Dressing member and method for manufacturing dressing member

Abstract

To provide a dressing member capable of suppressing contamination of a processing device due to processing chips.SOLUTION: A dressing member used for dressing a machining tool includes a dressing layer having a contact surface that comes into contact with the machining tool and applying dressing to the machining tool, a capture layer that is provided on a side opposite to the contact surface of the dressing layer and captures chips generated when the machining tool is brought into contact with the dressing layer, and a support layer that supports the dressing layer and the capture layer, in which a dressing layer side of the capture layer has a region exposed without being covered with the dressing layer.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present invention relates to a dressing member used for dressing a machining tool and a method for manufacturing the dressing member. [Background technology]

[0002] Device chips each including a device are manufactured by dividing a wafer on which a plurality of devices are formed into individual pieces. Furthermore, a package substrate is formed by mounting a plurality of device chips on a predetermined substrate and then covering and sealing the mounted device chips with a resin layer (mold resin). Package devices each including a plurality of packaged device chips are manufactured by dividing and dividing this package substrate. The device chips and package devices are incorporated into various electronic devices such as mobile phones and personal computers.

[0003] A cutting device is used to separate wafers and package substrates. The cutting device is equipped with a chuck table that holds the workpiece and a cutting unit that performs cutting on the workpiece. The cutting unit is equipped with a spindle, the tip of which is fitted with a processing tool (cutting blade) with an annular cutting edge. The workpiece is held on the chuck table, and the cutting blade is rotated while cutting into the workpiece, thereby cutting the workpiece.

[0004] Furthermore, in recent years, with the miniaturization of electronic devices, there has been a demand for thinner device chips and package devices. Therefore, a process of grinding and thinning wafers and package substrates before division using a grinding device is sometimes performed. The grinding device includes a chuck table that holds the workpiece and a grinding unit that performs grinding on the workpiece. The grinding unit includes a spindle, the tip of which is attached with an annular processing tool (grinding wheel) having multiple grinding stones. The workpiece is held by the chuck table, and the grinding surface of the grinding stone is brought into contact with the workpiece while the chuck table and grinding wheel are rotated, thereby grinding the workpiece (see Patent Document 1).

[0005] The cutting edge of a cutting blade or the grinding stone of a grinding wheel is formed by fixing abrasive grains made of diamond or the like with a bonding material. When the cutting blade or grinding wheel is rotated and brought into contact with the workpiece, the abrasive grains supported by the bonding material collide with the workpiece. This results in the cutting or grinding process being performed on the workpiece.

[0006] However, if the abrasive grains are not adequately exposed from the binder, the machining ability of the machining tool will decrease, and the force (machining load) acting on the workpiece and the machining tool during machining will increase. This will make the workpiece more susceptible to machining defects such as chipping. Furthermore, especially when grinding a workpiece with a grinding wheel, if there is variation in the height positions of the grinding surfaces of multiple grinding stones, the workpiece will not be ground uniformly, resulting in reduced machining quality.

[0007] Therefore, before or during machining of a workpiece, dressing is sometimes performed to intentionally wear down the machining tool to condition it. Dressing of a machining tool is performed by rotating the machining tool and bringing it into contact with a dressing member (dressing member). For example, dressing of a grinding wheel is performed by bringing the grinding stone of a grinding wheel into contact with a dresser board attached to a holding substrate (see Patent Document 2). This allows the abrasive grains of the grinding stone to be appropriately exposed from the binder (dressing) and aligns the height positions of the grinding surfaces of multiple grinding stones (truing). [Prior art documents] [Patent documents]

[0008] [Patent Document 1] Japanese Patent Application Laid-Open No. 2000-288881 [Patent Document 2] Japanese Patent Application Laid-Open No. 2008-221360 Summary of the Invention [Problem to be solved by the invention]

[0009] When dressing a machining tool such as a cutting blade or a grinding wheel, a dressing member is held on a chuck table of a machining device, and the machining tool is rotated and brought into contact with the dressing member. During this process, the dressing member is machined by the machining tool, generating debris (machining debris) such as fragments and dust of the dressing member and the machining tool. Some of the machining debris remains attached to the dressing member.

[0010] Once the dressing of the processing tool is complete, the dressing member is transported from the chuck table. At this time, processing debris remaining on the dressing member may fall off due to vibrations during transport and adhere to the holding surface of the chuck table. If processing debris adheres to the holding surface of the chuck table, it will prevent the chuck table from properly holding the workpiece, such as a wafer or package substrate, when it is subsequently processed. In addition, processing debris adhering to the dressing member may fall off during transport or at its destination. This causes processing debris to adhere and accumulate inside the processing equipment, causing contamination of the processing equipment.

[0011] The present invention has been made in view of the above problems, and has an object to provide a dressing member that can suppress contamination of a processing device by processing debris, and a method for manufacturing the dressing member. [Means for solving the problem]

[0012] According to one aspect of the present invention, a dressing element for use in dressing a machining tool is provided, comprising: a dressing layer having a contact surface that comes into contact with the machining tool and that dresses the machining tool; a capture layer that is provided on the opposite side of the dressing layer from the contact surface and that captures debris generated when the machining tool is brought into contact with the dressing layer; and a support layer that supports the dressing layer and the capture layer, wherein the dressing layer side of the capture layer has an exposed area that is not covered by the dressing layer.

[0013] Preferably, the capture layer is made of a porous material having pores. Preferably, the dressing layer, the capture layer, and the support layer have the same main component.

[0014] According to another aspect of the present invention, there is provided a method for manufacturing a dressing member used to dress a processing tool, the dressing member comprising: a dressing layer having a contact surface that comes into contact with the processing tool and that dresses the processing tool; a capture layer that is provided on the opposite side of the contact surface of the dressing layer and that captures debris generated when the processing tool is brought into contact with the dressing layer; and a support layer that supports the dressing layer and the capture layer.The method for manufacturing a dressing member includes: a molding step of stacking and molding a dressing material that is the raw material for the dressing layer, a capture material that is the raw material for the capture layer, and a support material that is the raw material for the support layer; an integration step of integrating the stacked dressing material, capture material, and support material to form a fired body having the dressing layer, the capture layer, and the support layer; and a capture layer exposing step of removing a portion of the dressing layer to form an exposed area on the dressing layer side of the capture layer that is not covered by the dressing layer.

