System and method for maintaining constant clamping pressure during chamber restart and power outage events

Abstract

The clamping system for the substrate support includes a clamping assembly configured to clamp an edge ring to a base plate of the substrate support, a valve control assembly coupled to a compressed air source, and a valve assembly coupled between the valve control assembly and the clamping assembly. The valve assembly is coupled to the compressed air source and the valve control assembly, and the valve assembly receives compressed air separately from the compressed air source and the valve control assembly as inputs. The valve assembly is configured to selectively supply pressurized air from the compressed air source to the clamping assembly in response to the input received from the valve control assembly to clamp the edge ring to the base plate.

Description

[Technical Field]

[0001] [CROSS-REFERENCE TO RELATED APPLICATIONS] This application claims the benefit of priority to U.S. Provisional Patent Application No. 63 / 394,795, filed August 3, 2022, the entire disclosure of which is incorporated herein by reference.

[0002] The present disclosure relates to securing a ring structure within a substrate processing chamber. [Background technology]

[0003] The background art description provided herein is intended to provide a general overview of the contents of the present disclosure. Work by the currently named inventors within this background art section, as well as aspects of the description that may not otherwise be considered prior art at the time of filing, are not admitted, expressly or impliedly, as prior art against the present disclosure.

[0004] Substrate processing systems may be used to process substrates, such as semiconductor wafers. Examples of processes that may be performed on the substrate include, but are not limited to, chemical vapor deposition (CVD), atomic layer deposition (ALD), conductor etching, dielectric etching, and / or other etching, deposition, or cleaning processes. The substrate may be positioned on a substrate support, such as a pedestal, electrostatic chuck (ESC), or the like, in a processing chamber of the substrate processing system. During etching, an etching gas mixture containing one or more gases may be introduced into the processing chamber, and a plasma may be used to initiate a chemical reaction.

[0005] The substrate support may include a ceramic layer disposed to support the substrate. For example, the substrate may be clamped to the ceramic layer during processing. The substrate support may include the ceramic layer and an edge ring disposed to surround the outer periphery of the substrate. Summary of the Invention

[0006] The clamping system for the substrate support includes a clamping assembly configured to clamp an edge ring to a base plate of the substrate support, a valve control assembly coupled to a compressed air source, and a valve assembly coupled between the valve control assembly and the clamping assembly. The valve assembly is coupled to the compressed air source and the valve control assembly, and the valve assembly receives compressed air separately from the compressed air source and the valve control assembly as inputs. The valve assembly is configured to selectively supply pressurized air from the compressed air source to the clamping assembly to clamp the edge ring to the base plate in response to the input received from the valve control assembly.

[0007] In other features, the valve assembly includes a clamp supply port coupled to a compressed air source, a clamp control port coupled to the valve control assembly, a release control port coupled to the valve control assembly, and a discharge port. The valve assembly has a clamp state and a release state. The valve assembly is configured to supply pressurized air from the compressed air source to the clamp assembly when in the clamp state, and the valve assembly is configured to discharge pressurized air through the discharge port when in the release state. The valve assembly is configured to transition to the clamp state in response to receiving pressurized air from the valve control assembly at the clamp control port. The valve assembly is configured to transition to the clamp state in response to receiving pressurized air from the valve control assembly at the release control port.

[0008] In other features, the valve control assembly includes a first solenoid valve coupled between a compressed air source and the clamp control port and a second solenoid valve coupled between the compressed air source and the release control port. To transition the valve assembly to a clamped state, the first solenoid valve is energized and the second solenoid valve is de-energized. To transition the valve assembly to a release state, the second solenoid valve is energized and the first solenoid valve is de-energized. When the valve assembly is in the clamped state, loss of power to the first and second solenoid valves prevents the valve assembly from transitioning out of the clamped state. When the valve assembly is in a release state, loss of power to the first and second solenoid valves prevents the valve assembly from transitioning out of the release state.

[0009] In other features, the valve assembly is an air-controlled valve. The clamping assembly includes a plurality of clamping mechanisms mechanically coupled to a support ring of the substrate support, and an edge ring is attached to the support ring. The plurality of clamping mechanisms includes a plurality of actuators configured to actuate respective rods coupled to the support ring. The actuators are configured to pull down the rods when the clamping assembly receives pressurized air from the valve assembly.

