Wire Steaming Device

Abstract

The present invention relates to a wire deposition apparatus, which includes a plurality of rollers around which a wire is wound and moved, a heater for intensively heating the wire passing through the rollers, a cathode for supplying deposition material to the wire, and an adhesion prevention unit for covering the outside of the wire except for the wire deposition space to prevent scattered particles from adhering to the wire.

Description

[Technical Field]

[0001] The present invention relates to a wire deposition apparatus, and more particularly to a wire deposition apparatus that can achieve excellent thin film quality by allowing a material to reach the surface of a wire in a set area and have a certain directionality. [Background technology]

[0002] Generally, as expectations for the practical application of superconducting application technologies using high-temperature superconductors increase, research and development of high-temperature superconducting wires is being actively carried out worldwide.

[0003] There are two methods for manufacturing high-temperature superconducting wire: the first-generation high-temperature superconducting wire manufacturing method, which uses the PIT (Powder In Tube) process to fill an Ag pipe with precursor powder and process it, and the second-generation high-temperature superconducting wire manufacturing method, which produces high-temperature superconducting wire known in technical terms as CC (Coated Conductor).

[0004] CC, a second-generation high-temperature superconducting wire, is being researched and developed by many research institutes and companies around the world, and has a more complex multi-layer structure than first-generation high-temperature superconducting wire, with a variety of manufacturing methods.

[0005] Meanwhile, conventionally, there is a problem that the roller around which the wire is wound is damaged during the process of heating the wire at a high temperature, which frequently results in poor deposition of the wire. Therefore, there is a need to improve this problem.

[0006] The background art of the present invention is described in Korean Patent Publication No. 10-0910613 (registered on July 28, 2009, title of invention: continuous manufacturing apparatus for superconducting tape wire). Summary of the Invention [Problem to be solved by the invention]

[0007] The present invention has been devised to solve the above-mentioned problems, and its object is to provide a wire deposition apparatus that can achieve excellent thin film quality by allowing materials to reach the surface of the wire in a set area and have a certain directionality. [Means for solving the problem]

[0008] The wire deposition apparatus according to the present invention includes: a plurality of rollers around which the wire is wound and moved; a heater unit that intensively heats the wire passing through the rollers; a cathode unit that supplies deposition material to the wire; and an adhesion prevention unit that covers the outside of the wire except for the deposition space of the wire to prevent scattered particles from adhering to it.

[0009] The heater section may include a first heater section disposed above the wire and heated when power is applied; and one or more first heat dissipation sections covering the first heater section so that only the lower part of the first heater section is open and dissipating heat.

[0010] The heater unit may include a second heater unit disposed above the wire and heated by a lamp that is turned on when power is applied; a second reflector that covers the second heater unit so that only the lower part of the second heater unit is exposed and reflects heat generated by the second heater unit; and a second cooling unit that comes into contact with the second reflector and through which cooling water flows to cool the second reflector.

[0011] The heater unit may include an upper heater unit disposed above the wire and generating heat; an upper reflector unit covering the upper heater unit so that only the lower part of the upper heater unit is open and reflecting the heat generated by the upper heater unit; an upper cooling unit cooling the upper reflector unit; a lower heat dissipation unit disposed between the wire and the cathode unit and inducing heat to be concentrated on the wire; and a lower cooling unit cooling the lower heat dissipation unit.

[0012] The lower heat dissipation portion may include a plurality of heat dissipation center portions having a through-hole portion formed in a center portion and stacked on the lower cooling portion; and a plurality of heat dissipation side portions covering edges of the heat dissipation center portions.

[0013] The heat dissipation center portion may include a center plate portion having the through-hole portion formed in the center thereof; a plurality of center fixing holes formed in each of the center plate portions; and a center support portion that passes through the center fixing holes and is attached to the lower cooling portion to support the center plate portion.

[0014] The center support portion fixes a center portion of the center plate portion, and the center fixing hole portion may have a rectangular hole shape whose length increases from the center portion to an end portion of the center plate portion.

