Thermal head for independent control of zones

Abstract

Disclosed herein are thermal heads and corresponding test systems for independently controlling one or more components while testing one or more devices under test. In some embodiments, the thermal head includes multiple adapters, one or more heaters, and one or more thermal controllers for independently controlling the temperatures of the components. The thermal controllers may independently control the temperatures of at least some of the components such that thermal control of one component does not affect the thermal control of other components. In some embodiments, thermal control is performed using one or more cold plates, and the thermal head includes one or more cold plates. Embodiments of the present disclosure further include independent control of one or more forces using one or more force mechanisms.

Description

[Technical Field]

[0001] (CROSS-REFERENCE TO RELATED APPLICATIONS) This application claims the benefit of U.S. Non-provisional Application No. 17 / 971,505, filed October 21, 2022, U.S. Non-provisional Application No. 18 / 048,831, filed October 21, 2022, U.S. Non-provisional Application No. 18 / 848,833, filed October 21, 2022, and U.S. Non-provisional Application No. 18 / 048,836, filed October 21, 2022, the entire contents of each of which are incorporated herein by reference for all purposes.

[0002] (Field) The present disclosure relates to a test system with a thermal head capable of independently controlling multiple zones while testing a device. [Background technology]

[0003] Integrated circuit (IC) chips are typically fabricated in multiple identical copies on semiconductor wafers. After wafer fabrication is complete, the wafers may be cut or diced to separate individual IC chips. These IC chips (also referred to as devices) may then be tested (referred to as devices under test (DUTs)). Testing may involve electrical testing (burn-in tests, open and short circuit tests, device function tests, system-level tests, etc.), and the performance (e.g., functionality, speed, reliability, etc.) of the IC chip may be measured by a test system to determine whether the IC chip meets one or more performance metrics. For example, electrical test signals may be communicated to and / or from the IC chip to measure its performance. If the IC chip meets the performance metrics, the IC chip may be assembled into a package. Packages may be used for multiple purposes, such as environmental protection and providing electrical contact from the IC chip to a system board, among others. These packages may be tested. In some cases, testing at the package level is similar to testing at the chip level.

[0004] The performance of the DUT may be compared to a target performance or specification, such as the performance of a reference device or another device. One factor that may cause the DUT's performance to deviate or fall off prematurely while being tested may be its temperature. To ensure that any deviations in the DUT's performance are not due to temperature, the temperature of the DUT may be controlled during testing. It may be important that the temperature of the DUT remains constant and at a set-point temperature (or within a given range). While undergoing testing, thermal energy may be exchanged between the DUT and components thermally coupled to it. The temperature of the DUT may be controlled via a heat sink or cold plate thermally coupled to the DUT. Thermal coupling may occur when there is sufficient contact between the cold plate and the DUT and / or any intermediate layers.

[0005] Advances in technology, such as process nodes, have led to more difficult and expensive wafer fabrication. For example, technologies involving 9 nm and below may require extreme ultraviolet (EUV) processing techniques for critical mask layers. Designing and fabricating advanced types of IC chips (e.g., wafer-level systems-on-chips (SOCs)) can be challenging, especially when multiple functions are involved. In some cases, different package designs may be developed or utilized. For example, multiple IC chips, mixed bare IC chips, pre-packaged IC chips, etc. may be packaged together in a device. Different types of advanced packages, such as system-in-package (SiP), multi-chip modules (MCM), stacked die, and heterogeneous integrated packages, have already been developed and are becoming more structurally and functionally complex. In some cases, devices include an increasing number of components within the same size or more compact packaging, bringing the components into closer proximity to one another. Close proximity can make it difficult to control the temperature of a component if not considered, as the temperature of the component may be affected by the temperature of neighboring components.

[0006] Some devices (chips or packages) may have multiple zones, each of which may include one or more components (e.g., component IC chips within a package may each have a zone). For example, a complex SOC may include multiple components, such as a graphics processing unit (GPU) core, multiple central processing unit (CPU) cores, and various interfaces and other functions, separated into multiple zones within the device. In some cases, components within a device under test may have different characteristics, such as height, surface area, stacked vs. non-stacked, etc., and therefore, a test system with a single adapter or multiple adapters with the same characteristics may not adequately thermally couple to the components (e.g., due to insufficient contact). In some cases, components may dissipate different amounts of power while under test conditions due to the functionality of the different zones and / or tests being performed in the different zones. It may be beneficial to keep the temperature of the components constant and at the same set-point temperature (or within a given range) while the device is being tested. The test system may not account for different amounts of power dissipation. What is needed is a test system that allows for independent control of one or more characteristics (e.g., temperature, applied force, movement, etc.) of different components within a device or devices under test. What is needed is a test system that allows for independent control of components that are in close proximity to one another. Summary of the Invention [Means for solving the problem]

[0007] Disclosed herein are thermal heads and corresponding test systems for independently controlling multiple zones (e.g., one or more components) while testing one or more devices under test. In some embodiments, the thermal head includes multiple adapters, one or more heaters, and one or more thermal controllers for independently controlling the temperatures of the components. For example, two components may have different setpoint temperatures. The thermal controller may independently control the temperatures of two components so that thermal control of one component does not affect the thermal control of the other component. At a given time, a first heater (thermally coupled to the first component) may heat the first component, while the temperature of the second component may remain the same. In some embodiments, thermal control is performed using one or more cold plates, and the thermal head includes one or more cold plates. As one non-limiting example, at a given time, the first component is cooled by the cold plate, while the second component is not. As yet another example, a third component may not be thermally coupled to the heater and / or cold plate. Embodiments of the present disclosure include independent control of one or more forces using one or more force mechanisms.

[0008] A test system for testing one or more devices under test is disclosed. The test system includes a thermal head for controlling one or more temperatures of the one or more devices under test, the thermal head including a plurality of adapters thermally coupled to one or more components of the one or more devices under test, and one or more heaters thermally coupled to the plurality of adapters and to one or more components of the one or more devices under test, the one or more heaters configured to heat the one or more components of the one or more devices under test, and one or more thermal controllers configured to independently control one or more temperatures of the one or more components of the one or more devices under test. Additionally or alternatively, in some embodiments, at least two of the one or more components have different setpoint temperatures. Additionally or alternatively, in some embodiments, one or more temperatures of the one or more components are independently controlled using different changes in temperature. Additionally or alternatively, in some embodiments, the one or more heaters include a first heater and a second heater, and the one or more components include a first component and a second component, where the first heater is configured to heat the first component and the second heater is configured to heat the second component. Additionally or alternatively, in some embodiments, the thermal head further includes one or more temperature sensors configured to measure temperatures of the one or more heaters or the multiple adapters, and the one or more thermal controllers control the one or more temperatures based on the measured temperatures. Additionally or alternatively, in some embodiments, the update frequency of the one or more thermal controllers for independently controlling one or more temperatures of the one or more components is less than 200 microseconds. Additionally or alternatively, in some embodiments, the one or more heaters include a heater including at least two heating elements, and the thermal head further includes a thermal insulator positioned between the at least two heating elements. Additionally or alternatively, in some embodiments, the thermal insulator includes a material having through holes or grooves.Additionally or alternatively, in some embodiments, the thermal head further comprises a heat dissipation material located on at least one side of at least one of the one or more heaters. Additionally or alternatively, in some embodiments, the thermal head further comprises a heat dissipation material located on at least one side of at least one of the plurality of adapters. Additionally or alternatively, in some embodiments, the plurality of adapters comprise a first adapter thermally coupled to the first heat dissipation material layer and a second adapter thermally coupled to the second heat dissipation material layer, wherein the thermal resistance of the first heat dissipation material layer is different from the thermal resistance of the second heat dissipation material layer. Additionally or alternatively, in some embodiments, the first heat dissipation material layer has a larger surface area than the second heat dissipation material layer. Additionally or alternatively, in some embodiments, the second heat dissipation material layer comprises openings or holes. Additionally or alternatively, in some embodiments, at least one of the one or more heaters is in contact with at least one of the one or more components. Additionally or alternatively, in some embodiments, at least one of the one or more heaters is attached to at least one of the plurality of adapters. Additionally or alternatively, in some embodiments, at least one heater includes a plurality of pins that enable the at least one heater to be attached to the at least one adapter. Additionally or alternatively, in some embodiments, the plurality of pins are attached to the at least one adapter by soldering, welding, brazing, press-fitting, or a conductive adhesive. Additionally or alternatively, in some embodiments, the surface area of ​​at least one of the one or more heaters is the same as the surface area of ​​the corresponding adapter. Additionally or alternatively, in some embodiments, at least one of the one or more heaters and the corresponding adapter include mating alignment features for aligning the at least one heater and the corresponding adapter.Additionally or alternatively, in some embodiments, the one or more components of the one or more devices under test comprise a first component and a second component, and the plurality of adapters comprise a first adapter and a second adapter, where the first component is thermally coupled to the first adapter and the second component is thermally coupled to the second adapter. Additionally or alternatively, in some embodiments, the one or more thermal controllers control one or more temperatures of the one or more components based on an amount of power from the one or more components. Additionally or alternatively, in some embodiments, the amount of power from the one or more components comprises an expected amount of power dissipation. Additionally or alternatively, in some embodiments, the thermal head further comprises one or more cold plates thermally coupled to at least one of the plurality of adapters, where the one or more cold plates are configured to cool the at least one adapter. Additionally or alternatively, in some embodiments, the one or more cold plates are independently controlled. Additionally or alternatively, in some embodiments, the thermal head further comprises one or more force mechanisms configured to apply a force to at least one of the one or more components. Additionally or alternatively, in some embodiments, one or more force mechanisms are independently controlled. Additionally or alternatively, in some embodiments, at least two of the one or more components have different heights. Additionally or alternatively, in some embodiments, at least one of the plurality of adapters is thermally coupled to at least two of the one or more components. Additionally or alternatively, in some embodiments, each of the plurality of adapters is thermally coupled to only one of the one or more components. Additionally or alternatively, in some embodiments, the one or more components are part of a single device under test.

[0009] A test system for testing one or more devices under test is disclosed. The test system includes a thermal head for controlling one or more temperatures of the one or more devices under test, the thermal head including a plurality of adapters thermally coupled to one or more components of the one or more devices under test, and one or more cold plates thermally coupled to the plurality of adapters, the cold plates configured to cool the plurality of adapters; and one or more thermal controllers configured to independently control one or more temperatures of the one or more components of the one or more devices under test. Additionally or alternatively, in some embodiments, at least two of the one or more components have different setpoint temperatures. Additionally or alternatively, in some embodiments, one or more temperatures of the one or more components are independently controlled using different changes in temperature. Additionally or alternatively, in some embodiments, the one or more cold plates include a first cold plate and a second cold plate, and the multiple adapters include a first adapter and a second adapter, where the first cold plate is configured to cool the first adapter and the second cold plate is configured to cool the second adapter. Additionally or alternatively, in some embodiments, at least two of the multiple adapters are thermally coupled to the same cold plate. Additionally or alternatively, in some embodiments, at least one of the multiple adapters is in contact with at least one of the one or more cold plates. Additionally or alternatively, in some embodiments, at least one cold plate has a surface area that is the same as the surface area of ​​the at least one adapter. Additionally or alternatively, in some embodiments, the one or more thermal controllers set, regulate, or maintain the temperature of the one or more cold plates by setting, regulating, or maintaining a flow rate or temperature of a liquid or gas associated with the one or more cold plates.Additionally or alternatively, in some embodiments, the update frequency of one or more thermal controllers for independently controlling one or more temperatures of one or more components is less than 200 microseconds. Additionally or alternatively, in some embodiments, the thermal head further comprises a heat dissipation material located on at least one side of at least one of the one or more cold plates. Additionally or alternatively, in some embodiments, the thermal head further comprises a heat dissipation material located on at least one side of at least one of the plurality of adapters. Additionally or alternatively, in some embodiments, the plurality of adapters comprises a first adapter thermally coupled to the first heat dissipation material layer and a second adapter thermally coupled to the second heat dissipation material layer, wherein the thermal resistance of the first heat dissipation material layer is different from the thermal resistance of the second heat dissipation material layer. Additionally or alternatively, in some embodiments, the first heat dissipation material layer has a larger surface area than the second heat dissipation material layer. Additionally or alternatively, in some embodiments, the second heat dissipation material layer comprises openings or holes. Additionally or alternatively, in some embodiments, the one or more components of the one or more devices under test comprise a first component and a second component, and the plurality of adapters comprise a first adapter and a second adapter, wherein the first component is thermally coupled to the first adapter and the second component is thermally coupled to the second adapter. Additionally or alternatively, in some embodiments, the one or more thermal controllers control one or more temperatures of the one or more components based on an amount of power from the one or more components. Additionally or alternatively, in some embodiments, the amount of power from the one or more components comprises an expected amount of power dissipation. Additionally or alternatively, in some embodiments, at least two of the one or more components have different amounts of power dissipation. Additionally or alternatively, in some embodiments, the thermal head further comprises one or more heaters thermally coupled to at least one of the one or more components, wherein the one or more heaters are configured to heat the at least one component.Additionally or alternatively, in some embodiments, the one or more heaters are independently controlled. Additionally or alternatively, in some embodiments, the thermal head further includes one or more force mechanisms configured to apply a force to at least one of the one or more components. Additionally or alternatively, in some embodiments, the one or more force mechanisms are independently controlled. Additionally or alternatively, in some embodiments, the one or more force mechanisms are in contact with at least one of the one or more cold plates. Additionally or alternatively, in some embodiments, at least one of the multiple adapters is thermally coupled to at least two of the one or more components. Additionally or alternatively, in some embodiments, each of the multiple adapters is thermally coupled to only one of the one or more components. Additionally or alternatively, in some embodiments, the one or more components are part of a single device under test.

