Electrical connection device

Abstract

To provide an electrical connection device capable of stably laminating a probe guide and a wiring board.SOLUTION: The electrical connection device 1 includes probes 10, a probe guide 20 that supports the probes 10, probe pads 30 to which base end portions of the probes 10 are connected, and a wiring board 40. The probe guide 20 supports the probe 10 in a state of passing through the guide hole 200 penetrating from the first surface 201 to the second surface 202 facing the opposite direction of the first surface 201, and has the recess 210 formed in the second surface 202 in communication with the guide hole 200. The probe pad 30 is disposed inside the recess 210. The wiring board 40 is stacked on the probe guide 20 so as to face the second surface 202, and includes an internal wiring electrically connected to the probe pad 30.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to an electrical connecting device used for testing electrical characteristics of an object to be tested. [Background technology]

[0002] In order to measure the electrical characteristics of an object under test such as an integrated circuit, an electrical connection device is used to electrically connect the object under test to an inspection device. The electrical connection device includes a probe that contacts the object under test, a probe guide that supports the probe, and a wiring board on which internal wiring that electrically connects the probe and the inspection device is arranged.

[0003] The wiring board includes internal wiring such as signal wiring that transmits electrical signals between the signal terminals of the DUT and the testing device, ground wiring that supplies a ground voltage to the DUT, and power supply wiring that supplies a power supply voltage to the DUT. Probe pads that connect to the internal wiring are arranged on the surface of the wiring board. By stacking the probe guide and the probe pad, the probes come into contact with the probe pads, and the probes are electrically connected to the internal wiring of the wiring board. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Publication No. 2018-179934 Summary of the Invention [Problem to be solved by the invention]

[0005] If the positions of the surfaces that contact the probes of multiple probe pads are not consistent, the probe guide and the wiring board cannot be stacked stably. For example, if there is variation in the height of the probe pads, the connection between the probe guide and the wiring board becomes unstable. An object of the present invention is to provide an electrical connection device that can stably stack the probe guide and the wiring board. [Means for solving the problem]

[0006] An electrical connection device according to one aspect of the present invention includes a probe, a probe guide supporting the probe, a probe pad connected to a base end of the probe, and a wiring substrate. The probe guide supports the probe after it has passed through a guide hole penetrating from a first surface to a second surface facing the opposite direction from the first surface, and has a recess formed in the second surface communicating with the guide hole. The probe pad is disposed within the recess. The wiring substrate is stacked on the probe guide facing the second surface, and includes internal wiring electrically connected to the probe pad. [Effects of the Invention]

[0007] According to the present invention, it is possible to provide an electrical connecting device that can stably stack a probe guide and a wiring board. [Brief explanation of the drawings]

[0008] [Figure 1] FIG. 1 is a schematic diagram showing the configuration of the electrical connecting device according to the first embodiment. [Figure 2] FIG. 2 is a schematic diagram showing the configuration of an electrical connecting device according to a modified example of the first embodiment. [Figure 3] FIG. 3 is a schematic diagram showing the configuration of an electrical connecting device according to another modified example of the first embodiment. [Figure 4] FIG. 4 is a schematic diagram showing the configuration of the electrical connecting device according to the second embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0009] Next, embodiments of the present invention will be described with reference to the drawings. In the following description of the drawings, identical or similar parts are designated by identical or similar reference numerals. However, it should be noted that the drawings are schematic, and the thickness ratios of the various parts may differ from those in reality. Furthermore, it goes without saying that the dimensional relationships and ratios of parts included in the drawings may differ from one another. The embodiments shown below exemplify devices and methods for embodying the technical ideas of the present invention, and the materials, shapes, structures, arrangements, etc. of the components of the embodiments of the present invention are not limited to those described below.

[0010] (First embodiment) The electrical connecting device 1 according to the first embodiment shown in Fig. 1 is used to measure the electrical characteristics of an object under test 2. The electrical connecting device 1 includes a probe 10, a probe guide 20, a probe pad 30, and a wiring board 40. As shown in Fig. 1, the probe guide 20 and the wiring board 40 are stacked.

[0011] In the description of the embodiment, the direction in which the wiring board 40 is located as viewed from the probe guide 20 is referred to as the upward direction, and the direction in which the probe guide 20 is located as viewed from the wiring board 40 is referred to as the downward direction. The surface facing upward is also referred to as the upper surface, and the surface facing downward is also referred to as the lower surface. For example, the first surface 201 is the lower surface of the probe guide 20, and the second surface 202 is the upper surface of the probe guide 20.

