Imaging apparatus and processing apparatus

Abstract

To provide an imaging apparatus of a new structure capable of adjusting the focus of a camera without bringing the camera close to or away from an object to be imaged.SOLUTION: The imaging device includes a camera, a reflection member that reflects light from the object toward the camera, and a first movement mechanism configured to change a distance between the camera and the reflection member without changing a distance between the object and the reflection member by relatively moving the camera and the reflection member.SELECTED DRAWING: Figure 4

Description

[Technical Field]

[0001] The present invention relates to an imaging device and a processing device. [Background technology]

[0002] Device chips equipped with devices such as electronic circuits are essential components of electronic devices such as mobile phones and personal computers. Device chips are obtained, for example, by dividing the front surface of a wafer made of silicon or the like into multiple small regions along linear processing lines (streets), forming devices in each small region, and then dividing the wafer along these processing lines.

[0003] When dividing the above-mentioned wafer into a plurality of device chips, for example, a cutting device having a processing tool called a cutting blade attached to a spindle is used (see, for example, Patent Document 1). The cutting blade is rotated at high speed and cuts into the wafer on the planned processing line while supplying a liquid such as water, thereby cutting the wafer on the planned processing line and dividing it into a plurality of device chips.

[0004] In recent years, a processing device has been proposed that includes a transparent table and a camera positioned below the table so that the positions of devices and processing lines can be confirmed with the front surface of the wafer facing downwards (see, for example, Patent Document 2). With this processing device, the positions of devices and processing lines can be reliably detected and the wafer can be processed even with the front surface of the wafer facing downwards. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Japanese Patent Application Laid-Open No. 2003-234308 [Patent Document 2] Japanese Patent Application Laid-Open No. 2010-87141 Summary of the Invention [Problem to be solved by the invention]

[0006] In the above-mentioned processing equipment, since the focus is adjusted by a movement mechanism that moves the camera toward or away from the object to be imaged, such as a wafer, it is necessary to provide a space of sufficient height below the table. In this case, the entire camera must be moved against gravity, so a fairly large movement mechanism must be adopted.

[0007] SUMMARY OF THE INVENTION It is therefore an object of the present invention to provide an imaging device or the like having a new structure that allows the camera focus to be adjusted without moving the camera closer to or further away from the object being imaged. [Means for solving the problem]

[0008] According to one aspect of the present invention, there is provided an imaging device for imaging an object, the imaging device including a camera, a reflecting member that reflects light from the object toward the camera, and a first moving mechanism configured to change the distance between the camera and the reflecting member without changing the distance between the object and the reflecting member by moving the camera and the reflecting member relative to each other.

[0009] Preferably, the camera further includes a second movement mechanism configured to change the positions of the reflecting member and the camera relative to the object without changing the distance between the object and the reflecting member, and the first movement mechanism is configured to change the distance between the camera and the reflecting member without changing the position of the reflecting member relative to the object. Preferably, the reflecting member is a prism or a mirror.

[0010] According to another aspect of the present invention, there is provided a processing device for processing a workpiece, comprising: a holding table having a holding plate, at least a portion of which is light-transmitting, and configured to hold the workpiece on a first surface side of the holding plate; a processing unit configured to process the workpiece held by the holding table; and an imaging mechanism configured to image the workpiece held by the holding table from a second surface side opposite the first surface of the holding plate, wherein the imaging mechanism has a camera, a reflective member that reflects light from the workpiece held by the holding table toward the camera, and a first moving mechanism configured to change the distance between the camera and the reflective member without changing the distance between the workpiece held by the holding table and the reflective member by moving the camera and the reflective member relative to each other.

[0011] Preferably, the system further includes a second moving mechanism configured to move the holding table, and the first moving mechanism is configured to change the distance between the camera and the reflecting member without changing the position of the reflecting member relative to the workpiece held by the holding table.