[0010] A test system for testing one or more devices under test is disclosed. The test system includes a thermal head for controlling one or more temperatures of the one or more devices under test, the thermal head including a plurality of adapters thermally coupled to one or more components of the one or more devices under test and one or more force mechanisms configured to apply one or more forces to the one or more components of the one or more devices under test, and a force controller configured to independently control the one or more forces applied to the one or more components of the one or more devices under test. Additionally or alternatively, in some embodiments, at least two of the one or more components are tested with different applied forces. Additionally or alternatively, in some embodiments, the one or more force mechanisms include one or more force application devices that apply the one or more forces to the one or more components. Additionally or alternatively, in some embodiments, the one or more force application devices include a pneumatic or hydraulic cylinder, a pneumatic or hydraulic diaphragm, a stepper motor, a linear motor, a servo motor, an electroactive polymer actuator, a shape memory alloy actuator, an electromagnetic actuator, a rotary motor, an electromechanical actuator, a piezoelectric actuator, or a voice coil. Additionally or alternatively, in some embodiments, the one or more force mechanisms include one or more pushers, and the one or more force applicators push the one or more pushers so that the one or more devices under test are moved toward the socket. Additionally or alternatively, in some embodiments, at least one of the one or more force mechanisms applies a force greater than 2 kgf. Additionally or alternatively, in some embodiments, the one or more force mechanisms include a first force mechanism and a second force mechanism, and the plurality of adapters includes a first adapter and a second adapter, wherein the first force mechanism applies a first force to the first adapter and the second force mechanism applies a second force to the second adapter.Additionally or alternatively, in some embodiments, the one or more force mechanisms include one or more transducers configured to measure force, and the force controller sets, adjusts, or maintains the one or more applied forces based on the measured force. Additionally or alternatively, in some embodiments, the one or more force mechanisms include one or more force application devices, and the one or more force application devices are controlled based on a difference between the measured force and a target force. Additionally or alternatively, in some embodiments, the one or more transducers include a pneumatic load cell, a hydraulic load cell, an inductive load cell, a capacitive load cell, a magnetostrictive device, a strain gauge-based sensor, a force-sensitive resistor, a thin film device, or a piezoelectric device. Additionally or alternatively, in some embodiments, the thermal head further includes one or more cold plates, and the one or more transducers are in contact with the one or more cold plates. Additionally or alternatively, in some embodiments, at least one of the one or more force mechanisms includes a spring. Additionally or alternatively, in some embodiments, at least one of the one or more force mechanisms comprises a piston, a ramp, and a roller, where movement of the piston causes movement of the ramp, which adjusts the amount of force applied by the roller. Additionally or alternatively, in some embodiments, at least one of the one or more force mechanisms comprises a cam and a roller, where rotation of the cam adjusts the amount of force applied by the roller. Additionally or alternatively, in some embodiments, at least one of the one or more forces is a variable force that is different at the beginning and during the test, or during the test and at the end of the test. Additionally or alternatively, in some embodiments, at least one of the one or more forces is a fixed force that is the same at the beginning and during the test, or during the test and at the end of the test. Additionally or alternatively, in some embodiments, at least one of the one or more force mechanisms applies a force to at least two of the one or more components.Additionally or alternatively, in some embodiments, the test system further includes a test force mechanism configured to move one or more devices under test toward the sockets to electrically couple the one or more devices under test to the sockets. Additionally or alternatively, in some embodiments, the test force mechanism includes a force applicator configured to apply a force greater than 10 kgf. Additionally or alternatively, in some embodiments, the thermal head further includes one or more heaters thermally coupled to at least one of the one or more components, the one or more heaters configured to heat the at least one component. Additionally or alternatively, in some embodiments, the one or more heaters are independently controlled. Additionally or alternatively, in some embodiments, the thermal head further includes one or more cold plates thermally coupled to at least one of the plurality of adapters, the one or more cold plates configured to cool the at least one adapter. Additionally or alternatively, in some embodiments, the one or more cold plates are independently controlled. Additionally or alternatively, in some embodiments, the one or more thermal controllers control one or more temperatures of the one or more components based on the amount of power from the one or more components. Additionally or alternatively, in some embodiments, the amount of power from the one or more components comprises an expected power dissipation amount. Additionally or alternatively, in some embodiments, at least two of the one or more components have different power dissipation amounts. Additionally or alternatively, in some embodiments, at least two of the one or more components have different heights. Additionally or alternatively, in some embodiments, at least one of the multiple adapters is thermally coupled to at least two of the one or more components. Additionally or alternatively, in some embodiments, each of the multiple adapters is thermally coupled to only one of the one or more components. Additionally or alternatively, in some embodiments, the one or more components are part of a single device under test.

[0011] A test system for testing one or more devices under test is disclosed. The test system includes a thermal head for controlling one or more temperatures of the one or more devices under test, the thermal head including a plurality of adapters thermally coupled to one or more components of the one or more devices under test, the plurality of adapters including a first adapter and a second adapter, wherein movement of the first adapter is independent of movement of the second adapter, and a controller configured to independently control one or more characteristics of the plurality of adapters. Additionally or alternatively, in some embodiments, the one or more characteristics include temperature or force. Additionally or alternatively, in some embodiments, the plurality of adapters includes a first adapter having a first height and a second adapter having a second height. Additionally or alternatively, in some embodiments, the plurality of adapters includes a first adapter having a first thermal mass and a second adapter having a second thermal mass. Additionally or alternatively, in some embodiments, the plurality of adapters includes a first adapter having a first surface area thermally coupled to one or more corresponding components and a second adapter having a second surface area thermally coupled to one or more corresponding components. Additionally or alternatively, in some embodiments, at least two of the plurality of adapters are configured to thermally couple to one or more components on the same side of a substrate of one or more devices under test. Additionally or alternatively, in some embodiments, at least two of the plurality of adapters are configured to thermally couple to one or more components on different sides of a substrate of one or more devices under test. Additionally or alternatively, in some embodiments, the plurality of adapters includes the first adapter nested within the second adapter. Additionally or alternatively, in some embodiments, the plurality of adapters includes the first adapter and the second adapter, and the thermal head further includes a first heater thermally coupled to the first adapter and a second heater thermally coupled to the second adapter, the first heater nested within the second heater.Additionally or alternatively, in some embodiments, the plurality of adapters further comprises a first adapter and a second adapter, and the thermal head comprises a first heat-dissipating material layer thermally coupled to the first adapter and a second heat-dissipating material layer thermally coupled to the second adapter, the first heat-dissipating material layer being nested within the second heat-dissipating material layer. Additionally or alternatively, in some embodiments, the first adapter is thermally coupled to the first component and the second adapter is thermally coupled to the second component, and movement of the second component is not independent of movement of the first component. Additionally or alternatively, in some embodiments, the one or more components comprise stacked components. Additionally or alternatively, in some embodiments, the first adapter is thermally coupled to the first component of the stacked components and the second adapter is thermally coupled to the second component of the stacked components, and the height of the first adapter is less than the height of the second adapter. Additionally or alternatively, in some embodiments, the first adapter is thermally coupled to a first component of the stacked components, and the second adapter is thermally coupled to a second component of the stacked components, and the force applied by the first adapter is less than the force applied by the second adapter. Additionally or alternatively, in some embodiments, the thermal head further includes one or more heaters thermally coupled to at least one of the one or more components, the one or more heaters being configured to heat the at least one component. Additionally or alternatively, in some embodiments, the one or more heaters include a first heater coupled to the first adapter and a second heater coupled to the second adapter, and movement of the first heater is independent of movement of the second heater. Additionally or alternatively, in some embodiments, at least one of the one or more heaters is in contact with at least one of the multiple adapters. Additionally or alternatively, in some embodiments, the one or more heaters are independently controlled.Additionally or alternatively, in some embodiments, the thermal head further includes one or more cold plates thermally coupled to at least one of the multiple adapters, the one or more cold plates configured to cool the at least one adapter. Additionally or alternatively, in some embodiments, the one or more cold plates include a first cold plate coupled to the first adapter and a second cold plate coupled to the second adapter, the movement of the first cold plate being independent of the movement of the second cold plate. Additionally or alternatively, in some embodiments, at least one of the one or more cold plates is in contact with at least one of the multiple adapters. Additionally or alternatively, in some embodiments, the one or more cold plates are independently controlled. Additionally or alternatively, in some embodiments, the thermal head further includes one or more force mechanisms configured to apply one or more forces to at least one of the one or more components. Additionally or alternatively, in some embodiments, the one or more force mechanisms are independently controlled. Additionally or alternatively, in some embodiments, at least two of the one or more components have different setpoint temperatures. Additionally or alternatively, in some embodiments, at least two of the one or more components have different amounts of power dissipation. Additionally or alternatively, in some embodiments, at least two of the one or more components are tested with different applied forces. Additionally or alternatively, in some embodiments, at least two of the one or more components have different heights. Additionally or alternatively, in some embodiments, at least one of the plurality of adapters is thermally coupled to at least two of the one or more components. Additionally or alternatively, in some embodiments, the one or more components are part of a single device under test.

[0012] It should be understood that any of the variations, aspects, features, and options described with respect to the system apply equally to the method, and vice versa. It will also be apparent that any one or more of the variations, aspects, features, and options described above may be combined. It should also be understood that the present invention is not limited to the objectives mentioned above, but may include other objectives, including those that may be recognized by those skilled in the art. [Brief explanation of the drawings]

[0013] [Figure 1A] FIG. 1A illustrates a top view of an exemplary chip comprising multiple regions.

[0014] [Figure 1B] FIG. 1B illustrates a block diagram of an exemplary test system according to some embodiments.

[0015] [Figure 2A] FIG. 2A illustrates a top view of an exemplary device comprising multiple zones according to some embodiments.

[0016] [Figure 2B] FIG. 2B illustrates a cross-sectional view of the device along line AA as depicted in FIG. 2A.

[0017] [Figure 2C] FIG. 2C illustrates a cross-sectional view of the device along line BB as depicted in FIG. 2A.

[0018] [Figure 3A] 3A-3C illustrate cross-sectional views of an exemplary thermal head with multiple adapters according to some embodiments. [Figure 3B] 3A-3C illustrate cross-sectional views of an exemplary thermal head with multiple adapters according to some embodiments. [Figure 3C] 3A-3C illustrate cross-sectional views of an exemplary thermal head with multiple adapters according to some embodiments.

[0019] [Figure 4] FIG. 4 illustrates a cross-sectional view of a portion of a thermal head according to some embodiments.

[0020] [Figure 5A] FIG. 5A illustrates a cross-sectional view of an exemplary heater according to some embodiments.

[0021] [Figure 5B] FIG. 5B illustrates an exemplary adapter with holes that provide access to the pins according to some embodiments.

[0022] [Figure 6] 6A and 6B illustrate cross-sectional views of an exemplary cold plate according to some embodiments.

[0023] [Figure 7A] FIG. 7A illustrates an exemplary thermal interface material with openings or holes according to some embodiments.

[0024] [Figure 7B] FIG. 7B illustrates an exemplary liquid thermal interface material being dispensed according to some embodiments.

[0025] [Figure 8A] 8A and 8B illustrate a top view and a cross-sectional view, respectively, of a device including stacked components according to some embodiments. [Figure 8B] 8A and 8B illustrate a top view and a cross-sectional view, respectively, of a device including stacked components according to some embodiments.

[0026] [Figure 9A] FIG. 9A illustrates a top view of an exemplary device comprising stacked components according to some embodiments.

[0027] [Figure 9B] 9B and 9C illustrate cross-sectional views of the thermal head and device along lines BB and AA, respectively, as depicted in FIG. 9A. [Figure 9C] 9B and 9C illustrate cross-sectional views of the thermal head and device along lines BB and AA, respectively, as depicted in FIG. 9A.

[0028] [Figure 10A] 10A and 10B illustrate a top view and a cross-sectional view, respectively, of an exemplary device comprising components on multiple sides of a substrate according to some embodiments. [Figure 10B] 10A and 10B illustrate a top view and a cross-sectional view, respectively, of an exemplary device comprising components on multiple sides of a substrate according to some embodiments.

[0029] [Figure 11] FIG. 11 illustrates a cross-sectional view of a portion of a test system including a thermal head with components on multiple sides of a substrate and a device under test according to some embodiments.

[0030] [Figure 12A] FIG. 12A illustrates an exemplary force mechanism comprising a piston and a ramp according to some embodiments of the present disclosure.