[0015] Preferably, the capture material includes a pore-forming material. Preferably, the dressing material, the capture material, and the support material have the same main component. [Effects of the Invention]

[0016] A dressing member according to one aspect of the present invention includes a capture layer that captures debris generated when a machining tool is brought into contact with the dressing layer. This captures the debris and makes it less likely for the debris to fall from the dressing member. As a result, contamination of the machining device due to debris adhering to the dressing member is suppressed. [Brief explanation of the drawings]

[0017] [Figure 1] FIG. [Figure 2] FIG. 2(A) is a perspective view showing a dressing member, and FIG. 2(B) is a cross-sectional view showing a part of the dressing member. [Figure 3] FIG. 1 is a perspective view showing a grinding apparatus for dressing a processing tool. [Figure 4] 10 is a flowchart showing a method for manufacturing a dressing member. [Figure 5] Figure 5(A) is a cross-sectional view showing how the dressing material is produced, Figure 5(B) is a cross-sectional view showing how the capture material is produced, and Figure 5(C) is a cross-sectional view showing how the support material is produced. [Figure 6] Figure 6(A) is a cross-sectional view showing a mold into which a dressing material has been poured, Figure 6(B) is a cross-sectional view showing a mold into which a capture material has been poured, and Figure 6(C) is a cross-sectional view showing a mold into which a support material has been poured. [Figure 7] FIG. 1 is a partial cross-sectional front view showing a pressurized dressing, capture material, and support material. [Figure 8] FIG. 10 is a partial cross-sectional front view showing the dressing material, capture material, and support material during the integration process. [Figure 9] FIG. [Figure 10] A front view showing the sintered body in the capture layer exposure process. DETAILED DESCRIPTION OF THE INVENTION

[0018] Hereinafter, an embodiment according to one aspect of the present invention will be described with reference to the accompanying drawings. First, a configuration example of a processing device capable of dressing a processing tool using a dressing member according to this embodiment will be described. In this embodiment, as an example of the processing device, a grinding device that grinds a workpiece with a processing tool (grinding wheel) equipped with a grinding stone will be described.

[0019] Fig. 1 is a perspective view showing a grinding device 2 that grinds a workpiece 11. In Fig. 1, the X-axis direction (first horizontal direction) and the Y-axis direction (second horizontal direction) are perpendicular to each other. The Z-axis direction (up-down direction, height direction, vertical direction) is perpendicular to the X-axis direction and the Y-axis direction.

[0020] For example, the workpiece 11 is a disk-shaped wafer made of a semiconductor material such as single crystal silicon, and includes a front surface 11a and a back surface 11b that are generally parallel to each other. The workpiece 11 is divided into a plurality of rectangular regions by a plurality of streets (planned division lines) that are arranged in a grid pattern so as to intersect with each other. Devices (not shown), such as ICs (Integrated Circuits), LSIs (Large Scale Integration), LEDs (Light Emitting Diodes), and MEMS (Micro Electro Mechanical Systems) devices, are formed on the front surface 11a side of each of the regions divided by the streets.

[0021] A plurality of device chips each including a device are manufactured by dividing the workpiece 11 along the streets. Furthermore, before dividing the workpiece 11, the back surface 11b side of the workpiece 11 is ground using the grinding device 2 to thin the workpiece 11, thereby obtaining thinned device chips.

[0022] However, there are no limitations on the material, shape, structure, size, etc. of the workpiece 11. For example, the workpiece 11 may be a substrate made of a semiconductor other than silicon (GaAs, InP, GaN, SiC, etc.), glass (quartz glass, borosilicate glass, etc.), ceramics, resin, metal, etc. Furthermore, there are no limitations on the type, number, shape, structure, size, arrangement, etc. of devices, and the workpiece 11 does not necessarily have to have any devices formed thereon.

[0023] The grinding device 2 includes a chuck table (holding table) 4 that holds the workpiece 11. The upper surface of the chuck table 4 forms a circular holding surface 4a that holds the workpiece 11.

[0024] Specifically, the chuck table 4 includes a cylindrical frame (main body) 6 made of a metal such as SUS (stainless steel), glass, ceramics, resin, or the like. A cylindrical recess 6b is provided in the center of the upper surface 6a of the frame 6. A disk-shaped holding member 8 made of a porous material such as porous ceramics is fitted into the recess 6b of the frame 6. The holding member 8 includes a large number of pores that communicate from the upper surface to the lower surface of the holding member 8.

[0025] The upper surface of the holding member 8 forms a circular suction surface 8a that sucks the workpiece 11 when the workpiece 11 is held by the chuck table 4. The upper surface 6a of the frame 6 and the suction surface 8a of the holding member 8 form the holding surface 4a of the chuck table 4. The holding surface 4a (suction surface 8a) is connected to a suction source (not shown) such as an ejector via pores contained in the holding member 8, a flow path (not shown) provided inside the frame 6, a valve (not shown), etc.

[0026] A moving unit (not shown) that moves the chuck table 4 horizontally (in the XY plane) is connected to the chuck table 4. For example, the moving unit may be configured with a ball screw type moving mechanism or a turntable. Also, a rotation drive source (not shown) such as a motor is connected to the chuck table 4 to rotate the chuck table 4 around a rotation axis that is set approximately perpendicular to the radial direction of the holding surface 4a.

[0027] A grinding unit 10 that performs grinding on a workpiece 11 is provided above the chuck table 4. The grinding unit 10 includes a cylindrical spindle 12 that is arranged along the Z-axis direction. A rotation drive source (not shown), such as a motor, that rotates the spindle 12 is connected to the base end (upper end) of the spindle 12.

[0028] A disk-shaped wheel mount 14 made of metal or the like is fixed to the tip (lower end) of the spindle 12. A processing tool 16 for processing the workpiece 11 is detachably attached to the underside of the wheel mount 14. The processing tool 16 is an annular grinding wheel that grinds the workpiece 11, and is fixed to the wheel mount 14 with fasteners such as bolts.

[0029] The machining tool 16 includes an annular wheel base 18 made of a metal such as aluminum or stainless steel and formed to have roughly the same diameter as the wheel mount 14. The upper surface of the wheel base 18 is fixed to the lower surface of the wheel mount 14. A plurality of grinding wheels 20 are fixed to the lower surface of the wheel base 18.

[0030] For example, the grinding wheels 20 are formed in a rectangular parallelepiped shape and are arranged in a ring shape at approximately equal intervals along the circumferential direction of the wheel base 18. The lower surfaces of the grinding wheels 20 form a grinding surface 20a that grinds the workpiece 11. The grinding wheels 20 include abrasive grains made of diamond, cBN (cubic boron nitride), or the like, and a bonding material (bond material) that secures the abrasive grains, such as a metal bond, a resin bond, or a vitrified bond. However, there are no limitations on the material, shape, structure, size, etc. of the grinding wheels 20. Furthermore, the number of grinding wheels 20 can be set as desired.

[0031] The machining tool 16 rotates around a rotation axis that is roughly parallel to the Z-axis direction by power transmitted from a rotation drive source (not shown) connected to the spindle 12 via the spindle 12 and the wheel mount 14. When the machining tool 16 rotates, each of the multiple grinding wheels 20 revolves around the rotation axis of the machining tool 16 along a circular revolving path that is roughly parallel to the horizontal plane (XY plane).

[0032] A moving unit (not shown) that moves (lifts and lowers) the grinding unit 10 along the Z-axis direction is connected to the grinding unit 10. For example, the moving unit is configured with a ball screw type moving mechanism. Specifically, the moving unit includes a ball screw arranged along the Z-axis direction, a pulse motor that rotates the ball screw, and a nut portion that is connected to the grinding unit 10 and into which the ball screw is screwed. When the moving unit moves the grinding unit 10 up and down, the machining tool 16 moves relative to the chuck table 4, and the holding surface 4a of the chuck table 4 and the machining tool 16 move closer to and away from each other along the Z-axis direction.

