiliary circuitry, and connectors. For example, the daughter board can support a coaxial connector that is electrically connected to the device under test socket to enable electrical connection to the device under test when mated to the device under test socket.

[0025] According to one embodiment, the test mechanism comprises a first antenna or a first antenna structure (e.g., a single aperture antenna (e.g., dual linearly polarized or circularly polarized)) configured to receive a signal radiated from a first outer surface of the angle device under test and / or configured to emit a signal to be received at the first outer surface of the angle device under test.

[0026] The first antenna or first antenna arrangement allows for establishing an OTA connection with the device under test in the device under test socket. Thus, the first antenna or first antenna structure allows for testing of the device under test. The device under test socket allows for orienting the device under test in a prescribed manner so that the first antenna or first antenna structure is precisely oriented relative to the angled device under test (or so that precise alignment between the first antenna or first antenna structure and the angled device under test is achieved).

[0027] According to one embodiment, the test mechanism comprises a first antenna or first antenna structure (e.g., a single aperture antenna (e.g., dual linearly polarized or circularly polarized)), and the aperture (or opening or aperture) of the first antenna or first antenna structure is spaced apart from the first outer surface of the angled device under test such that (e.g., when at least the second antenna or second antenna structure is placed in an operating position) a surface normal to the first outer surface of the angled device under test extends through the aperture of the first antenna or first antenna structure.

[0028] The first outer surface may have or be configured to emit and / or receive a main lobe in a direction perpendicular to the first outer surface (e.g., by beamforming). By providing a surface normal of the first outer surface passing through the aperture plane of the first antenna or first antenna structure (in other words, by positioning the first antenna so that the surface normal extends through the aperture plane of the first antenna), the reception and / or radiation of the first antenna or first antenna structure may be improved, and good electromagnetic coupling between the first antenna or first antenna structure and the antenna of the device under test may be achieved.

[0029] According to one embodiment, the first antenna or first antenna structure is mounted to have a fixed position relative to the socket of the device under test.

[0030] Such a fixed position allows repeated coupling and testing of multiple angled devices under test, improving test accuracy and repeatability. Furthermore, it should be noted that by using the above mechanism, in some cases the first antenna or first antenna structure may not be in the path of the handler, and as a result, does not need to be removed when the device under test is replaced by the handler.

[0031] According to one embodiment, the first antenna or first antenna structure (or the second antenna or second antenna structure) is mechanically attached to an arm of a handler (e.g., configured to insert a device under test into a device under test socket), and the first antenna or first antenna structure (or the second antenna or second antenna structure) is movable.

[0032] The arm allows the first antenna or first antenna structure (or second antenna or second antenna structure) to be movable, thereby allowing removal of the first antenna or first antenna structure (or second antenna or second antenna structure) or readjustment of the first antenna or first antenna structure (or second antenna or second antenna structure) (e.g., to facilitate coupling of the angle device under test to the device under test socket). When the handler is configured to insert the angle device under test into the device under test socket, the handler can facilitate coupling and positioning of the first antenna or first antenna structure (or second antenna or second antenna structure) during or after coupling of the angle device under test to the device under test socket.

[0033] According to one embodiment, the first antenna or first antenna structure (or second antenna or second antenna structure) is configured to be connected to a signal source and / or a signal receiver via a blind-mating microwave connection (e.g., via a blind-mating waveguide connection) when the handler places the first antenna or first antenna structure (or second antenna or second antenna structure) in an operating position (or, equivalently, when the handler inserts the angled device under test into the test socket or when the handler presses the device under test into the test socket).

[0034] The signal source and / or signal receiver enable the first antenna or first antenna structure (or second antenna or second antenna structure) to emit a signal (e.g., to be received by the antenna or antenna array of the angled device under test) and / or receive a signal (e.g., emitted by the antenna or antenna array of the angled device under test), thus facilitating testing of the angled device under test. The blind-mating microwave connection facilitates coupling (e.g., manual and / or automatic) between the signal source and / or signal receiver and the first antenna or first antenna structure (or between the signal source and / or signal receiver and the second antenna or second antenna structure).

[0035] According to one embodiment, the test mechanism includes a second antenna or second antenna structure (e.g., a single aperture antenna (e.g., dual linearly polarized or circularly polarized)) configured to receive a signal radiated from a second outer surface of the angled device under test and / or emit a signal to be received at a second outer surface of the angled device under test (e.g., when at least the second antenna or second antenna structure is placed in an operating position) (e.g., equivalently, when the handler inserts the angled device under test into the test socket or when the handler presses the device under test into the test socket).

[0036] The second antenna or second antenna structure allows testing of the second exterior surface and / or antenna structure on the device under test. The second antenna or second antenna structure benefits from the orientation of the second exterior surface defined by the device under test socket. The first and second antennas or first and second antenna structures allow testing of the device under test using signals emitted and / or received by the first and second exterior surfaces (e.g., simultaneously or sequentially) without re-attaching the device under test to an angle in a different direction (e.g., or to a different device under test socket).

[0037] According to one embodiment, the test mechanism includes a second antenna or second antenna structure (e.g., a (e.g., dual linearly polarized or circularly polarized) single aperture antenna), and the aperture of the second antenna or second antenna structure is spaced apart from the second outer surface of the angled device under test such that (e.g., when at least the second antenna or second antenna structure is placed in an operating position) (e.g., equivalently, when the handler inserts the angled device under test into the test socket or when the handler presses the device under test into the test socket) a surface normal to the second outer surface of the angled device under test extends through the aperture of the second antenna or second antenna structure.

[0038] The second outer surface may have or be configured to emit and / or receive a main lobe in a direction perpendicular to the second outer surface (e.g., by beamforming). By providing a surface normal of the second outer surface passing through the aperture plane of the second antenna or second antenna structure (in other words, by positioning the second antenna so that the surface normal extends through the aperture plane of the second antenna), the reception and / or radiation of the second antenna or second antenna structure may be improved, and good electromagnetic coupling between the second antenna or second antenna structure and the antenna of the device under test may be achieved.

[0039] According to one embodiment, the second antenna or second antenna structure is mechanically attached to an arm of a handler (e.g., configured to insert an angled device under test into a device under test socket) such that the second antenna or second antenna structure is movable. The first and second antennas or first and second antenna structures may, for example, be attached to the same / common arm or each may be attached to a separate arm.

[0040] The arm allows the second antenna or second antenna structure to be movable, allowing removal of the second antenna or second antenna structure or readjustment of the second antenna or second antenna structure (e.g., to facilitate insertion / coupling of the angled device under test to the device under test socket). When the handler is configured to insert the angled device under test into the device under test socket, the handler facilitates coupling and positioning of the first antenna or first antenna structure while coupling the angled device under test to the device under test socket. In the case of a common arm, the first and second antenna structures may be provided in a predetermined orientation to facilitate orientation of the first and second antenna structures relative to the first and second exterior surfaces. In the case of separate arms, the orientation of the first and second antenna structures can be customized.

[0041] According to one embodiment, the second antenna or second antenna structure is part of a pusher for pushing the angled device under test into the device under test socket, or the second antenna or second antenna structure is configured to be movable together with a pusher for pushing the angled device under test into the device under test socket (where, for example, the pusher is arranged such that when the device under test is inserted into the device under test socket, the pusher or a portion of the pusher is between the second antenna or second antenna structure and the second outer surface of the angled device under test). (And / or, for example, the pusher is arranged such that when the device under test is inserted into the device under test socket, the pusher or a portion of the pusher is between the first antenna and the first outer surface of the angled device under test.)

[0042] The second antenna or second antenna structure is movable with the pusher, and thus can be moved (e.g., to facilitate coupling of the angled device under test to the device under test socket) or realigned (e.g., by adapting its orientation). Because the pusher is configured to push the angled device under test into the device under test socket, the pusher facilitates coupling and positioning of the second antenna or second antenna structure when coupling the angled device under test to the device under test socket.

[0043] According to one embodiment, the second antenna or second antenna structure is configured to be connected to the signal source and / or the signal receiver via a blind-mate microwave connection (e.g., via a blind-mate waveguide connection) when the handler places the second antenna or second antenna structure in an operating position (e.g., equivalently, when the handler inserts the angled device under test into the test socket or when the handler presses the device under test into the test socket).

[0044] The connection with the signal source and / or the connection with the signal receiver enables the second antenna or second antenna structure to emit signals (e.g., to be received by the antenna or antenna array of the angled device under test) and / or receive signals (e.g., emitted by the antenna or antenna array of the angled device under test), thus facilitating testing of the angled device under test. The blind-mating microwave connection can facilitate coupling (e.g., manual and / or automatic) between the signal source and / or signal receiver and the second antenna or second antenna structure.

[0045] According to one embodiment, the device under test socket has an angle recess or angle removal portion configured to support and / or align the angle device under test. The angle recess or angle removal portion may have side walls on one or both of its ends.

[0046] The angle recess or angle removal portion has two (or more) (e.g., angled) support surfaces that can abut against the first and second inner surfaces, respectively. Such support surfaces can (at least partially) achieve a predetermined orientation and / or position of the angled device under test. The predetermined orientation and / or position of the angled device under test can facilitate establishment of electrical connections and improve test repeatability and accuracy. Optionally, one or more side walls can further limit lateral movement of the angled device under test.

