Multi-size wafer handling frame

Abstract

[0003] Embodiments of the present disclosure herein include apparatus and methods for processing substrates. More specifically, embodiments of the present disclosure provide a substrate inversion apparatus including a gripping actuator and a substrate clamping assembly. The substrate clamping assembly includes an upper structure coupled to the gripping actuator, a lower structure coupled to the gripping actuator, and multiple sets of gripping pads attached to the upper structure and the lower structure, each set of gripping pads configured to clamp substrates of different sizes.

Description

[Technical Field]

[0001] TECHNICAL FIELD

[0001] Embodiments of the present disclosure relate to an inversion device in a manufacturing system (such as a semiconductor substrate processing system), and more particularly to a substrate inversion device in a manufacturing system. [Background technology]

[0002] 2. Description of Related Art In electronic processing systems, such as semiconductor processing systems, objects such as substrates are processed. In some systems, both the top and bottom surfaces of the object are processed. In semiconductor processing systems, the substrate is transported by a robotic arm and placed into a processing chamber where the top surface of the substrate is processed. To process the bottom surface of the substrate, the substrate must be removed from the processing chamber, inverted so that the bottom surface of the substrate is facing up, and replaced into the processing chamber for processing.

[0003]

[0003] Some conventional systems have stand-alone devices for rotating and / or flipping substrates. These conventional stand-alone devices are large and either unavailable in many semiconductor processing systems, or the semiconductor processing system must be configured to accommodate the large stand-alone devices. Furthermore, conventional stand-alone devices typically only accommodate substrates of one size, making them impractical for many semiconductor processing systems. Additionally, conventional systems use increasingly complex electronic controls to provide substrate rotation and / or flipping in a wide range of orientations (e.g., vertical, horizontal, and many intervening oblique orientations). In some conventional systems, substrate (e.g., ultra-thin wafers and substrates) breakage has become a problem.

[0004] There is a need in the art for a substrate inversion device that can accommodate multiple substrate sizes without breaking. Summary of the Invention

[0005] The present disclosure generally includes a substrate inverting apparatus comprising a gripping actuator and a substrate clamping assembly comprising an upper structure coupled to the gripping actuator, a lower structure coupled to the gripping actuator, and multiple sets of gripping pads attached to the upper and lower structures, each set of gripping pads configured to clamp a different size substrate.

[0006]

[0006] Embodiments of the present disclosure may further provide a substrate inverting apparatus including a gripping actuator and a substrate clamping assembly, the substrate clamping assembly including: an upper structure coupled to the gripping actuator and including a first upper section and a second upper section; a lower structure coupled to the gripping actuator and including a first lower section and a second lower section; two first gripping pads attached to opposite ends of the first upper section and the first lower section; one first gripping pad attached to opposite ends of the second upper section and the second lower section; and one second gripping pad located at each end of the body of the first upper section, the second upper section, the first lower section, and the second lower section, each second gripping pad positioned radially inward of a respective first gripping pad.

[0007]

[0007] Embodiments of the present disclosure may further provide a substrate processing system including a transfer chamber, a factory interface disposed between the transfer chamber and a plurality of enclosure systems, and a substrate inverter disposed in, on, or within the factory interface and configured to secure substrates of different sizes. The substrate inverter includes a gripping actuator and a substrate clamping assembly. The substrate clamping assembly includes an upper structure coupled to the gripping actuator, a lower structure coupled to the gripping actuator, and multiple sets of gripping pads attached to the upper structure and the lower structure, each set of gripping pads configured to secure substrates of different sizes.

[0008]

[0008] So that the above-mentioned features of the present disclosure may be understood in detail, a more particular description of the present disclosure briefly summarized above will be had by reference to embodiments, some of which are illustrated in the accompanying drawings. It should be noted, however, that the accompanying drawings illustrate only exemplary embodiments and therefore should not be considered as limiting the scope of the present disclosure, which may admit of other equally effective embodiments. [Brief explanation of the drawings]

[0009] [Figure 1] According to certain embodiments, there is provided a processing system. [Figure 2A]

[0010] 1 is a substrate inversion assembly according to certain embodiments. [Figure 2B] 1 is a substrate inversion assembly according to certain embodiments. [Figure 2C] 1 is a substrate inversion assembly according to certain embodiments. [Figure 2D] 1 is a substrate inversion assembly according to certain embodiments. [Figure 2E] 1 is a substrate inversion assembly according to certain embodiments. [Figure 2F] 1 is a substrate inversion assembly according to certain embodiments. [Figure 2G] 1 is a substrate inversion assembly according to certain embodiments. [Figure 2H] 1 is a substrate inversion assembly according to certain embodiments. [Figure 3A]

[0011] 1 is a substrate inversion apparatus according to certain embodiments; [Figure 3B] 1 is a substrate inversion apparatus according to certain embodiments; [Figure 4]

[0012] 1 is a method of using a substrate inversion device, according to certain embodiments. DETAILED DESCRIPTION OF THE INVENTION

[0010]

[0013] For ease of understanding, wherever possible, like reference numerals have been used to designate like elements common to the figures. It is envisioned that elements and features of one embodiment may be beneficially incorporated in other embodiments without further recitation.

[0011]

[0014] For ease of understanding, wherever possible, like reference numerals have been used to designate like elements common to the figures. It is envisioned that elements and features of one embodiment may be beneficially incorporated in other embodiments without further recitation.

[0012]

[0015] The apparatus, system, and method disclosed herein provide a substrate flipping device. The substrate flipping device includes a substrate clamping assembly including multiple sets of substrate gripping pads for clamping substrates of different sizes. The substrate flipping device can be expanded to any number of sizes to clamp different substrates of any size. Different sets of gripping pads are configured to clamp substrates of different sizes. In one example, a first set of gripping pads includes a first gripping pad used to clamp substrates of a first size, and a second set of gripping pads includes a second gripping pad used to clamp substrates of a second size. In embodiments described herein, the substrates can have different material compositions. The first gripping pads are configured to clamp substrates of a larger size than the second gripping pads. The first gripping pads are taller than the second gripping pads. The first gripping pads are arranged in a "tooth-like" configuration to interlock to clamp substrates of the first size. The second gripping pads are aligned to interlock to clamp substrates of the second size while the first gripping pads slide between each other. As explained above, the substrate inverter may also include additional sets of gripping pads for securing additional substrates of different sizes.

[0013]

[0016] FIG. 1 illustrates a processing system 100 (e.g., a wafer processing system, a substrate processing system, a semiconductor processing system) in accordance with certain embodiments. The processing system 100 includes a factory interface 101 and an enclosure system 130. The enclosure system 130 (e.g., a cassette, a front-opening unified pod (FOUP), a process kit enclosure system, etc.) is configured to transport wafers and / or other substrates into and out of the processing system 100. In some embodiments, one or more of the enclosure systems 130 includes (e.g., fully encloses, at least partially encloses) a substrate inversion device 105. In some embodiments, as shown, the substrate inversion device 105 is located in or attached to the factory interface 101. Alternatively or additionally, the substrate inversion device 105 is located in or attached to a transfer chamber 106 (as shown). In some embodiments, the enclosure system 130 is a system with shelves for aligning the carriers and / or process kit rings.