[0033] A machining fluid supply path (not shown) for supplying a liquid (machining fluid) such as pure water is provided inside or near the grinding unit 10. When the workpiece 11 is ground with the processing tool 16, the machining fluid is supplied from the machining fluid supply path to the workpiece 11 and the grinding wheel 20. This cools the workpiece 11 and the grinding wheel 20, and also washes away chips (processing chips) generated by the grinding process.

[0034] The grinding apparatus 2 also includes a controller (control unit, control section, control device) (not shown) that controls the grinding apparatus 2. The controller is connected to the components of the grinding apparatus 2 (the chuck table 4, the grinding unit 10, etc.), and generates control signals that control the operation of each component.

[0035] For example, the controller is configured by a computer and includes a processing unit that executes processes such as calculations required for the operation of the grinding device 2, and a storage unit that stores various information (data, programs, etc.) used for the operation of the grinding device 2. The processing unit includes a processor such as a CPU (Central Processing Unit). The storage unit includes memories such as a ROM (Read Only Memory) and a RAM (Random Access Memory).

[0036] When grinding the workpiece 11 with the grinding device 2, the workpiece 11 is first held by the chuck table 4. For example, the workpiece 11 is placed on the chuck table 4 so that the front surface 11a faces the holding surface 4a and the back surface 11b (surface to be ground) is exposed upward. In this state, when the suction force (negative pressure) of the suction source is applied to the holding surface 4a, the workpiece 11 is sucked and held by the chuck table 4. A protective sheet for protecting the workpiece 11 may be fixed to the front surface 11a side of the workpiece 11.

[0037] Next, the chuck table 4 is positioned below the machining tool 16. Then, while rotating the chuck table 4 and the spindle 12, the grinding unit 10 is lowered at a predetermined speed, and the grinding surface 20a of the grinding wheel 20 is brought into contact with the back surface 11b of the workpiece 11. As a result, the back surface 11b side of the workpiece 11 is scraped off, and the workpiece 11 is ground and thinned.

[0038] Before or during grinding of the workpiece 11, the processing tool 16 is dressed. Specifically, the grinding surface 20a side of the grinding wheel 20 is intentionally worn to adjust the condition of the grinding wheel 20. The processing tool 16 is dressed by rotating the grinding wheel 20 and bringing it into contact with a dressing member (dressing member, dressing board, dressing tool). The dressing member according to this embodiment will be described in detail below.

[0039] Fig. 2(A) is a perspective view showing the dressing member 21, and Fig. 2(B) is a cross-sectional view showing a part of the dressing member 21. The dressing member (dressing board, dressing tool) 21 is a plate-shaped member (tool) that dresses the grinding wheel 20 (see Fig. 1) of the processing tool 16, and has a first surface (upper surface) 21a and a second surface (lower surface) 21b that are generally parallel to each other.

[0040] More specifically, the dressing member 21 comprises a dressing layer (dressing portion) 31, a capture layer (capture portion) 41, and a support layer (support portion) 51. The dressing layer 31, the capture layer 41, and the support layer 51 are laminated so as to overlap one another in the thickness direction of the dressing member 21, and are integrated.

[0041] The dressing layer 31 corresponds to the portion of the dressing member 21 that dresses the machining tool 16 (grinding wheel 20), and the surface (upper surface) of the dressing layer 31 forms a circular contact surface 31a that comes into contact with the machining tool 16 (grinding wheel 20). The contact surface 31a of the dressing layer 31 corresponds to the first surface 21a of the dressing member 21.

[0042] The capture layer 41 is provided on the opposite side of the contact surface 31a of the dressing layer 31, and has the function of capturing chips (machining chips) generated when the machining tool 16 is brought into contact with the dressing layer 31. For example, the capture layer 41 is made of a porous material with many pores, and captures the machining chips using the pores. The surface (upper surface) of the capture layer 41 forms a capture surface 41a that captures the machining chips.

[0043] The support layer 51 is provided on the opposite side of the capture surface 41a of the capture layer 41, and corresponds to a support member (support plate) that supports the dressing layer 31 and the capture layer 41. The surface (lower surface) of the support layer 51 forms a circular held surface 51a that is held by the holding surface 4a (see FIG. 1) of the chuck table 4. The held surface 51a of the support layer 51 corresponds to the second surface 21b of the dressing member 21.

[0044] When the dressing member 21 is used to dress the machining tool 16, the capture layer 41 and the support layer 51 do not come into contact with the machining tool 16. In other words, the capture layer 41 and the support layer 51 correspond to non-dressing layers (non-dressing portions) that do not contribute to dressing the machining tool 16.

[0045] The dressing layer 31, the capture layer 41, and the support layer 51 are formed, for example, in a disk shape. The diameter of the dressing layer 31 is set smaller than the diameter of the capture layer 41, and the diameter of the support layer 51 is set approximately the same as the diameter of the capture layer 41. The dressing layer 31, the capture layer 41, and the support layer 51 are stacked so that the capture layer 41 is sandwiched between the dressing layer 31 and the support layer 51. The dressing layer 31, the capture layer 41, and the support layer 51 are arranged concentrically so that their centers coincide in a plan view.

[0046] When the dressing member 21 is configured as described above, the side of the capture layer 41 facing the dressing layer 31 has an exposed area that is not covered by the dressing layer 31. Specifically, at the outer periphery of the capture layer 41, an annular area of ​​a predetermined width including the outer periphery of the capture layer 41 is exposed on the surface (upper surface) of the capture layer 41. This annular area functions as a capture surface 41a that captures processing debris.

[0047] In the above description, the dressing layer 31, capture layer 41, and support layer 51 are formed in a disk shape. However, as long as the dressing member 21 has a contact surface 31a, capture surface 41a, and held surface 51a, there are no restrictions on the shapes and sizes of the dressing layer 31, capture layer 41, and support layer 51. For example, the dressing layer 31, capture layer 41, and support layer 51 may each be formed in a polygonal shape (typically rectangular).

[0048] When forming the dressing member 21, as described below, the dressing layer 31 and the capture layer 41 are bonded by firing, and the capture layer 41 and the support layer 51 are bonded by firing. Therefore, no bonding agent such as an adhesive is provided between the dressing layer 31 and the capture layer 41, or between the capture layer 41 and the support layer 51. However, the dressing layer 31 and the capture layer 41 may be bonded via a bonding agent such as an adhesive, or the capture layer 41 and the support layer 51 may be bonded via a bonding agent such as an adhesive.

[0049] As shown in FIG. 2(B), the dressing layer 31 includes a binder (bond material) 33 and abrasive grains 35, and the binder 33 fixes the abrasive grains 35. The binder 33 may be a vitrified bond made of a glass material or a resin bond made of a resin. The abrasive grains 35 may be made of white alundum (WA), green carborundum (GC), or the like. However, there are no limitations on the material of the binder 33 or the material, shape, or size of the abrasive grains 35. For ease of explanation, the abrasive grains 35 are shown enlarged in FIG. 2(B).

[0050] The capture layer 41 is made of a vitrified bond, a resin bond, or the like, similar to the binder 33 of the dressing layer 31. However, the capture layer 41 contains multiple pores (voids) 43 and does not contain abrasive grains. The multiple pores 43 are exposed on the capture surface 41a of the capture layer 41. This forms unevenness on the capture surface 41a side of the capture layer 41. Note that for ease of explanation, the pores 43 are shown enlarged in Figure 2(B). Also, while Figure 2(B) illustrates an example in which the pores 43 are closed cells, the pores 43 may also be open cells.