[0047] According to one embodiment, the device under test socket is configured such that a second inner surface of the angled device under test opposite the second outer surface of the angled device under test is at least 10 mm, or at least 30 mm, or at least 45 mm from the carrier structure (e.g., load board), or at least two wavelengths, or at least three wavelengths, or at least four wavelengths (e.g., free space wavelengths or the first wavelength of the angled device under test) at a lowest operating frequency of the angled device under test (e.g., a lowest operating frequency of an antenna-in-package (AiP) module comprising or included in the device under test). Preferably, the end of the first outer surface is spaced from the load board by at least 10 mm, or at least 20 mm, e.g., at the lowest operating frequency of the device under test (e.g., the lowest operating frequency of an antenna-in-package (AiP) module constituting or included in the device under test), or at least two wavelengths, or at least three wavelengths, or at least four wavelengths (e.g., free space wavelengths or wavelengths in the medium between the first outer surface of the device under test and the carrier structure).

[0048] It is recognized that such spacing significantly reduces the effects (e.g., reflections, beamforming, and interference) of the carrier structure on the characteristics of one or more antenna structures of the device under test, or generally speaking, on circuitry on the second inner and / or second outer surface (e.g., antenna structures, circuitry for signal transmission, or silicon dies for converting signals such as converting intermediate frequency signals to millimeter wave signals and vice versa).

[0049] According to one embodiment, the device under test socket has a socket height of at least 10 mm, at least 30 mm, or at least 45 mm, and a second inner surface of the angled device under test opposite the second outer surface of the angled device under test is at least 10 mm, or at least 10 mm, or at least 30 mm, or at least 45 mm, from the carrier structure (e.g., load board), or at least 2 wavelengths, or at least 3 wavelengths, or at least 45 mm, at a lowest operating frequency of the angled device under test (e.g., a lowest operating frequency of an antenna-in-package (AiP) module comprising or included in the device under test). The angle is preferably arranged so that the end of the first outer surface is at least 10 mm, or at least 20 mm, from the load board at the lowest operating frequency of the device under test (e.g., the lowest operating frequency of an antenna-in-package (AiP) module constituting or included in the device under test), or at least two wavelengths, or at least three wavelengths, or at least four wavelengths (e.g., the free space wavelength or the wavelength in the medium between the first outer surface of the device under test and the carrier structure).

[0050] It is recognized that such spacing significantly reduces the effects (e.g., reflections, beamforming, and interference) of the carrier structure on the characteristics of one or more antenna structures of the device under test, or generally speaking, on circuitry on the second inner and / or second outer surface (e.g., antenna structures, circuitry for signal transmission, or silicon dies for converting signals such as converting intermediate frequency signals to millimeter wave signals and vice versa).

[0051] According to one embodiment, the device under test socket includes one or more coaxial pogo pins (e.g., extending from a bottom surface of the device under test socket in contact with the load board to a top surface of the device under test socket in contact with a second inner surface of the angle device under test) to establish an electrical connection between the carrier structure (e.g., load board) and the angle device under test (e.g., a first end of the coaxial pogo pin may contact a pad on the load board, and a second end of the coaxial pogo pin may contact a pad on the angle device under test).

[0052] The pogo pins are generally decompressible, allowing the device under test socket to establish reliable electrical contact with the device under test when the device under test is coupled to the device under test socket (e.g., when pushed into the device under test socket by a handler / pusher). For example, coaxial springs allow for high frequency interconnections to the device under test socket.

[0053] According to one embodiment, an extender structure (eg, including an extender and a PCB interposer) is provided between a carrier structure (eg, a load board or PCB test fixture) and a device under test socket.

[0054] Extenders allow for the separation of establishing electrical connections to the device under test from providing space between the carrier structure and the device under test. This allows, for example, the same device under test socket to be used in combination with multiple extenders of different heights. The structure (or circuitry) for establishing electrical contact with the device under test can be largely or entirely implemented within the device under test socket, simplifying the design of the extender. Optional PCB interposers allow, for example, rerouting between different shapes of electrical contacts between the device under test socket and the extender.

[0055] According to one embodiment, the extender structure includes an extender assembly, which includes one or more coaxial pogo pins (which may, for example, extend from a bottom surface of the extender assembly in contact with the carrier structure (e.g., load board) to a top surface of the extender assembly in contact with a PCB interposer or a device under test socket) to establish an electrical connection between the carrier structure (e.g., load board) and the device under test socket (where, for example, a first end of the coaxial pogo pin may contact a pad on the load board, and, for example, a second end of the coaxial pogo pin may contact a pad on a PCB interposer between the extender assembly and the device under test socket).

[0056] The extender assembly provides spacing between the device under test socket and the carrier structure, and the coaxial pogo pins provide electrical contact that can cover the distance across the spacing provided by the extender. The coaxial pogo pins further provide an electrical interface that is compatible with device under test sockets configured to receive devices under test that are pressed into them, improving compatibility with other / older carrier structures.

[0057] According to one embodiment, the test mechanism includes at least two device under test sockets configured to support respective angle devices under test (e.g., two equal devices under test), and the at least two device under test sockets are arranged to position the respective angle devices under test (e.g., back to back) so that the respective first outer surfaces of the respective angle devices under test are aligned in opposite (avoidance) directions.

[0058] A testing mechanism including at least two device under test sockets allows multiple devices under test to be tested at once (e.g., simultaneously or sequentially, e.g., within one cycle in which a handler places a device under test into a device under test socket). Furthermore, by aligning the respective first outer surfaces of the respective angled devices under test in opposite (avoidant) directions, interference between signals emitted by and / or received at the respective first outer surfaces is reduced.

[0059] According to one embodiment, the test mechanism comprises at least two rows (e.g., parallel rows) of device under test sockets, the device under test sockets configured to support respective angled devices under test, and the at least two rows of device under test sockets are arranged so that the respective first outer surfaces of the respective angled devices under test are aligned in opposite (avoiding) directions (e.g., back to back, e.g., so that the sides of the device under test sockets on which the first outer surfaces of the devices under test are located are avoided relative to each other).

[0060] Such an arrangement improves the compromise between densely arranging multiple devices under test and reducing interference between signals emitted by and / or received at each first external surface.

[0061] According to one embodiment, a test setup for OTA testing of an angled (e.g., L-shaped) device under test (e.g., an L-shaped antenna-in-package device under test) includes a carrier structure (e.g., a PCB test fixture or load board). The test setup also includes a device under test socket coupled to the carrier structure (e.g., PCB test fixture or load board) (e.g., directly or with an extender assembly and / or PCB interposer between the carrier structure and the device under test socket). The device under test socket is configured to establish electrical contact with an inner surface of the angled (e.g., L-shaped) device under test (e.g., an inner surface of the angled (e.g., L-shaped) device under test opposite a second outer surface of the angled (e.g., L-shaped) device under test) or a connector provided on the inner surface of the angled (e.g., L-shaped) device under test. The device under test socket is configured to position the angled (e.g., L-shaped) device under test so that a first outer surface (e.g., a surface having a radiating structure) of the angled (e.g., L-shaped) device under test is spaced apart from the surface (e.g., main surface) of the load board and so that a surface normal of the first outer surface of the angled (e.g., L-shaped) device under test is parallel to the surface (e.g., main surface) of the load board within a tolerance of ±15 degrees, and so that a second outer surface (e.g., a surface having a radiating structure) of the angled (e.g., L-shaped) device under test faces away from the load board and so that a surface normal of the second outer surface of the angled (e.g., L-shaped) device under test is perpendicular to the surface of the load board within a tolerance of ±15 degrees.

[0062] It has been recognized that such an arrangement of the first and second outer surfaces provides an improved compromise between accessibility of the antenna structure for testing and reduced impact on the surface of the carrier structure. [Brief explanation of the drawings]

[0063] The drawings are not necessarily to scale, emphasis instead generally being placed upon illustrating the principles of the invention. In the following description, various embodiments of the invention are described with reference to the following drawings: [Figure 1] 1 shows a schematic cross section of a test setup for OTA testing of an angle device under test. [Figure 2A] 1 shows a schematic cross section of a first example of an angle device under test. [Figure 2B] 10 shows a schematic cross section of a second example of an angle device under test. [Figure 3] 1 shows a perspective view of an angle device under test. [Figure 4] 4 shows simulated results of the far field emitted by antenna elements of a first antenna array on a first external surface of the device under test depicted in FIG. 3. [Figure 5] 1 shows a perspective view of an angle device under test. [Figure 6] 6 shows simulation results of the far field emitted by the antenna elements of the first antenna array on the first exterior surface of the device under test depicted in FIG. 5. [Figure 7] 1 shows a schematic cross section of another example of a test setup with a device under test. [Figure 8] 1 shows a perspective view of an example of a socket for a device under test. [Figure 9] 1 shows a schematic cross section of another example of a test setup with a device under test. [Figure 10] 1 shows a schematic cross section of another example of a test setup with a device under test. [Figure 11] 1 shows a schematic top view of another example of a test setup with multiple devices under test. [Figure 12] 1 shows a schematic top view of another example of a test setup with multiple devices under test. [Figure 13A] 1 shows a perspective view of an example of a device under test. [Figure 13B] 13B shows a perspective view of the device under test depicted in FIG. 13A. DETAILED DESCRIPTION OF THE INVENTION

[0064] Detailed Description of the Embodiments In the following description, like or equivalent elements, or elements having like or equivalent functions, are designated with like or equivalent reference numerals even if they appear in different figures.

[0065] In the following description, numerous details are set forth to provide a more thorough explanation of embodiments of the present invention. However, it will be apparent to those skilled in the art that embodiments of the present invention may be practiced without these specific details. In other instances, well-known structures and devices are shown in block diagram form, rather than in detail, in order to avoid obscuring embodiments of the present invention. Furthermore, features of different embodiments described below in this specification can be combined with each other in any way, unless otherwise specified.

[0066] 1 shows a schematic cross-section of a test setup 100 for OTA testing of an angled device under test 140. The test setup 100 includes a carrier structure 110 and a device under test socket 130 coupled to the carrier structure 110. The device under test socket 130 is configured to establish electrical contact with an inner surface 142 of the device under test 140 or a connector (not shown in FIG. 1) provided on the inner surface 142 of the device under test 140.

