Semiconductor Process Equipment

Abstract

The substrate processing station includes a housing including a transfer region and a process region. The process station further includes a magnetic levitation assembly disposed in the transfer region configured to levitate and propel the substrate carrier. The magnetic levitation assembly includes first track segments including first rails disposed within the transfer region and below the process region, each of the first rails including a first plurality of magnets. The process station further includes a pedestal assembly including a pedestal disposed within the housing. The pedestal is movable between a pedestal transfer position and a process position, where the pedestal is disposed between the first rails to receive a substrate from a substrate carrier, and where the pedestal is movable between the first rails to position the received substrate within the process region.

Description

[Technical Field]

[0001] FIELD OF THE INVENTION The embodiments disclosed herein generally relate to semiconductor processing equipment used to transport semiconductor substrates. [Background technology]

[0002] Semiconductor devices are typically formed on a semiconductor substrate using multiple process chambers, with each process chamber being used to complete one or more of the various steps (e.g., deposition) to form a semiconductor device such as a memory chip. A substrate transfer system is typically used to move the substrate between each process chamber. The process chambers and the substrate transfer system can each be held under vacuum. Two common arrangements used for substrate transfer systems include a cluster arrangement and a linear arrangement.

[0003] A substrate transfer system using a cluster configuration includes a central region surrounded by different process chambers. The central region is connected to a load lock chamber, which can maintain a vacuum environment within the substrate transfer system as substrates are loaded into and removed from the substrate transfer system. The central region, or transfer chamber, typically also includes a fixed robot that rotates about a central axis to move substrates to and from the load lock chamber and between the process chambers. These conventional robots are often limited to transferring only one or two substrates at a time, and the footprint of the central region can be large because the robot must rotate and extend into the process chambers without interfering with the walls of the central region chamber in which it resides. These types of conventional robots can also be a source of undesirable particles.

[0004] Substrate transfer systems using linear configurations typically include a rectangular-top conveyor with process chambers on one or both sides of the conveyor. The conveyor is connected to a load lock chamber, which can maintain a vacuum environment within the substrate transfer system as substrates are loaded into and removed from the substrate transfer system. One or more robots are located near each of the process chambers and can transfer substrates between the conveyor and the process chambers. The conveyors used in these linear substrate transfer systems can be a source of particles and require regular and complex maintenance to ensure the conveyor is operating properly. Furthermore, the conveyor can only move in one direction at a time, which can limit substrate movement on the conveyor and reduce throughput.

[0005] Therefore, there is a need for an improved substrate transfer system that reduces particle generation, reduces footprint, and increases throughput. Summary of the Invention

[0006] The present disclosure generally relates to substrate processing apparatus that includes transporting a carrier having objects disposed thereon into a station and transferring the objects from the carrier to a pedestal by a magnetic levitation assembly.

[0007] In one embodiment, a substrate processing station includes a housing including a transfer region and a process region. The process station further includes a magnetic levitation assembly disposed in the transfer region configured to levitate and propel a substrate carrier. The magnetic levitation assembly includes first track segments including first rails disposed within the transfer region and below the process region, each of the first rails including a first plurality of magnets. The process station further includes a pedestal assembly including a pedestal disposed within the housing. The pedestal is movable between a pedestal transfer position and a process position, where the pedestal is disposed between the first rails to receive a substrate from a substrate carrier, and where the pedestal is movable between the first rails to position the received substrate within the process region.

[0008] In one embodiment, a method for processing a substrate in a substrate processing station includes moving a carrier with a substrate disposed thereon to a carrier transfer position in the substrate processing station to position the substrate above a pedestal. The carrier is moved by a magnetic levitation assembly disposed in the substrate processing station. The method further includes moving the pedestal from a first position to a pedestal transfer position below the substrate. The method further includes extending lift pins to lift the substrate from a substrate support surface of the carrier. The method further includes moving the carrier to a standby position in the substrate processing station using the magnetic levitation assembly. The method further includes retracting the lift pins to lower the substrate onto the substrate support surface of the pedestal. The method further includes moving the pedestal to a process position to position the substrate in a process region of the substrate processing station. The method further includes processing the substrate in the process region.

[0009] In one embodiment, a substrate processing station includes a housing including a transfer region and a process region. The process station further includes a source assembly. The process station further includes a magnetic levitation assembly disposed in the transfer region. The magnetic levitation assembly includes a first track segment including a first plurality of electromagnets and a second track segment including a second plurality of electromagnets. The process station further includes a pedestal assembly disposed within the housing, the pedestal assembly including a pedestal, an actuator assembly, and lift pins. The process station further includes a controller including a non-transitory computer-readable medium including instructions that, when executed by one or more processors of the controller, cause the substrate processing station to perform operations. The operations include activating one or more of the first plurality of electromagnets to move a carrier with a substrate disposed thereon to a carrier transfer position above the pedestal. The operations further include activating the actuator assembly to move the pedestal from the first position to a pedestal transfer position below a substrate disposed on the carrier. The operations further include extending the lift pins to disengage the substrate from the carrier. The operations further include actuating one or more of the first plurality of electromagnets and one or more of the second plurality of electromagnets to move the carrier from the carrier transfer position to a carrier waiting position in the substrate processing station. The operations further include retracting the lift pins to position the substrate on a surface of the pedestal. The operations further include actuating the actuator assembly to move the pedestal to a process position and position the substrate in the process region. The operations further include actuating the source assembly to process the substrate in the process region.

[0010] In one embodiment, a substrate processing station includes a housing including a transfer region and a process region. The process station further includes a magnetic levitation assembly disposed in the transfer region configured to levitate and propel the carrier. The magnetic levitation assembly includes a first track segment including first rails disposed within the transfer region and below the process region, each of the first rails including a first plurality of magnets. The process station further includes a pedestal assembly including a pedestal disposed within the housing, the pedestal movable between a pedestal transfer position and a process position, the pedestal disposed between the first rails at the pedestal transfer position to receive objects from the carrier, the pedestal movable between the first rails.

[0011] In one embodiment, a method for transferring an object within a substrate processing station includes moving a carrier with an object disposed thereon to a carrier transfer position within the substrate processing station to position the object above a pedestal. The carrier is moved by a magnetic levitation assembly disposed within the substrate processing station. The method further includes moving the pedestal from a first position to a pedestal transfer position below the substrate. The method further includes extending lift pins to lift the object from a support surface of the carrier. The method further includes moving the carrier to a standby position within the substrate processing station using the magnetic levitation assembly. The method further includes retracting the lift pins to lower the object onto the support surface of the pedestal. The method further includes moving the pedestal to a process position.

[0012] In one embodiment, the substrate station includes a housing including a transport region. The substrate station further includes a magnetic levitation assembly disposed within the transport region and configured to levitate and propel the substrate carrier. The magnetic levitation assembly includes a first track segment including a first rail and a second rail. The magnetic levitation assembly further includes a first actuator attached to each first rail, where each first actuator is configured to move the corresponding first rail between a first upper position and a first lower position relative to the housing. The magnetic levitation assembly further includes a second actuator attached to each second rail, where each second actuator is configured to move the corresponding second rail between a second upper position and a second lower position relative to the housing.

[0013] In one embodiment, the substrate station includes a housing including a transport region. The substrate station further includes a magnetic levitation assembly disposed within the transport region and configured to levitate and propel the substrate carrier. The magnetic levitation assembly includes a first magnetic track segment configured to propel the carrier within the transport region in a first axial direction, the first track segment rotatable relative to the housing to propel the carrier within the transport region in a second axial direction.

[0014] In one embodiment, the substrate station includes a housing including a transport region. The substrate station further includes a first track segment disposed within the transport region. The first track segment includes a pair of first rails, each of which includes a plurality of first electromagnets configured to transport the substrate carrier in a first axial direction and a plurality of first permanent magnets configured to levitate the substrate carrier. The first track segment further includes a pair of second rails perpendicular to the pair of first rails, each of which includes a plurality of second electromagnets configured to transport the substrate carrier in a second axial direction and a plurality of second permanent magnets configured to levitate the substrate carrier.

[0015] In one embodiment, a substrate processing system includes at least one processing line, the at least one processing line including a first station, a second station, a third station, and a fourth station, each including a first magnetic levitation assembly configured to change an axial direction of movement of a substrate carrier from a first axial direction of movement to a second axial direction of movement, the at least one processing line further including at least one substrate processing station disposed between the second station and the third station, the at least one substrate processing station including a second magnetic levitation assembly configured to move the substrate carrier.

[0016] In one embodiment, a substrate processing system includes a first processing line including a first processing station arrangement including a plurality of first processing stations including a magnetic rail configured to move a first carrier in a first axial direction. The substrate processing system further includes a second processing line including a second processing station arrangement including a plurality of second processing stations including a second magnetic rail configured to move a second carrier in the first axial direction. The substrate processing system further includes a central arrangement of stations shared by the first processing line and the second processing line and disposed between the first and second processing station arrangements. The central arrangement of stations includes a plurality of stations including magnetic levitation assemblies configured to move the first and second carriers in the first axial direction and to move the first and second carriers in the second axial direction.

[0017] In one embodiment, a substrate processing system includes a first plurality of linearly arranged stations. A substrate carrier is transportable through the first plurality of stations in a first linear direction along a first transport surface along a plurality of magnetic rails. The substrate carrier is movable between positions along the first linear direction within each of the first plurality of stations by the magnetic rails. At least one of the plurality of stations includes a housing including a transport region and a process region, and at least two of the plurality of magnetic rails are disposed in the transport region and configured to levitate and propel the substrate carrier. At least one of the plurality of stations further includes a pedestal assembly including a pedestal disposed within the housing, the pedestal being movable between a substrate loading position and a process position.

[0018] In one embodiment, the substrate processing station includes a housing including a transfer region and a first process region. The substrate processing station further includes a first magnetic levitation assembly disposed in the transfer region configured to levitate and propel the first carrier, the first magnetic levitation assembly including a first pair of magnetic rails disposed in the transfer region and below the first process region. The substrate processing station further includes a second magnetic levitation assembly disposed in the transfer region below the first magnetic levitation assembly configured to levitate and propel the second carrier, the second magnetic levitation assembly including a second pair of magnetic rails. The substrate processing station further includes a first pedestal disposed in the housing. The first pedestal, movable between a pedestal transfer position and a process position, is disposed between the first rail and the second rail at the pedestal transfer position to receive the first substrate from the first carrier. The first pedestal is then raised between the first rail and the second rail to place the received first substrate at a process position in the first process region.

[0019] In one embodiment, a substrate processing system includes a station arrangement including a plurality of stations, each station including a first magnetic levitation assembly and a second magnetic levitation assembly disposed in a transport region of the station. The first magnetic levitation assembly is aligned to transport a first carrier along a first transport surface. The second magnetic levitation assembly is aligned to transport the first carrier along a second transport surface. The substrate processing system further includes a first lift station and a second lift station located at opposite ends of the station arrangement, the first and second lift stations configured to move the first carrier between the first transport surface and the second transport surface.

[0020] In one embodiment, a method of operating a substrate support system includes transferring a first substrate from a first carrier onto a first pedestal at a first station. The method further includes processing the first substrate at the first station while it is disposed on the first pedestal. The method further includes transferring the first substrate from the first pedestal onto the first carrier. The method further includes transporting the first carrier with the first substrate disposed thereon into a second station along a first transport surface, the first carrier being transported using first magnetic levitation assemblies disposed in the transport regions of both the first and second stations. The method further includes transporting a second carrier with a second substrate disposed thereon from the second station to the first station along a second transport surface, the second carrier being transported using second magnetic levitation assemblies disposed in the transport regions of both the first and second stations.

[0021] In one embodiment, the shutter station includes a housing including a transport region. The shutter station further includes a first magnetic levitation assembly disposed in the transport region configured to levitate and propel the first carrier. The shutter station further includes a shutter garage coupled to the housing. The shutter station further includes an arm movable from a first position to a second position, wherein a substrate supported on the arm is disposed in the shutter garage when the arm is in the first position. The shutter station further includes a pedestal disposed in the transport region and movable to a transfer position to receive a shutter disk disposed on the arm at the second position, wherein the shutter disk is disposed above the pedestal when the arm is in the second position.

[0022] In one embodiment, the shutter station includes a housing including a transport region. The shutter station further includes a first magnetic levitation assembly disposed within the transport region and configured to levitate and propel the first carrier between a standby position and a carrier transfer position. The shutter station further includes a shutter assembly. The shutter assembly includes a shutter carriage including a first support member configured to support the first shutter disk. The shutter assembly further includes an actuation assembly configured to move the shutter carriage within the housing. The shutter carriage is movable from a first position to a second position to position the first shutter disk at the first shutter transfer position above the first carrier. The shutter carriage is movable from the second position to a third position while the first carrier is in the standby position to engage the first shutter disk with the first carrier and disengage the first shutter disk from the first support member.

[0023] In one embodiment, a method for transferring a shutter to a carrier includes moving an arm, on which a shutter disk is disposed, from a first position to a second position to position the shutter disk above a pedestal. The method further includes extending a plurality of lift pins coupled to the pedestal into recesses in the arm to engage with the shutter disk and disengage the shutter disk from the arm. The method further includes moving the arm to the first position after the shutter disk is disengaged from the arm. The method further includes retracting the plurality of lift pins to engage the shutter disk with a carrier levitated above a magnetic levitation assembly.

[0024] In one embodiment, the station includes a housing including a transfer region and a process region. The station further includes a first carrier. The first carrier includes a base including a plurality of first magnets and a port formed in the base. The first carrier further includes a plurality of substrate support assemblies coupled to the base. Each support assembly includes a second magnet and a support member attached to the second magnet, the support member being movable between an extended position and a retracted position relative to the base. The station further includes a first magnetic levitation assembly disposed in the transfer region including a plurality of third magnets configured to interact with the plurality of first magnets to levitate and propel the first carrier. The magnetic levitation assembly further includes a fourth magnet for each substrate support assembly selectively interacting with the second magnet to move the support member to the retracted position. The station includes a pedestal assembly disposed in the transfer region, the pedestal being extendable through the port to the process position.

[0025] In one embodiment, the carrier includes a base, a plurality of first magnets arranged around an edge of the base, and a port formed in the base. The carrier further includes a plurality of substrate support assemblies coupled to the base. Each support assembly includes a second magnet and a support member attached to the second magnet, the support member being movable between an extended position and a retracted position relative to the base. Each support member is configured to support a substrate in the extended position.

[0026] In one embodiment, a method of operating a station includes using a magnetic levitation assembly to position a carrier above a pedestal, wherein the substrate is engaged with a plurality of support members in an extended position. The method further includes extending a plurality of lift pins coupled to the pedestal to disengage the substrate from the plurality of support members. The method further includes actuating a plurality of first electromagnets of the magnetic levitation assembly to move the plurality of support members to a retracted position. The method further includes moving the pedestal to a process position through a port formed in the carrier to place the substrate in a process region of the station.

[0027] So that the above aspects may be achieved and understood in detail, a more particular description of the embodiments described hereinabove briefly summarized may be had by reference to the accompanying drawings.

[0028] It should be noted, however, that the attached drawings illustrate typical embodiments and are therefore not to be considered limiting, as other equally effective embodiments are contemplated. [Brief explanation of the drawings]

[0029] [Figure 1A] 1 is a cross-sectional side view of a process station having a carrier positioned therein that is levitated above a magnetic levitation rail, according to one embodiment. [Figure 1B] 1B is a cross-sectional top view of a process station having a carrier disposed therein levitated above a magnetic levitation rail, according to the embodiment of FIG. 1A. [Figure 1C] 1B is a cross-sectional side view of a process station having a carrier with a substrate positioned at a carrier transfer position according to the embodiment of FIG. 1A. [Figure 1D] 1B is a cross-sectional side view of a process station with a carrier in a carrier transfer position and a substrate disengaged from the carrier, according to the embodiment of FIG. 1A. [Figure 1E] 1B is a cross-sectional side view of a process station with a carrier in a carrier standby position according to the embodiment of FIG. 1A. [Figure 1F] 1B is a cross-sectional side view of a process station with a substrate positioned in a process region according to the embodiment of FIG. 1A. [Figure 1G] 1B is a cross-sectional side view of a process station with a substrate lowered from the process region into the transfer region, according to the embodiment of FIG. 1A. [Figure 1H] 1B is a cross-sectional side view of a process station with a carrier in a carrier transfer position and a substrate disengaged from the carrier, according to the embodiment of FIG. 1A. [Figure 1I] 1B is a cross-sectional side view of the process station with the substrate returned onto the carrier in the carrier transfer position according to the embodiment of FIG. 1A. [Figure 2A] 1 is a partial cross-sectional top view of an arrangement of stations with a substrate disposed on a carrier located at a first station, according to one embodiment. [Figure 2B] 2B is a partial cross-sectional side view of a station arrangement according to the embodiment of FIG. 2A. [Figure 2C] 2B is a partial cross-sectional side view of the station arrangement showing a carrier levitated by a first rack segment of a second station of the station arrangement according to the embodiment of FIG. 2A. [Figure 2D] 2B is a partial cross-sectional side view of the station arrangement illustrating the change in position of the rails of the first track segments of the second and third stations of the station arrangement according to the embodiment of FIG. 2A. FIG. [Figure 2E]2B is a partial cross-sectional side view of the station arrangement illustrating the change in position of the rails of the first track segments of the second and third stations of the station arrangement according to the embodiment of FIG. 2A. FIG. [Figure 2F] 2B is a partial cross-sectional side view of the station arrangement showing the carrier moved from the second station into the third station of the station arrangement according to the embodiment of FIG. 2A. [Figure 2G] 2B is a partial cross-sectional side view of the station arrangement illustrating the change in position of the rails of the first track segments of the second and third stations of the station arrangement according to the embodiment of FIG. 2A. FIG. [Figure 2H] 2B is a partial cross-sectional side view of the station arrangement illustrating the change in position of the rail of the first track segment for the second and third stations of the station arrangement according to the embodiment of FIG. 2A. FIG. [Figure 2I] A partial top cross-sectional view of the station arrangement showing a substrate on a carrier positioned at a fourth station after passing through the first, second, and third stations of the station arrangement according to the embodiment of Figure 2A. [Figure 3A] 1 is a partial cross-sectional side view of a process station, according to one embodiment. [Figure 3B] 3B is a cross-sectional top view of the process station with the first track segment in a first position according to the embodiment of FIG. 3A. [Figure 3C] 3B is a cross-sectional top view of the process station with the first track segment in a second position according to the embodiment of FIG. 3A. [Figure 4A] 1 is a partial cross-sectional top view of an arrangement of stations with a substrate disposed on a carrier in a first station, according to one embodiment. [Figure 4B] 4B is a partial cross-sectional top view of a station arrangement in which a substrate is disposed on a carrier in the second station, according to the embodiment of FIG. 4A. [Figure 4C]4B is a partial top cross-sectional view of the station arrangement after rotating the carrier and substrate within the second station according to the embodiment of FIG. 4A. [Figure 4D] 4B is a partial cross-sectional top view of an arrangement of stations with substrates disposed on carriers in the third station according to the embodiment of FIG. 4A. [Figure 4E] FIG. 4B is a partial top cross-sectional view of a station arrangement with a carrier and substrate disposed at a fourth station according to the embodiment of FIG. 4A. [Figure 5A] 1 is a partial cross-sectional top view of an arrangement of stations with a substrate disposed on a carrier in a first station, according to one embodiment. [Figure 5B] 5B is a partial cross-sectional top view of a station arrangement in which a substrate is disposed on a carrier in the second station, according to the embodiment of FIG. 5A. [Figure 5C] 5B is a partial cross-sectional top view of an arrangement of stations with substrates disposed on carriers in the third station according to the embodiment of FIG. 5A. [Figure 5D] FIG. 5B is a partial top cross-sectional view of an arrangement of stations with substrates disposed on carriers in the fourth station according to the embodiment of FIG. 5A. [Figure 6A] 1 is a schematic top view of a substrate processing system, according to one embodiment. [Figure 6B] 6B is a partial cross-sectional top view of a substrate processing system according to the embodiment of FIG. 6A. [Figure 7] 1 is a schematic top view of a substrate processing system, according to one embodiment. [Figure 8] 1 is a schematic top view of a substrate processing system, according to one embodiment. [Figure 9] 1 is a schematic top view of a substrate processing system, according to one embodiment. [Figure 10A] 1 is a schematic top view of a substrate processing system, according to one embodiment. [Figure 10B] 1 is a schematic top view of a substrate processing system, according to one embodiment. [Figure 10C]1 illustrates a top view of a substrate processing system, according to one embodiment. [Figure 10D] 1 illustrates a top view of a substrate processing system, according to one embodiment. [Figure 10E] 1 illustrates a top view of a substrate processing system, according to one embodiment. [Figure 11A] 1 is a schematic top view of a substrate processing system, according to one embodiment. [Figure 11B] 1 illustrates a top cross-sectional view of a process station that can be included in a substrate processing system, according to one embodiment. [Figure 12] 1 is a schematic top view of a substrate processing system, according to one embodiment. [Figure 13A] 1 is a schematic top view of a substrate processing system, according to one embodiment. [Figure 13B] 13B is a partial cross-sectional side view of a substrate processing system according to the embodiment of FIG. 13A. [Figure 14] 1 is a schematic top view of a substrate processing system, according to one embodiment. [Figure 15] 1 is a schematic top view of a substrate processing system, according to one embodiment. [Figure 16] 1 is a schematic top view of a branched arrangement of stations that may be included in a substrate processing system, according to one embodiment. [Figure 17A] FIG. 1 is a cross-sectional side view of a station according to one embodiment. [Figure 17B] 17B is a top cross-sectional view of a station according to the embodiment shown in FIG. 17A. [Figure 18A] 1 is a schematic top view of a substrate processing system, according to one embodiment. [Figure 18B] 18B is a partial cross-sectional side view of a substrate processing system according to the embodiment of FIG. 18A. [Figure 19A] FIG. 1 is a cross-sectional side view of a station according to one embodiment. [Figure 19B] 19B is a top cross-sectional view of a station according to the embodiment shown in FIG. 19A. [Figure 20] 1 is a schematic top view of a substrate processing system, according to one embodiment. [Figure 21A]FIG. 10 is a top cross-sectional view of a shutter station according to one embodiment. [Figure 21B] FIG. 21B is a side cross-sectional view of a shutter station according to the embodiment of FIG. 21A. [Figure 22A] 1 is a cross-sectional side view of a shutter station according to one embodiment with the carrier in a standby position and the shutter carriage in a first position. [Figure 22B] 21B is a cross-sectional side view of a shutter station according to the embodiment of FIG. 21A with the carrier in a carrier transfer position and the shutter carriage in a second position. [Figure 22C] 21B is a side cross-sectional view of the shutter station according to the embodiment of FIG. 21A with the carrier in a carrier transfer position and the shutter carriage in a third position. [Figure 23A] 1 is a cross-sectional side view of a station according to one embodiment showing a carrier supporting a substrate levitated above a pair of magnetic rails. [Figure 23B] 23B is a cross-sectional top view of a station according to the embodiment of FIG. 23A, showing a carrier supporting a substrate levitated above a pair of magnetic rails. [Figure 23C] 23C is a cross-sectional side view of a station according to the embodiment of FIG. 23B, showing a substrate positioned within a process region of the station. [Figure 24A] 1 is a cross-sectional view of a station according to one embodiment. [Figure 24B] FIG. [Figure 24C] 24B is a cross-sectional view of a station according to the embodiment of FIG. 24A showing the substrate disengaged from the carrier. [Figure 25A] 1 is a cross-sectional side view of a process station with a deposition ring positioned above a carrier levitated to a carrier transfer position above an internally positioned magnetic levitation rail, according to one embodiment. [Figure 25B] 25B is a cross-sectional side view of a process station with a carrier in a parked position and a deposition ring positioned on a pedestal, according to the embodiment of FIG. 25A. [Figure 26]1 is a flowchart of a method for moving a substrate. [Figure 27] 10 is a flowchart of a method of operating a substrate station. DETAILED DESCRIPTION OF THE INVENTION

[0030] The present disclosure relates generally to semiconductor processing equipment used to transfer semiconductor substrates between process stations. More particularly, embodiments disclosed herein relate to a system used to transfer semiconductor substrates between process stations using a transport device that employs one or more magnetic levitation elements.

[0031] Using magnetic levitation to transport substrates between process chambers offers many advantages. First, magnetic levitation, in some embodiments, enables a reduced footprint design by eliminating the robots typically used to transfer substrates into and out of process chambers. Reducing the footprint of a substrate processing system can reduce the capital costs of the substrate processing system, as well as the operation and maintenance costs of the system, and can reduce the costs associated with the tool's footprint in a semiconductor fab.

[0032] Using magnetic levitation to transport substrates reduces particle and contamination generation compared to mechanical systems with moving parts and vacuum-compatible greases, which can generate particles and outgassing in a vacuum environment. For example, moving a central conveyor to transport substrates between process chambers can generate particles from the relative movement of the conveyor with respect to its supporting components and from contact between the substrate and the conveyor. The generated particles and contamination can adversely affect product quality and potentially reduce production yields.

[0033] Using magnetic levitation to transport substrates between stations increases the throughput of a substrate processing system. In conventional substrate processing systems, substrates are transferred between processing chambers by one or more robot arms. For example, a substrate may be picked up from a load lock by a first robot arm, transferred from the first robot arm to a second robot arm, and then placed into a chamber, such as a process chamber, by the second robot arm. Each transfer of a substrate consumes time that can be used to process the substrate. As a result, each transfer increases the time required to process a substrate. Using magnetic levitation to transport substrates between stations in a substrate processing system eliminates the robot arm. Furthermore, the amount of time it takes to transport a substrate between stations using magnetic levitation is significantly less than the amount of time it takes to transport a substrate by a robot arm. It is believed that the use of magnetic levitation can increase the throughput of a substrate processing system by up to 50% or more.

[0034] 1A-1I illustrate an exemplary process station 100 that can be used to process substrates. An XYZ coordinate system is included in FIGS. 1A-1I to illustrate the axial directions of movement of the components of the process station 100 and the carrier 130 being transported within the process station 100. FIG. 1A illustrates a cross-sectional view of the process station 100. As shown in FIG. 1A, the process station 100 includes a housing 102, a first slit valve 104, a second slit valve 105, a magnetic levitation assembly 120, a source assembly 170, a process kit assembly 180, and a pedestal assembly 190. A controller 101 communicates with the process station 100 and controls one or more components of the process station 100. An opening 106 is formed in the top wall of the housing 102 between the magnetic levitation assembly 120 and the source assembly 170.