[0010] A clamping system configured to clamp an edge ring to a base plate of a substrate support includes a plurality of clamping mechanisms configured to pull the edge ring downward to clamp the edge ring to the base plate. The valve assembly is configured to receive pressurized air from a compressed air source at a first port and from a valve control assembly at second and third ports, separately, and transition between a clamped state and a released state in response to the pressurized air received at the second and third ports. The valve assembly is configured to supply pressurized air to the plurality of clamping mechanisms when in the clamped state, and to release the pressurized air through a fourth port when in the released state.

[0011] In other features, the valve assembly is an air-controlled valve. The clamping system further includes a valve control assembly. The valve control assembly includes an array of solenoid valves. The array of solenoid valves includes a first solenoid valve coupled between a compressed air source and the second port and a second solenoid valve coupled between the compressed air source and a third port. The first solenoid valve is configured to supply pressurized air from the compressed air source to the second port in response to receiving power from the power source, and the second solenoid valve is configured to supply pressurized air from the compressed air source to the third port in response to receiving power from the power source.

[0012] In other features, the valve assembly is configured to supply pressurized air received from the compressed air source at the first port to the plurality of clamping mechanisms when in the clamped state regardless of whether the first solenoid valve receives power from the power source, and to release pressurized air through the fourth port when in the released state regardless of whether the second solenoid valve receives power from the power source.

[0013] The clamping system configured to clamp the edge ring to the base plate of the substrate support includes a plurality of actuators for pulling down respective rods to clamp the edge ring to the base plate, a first solenoid valve coupled between a compressed air source and the plurality of actuators, a second solenoid valve coupled between the compressed air source and the plurality of actuators, and an air control valve coupled between the compressed air source and the plurality of actuators and between the first and second solenoid valves and the plurality of actuators, The air control valve includes a first port for receiving pressurized air from the compressed air source separately from the first and second solenoid valves, a second port for receiving pressurized air from the first solenoid valve, and a third port for receiving pressurized air from the second solenoid valve.

[0014] Further areas of applicability of the present disclosure will become apparent from the detailed description, claims, and drawings. The detailed description and specific examples are for purposes of illustration only and are not intended to limit the scope of the present disclosure. [Brief explanation of the drawings]

[0015] The present disclosure will become more fully understood from the detailed description and the accompanying drawings, wherein:

[0016] [Figure 1] FIG. 1 is an exemplary substrate processing system according to the present disclosure.

[0017] [Figure 2A] FIG. 2A is an exemplary substrate support and clamping system according to the present disclosure.

[0018] [Figure 2B] FIG. 2B is an exemplary clamping system according to the present disclosure.

[0019] [Figure 3] FIG. 3 illustrates the respective states of a clamping system during clamping and release operations according to the present disclosure.

[0020] In the drawings, reference numerals may be reused to identify similar and / or identical elements. DETAILED DESCRIPTION OF THE INVENTION

[0021] In a substrate processing chamber, the temperature of the edge ring affects process parameters such as etch rate and uniformity at the outer edge of the substrate. The edge ring is exposed to the processing environment (including the plasma) and absorbs heat. Therefore, the temperature of the edge ring changes during processing, and by controlling the temperature of the edge ring, repeatable etch rates and process uniformity can be achieved.

[0022] In some examples, the edge ring is positioned in thermal contact with a base plate or lower ring of the substrate support. The base plate and other structures, such as ring structures, can act as heat sinks for the edge ring. Heat is transferred through the contact surface between the edge ring and the other structures. In some examples, a thermally conductive material (e.g., a silicon-based material such as a gel, paste, or pad) is provided between the edge ring and the base plate to facilitate heat transfer from the edge ring to the base plate.

[0023] In some examples, a portion of the edge ring is supported on and / or attached to a support ring, such as an adjustable edge sheath (TES) ring. For example, the edge ring is attached to the TES ring using screws or other fasteners. During processing, the TES ring is pulled downward, thereby pulling the edge ring downward to ensure thermal contact and heat transfer between the edge ring and the thermally conductive material. In some examples, the substrate support implements a hold-down rod mechanism or system configured to pull the TES ring downward. An example of a hold-down rod system for a TES ring is described in more detail in U.S. Patent Publication No. 2020 / 0365378, filed December 15, 2017, the contents of which are incorporated herein in their entirety.