[0015] The wire deposition apparatus according to the present invention may further include a cooling unit disposed between the heater unit and the roller unit, in direct contact with the wire, to cool the wire. [Effects of the Invention]

[0016] In the wire deposition apparatus according to the present invention, a wire is heated by a heater and is wound around a plurality of rollers and moved while being deposited. The heater unit heats the wire intensively to prevent damage to surrounding equipment, and the adhesion prevention unit partially covers the wire to prevent scattered particles from adhering to the wire. [Brief explanation of the drawings]

[0017] [Figure 1] 1 is a schematic view of a wire deposition apparatus according to an embodiment of the present invention; [Figure 2] 1 is a view schematically illustrating a roller unit according to an embodiment of the present invention. [Figure 3] 1 is a view schematically illustrating a roller maintaining unit according to an embodiment of the present invention; [Figure 4] 1 is a view schematically illustrating a cooling unit according to an embodiment of the present invention. [Figure 5]1 is a view schematically illustrating an adhesion prevention unit according to an embodiment of the present invention. [Figure 6] 1 is a view schematically illustrating a heater unit according to a first embodiment of the present invention. [Figure 7] 10 is a view schematically illustrating a heater unit according to a second embodiment of the present invention. [Figure 8] 10 is a view schematically illustrating a heater unit according to a third embodiment of the present invention. [Figure 9] 10 is a view schematically illustrating a lower heat dissipation part according to a third embodiment of the present invention. [Figure 10] 2 is a view schematically illustrating a cathode part according to an embodiment of the present invention; DETAILED DESCRIPTION OF THE INVENTION

[0018] Hereinafter, an embodiment of a wire deposition apparatus according to the present invention will be described with reference to the accompanying drawings. In the drawings, the thickness of wires and the size of components may be exaggerated for clarity and convenience. Furthermore, the terms used below are defined in consideration of the functions of the present invention and may vary depending on the intentions or practices of users and operators. Therefore, the definitions of these terms should be based on the overall content of this specification.

[0019] 1 is a schematic diagram of a wire deposition apparatus according to an embodiment of the present invention. Referring to FIG. 1, the wire deposition apparatus 1 according to the embodiment of the present invention includes a roller unit 10, a heater unit 20, and a cathode unit 30.

[0020] The wire 90 may be wound around two or more roller units 10 and moved. The roller units 10 are capable of changing their length on the shaft, so malfunctions can be prevented even when heated by the heater unit 20. For example, the roller units 10 may be arranged in pairs facing each other, or three or more roller units may be arranged. The wire 90 may be deposited while passing through each roller unit 10 several times.

[0021] The heater unit 20 can heat the wire 90 passing through the roller unit 10. For example, the heater unit 20 can be disposed between the roller units 10 and heat the wire 90 above the wire 90 passing through the roller units 10.

[0022] The cathode unit 30 can provide a deposition material to the wire 90. For example, the roller unit 10, the heater unit 20, and the cathode unit 30 can be housed in a chamber that can be converted to a vacuum state. The cathode unit 30 can include a cathode supply unit that is housed in the chamber and provides a deposition material, a cathode gas unit that supplies gas to the chamber, and a cathode power unit that supplies power to the chamber.

[0023] 2 is a diagram illustrating a roller unit according to an embodiment of the present invention. Referring to FIG. 2, the roller unit 10 according to an embodiment of the present invention may include a roller support portion 11, a roller shaft portion 12, and a roller absorber portion 13.

[0024] The roller support 11 may be fixedly installed in the chamber. For example, the roller support 11 may include a pair of first roller support parts 111 fixedly installed in the chamber to face each other, and a second roller support part 112 formed in the first roller support part 111 and into which the roller shaft part 12 can be inserted.

[0025] The second roller support part 112 may have a hole formed in the center of the first roller support part 111. The third roller support part 113 may be attached to the second roller support part 112. The third roller support part 113 may be a bearing.

[0026] The roller axle 12 may be rotatably mounted on the roller support 11. For example, both ends of the roller axle 12 may be inserted into the second roller support 112, and the roller axle 12 may be supported and rotated by the third roller support 113. The roller axle 12 may pass through the third roller support 113. The roller axle 12 may be supported by the third roller support 113, which is movable on the second roller support 112.

[0027] The roller absorbing portion 13 is disposed between the roller support portion 11 and the roller shaft portion 12, and can absorb the expansion of the roller shaft portion 12. As an example, the roller absorbing portion 13 can be built into the second roller support portion 112 to support the roller shaft portion 12.

