Method for connecting a first part to a second part and an apparatus comprising a first part and a second part

Abstract

A method for connecting a first component (2) to a second component (3), the method comprising the steps of: a) preparing a first component (2) and a second component (3); b) mating the first component (2) and the second component (3); and c) heating the second component (3), wherein steps b) and c) connect sub-regions (10) of the surface of the first component (2) to sub-regions (10) of the surface of the second component (3) via a connecting material (9), and a plurality of contact regions (8) on the surface (4) of the first component (2) to a plurality of contact regions (8) on the surface (5) of the second component (3) are connected in pairs via a plurality of nanowires (7).

Description

[Technical Field]

[0001] The present invention relates to a method for connecting two components and to a device comprising two correspondingly connected components. The present invention is particularly applicable in the field of electronics, for interconnecting multiple electronic components by electrical and / or thermal conduction.

[0002] To connect two components, the so-called hybrid bonding method is known, particularly in the electronics field. In this method, contacts, for example made of copper, are formed on the two components to be connected, and the gap between the contacts is filled with an adhesive. When the two components are brought together, the contacts of the two components come into contact in pairs. The components are then connected by the adhesive. In this way, the components are mechanically joined and fixed in a stable state. This is followed by an annealing process, in which the two components are heated, thereby also connecting the contacts of the components.

[0003] A drawback of hybrid bonding is that the annealing process exposes components to relatively high temperatures for relatively long periods of time, which can damage temperature-sensitive components such as semiconductor chips. Furthermore, the annealing process requires particularly clean surfaces for the contacts. If dust particles are present between the two contacts, the annealing process may not bond the two contacts as desired. Therefore, hybrid bonding is usually performed under strict cleanroom conditions. In particular, components are rarely moved from one cleanroom to another between the time the contacts are made and the time they are bonded.

[0004] Furthermore, fusion bonding, which is typically performed as part of hybrid bonding, requires particularly smooth surfaces for the components to be bonded. This requires cleanroom conditions and sometimes additional polishing processes, such as chemical mechanical polishing (CMP). These processes are complex and expensive. The most expensive operation is the post-polishing surface cleaning, which is almost always required. Therefore, the cost of hybrid bonding is usually relatively high.

[0005] As alternatives to hybrid bonding, various methods for connecting components are known, particularly in the electronics field. However, these methods have drawbacks compared to hybrid bonding, particularly in that they require relatively large contact surfaces on the components to be connected and the contact surfaces to be spaced relatively far apart. This requires a relatively large pitch. Wire bonding is an example of this. Such methods are generally considered to be less precise than hybrid bonding.

[0006] There are other examples outside the electronics field where two components need to be connected, but the known methods have similar drawbacks. This is the case, for example, with precision mechanical components. Summary of the Invention [Means for solving the problem]

[0007] The object of the present invention is to connect two components in a simple manner with precision and low load, and also to provide a device containing the correspondingly connected components.

[0008] These objects are achieved by the methods and devices set out in the independent claims. Further advantageous embodiments are set out in the dependent claims. The features of the claims and described herein may be combined with one another in any desired manner, where technically appropriate.

[0009] According to the present invention, there is provided a method for connecting a first component to a second component, wherein the surfaces of the first component and the second component each have a plurality of conductive contact areas, the plurality of conductive contact areas being spaced apart from one another and electrically insulated from one another, the method comprising: a) providing a first component and a second component, wherein the first component has a surface on which a plurality of conductive nanowires are disposed in a plurality of contact regions, and the second component has a surface on which a connecting material is disposed in a subregion outside the plurality of contact regions, the connecting material being suitable for connecting the components together via the connecting material; b) mating the first part with the second part, each of the nanowires at the contact regions on the surface of the first component contacts one of the contact regions on the surface of the second component; the connection to the sub-area of ​​the surface of the first component is made by a connecting substance on the second component, the subregion of the surface of the first component is outside the plurality of contact regions of the surface of the first component; c) heating at least the plurality of nanowires and the plurality of contact areas on the surface of the second component to at least 90°C; and, treating the nanowires and the contact areas on the surface of the second component by plasma activation; and at least one of steps b) and c), whereby the plurality of contact areas on the surface of the first component and the plurality of contact areas on the surface of the second component are connected in pairs via the plurality of nanowires, respectively.