[0024] As an example, a hold-down rod system includes a bank of solenoid valves configured to selectively pressurize clamp lines coupled to a clamping system (e.g., multiple pneumatic actuators). When the clamp lines are pressurized, the pneumatic actuators pull down the respective rods, thereby lowering (i.e., clamping) the TES ring and edge ring. However, under some circumstances, such as during a power-off or restart of the substrate processing system, a power outage, or other event that interrupts power to the solenoid valves, the solenoid valves may become deactivated. Deactivation of the solenoid valves unclamps the TES ring, thereby reducing thermal contact between the edge ring and the base plate.

[0025] The support ring clamping system and method according to the present disclosure is configured to maintain clamping pressure during system restarts and other power interruptions. For example, an air control valve assembly is coupled between the solenoid valve and the clamping mechanism. The valve assembly is configured to maintain the supply of clamping pressure to the clamping mechanism during restarts or loss of power.

[0026] Referring now to FIG. 1 , an exemplary substrate processing system 100 is shown. By way of example, the substrate processing system 100 may be used to perform etching using RF plasma and / or other suitable substrate processes. The substrate processing system 100 includes a processing chamber 102 that surrounds other components of the substrate processing system 100 and contains the RF plasma. The substrate processing chamber 102 includes an upper electrode 104 and a substrate support 106, such as an ESC. During operation, a substrate 108 is placed on the substrate support 106. While a particular substrate processing system 100 and processing chamber 102 are shown as examples, the principles of the present disclosure are applicable to other types of substrate processing systems and processing chambers, such as substrate processing systems that generate plasma in-situ, substrate processing systems that implement remote plasma generation and delivery (e.g., using plasma tubes, microwave tubes), etc.

[0027] By way of example, the upper electrode 104 may include a gas distribution device, such as a showerhead 110, for introducing and distributing process gases. The showerhead 110 may include a stem portion with one end connected to the top surface of the processing chamber 102. A base portion is generally cylindrical and extends radially outward from the opposite end of the stem portion at a location spaced from the top surface of the processing chamber. A substrate-facing surface or faceplate of the base of the showerhead 110 includes a plurality of holes through which process or purge gases are passed. Alternatively, the upper electrode 104 may include a conductive plate, and process gases may be introduced in another manner.

[0028] The substrate support 106 includes a conductive base plate 112 that functions as a bottom electrode. The base plate 112 supports a ceramic layer 114. An adhesive layer (e.g., an adhesive and / or a thermal adhesive layer) 116 may be disposed between the ceramic layer 114 and the base plate 112. The base plate 112 may include one or more coolant channels 118 for flowing coolant within the base plate 112. The substrate support 106 may include an edge ring 120 disposed to surround the outer periphery of the substrate 108.

[0029] The RF generation system 122 generates an RF voltage and outputs it to one of the upper electrode 104 and the lower electrode (e.g., the base plate 112 of the substrate support 106). The other of the upper electrode 104 and the base plate 112 may be DC grounded, AC grounded, or floating. In this example, the RF voltage is supplied to the lower electrode. Illustratively, the RF generation system 122 may include an RF voltage generator 124 that generates an RF voltage supplied to the upper electrode 104 or the base plate 112 by a matching and distribution network 126. In other examples, the plasma may be generated inductively or remotely. For illustrative purposes, the RF generation system 122 corresponds to a capacitively coupled plasma (CCP) system, although the principles of the present disclosure may also be implemented in other suitable systems, such as a transformer coupled plasma (TCP) system, a CCP cathode system, or a remote microwave plasma generation and delivery system.

[0030] The gas delivery system 130 includes one or more gas sources 132-1, 132-2, ..., and 132-N (collectively, gas sources 132), where N is an integer greater than zero. The gas sources supply one or more etching gases and mixtures thereof. The gas sources may also supply carrier gases and / or purge gases. The gas sources 132 are connected to a manifold 140 by valves 134-1, 134-2, ..., and 134-N (collectively, valves 134) and mass flow controllers 136-1, 136-2, ..., and 136-N (collectively, mass flow controllers 136). An output of the manifold 140 is supplied to the processing chamber 102. Illustratively, an output of the manifold 140 is supplied to the showerhead 110.

