Power module and electronic device having power module

Abstract

A power module and an electronic device having the same are provided. The power module includes a plurality of power chips, a plurality of islands, and a plurality of power pins. The plurality of islands include die bond portions and pin bond portions, and the pin bond portion of at least one island has a first hypotenuse. The plurality of power chips are disposed on the die bond portions of the plurality of islands. The plurality of power pins are connected to corresponding pin bond portions of the plurality of islands, and a portion of at least one power pin adjacent to the connected island is welded to the pin bond portion of the island and has a second hypotenuse. Here, the second hypotenuse corresponds to the first hypotenuse, and an orthogonal projection of the second hypotenuse onto a plane in which the islands are located extends along approximately the same direction as an orthogonal projection of the first hypotenuse onto the plane in which the islands are located.

Description

[Technical Field]

[0001] (CROSS-REFERENCE TO RELATED APPLICATIONS) This application claims priority to Chinese patent application No. 202223090040.9, filed on November 17, 2022, and Chinese patent application No. 202310495887.5, filed on April 28, 2023, each of which is incorporated herein by reference in its entirety.

[0002] The present disclosure relates to the field of electronic device technology, and more particularly to a power module and an electronic device having the same. [Background technology]

[0003] Electronic devices typically incorporate a power module to realize their functional applications. The power module, packaged in a molded resin, includes a power chip and a driver chip for driving the power chip. As electronic devices become more widespread, there is an increasing demand for smaller power modules in applications. Summary of the Invention [Means for solving the problem]

[0004] In one embodiment, a power module is provided that includes a plurality of power chips, a plurality of islands, and a plurality of power pins. The plurality of islands include die bond portions and pin bond portions, and the pin bond portion of at least one island has a first hypotenuse. The plurality of power chips are disposed on the die bond portions of the plurality of islands. The plurality of power pins are connected to corresponding pin bond portions of the plurality of islands, and a portion of at least one power pin adjacent to the connected island is welded to the pin bond portion of the island and has a second hypotenuse. Here, the second hypotenuse corresponds to the first hypotenuse, and an orthogonal projection of the second hypotenuse onto a plane in which the islands are located and an orthogonal projection of the first hypotenuse onto the plane in which the islands are located extend along approximately the same direction.

[0005] In another aspect, an electronic device is provided that includes the power module described above. [Brief explanation of the drawings]

[0006] [Figure 1] FIG. 1 is a configuration diagram of a power module according to a related art. [Figure 2] FIG. 1 is a plan view of a power module according to some embodiments of the present disclosure. [Figure 3] FIG. 1 is a cross-sectional view of a power module according to some embodiments of the present disclosure. [Figure 4] FIG. 1 is a diagram illustrating a power module implementation in accordance with some embodiments of the present disclosure. [Figure 5] FIG. 2 is a schematic diagram of a top view of a package of a power module according to some embodiments of the present disclosure. [Figure 6] FIG. 1 is a perspective view of a package of a power module according to some embodiments of the present disclosure. [Figure 7] FIG. 7 is an enlarged view of a region M in the power module shown in FIG. [Figure 8] FIG. 2 is a schematic diagram of the underside of a package of a power module according to some embodiments of the present disclosure. [Figure 9] FIG. 1 is a perspective view of a package of a power module according to some embodiments of the present disclosure. [Figure 10] 1 is a schematic diagram of a packaging process for a power module according to some embodiments of the present disclosure. [Figure 11] 1 is a schematic diagram of a packaging process for a power module according to some embodiments of the present disclosure. [Figure 12] 1 is a schematic diagram of a packaging process for a power module according to some embodiments of the present disclosure. [Figure 13] FIG. 2 is another plan view of a power module in accordance with some embodiments of the present disclosure. [Figure 14] FIG. 14 is an enlarged view of an N region in the power module shown in FIG. [Figure 15]FIG. 10 is a schematic diagram of an annular dimple on a first surface of a power module according to some embodiments of the present disclosure. [Figure 16] FIG. 1 is a schematic diagram of an electronic device according to some embodiments of the present disclosure. DETAILED DESCRIPTION OF THE INVENTION

[0007] Hereinafter, several embodiments of the present disclosure will be clearly and completely described with reference to the drawings, but it is clear that the described embodiments are only some of the embodiments of the present disclosure and do not include all of the embodiments. All other embodiments that can be obtained by those skilled in the art based on the embodiments provided by the present disclosure are within the scope of the present disclosure.

[0008] Unless the context dictates otherwise, in the specification and claims, the term "comprise" and other forms thereof, such as the third-person singular "comprises" and the present participle "comprising," are intended to be interpreted in an open and inclusive sense, i.e., "including, but not limited to." In the description, terms such as "one embodiment," "some embodiments," "exemplary embodiments," "example," "specific example," or "some examples" are intended to indicate that a particular feature, structure, material, or characteristic associated with the embodiment or example is included in at least one embodiment or example of the present disclosure. General references to the above terms do not necessarily refer to the same embodiment or example. Furthermore, a particular feature, structure, material, or characteristic described may be included in any one or more embodiments or examples in any appropriate manner.

[0009] Hereinafter, the terms "first" and "second" are for descriptive purposes only and should not be understood as indicating or suggesting the relative importance or implicitly indicating the number of technical features indicated. Thus, features qualified by "first" and "second" can explicitly or implicitly include one or more of such features. In describing the embodiments of the present disclosure, "plurality" means two or more, unless otherwise specified.

[0010] In describing some embodiments, the term "connected" and its derivatives may be used. For example, in describing some embodiments, the term "connected" is used to mean that two or more elements are in direct physical or electrical contact. The embodiments disclosed herein are not necessarily limited to the present specification.

[0011] "A and / or B" includes the three combinations of A only, B only, and A and B in combination.

[0012] As used herein, "about," "approximately," or "approximate" includes the stated value and the mean within a range of acceptable deviation from the particular value, which range of acceptable deviation would be determined by one of ordinary skill in the art taking into account the measurement under consideration and the error associated with measuring the particular quantity (i.e., limitations of the measurement system).

[0013] Exemplary embodiments are described herein with reference to cross-sectional and / or plan views as idealized, exemplary drawings. In the drawings, thicknesses of layers and regions are exaggerated for clarity. The exemplary embodiments of the present disclosure should not be construed as limited to the shapes of regions shown herein and include, for example, shape deviations due to manufacturing. For example, an etched region shown as a rectangle typically has curved features. Therefore, the regions shown in the drawings are schematic in nature, and their shapes do not represent the actual shapes of regions of a device, nor do they limit the scope of the exemplary embodiments.

[0014] Electronic devices usually incorporate a power module to realize their functions. A power module includes a power frame with a power chip mounted thereon and a driver frame with a driver chip mounted thereon, and the power frame and driver frame are packaged together using a package made of molded resin.

[0015] FIG. 1 shows a power module with a DBC (Direct Bond Copper) structure. The power module 900 may include a first pad 901 (the unpackaged portion of the first pad 901 is a driver pin), a driver chip 902 disposed on the first pad 901, a second pad 903, a power pin 904 connected to the second pad 903, and a power chip 905 disposed on the second pad 903. The power module includes a plurality of first pads and a plurality of corresponding power pins, and each first pad and its corresponding power pin must be welded together. To ensure sufficient welding strength, the portion of the first pad corresponding to the power pin has a relatively large area. As a result, the overall dimensions of the power module are relatively large, and the overall structure of the power module is not compact, which makes it difficult to meet the demand for a compact design of the power module.