[0012] Preferably, the processing unit has a spindle to which a processing tool that is brought into contact with the workpiece is attached, or a condenser that condenses the laser beam on the workpiece. Preferably, the reflecting member is a prism or a mirror. [Effects of the Invention]

[0013] An imaging device according to one aspect of the present invention includes a camera, a reflecting member that reflects light from an object toward the camera, and a first moving mechanism that can change the distance between the camera and the reflecting member without changing the distance between the object and the reflecting member, so that the focus of the camera can be adjusted without moving the camera closer to or farther away from the object. Similarly, a processing device according to another aspect of the present invention can adjust the focus of the camera without moving the camera closer to or farther away from the workpiece. [Brief explanation of the drawings]

[0014] [Figure 1] FIG. 1 is a perspective view schematically showing the structure of a cutting device. [Figure 2] FIG. 2 is a perspective view schematically showing the structure of the workpiece. [Figure 3] FIG. 3 is a perspective view schematically showing a part of the cutting device. [Figure 4] FIG. 4 is a cross-sectional view schematically showing a part of the cutting device. [Figure 5] FIG. 5 is a cross-sectional view that schematically shows the state of each part when the workpiece is imaged from below by the imaging mechanism. [Figure 6] FIG. 6 is a cross-sectional view schematically showing another state of each part when the workpiece is imaged from below by the imaging mechanism. DETAILED DESCRIPTION OF THE INVENTION

[0015] Hereinafter, an embodiment of the present invention will be described with reference to the accompanying drawings. Fig. 1 is a perspective view showing a schematic structure of a cutting device (processing device) 2 incorporating an imaging mechanism (imaging device) of this embodiment. Note that in Fig. 1, some elements are expressed as functional blocks. Furthermore, the X-axis (front-rear axis), Y-axis (left-right axis), and Z-axis (vertical axis) used in the following description are perpendicular to one another.

[0016] As shown in Fig. 1, the cutting device 2 includes a base 4 that supports various elements. An opening 4a is formed in a corner of the top surface of the base 4, and a cassette table 6 that is raised and lowered by an elevating mechanism (not shown) is disposed within this opening 4a. A cassette 8 that can accommodate a plate-shaped workpiece (object to be imaged) 11 is placed on the top surface of the cassette table 6. For ease of explanation, only the outline of the cassette 8 is shown in Fig. 1.

[0017] 2 is a perspective view schematically showing the structure of workpiece 11. Workpiece 11 is typically a disk-shaped wafer made of a semiconductor such as silicon (Si), and has a circular first surface (front surface) 11a and a circular second surface (back surface) 11b opposite to first surface 11a. The first surface 11a side of workpiece 11 is partitioned into a plurality of small regions by a plurality of linear processing lines (streets) 13 that intersect with each other, and a device 15 such as an IC (Integrated Circuit) is formed in each small region.

[0018] In this embodiment, a disk-shaped wafer made of a semiconductor such as silicon is exemplified as the workpiece 11, but the material, shape, structure, size, etc. of the workpiece 11 are not limited to this embodiment. For example, a substrate made of other semiconductors, ceramics, resin, metal, etc. may be used as the workpiece 11. Similarly, the type, number, shape, structure, size, arrangement, etc. of the devices 15 are not limited to the above embodiment. The devices 15 may not be formed on the workpiece 11.

[0019] Furthermore, a supporting (or protective) member such as tape may be attached to the first surface 11a or the second surface 11b of the workpiece 11. For example, when a supporting member having a diameter larger than that of the workpiece 11 is attached to the workpiece 11, an annular frame may be fixed to the outer edge of the supporting member.

[0020] An opening 4b that is long in the direction along the X-axis is formed at a position adjacent to the cassette table 6 along the Y-axis. Fig. 3 is a perspective view that schematically shows part of the structure inside the opening 4b of the cutting device 2, and Fig. 4 is a cross-sectional view that schematically shows part of the structure inside the opening 4b of the cutting device 2.

[0021] 3 and 4, a ball screw type table movement mechanism (processing feed mechanism, second movement mechanism) 10 is disposed within opening 4b. Table movement mechanism 10 has a pair of long X-axis guide rails 12 that are fixed to, for example, a frame or the like that constitutes base 4 and extend along the X-axis. An X-axis movement unit 14 that constitutes table movement mechanism 10 is attached to X-axis guide rails 12 in a manner that allows it to slide along the X-axis.