[0051] When the dressing member 21 is used to dress the machining tool 16, the dressing member 21 is machined by the machining tool 16, generating chips (machining chips) 23 equivalent to fragments, dust, etc. of the dressing member 21 and the machining tool 16. The chips 23 then enter and are captured in the pores 43 exposed on the capture surface 41a of the capture layer 41. This prevents the chips 23 from falling off the dressing member 21 when the dressing member 21 is being transported, etc.

[0052] There are no restrictions on the number and size of the pores 43 as long as the capturing surface 41a of the capturing layer 41 can capture the debris 23. For example, the porosity of the capturing layer 41 is 20% or more and 80% or less. The porosity of the capturing layer 41 can be measured, for example, by the Archimedes method. The diameter of the pores 43 is, for example, 100 μm or more and 300 μm or less.

[0053] Although the above description has been given of the case where capture layer 41 is made of a porous material containing multiple pores 43, there are no limitations on the configuration of capture layer 41 as long as it is capable of trapping debris 23. For example, capture layer 41 may have irregularities formed on capture surface 41a instead of multiple pores 43. Furthermore, capture layer 41 may have the property of adsorbing debris 23 on capture surface 41a.

[0054] The support layer 51 includes a main material (base material) 53 but does not include abrasive grains. The main material 53 is made of a vitrified bond, a resin bond, or the like, similar to the binder 33 of the dressing layer 31 and the capture layer 41.

[0055] The support layer 51 may also contain a filler (aggregate) 55 that reinforces the support layer 51. For example, ceramic particles made of silica (silicon dioxide, SiO2), alumina (aluminum oxide, Al2O3), or the like are dispersed in the main material 53 as the filler 55. For ease of explanation, the filler 55 is shown enlarged in FIG. 2(B).

[0056] For example, the average particle size of the filler 55 is smaller than that of the abrasive grains 35. Specifically, the average particle size of the filler 55 is preferably set to 1 / 5 or less of the average particle size of the abrasive grains 35, more preferably 1 / 10 or less of the average particle size of the abrasive grains 35, and even more preferably 1 / 20 or less of the average particle size of the abrasive grains 35. The magnitude relationship between the average particle sizes of the abrasive grains 35 and the filler 55 can be confirmed by measuring both using the same measurement method and comparing the measurement results. For example, the average particle size of the abrasive grains 35 is 1 μm or more and 300 μm or less, and the average particle size of the filler 55 is 0.1 μm or more and 10 μm or less. The above average particle sizes of the abrasive grains 35 and the filler 55 correspond to the particle size at 50% of the cumulative particle size distribution (median diameter, d50, 50% diameter) measured by, for example, laser diffraction / scattering.

[0057] By including filler 55 in main material 53, the mechanical strength of support layer 51 is improved and deformation of support layer 51 is suppressed. Note that there are no limitations on the material, shape, or size of filler 55 as long as filler 55 can reinforce main material 53. Furthermore, if main material 53 itself has high strength and is not easily deformed, filler 55 does not need to be included in main material 53.

[0058] The main components of the dressing layer 31, the capture layer 41, and the support layer 51 may be the same or different. However, if the main components of the dressing layer 31, the capture layer 41, and the support layer 51 are the same, the dressing layer 31, the capture layer 41, and the support layer 51 can be formed using common materials, thereby reducing manufacturing costs.

[0059] For example, the binder 33 of the dressing layer 31, the capture layer 41, and the main material 53 of the support layer 51 are each made of a glass material such as silica (silicon dioxide, SiO2) or a resin such as a phenolic resin, an epoxy resin, or a polyimide resin. In this case, the dressing layer 31, the capture layer 41, and the support layer 51 are formed with a glass material or a resin as the main component.

[0060] The dressing layer 31 is preferably thick enough to be worn away by contact with the grinding wheel 20 of the machining tool 16. The capture layer 41 may be thick enough to capture the chips 23. The support layer 51 may be thick enough to support the dressing layer 31 and the capture layer 41. Therefore, the dressing layer 31 may be thicker than the capture layer 41 and the support layer 51. For example, the dressing layer 31 is thicker than the capture layer 41 and the support layer 51, and is preferably thicker than the capture layer 41 and the support layer 51, and is preferably 5 times or more, and more preferably 10 times or more. More specifically, the dressing layer 31 may be thicker than 1 mm and 10 mm, and the capture layer 41 and the support layer 51 may be thicker than 0.1 mm and less than 1 mm.

[0061] In Figure 2(B), for ease of explanation, the boundary between the dressing layer 31 and the capture layer 41, and the boundary between the capture layer 41 and the support layer 51 are shown as straight lines. However, in reality, there may not be clear boundaries between the dressing layer 31, the capture layer 41, and the support layer 51. In this case, each layer is distinguished by the presence or absence of abrasive grains 35, pores 43, or filler 55.

[0062] Next, a specific example of a method for dressing the machining tool 16 using the above-mentioned dressing member 21 will be described. FIG.

[0063] When dressing the machining tool 16, first, the dressing member 21 is held by the chuck table 4. Specifically, the dressing member 21 is placed on the chuck table 4 so that the first surface 21a side of the dressing member 21 (the side of the contact surface 31a of the dressing layer 31) is exposed upward and the second surface 21b side of the dressing member 21 (the side of the held surface 51a of the support layer 51) faces the holding surface 4a. At this time, the dressing member 21 is positioned concentrically with the holding surface 4a so that the rotation axis of the chuck table 4 passes through the center of the dressing member 21.

[0064] The shape and size of the support layer 51 are set so that it can cover the entire suction surface 8a (see FIG. 1) of the chuck table 4. Specifically, the diameter of the support layer 51 is equal to or greater than the diameter of the suction surface 8a. The dressing member 21 is arranged so that the entire suction surface 8a of the chuck table 4 is covered by the support layer 51. In this state, when the suction force (negative pressure) of the suction source is applied to the holding surface 4a, the held surface 51a of the support layer 51 is sucked while in contact with the holding surface 4a. As a result, the dressing layer 31 is suction-held by the chuck table 4 via the capture layer 41 and the support layer 51.

[0065] As described above, the support layer 51 does not contain abrasive grains. Therefore, the held surface 51a side of the support layer 51 is free of irregularities caused by abrasive grains, and the held surface 51a is highly flat. This makes it easier for the held surface 51a to come into close contact with the holding surface 4a of the chuck table 4, and the support layer 51 can be reliably sucked and held by the chuck table 4.

[0066] Next, the positional relationship between the chuck table 4 and the machining tool 16 is adjusted. Specifically, with the machining tool 16 disposed above the dressing member 21, the chuck table 4 is positioned so that the center of the dressing member 21 (the center of the dressing layer 31) and the rotation path of the grinding wheel 20 overlap in the Z-axis direction.

