Component mounting apparatus and component mounting method

Abstract

To provide a component mounting device and a component mounting method capable of appropriately correcting a reference suction height of a component supplied to a component take-out position with time.SOLUTION: The method includes a reference suction height measuring step (ST1) of measuring a reference suction height of the component supplied to the component pick-up position by measuring a height of the tape or the component stored in the tape, a cart height measuring step (ST3) of measuring a height of a predetermined location of the cart, and a time correction step (ST4) of correcting the reference suction height over time. In the cart height measurement step (ST3), the height of the predetermined location of the cart is measured again, and in the temporal correction step (ST4), the reference suction height is updated based on the height of the predetermined location measured again.SELECTED DRAWING: Figure 13

Description

[Technical Field]

[0001] The present disclosure relates to a component mounting apparatus and a component mounting method for mounting components on a board. [Background technology]

[0002] In a component mounting device, a tape feeder (component supply device) sequentially supplies components stored on a carrier tape to a component pick-up position, where a nozzle attached to a head picks up and mounts the components on a board. The head moves horizontally (in the X and Y directions) using a head movement mechanism equipped with a linear motor, moves to above the component pick-up position to pick up the component, and then moves above the board to mount the component on the board. However, components that have fallen off the nozzle, components that the nozzle has brought back because they could not be mounted on the board, or foreign objects such as dust may overlap on top of the components to be picked up that have been supplied to the component pick-up position. If another foreign component overlaps on top of a component to be picked up that has been supplied to the component pick-up position, there is a problem in that the nozzle picks up the other component and mistakenly mounts it on the board.

[0003] Patent Document 1 discloses a mounting device that has a load sensor in a mounting head that detects the load applied to the suction nozzle, lowers the suction nozzle onto a reference surface formed on a reference member, detects contact of the suction nozzle with the reference surface using the load sensor, and acquires the height at which the suction nozzle contacts the reference surface as the reference height.The mounting device in Patent Document 1 discloses that the suction nozzle is lowered toward a component supplied by a tape feeder, acquires the height at which the suction nozzle contacts the component as the contact height, and determines that an abnormality (the presence of a foreign object) exists if the contact height exceeds a height threshold based on the reference height. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] International Publication No. 2016 / 189684 Summary of the Invention [Problem to be solved by the invention]

[0005] However, when the head repeatedly picks up components from the component pick-up position and places them on the board, the head movement mechanism that moves the head heats up and deforms over time. When the head movement mechanism deforms over time, the height of the tape feeder relative to the nozzle fluctuates, so calibration is performed after a predetermined time has passed to remeasure and update the height of the reference surface of the reference member. However, with conventional technologies including Patent Document 1, when there are a large number of reference surfaces to be measured, the time required for calibration increases, resulting in reduced productivity.

[0006] Therefore, an object of the present disclosure is to provide a component mounting apparatus and a component mounting method that can appropriately correct the reference pickup height of a component supplied to a component pick-up position over time. [Means for solving the problem]

[0007] The component mounting device of the present disclosure is a component mounting device on which a cart equipped with a component supply device having a carrier tape containing a plurality of components attached is set, the plurality of components are sequentially supplied to a component removal position by the component supply device, the components supplied to the component removal position are picked up by a nozzle attached to a head, and mounted on a board, and the component mounting device is equipped with a cart height measurement unit that measures the height of a predetermined location on the cart, a reference suction height measurement unit that measures a reference suction height of a component supplied to the component removal position by measuring the height of the carrier tape or the components stored on the carrier tape, and a time-dependent correction unit that corrects the reference suction height over time, the cart height measurement unit re-measures the height of the predetermined location on the cart, and the time-dependent correction unit updates the reference suction height based on the re-measured height of the predetermined location.

[0008] The component mounting method disclosed herein is a component mounting method in which multiple components stored on a carrier tape are supplied in sequence to respective component removal positions by multiple component supply devices mounted on a cart, and the components supplied to the component removal positions are picked up by nozzles attached to heads and mounted on a board, and includes a reference pickup height measurement process for measuring a reference pickup height of the components supplied to the component removal positions by measuring the height of the carrier tape or the components stored on the carrier tape, a cart height measurement process for measuring the height of a predetermined location on the cart, and a time-dependent correction process for correcting the reference pickup height over time, wherein the height of the predetermined location on the cart is measured again in the cart height measurement process, and the reference pickup height is updated based on the height of the predetermined location measured again in the time-dependent correction process. [Effects of the Invention]

[0009] According to the present disclosure, the reference suction height of a component supplied to a component pick-up position can be appropriately corrected over time. [Brief explanation of the drawings]

[0010] [Figure 1] 1 is a plan view showing a configuration of a main part of a component mounting apparatus according to an embodiment of the present disclosure; [Figure 2] 1 is a configuration explanatory diagram of a main part of a component mounting apparatus according to an embodiment of the present disclosure; [Figure 3] 1A is an explanatory diagram showing a nozzle removing components from a carrier tape that has been pitch-fed to a component removal position of a tape feeder provided in a component mounting device according to an embodiment of the present disclosure; FIG. 1B is an explanatory diagram showing the configuration of the carrier tape; [Figure 4] 1 is a cross-sectional view showing a configuration of a main part of a head provided in a component mounting apparatus according to an embodiment of the present disclosure. [Figure 5] 10A and 10B are explanatory diagrams showing the relationship of forces acting on a mounting unit of a head included in a component mounting apparatus according to an embodiment of the present disclosure. [Figure 6] FIG. 2 is a block diagram showing the configuration of a control system of the component mounting apparatus according to the embodiment of the present disclosure. [Figure 7]FIG. 2 is a block diagram showing the configuration of a control system for a head attached to a component mounting apparatus according to an embodiment of the present disclosure. [Figure 8] 10A and 10B are explanatory diagrams illustrating an example of a reference suction height measurement position and a carriage height measurement position set in a component mounting device according to an embodiment of the present disclosure. [Figure 9] FIG. 10A is an explanatory diagram of an example of the reference suction height and carriage height measured initially in a component mounting device according to an embodiment of the present disclosure; FIG. 10B is an explanatory diagram of an example of the corrected reference suction height calculated from the carriage height measured the Nth time. [Figure 10] 1A is an explanatory diagram of an example of a state where there is no abnormality in the component take-out position of the tape feeder in the component mounting device according to the embodiment of the present disclosure, and FIG. 1B is an explanatory diagram of an example of a state where there is an abnormality. [Figure 11] 1A is an explanatory diagram showing a transition in nozzle height when a component is adsorbed by a component mounting device according to an embodiment of the present disclosure; FIG. 1B is an explanatory diagram showing a transition in thrust of a Z-axis motor; [Figure 12] 1A is an explanatory diagram showing the movement path of the head when there is no defective component, and FIG. 1B is an explanatory diagram showing the movement path of the head when there is a defective component, during component mounting by the component mounting device according to an embodiment of the present disclosure. [Figure 13] FIG. 1 is a flow diagram of a component mounting method according to an embodiment of the present disclosure. [Figure 14] FIG. 1 is a flow diagram of a component suction method according to an embodiment of the present disclosure. DETAILED DESCRIPTION OF THE INVENTION

[0011] An embodiment of the present disclosure will be described in detail below with reference to the drawings. The configurations, shapes, etc. described below are examples for explanation purposes and can be modified as appropriate depending on the specifications of the component mounting device, head, tape feeder, and cart. In the following, corresponding elements in all drawings will be given the same reference numerals, and duplicated explanations will be omitted. In FIG. 1 and in some parts described below, the X-axis (left-right direction in FIG. 1) in the substrate transport direction and the Y-axis (up-down direction in FIG. 1) perpendicular to the substrate transport direction are shown as two axes that are perpendicular to each other in a horizontal plane. In FIG. 2 and in some parts described below, the Z-axis (up-down direction in FIG. 2) is shown as the height direction that is perpendicular to the horizontal plane.