[0022] The X-axis moving unit 14 includes a flat bottom plate 14a that is rectangular when viewed along the Z-axis. One end of the bottom plate 14a along the Y-axis is connected to the lower end of a flat side plate 14b that is rectangular when viewed along the Y-axis. One end of the side plate 14b along the Y-axis is connected to the upper end of the side plate 14b. The flat top plate 14c that is rectangular when viewed along the Z-axis, similar to the bottom plate 14a, is connected to the upper end of the side plate 14b.

[0023] That is, one end of bottom plate 14a along the Y axis and one end of top plate 14c along the Y axis are connected to each other via side plate 14b. A space 14d is formed between bottom plate 14a and top plate 14c, and is connected to the outside at the other end along the Y axis and at both end portions along the X axis.

[0024] A nut portion 14e (FIG. 4) constituting a ball screw is provided on the underside of the bottom plate 14a of the X-axis moving portion 14. A long screw shaft 16 extending along the X-axis is connected to this nut portion 14e in a rotatable manner via a plurality of small balls. A rotational drive source 18 such as a motor is connected to the end of the screw shaft 16.

[0025] Therefore, when the screw shaft 16 is rotated by the rotary drive source 18, the X-axis moving unit 14 moves along the longitudinal direction of the X-axis guide rail 12, that is, along the X-axis. For example, a position sensor (not shown) is provided near the X-axis guide rail 12, and this position sensor detects the position of the X-axis moving unit 14 in the direction along the X-axis.

[0026] A table (holding table, chuck table) 20 configured to be able to hold the above-mentioned workpiece 11 is disposed on the upper surface side of the top plate 14c of the X-axis moving unit 14. The table 20 is supported by the top plate 14c in a manner that allows it to rotate around a rotation axis that is roughly parallel to the Z-axis. In other words, the table 20 is supported by the X-axis moving unit 14.

[0027] Table 20 includes a cylindrical frame 22 made of a metal such as stainless steel. The lower end of space 22a provided inside frame 22 is connected to opening 14f that penetrates top plate 14c from top to bottom. A disk-shaped holding plate 24 is fixed to the top of frame 22 so as to close the upper end of space 22a.

[0028] The holding plate 24 has a first surface (upper surface) 24a facing upward and a second surface (lower surface) 24b facing in the opposite direction (downward) from the first surface 24a, and is made of a material that transmits visible light, such as soda glass, borosilicate glass, quartz glass, etc. At least a portion of the holding plate 24 is transparent from the first surface 24a to the second surface 24b.

[0029] Therefore, the workpiece 11 and the like held on the first surface 24a side of the holding plate 24 can be observed from below the top plate 14c. Note that, although the present embodiment illustrates an example of an entirely transparent holding plate 24, it is sufficient that at least a portion of the holding plate 24 is transparent from the first surface 24a to the second surface 24b. In other words, the holding plate 24 does not necessarily have to be made of only a transparent material.

[0030] A flow path (not shown) for transmitting negative pressure used to suck the workpiece 11 is provided inside the frame 22. An opening (not shown) corresponding to one end of this flow path is formed on the upper end surface of the frame 22. A suction source (not shown) for generating negative pressure is connected to the other end of the flow path. The suction source may be, for example, a vacuum pump that combines an air supply source and an ejector.

[0031] 3, a pulley 26 having a diameter larger than that of the frame 22 is fixed to the outer circumferential surface of the frame 22. A rotary drive source 28 such as a motor is provided on the side plate 14b of the X-axis moving section 14, and a pulley 30 is connected to the rotation shaft of the rotary drive source 28. An endless belt 32 for transmitting the power of the rotary drive source 28 to the table 20 is wound around the pulley 26 and the pulley 30.

[0032] Therefore, the table 20 rotates about a rotation axis that is roughly parallel to the Z axis due to the force transmitted from the rotary drive source 28 via the belt 32. The table 20 is moved along the X axis together with the X-axis moving unit 14 and the like by the above-mentioned table moving mechanism 10 (processing feed). The above-mentioned table moving mechanism 10, table 20, and the like are also part of the imaging mechanism (imaging device) according to this embodiment.

