Probe pin, probe card including probe pin, and manufacturing method thereof

Abstract

The present invention provides vertical and / or horizontal slits to adjust the flexibility of the probe pins, thereby facilitating elastic deformation. The present invention also adjusts the cross-sectional area of ​​the probe pins to maintain excellent high-frequency signal characteristics. The present invention also utilizes a plurality of isolation bodies separated by vertical and / or horizontal slits to facilitate insertion of the probe pins into the upper and lower plates and prevent the inserted probe pins from falling out.

Description

[Technical Field]

[0001] The present invention relates to a probe pin, a probe card including the probe pin, and a manufacturing method thereof, and more particularly to a probe pin whose flexibility is adjusted via a slit structure, a probe card including the probe pin, and a manufacturing method thereof. [Background technology]

[0002] A probe card is a device used to check the characteristics of semiconductor devices at the wafer level after they are manufactured and before they are cut into individual packages. The probe card has probe pins that input electrical signals, and can detect defects in the semiconductor devices based on the results.

[0003] A probe card is composed of multiple probe pins. The probe pins come into contact with the electrode pads of a semiconductor device and apply a certain amount of pressure to the semiconductor device. This process of bringing the probe pins into contact with the electrode pads and applying pressure to the electrode pads is called overdriving.

[0004] The probe pin is made of a material that can be elastically deformed to prevent damage to the probe pin and the semiconductor element. Thus, various methods have been attempted to adjust the flexibility of the probe pin itself to prevent damage to the semiconductor element.

[0005] In this regard, Korean Patent Registration No. 10-1082459, a prior art document, discloses an "electrical contact element" in which the electrical contact element has a longitudinal vertical slot passing through a probe pin.

[0006] However, since the "electrical contact element" has a form including one or more vertical slots, there is a problem that the width increases in the direction in which the vertical slots are arranged, which is clearly a limiting point in the current situation where electrode pads are being spaced at narrower pitches as semiconductor devices become smaller. [Prior art documents] [Patent documents]

[0007] [Patent Document 1] Korean Patent No. 10-1082459 Summary of the Invention [Problem to be solved by the invention]

[0008] In order to solve the above-mentioned problems, the present invention aims to provide a probe pin and a method for manufacturing the probe pin, which utilizes various shapes of vertical slits and / or horizontal slits to adjust flexibility to facilitate elastic deformation, realize narrow pitches of electrode pads, and adjust cross-sectional area to maintain excellent high-frequency signal characteristics.

[0009] Another object of the present invention is to provide a probe pin and a method for manufacturing the probe pin, which utilizes a plurality of isolation bodies separated by vertical and horizontal slits to reduce the skin effect even in high frequency signals and increase current carrying capacity.

[0010] Another object of the present invention is to provide a probe card including probe pins that utilize a plurality of isolation bodies separated by vertical and / or horizontal slits to easily insert the probe pins into the upper and lower plates and prevent them from coming off. [Means for solving the problem]

[0011] To achieve the above object, a probe pin according to an embodiment of the present invention includes a body extending in one direction and a slit formed through a portion of the body, the body including a first body constituting one side of the body, a second body extending from the first body to form an intermediate portion of the body, and a third body extending from the second body to form the other side of the body, and the slit may include a vertical slit formed in a vertical direction through a horizontal surface of the body, and a horizontal slit formed in a horizontal direction through a vertical surface of the body.

[0012] At least one of the vertical slit and the horizontal slit may be formed in the second body.

[0013] At least one of the vertical slit and the horizontal slit may extend from the second body to an end of the first body, and one side of the first body may be open.

[0014] The vertical slit and the horizontal slit may intersect with each other.

[0015] In addition, the body may include a first spaced body, a second spaced body, a third spaced body, and a fourth spaced body spaced from one another by the vertical slit and the horizontal slit, and at least one of the first spaced body to the fourth spaced body may include an over-spaced portion bent in a direction that increases a spaced distance from at least one of the remaining bodies excluding the at least one, and the over-spaced portion may come into contact with an upper plate into which the body is inserted, thereby preventing the body from being separated.

[0016] The body may include a first remote body, a second remote body, a third remote body, and a fourth remote body spaced apart from one another by the vertical slit and the horizontal slit, and may further include a tie portion connecting an inner surface of the first remote body to an inner surface of at least one of the second remote body to the fourth remote body, and a recessed portion recessed in at least one of an outer surface facing the inner surface of the first remote body connected to the tie portion and an outer surface facing the at least one inner surface.

[0017] At least one of the vertical slits and the horizontal slits may be provided in plural.

[0018] The vertical slit and the horizontal slit may have different widths or lengths.

[0019] The probe pin may further include a contact tip located at an end region of the third body to contact the test object.

[0020] Additionally, the contact tip may be made of a different material than the body.

[0021] The contact tip may also include a rhodium layer made of a material containing rhodium.

[0022] The contact tip may further include a protective layer located on the rhodium layer and made of a material having a lower hardness than the rhodium.

[0023] The thickness of the contact tip may be greater than the thickness of the horizontal slit.

[0024] The horizontal slit and the contact tip may be positioned at different heights so as not to form an overlapping region.

[0025] The body may include a first isolated body, a second isolated body, a third isolated body, and a fourth isolated body separated from each other by the vertical slit and the horizontal slit, and at least one of the first isolated body to the fourth isolated body may further include an insulating layer formed to be insulated from the rest of the bodies except for the at least one, and the insulating layer may be formed on an inner surface of the at least one body facing the rest and extend from the first body to the third body.

[0026] Also, at least one of the first to fourth isolated bodies may be bent or have a protrusion to be connected to a ground wire as a ground pin.

[0027] In addition, a probe pin according to an embodiment of the present invention may include a body extending in one direction, a vertical slit formed vertically through a horizontal surface of the body, a horizontal slit formed horizontally through the vertical surface of the body, and a contact tip formed on one side of the body.

[0028] The contact tip may be formed at a height closer to the lower surface of the body than to the upper surface of the body.

[0029] Meanwhile, a probe card according to an embodiment of the present invention may include a body, a probe pin having a vertical slit formed vertically through a horizontal surface of the body and a horizontal slit formed horizontally through the vertical surface of the body, an upper plate having an upper hole through which the probe pin passes, and a lower plate having a lower hole through which the probe pin passes, and the body may include a first body located in the upper hole, a third body located in the lower hole, and a second body formed intermediate the first body and the third body.

[0030] In addition, the body may include a first spaced body, a second spaced body, a third spaced body, and a fourth spaced body spaced from one another by the vertical slit and the horizontal slit, and at least one of the first spaced body to the fourth spaced body may include an over-spaced portion bent in a direction that increases a spaced distance from at least one of the remaining bodies excluding the at least one, and the over-spaced portion may come into contact with an upper plate into which the body is inserted, thereby preventing the body from being separated.

[0031] The body may include a first isolated body, a second isolated body, a third isolated body, and a fourth isolated body separated from each other by the vertical slit and the horizontal slit, and at least one of the first isolated body to the fourth isolated body may further include an insulating layer formed to be insulated from the rest of the bodies except for the at least one, the insulating layer being formed on an inner surface of the at least one body facing the rest and extending from the first body to the third body, and the upper plate may include a ground wiring on an upper surface or a lower surface, and the at least one may be connected to the ground wiring.

[0032] Meanwhile, a method for manufacturing a probe pin according to an embodiment of the present invention may include the steps of providing a base substrate, providing a first body layer on the base substrate, providing a second body layer on the first body layer, the second body layer including a connecting portion and a horizontal slit, and providing a third body layer on the second body layer.

[0033] The second body layer may further include a contact tip.

[0034] Furthermore, the method may further include providing a first sacrificial layer around the first body layer before providing the second body layer, and the providing the second body layer may include providing the connecting portion on a partial region of the first body layer and providing the contact tip on a region including a boundary between the first body layer and the first sacrificial layer, and the contact tip may be made of a different material from the body layer and the second body layer.

[0035] Also, the step of providing the contact tip may include the steps of providing a second metal and providing a protective layer on the second metal, and the protective layer may be made of a material having a lower hardness than the second metal.

[0036] The first body layer, the second body layer, and the third body layer may each include a vertical slit.

[0037] In addition, a method for manufacturing a probe pin according to an embodiment of the present invention may include the steps of providing a base substrate having a protrusion on an upper surface thereof, providing a contact tip on the upper surface of the protrusion, and providing a body on at least a portion of the contact tip and the base substrate.

[0038] In addition, the process of providing the body may include the processes of providing a first body layer on at least a portion of the contact tip and the base substrate, providing a second body layer on the first body layer, the second body layer including a connecting portion and a horizontal slit, and providing a third body layer on the second body layer.

[0039] Meanwhile, a method for manufacturing a probe card according to an embodiment of the present invention may include the steps of adjoining an upper plate and a lower plate to align the upper hole of the upper plate with the lower hole of the lower plate, passing a probe pin through the upper hole and the lower hole, and raising the upper plate to contact the over-separated portion of the probe pin with the upper hole.

[0040] In addition, a method for manufacturing a probe card according to an embodiment of the present invention may include the steps of: adjoining an upper plate and a lower plate and overlapping an upper hole of the upper plate with a lower hole of the lower plate; passing a probe pin through the upper hole and the lower hole; and connecting an isolated body including a ground layer among first to fourth isolated bodies separated by vertical and horizontal slits to a ground wiring. [Effects of the Invention]

[0041] The present invention can provide the effect of facilitating elastic deformation by providing vertical and horizontal slits to adjust the flexibility of the probe pin.

[0042] Furthermore, the present invention can provide the effect of maintaining excellent high frequency signal characteristics by adjusting the cross-sectional area of ​​the probe pin.

[0043] In addition, the present invention can provide the effect of making it possible to easily insert probe pins into the upper plate and the lower plate and preventing the inserted probe pins from falling out by utilizing a plurality of isolation bodies separated by vertical slits and / or horizontal slits. [Brief explanation of the drawings]

[0044] [Figure 1] 1A and 1B illustrate probe pins according to an embodiment of the present invention. [Figure 2] 1A and 1B are diagrams illustrating a probe card with probe pins inserted therein according to an embodiment of the present invention. [Figure 3a] 10A to 10C are diagrams illustrating the operation of a probe card into which a probe pin is inserted according to an embodiment of the present invention. [Figure 3b] 10A to 10C are diagrams illustrating the operation of a probe card into which a probe pin is inserted according to an embodiment of the present invention. [Figure 4a] FIG. 2 is a front view of a probe pin according to an embodiment of the present invention. [Figure 4b] FIG. 2 is a side view of a probe pin according to an embodiment of the present invention. [Figure 5a] FIG. 2 is a front view of a probe pin according to an embodiment of the present invention. [Figure 5b] FIG. 2 is a side view of a probe pin according to an embodiment of the present invention. [Figure 6a] FIG. 2 is a front view of a probe pin according to an embodiment of the present invention. [Figure 6b] FIG. 2 is a side view of a probe pin according to an embodiment of the present invention. [Figure 6c] 1 is a diagram showing an overall view of a probe pin according to an embodiment of the present invention; [Figure 7a] FIG. 2 is a front view of a probe pin according to an embodiment of the present invention. [Figure 7b] FIG. 2 is a side view of a probe pin according to an embodiment of the present invention. [Figure 7c] 1 is a diagram showing an overall view of a probe pin according to an embodiment of the present invention; [Figure 8a] 10A and 10B are diagrams illustrating a process in which the upper plate and the excessively spaced portion come into contact with each other. [Figure 8b] 10A and 10B are diagrams illustrating a process in which the upper plate and the excessively spaced portion come into contact with each other. [Figure 8c] 10A and 10B are diagrams illustrating a process in which the upper plate and the excessively spaced portion come into contact with each other. [Figure 9a] 10A and 10B are diagrams illustrating the process in which the upper plate passes through the recessed portion. [Figure 9b] 10A and 10B are diagrams illustrating the process in which the upper plate passes through the recessed portion. [Figure 9c] 10A and 10B are diagrams illustrating the process in which the upper plate passes through the recessed portion. [Figure 10a] 1A-1C illustrate end views of probe pins according to various embodiments of the present invention. [Figure 10b] 1A-1C illustrate end views of probe pins according to various embodiments of the present invention. [Figure 10c] 1A-1C illustrate end views of probe pins according to various embodiments of the present invention. [Figure 10d] 1A-1C illustrate end views of probe pins according to various embodiments of the present invention. [Figure 11a] 1A-1C illustrate vertical and horizontal slits according to various embodiments of the present invention. [Figure 11b] 1A-1C illustrate vertical and horizontal slits according to various embodiments of the present invention. [Figure 11c] 1A-1C illustrate vertical and horizontal slits according to various embodiments of the present invention. [Figure 11d] 1A-1C illustrate vertical and horizontal slits according to various embodiments of the present invention. [Figure 11e] 1A-1C illustrate vertical and horizontal slits according to various embodiments of the present invention. [Figure 11f] 1A-1C illustrate vertical and horizontal slits according to various embodiments of the present invention. [Figure 12a] 1A-1C illustrate vertical and horizontal slits according to various embodiments of the present invention. [Figure 12b] 1A-1C illustrate vertical and horizontal slits according to various embodiments of the present invention. [Figure 12c] 1A-1C illustrate vertical and horizontal slits according to various embodiments of the present invention. [Figure 12d] 1A-1C illustrate vertical and horizontal slits according to various embodiments of the present invention. [Figure 12e] 1A-1C illustrate vertical and horizontal slits according to various embodiments of the present invention. [Figure 12f] 1A-1C illustrate vertical and horizontal slits according to various embodiments of the present invention. [Figure 13a] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 13b] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 13c] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 13d] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 13e] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 13f] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 13g] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 13h] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 13i] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 13j] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 13k] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 13l] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 14a] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 14b] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 14c] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 14d] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 14e] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 14f] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 14g] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 14h] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 14i] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 14j] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 14k] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 14l] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 15a] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 15b] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 15c] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 15d] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 15e] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 15f] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 15g] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 15h] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 15i] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 15j] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 15k] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 15l] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 16a] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 16b] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 16c] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 16d] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 16e] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 16f] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 16g] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 16h] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 17a]1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 17b] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 17c] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 17d] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 17e] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 17f] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 17g] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 17h] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 17i] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 17j] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 17k] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 17l] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 18a] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 18b] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 18c] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 18d] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 18e] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 18f] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 18g] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 18h] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 18i] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 18j] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 18k] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 18l] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 19a] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 19b] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 19c] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 19d] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 19e] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 19f] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 19g] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 19h] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 19i] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 19j] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 19k] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 19l] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 20a] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 20b] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 20c] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 20d] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 20e] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 20f] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 20g] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 20h] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 20i] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 20j] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 20k] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 20l] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 21a] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 21b] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 21c] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 21d] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 21e] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 21f]1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 21g] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 21h] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 21i] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 21j] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 21k] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 21l] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 22a] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 22b] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 22c] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 22d] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 22e] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 22f] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 22g] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 22h] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 22i] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 22j] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 22k] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 22l] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 23a] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 23b] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 23c] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 23d] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 23e] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 23f] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 23g] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 23h] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 24a] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 24b] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 24c] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 24d] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 24e] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 24f] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 24g] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 24h] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 24i] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 24j] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 24k] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 24l] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 25a] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 25b] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 25c] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 25d] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 25e] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 25f] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 25g] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 25h] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 26a] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 26b] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 26c] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 26d] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 26e] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 26f] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 26g]1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 26h] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 26i] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 26j] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 26k] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 26l] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 27a] 1A and 1B illustrate probe pins according to an embodiment of the present invention. [Figure 27b] 1A and 1B illustrate probe pins according to an embodiment of the present invention. [Figure 28a] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 28b] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 28c] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 28d] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 28e] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 28f] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 28g] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 28h] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 28i] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 28j] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 28k]1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 28l] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 29a] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 29b] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 29c] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 29d] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 29e] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 29f] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 29g] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 29h] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 29i] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 29j] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 29k] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 29l] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 30a] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 30b] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 30c] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 30d] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 30e] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 30f] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 30g] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 30h] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 30i] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 30j] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 30k] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 30l] 1A to 1C are diagrams illustrating a method for manufacturing a probe pin according to an embodiment of the present invention. [Figure 31a] 10A-10C illustrate insulating layers of isolation bodies according to embodiments of the present invention. [Figure 31b] 10A-10C illustrate insulating layers of isolation bodies according to embodiments of the present invention. [Figure 31c] 10A-10C illustrate insulating layers of isolation bodies according to embodiments of the present invention. [Figure 31d] 10A-10C illustrate insulating layers of isolation bodies according to embodiments of the present invention. [Figure 32a] FIG. 2 is a front view of a probe pin with an insulating layer according to an embodiment of the present invention. [Figure 32b] 1A and 1B are side views of a probe pin with an insulating layer according to an embodiment of the present invention. [Figure 32c] 3A and 3B are diagrams illustrating an end of a first body according to an embodiment of the present invention. [Figure 32d] 4A and 4B are diagrams illustrating a connection state between a contact tip and a ground wire according to an embodiment of the present invention; [Figure 33a] FIG. 2 is a front view of a probe pin with an insulating layer according to an embodiment of the present invention. [Figure 33b]1A and 1B are side views of a probe pin with an insulating layer according to an embodiment of the present invention. [Figure 33c] 3A and 3B are diagrams illustrating an end of a first body according to an embodiment of the present invention. [Figure 33d] 4A and 4B are diagrams illustrating a connection state between a contact tip and a ground wire according to an embodiment of the present invention; [Figure 34a] FIG. 2 is a front view of a probe pin with an insulating layer according to an embodiment of the present invention. [Figure 34b] 1A and 1B are side views of a probe pin with an insulating layer according to an embodiment of the present invention. [Figure 34c] 3A and 3B are diagrams illustrating an end portion of a first body and a ground wiring according to an embodiment of the present invention. [Figure 34d] 10A and 10B are diagrams illustrating the positional state of a ground pin and a ground wiring according to an embodiment of the present invention. [Figure 35] 1A and 1B show a probe pin with a protrusion according to an embodiment of the present invention; DETAILED DESCRIPTION OF THE INVENTION