[0016] Based on this, an embodiment of the present disclosure provides a power module. The power module may be an intelligent power module (IPM). As shown in Fig. 2, the power module 10 includes a plurality of islands 100, a plurality of power chips 200 arranged in the plurality of islands 100, and a plurality of power pins 300 connected to the plurality of islands 100. Here, the plurality of power chips 200 are arranged in the plurality of islands 100, and the number of power chips 200 arranged in each island 100 can be designed according to actual needs.

[0017] Note that when describing the configuration of the power module 10, the description may be made with reference to the longitudinal direction X of the power module 10, the width direction Y of the power module 10, and the thickness direction Z of the power module 10. Here, in a plane on which the multiple islands 100 are located, the arrangement direction of the multiple islands 100 is the longitudinal direction X of the power module 10, the extension direction of any one of the islands 100 is the width direction Y of the power module 10, and the longitudinal direction X and the width direction Y intersect, for example, perpendicular to each other. Furthermore, the direction perpendicular to the plane on which the multiple islands 100 are located is the thickness direction Z of the power module 10, and this thickness direction Z may be, for example, the direction from the power chip 200 toward the island 100, or vice versa. The longitudinal direction X and the width direction Y are both perpendicular to the thickness direction Z.

[0018] The island 100 may include a die bond portion 110 and a pin bond portion 120, and the die bond portion 110 and the pin bond portion 120 may be connected along the width direction Y of the power module 10. The die bond portion 110 is configured to have the power chip 200 disposed thereon, and the pin bond portion 120 is configured to have the power pin 300 connected thereto. That is, the power chip 200 is disposed on the die bond portion 110 of the island 100, and the power pin 300 is welded to the pin bond portion 120 of the island 100. As can be seen from the above, the island 100 can provide an assembly position for the power chip 200 and the power pin 300 to more securely position the power chip 200 and the power pin 300.

[0019] The pin bond portion 120 of at least one island 100 has a first hypotenuse 121, and a portion of at least one power pin 300 connected to the at least one island, which is adjacent to the island 100, has a second hypotenuse 310. The second hypotenuse 310 corresponds to the first hypotenuse 121, and the orthogonal projection of the second hypotenuse 310 onto the plane on which the island 100 is located and the orthogonal projection of the first hypotenuse 121 onto the plane on which the island 100 is located are approximately parallel to each other.

[0020] It should be understood that the first hypotenuse 121 means that the pin bond portion 120 of the island 100 is chamfered, and this chamfered side is the first hypotenuse 121, and the second hypotenuse 310 means that a portion of the power pin 300 that is close to the pin bond portion 120 of the island 100 is chamfered, and this chamfered side is the second hypotenuse 310. The fact that the second hypotenuse 310 corresponds to the first hypotenuse 121 means that the position of the second hypotenuse 310 corresponds to the position of the first hypotenuse 121. In other words, the orthogonal projection of the second hypotenuse 310 onto the plane in which the island 100 is located is close to the position of the orthogonal projection of the first hypotenuse 121 onto the plane in which the island 100 is located.

[0021] The arrangement of the first hypotenuse 121 can reduce the size of the pin bond portion 120, and the arrangement of the second hypotenuse 310 can reduce the size of the power pin 300. The second hypotenuse 310 is arranged corresponding to the first hypotenuse 121, and the orthogonal projection of the second hypotenuse 310 onto the plane on which the island 100 is located is approximately parallel to the orthogonal projection of the first hypotenuse 121 onto the plane on which the island 100 is located, which is advantageous in providing a certain space for the arrangement of adjacent islands 100.

[0022] For example, the pin bond portion 120 of the first island 101 has a first hypotenuse 121, the first power pin 301 has a second hypotenuse 310 corresponding to the first hypotenuse 121 of the first island 101, the pin bond portion 120 of the second island 102 has a first hypotenuse 121, the second power pin 302 has a second hypotenuse 310 corresponding to the first hypotenuse 121 of the second island 102, and the pin bond portion 120 of the third island 103 has a first hypotenuse 121, and the second power pin 302 has a second hypotenuse 310 corresponding to the first hypotenuse 121 of the third island 103. The pin bond portion 120 of the fourth island 104 has a first hypotenuse 121, and the fourth power pin 304 has a second hypotenuse 310 that corresponds to the first hypotenuse 121 of the fourth island 104. This allows the structure of the first island 101, the second island 102, the third island 103, and the fourth island 104 to be more compact.

[0023] In a power module 10 according to an embodiment of the present disclosure, a first hypotenuse 121 is disposed at the pin bond portion 120 of the island 100, and a second hypotenuse 310 is disposed at a portion of the power pin 300 that is close to the island 100. The second hypotenuse 310 corresponds to the first hypotenuse 121, and the orthogonal projection of the second hypotenuse 310 onto the plane on which the island 100 is located and the orthogonal projection of the first hypotenuse 121 onto the plane on which the island 100 is located are approximately parallel. This reduces the dimensions of the welded portion formed between the pin bond portion 120 and the island 100, allowing a certain amount of space to be provided for the placement of adjacent islands 100. This makes the structure of the power module 10 more compact, which is advantageous for designing a more compact power module 10. Furthermore, this arrangement facilitates assembly of the power pin 300 and the pin bond portion 120 of the island 100, improving production efficiency.

[0024] 2 , the island 100 is welded to the power pin 300, and the first hypotenuse 121 of the pin bond portion 120 of the island 100 and the second hypotenuse 310 of the power pin connected to the island are arranged parallel to each other. That is, the orthogonal projection of the second hypotenuse 310 onto the plane in which the island 100 is located and the orthogonal projection of the first hypotenuse 121 onto the plane in which the island 100 is located extend in the same direction. In this way, when assembling the power pin 300 and the pin bond portion 120 of the island 100 by welding, the coincidence of the directions of the first hypotenuse 121 and the second hypotenuse 310 can reduce process difficulty and improve production efficiency.

[0025] 2 , the power pin 300 may include a fixed portion 320, a bent portion 330, a terrace portion 340, and a lead-out portion 350, which are connected in this order along the width direction Y of the power module 10. The fixed portion 320 is welded to the pin bond portion 120 of the island 100 connected to the power pin 300. The bent portion 330 is connected between the fixed portion 320 and the terrace portion 340, and the lead-out portion 350 is connected to one end of the terrace portion 340 remote from the bent portion 330. Here, the fixed portion 320 has a second hypotenuse 310. That is, the fixed portion 320 of the power pin 300 is the portion of the power pin 300 adjacent to the island 100 where the second hypotenuse 310 is located.

[0026] It should be understood that the terrace portion 340 is higher than the fixed portion 320 along the thickness direction Z of the power module 10, and the bent portion 330 is connected between the terrace portion 340 and the fixed portion 320.

[0027] After packaging the power module 10, the fixed portion 320, the bent portion 330 and the terrace portion 340 of the power pin 300 are all covered with the sealing resin, and most of the drawn-out portion 350 of the power pin 300 is exposed to the outside of the sealing resin, with only a small portion connected to the terrace portion 340 being located within the sealing resin.

[0028] For example, the fixed portion 320, the bent portion 330, the terrace portion 340, and the lead-out portion 350 of the power pin 300 may be an integral structure, and the fixed portion 320, the bent portion 330, the terrace portion 340, and the lead-out portion 350 may correspond to different portions of the power pin 300. In this way, the strength of the power pin 300 can be sufficiently ensured, thereby increasing the reliability of the power module 10 and improving its performance in use.

[0029] 2, terrace portion 340 of power pin 300 may include a first notch 341 that may be located in a position proximate to bent portion 330 of terrace portion 340, such as a position in terrace portion 340 proximate a connection between bent portion 330 and terrace portion 340. By way of example, first notch 341 located in terrace portion 340 may be a U-shaped notch.