[0014]

[0017] In some embodiments, the enclosure system 130 (e.g., a process kit enclosure system) contains one or more items of contents (e.g., one or more of process kit rings, empty process kit ring carriers, process kit rings positioned on process kit ring carriers, placement verification wafers, substrates, etc.) In some examples, the enclosure system 130 is coupled to the factory interface 101 to enable automated transfer of process kit rings on the process kit ring carriers into the processing system 100 for replacement of used process kit rings.

[0015]

[0018] In some embodiments, the processing chamber 108 is an etch chamber, a chamber for deposition (including atomic layer deposition, chemical vapor deposition, physical vapor deposition, or plasma-enhanced versions thereof), an anneal chamber, or the like.

[0016]

[0019] The factory interface 101 includes a factory interface robot 112. The factory interface robot 112 includes a robot arm, such as a Selective Compliance Assembly Robot Arm (SCARA) robot. Examples of SCARA robots include a two-link SCARA robot, a three-link SCARA robot, a four-link SCARA robot, etc. The factory interface robot 112 includes an end effector at the end of the robot arm. The end effector is configured to pick up and handle specific objects (e.g., wafers). Alternatively or additionally, the end effector is configured to handle objects such as carriers and / or process kit rings (edge rings). The robot arm has one or more links or members (e.g., wrist members, upper arm members, forearm members, etc.) configured to move the end effector in different orientations to different locations. The factory interface robot 112 is configured to transfer objects between the enclosure system 130 (e.g., cassettes, FOUPs) and the transfer chamber 106.

[0017]

[0020] The transfer chamber 106 includes a chamber robot 110. The chamber robot 110 includes a robot arm having an end effector at its end. The end effector is configured to handle a particular object (such as a wafer). In some embodiments, the chamber robot 110 is a SCARA robot, although the SCARA robot has fewer links and / or degrees of freedom than the factory interface robot 112 in some embodiments.

[0018]

[0021] Controller 102 controls various aspects of processing system 100. In some embodiments, controller 102 includes one or more controllers. Controller 102 is and / or includes a computing device such as a personal computer, a server computer, a programmable logic controller (PLC), a microcontroller, etc. Controller 102 includes one or more processing devices, which in some embodiments are general-purpose processing devices (e.g., microprocessors, central processing units, etc.). More specifically, in some embodiments, the processing devices are complex instruction set computing (CISC) microprocessors, reduced instruction set computing (RISC) microprocessors, very long instruction word (VLIW) microprocessors, or processors implementing other instruction sets or combinations of instruction sets. In some embodiments, the processing devices are one or more special-purpose processing devices such as application-specific integrated circuits (ASICs), field-programmable gate arrays (FPGAs), digital signal processors (DSPs), network processors, etc. In some embodiments, the controller 102 includes a data storage device (e.g., one or more disk drives and / or solid state drives), a main memory, a static memory, a network interface, and / or other components. In some embodiments, the controller 102 executes instructions to perform any one or more of the methods or processes described herein. The instructions are stored on a computer-readable storage medium, which may include one or more of a main memory, a static memory, a secondary storage device, and / or a processing device (in executing the instructions). The controller 102, in some embodiments, receives signals from and sends controls to the factory interface robot 112 and the chamber robot 110.

[0019]

[0022] According to one aspect of the present disclosure, contents are removed from the enclosure systems 130 by a factory interface robot 112 located within the factory interface 101. A chamber robot 110 located within the transfer chamber 106 removes the contents from one of the enclosure systems 130. The chamber robot 110 moves the contents to the transfer chamber 106. From the transfer chamber 106, the chamber robot moves the contents to the processing chamber 108. Although not shown in FIG. 1 for clarity, content transfers include transferring process kit rings positioned on process kit ring carriers, transferring substrates positioned on substrate carriers, transferring wafers for placement verification, etc. In some embodiments, the substrate may be removed from the substrate carrier, and then the substrate flipper 105 may flip the substrate. The substrate may then be placed back onto the substrate carrier.

[0020]

[0023] In some embodiments, it is contemplated that the enclosure system 130 is coupled to the transfer chamber 106 via a load port attached to the transfer chamber 106. The contents are transferred from the enclosure system 130 to the transfer chamber 106 by the chamber robot 110. The chamber robot 110 may then transfer the contents to the processing chamber 108. Furthermore, in some embodiments, the contents are loaded onto a substrate support pedestal (SSP). In some embodiments, an additional SSP is positioned opposite the illustrated SSP and in communication with the factory interface 101. Processed contents (e.g., used process kit rings) are removed from the processing system 100 in the reverse flow of any of the methods described herein. When multiple enclosure systems 130 or a combination of enclosure systems 130 and SSPs are utilized, in some embodiments, one SSP or enclosure system 130 is used for unprocessed contents (e.g., new process kit rings), while another SSP or enclosure system 130 is used to receive processed contents (e.g., used process kit rings).

[0021]

[0024] The processing system 100 includes chambers, such as a factory interface 101 (e.g., an equipment front-end module (EFEM)), a transfer chamber 106, and neighboring chambers (e.g., enclosure system 130, etc.) adjacent to the factory interface 101 and / or the transfer chamber 106. Typically, the transfer chamber 106 is sealed. In some embodiments, an inert gas (e.g., one or more of nitrogen, argon, neon, helium, krypton, or xenon) is provided within one or more of the chambers (e.g., the factory interface 101 or the transfer chamber 106) to provide one or more inert environments. In some examples, the factory interface 101 is an inert EFEM that maintains an inert environment (e.g., an inert EFEM mini-environment) within the factory interface 101, so that a user does not need to enter the factory interface 101 (e.g., the processing system 100 is configured to prevent manual access within the factory interface 101).

[0022]

[0025] In some embodiments, gas flows (e.g., to provide an inert gas, to provide nitrogen, to exhaust gas to provide a vacuum environment, etc.) are provided into and / or out of one or more chambers of the processing system 100 (e.g., the factory interface 101, or the transfer chamber 106).

[0023]

[0026] In some embodiments, the gas flow exceeds the leakage through one or more chambers to maintain a positive pressure in the one or more chambers, hi some embodiments, the exhaust gas flow exceeds the leakage through one or more chambers to maintain a negative pressure in the one or more chambers.