[0067] Then, while rotating the chuck table 4 and the machining tool 16, the chuck table 4 and the machining tool 16 are moved relatively along the Z-axis direction. Specifically, the grinding unit 10 is lowered along the Z-axis direction at a predetermined speed, and the machining tool 16 is brought close to the dressing member 21 (grinding feed). As a result, the grinding surfaces 20a of the rotating grinding wheels 20 come into contact with the contact surface 31a side of the dressing layer 31.

[0068] When the grinding wheel 20 comes into contact with the dressing layer 31, the grinding wheel 20 rotates so as to pass through the rotation axis of the chuck table 4, grinding the entire contact surface 31a side of the dressing layer 31. At this time, the binder of the grinding wheel 20 collides with the abrasive grains 35 (see FIG. 2(B)) exposed at the contact surface 31a of the dressing layer 31, accelerating wear on the grinding surface 20a side of the grinding wheel 20. As a result, the abrasive grains of the grinding wheel 20 are appropriately exposed from the binder (dressing), and the height positions of the grinding surfaces 20a of the multiple grinding wheels 20 are aligned (truing), and the condition of the grinding wheels 20 is adjusted.

[0069] In this way, the grinding wheel 20 of the processing tool 16 is dressed. Then, before the dressing layer 31 is ground and the grinding wheel 20 reaches the capture layer 41, the grinding feed is stopped and the processing tool 16 is raised. As a result, the grinding wheel 20 separates from the dressing layer 31 without coming into contact with the capture layer 41, and the dressing of the grinding wheel 20 is completed. Thereafter, the dressing member 21 is transported from the chuck table 4 to a predetermined storage location.

[0070] During the dressing of the machining tool 16, machining fluid is supplied to the dressing member 21 and the grinding wheel 20. As a result, the debris 23 generated by grinding the dressing layer 31 is mostly washed away. However, some of the debris 23 may remain attached to the dressing member 21. In this case, when the dressing member 21 is transported after the dressing of the machining tool 16 is completed, the debris 23 may fall off the dressing member 21 due to vibrations during transport or the like, and may be scattered inside the grinding device 2.

[0071] For example, if the debris 23 adhering to the dressing member 21 falls and adheres to the holding surface 4a of the chuck table 4, the workpiece, such as a wafer or a package substrate, will be prevented from being properly held by the chuck table 4 when it is subsequently ground. Furthermore, the debris 23 adhering to the dressing member 21 may fall off during transport of the dressing member 21 or at its destination. This causes the processing debris to adhere and accumulate inside the grinding device 2, causing contamination of the grinding device 2.

[0072] However, the dressing member 21 according to this embodiment includes a capture layer 41 that captures the chips 23. The chips 23 generated during dressing of the machining tool 16 enter and are captured in pores 43 (see FIG. 2(B)) exposed on the capture surface 41a of the capture layer 41. This prevents the chips 23 from detaching and falling from the dressing member 21, making it difficult for the chips 23 to adhere to the interior of the grinding device 2 (such as the holding surface 4a of the chuck table 4).

[0073] Next, a method for manufacturing the dressing member 21 will be described. Fig. 4 is a flowchart showing the method for manufacturing the dressing member. In the method for manufacturing the dressing member according to this embodiment, the dressing member 21 is formed by sequentially carrying out a molding step S1, an integration step S2, and a capture layer exposure step S3.

[0074] In this embodiment, a manufacturing method of a dressing member 21 in which the main components of the dressing layer 31, capture layer 41, and support layer 51 are the same will be described. Specifically, a case will be described in which the main material 53 of the dressing layer 31, the capture layer 41, and the main material 53 of the support layer 51 are made of a glassy material.

[0075] In the forming step S1, first, a dressing material (first raw material) that is the raw material for the dressing layer 31, a capture material (second raw material) that is the raw material for the capture layer 41, and a support material (third raw material) that is the raw material for the support layer 51 are produced. Figure 5(A) is a cross-sectional view showing how the dressing material 39 is produced, Figure 5(B) is a cross-sectional view showing how the capture material 49 is produced, and Figure 5(C) is a cross-sectional view showing how the support material 59 is produced.

[0076] As shown in Figure 5(A), the dressing material 39 is produced by mixing abrasive grains 35 with raw material powder 37, which is the raw material for the binder 33 (see Figure 2(B)). For example, the abrasive grains 35 and raw material powder 37 are placed in a cylindrical mixing container 30A made of plastic or the like in a predetermined ratio, and the mixing container 30A is rotated to mix the abrasive grains 35 and raw material powder 37. This produces a dressing material 39 containing the abrasive grains 35 and raw material powder 37.

[0077] As shown in FIG. 5(B), the capture material 49 is produced by mixing a pore-forming material 45 with raw material powder 47, which is the raw material for the capture layer 41. The pore-forming material 45 is an additive added to form pores 43 (FIG. 2(B)) inside the capture layer 41, and is burned and eliminated in the integration step S2 described below. For example, the pore-forming material 45 can be fine particles made of an organic substance (such as styrene resin or acrylic resin). However, there are no restrictions on the type and material of the pore-forming material 45, as long as it is possible to form the desired pores 43 in the capture layer 41.

[0078] The amount and size of the pore-forming material 45 added are adjusted according to the number and size of the pores 43 (FIG. 2(B)) to be formed in the capture layer 41. For example, the content of the pore-forming material 45 in the capture material 49 is set to 20 vol% or more and 80 vol% or less. The average particle size of the pore-forming material 45 is set to 100 μm or more and 300 μm or less. The above average particle size value corresponds to the particle size at 50% of the cumulative particle size distribution measured by, for example, laser diffraction / scattering.

[0079] For example, the pore-forming material 45 and the raw material powder 47 are placed in a cylindrical mixing vessel 30B made of plastic or the like in a predetermined ratio, and the mixing vessel 30B is rotated to mix the pore-forming material 45 and the raw material powder 47. As a result, a capture material 49 containing the pore-forming material 45 and the raw material powder 47 is obtained.

[0080] As shown in FIG. 5(C), support material 59 is produced by mixing filler 55 with powdered raw material powder 57, which is the raw material for main material 53 (see FIG. 2(B)). For example, filler 55 and raw material powder 57 are placed in a cylindrical mixing container 30C made of plastic or the like in a predetermined ratio, and mixing container 30B is rotated to mix filler 55 and raw material powder 57. In this way, support material 59 containing filler 55 and raw material powder 57 is obtained.

[0081] No abrasive grains are put into the mixing containers 30B and 30C. Therefore, the capture material 49 and the support material 59 do not contain abrasive grains, unlike the dressing material 39. Furthermore, when it is not necessary to include the filler 55 in the main material 53 (see FIG. 2(B)), the filler 55 and the raw material powder 57 are not mixed, and the raw material powder 57 can be used alone as the support material 59.

[0082] In this embodiment, raw material powders 37, 47, and 57 made of the same material are used. For example, glass powder made of silica or the like is selected as the raw material powders 37, 47, and 57. This allows the dressing material 39, capture material 49, and support material 59 to have the same main component.

[0083] Next, the dressing material 39 (first raw material), the capture material 49 (second raw material), and the support material 59 (third raw material) are layered and formed. The state in which the dressing material 39, the capture material 49, and the support material 59 are layered is shown in Figures 6(A) to 6(C).