[0035] A transport region 112 is formed within the housing 102. The transport region 112 has sufficient dimensions to enable a magnetic levitation assembly 120 disposed therein to levitate a carrier 130 without contacting the walls of the housing 102. The transport region 112 extends from the first slit valve 104 to the second slit valve 105.

[0036] The magnetic levitation assembly 120 is disposed within a transport region 112 formed within one or more walls of the housing 102. A first slit valve 104 and a second slit valve 105 are disposed at opposite ends of the transport region 112. The slit valves 104, 105 are selectively opened to allow the carrier 130 to enter and exit the process station 100. The slit valves 104, 105 are also selectively closed to isolate the process station 100 from the external environment and / or another station. The transport region 112 can be in communication with a vacuum pump 114 for evacuating the transport region 112. For example, the vacuum pump 114 can maintain a pressure within the transport region 112 at approximately 10 -3 The vacuum pump 114 may be a turbopump, a cryopump, a roughing pump, or any other useful device capable of maintaining the desired pressure within the transfer region 112.

[0037] The carrier 130, on which the substrate 140 is disposed, can be transported into the transfer region 112 while the first slit valve 104 is in the open position so that the carrier 130 levitates above the magnetic levitation assembly 120. The magnetic levitation assembly 120 levitates the carrier 130 and selectively moves the carrier 130 linearly to one or more positions along an axial direction (e.g., the Y direction) within the transfer region 112. The carrier 130 is movable to a carrier transfer position (FIG. 1C) to transfer the substrate 140 to a pedestal assembly 190. Once the substrate 140 has been transferred to the pedestal assembly 190, the carrier 130 moves to a carrier waiting position (FIG. 1E). The pedestal assembly 190 is actuated to lift the substrate in the Z direction and position the substrate within the process region 160 of the source assembly 170 for processing (FIG. 1F). After the process is complete, the pedestal assembly 190 returns the substrate 140 into the transfer region 112 where it is transferred back onto the carrier 130 .

[0038] The carrier 130 includes a base 131 and a substrate support surface 132. The base 131 includes a plurality of magnets 134, such as a plurality of permanent magnets. The plurality of magnets 134 may be positioned adjacent to an edge of the base 131 so that the magnets 134 can interact with at least one rail 124, 126 of the magnetic levitation assembly 120. In some configurations, the plurality of magnets 134 may be arranged to form a Halbach array or other similar configuration. A substrate 140 can be placed on the substrate support surface 132 of the carrier 130. The carrier 130 may include one or more slots 133 formed in the substrate support surface 132, as shown in FIG. 1B. Lift pins 198 of the pedestal assembly 190 can be inserted through the corresponding slots 133 to engage the bottom surface of the substrate 140 when the carrier 130 is in the carrier transfer position, as shown in FIG. 1D. In some embodiments, the substrate support surface 132 does not include the slots 133 and instead is shaped, such as with a hemispherical recess, to allow the lift pins 198 to contact the underside of the substrate 140.

[0039] The substrate carrier 130 may be formed from a non-magnetic material, such as aluminum. In some embodiments, it may be beneficial to select the material from which the substrate carrier 130 is made to include a material that can withstand high processing temperatures. In one example, the substrate carrier 130 is made from a ceramic material (e.g., alumina, quartz, zirconia, etc.). In some cases, the substrate carrier 130 may be coated with a conductive coating to address issues with charge buildup on the substrate carrier 130 during processing in the process station 100.

[0040] The magnetic levitation assembly 120 may include a first track segment 121 and a second track segment 122. Each track segment 121, 122 may be positioned within the transport region 112 by one or more rail support members 103 connected to the housing 102. The first track segment 121 and the second track segment 122 each include a plurality of magnets that interact with magnets 134 of the carrier 130 to levitate and propel the carrier 130. The carrier 130 is movable between the first track segment 121 and the second track segment 122. When the carrier 130 is levitated above the first track segment 121, as shown in FIG. 1C, the carrier 130 is in a carrier transfer position. When the carrier 130 is levitated above the second track segment 122, as shown in FIG. 1E, the carrier 130 is in a standby position.

[0041] As shown in FIGS. 1A and 1B , a gap 123 separates the first track segment 121 from the second track segment 122. The size of the gap 123 can be selected to facilitate movement of the carrier 130 and substrate 140 over the gap 123 between the first track segment 121 and the second track segment 122 without losing control of the carrier 130. The process station 100 may have a slit valve extending across the gap 123 that, when closed, bisects the transfer region 112 (as shown by valve 1108 in FIG. 11B ). The transfer region 112 can be bisected by this slit valve to form a buffer region to further isolate the process region 160 from other stations and / or the external environment. In some embodiments, the magnetic levitation assembly 120 does not have a gap 123 between the track segments. Instead, a single track segment made up of a pair of rails extends across the transport region 112 from the first slit valve 104 to the second slit valve 105 .

[0042] The first track segment 121 and the second track segment 122 may be a pair of spaced-apart magnetic first rails 124, as shown in FIG. 1B. In some embodiments, a track segment, such as the first track segment 121, may optionally include a second pair of rails 126 perpendicular to the first rails 124, as shown in FIG. 1B. Each rail 124, 126 includes multiple magnets. The multiple magnets may include electromagnets, permanent magnets, or a combination of both electromagnets and permanent magnets. A second rail 126 may be disposed between each first rail 124, as shown in FIG. 1B. The second rail 126 has a length that is shorter than or equal to the length of the first rail 124. In some embodiments, the first rail 124 and the second rail 126 are in contact with each other. In some embodiments, the first rail 124 and the second rail 126 are integral with each other. As shown in FIG. 1A, first rail 124 and second rail 126 are positioned within transport region 112 by rail support members 103 connected to housing 102 .

[0043] 1A as having multiple electromagnets in the form of coils 125 disposed within the respective rails. Power supplied to the coils 125 generates an electromagnetic field. The controller 101 can adjust the amount of electricity supplied to each coil 125 to adjust the strength of the magnetic field generated. In some embodiments, each coil 125 can be spaced approximately the same distance from the other coils 125 to consistently control the movement and orientation of the levitated carrier 130 relative to the respective track segments 121, 122.

[0044] In addition to being positioned to levitate carrier 130, rails 124, 126 are also positioned to accommodate movement of pedestal assembly 190 past magnetic levitation assembly 120. As shown in FIG. 1B, there is a space 127 between rails 124, 126. Support plate 194 of pedestal assembly 190 can pass through space 127 in the Z direction without contacting rails 124, 126.

[0045] In some embodiments, the process station 100 includes multiple sensors (not shown) for detecting the position of the substrate carrier 130 within the transfer region 112. For example, in one embodiment, multiple Hall effect sensors or magnetic encoders may be positioned at various locations in the transfer region 112 to detect the three-dimensional position of the substrate carrier 130. The sensors may be connected to the controller 101 to provide feedback to the controller 101 regarding the position of the substrate carrier 130. The controller 101 may use signals from the sensors in a feedback control loop to adjust the power levels provided to different individual coils 125 as needed, thereby changing or maintaining the position of the substrate carrier 130.

[0046] As shown, the opening 106, the source assembly 170, and the process kit assembly 180 are positioned above the first track segment 121. The source assembly 170, the process kit assembly 180, and the pedestal assembly 190 can be used together to perform a desired process within the process region 160 of the process station 100. In various embodiments of the disclosure provided herein, the process region 160 within each process station 100 is configured to be individually separable from the transfer region 112. The process region 160 is isolated to substantially prevent electromagnetic energy, vapors, gases, and / or other undesirable contaminants from adversely affecting the process performed on the substrate 140 in the process region 160. Once isolated from the transfer region 112, the process region 160 is generally enclosed by one or more processing surfaces of the source assembly 170 and the seal assembly 185 of the process kit assembly 180 during substrate processing performed within the process station 100.

[0047] 1A illustrates a source assembly 170 adapted to perform a physical vapor deposition ("PVD") process. The exemplary source assembly 170 includes a magnetron assembly 171, a target 172, a process assembly wall 173 coupled to the housing 102, a lid 174, and a sputtering power supply 175. In this configuration, a processing surface 172A of the PVD target 172 generally defines at least a portion of an upper portion of the process region 160. The magnetron assembly 171 includes a magnetron region 179 in which the magnetron 171A rotates during processing using a magnetron rotation motor 176. The target 172 and magnetron assembly 171 are typically cooled by supplying a cooling fluid (e.g., deionized water) to the magnetron region 179 from a fluid recirculation system (not shown). The magnetron 171 includes a plurality of magnets 171B configured to generate a magnetic field extending below the processing surface 172A of the target 172 to facilitate the sputtering process performed in the processing region 160 during the PVD deposition process.

[0048] The pedestal assembly 190 includes a pedestal 192 and an actuator assembly 196. The pedestal 192 includes a shaft 193 connected to a support plate 194 and a lift pin 198.

[0049] The lift pins 198 can extend and retract in the Z direction. For example, the lift pins 198 can extend to lift the substrate 140 from the carrier 130 and then retract to position the substrate 140 in engagement with the upper surface of the support plate 194. A lift pin actuator 199 can supply hydraulic or pneumatic fluid to extend or retract the lift pins 198. The lift pin actuator 199 can include a lead screw assembly actuated by a stepper motor or servo motor, a linear motor assembly, an assembly actuated by a pneumatic cylinder, or other conventional mechanical linear actuation mechanism. In some embodiments, the lift pins are disposed on the support plate 194, as shown in FIG. 1A. In other embodiments, the lift pins 198 can be disposed outside the support plate 194. For example, the lift pins 198 can be coupled to a plate surrounding a shaft 193 that is raised and lowered relative to the pedestal support surface 194 by an actuator. The lift pins 198 can be extended and retracted through corresponding holes formed in the pedestal 192 by movement of the plate relative to the support surface 194 .

[0050] The actuator assembly 196 operates to raise and lower the pedestal 192 in the Z direction. The actuator assembly 196 is coupled to a pedestal shaft 193, which is supported by bearings (not shown) coupled to the lower wall of the housing 102 to guide the pedestal shaft 193 as it is translated by the actuator assembly 196. A seal, such as a bellows assembly (not shown), is used to form a seal between the outer diameter of the pedestal shaft 193 and a portion of the lower wall of the housing 102 so that a vacuum environment created within the transfer region 112 through use of the vacuum pump 114 is maintained during normal operation. The actuator assembly 196 may be mounted to the housing 102. The actuator assembly 196 may include a lead screw assembly actuated by a stepper motor or servo motor, a linear motor assembly, an assembly actuated by a pneumatic cylinder, or other conventional mechanical linear actuation mechanism.

[0051] In operation, the actuator assembly 196 is configured to move the pedestal assembly between positions within the process station 100. The pedestal 192 can be positioned in a lower position (e.g., FIGS. 1A and 1C) vertically (in the Z direction) below the first track segment 121. The pedestal 192 can be moved to a pedestal transfer position (FIG. 1D) such that the surface of the support plate 194 is positioned below the carrier 130 (e.g., a transfer surface) without contacting the carrier 130. After the lift pins 198 are used to transfer the substrate 140 to the support plate 194 and the carrier 130 is moved to a standby position (FIG. 1E), the pedestal 192 can be moved to a process position (FIG. 1F) vertically above the first track segment 121 such that the substrate 140 is positioned within the process region 160.

[0052] The process kit assembly 180 may include a process region shield 182, an insulating ring 183, a seal assembly 185 that may be positioned over and / or within the opening 106 formed in the housing 102, a deposition ring (not shown), and a cover ring 186. In some embodiments, a support plate 194 contacts portions of the process kit assembly 180, such as the seal assembly 185, to form the process region 160. The process region 160 may be evacuated via a vacuum pump 165 coupled to the station wall 184 of the housing 102 through a first port in the station wall 184.

[0053] For example, the vacuum pump 165 may reduce the pressure in the process region 160 to approximately 10 -3 The station wall 184 is coupled to a gas source assembly 166 and configured to supply one or more process gases (e.g., Ar, N) through a plenum to the process region 160 during processing.

[0054] A process region shield 182 is disposed below the station wall 184. The process region shield 182 is typically used to collect sputtered deposits from the target 172 and to enclose a portion of the process region 160. An insulating ring 183 is formed from a dielectric material and configured to support the target 172 and be disposed on the station wall 184. The insulating ring 183 is used to electrically isolate the target 172 from the grounded station wall 184 when the target 172 is biased by the sputtering power supply 175.

[0055] 1F , during processing of substrate 140, substrate 140 is engaged with support plate 194 of pedestal 192 positioned in a process position below source assembly 170. When in the process position, a region of support plate 194 forms a separable seal with a portion of seal assembly 185 to substantially fluidly isolate process region 160 from transport region 112. Thus, when in the process position, support plate 194, seal assembly 185, process region shield 182, station wall 184, isolation ring 183, and target 172 substantially enclose and define process region 160.

[0056] The seal assembly 185 can include an upper plate 185a, a bellows 185b, and a lower plate 185c. The bellows 185b is disposed between the upper plate 185a and the lower plate 185c. In some embodiments, a seal formed between a portion of the support plate 194 and the upper plate 185a of the seal assembly 185 is created in a seal region formed by physical contact between a surface of the region of the support plate 194 and a surface of the upper plate 185a. In some embodiments, the flexible bellows assembly 185b of the seal assembly 185 is configured to extend in the vertical (Z) direction as a portion of the support plate 194 is placed in contact with a surface of the portion of the seal assembly 185 using the actuator assembly 196 of the pedestal assembly 190. The compliant nature of the flexible bellows 185b assembly can accommodate any misalignment or flatness differences between the surface of the portion of the support plate 194 and the surface of the portion of the seal assembly 185, resulting in a reliable, repeatable, and separable seal. Flexible bellows assembly 185b may be a stainless steel bellows assembly or an Inconel bellows assembly, among others.

[0057] 1A is shown as being adapted to perform a PVD deposition process, the source assembly 170 may include different hardware for performing different processes. For example, the source assembly 170 may be adapted to perform chemical vapor deposition ("CVD"), plasma-enhanced chemical vapor deposition ("PECVD"), atomic layer deposition ("ALD"), plasma-enhanced atomic layer deposition ("PEALD"), etching, lithography, ion implantation, ashing, cleaning, thermal processes (e.g., rapid thermal processing, annealing, cooling, thermal management control), degassing, and / or other useful substrate processes.

[0058] In one example, the source assembly 170 of a process station adapted to perform a CVD deposition process, a PECVD deposition process, or an etching process includes a gas distribution plate or showerhead configured to supply precursor or etching gases into the process region 160 and across the surface of the substrate. Typically, the showerhead or gas distribution plate includes a metal, quartz, or ceramic plate formed with a plurality of holes (e.g., more than 100 holes) to restrict gas flow from an upstream side of the showerhead disposed adjacent to the process region 160 of the process station 100 to a downstream side of the showerhead during processing, thereby enabling uniform distribution of the gas. Gas (e.g., precursor or etching gas) is supplied upstream and through the showerhead by a precursor gas source (not shown), typically located external to the process station 100. In this configuration of the source assembly 170, the processing surface or surfaces that define at least a portion of the process region 160 are the underside of the gas distribution plate or showerhead (e.g., the surface that contacts the process region). In this configuration, the magnetron assembly 171 and target are not used, and the sputtering power supply 175 can be replaced with an RF power supply configured to bias the gas distribution plate.

[0059] The controller 101 may include a programmable central processing unit (CPU) operable with memory (e.g., non-volatile memory) and support circuits. The support circuits may include cache, clock circuits, input / output subsystems, power supplies, and the like, and combinations thereof, coupled to the CPU in a conventional manner and coupled to various components of the station 100 to facilitate control of the station 100. For example, in some embodiments, the CPU is one of any form of general-purpose computer processor used in industrial environments, such as a programmable logic controller (PLC) for controlling various polishing system components and sub-processors. The memory coupled to the CPU is non-transitory and is typically one or more of readily available memory, such as random access memory (RAM), read-only memory (ROM), a floppy disk drive, a hard disk, or any other form of digital storage, local or remote.

[0060] As used herein, memory is a form of computer-readable storage medium (e.g., non-volatile memory) that contains instructions that, when executed by the CPU, facilitate operation of station 100. The instructions in memory are in the form of a program product, such as a program (e.g., a middleware application, a device software application, etc.), that implements the methods of the present disclosure. The program code may conform to any one of several different programming languages. In one example, the present disclosure may be implemented as a program product stored on a computer-readable storage medium for use with a computer system. The programs in the program product define the functions of the embodiments, including the methods and operations described herein.

[0061] Exemplary computer-readable storage media include, but are not limited to, (i) non-writable storage media in which information is permanently stored (e.g., a read-only memory device in a computer, such as a CD-ROM disk readable by a CD-ROM drive, a flash memory, a ROM chip, or any type of solid-state non-volatile semiconductor memory), and (ii) writable storage media in which changeable information is stored (e.g., a floppy disk in a diskette drive, or a hard disk drive, or any type of solid-state random-access semiconductor memory). Such computer-readable storage media, when carrying computer-readable instructions that direct the functions of the methods described herein, are embodiments of the present disclosure.

[0062] 1A-1I illustrate operation within the process station 100. 1A-1B show the process station 100 after a carrier 130 with a substrate 140 disposed thereon has entered the transfer region 112 through an open first slit valve 104. The carrier 130 may have entered the process station 100 from a load lock station or another process station 100. The carrier 130 is levitated above the second track segment 122 in a parked position. Once the carrier 130 and substrate 140 are in the transfer region 112, the first and second slit valves 104, 105 are closed.

[0063] The carrier 130 is moved to the carrier transfer position, as shown in FIG. 1C, with the substrate 140 positioned above the support plate 194 in its lower position. After entering the first slit valve 104, the carrier 130 may be moved to this position without first being transported to the waiting position shown in FIGS. 1A-1B. Before, during, or after moving the carrier 130 to the carrier transfer position, the actuator assembly 196 is actuated to move the pedestal 192 to the pedestal transfer position. The lift pins 198 are positioned adjacent to corresponding slots 133 when the pedestal 192 is in the pedestal transfer position. The lift pins 198 are actuated to pass through the slots 133 and lift the substrate 140, disengaging it from the substrate support surface 132. FIG. 1D shows the substrate 140 disengaged from the substrate support surface 132 and supported on the lift pins 198. 1E, the carrier 130 moves to a parked position with the substrate 140 still supported on the lift pins 198. The lift pins 198 exit the slots 133 as the carrier 130 moves away from the carrier transfer position. After the carrier 130 clears the pedestal 192, the lift pins 198 retract and the substrate 140 is positioned on the upper surface of the support plate 194.

[0064] 1F, the pedestal 192 is raised to a process position and the substrate 140 is moved from the transfer region 112 through the opening 106 and into the process region 160. The support plate 194 is shown engaged with the seal assembly 185. In the process region 160, the substrate 140 undergoes a process, such as PVD. The slit valves 104, 105 may be closed during processing.

[0065] Once the process is complete, the pedestal 192 is returned to the pedestal transfer position, as shown in FIG. 1G. The lift pins 198 are actuated to lift the substrate 140 above the support plate 194, ensuring sufficient clearance for the substrate support surface 132 to move beneath the substrate 140. As shown in FIG. 1H, the carrier 130 is moved from the standby position to the carrier transfer position, such that the substrate support surface 132 is positioned beneath the substrate 140 without contacting the substrate 140. The lift pins 198 enter the slots 133 as the carrier 130 moves to the carrier transfer position. Once the carrier 130 reaches the carrier transfer position, the lift pins 198 are retracted, lowering the substrate 140 into engagement with the substrate support surface 132. The pedestal 192 is then returned to the lower position, as shown in FIG. 1I.

[0066] The controller 101 can cause the slit valves 104, 105 to open. The carrier 130 and substrate 140 are transferred out of the process station 100 through the open second slit valve 105. Additional carriers 130 and substrates 140 may be transferred into the process station 100 through the open first slit valve 104 to repeat the processing of the substrate 140 in the process region 160. The carrier 130 exiting the process station 100 through the second slit valve 105 can enter another process station, such as an additional process station 100, to subject the substrate 140 to additional processing.

[0067] In some embodiments, carrier 130 may enter transfer region 112 through second slit valve 105 and exit through first slit valve 104, rather than entering through first slit valve 104 and exiting through second slit valve 105 as described above. In some embodiments, opening 106, source assembly 170, and process kit assembly 180 may be positioned above second track segment 122 rather than first track segment 121.

[0068] Many of the following embodiments described in this disclosure use features similar to or the same as those shown in Figures 1A-1H. These features allow substrate carriers to move throughout the substrate processing system with little or no contact with other parts of the substrate processing system, thereby minimizing particle generation. Additionally, these features allow substrates to be moved between stations without being picked up and placed by a robotic arm, thereby increasing system throughput because substrates are not transferred from one robotic arm to another or from a robotic arm to a processing chamber.

[0069] Generally, a substrate 140 undergoes a manufacturing sequence in a substrate processing system to produce desired characteristics. The substrate processing system includes multiple stations, such as process station 100, coupled to each other to perform each process in the manufacturing sequence. A carrier 130 transports the substrate 140 sequentially through the substrate processing system to each station. The carrier 130 may need to change its axial direction of movement depending on the station configuration.

[0070] FIG. 2A illustrates an exemplary arrangement of stations 200. The arrangement of stations 200 may be included in a substrate processing system for manufacturing substrates. An XYZ coordinate system is included to illustrate the axial directions of movement of the carrier 130 and substrates 140 within the arrangement of stations 200. The arrangement 200 may include a first station 201, a second station 202, a third station 203, and a fourth station 204. FIG. 2A is a cross-sectional top view of the arrangement of stations 200, illustrating the transfer regions 112 of each of the stations 201, 202, 203, and 204. The carrier 130 transports the substrates 140 through each of the stations 201-204 in sequence. The second station 202 and the third station 203 are routing stations configured to change the axial direction of movement of the carrier 130 so that instead of moving linearly in a second axial direction (e.g., X direction), the carrier moves linearly in a first axial direction (e.g., Y direction), or vice versa.

[0071] The first station 201 may be the process station 100. The second station 202 may be a process station similar to the process station 100. The third station 203 may be a load lock station, and the fourth station 204 may be a transfer station.

[0072] 2B-2H show partial cross-sectional views of station arrangement 200 taken along line 2B-H to illustrate the transfer areas of second station 202 and third station 204. The source assembly 170 and process kit assembly 180 of second station 202 are not shown.

[0073] The second station 202 includes a magnetic levitation assembly 220 capable of selectively changing the axial direction of transport. The axial direction of transport is changed to change the axial direction of movement of the carrier 130 from a first axial direction, such as the Y direction, to a second axial direction, such as the X direction. The magnetic levitation assembly 220 includes a first track segment 221, a second track segment 222, and an actuator 228. The first track segment 221 includes a first rail 224 and a second rail 226. Each rail 224, 226 is connected to an actuator 228. Each actuator 228 moves the respective rail 224, 226 in the Z direction. The second track segment 222 also includes a pair of first rails 224. The first rail 224 and the second rail 226 may include a plurality of magnets, such as coils 125, that generate an electromagnetic field to levitate and move the carrier 130. 2B, the rails 224, 226 may include a shoulder 229 formed between the top and bottom surfaces of each rail 224, 226. The carrier 130 may be levitated above the rails 224, 226 above the shoulder 229.

[0074] The first rails 224 are movable in the Z direction relative to the second rails 226 between an upper position ( FIG. 2B ) and a lower position ( FIG. 2E ) by extending and retracting actuators 228 connected to each rail 224. The second rails 226 can be moved in the Z direction relative to the first rails 224 between an upper position ( FIG. 2E ) and a lower position ( FIG. 2B ) by the respective actuators 228. The actuators 228 may be hydraulic actuators, pneumatic actuators, linear electric actuators, or any other actuators suitable for raising and lowering the rails 224, 226.

[0075] Rails 224, 226 are raised and lowered by actuator 228 to facilitate axial changes in the transport of magnetic levitation assembly 220. Magnetic levitation assembly 220 transports carrier 130 in the Y direction when first rail 224 is in the upper position and second rail 226 is in the lower position. Magnetic levitation assembly 220 transports carrier 130 in the X direction when second rail 226 is in the upper position and first rail 224 is in the lower position.

[0076] Each second rail 226 may be positioned between first rails 224, as shown in FIG. 2A. In some embodiments, the first rails 224 are positioned so that the first rails 224 do not extend beyond the ends of the second rails 224, as shown in FIG. 2A. In some embodiments, the first rails 224 may be positioned so that they extend beyond the ends of the second rails 226, or the rails 224 may be positioned so that the edges of the rails 224 are flush with the ends of the second rails 226. In some embodiments, the second rails 226 are shorter in length than the first rails 224 or are equal in length to the first rails 224.

[0077] The third station 203 includes a magnetic levitation assembly 230 that is selectively variable in axial direction of transport. Varying the axial direction of transport changes the axial direction of movement of the carrier 130. The magnetic levitation assembly 230 includes a first track segment 231 similar to the first track segment 221 of the second station 202 and an actuator 228 connected to each rail 224, 226 of the first track segment 231, and is labeled accordingly. Although the third station 203 is shown as a load lock station, the third station 203 may instead be a process station similar to the second process station 202.

[0078] The magnetic levitation assemblies 220, 230 of the second station 202 and the third station 203 operate in coordination to change the axial direction of movement of the carrier 130. Figures 2A-2I illustrate an exemplary operation of transporting the substrate 140 and carrier 130 through the station arrangement 200.

[0079] 2A shows carrier 130 and substrate 140 positioned in transfer region 112 of first station 201. Substrate 140 may be processed in first station 201 in a manner similar to that described with respect to process station 100. Once processing in first station 201 is complete, carrier 130 is transferred from first station 201 in the Y direction into second station 202 while slit valve 251 is in the open position.

[0080] FIG. 2B shows a cross-sectional view of the second and third stations 202 and 203 before the carrier 130 and substrate 140 are transported from the first station 201 to the second and third stations 202 and 203. The first rail 224 is in the upper position, and the second rail 226 is in the lower position. When the first rail 224 of the first track segment 221 is in the upper position, it is substantially coplanar with the first rail 224 of the second track segment 222. The controller 101 can adjust the magnetic fields of the second track segment 122 of the first station 201 and the first rail 224 of the first track segment 221 of the second station 202 to transport the carrier 130 in the Y direction into the second station 202. FIG. 2C shows the carrier 130 positioned in the second station 202 and levitating above the first rail 224. While the second rail 226 is in the lower position and the first rail 224 is in the upper position, the electromagnet in the second rail 226 can be deactivated. Although not shown, the second carrier may be transported from the third station 203 in the Y direction into the fourth station 204 while the carrier 130 is being transported into the second station 202.