[0024]

[0027] In some embodiments, the inert gas in the factory interface 101 is recirculated. In some embodiments, a portion of the inert gas is exhausted. In some embodiments, the flow of gas that is not recirculated into one or more chambers exceeds the flow of gas that is exhausted and gas leakage so as to maintain a positive pressure of inert gas in one or more chambers. In some embodiments, the flow of gas that is exhausted from one or more chambers exceeds the gas leakage (and, e.g., gas flow) into one or more chambers so as to maintain a negative pressure (e.g., a vacuum environment) in one or more chambers.

[0025]

[0028] In some embodiments, one or more chambers are coupled to one or more valves and / or pumps to provide a gas flow into and / or out of the one or more chambers. A processing device (e.g., controller 102) controls the gas flow into and out of the one or more chambers. In some embodiments, the processing device receives sensor data from one or more sensors (e.g., oxygen sensors, humidity sensors, motion sensors, door operation sensors, temperature sensors, pressure sensors, etc.) and determines a flow rate of inert gas into and / or out of the one or more chambers based on the sensor data.

[0026]

[0029] In some embodiments, the chamber (e.g., enclosure system 130, FOUP, etc.) housing the substrate inversion device 105 is configured to provide a gas flow into or out of the chamber. In some examples, gas is evacuated from the chamber housing the substrate inversion device 105 so as not to draw inert gas into the chamber from the factory interface 101 and contaminate the factory interface 101.

[0027]

[0030] 2A-H illustrate a substrate inversion apparatus 200 according to certain embodiments. FIG. 2A is a cross-sectional side view of the substrate inversion apparatus 200 clamping a substrate of a first size. FIG. 2B is a cross-sectional side view of the substrate inversion apparatus 200 clamping a substrate of a second size. FIG. 2C is a top view of the substrate inversion apparatus 200 clamping a substrate of a first size in a first configuration. FIG. 2D is a top view of the substrate inversion apparatus 200 clamping a substrate of a second size in a second configuration. FIG. 2E is an isometric view of a substrate clamping assembly of the substrate inversion apparatus. FIG. 2F is an enlarged cross-sectional side view of the substrate inversion apparatus 200 clamping a substrate of a first size. FIG. 2G is an isometric view of a first pad of the substrate inversion apparatus 200 configured to clamp a substrate of a first size. FIG. 2H is an isometric view of a second pad of the substrate inversion apparatus 200 configured to clamp a substrate of a second size.

[0028]

[0031] The substrate inversion apparatus 200 includes a gripping actuator 210, a rotary actuator 222, and a substrate clamping assembly 230. The substrate inversion apparatus 200 includes a base structure 250, a back structure 252, and a gripping bracket 212 (e.g., the gripping actuator 210 is at least partially disposed on the gripping bracket 212). The gripping bracket 212 may also function as an air pressure distribution block having various channels drilled into the material. In some embodiments, the air pressure manifold 222 has a pressurized gas inlet, and the gripping bracket 212 has a pressurized gas outlet. In some embodiments, one or more portions of the substrate inversion apparatus 200 (e.g., the rotary actuator 222) include a damper (e.g., a hydraulic damper (not shown)). In some embodiments, the gripping bracket 212 has one or more mechanical gaskets (e.g., one or more O-rings (not shown)) for sealing a channel (e.g., a pneumatic feedthrough (not shown), a channel (not shown) from the rotary actuator 222 through the gripping bracket 212 to the gripping actuator 210). In some embodiments, the gripping bracket 212 has one or more openings (e.g., drilled holes (not shown)) for fluidly connecting a pressurized gas outlet to one or more channels (e.g., pneumatic passages (not shown)) in the gripping bracket 212.

[0029]

[0032] The substrate clamping assembly 230 is configured to secure substrates of different sizes in place. One or more components of the substrate clamping assembly 230 may be rigid to reduce frame sagging. To prevent substrate breakage, a pressure regulator located in a control unit (not shown) of the substrate inverting device 200 may be used to adjust the gripping force of the gripping actuator 210 to prevent substrate breakage. In one embodiment, one or more components of the substrate clamping assembly 230 may be flexible (e.g., the upper bracket 234A and the lower bracket 234B may be flexible gripping brackets that flex to protect the substrate from breakage). The substrate clamping assembly 230 includes an upper portion 232A and a lower portion 232B configured to have an open position and multiple closed positions, each corresponding to securing substrates of different sizes. In one example (without limitation), the upper and lower portions 232A and 232B are configured to be in a first closed position (FIG. 2A) to secure a substrate of a first size and a second closed position (FIG. 2B) to secure a substrate of a second size. The substrate of the first size is larger than the substrate of the second size. The upper and / or lower portions 232A and 232B are actuated by the gripping actuator 210 to either of the closed positions and actuated by the gripping actuator 210 to either of the open positions. Embodiments may include four or more positions to handle three or more substrate sizes. The upper portion 232A includes an upper bracket 234A coupled to the gripping actuator 210 and an upper structure 240A attached to the upper bracket 234A.

[0030]

[0033] In some embodiments, the upper portion 232A includes a teaching feature 236A (e.g., a feature having a flat top surface, a cylindrical feature, a feature having a trapezoidal perimeter, etc.). In some embodiments, the teaching feature 236A is disposed on (e.g., attached to, integrated with) the upper bracket 234A. The teaching feature 236A enables the substrate inversion apparatus 200 to be automatically taught. In some embodiments, an end effector of a robot arm determines the location of the teaching feature 236A. In some examples, the end effector determines the location of the teaching feature 236A by severing an optical transmission path (e.g., a light beam, a beam trigger path) between a first optical path opening of the end effector (e.g., a fiber emitter coupled to a light source) and a second optical path opening of the end effector (e.g., a fiber receiver coupled to a light receiver). In response to determining the location of teaching feature 236A, the robot determines where to deposit and retrieve the substrate (e.g., on gripping pads 246 and 247). In some embodiments, teaching feature 236 is located at one or more other locations on substrate inversion device 200 (e.g., on bottom bracket 234B, etc.).

[0031]

[0034] The lower part 232B includes a lower bracket 234B connected to the gripping actuator 210 and a lower structure 240B attached to the lower bracket 234B. The lower part 232B and each of its components may be identical to the upper part 232A.

[0032]

[0035] Multiple sets of gripping pads are attached to upper structure 240A and lower structure 240B. Each set of gripping pads is configured to secure substrates of different sizes in a corresponding closed position. The number of sets of gripping pads equals the number of substrates of different sizes that can be secured. In one embodiment, a first set of first gripping pads 246 and a second set of second gripping pads 247 are attached to the structure, allowing two different sized substrates to be secured by substrate securing assembly 230.