[0012] Probe 10 is a non-limiting notation for each of the signal probe 10S, power probe 10V, and ground probe 10G shown in FIG. 1. The signal probe 10S is a probe that transmits an electrical signal between the test object 2 and the test device. The power probe 10V is a probe that supplies a power supply voltage to the test object 2. The ground probe 10G is a probe that supplies a ground voltage to the test object 2. The probe 10 has a tip end that is one end that contacts a terminal (not shown) of the test object 2, and a base end that is the other end. The material of the probe 10 may be, for example, nickel (Ni) or a nickel alloy.

[0013] The probe guide 20 has a guide hole 200 formed therein, which penetrates from a first surface 201 to a second surface 202 facing in the opposite direction to the first surface 201. The probe guide 20 supports the probe 10 when it has passed through the guide hole 200.

[0014] The probe guide 20 has a recess 210 formed in the second surface 202 and communicating with the guide hole 200. The area of ​​the recess 210 as viewed from the normal direction of the second surface 202 is larger than that of the guide hole 200. In other words, the inner diameter of the recess 210 is larger than that of the guide hole 200. The probe guide 20 may be a multilayer wiring substrate such as an MLO (Multi-Layer Organic) substrate or an MLC (Multi-Layer Ceramic) substrate.

[0015] The probe pad 30 is disposed inside the recess 210 of the probe guide 20. That is, the area of ​​the bottom surface of the recess 210 is larger than the area of ​​the probe pad 30. The base end of the probe 10 passing through the guide hole 200 is connected to the probe pad 30. The probe pad 30 may be made of a metal material such as gold (Au) or copper (Cu).

[0016] The wiring board 40 has a structure including a substrate 41 and a thin film 42 arranged on the surface of the substrate 41 facing the probe guide 20. The probe pads 30 are arranged on the surface of the thin film 42, which is the main surface (lower surface) of the wiring board 40 facing the probe guide 20. The wiring board 40 includes internal wiring (not shown) that is electrically connected to the probe pads 30. The substrate 41 may have, for example, a laminated structure in which the internal wiring is arranged in multiple wiring layers. One end of the internal wiring is connected to the probe pads 30, and the other end is connected to an electrode terminal 410 arranged on the upper surface of the substrate 41. The electrode terminal 410 is electrically connected to an inspection device such as a tester.

[0017] The wiring substrate 40 may be, for example, a space transformer that makes the spacing between the electrode terminals 410 wider than the spacing between the probe pads 30. The substrate 41 may be, for example, a ceramic substrate or an MLO substrate. The thin film 42 may be, for example, a resin film.

[0018] Although not shown, a printed circuit board may be laminated on the wiring board 40. For example, the electrode terminals 410 of the wiring board 40 may be connected to the electrode terminals of the printed circuit board via pogo pins or the like. In the electrical connection device 1 in which the printed circuit board is laminated on the wiring board 40, the probes 10 and the inspection device are electrically connected via the wiring of the printed circuit board that is connected to the electrode terminals 410 of the wiring board 40.

[0019] 1, the probe pads 30 are arranged on the lower surface of the wiring board 40 facing the probe guide 20. The second surface 202 of the probe guide 20 and the lower surface of the wiring board 40 abut against each other around the recess 210. Therefore, even if there is variation in the height of the probe pads 30, for example, the variation is absorbed by the recess 210, and the probe guide 20 and the wiring board 40 can be stably connected.

[0020] As described above, the electrical connection device 1 shown in Fig. 1 allows the probe guide 20 and the wiring board 40 to be stably stacked. For example, even if there is variation in the height of the lower surface of the probe pad 30 to which the probe 10 is connected, the probe guide 20 can be easily attached to the wiring board 40. This makes it possible to suppress distortion or bending between the probe guide 20 and the wiring board 40 when the probe guide 20 and the wiring board 40 are connected, thereby improving the rigidity of the electrical connection device 1. Furthermore, the electrical connection device 1 allows the flatness of the probe guide 20 to be improved compared to when the probe pad 30 is stacked on the probe guide 20.