[0031] [Figure 12B] FIG. 12B illustrates an exemplary force mechanism comprising a cam-roller according to some embodiments of the present disclosure.

[0032] [Figure 13A] FIG. 13A illustrates a cross-sectional view of an exemplary test system according to some embodiments.

[0033] [Figure 13B] FIG. 13B illustrates a flowchart of an exemplary method of operating a test system 1390 according to some embodiments.

[0034] [Figure 14] FIG. 14 illustrates an exemplary active thermal control for multiple components of a device according to some embodiments.

[0035] [Figure 15] FIG. 15 illustrates an exemplary thermal head and socket according to some embodiments.

[0036] [Figure 16] FIG. 16 illustrates a block diagram of an exemplary computer used for one or more controllers according to embodiments of the present disclosure. DETAILED DESCRIPTION OF THE INVENTION

[0037] It should be understood that any of the variations, aspects, features, and options described with respect to the system apply equally to the method, and vice versa. It will also be apparent that any one or more of the variations, aspects, features, and options described above may be combined.

[0038] Disclosed herein are thermal heads and corresponding test systems for independently controlling multiple zones (e.g., one or more components) while testing one or more devices under test. In some embodiments, the thermal head includes multiple adapters, one or more heaters, and one or more thermal controllers for independently controlling the temperatures of the components. For example, two components may have different setpoint temperatures. The thermal controller may independently control the temperatures of two components so that thermal control of one component does not affect the thermal control of the other component. At a given time, a first heater (thermally coupled to the first component) may heat the first component, while the temperature of the second component may remain the same. In some embodiments, the thermal control uses one or more cold plates, and the thermal head includes one or more cold plates. As one non-limiting example, at a given time, the first component is cooled by the cold plate, while the second component is not. As yet another example, a third component may not be thermally coupled to the heater and / or cold plate. Embodiments of the present disclosure include independent control of one or more forces using one or more force mechanisms.Embodiments of the present disclosure further include methods for the operation thereof.

[0039] The following description is presented to enable those skilled in the art to make and use various embodiments. Descriptions of specific devices, techniques, and applications are provided only as examples. These examples are provided merely to add context and aid in understanding the described examples. Thus, it will be apparent to one skilled in the art that the described examples can be practiced without some or all of the specific details. Other applications are possible, and therefore the following examples should not be construed as limiting. Various modifications in the examples described herein will be readily apparent to those skilled in the art, and the general principles defined herein may be applied to other examples and applications without departing from the spirit and scope of the various embodiments. Thus, the various embodiments are not intended to be limited to the examples described and shown herein, but are to be accorded scope consistent with the claims.

[0040] Various techniques and process flow steps will be described in detail with reference to examples as illustrated in the accompanying drawings. In the following description, numerous specific details are set forth to provide a thorough understanding of one or more aspects and / or features described or referenced herein. However, it will be apparent to one skilled in the art that one or more aspects and / or features described or referenced herein can be practiced without some or all of these specific details. In other instances, well-known process steps and / or structures have not been described in detail so as not to obscure some of the aspects and / or features described or referenced herein.

[0041] In the following description of examples, reference is made to the accompanying drawings, which form a part hereof, and in which is shown by way of illustrative example specific examples which may be practiced. It is to be understood that other examples may be used and structural changes may be made without departing from the scope of the disclosed examples.

[0042] The terminology used in describing the various described embodiments herein is for the purpose of describing particular embodiments and is not intended to be limiting. As used in describing the various described embodiments and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It should also be understood that the term "and / or," as used herein, refers to and encompasses any and all possible combinations of one or more of the associated listed items. It should be further understood that the terms "includes," "including," "comprises," and / or "comprising," when used herein, specify the presence of stated features, integers, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof. It should also be understood that the term "same" as used herein refers to characteristics that are described as being identical or within a range (e.g., 1%, 5%, etc.) of identical.

[0043] Some devices may include multiple regions, each of which may include one or more components (e.g., an IC chip in a package or functional blocks within a chip). FIG. 1A illustrates a top view of an example chip including multiple regions. Device 100 may include regions 117A, 117B, 117C, 117D, 119A, 119B, and 119C. For example, a complex SOC device may include multiple graphics processing unit (GPU) cores, multiple central processing unit (CPU) cores, and various interfaces and other functions; regions 119A, 119B, and 119C may be high-power regions (e.g., including GPU and / or CPU cores), and regions 117A, 117B, 117C, and 117D may be low-power regions (e.g., including memory, transceivers, etc.). A region may include one or more components. In some embodiments, at least two zones of a device may dissipate different amounts of power while under test conditions due to the functionality of the different zones and / or tests being performed in the different zones. It may be beneficial to keep the temperature of one or more zones constant and at one or more set point temperatures (or within a given range) while the device is being tested.

[0044] A zone may comprise one or more components, such as zone 117A comprising one or more components and zone 119C comprising at least two components. The one or more components may be part of a single device (as shown in the figure) or, alternatively, part of multiple devices under test (not shown in the figure).

[0045] 1B illustrates a block diagram of an exemplary test system according to some embodiments. The test system 190 may include a thermal head 150, a controller 158, a socket 121, and a tester 141. The thermal head 150 may be configured to thermally control the device under test 100. The thermal head 150 may include one or more of an adapter 130, a heater 156, a cold plate 162, or a force mechanism 132. The adapter 130 may be configured to allow thermal energy to be transferred to and / or from thermally coupled components. For example, the adapter 130 may allow thermal energy (e.g., heat) to be transferred from the heater 156 located on the bottom side of the adapter 130 to the cold plate 162 located on the top side of the adapter 130. The heater 156 may be configured to increase the temperature of (e.g., heat) the device 100, and the cold plate 162 may be configured to decrease the temperature of (e.g., cool) the device 100. The ability and speed of the thermal head in thermally controlling the temperature of the device 100 may depend on the thermal coupling between its components and the device 100.

[0046] The force mechanism 132 may be configured to apply a force to the device 100 to improve thermal coupling between the thermal head 150 and the device 100. The controller 158 may be configured to send one or more signals to the thermal head 150 to control one or more of its components. For example, the controller 158 may send a current or voltage signal to the heater 156 to cause the heater 156 to heat the device 100. As another example, the controller 158 may send a current or voltage signal to a valve or associated chiller metering the flow inside the cold plate 162 to cause the valve or associated chiller to cool the device 100. Additionally or alternatively, the controller 158 may send a current or voltage signal to the thermal head 150 to cause the force mechanism 132 to apply more or less force, thereby improving thermal coupling between the thermal head 150 and the device 100 without damaging it. As one non-limiting example, the thermal controller may be a field-programmable gate array (FPGA)-based proportional-integral-derivative (PID) controller.

[0047] The socket 121 may be configured to electrically couple power connections and / or test signals from the tester 141 to the device 100 or from the device 100 to the tester 141. The tester 141 may transmit test signals and / or receive response signals to determine the performance of the device 100. In some embodiments, the tester 141 may monitor power being supplied to one or more of the DUT, components, or sections of the DUT. While the figures illustrate the test system 190 as including one or more components, embodiments of the present disclosure may include additional components or may not include one or more components. Additionally or alternatively, while one configuration of the test system is shown, embodiments of the present disclosure may include other configurations, such as a thermal head with an additional adapter located on the bottom side of the device 100. (Example Thermal Head with Multiple Adapters)

[0048] 2A illustrates a top view of an exemplary device comprising multiple sections according to some embodiments. Device 200 may comprise multiple components, such as component 202A, component 202B, and components 203A-H, mounted on substrate 210. Device 200 may comprise one or more high-power components (e.g., component 202), one or more low-power components (e.g., component 203), or a combination thereof. In some embodiments, device 200 may comprise any type of component (e.g., chip or package), non-limiting examples include logic, RF, analog, digital, power, diodes (e.g., light-emitting diodes (LEDs)), sensors (e.g., image sensors), microelectromechanical systems (MEMS), integrated passive devices (IPDs), power management units, or integrated circuits (PMUs, PMICs), etc. Additionally or alternatively, device 200 may comprise other types of components, including, but not limited to, resistors, capacitors, inductors, transistors, etc.

[0049] As one non-limiting example, device 200 may be a SiP device used for high-performance computing (HPC) applications. Component 202A and component 202B may be, for example, a processor chip (e.g., a CPU and / or GPU chip) surrounded by dynamic random access memory (DRAM) chips. The memory chips may be individual chips, packaged chips, through-silicon-via (TSV)-stacked chips (e.g., high-bandwidth memory (HBM) devices), etc. In some embodiments, one or more components may be located in close proximity to one or more other components. For example, memory chips may be located in close proximity to a processor chip to reduce signal delays and noise in the memory-processor interconnect, improving overall performance due to, for example, higher transfer speeds and lower latency. Due to the close proximity, the temperature from one component may affect the temperature of another component.

[0050] FIG. 2B illustrates a cross-sectional view of device 200 along line AA as depicted in FIG. 2A. Line AA may be drawn through components 202B, 203D, and 203H. Components 202B, 203D, and 203H may be mounted on substrate 210 and connected to substrate 210 using interconnects 206. In some embodiments, the components in device 200 may be on a single layer of substrate 210. In some embodiments, interconnects 206 may be component interconnects such as, by way of non-limiting example, solder balls, copper pillar bumps, C4 (controlled collapse chip connection) bumps, gold bumps, wire bonds, or conductive adhesives. Interconnects 206 may allow components to be mechanically and / or electrically connected to substrate 210. Substrate 210 may comprise any type of material, such as a laminate. In some embodiments, substrate 210 may comprise one or more layers of conductive traces, conductive planar layers, dielectric layers, or combinations thereof. One or more vias may be used to connect the conductive layers. The layers and / or vias may be formed using a printed circuit board process. Embodiments of the present disclosure may include other materials (e.g., ceramic, silicon, glass, molding compound, etc.) for creating the substrate 210.

[0051] Components 202 / 203 and interconnects 206 may be located on the top side of substrate 210, and interconnects 216 may be located on the bottom side of substrate 210. In some embodiments, no components may be located on the bottom side of substrate 210. Interconnects 216 may be used, for example, to electrically couple device 200 to a board. The board may be a test board when device 200 is being tested, or a system board when the device is used in an end product. When coupled to a test board, interconnects 216 may be electrically coupled to a socket, which is used to transmit test signals between a tester and device 200. Interconnects 216 may be solder balls, pins, conductive wires, pads on substrate 210, or other forms of interconnect.

[0052] As one non-limiting example, a test board may send one or more test (input) signals to device 200 and / or receive one or more output signals from device 200. The test signals may have a predetermined pattern. The output signals may represent electrical characteristics of device 200 in response to applying the test signals to device 200 while it is being tested. In some embodiments, testing may be performed using multiple sets of input / output signals while operating device 200 under the same or different conditions (e.g., different temperatures).

[0053] FIG. 2C illustrates a cross-sectional view of device 200 along line BB as depicted in FIG. 2A. Line BB may be drawn through components 202A and 202B. In some embodiments, as shown in the figure, two or more components (e.g., chips or packages) may have different heights, for example, due to different designs and / or manufacturing variations. For example, component 202A may be shorter than component 202B, resulting in height difference 220. In some embodiments, height difference 220 may be due to differences in component type. For example, memory chip 203A may be taller than processor chip 202A. As another example, high-power chip 202B may be taller than high-power chip 202A. In instances where components 202A and 202B have the same height, it is also contemplated that they may lie in different planes after assembly to substrate 210 due to differences in final solder size during assembly (e.g., differences in solder ball compression during soldering).

[0054] If the elevation differences of the components within device 200 are not taken into account, the test system may not be able to properly control the test conditions of the components of device 100. For example, the test system may have an adapter or associated heater that contacts the top of component 202B but not the top of component 202A due to elevation difference 220. As a result, the test system may be thermally coupled to component 202B but not properly thermally coupled to component 202A. Such lack of thermal coupling may cause performance issues when testing component 202A. An exemplary test system of the present disclosure is capable of simultaneously testing different components within one or more devices under test that have different set-point temperatures. The thermal control of the different components is such that the different components have temperatures within a tolerance (1%, 5%, etc.) of their respective set-point temperatures without compromising the performance of the components. Additionally or alternatively, the test system of the present disclosure is capable of testing devices with multiple components having different elevations at a given time without compromising thermal performance.

[0055] 2A-2C illustrate two components with eight other components located along the side of the substrate, embodiments of the present disclosure may include any number and / or arrangement of components. Additionally, or alternatively, components within a device may be arranged in any manner not shown in the figures.

[0056] Embodiments of the present disclosure may include a test system including a thermal head configured to thermally control one or more devices under test. Figures 3A-3B illustrate cross-sectional views of an exemplary thermal head including multiple adapters according to some embodiments. Thermal head 350 may be configured to test one or more devices. The devices may include components 302A, 302B, 303A, 303D, substrate 310, interconnect 306, and interconnect 316, each of which may have one or more characteristics similar to components 202A, 202B, 203A, 203D, substrate 210, interconnect 206, or interconnect 216.