[0045] Those of ordinary skill in the art will be able to develop various devices that embody the principles of the invention and fall within the concept and scope of the invention, even if not explicitly described or illustrated herein. Furthermore, all conditional terms and embodiments listed herein are expressly intended solely for the purpose of enabling the concept of the invention to be understood, and should not be construed as being limited to the embodiments and conditions specifically listed in this specification.

[0046] The above objects, features, and advantages will become more apparent from the following detailed description of the invention taken in conjunction with the accompanying drawings, which will enable those skilled in the art to easily implement the technical idea of ​​the invention.

[0047] The embodiments described herein will be described with reference to idealized drawings of the present invention. The shapes of the illustrative drawings may vary due to manufacturing techniques and / or tolerances. Therefore, the embodiments of the present invention are not limited to the specific shapes shown in the drawings, and also include changes in shapes produced by the manufacturing process.

[0048] While describing various embodiments, components performing the same functions will be given the same names and reference numbers for convenience, even if the embodiments are different, and configurations and operations already described in other embodiments will be omitted for convenience.

[0049] Next, the terms used in this specification will be briefly explained with reference to FIG.

[0050] FIG. 1 is a diagram illustrating a probe pin 100 according to an embodiment of the present invention.

[0051] Referring to FIG. 1, the expression "at least one of A, B, and C" used in this specification means that the component is composed of one, two, or three of A, B, and C. The expression "E provided on D" includes both the case where E is provided in direct contact with D and the case where E is provided in indirect contact with D through another structure provided between D and E. Furthermore, width, height, and length are based on the x-axis, y-axis, and z-axis, respectively. Furthermore, the horizontal and side directions are based on the x-axis, the vertical, top, and bottom directions are based on the y-axis, and the front and rear directions are based on the z-axis. However, for ease of explanation, the width of a vertical slit and the height of a horizontal slit will both be referred to as "width."

[0052] The probe pin 100, the probe card 200 including the probe pin, and the manufacturing method thereof will be described below.

[0053] FIG. 2 is a diagram showing a probe card 200 into which a probe pin 100 according to an embodiment of the present invention is inserted.

[0054] First, the overall configuration of the probe pin 100 and the probe card 200 will be described.

[0055] The probe card 200 may include probe pins 100. The probe pins 100 may be electrically connected to a circuit board (not shown). An electrical signal flowing through the probe pins 100 may be used to test for defects in a semiconductor device.

[0056] 2, the probe card 200 may include an upper plate 210 and a lower plate 220. The upper plate 210 may include upper holes 211 through which the probe pins 100 pass, and the lower plate 220 may include lower holes 221 through which the probe pins 100 pass.

[0057] The upper plate 210 and the lower plate 220 may be spaced apart from each other, or may be connected to each other via a spacer SP provided at a spaced apart position.

[0058] The probe card 200 may include a plurality of probe pins 100. In this case, the upper plate 210 may include a plurality of upper holes 211 through which the plurality of probe pins 100 may pass, and the lower plate 220 may include a plurality of lower holes 221 through which the plurality of probe pins 100 may pass.

[0059] A probe card 200 including a plurality of probe pins 100 can be positioned on a wafer, and the probe pins 100 can be brought into an overdrive state in which pressure is applied by contacting the electrode pads, thereby detecting defects in semiconductor devices.

[0060] 3a and 3b are diagrams illustrating the operation of a probe card with probe pins inserted therein according to an embodiment of the present invention.

[0061] 3a and 3b schematically show a probe card 200, a test object W, and a chuck table CT. In the method for manufacturing a probe card according to an embodiment of the present invention, the chuck table CT can be moved horizontally and vertically during the overdrive process. In this case, the plurality of probe pins 100 can be configured as straight pins.

[0062] 3a shows a state in which the test object W is further elevated toward the probe card 200 via the chuck table CT while the test object W is in contact with the lower end of the straight pin. The chuck table CT can move horizontally, for example, to the left, while the test object W is further elevated. In FIG. 3a, the arrows around the test object W indicate the direction in which the chuck table CT moves horizontally, and the arrows around the chuck table CT indicate the direction in which the chuck table CT moves vertically.

[0063] Referring to FIG. 3b, the plurality of probe pins 100, each consisting of a single pin, are bent by horizontal movement of the chuck table CT to the left.

[0064] The method for manufacturing a probe card according to an embodiment of the present invention may perform a process of moving a chuck table CT in horizontal and vertical directions to control the behavior of the plurality of probe pins 100. Therefore, in the method for manufacturing a probe card according to an embodiment of the present invention, when the plurality of probe pins 100 are shaped pins, warpage deformation may be generated in the shaped pins via the chuck table CT.

[0065] 3a and 3b, the method for manufacturing a probe card according to an embodiment of the present invention may perform a process of moving the chuck table CT in horizontal and vertical directions to control the behavior of the plurality of probe pins 100. Therefore, the method for manufacturing a probe card according to an embodiment of the present invention may include straight pins as the plurality of probe pins 100, realize quick assembly with the plates 210 and 220, and generate warpage deformation of the probe pins 100 in a desired direction via the chuck table CT.

[0066] As described above, the method for manufacturing a probe card according to an embodiment of the present invention controls the driving of the multiple probe pins 100 via the chuck table CT, thereby minimizing the damage and breakage of the probe pins 100 and the scrub phenomenon, thereby enabling efficient testing of the electrical characteristics of semiconductor devices.

[0067] Next, the probe pin 100 according to a plurality of embodiments of the present invention will be described in detail.

[0068] Figures 4a and 4b are front and side views of a probe pin 100 according to an embodiment of the present invention. Figures 5a and 5b are front and side views of a probe pin 100 according to an embodiment of the present invention. Figures 6a, 6b, and 6c are front, side, and overall views of a probe pin 100 according to an embodiment of the present invention. Figures 7a, 7b, and 7c are front, side, and overall views of a probe pin 100 according to an embodiment of the present invention.

[0069] 4a and 4b, a probe pin 100 according to an embodiment of the present invention may include a body 110 and a slit 120 formed through a portion of the body 110.

[0070] The probe pin 100 may be, but is not limited to, a cobra pin, a straight pin, or a modified straight pin. Therefore, the body 110 may extend in one direction. The body 110 may be straight or may have at least one horizontally bent portion.

[0071] The body 110 may include a first body 111 that constitutes one side of the body 110, a second body 112 that extends from the first body 111 and constitutes the middle part of the body 110, and a third body 113 that extends from the second body 112 and constitutes the other side of the body 110.

[0072] The slit 120 may include a vertical slit 120 a formed vertically through the horizontal surface HS of the body 110 .

[0073] The body 110 may have one or more horizontally bent portions. Here, the horizontal direction may refer to either the +x direction or the -x direction. That is, the body 110 may have a bent shape. The body 110 may be further elastically deformed in the bent direction in an overdrive state. For example, if the body 110 is formed to bend in the +x direction from the front to the rear, the rear portion of the body 110 may be elastically deformed in the +x direction.

[0074] The body 110 may include a first body 111, a second body 112, and a third body 113. The first body 111 may constitute one side of the body 110 and may be connected to a circuit board. In this case, connection means electrical connection, and may include both direct connection and indirect connection.

[0075] The second body 112 may extend from the first body 111 and may form a middle portion of the body 110 .

[0076] The third body 113 may extend from the second body 112 and may constitute one side of the body 110. The third body 113 may directly contact an electrode pad on the wafer or indirectly contact it via a contact tip 130 to transmit an electrical signal.

[0077] The body 110 can be made of a metal, and a metal with high electrical conductivity can be used to improve the current carrying capacity (CCC).

[0078] The body 110 may be made of copper (Cu), silver (Ag), gold (Au), rhodium (Rd), platinum (Pt), iridium (Ir), palladium (Pd), nickel (Ni), manganese (Mn), tungsten (W), phosphorus (P), or an alloy thereof. The body 110 may also be made of a palladium-cobalt (PdCo) alloy, a palladium-nickel (PdNi) alloy, a nickel-phosphorus (NiP) alloy, a nickel-manganese (NiMn) alloy, a nickel-cobalt (NiCo) alloy, or a nickel-tungsten alloy. However, the materials of the body 110 are not limited to those listed above.

[0079] The slit 120 may be formed to penetrate a portion of the body 110. The slit 120 may also include a vertical slit 120a. The vertical slit 120a may be formed to penetrate a horizontal surface of the body 110. Specifically, the vertical slit 120a may extend from the upper surface to the lower surface of the body 110, or may extend in the longitudinal direction of the body 110. In this case, the vertical slit 120a may be formed to bend along the curved shape of the body 110.

[0080] The vertical slits 120a can increase the flexibility of the body 110, allowing for smooth elastic deformation in an overdrive state, and can also reduce the cross-sectional area perpendicular to the longitudinal direction of the body 110, preventing attenuation of high-frequency signals.

[0081] Because the skin effect causes AC current to flow concentratedly on the surface of a conductor, signal attenuation can be prevented and current-carrying capacity can be increased by increasing the surface area of ​​body 110. Therefore, vertical slits 120a and horizontal slits 120b increase the surface area of ​​body 110, thereby increasing current-carrying capacity.

[0082] 5a and 5b, a probe pin 100 according to an embodiment of the present invention may include a body 110 and a slit 120. The body 110 may include a first body 111, a second body 112, and a third body 113. The slit 120 may include a horizontal slit 120b formed in a horizontal direction penetrating a vertical surface of the body 110. Here, a description of the same components as those described above will be omitted.

[0083] The horizontal slit 120b may be formed to penetrate the vertical plane VS of the body 110. Specifically, the horizontal slit 120b may extend from the left side to the right side of the body 110, or may extend in the longitudinal direction of the body 110. In this case, the horizontal slit 120b may be formed along the shape of the body 110.

[0084] The horizontal slits 120b can increase the flexibility of the body 110 to enable smooth elastic deformation in an overdrive state, and the vertical slits 120a can reduce the cross-sectional area of ​​the body 110 to prevent signal attenuation of high frequency signals.

[0085] 6a, 6b, and 6c, a probe pin 100 according to an embodiment of the present invention may include a body 110 and a slit 120. The body 110 may include a first body 111, a second body 112, and a third body 113. The slit 120 may include a vertical slit 120a and a horizontal slit 120b. Here, a description of the same components as those described above will be omitted.