[0081] Once the carrier 130 and substrate 140 are positioned in the second station 202, the substrate 140 is processed in a manner similar to that described for the process station 100. The carrier 130 is moved to a carrier transfer position above the first track segment 221 to transfer the substrate 140 onto the lift pins 198. After the substrate 140 has been transferred onto the lift pins 198, the carrier 130 is moved to a waiting position above the second track segment 222. The pedestal 192 is moved to a process position to position the substrate 140 within the process region 160 of the second station 202 for processing. Once processing is complete, the pedestal 192 is lowered to the pedestal transfer position, and the lift pins 198 are extended to position the substrate 140 above the support plate 194. The carrier 130 is then returned to the carrier transfer position, and the substrate 140 is transferred from the lift pins 198 to the carrier 130.

[0082] The second rails 226 of the second station 202 and the third station 203 are raised from a lower position to an upper position, as shown in FIG. 2D . When the second rail 226 of the second station 202 is in the upper position, it is substantially flush with the second rail 226 of the third station 203. The electromagnets in the second rails 226 can be activated before or after the second rails 226 reach the upper position to levitate the carrier 130. Once the second rails 226 reach the upper position, the first rails 224 of both stations 202 and 203 are moved to a lower position, as shown in FIG. 2E , to provide a path for the carrier 130 to be transported in the X direction between the second rail 226 of the second station 202 and the second rail 226 of the third station 203. The electromagnets in the first rails 224 can be deactivated while the first rails 224 are in the lower position.

[0083] The carrier 130 is then transferred into the third station 203, as shown in FIG. 2F, while the second slit valve 252 is in the open position. For example, the controller 101 can adjust the magnetic fields of the second rails 226 of the second station 202 and the third station 203 to transfer the carrier 130 in the X direction into the third station 203. Once the carrier 130 and substrate 140 are positioned in the third station 203, the first rails 224 of both the second station 202 and the third station 203 are returned to their upper positions, as shown in FIG. 2G. The first rails 224 are substantially coplanar with the rails 244 of the fourth station 204, which is in its upper position. The second rails 226 of both the second station 202 and the third station 203 are then returned to their lowered positions, as shown in FIG. 2H, to provide a path for the carrier 130 to travel in the Y direction from the third station 203 to the fourth station 204 while the third slit valve 253 is in the open position. FIG. 21 is a top view of the station arrangement 200, showing the carrier 130 and substrate 140 positioned at the fourth station 204 after being transferred from the third station 203. The fourth station 204 has a magnetic levitation assembly 240 that may be similar to the magnetic levitation assembly 120, but may have only a single pair of magnetic rails 224, as shown in FIGS. 2A and 21.

[0084] In some embodiments, the rails 224 and 226 of the second station 202 and the third station 203 rise and fall simultaneously. In some embodiments, the rails 224, 226 of each station 202, 204 rise asynchronously. For example, the controller 101 can instruct the third station 203 to move the second rail 226 to an upper position and the first rail 224 to a lower position in preparation for receiving the carrier 130 in the X direction while the carrier 130 is being transported into the second station 202 in the Y direction.

[0085] 3A-3C illustrate a station 300 configured to change the axial direction of movement of the carrier 130. The station 300 is a routing station and can be included in a substrate processing system. FIG. 3A is a cross-sectional view of the station 300. FIGS. 3B and 3C are top views of the cross-section of the station 300 taken along section line 3B-C. The station 300 may also be a process station having similar components to the process station 100, as indicated by reference numerals; however, for the sake of brevity, a detailed description of these components of the process station 100 will not be provided. The substrate 140 may be processed in the station 300 in a manner similar to that described for the process station 100. An XYZ coordinate system is included in the figures to illustrate the axial directions of movement of the carrier 130 and the substrate 140 within the station 300.

[0086] Station 300 includes a magnetic levitation assembly 320 that can selectively change an axial direction of transport. The axial direction of transport is changed to change the axial direction of movement of carrier 130. Magnetic levitation assembly 320 is at least partially disposed in transport region 112. Magnetic levitation assembly 320 can include a first track segment 321, a second track segment 322, and an actuator 330.

[0087] The first track segment 321 and the second track segment 322 may be rails 324. The rails 324 may include a plurality of magnets, such as coils 125, that are used to generate electromagnetic currents to levitate and propel the carrier 130. The rails 324 may include grooves 325, and the carrier 130 may be partially housed in the grooves 325. As shown in FIG. 3B , the grooves 325 of each rail 324 face each other and are aligned. The carrier 130 levitates within the grooves 325. Magnets may be positioned on both sides of the grooves 325. In some embodiments, the carrier 130 is levitated and propelled within the grooves 325 without contacting the surface of the grooves 325.

[0088] FIG. 3A shows an exemplary actuator 330 coupled to the rail 324 of the first track segment 321. The actuator 330 rotates the first track segment 321 about the central axis 301, such as rotating the first track segment 321 between a first position shown in FIG. 3B and a second position shown in FIG. 3C. The actuator 330 may include a motor 331 operable to selectively rotate the first track segment 321 about the central axis 301. The motor may be an electric motor, a hydraulic motor, or the like. The motor 331 may include a gear 332 that meshes with teeth 334 on a body 336 attached to the rail 324. The pedestal 192 may be partially disposed in the body 336, and the actuator 330 may rotate the rail 324 relative to the pedestal 192 and the housing 102. In an alternative embodiment, the body 336 may be a ring around the rail 324 with an opening for a pedestal 192 that is rotatable by an actuator 330 that rotates the first track segment 321 .

[0089] When the first track segment 321 is in the first position, the grooves 325 of the first track segment 321 align with the grooves 325 of the rails 324 of the second track segment 322. The carrier 130 is transported into the station 300 in the Y direction with the first track segment 321 in the first position. FIG. 3B shows the carrier 130 in the carrier transfer position. The substrate 140 is processed while the first track segment 321 is in the first position in a manner similar to that described with respect to the process station 100. The carrier 130 is moved to the carrier transfer position to transfer the substrate 140 onto the lift pins 198 of the pedestal 192. After the substrate 140 has been transferred onto the lift pins 198, the carrier 130 moves along the second track segment 321 to a waiting position in the Y direction (floating within the grooves of the second track segment 322). The pedestal 192 is then moved to a process position and the substrate 140 is placed in the process region 160 for processing.

[0090] Once the process is complete, the pedestal 192 is lowered to the pedestal transfer position, and the substrate 140 is returned to the transport region 112 and transferred onto the carrier 130. The substrate 140 is supported above the surface of the support plate 194 on the lift pins 198, out of the carrier 130's path of travel. To retrieve the substrate 140, the carrier 130 is moved in the Y direction from the standby position to the carrier transfer position. After the substrate 140 is transferred from the lift pins 198 to the carrier 130, the actuator 330 is activated to rotate the first track segment 321 from a first position to a second position, thereby rotating the carrier 130. Rotating the first track segment 321 changes the axial direction in which the carrier 130 is transported by the magnetic levitation assembly 320. The actuator 330 can rotate the rail 324 approximately 90 degrees, as shown in FIG. 3C. The carrier 130 and substrate 140 can then exit the station 300 in the X direction.

[0091] 4A-4E are top views, partially in section, of an exemplary arrangement of stations 400. An XYZ coordinate system is included to illustrate the axial direction of movement of the carrier 130 and substrate 140 within the arrangement of stations 400. The arrangement 400 may include a first station 401, a second station 402, a third station 403, and a fourth station 404. The carrier 130 transports the substrate 140 sequentially through each of the stations 401-404. The second station 402 and the third station 403 are configured to change the axial direction of movement of the carrier 130.

[0092] The first station 401 may be similar to the process station 100, with rails 324 replacing the rails 124 of the first and second track segments 121 and 122. The rails 126 may be omitted from the first station 201, as shown in FIG. 4A. The second station 202 may be a process station similar to station 300. The third station 403 may be a load lock station having a magnetic levitation assembly 430. The magnetic levitation assembly 430 is similar to the magnetic levitation assembly 320 and includes a first track segment 321 that is rotatable by an actuator 330. FIG. 4A also shows the magnetic levitation assembly 430 partially rotated from the position shown in FIG. 4A, as indicated by the dashed line labeled 430A. The fourth station 404 may be a transfer station including a magnetic levitation assembly 440 with non-rotatable rails 324.

[0093] The carrier 130 and substrate 140 move into the first station 401 in the Y direction as shown in FIG. 4A when the slit valve 451 is open. The substrate 140 is processed in the first station 401 in a manner similar to that of the process station 100. After processing, the carrier 130 transports the substrate 140 along the rails 324 of the first station 401 in the Y direction into the second station 402 when the slit valve 452 is open as shown in FIG. 4B. The rails 324 of the second station 402 receive the carrier 130 and levitate and propel the carrier 130 within the second station 402. The substrate 140 may be processed in the second station 402 as described with respect to the station 100. As shown in FIG. 4C, after the substrate 140 is processed, the rails 324 of the second station 402 are rotated to change the axial direction of movement of the carrier 130. The rails 324 of the third station 403 are also rotated to align the rails 324 of both the second station 402 and the third station 403. The carrier 130 then moves along the rails 324 in the X direction, moving the substrate into the third station 403 while the third slit valve 453 is open as shown in FIG. 4D . The rails 324 in the third station 403 are then rotated to align with the rails 324 of the fourth station 404, allowing the carrier to enter the fourth station 404 while the fourth slit valve 454 is open in the Y direction. The rails 324 of the second station 402 are also rotated to align with the rails 324 of the first station 401, preparing for the additional carrier to transfer an additional substrate from the first station 401 into the second station 402. FIG. 4E shows the carrier 130 in the fourth station 404 after being transferred in the Y direction from the third station 403.

[0094] 5A-5D are top views, partially in section, of an exemplary arrangement of stations 500. An XYZ coordinate system is included to illustrate the axial direction of movement of carriers 130 and substrates 140 within the arrangement of stations 500. Arrangement 500 may include a first station 501, a second station 502, a third station 503, and a fourth station 504. Carriers 130 transport substrates 140 through each of stations 501-504. Second station 502 and third station 503 are routing stations configured to change the axial direction of movement of carriers 130 without physically moving the magnetic levitation track.

[0095] The first station 501 may be similar to the process station 100 and is labeled accordingly. The second station 502 may be similar to the process station 100, except that the magnetic levitation assembly 120 is replaced with a magnetic levitation assembly 520 including a first track segment 521 and an optional second track segment 522. The axial direction of transport of the magnetic levitation assembly 520 is selectively alterable to change the axial direction of movement of the carrier 130. The first track segment 521 includes a first rail 524 and a second rail 526. The first and second rails 524, 526 may be connected to each other by a corner member 528. The corner member 528 may include a magnet, such as a permanent magnet, or may be constructed of a non-magnetic material. The first rail 524 and the second rail 526 may have the same or different lengths.

[0096] The first rail 524 includes an arrangement of magnets, such as alternating permanent magnets 524p and electromagnets 524e. The second rail 526 also includes an arrangement of magnets, such as alternating permanent magnets 526p and electromagnets 526e. The permanent magnets 524p interact with the magnets 134 of the carrier 130 to levitate the carrier 130. The electromagnets 524e and 526e interact with the magnets 134 to levitate and propel the carrier 130. The electromagnets 524e and 526e can be selectively turned on and off by the controller 101. The controller 101 can also selectively change the strength of the magnetic field generated by the electromagnets 524e and 526e by increasing or decreasing the current supplied to the electromagnets 524e and 526e from a power source (not shown), thereby selectively propelling the carrier 130 in response to the interaction of the electromagnets 524e and 526e with the magnets 134 of the carrier 130. The controller 101 can use the electromagnet 524e to move the carrier 130 in the Y direction and the electromagnet 526e to move the carrier 130 in the X direction. For example, the strength of the electromagnet 524e can be adjusted to propel the carrier 130 in the Y direction while the electromagnet 526e is turned off. The strength of the electromagnet 526e can be adjusted to propel the carrier 130 in the X direction while the electromagnet 524e is turned off. In some embodiments, the axial direction of transport of the magnetic levitation assemblies 520, 530 can be changed by turning off the electromagnet 524e and turning on the electromagnet 526e, or vice versa. In some embodiments, the axial direction of transport of the magnetic levitation assemblies 520, 530 can be changed by decreasing the strength of the electromagnet 524e and increasing the strength of the electromagnet 526e, or vice versa.

[0097] 5A, the second rails 526 may be disposed between each of the first rails 524. The second rails 526 may be shorter in length than the first rails 524 or may be equal in length to the first rails 524. In some embodiments, the first rails 524 and the second rails 526 are contiguous. In some embodiments, the first rails 524 and the second rails 526 are integral with each other.

[0098] The third station 503 is a load lock station that includes a magnetic levitation assembly 530 with a first track segment 521 but omits the second track segment 522. The fourth station 504 may be a transfer station that includes a magnetic levitation assembly 540 that includes a rail 544 with multiple magnets, such as alternating permanent magnets and electromagnets, similar to rail 524. In some embodiments, rail 544 may be similar to rail 244 of FIG. 2A.

[0099] 5A-5D illustrate a sequence for moving a carrier 130 through the station arrangement 500. The carrier 130 transfers a substrate 140 into the first station 501 while the first slit valve 551 is open to the carrier transfer position, as shown in FIG. 5A. The carrier 130 is processed in the first station 501 in a manner similar to that described for the process station 100. After the substrate 140 is placed back onto the carrier 130, the carrier 130 is transferred into the second station 502 by cooperatively operating the electromagnetic coils 125 (not shown) in the rails 124, 126. As shown in FIG. 5B, while the second slit valve 552 is open, the carrier 130 is moved into the second station 502 and to a carrier transfer position above the first track segment 521 for transferring the substrate 140 to the lift pins 198. The electromagnet 524e on the first rail 524 is then used to move the carrier 130 to a waiting position above the second track segment 522. The substrate 140 is lifted by the pedestal 192 into the process region 160 (not shown) of the second station 502. After the substrate 140 has been processed, the pedestal 192 is lowered to the pedestal transfer position. The electromagnet 524e on the first rail 524 returns the carrier 130 to the carrier transfer position so that the substrate 140 can again be transferred onto the carrier 130. Once transfer is complete, the carrier 130 is transported in the X direction to the third station 503 using the electromagnet 526e on the second rail 526 while the third slit valve 553 is open, as shown in FIG. 5C . The electromagnets 524e of the first rail 524 of the third station 503 can be operated in coordination to transport the carrier 130 in the Y direction into the fourth station 504 while the fourth slit valve 554 is open, as shown in FIG. 5D.

[0100] 6A-6B illustrate a schematic substrate processing system 600. The substrate processing system 600 includes a controller 101, at least one processing line 601, and a factory interface 604. While FIG. 6A illustrates two processing lines 601, the substrate processing system 600 may have only one processing line 601 or three or more processing lines 601. Each processing line 601 is configured to manufacture substrates 140 (not shown). Each processing line 601 includes multiple stations, such as stations 611-617 shown in FIG. 6. Each processing line 601 includes a magnetic transport system 690 formed from individual magnetic levitation assemblies of stations 611-617 that transport substrates 140 disposed on carriers 130 (not shown) through the processing line 601. Each processing line 601 may include multiple slit valves 660 for selectively isolating each station. Slit valve 660 is selectively opened and closed to provide a path for movement of carrier 130, selectively isolate stations 611-617 from one another, and facilitate pressurization or depressurization of the stations.

[0101] The substrate processing system 600 is used to process multiple substrates in each processing line 601 to produce the desired manufactured substrates. For example, the substrate processing system 600 may be a PVD system as shown in FIG. 6A. The first station 611 is a first load lock, the second station 612 is a degassing station, the third station 613 is a pre-cleaning station, the fourth station 614 is a tantalum nitride deposition station, the fifth station 615 is a copper deposition station, the sixth station 616 is a second load lock, and the seventh station 617 is a transfer station. The vacuum strength within each station may increase between stations. For example, the vacuum strength of the fifth station 615 may be greater than the vacuum strength of the other stations.

[0102] Multiple substrates are processed simultaneously in each processing line 601. The carrier 130 is moved to a carrier transfer position within each process station 612-615 to facilitate the transfer of the substrate 140 onto the pedestal assembly 190. Once the substrate 140 is transferred to the pedestal assembly 190, such as supported above the carrier 130 by extended lift pins 198, the carrier 130 moves to a standby position. The pedestal assembly 190 moves to a processing position to place the substrate 140 in the processing region of each process station 612-615 for processing. Once processing is complete, the pedestal 192 returns to the pedestal transfer position, allowing the substrate 140 to be placed back onto the carrier 130, and the carrier 130 and substrate 140 to be transported into another station.

[0103] The first station 611 is coupled to a factory interface 604. The factory interface 604 may be coupled to one or more front-opening unified pods (FOUPs) 606. Each of the FOUPs 606 may be a container having a fixed cassette therein for holding a plurality of substrates. Each of the FOUPs 606 may have a front-opening interface configured for use with the factory interface 604. The factory interface 604 may have a buffer chamber (not shown) and one or more robot assemblies (not shown) configured to transfer substrates via linear, rotational, and / or vertical motion between the FOUPs 606 and the carriers 130 in the first station 611.

[0104] 6B is a cross-sectional top perspective view of the substrate processing system 600 to illustrate the magnetic levitation assemblies within the substrate processing system 600. The magnetic levitation assemblies form a magnetic transport system 690 that circulates the carriers 130 through the substrate processing system 600.

[0105] 6B includes an XYZ coordinate system to illustrate the axial direction of carrier and substrate movement through the substrate processing system 600. The arrows indicate the direction in which one or more carriers circulate within the processing line 601. The carrier and substrate move in the X direction from the first station 611 to the second station 612. The carrier and substrate move in the Y direction from the second station 612 to the fifth station 615. The carrier and substrate move in the X direction from the fifth station 615 to the sixth station 616. The carrier and substrate then move in the Y direction from the sixth station 616 through the seventh station 617 back to the first station 611. The first station 611, the second station 612, the fifth station 615, and the sixth station 616 each include a magnetic levitation assembly configured to change the axial direction of carrier and substrate movement. The first station 611 and the second station 612, and the fifth station 615 and the sixth station 616 cooperate to change the axial direction of movement of the carrier 130.

[0106] First station 611 and sixth station 616 (e.g., load locks) have magnetic levitation assemblies 630. Figure 6B shows magnetic levitation assembly 630 as being similar to magnetic levitation assembly 230 and including rails 224, 226. In some embodiments, magnetic levitation assembly 630 may be similar to magnetic levitation assemblies 430, 530 described above.

[0107] The second station 612 and the fifth station 615 (e.g., a process station) have a magnetic levitation assembly 620. Figure 6B shows the magnetic levitation assembly 620 as being similar to the magnetic levitation assembly 220 and including rails 224, 226. In some embodiments, the magnetic levitation assembly 620 may be similar to the magnetic levitation assemblies 320, 520 described above.

[0108] The third station 613 and the fourth station 614 may be similar to the process station 100 described above or another station described above for processing substrates. The third station 613 and the fourth station 614 each have a magnetic levitation assembly 120 including a first track segment 121 having rails 124, 126 and a second track segment 122 having rail 124. In some embodiments, the second rail 126 is omitted. In some embodiments, the magnetic levitation assemblies 120 of the third station 613 and the fourth station 614 can instead have rails selected from rails 224, 226, 324, 524, and 526 as described above, or any other rails described herein.

[0109] The magnetic assembly 630 of the first station 611 and the magnetic levitation assembly 620 of the second station 612 cooperate to change the axial direction of movement of the carrier 130. Additionally, the magnetic levitation assembly 620 of the fifth station 615 and the magnetic levitation assembly 630 of the sixth station 616 cooperate to change the axial direction of movement of the carrier 130.

[0110] The seventh station 617 may be similar to stations 204, 404, 504 and may include a magnetic levitation assembly 640 including a rail selected from rails 124, 126, 224, 226, 324, 524, and 526 described above, or any other rail described herein.

[0111] A carrier 130 carrying a substrate 140 can be circulated through the substrate processing system 600 as follows: The substrate 140 is transferred from a FOUP 606 to a carrier 130 located at a first station 611. The carrier 130 is then transported along the X direction to a second station 612. From the second station 612, the carrier 130 is transported in the Y direction through a third station 613 and a fourth station 614 to a fifth station 615. The substrate 140 may be processed at stations 612-615. The carrier 130 is then transported in the X direction from the fifth process station 615 to a sixth station 616. The carrier 130 is then transported from the sixth station 616 in the Y direction to a seventh station 617. The seventh station 617 transports the carrier 130 in the Y direction back to the first station 611. When the carrier 130 returns to the first station 611, the fabricated substrate 140 is removed from the carrier 130 at the first station 611 and transferred to the FOUP 606. The next substrate 140 is then placed onto the carrier 130 located at the first station 611 for a processing cycle in the substrate processing system 600, as described above.

[0112] Multiple substrates can circulate simultaneously through each processing line 601. Each process station (e.g., stations 612-615) within each processing line can process the substrates contained therein simultaneously or asynchronously. The number of carriers 130 can be equal to or less than the number of stations. The number of stations in each processing line 601 can be more or less than the seven stations shown in FIG. 6A. For example, processing line 601 can have more than 10 stations.

[0113] In one example, a first substrate on a first carrier is transferred from the first station 611 to the second station 612. A second substrate on a second carrier is transferred from the second station 612 to the third station 613. A third substrate on a third carrier is transferred from the third station 613 to the fourth station 614. A fourth substrate on a fourth carrier is transferred from the fourth process station 614 to the fifth station 615. A fifth substrate on a fifth carrier is transferred from the fifth station 615 to the sixth station 616. After the five carriers have been transferred, one or more of the slit valves 660 may be closed to isolate the process stations 612-615 while the four substrates disposed therein are processed. While process stations 612, 615 are processing substrates disposed therein, the fifth substrate on the fifth carrier is transported along the magnetic levitation assembly 640 of the seventh station 617 back into the first station 611. The fifth substrate is then removed from the first station 611, and the sixth substrate is placed on the fifth carrier disposed in the first station 611 in preparation for processing in the second station 612. The sixth substrate may be placed on the fifth carrier in the first station 611 before stations 612-615 have completed processing of the substrates disposed therein.

[0114] Each processing line 601 can have a separate seventh station 617. In some embodiments, each processing line 601 can share the seventh station 617 with two magnetic levitation assemblies 640 so that each processing line 601 can process one or more substrates independently of each other.

[0115] 7 shows a schematic substrate processing system 700 including a controller 101, at least one processing line 701, and a factory interface 604. Substrate processing system 700 differs from system 600 in that both processing lines share one or more stations, including sharing a magnetic levitation assembly for each shared station. Sharing one or more stations may reduce the footprint of the substrate processing system.

[0116] As shown, both processing lines 701 each include multiple stations, such as stations 711-717. Each processing line 701 includes a magnetic transport system (not shown) formed from individual magnetic levitation assemblies of stations 711-717 that transport substrates 140 (not shown) disposed on carriers 130 (not shown) through processing line 701.

[0117] Each processing line 701 may include a plurality of slit valves 760 for selectively isolating each station. The slit valves 760 are selectively opened and closed to provide a path for movement of the carrier 130, selectively isolate the stations 711-717 from one another, and facilitate pressurization or depressurization of the stations.

[0118] The substrate processing system 700 is used to process multiple substrates in each processing line 701 to produce the desired manufactured substrates. For example, the substrate processing system 700 may be a PVD system. For example, the first station 711 is a first load lock, the second station 712 is a degassing station, the third station 713 is a pre-clean station, the fourth station 714 is a tantalum nitride deposition station, the fifth station 715 is a copper deposition station, the sixth station 716 is a second load lock, and the seventh station 717 is a transfer station. Substrates are transferred and processed within each process station 712-715 in a manner similar to that described above for the other process stations, including stations 612-615. The vacuum strength within each station may increase between stations. For example, the vacuum strength within the fifth station 715 may be greater than the vacuum strength within the other stations.

[0119] Each processing line 701 shares a first station 711, a sixth station 716, and a seventh station 717. As a result, the magnetic transport systems of each processing line 701 share the magnetic levitation assemblies of the shared stations.

[0120] The first station 711, the sixth station 716, and the seventh station 717 can only handle a single carrier at a time. As a result, production in each processing line 701 may be offset from one another by a period of time. This offset period may be based on the time required to process a substrate in the first station 711, the sixth station 716, and the seventh station 717. For example, the processing line 701 on the right side of the substrate processing system 700 may be offset from the other processing lines 701 by approximately 30 seconds.

[0121] The first station 711 and the sixth station 716 (eg, load locks) have magnetic levitation assemblies that may be similar to the magnetic levitation assemblies 230, 430, 530 described above.

[0122] The second station 712 and the fifth station 715 (eg, process stations) can have magnetic levitation assemblies similar to the magnetic levitation assemblies 220, 320, 520 described above.

[0123] The seventh station 717 may be similar to stations 204, 404, 504 and may include a magnetic levitation assembly having rails selected from rails 124, 126, 224, 226, 324, 524, and 526 described above, or any other rails described herein.

[0124] The third station 713 and the fourth station 714 (e.g., process stations) may be similar to the process station 100 described above or another station described above for processing substrates. The third station 713 and the fourth station 714 each have a magnetic levitation assembly 120 (not shown) that includes a first track segment 121 (not shown) and a second track segment 122 (not shown). The rails of each track segment 121, 122 may be configured similarly to the rails 124, 126, 224, 226, 324, 524, and 526 described above, or any other rails described herein.

[0125] The magnetic levitation assembly of the first station 711 and the magnetic levitation assembly of the second station 712 cooperate to change the axial direction of movement of the carrier 130. Additionally, the magnetic levitation assembly of the fifth station 715 and the magnetic levitation assembly of the sixth station 716 cooperate to change the axial direction of movement of the carrier 130.

[0126] FIG. 7 includes an XYZ coordinate system to illustrate the axial directions of carrier and substrate movement through the substrate processing system 700. The arrows indicate the direction in which one or more carriers circulate within the processing line 701. The carrier 130 receives a substrate from the FOUP 606 in the factory interface 604, entering a first station 711 in the Y direction. The carrier 130 is then transported along the X direction to a second station 712. The carrier 130 is then transported in the Y direction from the second station 712 to a fifth station 715. The carrier 130 is then transported in the X direction from the fifth process station 715 to a sixth station 716. The carrier 130 is then transported in the Y direction from the sixth station 716 into a seventh station 717. The carrier 130 is then transported in the Y direction from the seventh station 717 back to the first station 711, and the fabricated substrate 140 is transferred to the FOUP 606. Another substrate can be placed on a carrier in the first station 711 for processing operations as described above.