[0030] In this way, by arranging the first notch 341 in the terrace portion 340, it is advantageous to release the stamping stress when bending the power pin 300, and the entire structure consisting of the island 100 and the power pin 300 has higher structural strength and better usability.

[0031] 2, the terrace 340 of the power pin 300 may include a through hole 342 disposed on a side of the terrace 340 adjacent to the lead-out 350. By way of example, the through hole 342 disposed on the terrace 340 may be a circular hole or an elliptical hole.

[0032] Because the terrace portion 340 has a large area, the through-holes 342 can improve the bonding strength between the power pins 300 and the sealing resin, thereby ensuring the reliability of the power module 10. Furthermore, the through-holes 342 are located on the side of the terrace portion 340 that is close to the lead-out portion 350, i.e., on the edge that is close to the lead-out portion 350, and prevent external air and moisture from entering the vicinity of the power chip 200 along the power pins 300, thereby ensuring the reliability of the power chip 200, improving its performance in use, and extending its lifespan. Furthermore, because the terrace portion 340 is configured to provide a position for bonding leads to connect the power chip 200, the through-holes 342 are located in a position close to the edge of the outer lead-out portion 350 while avoiding the position for lead bonding.

[0033] 2 , the plurality of islands 100 may include a first island 101, a second island 102, a third island 103, and a fourth island 104 spaced apart sequentially along the longitudinal direction X of the power module 10. Accordingly, the plurality of power pins 300 may include a first power pin 301, a second power pin 302, a third power pin 303, and a fourth power pin 304.

[0034] Here, one end of the first power pin 301 is welded to the pin bond portion 120 of the first island 101, one end of the second power pin 302 is welded to the pin bond portion 120 of the second island 102, one end of the third power pin 303 is welded to the pin bond portion 120 of the third island 103, and one end of the fourth power pin 304 is welded to the pin bond portion 120 of the fourth island 104.

[0035] In addition, due to the structural design of the power module 10, the pin bond portion 120 of the island 100 has a relatively large dimension (dimension in the longitudinal direction X of the power module 10) compared to its die bond portion 110, so the pin bond portions 120 of two adjacent islands 100 must be sequentially shifted in position relative to their die bond portions 110, and the pin bond portion 120 of one island 100 and the die bond portion 110 of the other island 100 correspond at least partially to each other in the width direction Y of the power module 10.

[0036] 2 and 13 , the pin bond portion 120 of at least one island 100 among the first island 101, the second island 102, and the third island 103 can be configured to have a first hypotenuse 121, and at least one power pin 300 connected to the at least one island 100 among the first power pin 301, the second power pin 302, and the third power pin 303 can be configured to have a second hypotenuse 310. That is, the island 100 on which the first hypotenuse 121 is located is selected from the first island 101, the second island 102, and the third island 103, and the power pin 300 on which the second hypotenuse 310 is located is selected from the first power pin 301, the second power pin 302, and the third power pin 303.

[0037] In some examples, the pin bond portion 120 of the first island 101 has a first hypotenuse 121, the first power pin 301 has a second hypotenuse 310 that corresponds to the first hypotenuse 121 of the first island 101, the pin bond portion 120 of the second island 102 has a first hypotenuse 121, and the second power pin 302 has a second hypotenuse 310 that corresponds to the first hypotenuse 121 of the second island 102. The pin bond portion 120 of the third island 103 has a first hypotenuse 121, and the second power pin 302 has a second hypotenuse 310 that corresponds to the first hypotenuse 121 of the third island 103.

[0038] In another example, the pin bond portion 120 of the first island 101 has a first hypotenuse 121 and the first power pin 301 has a second hypotenuse 310 that corresponds to the first hypotenuse 121 of the first island 101.

[0039] In yet another example, the pin bond portion 120 of the second island 102 has a first hypotenuse 121 and the second power pin 302 has a second hypotenuse 310 that corresponds to the first hypotenuse 121 of the second island 102.

[0040] The first island 101, the second island 102, the third island 103, and the fourth island 104 are arranged at intervals along the longitudinal direction X of the power module 10, so that the fourth island 104 is located on the outermost side of the multiple islands 100, i.e., no other islands are arranged on the side of the fourth island 104 away from the first island 101. As can be seen from the above, if the pin bond portion 120 of the fourth island 104 is shifted relative to its die bond portion 110 in a direction away from the first island 101, a relatively large space for arranging the pin bond portion 120 of the fourth island 104 is provided on the side of the fourth island 104 away from the first island 101.

[0041] Of course, other islands may be located on the side of the fourth island 104 away from the first island 101. In this case, the pin bond portion 120 of the fourth island 104 may have a first hypotenuse 121, and the power pin 300 connected to the fourth island 104 will correspondingly have a second hypotenuse 310.

[0042] The above arrangement makes it possible to make the structure of the power module 10 more compact and avoid chamfering the pin bond portions 120 of all islands 100 and all power pins 300, thereby reducing the difficulty of the process and improving production efficiency.

[0043] Since the number of power chips 200 arranged on each island 100 may vary, the areas of the first island 101, the second island 102, the third island 103, and the fourth island 104 may also vary. For example, the areas of the first island 101, the second island 102, and the third island 103 may all be smaller than the area of ​​the fourth island 104, i.e., the fourth island 104 may have the largest area. In this case, one power chip 200, e.g., a low-voltage power chip, may be arranged on each of the first island 101, the second island 102, and the third island 103, and three power chips 200, e.g., high-voltage power chips, may be arranged on the fourth island 104. In this way, all of the multiple high-voltage power chips are integrated on the fourth island 104, thereby saving space and enabling the power module 10 to have a compact structure. In addition, the low-voltage power chip and the high-voltage power chip are spaced apart to not only meet the power demands of different circuits, but also avoid mutual interference between different power domains, thereby ensuring the stability and reliability of the power chips.

[0044] For example, the power chip 200 may include a MOS (metal-oxide-semiconductor) chip, an IGBT (insulated gate bipolar transistor) chip, an FRD (fast recovery diode) chip, a combination of an IGBT chip and an FRD chip, or an RC-IGBT (reverse-conducting insulated gate bipolar transistor) chip that is an IGBT chip with an FRD chip built in. In this way, at least one of the IGBT chip, the FRD chip, and the RC-IGBT chip can be selected and used as needed, improving usability.

[0045] In some embodiments, as shown in FIG. 2, the pin bond portion 120 of the first island 101 and the pin bond portion 120 of the second island 102 each have a first hypotenuse 121, and the first power pin 301 and the second power pin 302 have second hypotenuses 310 corresponding to the first hypotenuse 121 of the pin bond portion 120 of the first island 101 and the first hypotenuse 121 of the pin bond portion 120 of the second island 102, respectively.

[0046] Since the area of ​​the fourth island 104 is large, the corresponding region in the width direction Y of the power module 10 between the die bond portion 110 of the fourth island 104 and the pin bond portion 120 of the third island 103 is relatively large. In this case, it is not necessary to provide the first oblique side 121 on the pin bond portion 120 of the third island 103, i.e., it is not necessary to perform chamfering, which reduces the difficulty of the process and improves production efficiency.

[0047] 2 , both the pin bond portion 120 of the first island 101 and the pin bond portion 120 of the second island 102 have a first hypotenuse 121. The second island 102 may further include a first connection portion 130 diagonally connected between its die bond portion 110 and the pin bond portion 120. The first connection portion 130 has a third hypotenuse 131 adjacent to the first island 101 and a fourth hypotenuse 132 adjacent to the third island 103. Here, the third hypotenuse 131 is parallel to the first hypotenuse 121 of the pin bond portion 120 of the first island 101, and the fourth hypotenuse 132 is collinear with the first hypotenuse 121 of the pin bond portion 120 of the second island 102.