[0033] 1, the top of the table moving mechanism 10 is covered by covers 34a, 34b, 34c, 34d, and the like, which are arranged to close the opening 4b. For example, flat covers 34a and 34b are attached to both ends of the table top 14c in the direction along the Y axis. Also, accordion-shaped covers 34c and 34d, which expand and contract in response to movement of the X-axis moving unit 14 along the X axis, are attached to both ends of the table top 14c in the direction along the X axis.

[0034] Above the opening 4b, one or more transport mechanisms (not shown) are arranged that can transport the above-mentioned workpiece 11 to the table 20 or the like. The transport mechanism, for example, carries the workpiece 11 out of the cassette 8 and carries the workpiece 11 into the table 20 positioned in a front carry-in / out area close to the cassette 8 (cassette table 6). The workpiece 11 is placed on the first surface 24a of the table 20, for example, with the first surface 11a facing downward (with the second surface 11b facing upward).

[0035] A cantilevered support structure 36 is disposed at a position adjacent to the opening 4b along the Y axis. A cutting unit movement mechanism (indexing feed mechanism, cutting feed mechanism) 38 is disposed above the support structure 36. This cutting unit movement mechanism 38 has a pair of Y-axis guide rails 40 that are fixed to the front surface of the support structure 36 and extend along the Y axis.

[0036] A Y-axis moving plate 42, which constitutes the cutting unit moving mechanism 38, is attached to the Y-axis guide rail 40 in a manner that allows it to slide along the Y-axis. A nut portion (not shown) that constitutes a ball screw is provided on the back side of the Y-axis moving plate 42, and a long screw shaft 44 that is rotatable along the Y-axis is connected to this nut portion via multiple small balls.

[0037] A rotary drive source (not shown), such as a motor, is connected to the end of the screw shaft 44. Therefore, when the rotary drive source rotates the screw shaft 44, the Y-axis moving plate 42 moves along the longitudinal direction of the Y-axis guide rail 40, i.e., along the Y-axis. A pair of Z-axis guide rails 46 that are long along the Z-axis are fixed to the front of the Y-axis moving plate 42. A Z-axis moving plate 48 is attached to the pair of Z-axis guide rails 46 in a manner that allows it to slide along the Z-axis.

[0038] A nut portion (not shown) constituting a ball screw is provided on the back side of Z-axis moving plate 48, and a long screw shaft 50 extending along the Z axis is rotatably connected to this nut portion via a plurality of small balls. A rotational drive source 52 such as a motor is connected to the end of screw shaft 50. Therefore, when screw shaft 50 is rotated by rotational drive source 52, Z-axis moving plate 48 moves along the longitudinal direction of Z-axis guide rail 46, i.e., along the Z axis.

[0039] A cutting unit (processing unit) 54 is fixed to the lower part of the Z-axis moving plate 48. The cutting unit 54 includes a cylindrical spindle housing 56. The internal space of the spindle housing 56 accommodates a portion of a cylindrical spindle (not shown) that serves as a rotation axis along the Y-axis.

[0040] The tip of the spindle is exposed to the outside of the spindle housing 56. Attached to the tip of this spindle is an annular cutting blade (machining tool) 58, which is obtained by, for example, solidifying abrasive grains such as diamond with a binder such as resin. A rotational drive source (not shown), such as a motor, is connected to the base end of the spindle. Therefore, when the spindle is rotated by the rotational drive source, the cutting blade 58 rotates around a rotation axis along the Y-axis.

[0041] An upper imaging unit (upper camera) 60 configured to be able to capture images from above of the workpiece 11 etc. supported by the table 20 is fixed to the lower part of the Z-axis moving plate 48. The cutting unit 54 and the upper imaging unit 60 are moved along the Y-axis and Z-axis by the cutting unit moving mechanism 38.

[0042] The upper imaging unit 60 includes an imaging element (two-dimensional optical sensor) such as a CMOS (Complementary Metal Oxide Semiconductor) image sensor or a CCD (Charge Coupled Device) image sensor, and an imaging lens, and is disposed in a direction that allows the imaging element to receive light incident along the Z axis. However, the type, structure, arrangement, etc. of the upper imaging unit 60 are not limited to this.