[0086] In addition, in the probe pin 100 according to the embodiment of the present invention, at least one of the vertical slit 120a and the horizontal slit 120b may be formed in the second body 112.

[0087] The slit 120 may include both a vertical slit 120a and a horizontal slit 120b. In this case, the vertical slit 120a may be formed to penetrate a horizontal plane corresponding to the entire length or a portion of the body 110, and the horizontal slit 120b may be formed to penetrate a vertical plane corresponding to the entire length or a portion of the body 110 that the vertical slit 120a does not penetrate. That is, the vertical slit 120a and the horizontal slit 120b may be formed so as not to intersect with each other.

[0088] Furthermore, vertical slits 120a and horizontal slits 120b may be formed through the horizontal and vertical surfaces of the second body 112, respectively.

[0089] The vertical slits 120a and the horizontal slits 120b are provided simultaneously to further improve the flexibility of the body 110, thereby enabling smooth elastic deformation in an overdrive state. Also, the vertical slits 120a and the horizontal slits 120b are provided simultaneously to further reduce the cross-sectional area of ​​the body 110, thereby preventing signal attenuation of high frequency signals.

[0090] In addition, the vertical slit 120a and the horizontal slit 120b may be provided simultaneously to achieve a narrow pitch effect. For example, if only the vertical slit 120a is provided, the flexibility of the body 110 may be insufficient, which may result in damage to the semiconductor device. Similarly, if only the horizontal slit 120b is provided, the flexibility of the body 110 may be insufficient, which may result in damage to the semiconductor device.

[0091] When multiple vertical slits 120a are provided, the flexibility of the body 110 can be increased, but there is a problem in that the width of the body 110 (in the direction in which the multiple vertical slits 120a are arranged) becomes wider, making it difficult to achieve a narrow pitch.

[0092] Therefore, by including the vertical slits 120a and the horizontal slits 120b in the body 110 at the same time, the flexibility of the body 110 can be further increased and a narrow pitch effect can be generated at the same time.

[0093] 7a, 7b, and 7c, the probe pin 100 according to the embodiment of the present invention may include a vertical slit 120a and a horizontal slit 120b. At least one of the vertical slit 120a and the horizontal slit 120b may extend from the second body 112 to an end of the first body 111, so that one side of the first body 111 is open.

[0094] The vertical slit 120a may extend from the second body 112 to the first body 111. The vertical slit 120a may open one side of the first body 111. That is, the vertical slit 120a may extend to the rear surface of the end portion to form a vertical opening on the rear surface of the end portion.

[0095] The horizontal slit 120b may extend from the second body 112 to the first body 111. The horizontal slit 120b may open one side of the first body 111. That is, the horizontal slit 120b may extend to the rear surface of the end of the body 110 to form a horizontal opening on the rear surface of the end.

[0096] Furthermore, both the vertical slit 120a and the horizontal slit 120b may extend from the second body 112 to the first body 111. Both the horizontal slit 120b and the horizontal slit 120b may open one side of the first body 111. That is, the vertical slit 120a and the horizontal slit 120b may extend to the rear surface of the end of the body 110 to form a cross-shaped opening.

[0097] The vertical slits 120a and / or the horizontal slits 120b extend to the rear surface of the end of the body 110 to further increase the flexibility of the body 110, thereby enabling smooth elastic deformation in an overdrive state, and further reducing the cross-sectional area of ​​the body 110 to prevent signal attenuation of high frequency signals. At the same time, a narrow pitch effect can be achieved.

[0098] Furthermore, because the vertical slits 120a and / or the horizontal slits 120b extend to the first body 111, the flexibility of the first body 111 can be further increased. That is, while the flexibility of the body 110 is increased, the flexibility of the third body 113 can be maintained relatively low. As a result, the third body 113 deforms less, which reduces the force applied to the lower hole 221 of the lower plate 220, thereby reducing wear on the lower hole 221 and enabling more accurate contact with the semiconductor device.

[0099] Furthermore, the vertical slits 120a and the horizontal slits 120b according to the embodiment of the present invention may intersect with each other.

[0100] For example, the body 110 may be realized in such a manner that the second body 112 has a vertical slit 120a and the first body 111 has a horizontal slit 120b. In this case, the vertical slit 120a and the horizontal slit 120b do not intersect with each other, so the cross-sectional areas of the second body 112 and the first body 111 can be kept constant. Nevertheless, the second body 112 has the vertical slit 120a, so that greater lateral flexibility can be achieved.

[0101] Alternatively, the body 110 may be realized in a form in which the second body 112 has vertical slits 120a and horizontal slits 120b, the body 110 may be realized in a form in which the first body 111 has vertical slits 120a and horizontal slits 120b, and the body 110 may be realized in a form in which both the second body 112 and the first body 111 have vertical slits 120a and horizontal slits 120b. The vertical slits 120a and horizontal slits 120b are arranged to intersect with each other, which can significantly narrow the overall cross-sectional area of ​​the body 110 and further increase flexibility.

[0102] Next, a method for manufacturing the probe pin 100 including the excessively spaced portion 116 according to a plurality of embodiments of the present invention and the probe card 200 including the probe pin 100 will be described.

[0103] 8a to 8c are diagrams showing the process in which the upper plate 210 and the excessively spaced portion 116 come into contact with each other.

[0104] 8a to 8c, a probe pin 100 according to an embodiment of the present invention may include a body 110 and a vertical slit 120a. The body 110 may include a first spaced body 110a and a second spaced body 110b spaced apart from each other by the vertical slit 120a.

[0105] The first to eighth isolated bodies 110a to 110h described in the present invention are merely separate concepts for the sake of convenience in describing the multiple isolated bodies, and their positions are not limited to those shown in the drawings and embodiments. For example, the first isolated body 110a may refer to any one of the multiple isolated bodies.

[0106] The plurality of separated bodies may be formed in the first body 111 and the second body 112. In this case, the third body 113 does not have the slit 120 formed therein, so the body 110 is not divided.

[0107] In other words, the first body 111 and the second body 112 may comprise separate bodies, but the third body 113 may be integrally formed.

[0108] At least one of the first and second separated bodies 110a and 110b may include an over-spacing portion 116 bent in a direction that increases the separation distance from the other separated body. In addition, the first and second separated bodies 110a and 110b may each include an over-spacing portion 116 bent in a direction that increases the separation distance from each other.

[0109] That is, only the first remote body 110a may include the over-spacing portion 116, only the second remote body 110b may include the over-spacing portion 116, or both the first remote body 110a and the second remote body 110b may include the over-spacing portion 116. Because the vertical cross-sectional area of ​​the first remote body 110a along the longitudinal direction can be maintained constant, the first remote body 110a can be bent to protrude in the lateral (+x) direction due to the over-spacing portion 116. Furthermore, because the vertical cross-sectional area of ​​the second remote body 110b along the longitudinal direction can be maintained constant, the second remote body 110b can be bent to protrude in the lateral (-x) direction due to the over-spacing portion 116.

[0110] The probe card 200 may include an upper plate 210 having an upper hole 211 and a lower plate 220 having a lower hole 221. The upper hole 211 and the lower hole 221 of the probe card 200 allow the body 110 to pass through, and the first body 111 may be positioned in the upper hole 211, and the third body 113 may be positioned in the lower hole 221.

[0111] The probe card 200 may further include an intermediate plate (not shown) having an intermediate hole through which the body 110 may pass, and the second body 112 may be positioned in the intermediate hole.

[0112] 8a and 8b, the over-separated portion 116 may be located in at least one of the first body 111, the second body 112, and the third body 113. The over-separated portion 116 of the first body 111 may contact the upper hole 211 to be fixed to the upper plate 210, and the over-separated portion 116 of the second body 112 may contact the middle hole to be fixed to the middle plate.

[0113] The probe pin 100 and / or the body 110 are fixed to the probe card 200 via the over-separation portion 116, which can provide the effect of preventing the probe pin 100 and / or the body 110 from being separated from the probe card 200.

[0114] 7a to 7c, the probe pin 100 according to the embodiment of the present invention may include a body 110 and a horizontal slit 120b. The body 110 may include a first spaced body 110a and a second spaced body 110b spaced apart from each other by the horizontal slit 120b.

[0115] That is, the first and second separated bodies 110a and 110b are not limited to those separated from each other by the vertical slit 120a, but may be those separated from each other by the horizontal slit 120b. The effect of the first and second separated bodies 110a and 110b separated from each other by the horizontal slit 120b is as described above.

[0116] 7a to 8c, the probe pin 100 according to the embodiment of the present invention may include a body 110, a vertical slit 120a, and a horizontal slit 120b. The body 110 may include a first spaced body 110a, a second spaced body 110b, a third spaced body 110c, and a fourth spaced body 110d spaced apart from one another by the vertical slit 120a and the horizontal slit 120b.

[0117] At least one of the first to fourth isolated bodies 110a to 110d may include an over-separation portion 116 bent in a direction that increases the separation distance between the at least one isolated body and the remaining at least one isolated body excluding the at least one isolated body.

[0118] Specifically, the first and second remote bodies 110a and 110b may include over-spacing portions 116 that are bent in a direction that increases the distance from the third and fourth remote bodies 110c and 110d, respectively. In contrast, the first and third remote bodies 110a and 110c may include over-spacing portions 116 that are bent in a direction that increases the distance from the second and fourth remote bodies 110b and 110d, respectively.

[0119] That is, at least one of the first to fourth separated bodies 110a to 110d may include an over-separated portion 116. In this case, the separated body including the over-separated portion 116 may bend in a direction that increases the separation distance from the separated body that does not include the over-separated portion 116.

[0120] The over-separated portion 116 may be located in at least one of the first body 111, the second body 112, and the third body 113, as described above.

[0121] The body 110 or the probe pin 100 including the over-separated portion 116 may be provided on a probe card 200 .

[0122] Referring again to Figures 8a to 8c, a manufacturing method of a probe card 200 according to an embodiment of the present invention may include the steps of adjoining an upper plate 210 and a lower plate 220 and overlapping the upper hole 211 of the upper plate 210 with the lower hole 221 of the lower plate 220, passing the probe pin 100 through the upper hole 211 and the lower hole 221, and lifting the upper plate 210 to bring the over-separated portion 116 of the probe pin 100 into contact with the upper hole 211.

[0123] First, the upper plate 210 and the lower plate 220 of the probe card 200 are placed adjacent to each other, and the upper holes 211 of the upper plate 210 and the lower holes 221 of the lower plate 220 are overlapped with each other.

[0124] The upper plate 210 may move downward to be adjacent to the lower plate 220. At this time, the upper hole 211 and the lower hole 221 may overlap each other to form one continuous hole that is vertically aligned. In this case, the probe pin 100 and / or the body 110 may have an over-separation portion 116 in the first body 111.

[0125] Next, a process of passing the probe pin 100 through the upper hole 211 and the lower hole 221 can be performed.

[0126] When the upper plate 210 is moved downward and overlapped, the body 110 or the probe pin 100 can pass through the upper hole 211 and the lower hole 221 .

[0127] Next, the upper plate 210 may be raised to bring the over-separated portions 116 of the probe pins 100 into contact with the upper holes 211 .

[0128] When the upper plate 210 moves upward, the distance between the first and second isolated bodies 110a and 110b decreases, and the first and second isolated bodies 110a and 110b may have a thickness smaller than that of the upper hole 211. This is a phenomenon that may occur temporarily when the upper plate 210 moves.

[0129] The upper plate 210 may move upward to come into contact with the over-separated portion 116. That is, the over-separated portion 116 may come into contact with the upper hole 211 and be fixed to the probe card 200. At this time, the over-separated portion 116 may be deformed by receiving an inward force from the upper hole 211, and the first and second separated bodies 110a and 110b may come into contact with each other.

[0130] The sum of the widths of the first and second isolated bodies 110a and 110b and the slit 120 therebetween may be greater than the width of the upper hole 211. Thus, the first and second isolated bodies 110a and 110b may be fixed by receiving force through the upper hole 211.

[0131] The body 110 may be composed of a first isolated body 110a and a second isolated body 110b that are spaced apart from each other, or may be composed of first isolated bodies 110a to 110d that are spaced apart from each other. The isolated bodies that are spaced apart from each other can deform inward when the upper plate 210 is raised, making it easy to position the upper hole 211 of the upper plate 210 in the first body 111.

[0132] Next, a probe pin 100 including a tie portion 117 and a recessed portion 117a according to several embodiments of the present invention will be described.

[0133] 9a to 9c are diagrams showing the process in which the upper plate 210 passes through the recess 117a.

[0134] 9a to 9c, a probe pin 100 according to an embodiment of the present invention may include a body 110, a vertical slit 120a, and a tie portion 117, and may further include a recess 117a. In this case, the body 110 may include a first spaced body 110a and a second spaced body 110b spaced apart by the vertical slit 120a.

[0135] The tie portion 117 may connect the inner surface of the first remote body 110a to the inner surface of the second remote body 110b. If the probe pin 100 includes only the vertical slit 120a, the tie portion 117 may extend horizontally to connect the first remote body 110a to the second remote body 110b. Here, the "inner surface" may refer to the surface of the first remote body 110a and the second remote body 110b facing inward or the surfaces facing each other.

[0136] Alternatively, if the probe pin 100 includes only the horizontal slit 120b, the tie portion 117 may extend vertically to connect the first and second isolated bodies 110a, 110b.

[0137] The recess 117a may be formed only on the outer surface of the first isolated body 110a or only on the outer surface of the second isolated body 110b. Furthermore, the recess 117a may be formed on each of the outer surfaces of the first isolated body 110a and the second isolated body 110b. Here, the outer surface may refer to the surface exposed to the outer portion of the body 110 or the surface opposite the inner surface.

[0138] Specifically, the first and second isolated bodies 110a and 110b may each have a recess 117a formed on an outer surface thereof and a tie portion 117 formed on an inner surface thereof.

[0139] Meanwhile, the body 110 may include a first spaced body 110a, a second spaced body 110b, a third spaced body 110c, and a fourth spaced body 110d separated by a vertical slit 120a and a horizontal slit 120b.

[0140] The tie portion 117 may connect the inner surface of the first isolated body 110a to the inner surface of at least one of the second isolated body 110b to the fourth isolated body 110d.