[0048] It should be understood that the first connection portion 130 is connected diagonally between the die bond portion 110 and the pin bond portion 120, and the position of the pin bond portion 120 can be adjusted to improve the space efficiency of the power module 10.

[0049] For example, along the width direction Y of the power module 10, the second island 102 includes a die bond portion 110, a first connection portion 130, and a pin bond portion 120, which are connected in this order. The first connection portion 130 is disposed obliquely with respect to the die bond portion 110 and the pin bond portion 120 such that the pin bond portion 120 is offset from the die bond portion 110 in the longitudinal direction X of the power module 10. The pin bond portion 120 of the first island 101 has a straight side portion and a first oblique side 121 continuing to the straight side portion on the side away from the first power pin 301, the third oblique side 131 of the first connection portion 130 of the second island 102 is parallel to the first oblique side 121 of the pin bond portion 120 of the first island 101, and the fourth oblique side 132 of the second island 102 and the first oblique side 121 of the pin bond portion 120 of the second island 102 are positioned on the same straight line. In this way, the straight side portion of the pin bond portion 120 of the first island 101 is aligned with the die bond portion 110 of the second island 102, and the first oblique side 121 of the pin bond portion 120 of the first island 101 is aligned with the first connection portion 130 of the second island 102.

[0050] According to the above arrangement, the extension direction of the first connection portion 130 can be made the same as the extension direction of the first oblique side 121 of the first island 101, the distance between the second island 102 and the first island 101 can be reduced, the structure of the second island 102 and the first island 101 can be made compact, and this is advantageous for designing a compact power module 10.

[0051] 2 , each of the pin bond portions 120 of the second island 102 has a first hypotenuse 121. The third island 103 may further include a second connection portion 140 diagonally connected between the die bond portion 110 and the pin bond portion 120. The second connection portion 140 has a fifth hypotenuse 141 adjacent to the second island 102 and a sixth hypotenuse 142 adjacent to the fourth island 104. Here, the fifth hypotenuse 141 is parallel to the first hypotenuse 121 of the pin bond portion 120 of the second island 102.

[0052] It should be understood that the second connection portion 140 is diagonally connected between the die bond portion 110 and the pin bond portion 120 of the third island 103, and the position of the pin bond portion 120 can be adjusted to improve the space efficiency of the power module 10.

[0053] For example, along the width direction Y of the power module 10, the third island 103 includes a die bond portion 110, a second connection portion 140, and a pin bond portion 120, which are connected in this order. The second connection portion 140 is disposed obliquely with respect to the die bond portion 110 and the pin bond portion 120 such that the pin bond portion 120 is shifted in the longitudinal direction X of the power module 10 relative to the die bond portion 110. A fourth hypotenuse 132 of the second island 102 is located on the same straight line as the first hypotenuse 121 of the pin bond portion 120 of the second island 102, and a fifth hypotenuse 141 of the second connection portion 140 of the third island 103 is parallel to the first hypotenuse 121 of the pin bond portion 120 of the second island 102 and the fourth hypotenuse 132 of the first connection portion 130 of the second island 102. This allows the fifth oblique side 141 of the second connecting portion 140 of the third island 103 to be aligned with the first connecting portion 130 of the second island 102 .

[0054] According to the above arrangement, the extension direction of the second connection portion 140 can be made the same as the extension direction of the first oblique side 121 of the second island 102, and can also be made the same as the extension direction of the first connection portion 130 of the second island 102. In this way, the distance between the third island 103 and the second island 102 can be reduced, and the structure of the third island 103 and the second island 102 can be made more compact, which is advantageous for designing a more compact power module 10.

[0055] In addition, as shown in FIG. 2, the die bond portion 110 of the fourth island 104 has a seventh hypotenuse 111 adjacent to the third island 103, and this seventh hypotenuse 111 is parallel to the sixth hypotenuse 142 of the third island 103 and is close to the third island 103.

[0056] In this way, the extension direction of the second connection portion 140 of the third island 103 is further the same as the extension direction of the seventh oblique side 111 of the fourth island 104, which is advantageous for reducing the distance between the fourth island 104 and the third island 103, making the structure of the fourth island 104 and the third island 103 compact, and is advantageous for further miniaturizing the design of the power module 10.

[0057] Hereinafter, with reference to FIG. 2, an exemplary arrangement of the first island 101 to the fourth island 104 of the power module 10 according to the embodiment of the present disclosure will be described.

[0058] The multiple islands 100 of the power module 10 include a first island 101, a second island 102, a third island 103, and a fourth island 104 that are arranged at intervals along the longitudinal direction X of the power module 10, and the area of ​​the fourth island 104 is larger than the areas of the first island 101, the second island 102, and the third island 103.

[0059] The first island 101 includes a die bond portion 110 and a pin bond portion 120 that are connected in this order along the width direction Y of the power module 10. The second island 102 includes a die bond portion 110, a first connection portion 130, and a pin bond portion 120 that are connected in this order along the width direction Y of the power module 10. The third island 103 includes a die bond portion 110, a second connection portion 140, and a pin bond portion 120 that are connected in this order along the width direction Y of the power module 10. The fourth island 104 includes a die bond portion 110 and a pin bond portion 120 that are connected in this order along the width direction Y of the power module 10.

[0060] In the longitudinal direction X of the power module 10, the dimension of the pin bond portion 120 of the first island 101 is larger than the dimension of the die bond portion 110 thereof, and the pin bond portion 120 extends in the direction of the second island 102 relative to the die bond portion 110. The first connection portion 130 of the second island 102 is inclined in the direction of the third island 103 relative to the die bond portion 110 of the second island 102 such that the pin bond portion 120 is shifted in the direction of the third island 103 relative to the die bond portion 110 of the second island 102. The second connection portion 140 of the third island 103 is inclined in the direction of the fourth island 104 relative to the die bond portion 110 of the third island 103 such that the pin bond portion 120 is shifted in the direction of the fourth island 104 relative to the die bond portion 110 of the third island 103.

[0061] The pin bond portion 120 of the first island 101 has a first oblique side 121 arranged in the vicinity of the first connection portion 130 of the second island 102, the first oblique side 121 being parallel to the extension direction of the first connection portion 130. The pin bond portion 120 of the second island 102 has a first oblique side 121 arranged in the vicinity of the second connection portion 140 of the third island 103, the first oblique side 121 being parallel to the extension direction of the second connection portion 140. The die bond portion 110 of the fourth island 104 has a seventh oblique side 111 arranged in the vicinity of the second connection portion 140 of the third island 103, the seventh oblique side 111 being similarly parallel to the extension direction of the second connection portion 140.

[0062] According to the above arrangement, the distance between any two adjacent islands among the first island 101 to the fourth island 104 can be reduced, making the structure of the multiple islands 100 more compact, which is advantageous for designing a more compact power module 10.

[0063] 2 and 3 , the power module 10 may further include a driver frame 500 and at least one driver chip 600 disposed on the driver frame 500. The driver chip 600 is electrically connected to the power chip 200 and configured to drive and operate the power chip 200, thereby realizing the functions of the power module 10.