[0028] The roller shaft 12 may pass through the roller absorbing portion 13. The roller absorbing portion 13 may form a vacant space in the second roller support portion 112. When the roller shaft 12 is heated and expands in length, the roller absorbing portion 13 may contract. The roller absorbing portion 13 may be in close contact with the third roller support portion 113.

[0029] More specifically, the roller shaft portion 12 may include a shaft rotating portion 121 , a shaft connecting portion 122 , and a shaft coupling portion 123 .

[0030] The shaft rotating portion 121 may be rotatably mounted on the roller support portion 11. A pair of shaft rotating portions 121 may be mounted on the roller support portions 11 at a distance from each other.

[0031] As an example, the axial rotation part 121 may include a first axial rotation part 181 inserted into the second roller support part 112 and engaged with the third roller support part 113, a second axial rotation part 182 extending from one end of the first axial rotation part 181, inserted into the third roller support part 113, and supported so as to be rotatable by the third roller support part 113, and a third axial rotation part 184 extending outward from the other end of the first axial rotation part 181.

[0032] The first and second rotating shaft parts 181 and 182 may have a cylindrical shape. The third rotating shaft part 183 may be formed at the end of the first rotating shaft part 181 and may have a disk shape. The diameter of the third rotating shaft part 183 may be larger than the diameter of the first rotating shaft part 181. The diameter of the second rotating shaft part 182 may be smaller than the diameter of the first rotating shaft part 181.

[0033] The shaft connecting portion 122 can connect a pair of shaft rotating portions 121. For example, the shaft connecting portion 122 can have a hollow cylindrical shape, and both ends can be stepped so that they can be locked onto the edges of the second shaft rotating portion 182.

[0034] The shaft coupling part 123 may couple the shaft rotating part 121 and the shaft connecting part 122. For example, the shaft coupling part 123 may include a first shaft coupling part 191 disposed to face the second shaft rotating part 182, and a second shaft coupling part 192 bent from the first shaft coupling part 191 to cover the end of the shaft connecting part 122.

[0035] The shaft coupling portion 123 may be disposed at one end or both ends of the shaft connecting portion 122. The third shaft rotating portion 183 may be connected to the first shaft coupling portion 191 by a bolt.

[0036] The wire 90 may be wound and moved directly on the outer periphery of the shaft connecting part 122. In addition, an additional roller support part 14, which is attached to the shaft connecting part 122 and around which the wire 90 is wound and moved, and an additional roller absorbing part 15, which maintains the surplus space of the shaft connecting part 122, may be additionally installed. When these are added, the operation of the wire 90 can be guaranteed in a double bearing system.

[0037] One or more roller additional support parts 14 may be arranged in the longitudinal direction of the shaft connecting part 122 to support the wire 90. As an example, the roller additional support part 14 may include a pair of first additional support parts 141 each having a ring shape and a second additional support part 142 arranged between the first additional support parts 141.

[0038] The outer diameter of the first additional support part 141 is larger than the outer diameter of the second additional support part 142. Therefore, when the wire 90 is placed on the second additional support part 142, the first additional support parts 141 placed on both sides can prevent the wire 90 from derailing.

[0039] The second additional support part 142 may serve as a bearing. The wire 90 is disposed on the second additional support part 142, thereby reducing friction that occurs during the movement of the wire 90. The roller additional support parts 14 may be arranged in series depending on the width of the wire 90 or the number of times the wire 90 is wound around the roller unit 10. When the roller additional support parts 14 are arranged in series, the first additional support parts 141 and the second additional support parts 142 may be arranged alternately.

[0040] A shaft mounting part 129 may be formed on the outer circumferential surface of the shaft connecting part 122. The shaft mounting part 129 may have a recessed groove shape so as to have a smaller outer diameter than the shaft connecting part 122.

[0041] The shaft mounting portion 129 extends from a set point to the end of the shaft connecting portion 122, and the roller additional support portion 14 can be inserted from the end to the set point. A shaft step portion 128 can be formed at the set point so that the roller additional support portion 14 can be locked.

[0042] The roller additional absorbing portion 15 is disposed between the roller additional support portion 14 and the shaft connecting portion 123, and can absorb expansion of the roller additional support portion 14. As an example, the roller additional absorbing portion 15 can be disposed between the shaft connecting portion 123 and a roller additional support portion 14 disposed at an edge of the roller additional support portions 14 disposed in a row.