[0057] Thermal head 350 may include multiple adapters 330A-330D. Adapters 330B and 330C may be located in an inner region of thermal head 350, and adapters 330A and 330D may be located in an outer region of thermal head 350. Each adapter 330 may be thermally coupled to a corresponding component of the device. In some embodiments, one or more (e.g., each) adapter may be thermally coupled to one component. In some embodiments, a first adapter may be thermally coupled to a first component, and a second adapter may be thermally coupled to a second component. Adapter 330A may be thermally coupled to component 303A, adapter 330B may be thermally coupled to component 302A, adapter 330C may be thermally coupled to component 302B, and adapter 330D may be thermally coupled to component 303D. In some embodiments, the number of adapters used to test a device may be the same as the number of components in the device. In some embodiments, at least one adapter may be thermally coupled to one or more (e.g., at least two) components. For example, an adapter may be thermally coupled to a first component and a second component. In some embodiments, the number of adapters used to test a device may be less than the number of components in the device.

[0058] By being thermally coupled, the temperature of the adapter may affect the temperature of the corresponding thermally coupled component. In some embodiments, two or more adapters may be thermally independent of one another, such that the temperature of one adapter and / or its corresponding thermally coupled component may not affect the temperature of another adapter and / or its corresponding thermally coupled component. For example, adapter 330B may be thermally independent from adapter 330C, resulting in the temperatures of the adapters and / or corresponding thermally coupled components not affecting each other. In some embodiments, the adapters and / or thermally coupled components may be independently controlled, such as independently thermally controlled.

[0059] The independent control may comprise one or more of independent thermal control (e.g., using independent adapters, independent heaters, independent flow control, independent heat sinks, and / or independent cold plates) or independent force control (e.g., using independent force mechanisms). In this manner, the test system may provide different thermal controls for different components of the device.

[0060] One or more characteristics of one or more adapters may be such that different characteristics (e.g., height) of the components may be taken into account, so that heat transfer between the thermal head and the components may not be impaired due to, for example, the size of the components. For example, one or more characteristics (e.g., size, force, etc.) of adapter 330B may differ from one or more characteristics of adapter 330C to account for the height difference between components 302A and 302B. In some embodiments, the size (e.g., height) of the adapters and / or associated components may be related (e.g., inversely proportional) to the size of the corresponding thermally coupled components. As one non-limiting example, the height of adapter 330C may be taller (compared to adapter 330B) due to component 302B being shorter (compared to component 302A).

[0061] In some embodiments, the first adapter 330B may have a first height and the second adapter 330C may have a second height. This difference in height may account for height differences between corresponding components of the device under test. In some embodiments, the first adapter 330B may have a first thermal mass and the second adapter 330C may have a second thermal mass. The difference in thermal mass may account for differences in thermal mass between corresponding heaters. In some embodiments, the first adapter 330B may have a first surface area and the second adapter 330C may have a second area. This difference in surface area may account for differences in surface area or thermal interface material (TIM) layers between corresponding components of the device under test. The adapters may have other differences, such as different thermal conductivities, widths, etc. In some embodiments, the differences in the adapters may result in components heating or cooling by different amounts.

[0062] The multiple adapter thermal head of the present disclosure includes a monolithic adapter that is thermally coupled to a component of a device under test. The monolithic adapter may be fabricated from a continuous material. In some cases, the monolithic thermal head may include a monolithic cold plate, a monolithic heater, and / or multiple large size heaters (as one non-limiting example, 900 mm 2 Exemplary adapters are described in more detail below.

[0063] As shown in the figure, the thermal head 350 may include one or more heaters 356, which are thermally coupled to one or more adapters and one or more components of one or more devices under test. For example, adapter 330B may be thermally coupled to heater 356B, and adapter 330C may be thermally coupled to heater 356C. A first heater 356B may be configured to heat a first component 302A, and a second heater 356C may be configured to heat a second component 302B. In some embodiments, two or more heaters 356 may be thermally independent from one another, such that thermal control of one and / or its corresponding thermally coupled component may not affect thermal control of another heater 356 and / or its corresponding thermally coupled component. In some embodiments, one or more (e.g., each) adapter may be thermally coupled to only one heater. In some embodiments, one or more adapters, such as adapter 330A shown in Figure 3A, may not be thermally coupled to a heater. Exemplary heaters are discussed in more detail below.

[0064] The heaters may be positioned in close proximity to the corresponding thermally coupled components so that the delay between a change in the heater's temperature and a change in the device's temperature may be minimized. In some embodiments, at least one heater may be positioned adjacent to (e.g., in contact with) at least one component or an intermediate layer (e.g., a TIM layer) that contacts a component. In some embodiments, at least one heater may be positioned adjacent to (e.g., in contact with) at least one adapter. At least one heater and at least one adapter may include mating alignment features to align the two together. Any misalignment may reduce the amount of thermal coupling between the heater and the adapter. Exemplary mating alignment features may include, but are not limited to, a protrusion on one surface and a mating recess on another surface, or a perimeter shape of one element (e.g., the heater) and a corresponding recess or contour in the adapter or retainer.

[0065] Embodiments of the present disclosure may include heaters comprising multiple (e.g., at least two) heating elements that are spatially separated and thermally isolated using thermal insulation between the heating elements. In some embodiments, a thermal insulation (e.g., thermal insulating material or air) may be positioned between at least two heating elements to prevent (or reduce) thermal coupling between them. Exemplary thermal insulation materials may include, but are not limited to, materials with low thermal conductivity (e.g., polymers, plastics), materials with high void content (e.g., foam materials, mineral wool), air, vacuum, etc. In some embodiments, the thermal insulation material may include perforations or grooves for enhanced thermal isolation.

[0066] In some embodiments, the heater 356 is a small size heater (as one non-limiting example, 500 mm 2 Smaller heaters may have increased complexity and / or manufacturing yield compared to larger heaters. Smaller heaters may also be easier to control due to their lower thermal mass and may be particularly suited for maintaining a device at or within a setpoint temperature. In addition to being easier to control, smaller heaters may operate faster (in terms of temperature change) and provide more stable and accurate thermal control of a device under test. In some embodiments, the size of the heater may be based on the size of the component to which the heater is thermally coupled. For example, a device under test may include multiple components having different sizes, such as large and small components, and a corresponding test system may include multiple heaters having different sizes, such as large and small heaters. In some embodiments, the surface areas of the device and heater that contact each other may be the same. Intermediate layers, such as TIM layers, may also have the same surface area.

[0067] Additionally or alternatively, one or more TIM layers 322 may be used to improve thermal coupling between the adapter and the corresponding component of the thermal head or DUT. In some embodiments, the TIM layer 322 may be located on at least one side of the adapter and / or heater. The TIM layer 322 may be located between the adapter and the device (such as TIM layer 322A located between adapter 330A and component 303A), between the heater and the device (such as TIM layer 322B located between heater 356B and component 302A), or between the adapter and the heater (such as TIM layer 332C located between adapter 330C and heater 356C). Additionally or alternatively, in some embodiments, a TIM layer may be located between the adapter and the heater, and the same or different TIMs may be located between the heater and the device (e.g., TIM layers on both sides of the heater). In some embodiments, the different TIM layers may have different properties. For example, the thermal resistance of TIM layer 322B may be different from the thermal resistance of TIM layer 322C. Exemplary TIM layers are discussed in more detail below.

[0068] In some embodiments, one or more properties of the heater and / or TIM may be configured to account for components of different sizes, such that heat transfer between the heater (or adapter) and the component may not be impaired due to the size of the component. Returning again to the above example where component 302A is taller than component 302B, in some embodiments, the height of heater 356B and / or TIM layer 322B may be less than the height of heater 356C and / or TIM layer 322C.

[0069] Embodiments of the present disclosure may further include one or more force mechanisms 332A or 332B for moving the corresponding adapter closer to the thermally coupled component. Exemplary force mechanisms may include, but are not limited to, a spring, a lever coupled to a force application device, or a force application device. In some embodiments, the force mechanism 332 may apply a force to one side of the adapter, causing the other side to move closer to the TIM layer 322 and / or the surface of the component. In some embodiments, the movement of the first adapter is independent of the movement of the second adapter; for example, movement of adapter 330B may not cause movement of adapter 330C; therefore, movement of heater 356B may be independent of movement of heater 356C. As one non-limiting example, the independent movement of the adapters may account for any height differences (e.g., due to manufacturing tolerances). Embodiments of the present disclosure include a test system capable of independently controlling forces on different components.

[0070] The disclosed thermal head may include one or more controllers. One exemplary controller is a thermal controller configured to control one or more heaters. The thermal controller may, without limitation, send one or more signals to a given heater (including sending different signals to different heaters), thereby controlling the given heaters independently. For example, a first signal sent to a first heater 356B may adjust its temperature without affecting a second heater 356C. In some embodiments, at least two components may be tested at different temperatures during a given test operation, and corresponding controllers and heaters may operate independently to maintain the components at their respective temperatures. For example, a first controller and corresponding heater 356B may operate to ensure that a first component 302A is at a first temperature, while a second controller and corresponding heater 356C may operate to ensure that a second component 302B is at a second temperature.

[0071] In some embodiments, at least two components and corresponding heaters 356 may have different changes in temperature. At least two components may have, for example, different power dissipation levels and, as a result, different changes in temperature. For example, the first component 302A may dissipate a first power level and the second component 302B may dissipate a second power level. The first heater 356B may operate at a first change in temperature corresponding to the first power level, while the second heater 356C may operate at a second change in temperature corresponding to the second power level. Additionally or alternatively, the thermal controller may control the temperature based on the power dissipated from one or more components of the device under test.

[0072] In some embodiments, two or more adapters are not thermally independent such that they are thermally coupled together. Two or more adapters (e.g., adapters 330A and 330D) may be coupled to the same input from a thermal controller. For example, components 303A and 303D may be low-power memory chips or packages arranged in four columns, such as that shown by the arrangement of components 203A-203D on the left side and components 203E-203H on the right side in FIG. 2A. A single adapter or multiple adapters may be thermally coupled to multiple components. In some embodiments, multiple adapters and / or multiple components may have the same height.

[0073] Additionally or alternatively, the controller may include a force controller configured to send multiple signals to the thermal head to independently control one or more forces applied to one or more components. The force controller may send one or more signals to a given force mechanism, such as sending different signals to different force mechanisms to control the force applied by a given adapter. As one non-limiting example, the force controller may cause a first force to be applied to the first adapter 330B and a second force to be applied to the second adapter 330C. For example, the force controller may apply a greater force to a component having a larger surface area compared to a component having a smaller surface area. In some cases, the pressure on a component with a larger surface area may be the same as the pressure on a component with a smaller surface area.

[0074] In some embodiments, thermal head 350 may include one or more cold plates configured to reduce the temperature of one or more of the adapters, one or more components, or devices. FIG. 3B illustrates an example thermal head including cold plate 362. In some embodiments, at least two of the adapters may be thermally coupled to the same cold plate, such as adapters 330B and 330C being thermally coupled to cold plate 362. Thermal energy may be transferred to / from cold plate 362 to adapter 330B and / or adapter 330C. Cold plate 362 may be located on the top side of one or more adapters 330, and one or more heaters 356 may be located on the bottom side of adapter 330. In some embodiments, cold plate 362 may cool components 303A and / or 303D, for example, by contacting at least a portion of force mechanisms 332A and / or 332B.

[0075] In some embodiments, thermal head 350 may include multiple cold plates, such as those shown in FIG. 3C. At least two cold plates may be thermally independent of each other. Cold plate 362B may be thermally coupled to adapter 330B, and cold plate 362C may be thermally coupled to adapter 330C. Thermal control of cold plate 362B, for example, may not affect the temperature and / or thermal control of cold plate 362C, or vice versa.

[0076] In some embodiments, the movement of cold plate 362B can be independent of the movement of cold plate 362C. The amount of force applied can depend on the characteristics of the corresponding component, heater, TIM, adapter, or a combination thereof. For example, more force can be applied when the corresponding component has a larger surface area. Exemplary force mechanisms are discussed in more detail below.

[0077] In some embodiments, at least two components and corresponding cold plates 362 may have different changes in temperature, for example, due to having different power dissipation levels. For example, a first component 302A may dissipate a first power level and a second component 302B may dissipate a second power level. The first cold plate 362B may operate with a first temperature corresponding to the first power level, while the second cold plate 362C may operate with a second temperature corresponding to the second power level. Additionally or alternatively, the cold plates 362B and 362C may operate at different temperatures, such as when corresponding components are being tested at different temperatures.

[0078] The thermal controller may be configured to control one or more heaters (as discussed above), one or more cold plates, or both. To control the cold plates, the thermal controller may send one or more signals to one or more flow control valves associated with each cold plate. In instances where the thermal head includes at least two cold plates, the thermal controller may send one signal to the flow valve of one cold plate without affecting the flow through the valve of another cold plate (independent flow control). Cold plates and associated thermally coupled components (adapters, heaters, components, etc.) may be thermally isolated from other (e.g., neighboring) cold plates and associated thermally coupled components. In some embodiments, thermal insulators (e.g., thermal insulating material or air) may be disposed between neighboring cold plates.