[0064] The driver frame 500 may include a frame body having at least one driver pad 510 and a plurality of driver pins 520 connected to the frame body. At least one driver chip 600 is disposed on the at least one driver pad 510, and the at least one driver chip 600 includes, for example, a low-voltage driver chip and a high-voltage driver chip. The plurality of driver pins 520 and the plurality of power pins 300 are located on both sides of the width direction Y of the power module 10, and the plurality of driver pins 520 and the plurality of power pins 300 are respectively spaced apart in the longitudinal direction X of the power module 10. For example, some of the plurality of driver pins 520 are electrically connected to the low-voltage driver chip, and other of the plurality of driver pins 520 are electrically connected to the high-voltage driver chip. When the power module 10 is operating, the plurality of driver pins 520 and the plurality of power pins 300 are connected to an external controller, thereby realizing electrical connection between the internal circuit of the power module 10 and an external circuit and realizing normal use of the power module 10.

[0065] 2 to 4, the power module 10 may further include a package 400. The package 400 may be, for example, a protective case made of sealing resin. The package 400 is disposed outside the driver frame 500, the plurality of islands 100, and the plurality of power pins 300, and both the free ends of the driver pins 520 and the free ends of the power pins 300 protrude from the package 400.

[0066] As a result, the package 400 arranged outside the driver frame 500 and the island 100 makes the assembly of the driver frame 500 and the island 100 more reliable, and also plays a protective role to provide good protection for the driver chip 600 and the power chip 200, thereby improving the usability and reliability of the power module 10.

[0067] 3 , the power module 10 may include a conductive layer 710, an insulating layer 720, and a heat dissipation layer 730 stacked along its thickness direction Z. The conductive layer 710 is disposed close to the power chip 200, and the heat dissipation layer 730 is disposed away from the power chip 200. The surface of the heat dissipation layer 730 away from the conductive layer 710 is flush with the bottom surface of the package 400, so that the heat dissipation layer 730 is exposed at the bottom surface of the package 400. Here, the conductive layer 710 can be the island 100 described above, that is, the multiple islands described above can be multiple portions of the conductive layer 710.

[0068] The conductive layer 710 may be made of a metal material with excellent electrical conductivity, the heat dissipation layer 730 may be made of a metal material with excellent heat dissipation, and the insulating layer 720 may be made of an insulating resin material with excellent thermal conductivity. For example, the conductive layer 710, the insulating layer 720, and the heat dissipation layer 730 may be a copper layer, a ceramic layer, and a copper layer, and these three together constitute the DBC structure 700.

[0069] With the above-described structure, the conductive layer 710 functions as the island 100, the insulating layer 720 prevents current dissipation, and the heat dissipation layer 730 provides a heat dissipation path. In this way, heat generated during operation of the power chip 200 is quickly dissipated through the conductive layer 710, the insulating layer 720, and the heat dissipation layer 730, realizing heat dissipation of the power module 10, thereby ensuring the reliability of the power chip 200 and improving the performance of the power module 10.

[0070] The power module 10 has a package structure in which its main body structure (including the driver frame 500, driver chip 600, island 100, power pins 300, and power chip 200) is packaged by molding. For example, the main body structure of the power module 10 is placed in the cavity of a sealing mold, and liquid resin is injected into the cavity of the sealing mold. Once the resin hardens, the external package 400 can be formed. The sealing effect of the package structure affects the reliability of the connection between the pads and the chips placed thereon, and the connection between the chips themselves, and this reliability of the connection further affects the performance of the power module 10.

[0071] In the power module 10 having the DBC structure, in order to realize a compact design of the power module 10 while ensuring a good sealing effect, when packaging the main body structure of the power module 10, pressure can be applied above the island 100 so that the DBC structure including the conductive layer 710 (island 100), the insulating layer 720, and the heat dissipation layer 730 is fixed in position when resin is injected.

[0072] 3 and 5 to 9, package 400 has first surface 401 (top surface) and second surface 402 (bottom surface). Conductive layer 710 is adjacent to first surface 401, and heat dissipation layer 730 is adjacent to second surface 402. It should be understood that the surface of heat dissipation layer 730 remote from conductive layer 710 is flush with the bottom surface of package 400, i.e., the surface of heat dissipation layer 730 remote from conductive layer 710 is flush with the second surface.

[0073] At least one remainder 410 is disposed on the first surface 401 of the package 400. The remainder 410 should be understood to mean a dimple left on the surface of the package 400 by an ejector pin of the encapsulation mold after the packaging of the power module is completed.

[0074] For example, Fig. 10 is a schematic diagram of an ejector pin of a sealing mold pressing against the island 100 during the injection molding process, Fig. 11 is a schematic diagram of the ejector pin starting to return during the injection molding process, and Fig. 12 is a schematic diagram of the ejector pin completing its return during the injection molding process. As shown in Figs. 10 to 12, when packaging the main structure of the power module 10, the main structure of the power module 10 can be pressed from above the island 100 (the side where the power chip 200 is located) through an ejector pin 810 of the sealing mold in an ejector plate and a sleeve so that the DBC structure consisting of the island 100 (conductive layer 710), insulating layer 720, and heat dissipation layer 730 is packed downward. During the process of injecting resin into a cavity 820 of the sealing mold, the DBC structure can maintain a stable position. By controlling the ejector pins 810 to start returning just before the resin is completely cured, and completely removing the sealing mold after packaging is completed, the island 100 can be controlled to closely contact the surface of the sealing mold during the packaging process. As can be seen from this, the ejector pins 810 of the sealing mold may be extendable ejector pins that extend from the sleeve to fix the island 100 when the resin is injected and retract when the resin filling is completed and holding pressure begins, completing the entire sealing process. In this way, the ejector pins 810 extend and contract within the space defined by the sleeve, which is advantageous in improving the accuracy of the up and down movement of the ejector pins 810.

[0075] When the island 100 is fixed with the ejector pin 810, the ejector pin 810 penetrates the ejector plate and the sleeve and is fixed to the bottom plate, and is protruded when power is supplied to the ejector rod from the oil passage, and can return to its original position by the operation of the return spring or the reverse oil passage after the power from the oil passage is cut off.

[0076] The return positions of the ejector pin and the sleeve are closer to the island 100 than to the cavity surface of the sealing mold in order to prevent the resin from filling inside the sleeve, so that two annular dimples (e.g., annular dimples) nested within each other are finally formed on the first surface 401 of the package 400. Here, the return position of the ejector pin 810 is closer to the island 100 than to the return position of the sleeve, so that the annular dimple finally formed on the first surface 401 of the package 400 is a stepped hole 412 in which the sleeve and the ejector pin 810 are formed together, as shown in FIGS. 7 and 15 , with the edge of the sleeve corresponding to the outer circle of the annular dimple (i.e., the edge of the dimple 411 corresponding to the sleeve) and the edge of the ejector pin corresponding to the inner circle of the annular dimple (i.e., the above-mentioned remaining portion 410), and the depth of the remaining portion 410 is greater than the depth of the dimple 411 corresponding to the sleeve.

[0077] In this way, during the resin filling process, pressure can be applied to the island 100 by the ejector pin 810 so that the bottom surface of the DBD structure (i.e., the surface of the heat dissipation layer 730 away from the conductive layer 710) is not easily tilted by the impact of the fluid resin, ensuring the stability of the position of the DBD structure and preventing the injected resin from spilling out onto the back surface of the DBD structure. Furthermore, because the resin has hardened when the ejector pin 810 is removed, the stability of the position of the DBD structure can be maintained. In this way, it is possible to ensure that the island 100 is in close contact with the bottom of the sealing mold and prevent the resin from spilling out onto the back surface of the DBD structure, thereby achieving smooth packaging of the power module 10 and ensuring a good sealing effect.