[0031] The temperature controller 142 may be in communication with the coolant assembly 146 to control the flow of coolant through the channels 118. For example, the coolant assembly 146 may include a coolant pump and a reservoir. The temperature controller 142 operates the coolant assembly 146 to selectively flow coolant into the channels 118 to cool the substrate support 106.

[0032] Valves 150 and pumps 152 may be used to evacuate reactants from the processing chamber 102. A system controller 160 may be used to control the components of the substrate processing system 100. A robot 170 may be used to deliver substrates onto and remove substrates from the substrate support 106. For example, the robot 170 may transport substrates between the substrate support 106 and a load lock 172. The temperature controller 142, although shown as a separate controller, may also be implemented within the system controller 160.

[0033] A thermal contact surface 180 is defined between the edge ring 120 and the upper surface of the base plate 112. For example, the edge ring 120 contacts and is supported on the upper surface of the base plate 112. A thermally conductive material (e.g., a silicon-based material such as a gel, paste, or pad, not shown in FIG. 1 ) is provided at the thermal contact surface 180 between the edge ring 120 and the base plate 112. The thermally conductive material facilitates cooling of the edge ring 120 (i.e., heat transfer from the edge ring 120 to the base plate 112).

[0034] The edge ring 120 is at least partially supported on and / or in contact with a support ring 184, such as a TES ring. For example, the edge ring 120 is attached to the support ring 184 using screws or other fasteners. The support ring 184 is pulled downward to clamp the edge ring 120 to the base plate 112 (e.g., using a clamping system, as described in more detail below). In this manner, thermal contact between the edge ring 120 and the base plate 112 is maximized.

[0035] 2A , a portion of an exemplary substrate support 200 according to the present disclosure is shown. The substrate support 200 is configured to support a substrate 204. The substrate support 200 includes a base plate (e.g., a conductive base plate) 208, a ceramic layer 212, and, in some examples, an adhesion layer 214 disposed between the ceramic layer 212 and the base plate 208. The base plate 208 may include one or more coolant channels 216 for flowing coolant within the base plate 208. The substrate support 200 includes an edge ring 220 disposed around the outer periphery of the substrate 204. A thermally conductive material 224 is disposed between the edge ring 220 and the base plate 208 (e.g., adjacent the backside of the edge ring 220). The thermally conductive material 224 facilitates cooling of the edge ring 220.

[0036] The edge ring 220 is at least partially supported on and / or in contact with the support ring 228. For example, the edge ring 220 is attached to the support ring 228 using fasteners, such as screws 230. While the edge ring 220 and the support ring 228 are shown as separate components, in other examples, the edge ring 220 and the support ring 228 may be comprised of a single, integrated component. The support ring 228 is pulled downward to clamp the edge ring 220 to the base plate 208. For example, the clamping system 232 includes a clamping assembly 234. The clamping assembly 234 includes one or more clamping mechanisms, such as a pneumatic linear actuator 236. The actuator 236 is configured to pull each hold-down rod 240 downward, thereby pulling the support ring 228 and the edge ring 220 downward. For example, the support ring 228 may be disposed on an outer ring 244 (e.g., a ring comprised of quartz or another insulating material). The rods 240 extend into the support ring 228 through channels 248 defined in the outer ring 244 .

[0037] The temperature controller 252 is in communication with the coolant assembly 254 to control the flow of coolant through the channels 216. The temperature controller 252 may also operate the coolant assembly 254 to selectively flow coolant through the channels 216 to cool the substrate support 200. The temperature controller 252 may be a separate controller implemented within the system controller 256, etc. The temperature controller 252 may be configured to measure and / or calculate the temperature of the edge ring 220 based in part on sensed and / or modeled temperatures of the substrate support 200 and the edge ring 220, process parameters, etc.

[0038] For example, the temperature controller 252 determines the temperature of the edge ring 220 according to the temperatures of the substrate support 200 and the edge ring 220 measured using one or more temperature sensors (not shown). In other examples, the temperature controller 252 may be configured to calculate the temperature of the edge ring 220 using other measurements and / or estimates, such as the output of a model. For example, the temperature controller 252 may receive one or more signals 258 corresponding to directly sensed temperatures and / or other process parameters used to calculate the temperature of the edge ring 220.