[0012] First, the configuration of component mounting apparatus 1 will be described with reference to Figures 1 to 5. Component mounting apparatus 1 has a function of performing a component mounting operation for manufacturing a mounted board by mounting components supplied from a component supply unit onto a board.

[0013] 1 and 2, a board transport mechanism 3 is arranged along the X-axis at the center of the base 2. The board transport mechanism 3 transports the board B transported from upstream to the mounting position, positions it, and holds it. The board transport mechanism 3 also transports the board B downstream after the component mounting operation is complete.

[0014] Component supply units 4 are arranged on both sides (front and back directions of the Y axis) of the board transport mechanism 3. Each component supply unit 4 is equipped with a carriage 6 that holds multiple tape feeders 5 (component supply devices) along the X axis. The tape feeders 5 pitch-feed a carrier tape 16, on which pockets for storing components D are formed, in a direction (tape feed direction) from the outside of the component supply unit 4 toward the board transport mechanism 3, thereby supplying components D to a component pick-up position 5a where the components D are picked up by a head 9, which will be described below.

[0015] 1 and 2, a Y-axis table 7 equipped with a linear drive mechanism is arranged along the Y-axis at both ends of the X-axis on the upper surface of the base 2. A beam 8 similarly equipped with a linear drive mechanism is connected to the Y-axis table 7 so as to be freely movable along the Y-axis. The beam 8 is arranged along the X-axis. A head 9 is attached to the beam 8 via a plate 8a so as to be freely movable along the X-axis. The head 9 is detachable from the plate 8a. The head 9 is equipped with a plurality of mounting units 20. A nozzle 29 for suctioning and holding a component D is attached to the lower end of each mounting unit 20.

[0016] The Y-axis table 7 and beam 8 constitute a head moving mechanism 10 that moves the head 9 along the X-axis and Y-axis. The head moving mechanism 10 and head 9 perform a mounting turn in which nozzles 29 attached to the mounting unit 20 pick up and remove components D from tape feeders 5 arranged in the component supply unit 4, and mount them at the mounting positions on the board B positioned by the board transport mechanism 3. In this way, multiple nozzles 29 are attached to the head 9, and each nozzle 29 picks up a component D supplied from the component supply unit 4 and mounts it on the board B.

[0017] 1 and 2, a component recognition camera 11 and a discharge box 14 are disposed between the component supply unit 4 and the board transport mechanism 3. When the head 9, which has picked up a component D from the component supply unit 4, moves above the component recognition camera 11, the component recognition camera 11 captures an image of the component D held by the head 9 and recognizes the holding posture of the component D. A head camera 12 is attached to the plate 8a to which the head 9 is attached. The head camera 12 moves integrally with the head 9.

[0018] As head 9 moves, head camera 12 moves above board B positioned on board transport mechanism 3, and captures an image of a board mark (not shown) provided on board B to recognize the position of board B. When head 9 mounts components on board B, the mounting position is corrected taking into account the recognition result of component D by component recognition camera 11 and the recognition result of the board position by head camera 12.

[0019] In FIG. 1, discharge box 14 is for discarding unnecessary components D. When head 9 determines that a component D picked up from tape feeder 5 is unnecessary, head 9 moves above discharge box 14 before moving to board B. Then, head 9 causes nozzle 29 that picked up the unnecessary component D to perform a discarding operation, causing the unnecessary component D to be discarded in discharge box 14 (see FIG. 12(b)). A touch panel 13 that is operated by the worker is installed in front of component mounting apparatus 1 at a position where the worker works. Touch panel 13 displays various information on its display, and the worker inputs data and operates component mounting apparatus 1 using operation buttons and the like displayed on the display.

[0020] 1 and 2, a carriage 6 is set in the component supply unit 4, with a plurality of tape feeders 5 held in advance on a feeder base 6a. The carriage 6 holds a tape reel 17 that stores a wound carrier tape 16 holding components D. The carrier tape 16 pulled out from the tape reel 17 is pitch-fed by the tape feeders 5 to the component removal position 5a.

[0021] 3(a), a pressing member 5b that guides carrier tape 16 from above is disposed above tape feeder 5. Pressing member 5b is provided with an opening 5c ​​located at component removal position 5a.

[0022] 3(b) shows the carrier tape 16 near the component removal position 5a as viewed from above, with the holding member 5b omitted from the illustration. The base tape 16a of the carrier tape 16 has recessed pockets 16b for storing components D and feed holes 16c formed at equal intervals that engage with a sprocket (not shown) that pitch-feeds the carrier tape 16. A top tape 16d is attached to the top surface of the pockets 16b that store the components D.

[0023] In Figure 3(a), top tape 16d is peeled off and folded back at edge 5d located upstream of opening 5c ​​in the direction of carrier tape travel. The peeled top tape 16d is pulled and moved in the opposite direction to the direction of carrier tape travel (the direction of top tape travel after peeling). This opens up the upper part of pocket 16b downstream in the direction of travel of carrier tape 16 (right side of Figure 3(a)) including component removal position 5a. Nozzle 29 of head 9 is moved by head moving mechanism 10 to above component removal position 5a and picks up and removes component D stored in pocket 16b at component removal position 5a through opening 5c.

[0024] 1 and 2, reference posts 15 are arranged on the feeder base 6a at left and right positions in the X-axis direction that sandwich multiple tape feeders 5. The reference posts 15 are made of a hard material such as metal. The reference posts 15 are arranged at positions that allow the nozzle 29 of the head 9 to come into contact with the upper surfaces of the reference posts 15 when the carriage 6 is attached to the component supply unit 4. The height of the upper surfaces of the reference posts 15 is set to be approximately the same height as the height of the component pick-up positions 5a of the tape feeders 5 held by the feeder base 6a.

[0025] Next, the configuration of the head 9 will be described with reference to Figure 4. The head 9 has multiple mounting units 20 (#1) to (#4) (here, four in the X direction) arranged inside a head base 9a. Hereinafter, the symbols (#1) to (#4) that identify the mounting units 20 will be omitted where appropriate. The mounting unit 20 is configured to raise and lower a shaft 21 extending in the vertical direction (Z-axis direction) by a servo-controlled Z-axis motor 22, thereby raising and lowering a nozzle 29.

[0026] Shaft 21 is connected to the lower side of Z-axis motor 22 via output portion 23. The lower end of shaft 21 is inserted into spline guide portion 24, which is rotatable through θ by bearings 24a arranged above and below, and protrudes outward from the lower surface of head base 9a. A nozzle 29 is attached to the lower end of shaft 21 protruding from the lower surface of head base 9a. In this way, nozzle 29 is attached to the lower end of shaft 21, which is raised and lowered by Z-axis motor 22 (motor).

[0027] 4, a return spring 25, which is a compression spring, is attached to the shaft 21 between the output portion 23 and the spline guide portion 24. The return spring 25 exerts an upward repulsive force on the output portion 23. That is, when the nozzle 29 is to be lowered, the Z-axis motor 22 generates a downward thrust, which lowers the shaft 21 against the repulsive force of the return spring 25. When the nozzle 29 is to be raised, the Z-axis motor 22 reduces the thrust it generates, and the return spring 25 raises the output portion 23 with the upward repulsive force, which raises the shaft 21.