[0067] The carrier structure 110 may be a printed circuit board (PCB) test fixture or a load board. The carrier structure 110 may, for example, be or include at least one region having a flat surface. The device under test socket 130 may be provided on the carrier structure 110 (e.g., on the flat surface) or may be coupled to the carrier structure 110 via one or more intermediate devices or structures. An area of the carrier structure 110 (e.g., a load board) adjacent to (e.g., with a space between) the first outer surface 144a of the angled device under test 140 is free from a power plane and / or free from a ground plane. The area may be in a half space separated by a plane (e.g., defined by the first outer surface 144 a or the first inner surface 142 a when the device under test is coupled to the device under test socket 130) passing through the device under test socket 130 or the device under test 140, e.g., in the space 111 to the left of the first outer surface 144 a or the first inner surface 142 a in FIG. 1 . This area may be an area of the carrier structure 110 (e.g., a load board) adjacent to the projection of the outer (outward) surface normal 143 of the first outer surface 144 a of the angle device under test onto the load board. This adjacent area may be adjacent to the first outer surface of the angle device under test 140 (e.g., at a distance 114) (e.g., in an area adjacent to the projection of the outer (outward) surface normal 143 of the first outer surface 144 a of the angle device under test 140 onto the carrier structure 110 (e.g., a load board)).

[0068] 1 can be used, for example, to test the angle device under test 140 by itself (e.g., without an antenna structure to detect electromagnetic radiation emitted by the angle device under test), or to test the angle device under test 140 in combination with one or more additional antennas. For example, the test setup 100 may be used to test the power consumption of the angle device under test 140 or the interference between the antennas of the angle device under test 140. Alternatively, the test setup 100 may be configured to wirelessly test one or more antenna structures of the angle device under test.

[0069] Because the device under test socket 130 is configured to contact the inner surface 142 of the angled device under test, the outer surface of the angled device under test 140 is completely (or at least mostly) spaced apart from the device under test socket 130 and the carrier 110. Thus, the effect of the device under test socket 130 and / or carrier structure 110 on (and its effect on testing of) radiation emitted (and / or received) by the outer surface of the angled device under test 140 is reduced.

[0070] The angled device under test 140 may be (or may have) an antenna-in-package (AiP) device. The angled device under test 140 may have an L-shape (as shown abstractly in FIG. 1 ), for example, the angled device under test may be a device having a first plate 141a connected to a second plate 141b. The plates 141a, 141b are angled with respect to each other by at least substantially 90 degrees (e.g., within a tolerance of ±15 degrees). The angled device under test 140 may have a first outer surface 144a (e.g., of the first plate 141a) and a second outer surface 144b (e.g., of the second plate 141b). The first and second outer surfaces 144a, b are angled with respect to each other by at least substantially 270 degrees (e.g., within a tolerance of ±15 degrees). The inner surfaces 142 of the angled device under test 140 may include a first inner surface 142a (e.g., of the first plate 141a) and a second inner surface 142b (e.g., of the second plate 141b). The first and second inner surfaces 142a,b are angled at least substantially 90 degrees relative to one another (e.g., within a tolerance of ±15 degrees). The first inner surface 142a and the first outer surface 144a may be parallel to one another. The second inner surface 142b and the second outer surface 144b may be parallel to one another.

[0071] The device under test socket 130 may be configured to position the angled device under test 140 such that the second outer surface 144b of the angled device under test 140 faces away from the carrier structure 110. The device under test socket 130 may be configured to position the angled device under test 140 such that the surface normal of the second outer surface 144b of the angled device under test is perpendicular to the surface 112 of the carrier structure 110 within a tolerance of ±15 degrees. The second outer surface 144b may be provided parallel to the surface 112 of the carrier structure 110.

[0072] FIG. 2A shows a schematic cross section of a first example of an angle device under test 240 that can be substituted for the angle device under test 140 .

[0073] The angled device under test 240 has a first plate 241a and a second plate 241b angled at 90 degrees relative to each other (e.g., within a tolerance of ±15 degrees). The first plate 241a includes a first outer surface 244a and a first inner surface 242a, and the second plate 241b includes a second outer surface 244b and a second inner surface 242b.

[0074] 2A, the first exterior surface 244a has a first antenna array 246a including four antenna elements. However, the first exterior surface 244a may (additionally or alternatively) have any other form of antenna (e.g., a single antenna and / or a circularly polarized antenna) and any other number of antenna elements or antenna arrays. Alternatively, the second exterior surface 244b may have the first antenna array 246a. The first antenna array 246a may be configured to receive and / or transmit electromagnetic radiation.

[0075] The angle device under test 240 may further include a connector 248 (e.g., an array connector). In the example shown in FIG. 2A , the (array) connector 248 is provided on the second inner surface 242b. Alternatively, the (array) connector 248 may be provided on the first inner surface 242a or on the first and second inner surfaces 242a,b (e.g., in the case of multiple (array) connectors 248). The (array) connector 248 is electrically connected to at least one (e.g., all) of the antenna elements of the first antenna array 246a. Thus, an electrical signal applied at the (array) connector 248 can cause the first antenna array 246a to emit electromagnetic radiation. Alternatively or additionally, electromagnetic radiation received by the first antenna array 246a may result in an electrical signal at the (array) connector 248. The (array) connector 248 may be or include one or more solder balls. The (array) connector 248 may be configured to connect the angled device under test 140 (e.g., an antenna in a package module) to the system (e.g., a mobile phone or device under test socket 130) and may allow transmission of signals such as power signals, digital signals, radio frequency (RF) signals, or intermediate frequency (IF) signals.

[0076] The first antenna array 246a may be directly electrically connected to the (array) connector 248 or may be indirectly coupled to the (array) connector 248 (e.g., via additional electrical components therebetween). For example, the additional electrical components may include at least one of an amplifier, a filter, a switch, a resistor, a capacitor, and an integrated circuit. In the example shown in FIG. 2A , the additional electrical components include an antenna circuit 249 (e.g., a silicon die). The antenna circuit 249 may be configured, for example, to convert an intermediate frequency (IF) signal to a millimeter-wave signal (e.g., in a 5G bandwidth, such as the range of 24 GHz to 53 GHz) and / or vice versa. Alternatively or additionally, the antenna circuit 249 may be configured to (at least partially) control beamforming of the first antenna array 246a.

[0077] FIG. 2B shows a schematic cross-section of a second example of an angle device under test 240 a that can be used in place of the angle device under test 140 .

[0078] 2A , where like elements are designated by like reference numerals, but further includes a second antenna array 246b on the second exterior surface 244b. The second antenna array 246b may have similar features to the first antenna array 246a. The second antenna array 246b may also be electrically connected to at least one of the (array) connector 248 and the antenna circuit 249. Alternatively, the second antenna array 246b may be electrically connected to a separate (array) connector and / or a separate antenna circuit.

[0079] The device under test socket 130 may be configured to position the angled device under test 140 (e.g., the angled device under test 240 or the angled device under test 240a) such that the first outer surface 144a (e.g., the first outer surface 244a) of the device under test 140 is spaced apart from the surface 112 of the carrier structure 110. FIG. 1 exemplarily illustrates a first distance 114 (in the form of a dashed line) indicating the space (or gap) between the first outer surface 144a and the surface 112 of the carrier structure 110. The device under test socket 130 may be configured to position the angled device under test 140 such that the surface normal of the first outer surface 144a of the angled device under test 140 is parallel to the surface 112 of the carrier structure 110 (as exemplarily depicted in FIG. 1) within a tolerance of, for example, ±15 degrees. The first outer surface 144a may be disposed perpendicular to the surface 112 of the carrier structure 110.

[0080] The device under test socket 130 may be configured to position the angled device under test 140 such that the spacing (e.g., first distance 114) between the first outer surface 144a of the device under test 140 and the carrier structure 110 (e.g., its surface 112) is at least two wavelengths at the lowest operating frequency of the angled device under test. The angled device under test 140 may operate in a frequency band of the 5G standard, for example, within the range of 24 GHz to 53 GHz (e.g., frequency range 2). In such a case, the lowest operating frequency may be 24 GHz at a wavelength of 12.5 mm. The space between the first outer surface 144a and the surface 112 of the carrier structure 110 may be, for example, 25 mm or more (i.e., twice 12.5 mm).

[0081] This spacing may be defined by different surfaces of the angled device under test 140. The device under test socket 130 is arranged such that the second inner surface 142b of the angled device under test 140 (e.g., second inner surface 242b of the angled device under test 240), which is opposite the second outer surface 114b of the angled device under test 140, is spaced from the carrier structure 110 (e.g., surface 112) by at least 10 mm, or at least 30 mm, or at least 45 mm, or at least 2 wavelengths, or at least 3 wavelengths, or at least 4 wavelengths at the lowest operating frequency of the angled device under test.

[0082] The device under test socket 130 has a socket height 115 (shown by a dashed imaginary line) of at least 10 mm, or at least 30 mm, or at least 45 mm such that the second inner surface 142 b of the angled device under test 140 opposite the second outer surface 144 b of the angled device under test 140 is spaced from the carrier structure by at least 10 mm, or at least 30 mm, or at least 45 mm, or at least two wavelengths, or at least three wavelengths, or at least four wavelengths at the lowest operating frequency of the angled device under test.

[0083] FIG. 3 shows a perspective view of an angle device under test 340 that can be used in place of the angle device under test 140 .