[0079] The characteristics of the cold plate 362 may be based on the characteristics of the thermally coupled adapter 330. For example, the surface area of ​​the cold plate 362 (contacting the adapter) may be the same as the surface area of ​​the adapter 330 (the top side of the adapter contacting the cold plate). As discussed in more detail below, the cold plate 362 may include one or more cooling channels through which a liquid or gas may flow. The flow rate and / or temperature of the liquid or gas may affect the cooling capacity of the cold plate 362. (Exemplary Thermal Head)

[0080] Embodiments of the present disclosure may include one or more thermal heads with the characteristics described herein. For purposes of simplicity, some of the figures may depict some, but not all, portions of the disclosed thermal head. While portions of the thermal head, including an adapter, will be described herein, the thermal head may include other portions not disclosed or in combination with the disclosure herein. FIG. 4 illustrates a cross-sectional view of a portion of a thermal head according to some embodiments. The thermal head 450 is configured to thermally control components 402 mounted on a substrate 410. While the figure depicts a single adapter 430 and a single component 402 on a single substrate 410, embodiments of the present disclosure may include any number of components (e.g., 2, 3, 4, 5, 10, etc.), any type of component (e.g., high-power chips, low-power chips, passive components, etc.), and any number of substrates.

[0081] When testing a device, it can be difficult, yet important, to control the temperature of the device while it is being tested. In some cases, thermal control may require rapidly heating or cooling one or more components of the device so that the components can quickly reach a set-point temperature and the temperature remains constant during the test.

[0082] The adapter 430 may comprise a continuous thermally conductive material. For example, the adapter 430 may comprise a metal such as copper, aluminum, silver, or a metal matrix composite (copper-diamond, aluminum-diamond, copper-graphite, aluminum-graphite, etc.). One or more characteristics (e.g., thermal mass, height, surface area, etc.) may be based on the setpoint temperature and / or characteristics of the thermally coupled heater and / or cold plate.

[0083] In some embodiments, the thermal head 450 may include a heater 456. The heater 456 may be configured to apply heat to the component 402. In some embodiments, the heater 456 may increase the temperature of the component 402, for example, when the component power is low and / or when its temperature is lower than the setpoint temperature of the component 402. The heater 456 may be any type of heater, including, but not limited to, a solid-state device (e.g., comprising a ceramic body with one or more resistive traces), a cartridge heater in a thermally conductive body, a thermoelectric device (TED), a silicon-based semiconductor device, etc. In some embodiments, the heater 456 may have a low thermal mass. In some embodiments, the thermal mass of the heater 456 may be less than the thermal mass of the adapter 430, the cold plate 462, or both. In some embodiments, the thermal mass of the heater 456 may be at least one-fifth the thermal mass of the adapter 430. In some embodiments, the thermal mass of the heater 456 may be at least one-tenth the thermal mass of the adapter 430. The thermal mass of the heater 456 can affect its response, temperature ramp rate, and conductive heat transfer, for example, through the heater 456, the adapter 430, the cold plate 462, or a combination thereof.

[0084] Additionally or alternatively, the thermal head 450 may include a cold plate 462. The cold plate 462 may be configured to cool the adapter 430, which may thereby cool the heater 456 and / or the component 402. When the heater 456 is off, the cooled adapter 430 may cool the heater 456. The cold plate 462 may include one or more cooling channels 469 that may circulate a liquid or gas to cool the cold plate 462. Exemplary liquids may include, but are not limited to, water, heat transfer fluids, refrigerant coolants, gases, etc. In some embodiments, one or more other cooling mechanisms may be used to cool the cold plate 462, such as a thermoelectric cooler (TEC) (as one non-limiting example). A TEC may, for example, cool the cold plate 462 below the temperature of the fluid circulating through the cold plate 462. As another (non-limiting) example, a chiller or radiator may be used to cool the temperature of the fluid.

[0085] The adapter 430 can be configured to thermally couple to the component 402. Better thermal coupling can lead to better thermal control. In some embodiments, the thermal coupling can occur with the adapter 430 in contact with the component 402 and / or using one or more interlayers to facilitate heat transfer between the adapter 430 and the component 402. The TIM layer 422 is an exemplary interlayer.

[0086] In some embodiments, one or more TIM layers 422 may be located between one or more components of the thermal head 450. The TIM layers 422 may be used to reduce thermal resistance and thereby improve thermal coupling. For example, one TIM layer 422 may be located between the adapter 430 and the heater 456, and / or one TIM layer 422 may be located between the heater 456 and the component 402. As another example, a TIM layer 422 may be located between the cold plate 462 and the adapter 430 (not shown). In some cases, a TIM layer may be omitted, and instead, the cold plate 462 and the adapter 430 may be one continuous piece of material (e.g., a cold plate with one or more adapters machined from the surface of the cold plate). The TIM layer may comprise one or more of thermal grease (e.g., an oil or other material with incorporated thermally conductive particles such as metal or ceramic particles), a liquid material (e.g., glycol, water), a carbon material, a metallic malleable material (e.g., a low melting point material such as indium, tin, or a combination of materials such as a thermally conductive elastomeric pad with an aluminum foil cover layer), a thermally conductive elastomeric pad, or the like.

[0087] In some embodiments, thermal coupling between the adapter 430 and the component 402 may be improved when a force is applied to the thermal head 450 component and / or the component 402 to create better contact. The thermal resistance between the adapter 430 and the component 402 may be related to the amount of force applied. The applied force may also affect the contact between the socket contactor and the interconnect 416, which the test system uses to electrically connect to the component. Additionally, or alternatively, the applied force may help prevent or reduce unwanted warping of the component 402 and / or the substrate 410, which may lead to defects.

[0088] Embodiments of the present disclosure may include other types of intermediate layers, including, but not limited to, bumps, posts, or other contacts in the surfaces of the adapter, cold plate, and / or heater, to increase or decrease thermal coupling. The number, size, density, and / or pattern of the bumps, posts, or contacts may be configured so that a target thermal resistance can be obtained between the adapter and the heater, between the adapter and the cold plate, or between the heater and the component. In some embodiments, the thermal resistance may be configured according to the type of component or device. For example, a test system for low-power components may be configured with a high thermal resistance. A low-power heater may be used for thermal control and may be able to easily heat the low-power component due to its high thermal resistance.

[0089] The thermal head 450 may further include one or more temperature sensors for measuring the temperature of the adapter 430, the heater 456, or the cold plate 462. The measured temperature may be used by a thermal controller to set, adjust, or maintain the temperature of the adapter 430, the heater 456, and / or the cold plate 462. The measured temperature may be compared to a setpoint temperature, and a signal sent to the controller may be updated accordingly to minimize the difference between the measured temperature and the setpoint temperature. Setting, adjusting, or maintaining the temperature of the heater 456 may include setting, adjusting, or maintaining a current or voltage from the thermal controller to the heater 456. Setting, adjusting, or maintaining the temperature of the cold plate 462 may include setting, adjusting, or maintaining a flow rate or temperature of a liquid or gas associated with the cold plate 462. In some embodiments, the update frequency of the thermal controller for controlling temperature is less than 200 microseconds.

[0090] Exemplary methods for controlling the temperature of a component include, but are not limited to, setting or adjusting the temperature based on whether a measured temperature (e.g., heater temperature) is above or below a setpoint temperature (or setpoint temperature range). If the measured temperature is above the setpoint temperature, the thermal controller reduces the amount of power to the heater. If the measured temperature is below the setpoint temperature, the thermal controller increases the amount of power to the heater. In some embodiments, the heater can be configured for the specific power output of the thermal controller. As an example, the thermal controller can power the heater at up to 500 W using 100 V, and the heater generates 500 W using a 100 V supply (e.g., for the setpoint temperature or across the setpoint temperature range). In some embodiments, the heater can be configured for the corresponding component, e.g., the heater has an output power that exceeds the output power of the component. For example, a 30 W heater can be used to heat a 10 W component, while a 300 W heater can be used to heat a 100 W component. The lower the thermal mass of the heater, the more effective the heater 456 is at quickly increasing the temperature of the component 402. In some embodiments, the thermal controller separately sets or regulates different temperatures of the thermal head. For example, the controller sets or regulates the DUT temperature, the adapter temperature, the cold plate temperature, etc. (Exemplary Heater)

[0091] 5A illustrates a cross-sectional view of an exemplary heater according to some embodiments of the present disclosure. The figure illustrates one surface 558 of the heater 556 contacting the adapter 530 or one or more TIM layers (which would be located between the surface of the heater 556 and the adapter 530). Another surface 559 of the heater 556 may contact a component of the DUT or a TIM layer (which would be located between the surface 559 of the heater 556 and the component of the DUT).

[0092] In some embodiments, heater 556 may include multiple heater pins, one or more heating elements, one or more measurement traces, or a combination thereof. Some of pins 551 (including pins 551A and 551B), 553 (including pins 553A and 553B), 555 (including pins 555A and 555B), and 557 (including pins 557A and 557B) may be pins used to carry current into or out of heater 556. In some embodiments, pins 551, 553, 555, and / or 557 may be attached to one or more pads (not shown) on heater 556. Exemplary methods for attaching heater pins to pads include, but are not limited to, brazing, soldering, gluing (e.g., using conductive epoxy), etc. As shown in the figure, one or more insulating layers 566 may insulate pins 551, 553, 555, and 557 from adapter 530, for example, to prevent electrical shorting. An insulating layer 566 may be located around the heater pins and / or between the heater pins and the adapter 530. The insulating layer 566 may comprise one or more of plastic, rubber, ceramic, or another dielectric. In some embodiments, the insulating layer 566 may be a hollow polytetrafluoroethylene (PTFE) tube with an inner diameter sized for the diameter of the heater pins and an outer diameter configured to fit within a pilot hole in the body of the adapter 530.

[0093] 5A illustrates a single row of six heater pins, embodiments of the present disclosure may include any configuration and number of heater pins, such as a single row of heater pins arranged around the periphery of the heater's surface, two heater pins in a row on one side of the heater, ten or more heater pins in a row, four pins in two rows on two sides of the heater, etc. In some embodiments, the heater pins may occupy less than 10%, 30%, 50%, etc., of the surface 558 of the heater 556. In some embodiments, an interior region of the surface 558 of the heater 556 may exclude heater pins to allow the heater 556 to contact the adapter 530 at the interior region.

[0094] Heating elements 563 and 565 may be used to generate heat for heater 556. In some embodiments, heating elements 563 and 565 may comprise resistors and / or resistive traces. The total area of ​​thermal control by heater 556 may depend on the characteristics of heating elements 563 and 565. For example, heating elements 563 and 565 may be formed on separate layers within the body of heater 556, and one or more resistive traces of the heating elements may be formed on multiple layers so that a target resistance within a target area of ​​heater 556 can be obtained. In some embodiments, heating elements 563 and 565 may be located closer to adapter 530 than ground plane 567 and measurement traces 561.

[0095] In some embodiments, each zone of the thermal head may include one or more heating elements and measurement traces 561. In some embodiments, any number of heating elements and measurement traces may be associated with a zone, depending on the zone's power requirements and the power limitations of the heating elements. In some embodiments, the total area of ​​the thermal controls may be the same as the total surface area of ​​the heater 556. Alternatively, the total area of ​​the thermal controls may be less than the total surface area of ​​the heater 556 (e.g., 20%). Heating elements may be located on a large percentage of the heater 556's surface (e.g., 80% or more) or throughout a zone of the heater 556. In some embodiments, one or more first heating elements may be associated with one or more first zones, and one or more second heating elements may be associated with one or more second zones. As one non-limiting example, the first heating element and the first zone may be a high-power heating element and a high-power zone, respectively, while the second heating element and the second zone may be a low-power heating element and a low-power zone, respectively.

[0096] Heating elements 563 and 565 may be configured to generate heat using, for example, resistors. The heating elements may be electrically coupled to the heater pins such that power via a current or voltage signal may be applied to the heater pins and turn on the corresponding heating element. Power applied to pins 553A and 553B may cause the electrically coupled heating element 563 to turn on and generate heat, and power applied to pins 555A and 555B may cause the electrically coupled heating element 565 to turn on and generate heat. In some embodiments, the number of heating elements and / or heating element layers may be increased to increase the overall power output from heater 556 at a given voltage. For example, heater 556 may include five heating elements, each configured to generate 200 W at 200 VDC, thereby generating a total output power of 1,000 W.

[0097] In some embodiments, the heater 556 may include multiple heating zones. In some embodiments, the heater 556 may include one or more insulation mechanisms for insulating two or more heaters or heating zones from each other. One exemplary insulation mechanism includes a through-hole or groove in the body of the heater at a location between the heating element and the edge of the heating zone. Another exemplary insulation mechanism includes using different adapters for different zones, such as one or more first adapters and associated heaters for a first heating zone and one or more second adapters and associated heaters for a second heating zone.

[0098] Measurement trace 561 may be used to measure the temperature of one or more surfaces of heater 556 (e.g., surface 559 in contact with a component or an intermediate TIM layer). Measurement trace 561 may be located within the body of heater 556. Measurement trace 561 may be located, for example, in proximity to surface 559. In some embodiments, measurement trace 561 may be a trace with a certain temperature coefficient of resistance such that its resistance can be correlated to a temperature reading; this type of device is also referred to as a resistance temperature detector (RTD).