[0028] A scale 26 that moves up and down in accordance with the up and down movement of the output unit 23, i.e., the up and down movement of the shaft 21, is provided to protrude upward from the top of the Z-axis motor 22. Also, a position detection sensor 27 that detects the movement of the scale 26 is arranged above the Z-axis motor 22. The position detection sensor 27 outputs encoder pulses that indicate the movement distance and direction of the scale 26 as position signals to the servo control unit 40 (see FIG. 6). The vertical position (height position) of the shaft 21 is detected from the position signal. In other words, the scale 26 and the position detection sensor 27 constitute an encoder 28 that detects the height position of the shaft 21 (or the nozzle 29).

[0029] Next, the relationship between the forces acting on mounting unit 20 will be described with reference to Fig. 5. Thrust Ft is generated by Z-axis motor 22, and acts in a direction that pushes down shaft 21, which is connected via output unit 23. Weight W is the sum of the weights of the hatched parts that indicate the moving parts in the figure, that is, scale 26, output unit 23, shaft 21, nozzle 29, etc., and acts in a direction that pushes down shaft 21, just like thrust Ft.

[0030] The reaction force Fr is the reaction force of the return spring 25, and acts in a direction pushing up the shaft 21 via the output portion 23. The resistance Ff is an external resistive force from the spline guide portion 24 and the like that slidably holds the above-mentioned movable portion, and acts upward on the shaft 21 that is driven in the downward direction. The load Fa represents the load when the nozzle 29 presses the component D held by it against the board B.

[0031] 5 shows a state in which nozzle 29 is pressing component D held by nozzle 29 against board B during component mounting work. In this state, load Fa is expressed as Fa = Ft + W - Fr - Ff. When thrust Ft of Z-axis motor 22 is increased while component D is in contact with board B, the reaction force Fr of return spring 25 remains constant, and load Fa increases in proportion to thrust Ft. Furthermore, before component D held by nozzle 29 comes into contact with board B, load Fa is zero, and output section 23 (shaft 21, nozzle 29) descends in proportion to thrust Ft of Z-axis motor 22, increasing reaction force Fr of return spring 25 (Fr = Ft + W - Ff).

[0032] Next, the configuration of the control system of the component mounting apparatus 1 will be described with reference to Fig. 6. The main body control unit 30 provided in the component mounting apparatus 1 is connected to the board transport mechanism 3, tape feeder 5, head 9, head moving mechanism 10, component recognition camera 11, head camera 12, and touch panel 13. The four mounting units 20 (#1) to (#4) provided in the head 9 each include a servo control unit 40. The servo control unit 40 is connected to the Z-axis motor 22 and the position detection sensor 27 of the encoder 28.

[0033] Servo control unit 40 drives Z-axis motor 22 based on the vertical position of shaft 21 (nozzle 29) detected by encoder 28, in accordance with a command from main body control unit 30. Methods for controlling Z-axis motor 22 by servo control unit 40 include position control and torque control. In the case of position control, servo control unit 40 controls Z-axis motor 22 so that the height of nozzle 29 matches the height commanded by main body control unit 30. In the case of torque control, servo control unit 40 controls thrust Ft of Z-axis motor 22 based on a command from main body control unit 30.

[0034] 6, the main body control unit 30 includes a main body storage unit 31, a carriage height measurement processing unit 32, a reference height measurement processing unit 33, a suction height measurement processing unit 34, a time-dependent correction unit 35, a suction abnormality detection unit 36, and a mounting processing unit 37. The main body storage unit 31 is a storage device, and stores mounting data 31a, measured position data 31b, carriage height data 31c, reference suction height data 31d, measured suction height data 31e, suction abnormality data 31f, etc.

[0035] The mounting data 31a stores various information for each type of mounting board, such as information identifying the board B (board type number, size, material, thickness, etc.), information on the components D to be mounted on the board B (component name, size, thickness, supply position on the carriage 6, etc.), and coordinates of the mounting position on the board B. The mounting data 31a also stores the thrust limit value Ftt (see FIG. 11(b)) of the Z-axis motor 22 during the component mounting operation.

[0036] 6, the measurement position data 31b stores information (such as XY coordinates) about carriage height measurement positions Pc1 and Pc2 (FIG. 8), which are the center positions of the reference posts 15 provided on the carriage 6 attached to the component supply unit 4. The measurement position data 31b also stores information (such as XY coordinates) about reference suction height measurement positions Pt1 to Pt6 (FIG. 8), which are set within the opening 5c ​​of the tape feeder 5 and at which a reference suction height measurement unit 51 (described later) measures height. The carriage height data 31c stores measurement results of the heights of the carriage height measurement positions Pc1 and Pc2 (reference posts 15) of the carriage 6 (hereinafter referred to as "reference carriage heights Hc1 and Hc2") measured by a carriage height measurement unit 50 (described later).

[0037] The reference suction height data 31d stores the measurement results of the heights at the reference suction height measurement positions Pt1 to Pt6 (hereinafter referred to as "reference suction heights Ht1 to Ht6") measured by the reference suction height measurement unit 51 (FIG. 9). The measured suction height data 31e stores the measurement results of the heights (hereinafter referred to as "suction heights Hp1, Hp2") at which the nozzle 29 picks up the component D supplied to the component take-out position 5a of the tape feeder 5, measured by the suction height measurement unit 52 (described later) (FIG. 10).

[0038] Here, the control system of the head 9 will be described in detail with reference to Fig. 7. The head 9 in this example is equipped with four mounting units 20(#1) to (#4). Each mounting unit 20(#1) to (#4) is equipped with a Z-axis motor 22(#1) to (#4), an encoder 28(#1) to (#4), and a servo control unit 40(#1) to (#4). The four mounting units 20(#1) to (#4) have the same configuration, and the following description will be given using mounting unit 20(#1) as an example. Furthermore, the symbols (#1) to (#4) that identify the mounting units 20, etc. will be omitted as appropriate.

[0039] 7, servo control unit 40 includes motor driver 41, thrust measurement unit 42, thrust limiting unit 43, position detection unit 44, and contact detection unit 45. Motor driver 41 is a drive control device for Z-axis motor 22, which is a servo motor, and supplies current to Z-axis motor 22 (arrow a) based on a preset operation pattern to drive Z-axis motor 22. Motor driver 41 then detects deviations from the target height and target elevation speed determined by the operation pattern using pulse signals sent from encoder 28 (arrow b), and drives Z-axis motor 22 using servo control that feeds back the detected deviations.

[0040] The thrust measuring unit 42 has a function of measuring the thrust Ft of the Z-axis motor 22. That is, the thrust Ft generated by the Z-axis motor 22 is measured based on the current (arrow a) supplied to the Z-axis motor 22 from the motor driver 41 or the current value (arrow c) notified from the motor driver 41. The thrust limiting unit 43 sets a thrust limit value Ftt instructed by the main body control unit 30 to the motor driver 41 (arrow d). In this embodiment, the thrust Ft of the Z-axis motor 22 is limited based on the thrust limit value Ftt.

[0041] 7, contact detection unit 45 calculates the rate of change ΔFt of thrust from thrust Ft measured by thrust measurement unit 42. Furthermore, when the calculated rate of change ΔFt of thrust exceeds a predetermined contact determination value, contact detection unit 45 determines that nozzle 29 has come into contact with component D supplied to component pick-up position 5a, or that component D sucked by nozzle 29 has come into contact with board B.