[0127] 8 illustrates an alternative substrate processing system 800 that includes one or more processing lines 801, a factory interface 604, and a FOUP 604. Substrate processing line 800 differs from system 600 in that each processing line 801 has one less station and carriers 130 circulate in the opposite direction to system 600.

[0128] As shown, both processing lines 801 each include multiple stations, such as stations 811-816. Each processing line 801 includes a magnetic transport system (not shown) formed from individual magnetic levitation assemblies of stations 811-816 that transport substrates 140 (not shown) disposed on carriers 130 (not shown) through processing line 801. Each processing line 801 is independent of the other processing lines.

[0129] Each processing line 801 may include a plurality of slit valves 860 for selectively isolating each station. The slit valves are selectively opened and closed to provide a path for movement of the carrier 130, selectively isolate the stations 811-816 from one another, and facilitate pressurization or depressurization of the stations.

[0130] Each processing line 801 can have a separate second station 812. In some embodiments, each processing line 801 can share a second station 812 with two magnetic levitation assemblies such that each processing line 801 can process one or more substrates independently of each other.

[0131] The substrate processing system 800 is used to process multiple substrates in each processing line 801 to produce the desired manufactured substrates. For example, the substrate processing system 800 may be a PVD system. For example, the first station 811 is a first load lock, the second station 812 is a transfer station, the third station 813 is a degassing station, the fourth station 814 is a pre-clean station, the fifth station 815 is a tantalum nitride deposition station, and the sixth station 816 is a copper deposition station. Substrates are transferred and processed within each process station 813-816 in a manner similar to that described above for other process stations, such as process station 100. In the PVD system shown in FIG. 8, the second load lock 612 of the system 800 is eliminated, thereby reducing process time and the footprint of the substrate processing system 600. The vacuum strength within each station may be increased between stations. For example, the vacuum strength within the sixth station 816 may be greater than the vacuum strength within the other stations.

[0132] A first station 811 (eg, a load lock) has a magnetic levitation assembly that may be similar to magnetic levitation assemblies 230, 430, 530 described above.

[0133] The second station 812 may be similar to stations 204, 404, 504 and may include rails selected from rails 124, 126, 224, 226, 324, 524, and 526 described above, or any other rails described herein.

[0134] The third station 813, fourth station 814, and sixth station 816 (eg, process stations) have magnetic levitation assemblies similar to magnetic levitation assemblies 220, 320, 520 described above.

[0135] Fifth station 815 (e.g., a tantalum nitride process station) may be similar to process station 100 described above or another station described above for processing substrates. Fifth station 815 has a magnetic levitation assembly 120 (not shown) including a first track segment 121 (not shown) and a second track segment 122 (not shown). The rails of each track segment 121, 122 may be configured similarly to rails 124, 126, 224, 226, 324, 524, and 526 described above, or any other rails described herein.

[0136] The magnetic assembly of the third station 813 and the magnetic levitation assembly of the fourth station 814 cooperate to change the axial direction of movement of the carrier 130. Additionally, the magnetic levitation assembly of the sixth station 816 and the magnetic levitation assembly of the first station 811 cooperate to change the axial direction of movement of the carrier 130.

[0137] FIG. 8 includes an XYZ coordinate system to illustrate the axial directions of movement of the carrier 130 and substrate 140 through the substrate processing system 800. The arrows indicate the direction in which one or more carriers circulate within the processing line 801. The carrier 130 receives a substrate from a FOUP 606 in the factory interface 604 entering a first station 811 in the Y direction. The carrier 130 is then transported in the Y direction to a second station 812. The first station 811 also receives the carrier 130 from a sixth station 816 in the X direction. The carrier 130 is transported from the second station 812 to a third station 813 in the Y direction. The carrier 130 is then transported from the third station 813 to a fourth station 814 in the X direction. The carrier is then transported from the fourth station 814 to a fifth station 815 and then in the Y direction to a sixth station 816. The carrier 130 is then returned in the X direction from the sixth station 816 to the first station 811. The fabricated substrate 140 is transferred to the FOUP 606. Another substrate can be placed on the carrier 130 in the first station 811 for processing operations as described above.

[0138] 9 shows a schematic substrate processing system 900 including a controller 101, at least one processing line 901, and a factory interface 604. The system 900 is shown with two processing lines 901 sharing one or more stations, including sharing a magnetic levitation assembly (not shown) for each shared station. Sharing one or more stations can reduce the footprint of the substrate processing system.

[0139] As shown, both processing lines 901 each include multiple stations, such as stations 911-919. Each processing line 901 includes a magnetic transport system (not shown) formed from individual magnetic levitation assemblies of stations 911-919 that transport substrates 140 (not shown) disposed on carriers 130 (not shown) through the processing line 901.

[0140] Each processing line 901 shares a seventh station 917, an eighth station 918, and a ninth station 919. As a result, the magnetic transport systems of each processing line 901 share the magnetic levitation assemblies of the shared stations.

[0141] Each processing line 901 can include multiple slit valves 960 for selectively isolating each station. The slit valves 960 are selectively opened and closed to provide a path for movement of the carrier 130, selectively isolate the stations 911-919 from one another, and facilitate pressurization or depressurization of the stations.

[0142] The substrate processing system 900 is used to process multiple substrates in each processing line 901 to produce the desired manufactured substrates. For example, the substrate processing system 900 may be a PVD system. The first station 911 may be a load lock capable of selectively changing the axial direction of transport of the carrier 130, allowing the carrier 130 to be transferred from the first station 911 to the second station 912 in the Y direction while simultaneously receiving the carrier 130 from the ninth station 919 in the X direction. The second station 912 may be a buffer station, a degassing station, a shutter station, a vacuum soak station, or a combination thereof. The third station 913 may be a pre-cleaning station, the fourth station 914 may be a tantalum nitride deposition station, and the fifth station 915 may be a copper deposition station. The sixth station 916 and the seventh station 917 may each be routing stations capable of selectively changing the axial direction of the carrier. The eighth station 918 may be a transfer station that transfers the carrier 130 from the seventh station 917 to the ninth station 919 .

[0143] The seventh station 917, the eighth station 918, and the ninth station 919 can only handle a single carrier 130 at a time. As a result, production in each processing line 901 may be offset from one another by a period of time. This offset period may be based on the time required to process a substrate in the seventh station 917, the eighth station 918, and the ninth station 919. For example, each processing line 901 may be offset from one another by approximately 30 seconds.

[0144] The sixth station 916, seventh station 917, and ninth station 919 (e.g., routing stations) may have magnetic levitation assemblies similar to magnetic levitation assemblies 230, 430, 530 as described above. For example, the sixth station 916, seventh station 917, and ninth station 919 may each have magnetic levitation assembly 530 for rotating carrier 130 and varying the axial direction of movement of carrier 130.

[0145] The first station 911 (eg, a load lock) may have a magnetic levitation assembly, which may be similar to the magnetic levitation assemblies 230, 430, 530 described above, for changing the axial direction of transport of the carrier.

[0146] The second station 912 may include a magnetic levitation assembly 120 having one or both of a first track segment 121 and a second track segment 122. The rails of each track segment 121, 122 may be configured similarly to the rails 124, 126, 224, 226, 324, 524, and 526 described above, or any other rails described herein. The second station 912 may be configured similarly to the process station 100, where the substrate 140 is elevated into the process region 160 for degassing or vacuum immersion. In some embodiments, the opening 106, kit assembly 180, and pedestal assembly 190 are omitted, and the source assembly 170 is positioned in the transfer region 112 to process the substrate 140 directly on the carrier 130. For example, degassing and vacuum immersion are performed while the substrate 140 is positioned on the carrier 130 in the second station 912. The second station 912 may be a buffer station, and the transfer region 112 of the second station 912 may be selectively isolated by one or more slit valves 960 to provide an isolated volume within the processing line 901 between the external environment and another station. For example, a buffer chamber may be used to reduce the possibility of contaminants entering another station, such as the next station in the processing line through which the carrier 130 travels. In some embodiments, the third station 913 is a shutter station including a shutter disk. The shutter disk is used in place of a substrate to clean processing equipment, such as cleaning deposits within the process region 160. If necessary, the carrier 130 may be transported into the second station 912 without a substrate 140 present to receive the shutter disk. The carrier 130 and shutter disk are then transported through the processing line 901 to clean one or more stations. In some embodiments, the carrier 130 may be transported into the second station 912 with a substrate 140 present.The second station 912 may include one or more robotic arms configured to remove the substrate 140 from the carrier 130 and replace it with a shutter disk when a cleaning operation is required.

[0147] The third station 913, the fourth station 914, and the fifth station 915 (e.g., process stations) may be similar to the process station 100 described above or another station described above for processing substrates. Each station may have a magnetic levitation assembly 120 (not shown) including a first track segment 121 (not shown) and a second track segment 122 (not shown). The rails of each track segment 121, 122 may be configured similarly to the rails 124, 126, 224, 226, 324, 524, and 526 described above, or any other rails described herein.

[0148] The eighth station 918 may be similar to stations 204, 404, 504 and may include a magnetic levitation assembly having rails selected from 124, 126, 224, 226, 324, 524, and 526 as described above, or any other rails described herein.

[0149] The magnetic levitation assembly of the first station 911 and the magnetic levitation assembly of the ninth station 919 cooperate to change the axial direction of movement of the carrier 130. Additionally, the magnetic levitation assembly of the sixth station 916 and the magnetic levitation assembly of the seventh station 917 cooperate to change the axial direction of movement of the carrier 130.

[0150] FIG. 9 includes an XYZ coordinate system to illustrate the axial direction of movement of the carrier 130 and substrate 140 through the substrate processing system 900. The arrows indicate the direction in which one or more carriers circulate within the processing line 901. The carrier 130 receives substrates entering a first station 911 in the Y direction from a FOUP 606 in the factory interface 604. The substrates may be preheated in a preheater 907 in the factory interface 604 before entering the first station 911. The carrier 130 is then transported along the Y direction to a second station 912. The carrier 130 then transports in the Y direction from the second station 912 to a sixth station 916 through stations 913-915. The substrates may have layers deposited in one or more of the stations, such as a fourth station 914 (e.g., a tantalum nitride station) and a fifth station 915 (e.g., a copper deposition station). After the carrier 130 is received at the sixth station 916, the carrier 130 is transported in the X direction to a seventh station 917. The seventh station 917 then transports the carrier 130 in the opposite direction along the Y direction to a ninth station 919. The carrier 130 is then transported further in the X direction from the ninth station 919 back to the first station 911. The fabricated substrate is transferred from the first station 911 to a FOUP 606. Another substrate 140 can be placed on the carrier 130 in the first station 911 for processing operations as described above.

[0151] The shutter disks may be transported from the second station 912 to the first station 911 on a carrier 130 in the same manner as the substrates.

[0152] FIG. 10A shows a schematic substrate processing system 1000 including a controller 101 , at least one processing line 1001 , and a factory interface 604 .

[0153] As shown, both processing lines 1001 each include multiple stations, such as stations 1011-1018. Each processing line 1001 includes a magnetic transport system (not shown) formed from individual magnetic levitation assemblies of stations 1011-1018 that transport substrates 140 (not shown) disposed on carriers 130 (not shown) through the processing line 1001. Each processing line 1001 is independent of the other processing lines. As shown, the processing lines 1001 are physically separated from one another by gaps 1002. The gaps 1002 can be sized to allow a technician to walk between each processing line 1001 and service one or more stations.

[0154] Each processing line 1001 can include a plurality of slit valves 1060 for selectively isolating each station. The slit valves are selectively opened and closed to provide a path for movement of the carrier 130, selectively isolate the stations 1011-1017 from one another, and facilitate pressurization or depressurization of the stations.

[0155] The substrate processing system 1000 is used to process multiple substrates in each processing line 1001 to produce the desired manufactured substrates. For example, the substrate processing system 1000 may be a PVD system. For example, the first station 1011 is a first load lock, the second station 1012 is a degassing station, the third station 1013 is a pre-cleaning station, the fourth station 1014 is a routing station, the fifth station 1015 is a routing station, the sixth station 1016 is a tantalum nitride deposition station, the seventh station 1017 is a copper deposition station, and the eighth station 1018 is a routing station that also functions as a buffer station. Substrates are transferred and processed within each of the process stations 1012-1013 and 1016-1017 in a manner similar to that described above for the other process stations, including stations 612-615. 10A , the second load lock 612 and transfer station 617 of system 600 are eliminated, thereby reducing process time and the footprint of the substrate processing system 1000. The vacuum strength within each station may increase between stations. For example, the vacuum strength within the seventh station 1017 may be greater than the vacuum strength within the other stations.

[0156] The first station 1011 (eg, a load lock) can have a magnetic levitation assembly that can be similar to the magnetic levitation assemblies 230, 430, 530 described above.

[0157] The second station 1012, the third station 1013, the sixth station 1016, and the seventh station 1017 (e.g., process stations) may be similar to the process station 100 described above or another station described above for processing substrates. Each of the stations 1012-1013 and 1016-1017 has a magnetic levitation assembly 120 (not shown) that includes a first track segment 121 (not shown) and a second track segment 122 (not shown). The rails of each track segment 121, 122 may be configured similarly to the rails 124, 126, 224, 226, 324, 524, and 526 described above, or any other rails described herein.

[0158] The fourth station 1014, the fifth station 1015, and the eighth station 1018 (e.g., a routing station) can have magnetic levitation assemblies similar to the magnetic levitation assemblies 230, 430, 530 described above. The fifth station 1015 can also include a plurality of shutter disks disposed on the carrier 130 without substrates. The shutter disks are used in place of substrates when the processing equipment needs to be cleaned, such as to clean deposits in the process region 160.

[0159] The magnetic levitation assembly of the first station 1011 and the magnetic levitation assembly of the eighth station 1018 cooperate to change the axial direction of movement of the carrier 130. Additionally, the magnetic levitation assembly of the fourth station 1014 and the magnetic levitation assembly of the fifth station 1015 cooperate to change the axial direction of movement of the carrier 130.

[0160] FIG. 10A includes an XYZ coordinate system to illustrate the axial directions of carrier and substrate movement through the substrate processing system 1000. The arrows indicate the direction in which one or more carriers circulate within the processing line 1001. The carrier 130 receives a substrate from a FOUP 606 in the factory interface 604 entering a first station 1011 in the Y direction. The carrier 130 is then transported along the Y direction to a second station 1012. The first station 1011 also receives the carrier 130 from an eighth station 1018 in the X direction. After the carrier 130 is transported into the second station 1012, the carrier 130 is transported along the Y direction through a third station 1013 to a fourth station 1014. The carrier 130 is then transported along the Y direction from the fourth station 1014 to a fifth station 1015. The carrier 130 is then transported in the Y direction through stations 1016-1017 from the fifth station 1015 to the eighth station 1018. The carrier 130 is then transported in the X direction back into the first station 1011. The fabricated substrate 140 is transferred to the FOUP 606. Another substrate can be placed on the carrier in the first station 1011 for processing operations as described above.

[0161] The shutter disks may be transported from the fifth station 1015 to the first station 1011 on a carrier 130 in the same manner as the substrates.

[0162] In some embodiments of the substrate processing system 1000A, the processing line 1001 has a non-deposition portion 1003 and a deposition portion 1004. The non-deposition portion 1003 can include a linear arrangement of stations that do not expose the substrate to a process that deposits a layer on the substrate, such as a first station 1011, a second station 1012, a third station 1013, and a fourth station 1014. After the substrate passes through the non-deposition portion 1003, the substrate is transported into the deposition portion 1004, which can also be a linear arrangement of stations, such as a fifth station 1015, a sixth station 1016, a seventh station 1017, and an eighth station 1018, and includes at least one station that deposits at least one layer on the substrate. For example, the non-deposition portion 1003 includes a first station 1011, which is a first load lock, a second station 1012, which is a degassing station, a third station 1013, which is a pre-cleaning station, and a fourth station 1014, which is a routing station. The deposition portion 1004 includes a fifth station 1015, which is a routing station, a sixth station 1016, which is a tantalum nitride deposition station, a seventh station 1017, which is a copper deposition station, and an eighth station 1018, which is a routing station that also functions as a buffer station.

[0163] FIG. 10B illustrates an alternative substrate processing system 1000B, which is the same as substrate processing system 1000A, except that gap 1002 is omitted.

[0164] In some embodiments, one or more of the stations of the processing line 1001 may be included in the same housing. For example, stations 1012-1013 of each processing line 1001 may be double stations sharing the same housing.

[0165] FIG. 10C illustrates an alternative substrate processing system 1000C, which is similar to substrate processing system 1000A, except that each processing line 1001 is connected to a separate factory interface 604 and FOUP 606.

[0166] FIG. 10D illustrates an alternative substrate processing system 1000D, which is similar to substrate processing system 1000A except that it has only one processing line 1001.

[0167] FIG. 10E illustrates an alternative substrate processing system 1000E, which is similar to the substrate processing system 1000A, except that a transfer station 1020 is present for transferring carriers between processing lines 1001. While the transfer station 1020 is shown as being located between the fourth station 1014 of each processing line 1001, the transfer station may also be located between two stations of adjacent processing lines, such as between the first stations 1001. The transfer station 1020 includes a magnetic levitation assembly, which may be similar to the magnetic levitation assemblies 120, 230, 430, and 530 described above. For example, the transfer station 1020 may have a magnetic levitation assembly 120 with only one track segment 121. In some embodiments, the substrate processing system 1000E includes multiple transfer stations 1020 between adjacent processing lines 1001.

[0168] The transfer station 1020 is used to transfer the carrier 130 and the substrates thereon between processing stations. The transfer station 1020 may be disposed in the gap 1002. The transfer station 1020 can be used to divert the carrier to another processing line 1001 that includes one or more stations configured to complete a desired process. In some embodiments, the transfer chamber 1020 is used to divert the carrier to another processing line 1001 when one of the downstream stations of the processing line 1001 needs to be shut down for maintenance.

[0169] In some embodiments, the transfer station 1020 is not used to transfer all substrates being processed in the substrate processing system 1000 between processing lines 1001. Instead, the transfer station 1020 is used when it is desirable to transfer one or more substrates between processing lines 1001.

[0170] In some embodiments, one processing line 1001 is a non-deposition processing line and the other is a deposition processing line. The stations of the non-deposition processing line complete processes that do not deposit a layer on a substrate. The deposition processing line includes at least one station that completes a deposition process to deposit at least one layer on a substrate, or only such stations. A transfer station 1020 can be used to transfer a carrier and the substrate thereon from the non-deposition processing line to the deposition processing line. In other words, the transfer station 1020 allows the substrate to be transferred between different processing lines without exposing the substrate to the atmosphere.

[0171] 11A-11B show a schematic diagram of a substrate processing system 1100 including a controller 101, at least one processing line 1101, and a factory interface 604. The substrate processing system 1100 is shown having two processing lines 1101 that share one or more stations, including sharing a magnetic levitation assembly for each shared station. Sharing one or more stations can reduce the footprint of the substrate processing system.

[0172] As shown, both processing lines 1101 each include multiple stations, such as stations 1111-1120. Each processing line 1101 includes a magnetic transport system (not shown) formed from individual magnetic levitation assemblies of stations 1111-1120 that transport substrates 140 (not shown) disposed on carriers 130 (not shown) through the processing line 1101. Each processing line 1101 may include multiple slit valves 1160 for selectively isolating each station. The slit valves are selectively opened to clear a path for movement of carriers 130 through the processing line 1101.

[0173] The substrate processing system 1100 is used to process multiple substrates in each processing line 1101 to produce the desired manufactured substrates. For example, the substrate processing system 1100 may be a PVD system. For example, the first station 1111 may be a load lock, and the second station 1112 may be a routing station that selectively changes the axial movement direction of the carrier 130 to direct carriers received from both first stations 1111 in the X direction into the third station 1113 in the Y direction. The third station 1113 may be a degassing station. The fourth station 1114 may be a transfer station configured to transport the carrier 130 from the third station 1113 to the fifth station 1115. The degassed substrate 140 may be cooled in the fourth station 1114. The carrier 130 may move between each end of the fourth station 1114 for a selected dwell time sufficient to cool the substrate 140 to a desired temperature. The fifth station 1115 may be a shutter station. The sixth station 1116 and the seventh station 1117 may be routing stations that can selectively change the axial direction of movement of the carrier 130. The sixth station 1116 directs the carrier to either the left or right processing line 1101. The eighth station 1118 may be a pre-cleaning station, the ninth station 1119 may be a tantalum nitride deposition station, and the tenth station 1120 may be a copper deposition station. In some embodiments, the third station 113, the fourth station 1114, and the fifth station 1115 may be combined into one station.

[0174] Each processing line 1101 shares stations 1112 to 1116. As a result, the magnetic transport systems of each processing line 1101 share magnetic levitation assemblies at the shared stations.

[0175] Each shared station 1112-1116 can process only a single carrier 130 at a time. As a result, production in each processing line 1101 may be offset from one another by a period of time. This offset period may be based on the time required to process a substrate within the shared stations 1112-1116. For example, the processing lines 1101 may be offset from one another by approximately 30 seconds.

[0176] A first station 1111 (eg, a load lock) has a magnetic levitation assembly that may be similar to magnetic levitation assemblies 230, 430, 530 described above.

[0177] The second station 1112, sixth station 1116, and seventh station 1117 (eg, routing stations) may have magnetic levitation assemblies similar to magnetic levitation assemblies 230, 430, 530 as described above.

[0178] The third station 1113 may include a magnetic levitation assembly 120 (not shown) having one or both of a first track segment 121 (not shown) and a second track segment 122 (not shown). The rails of each track segment 121, 122 may be configured similarly to the rails 124, 126, 224, 226, 324, 524, and 526 described above, or any other rails described herein. The third station 1113 may be configured similarly to the process station 100, where the substrate 140 is elevated into the process region 160 for degassing. In some embodiments, the opening 106, kit assembly 180, and pedestal assembly 190 are omitted, and the source assembly 170 is positioned in the transfer region 112 to degas the substrate 140 directly on the carrier 130.

[0179] The fourth station 1114 may be similar to stations 204, 404, 504 and may include a magnetic levitation assembly having rails selected from rails 124, 126, 224, 226, 324, 524, and 526 described above, or any other rails described herein.

[0180] The fifth station 1115 may include a magnetic levitation assembly 120 (not shown) having one or both of a first track segment 121 (not shown) and a second track segment 122 (not shown). The rails of each track segment 121, 122 may be configured similarly to the rails 124, 126, 224, 226, 324, 524, and 526 described above, or any other rails described herein. Multiple shutter disks may be disposed in the fifth station 1115. If a cleaning operation is required, the carrier 130 may be transported into the fifth station 1115 without a substrate 140 disposed thereon to receive the shutter disks. The carrier 130 and shutter disks are then transported through the processing line 1101 to clean one or more stations. In some embodiments, the carrier 130 may be transported into the fifth station 1115 with a substrate 140 disposed thereon. One or more robotic arms located in the fifth station 1115 can remove the substrate 140 from the carrier 130 and replace the substrate 140 with a shutter disk.

[0181] Eighth station 1118, ninth station 1119, and tenth station 1120 (e.g., process stations) may be similar to process station 100 described above or another station described above for processing substrates. Each station may have a magnetic levitation assembly 120 including a first track segment 121 and a second track segment 122. The rails of each track segment 121, 122 may be configured similarly to rails 124, 126, 224, 226, 324, 524, and 526 described above, or any other rails described herein.

[0182] FIG. 11B illustrates the transfer region 112 of the tenth station 1120 with the magnetic levitation assembly 120 disposed therein. As illustrated, the tenth station 1120 is similar to the process station 100, but includes a slit valve 1108 that can be closed to bisect the transfer region 112 to form a buffer region 1121 separated from the other region 1122 in which the pedestal 192 and first track segment 121 are located. The buffer region 1121 is the portion of the transfer region 112 on the slit valve 1108 side that includes the second track segment 122, as illustrated. The buffer region 1121 functions similarly to a buffer station. The slit valve 1108 transfers the substrate 140 from the carrier 130 to the pedestal assembly 190 and then closes after moving the carrier 130 to a waiting position above the second track segment 122. The slit valve 1108 may remain closed while the substrate 140 is being processed. A vacuum pump, such as vacuum pump 114, may be in communication with each region 1121, 1122 of the transfer region 112 so that the pressure on either side of the slit valve 1108 can be adjusted independently of each other.

[0183] The magnetic levitation assembly of the first station 1111 and the magnetic levitation assembly of the second station 1112 cooperate to change the axial direction of movement of the carrier 130. Additionally, the magnetic levitation assembly of the sixth station 1116 and the magnetic levitation assembly of the seventh station 1117 cooperate to change the axial direction of movement of the carrier 130.

[0184] FIG. 11A includes an XYZ coordinate system to illustrate the axial directions of carrier and substrate movement through the substrate processing system 1100. The arrows indicate the direction in which one or more carriers circulate within the processing line 1101. The carrier 130 circulates through the processing line 1101 as follows: The carrier 130 receives a substrate from a FOUP 606 in the factory interface 604, which enters a first station 1111 in the Y direction. The substrate may be preheated in a preheater 1107 in the factory interface 604 before entering the first station 1111. The carrier 130 is then transferred in the X direction to a second station 1112. The second station 1112 changes the axial direction of the carrier 130 so that the carrier 130 is transported from the second station 1112 to a third station 1113 in the Y direction. The carrier 130 is then transported in the Y direction from the third station 1113 through the fourth station 1114 and the fifth station 1115 to the sixth station 1116. The sixth station 1116 changes the axial direction of the carrier 130 to transport the carrier 130 in the X direction into the seventh station 1117. The seventh station changes the axial direction of the carrier 130 to transport the carrier 130 in the Y direction into the eighth station 1118. The carrier 130 is then transported in the Y direction through the ninth station 1119 and the tenth station 1120 and back into the first station 1111. The fabricated substrate 140 is transferred to the FOUP 606. Another substrate can be placed on the carrier in the first station 1111 for processing operations as described above.

[0185] 12 shows a schematic diagram of a substrate processing system 1200 having at least one processing line 1201, a first factory interface 1204a, a second factory interface 1204b, and a controller 101. The substrate processing system 1200 has a straight processing line 1201 that does not change the axial direction of the carrier 130. Instead, the carrier 130 is transported linearly from one factory interface to the other along the first axial direction. The straight processing line 1201 can include multiple slit valves 1260.