[0084] For example, a mold 40 is used to mold the dressing material 39, capture material 49, and support material 59. The mold 40 is a cylindrical member made of metal, and a container (recess) 40a is provided in the center of the mold 40, into which the object to be molded is placed. In this embodiment, a mold 40 having a cylindrical container 40a is used to mold the dressing material 39, capture material 49, and support material 59 into a disk shape. The diameter of the container 40a is set to the target diameter of the dressing material 39, capture material 49, and support material 59 after molding. The depth of the container 40a is set to a value greater than the total thickness of the dressing material 39, capture material 49, and support material 59 placed in the container 40a.

[0085] 6(A) is a cross-sectional view showing a mold 40 into which a dressing material 39 has been placed. First, the dressing material 39 is placed in the container 40a of the mold 40. Then, while rotating the mold 40, the surface of the dressing material 39 is smoothed with a predetermined jig (not shown) as necessary, thereby making the thickness of the dressing material 39 in the mold 40 approximately uniform.

[0086] 6(B) is a cross-sectional view showing the mold 40 into which the capture material 49 has been poured. After the dressing material 39 inside the mold 40 has been smoothed, the capture material 49 is poured into the accommodation section 40a of the mold 40, and the surface of the dressing material 39 is covered with the capture material 49. Then, while rotating the mold 40, the surface of the capture material 49 is smoothed with a predetermined jig (not shown) as necessary, thereby making the thickness of the capture material 49 inside the mold 40 approximately uniform. As a result, the capture material 49 is layered on the dressing material 39.

[0087] 6(C) is a cross-sectional view showing the mold 40 into which the support material 59 has been introduced. After the capture material 49 inside the mold 40 has been smoothed, the support material 59 is introduced into the accommodation portion 40a of the mold 40, and the surface of the capture material 49 is covered with the support material 59. Then, while rotating the mold 40, the surface of the support material 59 is smoothed with a predetermined jig (not shown) as necessary, thereby making the thickness of the support material 59 inside the mold 40 approximately uniform. As a result, the support material 59 is layered on the dressing material 39 and the capture material 49.

[0088] When the dressing material 39 and the capture material 49 are layered, the raw material powder 37 and the raw material powder 47 may be mixed together near the boundary between the dressing material 39 and the capture material 49. In this case, the clear boundary between the dressing material 39 and the capture material 49 disappears, and the dressing material 39 and the capture material 49 are distinguished by the presence or absence of the abrasive grains 35 or the pore-forming material 45. Similarly, when the capture material 49 and the support material 59 are layered, the raw material powder 47 and the raw material powder 57 may be mixed together near the boundary between the capture material 49 and the support material 59. In this case, the clear boundary between the capture material 49 and the support material 59 disappears, and the capture material 49 and the support material 59 are distinguished by the presence or absence of the pore-forming material 45 or the filler 55.

[0089] The amounts of the dressing material 39, capture material 49, and support material 59 to be poured into the mold 40 are set according to the specifications of the dressing member 21 (see FIG. 2(A)). Specifically, the amounts of the dressing material 39, capture material 49, and support material 59 are adjusted so that the thickness ratio of the dressing material 39, capture material 49, and support material 59 after leveling in the mold 40 is approximately the same as the thickness ratio of the dressing layer 31, capture layer 41, and support layer 51 of the dressing member 21 that is finally manufactured.

[0090] 7 is a partial cross-sectional front view showing the dressing material 39, capture material 49, and support material 59 being pressurized. After the dressing material 39, capture material 49, and support material 59 are placed in the mold 40 and stacked, the dressing material 39, capture material 49, and support material 59 are pressurized. As a result, the dressing material 39, capture material 49, and support material 59 are compressed and solidified, and formed into a disk shape.

[0091] Specifically, first, the mold 40 is placed on the support surface 42a of the support stand 42 and supported by the support stand 42. Then, the dressing material 39, capture material 49, and support material 59 contained in the mold 40 are pressed by a pressing member 44. The pressing member 44 is, for example, a cylindrical member made of metal or the like. The diameter of the pressing member 44 is approximately equal to the diameter of the storage section 40a of the mold 40, and the pressing member 44 is insertable into the storage section 40a of the mold 40. The underside of the pressing member 44 forms a flat, circular pressing surface 44a that presses the dressing material 39, capture material 49, and support material 59.

[0092] After the mold 40 is placed on the support base 42, the pressing member 44 is inserted into the container 40a of the mold 40 and comes into contact with the surface of the support material 59 layered on top of the dressing material 39 and the capture material 49. The pressing member 44 is then pressed toward the bottom of the container 40a, whereby the dressing material 39, the capture material 49, and the support material 59 are pressed by the pressing surface 44a. As a result, the dressing material 39, the capture material 49, and the support material 59 are compressed and solidified, and formed into a disk shape.

[0093] In the above-described molding step S1, the dressing material 39, the capture material 49, and the support material 59 are molded in a stacked state, and disk-shaped dressing materials 39, 49, and support materials 59 having approximately the same diameter are obtained. Note that, in the above description, the dressing material 39, the capture material 49, and the support material 59 are sequentially placed in the mold 40 (see FIGS. 6(A) to 6(C)). However, the dressing material 39, the capture material 49, and the support material 59 may also be stacked by sequentially placing the support material 59, the capture material 49, and the dressing material 39 in the mold 40.

[0094] Next, the layered dressing material 39, capture material 49, and support material 59 are fired and integrated to form a fired body having the dressing layer 31, capture layer 41, and support layer 51 (integration step S2). Figure 8 is a partial cross-sectional front view showing the dressing material 39, capture material 49, and support material 59 in the integration step S2.

[0095] For example, in the integration step S2, the dressing material 39, the capture material 49, and the support material 59 are heated and fired in a firing furnace 50 to bond the dressing material 39 and the capture material 49 together, and also to bond the capture material 49 and the support material 59 together. There are no restrictions on the type of firing furnace 50 as long as it is capable of firing the dressing material 39, the capture material 49, and the support material 59. For example, the firing furnace 50 uses an electric heater, a gas burner, infrared rays, microwaves, or the like as a heat source.

[0096] The firing furnace 50 includes a chamber 52 in which an object to be heated is accommodated. The interior of the chamber 52 corresponds to a heating chamber 54 in which heat treatment is carried out. A transfer port 52a for transferring the object to be heated is provided on a side wall of the chamber 52. The transfer port 52a is opened and closed by a gate (opening and closing door) 56. By opening the gate 56 to expose the transfer port 52a, the object to be heated can be transferred into or out of the heating chamber 54 through the transfer port 52a. By closing the transfer port 52a with the gate 56, the heating chamber 54 is sealed.

[0097] A heat-resistant holding table 58 for holding an object to be heated is provided inside the chamber 52. The upper surface of the holding table 58 is a flat surface that is approximately parallel to the horizontal plane, and forms a holding surface 58a for holding the object to be heated.

[0098] In the integration step S2, first, the gate 56 is opened, and the dressing material 39, capture material 49, and support material 59 formed in the forming step S1 are carried into the chamber 52. Then, the dressing material 39, capture material 49, and support material 59 are placed in a stacked state on the holding surface 58a of the holding table 58. For example, the mold 40 is made of a heat-resistant metal, and the mold 40 containing the dressing material 39, capture material 49, and support material 59 is placed on the holding table 58.