[0042] Position detection unit 44 counts encoder pulses (arrow e) from encoder 28 of Z-axis motor 22. This count value becomes position information indicating the height position of nozzle 29 (hereinafter referred to as "nozzle height H"). In other words, position detection unit 44 detects nozzle height H of nozzle 29 based on the position signal from Z-axis motor 22.

[0043] In Figure 6, the trolley height measurement processing unit 32 controls the head moving mechanism 10 and the servo control unit 40 of the head 9 based on the measurement position data 31b to measure the reference trolley height Hc1 at the trolley height measurement position Pc1 of the trolley 6 attached to the component supply unit 4 and the reference trolley height Hc2 at the trolley height measurement position Pc2, and stores the measured height data in the main memory unit 31 as trolley height data 31c in association with information related to the measurement time (such as Nth time).

[0044] 8 and 9, a specific example of the process of measuring the reference bogie heights Hc1 and Hc2 by the bogie height measurement processor 32 will be described. First, the bogie height measurement processor 32 controls the head moving mechanism 10 to move the head 9 so that the nozzle 29 is above the bogie height measurement positions Pc1 and Pc2 set on the reference post 15. Next, the bogie height measurement processor 32 instructs the servo controller 40 to set a height lower than the reference bogie heights Hc1 and Hc2 as a target height, and lowers the nozzle 29. When the contact detector 45 detects from the thrust change rate ΔFt that the nozzle 29 has come into contact with the upper surface of the reference post 15, the servo controller 40 stops the descent of the nozzle 29 and transmits the nozzle height H (height of the nozzle 29) detected by the position detector 44 to the bogie height measurement processor 32.

[0045] The carriage height measurement processing unit 32 associates the received nozzle height H with information about the measurement time (Nth time) and stores it in the carriage height data 31c as reference carriage heights Hc1(N) and Hc2(N). In this way, the carriage height measurement processing unit 32, the head 9, and the head movement mechanism 10 constitute a carriage height measurement unit 50 that measures the height (reference carriage heights Hc1, Hc2) of a predetermined location (reference post 15) of the carriage 6. The carriage height measurement unit 50 also measures the height of the predetermined location of the carriage 6 based on the nozzle height H of the nozzle 29 attached to the head 9. The carriage height measurement unit 50 also measures the height of the predetermined location based on the thrust force Ft of the motor (Z-axis motor 22) that lowers the nozzle 29. The carriage height measurement unit 50 may be configured to include a height sensor such as a laser displacement sensor.

[0046] In Figure 6, the reference height measurement processing unit 33 controls the head moving mechanism 10 and the servo control unit 40 of the head 9 based on the measurement position data 31b to measure the heights (reference suction heights Ht1 to Ht6) of the reference suction height measurement positions Pt1 to Pt6 of the tape feeder 5 attached to the cart 6, and stores the measured heights in the main body memory unit 31 as reference suction height data 31d in association with information related to the measurement time (Nth time, etc.).

[0047] 8 and 9, a specific example of the measurement process of the reference suction heights Ht1 to Ht6 by the reference height measurement processor 33 will be described. In the example of Fig. 8, the reference suction height measurement positions Pt1 to Pt6 are set on the upper surface of the base tape 16a fed to each of the component take-out positions 5a of the tape feeders 5(1) to 5(6), outside the pocket 16b (see also Fig. 3(b)).

[0048] First, the reference height measurement processing unit 33 controls the head moving mechanism 10 to move the head 9 so that the nozzle 29 is above the reference suction height measurement positions Pt1 to Pt6 set in the tape feeders 5(1) to 5(6) attached to the carriage 6. Next, the reference height measurement processing unit 33 instructs the servo control unit 40 to set a height lower than the reference suction heights Ht1 to Ht6 as a target height, and lowers the nozzle 29. When the contact detection unit 45 detects from the rate of change ΔFt of thrust that the nozzle 29 has come into contact with the upper surface of the base tape 16a, the servo control unit 40 stops the descent of the nozzle 29 and transmits the nozzle height H (height of the nozzle 29) detected by the position detection unit 44 to the reference height measurement processing unit 33.

[0049] The reference height measurement processing unit 33 associates the received nozzle height H with information about the measurement time (Nth time), and stores the information as reference suction heights Ht1(N) to Ht6(N) in the reference suction height data 31d. Note that the reference suction height measurement positions Pt1 to Pt6 may be the top surface of the base tape 16a of the carrier tape 16, or the top surface of the component D stored in the pocket 16b.

[0050] In this way, the reference height measurement processing unit 33, head 9, and head moving mechanism 10 constitute a reference suction height measuring unit 51 that measures the reference suction heights Ht1 to Ht6 of the component D supplied to the component take-out position 5a by measuring the height of the carrier tape 16 or the upper surface (reference suction height measurement positions Pt1 to Pt6) of the component D stored on the carrier tape 16. Also, the reference suction height measuring unit 51 measures the reference suction heights Ht1 to Ht6 based on the thrust of the motor (Z-axis motor 22) that lowers the nozzle 29. Note that the reference suction height measuring unit 51 may be configured to include a height sensor such as a laser displacement sensor.

[0051] 6, the aging correction unit 35 corrects changes over time in the reference attraction heights Ht1 to Ht6 caused by thermal deformation of the head moving mechanism 10 based on the carriage height data 31c and the reference attraction height data 31d, and calculates the corrected reference attraction heights Ht1 to Ht6. Then, the aging correction unit 35 updates the reference attraction heights Ht1 to Ht6 of the reference attraction height data 31d to the corrected reference attraction heights Ht1 to Ht6. In other words, the aging correction unit 35 corrects the reference attraction heights Ht1 to Ht6 over time.

[0052] In the component mounter 1, continuous component mounting operations can cause thermal deformation, such as warping or twisting, of the Y-axis table 7 and beam 8 of the head movement mechanism 10. When the head movement mechanism 10 thermally deforms, the head 9 moves in the Z-axis direction (up and down) relative to the carriage 6 and tape feeders 5(1) to 5(6). If the height of the head 9 fluctuates relative to the tape feeder 5, the distance between the nozzle 29 and the component D supplied to the component pick-up position 5a fluctuates, which could result in the nozzle 29 being unable to pick up the component D or an excessive load Fa being applied to the component D during the component pickup operation. Therefore, during the component mounting operation, it is necessary to remeasure the reference pickup heights Ht1 to Ht6 at predetermined intervals or to correct the reference pickup heights Ht1 to Ht6 over time based on the remeasured reference carriage heights Hc1, Hc2, etc., to correct the amount of descent of the nozzle 29.

[0053] 9, an example of the time-dependent correction process will be described in which the time-dependent correction unit 35 calculates corrected reference suction heights Ht1(N) to Ht6(N) based on the reference suction heights Ht1(0) to Ht6(0) and reference carriage heights Hc1(0), Hc2(0) measured initially (0th time) and the reference carriage heights Hc1(N), Hc2(N) re-measured the Nth time. Here, the description will be made taking as an example a carriage 6 on which six tape feeders 5(1) to 5(6) are mounted between two reference posts 15 arranged on a feeder base 6a shown in FIG.