[0084] The angle device under test 340 has a first outer surface 344a with a first antenna array including four antenna elements and a second outer surface 344b with a second antenna array including four antenna elements. At least one antenna element may include at least one parasitic patch. In the example shown in FIG. 3, each antenna element includes four parasitic patches surrounding a central antenna structure. The first outer surface 344a includes two central antenna elements 345a,b. There are no metallized surfaces in the vicinity of the angle device under test 340.

[0085] 4 shows the results of a simulation of the far field emitted by an antenna element (e.g., antenna element 345a or 345b) of the first antenna array on the first outer surface 344a of the device under test 340 depicted in FIG. 3. Note that for simplicity, the simulation of the far field depicted in FIG. 3 is emitted from the center of the first antenna array on the first outer surface 344a (e.g., between the central antenna elements 345a, b). However, the simulation of the far field may have at least substantially the same shape if emitted from the center of one of the central antenna elements 345a, b. The far field exhibits a significant lobe oriented perpendicular to the antenna elements 345a, 345b on the first outer surface 344a (although radiation in the backward direction may be reduced or suppressed if the device under test 340 is applied in a system (e.g., a system providing a metalized backplane)).

[0086] 5 is a perspective view of an angled device under test 540 that may be used in place of the angled device under test 140. The angled device under test 540 has a first outer surface 544a with a first antenna array including four antenna elements and a second outer surface 544b with a second antenna array including four antenna elements. The first antenna array on the first outer surface 544a includes two central antenna elements 545a, b. A metal (e.g., copper) surface 551 is located 2 mm from the first outer surface 544a.

[0087] FIG. 6 shows the results of a simulation of the far field (preferably taking into account the metal surface 551) emitted by an antenna element (e.g., antenna element 545a or 545b) of the first external antenna array 544a of the angled device under test 530 depicted in FIG. 5. Compared to the results depicted in FIG. 4, the far field shows less pronounced radiation oriented perpendicular to the two antenna elements of the first external antenna array 544a. Instead, the far-field intensity is more evenly distributed around the angled device under test 540, with separate main lobes in two directions different from the surface normal of the first external surface 544a. This result indicates that nearby metallized surfaces can affect the far field emitted by the angled device under test 540, thus reducing the accuracy and / or repeatability of the test. For example, metallized surfaces can reduce the spatial selectivity of the beamforming antenna array and / or change the direction of the main lobe(s).

[0088] Therefore, by providing a spacing such as that described above (for example, at least two wavelengths, or at least 10 mm, or at least 30 mm, or at least 45 mm), the accuracy and / or repeatability of the test can be improved.

[0089] FIG. 13A is a perspective view of an example of an angle device under test 1340 that can be used in place of angle device under test 140. As shown in FIG.

[0090] The angle device under test 1340 includes a first inner surface 1342a and a second inner surface 1342b. In the example shown in FIG. 13A , the angle device under test has a first plate 1341a including the first inner surface 1342a and a second plate 1341b including the second inner surface 1342b. The first and second plates 1341a, b are mechanically (and optionally electrically) connected by a flexible conductive structure, such as three flexible printed circuits 1347a, b, c. The first and second plates 1341a, b may be movable (e.g., bendable) relative to one another, for example, to facilitate manufacturing or assembly in a system. However, while the mobility of the plates may facilitate coupling of the angle device under test to a socket in some cases, it may complicate testing in other cases. Alternatively, the first and second plates 1341a, b may be fixedly mounted relative to one another.

[0091] The angled device under test 1340 has a connector 1348 (e.g., an array connector) and a silicon die 1349 (or other antenna circuit) on the second inner surface 1342b. The silicon die 1349 may be electrically contacted indirectly via the array connector 1348 or directly via electrical contacts on the silicon die 1349 itself (not shown in FIG. 13A ). The device under test sockets described herein are configured to establish electrical contact with an inner surface of the angled device under test 1340, such as the (array) connector 1348 on the second inner surface 1342b.

[0092] FIG. 13B shows another perspective view of the angle device under test 1340 depicted in FIG. 13A. The angle device under test 1340 includes a first outer surface 1344a (on the first plate 1341a) and a second outer surface 1344b (on the second plate 1341b). The first and second outer surfaces 1344a,b are configured to emit and / or receive electromagnetic radiation (e.g., by forming respective antenna structures thereon). To this end, antenna elements (e.g., antenna arrays) may be at least partially disposed on the first and / or second surfaces 1344a,b or at least partially disposed within the first and / or second plates 1341a,b. In the example shown in FIG. 13, the first and second outer surfaces 1344a,b are configured to emit and / or receive electromagnetic radiation. Alternatively, only the first or second outer surfaces 1344a,b may be configured to emit and / or receive electromagnetic radiation.

[0093] 7 shows a schematic cross-section of another example of a test mechanism 700 including an angled device under test 740. The angled device under test 740 includes a first inner surface 742a, a second inner surface 742b, a first outer surface 744a, and a second outer surface 744b. The test mechanism includes a carrier structure 710 (e.g., a load bird). The angled device under test 740 may be any of the angled devices under test described herein. The test mechanism 700 includes a device under test socket 730, which may be any of the device under test sockets described herein.

[0094] The test mechanism 700 may include an extender structure 732 disposed between the carrier structure 710 (e.g., a load board or PCB test fixture) and the device under test socket 730. The extender structure 732 includes an extender 733 and a PCB interposer 734. The extender forms a structure that enables the device under test socket 730 to be disposed higher relative to (e.g., spaced apart from) the carrier structure 710. The extender 733 may be configured to receive the device under test socket 730 directly or indirectly, for example, via the PCB interposer 734 and / or other elements. The PCB interposer is configured to form an adapter between the extender 733 and the device under test socket 730 (e.g., structurally and / or in terms of the location of electrical connections). For example, the PCB interposer 734 may enable rerouting of electrical contacts between the device under test socket 730 and the extender 733 with different geometries, thereby increasing compatibility therebetween. The PCB interposer 734 may, for example, (optionally) include one or more decoupling capacitors.

[0095] 7 , the extender structure 732 includes an extender assembly 735. The extender assembly has one or more coaxial pogo pins 735 for establishing an electrical connection between the carrier structure (e.g., a load board) and the device under test (e.g., a first end of the coaxial pogo pin may contact a pad on the load board, and a second end of the coaxial pogo pin may contact a pad on a PCB interposer between the extender assembly and the device under test socket). The coaxial pogo pins may extend from a bottom surface of the extender assembly 735 that contacts the carrier structure 710 (e.g., a load board) (as exemplarily depicted in FIG. 7 ) to a top surface of the extender assembly 735 that contacts the PCB interposer 734 or the device under test socket 730. In the example shown in FIG. 7 , the extender structure 732 has four coaxial pogo pins, although other numbers of coaxial pogo pins may be provided. At least one of the coaxial pogo pins may be depressible by the PCB interposer 734 and / or the device under test socket 730. The extender assembly 735 may have a height (e.g., in a direction perpendicular to the surface of the carrier structure 710) that is greater than the device under test socket 730.

[0096] Below we explain how the performance of the test setup can be improved by designing different spatial regions. For example, the so-called "adjacent region" can be designed to be free from power or ground planes. Alternatively, or in addition, the so-called "first designated region" can be designed to be completely free from metallization.

[0097] An adjacent region 716 of the carrier structure 710 (e.g., load board) adjacent to (e.g., spaced apart from) the first outer surface 744a of the angle device under test 740 (e.g., an area of the carrier structure 710 (e.g., load board) adjacent to the projection of the outer (outward-facing) surface normal of the first outer surface 744a of the angle device under test 740 onto the carrier structure 710 or load board) is free from a power plane and / or free from a ground plane. The adjacent region may be provided in a half-space through the device under test socket 730, including the first outer surface 734a. The adjacent region may be adjacent to (e.g., spaced apart from) the first outer surface 744a of the angle device under test 740 (e.g., in an area adjacent to the projection of the outer (outward-facing) surface normal of the first outer surface 744a of the angle device under test 740 onto the carrier structure 710 (e.g., load board)). 7, the adjacent region 716 is a rectangular region that is tangent to the surface of the extender 733 facing the first inner surface 742a. However, the adjacent region may have other shapes (e.g., a triangle, a trapezoid, a polygon, or an ellipse). Furthermore, the adjacent region may be spaced apart from the extender 733 (e.g., offset to the left in FIG. 7) or may at least partially surround the extender 733 (e.g., offset to the right in FIG. 7).

[0098] A first designated area 718 of the carrier structure 710 (e.g., load board) adjacent to (e.g., spaced apart from) the first outer surface 742a of the angle device under test 740 is free of metallization. The first designated area 718 of the carrier structure 710 (e.g., load board) may be adjacent to a projection of the outer (outward-facing) surface normal of the first outer surface 744a of the angle device under test 740 onto the carrier structure 710 (e.g., load board). The first designated area 718 may be coincident with, intersect with, or be compromised by the adjacent area 716.

[0099] The test mechanism 700 may include an absorber material 717 provided on the carrier structure 710 (e.g., a load board) in a second designated area (e.g., a second designated area adjacent to a projection of an outer (outward-facing) surface normal of the first outer surface of the angled device under test 740 onto the carrier structure (e.g., a load board)) adjacent to (e.g., spaced apart from) the first outer surface 744a of the angled device under test 740. The absorber material may include a radio-frequency absorber material (e.g., a rubberized foam material impregnated with carbon and / or iron). The second designated area may be identical to, intersect with, or be a compromise between the adjacent area 716 (and / or the first designated area 718). However, the second designated area may preferably be adjacent to the so-called "adjacent area 716" of the carrier structure 710. In the example shown in FIG. 7, the absorber material 717 is provided higher (e.g., mounted on top of the carrier structure 710) compared to the surrounding area of the carrier structure 710. Alternatively, the absorber material 717 may be at least substantially flush with the surrounding area of the carrier structure 710 or may be recessed therein (eg, embedded in an opening in the carrier structure).

