Evaporation mask for OLED pixel deposition

Abstract

An evaporation mask according to an embodiment includes a metal plate having an evaporation region and a non-evaporation region, the evaporation region includes at least one effective region and an ineffective region, the effective region includes a plurality of through holes, the through holes including a small-area hole formed on a first surface of the metal plate, a large-area hole formed on a second surface of the metal plate, and a communication portion connecting the small-area hole and the large-area hole, and the ineffective region includes a plurality of grooves.

Description

[Technical Field]

[0001] The example relates to a deposition mask for OLED pixel deposition. [Background technology]

[0002] Display devices are applied to a variety of devices. For example, the display devices are applied to small devices such as smartphones or tablet PCs. Alternatively, the display devices are applied to large devices such as TVs, monitors, and public displays (PDs). Recently, there has been an increasing demand for ultra-high resolution (UHD) of 500 pixels per inch (PPI) or more. As a result, display devices with high resolution are being applied to both small and large devices.

[0003] Display devices are classified into liquid crystal displays (LCDs) and organic light emitting diodes (OLEDs) depending on their driving methods.

[0004] The LCD is a display device driven by using liquid crystal, and the OLED is a display device driven by using organic materials.

[0005] OLEDs can display an infinite contrast ratio, have a response speed 1000 times faster than LCDs, and have a wide viewing angle, making them a promising display device that can replace LCDs.

[0006] The OLED includes an emitting layer. The emitting layer includes an organic material. The organic material is deposited on a substrate using a deposition mask. The deposition mask may be an open mask (OM) or a fine metal mask (FMM). A deposition pattern corresponding to the pattern formed on the deposition mask is formed on the substrate. As a result, the deposition pattern can function as a pixel.

[0007] The open mask is a thin plate that forms a deposition pattern only in specific locations when manufacturing an OLED. The open mask is used in the deposition process to form an emitting layer on a backplane after the backplane is completed during the display manufacturing process. That is, the open mask is a mask that does not block any areas within the display's operating range in order to deposit the entire surface of the display. Therefore, the open mask is used when depositing an emitting layer with a single color emitting material.

[0008] On the other hand, a fine metal mask is used to create different colors for each sub-pixel of the light-emitting layer. Therefore, the fine metal mask contains ultra-fine holes. The process using the fine metal mask requires multiple deposition steps. Therefore, the process requires precise alignment. Therefore, the process using the fine metal mask is more difficult than the process using an open mask.

[0009] When the OLED light-emitting layer is deposited using an open mask, only one color light-emitting layer is formed. Therefore, a separate color filter (C / F) is required to realize various colors. On the other hand, when the fine metal mask is used, RGB light-emitting layers can be formed. Therefore, a separate color filter is not required. In other words, the technology using the fine metal mask is difficult. However, compared to the method using an open mask, light efficiency is better because a filter that blocks light is not required.

[0010] The fine metal mask is generally manufactured using an Invar alloy metal plate containing iron (Fe) and nickel (Ni). Through holes are formed on one side and the other side of the metal plate, penetrating the one side and the other side. The through holes are formed at positions corresponding to pixel patterns. As a result, red, green, and blue organic materials pass through the through holes in the metal plate and are deposited on the substrate. As a result, pixel patterns are formed on the substrate.

[0011] The fine metal mask includes a small-area hole formed on one side of a metal plate and a large-area hole formed on the other side of the metal plate, and the small-area hole and the large-area hole are connected by a connecting portion to form the through hole.

[0012] The fine metal masks are formed in a stick shape and are fixed to a deposition substrate via a frame.

[0013] At this time, the fine metal mask is stretched in the length direction, which can cause a stress difference in the width direction of the mask due to the tensile force. This stress difference can cause the fine metal mask to warp, which reduces the deposition efficiency of the TKIDRL fine metal mask.