[0033]

[0036] The first gripping pad 246 is configured to secure a first substrate 260 of a first size. The second gripping pad 247 is configured to secure a second substrate 261 of a second size (see, for example, FIG. 2B ). The first size is larger than the second size. The first gripping pad 246 is positioned at both ends of the upper structure 240A and the lower structure 240B. The second gripping pad 247 is positioned inside the first gripping pad 246. In other words, the second gripping pad 247 is closer to the center of the upper structure 240A and the lower structure 240B than the first gripping pad 246. Therefore, there is a space between the first gripping pad 246 and the second gripping pad 247 to allow for substrates of different sizes.

[0034]

[0037] Although two sets of radially arranged gripping pads are shown, it is contemplated that more than two sets of gripping pads may be radially arranged relative to one another. Each subsequent set of gripping pads positioned radially closer to the center of the structure (e.g., closer to the center of upper structure 240A and the center of lower structure 240B) is vertically shorter than gripping pads positioned radially farther from the center of the structure, accommodating smaller substrates without interference. For example, first gripping pad 246 is taller than second gripping pad 247. The closer each subsequent set of gripping pads is to the center of the structure, the smaller the size of the substrate secured by each set of gripping pads. For example, first gripping pad 246 secures a larger substrate (first substrate 260) than the substrate secured by second gripping pad 247 (second substrate 261). A third set of gripping pads positioned closer to the center of the structure than the second gripping pads 247 secures a third substrate that is vertically shorter than the second gripping pads 247 and smaller than the second substrate, and so on.

[0035]

[0038] In some embodiments, the upper structure 240A and the lower structure 240B are "x" shaped (e.g., both structures have four corners). The vertically aligned corners of the structures have an unequal number of first gripping pads 246. For example, on the first side 203 of the substrate clamp assembly 230, the upper structure 240A includes two first gripping pads 246 and the lower structure 240B includes one first gripping pad 246. The first gripping pads 246 on the upper structure 240A are horizontally spaced apart. The first gripping pad 246 on the lower structure 240B is aligned with the space between the two first gripping pads 246 on the corresponding corner of the upper structure 240A. The lower portion 232B can be oriented so that the upper surfaces of the first gripping pad 246 and the second gripping pad 247 attached to the lower structure 240B face the upper surfaces of the first gripping pad 246 and the second gripping pad 247 attached to the upper structure 240A.

[0036]

[0039] Additionally, on the second side 205 of the substrate clamping assembly 230, the upper structure 240A includes one first gripping pad 246 and the lower structure 240B includes two first gripping pads 246. The first gripping pads 246 on the lower structure 240B are horizontally spaced apart. The first gripping pads 246 on the upper structure 240A are aligned with the spaces between the two first gripping pads 246 on the vertically aligned corners of the lower structure 240B. This forms a tooth-like structure that allows the first gripping pads 246 to interlock (i.e., pass by) each other without contacting each other.

[0037]

[0040] The first gripping pad 246 is taller than the second gripping pad 247. The height difference allows the first substrate 260 to be secured in the first closed position and the second substrate 261 (see, for example, FIG. 2B) to be secured in the second closed position. The distance 208 between the upper structure 240A and the lower structure 240B is greater in the first closed position than in the second closed position.

[0038]

[0041] Rotary actuator 222 is configured to receive pressurized gas for controlling gripping actuator 210. Bracket 212 forms a channel (not shown) for providing pressurized gas from rotary actuator 222 to gripping actuator 210 (e.g., without routing pneumatic lines).

[0039]

[0042] In some embodiments, the substrate inversion apparatus 200 includes one or more speed control valves (not shown) configured to control the rotational speed of the rotary actuator 222 and minimize vibrations (e.g., reduce the likelihood of induced substrate vibrations) of the substrate inversion apparatus 200. In some embodiments, the substrate inversion apparatus 200 includes a pressure regulator (not shown) configured to adjust the system pressure (e.g., reduce the received gas pressure to a predetermined operating pressure) to control the rotational speed of the rotary actuator 222 and the gripping force of the gripping actuator 210 (e.g., both the rotary actuator 222 and the gripping actuator 210 operate under the same set pressure).

[0040]

[0043] In some embodiments, the substrate inversion device 200 includes one or more first sensors (e.g., two sensors (not shown)) coupled to the rotary actuator 222 and configured to provide first sensor data indicative of a first position of the rotary actuator 222 (e.g., an inverted position, a non-inverted position). In some embodiments, the substrate inversion device 200 includes one or more second sensors (e.g., two sensors (not shown)) coupled to the gripping actuator 210 and configured to provide second sensor data indicative of a second position of the gripping actuator 210 (e.g., a closed position, an open position, etc.). In some embodiments, the substrate inversion device 200 includes a substrate presence sensor 254 (e.g., an ultrasonic sensor, an optical sensor) configured to provide third sensor data indicative of the presence of the substrate and the state of the substrate inversion. Additionally, the substrate inversion device 200 may include at least two additional sensors (not shown) coupled to the rotary actuator 222 to indicate whether the inversion operation is complete and, if complete, whether the substrate inversion device 200 is in an inverted up or inverted down position.

[0041]

[0044] The substrate flipping device 200 is configured to receive one or more different sized substrates (e.g., 200 mm and 150 mm). In some embodiments, the substrate includes one or more of a glass wafer, a silicon wafer, etc. In some embodiments, the substrate flipping device 200 receives a substrate from a robot (e.g., an atmospheric robot blade) and flips the substrate 180 degrees (e.g., bottom side up). In some embodiments, the rotation occurs along the X or Y axis to account for robot entry and substrate placement. In some embodiments, the substrate thickness may be 0.3 mm to 2.5 mm or more. In some embodiments, the robot substrate transfer is along or perpendicular to the substrate rotation axis. In some embodiments, there are no moving parts (e.g., wires, tubes, manual adjusters, etc.) above or below the substrate plane. In some embodiments, the pneumatic actuators exhaust away from the substrate plane (e.g., under or behind a barrier in an enclosure system).

[0042]

[0045] In some embodiments, the gripping actuator 210 receives air pressure as an input and outputs gripping and opening motion (e.g., open and closed positions). The controls for the gripping actuator 210 are pressure control and exhaust flow control. In some embodiments, the rotational actuator 222 receives air pressure as an input and outputs rotational motion (e.g., reverse and non-reverse positions, 0 degree and 180 degree positions, etc.). The controls for the rotational actuator 222 are pressure, exhaust flow control, shock absorber, and end position.

[0043]

[0046] The sensor 254 (e.g., an ultrasonic sensor) receives a voltage input and outputs an on or off signal. The control of the sensor 254 is to indicate distance. The gripper may include two or more magnetic switches (not shown), such as a reed switch (e.g., in the gripping actuator 210). The number of magnetic switches is determined by the number of sets of gripping pads. The number of magnetic switches is equal to the number of possible positions of the substrate clamp assembly 230. In other words, the number of magnetic switches is equal to the number of sets of gripping pads (i.e., the number of closed positions) plus one for the open position. For example, two sets of gripping pads require three magnetic switches.