[0054] 9(a) is an XY graph plotting initial reference carriage heights Hc1(0), Hc2(0) and reference suction heights Ht1(0) to Ht6(0), with the horizontal axis representing the X coordinates of carriage height measurement positions Pc1, Pc2 and reference suction height measurement positions Pt1 to Pt6, and the vertical axis representing the nozzle height H measured initially (0th time) by carriage height measurement unit 50 and reference suction height measurement unit 51. Variations occur in the reference suction heights Ht1(0) to Ht6(0) due to variations in the thickness of base tape 16a of carrier tape 16 transported by tape feeders 5(1) to 5(6) and variations in how tape feeders 5(1) to 5(6) are attached to carriage 6.

[0055] 9(b) is a diagram illustrating the time-dependent correction process by the time-dependent correction unit 35 based on the reference carriage heights Hc1(N) and Hc2(N) remeasured for the Nth time. In this example, the remeasured reference carriage heights Hc1(N) and Hc2(N) are higher than the initial reference carriage heights Hc1(0) and Hc2(0). In other words, due to thermal deformation of the head moving mechanism 10, the head 9 has moved relatively closer to the carriage 6.

[0056] The time-dependent correction unit 35 derives the initial approximate straight line (H=a0*X+b0; a0=(Hc2(0)-Hc1(0)) / (X8-X1), b0=(Hc1(0)*X8-Hc2(0)*X1) / (X8-X1)) from the X coordinates (X1, X8) of the carriage height measurement positions Pc1 and Pc2 and the initial reference carriage heights Hc1(0) and Hc2(0). In addition, the time-dependent correction unit 35 derives the approximate straight line (H=aN*X+bN; aN=(Hc2(N)-Hc1(N)) / (X8-X1), bN=(Hc1(N)*X8-Hc2(N)*X1) / (X8-X1)) at the time of re-measurement from the X coordinates (X1, X8) of the carriage height measurement positions Pc1 and Pc2 and the re-measured reference carriage heights Hc1(N) and Hc2(N).

[0057] In FIG. 9(b), the time-dependent correction unit 35 then calculates the relative height fluctuation amounts ΔH1 to ΔH6 of each of the tape feeders 5(1) to 5(6) with respect to the head 9 from the initial approximate straight line, the approximate straight line at the time of re-measurement, and the X coordinates (X2 to X7) of the reference suction height measurement positions Pt1 to Pt6.

[0058] For example, the aging correction unit 35 calculates the amount of fluctuation ΔH3 in the position of tape feeder 5(3) as the difference between the nozzle height H calculated from the approximation line at the time of re-measurement and the nozzle height H calculated from the initial approximation line (ΔH3=(aN-a0)*(X4-X1)+(bN-b0)).Then, the aging correction unit 35 assumes that the reference suction height Ht3(N) of tape feeder 5(3) has fluctuated from the initial value (reference suction height Ht3(0)) by the amount of fluctuation ΔH3 at the time of re-measurement, and calculates the corrected reference suction height Ht3(N) (Ht3(N)=Ht3(0)+ΔH3).

[0059] In this way, the carriage height measurement unit 50 remeasures the heights (reference carriage heights Hc1(N), Hc2(N)) of the predetermined locations (reference posts 15) of the carriage 6, and the time-dependent correction unit 35 updates the reference pickup heights Ht1(N) to Ht6(N) based on the heights of the predetermined locations measured again. This reduces the number of measurement locations during remeasurement, while appropriately correcting the reference pickup heights Ht1 to Ht6 of the components D supplied to the component pick-up position 5a over time.

[0060] In FIG. 6, the suction height measurement processing unit 34 controls the servo control unit 40 of the head 9 based on the mounting data 31a and the reference suction height data 31d to measure the suction height, which is the nozzle height H when the nozzle 29 picks up the component D supplied to the component removal position 5a of the tape feeder 5 attached to the cart 6, and stores the measured suction height data 31e in the main body memory unit 31 in association with information identifying the mounting unit 20 (#1) to (#4) to which the nozzle 29 is attached.

[0061] 10 and 11, a specific example of the measurement process of the suction heights Hp1 and Hp2 by the suction height measurement processing unit 34 will be described. Fig. 10(a) schematically shows a state in which the component D1 is normally supplied to the component take-out position 5a of the tape feeder 5. The reference suction height data 31d stores the reference suction height Ht(0) at the reference suction height measurement position Pt measured by the reference suction height measurement unit 51, or the corrected reference suction height Ht(N) corrected by the time-dependent correction unit 35.

[0062] The pickup height measurement processor 34 measures the pickup heights Hp1 and Hp2 during a component pickup operation in which the nozzle 29 picks up the component D1 supplied to the component pick-up position 5a during a component mounting operation. Specifically, the mounting processor 37 controls the head movement mechanism 10 to move the head 9 so that the nozzle 29 is above the pickup position Pd of the component D1 supplied to the component pick-up position 5a, and instructs the servo controller 40 to set a target height Hg that is lower than the component height Hd, which is the height of the upper surface of the component D1 supplied to the component pick-up position 5a, while the nozzle 29 is descending. The target height Hg may be a pre-stored fixed value or a calculated value calculated based on the reference pickup height Ht included in the reference pickup height data 31d. In this case, the head 9 picks up the component D supplied to the component pick-up position 5a based on the reference pickup height Ht.

[0063] Figure 11(a) shows the change in nozzle height H during component pickup. Figure 11(b) shows the change in thrust Ft of Z-axis motor 22 during component pickup. In Figures 11(a) and 11(b), the nozzle height H and thrust Ft in the normal state (when no other component D2 is present) shown in Figure 10(a) are plotted by solid lines.

[0064] The pickup height measurement processing unit 34 instructs the thrust limiting unit 43 of the servo control unit 40 of the thrust limiting value Ftt included in the mounting data 31a, and the thrust limiting unit 43 sets the thrust limiting value Ftt in the motor driver 41. Note that the mounting processing unit 37 may also instruct the thrust limiting value Ftt to the thrust limiting unit 43. That is, when the nozzle 29 picks up the component D1 supplied to the component pick-up position 5a, the component mounting device 1 limits the thrust Ft of the motor (Z-axis motor 22) that lowers the nozzle 29 to a predetermined value (thrust limiting value Ftt).

[0065] 11, until time T2 when the descending nozzle 29 abuts against the top surface of component D1, the Z-axis motor 22 generates a thrust Ft that causes the nozzle 29 to descend against resistance Ff from the shaft 21 and other components. When the nozzle 29 abuts against the top surface of component D1 at time T2, the thrust Ft generated by the Z-axis motor 22 increases rapidly, applying a load Fa to component D1, and reaching a thrust limit value Ftt at time T3. When the thrust Ft reaches the thrust limit value Ftt, the motor driver 41 controls the thrust Ft so that it does not exceed the thrust limit value Ftt. The thrust limit value Ftt is set to a value that will prevent the load Fa applied from the nozzle 29 from damaging component D1 or causing reliability problems.

[0066] When the contact detection unit 45 detects from the rate of change ΔFt of thrust that the nozzle 29 has come into contact with the upper surface of the component D1, the position detection unit 44 transmits the detected nozzle height H (component height Hd) to the suction height measurement processing unit 34. The reference height measurement processing unit 33 sets the received nozzle height H as the suction height Hp1, associates it with information specifying the mounting units 20 (#1) to (#4) that lowered the nozzle 29, and stores the data in the main body storage unit 31 as measured suction height data 31e.