[0021] Furthermore, in the electrical connecting device 1, the base ends of the probes 10 may be fixed to the probe pads 30. However, if the probes 10 are not fixed to the probe pads 30, the connection points between the probes 10 and the probe pads 30 will change every time the probe guide 20 is removed from the wiring board 40. As a result, the electrical resistance between the probes 10 and the wiring board 40 becomes unstable, making it impossible to stably measure the electrical characteristics of the test object 2. However, with the electrical connecting device 1 in which the base ends of the probes 10 are fixed to the probe pads 30, the electrical characteristics of the test object 2 can be measured more stably.

[0022] 1, the probe guide 20 may include a power supply layer 230 formed in the remaining region of the region where the guide hole 200 is formed, and a side wiring layer 220 arranged on the inner wall of the guide hole 200. The side wiring layer 220 is electrically connected to the probe pad 30 and the power supply layer 230. Therefore, when the side surface of the probe 10 comes into contact with the side wiring layer 220 inside the guide hole 200, the probe 10 and the power supply layer 230 arranged inside the probe guide 20 are electrically connected via the side wiring layer 220. A conductive material such as a metal material may be used for the side wiring layer 220 and the power supply layer 230.

[0023] A plurality of power supply layers 230 insulated from each other may be formed in the probe guide 20. The probe guide 20 shown in FIG. 1 has a first power supply layer 231 and a second power supply layer 232. For example, the first power supply layer 231 may be a power supply layer that supplies a power supply voltage to the test object 2, and the second power supply layer 232 may be a ground layer that supplies a ground voltage to the test object 2. Hereinafter, the first power supply layer 231 and the second power supply layer 232 will be referred to as the power supply layer 230 unless otherwise specified.

[0024] The power supply layer 230 of the probe guide 20 is electrically connected to the internal wiring of the wiring board 40 via the side wiring layer 220 and the probe pad 30. As a result, a voltage set by the inspection device is supplied to the power supply layer 230 of the probe guide 20 via the wiring board 40 and the probe pad 30.

[0025] For example, when the first power supply layer 231 is a power supply layer, the first power supply layer 231 and the power probe 10V are electrically connected via the side wiring layer 220. This allows the power supply voltage to be supplied from a position close to the power probe 10V. Also, when the second power supply layer 232 is a ground layer, the second power supply layer 232 and the ground probe 10G are electrically connected via the side wiring layer 220. This allows the ground voltage to be supplied from a position close to the ground probe 10G.

[0026] The side wiring layer 220 does not need to be arranged on the inner wall of the guide hole 200 through which the signal probe 10S passes. Therefore, the signal probe 10S is connected to the probe pad 30 without being connected to the power supply layer 230 inside the probe guide 20.

[0027] The probe guide 20 may have a layered structure including multiple wiring layers. In the probe guide 20 shown in Fig. 1, the first power supply layer 231 and the second power supply layer 232 are arranged on different wiring layers. Specifically, the first power supply layer 231 is arranged on the first wiring layer L1, and the second power supply layer 232 is arranged on the second wiring layer L2. Note that the first power supply layer 231 and the second power supply layer 232 may be arranged on the same wiring layer while being insulated from each other.

[0028] 1, multiple probes 10 that are set to the same potential when measuring the object under test 2 can be connected to the same power supply layer 230 included in the probe guide 20. Therefore, when the electrical resistance between the terminal of the object under test 2 and the probe 10 is high, the current can be branched even at a position close to the probe 10. This prevents the current from concentrating on one probe 10, and prevents the probe 10 from burning out due to an excessive current flowing.

[0029] Furthermore, the electrical connecting device 1 can supply the power supply voltage and the ground voltage at positions close to the probe 10. This reduces the electrical resistance of the current path, allowing a large current to flow through the probe 10 and improving the high-frequency characteristics. In this way, the electrical connecting device 1 can measure the electrical characteristics of the object under test 2 with high accuracy.

[0030] Furthermore, according to the electrical connecting device 1 in which the base end of the probe 10 is fixed to the probe pad 30, it is possible to suppress distortion of the probe 10 inside the guide hole 200. This allows the probe 10 to be in stable contact with the side wiring layer 220 of the guide hole 200.

[0031] <Modification> 2, a plurality of probe pads 30 are arranged inside the recesses 210 of the probe guide 20. This reduces the number of recesses 210, thereby narrowing the area of ​​the second surface 202 of the probe guide 20, and making it possible to miniaturize the electrical connecting device 1.