[0044]

[0047] The magnetic switches have a voltage input and on and off outputs. The magnetic switches are configured to verify that the substrate clamping assembly 230 is in the proper closed position. For example, a first magnetic switch is configured to be off when the substrate clamping assembly 230 is open and on when the substrate clamping assembly 230 is clamping a first substrate 260 to the first gripping pad 246 (i.e., the first closed position of FIG. 2A ). Similarly, the output of a second magnetic switch is configured to be off when the substrate clamping assembly 230 is open and on when the second gripping pad is clamping a second substrate 261 (i.e., the second closed position of FIG. 2B ).

[0045]

[0048] 2A , in one embodiment, substrate clamping assembly 230 is in the first closed position when first gripping pad 246 clamps first substrate 260. First substrate 260 is the largest size substrate that can be clamped by substrate inversion device 200. When clamping a maximum size substrate, the substrate clamping assembly stalls out when first substrate 260 is clamped between first gripping pads 246. Due to the unequal number of first gripping pads 246 on each vertically aligned corner of upper structure 240A and lower structure 240B, first gripping pads 246 clamp first substrate 260 without interlocking.

[0046]

[0049] 2B, second gripping pads 247 secure second substrate 261 in the second closed position. Due to this positional relationship, when substrate clamping assembly 230 moves beyond the first closed position, first gripping pads 246 interlock (pass between each other), thereby engaging and securing shorter second gripping pads 247 to second substrate 261. Second gripping pads 247 secure second substrate 261 in the second closed position. Distance 208 between upper structure 240A and lower structure 240B is smaller in the second closed position than in the first closed position. As noted above, it is envisioned that two or more pairs of gripping pads may be radially disposed relative to one another. In instances where more than one set of gripping pads is used, the gripping pads in each set, except for the gripping pads closest to the center of the structure (e.g., the gripping pads closest to the center of upper structure 240A and the center of lower structure 240B), are positioned in a tooth-like structure and configured to interlock similarly to first gripping pad 246. For example, if a third set of gripping pads is positioned closer to the center of the structure than second gripping pad 247, the second gripping pads are positioned similarly to first gripping pad 246 and configured to interlock.

[0047]

[0050] 2C-2D, in some embodiments, first substrate 260 is secured between first gripping pads 246 attached to both upper structure 240A and lower structure 240B (see, e.g., FIG. 2C). Additionally, second gripping pads 247 attached to both upper structure 240A and lower structure 240B are configured to secure second substrate 261 (see, e.g., FIG. 2D). In some examples, first substrate 260 has a diameter of 200 mm or 300 mm, and second substrate 261 has a diameter of 150 mm or 200 mm.

[0048]

[0051] 2E shows the substrate clamping assembly 230 of the substrate inversion device 200. The substrate clamping assembly 230 is configured to clamp substrates of different sizes in place. One or more components of the substrate clamping assembly 230 are flexible to protect the substrates from breaking.

[0049]

[0052] Upper structure 240A includes intersecting first and second upper sections 242A and 244A, with first and second gripping pads 246 and 247 attached to upper structure 240A. First upper section 242A of upper structure 240A has a capital "I" shape. First upper section 242A of upper structure 240A includes two first gripping pads 246 attached to opposite ends of the capital "I" shape. Second upper section 244A of upper structure 240A is linear and includes a single first gripping pad 246 at each end. Thus, adjacent corners of upper structure 240A alternate between including one and two first gripping pads 246.

[0050]

[0053] Second gripping pad 247 is positioned inward of first gripping pad 246. In other words, second gripping pad 247 is closer to the center of upper structure 240A than first gripping pad 246. First gripping pad 246 and second gripping pad 247 are oriented in opposite directions.

[0051]

[0054] In some embodiments, two first gripping pads 246 located at the same corner of the upper structure 240A are horizontally separated. The horizontal space 241 between the two first gripping pads 246 is configured to allow a first gripping pad 246 positioned at a vertically aligned corner of the lower structure 240B to pass between the two first gripping pads 246. At a corner of the upper structure 240A that includes two first gripping pads 246, the second gripping pad 247 is aligned with the center of the horizontal space 241 between the two first gripping pads 246. At a corner of the upper structure 240A that has one first gripping pad 246, the centers of the second gripping pad 247 and the first gripping pad 246 are aligned. As explained above, the first gripping pad 246 is taller than the second gripping pad 247.

[0052]

[0055] Lower structure 240B includes a first lower section 242B and a second lower section 244B, along with a first gripping pad 246 and a second gripping pad 247 attached to lower structure 240B.

[0053]

[0056] The first lower section 242B of the lower structure 240B has a capital "I" shape. The first lower section 242B of the lower structure 240B includes two first gripping pads 246 attached to opposite ends of the capital "I" shape. The second lower section 244B of the lower structure 240B is linear and includes a single first gripping pad 246 at each end. The second gripping pads 247 are positioned inward of the first gripping pads 246. In other words, each second gripping pad 247 is closer to the center of the lower structure 240B than the first gripping pads 246.

[0054]

[0057] Thus, adjacent corners of lower structure 240B alternate between including one first gripping pad 246 and two first gripping pads 246. For example, a corner of lower structure 240B that is vertically aligned with a corner of upper structure 240A that has two first gripping pads 246 includes one first gripping pad 246 (and vice versa).

[0055]

[0058] The first upper section 242A of the upper structure 240A and the second lower section 244B of the lower structure 240B are positioned in a parallel orientation to each other. Similarly, the second upper section 244A of the upper structure 240A and the first lower section 242B of the lower structure 240B are positioned in a parallel orientation to each other. The horizontal space 241 between the two sets of first gripping pads 246 on the upper structure 240A is aligned with the single first gripping pad 246 on the lower structure 240B. The horizontal space 241 between the sets of first gripping pads 246 on the lower structure 240B is aligned with the single first gripping pad 246 on the upper structure 240A. The second gripping pads 247 on the upper structure 240A and the second gripping pads 247 on the lower structure 240B are aligned with each other, respectively.

[0056]

[0059] In some embodiments, the first gripping pad 246 and the second gripping pad 247 have different heights. The height 243 of the second gripping pad 247 is configured to be able to receive a substrate from a robot blade. The height 243 of the second gripping pad 247 takes into account the thickness of the robot blade, the minimum clearance required above and below the blade, and the maximum allowable substrate sag. Thus, the height 243 of the second gripping pad 247 is between 12 mm and 16 mm, for example, 14 mm.

[0057]

[0060] The height of the first gripping pad 246 is configured based on the height 243 of the second gripping pad 247 and the maximum substrate sag. Thus, there is a minimum height difference 249 of at least 2.4 mm between the substrate drop surface of the first gripping pad 246 and the top surface of the second gripping pad 247.