[0014] Therefore, a deposition mask having a new structure and a method for manufacturing the same that can solve the above problems is required. Summary of the Invention [Problem to be solved by the invention]

[0015] The embodiments provide a deposition mask for OLED pixel deposition with improved deposition efficiency. [Means for solving the problem]

[0016] An evaporation mask according to an embodiment includes a metal plate having an evaporation region and a non-evaporation region, the evaporation region includes at least one effective region and an ineffective region, the effective region includes a plurality of through holes, the through holes including a small-area hole formed on a first surface of the metal plate, a large-area hole formed on a second surface of the metal plate, and a communication portion connecting the small-area hole and the large-area hole, and the ineffective region includes a plurality of grooves. [Effects of the Invention]

[0017] The deposition mask according to the embodiment includes an effective area and an ineffective area, and a pattern is formed in the effective area and the ineffective area, and the pattern is formed of a hole or a groove.

[0018] Therefore, the stress difference generated when the deposition mask is stretched is reduced. When the deposition mask is stretched, tensile stress is generated. The stress exists as residual stress inside the deposition mask. The central region in the width direction of the deposition mask is an effective region where through holes are formed. Furthermore, through holes are not formed in the outer edge region in the width direction (the end region in the width direction of the deposition mask). Therefore, the stress difference of the deposition mask is generated mainly in the width direction of the deposition mask.

[0019] The deposition mask includes grooves formed in the non-effective area to reduce the magnitude of residual stress in the non-effective area, thereby reducing the difference in residual stress between the effective area and the non-effective area.

[0020] This makes it possible to prevent the deposition mask from warping due to the difference in residual stress.

[0021] In addition, the difference in strength between the first and second surfaces of the deposition mask is reduced. Specifically, additional grooves are formed on the ineffective areas of the first surface where the small-area holes are formed. This reduces the difference in aperture ratio between the first surface and the second surface.

[0022] Therefore, the difference in strength between the first surface and the second surface is reduced, thereby preventing the deposition mask from warping due to the difference in strength. [Brief explanation of the drawings]

[0023] [Figure 1] FIG. 1 is a diagram illustrating the combination of a deposition mask and a frame according to an embodiment. [Figure 2] FIG. 2 is a cross-sectional view of an organic vapor deposition apparatus including a vapor deposition mask according to the embodiment. [Figure 3] FIG. 3 is a diagram illustrating that a deposition pattern is formed on a deposition substrate by through-holes of a deposition mask according to an embodiment. [Figure 4] FIG. 4 is a view illustrating that the deposition mask according to the embodiment is stretched to be fixed on the mask frame. [Figure 5] FIG. 5 is a plan view of an evaporation mask according to an embodiment. [Figure 6] FIG. 6 is an enlarged view of region A in FIG. [Figure 7] FIG. 7 is an enlarged view of region A in FIG. [Figure 8] FIG. 8 is an enlarged view of region B in FIG. DETAILED DESCRIPTION OF THE INVENTION

[0024] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. It should be noted that the technical concept of the present invention is not limited to the described embodiments, but may be embodied in various forms, and the components of the embodiments may be selectively combined or substituted within the scope of the technical concept of the present invention. Furthermore, terms (including technical and scientific terms) used in the embodiments of the present invention should be interpreted as meanings that are commonly understood by those skilled in the art to which the present invention pertains, unless otherwise expressly specified. Generally used terms, such as dictionary-defined terms, should be interpreted in light of the context of the relevant technology.

[0025] Furthermore, terms used in the examples of the present invention are intended to explain the examples and are not intended to limit the present invention. In this specification, the singular form can also include the plural form unless otherwise specified, and when it is described as "A and at least one (or one or more) of B and C," it can include one or more of all possible combinations of A, B, and C.

[0026] Furthermore, in describing the components of the embodiments of the present invention, terms such as first, second, A, B, (a), (b), etc. are used to distinguish the components from other components, and the terms do not limit the essence or order of the components.

[0027] Furthermore, when a component is described as being "coupled," "coupled," or "connected" to another component, this includes both cases where the component is directly coupled or connected to the other component, and cases where other components are further "coupled," "coupled," or "connected" between the components.