[0043] The roller additional absorbing portion 15 can be selectively disposed between the roller additional support portions 14 arranged in a row. That is, the roller additional absorbing portion 15 can be disposed between a pair of opposing first additional support portions 141.

[0044] The roller absorber 13 and the roller additional absorber 15 may be wave washers or disc springs. As an example, the roller absorber 13 and the roller additional absorber 15 may be wave washers or disc springs.

[0045] Either the roller absorbing part 13 or the roller additional absorbing part 15 may be a wave washer, and the other may be a disc spring. When the shaft connecting part 122 expands, the roller absorbing part 13 contracts to secure a space for the expansion of the shaft connecting part 122. When the adjacent roller additional supporting part 14 expands, the roller additional absorbing part 15 contracts to secure a space for the expansion of the roller additional supporting part 14.

[0046] The roller unit 10 according to an embodiment of the present invention may further include a roller discharge unit 16. The roller discharge unit 16 can discharge gas remaining in the roller shaft unit 12 that is not discharged during the vacuum process.

[0047] For example, the roller discharge part 16 may include a first discharge part 161 that discharges gas remaining inside the shaft connecting part 122, and a second discharge part 162 that discharges gas remaining between the shaft connecting part 122 and the roller additional support part 14.

[0048] The first exhaust part 161 may have a hole shape that penetrates the first shaft rotating part 181 and the second shaft rotating part 182. In addition, the first exhaust part 161 may have a hole shape that penetrates the third shaft rotating part 183 and the first shaft coupling part 191. The first exhaust part 161 can exhaust gas inside the shaft connecting part 122.

[0049] The second discharge portion 162 may include a second discharge mounting groove portion 119 that forms a groove for gas movement in the length direction of the shaft mounting portion 129, and a second discharge step groove portion 118 that is formed in the shaft step portion 128 and communicates with the second discharge mounting groove portion 119. A plurality of second discharge portions 162 may be formed in the circumferential direction of the shaft mounting portion 129.

[0050] 3 is a view schematically illustrating a roller maintaining unit according to an embodiment of the present invention. Referring to FIG. 3, the roller unit 10 according to an embodiment of the present invention may further include a roller maintaining unit 17.

[0051] The roller support parts 17 are disposed between the roller additional support parts 14 and can cover the space formed in the shaft connecting part 122 so that the roller additional support parts 14 are in close contact with the roller additional absorbing parts 15. The number of roller additional support parts 14 can be changed depending on the work environment, and if the number of roller additional support parts 14 installed is reduced, the remaining space can be covered by the roller support parts 17.

[0052] That is, when four roller additional support parts 14 are used and then two roller additional support parts 14 are used, the roller support parts 17 corresponding to the two roller additional support parts 14 are attached to the shaft connecting part 122. This allows the roller additional support parts 14 and the roller additional absorbing parts 15 to maintain a tight contact state.

[0053] 1 and 4, the wire deposition apparatus 1 according to the embodiment of the present invention may further include a cooling unit 40.

[0054] The cooling unit 40 can cool the wire 90. The cooling unit 40 can cool the wire 90 heated by the heater unit 20, thereby preventing the roller unit 10 from being heated by the wire 90. The cooling unit 40 can be disposed between the heater unit 20 and the roller unit 10 and can be in direct contact with the wire 90.

[0055] The cooling unit 40 may include a cooling block unit 41 that is fixedly installed in the chamber and contacts the wire 90, and a cooling circulation unit 42 that circulates cooling water through the cooling block unit 41 to cool the cooling block unit 41.

[0056] The cooling unit 40 is additionally disposed between the heater unit 20 and the roller unit 10, which guides the wire 90 that has not passed through the heater unit 20, to cool the wire 90. Meanwhile, the cooling circulation unit 42 supplies additional cooling water to the roller unit 10 to directly cool the roller unit 10.

[0057] 1 and 5, the wire deposition apparatus 1 according to the embodiment of the present invention may further include an adhesion prevention unit 50.

[0058] The adhesion prevention unit 50 covers the outside of the wire 90 except for the deposition space of the wire 90, thereby preventing scattered particles from adhering to the wire 90 outside the deposition space. For example, the adhesion prevention unit 50 may include a prevention box unit 51 having a box shape surrounding the roller unit 10 and the heater unit 20.