[0099] The dressing material 39, capture material 49, and support material 59 may be housed in the mold 40 in a pressurized state. For example, a pressing member 46 functioning as a weight is placed in the housing portion 40a of the mold 40. The pressing member 46 is a disk-shaped member made of a heat-resistant metal or the like, and the diameter of the pressing member 46 is approximately equal to the diameter of the housing portion 40a of the mold 40. By inserting the pressing member 46 into the housing portion 40a of the mold 40, the dressing material 39, capture material 49, and support material 59 are pressed by the weight of the pressing member 46.

[0100] After the dressing material 39, capture material 49, and support material 59 are carried into the chamber 52, the gate 56 closes to block the transfer port 52a and seal the heating chamber 54. The temperature of the heating chamber 54 is then raised, and the dressing material 39, capture material 49, and support material 59 are heated in the air. This bakes the dressing material 39, capture material 49, and support material 59, respectively, and bonds the dressing material 39 and the capture material 49, and bonds the capture material 49 and the support material 59. As a result, the dressing material 39, capture material 49, and support material 59 are integrated.

[0101] The heating conditions are set appropriately depending on the materials of the dressing material 39, the capture material 49, and the support material 59. For example, when the raw material powders 37, 47, and 57 (see FIGS. 6(A) to 6(C)) are glass powders for vitrified bonding, the dressing material 39, the capture material 49, and the support material 59 can be fired by heating them at a temperature of 600°C or higher and 1000°C or lower for about six hours.

[0102] When the capture material 49 is heated, the pore-forming material 45 (see FIGS. 6(B) and 6(C)) contained in the capture material 49 is burned and disappears. As a result, the area where the pore-forming material 45 was present becomes hollow, and multiple pores 43 (see FIG. 2(B)) are formed inside the capture material 49. Furthermore, if the support material 59 contains a filler 55 (see FIG. 6(C)), the support material 59 is less likely to shrink when heated, and deformation of the support layer 51 is suppressed.

[0103] 9 is a perspective view showing a sintered body 61. By sintering the layered dressing material 39, capture material 49, and support material 59, the sintered body 61 is obtained, which includes a dressing layer 31, a capture layer 41, and a support layer 51. In this embodiment, the sintered body 61 is formed, which includes a disk-shaped dressing layer 31, a capture layer 41, and a support layer 51 that are approximately equal in diameter. The sintered body 61 includes a first surface (upper surface) 61a and a second surface (lower surface) 61b that are approximately parallel to each other. The first surface 61a corresponds to the contact surface 31a of the dressing layer 31, and the second surface 61b corresponds to the held surface 51a of the support layer 51.

[0104] Although the above describes a method of bonding the dressing material 39, capture material 49, and support material 59 by firing, there are no limitations on the process for realizing the laminated structure of the dressing layer 31, capture layer 41, and support layer 51. For example, the dressing layer 31, capture layer 41, and support layer 51 may each be formed independently, and then the dressing layer 31 and the capture layer 41 may be bonded together via a bonding agent such as an adhesive, and the capture layer 41 and the support layer 51 may be bonded together via a bonding agent such as an adhesive.

[0105] However, by adopting the above-mentioned baking process, it is not necessary to form the dressing layer 31, capture layer 41, and support layer 51 independently and then bond them together with an adhesive. This reduces the labor and cost required for selecting and preparing an adhesive. In addition, precise alignment of each layer in the process of bonding the dressing layer 31, capture layer 41, and support layer 51 is not required, simplifying the process. Furthermore, tilting of each layer due to variations in adhesive thickness is suppressed.

[0106] Next, a portion of the dressing layer 31 is removed to form an exposed area on the dressing layer 31 side of the capture layer 41 that is not covered by the dressing layer 31 (capture layer exposing step S3). Figure 10 is a front view showing the sintered body 61 in the capture layer exposing step S3. For example, in the capture layer exposing step S3, a grinding device 2 is used to grind and remove a portion of the dressing layer 31 of the sintered body 61 to expose a portion of the capture layer 41, thereby forming the dressing member 21.

[0107] Specifically, first, the sintered body 61 is held by the chuck table 4. The sintered body 61 is placed on the chuck table 4 so that the first surface 61a (the contact surface 31a side of the dressing layer 31) is exposed upward and the second surface 61b (the held surface 51a side of the support layer 51) of the sintered body 61 faces the holding surface 4a. At this time, the sintered body 61 is positioned concentrically with the holding surface 4a so that the rotation axis of the chuck table 4 passes through the center of the sintered body 61. In this state, when the suction force (negative pressure) of the suction source is applied to the holding surface 4a, the sintered body 61 is suction-held by the chuck table 4.

[0108] Next, the positional relationship between the chuck table 4 and the processing tool 16 is adjusted. Specifically, with the processing tool 16 disposed above the sintered body 61, the chuck table 4 is positioned so that the center of the sintered body 61 (the center of the dressing layer 31) and the swivel path of the grinding wheel 20 do not overlap in the Z-axis direction. For example, the grinding wheel 20 is disposed so that the swivel path does not overlap with the center of the dressing layer 31 but overlaps only with the outer periphery of the dressing layer 31.

[0109] Then, while rotating the chuck table 4 and the machining tool 16, the chuck table 4 and the machining tool 16 are moved relatively along the Z-axis direction. Specifically, the grinding unit 10 is lowered along the Z-axis direction at a predetermined speed, and the machining tool 16 is brought closer to the sintered body 61 (grinding feed). As a result, the grinding surfaces 20a of the rotating grinding wheels 20 come into contact with the contact surface 31a side of the outer periphery of the dressing layer 31.

[0110] When the grinding wheel 20 comes into contact with the outer periphery of the dressing layer 31, the outer periphery of the dressing layer 31 is ground and thinned. On the other hand, the center of the dressing layer 31 becomes a circular unground region that is not subjected to grinding, and is not ground or thinned by the grinding wheel 20. Then, as grinding of the outer periphery of the dressing layer 31 progresses and the grinding wheel 20 reaches the capture layer 41, the outer periphery of the dressing layer 31 is removed.

[0111] When the outer peripheral portion of the dressing layer 31 is removed, the diameter of the dressing layer 31 becomes smaller than the diameter of the capture layer 41. As a result, the outer peripheral portion of the upper surface of the capture layer 41 (the area that does not overlap with the dressing layer 31) is exposed. This exposed area becomes the capture surface 41a of the capture layer 41. As described above, multiple pores 43 (see Figure 2(B)) are exposed on the capture surface 41a of the capture layer 41.

[0112] In this way, a dressing member 21 is formed, which includes a capture layer 41 having an exposed capture surface 41a that is not covered by the dressing layer 31. In this embodiment, an example has been described in which the capture layer 41 is exposed by subjecting the dressing layer 31 to grinding processing, but there are no limitations on the method for processing the dressing layer 31. For example, a portion of the dressing layer 31 may be removed by subjecting the dressing layer 31 to cutting processing, laser processing, or the like.