[0100] The device under test socket 730 is configured to establish electrical contact with a connector (e.g., an array connector) 748 of the device under test 740. Alternatively, the device under test socket 730 may be configured to make electrical contact with at least one of the first and second inner surfaces 742a,b.

[0101] 7 includes a first antenna or antenna structure 750 and a second antenna or antenna structure 752. Alternatively, the test setup 700 may include only the first antenna or antenna structure 750 or only the second antenna or antenna structure 752 (i.e., not a combination of the first and second antenna or antenna structures 750, 752).

[0102] The first antenna or first antenna structure 750 (e.g., a single aperture antenna (e.g., dual linearly or circularly polarized)) is configured to receive signals radiated from the first outer surface 744a of the angle device under test 740 and / or to emit signals to be received at the first outer surface 744a of the angle device under test 740. For this purpose, the first antenna or first antenna structure 750 is positioned away from the first outer surface 744a of the angle device under test 740, for example, such that the surface normal to the first outer surface 744a of the angle device under test 740 extends through the aperture plane of the first antenna or first antenna structure 750. The first antenna or first antenna structure 750 may be positionable in an operating position. A surface normal of the first outer surface 744a of the angle device under test 740 (which may, for example, be coaxial with a main lobe (e.g., due to beamforming) of an antenna structure on the first outer surface and / or may extend through the geometric center of one or more antenna arrays on the first outer surface 744a) may extend through the aperture plane (e.g., through the center of the aperture plane) of the first antenna or first antenna structure 750. The first antenna or first antenna structure 750 may be mechanically attached to an arm of a handler (or pusher) 754 such that the first antenna or first antenna structure 750 is movable. The handler 754 may be configured to insert the device under test 740 into the device under test socket 730.

[0103] The first antenna or first antenna structure 750 may be configured to couple to a signal source and / or a signal receiver (not shown in FIG. 7 ) via a blind-mate microwave connection (e.g., via a blind-mate waveguide). The first antenna or first antenna structure 750 may be configured to couple to a signal source and / or a signal receiver (not shown) when the handler 754 places the first antenna or first antenna structure 750 in an operating position (or, equivalently, when the handler 754 inserts the device under test 740 into the device under test socket 730 or when the handler 754 presses the device under test 740 into the device under test socket 730). The operating position may be defined by the alignment of the radiation direction of the first outer surface 744 a (e.g., a direction perpendicular to the first outer surface 744 a) with the receiving direction of the first antenna or first antenna structure 750. The signal source and / or signal receiver may be part of a processing device configured to test the device under test, for example using a computer program product including instructions that, when executed by automatic test equipment, cause the processing device to at least one of generate a signal to be transmitted by the first antenna or first antenna structure 750 and process (e.g., detect) a signal received by the first antenna or first antenna structure 750.

[0104] The second antenna or second antenna structure 752 (e.g., a single aperture antenna (e.g., dual linearly polarized or circularly polarized)) may be configured to receive signals radiated from the second outer surface 744b of the angled device under test 740 and / or to emit signals to be received at the second outer surface 744b of the angled device under test 740 (at least when the second antenna or second antenna structure 752 is placed in an operating position) (or, equivalently, when the handler 754 inserts the device under test 744b into the device under test socket 730 or when the handler 754 presses the device under test 740 into the device under test socket 730).

[0105] The aperture plane of the second antenna or second antenna structure 752 may be spaced apart from the second outer surface 744b of the angled device under test 740 such that (at least when the second antenna or second antenna structure 752 is placed in the operating position) (or, similarly, when the handler inserts the angled device under test into the test socket or when the handler presses the device under test into the test socket) a surface normal to the second outer surface 744b of the angled device under test 740 passes through the aperture plane of the second antenna or second antenna structure 752. A surface normal to the second outer surface 744b of the angled device under test 740 that is coaxial with a main lobe of the antenna structure on the second outer surface and / or a surface normal that extends through the geometric center of one or more antenna arrays on the first outer surface 744a may extend through the aperture plane of the first antenna or first antenna structure 750 (e.g., through the center of the aperture of the first antenna or first antenna structure).

[0106] The second antenna or second antenna structure 752 may be mechanically attached to an arm of a handler (eg, pusher) 754 such that the second antenna or second antenna structure 752 is movable.

[0107] The second antenna or second antenna structure 752 may be part of a pusher 754 for pushing the angled device under test 740 into the device under test socket 730, or the second antenna or second antenna structure 752 may be configured to be movable with the pusher 754 for pushing the angled device under test 740 into the device under test socket 730. The pusher 754 may be arranged such that the pusher 754, or a portion of the pusher 754, is between the second antenna or second antenna structure 752 and the second outer surface 744b of the device under test 740 when the device under test 740 is inserted into the device under test socket 730. The pusher 754 may be positioned such that, when the angled device under test 740 is inserted into the device under test socket 730, the pusher 754, or a portion of the pusher 754, is between the first antenna or first antenna structure 750 and the first outer surface 744a of the angled device under test 740. It should be noted that in some cases, the force pushing the device under test may act in two directions, for example, to push both the first inner surface of the device under test and the second inner surface of the device under test toward the device under test socket. Thus, the pusher may be angled to make (pushes into) contact with both the first outer surface of the device under test and the second outer surface of the device under test. As a result, the pusher can move both along the surface normal to the first outer surface of the device under test and along the surface normal to the second outer surface of the device under test.

[0108] The second antenna or second antenna structure 752 may be configured to be connected to a signal source and / or a signal receiver (not depicted in FIG. 7 ) via a blind-mate microwave connection (e.g., via a blind-mate waveguide connection) when the handler 754 places the second antenna or second antenna structure 752 in an operating position (or, equivalently, when the handler 754 inserts the angled device under test 740 into the device under test socket 730 or when the handler 754 presses the device under test 740 into the device under test socket 730). The operating position may be defined by the alignment of the radiation direction of the second outer surface 744b (e.g., a direction perpendicular to the second outer surface 744b) with the receiving direction of the second antenna or second antenna structure 752. The signal source and / or signal receiver may be part of a processing device configured to test the device under test 740, e.g., using a computer program product including instructions that, when executed by automatic test equipment, cause the processing device to at least one of generate a signal emitted by the second antenna or second antenna structure 752 and process (e.g., detect) a signal re-received by the second antenna or second antenna structure 752. The first and second antenna or second antenna structures 750, 752 may be configured to be connected to the same signal source and / or signal receiver, or may be configured to be connected to separate signal sources and / or signal receivers. The signal source and / or signal receiver may be configured by, e.g., the test setup 700.

[0109] FIG. 8 is a perspective view of an example device under test socket 830 that may be used, for example, in any of the embodiments disclosed herein.

[0110] The device under test socket 830 can be configured to accept any device under test described herein and to be part of any testing mechanism described herein. The device under test socket 830 includes an angle recess or angle removal portion 860 configured to support and / or align the device under test. The angle recess or angle removal portion 860 includes a first support base surface 862a configured to abut a first inner surface (e.g., first inner surface 142a, 242a, or 742a) of the device under test and a second support base surface 862b configured to abut a second inner surface (e.g., second inner surface 142b, 242b, or 742b) of the device under test. The first support base surface 862a and the second support base surface 862b can be provided at a support base surface angle such that the sum of the support base surface angle (e.g., 270 degrees) and the angle between the first and second inner surfaces (e.g., 90 degrees) of the device under test is at least substantially 360 degrees. For example, if the first and second inner surfaces of the device under test are disposed at an angle of 90 degrees, the support table surface angle may be 270 degrees (the sum of 90 degrees and 270 degrees is 360 degrees).

[0111] Any surface of the device under test socket 830 may be configured to make electrical contact with an inner surface of the device under test. For example, the first and / or second support base surfaces 862 a, b may be configured to establish electrical contact with an inner surface of the device under test and / or to provide a ground plane for the antenna structure of the device under test. To this end, the first and / or second support base surfaces 862 a, b may be composed of or formed from a conductive material (e.g., at least one of gold, copper, iron, and nickel). Alternatively, the first and / or second support base surfaces 862 a, b may be composed of or formed from a dielectric (non-conductive) material (e.g., a wear-resistant material). Optionally, the first and / or second support base surfaces 862 a, b may have one or more (local) socket connectors 865 (or other contact structures for contacting the device under test, such as conductive pads, pogo pins, spring contacts, etc.). The socket connector 865 is positioned so that when a device under test is placed in the device under test socket 860, the connector 865 establishes an electrical connection with an inner surface of the device under test or its connector (eg, array connector 248, 748).

[0112] The device under test socket 830 has a support 864 including a main socket structure 864a and a leg socket structure 864b. The main socket structure 864a and the leg socket structure 864b both have a rectangular cubic shape (optionally with rounded edges), and at least two edges of the leg socket structure 864b are shorter than two edges (e.g., corresponding edges) of the main socket structure 864a. The main socket structure 864a and the leg socket structure 864b may have, for example, the same height. A side 861 of the leg socket structure 864b is flush with a side of the main socket structure 864a, and the other three sides of the leg socket structure 864b are recessed relative to the other three (corresponding) sides of the main socket structure 864a. Thus, the leg socket structure 864b may be received by an opening in a carrier structure or an extender structure, for example, such that lateral movement of the device under test socket 830 is limited by the sides of the leg socket structure 864b. However, the device under test socket may also be mounted on an extender structure (e.g., on the extender structure 732), in which case the main socket structure 864a may be provided on the top surface of the extender structure and the leg socket structure 864b may be adjacent to a sidewall of the extender structure.