[0141] The recess 117a may be recessed in an outer surface of the first isolated body 110a facing the inner surface of the first isolated body 110a to which the tie portion 117 is connected, and in at least one outer surface facing the inner surface of at least one of the second isolated body 110b to the fourth isolated body 110d. The recess 117a may also be recessed in the first isolated body 110a or at least one of the outer surfaces.

[0142] The tie portion 117 may be formed to connect at least two of the first to fourth remote bodies 110a to 110d to each other. The tie portion 117 may extend horizontally to connect the first remote body 110a to the second remote body 110b and the third remote body 110c to the fourth remote body 110d, and may extend vertically to connect the first remote body 110a to the third remote body 110c and the second remote body 110b to the fourth remote body 110d.

[0143] The tie portion 117 can divide the slit 120 into multiple sections. The tie portion 117 has the effect of reducing the flexibility of the body 110. In addition, the tie portion 117 can deform the multiple isolated bodies in one direction in an overdrive state. This can prevent the multiple isolated bodies formed on one probe pin 100 from warping in different directions. The tie portion 117 can prevent the multiple isolated bodies from deforming in different directions due to the slits 120, resulting in short circuits between adjacent probe pins 100.

[0144] The plurality of separated bodies having a structure separated from each other can be deformed inward even when the upper plate 210 is raised, so that the upper hole 211 of the upper plate 210 can be easily positioned in the first body 111.

[0145] At this time, the recess 117a is provided on the outer surface of the body 110 and recessed inward, so that the upper hole 211 of the upper plate 210 can easily pass through.

[0146] The tie portion 117 guides the plurality of spaced bodies so that they can deform in one direction during the overdrive process.

[0147] However, when the upper hole 211 passes through the tie portion 117 during the process of assembling the probe pin 100 to the upper plate 210 and the lower plate 220, the inward deformation of the plurality of spaced bodies may be prevented, hindering the movement of the upper plate 210. In this case, the recessed portion 117a may complement the tie portion 117 by allowing the upper hole 211 of the upper plate 210 to easily pass through the body 110.

[0148] Next, a probe pin 100 including a plurality of vertical slits 120a and horizontal slits 120b according to an embodiment of the present invention will be described.

[0149] 10a-10d are diagrams illustrating end faces of a probe pin 100 according to various embodiments of the present invention.

[0150] 10a to 10d, the probe pin 100 according to the embodiment of the present invention may include a vertical slit 120a and a horizontal slit 120b. At least one of the vertical slit 120a and the horizontal slit 120b may be provided in plural.

[0151] The probe pin 100 may include a slit 120, which may include one or more vertical slits 120a. The slit 120 may also include one or more horizontal slits 120b. Furthermore, the slit 120 may include both a plurality of vertical slits 120a and a plurality of horizontal slits 120b.

[0152] 10a shows an end view of a plurality of isolated bodies separated by one vertical slit 120a and one horizontal slit 120b, where the body 110 may include a first isolated body 110a to a fourth isolated body 110d.

[0153] 10b shows an end view of a plurality of isolated bodies separated by two vertical slits 120a and one horizontal slit 120b, where the body 110 may include a first isolated body 110a to a sixth isolated body 110f.

[0154] 10c shows an end view of a plurality of isolated bodies separated by three vertical slits 120a and one horizontal slit 120b, where the body 110 may include a first isolated body 110a to an eighth isolated body 110h.

[0155] 10d shows a plurality of isolated bodies separated by one vertical slit 120a and two horizontal slits 120b, where the body 110 may include a first isolated body 110a to a sixth isolated body 110f.

[0156] When the body 110 includes a plurality of separated bodies, one side of the body 110 may be formed in a split shape. The more slits 120 the probe pin 100 includes, the higher its flexibility may be.

[0157] 10a to 10d, if the thickness (vertical) of the isolation body is greater than the width (horizontal), the lateral flexibility of the body 110 and / or the probe pin 100 may be greater. Conversely, if the thickness of the isolation body is less than the width, the lateral flexibility of the body 110 and / or the probe pin 100 may be less.

[0158] In addition, since increasing the number of vertical slits 120a may increase the width of the body 110 and make it difficult to achieve a narrow pitch, the body 110 may be provided with horizontal slits 120b to further increase flexibility. On the other hand, when a long edge in the end face of the isolation body is placed in the direction of deformation of the pin in an overdrive state, flexibility can be further increased.

[0159] In the present invention, the shape of the probe pin 100, the body 110 and the plurality of spaced bodies can be changed by changing the number of vertical slits 120a and horizontal slits 120b, thereby adjusting the flexibility of the probe pin 100.

[0160] Next, various configurations of the vertical slits 120a and the horizontal slits 120b according to embodiments of the present invention will be described.

[0161] Figures 11a-11f show vertical slits 120a and horizontal slits 120b according to various embodiments of the present invention, and Figures 12a-12f show vertical slits 120a and horizontal slits 120b according to various embodiments of the present invention.

[0162] 11a to 12f, in the probe pin 100 according to the embodiment of the present invention, the vertical slit 120a and the horizontal slit 120b may have different widths or lengths.

[0163] 11a and 11b, the probe pin 100 may include a vertical slit 120a and a horizontal slit 120b of the same width and length.

[0164] 11c and 11d, the probe pin 100 may include vertical slits 120a and horizontal slits 120b of the same width, or may include vertical slits 120a and horizontal slits 120b of different lengths.

[0165] 11e and 11f, the probe pin 100 may include vertical slits 120a and horizontal slits 120b with different widths, or may include vertical slits 120a and horizontal slits 120b with the same length.

[0166] 12a to 12d, the probe pin 100 may include a vertical slit 120a and a horizontal slit 120b having the same width. The probe pin 100 may also include the vertical slit 120a and the horizontal slit 120b in the second body 112. Furthermore, the probe pin 100 may have at least one slit 120 of the vertical slit 120a and the horizontal slit 120b extending in the first body 111, and the at least one slit 120 may extend to an end surface of the first body 111 to form an opening.

[0167] 12e and 12f, the probe pin 100 may include different numbers of vertical slits 120a and horizontal slits 120b. In this case, the widths and lengths of the vertical slits 120a and horizontal slits 120b are not limited to being the same, and may be selected from the above-mentioned forms.

[0168] The probe pin 100 can have different numbers and shapes of vertical slits 120a and horizontal slits 120b to adjust the flexibility of the probe pin 100 and / or body 110 and reduce the cross-sectional area of ​​the probe pin 100 and / or body 110, thereby maintaining high-frequency characteristics.

[0169] Next, a probe pin 100 including a contact tip 130 according to an embodiment of the present invention and a method for manufacturing the probe pin 100 will be described.

[0170] 13a to 15l are diagrams illustrating a method for manufacturing the probe pin 100 according to an embodiment of the present invention.

[0171] 13a to 15l, a probe pin 100 according to an embodiment of the present invention may include a body 110 and a slit 120. The body 110 may include first to third bodies 111 to 113, and the slit 120 may include a vertical slit 120a and a horizontal slit 120b. In addition, the probe pin 100 may further include a contact tip 130 located at an end region of the third body 113 and contacting an object to be tested.

[0172] The contact tip 130 can be made of the same or different material as the body 110. The contact tip 130 can also include rhodium layers 130a, 22a, 32a made of a material containing rhodium. The contact tip 130 can also be made of a single metal layer or a stack of multiple metal layers.

[0173] The contact tip 130 may be located in an end region of the third body 113. The contact tip 130 may be in direct contact with the object to be tested. Therefore, the contact tip 130 may be formed of a metal having higher wear resistance and / or hardness than the body 110, and may be formed of a metal having higher electrical conductivity than the body 110. This allows the wear resistance and / or hardness of the probe pin 100 to be maintained high, and the current carrying capacity to be increased.

[0174] The contact tip 130 may be made of copper (Cu), silver (Ag), gold (Au), rhodium (Rd), platinum (Pt), iridium (Ir), palladium (Pd), nickel (Ni), manganese (Mn), tungsten (W), phosphorus (P), or alloys thereof. The body 110 may be made of palladium-cobalt (PdCo) alloy, palladium-nickel (PdNi) alloy, nickel-phosphorus (NiP) alloy, nickel-manganese (NiMn) alloy, nickel-cobalt (NiCo) alloy, or nickel-tungsten (NiW). However, the materials of the contact tip 130 are not limited to those listed above.

[0175] The contact tip 130 is preferably formed to a thickness of about 10 μm, since if the thickness is too thin, the strength will be weak.

[0176] The probe pin 100 may be manufactured by forming a mold and plating it. In this case, the probe pin 100 may be manufactured in a vertical direction and may include a first body layer 10, a second body layer 20, and a third body layer 30.

[0177] The first body layer 10 may constitute a lower layer of the probe pin 100. The second body layer 20 may be located on the first body layer 10 and include a horizontal slit 120b. The third body layer 30 may be located on the second body layer 20 and constitute an upper layer. The division of each layer is performed based on the horizontal slit 120b.

[0178] In the drawings related to the manufacturing method of the probe pin 100 described below, (a) shows the front of the probe pin 100, (b) shows the side of the probe pin 100, (c) shows the side of the probe pin 100, and (d) shows the front of the probe pin 100.

[0179] 13a and 13b, the probe pin 100 may include a body 110, a horizontal slit 120b, and a contact tip 130, and may further include a vertical slit 120a.

[0180] 13c to 13l, 14c to 14l, and 15c to 15l, a method for manufacturing a probe pin 100 according to an embodiment of the present invention may include the steps of providing a base substrate 50, providing a first body layer 10 on the base substrate 50, providing a second body layer 20 on the first body layer 10, providing a third body layer 30 on the second body layer 20, and separating the first body layer 10 to the third body layer 30.

[0181] The base substrate 50 has a space for forming the body 110 that constitutes the probe pin 100, and can be separated after the probe pin 100 is manufactured.

[0182] First, a process of providing a first body layer 10 on a base substrate 50 may be performed.

[0183] The first body layer 10 may refer to a layer below the probe pin 100. Specifically, the first body layer 10 may refer to a layer located below the horizontal slit 120b. Since the probe pin 100 has a horizontally bent shape, the first body layer 10 may also have a horizontally bent shape. That is, the first body layer 10 may include at least one bent portion bent in the horizontal direction.

[0184] Referring to Figures 13c to 13e and 13h to 13j, the process of providing a first body layer 10 may include the processes of providing a first mold 11, providing a first metal 12, and removing the first mold 11.

[0185] The process of providing the first mold 11 may be performed through a PR layer providing process, an exposure process, and a development process. At this time, the PR layer is a photoresist layer and may be used as a mold for plating the first metal 12. The exposure process may determine an area for removing a portion of the PR layer. The development process may remove the PR layer in the determined area. The first mold 11 may undergo the PR layer providing process, the exposure process, and the development process to form openings 14 through which the first metal 12 is plated. The first mold 11 may include openings 14 corresponding to the first body layer 10. The first mold 11 may also include vertical portions 15 corresponding to the vertical slits 120a.

[0186] The process of providing the first metal 12 may include a first metal 12 plating process and a CMP process. The first metal 12 may be formed by plating in the openings 14 of the first mold 11. As described above, the plating material may be the same as the material that constitutes the body 110. Thereafter, the first metal 12 may be planarized by chemical mechanical polishing (CMP).

[0187] The process of removing the first mold 11 may be performed by forming the first metal 12 and removing residual photoresist (PR) remaining on the side of the first metal 12. This allows the first body layer 10 to be formed. At this time, the first body layer 10 may include vertical slits 120a.

[0188] Referring to Figures 13f to 13g, 13k to 13l, 14c to 14e, and 14h to 14j, the process of providing the second body layer 20 may include the processes of providing a first sacrificial layer 13, providing a second mold 21, providing a second metal, and removing the second mold 21.

[0189] The process of providing the first sacrificial layer 13 may include a first sacrificial layer 13 plating process and a CMP process. The first sacrificial layer 13 may be provided to form a second mold 21 thereon. The first sacrificial layer 13 may be formed by plating to cover the side and top surfaces of the first body layer 10. The first sacrificial layer 13 may be formed with a protruding portion as shown in FIG. 13f. Thereafter, the first sacrificial layer 13 and / or the first body layer 10 may be planarized by chemical mechanical polishing. The first sacrificial layer 13 may be made of a metal material different from the first body layer 10 to the third body layer 30. The first sacrificial layer 13 may be made of a material that can be selectively etched, for example, copper (Cu) or a material containing copper. This also applies to the second sacrificial layer 23 described below.

[0190] The process of providing the second mold may be performed through a PR layer providing process, an exposure process, and a development process. Here, the second mold 21 may include at least one opening 24 corresponding to the second body layer 20. Because the second body layer 20 includes the horizontal slit 120b, the opening 24 may be separated into two or more. The opening 24 of the second mold 21 may be an area where the connecting portion and the contact tip 130 are to be formed.

[0191] The first opening 24a of the second mold 21 may be located on the first body layer 10 in the third body 113 region. In this case, the first opening 24a may be formed to correspond to the second body layer 20 forming the third body 113 region. As a result, the connecting portion and / or contact tip 130 constituting the second body layer 20 may be formed on the first body layer 10.

[0192] Also, the first opening 24a of the second mold 21 may be positioned to extend beyond the third body 113 region onto the first sacrificial layer 13. In this case, the first opening 24a may be formed to correspond to the contact tip 130.

[0193] The second opening 24b of the second mold 21 may be located on the first body layer 10 in the first body 111 region. In this case, the second opening 24b may be formed to correspond to the second body layer 20 forming the first body 111 region. At this time, a connecting portion is formed in the second opening 24b, so that a probe pin 100 having an isolated slit 120 as shown in FIGS. 6a to 6c can be manufactured.

[0194] The second mold 21 may include only the first opening 24a. In this case, since no connecting portion is formed, a probe pin 100 having an open slit 120 as shown in Figures 7a to 7c can be manufactured.

[0195] The process of providing the second metal 22 may include a second metal 22 plating process and a CMP process. The second metal 22 may be formed by plating in at least one opening 24 of the second mold 21. The plating material may be the same as or different from the first metal 12, but is not limited thereto. Thereafter, the second metal 22 may be planarized by chemical mechanical polishing.