[0186] Factory interfaces 1204a, b are similar to factory interface 604 described above. Each processing line 1201 includes multiple stations, such as stations 1211-1215. The two processing lines 1201 shown in Figure 12 transport carriers in opposite directions along the same axial direction of movement, as indicated by the arrows.

[0187] The substrate processing system 1200 is used to process multiple substrates in each processing line 1201 to produce the desired manufactured substrates. For example, the substrate processing system 1200 may be a PVD system. For example, the first station 1211 may be a load lock, the second station 1212 may be a pre-cleaning and degassing station, the third station 1213 may be a tantalum nitride deposition station, the fourth station 1214 may be a copper deposition station, and the fifth station 1215 may be a load lock. The carrier 130 and substrate 140 are placed in the first station 1211 and then transported through the processing line 1201 to the fifth station 1215. The substrate 140 may be processed in each station, such as stations 1212-1214.

[0188] After the substrate 140 is fabricated, it is removed from the fifth station 1215 and placed in the FOUP 606. The carrier 130 is also removed from the fifth station 1215. The carrier 130 may then be returned to the first station 1211 to transport additional substrates 140.

[0189] 13A and 13B show a substrate processing system 1300 having at least one processing line 1301, a factory interface 604, and a controller 101. As shown, the substrate processing system 1300 has two linear processing lines 1301 in which the axial direction of the carrier 130 does not change.

[0190] Each processing line 1301 includes one or more stations, such as stations 1311-1317. Lift stations (e.g., stations 1311, 1316) are located at each end of the processing line 1301 and raise and lower the carrier 130 between a first transport surface 1331 and a second transport surface 1332. The carrier 130 is transported linearly along the first transport surface 1331 in a first direction along the axial direction of travel through one or more stations (e.g., 1311-1316). The carrier 130 is then lifted to the second transport surface 1332, where it is transported in the opposite (second) direction along the same axial direction, returning the carrier 130 to the first station (e.g., 1311). The carrier 130 is then returned to the first transport surface 1331.

[0191] The substrate processing system 1300 may be a PVD system including stations 1311-1317. The first station 1311 and the sixth station 1316 are lift stations. The second station 1312 may be a degassing station, the third station 1313 may be a pre-cleaning station, the fourth station 1314 may be a tantalum nitride deposition station, and the fifth station 1315 may be a copper deposition station. The carrier 130 is transported from the first station 1311 to the sixth station 1316 along a first transport surface 1331. The seventh station 1317 is positioned above the stations 1312-1315. The seventh station may be a transfer station configured to transport the carrier 130 from the sixth station 1316 to the first station 1311 along a second transport surface 1332.

[0192] FIG. 13B shows a cross-sectional view of the substrate processing system 1300 along the section line shown in FIG. 13A. Stations 1312-1315 are similar to process station 100. To maintain clarity in FIG. 13B, some, but not all, of the reference numbers from process station 100 are used to label features of stations 1312-1315. The first station 1311 and the sixth station 1316 each include a magnetic levitation assembly 1340. The magnetic levitation assembly 1340 may be similar to magnetic levitation assembly 120 or another magnetic levitation assembly described above. As shown, the magnetic levitation assembly 120 includes a first track segment 121. The first station 1311 and the sixth station 1316 are attached to an actuation assembly 1342 configured to move each of the stations 1311, 1316 between an upper position and a lower position. The actuation assembly 1342 can include a lead screw assembly actuated by a stepper motor or servo motor, a linear motor assembly, an assembly actuated by a pneumatic cylinder, or other conventional mechanical linear actuation mechanism. In some embodiments, the actuator assembly 1342 can raise and lower the rail relative to the housings of the first station 1311 and the sixth station 1316, rather than raising and lowering the stations 1311, 1316.

[0193] Seventh station 1317 may be similar to stations 204, 404, and 504 and may include a magnetic levitation assembly 1350. While FIG. 13B shows magnetic levitation assembly 1350 as having one track segment made of rail 124, magnetic levitation assembly 1350 may include rails selected from rails 124, 126, 224, 226, 324, 524, and 526 as described above, or any other rails described herein. Rails such as rail 124 at each station 1311-1316 are coplanar for transporting carriers 130 along first transport surface 1331 when the first and sixth stations 1311, 1316 are in the down position. Rails such as rail 124 at first station 1311 and sixth station 1316 are flush with rails such as rail 124 at seventh station 1317 to transport carrier 130 along second transport surface 1332 when each of first station 1311 and sixth station 1316 is in the upper position.

[0194] A plurality of carriers 130 and substrates 140 are shown in the processing line 1301. Once the carrier 130 is transported along the first transport surface 1331 into the sixth station 1316, the sixth station 1316 is moved to the upper position as shown in FIG. 13B . The first station 1311 is shown in the lower position after the fabricated substrate 140 is removed from the carrier 130 and the carrier 130 with the new substrate 140 is then transported along the first transport surface 1331 into the second station 1312. The first station 1311 is then raised to the upper position using the actuation assembly 1342 to receive the carrier 130 being transported along the second transport surface 1332 from the sixth station 1316 through the seventh station 1317. The first station 1311 is then returned to the lower position so that the fabricated substrate 140 can be removed from the carrier 130. The sixth station 1316 is returned to the lower position to receive additional carriers 130 from the fifth station 1315 .

[0195] 14 shows a schematic substrate processing system 1400 including a controller 101, at least one processing line 1401, and a factory interface 604. For example, the substrate processing system 1400 may be a PVD system.

[0196] As shown, both processing lines 1401 each include multiple stations, such as stations 1411-1423. Each processing line 1401 is offset from one another by a distance so that substrates can be processed and / or transported simultaneously through both processing lines 1401. Each processing line 1401 shares a central arrangement of stations 1401c and a processing arrangement of stations 1401p. Each processing line 1401 includes a magnetic transport system (not shown) formed from individual magnetic levitation assemblies of stations 1411-1423 that transports substrates 140 disposed on carriers 130 through the processing line 1401. Each processing line 1401 includes multiple slit valves 1460 that can be opened to secure a path of travel for the carriers 130 and selectively closed to isolate stations 1411-1423 from one another.

[0197] Each station 1411-1416 in the central arrangement of stations 1401c is configured to change the axial direction of movement of the carrier 130. For example, each of the stations 1411-1416 may be a routing station having a magnetic levitation assembly similar to the magnetic levitation assemblies 230, 430, 530 described above.

[0198] The station processing arrangement 1401p includes stations 1417-1423. The station processing arrangement 1401p includes lift stations, designated as seventh station 1417 and twelfth station 1422, which move the carrier 130 between the first transport surface and the second transport surface in a manner similar to the lift stations described above with respect to the substrate processing system 1300. The substrates 140 are processed in each of the process stations, designated as stations 1418-1421. Each of the stations 1418-1421 may be similar to the process station 100 described above or another station described above for processing a substrate. Each station 1418-1421 may have a magnetic levitation assembly 120 including a first track segment 121 and a second track segment 122. The rails of each track segment 121, 122 may be configured similarly to rails 124, 126, 224, 226, 324, 524, and 526 described above, or any other rails described herein. The thirteenth station 1423 may be similar to stations 204, 404, and 504 and, as described above, may include a magnetic levitation assembly having one track segment made up of one or more of rails 124, 126, 224, 226, 324, 524, and 526. When the seventh station 1417 and the twelfth station 1422 are moved to their upper positions, the rails of these stations are flush with the rails in the thirteenth station 1423 for transporting carriers along the second transport surface.

[0199] Carrier 130 is not transported linearly in the Y direction of travel through process stations 1418-1421 of station processing arrangement 1401p. Instead, carrier 130 is swapped between station central arrangement 1401c and station processing arrangement 1401p. Controller 101 determines whether carrier 130 is transported into station processing arrangement 1401p to the left or right of station central arrangement 1401c.

[0200] 14 includes an XYZ coordinate system to illustrate the axial directions of carrier and substrate movement through the substrate processing system 1400. The carrier 130 may be transported through the processing line 1401 as follows: The substrate 140 is first transferred from the FOUP 606 to the carrier 130 located at a first station 1411. The first station 1411 then transports the carrier 130 in the Y direction to a second station 1412. The second station 1412 then transports the carrier 130 into an eighth station 1418, where the substrate 140 can undergo processing, such as degassing. The eighth station 1418 then transports the carrier 130 in the X direction back to the second station 1412. The carrier 130 is then transported in the Y direction to a third station 1413. The third station 1413 then transports the carrier 130 to a ninth station 1419, where the substrate 140 can undergo processing, such as pre-cleaning. The ninth station 1419 then transports the carrier 130 in the X direction back into the third station 1413. The third station 1413 then transports the carrier 130 in the Y direction to a fourth station 1414. The fourth station 1414 then transports the substrate in the X direction into a tenth station 1420, where the substrate 140 can undergo processing, such as depositing a tantalum nitride layer thereon. The tenth station 1420 then transports the carrier 130 in the X direction back to the fourth station 1414. The fourth station 1414 then transports the carrier 130 in the Y direction into a fifth station 1415. The fifth station 1415 then transports the carrier 130 in the X direction into an eleventh station 1421, where the substrate 140 undergoes processing, such as depositing a copper layer thereon. The carrier 130 is then transported in the X direction from the eleventh station 1421 back to the fifth station 1415. The fifth station 1415 transports the carrier 130, with the fabricated substrate 140 on it, in the Y direction into a sixth station 1416. The carrier 130 is then transported in the X direction from the sixth station 1416 to a twelfth station 1422.The carrier 130 is lifted from the first transport surface to the second transport surface in the twelfth station 1422, where it is transported in the Y direction into the thirteenth station 1423. The carrier 130 moves in the Y direction along the second transport surface into the seventh station 1417, which is moved to its upper position. The seventh station 1417 then lowers the carrier 130 back to the first transport surface, where it is transported in the X direction back into the first station 1411. The fabricated substrate 140 may be removed from the carrier 130 at the first station 1411 and placed into the FOUP 606. A new substrate 1400 can be placed on the carrier 130 for a processing cycle as described above.

[0201] 15 shows a schematic substrate processing system 1500 including a controller 101, at least one processing line 1501, and a factory interface 604. For example, the substrate processing system 1500 may be a PVD system.

[0202] As shown, both processing lines 1501 each include multiple stations, such as stations 1511-1519. Each processing line 1501 is offset from one another by a distance so that substrates can be processed and / or transported simultaneously through both processing lines 1501. Each processing line 1501 shares a central arrangement of stations 1501c, shown to include stations 1511-1515, and a processing arrangement of stations 1501p. Each processing line 1501 includes a magnetic transport system (not shown) formed from individual magnetic levitation assemblies of stations 1511-1519 that transports substrates 140 (not shown) disposed on carriers 130 (not shown) through the processing line 1501. Each processing line 1501 includes multiple slit valves 1560 that can be opened to ensure a path of travel for the carriers 130 and selectively closed to isolate stations 1511-1519 from one another.

[0203] A central arrangement of stations 1501c includes stations 1511-1516. Lift stations are located at each end of the central arrangement of stations 1501c, shown as the first station 1511 and the fifth station 1515, and move the carrier 130 between the first and second transport surfaces in a manner similar to the lift stations described above with respect to the substrate processing system 1300. Stations 1512-1514 are configured to change the axial direction of movement of the carrier 130. For example, each of stations 1512-1514 may be a routing station having a magnetic levitation assembly similar to magnetic levitation assemblies 230, 430, and 530 described above. A sixth station 1516 is located above stations 1511-1515. The sixth station 1516 may be similar to stations 204, 404, 504 and, as described above, may include a magnetic levitation assembly having one track segment made from one or more of rails 124, 126, 224, 226, 324, 524, and 526. When the first station 1511 and the fifth station 1515 are moved to their upper positions, the rails of these stations are flush with the rails in the sixth station 1516.

[0204] The processing arrangement 1501p of stations includes stations 1517-1519. Each of the stations 1517-1519 may be similar to the process station 100 described above or another station described above for processing substrates. Each station 1517-1519 may have a magnetic levitation assembly 120 (not shown) including a first track segment 121 (not shown) and a second track segment 122 (not shown). The rails of each track segment 121, 122 may be configured similarly to the rails 124, 126, 224, 226, 324, 524, and 526 described above, or any other rails described herein.

[0205] The carrier 130 is not transported linearly in the Y direction of travel through the process stations 1517-1519 of the station processing arrangement 1501p. Instead, the carrier 130 is swapped between the station central arrangement 1501c and the station processing arrangement 1501p. The controller 101 determines whether the carrier 130 is transported into the station processing arrangement 1501p to the left or right of the station central arrangement 1501c.

[0206] 15 includes an XYZ coordinate system to indicate the axial directions of carrier and substrate movement through the substrate processing system 1500. The carrier 130 may be transported in the processing line 1501 as follows: The substrate 140 is first transferred from the FOUP 606 to the carrier 130 located in the first station 1511 when the first station 1511 is in a lowered position to transport the carrier along the first transport plane. The first station 1511 then transports the carrier 130 in the Y direction to the second station 1512. The second station 1512 then transports the carrier 130 in the X direction to the seventh station 1517, where the substrate 140 is processed. After the substrate 140 is processed in the seventh station 1517, the carrier 130 is transported back into the second station 1512. The carrier 130 is then transported in the Y direction to the third station 1513, and then in the X direction from the third station 1513 to the eighth station 1518. After the substrate 140 is processed at the eighth station 1518, the carrier 130 is transported in the X direction back to the third station. The carrier 130 is then transported in the Y direction to the fourth station 1514, and then in the X direction from the fourth station 1514 to the ninth station 1519. After the substrate 140 is processed at the ninth station 1519, the carrier 130 is transported in the X direction back to the fourth station 1514. The carrier 130 is then transported in the Y direction along the first transport surface to the fifth station 1515 while the fifth station 1515 is in the down position. The fifth station 1515 lifts the carrier 130 from the first transport surface to the second surface. The carrier 130 is then transported in the Y direction along the second transport surface from the fifth station 1515 through the sixth station 1516 to the first station 1511. As the carrier 130 enters the first station 1511, the first station 1511 lowers the carrier 130 back onto the first transport surface. The fabricated substrates 140 may be removed from the carrier 130 at the first station 1511 and placed into a FOUP 606.A new substrate 1400 can be placed on the carrier 130 for additional processing cycles.

[0207] The amount of time to complete a process within a station can vary depending on the process. For example, a first station may take approximately half the time to complete processing compared to an adjacent second station, causing carriers in the first station to wait in the first station after processing until processing in the second station is complete. The difference in processing time between stations creates a throughput bottleneck. To maximize throughput, processing lines can be branched to avoid the bottleneck.

[0208]

[0013] Figure 16 shows a branching arrangement 1600 of stations that may be included in one of the processing lines of the substrate processing system described above. The branching arrangement 1600 includes multiple stations and multiple branches. Figure 16 includes an XYZ coordinate system to indicate the axial directions of carrier and substrate movement through the branching arrangement 1600. Arrows indicate the direction in which one or more carriers move through the branching arrangement 1600 of stations.

[0209] A branching arrangement 1600 is shown in FIG. 16 with stations 1611-1616. A carrier (not shown), such as carrier 130, having a substrate 140 (not shown) disposed thereon, is transported into the first station 1611. A slit valve 1660 is disposed between stations 1611-1616. The first station 1611 may be process station 100 or another process station, as described above. The first station 1611 may process the substrate 140 in approximately half the time of another process station in the branch 1601 of the processing line. Each branch 1601 branches off at a second station 1612. A carrier 130 in the second station 1612 is transported in the X direction to one of the two branches 1601. The carrier 130 may be transported to each branch 1601 alternately, offset by a period of time. The offset period may be based on the amount of time required to process and transport a substrate within the branching arrangement 1600. Each branch 1601 can include one or more stations, such as a third station 1613 and a fourth station 1614. Carriers 130 are transported linearly in the Y direction through the branches 1601. The two branches 1601 meet at a fifth station 1615, where the carriers 130 are transported in the X direction from the fourth station 1614 to the fifth station 1615. Carriers entering the fifth station 1615 are then transported in the Y direction into a sixth station 1616.

[0210] In some embodiments, each branch 1601 can both branch and merge, as shown in Figure 16. In some embodiments, each branch 1601 can only branch.

[0211] However, the branching arrangement 1600 may include more than two branches, and each branch may include one or more stations.

[0212] The first station 1611 and the sixth station 1616 may be similar to the process station 100 described above and may have a magnetic levitation assembly 120 including a first track segment 121 and a second track segment 122. The rails of each track segment 121, 122 may be configured similarly to rails 124, 126, 224, 226, 324, 524, and 526 described above, or any other rails described herein.

[0213] Stations 1612-1615 are configured to change the axial direction of movement of carrier 130. Each of stations 1612-1615 may be a process station or a routing station, or other station having a magnetic levitation assembly similar to magnetic levitation assemblies 220, 230, 320, 430, 520, and 530 described above. For example, second station 1612 and fifth station 1615 may be routing stations, and third station 1613 and fourth station 1614 may be process stations.

[0214] Multiple carriers 130 and substrates 140 may be transported and processed simultaneously or asynchronously within the substrate processing system described above. For example, the number of carriers within a substrate processing system may be equal to, less than, or greater than the number of stations in the substrate processing system.

[0215] The number of stations in each processing line of a substrate processing system may vary depending on the desired process or the desired path of movement of the carriers. For example, each processing line may have two or more stations, such as 11 or more stations.

[0216] In some embodiments, one or more stations may be located along a second transport plane of the substrate processing system such that substrates are processed in stations oriented on the first transport plane and the second transport plane.

[0217] 17A-17B illustrate a station 1700 that can be incorporated into any substrate processing system disclosed herein. Station 1700 is similar to station 100. Station 1700 may be a process station having similar components to process station 100, as indicated by reference numerals, and for brevity, a detailed description of these components of process station 100 will not be provided. In some embodiments, station 1700 may not include source assembly 170, process kit assembly 180, pedestal assembly 190, or opening 106.

[0218] 17A shows a cross section of station 1700. Station 1700 includes a first magnetic levitation assembly 1720 positioned above a second magnetic levitation system 1740 within transport region 112 of housing 102. First magnetic levitation assembly 1720 and second magnetic levitation assembly 1740 provide parallel travel paths for different carriers, such as alternate carrier 1730. First magnetic levitation assembly 1720 transports carrier 1730 between positions in transport region 112 to facilitate processing of substrate 140. After processing is complete, first magnetic levitation assembly 1740 transports carrier 1730 out of station 1700 through open second slit valve 105. Second magnetic levitation assembly 1740 provides a return path for carrier 1730 through station 1700.

[0219] The first magnetic levitation assembly 1720 can have a first track segment 1721 separated from a second track segment 1722 by a gap 1723. The first and second track segments 1721, 1722 are aligned to transport a carrier 1730 along a first transport surface. The first track segment 1721 and the second track segment 1722 can be a pair of spaced-apart magnetic first rails 1724, as shown in FIG. 17A. In some embodiments, a track segment such as the first track segment 1721 can optionally include a second pair of rails 1726 perpendicular to the first rails 1724, as shown in FIG. 17B. The second rails 1726 can be disposed between each of the first rails 1724. The second rails 1726 can be shorter in length than the first rails 1724 or equal in length to the first rails 1724. In some embodiments, the first rail 1724 and the second rail 1726 are in contact with each other. In some embodiments, the first rail 1724 and the second rail 1726 are integral with each other. As shown in FIG. 17A , the first rail 1724 and the second rail 1726 are positioned within the transport region 112 by rail support members 103 connected to the housing 102.

[0220] The second magnetic levitation assembly 1740 may be a pair of spaced-apart rails 1744 aligned to transport the carrier 1730 along the second transport surface and positioned within the transport region 112 by rail support members 103 connected to the housing. As shown in FIG. 17A , the rails 1744 are positioned below the rails 1724 and 1726. In some embodiments, the second magnetic levitation assembly 1740 has two track segments configured similarly to the first magnetic levitation assembly 1720. A slit valve (not shown) can be closed in the gap between the track segments of the first and second magnetic levitation assemblies 1720, 1740 to bisect the transport region and create a buffer region to further isolate the process region 160 from other stations or the external environment.

[0221] Each rail 1724, 1726, 1744 includes a plurality of magnets. The plurality of magnets can include electromagnets, permanent magnets, or a combination of both electromagnets and permanent magnets. For example, each rail 1724, 1726, and 1744 can have a plurality of electromagnets in the form of coils 125 disposed within the respective rails that are used to generate electromagnetic currents to levitate and propel the carrier 1730. The rails of the first and second magnetic assemblies 1720, 1740 are spaced apart such that a space 1727 ( FIG. 17B ) exists between the rails, allowing the pedestal assembly 190 to pass through the space in the Z direction without contacting the rails of the magnetic levitation assemblies 1720, 1740. The controller 101 can apply a current to the coils 125 to linearly move the carrier 1730 to a position above the rails 1724, 1726, 1744.

[0222] 17A-17B show an alternative carrier 1730. Carrier 1730 is transportable within transport region 112 by first and second magnetic levitation assemblies 1720 and 1740. However, carrier 130 may be used in place of carrier 1730. Carrier 1730 may be used in place of carrier 130 in any of the substrate processing systems disclosed herein.

[0223] The substrate carrier 1730 may be formed from a non-magnetic material, such as aluminum. In some embodiments, it is beneficial to select the material from which the substrate carrier 1730 is made to include a material that can withstand high processing temperatures. In one example, the substrate carrier 1730 is made from a ceramic material (e.g., alumina, quartz, zirconia, etc.). In some cases, the substrate carrier 1730 may be coated with a conductive coating to address issues with charge buildup on the substrate carrier 1730 during processing in the station 1700.

[0224] The carrier 1730 includes a base 1731 and a substrate support surface 1732. The base 1731 includes a plurality of magnets 1734, such as a plurality of permanent magnets. The plurality of magnets 1734 may be disposed adjacent to an edge of the base 1731. The magnets 1734 are positioned such that when the carrier 1730 is positioned above either the first or second magnetic levitation assembly 1720, 1740, the magnets 1734 interact with at least one rail of the first or second magnetic levitation assembly 1720, 1740 disposed below the carrier 1730. In some configurations, the plurality of magnets 1734 may be arranged to form a Halbach array or other similar configuration. The substrate 140 may be disposed on the substrate support surface 1732 of the carrier 1730. The carrier 1730 may include a recess 1733 formed in the substrate support surface 1732, as shown in FIG. 17B . The lift pins 198 of the pedestal assembly 190 can be inserted through the recesses 1733 to engage the bottom surface of the substrate 140 when the carrier 1730 is in the carrier transfer position.

[0225] The recesses 1733 allow the lift pins 198 to access the bottom surface of the substrate 140. The recesses 1733 are also sized to provide sufficient clearance for a blade (not shown) of a factory interface to enter the recesses 1733 in order to place the substrate 140 on or remove the substrate from the substrate support surface 1732. Although the recesses 1733 are shown in FIG. 17B as pentagonal recesses, the recesses 1733 may instead be hemispherical recesses, V-shaped, or other shapes to allow the lift pins 198 to contact the underside of the substrate 140 and provide sufficient clearance for the blade of the factory interface to enter the recesses 1733.

[0226] A carrier 1730 with a substrate 140 disposed thereon can enter station 1700 for processing through an open first slit valve 104. A first magnetic levitation assembly 1720 is configured to transport the carrier 1730 with the substrate 140 thereon into the transport region 112 for processing. The first magnetic levitation assembly 1720 can move the carrier 1730 between a carrier transfer position and a standby position in a manner similar to that of the magnetic levitation assembly 120 of station 100, and the pedestal assembly 190 and the source assembly 170 can operate in a manner similar to that described with respect to station 100 to process the substrate 140.

[0227] For example, the carrier 1730 carrying the substrate 140 is moved to a carrier transfer position above the first track segment 1721, whereby the substrate 140 is positioned above the support plate 194 of the pedestal 192. The pedestal 192 is moved to the pedestal transfer position, whereby the support plate 194 is positioned adjacent to the bottom surface of the substrate 140. The lift pins 198 are actuated to lift the substrate 140 through the recesses 1733, disengaging the substrate 140 from the substrate support surface 1732. The carrier 1730 then moves to a parked position above the second track segment 1722, with the substrate 140 still supported on the lift pins 198. The lift pins 198 exit the open ends of the recesses 1733 as the carrier 1730 moves away from the carrier transfer position. After the carrier 1730 clears the pedestal 192, the lift pins 198 retract, and the substrate 140 is positioned on the upper surface of the support plate 194. The pedestal 192 is raised to the process position, and the substrate 140 is moved from the transfer region 112 through the opening 106 into the process region 160. The substrate 140 undergoes a process, such as PVD, in the process region 160. The slit valves 104 and 105 may be closed during processing. Once the process is complete, the pedestal 192 is returned to the pedestal transfer position. The lift pins 198 are actuated to lift the substrate 140 above the support plate 194, ensuring sufficient clearance for the substrate support surface 1732 to move beneath the substrate 140. The carrier 1730 moves from the standby position to the carrier transfer position to position the substrate support surface 1732 beneath the substrate 140. The lift pins 198 enter the recesses 1733 as the carrier 1730 moves to the carrier transfer position. Once the carrier 1730 reaches the carrier transfer position, the lift pins 198 are retracted, lowering the substrate 140 into engagement with the substrate support surface 1732. The pedestal 192 is returned to the lower position. The carrier 1730 and processing substrate 140 are then transported by the first magnetic levitation assembly 1720 out of the transfer region 112 through the open second slit valve 105. The substrate 140 can then undergo additional processing in a subsequent station 1700.

[0228] The carrier 1730 and substrate 140 transported out of the station 1700 by the first magnetic levitation assembly 1720 through the open second slit valve 105 can re-enter the station 1700 through the open second slit valve 105. The carrier 1730 re-enters the station 1700 above the second magnetic levitation assembly 1740 and is transported along the second transport surface. The carrier is lowered from the first transport surface to the second transport surface by a lift station. The second magnetic levitation assembly 1740 moves the carrier 1730 through the transport region 112 from the open second slit valve 105 toward the open first slit valve 104. When the pedestal 192 is in the pedestal transfer position or the process position, the pedestal 192 blocks the movement path of the carrier 1730 along the second magnetic levitation assembly 1740. The carrier 1730 may be held in a return waiting position along the second magnetic levitation assembly 1740 while the pedestal 192 blocks the movement path of the carrier 1730. Once the pedestal 192 is returned to the lower position below the rail 1744, the second magnetic levitation assembly 1740 then transports the carrier 1730 out of the transfer region through the open first slit valve 104. The return waiting position may be below the second track segment 1722 of the first magnetic levitation assembly 1720 or a position along the second magnetic levitation assembly 1740 that does not obstruct the movement of the pedestal 192. In some embodiments, the controller 101 waits to move the pedestal 192 from the lower position to the pedestal transfer position until the carrier 1730 carrying the processed substrate 140 has been transported into and out of the transfer region 112 by the second magnetic levitation assembly 1740.