[0043] 3 and 4, a Y-axis moving mechanism (third moving mechanism) 64 constituting an imaging mechanism (imaging device) 62 for capturing images of workpiece 11, etc. from below is disposed in the area behind table moving mechanism 10. Y-axis moving mechanism 64 has a pair of Y-axis guide rails 66 that are fixed to, for example, a frame constituting base 4 and are long along the Y-axis. A Y-axis moving plate 68 constituting Y-axis moving mechanism 64 is attached to Y-axis guide rails 66 in a manner that allows it to slide along the Y-axis.

[0044] A nut portion 70 constituting a ball screw is provided on the underside of the Y-axis moving plate 68, and a long screw shaft 72 extending along the Y-axis is rotatably connected to this nut portion 70 via a plurality of small balls. A rotational drive source 74 such as a motor is connected to the end of the screw shaft 72. Therefore, when the screw shaft 72 is rotated by the rotational drive source 74, the Y-axis moving plate 68 moves along the longitudinal direction of the Y-axis guide rail 66, i.e., along the Y-axis.

[0045] A long support 76 is fixed along the X axis to the upper surface of the Y-axis moving plate 68. For example, a part of a lower imaging unit 78 is fixed to this support 76. The lower imaging unit 78 includes, for example, a lower camera moving mechanism (first moving mechanism) 80 fixed to the Y-axis moving plate 68 (and the support 76). The lower camera moving mechanism 80 is, for example, an actuator including a rotational drive source such as a motor, and is able to move its movable part 80a along the X axis.

[0046] A lower camera 82 is fixed to a movable part 80a of the lower camera moving mechanism 80, and this lower camera 82 is moved along the X-axis by the lower camera moving mechanism 80. The lower camera 82 includes an imaging element (two-dimensional optical sensor) such as a CMOS (Complementary Metal Oxide Semiconductor) image sensor or a CCD (Charge Coupled Device) image sensor, and an imaging lens, and is positioned in a direction that allows the imaging element to receive light incident along the X-axis. However, the type, structure, position, etc. of the lower camera 82 are not limited to this.

[0047] A reflector 84 is fixed to a part of the support 76 so as to be aligned with the lower camera 82 along the X-axis. The reflector 84 includes a hollow reflector housing 84a. An opening 84b that allows light to pass through is provided at the top of the reflector housing 84a. Note that a member made of a light-transmitting material may be fitted into this opening 84b.

[0048] Also, directly below the opening 84b, for example, a reflecting member 84c is disposed, which reflects light that has passed through the opening 84b. The reflecting member 84c is, for example, a prism or a mirror, and reflects light that has entered downward along the Z axis in a direction toward the lower camera 82 along the X axis.

[0049] The side of the reflecting unit housing 84a near the lower camera 82 is opened to allow light to pass through. Therefore, for example, when the workpiece 11 is placed directly above the reflecting unit 84, light is reflected from the first surface 11a of the workpiece 11, passes through the opening 84b, and enters the reflecting member 84c.

[0050] In this way, the reflecting member 84c is configured to be able to reflect light from the workpiece 11 toward the lower camera 82, and the lower camera 82 can capture an image of the workpiece 11. As described above, in this embodiment, the reflecting member 84 is fixed to the support 76, and therefore the focus is adjusted by moving the lower camera 82 along the X-axis using the lower camera moving mechanism 80. For example, a light source (not shown) that can emit light upward (toward the workpiece 11) is disposed near the reflecting member 84.

[0051] An opening 4c is formed at a position opposite to opening 4a with respect to opening 4b. A cleaning unit 86 for cleaning the workpiece 11 and the like after processing is disposed within opening 4c. A controller (control unit) 88 is connected to elements such as the table moving mechanism 10, the transport mechanism, the cutting unit moving mechanism 38, the cutting unit 54, the upper imaging unit 60, the Y-axis moving mechanism 64, the lower imaging unit 78, and the cleaning unit 86.

[0052] The controller 88 is configured by, for example, a computer including a processing device 90 and a storage device 92, and controls the operation of each element of the above-mentioned cutting device 2 so as to properly process the workpiece 11. The processing device 90 is typically a CPU (Central Processing Unit) and performs various arithmetic processing required to control the above-mentioned elements.