[0010] The method allows for the connection of two components, preferably electronic components. For example, a printed circuit board as a first component can be connected to a semiconductor chip as a second component, or vice versa. However, the present invention only relates to the connection of components. Therefore, the advantages of the method described herein are realized regardless of the type of component. That is, it is not important whether the component meets the definition of an electronic component. The method described herein can also be applied to the connection of two components in technical fields other than electronics.

[0011] This method allows components to be connected, in particular mechanically. At the end of the method, the components are firmly fixed together. This method also allows multiple conductive connections between the components to be obtained. These connections are independent of each other, i.e., electrically isolated. Thus, for example, a computer chip (first component) with multiple pins can be attached to a printed circuit board (second component) with a corresponding number of contacts via a corresponding number of conductive connections, and vice versa. This method also allows components to be connected by thermal conduction. In particular, the conductive connections can also be thermally conductive.

[0012] As used herein, "electrically conductive" and "thermally conductive" refer specifically to properties found in metals such as copper, which are generally referred to as "electrically conductive" or, interchangeably, "electrically conductive," or "thermally conductive." In particular, materials that are considered to be electrically or thermally insulating are not generally considered to be electrically or thermally conductive.

[0013] The surfaces of the first and second components each have a plurality of electrically conductive contact areas that are spaced apart and electrically isolated from one another. Thus, the first component has a surface with a plurality of electrically conductive contact areas, and the plurality of electrically conductive contact areas on the surface of the first component are spaced apart and electrically isolated from one another. The second component has a surface with a plurality of electrically conductive contact areas, and the plurality of electrically conductive contact areas on the surface of the second component are spaced apart and electrically isolated from one another.

[0014] According to the methods described herein, a plurality of contact areas on a surface of a first component can be electrically connected in pairs to a plurality of contact areas on a surface of a second component. "Contact areas connected in pairs" means that a first contact area on a surface of a first component is connected to a first contact area on a surface of a second component, a second contact area on a surface of a first component is connected to a second contact area on a surface of a second component, and so on. Generally, the nth contact area on a surface of a first component can be said to be connected to the nth contact area on a surface of a second component. This is true for all values ​​of n, from 1 to the total number of contact areas on each component. Thus, each contact surface of a first component corresponds to one of the contact surfaces of a second component, and vice versa. "Contact areas connected in pairs" in this method means that both components have the same number of contact areas. It also means that the contact areas of the two parts are positioned and sized correspondingly.

[0015] In step a) of the method, a first component and a second component are provided. The first component has a surface on which a plurality of conductive nanowires are arranged in contact areas. The second component is provided in step a) and has a surface on which a connecting material is arranged in subareas outside the contact areas. Thus, upon completion of step a), the first component and the second component are ready for further steps of the method, as described above.

[0016] The term "sub-region" is used to linguistically distinguish it from a contact region. A sub-region can be considered a region subordinate to a contact region in that only the contact region is used for electrical contact between components. Alternatively, a contact region may simply be referred to as a "first type region," or multiple contact regions may be referred to as "multiple regions of the first type." A sub-region may also be referred to as a "second type region," or multiple sub-regions may be referred to as "multiple regions of the second type."

[0017] As used herein, a nanowire is understood to mean any material body having a linear shape and a size ranging from a few nanometers to a few micrometers. The base shape of the nanowire may be, for example, circular, elliptical, or polygonal. In particular, the nanowire may have a hexagonal base shape. The length of the nanowire is preferably in the range of 100 nm (nanometers) to 100 μm (micrometers), particularly in the range of 500 nm to 30 μm. The diameter of the nanowire is preferably in the range of 10 nm to 10 μm, particularly in the range of 30 nm to 2 μm. The diameter here refers to the diameter when the base shape is circular; if the base shape is other than circular, the corresponding definition of the diameter shall be used. In particular, it is preferable that all nanowires used have the same length and diameter.