[0039] 2B and with continued reference to FIG. 2A, an example clamping system 232 according to the present disclosure is shown in more detail. The clamping system 232 includes a clamping assembly 234. In this example, the clamping assembly 234 includes multiple clamping mechanisms, such as an actuator 236 and respective hold-down rods 240. Clamping pressure is supplied to the actuator 236 from a compressed air source 260 via one or more pressurized clamping lines 262, thereby pulling down the rods 240 and clamping the edge ring 220 to the base plate 208. For example, the compressed air source 260 may include multiple compressed air sources, air compressors, etc. Conversely, pressure is released from the actuator 236 via one or more release lines 264 to release the edge ring 220.

[0040] A valve control assembly, such as a solenoid valve bank or solenoid valve array 268, is coupled between the compressed air source 260 and the actuator 236. The solenoid valve array 268 is configured to selectively pressurize the clamp line 262 to clamp the edge ring 220 and to release pressure from the actuator 236 to release the edge ring 220. For example, a first solenoid valve 270 coupled to the compressed air source 260 is configured to be selectively opened to pressurize the clamp line 262. Conversely, a second solenoid valve 272 is configured to be selectively opened to release pressure from the actuator 236. That is, during processing, power is applied (e.g., from a power source 274 in response to the system controller 160) to open the first solenoid valve 270 and clamp the edge ring 220, while power is applied to open the second solenoid valve 272 and release the edge ring 220.

[0041] The power supplied to the solenoid valve array 268 may be interrupted under several circumstances, such as during a power down or restart of the substrate processing system 100, a power outage, or other event that interrupts power to the solenoid valve array 268. If the power supplied to the solenoid valve array 268 is interrupted during processing, the solenoid valves 270 are deactivated, unclamping the edge ring 220 and reducing thermal contact between the edge ring 220 and the base plate 208.

[0042] The clamping system 232 according to the present disclosure is configured to maintain a desired clamped or released state of the actuator 236 and edge ring 220 during restarts and other power interruptions of the system. For example, an air control valve assembly (e.g., a multi-port valve) 278 is coupled between the solenoid valves 270, 272 and the actuator 236. The valve assembly 278 is configured to maintain the supply of clamping pressure to the actuator 236 during restarts or loss of power, as described in more detail below.

[0043] As shown, a first port (e.g., clamp supply port) 280 of valve assembly 278 is coupled to compressed air source 260 via a direct clamp line 282. Thus, valve assembly 278 receives compressed air as an input directly from compressed air source 260. No solenoid valve is included in the path between compressed air source 260 and clamp supply port 280. That is, valve assembly 278 is coupled to compressed air source 260 separately from solenoid valve array 268, and is therefore configured to receive a supply of pressurized air from compressed air source 260 regardless of whether power is supplied to the solenoid valve coupled to clamp supply port 280. Thus, even if power to solenoid valve array 268 is interrupted, the supply of pressurized air to clamp supply port 280 is not interrupted.

[0044] Conversely, the first solenoid valve 270 is coupled to a second port (e.g., clamp control port 284) of the valve assembly 278, while the second solenoid valve 272 is coupled to a third port (e.g., release control port) 286 of the valve assembly 278. Thus, the valve assembly 278 receives compressed air as input from the first solenoid valve 270 and the second solenoid valve 272. Because the valve assembly 278 is pneumatically controlled, supplying pressurized air to the clamp control port 284 or the release control port 286 transitions the valve assembly 278 between a first position and a second position or state. In the first (e.g., clamped) state, the clamp control port 284 is pressurized and the valve assembly 278 supplies pressurized air from the clamp line 280 directly to the actuator 236. That is, when the first solenoid valve 270 is energized (ie, on) and the second solenoid valve 272 is not energized (ie, off), the valve assembly 278 is in a clamped state.

[0045] Furthermore, when the valve assembly 278 is in the clamped state, interruption of power to the first solenoid valve 270 does not interrupt the supply of clamping pressure to the actuator 236. For example, a loss of power to the solenoid valve array 268 interrupts power to both the first solenoid valve 270 and the second solenoid valve 272, thereby preserving the state of the valve assembly 278 prior to the loss of power (i.e., the clamped state). Thus, the valve assembly 278 continues to receive pressurized air from the compressed air source 260 via the direct clamping line 282, and the edge ring 220 remains clamped during a system restart or other power outage.