[0099] In some embodiments, after manufacturing heater 556, the resistance of measurement trace 561 can be measured at different temperatures to generate predetermined calibration information, such as a calibration curve, a calibration table, or an associated relationship (between resistance and temperature). The predetermined calibration information can be stored, for example, in a non-volatile memory chip, or coded into a 1D or 2D code (e.g., a linear barcode or a 2D matrix barcode), or stored remotely in a database. The predetermined calibration information can be used by a controller to determine the temperature of the heater or heating zone and use that knowledge to control one or more resistors (e.g., resistor 563 or resistor 565) included in the heater for thermal control of the corresponding zone.

[0100] In some embodiments, the measurement traces 561 may be coated with a dielectric. The thickness of the dielectric may depend on the physical structure and limitations of the heater 556. In some embodiments, the dielectric may have a thickness of less than 2 mm. In some embodiments, the dielectric may have a thickness of less than 0.4 mm. The measurement traces 561 may be located throughout the surface 559 of the heater 556 that contacts a component or an intermediate layer (e.g., a TIM layer that contacts a component). For example, the area where the measurement traces 561 are located may be the same area where another heating element (e.g., resistor 563 or resistor 565) is located, but these may be on different layers within the heater.

[0101] Some of the pins may be used to carry current for heating, while others may be used for shielding. Pins 557A and 557B shown in FIG. 5A may be electrically coupled to a ground plane 567 for electromagnetic interference (EMI) shielding. Ground plane 567 may be grounded and provide an electrical ground path to heater 556 during testing. During testing, the heater may be turned on and off in rapid succession at high voltages and currents, which may generate electrical noise that can potentially interfere with test circuitry or measurements. Shielding the heater element with a ground plane 567 covering the heater element may reduce (or eliminate) unwanted electrical noise. In some embodiments, pins 557A and 557B may be electrically coupled to an adapter. For example, as shown in the adapter illustrated in FIG. 5B, adapter 530 includes holes 525 that provide access to pins 557A and / or 557B. Hole 525 may expose ground pin 523, which may be attached to adapter 530 by, for example, soldering, spot welding, brazing, gluing (e.g., using a conductive adhesive), etc. In some embodiments, pin 557A and / or pin 557B may be attached to adapter 530 by, for example, soldering. Grounding both adapter 530 and ground plane 567 improves shielding of the heater element compared to grounding only ground plane 567. When both adapter 530 and ground plane 567 are grounded, there is effective shielding formed both above and below the heater element.

[0102] In some embodiments, the adapter may include a retainer 571. The retainer 571 may be configured as a mechanical attachment for attaching the heater 556 to the adapter 530 (e.g., requiring a tool for removal). This mechanical attachment promotes thermal coupling between the heater 556 and the adapter 530. Exemplary mechanical attachments include, but are not limited to, clamps, screws, retainers, and the like. As shown, the retainer 571 is located within the body of the adapter 530 and may allow the heater 556 and the adapter 530 to have any size for the surface area, including surface areas of the same size (as one non-limiting example). When the size of the adapter is the same or substantially the same as the size of the corresponding component, the disclosed test system is able to rapidly change the temperature of the component, for example, due to the thermal mass of the adapter. In some embodiments, a hole 525 in the adapter 530 provides access to one or more pins, such as pins 557A and 557B.

[0103] Additionally or alternatively, the retainer 571 may be configured to electrically couple the adapter 530 to one or more ground pins 523. The ground pins 523 may, for example, be flexible ground pins that allow the heater 556 and the adapter 530 to expand at different rates. The heater 556 and the adapter 530 may have different thermal expansion coefficients, allowing the two to expand and contract at different rates with temperature changes while maintaining good thermal contact between the adapter 530 and the heater 556 without undue stress or strain on either component.

[0104] In some embodiments, the heater is attached to the adapter (e.g., requires a tool for removal). An attached heater provides a better thermal bond between the adapter, the heater, and / or any intermediate layers. Without an attached heater, any movement in the adapter and / or intermediate layers may limit the extent to which heat can be rapidly transferred from the heater to the adapter and / or corresponding component.

[0105] 5A , the ground plane 567 may be a solid ground plane or a perforated ground plane (the size of the perforations may be configured based on the desired EMI frequency). In some embodiments, the area of ​​the ground plane 567 may be equal to or greater than the area of ​​the heating element. In some embodiments, the area of ​​the ground plane may be at least 80%, 85%, 90%, 95%, etc., of the area of ​​the surface of the heater 556. The ground plane 567 may be located within a depth from the surface of the heater 556 (that contacts the component or intermediate layer), such as (but not limited to) less than 1.5 mm, less than 1 mm, less than 0.6 mm, etc.

[0106] Although not shown, the heater 556 may include multiple dielectric layers, multiple conductive layers, and / or multiple conductive vias for making electrical connections between the multiple conductive layers. In some embodiments, the outer surface of the heater may include a protective layer (e.g., a dielectric such as a ceramic) to protect the conductive layers located within the heater 556. (Exemplary Cold Plate)

[0107] 6A and 6B illustrate cross-sectional views of an exemplary cold plate according to some embodiments of the present disclosure. The cold plate 662 may be oriented so that its bottom surface 691 is closest to a corresponding heater or adapter. The cold plate 662 includes a cavity with an inlet and an outlet for circulating a coolant 671 through cooling channels 669. The cavity may be formed by a top plate 673 and a bottom plate 675. The cold plate 662 includes multiple fins 663. In some embodiments, the multiple fins 663 may include long rectangular fins or rounded pin fins. The multiple fins 663 may be integrated into the bottom plate 675 and the top plate 673. In some embodiments, the multiple fins 663 may be oriented perpendicularly from the top plate 673 and / or the bottom plate 675. The multiple fins 663 are used to increase the surface area in contact with the coolant 671 flowing through the cold plate 662 , thereby providing more effective heat transfer from the cold plate 662 to the coolant 671 . Exemplary Thermal Interface Material (TIM) Layers

[0108] The test systems disclosed herein may use one or more TIM layers. The TIM layer may affect the thermal resistance between the adapter and the heater, between the adapter and the cold plate, between the adapter and the component, or between the heater and the component. The TIM layer may be selected based on one or more characteristics of the thermal head, the adapter, the heater, the cold plate, the component on the device under test, etc. The thermal resistance may be adjusted, for example, by configuring the thickness of the TIM layer and / or its thermal conductivity. Additionally or alternatively, the surface area of ​​the TIM layer may be adjusted by including one or more openings or holes 727, as shown in FIG. 7A. The thermal resistance of the TIM layer 722 may be configured based on the size and / or number of the openings or holes 727. In some embodiments, the TIM layers 722 within a thermal head may be different; for example, a first TIM layer may have a larger surface area than a second TIM layer.

[0109] In some embodiments, the TIM layer 722 may be configured based on the properties of the associated component and / or area. For example, a high thermal resistance TIM layer may be used for low power components. In some embodiments, the properties of the TIM layer may differ for different components and / or areas of the device.

[0110] The TIM layer 722 can be formed using any technique, such as dispensing a liquid TIM 722 onto the component or device, as shown in the example of FIG. 7B. Using a liquid TIM can help, for example, minimize the gap between the adapter and the component, which can reduce thermal resistance between the two; however, other types of TIM materials, such as a solid TIM material, a paste TIM material, or a grease TIM material, can be included. Low thermal resistance can be beneficial, among other cases, when the adapter does not include a heater, when the adapter is used only for cooling, when the adapter is used to regulate the temperature of a high-power component, or when the adapter includes a heater and is used for both heating and cooling.

[0111] The liquid TIM may be dispensed onto a component or device prior to testing and then removed after testing is completed. One or more techniques (such as a machine vision system that visually inspects and compares the liquid TIM to one or more predetermined criteria, or a system that tests its thermal resistance value) may be employed to inspect the dispensed liquid TIM to determine whether it meets target characteristics (e.g., the amount, location, thickness, etc. of the dispensed TIM). Based on whether the dispensed TIM meets one or more target characteristics, the testing system may proceed to perform testing (the dispensed TIM is qualified) or generate an alert (the dispensed TIM is unqualified). In this way, devices may be tested only when the TIM characteristics do not affect the testing of the device, ensuring that the test results accurately represent the device's performance. Too much liquid TIM dispensed can overflow onto one or more components and adversely affect one or more components during testing (e.g., if the liquid TIM is conductive) or can result in reliability issues for the device (e.g., if the liquid TIM induces corrosion or other adverse effects). Too little TIM can lead to high thermal resistance, causing problems with testing, such as being able to maintain the component at the setpoint temperature. In some cases, if no TIM is dispensed and high power is applied to the component, the component may fail due to a heat-induced catastrophic failure. Exemplary Thermal Head for Devices with Stacked Components

[0112] Embodiments of the present disclosure may include other types of devices, such as devices that may include one or more stacked components. FIGS. 8A and 8B illustrate top and cross-sectional views, respectively, of a device including stacked components according to some embodiments. Device 800 may include multiple components, such as component 802B, component 802T, and components 803A-H, mounted on a substrate 810. One or more components may be stacked on one or more other components (e.g., component 802T is a top component stacked on bottom component 802B). In some embodiments, the footprint of component 802T may be smaller than the footprint of component 802B. Component 802B may be, for example, a high-power component. In some embodiments, stacked components 802B and 802T may be coupled together using one or more interconnects 818, such as, for example, one or more of TSVs, microbumps, etc. In some embodiments, components 803A-H may be auxiliary components.

[0113] As one non-limiting example, component 802T may be a cache memory chip, component 802B may be a processor chip, and component 802T may be stacked on component 802B. In such an arrangement, component 802T may be a standalone chip (e.g., a chip capable of operating independently) that provides higher memory capacity than the internal cache in the processor chip itself. Stacking cache chip 802T on top of processor chip 802B may reduce interconnect length, thereby increasing read / write speeds and reducing latency. In some embodiments, component 802B may be a high-power component, and component 802T may be a low-power component.

[0114] Device 800 may further include a substrate 810, an interconnect 806, and an interconnect 816, where one or more of substrate 810, interconnect 806, or interconnect 816 have properties similar to the corresponding substrate 210, interconnect 206, or interconnect 216, respectively. As shown in FIG. 8B , there may be one or more elevation differences between stacked components (including components 802T and 802B) and other components 803C and 803G in device 800.

[0115] The adapter of the thermal head may be configured such that heat transfer between the adapter (and / or heater and / or cold plate) and the stacked components may not be impaired. FIG. 9A illustrates a top view of an exemplary device comprising stacked components according to some embodiments. The device may comprise components 903A-903H. Additionally, device 900 may comprise at least one stacked component, including component 902T stacked on component 902B. Device 900 may have one or more characteristics similar to devices 100, 200, 800, or combinations thereof (e.g., comprising interconnects for electrically coupling the component to a substrate, interconnects for electrically coupling the substrate to a test system, etc.).

[0116] 9B and 9C illustrate cross-sectional views of the thermal head 950 and device along lines BB and AA, respectively, as depicted in FIG. 9A. The thermal head 950 may include a first adapter 930B and / or a first heater 956B thermally coupled to a first component (e.g., one component 902B and / or a lower portion of the stacked components) and a second adapter 930C and / or a second heater 956T thermally coupled to a second component (e.g., component 902T and / or an upper portion of the stacked components).

[0117] The test system may include a thermal head 950. The thermal head 950 may include multiple adapters, including, but not limited to, adapters 930A-930D. One or more adapters, such as adapters 930A-930D, may have one or more characteristics similar to other adapters disclosed herein, such as adapters 330A-330D. For example, adapter 930A may not be thermally coupled to a heater. As another example, adapter 930D ​​may transfer an applied force to a component using a spring or other force mechanism 932F. Adapter 930D ​​may additionally or alternatively contact a TIM layer 922F located between adapter 930D ​​and component 903F.

[0118] In some embodiments, one or more adapters may be thermally coupled to a first portion of the stacked components. For example, adapter 930B may be thermally coupled to component 902B or a portion of component 902B of the stacked components. The thermal coupling may comprise one or more corresponding thermally coupled components in contact. For example, adapter 930B may be thermally coupled to heater 956B and TIM 922B. Adapter 930B may, for example, contact heater 956B. TIM 922B may contact a portion of component 902B, such as its outer region (e.g., outer periphery).

[0119] The adapter 930C may be thermally coupled to another component (e.g., component 902T) or another portion of the stacked components. The adapter 930C may be thermally coupled to the heater 956T and the TIM 922C, which may contact the top surface of the component 902T. In some embodiments, the first adapter 930C may be nested (fully or partially) within the second adapter 930B. The second adapter 930B may surround multiple (two or more, such as four) sides of the first adapter 930C. The first adapter 930C and the second adapter 930B may, for example, be thermally coupled.

[0120] In some embodiments, a corresponding first heater 956T can be nested within a second heater 956T. A second heater 956B can surround multiple (two or four) sides of the first heater 956B. Similarly, a first TIM layer 922C can be nested within a second TIM layer 922B. In some embodiments, as shown in the figures, a TIM layer 922C can be located between components of stacked components.