[0018] The first component can be prepared in step a) by being configured as described above before the start of the method. In this case, nanowires are disposed on the surface of the first component in the contact area even before the start of the method. This can be done, for example, by obtaining a prepared component from a supplier. Alternatively, the first component can be configured as described above as part of the method. In this case, a plurality of nanowires can be provided on the surface of the first component in the contact area in step a). This can be done, for example, by galvanic growth.

[0019] The second component can be prepared in step a) by being configured as described above before the start of the method. In this case, the connecting material can be disposed on a subregion of the surface of the second component even before the start of the method. This can be achieved, for example, by obtaining a prepared component from a supplier. Alternatively, the second component can be configured as described above as part of the method. In this case, the connecting material can be provided on a subregion of the surface of the second component in step a).

[0020] The connecting material is suitable for connecting components to each other via the connecting material. For example, the connecting material may be an adhesive, in particular a PI adhesive. However, the described method is not limited to the use of an adhesive. It is also possible to connect components to each other via other materials that do not fall under the definition of an adhesive. For example, the connecting material may be an oxide, such as silicon oxide. If the surface of the subregion is formed of an oxide, the oxide used as the connecting material can be connected to the surface by fusion bonding. Therefore, it is preferable to satisfy at least one of the following: using an oxide as the connecting material; the subregion on the surface of the first component is formed of an oxide; and the subregion on the surface of the second component is formed of an oxide.

[0021] It is sufficient that the components are initially only weakly connected via the connecting material. Such a connection can be considered a preliminary connection. In the case of oxides such as silicon oxide, such a connection is possible even before fusion bonding. The connection made by the connecting material can be further strengthened in further steps of the method. In particular, when oxides such as silicon oxide are used as the connecting material, the connection can be further strengthened by fusion bonding.

[0022] It is sufficient that the second component prepared in step a) has a connecting material disposed in the subregion. Preferably, after step a), the first component does not contain any material that meets the definition of the term "connecting material" as used herein. This simplifies the method, since it is not necessary to provide the first component with connecting material either. The connecting material then comes into contact with the first component for the first time in step b). Alternatively, the connecting material can be disposed in the corresponding subregion in both the first component and the second component prepared in step a). In this case, the connecting material of the second component comes into contact with the connecting material of the first component in step b).

[0023] The first part provided in step a) has a plurality of contact areas, and the second part provided in step a) has a plurality of contact areas and sub-areas. Sub-areas are also formed on the surface of the first part at the latest during the process. It is sufficient that each of the first and second parts has exactly one sub-area. In this case, the sub-area of ​​the first part and the sub-area of ​​the second part form a pair. This case will be explained below. However, each of the first and second parts may have multiple sub-areas that are spaced apart from each other. In this case, there will be multiple pairs of sub-areas of the first part and the second part. In this case, the reference in this specification to a pair of sub-areas applies.

[0024] In step b), the two components are brought together. First, each nanowire in a contact area on the surface of the first component is brought into contact with one of the contact areas on the surface of the second component. At the latest at the end of the method, the contact areas on the surface of the first component are connected in pairs to the contact areas on the surface of the second component via the respective nanowires. Thus, at the latest at the end of the method, a first contact area on the surface of the first component is connected to a first contact area on the surface of the second component via the first plurality of nanowires, a second contact area on the surface of the first component is connected to a second contact area on the surface of the second component via the second plurality of nanowires, and so on. In general, at the latest at the end of the method, the nth contact area on the surface of the first component is connected to the nth contact area on the surface of the second component via the nth plurality of nanowires. This is true for all values ​​of n from 1 to the total number of contact areas on each component.