[0078] 3 and 5 to 7, the conductive layer 710 includes a driver side 70A and a power side 70B located on either side of the width direction Y of the power module 10. The orthogonal projection of the center of the remaining portion 410 onto the conductive layer 710 overlaps with the vertex of the corner located on the driver side 70A of the conductive layer 710, and the orthogonal projection of the edge of the remaining portion 410 onto the conductive layer 710 and the edge of the power chip 200 are offset from each other.

[0079] In this way, by aligning the orthogonal projection of the center of the remaining portion 410 onto the conductive layer 710 with the vertex of the corner located on the driver side 70A of the conductive layer 710, stable pressing of the ejector pin 810 onto the conductive layer 710 is ensured during the packaging process, and the area of ​​the island 100 occupied by the ejector pin 810 is minimized, thereby increasing the area for arranging the power chip 200 on the island 100. In addition, by offsetting the orthogonal projection of the edge of the remaining portion 410 onto the conductive layer 710 from the edge of the power chip 200, the ejector pin 810 and the power chip 200 do not come into contact with each other during the packaging process, thereby avoiding interference between the ejector pin 810 and the power chip 200 and potentially damaging the power chip 200. This ensures normal use of the power module 10 and extends its lifespan.

[0080] For example, as shown in Figures 5 and 6, two remaining portions 410 are arranged on the first surface 401 of the package 400, and the orthogonal projections of the centers of the two remaining portions 410 onto the conductive layer 710 respectively overlap with the vertices of two corners located on the driver side 70A of the conductive layer 710. Taking the example of a case where the outer contour of the remaining portion 410 is circular, the orthogonal projection of the center of one remaining portion 410 onto the conductive layer 710 overlaps with a vertex located on the driver side 70A of the first island 101 and away from the fourth island 104, and is offset from the orthogonal projection of the power chip 200 placed on the first island 101 and the edge of the remaining portion 410 onto the conductive layer 710, while the orthogonal projection of the center of the other remaining portion 410 onto the conductive layer 710 overlaps with a vertex located on the driver side 70A of the fourth island 104 and away from the first island 101, and is offset from the orthogonal projection of the power chip 200 placed on the fourth island 104 and the edge of the remaining portion 410 onto the conductive layer 710.

[0081] In this way, in the packaging process, both ends of the conductive layer 710 in the longitudinal direction X of the power module 10 are pressed by the ejector pins 810, making it less likely to shift at either the position close to the first island 101 or the position close to the fourth island 104 of the DBC structure, ensuring that the surface of the heat dissipation layer 730 away from the conductive layer 710 is flush with the second surface 402, and better preventing resin from spilling out from the back surface of the DBC structure.

[0082] It should be understood that the number of remaining portions 410 may be one, and the arrangement method of the one remaining portion 410 may be the same as the arrangement method of the remaining portion 410 described in any of the above examples.

[0083] In some embodiments, as shown in Figures 13 and 14, the minimum distance A between the power chip 200 among the multiple power chips 200 that is closest to the residue 410 and the edge of the orthogonal projection of the residue 410 onto the conductive layer 710 satisfies A > 0.45 mm.

[0084] As an example, on the first surface 401 of the package 400, a remaining portion 410 is formed at the apex angle located on the driver side 70A corresponding to the first island 101 and away from the fourth island 104. On the first island 101, a power chip 200 close to the remaining portion 410 is arranged. The minimum distance between the upper left vertex of the power chip 200 (see FIG. 14) and the edge of the orthographic projection of the remaining portion 410 onto the conductive layer 710 is A, and A > 0.45 mm.

[0085] Among the plurality of power chips 200, when the minimum distance A between the power chip 200 closest to the remaining portion 410 and the remaining portion 410 is less than 0.45 mm, the distance between the orthographic projection of the remaining portion 410 onto the conductive layer 710 and the power chip 200 is relatively small. That is, the distance between the edge of the end face of the ejector pin 810 and the power chip 200 is relatively small in the packaging process. In this case, when the position of the ejector pin 810 is displaced, the ejector pin 810 and the power chip 200 are likely to come into contact, and there is a risk that the ejector pin 810 may crush the power chip 200. Therefore, in the embodiments of the present disclosure, the minimum distance A between the power chip 200 closest to the remaining portion 410 and the edge of the orthographic projection of the remaining portion 41 onto the conductive layer 710 is set to satisfy A > 0.45 mm. When the end of the ejector pin 810 contacts the conductive layer 710, the distance between the edge of the ejector pin 810 and the power chip 200 is controlled within a safe range, preventing the ejector pin 810 from contacting the power chip 200 and avoiding the risk of the ejector pin 810 crushing the power chip 200.

[0086] In some embodiments, as shown in FIGS. 13 and 14, the minimum distance between two adjacent power chips 200 is B, and the maximum cross-sectional dimension of the remaining portion 410 is C, and B and C satisfy B < C + 0.8 mm.

[0087] For example, the minimum distance between the power chip 200 arranged on the first island 101 and the power chip 200 arranged on the second island 102 is B, the shape of the remaining portion 410 is annular, the diameter of the outer circle is C, and B <C+0.8mmである。

[0088] When B=C+0.8 mm, the interval B between two adjacent power chips 200 can be accurately controlled within a safe range during packaging, i.e., the distance between the edge of the end of the ejector pin 810 and the power chip 200. In addition, the orthogonal projection of the center of the remaining portion 410 onto the conductive layer 710 overlaps with the apex of the corner located on the driver side 70A of the conductive layer 710. In other words, the remaining portion 410 is positioned corresponding to the apex located on the driver side 70A of the island 100, rather than between adjacent power chips 200 (i.e., adjacent islands 100). This makes it possible to further reduce the interval B between two adjacent power chips 200, thereby reducing the dimension of the conductive layer 710 in the longitudinal direction X of the power module 10 while preventing resin from spilling out, which is advantageous for miniaturizing the power module 10.

[0089] Furthermore, the maximum cross-sectional dimension C of the remaining portion 410 can be set to C=1.2 mm, and the minimum distance B between two adjacent power chips 200 can satisfy B<2 mm. For example, if the end face of the ejector pin 810 is circular and the diameter C of the ejector pin 810 is 1.2 mm, the minimum distance B between two adjacent power chips 200 in the longitudinal direction X of the power module 10 is less than 2 mm. By arranging them in this manner, the distance between two adjacent power chips 200 can be made relatively small while preventing resin from spilling out from the back surface, and the dimension of the power module 10 in the longitudinal direction X can be reduced.

[0090] 8 and 9, a plurality of release portions 430 are disposed on the second surface 402 of the package 400. The release portions 430 may be, for example, blind holes, and can avoid damage to the package 400 and deformation of the package 400 during the demolding process.

[0091] In some examples, the plurality of release portions 430 may include a plurality of first release portions 431 and a plurality of second release portions 432. The plurality of first release portions 431 and the plurality of second release portions 432 are located on both edges of the second surface 402 in the width direction Y of the power module 10, respectively, and the plurality of first release portions 431 and the plurality of second release portions 432 are both arranged at intervals along the longitudinal direction X of the power module 10. For example, the plurality of release portions 430 may include three first release portions 431 arranged at intervals along the longitudinal direction X of the power module 10 and three second release portions 432 arranged at intervals along the longitudinal direction X of the power module 10, where the first release portion 431 is located on the driver side 70A of the power module 10 and the second release portion 432 is located on the power side 70B of the power module 10.

[0092] In this way, after the packaging of the power module 10 is completed, the package 400 can be released from the mold by protruding the release pins arranged corresponding to the positions of the first release portion 431 and the second release portion 432, which is advantageous for releasing the power module 10. Furthermore, by arranging a plurality of first release portions 431 and a plurality of second release portions 432, the package 400 has release pins arranged corresponding to a plurality of positions in the longitudinal direction X and width direction Y of the power module 10, and this can improve the stability of releasing the package 400.