[0028] Furthermore, when it is described as being formed or positioned "above or below" each component, "above or below" does not only include cases where the two components are in direct contact with each other, but also cases where one or more other components are formed or positioned between the two components.

[0029] Furthermore, when the expression "above or below" is used, it can mean not only an upward direction but also a downward direction with respect to one component.

[0030] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, deposition masks according to embodiments will be described with reference to the drawings.

[0031] The deposition mask described below is a fine metal mask (FMM) that can form an RGB pixel pattern on a deposition substrate by depositing red, green, and blue organic materials on the deposition substrate. The following description does not apply to an open mask (OM).

[0032] 1 to 3 are diagrams illustrating a process of depositing an organic material on a deposition substrate 300 using a deposition mask 100 according to an embodiment.

[0033] Fig. 1 is a diagram illustrating the combination of a deposition mask and a frame according to an embodiment, Fig. 2 is a cross-sectional view of an organic material deposition apparatus including a deposition mask according to an embodiment, and Fig. 3 is a diagram illustrating that a deposition pattern is formed on the deposition substrate through through-holes of the deposition mask.

[0034] 1 and 2, the organic material deposition apparatus includes a deposition mask 100, a mask frame 200, a deposition substrate 300, an organic material deposition container 400, and a vacuum chamber 500.

[0035] The deposition mask 100 includes a metal. For example, the deposition mask includes iron (Fe) and nickel (Ni). More specifically, the deposition mask includes an Invar alloy including iron (Fe) and nickel (Ni).

[0036] The deposition mask 100 includes a plurality of through holes TH. The through holes are arranged in an effective portion. The through holes are arranged to correspond to pixel patterns to be formed on a deposition substrate. The deposition mask 100 includes an ineffective portion other than an effective portion including a deposition region.

[0037] The mask frame 200 includes openings 205. The through-holes are disposed in areas corresponding to the openings 205. Thus, the organic material supplied from the organic material deposition chamber 400 is deposited on the deposition substrate 300. The deposition mask 100 is disposed on and fixed to the mask frame 200. For example, the deposition mask 100 is stretched with a certain tension. The deposition mask 100 is also welded and fixed to the mask frame 200.

[0038] For example, the ineffective portion of the deposition mask 100 is welded, so that the deposition mask 100 is fixed on the mask frame 200. Then, the portion of the mask frame 200 that protrudes outward is cut off and removed.

[0039] The mask frame 200 includes a metal having high rigidity, which reduces deformation of the mask frame during the welding process.

[0040] The deposition substrate 300 is a substrate used when manufacturing a display device. For example, an OLED pixel pattern is formed on the deposition substrate 300. Organic patterns of red, green, and blue are formed on the deposition substrate 300 to form pixels of the three primary colors of light. That is, an RGB pattern is formed on the deposition substrate 300.

[0041] The organic material deposition container 400 is a crucible. An organic material is placed inside the crucible. The organic material deposition container 400 moves within the vacuum chamber 500. That is, the organic material deposition container 400 moves in one direction within the vacuum chamber 500. For example, the organic material deposition container 400 moves in the width direction of the deposition mask 100 within the vacuum chamber 500.

[0042] A heat source and / or an electric current is supplied to the organic material deposition chamber 400, so that the organic material is deposited on the deposition substrate 300.

[0043] 3, the deposition mask 100 includes a metal plate 10. The metal plate includes a first surface 101 and a second surface 102. The first surface 101 and the second surface 102 are opposite surfaces to each other.

[0044] The first surface 101 includes a small-area hole V1, and the second surface 102 includes a large-area hole V2. For example, the first surface 101 and the second surface 102 are respectively formed with a plurality of small-area holes V1 and a plurality of large-area holes V2.

[0045] The deposition mask 100 also includes through holes TH, which are formed by connecting portions CA that connect the boundaries of the small-area holes V1 and the large-area holes V2.