[0025] Each nanowire has two ends. Preferably, at the latest by the end of step a), the first end of the nanowire is fixedly connected to the surface of the first component at the contact area. According to step b), the second end of the nanowire is brought into contact with the surface of the second component at the contact area. Preferably, the first end of the nanowire is perpendicular to the surface of the first component and / or the second end of the nanowire is perpendicular to the surface of the second component. However, the nanowires do not necessarily have to be precisely positioned as described in this paragraph. In particular, the method does not involve the nanowires growing unevenly or not all pointing in the same direction, as is often the case in practice.

[0026] The nanowires on the first component are arranged in the contact areas on the surface of the first component. The nanowires are already connected to the surface of the first component at the end of step a) at the latest. This connection can be achieved, for example, by growing the nanowires by galvanic growth in the contact areas on the surface of the first component in step a) or before starting the method. However, it is also conceivable that nanowires formed separately, e.g., by galvanic growth, are first transferred to the surface of the first component in step a) or before starting the method, and then connected to the surface of the first component in the contact areas. The nanowires are preferably made of the same material as the surface of the first component in the contact areas. This allows for particularly good adhesion of the nanowires to the surface of the first component. The nanowires and the contact areas on the surface of the first component are preferably made of metal, in particular copper. The contact areas on the surface of the first component refer to areas on which the nanowires are arranged at the end of step a) at the latest. However, the fact that the contact areas on the surface of the first component are spaced apart and electrically isolated from one another also means that the surface of the first component between the contact areas is formed of another electrically insulating material, and in this respect the contact areas on the surface of the first component are recognizable as contact areas even before the nanowires are grown.

[0027] After step b), the nanowires are in contact with the surface of the second component in the contact area. This contact may be loose, meaning that the nanowires are in contact with the surface of the second component but are not yet firmly connected. In this case, such a firmly connected connection is only formed in further steps of the method. However, the nanowires may already be connected to the surface of the second component at the end of step b), in which case this connection is strengthened in further steps of the method.

[0028] The contact areas on the surface of the second component refer to the areas that are in contact with the nanowires at the latest by the end of step b). However, the fact that the contact areas on the surface of the second component are spaced apart from one another and electrically insulated from one another means that the surface of the second component between the contact areas is formed of another electrically insulating material. In this respect, the contact areas on the surface of the second component can be recognized as contact areas even before the nanowires come into contact with the surface of the second component in step b).

[0029] The nanowires are preferably made of the same material as the contact areas on the surface of the second component, which allows the nanowires to adhere particularly well to the surface of the second component, and the nanowires and the contact areas on the surface of the second component are preferably each made of metal, in particular copper.

[0030] The subregions on the surface of the first component are then connected to the subregions on the surface of the second component via the connecting material of the second component. If the connecting material is an adhesive, the connection is made by adhesion. If the connecting material is an oxide, such as silicon oxide, and the surface of the corresponding subregion is also made of oxide, the connection is an oxide-oxide bond.

[0031] If the first part prepared in step a) does not have any connecting material and the second part prepared in step a) only has connecting material disposed in a sub-region, the connection is made only by the connecting material.

[0032] The connecting material on the second component is disposed in a subregion of the surface of the second component. The connecting material is already connected to the surface of the second component by the end of step a) at the latest. This can be achieved, for example, by providing the connecting material in the subregion of the surface of the second component in step a) or before starting the method. The subregion of the surface of the second component refers to an area on which the connecting material is disposed by the end of step a) at the latest. Furthermore, the subregion of the surface of the second component does not necessarily have to be distinguishable as a separate area. However, it may be distinguishable, for example, if the subregion of the surface of the second component is formed of a different material from the areas outside the subregion. In particular, the subregion may be formed by a portion of the surface of the second component that does not belong to any of the contact areas. The electrical isolation of the surface of the second component by the subregions can electrically insulate the contact areas from each other.

[0033] At the latest after step b), the connecting material is in contact with the surface of the first component in a subregion of the surface of the first component, at which point the two components can be connected via the connecting material.