[0059] A deposition prevention hole 53 for deposition may be formed at the bottom of the protection box 51, and a pass-through hole 54 for passing the wire 90 may be formed at the top of the protection box 51. The protection box 51 can be disassembled and assembled, and can be fixed to the chamber using a separate support.

[0060] 6 is a diagram schematically illustrating a heater unit according to a first embodiment of the present invention. Referring to FIG. 6, the heater unit 20 according to the first embodiment of the present invention may include a first heater unit 610 and a first heat dissipation unit 620.

[0061] The first heater unit 610 is disposed above the wire 90 and can be heated when power is applied. The first heater unit 610 can be a sheath heater, a ceramic mold heater, or a PTC heater.

[0062] One or more first heat dissipation units 620 may cover the first heater unit 610 and radiate heat so that only the bottom of the first heater unit 610 is open. The first heat dissipation units 620 may cover the first heater unit 610 so that the wire 90 passing under the first heater unit 610 is heated intensively, and may block radiant heat from being transmitted to the periphery of the first heater unit 610.

[0063] 7 is a schematic view of a heater unit according to a second embodiment of the present invention. Referring to FIG. 7, the heater unit 20 according to the second embodiment of the present invention may include a second heater unit 710, a second reflector 720, and a second cooling unit 730.

[0064] The second heater 710 is disposed above the wire 90, and when power is applied, the lamp may be turned on to heat the wire 90. For example, a halogen lamp may be used as the second heater 710. A plurality of second heaters 710 may be disposed above the wire 90 to cross over it.

[0065] The second reflector 720 may cover the second heater unit 710 so that only the bottom of the second heater unit 710 is exposed. The second reflector 720 may reflect heat generated by the second heater unit 710. The second heater unit 710 may be attached to the second reflector 720. In addition, the second heater unit 710 may be attached to the second cooling unit 730.

[0066] The second cooling unit 730 is in contact with the second reflecting unit 720 and allows cooling water to flow through it to cool the second reflecting unit 720. The second cooling unit 730 may be fixed to the chamber by a separate fixing means.

[0067] The second reflector 720 may be attached to or coated on the inner wall of the second cooling part 730. The second reflector 720 may be an infrared reflector coated with a gold material on the inner wall of the second cooling part 730.

[0068] The second transmitting part 740 covers the lower part of the second cooling part 730 and can transmit the heat generated by the second heating part 710 .

[0069] 8 is a schematic view of a heater unit according to a third embodiment of the present invention. Referring to FIG. 8, the heater unit 20 according to the third embodiment of the present invention may include an upper heater unit 810, an upper reflector unit 820, an upper cooling unit 830, a lower heat dissipation unit 840, and a lower cooling unit 850.

[0070] The upper heater unit 810 is disposed above the wire 90 and can generate heat. For example, the upper heater unit 810 can be the first heater unit 610 of FIG. 6 or the second heater unit 710 of FIG. 7, and various heaters for heating the wire 90 can be applied.

[0071] The upper reflector 820 may cover the upper heater unit 810 so that only the bottom of the upper heater unit 810 is open. The upper reflector 820 may reflect heat generated by the upper heater unit 810. The upper heater unit 810 may be attached to the upper reflector 820. The upper reflector 820 may be attached to the upper cooling unit 830.

[0072] The upper cooling unit 830 is in contact with the upper reflector 820, and cooling water is circulated through the upper cooling unit 830 to cool the upper reflector 820. The upper cooling unit 830 may be fixed to the chamber by a separate fixing means. The upper reflector 820 may be attached to or coated on the inner wall of the upper cooling unit 830.

[0073] The lower heat dissipation unit 840 is disposed between the wire 90 and the cathode unit 30 and can induce heat to be concentrated on the wire 90. As an example, a plurality of lower heat dissipation units 840 may be stacked, and heat may be transferred through the stacked lower heat dissipation units 840. The lower heat dissipation units 840 may prevent radiant heat from the upper heater unit 810 from being transferred to surrounding equipment.

[0074] The lower cooling unit 850 may cool the lower heat dissipation unit 840. For example, heat transferred through the lower heat dissipation unit 840 may be cooled through the lower cooling unit 850. The lower cooling unit 850 may have a hole formed in the center, and the upper heater unit 810, the wire 90, and the cathode unit 30 may be arranged to face each other vertically.