[0113] In addition, in this embodiment, a method has been described in which the dressing layer 31, capture layer 41, and support layer 51, all of which have approximately the same diameter, are stacked and integrated, and then the dressing layer 31 is processed to expose the capture layer 41. However, the dressing layer 31 may be formed into a shape different from the capture layer 41 and support layer 51, and then the dressing layer 31, capture layer 41, and support layer 51 may be stacked and integrated. For example, the capture layer 41 and support layer 51 may be formed into a shape different from the capture layer 41 and support layer 51, and a dressing layer 31 having a diameter smaller than the capture layer 41 and support layer 51, and then the dressing layer 31, capture layer 41, and support layer 51 may be stacked and integrated.

[0114] As described above, the dressing member 21 according to this embodiment includes the capture layer 41 that captures the debris 23 generated when the machining tool 16 is brought into contact with the dressing layer 31. This allows the debris 23 to be captured by the capture layer 41, making it less likely for the debris 23 to fall from the dressing member 21. As a result, contamination of the grinding device 2 by the debris 23 adhering to the dressing member 21 is suppressed.

[0115] In this embodiment, the dressing member 21 is used to dress the processing tool 16 (grinding wheel). However, the processing tool to be dressed using the dressing member 21 is not limited to a grinding wheel. For example, the dressing member 21 can also be used to dress an annular cutting blade that cuts a workpiece.

[0116] The cutting blade is attached to a cutting device and cuts the workpiece. The cutting device includes a chuck table that holds the workpiece and a cutting unit that performs cutting on the workpiece. The cutting unit includes a spindle, and the cutting blade is attached to the tip of the spindle. The workpiece is held on the chuck table, and the cutting blade is rotated and cut into the workpiece, thereby cutting the workpiece.

[0117] The cutting blade attached to the cutting device may be a hub-type cutting blade (hub blade) or a washer-type cutting blade (washer blade). The hub blade has an annular hub base made of a metal such as an aluminum alloy and an annular cutting edge formed along the outer periphery of the hub base. The cutting edge of the hub blade is made of an electroformed grinding stone containing abrasive grains made of diamond, cubic boron nitride, or the like, and a binder such as a nickel-plated layer that secures the abrasive grains. On the other hand, the washer blade is made only of an annular cutting edge that contains abrasive grains and a binder made of metal, ceramics, resin, or the like that secures the abrasive grains.

[0118] Before or during cutting of a workpiece, the cutting blade is dressed. Specifically, the cutting edge of the cutting blade is intentionally worn down to adjust the condition of the cutting blade. When dressing the cutting blade, the dressing member 21 is held by the chuck table of the cutting machine. Then, while rotating the cutting blade attached to the tip of the spindle, the cutting edge of the cutting blade is brought into contact with the contact surface 31a side of the dressing layer 31 of the dressing member 21 and cuts into the workpiece.

[0119] When the cutting edge of the cutting blade comes into contact with the dressing layer 31, the binder of the cutting edge collides with the abrasive grains 35 (see FIG. 2(B)) exposed at the contact surface 31a of the dressing layer 31, accelerating the wear of the cutting edge. As a result, the abrasive grains of the cutting edge are appropriately exposed from the binder (sharpening), and the shape of the cutting edge is adjusted to approach a perfect circle centered on the rotation axis of the spindle (rounding). This improves the condition of the cutting blade, maintaining its cutting ability.

[0120] Furthermore, the dressing member 21 can also be used for dressing processing tools such as a polishing tool (polishing pad) for polishing a workpiece, a bit cutting tool for cutting a workpiece with a bit, and the like.

[0121] When dressing a machining tool using the dressing member 21, the machining tool may accidentally reach the boundary between the dressing layer 31 and the capture layer 41 due to incorrect setting of the dressing conditions, etc. However, the dressing member 21 according to this embodiment does not have an adhesive between the dressing layer 31 and the capture layer 41. Therefore, even if the machining tool does reach the boundary between the dressing layer 31 and the capture layer 41, the adhesive will not adhere to the machining tool. This prevents the machining ability of the machining tool from being reduced due to the adhesion of adhesive.

[0122] In addition, the structures, methods, etc. according to the above-described embodiments can be modified as appropriate without departing from the scope of the object of the present invention. [Explanation of symbols]

[0123] 11 Workpiece 11a surface 11b Back side 21 Dressing components (dressing boards, dressing tools) 21a 1st side (top side) 21b 2nd side (bottom side) 23 Scrap (processing scrap) 31 Dressing layer (dressing part) 31a Contact surface 33 Bonding material 35 abrasive grains 37 Raw material powder 39 Dressings 41 Capture layer (capture section) 41a Capture surface 43 Pores (voids) 45 Pore former 47 Raw material powder 49 Capture Material 51 Support layer (support part) 51a Surface to be held 53 Main material (base material) 55 Filler (aggregate) 57 Raw material powder 59 Support material 61 Sintered body 61a 1st side (top side) 61b 2nd side (bottom side) 2 Grinding equipment 4 Chuck table (holding table) 4a Holding surface 6 Frame (main body) 6a Top side 6b Recess 8 Retaining member 8a Suction surface 10 Grinding unit 12 spindles 14 Wheel mount 16 Processing tools 18 Wheel base 20 Grinding Wheel 20a grinding surface 30A,30B,30C Mixing container 40 molds 40a Receiving portion (recess) 42 Support stand 42a Support surface 44 Pressing member 44a Pressing surface 46 Pressing member 50 Kiln 52 Chambers 52a Transport entrance 54 Heating chamber 56 Gate (opening door) 58 Holding table 58a Holding surface

Claims

1. A dressing member used for dressing a processing tool, a dressing layer having a contact surface that comes into contact with the processing tool and that dresses the processing tool; a capture layer provided on the opposite side of the dressing layer from the contact surface, the capture layer capturing chips generated when the processing tool is brought into contact with the dressing layer; a support layer supporting the dressing layer and the acquisition layer; The dressing member has an exposed area on the dressing layer side of the capture layer that is not covered by the dressing layer.

2. 2. The dressing member according to claim 1, wherein the capture layer is made of a porous material having pores.

3. 3. A dressing element according to claim 1, wherein the main components of the dressing layer, the acquisition layer and the support layer are the same.

4. A method for manufacturing a dressing member for manufacturing a dressing member used for dressing a processing tool, comprising: The dressing member comprises: a dressing layer having a contact surface that comes into contact with the processing tool and that dresses the processing tool; a capture layer provided on the opposite side of the dressing layer from the contact surface, the capture layer capturing chips generated when the processing tool is brought into contact with the dressing layer; a support layer supporting the dressing layer and the acquisition layer; a molding step of laminating and molding a dressing material that is a raw material for the dressing layer, a capture material that is a raw material for the capture layer, and a support material that is a raw material for the support layer; an integration step of integrating the layered dressing material, capture material, and support material by firing them to form a fired body having the dressing layer, capture layer, and support layer; A method for manufacturing a dressing member, comprising a capture layer exposing step of removing a portion of the dressing layer to form an exposed area on the dressing layer side of the capture layer that is not covered by the dressing layer.

5. 5. The method of claim 4, wherein the capture material comprises a pore-forming material.

6. 6. The method for producing a dressing member according to claim 4, wherein the main components of the dressing material, the capture material and the support material are the same.

Images