[0058]

[0061] In some embodiments, upper structure 240A is attached to both first gripping pad 246 and second gripping pad 247 via fasteners 256 (e.g., bolts, screws, etc.). In some embodiments, fasteners 256 pass through upper structure 240A and both a portion of first gripping pad 246 and a portion of second gripping pad 247. Fasteners 256 extend into helicoils located on the bottom surfaces of first gripping pad 246 and second gripping pad 247. Upper bracket 234A is further attached to upper structure 240A via similar attachment means.

[0059]

[0062] Lower structure 240B is attached to first gripping pad 246 and second gripping pad 247 via fasteners 256 (e.g., bolts, screws, etc.). In some embodiments, fasteners 256 pass through lower structure 240B and both a portion of first gripping pad 246 and second gripping pad 247. Fasteners 256 extend into helicoils located on the bottom surfaces of first gripping pad 246 and second gripping pad 247. Lower bracket 234B is further attached to lower structure 240B via similar attachment means.

[0060]

[0063] In some embodiments, upper bracket 234A and upper structure 240A are attached to each other in a particular configuration, and lower bracket 234B and lower structure 240B are attached to each other in the same configuration so that a robot arm (e.g., a blade) approaches substrate clamping assembly 230 from one or more corresponding directions. In some embodiments, the particular configuration provides larger openings on the left and right of substrate clamping assembly 230 so that a robot arm can approach substrate clamping assembly 230 from the left and / or right to place and remove substrates.

[0061]

[0064] In one embodiment, upper structure 240A and lower structure 240B are constructed such that the angle θ between the front and back of each section, in combination with the location of second gripping pad 247, allows at least 5 mm of clearance for a robot arm to approach from either the left or right and place a substrate within substrate clamping assembly 230. The angle θ between corresponding structural portions can be between about 30 degrees and about 90 degrees.

[0062]

[0065] In some embodiments, the substrate clamping assembly 230 is controlled (e.g., placed in an open, closed, inverted, or non-inverted position) via pneumatic control (e.g., by providing pressurized gas to the rotational actuator 222 and / or the gripping actuator 210). The use of pneumatic control simplifies operation by only allowing (e.g., allowing) two positions: an inverted position and a non-inverted position (e.g., no intermediate position is required). In some embodiments, the substrate clamping assembly 230 is controlled (e.g., placed in an open, closed, inverted, or non-inverted position) via electronic control (e.g., servo control).

[0063]

[0066] 2F shows an enlarged view of substrate clamping assembly 230 clamping first substrate 260 between first gripping pads 246. As described above, first gripping pads 246 at vertically aligned corners of upper structure 240A and lower structure 240B are not aligned with one another. Therefore, first gripping pads 246 clamp first substrate 260 by each contacting first substrate 260 at different points, but do not contact one another. In other words, first gripping pads 246 do not interlock with one another.

[0064]

[0067] FIG. 2G shows an isometric view of the first gripping pad 246. The first gripping pad 246 includes a body 269 and a lip 272 separating a first upper surface 270 and a second upper surface 274. The second upper surface 274 is disposed above the first upper surface 270. The first substrate 260 rests on the first upper surface 270 of the first gripping pad 246 on the base structure 240B. The first upper surface 270 is tapered by the lip 272 and contacts only a small surface of the first substrate 260. Alternatively, the lip 272 may be an entire platform capable of supporting the first substrate 260. The lip 272 may have a width between 0.5 mm and the diameter of the first substrate 260.

[0065]

[0068] First substrate 260 is secured by closing substrate securing assembly 230 until first upper surface 270 of each first gripping pad 246 on upper structure 240A contacts (e.g., secures) first substrate 260. First substrate 260 is secured between first upper surface 270 of each first gripping pad 246 and held in place by lip 272 of each first gripping pad 246.

[0066]

[0069] The body 269 of the first gripping pad 246 also includes a pin slot 276. The pin slot 276 may have a width between 2 mm and 5 mm. The pin slot 276 is configured to receive a pin. The pin addresses alignment concerns for the first gripping pad 246 by limiting its rotational freedom.

[0067]

[0070] 2H is an isometric view of second gripping pad 247. Second gripping pad 247 includes a body 279, a first top surface 282, a second top surface 285, a third top surface 284, and a lip 287. Lip 287 may have a width between 0.8 mm and 1.2 mm. A front surface 283 of body 279 may be trimmed for clearance of a robot arm (e.g., a blade) configured to place a substrate on substrate clamp assembly 230.

[0068]

[0071] As shown in FIG. 2H , there is an empty space 286 between the first top surface 282, the second top surface 285, and the third top surface 284. The second substrate 261 rests on the second top surface 285 of each of the second gripping pads 247 attached to the lower structure 240B. In one embodiment, the second top surface 285 is tapered by a lip 287 that contacts a small surface of the second substrate 261. The second substrate 261 is secured by closing the substrate clamping assembly 230 until the third top surface 284 of each of the second gripping pads 247 attached to the upper structure 240A interlocks with the empty space 286 of the lower structure 240B (and vice versa). This “half-tooth” shape secures the second substrate 261 between the second top surfaces 285 of the interlocking second gripping pads 247. This design also allows the same parts to be used for the top and bottom gripping pads.

[0069]

[0072] The body 279 of the second gripping pad 247 also includes a pin slot 288. The width of the pin slot 288 can be between about 2 mm and 5 mm. The pin slot 288 is configured to receive a pin used to limit the rotational freedom of the second gripping pad 247.

[0070]

[0073] 3A-3B show a system 300 (eg, processing system 100 of FIG. 1) that includes a substrate inversion apparatus 200. As shown in FIG.

[0071]

[0074] In some embodiments, the inverter 200 may be mounted to the frame 370 for docking to the factory interface 101 at the load port location. In other embodiments, the inverter 200 may be mounted elsewhere in the factory.

[0072]

[0075] In some embodiments, the opening 374 in the panel 377 is configured to be sealed to maintain a sealed environment within the system (e.g., the factory interface 101 or the transfer chamber 106). In some embodiments, the sealed environment includes one or more of compressed dry air, an inert gas (e.g., nitrogen), a vacuum (e.g., negative pressure), a positive pressure, etc. In some embodiments, gas is exhausted from an enclosure system housing the substrate inversion apparatus 200 to the outside of the system, drawing gas from the sealed environment of the system 300 (e.g., the factory interface 101 or the transfer chamber 106) into the enclosure system and exhausting contaminants from the enclosure system to the outside of the system 300.

[0073]

[0076] In some embodiments, the pressurized gas used by the substrate inversion apparatus 200 is selected based on the type of gas in the enclosed environment. In some examples, in the case of an enclosed environment using air (e.g., clean dry air (CDA)), the substrate inversion apparatus 200 uses pressurized air (e.g., CDA).