[0113] The device under test socket 830 may further or alternatively include one or more protrusions 866 extending from the support 864 (e.g., from the main socket structure 864a) in a direction toward the carrier structure. The protrusions 866 may be or may have a shaft (e.g., having a cylindrical shape). The protrusions 866 may be received by recesses in the carrier structure or the extender structure 732. Alternatively or additionally, the device under test socket 830 may include one or more through holes configured to receive mounting elements such as pins or screws.

[0114] 8, the angle recess or relief 860 extends to the main socket structure 864a and the leg socket structure 864b. Alternatively, the angle recess or relief 860 may extend only to the main socket structure 864a.

[0115] The angle recess or angle removal portion 860 may have respective side walls 868 a, b at either end (only one of which is directly visible in FIG. 8 ). The side walls 868 a, b face each other and are at least substantially parallel (ignoring any optional taper). In the example shown in FIG. 8 , the side walls 868 a, b are oriented perpendicular or at least nearly perpendicular to the first and second support base surfaces 862 a, b. The side walls 868 a, b can limit lateral movement of the device under test within the angle recess or angle removal portion 860, while allowing for smooth and well-guided insertion and extraction of the device under test into and from the angle recess or angle removal portion 860. Alternatively, the angle recess or angle removal portion 860 may have only one side wall, e.g., to increase positioning flexibility.

[0116] The angle recess or angle removal portion 860 may include at least one taper, for example, such that the cross section (e.g., parallel to the first or second support surface 862a, b) decreases in a direction from the outside toward the first or second support surface 862b. In the example shown in FIG. 8 , the angle recess or angle removal portion 860 includes first and second tapers. According to the first taper, the distance between the side walls 868a, b decreases toward the first support surface 862a. According to the second taper, the three side walls of the main socket structure 864a surrounding the second support surface 862b have cross sections that decrease toward the second support surface 862b. This taper has a self-centering function and can facilitate insertion of a device under test into the angle recess or angle removal portion 860.

[0117] The device under test socket 830 may have adjacent openings 869 that intersect with the angle recesses or angle removal portions 860. In the example shown in FIG. 8 , the device under test socket 830 has four adjacent openings 869 located adjacent to the corners of the second support base surface 862b. Alternatively, the device under test socket 830 may have any other number of adjacent openings 869 located at any other position adjacent to the second support base surface 862b (and / or the first support base surface 862a). For example, the adjacent openings may be adapted to prevent the device under test from tilting, for example, when the device under test is inserted into the socket 830. However, the adjacent openings may also be useful when removing the device under test from the socket 830.

[0118] The angle recess or relief 860 may have an additional recess or elevation, for example, to accommodate the shape of the device under test. For example, the angle recess or relief 860 shown in FIG. 8 has a step 867 in the first support base surface 862a. This step 867 can, for example, accommodate a structural feature of the first inner surface or provide a support surface for the device under test to form a space underneath (e.g., for gripping the device under test).

[0119] The device under test socket 830 may have a blind mating interface. In the example shown in FIG. 8 , the main socket structure 864a has two (e.g., blind) mating recesses 863a, b. Alternatively, the main socket structure 864a may have other amounts of mating recesses. The mating recesses 863a, b are configured to receive (e.g., blind) mating protrusions of a pusher or handler (e.g., handler 754). Alternatively or additionally, the main socket structure 864a may include one or more (e.g., blind) mating protrusions configured to be received by (e.g., blind) mating recesses of a pusher or handler (e.g., handler 754).

[0120] In conclusion, the socket 830 may receive and establish electrical contact with a device under test. The device under test may be aligned within the angle recess or angle removal portion 860 to enable OTA testing of the device under test using antenna structures or antennas on both exterior surfaces of the device under test. The device under test is well aligned within the socket, and distortion of the radiation characteristics of the antenna or antenna structure of the device under test by the socket can be kept reasonably small. The socket can be easily attached to a carrier structure and used with any of the embodiments disclosed herein.

[0121] 9 shows a schematic cross-section of another example of a test setup 900 with a device under test 940, which may be any of the devices under test described herein. The test setup 900 includes a device under test socket 930, which may be any of the device under test sockets described herein.

[0122] 9 corresponds to the example shown in Figure 7, except that the device under test socket 930 is mounted to a daughterboard 970 instead of an extender structure 732. However, the daughterboard 970 and the extender structure 732 are not mutually exclusive and may be combined (e.g., an extender structure may be disposed between the daughterboard 970 and the carrier structure and / or between the daughterboard 970 and the device under test socket 930).

[0123] The device under test socket 930 is mounted on (e.g., on) a daughterboard 970 that is mounted on a carrier structure 910 (e.g., a PCB test fixture or a load board) with a spacing between the daughterboard 970 and the carrier structure 910. The spacing between the daughterboard 970 and the carrier structure 910 can be provided, for example, using one or more stiffeners 972. The stiffeners 972 may be composed of at least one of a polymer, a resin, a glass, and a metal. The stiffeners 972 may have one or more stiffener structures. At least one of the stiffener structures may include a step (e.g., to facilitate mounting of the daughterboard 970 on the stiffener and / or to limit movement in two directions parallel to the surface of the carrier structure 910). The stiffeners 972 may have one or more structures that are at least substantially equal heights or have surfaces that are provided at at least substantially equal heights (e.g., in the case of a stepped stiffener structure). The stiffeners 972 may form or be part of a socket guide. The socket guides may be configured to facilitate mounting of the daughterboard 970 onto the stiffener 972 (eg, for a user or automated equipment).

[0124] Alternatively or additionally, an extender structure (e.g., similar to extender structure 732) may be provided between carrier structure 910 and stiffener 972, or between stiffener 972 and daughterboard 970, or between carrier structure 910 and daughterboard 970, or between daughterboard 970 and device under test socket 930.

[0125] The test setup 900 may have electrical connections between the daughter board 970 and the carrier structure 910 using electrical connectors 974 (e.g., using connectors (e.g., array connectors) for digital / power signals and optionally for high frequency or microwave signals, e.g., IF RF signals). The electrical connectors 974 may be configured to establish electrical connections between the load board and the device under test 940 (e.g., by electrically connecting the carrier structure 910 and the device under test 940). The electrical connectors 974 may be configured to transmit IF RF signals or microwave signals. High performance electrical connectors 974, such as high performance array connectors, may be provided.

[0126] The daughterboard 970 may include one or more attached electrical connectors 976 that are electrically connected (or connectable) to the device under test socket 930 (e.g., to contacts of the device under test socket 930 that are configured to establish an electrical connection with the device under test 940). Alternatively, the one or more electrical connectors 976 may be configured to establish an electrical connection to automatic test equipment or external signal generating and / or measurement equipment, for example, that may be controlled by the automatic test equipment. In the example shown in FIG. 9, the electrical connector 976 is a coaxial connector. The attached electrical connector 976 may be provided in addition to or as an alternative to the electrical connector 974.

[0127] The device under test socket 930 and / or the daughterboard 970 may have one or more coaxial pogo pins (e.g., spring pins). In the example shown in Figure 9, the device under test socket 930 has socket pogo pins 978. The coaxial pogo pins enable electrical contact to be established with the device under test 940 (e.g., the socket pogo pins 978 may at least partially retract when the device under test is pressed into the device under test socket 930).

[0128] In conclusion, the test mechanism 900 enables testing of one or more devices under test, which may be placed in a device under test socket 930. The devices under test may be spaced apart from a carrier structure 910, with a daughterboard 970 located between the carrier structure (e.g., a load board) 910 and the device under test socket. The daughterboard may be, for example, a printed circuit board and may include, for example, electrical paths that establish electrical connections between the carrier structure and connectors connecting the daughterboard and the device under test socket. Thus, the device under test socket may be directly (or closely) attached (or connected) to the daughterboard using conventional techniques, and the daughterboard may be coupled to the carrier structure (e.g., a load board) using a "long-reach" connection suitable for covering spacings ranging from 5 mm to 50 mm, for example. Therefore, proper placement of the device under test can be achieved by good mechanical stability and good electrical properties of the connection between the support structure and the device under test.

[0129] FIG. 10 shows a schematic cross section of another example of a test setup 1000 including a device under test 1040 .

[0130] The test setup includes a first antenna or first antenna structure 1050 configured to receive signals radiated from the first outer surface 1044a of the angle device under test 1140 and / or to emit signals to be received at the first outer surface 1044a of the angle device under test 1040. In the example shown in Figure 10, the aperture plane of the first antenna or first antenna structure 1050 is spaced apart from the first outer surface 1044a of the angle device under test 1040 such that the surface normal 1043 of the first outer surface 1044a of the device under test extends through the aperture plane of the first antenna or first antenna structure 1050. Alternatively, the first antenna or first antenna structure 1050 may be spaced apart from the first outer surface 1044a (e.g., close to or nearly tangent to the first outer surface 1044a). Optionally, there may be a pusher (for pushing the device under test into the device under test socket) between the first outer surface 1044a and the first antenna or first antenna structure 1050.

[0131] The first antenna or first antenna structure 1050 is mounted, for example, to have a fixed position relative to the device under test socket 1030. The first antenna or first antenna structure 1050 may be mounted to the carrier structure 1010. Signal transmission between the first antenna or first antenna structure 1044a is performed in a direction parallel to the surface of the carrier structure 1010 (e.g., by positioning the device under test 1140 in the device under test socket 1140) so that the angled device under test 1140 can be inserted into the device under test socket 1030 from above (e.g., in a direction perpendicular to, or at least nearly perpendicular to, the surface of the carrier structure 1010) without removing the first antenna or first antenna structure 1050.

[0132] The first antenna or first antenna structure 1050 may have (or be part of) a housing having a waveguide, the aperture face of the waveguide forming (or being part of or transitioning into) the aperture face of the first antenna or first antenna structure 1050. The waveguide of the first antenna or first antenna structure 1050 may be coupled to, for example, a coaxial connector or a coaxial cable.