[0196] The process of removing the second mold 21 may be performed by forming the second metal 22 and removing the residual PR remaining on the side of the second metal 22. This allows the second body layer 20 to be formed. At this time, the second body layer 20 may include the contact tip 130 and the horizontal slit 120b, and may further include the vertical slit 120a.

[0197] Referring to Figures 14f to 14g, 14k to 14l, 15c to 15e, and 15h to 15j, the process of providing the third body layer 30 may include the processes of providing a second sacrificial layer 23, providing a third mold 31, providing a third metal 32, and removing the third mold 31.

[0198] The process of providing the second sacrificial layer 23 may include a second sacrificial layer 23 plating process and a CMP process. The second sacrificial layer 23 may be provided to form a third mold 31 thereon. The second sacrificial layer 23 may be formed by plating to cover the side and top surfaces of the second body layer 20. The second sacrificial layer 23 may be formed with a protruding portion as shown in FIG. 14f. Thereafter, the second sacrificial layer 23 and / or the second body layer 20 may be planarized by chemical mechanical polishing.

[0199] The process of providing the third mold 31 may be performed through a PR layer providing process, an exposure process, and a development process. Here, the third mold 31 may include openings 34 corresponding to the third body layer 30. The third mold 31 may also include vertical portions 35 corresponding to the vertical slits 120a.

[0200] The process of providing the third metal 32 may include a third metal 32 plating process and a CMP process. The third metal 32 may be formed by plating in the openings 34 of the third mold 31. The plating material may be the same as the first metal 12 and / or the second metal 22 described above, but is not limited thereto. Thereafter, the third metal 32 may be planarized by chemical mechanical polishing.

[0201] The process of removing the third mold 31 may be performed by forming the third metal 32 and removing residual PR remaining on the side surfaces of the third metal 32. This allows the third body layer 30 to be formed. At this time, the third body layer 30 may include vertical slits 120a.

[0202] 15f to 15g and 15k to 15l, the process of separating the first body layer 10 to the third body layer 30 may include a sacrificial layer removing process and a base substrate 50 removing process.

[0203] The sacrificial layer removal process may be performed by removing the first sacrificial layer 13 located on the side of the first body layer 10 and the second sacrificial layer 23 located on the side of the second body layer 20 and the horizontal slit 120b.

[0204] The base substrate 50 removing process may be performed by removing the base substrate 50 located under the first body layer 10. Also, the sacrificial layer removing process and the base substrate 50 removing process may be performed simultaneously. As a result, the manufacturing process of the probe pin 100 may be completed.

[0205] 16a to 18l are diagrams illustrating a method for manufacturing the probe pin 100 according to an embodiment of the present invention.

[0206] 16a and 16b, a probe pin 100 according to an embodiment of the present invention may include a body 110 and a slit 120. The body 110 may include first to third bodies 111 to 113, and the slit 120 may include a vertical slit 120a and a horizontal slit 120b. The probe pin 100 may further include a contact tip 130 located at an end region of the third body 113 and contacting the test object. Furthermore, the contact tip 130 may be made of a different material from the body 110 or may include a rhodium layer 130a, 22a made of a material containing rhodium.

[0207] 16c to 16h, 17c to 17l and 18c to 18l, a method for manufacturing a probe pin 100 according to an embodiment of the present invention may include the steps of providing a base substrate 50, providing a first body layer 10 on the base substrate 50, providing a second body layer 20 on the first body layer 10, providing a third body layer 30 on the second body layer 20, and separating the first body layer 10 to the third body layer 30.

[0208] In this embodiment, the process up to the step of providing the first body layer 10 is the same as the process described above, and therefore a description thereof will be omitted.

[0209] Referring to Figures 13f to 13g, 13k to 13l, 16c to 16h, 17c to 17e, and 17h to 17j, the process of providing the second body layer 20 may include the process of providing a first sacrificial layer 13, the process of providing a 2-1 mold (second mold) 21, the process of providing a connecting portion (second metal) 22, the process of removing the 2-1 mold 21, the process of providing a 2-2 mold (second mold) 21, the process of providing a contact tip 130, and the process of removing the 2-2 mold 21.

[0210] The process of providing the first sacrificial layer 13 may include a first sacrificial layer 13 plating process and a CMP process. The first sacrificial layer 13 may be provided to form the second mold 21 thereon. The first sacrificial layer 13 may be formed by plating to cover the side and top of the first body layer 10. The first sacrificial layer 13 may be formed with a protruding portion as shown in FIG. 13f. Thereafter, the first sacrificial layer 13 and / or the first body layer 10 may be planarized by chemical mechanical polishing.

[0211] The process of providing the 2-1 mold 21 may be performed through a PR preparation process, an exposure process, and a development process. Here, the 2-1 mold 21 may include openings 24 corresponding to the second body layer 20. The openings 24 of the 2-1 mold 21 may be regions where the connecting portions 22 are to be formed.

[0212] The opening 24 of the 2-1 mold 21 may be located on the first body layer 10 in the first body 111 region. In this case, the opening 24 may be formed to correspond to the second body layer 20 that forms the first body 111 region. As a result, the connecting portion 22 that constitutes the second body layer 20 may be formed on the first body layer 10.

[0213] The process of providing the connecting portion 22 may include a connecting portion plating process and a CMP process. The connecting portion 22 may be formed by plating the opening 24 of the 2-1 mold 21. The plating material may be the same as or different from the first metal 12, but is not limited thereto. Thereafter, the connecting portion may be planarized by chemical mechanical polishing.

[0214] The process of removing the 2-1 mold 21 may be performed by forming the connecting portion 22 and removing the residual PR remaining on the side of the connecting portion 22. As a result, the connecting portion 22 of the second body layer 20 may be formed.

[0215] The process of providing the 2-2 mold 21 may be performed through a PR layer providing process, an exposure process, and a development process. Here, the 2-2 mold 21 may include an opening 24 corresponding to the second body layer 20. The opening 24 of the 2-2 mold 21 may be an area where the contact tip 130 and the rhodium layer (connector, second metal, or contact tip) 22a are to be formed.

[0216] The opening 24 of the 2-2 mold 21 may be located on the first body layer 10 in the region of the third body 113. In this case, the opening 24 may be formed to correspond to the second body layer 20 that forms the region of the third body 113. As a result, the contact tip 130 that constitutes the second body layer 20 may be formed on the first body layer 10.

[0217] Furthermore, the opening 24 of the 2-2 mold may extend beyond the third body 113 region onto the first sacrificial layer 13. In this case, the opening 24 may be formed to correspond to the contact tip 130. That is, the contact tip 130 may be provided on a region including the boundary between the first body layer 10 and the first sacrificial layer 13. As a result, the contact tip 130 constituting the second body layer 20 on the first body layer 10 may be formed to protrude beyond the end surface of the first body layer 10.

[0218] The process of providing the contact tip 130 may include a contact tip 130 plating process and a CMP process. The contact tip 130 may be formed by plating the opening 24 of the second-second mold 21. The plating material may be a material different from the first metal 12 described above. It may also be a material different from the connecting portion 22. In particular, the plating material may be a material with high hardness, such as rhodium. That is, the contact tip 130 may include a rhodium layer 22a. Conversely, the plating material may be the same material as the first metal 12 and / or the connecting portion 22. That is, the plating material is not limited to a specific one.

[0219] The process of removing the 2-2 mold 21 can be performed by forming the contact tip 130 and removing the residual PR remaining on the side of the contact tip 130. In this way, the contact tip 130 of the second body layer 20 can be formed. That is, the second body layer 20 can be completed.

[0220] 17f to 17g, 17k to 17l, and 18c to 18l, the process of providing the third body layer 30 and the process of separating the first body layer 10 to the third body layer 30 are the same as those described above, and therefore, description thereof will be omitted.

[0221] 19a to 20l are diagrams illustrating a method for manufacturing the probe pin 100 according to an embodiment of the present invention.

[0222] 19a and 19b, a probe pin 100 according to an embodiment of the present invention may include a body 110 and a slit 120. The body 110 may include a first body 111 to a third body 113, and the slit 120 may include a vertical slit 120a and a horizontal slit 120b. The probe pin 100 may further include a contact tip 130 located at an end region of the third body 113. Furthermore, the contact tip 130 may be formed of a different material from the body 110. For example, the contact tip 130 may include a rhodium layer 130a, 22a and a protection layer 130b, 22b provided on the rhodium layers 130a, 22a.

[0223] 19c to 19l and 20c to 20l, a method for manufacturing a probe pin 100 according to an embodiment of the present invention may include the steps of providing a base substrate 50, providing a first body layer 10 on the base substrate 50, providing a second body layer 20 on the first body layer 10, providing a third body layer 30 on the second body layer 20, and separating the first body layer 10 to the third body layer 30.

[0224] In this embodiment, the process up to the step of providing the first body layer 10 is the same as the above-described process, and therefore a description thereof will be omitted.

[0225] Referring to Figures 13f to 13g, 13k to 13l, 19c to 19e, and 19h to 19j, the process of providing the second body layer 20 may include the processes of providing a first sacrificial layer 13, providing a second mold 21, providing a second metal 22, providing a protective layer (connecting portion or contact tip) 22b, and removing the second mold 21.

[0226] The process of providing the first sacrificial layer 13 may include a first sacrificial layer 13 plating process and a CMP process. The first sacrificial layer 13 may be provided to form the second mold 21 thereon. The first sacrificial layer 13 may be formed by plating to cover the side and top of the first body layer 10. The first sacrificial layer 13 may be formed with a protruding portion as shown in FIG. 13f. Thereafter, the first sacrificial layer 13 and / or the first body layer 10 may be planarized by chemical mechanical polishing.

[0227] The process of forming the second mold 21 may be performed through a PR process, an exposure process, and a development process. Here, the second mold 21 may include at least one opening 24 corresponding to the second body layer 20. The opening 24 of the second mold 21 may be an area where the connecting portions 22, 22a, and 22b and the contact tips 130, 130a, 130b, 22a, and 22b are to be formed.

[0228] The first opening 24a of the second mold 21 may be formed to correspond to the second body layer 20 forming the third body 113 region. As a result, the connecting portions 22, 22a, 22b and / or the contact tips 130, 130a, 130b, 22a, 22b constituting the second body layer 20 may be formed on the first body layer 10.

[0229] Also, the first opening 24a of the second mold 21 may be positioned to extend beyond the third body 113 region onto the first sacrificial layer 13. In this case, the first opening 24a may be formed to correspond to the contact tip 130.

[0230] The second opening 24b of the second mold 21 may be formed to correspond to the second body layer 20 forming the first body 111 region. At this time, the connecting portions 22, 22a, and 22b are formed in the second opening 24b, so that the probe pin 100 having the isolated slit 120 as shown in FIGS. 6a to 6c may be manufactured.

[0231] The second mold 21 may include only the first opening 24a. In this case, the connecting portions 22, 22a, and 22b are not formed, so that the probe pin 100 having the open slit 120 as shown in Figures 7a to 7c can be manufactured.

[0232] The process of providing the second metal 22 may include a second metal 22 plating process and may further include a CMP process. The second metal 22 may be formed by plating in at least one opening 24 of the second mold 21. The plating material may be a different type from the first metal 12 described above, but the type is not limited thereto. A CMP process may be performed thereafter, but may be omitted depending on the material of the second metal 22. For example, the second metal 22 may be a rhodium material or a material containing rhodium. That is, the second metal 22 may be composed of rhodium layers 130a, 22a.

[0233] The first opening 24a and the second opening 24b are not necessarily filled with the same metal, i.e., the second metal 22, 22a formed in the first opening 24a may have greater electrical conductivity than the second metal 22, 22a formed in the second opening 24b.

[0234] The process of providing the protective layer 22b may include a protective metal plating process and a CMP process. The protective metal may be formed by plating in at least one opening 24 of the second mold 21. The plating material may be different from the second metal 22. Preferably, the protective metal may be made of a material with a lower hardness than the second metal 22, but is not limited to this. Thereafter, the protective layer 22b may be planarized by chemical mechanical polishing.

[0235] The contact tip 130 may include a second metal 22 and a protective layer 22 b located on the second metal 22 .

[0236] If the second metal 22 includes rhodium or a rhodium layer 22a, there is a high risk of cracking during the polishing process, so a protective layer 22b may be provided on the second metal 22 before the CMP process. That is, the second metal 22 may be plated, and the protective metal may be plated without a planarization process.

[0237] The second metal 22 including rhodium or the rhodium layer 22a can be protected by providing a protective layer 22b on the second metal 22 and planarizing the protective layer 22b without planarizing the second metal 22 including rhodium or the rhodium layer 22a. Rhodium has high strength and high electrical conductivity, so when used as the contact tip 130, it can increase the current carrying capacity of the probe pin 100. Furthermore, the probe pin 100 including the rhodium layer 22a can be easily manufactured.

[0238] The process of removing the second mold 21 may be performed by removing the residual PR remaining on the side surfaces of the second metal 22 and the protective layer 22b after the second metal 22 and the protective layer 22b are formed, thereby forming the second body layer 20. At this time, the second body layer 20 may include the contact tip 130 and the horizontal slit 120b.

[0239] 19f to 19g, 19k to 19l, 20c to 20e, and 20h to 20j, the process of providing the third body layer 30 can include the process of providing the second sacrificial layer 23, the process of including the third mold 31, the process of providing the third metal, and the process of removing the third mold 31. The process of providing the third body layer 30 is the same as that described above, and therefore, a description thereof will be omitted.

[0240] 20f to 20g and 20k to 20l, the process of separating the first to third body layers 10 to 30 may include a sacrificial layer removing process and a base substrate 50. The process of separating the first to third body layers 10 to 30 is the same as that described above, and therefore a description thereof will be omitted.

[0241] 21a to 22l are diagrams illustrating a method for manufacturing the probe pin 100 according to an embodiment of the present invention.

[0242] 21a and 21b, a probe pin 100 according to an embodiment of the present invention may include a body 110 and a slit 120. The body 110 may include a first body 111 to a third body 113, and the slit 120 may include a vertical slit 120a and a horizontal slit 120b. The probe pin 100 may further include a contact tip 130 located at an end region of the third body 113. Furthermore, the contact tip 130 may be made of a different material from the body 110. For example, the contact tip 130 may include a first protective layer 22b', a rhodium layer 22a provided on the first protective layer 22b', and a second protective layer 22b'' provided on the rhodium layer 22a.