[0093] In another example, the plurality of release portions 430 may further include a plurality of third release portions 433 and a plurality of fourth release portions 434. The plurality of third release portions 433 and the plurality of fourth release portions 434 are located between the plurality of first release portions 431 and the plurality of second release portions 432 along the width direction Y of the power module 10. Along the longitudinal direction X of the power module 10, the plurality of third release portions 433 are located between the plurality of islands 100 and one side edge of the package 400, and the plurality of fourth release portions 434 are located between the plurality of islands 100 and the other side edge of the package 400. For example, the plurality of release portions 430 may include two third release portions 433 and two fourth release portions 434 located between the first release portion 431 and the second release portion 432 in the width direction Y of the power module 10. The two third release portions 433 are located on the side of the first island 101 away from the fourth island 104 and are spaced apart in the width direction Y of the power module 10, and the two fourth release portions 434 are located on the side of the fourth island 104 away from the first island 101 and are spaced apart in the width direction Y of the power module 10.

[0094] In this way, after the packaging of the power module 10 is completed, the release pins arranged corresponding to the positions of the third release portion 433 and the fourth release portion 434 are pushed out to release the package 400 from the mold, which is advantageous for releasing the power module 10. Furthermore, the third release portion 433 and the fourth release portion 434 are arranged in the center of the package 400, and the release pins are arranged corresponding to the edges and center of the package 400, which further improves the stability of the release of the package 400.

[0095] For example, a recessed step (the step is recessed toward the inside of the package 400) may be formed on the second surface 402 of the package 400, i.e., the second surface 402 of the package 400 may include a step surface 4021 that is spaced apart from the first surface 401 of the step, and a base surface 4022 that is spaced apart from the first surface 401 of the portion of the package that is located around the step. In this case, the plurality of first release portions 431 and the plurality of second release portions 432 may be arranged on the base surface 4022, and the plurality of third release portions 433 and the plurality of fourth release portions 434 may be arranged on the step surface 4021.

[0096] As can be seen from the above, the multiple first release portions 431 and the multiple second release portions 432 are relatively far from the central axis ab in the width direction Y of the power module 10, and the multiple third release portions 433 and the multiple fourth release portions 434 are relatively close to the central axis ab in the width direction Y of the power module 10.

[0097] 8 and 9, the plurality of third release portions 433 and the plurality of fourth release portions 434 are symmetrical about a plane with respect to the center of the package 400 in the width direction Y of the power module 10, i.e., the plurality of third release portions 433 and the plurality of fourth release portions 434 are symmetrical about a plane with respect to the center of the package 400 in the longitudinal direction X of the power module 10, i.e., the plurality of third release portions 433 and the plurality of fourth release portions 434 are symmetrical about a plane with respect to the center of the package 400 in the longitudinal direction X of the power module 10, i.e., the plurality of third release portions 433 and the plurality of fourth release portions 434 are symmetrical about a plane with respect to the left and right direction in FIG.

[0098] The above arrangement ensures that the load is uniform during the demolding process of the power module 10, enabling smooth demolding of the power module 10. In addition, the symmetrically arranged third demolding part 433 and fourth demolding part 434 are also advantageous for processing.

[0099] It should be understood that a plurality of release portions 430 are disposed on the first surface 401 of the package 400, and these release portions 430 are dimples left on the first surface 401 of the package 400 during the demolding process. The release portions 430 are uniformly distributed on the first surface 401 to ensure that the package 400 is subjected to a uniform load during the demolding process, thereby preventing the package 400 from being broken and avoiding deformation of the package 400.

[0100] 5 to 9 , the package 400 may further include two second notches 420 that may be disposed on both ends of the package 400 in the longitudinal direction X of the power module 10 to facilitate fixing of the package 400. For example, the second notches 420 may be circular or U-shaped notches, and the centers of the two second notches 420 may be disposed on the central axis ab in the width direction Y of the power module 10.

[0101] In addition, the number of each of the third release portions 433 and the fourth release portions 434 is two. In the width direction Y of the power module 10, the two third release portions 433 are located on both sides of one second cutout 420 (the second cutout 420 is located on the same side of the package 400 as the third release portion 433), and the two fourth release portions 434 are located on both sides of the other second cutout 420 (the second cutout 420 is located on the same side of the package 400 as the fourth release portion 434).

[0102] For example, if the centers of the two second notches 420 are on the central axis ab in the width direction Y of the power module 10, the two third release portions 433 are located on either side of the central axis ab and are symmetrical about the central axis ab, and the two fourth release portions 434 are also located on either side of the central axis ab and are symmetrical about the central axis ab. In this way, deformation and damage to the package 400 during the demolding process can be avoided, and the life of the sealing mold can be extended.

[0103] Taking the power module 10 shown in FIG. 8 as an example, the orthogonal projections of the centers of the two second cutouts 420 onto the second surface 402 of the package 400 are points a and b, respectively (the line connecting the two is the central axis ab described above), and the centers of the two third release portions 433 are points c and d, respectively. Point a is closer to points c and d than point b. The intersection of the second cutout 420 with the central axis ab is point e. The intersection of the line connecting points c and d with the central axis ab is point f, and point f is located between points a and e. As a result, in the longitudinal direction X of the power module 10, the two third release portions 433 are closer to the center of the package 400 than the center a of the second cutout 420 on the left side. Similarly, in the longitudinal direction X of the power module 10, the two fourth release portions 434 are closer to the center of the package 400 than the center b of the second cutout 420 on the right side. In this way, the stability of the demolding of the power module 10 can be improved, damage to the package 400 during the demolding process can be avoided, and the life of the sealing mold can be extended.

[0104] Although the package structure of the power module 10 has been described above using a DBC structure as an example, it should be understood that this package structure is also applicable to power modules with other structures. In another embodiment, the power module 10 may include a conductive layer 710, such as a copper layer, for forming the island 100, and an insulating heat dissipation layer, such as a ceramic layer, located on the side of the conductive layer 710 away from the power chip 200. The power pins 300 may be integral with the island 100. The surface of the insulating heat dissipation layer away from the conductive layer is flush with the second surface 402 of the package 400, and the surface of the insulating heat dissipation layer away from the conductive layer is exposed on the bottom surface of the package 400. In this way, heat generated in the power chip 200 is transferred to the insulating heat dissipation layer via the conductive layer, and heat exchange with the outside occurs via the insulating heat dissipation layer, allowing the heat to be rapidly dissipated. In addition, the ejector pin 810 of the sealing mold is pressed against the surface of the conductive layer away from the insulating heat dissipation layer, and a remaining portion 410 can be formed on the first surface 401 of the package 400 after packaging is completed. The arrangement of the mold release portion 430 and the second notch 420 is the same as in the above-described embodiment, so a description thereof will be omitted here.

[0105] An embodiment of the present disclosure provides an electronic device to which at least one of the power modules described above can be applied. As shown in Fig. 16, the electronic device 1000 may include a power module 10 and a controller 20 connected to the power module 10.

[0106] For example, the controller 20 can generate a control signal according to a user command and send the control signal to the power module 10, and the power module 10 can generate a drive signal according to the control signal and output it to a corresponding drive target to perform a corresponding function.

[0107] The electronic device according to the embodiment of the present disclosure has the same technical effects as the power module according to the embodiment described above that is included therein, and therefore a description thereof will be omitted.