[0046] The width of the large-area hole V2 is larger than the width of the small-area hole V1. The width of the small-area hole V1 is measured on a first surface 101 of the deposition mask 100. The width of the large-area hole V2 is measured on a second surface 102 of the deposition mask 100.

[0047] Additionally, the width of the connecting portion CA has a predetermined size. Specifically, the width of the connecting portion CA may be 15 μm to 33 μm. More specifically, the width of the connecting portion CA may be 19 μm to 33 μm. Even more specifically, the width of the connecting portion CA may be 20 μm to 27 μm. If the width of the connecting portion CA exceeds 33 μm, it becomes difficult to realize a resolution of 500 PPI or higher. Furthermore, if the width of the connecting portion CA is less than 15 μm, defects may occur during the deposition process.

[0048] The small area holes V1 face the deposition substrate 300. The small area holes V1 are disposed close to the deposition substrate 300. Therefore, the small area holes V1 have a shape corresponding to the deposition pattern DP.

[0049] The large-area hole V2 faces the organic material deposition container 400. Therefore, the organic material supplied from the organic material deposition container 400 is accommodated in a wide area by the large-area hole V2. In addition, a fine pattern can be quickly formed on the deposition substrate 300 through the small-area hole V1.

[0050] As a result, the organic material accommodated in the large-area holes V1 is deposited on the deposition substrate 300 through the small-area holes V1. As a result, one of red, green, and blue pixel patterns is formed on the deposition substrate 300. Then, the above process is repeated. As a result, all of red, green, and blue pixel patterns are formed on the deposition substrate 300.

[0051] 4, the deposition mask 100 is stretched in one direction. Specifically, when the deposition mask 100 is fixed to the mask frame 200, the deposition mask 100 is stretched in a first direction 1D. Specifically, the deposition mask 100 is stretched in the length direction.

[0052] Therefore, stress generated by tension remains inside the deposition mask 100. The deposition mask 100 includes a region where through holes are formed and a region where through holes are not formed. Therefore, the residual stress in the region where through holes are formed differs from the residual stress in the region where through holes are not formed.

[0053] Therefore, a difference in stress occurs between the region where the through-holes are formed and the region where the through-holes are not formed, and thus the deposition mask warps at the boundary region between the region where the through-holes are formed and the region where the through-holes are not formed.

[0054] Therefore, the deposition efficiency of the deposition mask is reduced.

[0055] Hereinafter, a deposition mask capable of solving the above-mentioned stress difference will be described.

[0056] FIG. 5 is a plan view of an evaporation mask 100 according to an embodiment.

[0057] Referring to FIG. 5, the deposition mask 100 includes a deposition area DA and a non-deposition area NDA.

[0058] The deposition area DA is an area for forming a deposition pattern and may be defined as an area from the first start point of a through-hole or hole to the end point in the length direction of the deposition mask 100.

[0059] The deposition area DA includes an effective area AA and a non-effective area UA. The effective area AA is an area where the through-holes TH and the island portions IS are formed. The non-effective area UA is an area where the through-holes TH and the island portions IS are not formed. The non-effective area UA is an area where the grooves G are formed. The island portions IS are areas where the metal plate 10 is not etched.

[0060] The deposition area DA includes a plurality of effective areas.

[0061] The deposition area DA includes a plurality of isolation regions IA1 and IA2. The isolation regions IA1 and IA2 are disposed between adjacent effective areas. The isolation regions IA1 and IA2 are separation regions between the effective areas. The isolation regions IA1 and IA2 can distinguish the adjacent effective areas from each other. In addition, one deposition mask 100 can support a plurality of effective areas.

[0062] The non-deposition area NDA is an area that is not involved in deposition. The non-deposition area NDA includes frame fixing areas FA1 and FA2. The frame fixing areas FA1 and FA2 are areas for fixing the deposition mask 100 to the mask frame 200. The non-deposition area NDA may also include half-etched portions HF1 and HF2 and an open portion.

[0063] The half-etched portions HF1 and HF2 can disperse stress generated when the deposition mask 100 is stretched.