[0229] 18A-18B show a substrate processing system 1800 having at least one processing line 1801, a factory interface 604, and a controller 101. As shown, the substrate processing system 1800 has two straight processing lines 1801 that do not change the axial direction of movement of the carrier 1730.

[0230] Each processing line 1801 includes one or more stations, such as stations 1811-1817. A lift station (e.g., stations 1811, 1817) is located at each end of processing line 1801 and raises and lowers carriers 1730 between first transport surface 1831 and second transport surface 1832. Stations 1812-1816 are each stations 1700. Stations 1812-1816 have first and second magnetic levitation assemblies, such as first and second magnetic levitation assemblies 1720, 1740. The rails of the first magnetic levitation assembly of each station 1812-1816 are aligned to transport carriers along first transport surface 1831, and the rails of the second magnetic levitation assembly of each station 1812-1816 are aligned to transport carriers along second transport surface 1832.

[0231] The carrier 1730 is transported linearly along a first transport surface 1831 through one or more stations (e.g., 1811-1816) in a first direction along an axial direction of travel into a lift station (e.g., lift station 1817). The carrier 1730 is then lowered by the lift station to a second transport surface 1832, where the carrier 1730 is transported linearly in the opposite direction along the same axial direction of travel, returning the carrier 1730 to the first station (e.g., 1811). In other words, the substrate 140 on the carrier 1730 is transported along the first transport surface 1831 for processing and returned along the second transport surface 1832.

[0232] The substrate processing system 1800 may be a PVD system including stations 1811-1817. The first station 1811 and the seventh station 1817 may be lift stations, and the first station 1811 may be a load lock. The second station 1812 may be a buffer station, the third station 1813 may be a degassing station, the fourth station 1814 may be a pre-clean station, the fifth station 1815 may be a tantalum nitride deposition station, and the sixth station 1816 may be a copper deposition station.

[0233] FIG. 18B shows a partial cross-sectional view of substrate processing system 1800 along the section line shown in FIG. 18A. As shown, station 1814 has been omitted. Stations 1812, 1813, 1815, and 1816 are similar to station 1700. To maintain clarity in FIG. 18B, some, but not all, of the reference numbers from station 1700 are used to label features of stations 1812, 1813, 1815, and 1816. A slit valve 1860 is disposed between each station. First station 1811 and seventh station 1817 each include a first magnetic levitation assembly 1840. Magnetic levitation assembly 1840 may be similar to magnetic levitation assembly 120 or another magnetic levitation assembly described above. As shown, the magnetic levitation assembly 1840 includes a first track segment 121 movable by an actuation assembly 1842 between an upper position for transporting the carrier 1730 along the first transport surface 1831 and a lower position for transporting the carrier 1730 along the second transport surface 1832. The actuation assembly 1842 may include a stepper motor or servo motor actuated lead screw assembly, a linear motor assembly, a pneumatic cylinder actuated assembly, or other conventional mechanical linear actuation mechanism. The first station 1811 is shown with the track segment 121 in the lower position for transporting the carrier 1730 along the second transport surface 1832, and the track segment 121 of the seventh station 1817 is shown in the upper position for transporting the carrier 1730 along the first transport surface 1831. In some embodiments, the actuator assembly 1842 may raise and lower the first station 1811 and the seventh station 1817 rather than raising and lowering the rails relative to the housings of the stations 1811, 1817.

[0234] A plurality of carriers 1730 and substrates 140 are shown in the processing line 1801. The substrate 140 may be placed on the carrier 1730 located at the first station 1811 when the track segment 121 of the first station 1811 is in the upper position. The carrier 1730 and substrate 140 are then transported through the stations 1812-1816 along the first transport surface 1831 by the first magnetic levitation assemblies 1720 of each of the stations. The substrate 140 may be processed at one or more of the stations, and the carrier 1730 may move between a standby position and a carrier transfer position at each station. The carrier 1730 exits the sixth station 1816 and enters the seventh station 1817 along the first transport surface 1831 when the track segment 121 of the seventh station 1817 is in the upper position. Once the carrier 1730 has been transported along the first transport surface 1831 into the seventh station 1817, the actuation assembly 1842 is actuated to move the track segment 121 of the seventh station 1817 to a lower position so that the track segment 121 is aligned with the second magnetic levitation assembly 1740 of the sixth station 1816. The carrier 1730 may then be transported along the second transport surface 1832 from the seventh station 1817 into the sixth station 1816. The track segment 121 of the seventh station 1817 is then returned to its upper position by the actuation assembly 1842 to receive the next carrier 1730. The track segment 121 of the first station 1811 is also moved to its lower position to receive the carrier 1730 moving along the second transport surface 1832. The processed substrate 140 can be removed from the carrier 1730 upon its return to the first station 1811. The substrate 140 can be removed from the carrier 1730 while the track segment 121 of the first station is in the lowered position, or after the track segment 121 has been returned to the upper position.

[0235] In some embodiments, a carrier 1730 returning from the seventh station 1817 to the first station 1811 along the second transport surface 1832 moves through stations 1812-1816 without stopping. In other words, the controller 101 delays the raising of the pedestals 192 of stations 1812-1816 until the returning carrier 1730 has returned to the first station 1811. Alternatively, the carrier 1730 may be moved to a waiting position along the second magnetic levitation assembly 1740 of that station while another substrate is being processed at that station. For example, each station 1812-1816 may have a first carrier 1730 in a waiting position along the first magnetic levitation assembly 1720 and a second carrier 1730 in a waiting position (shown in phantom in FIG. 18B ) along the second magnetic levitation assembly 1740 while a substrate 140 is being processed at each of stations 1812-1816. After the process is completed and the pedestal 192 is lowered, each carrier 1730 moves along its respective first and second transport surfaces 1831, 1832 to the next station.

[0236] 19A-19B illustrate a station 1900 that may be incorporated into any of the substrate processing systems disclosed herein. Station 1900 may be a process station having similar components to station 1700, as indicated by reference numerals, and for the sake of brevity, a detailed description of these components of station 1700 will not be provided. Station 1900 differs from station 1700 in that station 1900 includes duplicate components so that two or more substrates can be processed simultaneously within the station.

[0237] FIG. 19A is a cross-sectional view of station 1900. Station 1900 can include two openings 106, two source assemblies 170, two process kit assemblies 180, and two pedestal assemblies 190. First and second magnetic levitation assemblies 1720, 1740 are disposed in the transport region 112. Pedestal 192 is disposed between a first rail 1724 of the first magnetic levitation assembly 1720 and a rail 1744 of the second magnetic levitation assembly 1740. The rails 1724, 1744 are spaced apart to allow both pedestal assemblies 190 to rise and fall without contact within a space 1927 between each pair of rails 1724, 1744. A carrier 1930 (shown in FIG. 19B) is used to facilitate processing two substrates 140 simultaneously within station 1900.

[0238] 19B is a cross-sectional top view of station 1900 showing carrier 1930 in a parked position above second track segment 1722 of first magnetic levitation assembly 1720. As shown, two substrates 140 are supported on carrier 1930. A second carrier 1930 is also shown above second magnetic levitation assembly 1740 below first carrier 1930.

[0239] The carrier 1930 can be formed from a non-magnetic material, such as aluminum. In some embodiments, it is beneficial to select the material from which the carrier 1930 is made to include a material that can withstand high processing temperatures. In one example, the carrier 1930 is made from a ceramic material (e.g., alumina, quartz, zirconia, etc.). In some cases, the carrier 1930 can be coated with a conductive coating to address issues with charge buildup on the substrate carrier 1930 during processing in the process station 1900.

[0240] The carrier 1930 includes a base 1931 and a substrate support surface 1932. The base 1931 includes a plurality of magnets 1934, such as a plurality of permanent magnets. The plurality of magnets 1934 may be disposed adjacent to an edge of the base 1931. The magnets 1934 are positioned such that when the carrier 1930 is positioned above either the first or second magnetic levitation assembly 1720, 1740, the magnets 1934 interact with at least one rail of the first or second magnetic levitation assembly 1720, 1740 positioned below the carrier 1930. In some configurations, the plurality of magnets 1934 may be arranged to form a Halbach array or other similar configuration. Two substrates 140 can be positioned on the substrate support surface 1932 of the carrier 1930. The carrier 1930 includes a recess 1933 formed in the substrate support surface 1932 for each substrate 140. The recesses 1933 are positioned such that each recess 1933 is located above a different pedestal 192. The lift pins 198 of each pedestal assembly 190 can be inserted through each recess 1933 to engage the bottom surface of the substrate 140 when the carrier 1930 is in the carrier transfer position. In some embodiments, each recess 1933 can be part of a single recess formed in the base 1931.

[0241] Each recess 1933 allows the lift pins 198 to access the bottom surface of the substrate 140. Each recess 1933 is also sized to allow sufficient clearance for a blade (not shown) of a factory interface to enter the recess 1933 in order to position the substrate 140 on the substrate support surface 1932. Although the recesses 1933 are shown in FIG. 19B as pentagonal recesses, each recess 1933 may instead be a hemispherical recess, V-shaped, or other shape to allow the lift pins 198 to contact the underside of the substrate 140 and allow sufficient clearance for the blade of the factory interface to enter the recess 1933.

[0242] A carrier 1930 with two substrates 140 disposed thereon can enter station 1900 for processing through an open first slit valve 104. The first magnetic levitation assembly 1720 can move the carrier 1930 between a carrier transfer position and a standby position in a manner similar to that of magnetic levitation assembly 120 of station 100, and the pedestal assembly 190 and source assembly 170 can operate in a manner similar to that described with respect to station 100 to process the substrates 140.

[0243] For example, moving the carrier 1930 to a carrier transfer position above the first track segment 1721 positions each substrate 140 above the support plate 194 of its respective pedestal 192. Moving each pedestal 192 to a pedestal transfer position positions the support plate 194 adjacent to the bottom surface of the substrate 140. The lift pins 198 act to lift the substrate 140 through each recess 1933, causing the substrate 140 to disengage from the substrate support surface 1932. Each substrate 140 may simultaneously disengage from the substrate support surface 1932. In some embodiments, one substrate 140 disengages from the carrier 1930 before the other substrate 140. For example, a first substrate 140 may be disengaged from the carrier 1930, while a second substrate 140 is misaligned on the carrier 1930. The position of the carrier 1930 may be adjusted above the pedestal 192 to facilitate alignment of the substrate 140 with the lift pins 198. After the carrier 1930 is repositioned, the second substrate 140 may be disengaged from the carrier 1930 by actuating the lift pins 198.

[0244] After both substrates 140 are disengaged from the carrier 1930, the carrier 1930 moves to a standby position above the second track segment 1722. The lift pins 198 exit the open ends of the recesses 1933 as the carrier 1930 moves away from the carrier transfer position. After the carrier 1930 clears both pedestals 192, the lift pins 198 retract, positioning the substrates 140 on the upper surfaces of the respective support plates 194. Each pedestal 192 is raised to a process position, moving each substrate 140 from the transfer region 112 into its respective process region 160. In the process region 160, the substrates 140 undergo a process, such as PVD. The slit valves 104, 105 may be closed during processing. Once the process is complete, each pedestal 192 is returned to the pedestal transfer position. The lift pins 198 are actuated to lift each substrate 140 above its corresponding support plate 194, ensuring sufficient clearance for the substrate support surface 1932 to move beneath the substrate 140. The carrier 1930 moves from the standby position to the carrier transfer position to position the substrate support surface 1932 beneath the substrate 140. The lift pins 198 enter each recess 1933 as the carrier 1930 moves to the carrier transfer position. When the carrier 1930 reaches the carrier transfer position, the lift pins 198 are retracted, lowering the substrate 140 into engagement with the substrate support surface 1932. The pedestals 192 are returned to their lower positions. The carrier 1930 and processed substrate 140 are then transported by the first magnetic levitation assembly 1720 out of the transfer region 112 through the open second slit valve 105. The substrate 140 can then undergo additional processing in a subsequent station 1700.

[0245] Carrier 1930 and substrate 140 transported out of station 1900 by first magnetic levitation assembly 1720 through open second slit valve 105 can re-enter station 1900 through open second slit valve 105. Second magnetic levitation assembly 1740 can transport carrier 1930, in the same manner as carrier 1730, along the second transport surface through transport region 112 and out of open first slit valve 104.

[0246] Although station 1900 is shown with two pedestal assemblies 190, source assemblies 170, process kit assemblies 180, and openings 106, station 1900 can include more than two sets of these components. Carrier 1930 can include additional recesses 1933 and can be sized to accommodate additional substrates 140 for processing in station 1900. For example, station 1900 can process three, four, five, or more substrates 140 simultaneously.

[0247] In some embodiments, carrier 1930 may be used in place of carrier 130 in any of the disclosed substrate processing systems. For example, a processing station of a substrate processing system such as system 600 may house carrier 1930 and include the necessary replicated components for processing two substrates simultaneously. A magnetic levitation assembly may be positioned, for example, to house carrier 1930 and facilitate axial variation of movement of carrier 1930.

[0248] 20 illustrates a substrate processing system 2000 having a processing line 2001, a factory interface 604, and a controller 101. As shown, the substrate processing system 2000 has a linear processing line 2001 that does not change the axial direction of movement of a carrier 1930. The carrier 1930 is transported through the processing line 2001 to facilitate simultaneous processing of multiple substrates at each station.

[0249] Processing line 2001 includes one or more stations, such as stations 2011-2017. Lift stations (e.g., stations 2011, 2017) are located at each end of processing line 2001 and raise and lower carrier 1930 between a first transport surface and a second transport surface in a manner similar to substrate processing system 1800. Stations 2012-2016 have first and second magnetic levitation assemblies, such as first and second magnetic levitation assemblies 1720, 1740. The rails of the first magnetic levitation assembly of each station 2012-2016 are aligned to transport carrier 1930 along the first transport surface, and the rails of the second magnetic levitation assembly of each station 2012-2016 are aligned to transport carrier 1930 along the second transport surface.

[0250] The carrier 1930 is transported linearly in a first direction along the axial direction of travel through one or more stations (e.g., 2011-2017) along a first transport surface. The carrier 1930 is then lowered by a second lift station 2011 to a second transport surface. The carrier 1930 is transported in the opposite direction along the same axial direction, and the carrier 1930 is returned to the first station (e.g., 2011) along the second transport surface. In other words, the substrate 140 on the carrier 1930 is transported along the first transport surface for processing and returned along the second transport surface.

[0251] The substrate processing system 2000 may be a PVD system including stations 2011-2017. The first station 2011 and the seventh station 2017 may be lift stations, and the first station 2011 may be a load lock. The second station 2012 may be a buffer station, the third station 2013 may be a degassing station, the fourth station 2014 may be a pre-clean station, the fifth station 2015 may be a tantalum nitride deposition station, and the sixth station 2016 may be a copper deposition station.

[0252] The shutter disk can be circulated through the substrate processing system for use in cleaning or seasoning operations. The shutter disk can also be used to protect the support surface 194 from damage during chamber cleaning and / or seasoning processes. The shutter disk can be placed on a carrier in a first station of the substrate processing system by the factory interface 604, for example, by a robotic arm, in place of the substrate 140. The carrier then transports the shutter disk through the substrate processing system.

[0253] In some embodiments, the shutter disk is placed on a carrier in a shutter station of a substrate processing system instead of being placed on the carrier by a robotic interface. The carrier without a substrate is cycled through the substrate processing system to the shutter station for placement of the shutter disk. The shutter station 2100 (FIGS. 21A-21B) may include similar components as the process station 100, as indicated by reference numerals, however, for the sake of brevity, a detailed description of these components of the process station 100 will not be provided.

[0254] In some embodiments, the shutter disk is a single disk. In some embodiments, the shutter disk is a two-piece assembly, although the shutter disk assembly may include additional components. Additionally, although described herein as a disk, the shutter disk may have any suitable geometry for protecting the support plate 194 in a particular process chamber.

[0255] 21A-21B show a shutter station 2100 that may be incorporated into any of the substrate processing systems disclosed herein. The shutter station 2100 allows for shutter disks to be placed on carriers, such as carriers 130, 1730, 1930, as the carriers cycle through the substrate processing system. A carrier (carrier 1730 shown for simplicity) may be cycled through the substrate processing system without a substrate placed thereon to receive a shutter disk at the shutter station.

[0256] The shutter station 2100 includes a housing 2102, a shutter garage 2103, a transport region 2112 within the housing 2102, a shutter assembly 2120, and a pedestal assembly 190. The shutter garage 2103 may be attached to or integral with the housing 2102. One or more magnetic levitation assemblies are disposed within the transport region 2112. While the first and second magnetic levitation assemblies 1720, 1740 are shown disposed within the transport region 2112, it is contemplated that only one magnetic levitation assembly, such as magnetic levitation assembly 120, may be disposed within the transport region 2112. The shutter station 2100 may optionally include a source assembly 170 and a process kit assembly 180, as shown in FIG. 21B .

[0257] The transfer region 2112 can be in communication with a vacuum pump 114 to evacuate the transfer region 2112. For example, the vacuum pump 114 can reduce the pressure in the transfer region 2112 to approximately 10 -3 The vacuum pump 114 may be a turbopump, a cryopump, a roughing pump, or any other useful device capable of maintaining a desired pressure within the transfer region 2112.

[0258] The shutter assembly 2120 facilitates transport of the shutter disk 2122 onto a carrier, such as carrier 1730, as shown in FIGS. 21A-21B. The shutter assembly 2120 includes an arm 2130 and an actuation assembly 2140. The actuation assembly 2140 is configured to selectively move the arm 2130 between a first position (FIG. 21B) in which the shutter disk 2122 is disposed in the shutter garage 2103 and a second position (FIG. 21A) in which the shutter disk 2122 is disposed above the pedestal 192. The arm 2130 can move through an opening 2107 formed in the housing 2102 between the transport region 2112 and the shutter garage 2103. The arm 2130 and the shutter disk 2122 are disposed above the pedestal 192 and below a magnetic levitation assembly, such as second magnetic levitation assembly 1740, when the arm 2130 is in the second position.

[0259] In some embodiments, when the arm 2130 is in the first position, it is fully disposed in the shutter garage 2103. In some embodiments, when the arm 2130 is in the first position, it is partially disposed in the transport region 2112.

[0260] The arm 2130 has a shutter support surface 2132 and a recess 2134. The shutter support surface 2132 is configured to support the shutter disk 2122 so that the shutter disk 2122 does not fall off the arm 2130 during movement of the arm 2130. The shutter support surface 2132 is capable of engaging a portion of the outer periphery of the shutter disk 2122. The recess 2134 is sized to allow the lift pins 198 access to the underside of the shutter disk 2122 and to allow the arm 2130 to move from the second position to the first position while the shutter disk 2122 is supported by the extended lift pins 198.

[0261] The actuation assembly 2140 includes a shaft 2142 and an actuator 2144. The shaft 2142 is coupled to the arm 2130 and the actuator 2144. The actuator 2144 operates to control the position of the arm 2130. The actuator 2144 rotates the shaft 2142, which moves the arm 2130. The actuator 2144 can also raise and lower the arm 2130 in the Z direction. For example, when the actuator 2144 moves to the second position, it can raise the arm 2130 so that the arm 2130 is positioned between the first magnetic levitation assembly 1720 and the second magnetic levitation assembly 1740. The actuator 2144 can include a lead screw assembly actuated by a stepper motor or servo motor, a linear motor assembly, an assembly actuated by a pneumatic cylinder, or other conventional mechanical linear actuation mechanism.

[0262] Prior to a shutter disk transfer operation, the shutter disk 2122 is placed on the shutter support surface 2132 of the arm 2130. The shutter garage 2103 may be opened to place the shutter disk 2122 on the arm 2130, or the arm 2130 may be moved to retrieve the shutter disk 2122 from a shutter disk cassette (not shown) placed in the shutter garage 2103 that contains multiple shutter disks.

[0263] A carrier such as carrier 1730 may be transported into the shutter station 2100 without a substrate 140 positioned thereon to receive the shutter disk 2122. The actuator 2144 moves the arm 2130 from the first position to a second position to position the shutter disk 2122 on the pedestal 192. The carrier 1730 may be in a standby position while the arm 2130 moves to the second position. The pedestal 192 may be lifted in the Z direction to position the support plate 194 adjacent to the bottom of the shutter disk 2122. The lift pins 198 are actuated to disengage the shutter disk 2122 from the shutter support surface 2132. The actuator 2114 returns the arm from the second position to the first position after the shutter disk 2122 is supported by the lift pins 198 and disengaged from the shutter support surface 2132. Once the arm 2130 is unobstructed, such as when the arm 2130 returns to the first position, the lift pins 198 can be retracted to position the shutter disk 2122 on the support plate 194 of the pedestal 192 .

[0264] When the shutter station 2100 includes a source assembly 170 and a process kit assembly 180, the pedestal 192 can be raised to position the shutter disk 2122 in the process region 160 for a cleaning or seasoning operation. Once the cleaning or seasoning operation is complete, the pedestal 192 is lowered to the pedestal transfer position. The lift pins 198 are extended to lift the shutter disk 2122 above the support plate 194 to ensure sufficient clearance for the substrate support surface 1732 to move below the shutter disk 2122. The carrier 1730 then moves from the standby position to the carrier transfer position. The lift pins 198 are then retracted to position the shutter disk 2122 on the substrate support surface 1732. The pedestal 192 can then return to the lower position. The shutter disk 2122 may then be transported on the carrier 1730, like the substrate 140. Alternatively, if a cleaning or seasoning operation is not required at the shutter station 2100 but is required at a subsequent station in the substrate processing system, the shutter disk 2122 may be transferred from the pedestal 192 to the carrier 1730 without first placing the shutter disk 2122 in the process region 160.

[0265] In some embodiments, the shutter station 2100 does not include the source assembly 170 and the process kit assembly 170. The shutter disk 2122 is transferred by an arm 2130 to the pedestal 192 and from the pedestal 192 to the carrier 1730.

[0266] In some embodiments, the carrier 1930 can be cycled through the shutter station 2100 with one or no substrates 140 disposed thereon so that a shutter disk 2122 can be disposed on the carrier 1930. The shutter station 2100 can be configured to have two or more shutter assemblies 2120 to place multiple shutter disks 2122 on the carrier 1930.

[0267] 22A-22C illustrate a shutter station 2200 that can be incorporated into any substrate processing system disclosed herein. The shutter station 2202 can be controlled by the controller 101. The shutter station 2200 allows a shutter disk to be placed on a carrier, such as carrier 130, 1730, or 1930, as the carrier (carrier 1730 is shown for clarity) circulates through the substrate processing system. The carrier 1730 can circulate through the substrate processing system without a substrate placed thereon to receive a shutter disk within the shutter station. The shutter station 2200 can include similar components to the process station 100, as indicated by reference numerals; however, for the sake of brevity, a detailed description of these components of the process station 100 will not be provided.

[0268] Shutter station 2200 includes a housing 2202, a shutter garage 2203, a transport region 2212 within housing 2202, and a shutter assembly 2220. Shutter garage 2203 may be attached to or integral with housing 2202. One or more magnetic levitation assemblies are disposed within transport region 2212. While first and second magnetic levitation assemblies 1720, 1740 are shown disposed within transport region 2212, it is contemplated that only one magnetic levitation assembly, such as magnetic levitation assembly 120, may be disposed within transport region 2212.

[0269] The transfer region 2112 can be in communication with a vacuum pump 114 to evacuate the transfer region 2112. For example, the vacuum pump 114 can evacuate the transfer region 2112 to a pressure of approximately 10 -3 The vacuum pump 114 may be a turbopump, cryopump, roughing pump, or other useful device capable of maintaining the desired pressure within the transfer region 2112.

[0270] The shutter assembly 2220, as shown in FIGS. 22A-22C, facilitates the transfer of shutter disks 2222 onto a carrier, such as carrier 1730. The shutter disk assembly includes a shutter carriage 2230 and an actuation assembly 2240. The shutter carriage 2230 includes multiple supports 2232, such as the three supports shown in FIGS. 22A-22C, separated from one another to hold different shutter disks. A first shutter disk 2222a is disposed on the first support 2232a, a second shutter disk 2222b is disposed on the second support 2232b, and a third shutter disk 2222c is disposed on the third support 2232c. The supports 2232a-c are positioned such that a carrier can move between adjacent supports to retrieve a shutter disk 2222. Additionally, the supports 2232 are shaped to avoid contact with carriers, such as carrier 1730, as the carrier 1730 moves to retrieve the shutter disk 2222. For example, each support 1732a-c may be sized to fit within a recess 1733 in the carrier 1730. The supports 2232 may be one or more blades. Opening the shutter garage 2203 allows the shutter disk 2222 to be placed on the support members 2232 of the shutter carriage 2230.

[0271] The actuation assembly 2240 is configured to raise and lower the shutter carriage 2230. The actuation assembly 2240 can include a lead screw assembly actuated by a stepper motor or servo motor, a linear motor assembly, an assembly actuated by a pneumatic cylinder, or other conventional mechanical linear actuation mechanism.

[0272] FIG. 22A shows the carrier 1730 in a standby position and the shutter carriage 2230 in a first position (e.g., an upper position) within the shutter garage 2203. When the shutter carriage 2230 is in the first position, the carrier 1730 can pass under the shutter carriage 2230 without contact. The carrier 1730 enters the shutter station 2200 through the open first slit valve 2204 and moves to the standby position while the shutter carriage 2230 is in the first position. Once the carrier 1730 is in the standby position, the actuation assembly 2240 lowers the shutter carriage 2230 to position the shutter disk 2222a in the shutter transfer position. For example, the shutter carriage 2230 can be lowered to a second position (FIG. 22B) to position the first shutter disk 2222a in the first shutter transfer position. After the first shutter disk 2222a is in the first shutter transfer position, the carrier 1730 moves to a carrier transfer position below the first shutter disk 2222a. The support 2232a can enter the recess 1733 when the carrier 1730 moves to the carrier transfer position. In some embodiments, the first support member 2232a is positioned above the support surface 1732 when the first shutter disk 2222a is in the first shutter transfer position.