[0108] In the description of this disclosure, a first feature being "above" or "below" a second feature may include direct contact between the first and second features, or may include contact between the first and second features through another feature between them, rather than direct contact. A first feature being "above," "above," and "above" a second feature may include the first feature being directly above and diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature.

[0109] In describing this disclosure, orientations or positional relationships indicated by the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," etc. are orientations or positional relationships indicated based on the drawings and do not indicate or imply that the devices or elements shown have a particular orientation or are required to be configured and operate in a particular orientation, but are merely intended to facilitate and simplify the description of the invention.

[0110] While embodiments of the present disclosure have been illustrated and described, it will be understood that those skilled in the art can make various changes, modifications, substitutions and variations to these embodiments without departing from the principles and scope of the present invention, the scope of which is defined by the claims and their equivalents.

[0111] Those skilled in the art will appreciate that the scope of the present disclosure is not limited to the particular examples described above, and that modifications and substitutions can be made to specific elements of the examples without departing from the spirit of the present application. The scope of the present disclosure is limited by the claims.

Claims

1. A power module, a plurality of islands including die bond portions and pin bond portions; a plurality of power chips disposed on die bonding portions of the plurality of islands; a plurality of power pins connected to corresponding pin bond portions of the plurality of islands; a pin bond portion of at least one island having a first hypotenuse, a portion of at least one power pin adjacent to the island connected to the power pin being welded to the pin bond portion of the island and having a second hypotenuse, the second hypotenuse corresponding to the first hypotenuse, and an orthogonal projection of the second hypotenuse onto a plane in which the island is located being substantially parallel to an orthogonal projection of the first hypotenuse onto the plane in which the island is located; Power module.

2. the plurality of islands include a first island, a second island, a third island, and a fourth island that are sequentially arranged at intervals along a longitudinal direction of the power module; the plurality of power pins include a first power pin, a second power pin, a third power pin, and a fourth power pin, one end of the first power pin welded to a pin bond portion of the first island, one end of the second power pin welded to a pin bond portion of the second island, one end of the third power pin welded to a pin bond portion of the third island, and one end of the fourth power pin welded to a pin bond portion of the fourth island; a pin bond portion of at least one of the first island, the second island, and the third island has a first hypotenuse, and at least one power pin connected to the at least one island among the first power pin, the second power pin, and the third power pin has a second hypotenuse; The power module according to claim 1 .

3. an area of ​​the fourth island is larger than areas of the first island, the second island, and the third island; the pin bond portion of the first island and the pin bond portion of the second island each have a first hypotenuse, and the first power pin and the second power pin each have a second hypotenuse corresponding to the first hypotenuse of the pin bond portion of the first island and the first hypotenuse of the pin bond portion of the second island, respectively; The power module according to claim 2 .

4. the second island further includes a first connection portion obliquely connected between the die bond portion and the pin bond portion, the first connection portion having a third oblique side adjacent to the first island and a fourth oblique side adjacent to the third island; the third oblique side is parallel to the first oblique side of the pin bond portion of the first island, and the fourth oblique side is collinear with the first oblique side of the pin bond portion of the second island. The power module according to claim 3 .

5. the third island further includes a second connection portion obliquely connected between the die bond portion and the pin bond portion, the second connection portion having a fifth oblique side adjacent to the second island, and the fifth oblique side being parallel to a first oblique side of the pin bond portion of the second island; The power module according to claim 3 .

6. the second connection portion further has a sixth oblique side adjacent to the fourth island; the die bonding portion of the fourth island has a seventh oblique side adjacent to the third island, and the sixth oblique side is parallel to the seventh oblique side; The power module according to claim 5 .

7. the power pin includes a fixed portion, a bent portion, a terrace portion, and a lead portion, which are connected in this order; the fixed portion is welded to the pin bond portion, the bent portion is connected between the fixed portion and the terrace portion, the lead-out portion is connected to one end of the terrace portion remote from the bent portion, and the fixed portion has the second oblique side. The power module according to any one of claims 1 to 6.

8. the terrace portion includes a first notch disposed at a position adjacent to the bent portion of the terrace portion; The power module according to claim 7.

9. the terrace portion has a through hole disposed on a side of the terrace portion adjacent to the drawn-out portion, The power module according to claim 7.

10. a driver frame including at least one driver pad and a plurality of driver pins; a driver chip disposed on the at least one driver pad; a package disposed outside the driver frame, the islands, and the power pins; the plurality of driver pins and the plurality of power pins are located on both sides in a width direction of the power module, and free ends of the plurality of driver pins and free ends of the plurality of power pins protrude from the package. The power module according to any one of claims 1 to 8.

11. a conductive layer, an insulating layer, and a heat dissipation layer stacked along a thickness direction of the power module, the plurality of islands being a plurality of portions of the conductive layer; the conductive layer is disposed adjacent to the power chip, and a surface of the heat dissipation layer remote from the conductive layer is flush with a bottom surface of the package, and the heat dissipation layer is exposed to the bottom surface of the package. The power module according to claim 10.

12. the package has a first surface and a second surface, the conductive layer is adjacent to the first surface, and the heat dissipation layer is adjacent to the second surface; At least one remainder is disposed on the first surface. The power module according to claim 11.

13. the conductive layer includes a driver side and a power side located on both sides in a width direction of the power module, an orthogonal projection of a center of the remaining portion onto the conductive layer overlaps with a vertex of a corner located on the driver side of the conductive layer, and an orthogonal projection of an edge of the remaining portion onto the conductive layer is misaligned with an edge of the power chip. The power module according to claim 12.

14. the at least one remaining portion is two remaining portions, and orthogonal projections of centers of the two remaining portions onto the conductive layer respectively coincide with vertices of two corners located on the driver side of the conductive layer; The power module according to claim 13.

15. a minimum distance A between a power chip among the plurality of power chips that is closest to the remaining portion and an edge of an orthogonal projection of the remaining portion onto the conductive layer satisfies A>0.45 mm; The power module according to any one of claims 12 to 14.

16. The minimum distance between two adjacent power chips is B, the maximum cross-sectional dimension of the remaining portion is C, and B and C satisfy B<C+0.8 mm. The power module according to any one of claims 12 to 14.

17. A plurality of release portions are disposed on a second surface of the package, the plurality of release portions comprising: a plurality of first release portions and a plurality of second release portions located on both edges of the second surface in a width direction of the power module; a plurality of third release portions and a plurality of fourth release portions located between the plurality of first release portions and the plurality of second release portions along a width direction of the power module, the plurality of first release portions are arranged at intervals along the longitudinal direction of the power module, the plurality of second release portions are arranged at intervals along the longitudinal direction of the power module, the plurality of third release portions are located between the plurality of islands and one side edge of the package, and the plurality of fourth release portions are located between the plurality of islands and the other side edge of the package along the longitudinal direction of the power module. The power module according to any one of claims 12 to 16.

18. the plurality of third release portions and the plurality of fourth release portions are planarly symmetrical with respect to the center of the package in the width direction of the power module, and / or the plurality of third release portions and the plurality of fourth release portions are planarly symmetrical with respect to a center of the package in the longitudinal direction of the power module.

18. The power module according to claim 17.

19. the package includes two second notches located at both ends of the package in the longitudinal direction of the power module, the plurality of third release portions are two third release portions, and the two third release portions are located on both sides of one second cutout that is located on the same side of the package as the two third release portions in the width direction of the power module; the plurality of fourth release portions are two fourth release portions, and the two fourth release portions are located on both sides of another second notch located on the same side of the package as the two fourth release portions in the width direction of the power module; 18. The power module according to claim 17.

20. A power module comprising the power module according to any one of claims 1 to 19. electronic equipment.

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