[0034] If the connecting substance is an adhesive, the adhesive can be cured at any time after step b), and the fact that the connection is made by adhesive means means that the adhesive will not have cured when the two parts are brought together in step b).

[0035] The subregion on the surface of the first component refers to a region that is in contact with the connecting material by the end of step b) at the latest. Furthermore, the subregion on the surface of the first component does not need to be identifiable as a separate region. In particular, the subregion on the surface of the first component does not need to be identifiable as such a separate region even before step b). It is sufficient that the connecting material contacts a portion of the surface of the first component in step b), thereby forming a subregion on the surface of the first component. However, the subregion may be identifiable as a separate region even before step b). For example, the subregion on the surface of the first component may be identifiable if it is formed of a material different from the other regions. In particular, the subregion may be formed by a portion of the surface of the first component that does not belong to any of the contact regions. The surface of the first component is electrically insulated by the subregions, thereby electrically insulating the contact regions from each other.

[0036] If a connecting material is disposed on both the sub-region of the first component provided in step a) and the sub-region of the second component provided in step a), the connecting material of the second component will mechanically connect to the sub-region of the surface of the first component, insofar as the connecting material of the second component is involved in connecting the first component to the second component, and the connecting material of the first component also participates in forming such a connection.

[0037] The above-described method allows two components to be connected to each other in two ways simultaneously. One method involves connecting the components to each other via a connecting material. If the connecting material is an adhesive, curing of the adhesive after step b) is sufficient to establish the connection. The other method involves forming multiple nanowire connections between the components via nanowires. The nanowire connections are formed at the latest by step c). The connection made via the connecting material is intended in particular to rigidly connect the two components to each other, preventing them from moving relative to each other before the final nanowire connection is made. In this respect, the connection is an auxiliary means used in the method. However, the connection is also intended to permanently and mechanically connect the two components to each other. In this respect, the connection remains valid even after the method is completed. In addition to the connection formed by the connecting material, the two components are also mechanically connected to each other by the nanowire connections.

[0038] In step c), at least the contact area of ​​the nanowires and the surface of the second component is heated to at least 90°C, in particular at least 170°C, and / or, preferably, at least the contact area of ​​the nanowires and the surface of the second component is treated by plasma activation, where the heating can occur during plasma activation or by another heating method.

[0039] As a result of the heating and / or the plasma activation, the nanowires are connected to the surface of the second component, if they are not already connected. After step b), there is only loose contact between the nanowires and the surface of the second component, but this contact can be strengthened in further steps of the method, as described above. This strengthening may occur in step c). As a result of the heating and / or the plasma activation, the nanowires and the surface of the second component can be connected at the atomic level. The connection can be further strengthened by temporarily pressing the components together.

[0040] At the latest in step c), nanowire connections between the first and second components are formed between their contact areas. These nanowire connections are particularly strong if the contact areas on the surface of the first component, the nanowires and the contact areas on the surface of the second component are made of the same material. This arrangement is therefore preferred. The material is preferably a metal, in particular copper.

[0041] To connect the nanowire to the surface of the second component, it is sufficient to heat the contact area between the nanowire and the surface of the second component in step c). Whether the other parts of the two components are also heated is not important for the formation of the connection. Step c) is most easily performed by heating the entire first and second components, for example by placing the two components together in an oven. For the plasma activation treatment in step c), it is sufficient to heat the contact area between the nanowire and the surface of the second component. Whether the other parts of the two components are also plasma activated is not important for the formation of the connection. Therefore, step c) can be easily performed by plasma activating the entire first and second components. The plasma used for plasma activation activates both the nanowire and the oxides on the contact surfaces. In the latter case, an oxide-oxide bond can be formed.

[0042] The heating in step c) can be performed at a relatively low temperature. Satisfactory results can be obtained even with heating at only 90°C. In particular, the present method requires heating at a temperature significantly lower than that normally required for hybrid bonding. Furthermore, the heating in step c) can be performed for a short period of time. In particular, the present method requires heating for a time significantly shorter than that normally required for hybrid bonding.