[0133] The first antenna or first antenna structure 1050 may be connected (or connectable) to a signal source and / or signal receiver 1056a. In the example shown in Figure 10, the first antenna or first antenna structure 1050 has a first coaxial cable 1053a connected (or connectable) to the signal source and / or signal receiver 1056a. However, any other form of electrical signal transmission (such as a waveguide connection or a blind-mating waveguide connection) may be used instead.

[0134] The first antenna or first antenna structure 1050 may be configured to be connected to the first signal source and / or signal receiver 1056a (e.g., via the first coaxial cable 1053a) via a blind-mate microwave connection (e.g., via a blind-mate waveguide connection) when the first antenna or first antenna structure 1050 is placed in an operating position (e.g., by a handler), in which case the first antenna or first antenna structure may be moved, for example, by the handler.

[0135] The test mechanism 1000 may include a second antenna or second antenna structure 1152 (e.g., a single aperture antenna (e.g., dual linearly polarized or circularly polarized)) (illustrated in FIG. 10) configured to receive a signal radiated from the second outer surface 1044b of the angled device under test 1040 (e.g., when at least the second antenna or second antenna structure 1052 is placed in an operating position) and / or to emit a signal to be received at the second outer surface 1044b of the angled device under test 1040.

[0136] The second antenna or second antenna structure 1052 and / or antenna carrier structure 1054 (which may, for example, mechanically support the antenna structure 1052 and include one or more feed lines coupled to the antenna or antenna structure 1052) is (or is attachable to) an arm of a handler, for example, such that the second antenna or second antenna structure 1052 and / or antenna carrier structure 1054 is movable. The handler may be movable (e.g., removable), for example, to provide access to the device under test socket 1030, for example, to allow insertion and / or removal of a device under test 1140. In the example shown in FIG. 10 , the antenna structure 1052 or antenna carrier structure 1054 is (or is attachable to) a (e.g., blind-mate) microwave connection 1055. For example, the handler may move the antenna structure 1052 and the carrier structure to push the antenna carrier structure 1054 (which may have a connection structure, e.g., a hollow waveguide and / or a coaxial cable, and / or a microstrip line) towards the microwave connection, thereby establishing an electrical connection between the antenna and the microwave connection 1055. The microwave connection 1055 is electrically connected to the second signal source and / or signal receiver 1056b.

[0137] 10 has two separate signal sources and / or signal receivers 1056a,b coupled to different antenna structures 1050, 1052. However, the test setup 1000 may have a common (e.g., single) signal source and / or signal receiver, which may be connected to the first and second antennas or second antenna structures 1050, 1052 by separate or common electrical connections (such as coaxial cables and / or hollow waveguides).

[0138] The aperture plane of the second antenna or second antenna structure 1052 may be spaced apart from the second outer surface 1044b of the angled device under test 1040 such that the surface normal 1092 of the second outer surface 1044b of the angled device under test 1040 extends through the aperture plane of the second antenna or second antenna structure 1040 (e.g., at least when the second antenna or second antenna structure 1052 is positioned in the operating position).

[0139] 10 , the first and second antennas or first and second antenna structures 1050, 1052 are spaced apart from the first and second outer surfaces 1044 a, b. However, in some cases, at least one of the first and second antennas or first and second antenna structures 1050, 1052 may be positioned so as to be in substantial or complete contact with a respective one of the first and second outer surfaces 1044 a, b. To this end, at least one of the first and second antennas or first and second antenna structures 1050, 1052 may have a cover or spacer covering its respective open surface, the cover or spacer comprising a material that is at least partially transparent to the operating frequency of the device under test 1040.

[0140] The second antenna or second antenna structure 1052 may have (or be part of) a housing having a waveguide, the aperture face of the waveguide forming (or being part of) the aperture face of the second antenna or second antenna structure 1052. The waveguide of the second antenna or second antenna structure 1052 or the waveguide of the microwave connection 1055 may be coupled to a coaxial connector.

[0141] The test setup 1000 comprises a first coaxial cable 1053a coupled or coupleable to a coaxial connector of the first antenna or first antenna structure 1050. The test setup 1000 further comprises a second coaxial cable 1053b coupled or coupleable to a microwave connection 1055 of (or associated with) the second antenna or second antenna structure 1052. Alternatively, the test setup 1000 may comprise different devices or other numbers of coaxial cables for signal transmission.

[0142] 10 , the carrier structure 1010 includes a first carrier opening 1013a configured to receive a first coaxial cable 1053a and a second carrier opening 1013b configured to receive a second coaxial cable 1053b. The test setup 1000 includes a daughter board 1070 having a board opening 1073 configured to receive the second coaxial cable 1053b. Thus, the first and second coaxial cables 1053a, b may be partially disposed on a side of the carrier structure 1010 opposite the device under test socket 1030 (e.g., below the carrier structure 1010 as depicted in FIG. 10 ). Therefore, the influence on the signal transmission between the device under test 1030 and the first and / or second antennas or first and / or second antenna structures 1050, 1052 that may be caused by other devices, such as the first and second coaxial cables 1053a,b and the first and / or second signal sources and / or signal receivers 1056a,b connected thereto, is reduced. Furthermore, by providing the first and / or second signal sources and / or signal receivers 1056a,b on opposite sides of the carrier structure 1010, the length of the first and second coaxial cables 1053a,b can be shortened, improving signal quality.

[0143] At least one of the first and second coaxial cables 1053a, b may, for example, be movably (e.g., entirely removable) disposed inside the respective substrate opening 1013a, 1013b, 1073, or at least one of the first and second coaxial cables 1053a, b may be fixedly held by the respective substrate opening 1013a, 1013b, 1073 (e.g., by frictional engagement).

[0144] Alternatively, the carrier structure 1010 may not have board openings for the first and / or second coaxial cables 1053a,b, and the first and / or second coaxial cables 1053a,b may be provided entirely on the same side of the carrier structure 1010 as the device under test socket 1040 (e.g., above the carrier structure 1010 as shown in FIG. 10). Alternatively or additionally, the daughter board 1070 may not have board openings for the second coaxial cable 1053b.

[0145] The daughterboard 1070 may be any daughterboard as described herein (e.g., daughterboard 970). In the example shown in FIG. 10 , the daughterboard 1070 includes spacers or stacking connectors 1075 a, b, where, for example, one or more electrical connectors may be integrated into one of the spacers or stacking connectors 1075 a, 1075 b, or one or more electrical connectors may replace one or more of the spacers or stacking connectors 1075 a, 1075 b. At least one of the stacking connectors may be configured to transmit signals (e.g., digital signals) and / or power. To this end, at least one of the spacers or stacking connectors 1075 a, 1075 b may include an electrical connector (e.g., electrical connector 974).

[0146] The device under test socket 1030 includes socket pogo pins 1078. The socket pogo pins 1078 may be configured to establish an electrical connection between the device under test socket 1030 and an inner surface of the device under test 1140. The socket pogo pins 1078 may be housed in the device under test socket 1030 and / or the daughterboard 1070.

[0147] FIG. 11 is a schematic top view of another example of a test mechanism 1100 having multiple devices under test 1140a, b, c, d. The test mechanism 1100 includes a carrier structure 1110 (e.g., a printed circuit board test fixture or a load board) (which may be any carrier structure described herein) and four (e.g., four equal) device under test sockets 1130a, b, c, d (which may be any device under test sockets described herein). However, the test mechanism 1100 may include any other quantity of device under test sockets (e.g., two, three, five, six, or more). The multiple devices under test 1140a-d may be arranged in a row 1115a as depicted in FIG. 11. The test mechanism 1100 allows multiple devices under test 1140a-d to be tested, thereby improving test efficiency. Tests may be performed simultaneously, for example, to increase time efficiency. Additionally, the tests can be performed consecutively to reduce crosstalk between the devices under test 1140a-d.

[0148] The device under test sockets 1130a-d are provided to position the angled devices under test 1140a-d so that the first outer surfaces of the angled devices under test (in FIG. 11, the first outer surface 1144a of the device under test 1140a is shown as an example) are aligned in the same direction (the positive x direction in FIG. 11). By aligning them in the same direction, the device under test sockets 1130a-d can be provided at a higher density.

[0149] The test setup 1100 includes four first antennas or first antenna structures 1150a, b, c, d (which may be any of the first antennas or first antenna structures described herein) (e.g., side-measuring antennas). However, the test setup 1100 may include any other number of first antennas or first antenna structures 1150a-d, for example, the same number as the number of device under test sockets 1130a-d. In the example shown in FIG. 11 , each of the device under test sockets 1130a-d is assigned a respective one of the first antennas or first antenna structures 1150a-d. Each of the first antennas or first antenna structures 1150a-d is configured to receive signals radiated from a first outer surface of the assigned (respective) angle device under test 1140a-d and / or to emit signals to be received at a first outer surface of the assigned (respective) angle device under test 1140a-d.

[0150] At least one aperture plane of the first antenna or first antenna structure 1150a-d may be positioned away from each one of the first outer surfaces of the angle device under test 1140a-d such that a surface normal of the first outer surface of the angle device under test 1140a-d extends through each one of the aperture planes of the first antenna or first antenna structure 1150a-d.

[0151] 11, the test setup 1100 does not include a second antenna or second antenna structure so as not to obscure the devices under test 1140a-d. However, the test setup 1100 may include only the first antenna or first antenna structure (i.e., no second antenna or second antenna structure), only the second antenna or second antenna structure (i.e., no first antenna or first antenna structure), or both the first and second antenna or second antenna structures.

[0152] The carrier structure 1110 may define a board limit 1113 (eg, a handler docking plate limit), which defines an area (eg, a rectangular frame) surrounding an area that supports the attached device under test sockets 1130a-d.