[0074]

[0077] In some embodiments, the controller 380 is located proximate to the substrate inversion device 200. In some embodiments, the controller 380 is located on the panel 377. In some embodiments, a cover is placed over the controller 380.

[0075]

[0078] In some embodiments, controller 380 provides control of pneumatic actuators (e.g., gripping actuator 210 and rotary actuator 222 of FIG. 2) and receives sensor data from rotary actuator 222 and gripping actuator 210 via magnetic switches.

[0076]

[0079] In some embodiments, one or more portions of the substrate inversion device 200 (e.g., the rotational actuator 222 and the gripping actuator 210) are disposed within an enclosure (e.g., in addition to the enclosure system 130 surrounding the substrate inversion device 200) to capture any contaminants (e.g., particles).

[0077]

[0080] Alternatively, the substrate inverter 200 may be separate from the system 300. For example, the substrate inverter may be mounted in an equipment front end module, the panel 377 is not present, and the controller 380 is located elsewhere (not shown).

[0078]

[0081] 3B shows a close-up view of a magnetic switch 385, such as a reed switch, included in the gripping actuator 210. The magnetic switch 385 is configured to detect whether there is an error in the substrate clamp assembly 230. In one embodiment, the gripping actuator 210 may include three magnetic switches.

[0079]

[0082] The controller 380 can utilize magnetic switches 385 to ensure that the substrate clamping assembly 230 is clamping the correct size substrate. For example, a first magnetic switch 390 is configured to detect when the substrate clamping assembly 230 is in a fully open position, a second magnetic switch 395 is configured to detect when the substrate clamping assembly 230 is in a first closed position, and a third magnetic switch 397 is configured to detect when the substrate clamping assembly 230 is in a second closed position.

[0080]

[0083] For example, the substrate clamping assembly 230 may need to clamp a first substrate 260 to the first gripping pad 246 (i.e., a larger substrate) after being closed for a known period of time. Thus, when clamping the first substrate 260, the controller 380 may check whether the second magnetic switch 395 is activated after being closed for a first preprogrammed period of time. If the second magnetic switch 395 is not activated, the controller 380 may determine that there is an error and refrain from inverting the substrate clamping assembly 230. Similarly, the substrate clamping assembly 230 may need to clamp a second substrate 261 to the second gripping pad 247 (i.e., a smaller substrate) after being closed for a second preprogrammed period of time (a period longer than the first period of time). Thus, when clamping the second substrate 261, the controller 380 may check whether the third magnetic switch 397 is activated after being closed for a second preprogrammed period of time. If the third magnetic switch 397 is not activated, the controller 380 may determine that there is an error and refrain from inverting the substrate clamping assembly 230 .

[0081]

[0084] Additionally, if a magnetic switch is engaged for an unexpected wafer size or gripper condition, for example, if the second magnetic switch 395 is engaged when the third magnetic switch 397 should be engaged (or vice versa), the controller 380 determines that there is an error and refrains from flipping the substrate clamping assembly 230.

[0082]

[0085] In other embodiments of the substrate clamping assembly 230, the upper portion 232A and / or lower portion 232B are opened, closed, and / or inverted using electric motors or other actuation mechanisms.

[0083]

[0086] 4 illustrates a method 400 of using substrate inversion apparatus 200, according to certain embodiments. Method 400 is performed by processing logic, including hardware (e.g., circuitry, dedicated logic, programmable logic, microcode, a processing device, etc.), software (e.g., instructions running on a processing device, a general-purpose computer system, or a dedicated machine), firmware, microcode, or a combination thereof. In some embodiments, method 400 is performed in part by a controller device (e.g., controller 102 of FIG. 1 and / or controller 380 of FIG. 3). In some embodiments, a non-transitory storage medium stores instructions that, when executed by a processing device (e.g., controller 102, controller 380, etc.), cause the apparatus to perform method 400.

[0084]

[0087] For ease of explanation, method 400 is shown and described as a series of steps. However, steps according to this disclosure may occur in various orders and / or simultaneously with other steps not shown and described herein. Furthermore, in some embodiments, not all illustrated steps are performed to implement method 400 in accordance with the disclosed subject matter. In addition, those skilled in the art will understand and appreciate that method 400 may alternatively be represented as a series of interrelated states via a state diagram or state events. As described herein, a substrate is placed on substrate clamping assembly 230. Gripper actuator 210 then moves substrate clamping assembly 230 to a closed position to clamp the substrate between a set of gripping pads (e.g., first gripping pad 246 or second gripping pad 247) based on the size of the substrate, and a magnetic switch confirms that substrate clamping assembly 230 is in the correct closed position corresponding to the size of the substrate being clamped. The substrate clamping assembly 230 is then inverted via the rotational actuator 222 , the gripping actuator 210 returns the substrate clamping assembly to the open position, and the substrate is retrieved from the substrate clamping assembly 230 .

[0085]

[0088] At block 402 of method 400, the substrate clamping assembly 230 and substrate inversion device 200 are in an open position to receive a substrate. In one embodiment, processing logic pneumatically causes the substrate clamping assembly 230 of the substrate inversion device 200 to be in the open position to receive a substrate via the gripping actuator 210 of the substrate inversion device 200 (e.g., by sending a first signal to the substrate inversion device). An end effector (e.g., a blade) of the robot arm can place the substrate in a first orientation on the first gripping pad 246 of the base structure 240B or the second gripping pad 247 of the base structure based on the size of the substrate. In other embodiments, one or more electric motors or other actuation mechanisms cause the gripping actuator 210 of the substrate inversion device 200 to be in the open position to receive a substrate.

[0086]

[0089] In block 404, processing logic pneumatically causes the substrate clamping assembly 230 to be in the closed position to clamp a substrate via the gripping actuator 210 (e.g., by sending a second signal to the substrate inversion apparatus 200). As described above, the substrate clamping assembly 230 can stop at the first closed position or continue to the second closed position based on the size / configuration of the substrate. Furthermore, as described above, the substrate clamping assembly 230 is not limited to clamping substrates of only two sizes. The substrate clamping assembly 230 can continue to a further closed position beyond the second closed position to clamp substrates of further different sizes. In other embodiments, one or more electric motors or other actuation mechanisms cause the gripping actuator 210 of the substrate inversion apparatus 200 to be in the closed position to clamp a substrate.

[0087]

[0090] The substrate clamping assembly 230 is configured to stop (e.g., stall) in the first closed position once the first substrate 260 is secured between the first gripping pads 246. The substrate clamping assembly is configured to continue past the first closed position, engage the first gripping pads 246, and continue to the second closed position to secure the second substrate 261 between the mating second gripping pads 247.