[0067] 11, at time T4, a predetermined time after time T2 when nozzle 29 comes into contact with component D1, mounting processing unit 37 starts suction from nozzle 29, causing component D1 to be picked up by nozzle 29. Next, mounting processing unit 37 causes servo control unit 40 to raise nozzle 29, so that nozzle 29 picks up component D1 and begins to rise at time T5.

[0068] Figure 10(b) shows a schematic diagram of an abnormal state in which a foreign object, component D2, overlaps component D1 supplied to component pick-up position 5a of tape feeder 5. Figures 11(a) and 11(b) show the nozzle height H and thrust force Ft in the abnormal state shown in Figure 10(b) (where another component D2 overlaps) using dotted lines.

[0069] 11, when a component pickup operation is performed on tape feeder 5 in the abnormal state shown in FIG. 10(b), the descending nozzle 29 contacts the top surface of component D2, which is at height H2 higher than component height Hd of component D1, at time T1, which is earlier than time T2. Thereafter, thrust Ft generated by Z-axis motor 22 increases rapidly, and load Fa is applied to component D1 via component D2. However, because thrust Ft is limited to thrust limit value Ftt, component D1 is not damaged. When suction from nozzle 29 begins at time T3, another component D2, which is a foreign object, is picked up by nozzle 29.

[0070] The contact detection unit 45 detects that the nozzle 29 has come into contact with the upper surface of the component D2 from the rate of change ΔFt of thrust, and the position detection unit 44 transmits the detected nozzle height H (height H2) to the suction height measurement processing unit 34. The reference height measurement processing unit 33 sets the received nozzle height H as the suction height Hp2, associates it with information specifying the mounting units 20 (#1) to (#4) that performed the component suction work, and stores the data in the main body storage unit 31 as measured suction height data 31e.

[0071] In this way, the suction height measurement processing unit 34 and the head 9 constitute a suction height measurement unit 52 that measures the suction heights Hp1 and Hp2 when the nozzle 29 picks up the component D1 supplied to the component pick-up position 5a. The suction height measurement unit 52 also measures the suction heights Hp1 and Hp2 based on the thrust Ft of the motor (Z-axis motor 22) that lowers the nozzle 29.

[0072] 6, the suction abnormality detection unit 36 ​​determines whether or not there was an abnormality at the component pick-up position 5a of the tape feeder 5 where the nozzles 29 of the mounting units 20(#1) to (#4) performed a component pick-up operation, based on the reference suction height data 31d and the measured suction height data 31e. Specifically, the suction abnormality detection unit 36 ​​calculates the difference between the suction heights Hp1 and Hp2 included in the measured suction height data 31e and the reference suction height Ht included in the reference suction height data 31d. The suction abnormality detection unit 36 ​​then determines whether or not the calculated difference is equal to or greater than a predetermined threshold value ΔHt, and if the difference is equal to or greater than the threshold value ΔHt, determines that there was an abnormality at the component pick-up position 5a.

[0073] That is, when the suction heights Hp1 and Hp2 are higher than the height obtained by adding the reference suction height Ht to the threshold value ΔHt, the suction abnormality detection unit 36 ​​determines that there is an abnormality in the component pick-up position 5a (hereinafter referred to as "suction abnormality"). The threshold value ΔHt is set to a value greater than the manufacturing variation in the thickness of the base tape 16a of the carrier tape 16 and the fluctuation in the carriage heights Hc1 and Hc2 due to changes over time. In the example of FIG. 10(a), the suction height Hp1 is lower than the height obtained by adding the reference suction height Ht to the threshold value ΔHt, and is determined to be normal by the suction abnormality detection unit 36. In the example of FIG. 10(b), the suction height Hp2 is higher than the height obtained by adding the reference suction height Ht to the threshold value ΔHt, and is determined to be abnormal by the suction abnormality detection unit 36.

[0074] In this way, the suction abnormality detection unit 36 ​​determines whether the difference between the suction heights Hp1, Hp2 measured by the suction height measurement unit 52 and the reference suction height Ht measured by the reference suction height measurement unit 51 is equal to or greater than the threshold value ΔHt, and if the difference is equal to or greater than the threshold value ΔHt, determines that there is an abnormality at the component takeout position 5a. The suction abnormality detection unit 36 ​​stores information identifying the mounting unit 20(#1)-(#4) determined to have an suction abnormality as suction abnormality data 31f in the main body storage unit 31. Note that cases where there is an abnormality at the component takeout position 5a include cases where another component D2 overlaps on the supplied component D1 as shown in FIG. 10(b), as well as cases where a foreign object such as dust is placed on the supplied component D1.

[0075] 6, mounting processing unit 37 controls each unit of component mounting apparatus 1 to perform component mounting work based on the component name of component D to be mounted on board B, the supply position on cart 6, the mounting position, etc., included in mounting data 31a. Mounting processing unit 37 also changes the movement path of head 9 based on suction abnormality data 31f.

[0076] Here, the movement path of the head 9 after the component suction operation will be described with reference to FIG.

[0077] 12(a) shows the path along which the mounting processing unit 37 controls the head moving mechanism 10 to move the head 9 that had no pickup abnormalities in all of the mounting units 20(#1) to (#4). After the component pickup operation, the mounting processing unit 37 moves the head 9 from the tape feeder 5 to the side of the component recognition camera 11 (arrow f1). Next, the mounting processing unit 37 moves the head 9 above the component recognition camera 11 to recognize the holding posture of the component D (arrow f2). Next, the mounting processing unit 37 moves the head 9 above the board B positioned by the board transport mechanism 3 (arrow f3), corrects the position based on the image capture result of the component recognition camera 11, and mounts the component D held by the nozzle 29 at the mounting position.

[0078] 12(b) shows the path that the mounting processing unit 37 controls the head moving mechanism 10 to move a head 9 that has a suction abnormality in at least one of the mounting units 20(#1) to (#4). When a suction abnormality occurs, the path (arrows g3 to g4) that the head 9 takes after moving to the side of the component recognition camera 11 (arrow g1) and above the component recognition camera 11 (arrow g2) after the component suction operation is different from the path that the head 9 takes when there is no suction abnormality as shown in FIG. 12(a). Specifically, after an image is captured by the component recognition camera 11, the mounting processing unit 37 moves the head 9 above the discharge box 14 (arrow g3).

[0079] Next, the mounting processing unit 37 causes the mounting unit 20 (#1) to (#4) having the suction abnormality to execute a discarding operation to release the component D held by the nozzle 29 from the nozzle 29. As a result, if a foreign object such as another component D2 is placed on the component removal position 5a and the nozzle 29 has picked up the foreign object, causing a suction abnormality, the foreign object picked up by the nozzle 29 is discarded into the discharge box 14. Next, the mounting processing unit 37 moves the head 9 above the board B positioned by the board transport mechanism 3 (arrow g4), corrects the position based on the image capture result of the component recognition camera 11, and mounts the component D held by the nozzle 29 at the mounting position.

[0080] In this way, when the suction abnormality detection unit 36 ​​determines that there is an abnormality at the component pick-up position 5a (there is a suction abnormality), the head 9 moves above the discharge box 14 before moving to the board B, and causes the nozzle 29 that has performed the operation of picking up the component D at the component pick-up position 5a determined to be abnormal to perform a discard operation. This makes it possible to prevent foreign matter that has been mistakenly picked up by the nozzle 29 from falling onto the board B.