[0075] The lower cooling unit 850 may include a lower cooling block unit 851, a lower cooling circulation unit 852 that guides the circulation of cooling water in the lower cooling block unit 851, and a lower cooling partition unit 853 that is coupled to the edge of the lower cooling block unit 851.

[0076] 9 is a schematic view of a lower heat dissipation unit according to a third embodiment of the present invention. Referring to FIG. 9, a lower heat dissipation unit 840 according to the third embodiment of the present invention may include a heat dissipation center portion 841 and a heat dissipation side portion 842.

[0077] A plurality of heat dissipation center parts 841 may have a through-hole part 849 formed in the center thereof and may be stacked on the lower cooling part 850. For example, the heat dissipation center parts 841 may be stacked on the lower cooling block part 751 in a vertical direction.

[0078] The plurality of heat dissipation side portions 842 may cover the edges of the heat dissipation center portion 841. For example, the plurality of heat dissipation side portions 842 arranged horizontally may be closely attached to the lower cooling partition portion 853 and fixed to the lower cooling partition portion 853 by a fixing means.

[0079] More specifically, the heat dissipation center portion 841 may include a center plate portion 891 , a center fixing hole portion 892 , and a center support portion 893 .

[0080] The center plate 891 may have a through-hole 849 formed in the center thereof. For example, the center plate 891 may have a rectangular plate shape, and a plurality of center plates 891 may be stacked on the lower cooling block 851.

[0081] The center fixing hole 892 may be formed in the center plate 891. For example, the center fixing hole 892 may include a first fixing hole 881 disposed in the center of the center plate 891 having a rectangular plate shape, and second fixing holes 882 disposed on both the left and right sides of the first fixing hole 881.

[0082] The center support part 893 may be attached to the lower cooling part 850 through the center fixing hole part 892 and support the center plate part 891. For example, the center support part 893 may be attached to the lower cooling block part 851 and may be a pin, bolt, or the like that protrudes upward, and a nut may be selectively coupled to fix the center plate part 891.

[0083] The center support part 893 fixes the center part of the center plate part 891, and the center fixing hole part 892 may have a rectangular hole shape whose length increases from the center part of the center plate part 891 to the end part.

[0084] The first fixing hole 881 has a size corresponding to the center support 893 , and the center of the center plate 891 where the first fixing hole 881 is formed can be fixed by the center support 893 .

[0085] A plurality of second fixing holes 882 may be formed on both the left and right sides of the first fixing hole 881. The length of the rectangular hole of the second fixing hole 882 may increase from the first fixing hole 881 toward the left and right ends of the center plate 891. This prevents interference with the center support 893 even if the center plate 891 expands due to heating.

[0086] 10 is a schematic view of a cathode assembly according to an embodiment of the present invention. Referring to FIG. 10, the cathode assembly 30 according to an embodiment of the present invention may include a cathode cooling section 31, a cathode magnet section 32, and a cathode material section 33.

[0087] The cathode cooling unit 31 has a cathode flow path 312 formed in a cathode block 311, through which cooling water can circulate. The cathode flow path 312 is integrally formed with the cathode block 311 through gun drilling and welding, thereby improving thermal conductivity.

[0088] The cathode cooling part 31 has an open shape at the top, the cathode magnet part 32 is built into the cathode cooling part 31 to provide magnetic force, and the cathode material part 33 is exposed to the outside on the top surface of the cathode magnet part 32 to provide deposition material.

[0089] The operation of the wire deposition apparatus according to the embodiment of the present invention having the above-described structure will now be described.

[0090] The wire 90 introduced into the chamber is wound around a plurality of rollers 10 several times and moved, and the wire 90 placed between the rollers 10 is heated by the heater 20, and a material provided from the cathode 30 is deposited on the wire 90.

[0091] When the roller portion 10 is heated by the heater portion 20, the roller shaft portion 12 expands, and the roller absorbing portion 13 supports the expanding roller shaft portion 12 while contracting.

[0092] When the roller additional support part 14 expands, the roller additional absorbing part 15 contracts to support the expanding roller additional support part 14. At this time, the roller shaft part 12 and the roller additional support part 14 surrounding the roller shaft part 12 are each provided with a bearing, thereby ensuring the operability of the wire 90.

[0093] The roller discharge part 16 guides the gas remaining inside the roller part 10 to be discharged stably, and the roller support part 17 can replace the space when the roller additional support part 14 is removed depending on the working environment.