[0088]

[0091] In block 406, processing logic pneumatically causes the substrate clamping assembly 230 to be in the inverted position via the rotary actuator 222 of the substrate inverter (e.g., by sending a third signal to the substrate inverter). As described above, before inverting the substrate clamping assembly, the controller 380 checks whether the substrate clamping assembly is in an error state based on a magnetic switch in the gripping actuator 210. In other embodiments, one or more electric motors or other actuation mechanisms cause the rotary actuator 222 of the substrate inverter 200 to be in the inverted position to clamp the substrate.

[0089]

[0092] In some embodiments, the system pressure is manually controlled via a pressure regulator in the substrate inversion apparatus 200 to adjust the rotational speed of the rotary actuator 222 and the gripping force of the gripping actuator 210. In some embodiments, processing logic causes the rotary actuator 222 in the substrate inversion apparatus 200 to receive pressurized gas to control the gripping actuator 210. In some embodiments, the rotary actuator 222 and the gripping actuator are controller turned on or off based on airflow, and their rotational speeds are preset.

[0090]

[0093] While the above description is directed to embodiments of the present disclosure, other and further embodiments of the disclosure may be devised without departing from the basic scope thereof, the scope of which is determined by the claims that follow.

Claims

1. A substrate inversion device, a gripping actuator; 1. A substrate clamping assembly, comprising: an upper structure coupled to the gripping actuator; a substructure coupled to the gripping actuator; and a plurality of sets of gripping pads attached to the upper structure and the lower structure; a substrate clamping assembly comprising: wherein each set of gripping pads is configured to secure substrates of different sizes.

2. 2. The substrate inversion apparatus of claim 1, wherein each of the sets of gripping pads are spaced radially inward from one another, with the gripping pads in the radially inner set configured to secure smaller substrates than the gripping pads in the radially outer set.

3. 2. The substrate inversion apparatus of claim 1, wherein the plurality of sets of gripping pads comprises a first set of gripping pads configured to secure a first substrate of a first size and a second set of gripping pads configured to secure a second substrate of a second size, the first size and the second size being different.

4. The first set of gripping pads comprises: two first gripping pads attached to opposite ends of a first upper section of the upper structure; a first gripping pad attached to each end of the second upper section of the upper structure; two first gripping pads attached to opposite ends of a first lower section of the undercarriage; a first gripping pad attached to each end of the second lower section of the undercarriage; 4. The substrate inversion device of claim 3, wherein the first upper section of the upper structure and the second lower section of the lower structure extend in directions parallel to each other, and the second upper section of the upper structure and the first lower section of the lower structure extend in directions parallel to each other.

5. the two first gripping pads attached to opposite ends of the first upper section of the upper structure are separated by a first horizontal space; 5. The substrate inversion device of claim 4, wherein the two first gripping pads attached to both ends of the first lower section of the lower structure are separated by a second horizontal space, and the first horizontal distance and the second horizontal distance are equal.

6. the one first gripping pad attached to each end of the second lower section of the lower structure is aligned with the center of the first horizontal space; 6. The substrate inversion device of claim 5, wherein the one first gripping pad attached to each end of the second upper section of the upper structure is aligned with the center of the second horizontal space.

7. 4. The substrate inverting device according to claim 3, wherein the first size is a diameter of 300 mm or 200 mm, and the second size is a diameter of 200 mm or 150 mm.

8. 4. The substrate inversion apparatus of claim 3, wherein the first set of gripping pads and the second set of gripping pads have different heights.

9. A substrate inversion device, a gripping actuator; 1. A substrate clamping assembly, comprising: an upper structure coupled to the gripping actuator, the upper structure comprising a first upper section and a second upper section; a lower structure coupled to the gripping actuator, the lower structure comprising a first lower section and a second lower section; two first gripping pads attached to opposite ends of the first upper section and the first lower section; a first gripping pad attached to each end of the second upper section and each end of the second lower section; and one second gripping pad located at each end of the body of the first upper section, the second upper section, the first lower section, and the second lower section; a substrate clamping assembly comprising: A substrate inversion device comprising:

10. the first upper section and the second lower section extend in parallel directions; The substrate inversion device of claim 9 , wherein the second upper section and the first lower section extend in directions parallel to each other.

11. the two first gripping pads attached to opposite ends of the first upper section are separated by a first horizontal space; the two first gripping pads attached to opposite ends of the first lower section are separated by a second horizontal space; the first gripping pad attached to each end of the second lower section is aligned with the center of the first horizontal space; 10. The substrate inverting device of claim 9, wherein the one first gripping pad attached to each end of the second upper section is aligned with the center of the second horizontal space.

12. 10. The substrate inversion apparatus of claim 9, wherein the first gripping pad is configured to secure a first substrate of a first size and the second gripping pad is configured to secure a second substrate of a second size, the first size being different from the second size, the first size being 300 mm or 200 mm in diameter, and the second size being 200 mm or 150 mm in diameter.

13. The substrate inversion device of claim 9 , wherein the first gripping pad is higher than the second gripping pad.

14. 10. The substrate inversion apparatus of claim 9, wherein the second gripping pad is positioned closer to the center of both the upper structure and the lower structure than the first gripping pad.

15. 1. A substrate processing system, comprising: a transfer chamber; a factory interface disposed between the transfer chamber and a plurality of enclosure systems; a substrate inversion device disposed in or on the factory interface or in the transfer chamber and configured to secure substrates of different sizes, the substrate inversion device comprising: a gripping actuator; 1. A substrate clamping assembly, comprising: an upper structure coupled to the gripping actuator; a substructure coupled to the gripping actuator; and a plurality of sets of gripping pads attached to the upper structure and the lower structure; A substrate clamping assembly comprising: a substrate inversion device comprising: wherein each set of gripping pads is configured to secure substrates of different sizes.

16. 16. The substrate processing system of claim 15, wherein the plurality of sets of gripping pads comprises a first set of gripping pads configured to secure a first substrate of a first size and a second set of gripping pads configured to secure a second substrate of a second size, the first size and the second size being different, the first size being 300 mm or 200 mm in diameter, and the second size being 200 mm or 150 mm in diameter.

17. A controller; a memory for storing a program to be executed within the controller; When the program is executed, the program causes the controller to actuating the gripping actuator to place the substrate clamping assembly in a first closed position for gripping a first substrate of a first size between the first set of gripping pads; Actuating the gripping actuator causes the substrate clamping assembly to be placed in a second closed position for gripping a second substrate of a second size between the second set of gripping pads.

17. The substrate processing system of claim 16, further comprising instructions to:

18. 17. The substrate processing system of claim 16, wherein the first set of gripping pads are taller than the second set of gripping pads.

19. 20. The substrate processing system of claim 17, wherein the controller is further configured to cause the substrate clamping assembly to invert the first substrate or the second substrate after clamping by actuation of a rotational actuator.

20. 16. The substrate processing system of claim 15, wherein each of the sets of gripping pads are spaced radially inward from one another, with the gripping pads in the radially inner set configured to secure smaller substrates than the gripping pads in the radially outer set.

Images