[0046] In the second (e.g., released) state, the release control port 286 is pressurized and the valve assembly 278 releases pressurized air through the fourth port (e.g., release port) 288. That is, when the second solenoid valve 272 is energized (i.e., on) and the first solenoid valve 270 is not energized (i.e., off), the valve assembly 278 is in the released state.

[0047] When the valve assembly 278 is in the released state, interruption of power to the second solenoid valve 272 does not interrupt the released state of the valve assembly 278. For example, a loss of power to the solenoid valve array 268 interrupts power to both the first solenoid valve 270 and the second solenoid valve 272, thereby preserving the state of the valve assembly 278 prior to the loss of power (i.e., the released state). Thus, the valve assembly 278 continues to release pressurized air through the release port 288, keeping the edge ring 220 released during a system restart or other power outage.

[0048] 3 is a table 300 illustrating the respective states of the first solenoid valve 270, the second solenoid valve 272, and the valve assembly 278 of the clamping system 232 during clamping and release operations in accordance with the present disclosure. In the clamped state, the edge ring 220 is clamped to the base plate 208. Thus, the first solenoid valve 270 is ON (i.e., power is supplied or energized to open the first solenoid valve 270), the second solenoid valve 272 is OFF (i.e., not receiving power), and the valve assembly 278 is in the clamped state. In a power failure condition, which occurs during clamping, both the first solenoid valve 270 and the second solenoid valve 272 are OFF (i.e., not receiving power). However, the valve assembly 278 maintains the clamped state and continues to supply pressurized air from the compressed air source 260 to the actuator 236.

[0049] In the released state, the first solenoid valve 270 is OFF, the second solenoid valve 272 is ON, and the valve assembly 278 is in the released state. The valve assembly 278 is therefore configured to release pressurized air through the release port 288. In the event of a power failure occurring during release, both the first solenoid valve 270 and the second solenoid valve 272 are OFF (i.e., no power is applied). However, the valve assembly 278 remains in the released state.

[0050] The foregoing description is merely exemplary in nature and is not intended to limit the disclosure, its application, or uses. The broad teachings of the present disclosure can be embodied in a variety of forms. Accordingly, while the present disclosure includes specific examples, the true scope of the present disclosure should not be so limited, as other modifications will become apparent upon review of the drawings, the specification, and the following claims. It should be understood that one or more steps within a method may be performed in a different order (or simultaneously) without altering the principles of the present disclosure. Furthermore, although each embodiment is described above as having specific features, any one or more of those features described with respect to any embodiment of the present disclosure can be implemented in and / or combined with the features of any other embodiment, even if that combination is not explicitly stated. In other words, the described embodiments are not mutually exclusive, and substituting one or more embodiments for one another remains within the scope of the present disclosure.

[0051] Spatial and functional relationships between elements (e.g., between modules, circuit elements, semiconductor layers, etc.) are described using various terms, such as "connected," "engaged," "coupled," "adjacent," "next to," "on top of," "above," "below," and "disposed." When a relationship between a first element and a second element is described in the above disclosure, unless expressly specified as "direct," the relationship can be a direct relationship where no other intervening elements exist between the first and second elements, but can also be an indirect relationship where one or more intervening elements (spatial or functional) exist between the first and second elements. As used herein, the phrase "at least one of A, B, and C" should be interpreted as meaning the logic (A OR B OR C) using a non-exclusive logical OR, and not as meaning "at least one of A, at least one of B, and at least one of C."

[0052] In some embodiments, the controller is part of a system, which may be part of the examples described above. Such systems may include semiconductor processing equipment, such as one or more processing tools, one or more chambers, one or more processing platforms, and / or specific processing components (wafer pedestals, gas flow systems, etc.). These systems may be integrated with electronics for controlling the operation of the system before, during, and after processing of a semiconductor wafer or substrate. The electronics, sometimes referred to as a "controller," may control various components or subparts of one or more systems. Depending on the processing requirements and / or type of system, the controller may be programmed to control any of the processes disclosed herein, such as supply of process gases, temperature settings (e.g., heating and / or cooling), pressure settings, vacuum settings, power settings, radio frequency (RF) generator settings, RF matching circuit settings, frequency settings, flow rate settings, fluid supply settings, position and motion settings, wafer transfer in and out of the tool, and wafer transfer in and out of other transfer tools and / or load locks connected or interfaced to the particular system.