[0094] The heater unit 20 is disposed above the wire 90 and supplies heat to the wire 90 moving below in a concentrated manner, and employs a heat dissipation and reflection structure to prevent radiant heat from being transferred to other equipment.

[0095] The lower heat dissipation units 840 are designed to be stacked in multiple units. The multiple lower heat dissipation units 840 are fixed at their centers, and the length of the center fixing hole 892 formed in the lower heat dissipation units 840 increases from the center to the edge of the lower heat dissipation units 840. Therefore, even if the lower heat dissipation units 840 expand due to high heat from the upper heater unit 810, the installation state can be stably maintained.

[0096] The cooling unit 40 is disposed between the roller unit 10 and the heater unit 20 and comes into direct contact with the heated wire 90 to cool the wire 90, thereby preventing overheating of the roller unit 10 around which the wire 90 is wound. Such cooling units 40 may be disposed on both the left and right sides of the heater unit 20, and cooling water from the cooling unit 40 may pass through the roller unit 10 to directly cool the roller unit 10 as needed.

[0097] The adhesion prevention unit 50 is disposed to surround the entire outside of the wire 90 except for the deposition space of the wire 90. This prevents evaporated particles scattered by the cathode unit 30 from adhering to the wire 90 in areas other than the deposition space.

[0098] In the wire deposition apparatus 1 according to an embodiment of the present invention, a wire 90 is heated by a heater unit 20 and can be deposited while being wound around a plurality of roller units 10 and moved. In addition, the heater unit 20 intensively heats the wire 90 to prevent damage to surrounding equipment, and the adhesion prevention unit 50 partially covers the wire 90 to prevent scattered particles from adhering to the wire 90.

[0099] Although the present invention has been described with reference to the embodiments shown in the drawings, these are merely illustrative, and those skilled in the art will recognize that various modifications and equivalent embodiments are possible. Therefore, the true technical scope of the present invention should be determined by the following claims.

Claims

1. a plurality of rollers around which the wire is wound and moved; a heater section for intensively heating the wire passing through the roller section; a cathode portion for providing deposition material to the wire; and a deposition prevention unit that covers the outside of the wire except for the deposition space of the wire to prevent scattered particles from adhering to the wire;

2. The heater section a first heater portion disposed above the wire and heated when power is applied; and 2. The wire deposition apparatus of claim 1, further comprising: one or more first heat dissipation units that cover the first heater unit so that only a lower portion of the first heater unit is exposed and that dissipate heat.

3. The heater section a second heater section disposed above the wire, the second heater section being heated by a lamp lit when power is applied; a second reflector that covers the second heater unit so that only a lower portion of the second heater unit is exposed and reflects heat generated by the second heater unit; and The wire deposition apparatus according to claim 1 , further comprising: a second cooling unit that is in contact with the second reflecting unit and through which cooling water is moved to cool the second reflecting unit.

4. The heater section an upper heater section disposed above the wire and configured to generate heat; an upper reflector that covers the upper heater unit so that only a lower portion of the upper heater unit is exposed and reflects heat generated by the upper heater unit; an upper cooling section for cooling the upper reflecting section; a lower heat dissipation portion disposed between the wire and the cathode portion and configured to induce heat to be concentrated on the wire; and The wire deposition apparatus according to claim 1 , further comprising: a lower cooling unit that cools the lower heat dissipation unit.

5. The lower heat dissipation portion a plurality of heat dissipation center portions, each having a through-hole formed in the center thereof, stacked on the lower cooling portion; and 5. The wire deposition apparatus according to claim 4, further comprising a plurality of heat-dissipating side portions covering edges of the heat-dissipating center portion.

6. The heat dissipation center portion a center plate portion having the through-hole portion formed in the center thereof; a plurality of center fixing holes formed in the center plate; and 6. The wire deposition apparatus according to claim 5, further comprising: a center support portion that passes through the center fixing hole portion and is attached to the lower cooling portion to support the center plate portion.

7. the center support portion fixes the center portion of the center plate portion, 7. The wire deposition apparatus according to claim 6, wherein the center fixing hole portion has a rectangular hole shape whose length increases from the center portion of the center plate portion to an end portion thereof.

8. 2. The wire deposition apparatus according to claim 1, further comprising: a cooling unit disposed between the heater unit and the roller unit, in direct contact with the wire to cool the wire.

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