[0064] In addition, the open portions can disperse stress generated when the deposition mask 100 is stretched, thereby reducing deformation of the deposition mask.

[0065] 6 and 7 are enlarged views of region A in FIG. 5. Specifically, FIGS. 6 and 7 are enlarged views of the deposition region DA. FIG. 6 is a view before through-holes and grooves are formed in the deposition region DA. FIG. 7 is a view after through-holes and grooves are formed in the deposition region DA.

[0066] Referring to FIG. 6, the deposition area DA includes an effective area AA, a non-effective area UA, and an isolated area IA.

[0067] The effective area AA is an area in which through-holes TH are formed. More specifically, a plurality of through-holes TH are formed in the effective area AA.

[0068] The effective area AA includes a first effective area AA1 and a second effective area AA2. The second effective area AA surrounds the first effective area AA1. The area of the first effective area AA1 is larger than the area of the second effective area AA.

[0069] The separation area IA is an area that separates a plurality of effective areas AA. Adjacent effective areas AA are separated by the separation area IA. More specifically, adjacent effective areas AA in the first direction 1D are separated by the separation area IA. More specifically, adjacent effective areas AA in the length direction of the deposition mask 100 are separated by the separation area IA.

[0070] The non-effective area UA is an area where the through-holes TH are not formed. The non-effective area UA is disposed above and below the effective area AA. The deposition mask 100 includes a first end E1 and a second end E2 in the second direction 2D. The first end E1 and the second end E2 face each other in the width direction of the deposition mask 100.

[0071] The non-effective area UA is disposed between at least one of the effective area AA and the first end E1 and the effective area AA and the second end E2.

[0072] The effective area AA and the non-effective area UA have different widths. Specifically, the effective area AA has a width W1 in the second direction that is different from the width W2 in the second direction of the non-effective area UA.

[0073] Specifically, the width W1 of the effective area AA is larger than the width W2 of the non-effective area UA. For example, the width W1 of the effective area AA may be greater than or equal to 90% and less than 100% of the width of the metal plate 100. Specifically, the width W1 of the effective area AA may be greater than or equal to 93% and less than 100% of the width of the metal plate 100. Specifically, the width W1 of the effective area AA may be greater than or equal to 95% and less than 98% of the width of the metal plate 100.

[0074] Furthermore, the width W2 of the non-effective area UA may be greater than 0% to less than 10% of the width of the metal plate 100. More specifically, the width W2 of the non-effective area UA may be greater than 0% to 5% of the width of the metal plate 100. More specifically, the width W2 of the non-effective area UA may be greater than 0% to 3% of the width of the metal plate 100.

[0075] Since the widths of the effective area AA and the non-effective area UA are set within the above ranges, the intervals and sizes of the through-holes formed within the effective area AA are set within a range set according to deposition efficiency. In addition, the non-effective area UA can prevent the size of the deposition mask from increasing. In addition, the stress difference caused by the non-effective area UA can be reduced.

[0076] 7, a plurality of through holes are formed in the effective area AA. Specifically, a first through hole TH1 is formed in the first effective area AA1. A deposition pattern can be deposited on the deposition substrate 300 through the first through hole TH1.

[0077] A second through hole TH2 is formed in the second effective area AA2. The second through hole TH2 has the same or similar shape as the first through hole TH1 and the same or similar size as the first through hole TH1.

[0078] The organic material may flow into the second through-holes TH2, but the organic material flowing into the second through-holes TH2 is not deposited on the deposition substrate 300.

[0079] The second through holes TH2 can prevent defective etching of the first through holes TH1. Specifically, the second through holes TH2 make the size and / or spacing of the first through holes TH arranged in the first effective area AA1 uniform.

[0080] In the separated area IA, the surface of the metal plate is exposed. No through-holes or grooves are formed in the separated area IA. That is, the separated area IA is an area where the first surface 1S is exposed. That is, the aperture ratio of the separated area IA is 0%.

[0081] Therefore, the deposition mask 100 can maintain its strength due to the isolation area IA.