[0273] Figure 22B shows the carrier 1730 in the carrier transfer position and the first shutter disk 2222a in the first shutter transfer position. There is clearance between the bottom surface of the first shutter disk 2222a and the substrate support surface 1732 of the carrier 1730. Once the carrier 1730 is in the carrier transfer position, the actuation assembly 1740 lowers the shutter carriage 2230 relative to the carrier 1730 to a third position (Figure 22C) to engage the first shutter disk 2222a with the substrate support surface 1732. Once the first shutter disk 2222a contacts the carrier 1730, the carrier 1730 bears the weight of the first shutter disk 2222a and the support 2232a disengages from the first shutter disk 2222a. After the first shutter disk 2222a is transferred to the carrier 1730, the carrier 1730 moves away from the shutter carriage 2230. Once the carrier 1730 and the first shutter disk 2222a are removed from the shutter carriage 2230, the shutter carriage 2230 can return from the third position to the first position. The carrier 1730 and the first shutter disk 2222a may be transferred out of the second slit valve 2205 and into another station of the substrate processing system, where the first shutter disk 2222a is transferred onto the pedestal assembly 190.

[0274] Additional carriers 1730 with substrates 140 disposed thereon may be transported through the shutter station 2220 until it is desired to place the shutter disks 2222b, 2222c on a different carrier 1730. The shutter disks 2222b, 2222c may be placed on the carrier 1730 in the same manner as the first shutter disk 2222a. For example, the second shutter disk 2222b is transferred to a different carrier 1730 by moving the shutter carriage 2230 to a fourth position (not shown) and placing the second shutter disk 2222b in a second shutter transfer position. When the shutter carriage 2230 is in the fourth position, the second support member 2332b may be disposed in or above the recess 1733, and the first support member 2332a is below the carrier 1730. The shutter carriage 2230 is lowered to a fifth position when the carrier 1730 is in the carrier transfer position, engaging the second shutter disk 2222b with the carrier 1730 and disengaging the second shutter disk 2222b from the second support member 2232b. The third shutter disk 2222c is transferred to a different carrier 1730 by moving the shutter carriage 2230 to a sixth position (not shown) to place the third shutter disk 2222c in the third shutter transfer position. When the shutter carriage 2230 is in the sixth position, the third support member 2332c may be positioned in or above the recess 1733, and the second and third support members 2332a,b are below the carrier 1730. The shutter carriage 2230 is lowered to the seventh position when the carrier 1730 is in the carrier transfer position, engaging the third shutter disk 2222c with the carrier 1730 and disengaging the third shutter disk 2222c from the third support member 2232c.

[0275] In some embodiments, the carrier 1930 can be cycled through the shutter station 2200 with one or no substrates 140 placed on it so that a shutter disk can be placed on the carrier 1930. The shutter station 2220 can be configured with two or more shutter assemblies 2220 to place multiple shutter disks 2222 on the carrier 1930.

[0276] 23A-23C illustrate an alternative station 2300 for use in a substrate processing system. The station 2300 may be incorporated into any of the substrate processing systems disclosed herein. A carrier 2330 is transported into the station 2300 with a substrate 140 thereon. The substrate 140 may be processed in the station 2300. The carrier 2330 is configured to avoid the need to be transported to a parked position to facilitate processing of the substrate 140 in the station 2300. The alternative station 2300 may be controlled by the controller 101.

[0277] Station 2300 may be a process station having similar components as process station 100, as indicated by reference numbers, although for brevity, a description of these components of process station 100 will not be detailed. A magnetic levitation assembly 2320 is disposed within the transport region 2312. Station 2300 may optionally include a source assembly 170, a process kit assembly 180, and a pedestal assembly 190.

[0278] The transfer region 2312 can be in communication with a vacuum pump 114 to evacuate the transfer region 112. For example, the vacuum pump 114 can reduce the pressure in the transfer region 2312 to approximately 10 -3 The vacuum pump 114 may be a turbopump, a cryopump, a roughing pump, or any other useful device capable of maintaining the desired pressure within the transfer region 2312.

[0279] Figure 23A shows a cross-sectional view of station 2300 showing a substrate 140 positioned above pedestal 192. Figure 23B shows a top cross-sectional view of station 2300. Figure 23C shows a side cross-sectional view of station 2300 showing a substrate 140 positioned within process region 160.

[0280] The magnetic levitation assembly 2320 includes a pair of spaced apart rails 2324. A space 2327 exists between the rails 2324 sized to allow the pedestal 192 to move to a processing position without contacting either rail 2324. The pedestal 192 is positioned below the space 2327 between the rails 2324, the opening 106, the process kit assembly 180, and the source assembly 170. The pedestal 192 is raised to a processing position and a substrate 140 is processed in the station 2300 in a manner similar to that disclosed for the station 100.

[0281] The substrate carrier 2330 can be formed from a non-magnetic material, such as aluminum. In some embodiments, it is beneficial to select the material from which the substrate carrier 2330 is made to include a material that can withstand high processing temperatures. In one example, the substrate carrier 2330 is made from a ceramic material (e.g., alumina, quartz, zirconia, etc.). In some cases, the substrate carrier 2330 can be coated with a conductive coating to address issues with charge buildup on the substrate carrier 2330 during processing in the station 2300.

[0282] The carrier 2330 includes a base 2331. A pedestal port 2332 is formed in the base 2331. The pedestal port 2332 is an opening in the base 2331 sized to allow the pedestal 192 to pass through the pedestal portion 2332 without contacting the carrier 2330. A plurality of magnets 2334, such as permanent magnets, may be positioned adjacent an edge of the base 2331 such that the magnets 2334 can interact with at least one rail 2324 of the magnetic levitation assembly 2320. In some configurations, the plurality of magnets 2334 may be arranged to form a Halbach array or other similar configuration. The plurality of magnets 2334 may be disposed or embedded within the base 2331.

[0283] A plurality of substrate support assemblies 2340 are coupled to the base 2331, such as being embedded within the base 2331 as shown in FIG. 23A . The substrate support assemblies 2340 are configured to support a substrate 140 at least partially within or above the pedestal port 2332. As shown in FIG. 23A , the substrate support assembly 2340 includes a magnet 2342 attached to a support member 2344 disposed within a bore 2346 formed in the base 2331. The magnet 2342 may be a permanent magnet, and the support member 2344 may be a pin. The support member 2344 is shown in an extended position in FIG. 23A and in a retracted position in FIG. 23C . The support member 2344 may be disposed in the port 2332 in both the extended and retracted positions, or the support member 2344 may be fully retracted within the base 2331 when in the retracted position. The support member 2344 moves between the extended and retracted positions due to a force acting on the magnet 2342. The support member 2344 may be biased toward the extended position by a biasing member 2348. The biasing member 2348 may be an expandable bellows, as shown in FIG. 23A . The biasing member 2348 may be disposed around the support member 2344. The biasing member 2348 may not be disposed in the bore 2346, as shown in FIG. 23A , but may be disposed in the pedestal port 2332, such as against a wall of the port. In some embodiments, the biasing member 2348 may be a spring element disposed around the support member 2344 within the bore 2346.

[0284] In some embodiments, the substrate support assembly 2340 is positioned above or below the pedestal port 2332 such that the support members 2344 extend and retract without entering the pedestal port 2332 .

[0285] FIG. 23A is a cross-sectional view of station 2300. Rail 2324 may be "L" shaped, with first portion 2324a extending from second portion 2324b, as shown. Rail 2324 includes a plurality of magnets, such as electromagnets 2325, configured to interact with magnets 2324 to levitate and / or transport carrier 2330. The plurality of magnetic bodies may be a combination of permanent magnets and electromagnets. Electromagnet 2325, such as a coil, is shown disposed on first portion 2324a of rail 2324 and can be used to generate an electromagnetic current to levitate and propel carrier 2330. Coil 2325 is disposed below shoulder 2329 formed on the surface of first portion 2324a of rail 2324. Carrier 2330 levitates and moves above shoulder 2329.

[0286] An electromagnet 2350 is disposed along each rail 2324 of each substrate support assembly 2340. Each electromagnet 2350 may be embedded within the second portion 2324b of each rail 2324. The electromagnets 2350 can be selectively turned on and off. For example, when the magnet 2342 is turned on, it is attracted to the electromagnet 2350, which moves the support member 2344 to the retracted position. When the electromagnet 2350 is turned off, the biasing member 2348 returns the support member 2344 to the extended position. In some embodiments, the polarity of the electromagnet 2350 is changed to push and pull the magnet 2342, thereby extending and retracting the support member 2344.

[0287] The substrate 140 is supported by the substrate member 2344 when the carrier 2330 is in the extended position so that the carrier 2330 can move the substrate 140 into and out of the station 2300. When the carrier 2330 is transferred into the station 2300 for processing, the carrier 2330 moves to a carrier transfer position, as shown in FIGS. 23A-23C. Each electromagnet 2350 is aligned with a corresponding magnet 2342 on the substrate support assembly 2340 when the carrier 2330 is in the carrier transfer position. Additionally, the pedestal port 2332 is positioned to accommodate vertical movement of the pedestal 192 when the carrier 2330 is in the carrier transfer position.

[0288] Once the carrier 2330 is in the carrier transfer position, the pedestal 192 moves to a pedestal transfer position below the substrate 140. The lift pins 198 are extended to disengage the substrate 140 from the substrate support member 2344 so that there is clearance between the underside of the substrate 140 and the substrate member 2344. The extended substrate member 2344 prevents vertical movement of the pedestal 192. After the substrate 140 disengages from the support member 2344, the electromagnet 2350 is activated to retract the substrate support member 2344. The lift pins 198 are retracted to position the substrate 140 on the support plate 194 of the pedestal 192. After the substrate member 2344 is retracted to position the substrate 140 in the process region 160, the pedestal 192 is raised through the pedestal port 2332 to the processing position shown in FIG. 23C.

[0289] After the process is completed, the pedestal 192 is returned to the pedestal transfer position, and the lift pins 198 are extended to position the substrate 140 above the support plate 194. The substrate 140 and pedestal 192 are positioned so that the substrate member 2344 can extend below the substrate 140 without contacting the substrate 140 or the pedestal 192. When the substrate member 2344 is returned to the extended position, the lift pins 198 are retracted so that the bottom surface of the substrate 140 engages the substrate member 2344. After the substrate 140 engages the substrate member 2344, the lift pins 198 can be fully retracted, and the pedestal 192 can be moved to the lower position. The carrier 2330 may be transported out of the station 2300 by the magnetic levitation assembly 2320.

[0290] In some embodiments, station 2300 includes a second magnetic levitation assembly above or below magnetic levitation assembly 2320 in the transfer region. This second magnetic levitation assembly is used to return processed substrates through station 2300 in transfer region 2312. Controller 101 can wait to raise pedestal 192 to the process position until carrier 2330 carrying the substrate has finished entering and exiting station 2300 above the second magnetic levitation assembly.

[0291] Station 2300 reduces the time it takes to position carrier 2330 within the transport region by avoiding the need to move carrier 2330 to a parked position to facilitate lifting of pedestal 192. The omission of the second track segment reduces the length of station 2300. Additionally, because carrier 2330 is not moved to a parked position within transport region 112, the length of magnetic rail 2324 may be shorter.

[0292] In some embodiments, station 2300 includes a shutter garage and a shutter assembly, such as shutter garage 2103 and shutter assembly 2120 shown in Figures 21A-21B. The shutter disks may be transferred to a carrier 2330 and supported by support members 2344 in a manner similar to that of substrate 140.

[0293] 24A-24C illustrate an alternative station 2400 and an alternative carrier 2430. The carrier 2430 is transported into the station 2400 with a substrate 140 thereon. The substrate 140 may be processed in the station 2400. The alternative station 2400 is controlled by the controller 101. An XYZ coordinate system is included to indicate the axial directions of movement of the components of the station 2400 and the carrier 2430.

[0294] Figure 24A illustrates a cross-sectional view of station 2400 showing substrate 140 engaged with carrier 2430 and positioned above pedestal 192. Figure 24B illustrates a bottom view of carrier 2430. Figure 24C illustrates a side cross-sectional view of station 2400 showing substrate 140 disengaged from carrier 2430.

[0295] Station 2400 may be a process station having similar components to process station 100, as indicated by reference numbers, although for brevity, a detailed description of these components of process station 100 will not be provided. A first magnetic levitation assembly 2420 and an optional second magnetic levitation assembly 2440 may be disposed in a transport region 2412 within housing 2402. Station 2400 may optionally include a source assembly 170, a process kit assembly 180, and a pedestal assembly 190.

[0296] The transfer region 2412 can be in communication with a vacuum pump 114 to evacuate the transfer region 2412. For example, the vacuum pump 114 can reduce the pressure in the transfer region 2412 to approximately 10 -3 The vacuum pump 114 may be a turbopump, a cryopump, a roughing pump, or any other useful device capable of maintaining the desired pressure within the transfer region 2412.

[0297] The substrate carrier 2430 may be formed from a non-magnetic material, such as aluminum. In some embodiments, it may be beneficial to select the material from which the substrate carrier 2430 is made to include a material that can withstand high processing temperatures. In one example, the substrate carrier 2430 is made from a ceramic material (e.g., alumina, quartz, zirconia, etc.). In some cases, the substrate carrier 2430 may be coated with a conductive coating to address issues with charge buildup on the substrate carrier 2430 during processing in station 2400.

[0298] The carrier 2430 includes a base 2431. The base 2431 has an opening 2432 formed therein configured to receive the substrate 140. As shown in FIGS. 24A-24B, two support members 2435 extend from a bottom surface of the base 2431. Opposing edges 2435e of the support members 2435 are separated by a gap 2437. The gap 2437 is sized to allow the lift pins 198 to engage with the bottom surface of the substrate 140. The support members 2435 and the gap 2437 define an opening 2432. A portion of the opening 2432 is disposed between overlapping opposing top surfaces 2438 of the support members 2435 and a bottom surface 2439 of the base 2431. The support members 2435 may be generally rectangular in shape, as indicated by the dashed lines in FIG. 24B. An opening 2432 extends along the length of the carrier, and the substrate 140 can enter and exit through either end 2433 of the opening 2432. The two open ends 2433 allow the carrier 2430 to move in either direction to transfer the substrate 140 to the lift pins 198.

[0299] In some embodiments, the carrier 2430 includes a single support member 2435. For example, the single support member may be generally U-shaped, with opposing edges 2435e being generally U-shaped surfaces that define an opening 2432 having only one open end 2433. In some embodiments, the carrier 2430 includes three or more support members 2435, such as three support members 2435.

[0300] A plurality of magnets 2434, such as permanent magnets, may be positioned adjacent an edge of the base 2431 such that the magnets 2434 can interact with at least one rail 2424 of the magnetic levitation assembly 2420. In some configurations, the plurality of magnets 2434 may be arranged to form a Halbach array or other similar configuration. The plurality of magnets 2434 may be disposed or embedded within the base 2431. The magnets 2434 may be partially disposed in the base 2431 and the respective support members 2435, or the magnets 2434 may be completely disposed in either the base 2431 or the respective support members 2435.

[0301] In some embodiments, the carrier 2430 includes one or more engagement members 2436 disposed on the upper surface 2438 of the support member 2435. The engagement members 2436 extend from the upper surface 2438. The substrate 140 engages with the engagement members 2436 instead of the upper surface 2438 to reduce the contact area between the substrate 140 and the carrier 2430. The engagement members 2436 function as a substrate support surface for the carrier 2430. Reducing the contact area reduces the amount of particulates generated by physical contact between the substrate 140 and the carrier 2430. The one or more engagement members 2436 may be integrally formed with or attached to the support member 2435. For example, the one or more engagement members 2436 may be a plurality of raised protrusions or a single ridge formed by the upper surface 2438 of the support member 2435. The engagement members may be spaced apart from the edge 2435e of the support member 2435. In some embodiments, the engagement member 2435 may be made of ceramic or a material different from the material of the base 2431 .

[0302] In some embodiments, the carrier 2430 does not include one or more engagement members 2436 and the substrate 140 is engaged to an upper surface 2438 of the support member 2435 .

[0303] The first magnetic levitation assembly 2420 is configured to levitate and propel the carrier 2430 along a first transport surface to a position within the transport region 2412, such as transporting the carrier 2430 along the Y-axis between a carrier waiting position and a carrier transfer position. The first magnetic levitation assembly 2420 may include a pair of spaced-apart first rails 2424 aligned to transport the carrier 2430 along the first transport surface. The first rails 2424 include a plurality of magnets, such as electromagnets 2425, configured to interact with the magnets 2434 to levitate and / or transport the carrier 2430 below the first rails 2424. The plurality of magnetic materials may be a combination of permanent magnets and electromagnets. The electromagnet 2425, such as a coil, is shown disposed within the first rails 2424 and may be used to generate an electromagnetic current to levitate and propel the carrier 2430. The strength of the electromagnets 2425 can be adjusted to maintain a constant distance between the first rails 2424 and the carrier 2430 levitating therebelow. The first magnetic levitation assembly 2420 can also include an optional pair of second rails 2426 disposed below the pair of first rails 2424. These second rails 2426 are disposed parallel to the first rails 2424, and the carrier 2430 is transported contactlessly between the first rails 2424 and the second rails 2426. The second rails 2426 do not have to include magnets. The non-magnetic second rails 2426 are included to catch the carrier 2430 if power to the electromagnets 2425 is lost. In some embodiments, the second rails 2426 include multiple magnets, such as electromagnets, to assist in levitation and propulsion of the carrier 2430. In some embodiments, the second rail 2446 includes a plurality of permanent magnets for levitating the carrier 2430 when power is removed from the electromagnet 2425. The first rail 2424 and the second rail 2426 are spaced apart such that there is a space 2427 between the rails. The space 2427 is sized to allow the pedestal assembly 190 to pass through the space 2427 in the Z direction without contacting the rails 2424, 2426.The rails 2424 , 2426 may be positioned within the transport region 2412 by rail support members 103 connected to the housing 2402 .

[0304] Station 2400 may optionally include a second magnetic levitation assembly 2440 disposed in the transport region 2412. The second magnetic levitation assembly 2440 is configured to levitate and propel carrier 2430 along a second transport surface to a position within the transport region 2412. The second magnetic levitation assembly 2440 may be identical to the first magnetic levitation assembly 2420 as shown in FIG. 24A , which includes a pair of first and second rails 2424 and 2426. This second magnetic levitation assembly is used to return processed substrates through station 2400 within the transport region 2412.

[0305] The carrier 2430 can be incorporated into any of the substrate processing systems disclosed herein. In some embodiments, the carrier 2430 is levitated above a pair of magnetic rails instead of below the pair of magnetic rails as shown in FIG.

[0306] In some embodiments, the first and second magnetic levitation assemblies 2420, 2440 include first and second track sections.

[0307] The carrier 2430, with the substrate 140 positioned in the opening 2432, is transported to the carrier transfer position by the first magnetic levitation assembly 2420. The pedestal 192 is raised to the pedestal transfer position, positioning the support plate below the carrier 2430. The lift pins 198 extend to pass through the gap 2437 and engage the bottom surface of the substrate 140. The lift pins 198 further extend to disengage the substrate 140 from the engagement members 2436, thereby transferring the substrate 140 from the carrier 2430 to the lift pins 198. FIG. 24C shows the substrate 140 disengaged from the engagement members 2436 and supported by the lift pins 198. As shown, the substrate 140 is suspended in the opening 2432 on the lift pins 198 without contacting the bottom surface 2439 of the base 2431.

[0308] After the substrate 140 is transferred to the lift pins 198, the carrier 2430 moves to the waiting position. As the carrier 2430 moves to the waiting position, the substrate 140 and lift pins 198 exit the open end 2433 of the opening 2432. The lift pins 198 are lowered to engage the substrate 140 with the support plate 194, and then the pedestal 192 is raised to the process position. After the substrate 140 is processed, the pedestal 192 is returned to the pedestal transfer position. The lift pins 198 are extended to position the substrate 140 above the support plate 194 so that the substrate 140 can enter the opening 2432 without contacting the carrier 2430. Once the substrate 140 is in position, the carrier 2430 is returned to the carrier transfer position. The lift pins 198 are then retracted to engage the substrate 140 with the engagement members 2436, and the substrate 140 is returned to the carrier 2430. Once the substrate 140 is returned to the carrier 2430, the carrier 2430 may be transported to a different station in the substrate processing system.

[0309] The controller 101 may wait to raise the pedestal 192 to the pedestal transfer position until another carrier 2430 has finished being transported through the transport region 2412 by the second magnetic levitation assembly 2440 .

[0310] In some embodiments, carrier 2430 may be used in place of carrier 130 or carrier 1730 in any of the disclosed substrate processing systems. For example, a processing station of a substrate processing system such as system 600 or system 1800 may be configured to accommodate carrier 2430. Station 2400 may also be included in any of the disclosed substrate processing systems, such as a system having one transport surface (e.g., system 600) or a system having two transport surfaces (e.g., system 1800).

[0311] In some embodiments, carrier 2430 may be configured to transport two or more substrates simultaneously, such as by having two or more different sets of support members 2435 for two or more different substrates. Station 2400 contains the replicated components necessary to process two or more substrates simultaneously.

[0312] In some embodiments, the magnetic levitation assemblies 2420, 2440 may be positioned or modified to facilitate axial variation of the carrier's 2430 movement.

[0313] In some embodiments, the carrier 2430 carries a shutter disk or other component instead of the substrate 140 .

[0314] 25A-25B illustrate a station 2500 that can be incorporated into any substrate processing system disclosed herein. Station 2500 may be a process station having similar components to process station 100, as indicated by reference numerals, and for brevity, a detailed description of these components of process station 100 will not be provided. Station 2500 may have one magnetic levitation assembly, such as magnetic levitation assembly 120 shown in FIG. 25A, or station 2500 may have two magnetic levitation assemblies similar to station 1700. Pedestal assembly 190 includes first lift pins 198 and second lift pins 2598. Second lift pins 2598 are disposed around first lift pins 198. Therefore, second lift pins 2598 can be used to lift components having a larger diameter, such as a deposition ring 2540, compared to first lift pins 198. The lift pin actuator 199 can operate the first lift pin 198 and the second lift pin 2598 independently.

[0315] The carrier 130 may be transferred into the transfer region 112 of the station 2500 with the replacement deposition ring 2540 engaged with the substrate support surface 132. The deposition ring 2540 may be engaged with the top plate 185a and / or the cover ring 186 during processing of the subsequent substrate 140. The previous deposition ring may already have been removed from the station 2500 on the previous carrier 130.

[0316] To transfer the deposition ring 2540 from the carrier 130 to the support plate 194, the carrier 130 is transported to a carrier transfer position above the pedestal 192. The pedestal 192 is moved to the pedestal transfer position. The lift pin actuator 199 extends the second lift pins 2598 through the slots 133 to lift the deposition ring 2540 above the substrate support surface 132, as shown in FIG. 25A. The carrier 130 is then moved to a standby position. After the carrier 130 is separated from the pedestal 192 and the deposition ring 2540, the lift pin actuator 199 retracts the second lift pins 2598 to engage the deposition ring 2540 on the support plate 194, as shown in FIG. 25B. The carrier 130 may then be transported out of the station 2500. An additional carrier 130 with substrates 140 disposed thereon may be transported into the station 2500 for processing with the replacement deposition ring 2540.

[0317] In some embodiments, the substrate 140 and the replacement deposition ring 2540 may be transported into station 2500 together on the same carrier 130. The lift pin actuator 199 can extend and retract both the first lift pin 198 and the second lift pin 2598 together to lift the substrate 140 and the deposition ring 2540, respectively, from the substrate support surface 132. The lift pin actuator 199 can then retract the first and second lift pins 198, 2598 together to position the substrate 140 and the deposition ring 2540 on the support plate 194. Similarly, the shutter disk and the deposition ring 2540 may be transported into station 2500 together on the same carrier 130.

[0318] The second lift pins 2598 can be used to transfer other components from the carrier to the support plate 194. For example, the second lift pins 2598 can be used to transfer a calibration element, an edge ring, or a replacement component of the process kit assembly 180.

[0319] 26 is a flowchart of a method 2600 for moving a substrate, such as moving the substrate on a carrier 130, 1730, 1930, or 2430, within a process station 100 or other station described in this disclosure. A controller 101 can control each operation of the method.

[0320] In operation 2602, a carrier with substrate 140 disposed thereon is moved to a carrier transfer position by a magnetic levitation assembly, such as magnetic levitation assembly 120. When the carrier reaches the carrier transfer position, substrate 140 is positioned at a first position above pedestal 192.

[0321] In operation 2604 , the pedestal 192 is moved from the first position to a pedestal transfer position below the substrate 140 .

[0322] In operation 2606, the substrate 140 is lifted from the substrate support surface 132 of the carrier. The substrate 140 may be lifted using the lift pins 198 of the pedestal 192. The lift pins 198 may be extended to lift the substrate 140 from the carrier, such as to lift the substrate 140 from the substrate support surface 132.

[0323] In operation 2608, the carrier is moved by the magnetic levitation assembly to a carrier park position where the carrier is positioned away from the pedestal 192 and the substrate 140 such that the pedestal can lift the substrate 140 without lifting or contacting the carrier.

[0324] In operation 2610, the substrate 140 is lowered into engagement with the support plate 194 of the pedestal 192. The substrate 140 can be lowered by retracting the lift pins 198.

[0325] In operation 2612, the pedestal 192 is moved to a process position to place the substrate 140 in the station's process region 160. The pedestal 192 can be sealably engaged with the station's seal assembly 185.

[0326] In operation 2614, the substrate 140 is processed in the process region 160 by the station's source assembly 170. Within the process region 160, the substrate 140 may undergo PVD, CVD, PECVD, ALD, PEALD, etching, lithography, ion implantation, ashing, cleaning, thermal processes (e.g., rapid thermal processing, annealing, cooling, thermal management control), degassing, and / or other useful substrate processes.

[0327] In operation 2616, after the substrate 140 has been processed in the process region 160, the pedestal 192 is moved from the process position to the pedestal transfer position. The substrate 140 is disengaged from the support plate 194 of the pedestal 192 to provide clearance for a carrier to move between the substrate 140 and the pedestal 192. The substrate 140 may be disengaged from the support plate 194 using the lift pins 198, such as by extending the lift pins 198 to lift the substrate 140 from the support plate 194.

[0328] The carrier is returned from the carrier park position to the carrier transfer position by the magnetic levitation assembly in operation 2618. The substrate support surface 132 of the carrier is positioned below the substrate 140 when the carrier is returned to the carrier transfer position.

[0329] In operation 2620, the substrate 140 is lowered into engagement with the substrate support surface of the carrier, such as engaging the substrate with engagement members 2436. The substrate 140 may be lowered using the lift pins 198, such as by retracting the lift pins 198. The pedestal 192 may be returned to the first position.