[0043] Steps b) and c) result in the two components being connected via the nanowires and the connecting material, and steps b) and c) are therefore performed in particular such that in addition to the connections formed by the connecting material, a plurality of nanowire connections are formed between the surface of the first component and the surface of the second component.

[0044] The heating in step c) is preferably carried out at a temperature between 90° C. and 300° C., in particular at 170° C. The temperature of the two parts is preferably below 300° C., in particular below 200° C., throughout the entire process.

[0045] The heating in step c) is preferably carried out for 1 to 10 minutes, particularly 2 minutes, and throughout the method, the temperature of the two components is preferably kept above 50°C for no more than 10 minutes.

[0046] This method has advantages, especially compared to hybrid bonding, regardless of the temperature actually selected or the length of the actual heating time. Generally, nanowires are better connected to the surface of the second component than, for example, solid metal contacts in hybrid bonding. Heating solid metal contacts to the desired temperature requires a higher heat input than nanowires, which means higher temperatures and longer heating times. Therefore, this method is less demanding, especially compared to hybrid bonding.

[0047] The method is also simpler, especially compared to hybrid bonding. It has been found that the cleanroom requirements are lower and easier to maintain. This is due in particular to the use of nanowires. For example, in hybrid bonding, a dust particle can prevent contact between the two contacts, whereas in this method only the nanowire is directly affected. Nanowires that are close to the dust particle can still form a connection.

[0048] "In particular, the method is particularly accurate compared to alternative hybrid bonding methods. Known methods often only allow for the connection of relatively large contacts or contacts that are relatively far apart. In contrast, the method allows for smaller contact areas and closer proximity. This is possible because the connection is made by a connecting material, which can firmly connect the two components together before the nanowire connection is formed."

[0049] In one preferred embodiment of the method, the plurality of contact areas on the surface of the first component are elevated relative to the sub-areas on the surface of the first component.

[0050] The length of the nanowires can be much smaller than the extent of the connecting material, but the nanowires can still connect the surfaces of the two components by providing a raised contact area, although in this particular embodiment the surface of the second component can be flat.

[0051] The contact areas on the surface of the first component may be formed higher than sub-areas of the surface of the first component, since they are formed on contacts attached to other parts of the first component. The contacts may be, for example, metal pads. In this case, the metal pads are considered to be part of the first component. Therefore, in the areas of the metal pads, the surface of the first component can be said to be formed by the surfaces of the metal pads.

[0052] It should be noted that there are many alternatives to the described embodiment, for example the sub-region of the second component could be recessed and the surface of the first component could be flat.

[0053] In one preferred embodiment of the method, the surface of the second component prepared in step a) is metallized with a metallization layer in a plurality of contact areas, the metallization layer also extending at least partially onto the side edges of the connecting material on the second component.

[0054] Nanowires adhere particularly well to metals, especially if the nanowires are also made of metal, and especially if the nanowires and the metallization layer are made of the same metal, which allows electrical conductivity in the contact area on the surface of the second component.

[0055] As a further aspect of the present invention, there is provided an apparatus comprising a first component and a second component, each of whose surfaces has a sub-region and a plurality of conductive contact regions formed outside the sub-region, each of the plurality of contact regions being spaced apart from and electrically insulated from one another; The plurality of contact areas on the surface of the first component and the plurality of contact areas on the surface of the second component are connected in pairs via the plurality of nanowires, respectively; and the subregions of the surface of the first component and the subregions of the surface of the second component are connected via a connecting material; The first component and the second component are connected by this.

[0056] The advantages and features of the method are applicable to the device and vice versa. Preferably, the method is suitable for manufacturing a device. Preferably, a device is manufactured by the method.