[0081] Next, following the flow of Figures 13 and 14, and with reference to Figures 8 to 12, a component mounting method will be described in which multiple tape feeders 5 (component supply devices) mounted on a cart 6 sequentially supply multiple components D stored on carrier tapes 16 to their respective component removal positions 5a, and the components D supplied to the component removal positions 5a are sucked up by nozzles 29 attached to a head 9 and mounted on a board B.

[0082] 13, first, the reference suction height measurement unit 51 measures the height of the carrier tape 16 or the component D stored on the carrier tape 16 to measure the reference suction heights Ht1(0) to Ht6(0) of the component D supplied to the component take-out position 5a, and stores the measured heights as reference suction height data 31d (ST1: reference suction height measurement step) (FIGS. 8 and 9). The reference suction height measurement step (ST1) is executed when the component mounting apparatus 1 is started up, before the type of board B is changed in the component mounting apparatus 1 and before the component mounting operation is started (initial stage), after the carrier tape 16 supplied by the tape feeder 5 is switched, after the tape feeder 5 attached to the carriage 6 is replaced, etc.

[0083] Next, if it is time for time-dependent correction (Yes in ST2), the carriage height measurement unit 50 measures the height (reference carriage heights Hc1(N), Hc2(N)) of a predetermined location (reference post 15) of the carriage 6 and stores it as carriage height data 31c (ST3: carriage height measurement step) (FIGS. 8 and 9). The carriage height measurement step (ST3) is performed initially, as well as at predetermined time intervals (e.g., every 10 minutes) during component mounting work, or after component mounting work has been performed on a predetermined number of boards B (e.g., 10 boards).

[0084] In FIG. 13, next, the temporal correction unit 35 corrects the reference attraction heights Ht1(0) to Ht6(0) over time based on the reference attraction heights Ht1(0) to Ht6(0) measured initially, the reference vehicle heights Hc1(0), Hc2(0) measured at the timing when the reference attraction heights Ht1(0) to Ht6(0) were measured, and the latest reference vehicle heights Hc1(N), Hc2(N), to calculate corrected reference attraction heights Ht1(N) to Ht6(N), and updates the reference attraction height data 31d (ST4: temporal correction step) (FIG. 9(b)).

[0085] Next, the mounting processing unit 37 controls the board transport mechanism 3 to carry in and hold the board B, the target for component mounting, at the mounting position (ST5: board carrying-in step). If it is not time for time-dependent correction (No in ST2), the carriage height measurement step (ST3) and time-dependent correction step (ST4) are skipped, and the board carrying-in step (ST5) is executed. Next, the mounting processing unit 37 executes the component suction step (ST6).

[0086] 14, in the component suction step (ST6), a component D is sucked onto each of the multiple nozzles 29 of the head 9. First, the first nozzle 29 starts suction of the component D supplied to the component pick-up position 5a of the tape feeder 5, and the first nozzle 29 starts descending toward the component D supplied to the component pick-up position 5a (ST21, first ST22).

[0087] Next, suction height measurement unit 52 measures suction heights Hp1 and Hp2 when first nozzle 29 picks up component D supplied to component pick-up position 5a, and stores the measured suction height data 31e (ST23: suction height measurement step) (FIGS. 10 and 11). When first nozzle 29 picks up component D, first nozzle 29 rises to a predetermined height, and the component suction operation ends (ST24).

[0088] In FIG. 14, the component suction operation for the component D supplied to the component removal position 5a of the tape feeder 5 is then performed in order from the second nozzle 29 to the Nth nozzle 29 (No in ST25, ST26) (ST22 to ST24 for the second to Nth times), and the suction height measurement process (ST23 for the second to Nth times) is performed during the component suction operation.

[0089] When all nozzles 29 have finished picking up components D and measuring pick-up heights Hp1, Hp2 (Yes in ST25), the pick-up abnormality detection unit 36 ​​determines whether the difference between the measured pick-up heights Hp1, Hp2 and the reference pick-up heights Ht1(N) to Ht6(N) is equal to or greater than the threshold value ΔHt, and if the difference is equal to or greater than the threshold value ΔHt, determines that there is an abnormality in the component take-out position 5a (ST27: pick-up abnormality detection step) (FIGS. 10 and 11).The pick-up abnormality detection unit 36 ​​then stores information identifying the nozzles 29 with pick-up abnormalities, such as mounting units 20(#1) to (#4), as pick-up abnormality data 31f (ST28: pick-up abnormality storage step).

[0090] The suction heights Hp1 and Hp2 measured in the suction height measuring step (ST23) may be transmitted to the main body control unit 30 after each measurement and stored in the main body storage unit 31, or may be temporarily stored in a control storage unit provided in the servo control unit 40 (not shown) and, after measurements for all the nozzles 29 have been completed, transmitted to the main body control unit 30 and stored in the main body storage unit 31. Also, the suction abnormality detecting step (ST27) and the suction abnormality storing step (ST28) may be completed before the start of the component imaging step (ST7) described below, or may be executed in parallel with the component imaging step (ST7). That is, the suction abnormality detecting step (ST27) and the suction abnormality storing step (ST28) may be completed before the movement path is determined after the component imaging step (ST7).

[0091] 13, the mounting processing unit 37 then moves the head 9 holding the component D to the component recognition camera 11, and causes the component recognition camera 11 to capture an image of the component D held by the nozzle 29 (ST7: component imaging step) (arrows f1 and f2 in FIG. 12(a) and arrows g1 and g2 in FIG. 12(b)). Next, if there is no suction abnormality based on the suction abnormality data 31f (No in ST8), the mounting processing unit 37 moves the head 9 directly above the board B (ST9) (arrow f3 in FIG. 12(a)), and mounts the component D held by the nozzle 29 at the mounting position (ST10: component mounting step).

[0092] If there is a suction abnormality (Yes in ST8), the mounting processing unit 37 moves the head 9 above the discharge box 14 (ST12) (arrow g3 in FIG. 12(b)). Next, the mounting processing unit 37 performs a disposal operation on the nozzle 29 determined to have a suction abnormality (ST13: disposal step). Next, the mounting processing unit 37 moves the head 9 above the board B (ST14) (arrow g4 in FIG. 12(b)), and executes the component mounting step (ST10).

[0093] 13, if not all components D have been mounted on board B (No in ST11), the component pickup step (ST6) through component mounting step (ST10) of the next mounting turn are executed. If all components D have been mounted on board B (Yes in ST11), mounting processing unit 37 controls board transport mechanism 3 to unload board B, on which component mounting has been completed, from component mounting apparatus 1 (ST15: board unloading step).

[0094] If component mounting work has not been completed for all boards B (No in ST16), the process returns to (ST2), and if it is time for time-dependent correction (Yes in ST2), the carriage height measurement process (ST3) and time-dependent correction process (ST4) are followed by the board carry-in process (ST5), and component mounting work is performed for the next board B (ST6 to ST15). If it is not time for time-dependent correction (No in ST2), the carriage height measurement process (ST3) and time-dependent correction process (ST4) are skipped, the board carry-in process (ST5) is performed, and component mounting work is performed for the next board B (ST6 to ST15).

[0095] In this way, when it is time for time-dependent correction (Yes in ST2), the heights (reference cart heights Hc1(N), Hc2(N)) of predetermined locations (reference posts 15) of the cart 6 are measured again in the cart height measurement step (ST3), and the reference suction heights Ht1(N) to Ht6(N) are updated based on the heights of the predetermined locations measured again in the time-dependent correction step (ST4). As a result, by remeasuring only the reference cart heights Hc1 and Hc2 of the cart 6 without remeasuring the reference suction heights Ht1 to Ht6 of the tape feeder 5 (component supply device) at each time of time-dependent correction, the reference suction heights Ht1 to Ht6 of the component D supplied to the component pick-up position 5a can be appropriately corrected over time.