[0243] 21c to 21l and 22c to 22l, a method for manufacturing a probe pin 100 according to an embodiment of the present invention may include the steps of providing a base substrate 50, providing a first body layer 10 on the base substrate 50, providing a second body layer 20 on the first body layer 10, providing a third body layer 30 on the second body layer 20, and separating the first body layer 10 to the third body layer 30.

[0244] In this embodiment, the process up to the step of providing the first body layer 10 is the same as the above-described process, and therefore a description thereof will be omitted.

[0245] Referring to Figures 13f to 13g, 13k to 13l, 21c to 21e, and 21h to 21j, the process of providing the second body layer 20 may include a process of providing a first sacrificial layer 13, a process of providing a second mold 21, a process of providing a first protective layer 22b', a process of providing a second metal 22, a process of providing a second protective layer 22b'', and a process of removing the second mold 21.

[0246] The process of providing the first sacrificial layer 13 may include a first sacrificial layer 13 plating process and a CMP process. The first sacrificial layer 13 may be provided to form the second mold 21 thereon. The first sacrificial layer 13 may be formed by plating to cover the side and top of the first body layer 10. The first sacrificial layer 13 may be formed with a protruding portion as shown in FIG. 13f. Thereafter, the first sacrificial layer 13 and / or the first body layer 10 may be planarized by chemical mechanical polishing.

[0247] The process of forming the second mold 21 may be performed through a PR forming process, an exposure process, and a development process. Here, the second mold 21 may include at least one opening 24 corresponding to the second body layer 20. The opening 24 of the second mold 21 may be an area where the connecting portions 22 a, 22 b and the contact tips 22 a, 22 b are to be formed.

[0248] The second mold 21 can form the first opening 24a and / or the second opening 24b. This is the same as described above, so a detailed description will be omitted.

[0249] The process of providing the first protective layer 22b' may include a first protective metal plating process and may further include a CMP process. The first protective layer 22b' may be formed by plating at least one opening 24 of the second mold 21. The plating material may be the same as or different from the first metal 12 described above, but is not limited to that type. A subsequent CMP process may be performed, but may be omitted.

[0250] The process of providing the second metal 22 may include a second metal 22 plating process and may further include a CMP process. The second metal 22 may be formed by plating in at least one opening 24 of the second mold 21. The plating material may be the same as or different from the first metal 12, but the type is not limited thereto. A CMP process may be performed thereafter, but may be omitted depending on the material of the second metal 22. The second metal 22 may be a rhodium layer 22a.

[0251] The first opening 24a and the second opening 24b are not necessarily filled with the same metal, and the second metal 22 formed in the first opening 24a may have even greater electrical conductivity than the second metal 22 formed in the second opening 24b.

[0252] The process of providing the second protective layer 22b'' may include a second protective metal plating process and a CMP process. The second protective metal may be formed by plating in at least one opening of the second mold 21. The plating material may be different from the second metal 22. Preferably, the second protective metal may be made of a material having a lower hardness than the second metal 22, but is not limited to this. Thereafter, the second protective layer 22b'' may be planarized by chemical mechanical polishing.

[0253] As described above, when the second metal 22 contains rhodium, the second metal 22 can be protected by providing a second protective layer 22b'' on the second metal 22 and planarizing the second protective layer 22b'' without planarizing the second metal 22.

[0254] Rhodium has high strength and electrical conductivity, and when used as the contact tip 130, it can increase the current carrying capacity of the probe pin 100. Furthermore, the probe pin 100 including the rhodium layer 22a can be easily manufactured.

[0255] Meanwhile, the protective layer 22b, the first protective layer 22b′, and the second protective layer 22b″ can increase the thickness of the contact tip 130 without increasing the thickness of the rhodium layer 22a. Increasing the thickness of the contact tip 130 increases the width of the horizontal slit 120b, which may increase the flexibility of the body 110. However, rhodium is a relatively expensive material and may not be suitable for unlimited thickness increase. Therefore, by providing the first protective layer 22b′ and / or the second protective layer 22b″ below and / or above the rhodium layer 22a, the horizontal slit 120b can be widened while reducing the consumption of rhodium, thereby increasing the flexibility of the body 110. Furthermore, when the first protective layer 22b′ and the second protective layer 22″ are provided above and below the rhodium layer 22a, respectively, the rhodium layer 22a can be positioned at the center of the probe pin 100.

[0256] The process of removing the second mold 21 may be performed by removing the residual PR remaining on the side surfaces of the first protective layer 22b', the second metals 22, 22a, and the second protective layer 22b'' after the first protective layer 22b', the second metals 22, 22a, and the second protective layer 22b'' are formed. This allows the second body layer 20 to be formed. At this time, the second body layer 20 may include the contact tip 130 and the horizontal slit 120b.

[0257] 21f to 21g, 21k to 21l, 22c to 22e, and 22h to 22j, the process of providing the third body layer 30 can include the process of providing the second sacrificial layer 23, the process of providing the third mold 31, the process of providing the third metal 32, and the process of removing the third mold 31. The process of providing the third body layer 30 is the same as that described above, so a description thereof will be omitted.

[0258] 22f to 22g and 22k to 22l, the process of separating the first to third body layers 10 to 30 may include a sacrificial layer removing process and a base substrate 50. The process of separating the first to third body layers 10 to 30 is the same as that described above, and therefore a description thereof will be omitted.

[0259] 23a to 26l are diagrams illustrating a method for manufacturing the probe pin 100 according to an embodiment of the present invention.

[0260] 23a to 26l, a probe pin 100 according to an embodiment of the present invention may include a body 110 and a slit 120. The body 110 may include first to third bodies 111 to 113, and the slit 120 may include a vertical slit 120a and a horizontal slit 120b. The probe pin 100 may further include a contact tip 130 located at an end region of the third body 113. Furthermore, the contact tip 130 may be made of a different material from the body 110. For example, the contact tip 130 may include a first rhodium layer, a first protective layer 22b′, a second rhodium layer, and a second protective layer 32b. Here, the vertical width (thickness) of the horizontal slit 120b may be smaller than the height (thickness) of the contact tip 130.

[0261] Referring to Figures 23c to 23h, 24c to 24l, 25c to 25h, and 26c to 26l, a method for manufacturing a probe pin 100 according to an embodiment of the present invention may include the steps of providing a base substrate 50, providing a first body layer 10 on the base substrate 50, providing a second body layer 20 on the first body layer 10, providing a third body layer 30 on the second body layer 20, and separating the first body layer 10 to the third body layer 30.

[0262] In this case, the contact tip 130 may include a first contact tip 131 provided on the second body layer 20 and a second contact tip 132 provided on the third body layer 30. Here, the thickness of the first contact tips 131 may be the same as the vertical width (thickness) of the horizontal slit 120b, and the thickness of the second contact tip 132 may be thinner than the thickness of the third body layer 30, but is not limited to this structure. In this case, the first contact tip 131 may include a first protected layer 22a' and a first protective layer 22b', and the second contact tip 132 may include a second protected layer 32a and a second protective layer 32b.

[0263] In this embodiment, the process up to the step of providing the first body layer 10 is the same as the above-described process, and therefore a description thereof will be omitted.

[0264] Referring to Figures 13f to 13g, 13k to 13l, 23c to 23h, 24c to 24e, and 24h to 24j, the process of providing the second body layer 20 may include the process of providing a first sacrificial layer 13, the process of providing a 2-1 mold 21, the process of providing a connecting portion 22, the process of removing the 2-1 mold 21, the process of providing a 2-2 mold 21, the process of providing a first contact tip 131, and the process of removing the 2-2 mold 21.

[0265] The process of providing the first sacrificial layer 13 may include a first sacrificial layer 13 plating process and a CMP process. The first sacrificial layer 13 may be provided to form the second mold 21 thereon. The first sacrificial layer 13 may be formed by plating to cover the side and top of the first body layer 10. The first sacrificial layer 13 may be formed with a protruding portion as shown in FIG. 13f. Thereafter, the first sacrificial layer 13 and / or the first body layer 10 may be planarized by chemical mechanical polishing.

[0266] The process of providing the 2-1 mold 21 may be performed through a PR preparation process, an exposure process, and a development process. Here, the 2-1 mold may include an opening 24 corresponding to the second body layer 20. The opening 24 of the 2-1 mold 21 may be a region where a connecting portion is to be formed.

[0267] The opening 24 of the 2-1 mold may be located on the first body layer 10 in the first body 111 region. In this case, the opening 24 may be formed to correspond to the second body layer 20 that forms the first body 111 region. As a result, the connecting portion 22 that constitutes the second body layer 20 may be formed on the first body layer 10.

[0268] The process of providing the connecting portion 22 may include a connecting portion plating process and a CMP process. The connecting portion 22 may be formed by plating the opening 24 of the 2-1 mold 21. The plating material may be the same as the first metal 12 described above, but is not limited to this. Thereafter, the connecting portion 22 may be planarized by chemical mechanical polishing.

[0269] The process of removing the 2-1 mold 21 can be performed by removing residual PR remaining on the side of the connection portion after the connection portion is formed, thereby forming the connection portion 22 of the second body layer 20.

[0270] The process of providing the 2-2 mold 21 may be performed through a PR layer providing process, an exposure process, and a development process. Here, the 2-2 mold 21 may include an opening 24 corresponding to the second body layer 20. The opening 24 of the 2-2 mold 21 may be an area where the first contact tip 131 is to be formed.

[0271] The opening 24 of the 2-2 mold 21 may be located on the first body layer 10 in the region of the third body 113. In this case, the opening 24 may be formed to correspond to the second body layer 20 that forms the region of the third body 113. As a result, the first contact tip 131 that constitutes the second body layer 20 may be formed on the first body layer 10.

[0272] Furthermore, the opening 24 of the 2-2 mold 21 may extend beyond the third body 113 region onto the first sacrificial layer 13. In this case, the opening 24 may be formed to correspond to the contact tip 130. As a result, the first contact tip 131 constituting the second body layer 20 may be formed on the first body layer 10 so as to protrude beyond the end surface of the first body layer 10.

[0273] The process of providing the first contact tip 131 may include a plating process of the first protective layer 22a', a plating process of the first protective layer 22b', and a CMP process.

[0274] The first protected layer 22a' can be formed by plating the opening 24 of the 2-2 mold 21. The plating material can include, but is not limited to, rhodium.

[0275] The first protective layer 22b' can be formed by plating the opening 24 of the 2-2 mold 21. The plating material can be different from that of the first protected layer 22a'. Preferably, the first protective layer 22b' can be made of a material having a lower hardness than the first protected layer 22a', but is not limited to this. Thereafter, the first protective layer 22b' can be planarized by chemical mechanical polishing.

[0276] If the first protected layer 22a' includes a rhodium layer 22a, there is a high risk of cracking during the polishing process, so a first protective layer 22b' may be provided on the first protected layer 22a' before the CMP process. That is, the first protected layer 22a' may be plated, and then the first protective layer 22b' may be plated without a planarization process.

[0277] The process of removing the 2-2 mold 21 may be performed by removing the residual PR remaining on the sides of the connecting portion 22 and the first contact tip 131 after the connecting portion 22 and the first contact tip 131 are formed, thereby forming the second body layer 20. At this time, the second body layer 20 may include the first contact tip 131 and the horizontal slit 120b.

[0278] Referring to Figures 24f to 24g, 24k to 24l, 25c to 25h, 26c to 26d, and 26h to 26i, the process of providing the third body layer 30 may include the processes of providing a second sacrificial layer 23, providing a 3-1 mold (third mold) 31, providing a second contact tip 132, removing the 3-1 mold, providing a 3-2 mold (third mold) 31, plating a third metal 32, and removing the 3-2 mold 31.

[0279] The process of providing the second sacrificial layer 23 is the same as that described above, and therefore the description thereof will be omitted.

[0280] The process of providing the 3-1 mold 31 may be performed through a PR layer providing process, an exposure process, and a development process. Here, the 3-1 mold 31 may include an opening 34 corresponding to the second contact tip 132. The opening 34 of the 3-1 mold 31 may be provided to be positioned above the first contact tip 131 of the second body layer 20. As a result, the second contact tip 132 can be formed without creating a step on the first contact tip 131.

[0281] The process of providing the second contact tip 132 may include a plating process of the second protective layer 32a, a plating process of the second protective layer 32b, and a CMP process.

[0282] The second protected layer 32a may be formed by plating the opening 34 of the 3-1 mold 31. The plating material may include, but is not limited to, rhodium.

[0283] The second protective layer 32b may be formed by plating the opening 34 of the 3-1 mold 31. The plating material may be different from that of the second protected layer 32a. Preferably, the second protective layer 32b may be made of a material having a lower hardness than the second protected layer 32a, but is not limited to this. The second protective layer 32b may then be planarized by chemical mechanical polishing.

[0284] If the second protected layer 32a includes a rhodium layer 32a, there is a high risk of cracking during the polishing process, so a second protective layer 32b may be provided on the second protected layer (rhodium layer) 32a before the CMP process. That is, the second protected layer 32a may be plated, and then the second protective layer 32b may be plated without a planarization process.

[0285] The process of removing the 3-1 mold 31 can be performed by forming the second contact tip 132 and removing residual PR remaining on the side of the second contact tip 132. As a result, the third body layer 30 can partially include the second contact tip 132. In addition, the first contact tip 131 and the second contact tip 132 can be integrated to form one contact tip 130.

[0286] The process of providing the 3-2 mold 31 may be performed through a PR layer providing process, an exposure process, and a development process. Here, the 3-2 mold 31 may include openings 34 corresponding to the third body layer 30. The openings 34 of the 3-2 mold 31 may be provided to be located above the connecting portion 22, the horizontal slit 120b, and a portion of the second contact tip 132 of the second body layer 20. As a result, the third body layer 30 may be formed above the connecting portion 22, the horizontal slit 120b, and a portion of the second contact tip 132.