[0057] In one preferred embodiment of the apparatus, each of the plurality of contact areas on the surface of the first component is adjacent to a sub-area on the surface of the first component, and / or each of the plurality of contact areas on the surface of the second component is adjacent to a sub-area on the surface of the second component, and preferably both of the above.

[0058] In this embodiment, the surfaces of each of the two parts can be utilized particularly efficiently.

[0059] The present invention will now be explained in more detail with the aid of the figures, which show preferred exemplary embodiments, but to which the present invention is not limited. The figures and the size ratios shown are merely approximate. [Brief explanation of the drawings]

[0060] [Figure 1] 1 shows a first component and a second component connected by the method of the present invention, and shows a device of the present invention formed thereby. [Figure 2] 2 shows a device of the invention formed by the components of FIG. 1; DETAILED DESCRIPTION OF THE INVENTION

[0061] Figure 1 shows a first part 2 and a second part 3. The two parts 2, 3 are intended to be connected to each other.

[0062] The surface 4 of the first component 2 has three contact areas 8, on which a plurality of nanowires 7 are arranged. The surface 5 of the second component 3 has subareas 10, on which a connecting material 9 is arranged. Portions of the subareas 10 on the surface 4 of the second component 3 shown in FIG. 1 are connected out of the plane of the drawing, thereby forming a continuous subarea 10. The surface 4 of the first component 2 has subareas 10 between the contact areas 8. Portions of the subareas 10 on the surface 4 of the first component 2 shown in FIG. 1 are connected out of the plane of the drawing, thereby forming a continuous subarea 10. In these subareas, a connecting material 9 arranged on the second component 3 can be in contact with the surface 4 of the first component 2. On the surface 5 of the second component 3, three contact areas 8 exist between the visible subareas 10. In these contact areas, the nanowires 7 on the first component 2 can be in contact with the surface 5 of the second component 3. Thus, the components 2 and 3 can be connected by the nanowires 7 and the connecting material 9.

[0063] The contact area 8 of the surface 4 of the first part 2 is raised above the sub-area 10 of the surface 4 of the first part 2 due to the presence of the protruding portion 6 .

[0064] In the second part 3, each contact area 8 of the surface 5 is metallized with a metallization layer 11. The metallization layer 11 also extends at least partially onto the side edges 12 of the connection material 9 of the second part 3.

[0065] At the surface 4 of the first component 2, the contact area 8 is made of a conductive material. The nanowires 7 are made of a conductive material. At the surface 5 of the second component 3, the contact area 8 is made of a conductive material.

[0066] The two parts 2 and 3 can be connected by a method comprising the following steps: a) providing parts 2 and 3 shown in FIG. 1; b) combining the first part 2 and the second part 3, each of the nanowires 7 in the contact areas 8 on the surface 4 of the first component 2 contacts one of the contact areas 8 on the surface 5 of the second component 3; the connection to the sub-area 10 of the surface 4 of the first part 2 is made by a connecting substance 9 on the second part 3, a step in which a subregion 10 of the surface 4 of the first component 2 is outside the plurality of contact regions 8 of the surface 4 of the first component 2; c) at least one of the following steps: heating the at least nanowires 7 and the contact areas 8 of the surface 5 of the second component 3 to at least 90°C; and treating the nanowires 7 and the contact areas 8 of the surface 5 of the second component 3 by plasma activation; By steps b) and c), a plurality of contact areas 8 on the surface 4 of the first component 2 and a plurality of contact areas 8 on the surface 5 of the second component 3 are connected in pairs via a plurality of nanowires 7, respectively.

[0067] 2 shows a device 1 obtained by this method. The device 1 comprises a first part 2 and a second part 3. The surfaces 4, 5 of the first part 2 and the second part 3 respectively have sub-regions 10 and a plurality of electrically conductive contact regions 8 formed outside the sub-regions 10. The contact regions 8 are spaced apart from each other and electrically insulated from each other. the plurality of contact areas 8 on the surface 4 of the first component 2 and the plurality of contact areas 8 on the surface 5 of the second component 3 are connected in pairs via the plurality of nanowires 7, respectively; and the sub-areas 10 of the surface 4 of the first part 2 and the sub-areas 10 of the surface 5 of the second part 3 are connected via a connecting material 9; Thus, the first component 2 and the second component 3 are connected.