[0121] In some embodiments, the second adapter 930C may be located within a hollow portion of the first adapter 930B and may be surrounded by the first adapter 930B. In some embodiments, the first adapter 930B, the corresponding heater 956B, and / or the corresponding TIM 922B may contact a majority (e.g., greater than 50%) of the top surface of the component 902B.

[0122] In some embodiments, thermal control of a first component 902B in a stacked component and / or its thermally coupled (first) adapter 930B may be independent from thermal control of a second component 902T in the stacked component and / or its thermally coupled (second) adapter 930C. In some embodiments, separate control signals may be transmitted to corresponding heaters, cold plates, and / or force mechanisms.

[0123] Different adapters, heaters, and / or TIM layers for different portions of the stacked components may be configured accordingly. For example, a force applied by adapter 930C to both components in the stack (component 902B and component 902T) may be transferred, at least in part, to a force applied to the bottom component (component 902B). The adapters may apply force to different areas of component 902B, and thus, in some embodiments, the force applied by adapter 930C may be less than the force applied by adapter 930B. As another example, the top component 902T may be a memory chip, and the bottom component 902B may be a processor. The heater 956T for the top component 902T may be lower in power than the heater 956B for the bottom component 902B. Additionally or alternatively, adapter 930C (contacting the top component 902T, or an intermediate layer such as heater 956T and / or TIM 922C) has lower conductivity, smaller contact area, and / or higher TIM resistance compared to adapter 930B (contacting the bottom component 902B).

[0124] One or more (e.g., each) of the adapters, heaters, cold plates, and / or TIM layers disclosed herein for a given device may account for differences in the characteristics of the corresponding components, such as different component heights and / or component placement. In the example shown in Figures 9A-9C, adapter 930A, adapter 930D, adapter 930E, and adapter 930F (and / or corresponding heaters, cold plates, TIM layers, or combinations thereof) may account for the heights of component 903B, component 903F, component 903C, and component 903G, respectively, and may account for the heights of any associated TIM layers and / or interconnects. Adapter 930B, heater 956B, and / or TIM layer 922B may account for the heights of component 902B and any associated TIM layers and / or interconnects. The adapter 930C, heater 956T, and / or TIM layer 922C may account for the total height of components 902B and 902T and any associated TIM layers and / or interconnects. One or more force mechanisms may be used to move the corresponding adapter, heater, and / or cold plate closer to the thermally coupled components. For example, thermal head 950 may include spring 932B to move adapter 930A closer to component 903B and spring 932F to move adapter 930D ​​and TIM 922F closer to component 903F. Other force mechanisms may be used, including, but not limited to, levers, force applicators, and the like. Exemplary Thermal Head for a Device with Components on Multiple Sides of a Substrate

[0125] In some embodiments, the device under test may include components and / or packages located on multiple sides of a substrate; for example, device 1000 includes components 1002A and 1002B located on the top side of substrate 1010 and component 1002C located on the bottom side of substrate 1010, as shown in the top view of FIG. 10A and the cross-sectional view of FIG. 10B. The top view of FIG. 10A illustrates the outline of component 1002C (located on the bottom side of substrate 1010). As shown in the figures, in some embodiments, component 1002C may be located in a different region of substrate 1010 along the x and y axes than components 1002A and 1002B. In some embodiments, high-power components may be located on one side of substrate 1010 and low-power components may be located on the other side. Interconnects 1006 may be component or package interconnects that mount components to substrate 1010. For example, interconnect 1006A may mount component 1002A to the top surface of substrate 1010, interconnect 1006B may mount component 1002B to the top surface of substrate 1010, and interconnect 1006C may mount component 1002C to the bottom surface of substrate 1010. In some embodiments, device 1000 may include interconnect 1016 for electrically coupling device 1000 to a board. The board may be a test board with a socket that engages a DUT (when device 1000 is being tested) or a system board (when the device is used in a package).

[0126] Although the figures depict chips, packages, or other components as mounted on the surface of a substrate, embodiments of the present disclosure may include one or more components partially or completely encapsulated within the substrate. For example, the device under test may be an embedded die or a fan-out wafer-level type package.

[0127] 11 illustrates a cross-sectional view of a portion of a test system including a thermal head with components on multiple sides of a substrate and a DUT according to some embodiments. The device may include components 1102A and 1102B located on the top side of a substrate 1110 and a component 1102C located on the bottom side. The thermal head may include multiple adapters 1130A, 1130B, and 1130C for independent control of components 1102A, 1102B, and 1102C, respectively.

[0128] In some embodiments, the thermal head may include one or more adapters configured to thermally couple to corresponding components from multiple sides of the substrate. Adapters 1130A and 1130B are configured to thermally couple from the top side of the substrate 1110, and adapter 1130C is configured to couple from the bottom side of the substrate 1110. In some embodiments, the thermal coupling and / or contact of the adapters to multiple sides of the substrate may occur simultaneously.

[0129] Additionally or alternatively, test system 1190 may include one or more mechanisms for electrically coupling to send and / or receive test signals to and from the device. Socket body 1170 may include test contact pins 1172 that may contact and / or electrically couple to the interconnects 1116 of the device. The adapters 1130A, 1130B, and 1130C may have characteristics similar to the adapters discussed herein.

[0130] Embodiments of the present disclosure may include any of the properties described herein, including (but not limited to) devices with additional components not shown in the figures, one or more adapters thermally coupled to multiple components, the use of passive or active temperature control, the use of passive or active force mechanisms, etc. (Example Force Mechanism)

[0131] One (non-limiting) example force mechanism may include a piston. Figure 12A illustrates an example piston according to some embodiments of the present disclosure. The thermal head may include the force mechanism, an adapter 1230, a cold plate 1262, and a heater 1256.

[0132] Piston 1243 is coupled to ramp 1204 and roller 1205. Piston 1243 may move according to the amount of force applied. For example, movement of piston 1243 to the right along the x-axis may cause ramp 1204 to move and exert a greater amount of force on roller 1205, which may then exert a greater amount of force on the top of the thermal head, which in turn may cause a force to be applied to component 1202. The amount of force applied may be measured by transducer 1239.

[0133] In some embodiments, the piston 1243 and at least a portion of the ramp 1204 may be located toward the side of the thermal head, creating a shorter overall profile than if the force application device were located above the thermal head. The piston 1243, ramp 1204, and / or roller 1205 may be used and replaced for certain types of components, such as particular SiP DUTs (e.g., high pin or ball count SiPs) where a greater amount of force is desired. A particular SiP DUT may be tested without having to modify the rest of the test system by removing and replacing any other force mechanism. The other force mechanism may be attached or detached using screws, bolts, or other attachment means.

[0134] Another exemplary force mechanism includes a cam-roller such as that shown in Figure 12B. The cam-roller includes a cam 1207A and a roller 1207B. The cam 1207A rotates in a certain direction, such as clockwise, and the rotation of the cam adjusts the amount of force to be applied via the roller 1207B in the z direction.

[0135] In some embodiments, at least one force applied by the force mechanism may be a variable force, and the variable force may be different at the beginning of the test (just when the test begins) and during the test, or during the test and at the end of the test (just when the test ends). In some embodiments, the variable force may be a force that is adjusted during the test. In some embodiments, the at least one force may be a fixed force that is the same at the beginning and during the test, or during and at the end of the test. Embodiments may include other types of force mechanisms, and exemplary force mechanisms are discussed below. (Example Test System)

[0136] 13A illustrates a cross-sectional view of an exemplary test system according to some embodiments. The test system 1390 may include a thermal head and a socket. The device may include multiple components 1302, 1303A, and 1303B mounted on a substrate 1310. The substrate 1310 may include interconnects 1316 for electrically coupling to a tester (not shown). The socket includes a socket body 1318 including test contact pins 1317. Movement of the socket body 1318 toward the device or movement of the device toward the socket body 1318 may cause the test contact pins 1317 to electrically couple to the interconnects 1316.

[0137] One of the force mechanisms included within the test system 1390 may include a pusher 1331 and a force application device 1333 to electrically couple a device to the test contact pins 1317 of the test system 1390 for testing (e.g., transmitting and / or receiving electrical signals from a tester to the device). The force application device 1333 pushes the pusher 1331, which in turn pushes one or more unpopulated portions of the device's substrate 1310 toward the socket body 1318 and corresponding test contact pins 1317. The force application device 1333 may be any type of force-applying device, including, but not limited to, a pneumatic or hydraulic cylinder, a pneumatic or hydraulic diaphragm, a stepper motor, a linear motor, a servo motor, an electroactive polymer actuator, a shape memory alloy actuator, an electromagnetic actuator, a rotary motor, an electromechanical actuator, a piezoelectric actuator, a voice coil, or other active force-applying device. The force application device 1333 may apply a force of 5 to 300 kgf (including any force therebetween).

[0138] In some embodiments, the test system may include a transducer 1329 that measures the force being applied by the force application device 1333 in real time (while the force is being applied). The transducer 1329 may generate one or more force measurement signals that are used as feedback for a controller that communicates to the force application device 1333 to adjust the applied force so that the target force is met. The transducer 1329 may include a pneumatic load cell, a hydraulic load cell, an inductive load cell, a capacitive load cell, a magnetostrictive device, a strain gauge-based sensor, a force-sensitive resistor, a thin film device, a piezoelectric device, or the like. Although the figures illustrate the transducer 1329 as having a width that is the same as the pusher 1331, embodiments of the present disclosure may include a transducer 1329 having a width that is smaller than the width of the pusher 1331. In some embodiments, the test system 1390 may include one or more springs (not shown) that may be used to return the pusher 1331, the transducer 1329, and / or the force application device 1333 to a home position when the force application device 1333 is not applying a force. Additionally, in some embodiments, the test system 1390 may include a home sensor (not shown) that is used to indicate when the pusher 1331, the transducer 1329, and / or the force application device 1333 is in a home position. The home position may be, for example, a position where the pusher 1331, the transducer 1329, and / or the force application device 1333 is located farthest from the thermal head and / or is not applying a force to the thermal head.

[0139] Another force mechanism in the test system 1390 may include a force mechanism contained within the thermal head. The thermal head force mechanism may include a force applicator 1343 for thermally coupling a device to the thermal head for thermal control of one or more components of the device under test. The force applicator 1343 may apply force to the thermal head cold plate 1362 and / or adapter 1330C. The force applicator 1343 may be any type of force-applying device, including, but not limited to, a pneumatic or hydraulic cylinder, a pneumatic or hydraulic diaphragm, a stepper motor, a linear motor, a servo motor, a voice coil, or other active force-applying device. The force applicator 1343 may apply forces, including, but not limited to, between 1 kgf, 2 kgf, 100 kgf, 300 kgf, or 500 kgf. The thermal head may include a transducer 1339 (e.g., a load cell, a strain gauge-based sensor, a force-sensitive resistor, a thin film device, a piezoelectric device, etc.) that measures the force being applied by the force application device 1343 in real time and generates one or more force measurement signals that are used as feedback for a controller that communicates to the force application device 1343 to adjust the applied force to meet the target force. The force application device 1343 may have any width, for example, a width that is the same as or smaller than the width of the adapter 1330.

[0140] As shown in the example of FIG. 13A , embodiments of the present disclosure may include active thermal control, passive thermal control, active force control, passive force control, or a combination thereof. Active thermal control may be used to set or vary the temperature of one or more components of a device at a setpoint temperature (or within a given range). Active thermal control may include a heater 1356, an adapter 1330C, and / or a cold plate 1362 that vary the temperature of one or more components within the device based on a thermal controller. Temperature sensors may be included to measure the temperature of the device under test, and the measured temperature may be used as feedback by the thermal controller, the heater 1356, and / or the cold plate 1362.

[0141] Additionally or alternatively, the test system 1390 may include passive thermal control. Passive thermal control may allow one or more components within a device to change their temperature, for example, using heat transfer. Passive thermal control may include one or more adapters 1330A and 1330B that may transfer (e.g., exchange) thermal energy with one or more thermally coupled components 1303A and 1303B, respectively. In some embodiments, passive thermal control may allow the temperature of the thermally coupled components to reach the temperature of the adapter 1330. The adapters 1330A and 1330B may contact the components 1303A and 1303B, respectively. In some embodiments, the adapters 1330A and 1330B (for passive thermal control) may not be thermally coupled to a heater. In some embodiments, one or more adapters 1330A and / or 1330B may not be thermally coupled to the cold plate 1362 or may be thermally coupled to a cold plate 1362 that does not include cooling channels for circulation of cooling material.

[0142] Embodiments of the present disclosure may include both active and passive thermal control. For example, as shown in the figure, a test system may include one or more adapters 1330A and 1330B for passive thermal control and one or more adapters, such as adapter 1330C, for active thermal control. In some embodiments, active thermal control may be used for components that have temperature set points or specific requirements, while passive thermal control may be used for other types of components (e.g., low-power components, components that do not have specific test temperature requirements, components whose performance is not sensitive to temperature, etc.).

[0143] Additionally or alternatively, any type of thermal control may be combined with any type of force control. For example, one or more adapters, such as adapters 1330A and 1330B for passive thermal control, may be combined with passive force control, such as springs, bellows, elastomers, etc. As another example, force applicator 1343 for active thermal control may be combined with heater 1356 for active thermal control.