[0053] Broadly, a controller may be defined as an electronic device having various integrated circuits, logic, memory, and / or software that receives instructions, issues instructions, controls operations, enables cleaning operations, enables endpoint measurements, etc. Integrated circuits may include chips in the form of firmware that store program instructions, digital signal processors (DSPs), chips defined as application-specific integrated circuits (ASICs), and / or one or more microprocessors or microcontrollers that execute program instructions (e.g., software). Program instructions may be instructions communicated to the controller in the form of various individual settings (or program files) that define operational parameters for performing a particular process on or for a semiconductor wafer or for a system. The operational parameters, in some embodiments, may be part of a recipe defined by a process engineer to accomplish one or more processing steps during the fabrication of one or more layers, materials, metals, oxides, silicon, silicon dioxide, surfaces, circuits, and / or dies of a wafer.

[0054] The controller, in some embodiments, may be part of or coupled to a computer that is integrated with, coupled to, or otherwise networked to the system, or a combination thereof. For example, the controller may be in the “cloud” or may be all or part of a fab host computer system, thereby enabling remote access of wafer processing. The computer may enable remote access to the system to monitor the current progress of a fabrication operation, examine the history of past fabrication operations, examine trends or performance indicators from multiple fabrication operations, modify parameters of a current process, configure processing steps following a current process, or initiate a new process. In some examples, a remote computer (e.g., a server) can provide process recipes to the system over a network, which may include a local network or the Internet. The remote computer may include a user interface that allows for entry or programming of parameters and / or settings. These parameters and / or settings are then communicated from the remote computer to the system. In some examples, the controller receives instructions in the form of data, which specifies parameters for each processing step performed during one or more operations. It should be understood that the parameters may be specific to the type of process being performed and the type of tool the controller is configured to interface with or control. Thus, as noted above, the controller may be distributed, such as by having one or more separate controllers networked together and operating toward a common purpose, such as the processes and controls described herein. An example of a distributed controller for such purposes would be one or more integrated circuits on the chamber that communicate with one or more remotely located integrated circuits (e.g., at the platform level or as part of a remote computer) that combine to control the process on the chamber.

[0055] Exemplary systems may include, but are not limited to, a plasma etch chamber or module, a deposition chamber or module, a spin rinse chamber or module, a metal plating chamber or module, a cleaning chamber or module, a bevel edge etch chamber or module, a physical vapor deposition (PVD) chamber or module, a chemical vapor deposition (CVD) chamber or module, an atomic layer deposition (ALD) chamber or module, an atomic layer etch (ALE) chamber or module, an ion implantation chamber or module, a tracking chamber or module, and any other semiconductor processing system related to or usable for the fabrication and / or manufacturing of semiconductor wafers.

[0056] As described above, depending on the process step or steps being performed by the tool, the controller may communicate with one or more of other tool circuits or modules, other tool components, cluster tools, other tool interfaces, adjacent tools, nearby tools, tools located throughout the factory, a main computer, another controller, or tools used in material transport to and from tool locations and / or load ports of wafers within a semiconductor fabrication factory.

Claims

1. 1. A clamping system for a substrate support, said clamping system comprising: a clamping assembly configured to clamp an edge ring to a base plate of the substrate support; a valve control assembly coupled to a compressed air source; a valve assembly coupled between the valve control assembly and the clamp assembly; Equipped with (i) the valve assembly is coupled to the compressed air source and the valve control assembly; (ii) the valve assembly receives compressed air as input separately from the compressed air source and the valve control assembly; the valve assembly is configured to selectively supply pressurized air from the compressed air source to the clamping assembly in response to the input received from the valve control assembly to clamp the edge ring to the base plate.

2. 10. The clamping system of claim 1, The valve assembly includes a clamp supply port coupled to the compressed air source, a clamp control port coupled to the valve control assembly, a release control port coupled to the valve control assembly, and a discharge port.

3. 3. The clamping system of claim 2, 1. A clamping system, comprising: (i) the valve assembly having a clamped state and a released state; (ii) the valve assembly is configured to supply pressurized air from the compressed air source to the clamping assembly when in the clamped state; and (iii) the valve assembly is configured to release pressurized air through the release port when in the released state.