[0068] At least one of the multiple contact areas 8 on the surface 4 of the first part 2 are adjacent to sub-areas 10 on the surface 4 of the first part 2, and the multiple contact areas 8 on the surface 5 of the second part 3 are adjacent to sub-areas 10 on the surface 5 of the second part 3. [Explanation of symbols]

[0069] 1 device 2. First part 3 Second part 4. Surface of the first part 5 Surface of the second part 6 Protruding part 7. Nanowires 8 Contact area 9 Connecting Substances 10 subareas 11 Metallization layer 12 Side edges

Claims

1. A method for connecting a first part (2) to a second part (3), comprising the steps of: the surfaces (4, 5) of the first part (2) and the second part (3) each have a plurality of electrically conductive contact areas (8); the plurality of conductive contact areas (8) are spaced apart from one another and electrically insulated from one another; The method comprises: a) providing the first part (2) and providing the second part (3), a plurality of conductive nanowires (7) are arranged on each of the plurality of contact areas (8) on the surface (4) of the first component (2); a connecting material (9) is disposed on a sub-region (10) of the surface (5) of the second component (3) that is outside the plurality of contact regions (8); The connecting material (9) is suitable for connecting the components (2, 3) to each other via the connecting material (9). Steps and b) combining the first part (2) with the second part (3), - each of the nanowires (7) at the contact areas (8) of the surface (4) of the first part (2) is in contact with one of the contact areas (8) of the surface (5) of the second part (3); the connection of the first part (2) to the sub-regions (10) of the surface (4) is made by the connecting material (9) on the second part (3); the sub-regions (10) of the surface (4) of the first part (2) are outside the plurality of contact regions (8) of the surface (4) of the first part (2); Steps and c) heating at least said nanowires (7) and said contact areas (8) of said surface (5) of said second part (3) to at least 90°C; and, treating said nanowires (7) and said contact areas (8) of said surface (5) of said second component (3) by plasma activation; At least one of the steps Including, By steps b) and c), the plurality of contact areas (8) on the surface (4) of the first component (2) and the plurality of contact areas (8) on the surface (5) of the second component (3) are connected in pairs via the plurality of nanowires (7), respectively. method.

2. 10. The method of claim 1, the plurality of contact areas (8) of the surface (4) of the first part (2) are raised higher than the sub-areas (10) of the surface (4) of the first part (2); method.

3. 3. The method of claim 1 or 2, the surface (5) of the second component (3) prepared in step a) is metallized with a metallization layer (11) in the contact areas (8); the metallization layer (11) also extends at least partially to the side edges (12) of the connecting material (9) on the second component (3); method.

4. A device (1) comprising a first part (2) and a second part (3), the surfaces (4, 5) of the first part (2) and the second part (3) respectively have sub-areas (10) and a plurality of conductive contact areas (8); Each of the plurality of contact regions (8) is a region formed outside the sub-region (10), The plurality of contact areas (8) are spaced apart from one another and electrically insulated from one another; the plurality of contact areas (8) on the surface (4) of the first component (2) and the plurality of contact areas (8) on the surface (5) of the second component (3) are connected in pairs via a plurality of nanowires (7); and, the sub-areas (10) of the surface (4) of the first part (2) and the sub-areas (10) of the surface (5) of the second part (3) are connected via a connecting material (9); The first component (2) and the second component (3) are connected by Device (1).

5. 5. A device (1) according to claim 4, each of the plurality of contact areas (8) of the surface (4) of the first part (2) is adjacent to a sub-area (10) of the surface (4) of the first part (2); and, each of the plurality of contact areas (8) of the surface (5) of the second part (3) is adjacent to a sub-area (10) of the surface (5) of the second part (3); At least one of Device (1).

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