[0287] The process of providing the third metal 32 may include a third metal 32 plating process and a CMP process. The third metal 32 may be formed by plating in the openings 34 of the 3-2 mold 31. The plating material may be the same as or different from the first metal 12 and / or second metal 22 described above, but is not limited thereto. Thereafter, the third metal 32 may be planarized by chemical mechanical polishing.

[0288] The process of removing the 3-2 mold may be performed by forming the second contact tip 132 and the third metal 32 and removing residual PR remaining on the side surfaces of the second contact tip 132 and the third metal 32. This allows the third body layer 30 to be formed. At this time, the third body layer 30 may include vertical slits 120a.

[0289] 26f to 26g and 26k to 26l, the process of separating the first to third body layers 10 to 30 may include a sacrificial layer removing process and a base substrate 50. The process of separating the first to third body layers 10 to 30 is the same as that described above, and therefore a description thereof will be omitted.

[0290] The probe pin 100 in the above-described embodiment may include a horizontal slit 120b in the second body layer 20 and may include a vertical slit 120a formed across the first body layer 10, the second body layer 20 and the third body layer 30.

[0291] 27a and 27b are diagrams illustrating a probe pin 100 according to an embodiment of the present invention.

[0292] 27a, the probe pin 100 according to the embodiment of the present invention may include a body, a vertical slit 120a, a horizontal slit 120b, and a contact tip 130. In another aspect, the probe pin 100 may include a first body layer 61 provided at a lower portion, a second body layer 62 provided on the first body layer 61, a third body layer 63 provided on the second body layer 62, a fourth body layer 64 provided on the third body layer 63, and a fifth body layer 65 provided on the fourth body layer 64. In this case, the third body layer 30 may include a 3-1 body layer (connecting portion) 63a constituting a lower portion and a 3-2 body layer (connecting portion) 63b constituting an upper portion. Here, the lower portion refers to the left side with reference to FIG. 27a, and the upper portion refers to the right side with reference to FIG. 27a.

[0293] The first body layer 61 and the fifth body layer 65 may be made of the same material, but are not necessarily limited to this. The second body layer 62 and the fourth body layer 64 may be made of the same material, but are not necessarily limited to this. In this case, the first body layer 61 and the second body layer 62 may be made of different materials, but are not necessarily limited to this. Furthermore, the body 110 does not have to be made of the first body layer 61 to the fifth body layer 65, but may be made of more or fewer layers. The third-first body layer 63a may be made of a different material from the third-second body layer 63b, but are not necessarily limited to this. Furthermore, the first body layer 61 and the fifth body layer 65 may be formed thicker than the other layers.

[0294] The second body layer 62 may extend beyond the first body layer 61 to form a first contact tip, the third body layer 63 may extend beyond the first body layer 61 to form a second contact tip, and the fourth body layer 64 may extend beyond the first body layer 61 to form a third contact tip. In addition, the second body layer 62, the third body layer 63, and the fourth body layer 64 may have the same length, and the first contact tip, the second contact tip, and the third contact tip may form an integrally formed contact tip 130.

[0295] The third body layer 63 may include a horizontal slit 120b. The third body layer 63 may include connecting portions 22, 63a, and 63b in the first body 111 region, may include a horizontal slit 120b in the second body 112 region, and may include a contact tip 130 in the third body 113 region.

[0296] The second contact tip can include a 2-1 contact tip constituting a lower portion and a 2-2 contact tip constituting an upper portion. The 2-1 contact tip can be made of a rhodium layer 63a, and the 2-2 contact tip can be made of a metal layer 63b whose hardness is lower than that of rhodium. With this structure, the contact tip 130 including the rhodium layer 63a can be easily manufactured by polishing the 2-2 contact tip in the manufacturing method of the probe pin 100.

[0297] Furthermore, the contact tip 130 is made up of a part of the third body layer 63, the second body layer 62, and the fourth body layer 64, including the rhodium layer and the horizontal slit 120b, so that the thickness of the contact tip 130 can be increased. That is, the width of the horizontal slit 120b can be reduced while the thickness of the contact tip 130 can be increased. This allows the contact tip 130 to distribute the force applied to the semiconductor element in an overdrive state, preventing damage to the semiconductor element and increasing the strength of the contact tip 130.

[0298] 27b, the probe pin 100 according to the embodiment of the present invention may include a first body layer 71 provided at a bottom, a second body layer 72 provided on the first body layer 71, a third body layer 73 provided on the second body layer 72, a fourth body layer 74 provided on the third body layer 73, and a fifth body layer 75 provided on the fourth body layer 74. The second body layer 72 may include a first connection portion 72a and a first horizontal slit 120b, and the fourth body layer 74 may include a second connection portion 74a and a second horizontal slit 120b. Here, the bottom refers to the left side with reference to FIG. 27b, and the top refers to the right side with reference to FIG. 27b.

[0299] The first body layer 71, the third body layer 73, and the fifth body layer 75 can be made of the same material, but are not necessarily limited to this. The second body layer 72 and the fourth body layer 74 can be made of the same material, but are not necessarily limited to this. As described above, the body 110 is not made up of the first to fifth body layers 71 to 75.

[0300] Here, the first body layer 71 and the fifth body layer 75 can be formed thinner than the third body layer 73.

[0301] The third body layer 73 may extend beyond the second body layer 72 to form the contact tip 130. Here, the third body layer 73 may include a first contact tip in a lower portion of the third body 113 region and a second contact tip in an upper portion of the third body 113 region. The first contact tip may be made of a rhodium layer, and the second contact tip may be made of a metal layer having a lower hardness than the first contact tip or rhodium.

[0302] The horizontal slit 120b and the contact tip 130 may be located at different heights or layers from each other and may not form an overlapping area.

[0303] The second contact tip 130 is formed on the first contact tip 130 so as to have a lower hardness than the first contact tip 130. If the width of the horizontal slit 120b is too large, the strength of the probe pin 100 cannot be maintained high. Therefore, this structure can ensure the thickness of the contact tip 130 without increasing the width of the horizontal slit 120b.

[0304] 28a to 30l are diagrams illustrating a method for manufacturing the probe pin 100 according to an embodiment of the present invention.

[0305] 28a and 28b, a probe pin 100 according to an embodiment of the present invention may include a body 110 and a slit 120. The body 110 may include first to third bodies 111 to 113, and the slit 120 may include a vertical slit 120a and a horizontal slit 120b. The probe pin 100 may further include a contact tip 130 located at an end region of the third body 113. Furthermore, the contact tip 130 may be made of a different material from the body 110. In another aspect, the probe pin 100 may include a first body layer 10, a second body layer 20, and a third body layer 30. The second body layer 20 may include a horizontal slit 120b. In this case, the contact tip 130 may be provided in the first body layer 10. That is, the contact tip 130 may be maintained closer to the lower or upper surface of the body 110 rather than at the mid-height of the body 110.

[0306] 28c to 28l, 29c to 29l, and 30c to 30l, a method for manufacturing a probe pin 100 according to an embodiment of the present invention may include the steps of providing a base substrate 50 having a protrusion 50a on an upper surface thereof, providing a contact tip 130 on the protrusion 50a, providing a body 110 on at least a portion of the contact tip 130 and the base substrate 50, and separating the body 110. Here, the step of providing the body 110 may include the steps of providing a first body layer 10 on at least a portion of the contact tip 130 and the base substrate 50, providing a second body layer 20 on the first body layer 10, and providing a third body layer 30 on the second body layer 20.

[0307] First, a process of providing a base substrate 50 having a protrusion 50a on an upper surface thereof may be performed, and then a process of providing a contact tip 130 on the protrusion 50a may be performed.

[0308] In the process of providing the base substrate 50 having the protrusions 50a, the base substrate 50 may include the protrusions 50a. The base substrate 50 may be integrally formed with the protrusions 50a. The protrusions 50a and the area of ​​the base substrate 50 excluding the protrusions 50a may be made of the same or different materials. The protrusions 50a may be formed so that the cross-sectional area becomes narrower toward the top, but are not necessarily limited thereto.

[0309] In the process of providing the contact tip 130 on the protrusion 50a, the contact tip 130 may be provided on the protrusion 50a. The contact tip 130 may be manufactured separately and provided on the protrusion 50a, or may be provided on the protrusion 50a through plating. In this case, a mold (not shown) may be provided first except for a portion of the upper surface of the protrusion 50a for plating.

[0310] The contact tip 130 may be formed first by providing the protrusion 50a on the base substrate 50. The first mold 11 and the first metal 12 may be provided on the formed contact tip 130, and the process of polishing the first metal 12 may be performed without directly polishing the contact tip 130. In particular, if the contact tip 130 is made of a hard material, it is difficult to polish and is prone to cracking, so there is an advantage in that the process of polishing the contact tip 130 can be omitted. Specifically, the contact tip 130 may contain rhodium, and in this case, the process of polishing the rhodium can be omitted.

[0311] Referring to Figures 28c to 28e and 28h to 28j, the process of providing a first body layer 10 may include the processes of providing a first mold 11, providing a first metal 12, and removing the first mold 11.

[0312] The process of providing the first mold 11 may be performed through a PR layer providing process, an exposure process, and a development process. Here, the first mold 11 may include openings 14 corresponding to the first body layer 10. The first mold 11 may be provided on a portion of the protrusion 50a and a portion of the contact tip 130. Therefore, the openings 14 of the first mold 11 may be provided on the remaining portion of the protrusion 50a and the remaining portion of the contact tip 130. The first mold 11 may be a region where the first body layer 10 will be formed.

[0313] The process of providing the first metal 12 may include a first metal 12 plating process and may further include a CMP process. The first metal 12 may be formed by plating in the openings 14 of the first mold 11. Thereafter, the first metal 12 may be planarized by chemical mechanical polishing.

[0314] The process of removing the first mold 11 can be performed by removing the residual PR remaining on the side surfaces of the first body layer 10, the contact tip 130, and the protrusion 50a after the protrusion 50a, the contact tip 130, and the first body layer 10 are formed, thereby forming the first body layer 10.

[0315] Referring to Figures 28f to 28g, 28k to 28l, 29c to 29e, and 29h to 29j, the process of providing the second body layer 20 may include the processes of providing a first sacrificial layer 13, providing a second mold 21, providing a second metal 22, and removing the second mold 21.

[0316] The process of providing the first sacrificial layer 13 may include a first sacrificial layer 13 plating process and a CMP process. The first sacrificial layer 13 may be provided to form the second mold 21 thereon. The first sacrificial layer 13 may be formed by plating to cover the side and top of the first body layer 10, the contact tip 130, and the protrusion 50a. The first sacrificial layer 13 may be formed with a protruding portion as shown in FIG. 28f. Thereafter, the first sacrificial layer 13 and / or the first body layer 10 may be planarized by chemical mechanical polishing.

[0317] The process of providing the second mold 21, the process of providing the second metal 22, and the process of removing the second mold 21 are the same as those described above, and therefore, the description thereof will be omitted.

[0318] Referring to Figures 29f to 29g, 29k to 29l, 30c to 30e, and 30h to 30j, the process of providing the third body layer 30 may include the processes of providing a second sacrificial layer 23, providing a third mold 31, providing a third metal 32, and removing the third mold 31.

[0319] The process of providing the second sacrificial layer 23 may include a second sacrificial layer 23 plating process and a CMP process. The second sacrificial layer 23 may be provided to form a third mold 31 thereon. The second sacrificial layer 23 may be formed by plating to cover the side and top of the second body layer 20. The second sacrificial layer 23 may be formed with a protruding portion as shown in FIG. 29f. Thereafter, the second sacrificial layer 23 and / or the second body layer 20 may be planarized by chemical mechanical polishing. However, a process of removing the first sacrificial layer 13 may be performed before the process of providing the second sacrificial layer 23.

[0320] The process of providing the third mold 31, the process of providing the third metal 32, and the process of removing the third mold 31 are the same as those described above, and therefore, the description thereof will be omitted.

[0321] Meanwhile, the method for manufacturing the probe pin according to the above embodiment may further include a process of coating the entire surface of the separated probe pin 100 with a metal material and a process of coating a portion of the surface of the probe pin 100 with an insulating material.

[0322] Next, the insulating layer 118 and the ground pin GP provided on the isolation body will be described.

[0323] 31a-31d are diagrams illustrating an insulating layer 118 of an isolation body according to an embodiment of the present invention.

[0324] 31a, the body 110 may include a first to fourth separated bodies 110a to 110d. Each of the first to fourth separated bodies 110a to 110d may include two outer surfaces that form the exterior of the body 110 and two inner surfaces that form the interior of the body 110.

[0325] The second isolated body 110b may have an insulating layer 118 on at least one inner surface. That is, the second isolated body 110b may have an insulating layer 118 on one or two inner surfaces. However, the insulating layer 118 is not limited to being provided on the second isolated body 110b. Unlike in FIG. 31a, the insulating layer 118 may be provided on at least one of the first isolated body 110a to the fourth isolated body 110d.

[0326] 31b, the first and second isolated bodies 110a, 110b may each have an insulating layer 118 on an inner surface thereof. Specifically, the insulating layer 118 may be provided on the inner surface of the first isolated body 110a facing the third isolated body 110c, and the insulating layer 118 may be provided on the inner surface of the second isolated body 110b facing the fourth isolated body 110d. Unlike FIG. 31b, the insulating layer 118 may be provided on at least one of the first to fourth isolated bodies 110a, 110d. Also, unlike FIG. 31b, the insulating layer 118 may be integrally formed.

[0327] 31c, the first isolated body 110a has insulating layers 118 on its inner surface facing the third isolated body 110c and on its two outer surfaces, and the second isolated body 110b has insulating layers 118 on its inner surface facing the fourth isolated body 110d and on its two outer surfaces, and the insulating layers 118 may be connected to each other to form an integral body. Unlike in FIG. 31c, the insulating layers 118 may be provided on at least two of the first isolated body 110a to the fourth isolated body 110d.

[0328] 31d, the second isolated body 110b may have two inner surfaces and two outer surfaces with insulating layers 118. Unlike in FIG. 31d, at least one of the first isolated body 110a to the fourth isolated body 110d may have insulating layers 118 on all surfaces.

[0329] Among the first to fourth isolated bodies 110a to 110d, the isolated body having the insulating layer 118 can be used as a ground pin GP. By configuring the probe pin 100 by separating the body 110 with multiple isolated bodies, rather than configuring the probe pin 100 as a single body 110, the skin effect can be reduced and the current carrying capacity can be increased. Furthermore, by using some of the multiple isolated bodies as ground pins GP, the skin effect can be reduced and the current carrying capacity can be increased, even for high-frequency signals.