4. 4. The clamping system of claim 3, 1. A clamping system, wherein: (i) the valve assembly is configured to transition to the clamped state in response to receiving pressurized air from the valve control assembly at the clamp control port; and (ii) the valve assembly is configured to transition to the clamped state in response to receiving pressurized air from the valve control assembly at the release control port.

5. 5. The clamping system of claim 4, the valve control assembly includes: (i) a first solenoid valve coupled between the compressed air source and the clamp control port; and (ii) a second solenoid valve coupled between the compressed air source and the release control port.

6. 6. The clamping system of claim 5, (i) the first solenoid valve is energized and the second solenoid valve is not energized to transition the valve assembly to the clamped state; and (ii) the second solenoid valve is energized and the first solenoid valve is not energized to transition the valve assembly to the released state.

7. 7. The clamping system of claim 6, A clamping system wherein, when the valve assembly is in the clamped state, loss of power to the first solenoid valve and the second solenoid valve does not cause the valve assembly to transition from the clamped state.

8. 8. The clamping system of claim 7, A clamping system wherein, when the valve assembly is in the released state, loss of power to the first solenoid valve and the second solenoid valve does not cause the valve assembly to transition from the released state.

9. 10. The clamping system of claim 1, The clamping system, wherein the valve assembly is an air control valve.

10. 10. The clamping system of claim 1, The clamping assembly includes a plurality of clamping mechanisms mechanically coupled to a support ring of the substrate support, and the edge ring is attached to the support ring.

11. 11. The clamping system of claim 10, The clamping system, wherein the plurality of clamping mechanisms comprises a plurality of actuators configured to actuate respective rods coupled to the support ring.

12. 12. The clamping system of claim 11, The actuator is configured to pull down on the rod when the clamp assembly receives pressurized air from the valve assembly.

13. 1. A clamping system configured to clamp an edge ring to a base plate of a substrate support, the clamping system comprising: a plurality of clamping mechanisms configured to pull the edge ring downward to clamp the edge ring to the base plate; 1. A valve assembly comprising: (i) separately receiving pressurized air from a compressed air source at a first port and (ii) pressurized air from a valve control assembly at second and third ports; a valve assembly configured to transition between a clamped state and a released state in response to the pressurized air received at the second and third ports; Equipped with the valve assembly is configured to supply pressurized air to the plurality of clamping mechanisms when in the clamped state, and the valve assembly is configured to release pressurized air through a fourth port when in the released state.

14. 14. The clamping system of claim 13, The clamping system, wherein the valve assembly is an air control valve.

15. 14. The clamping system of claim 13, The clamping system further comprising the valve control assembly, the valve control assembly comprising an array of solenoid valves.

16. 16. The clamping system of claim 15, the array of electromagnetic valves includes: (i) a first electromagnetic valve coupled between the compressed air source and the second port; and (ii) a second electromagnetic valve coupled between the compressed air source and the third port.

17. 17. The clamping system of claim 16, (i) the first solenoid valve is configured to supply pressurized air from the compressed air source to the second port in response to receiving power from a power source, and (ii) the second solenoid valve is configured to supply pressurized air from the compressed air source to the third port in response to receiving power from the power source.

18. 18. The clamping system of claim 17, wherein the valve assembly is configured to supply pressurized air received at the first port from the compressed air source to a plurality of clamping mechanisms when in the clamped state, regardless of whether the first solenoid valve receives power from the power source.

19. 20. The clamping system of claim 18, wherein the valve assembly is configured to release pressurized air through the fourth port when in the released state regardless of whether the second solenoid valve receives power from the power source.

20. 1. A clamping system configured to clamp an edge ring to a base plate of a substrate support, the clamping system comprising: a plurality of actuators that pull down respective rods to clamp the edge ring to the base plate; a first solenoid valve coupled between a source of compressed air and the plurality of actuators; a second solenoid valve coupled between the compressed air source and the plurality of actuators; an air control valve coupled between (i) the compressed air source and the plurality of actuators, and (ii) between the first and second solenoid valves and the plurality of actuators; a first port for receiving pressurized air from the compressed air source separate from the first and second solenoid valves; a second port for receiving pressurized air from the first solenoid valve; a third port receiving pressurized air from the second solenoid valve; an air control valve including A clamping system comprising:

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