[0153] 12 is a schematic top view of another example of a test mechanism 1200 including a plurality of devices under test 1240. The test mechanism 1200 includes a carrier structure 1210 (which may be comprised of any of the carrier structures described herein) (e.g., a printed circuit board test fixture or a load board) and eight (e.g., eight equal) device under test socket sets 1230 (which may be any of the device under test sockets described herein). However, the test mechanism 1200 may include any other number of device under test sockets (e.g., two, three, five, six, or more).

[0154] At least two device under test sockets 1230 are provided to position respective angled devices under test 1240 (e.g., back-to-back) so that the respective first outer surfaces 1244aa of the respective devices under test are aligned in opposite (avoided) directions. For clarity, only the leftmost device under test socket 1230 is described in FIG. 12 and is therefore labeled with reference numerals 1230a, b, but the same principles apply to the remaining device under test sockets 1230. The first device under test socket 1230a is configured to position the respective devices under test 1240a so that the respective first outer surfaces 1244aa face a first direction (e.g., the negative x-direction in FIG. 12). The second device under test socket 1230b is configured to position the respective devices under test 1240b so that the respective first outer surfaces 1244ab face a second direction (e.g., the positive x-direction in FIG. 12) that is opposite (e.g., anti-parallel) to the first direction. As a result, the first outer surfaces 1244aa, 1244ab of the devices under test 1240a, 1240b placed in the first and second device under test socket sets 1230a, b face in opposite directions. As a result, the first antennas or first antenna structures 1250a, 1250b assigned to the respective first and second device under test sockets 1230a, b may be oriented in opposite directions. Furthermore, the first antennas or first antenna structures 1250a, 1250b assigned to the respective first and second device under test sockets 1230a, b may be positioned so as to be positioned (e.g., sandwiched) between the first antennas or first antenna structures 1250a, 1250b assigned to the first and second device under test socket sets 1230a, b. Such an arrangement reduces the risk of crosstalk between the devices under test 1240a, 1240b coupled to the first and second device under test sockets 1230a, b.

[0155] The test setup 1200 includes two rows (e.g., parallel rows) 1215a,b of device under test sockets 1230a, 1230b and associated first antennas 1250a, 1250b, the device under test sockets 1230 configured to support respective angled devices under test 1240a, 1240b, and the at least two rows 1215a,b of device under test sockets 1240 position the respective angled devices under test 1240a, 1240b (e.g., back to back, e.g., with the sides of the device under test socket 1230 on which the first outer faces 1244a of the devices under test 1240 are positioned facing each other) such that the respective first outer faces 1244aa, 1244ab of the respective angled devices under test 1240a, 1240b are aligned in opposite (facing) directions. Such an arrangement improves the compromise between reduced crosstalk and increased packing density.

Claims

1. 1. A test mechanism for over-the-air (OTA) testing of an angle device under test, comprising: the testing mechanism comprises a carrier structure; the test mechanism includes a device under test socket coupled to the carrier structure; the device under test socket is configured to establish electrical contact with an inner surface of the device under test or a connector provided on the inner surface of the device under test; Testing organization.

2. The device under test socket comprises: - the angle is such that a first outer surface of the device under test is spaced apart from the surface of the carrier structure; and - angle the device under test so that the surface normal of the first outer surface is parallel to the surface of the carrier structure within a tolerance of ±15 degrees; an angle configured to position the device under test; The testing mechanism of claim 1 .

3. The device under test socket is - angle the device under test so that a second outer surface faces away from the carrier structure; and - angle the device under test so that the surface normal of the second outer surface is perpendicular to the surface of the carrier structure within a tolerance of ±15 degrees; an angle configured to position the device under test; 3. A testing mechanism according to claim 1 or 2.

4. an area of the carrier structure adjacent to the first outer surface of the angle device under test being free from a power plane and / or a ground plane; A testing arrangement according to any one of claims 1 to 3.

5. an area of the carrier structure adjacent to the first outer surface of the angle device under test is not metallized; A testing arrangement according to any one of claims 1 to 4.

6. an absorber material is provided on the carrier structure in an area adjacent the first outer surface of the angle device under test; A testing arrangement according to any one of claims 1 to 5.

7. the device under test socket is configured to position the angle device under test such that the distance between the first outer surface of the angle device under test and the carrier structure is at least two wavelengths at a lowest operating frequency of the angle device under test; A testing arrangement according to any one of claims 1 to 6.

8. the device under test socket is mounted on a daughter board mounted on the carrier structure with a space between the daughter board and the load board; A testing mechanism according to any one of claims 1 to 7.

9. the test mechanism comprises a first antenna or a first antenna structure configured to receive a signal radiated from the first outer surface of the angle device under test and / or to emit a signal to be received at the first outer surface of the angle device under test; A testing arrangement according to any one of claims 1 to 8.

10. the test mechanism comprises a first antenna or a first antenna structure; an aperture plane of the first antenna or first antenna structure is spaced apart from the first outer surface of the angled device under test such that a surface normal of the first outer surface of the angled device under test extends through the aperture plane of the first antenna or first antenna structure; A testing arrangement according to any one of claims 1 to 9.

11. the first antenna or first antenna structure is mounted to have a fixed position relative to the device under test socket; A testing arrangement according to claim 9 or 10.

12. the first antenna or first antenna structure is mechanically attached to an arm of a handler such that the first antenna or first antenna structure is movable; A testing arrangement according to claim 9 or 10.

13. the first antenna or first antenna structure is configured to be connected to a signal source and / or a signal receiver via a blind-mate microwave connection when the handler places the first antenna or first antenna structure in an operating position; A testing arrangement according to any one of claims 9 to 12.

14. the test mechanism comprises a second antenna or a second antenna structure configured to receive a signal radiated from the second outer surface of the angle device under test and / or to emit a signal to be received at the second outer surface of the angle device under test; A testing arrangement according to any one of claims 1 to 13.

15. the test mechanism comprises a second antenna or a second antenna structure; the aperture plane of the second antenna or second antenna structure is spaced apart from the second outer surface of the angled device under test such that a surface normal to the second outer surface of the angled device under test extends through the aperture plane of the second antenna or second antenna structure; A testing arrangement according to any one of claims 1 to 14.

16. the second antenna or second antenna structure is mechanically attached to an arm of a handler such that the second antenna or second antenna structure is movable; 16. A testing arrangement according to claim 14 or 15.

17. the second antenna or second antenna structure is part of a pusher for pushing the angled device under test into the device under test socket; or the second antenna or the second antenna structure is configured to be movable together with a pusher for pushing the angle device under test into the device under test socket; A testing arrangement according to any one of claims 14 to 16.

18. the second antenna or second antenna structure is configured to be connected to a signal source and / or a signal receiver via a blind-mate microwave connection when the handler places the second antenna or second antenna structure in an operating position; A testing arrangement according to any one of claims 14 to 17.

19. the device under test socket has an angle recess or angle removal portion configured to support and / or align the angle device under test; A testing arrangement according to any one of claims 1 to 18.

20. the device under test socket is arranged so that a second inner surface of the angle device under test opposite to the second outer surface of the angle device under test is at least 10 mm, or at least 30 mm, or at least 45 mm, or at least 2 wavelengths, or at least 3 wavelengths, or at least 4 wavelengths at a lowest operating frequency of the angle device under test, from the carrier structure; A testing arrangement according to any one of claims 1 to 19.

21. the device under test socket has a socket height of at least 10 mm, or at least 30 mm, or at least 45 mm, such that a second inner surface of the angle device under test opposite the second outer surface of the angle device under test is at least 10 mm, or at least 30 mm, or at least 45 mm, or at least 2 wavelengths, or at least 3 wavelengths, or at least 4 wavelengths at a lowest operating frequency of the angle device under test, from the carrier structure; A testing arrangement according to any one of claims 1 to 20.

22. the device under test socket has one or more coaxial pogo pins for establishing an electrical connection between the carrier structure and the device under test; A testing arrangement according to any one of claims 1 to 20.

23. an extender structure is provided between the carrier structure and the device under test socket; 23. A testing arrangement according to any one of claims 1 to 22.

24. the extender structure includes an extender assembly; the extender assembly includes one or more coaxial pogo pins for establishing an electrical connection between the carrier structure and the angle device under test; 25. The testing mechanism of claim 24.

25. the test mechanism includes at least two device under test sockets configured to support respective angle devices under test; the at least two device under test sockets are configured to position the respective angle devices under test such that the respective first outer surfaces of the respective angle devices under test are aligned in opposite directions; 25. A testing arrangement according to any one of claims 1 to 24.

26. the test mechanism comprises at least two rows of device under test sockets; the device under test sockets are configured to support respective angle devices under test; the at least two rows of device under test sockets are arranged to position respective devices under test such that the first outer surfaces of the respective angled devices under test are aligned in opposite directions; 26. A testing arrangement according to any one of claims 1 to 25.

27. 1. A test mechanism for over-the-air (OTA) testing of an angle device under test, comprising: the testing mechanism comprises a carrier structure; the test mechanism includes a device under test socket coupled to the carrier structure; the device under test socket is configured to establish electrical contact with an inner surface of the angle device under test or a connector provided on the inner surface of the angle device under test; The device under test socket is - a first outer surface of the angled device under test is spaced from a surface of the load board; and - angle the device under test so that a surface normal of the first outer surface is parallel to the surface of the load board within a tolerance of ±15 degrees; - angle the device under test so that a second outer surface faces away from the load board; and - angle the device under test so that the surface normal of the second outer surface is perpendicular to the surface of the load board within a tolerance of ±15 degrees; an angle configured to position the device under test; Testing organization.

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