[0082] Grooves G are formed in the non-effective area UA. More specifically, a plurality of grooves G are formed in the non-effective area UA. The grooves G are formed by etching any one surface of the metal plate 10. More specifically, the grooves G are formed by partially etching the first surface 1S. As a result, the grooves G penetrate the first surface 1S but do not penetrate the second surface 2S.

[0083] The groove G may be formed in the same shape as at least one of the first through hole TH1 and the second through hole TH, or may be formed in a different shape from at least one of the first through hole TH1 and the second through hole TH2.

[0084] The size of the groove G may be different from the size of at least one of the first through hole TH1 and the second through hole TH. For example, the size of the groove G may be smaller than the size of at least one of the first through hole TH1 and the second through hole TH.

[0085] The pitch of the grooves G may be different from the pitch of at least one of the first through holes TH1 and the second through holes TH. For example, the pitch of the grooves G may be smaller than the pitch of at least one of the first through holes TH1 and the second through holes TH.

[0086] As a result, even if a groove is formed in the non-effective region instead of a through-hole, the stress distribution can be efficiently adjusted.

[0087] The aperture ratio of the effective area AA is different from the aperture ratio of the non-effective area UA. Specifically, the aperture ratio of the effective area AA is greater than the aperture ratio of the non-effective area UA. Here, the aperture ratio of the effective area AA is defined by the aperture ratio of the small area holes V1 formed on the first surface 1S. Furthermore, the aperture ratio of the non-effective area UA is defined by the aperture ratio of the grooves G formed on the first surface 1S.

[0088] The aperture ratio of the effective area AA may be five times or more the aperture ratio of the non-effective area UA. More specifically, the aperture ratio of the effective area AA may be seven times or more the aperture ratio of the non-effective area UA. More specifically, the aperture ratio of the effective area AA may be ten times or more the aperture ratio of the non-effective area UA. More specifically, the aperture ratio of the effective area AA may be five to fifteen times the aperture ratio of the non-effective area UA.

[0089] Alternatively, the aperture ratio of the effective area AA may be 20% or more of the area of the vapor deposition area DA of the metal plate. More specifically, the aperture ratio of the effective area AA may be 25% or more of the area of the vapor deposition area DA of the metal plate. More specifically, the aperture ratio of the effective area AA may be 20% to 40% of the area of the vapor deposition area DA of the metal plate.

[0090] Alternatively, the aperture ratio of the non-effective area UA may be 10% or less of the area of the vapor deposition area DA of the metal plate. More specifically, the aperture ratio of the non-effective area UA may be 5% or less of the area of the vapor deposition area DA of the metal plate. More specifically, the aperture ratio of the non-effective area UA may be 2% to 4% of the area of the vapor deposition area DA of the metal plate.

[0091] Since the aperture ratios of the effective area AA and the non-effective area UA are set within the above ranges, the organic material can be stably deposited on the deposition substrate 300 by the effective area AA.

[0092] Moreover, warping of the non-effective area UA can be prevented.

[0093] The deposition mask includes holes or grooves formed in the effective area AA and the non-effective area UA. Therefore, the difference in stress generated when the deposition mask 100 is stretched is reduced. That is, when the deposition mask 100 is stretched, tensile stress is generated. The stress exists as residual stress in the deposition mask.

[0094] The deposition mask 100 includes grooves formed in the non-effective area UA, which reduces the magnitude of residual stress in the non-effective area, thereby reducing the difference in residual stress between the effective area AA and the non-effective area UA.

[0095] This makes it possible to prevent the deposition mask from warping due to a difference in residual stress.

[0096] In addition, the difference in strength between the first and second surfaces of the deposition mask is reduced. Specifically, additional grooves are formed on the ineffective areas of the first surface where the small-area holes are formed. This reduces the difference in aperture ratio between the first surface and the second surface.

[0097] Therefore, the difference in strength between the first surface and the second surface is reduced, thereby preventing the deposition mask from warping due to the difference in strength.