[0330] The carrier with the substrate 140 disposed thereon is then moved out of the station using the magnetic levitation assembly in operation 2622. Another carrier with a substrate disposed thereon can be moved into the station and the method 2600 repeated.

[0331] 27 is a flow chart of a method 2700 of operating a substrate station, such as the substrate station disclosed in this disclosure. A controller 101 may control each operation of the method.

[0332] In operation 2702, the carrier is moved in a first axial direction within the station by a magnetic levitation assembly.

[0333] In operation 2704, the axial direction of transport of the magnetic levitation assembly is changed from a first axial direction to a second axial direction. Prior to changing the axial direction of transport, the carrier may be transported between one or more positions along the first axial direction, such as between a carrier transfer position and a carrier standby position.

[0334] For example, the magnetic levitation assemblies may be magnetic levitation assemblies 220, 230. The transport direction of magnetic levitation assembly 220 is changed by moving rails 224, 226 between positions. Magnetic levitation assembly 220 transports carriers in the Y direction when first rail 224 is in the upper position and second rail 226 is in the lower position. Magnetic levitation assembly 220 transports carriers in the X direction when second rail 226 is in the upper position and first rail 224 is in the lower position.

[0335] For example, the magnetic levitation assembly may be magnetic levitation assembly 320, 430. The conveying direction of magnetic levitation assembly 320 is changed by rotating first track segment 321. The carrier is movable between positions along a first axial direction (e.g., Y direction) while first track segment 321 is in a first position. First track segment 321 is rotatable to a second position by actuator 330 to rotate the carrier. The carrier is movable between positions along a second axial direction (e.g., X direction) when first track segment is in the second position.

[0336] For example, the magnetic levitation assemblies may be magnetic levitation assemblies 520, 530. In some embodiments, the axial direction of transport of magnetic levitation assemblies 520, 530 can be changed by turning off electromagnet 524e and turning on electromagnet 526e, or vice versa. In some embodiments, the axial direction of transport of magnetic levitation assemblies 520, 530 can be changed by decreasing the strength of electromagnet 524e and increasing the strength of electromagnet 526e, or vice versa.

[0337] In operation 2706, the carrier is moved in a second axial direction by the magnetic levitation assembly.

[0338] In some embodiments, the substrate processing system includes one or more linear processing lines consisting of multiple stations. The linear processing lines do not include a station with a magnetic levitation assembly configured to change the axial direction of movement from the X direction to the Y direction or vice versa. Factory interfaces are located at each end of the linear processing lines. Unprocessed substrates enter the linear processing line through a first factory interface and are transferred to each station on a carrier. The substrates exit the linear processing line at the opposite end and are transferred to a second factory interface.

[0339] In some embodiments, a substrate processing system has two processing lines each including a plurality of stations. Each processing line has a common first and last station. Substrate processing is offset by a predetermined time so that the shared station can accommodate processing in both processing lines. For example, a first substrate enters the first station and is then directed to the first processing line. A second substrate is placed in the first station a predetermined time later and then directed to the second processing line.

[0340] In one embodiment, the substrate processing system can have one or more lift assemblies for lifting the carrier to a position above other stations in the processing line, where the carrier can be transported above the other stations to an additional lift, which can then lower the carrier back into the first station in the processing line.

[0341] Each processing line of a substrate processing system may be separated by a distance, such as a distance sufficient to allow a person to walk between two adjacent processing lines to perform maintenance.

[0342] In some embodiments, each processing line may include two or more branches. For example, a first process station may take half the time to process a substrate as the other stations. The first process station supplies substrates to the other two connected station branches to maximize throughput.

[0343] In some embodiments, the permanent magnets are rare earth magnets, such as samarium cobalt and neodymium-iron-boron magnets.

[0344] In some embodiments, the carrier is changed from a first axial direction of movement to a second axial direction of movement. The carrier is linearly transported along the first axial direction and linearly transported along the second axial direction. The first axial direction of movement may be perpendicular to the second axial direction of movement. In some embodiments, the first axial direction of movement may not be perpendicular to the second axial direction of movement. For example, the first axial direction of movement may be at an angle of approximately 45 degrees from the second axial direction of movement.

[0345] The carrier can change direction along the axis of motion without changing the axis of motion, for example, the carrier can move linearly between a park position and a carrier transfer position along a first axis of motion, such as along an X-axis of the substrate processing system, without changing along a different axis of motion, such as along a Y-axis of the substrate processing system.

[0346] In one embodiment, a method of operating a substrate station includes moving a carrier in a first axial direction using a magnetic levitation assembly, the method further includes changing an axial direction of transport of the magnetic levitation assembly from the first axial direction to a second axial direction, the method further includes moving the carrier in the second axial direction.

[0347] In some embodiments of the method of operating a substrate station, moving the carrier in a first axis includes moving the carrier between a carrier transfer position and a standby position.

[0348] In some embodiments of the method of operating a substrate station, changing the axial direction of transport of the magnetic levitation assembly includes moving a first rail of the magnetic levitation assembly to a lower position while a second pair of rails is in an upper position.

[0349] In some embodiments of the method of operating a substrate station, changing the axial direction of transport of the magnetic levitation assembly includes rotating a rail of the magnetic levitation assembly relative to a housing of the station.

[0350] In some embodiments of the method of operating a substrate station, the rails include grooves and the carrier is partially disposed in the groove of each rail.

[0351] In some embodiments of the method of operating a substrate station, the step of changing the axial direction of transport of the magnetic levitation assembly includes the steps of turning off a plurality of first electromagnets arranged on a first rail and increasing the current supplied to a plurality of second electromagnets arranged on a second rail.

[0352] In some embodiments of the method of operating a substrate station, the step of changing the axial direction of transport of the magnetic levitation assembly includes the steps of decreasing the current supplied to a plurality of first electromagnets arranged on a first rail and increasing the current supplied to a plurality of second electromagnets arranged on a second rail.

[0353] In some embodiments, the rails of each magnetic levitation assembly may be attached directly to the wall of the station housing instead of being suspended in place by a support member.

[0354] In some embodiments, any station disclosed herein, such as process station 100, can include one or more position sensors in communication with controller 101 to detect the position of a carrier, such as carrier 130, in three-dimensional space. The controller 101 can use these sensors to position the carrier. For example, these sensors can be used for local center detection to position the carrier at a carrier transfer position such that the center of substrate 140 is located above the center of pedestal 192.

[0355] In some embodiments, the rails of the magnetic levitation assembly include only electromagnetic rails.

[0356] In some embodiments, multiple electromagnets on each rail are controlled independently of one another by controller 101 to facilitate levitation and / or propulsion of the carrier. For example, controller 101 can adjust the amount of current provided to each electromagnet so that each electromagnet generates an electromagnetic field of different strength. For example, the controller can adjust the amount of current provided to each electromagnet so that two or more electromagnets generate an electromagnetic field of the same strength.

[0357] In some embodiments, the carrier may be transported in a first direction along a first direction of axial movement from a first station to a second station, and then the carrier may move in a second direction along the first axial direction of movement from the second station back into the first station.

[0358] In some embodiments, the carrier may transport the calibration element into a substrate processing system, such as transporting the calibration element into a processing station of the substrate processing system, which may be used to calibrate alignment or to calibrate a sensor in the station, such as a temperature sensor.

[0359] In some embodiments, the carrier is configured to transport a replacement deposition ring into a station, such as process station 100. The carrier is transported to a carrier transfer position where the pedestal 192 is raised to engage the deposition ring with the support plate 194 and further raised to disengage the deposition ring from the carrier.

[0360] In some embodiments, the carrier is configured to transport the deposition ring into a station, such as process station 100, simultaneously with the substrate 140 or shutter disk. The carrier is transported to a carrier transfer position, where it raises the pedestal 192 to the pedestal transfer position. It also raises the pedestal 192 to engage the deposition ring with the support plate 194 and disengage the deposition from the carrier. After the carrier moves to the park position, the pedestal 192 moves to the process position.

[0361] The substrate support surface of the carrier 130, 1730, 1930 may include engagement members, such as engagement member 2436, for engaging and supporting the substrate 140, shutter disk, or other component.

[0362] In some embodiments, the carrier and substrate may be cycled multiple times through the substrate processing system disclosed herein to deposit multiple layers on the substrate. The substrate may be transported through and processed at one or more stations of the substrate processing system multiple times before being removed from the substrate processing system.

[0363] In some embodiments, the routing station may be configured only to change the axial direction of movement of the substrate carrier. In some embodiments, the routing station may also include components of a process station for processing substrates in addition to changing the axial direction of movement of the substrate carrier. In some embodiments, the routing station may be configured as a load lock or a buffer chamber.

[0364] In some embodiments, any of the substrate processing systems disclosed herein can have multiple processing lines stacked on top of each other and connected to the same factory interface. For example, substrate processing system 1000D can include two or more processing lines 1001 stacked on top of each other, such as two processing lines 1001 connected to the same interface. Processing in stacked processing lines can be offset such that the lower processing line is offset from the other processing line by 30 seconds.

[0365] In one embodiment, a method for processing a substrate in a substrate processing station includes moving a carrier with a substrate disposed thereon to a carrier transfer position in the substrate processing station to position the substrate above a pedestal. The carrier is moved by a magnetic levitation assembly disposed in the substrate processing station. The method further includes moving the pedestal from a first position to a pedestal transfer position below the substrate. The method further includes extending lift pins to raise the substrate from a substrate support surface of the carrier. The method further includes moving the carrier to a standby position in the substrate processing station using the magnetic levitation assembly. The method further includes retracting the lift pins to lower the substrate onto the substrate support surface of the pedestal. The method further includes moving the pedestal to a process position to position the substrate in a process region of the substrate processing station. The method further includes processing the substrate in the process region.

[0366] In some embodiments of the method of processing a substrate in a process station, the process may be at least one of chemical vapor deposition, plasma-enhanced chemical vapor deposition, atomic layer deposition, plasma-enhanced atomic layer deposition, etching, lithography, ion implantation, ashing, cleaning, a thermal process, or degassing.

[0367] In some embodiments of the method for processing a substrate in a process station, the method further includes moving the pedestal from the process position to the pedestal transfer position, and extending the lift pins to lift the substrate off the substrate support surface of the pedestal.

[0368] In some embodiments of the method for processing a substrate in a process station, the method further includes using a magnetic levitation assembly to move the carrier from a standby position to a carrier transfer position such that the substrate support surface of the carrier is below the substrate.

[0369] In some embodiments of the method for processing a substrate in a process station, the method further includes retracting the lift pins to engage the substrate with the substrate support surface of the carrier. The method further includes moving the pedestal to a first position. The method further includes transporting the carrier with the substrate disposed thereon out of the processing station using a magnetic levitation assembly.

[0370] In one embodiment, a substrate processing station includes a housing including a transfer region and a process region. The process station further includes a source assembly. The process station further includes a magnetic levitation assembly disposed in the transfer region. The magnetic levitation assembly includes a first track segment including a first plurality of electromagnets and a second track segment including a second plurality of electromagnets. The process station further includes a pedestal assembly disposed within the housing, the pedestal assembly including a pedestal, an actuator assembly, and lift pins. The process station further includes a controller including a non-transitory computer-readable medium including instructions that, when executed by one or more processors of the controller, cause the substrate processing station to perform operations. An operation including activating one or more of the first plurality of electromagnets to move a carrier having a substrate disposed thereon to a carrier transfer position above the pedestal. An operation further including activating the actuator assembly to move the pedestal from the first position to a pedestal transfer position below a substrate disposed on the carrier. An operation further including extending the lift pins to disengage the substrate from the carrier. The operations further include actuating one or more of the first plurality of electromagnets and one or more of the second plurality of electromagnets to move the carrier from the carrier transfer position to a carrier waiting position in the substrate processing station. The operations further include retracting the lift pins to position the substrate on a surface of the pedestal. The operations further include actuating the actuator assembly to move the pedestal to a processing position and position the substrate in the processing region. The operations further include operating the source assembly to process the substrate in the processing region.

[0371] In some embodiments of the substrate processing station, the process may be at least one of chemical vapor deposition, plasma-enhanced chemical vapor deposition, atomic layer deposition, plasma-enhanced atomic layer deposition, etching, lithography, ion implantation, ashing, cleaning, a thermal process, or degassing.

[0372] In some embodiments of the substrate processing station, the operation further includes actuating the actuator assembly to move the pedestal from the processing position to a pedestal transfer position and extending the lift pins to disengage the substrate from the pedestal.

[0373] In some embodiments of the substrate processing station, the operation further includes activating one or more of the first plurality of electromagnets and one or more of the second plurality of electromagnets to move the carrier from the carrier waiting position to the carrier transfer position.

[0374] In some embodiments of the substrate processing station, the operation further includes retracting the lift pins to engage the substrate with the carrier.

[0375] In some embodiments of the substrate processing station, the operation further includes activating one or more of the first plurality of electromagnets and one or more of the second plurality of electromagnets to move the carrier on which the substrate is disposed out of the processing station.

[0376] While the forgoing is directed to embodiments of the present disclosure, other and further embodiments of the disclosure may be devised without departing from the basic scope thereof, the scope of which is determined by the claims that follow.

Claims

1. a first station, a second station, a third station, and a fourth station, each including a first magnetic levitation assembly configured to change an axial direction of movement of a substrate carrier from a first axial direction of movement to a second axial direction of movement; at least one substrate processing station disposed between the second station and the third station, the at least one substrate processing station comprising a second magnetic levitation assembly configured to move the substrate carrier; At least one processing line comprising: A substrate processing system comprising:

2. 2. The substrate processing system of claim 1, wherein the at least one processing line comprises two processing lines, both processing lines sharing the first station and the fourth station.

3. the first station is a first routing station; the second station is a load lock; the third station is a second routing station; the fourth station is a third routing station; The substrate processing system of claim 1 .

4. the first magnetic levitation assembly: a first magnetic track segment configured to transport the substrate carrier in the first axial direction, the first magnetic track segment being movable to transport the substrate carrier in the second axial direction; Including, The substrate processing system of claim 1 .

5. the magnetic levitation assembly: the first magnetic track segment further comprising a pair of first rails and a pair of second rails, each first rail attached to a first actuator and each second rail attached to a second actuator; each first actuator configured to move a corresponding first rail between a first upper position and a first lower position; each second actuator configured to move the corresponding second rail between a second upper position and a second lower position; The substrate processing system according to claim 4 .

6. 5. The substrate processing system of claim 4, wherein the first magnetic levitation assembly includes an actuator configured to rotate the first magnetic track segment to change the axial direction of the movement from the first axial direction to the second axial direction.

7. the first magnetic levitation assembly: a pair of first rails including a plurality of first electromagnets configured to transport the substrate carrier in the first axial direction and a plurality of first permanent magnets configured to levitate the substrate carrier; a pair of second rails perpendicular to the pair of second rails, each second rail including a plurality of second electromagnets configured to transport the substrate carrier in the second axial direction and a plurality of second permanent magnets configured to levitate the substrate carrier; The substrate processing system of claim 1 .

8. The substrate processing system of claim 1 , wherein the first station, the second station, the third station, and the fourth station are routing stations.

9. a first processing line including a first process station arrangement including a plurality of first process stations including magnetic rails configured to move a first carrier in a first axial direction; a second processing line including a second process station arrangement including a plurality of second process stations including a second magnetic rail configured to move a second carrier in the first axial direction; a central arrangement of stations shared by the first processing line and the second processing line and disposed between the first arrangement of process stations and the second arrangement of process stations; and wherein the central arrangement of the stations comprises: a plurality of stations including magnetic levitation assemblies configured to move the first and second carriers in the first axial direction and configured to move the first and second carriers in the second axial direction; Including, Substrate processing system.

10. the first processing line including a first lift station at each end configured to selectively move the first carrier from between a first transport surface and a second transport surface, a first transfer station located on the second transport surface and configured to transport the first carrier in the second axial direction; the second processing line including a second lift station at each end configured to selectively move the second carrier from between the first transport surface and the second transport surface, a second transfer station located on the second transport surface and configured to transport the second carrier in the second axial direction; The substrate processing system of claim 9 .

11. The central arrangement of the stations is a first lift station at a first end of the central arrangement of stations, the first lift station configured to selectively lift the first carrier and the second carrier from a first transport surface to a transport station located on a second transport surface above the central arrangement of stations; a second lift station at a second end of the central arrangement of stations, the second lift station configured to selectively lower the first and second carriers from the second transport surface to the first transport surface; Including, the transfer station is configured to transfer the first and second carriers in the second axial direction; The substrate processing system of claim 9 .

12. a first plurality of stations in a linear arrangement, wherein a substrate carrier is transportable through the first plurality of stations in a first linear direction of travel along a first transport surface along a plurality of magnetic rails, the substrate carrier being movable by the magnetic rails between positions along the first linear direction within each of the first plurality of stations, wherein at least one of the plurality of stations comprises: a housing including a transport region and a process region, wherein at least two of the plurality of magnetic rails are disposed in the transport region and configured to levitate and propel the substrate carrier; a pedestal assembly comprising a pedestal disposed within the housing, the pedestal being movable between a substrate loading position and a process position; Equipped with Substrate processing system.

13. 13. The substrate processing system of claim 12, wherein the carrier is movable along the first linear direction from a carrier transfer position to a carrier waiting position and from the carrier waiting position to the carrier transfer position at each of the first plurality of stations.

14. a housing including a transport region; a magnetic levitation assembly disposed in the transport region and configured to levitate and propel a substrate carrier; a first track segment including a first rail and a second rail; a first actuator attached to each first rail, each first actuator configured to move a corresponding first rail relative to the housing between a first upper position and a first lower position; and a second actuator attached to each second rail, each second actuator configured to move a corresponding second rail relative to the housing between a second upper position and a second lower position; a magnetic levitation assembly including: A substrate processing station comprising:

15. a housing including a transport region; a magnetic levitation assembly disposed in the transport region and configured to levitate and propel a substrate carrier; a first magnetic track segment configured to propel the carrier in a first axial direction within the transport region, the first track segment rotatable relative to the housing to propel the carrier in a second axial direction within the transport region; a magnetic levitation assembly including: A substrate processing station comprising:

16. a housing including a transport region; a first track segment disposed in the transport region, a pair of first rails, each first rail including a plurality of first electromagnets configured to transport a substrate carrier in a first axial direction and a plurality of first permanent magnets configured to levitate the substrate carrier; and a pair of second rails perpendicular to the pair of first rails, each second rail including a plurality of second electromagnets configured to transport the substrate carrier in a second axial direction and a plurality of second permanent magnets configured to levitate the substrate carrier; a first track segment including: A substrate processing station comprising:

17. a first station, a second station, a third station, and a fourth station, each including a first magnetic levitation assembly configured to change an axial direction of movement of a substrate carrier from a first axial direction of movement to a second axial direction of movement; at least one substrate processing station disposed between the second station and the third station, the at least one substrate processing station comprising a second magnetic levitation assembly configured to move the substrate carrier; at least one processing line comprising: A substrate processing system comprising:

18. a first processing line including a first process station arrangement including a plurality of first process stations including magnetic rails configured to move a first carrier in a first axial direction; a second processing line including a second process station arrangement including a plurality of second process stations including a second magnetic rail configured to move a second carrier in the first axial direction; a central arrangement of stations shared by the first processing line and the second processing line and disposed between the first arrangement of process stations and the second arrangement of process stations; and wherein the central arrangement of the stations comprises: a plurality of stations including magnetic levitation assemblies configured to move the first and second carriers in the first axial direction and configured to move the first and second carriers in the second axial direction; Including, Substrate processing system.

19. a first plurality of stations in a linear arrangement, wherein a substrate carrier is transportable through the first plurality of stations in a first linear direction of travel along a first transport surface along a plurality of magnetic rails, the substrate carrier being movable between positions along the first linear direction within each of the first plurality of stations by the magnetic rails, at least one of the plurality of stations comprising: a housing including a transport region and a process region, wherein at least two of the plurality of magnetic rails are disposed within the transport region and configured to levitate and propel the substrate carrier; a pedestal assembly comprising a pedestal disposed within the housing, the pedestal being movable between a substrate loading position and a process position; Equipped with Substrate processing system.

20. a housing including a transfer area and a first process area; a first magnetic levitation assembly disposed in the transport region and configured to levitate and propel a first carrier, the first magnetic levitation assembly including a first pair of magnetic rails disposed within the transport region and below the first process region; a second magnetic levitation assembly disposed in the transport region below the first magnetic levitation assembly and configured to levitate and propel a second carrier, the second magnetic levitation assembly including a second pair of magnetic rails; a first pedestal disposed within the housing and movable between a pedestal transfer position and a process position, the first pedestal being disposed between the first rail and the second rail at the pedestal transfer position to receive a first substrate from the first carrier and rising between the first rail and the second rail to place the received first substrate at the process position in the first process area; Equipped with Substrate processing station.

21. a station arrangement including a plurality of stations, each station including a first magnetic levitation assembly and a second magnetic levitation assembly disposed in a transfer area of ​​the station; the first magnetic levitation assembly is aligned to transport a first carrier along a first transport surface; the second magnetic levitation assembly is aligned to transport the first carrier along a second transport surface; Station configuration; a first lift station and a second lift station located at opposite ends of the station arrangement, the first lift station and the second lift station configured to move the first carrier between the first transport surface and the second transport surface; Equipped with Substrate processing system.

22. transferring a first substrate from a first carrier onto a first pedestal at a first station; processing the first substrate at the first station while disposed on the first pedestal; transferring the first substrate from the first pedestal onto the first carrier; transporting the first carrier, on which the first substrate is disposed, along a first transport surface into a second station, the first carrier being transported using first magnetic levitation assemblies disposed in transport regions of both the first and second stations; transporting a second carrier, on which a second substrate is disposed, from the second station to the first station along a second transport surface, the second carrier being transported using second magnetic levitation assemblies disposed in the transport regions of both the first station and the second station; Including, A method for operating a substrate support system.

23. a housing including a transport region; a first magnetic levitation assembly disposed in the transport region configured to levitate and propel a first carrier; a shutter garage coupled to the housing; an arm movable from a first position to a second position, wherein a substrate supported on the arm is disposed in the shutter garage when the arm is in the first position; a pedestal disposed within the transfer region and movable to a transfer position to receive a shutter disk disposed on the arm at the second position, the shutter disk being disposed above the pedestal when the arm is at the second position; A shutter station comprising:

24. a housing including a transport region; a first magnetic levitation assembly disposed in the transport region and configured to levitate and propel a first carrier between a standby position and a carrier transfer position; a shutter assembly; wherein the shutter assembly comprises: a shutter carriage including a first support member configured to support a first shutter disk; an actuation assembly configured to move the shutter carriage within the housing; Including, the shutter carriage is movable from a first position to a second position to position the first shutter disk at a first shutter transfer position above the first carrier; the shutter carriage is movable from the second position to a third position to engage the first shutter disk with the first carrier and disengage the first shutter disk from the first support member while the first carrier is in the standby position. Shutter station.

25. 1. A method of transferring a shutter to a carrier, comprising: moving an arm on which a shutter disk is disposed from a first position to a second position to dispose the shutter disk above a pedestal; extending a plurality of lift pins coupled to the pedestal into recesses in the arm to engage and disengage the shutter disk from the arm; moving the arm to the first position after the shutter disk is disengaged from the arm; retracting the plurality of lift pins to engage the shutter disk with the carrier levitated above a magnetic levitation assembly; A method comprising:

26. a housing including a transport region and a process region; a base having a plurality of first magnets; a port formed in the base; and a plurality of substrate support assemblies coupled to the base; a first carrier, wherein each support assembly comprises: a second magnet, and a support member attached to the second magnet, the support member being movable relative to the base between an extended position and a retracted position; Including, The first career, a first magnetic levitation assembly disposed in the transfer region, the first magnetic levitation assembly including a plurality of third magnets configured to interact with the plurality of first magnets to levitate and propel the first carrier, the first magnetic levitation assembly further including a fourth magnet for each substrate support assembly to selectively interact with the second magnets to move the support member to the retracted position; a pedestal assembly disposed in the transfer region, the pedestal being extendable through the port to a process position; A substrate processing station comprising:

27. With the base, a plurality of first magnets disposed around an edge of the base; a port formed in the base; a plurality of substrate support assemblies coupled to the base; each support assembly comprising: a second magnet, and support members attached to the second magnet movable relative to the base between extended and retracted positions, each support member configured to support a substrate in the extended position; Including, A substrate carrier configured for use in a substrate processing system.

28. A method of operating a station, positioning the carrier above the pedestal using a magnetic levitation assembly, the substrate engaged with the plurality of support members in an extended position; extending a plurality of lift pins coupled to the pedestal to disengage the substrate from the plurality of support members; actuating a plurality of first electromagnets of the magnetic levitation assembly to move the plurality of support members to a retracted position; moving the pedestal to a process position through a port formed in the carrier to place the substrate in a process region of the station; A method comprising:

29. 1. A method for processing a substrate in a substrate processing station, comprising: moving a carrier with a substrate disposed thereon to a carrier transfer position within the substrate processing station to position the substrate above a pedestal, the carrier being moved by a magnetic levitation assembly disposed within the substrate processing station; moving the pedestal from a first position to a pedestal transfer position below the substrate; extending lift pins to lift the substrate off the substrate support surface of the carrier; using the magnetic levitation assembly to move the carrier to a parked position within the substrate processing station; retracting the lift pins to lower the substrate onto the substrate support surface of the pedestal; moving the pedestal to a process position to place the substrate in a process region of the substrate processing station; processing the substrate in the process region; A method comprising:

30. a housing including a transport region and a process region; The source assembly, a magnetic levitation assembly disposed in the transport region, a first track segment including a first plurality of electromagnets; and a second track segment including a second plurality of electromagnets; a magnetic levitation assembly including: a pedestal assembly including a pedestal, an actuator assembly, and a lift pin disposed within the housing; a controller comprising a non-transitory computer readable medium containing instructions that, when executed by one or more processors of the controller, cause the substrate processing station to: activating one or more of the first plurality of electromagnets to move a carrier with a substrate disposed thereon to a carrier transfer position above the pedestal; actuating the actuator assembly to move the pedestal from a first position to a pedestal transfer position below the substrate disposed on the carrier; extending the lift pins to disengage the substrate from the carrier; actuating one or more of the first plurality of electromagnets and one or more of the second plurality of electromagnets to move the carrier from the carrier transfer position to a carrier waiting position within the substrate processing station; retracting the lift pins to position the substrate on a surface of the pedestal; actuating the actuator assembly to move the pedestal to a process position and place the substrate in the process region; and operating the source assembly to process the substrate in the process region; including, causing an action to be performed, A controller; a substrate processing station comprising:

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