[0032] The type and number of probe pads 30 to be placed inside one recess 210 can be set arbitrarily. For example, as shown in Fig. 2, multiple probe pads 30 connected to power supply probes 10V set to the same potential may be placed inside one recess 210, or multiple probe pads 30 connected to ground probes 10G may be placed inside one recess 210. Also, multiple probe pads 30 connected to signal probes 10S may be placed inside one recess 210. Alternatively, the second surface 202 may be partitioned and multiple recesses 210 may be placed so that the area of ​​the bottom surface is constant.

[0033] 3, all the probe pads 30 of the electrical connecting device 1 may be arranged inside one recess 210. For example, the wall surface of a single recess 210 extends along the outer edge of the second surface 202 of the probe guide 20, and the probe guide 20 and the wiring board 40 abut against each other around this recess 210.

[0034] (Second embodiment) As shown in Fig. 4, the electrical connecting device 1 according to the second embodiment includes a probe guide 20 having a structure in which a first portion 21 and a second portion 22 are stacked. The first portion 21 has a first surface 201 and a second surface 202, and has a guide hole 200 formed therein. The second portion 22 has a third surface 203 facing the second surface 202 and having a probe pad 30 arranged thereon, and a fourth surface 204 facing the wiring board 40. The electrical connecting device 1 shown in Fig. 4 differs from the electrical connecting device 1 shown in Fig. 1 in that it includes a multi-stage probe guide 20, but the rest of the configuration is the same as that of the first embodiment shown in Fig. 1.

[0035] The second portion 22 includes a contact via 240 that electrically connects the probe pad 30 to the internal wiring of the wiring substrate 40, and a power supply layer 230 that is electrically connected to the contact via 240 inside the second portion 22. The contact via 240 penetrates from the third surface 203 to the fourth surface 204. The contact via 240 is formed, for example, by metal plating the inner surface of a through hole. The contact via 240 may also be formed by filling the inside of a through hole with a metal material. The power supply layer 230 is formed in the remaining area of ​​the area where the contact via 240 is formed. The power supply layer 230 of the first portion 21 and the power supply layer 230 of the second portion 22, which are set to the same potential, are electrically connected to the probe pad 30 via the contact via 240.

[0036] Similar to the first portion 21, the second portion 22 may include multiple power supply layers 230 therein. In this case, as shown in FIG. 4, the second portion 22 may have a stacked structure including multiple wiring layers. In the second portion 22 shown in FIG. 4, the first power supply layer 231 is arranged on the third wiring layer L3, and the second power supply layer 232 is arranged on the fourth wiring layer L4. Note that the first power supply layer 231 and the second power supply layer 232 may be arranged on the same wiring layer while being insulated from each other.

[0037] One end of the contact via 240 is connected to the probe pad 30, and the other end is connected to a connection terminal 420 arranged on the lower surface of the wiring substrate 40 facing the fourth surface 204. The connection terminal 420 is electrically connected to the electrode terminal 410 via the internal wiring of the wiring substrate 40. That is, the contact via 240 and the internal wiring of the wiring substrate 40 are electrically connected via the connection terminal 420. A convex portion 250 is formed on the fourth surface 204 of the probe guide 20 so as to surround the periphery of the connection terminal 420. In other words, the connection terminal 420 is arranged inside a recess formed on the fourth surface 204 of the probe guide 20. The second portion 22 and the wiring substrate 40 are connected at the top surface of the convex portion 250. Therefore, regardless of variations in the height of the connection terminal 420, the probe guide 20 and the wiring substrate 40 can be stably connected.

[0038] The signal probe 10S is electrically connected to the connection terminal 420 of the wiring board 40 via the probe pad 30 and the contact via 240 without being connected to either the power supply layer 230 of the first part 21 or the second part 22 of the probe guide 20.

[0039] In the electrical connection device 1 according to the second embodiment, the probe pad 30 is disposed inside the recess 210 of the first portion 21 of the probe guide 20. Therefore, even if there is variation in the position of the lower surface of the probe pad 30 to which the probe 10 is connected, the first portion 21 and the second portion 22 can be stably stacked. Furthermore, according to the electrical connection device 1 shown in FIG. 4, by staging the probe guide 20, the electrical resistance of the power supply layer 230 can be further reduced. The rest is substantially the same as in the first embodiment, and therefore, redundant description will be omitted. For example, in the electrical connection device 1 shown in FIG. 4, multiple probe pads 30 may be disposed inside one recess 210.