[0098] FIG. 8 is a diagram for explaining the sizes and intervals of the through-holes TH1 and TH2 and the grooves G of the deposition mask according to the embodiment.

[0099] 8, the pitch P1 of the through holes TH1 and TH2 may be 50 μm to 200 μm, the width W1 of the through holes TH1 and TH2 may be 10 μm to 200 μm, and the height H1 of the through holes TH1 and TH2 may be 10 μm to 200 μm.

[0100] Furthermore, the pitch P2 of the grooves G may be less than 50% of the pitch P1 of the through holes TH1 and TH2. Furthermore, the width W2 of the grooves G may be less than 50% of the width W1 of the through holes TH1 and TH2. Furthermore, the height H2 of the grooves G may be less than 50% of the height H1 of the through holes TH1 and TH2.

[0101] Furthermore, a distance D between the through holes TH1, TH2 and the grooves G may be 50% or more of a pitch P1 between the through holes TH1, TH2. The distance D between the through holes TH1, TH2 and the grooves G may be the distance in the longitudinal direction of the deposition mask 100.

[0102] The through holes TH1 and TH2 and the grooves G are formed to have a predetermined size and interval. Therefore, the deposition efficiency of the deposition mask can be improved by the through holes. In addition, the grooves can prevent the deposition mask from warping.

[0103] The features, structures, effects, etc. described in the above embodiments are included in at least one embodiment of the present invention and are not necessarily limited to one embodiment. Furthermore, the features, structures, effects, etc. exemplified in each embodiment can be combined or modified in other embodiments by a person skilled in the art to which the embodiment belongs. Therefore, the contents related to such combinations and modifications should be interpreted as being included in the scope of the present invention.

[0104] Furthermore, although the above description has focused on the embodiments, these are merely examples and are not intended to limit the present invention. A person skilled in the art to which the present invention pertains may make various modifications and applications not exemplified above within the scope of the essential characteristics of the present invention. For example, each component specifically presented in the embodiments may be modified and implemented. Differences related to such modifications and applications should be construed as being included within the scope of the present invention as defined by the appended claims.

Claims

1. a metal plate including a vapor-deposited area and a non-vapor-deposited area; the deposition area includes at least one active area and an inactive area; the effective area includes a plurality of through holes; the through-hole includes a small-area hole formed on a first surface of the metal plate, a large-area hole formed on a second surface of the metal plate, and a communication portion that communicates the small-area hole with the large-area hole, The non-effective area includes a plurality of grooves.

2. the metal plate includes a first end and a second end that are opposed to each other in a width direction of the metal plate; The deposition mask according to claim 1 , wherein the non-effective area is disposed between at least one of the effective area and the first end and the effective area and the second end.

3. the effective area includes a first effective area and a second effective area arranged to surround the first effective area, a first through hole is disposed in the first effective area; The deposition mask according to claim 2 , wherein a second through-hole is disposed in the second effective area.

4. The deposition mask of claim 3 , wherein the groove has a size smaller than a size of at least one of the first through hole and the second through hole.

5. The deposition mask of claim 3 , wherein a pitch of the grooves is smaller than a pitch of at least one of the first through holes and the second through holes.

6. The deposition mask of claim 1 , wherein the width of the non-effective region in the width direction of the metal plate is greater than 0% to 10% of the width of the metal plate.

7. 2. The deposition mask according to claim 1, wherein the aperture ratio of the effective region is 5 to 15 times the aperture ratio of the non-effective region.

8. 2. The deposition mask according to claim 1, wherein an opening ratio of the non-effective region is 2% to 4% of an area of the deposition region of the metal plate.

9. The deposition mask according to claim 1 , wherein the groove is formed in the first surface.

10. the effective area includes a plurality of effective areas spaced apart in a longitudinal direction of the metal plate, A separation region is disposed between adjacent effective regions in the length direction of the metal plate, The evaporation mask according to claim 1 , wherein the first surface of the metal plate is exposed in the isolation region.

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