[0096] As described above, the present disclosure discloses the following technical ideas.

[0097] (Technology 1) A component mounting apparatus (1) is set on a carriage (6) on which a component supplying device (tape feeder (5)) is mounted, the component supplying device having a carrier tape (16) on which a plurality of components (D) are attached, the component supplying device sequentially supplies the plurality of components (D) to a component pick-up position (5a), the components (D) supplied to the component pick-up position (5a) are sucked by a nozzle (29) attached to a head (9), and the components (D) are mounted on a board (B), a carriage height measuring unit 50 that measures the height (reference carriage heights Hc1, Hc2) of a predetermined location (reference post 15) of the carriage 6; a reference suction height measuring unit 51 that measures the height of the carrier tape 16 or the component D stored on the carrier tape 16 to measure the reference suction heights Ht1 to Ht6 of the component D supplied to the component take-out position 5a; a time-dependent correction unit 35 that corrects the reference adsorption heights Ht1 to Ht6 over time; Equipped with The carriage height measuring unit 50 measures the height of the carriage 6 at a predetermined location again, The component mounting device 1, in which the time-dependent correction unit 35 updates the reference suction heights Ht1 to Ht6 based on the heights of the predetermined locations that have been measured again.

[0098] As a result, the component mounting device 1 can appropriately correct the reference suction heights Ht1 to Ht6 of the component D supplied to the component removal position 5a over time by remeasuring only the reference cart heights Hc1, Hc2 of the cart 6 without remeasuring the reference suction heights Ht1 to Ht6 of the tape feeder 5 (component supply device) at each time of time correction.

[0099] (Technology 2) The component mounting device 1 described in technology 1, wherein the carriage height measuring unit 50 measures the height (reference carriage heights Hc1, Hc2) of a predetermined location (reference post 15) of the carriage 6 based on the height (nozzle height H) of the nozzle 29 attached to the head 9.

[0100] This allows the component mounter 1 to reduce measurement errors between the reference carriage heights Hc1, Hc2 and the reference suction heights Ht1 to Ht6.

[0101] (Technology 3) The component mounting device 1 according to the first or second technique, wherein the head 9 picks up the component D supplied to the component take-out position 5a based on the reference pickup heights Ht1 to Ht6.

[0102] As a result, even if the head moving mechanism 10 is deformed over time, the component mounting apparatus 1 can properly pick up the component D supplied to the component take-out position 5a by the nozzle 29.

[0103] (Technology 4) The carriage height measurement unit 50 measures the height (reference carriage heights Hc1, Hc2) of a predetermined location (reference post 15) based on the thrust Ft of the motor (Z-axis motor 22) that lowers the nozzle 29, The component mounting device 1 according to any one of the first to third techniques, wherein the reference suction height measuring unit 51 measures the reference suction heights Ht1 to Ht6 based on the thrust Ft of the motor (Z-axis motor 22) that lowers the nozzle 29.

[0104] This allows the component mounting apparatus 1 to measure the reference carriage heights Hc1, Hc2 and the reference suction heights Ht1 to Ht6 without additionally installing height sensors such as laser displacement sensors, load sensors, or the like.

[0105] (Technology 5) A component mounting method in which a plurality of components D stored on a carrier tape 16 are sequentially supplied to respective component pick-up positions 5a by a plurality of component supply devices (tape feeders 5) mounted on a carriage 6, and the components D supplied to the component pick-up positions 5a are sucked by nozzles 29 attached to a head 9 and mounted on a board B, a reference suction height measurement step (ST1) of measuring the height of the carrier tape 16 or the component D stored on the carrier tape 16 to measure the reference suction heights Ht1 to Ht6 of the component D supplied to the component take-out position 5a; a carriage height measurement step (ST3) for measuring the height (reference carriage heights Hc1, Hc2) of a predetermined location (reference post 15) of the carriage 6; a time-dependent correction step (ST4) of correcting the reference adsorption heights Ht1 to Ht6 over time; Including, In the carriage height measurement process (ST3), the height of the carriage 6 at a predetermined location is measured again, In the component mounting method, in the time-dependent correction step (ST4), the reference pickup heights Ht1 to Ht6 are updated based on the heights of the predetermined locations measured again.

[0106] As a result, according to the component mounting method, the component mounting device 1 can appropriately correct the reference suction heights Ht1 to Ht6 of the component D supplied to the component removal position 5a over time by remeasuring only the reference cart heights Hc1, Hc2 of the cart 6 without remeasuring the reference suction heights Ht1 to Ht6 of the tape feeder 5 (component supply device) at each timing of time-dependent correction. [Industrial Applicability]

[0107] The component mounting device and component mounting method disclosed herein have the effect of being able to appropriately correct the reference suction height of a component supplied to a component removal position over time, and are useful in fields where components are mounted on boards. [Explanation of symbols]

[0108] 1. Component mounting equipment 5 Tape feeder (component supply device) 5a Parts removal position 6 carts 9 heads 15 Reference post (specified location) 16 Carrier tape 22 Z-axis motor (motor) 29 nozzles 50 Carriage height measurement unit 51 Reference suction height measurement unit B board D, D1, D2 parts Ft Thrust H Nozzle height (nozzle height) Hc1, Hc2 Standard carriage height Ht1~Ht6 Standard adsorption height

Claims

1. A component mounting apparatus in which a carriage is set on which a component supply device having attached thereto a carrier tape containing a plurality of components is mounted, the plurality of components are sequentially supplied to a component pick-up position by the component supply device, the components supplied to the component pick-up position are sucked by a nozzle attached to a head, and mounted on a board, a carriage height measuring unit that measures the height of a predetermined location of the carriage; a reference suction height measuring unit that measures a reference suction height of a component supplied to the component pick-up position by measuring a height of the carrier tape or a component stored on the carrier tape; a time-dependent correction unit that corrects the reference adsorption height over time; Equipped with the carriage height measuring unit measures the height of the predetermined location of the carriage again, The component mounting device, wherein the time-dependent correction unit updates the reference suction height based on the height of the predetermined location that is measured again.

2. The component mounting device according to claim 1 , wherein the carriage height measuring unit measures the height of the predetermined location of the carriage based on the height of a nozzle attached to the head.

3. 2. The component mounting device according to claim 1, wherein the head picks up the component supplied to the component pick-up position based on the reference suction height.

4. the carriage height measuring unit measures the height of the predetermined location based on a thrust of a motor that lowers the nozzle; The component mounting device according to claim 1 , wherein the reference suction height measuring unit measures the reference suction height based on a thrust force of a motor that lowers the nozzle.

5. A component mounting method comprising: supplying a plurality of components stored on a carrier tape to respective component pick-up positions by a plurality of component supply devices mounted on a carriage; suctioning the components supplied to the component pick-up positions by nozzles attached to a head; and mounting the components on a board; a reference suction height measuring step of measuring a reference suction height of the component supplied to the component pick-up position by measuring a height of the carrier tape or a component accommodated on the carrier tape; a carriage height measuring step of measuring the height of a predetermined location of the carriage; a time-dependent correction step of correcting the reference adsorption height over time; Including, In the carriage height measuring step, the height of the predetermined location of the carriage is measured again; In the time-dependent correction step, the reference suction height is updated based on the height of the predetermined location that is measured again.

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