[0040] (Other embodiments) Although the present invention has been described above by way of the preferred embodiment, the descriptions and drawings that form part of this disclosure should not be understood as limiting the present invention. From this disclosure, various alternative embodiments, examples, and operating techniques will become apparent to those skilled in the art.

[0041] For example, although the above description exemplifies a case in which the probe guide 20 includes the first power supply layer 231 and the second power supply layer 232, the types of power supply layers 230 included in the probe guide 20 are not limited to two. For example, the power supply layer 230 included in the probe guide 20 may be only one of a ground layer or a power supply layer. Alternatively, the probe guide 20 may include two or more types of power supply layers set to different power supply voltages.

[0042] As such, the present invention naturally includes various embodiments not described above. Therefore, the technical scope of the present invention is defined only by the invention-specifying matters according to the scope of the claims that are appropriate from the above description. [Explanation of symbols]

[0043] 1 Electrical connection device 2. Inspection object 10 probes 10G Ground Probe 10S Signal Probe 10V Power Probe 20 Probe Guide 21 Part 1 22 Part 2 30 probe pads 40 Wiring board 41 PCB 42 Thin Film 200 guide hole 201 Page 1 202 2nd page 203 Page 3 204 Page 4 210 recess 220 Side wiring layer 230 Power layer 231 1st power layer 232 2nd power layer 240 contact vias 250 convex part 410 Electrode terminal 420 connection terminal

Claims

1. 1. An electrical connection device used to measure electrical characteristics of an object under test, comprising: a probe having a tip portion that contacts the test object; a probe guide having a first surface and a second surface facing in a direction opposite to the first surface, supporting the probe in a state where the probe has passed through a guide hole penetrating from the first surface to the second surface, and having a recess formed in the second surface and communicating with the guide hole; a probe pad disposed inside the recess and connected to a base end of the probe passing through the guide hole; a wiring board laminated on the probe guide facing the second surface and including internal wiring electrically connected to the probe pad; An electrical connection device comprising:

2. 2. The electrical connecting device according to claim 1, wherein a plurality of said probe pads are disposed inside one of said recesses.

3. 3. The electrical connecting device according to claim 2, wherein all of said probe pads are disposed inside one of said recesses.

4. the probe pads are arranged on a main surface of the wiring board facing the probe guide; the probe guide and the wiring board abut against each other around the recess; The electrical connecting device according to claim 1 .

5. The probe guide a power supply layer formed in the remaining area of ​​the area where the guide hole is formed; a side wiring layer disposed on an inner wall of the guide hole and electrically connected to the probe pad and the power supply layer; Including, a side surface of the probe contacts the side wiring layer inside the guide hole; The electrical connecting device according to claim 1 .

6. 6. The electrical connecting device according to claim 5, wherein a plurality of said power supply layers insulated from one another are formed on said probe guide.

7. the probe guide has a laminated structure including a plurality of wiring layers, 7. The electrical connecting device according to claim 6, wherein a plurality of said power supply layers are arranged on different wiring layers.

8. 8. The electrical connecting device according to claim 5, wherein the power supply layer includes a ground layer that supplies a ground voltage to the device under test.

9. 8. The electrical connecting device according to claim 5, wherein the power supply layer includes a power supply layer that supplies a power supply voltage to the device under test.

10. The probe guide a first portion having the first surface and the second surface and in which the guide hole is formed; a second portion having a third surface facing the second surface and a fourth surface facing the wiring substrate, the probe pads being arranged on the third surface; Including, the second portion includes a contact via that penetrates from the third surface to the fourth surface and has one end connected to the probe pad, and the power supply layer that is electrically connected to the contact via inside the second portion.

8. The electrical connecting device according to claim 5.

11. the wiring board includes a connection terminal disposed on a surface facing the probe guide and connected to the other end of the contact via; the contact via and the internal wiring are electrically connected via the connection terminal; a protrusion is formed on the fourth surface of the probe guide so as to surround the periphery of the connection terminal, and the second portion and the wiring board are connected at a top surface of the protrusion. The electrical connecting device according to claim 10.

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