[0330] 32a and 32b are front and side views of a probe pin 100 having an insulating layer 118 according to an embodiment of the present invention. Fig. 32c is a view showing an end of a first body 111 according to an embodiment of the present invention. Fig. 32d is a view showing a connection state between a contact tip 130 and a ground wire 230 according to an embodiment of the present invention.

[0331] 32a to 32c, a ground pin GP according to an embodiment of the present invention may include a first isolated body 110a and a second isolated body 110b. The first isolated body 110a may have an insulating layer 118 on an inner surface facing the third isolated body 110c, and the second isolated body 110b may have an insulating layer 118 on an inner surface facing the fourth isolated body 110d, or the insulating layers 118 may be integrally formed.

[0332] In an embodiment in which the third body 113 does not include the slit 120, the third body 113 does not include an isolated body, and therefore the insulating layer 118 may be formed on the inner surfaces of the first isolated body 110a and the second isolated body 110b and extend to the end surface of the third body 113. That is, the third body 113 may include the insulating layer 118 in the middle. This may be used for an isolated body having the insulating layer 118, which will be described later. As a result, the first isolated body 110a and the second isolated body 110b can be used as ground pins GP. As a result, the first isolated body 110a and the second isolated body 110b can be electrically insulated from the third isolated body 110c and the fourth isolated body 110d.

[0333] 32d, a probe card 200 according to an embodiment of the present invention may include an upper plate 210 having an upper hole 211, a lower plate 220 having a lower hole 221, and a probe pin 100. The probe pin 100 may include a body 110, a vertical slit 120a and a horizontal slit 120b, and may include first to fourth isolated bodies 110a to 110d separated by the vertical slit 120a and the horizontal slit 120b. The first isolated body 110a and the second isolated body 110b may include an insulating layer 118 and be used as a ground pin GP.

[0334] The upper plate 210 may include a ground wire 230 on an upper or lower portion thereof. In this case, the first and second isolated bodies 110a and 110b may be bent and connected to the ground wire 230.

[0335] The probe card 200 of this embodiment includes probe pins 100 spaced apart by a plurality of spaced apart bodies, and the spaced apart bodies including the insulating layer 118 are connected to the ground wiring 230, thereby reducing the cross-sectional area of ​​the body 110 and reducing the skin effect, and increasing the current carrying capacity even for high frequency signals.

[0336] 33a and 33b are front and side views of a probe pin 100 having an insulating layer 118 according to an embodiment of the present invention. Fig. 33c is a view showing an end of a first body 111 according to an embodiment of the present invention. Fig. 33d is a view showing a connection state between a contact tip 130 and a ground wire 230 according to an embodiment of the present invention.

[0337] 33a to 33c, a ground pin GP according to an embodiment of the present invention may include a first isolated body 110a and a fourth isolated body 110d. The second isolated body 110b may have insulating layers 118 on two inner surfaces facing the first isolated body 110a and the fourth isolated body 110d, and the insulating layers 118 may be integrally formed.

[0338] The insulating layer 118 may be formed on the inner surface of the second isolated body 110b and extend to the end surface of the third body 113. Thus, the second isolated body 110b may be used as a ground pin GP.

[0339] 33d, a probe card 200 according to an embodiment of the present invention may include an upper plate 210 having an upper hole 211, a lower plate 220 having a lower hole 221, and a probe pin 100. The probe pin 100 may include a body 110, a vertical slit 120a, and a horizontal slit 120b, and may include first to fourth isolated bodies 110a to 110d separated by the vertical slit 120a and the horizontal slit 120b. The second isolated body 110b may include an insulating layer 118 and may be used as a ground pin GP. Furthermore, at least one of the first to fourth isolated bodies 110a to 110d may include an insulating layer 118 and may be used as a ground pin GP.

[0340] The upper plate 210 may include a ground wire 230 on an upper or lower portion thereof. In this case, the first and second isolated bodies 110a and 110b may be bent and connected to the ground wire 230.

[0341] The probe card 200 of this embodiment includes probe pins 100 spaced apart by a plurality of spaced apart bodies, and the spaced apart bodies including the insulating layer 118 are connected to the ground wiring 230, thereby reducing the cross-sectional area of ​​the body 110 and reducing the skin effect, and increasing the current carrying capacity even for high frequency signals.

[0342] Figures 34a and 34b are front and side views of a probe pin 100 having an insulating layer 118 according to an embodiment of the present invention. Figure 34c is a view showing an end of a first body 111 and a ground wire 230 according to an embodiment of the present invention. Figure 34d is a view showing the positional state of the ground pin GP and the ground wire 230 according to an embodiment of the present invention.

[0343] In this embodiment, the probe pins 100 are similar to those shown in Figures 33a to 33d. Furthermore, in this embodiment, the probe card 200 includes an upper plate 210 with a ground wiring 230 on the upper portion thereof. Alternatively, the ground wiring 230 may be provided on the lower portion of the upper plate 210.

[0344] The ground wiring 230 may be extended to the upper hole 211 of the upper plate 210. In this case, the ground wiring 230 may be formed along two outer surfaces of the second isolated body 110b. In addition, the ground wiring 230 may be extended to an inner surface of the upper hole 211 of the upper plate 210. In this case, the ground wiring 230 may be formed along two outer surfaces of the second isolated body 110b. The probe pin 100 may be connected to the ground wiring 230 in an overdrive state.

[0345] On the other hand, the isolation body with the insulating layer 118 may have a shorter length than the other isolation bodies, i.e., the ground pin GP may be formed to have a shorter length than the other pins. In this configuration, the second isolated body 110b, which is used as the ground pin GP, ​​does not need to be bent, but the second isolated body 110b can be connected to the ground wiring 230 through elastic deformation in an overdrive state.

[0346] FIG. 35 is a diagram showing a probe pin 100 with a protrusion 119 according to an embodiment of the present invention.

[0347] 35, in this embodiment, the probe pin 100 is similar to that shown in FIGS. 33a to 33d. Furthermore, in this embodiment, the probe card 200 includes an upper plate 210 having a ground wiring 230 at its lower portion. In this case, the second isolated body 110b may have a protrusion 119 and be connected to the ground wiring 230. In this configuration, even if the second isolated body 110b used as the ground pin GP is not bent, the second isolated body 110b may be connected to the ground wiring 230 through elastic deformation in a normal state or an overdrive state.

[0348] As described above, the present invention has been described with reference to preferred embodiments, but a person skilled in the art can implement the present invention by modifying or changing it in various ways without departing from the spirit and scope of the present invention as set forth in the claims below. [Explanation of symbols]

[0349] 10 First Body Layer 11 First mold 12 First metal 13 First Sacrificial Layer 20 Second Body Layer 21 Second mold 22 Second metal 23 Second Sacrificial Layer 30 Third Body Layer 31 Third Mold 32 Third metal 50 base board 50a protrusion 100 probe pins 110 Body 110a First isolation body 110b second isolation body 110c Third Separate Body 110d 4th Separate Body 110e 5th Separated Body 110f 6th Separated Body 110g 7th separated body 110h 8th Separated Body 111 First Body 112 Second Body 113 Third Body 116 Overseparation 117 Thai Department 117a Depression 118 Insulating Layer 119 Protrusion 120 slit 120a Vertical slit 120b horizontal slit 130 Contact Tip 200 probe cards 210 Upper Plate 211 Upper Hall 220 Lower Plate 221 Lower Hall 230 Ground wiring GP Ground Pin

Claims

1. A body extending in one direction; a slit formed through a partial region of the body, The body is a first body constituting one side of the body, a second body extending from the first body to constitute a middle portion of the body, and a third body extending from the second body to constitute the other side of the body, The slit is a vertical slit formed vertically through the horizontal surface of the body; a horizontal slit formed horizontally through the vertical surface of the body.

2. The probe pin of claim 1 , wherein at least one of the vertical slit and the horizontal slit is formed in the second body.

3. At least one of the vertical slit and the horizontal slit is The probe pin of claim 1 , wherein the probe pin extends from the second body to an end of the first body, and one side of the first body is open.

4. The probe pin according to claim 1 , wherein the vertical slit and the horizontal slit intersect each other.

5. the body includes a first spaced body, a second spaced body, a third spaced body, and a fourth spaced body spaced apart from one another by the vertical slit and the horizontal slit; At least one of the first to fourth separated bodies includes an over-separated portion bent in a direction in which a separation distance between the first to fourth separated bodies and at least one of the remaining bodies excluding the at least one of the first to fourth separated bodies increases, The probe pin of claim 1 , wherein an over-separation portion contacts an upper plate into which the body is inserted to prevent the body from being separated.

6. the body includes a first spaced body, a second spaced body, a third spaced body, and a fourth spaced body spaced apart from one another by the vertical slit and the horizontal slit; a tie portion connecting an inner surface of the first remote body to an inner surface of at least one of the second remote body to the fourth remote body; The probe pin of claim 1 , further comprising: a recessed portion recessed in at least one of an outer surface facing an inner surface of the first isolation body to which the tie portion is connected and the outer surface facing the at least one inner surface.

7. The probe pin according to claim 1 , wherein at least one of the vertical slit and the horizontal slit is provided in plural.

8. The probe pin according to claim 1 , wherein the vertical slit and the horizontal slit have different widths or lengths.

9. The probe pin according to claim 1 , further comprising a contact tip located at an end region of the third body for contacting an object to be tested.

10. The probe pin of claim 9 , wherein the contact tip is made of a different material than the body.

11. 10. The probe pin according to claim 9, wherein the contact tip includes a rhodium layer made of a material containing rhodium.

12. The probe pin according to claim 11 , wherein the contact tip further includes a protective layer located on the rhodium layer and made of a material having a hardness lower than that of the rhodium.

13. The probe pin according to claim 9 , wherein the thickness of the contact tip is greater than the thickness of the horizontal slit.

14. The probe pin of claim 9 , wherein the horizontal slit and the contact tip are located at different heights so as not to form an overlapping region.

15. the body includes a first spaced body, a second spaced body, a third spaced body, and a fourth spaced body spaced apart from one another by the vertical slit and the horizontal slit; At least one of the first to fourth isolated bodies further includes an insulating layer formed to be insulated from the rest except for the at least one isolated body, The probe pin according to claim 1 , wherein the insulating layer is formed on the at least one inner surface facing the remainder and extends from the first body to the third body.

16. The probe pin of claim 15 , wherein at least one of the first to fourth isolated bodies is bent or has a protrusion to be connected to a ground wire as a ground pin.

17. A body extending in one direction; a vertical slit formed vertically through the horizontal surface of the body; a horizontal slit formed horizontally through the vertical surface of the body; a contact tip formed on one side of the body.

18. The probe pin according to claim 17 , wherein the contact tip is formed at a height closer to a lower surface of the body than to an upper surface of the body.

19. a probe pin having a body, a vertical slit formed vertically through a horizontal surface of the body, and a horizontal slit formed horizontally through the vertical surface of the body; an upper plate having an upper hole through which the probe pin passes; a lower plate having a lower hole through which the probe pin passes; The body includes a first body located in the upper hole, a third body located in the lower hole, and a second body formed between the first body and the third body.

20. the body includes a first spaced body, a second spaced body, a third spaced body, and a fourth spaced body spaced apart from one another by the vertical slit and the horizontal slit; At least one of the first to fourth separated bodies includes an over-separated portion bent in a direction in which a separation distance between the first to fourth separated bodies and at least one of the remaining bodies excluding the at least one of the first to fourth separated bodies increases, The probe card of claim 19 , wherein an over-separation portion contacts an upper plate into which the body is inserted to prevent the body from being separated.

21. the body includes a first spaced body, a second spaced body, a third spaced body, and a fourth spaced body spaced apart from one another by the vertical slit and the horizontal slit; At least one of the first to fourth isolated bodies further includes an insulating layer formed to be insulated from the rest except for the at least one isolated body, the insulating layer is formed on the at least one inner surface facing the remainder and extends from the first body to the third body; the upper plate includes a ground wiring on an upper surface or a lower surface; The probe card of claim 19 , wherein the at least one is coupled to the ground wire.

22. providing a base substrate; providing a first body layer on the base substrate; providing a second body layer on the first body layer, the second body layer including a connecting portion and a horizontal slit; and providing a third body layer on the second body layer.

23. The method for manufacturing a probe pin according to claim 22 , wherein the second body layer further includes a contact tip.

24. Before the step of providing the second body layer, The method further includes providing a first sacrificial layer around the first body layer; The step of providing the second body layer includes: providing the connecting portion on a partial region of the first body layer; and providing the contact tip on an area including a boundary between the first body layer and the first sacrificial layer; The method for manufacturing a probe pin according to claim 23 , wherein the contact tip is made of a material different from the first body layer and the second body layer.

25. The step of providing the contact tip comprises: providing a second metal; providing a protective layer on the second metal; The method for manufacturing a probe pin according to claim 24, wherein the protective layer is made of a material having a lower hardness than the second metal.

26. The method for manufacturing a probe pin according to claim 22 , wherein the first body layer, the second body layer, and the third body layer include vertical slits.

27. providing a base substrate having a protrusion on an upper surface thereof; providing a contact tip on the upper surface of the protrusion; and providing a body on at least a portion of the contact tip and the base substrate.

28. The step of providing the body includes: providing a first body layer on at least a portion of the contact tip and the base substrate; providing a second body layer on the first body layer, the second body layer including a connecting portion and a horizontal slit; and providing a third body layer on the second body layer.

29. placing the upper plate and the lower plate adjacent to each other so that the upper hole of the upper plate overlaps the lower hole of the lower plate; passing a probe pin through the upper hole and the lower hole; and raising the upper plate to bring the over-separated portions of the probe pins into contact with the upper holes.

30. placing the upper plate and the lower plate adjacent to each other so that the upper hole of the upper plate overlaps the lower hole of the lower plate; passing a probe pin through the upper hole and the lower hole; connecting the isolated body including the ground layer among the first to fourth isolated bodies separated by the vertical slit and the horizontal slit to a ground wire.

Images