[0144] In some embodiments, different amounts of control may be used to account for different temperature set points or requirements, different component heights, different configurations, and the like.

[0145] 13B illustrates a flowchart of an exemplary method of operating a test system 1390 according to some embodiments. Process 1370 includes step 1372, in which the test system 1390 sets the temperature of the thermal head to one or more setpoint temperatures. The temperature ramp rate can be as fast as possible or can be predetermined, for example. In step 1374, the test system places the device to be tested in the socket. The temperature of the thermal head can reach one or more setpoint temperatures before or after the device is placed in the socket.

[0146] In step 1376, a first force may be applied to the device to electrically couple the device to the socket. A transducer may measure the amount of force applied. If the measured force does not meet the threshold force, the test system may abort process 1370. Otherwise, in step 1378, a second force may be applied to the device to bring the adapter / heater / TIM into contact with the individual chips, for example, the force required to thermally couple a thermal head to the device. The transducer measures the amount of force applied to the device and terminates the process if it does not meet the threshold force.

[0147] If the first and second amounts of force applied to the device meet their respective threshold forces, the test system 1390 initiates the device test (step 1380). In some embodiments, the test system 1390 initiates the device test in response to a test start signal transmitted from one or more controllers (e.g., handler, thermal controller). During the test, the test system 1390 may optionally send one or more signals to the controller to change modes and / or setpoint temperatures (step 1382). Exemplary modes may include, but are not limited to, measuring heater temperature, measuring DUT temperature, etc. The mode may be changed according to examples of the present disclosure.

[0148] In step 1384, the test system 1390 completes the device test and sends a test end signal to the controller. The second force applied to the device may be removed (step 1386), and then the first force applied to the device may be removed (step 1388). In some embodiments, the process 1370 may not proceed to step 1388 until the test system 1390 verifies (in step 1386) that the second force applied to the device has been removed. In some embodiments, the process 1370 may not proceed to step 1390 until the test system 1390 verifies (in step 1388) that the first force applied to the device has been removed. In step 1390, the device may be removed from the socket. One or more steps of the process 1370 may be repeated, for example, to test another device.

[0149] Embodiments of the present disclosure may include active thermal control for multiple components of a device, as shown in FIG. 14 . Test system 1490 may include a thermal head and a socket. In some embodiments, the thermal head includes a force mechanism. The force mechanism (e.g., pusher 1431, transducer 1429, force application device 1433, force application device 1443, transducer 1439, etc.) and socket (including socket body 1418 and test contact pins 1417) may have one or more characteristics similar to the force mechanisms and sockets discussed herein (e.g., described in the context of FIGS. 13 and 15 ). The device may include multiple components 1403, 1402A, and 1402B mounted on a substrate 1410. The substrate 1410 may include interconnects 1416 for receiving and / or transmitting test signals to and / or from a tester.

[0150] Test system 1490 may include multiple adapters 1430A and 1430B thermally coupled to component 1402A and component 1402B, respectively. The multiple adapters 1430 may be thermally coupled to different heaters 1456, with adapter 1430A thermally coupled to heater 1456A while adapter 1430B is thermally coupled to heater 1456B. The multiple adapters 1430 may be thermally coupled to different cold plates 1462, with adapter 1430A thermally coupled to cold plate 1462A while adapter 1430B is thermally coupled to cold plate 1462B. The thermal controller may be configured to independently control the temperature of component 1402A and component 1402B using the respective adapter 1430A or 1430B, heater 1456A or 1456B, and / or cold plate 1462A or 1462B. These may be two non-limiting examples of active thermal control.

[0151] Embodiments of the present disclosure may further comprise passive thermal control: thermal energy dissipated from component 1403 may be allowed to transfer heat (e.g., dissipate) to adapter 1430C.

[0152] Additionally or alternatively, the thermal head of FIG. 14 may include both active and passive force control. For active force control, a force applicator 1443 applies a force to adapters 1430A and 1430B, which in turn apply a force to components 1402A and 1402B. The amount of force applied, as measured by transducer 1439, may be controlled by a controller that determines the force to be applied by force applicator 1443. In some embodiments, force control may not be independent for each adapter or component, such as when force applicator 1443 applies force to at least two adapters and / or components.

[0153] Embodiments of the present disclosure may further include passive force control. Spring 1432A may apply a force to adapter 1430C, which in turn applies the force to component 1403. The amount of force applied may not be adjustable and may be based on the characteristics of spring 1432A.

[0154] Embodiments of the present disclosure may include active force control for multiple components according to some embodiments of the present disclosure. Test system 1590 of Figure 15 may include a thermal head and a socket. The force mechanism (e.g., pusher 1531, transducer 1529, force applicator 1533, force applicators 1543A and 1543B, transducers 1539A and 1539B), other portions of the thermal head (e.g., cold plates 1562A and 1562B, adapters 1530A, 1530B, and 1530C, heaters 1556A and 1556B), socket (including socket body 1518 and test contact pins 1517), and portions of the device (e.g., interconnect 1516, components 1502A, 1502B, and 1503, substrate 1510) may have one or more characteristics similar to the force mechanism, portions of the socket, and portions of the device discussed herein (e.g., described in the context of Figures 13A and 14). (Example Controller)

[0155] As discussed above, one or more controllers may be used for the test system and / or thermal head of the present disclosure. FIG. 16 illustrates a block diagram of an exemplary computer 1602 used for one or more controllers according to embodiments of the present disclosure. The computer may be a machine on which a set of instructions causes the machine to perform any one of the methodologies discussed herein and can be executed according to embodiments of the present disclosure. In some embodiments, the machine can operate as a stand-alone device or can be connected (e.g., networked) to other machines. In a networked configuration, the machine may operate in the capacity of a server or client machine in a server-client network environment, or as a peer machine in a peer-to-peer (or distributed) network environment. The machine may be a personal computer (PC), tablet PC, set-top box (STB), personal digital assistant (PDA), cellular phone, web appliance, network router, switch or bridge, or any machine capable of executing a set of instructions (sequential or otherwise) that define actions to be taken by the machine. A mobile device may include an antenna, a chip for sending and receiving radio frequency transmissions and wireless communications, and a keyboard. Additionally, although only a single machine is illustrated, the term "machine" shall also be taken to include any collection of machines that individually or jointly execute a set (or sets) of instructions to implement any one of the methodologies discussed herein.

[0156] The exemplary computer 1602 includes a processor 1604 (e.g., a central processing unit (CPU), a graphics processing unit (GPU), or both), which may communicate with each other via a bus 1610, memory 1606 (e.g., read-only memory (ROM), flash memory, dynamic random access memory (DRAM) such as synchronous DRAM (SDRAM), etc.), and static memory 1608 (e.g., static random access memory (SRAM), etc.).

[0157] The computer 1602 may further include a video display 1612 (e.g., a liquid crystal display (LCD) or a light emitting diode (LED) display). The computer 1602 also includes an alphanumeric input device 1614 (e.g., a keyboard), a cursor control device 1616 (e.g., a mouse), a disk drive unit 1618, a signal generating device, a network interface device 1622, and one or more wireless interface devices.

[0158] The computer 1602 may also include other inputs and outputs, including digital I / O and / or analog I / O, for example, the inputs and outputs may communicate with external devices such as chillers, pressure controllers, force controllers, flow controllers, etc., using any type of communication protocol.

[0159] Drive unit 1618 includes machine-readable medium 1620 having stored thereon one or more sets of instructions 1624 (e.g., software) that embody any one or more of the methodologies or functions described herein. The software also resides, completely or at least partially, within primary memory 1606 and / or processor 1604 during its execution by computer 1602, and primary memory 1606 and processor 1604 may also constitute machine-readable media. The software may further be transmitted or received over a network via network interface device 1622 and / or wireless device.

[0160] While machine-readable medium 1620 is shown to be a single medium in the exemplary embodiment, the term "machine-readable medium" should be taken to include a single medium or multiple media (e.g., centralized or distributed databases and / or associated caches and servers) that store one or more sets of instructions. The term "machine-readable medium" should be taken to include any medium that is capable of storing, encoding, or carrying a set of instructions for execution by a machine, the set of instructions causing the machine to perform any one or more of the methodologies of the present invention. The term "machine-readable medium" should be taken to include, where appropriate, without limitation, solid-state memory, optical and magnetic media, and carrier wave signals.

[0161] Although examples of the present disclosure have been fully described with reference to the accompanying drawings, it should be noted that various changes and modifications will be apparent to those skilled in the art, and such changes and modifications are to be understood as being included within the scope of the examples of the present disclosure as defined by the appended claims.

Claims

1. 1. A test system for testing one or more devices under test, the test system comprising: a thermal head for controlling one or more temperatures of the one or more devices under test, the thermal head comprising: a plurality of adapters thermally coupled to one or more components of the one or more devices under test; one or more heaters thermally coupled to the plurality of adapters and the one or more components of the one or more devices under test; Equipped with a thermal head, wherein the one or more heaters are configured to heat the one or more components of the one or more devices under test; one or more thermal controllers configured to independently control the one or more temperatures of the one or more components of the one or more devices under test; A test system comprising:

2. The test system of claim 1 , wherein at least two of the one or more components have different set point temperatures.

3. 10. The test system of claim 1, wherein the one or more temperatures of the one or more components are independently controlled using different changes in temperature.

4. 2. The test system of claim 1, wherein the one or more heaters comprise a first heater and a second heater, the one or more components comprise a first component and a second component, the first heater configured to heat the first component, and the second heater configured to heat the second component.

5. 10. The test system of claim 1, wherein the thermal head further comprises one or more temperature sensors configured to measure temperatures of the one or more heaters or the plurality of adapters, and the one or more thermal controllers control the one or more temperatures based on the measured temperatures.

6. 10. The test system of claim 1, wherein an update frequency of the one or more thermal controllers for independently controlling the one or more temperatures of the one or more components is less than 200 microseconds.

7. 10. The test system of claim 1, wherein the one or more heaters comprise a heater including at least two heating elements, and the thermal head further comprises a thermal insulator positioned between the at least two heating elements.

8. The test system of claim 7 , wherein the thermal insulator comprises a material having through holes or grooves.

9. The test system of claim 1 , wherein the thermal head further comprises a heat dissipation material located on at least one side of at least one of the one or more heaters.

10. 10. The test system of claim 1, wherein the thermal head further comprises a heat dissipation material located on at least one side of at least one of the plurality of adapters.

11. 2. The test system of claim 1, wherein the plurality of adapters comprises a first adapter thermally coupled to a first heat dissipation material layer and a second adapter thermally coupled to a second heat dissipation material layer, the first heat dissipation material layer having a different thermal resistance than the second heat dissipation material layer.

12. 12. The test system of claim 11, wherein the first layer of thermal interface material has a larger surface area than the second layer of thermal interface material.

13. The test system of claim 11 , wherein the second layer of heat dissipation material comprises openings or holes.

14. The test system of claim 1 , wherein at least one of the one or more heaters contacts at least one of the one or more components.

15. The test system of claim 1 , wherein at least one of the one or more heaters is attached to at least one of the plurality of adapters.

16. 16. The test system of claim 15, wherein the at least one heater comprises a plurality of pins that enable the at least one heater to be attached to the at least one adapter.

17. 17. The test system of claim 16, wherein the plurality of pins are attached to the at least one adapter by soldering, welding, brazing, press-fitting, or a conductive adhesive.

18. The test system of claim 1 , wherein a surface area of ​​at least one of the one or more heaters is the same as a surface area of ​​a corresponding adapter.

19. 10. The test system of claim 1, wherein at least one of the one or more heaters and the corresponding adapter comprises a mating alignment feature for aligning the at least one heater and the corresponding adapter.

20. 2. The test system of claim 1, wherein the one or more components of the one or more devices under test comprise a first component and a second component, and the plurality of adapters comprise a first adapter and a second adapter, the first component being thermally coupled to the first adapter and the second component being thermally coupled to the second adapter.

21. The test system of claim 1 , wherein the one or more thermal controllers control the one or more temperatures of the one or more components based on an amount of power from the one or more components.

22. 22. The test system of claim 21, wherein the amount of power from the one or more components comprises an expected amount of power dissipation.

23. 10. The test system of claim 1, wherein the thermal head further comprises one or more cold plates thermally coupled to at least one of the plurality of adapters, the one or more cold plates configured to cool the at least one adapter.

24. 24. The test system of claim 23, wherein the one or more cold plates are independently controlled.

25. The testing system of claim 1 , wherein the thermal head further comprises one or more force mechanisms configured to apply a force to at least one of the one or more components.

26. 26. The test system of claim 25, wherein the one or more force mechanisms are independently controlled.

27. The test system of claim 1 , wherein at least two of the one or more components have different heights.

28. The test system of claim 1 , wherein at least one of the plurality of adapters is thermally coupled to at least two of the one or more components.

29. 10. The test system of claim 1, wherein each of the plurality of adapters is thermally coupled to only one of the one or more components.

30. The test system of claim 1 , wherein the one or more components are part of a single device under test.

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