[0053] The storage device 92 includes, for example, a main storage device such as a DRAM (Dynamic Random Access Memory) and an auxiliary storage device such as a hard disk drive, a flash memory, etc. The functions of the controller 88 are realized, for example, by the processing device 90 operating in accordance with software (programs, etc.) stored in the storage device 92.

[0054] A touch screen (input / output device, input device, output device) 94 serving as a user interface is connected to the controller 88. The touch screen 94, for example, inputs commands from an operator into the controller 88. The touch screen 94 also displays information related to the cutting device 2 based on commands from the controller 88.

[0055] Although the present embodiment shows a touch screen 94 having both input and output functions, an input device having an input function and an output device having an output function may each be connected to the controller 88. Examples of input devices that can be used include a keyboard and a mouse. Examples of output devices that can be used include a display device such as a liquid crystal display, a speaker that can communicate information by sound, and an indicator light that can communicate information by the color of light or the state of light emission (on, blinking, off, etc.).

[0056] Fig. 5 is a cross-sectional view schematically showing the state of each part when the workpiece 11 is imaged from below by the imaging mechanism 62, and Fig. 6 is a cross-sectional view schematically showing a state different from that shown in Fig. 5. As shown in Fig. 5, when the workpiece 11 is imaged from below by the imaging mechanism 62, first, the reflecting part 84 of the lower imaging unit 78 is positioned directly below the region of the workpiece 11 to be imaged.

[0057] Specifically, the position along the X-axis of table 20 holding workpiece 11 is adjusted by table moving mechanism 10, and the position along the Y-axis of lower imaging unit 78 including reflecting portion 84 is adjusted by Y-axis moving mechanism 64. Note that the optical path of light incident on lower camera 82 is represented by, for example, optical path 21a of light reflected at the imaged region of workpiece 11, passing through opening 84b, and incident on reflecting member 84c, and optical path 21b of light reflected by reflecting member 84c and incident on lower camera 82.

[0058] 5, when the focus of the lower camera 82 is on the imaged region of the workpiece 11, the lower camera 82 captures the image of the workpiece 11 as is and generates an image showing the first surface 11a side (lower surface side) of the workpiece 11. The generated image is stored in the controller 88, for example.

[0059] 5, if the focus of the lower camera 82 is not aligned with the imaged region of the workpiece 11, the focus is adjusted. Specifically, the lower camera moving mechanism 80 moves the lower camera 82 along the X axis, that is, moves the lower camera 82 and the reflecting member 84c relatively to each other, thereby changing the distance between the lower camera 82 and the reflecting member 84c.

[0060] Because the reflecting member 84c does not move, there is no change in the distance between the workpiece 11 and the reflecting member 84c, and in the position of the reflecting member 84c relative to the workpiece 11. In other words, the optical path 21a of the light that is reflected at the imaged region of the workpiece 11, passes through the opening 84b, and enters the reflecting member 84c is no different from the optical path 21a in the case of FIG.

[0061] On the other hand, the optical path 21c of the light reflected by the reflecting member 84c and incident on the lower camera 82 is longer (or shorter) than the optical path 21b in the case of Fig. 5. Therefore, the focus of the lower camera 82 can be adjusted by relatively moving the lower camera 82 and the reflecting member 84c by an appropriate distance. The focus of the lower camera 82 can be adjusted by autofocus using, for example, a contrast method or an image plane phase difference method.

[0062] Incidentally, both the table moving mechanism 10 and the Y-axis moving mechanism 64 can change the position of the lower imaging unit 78 (the reflecting member 84c and the lower camera 82) relative to the workpiece 11 without substantially changing the distance between the workpiece 11 and the reflecting member 84c. Therefore, the table moving mechanism 10 and the Y-axis moving mechanism 64 can easily change the imaged area of ​​the workpiece 11 while maintaining the state in which the focus of the lower camera 82 is on the first surface 11a side of the workpiece 11.

[0063] As described above, the imaging mechanism (imaging device) 62 of this embodiment includes a lower camera 82, a reflecting member 84c that reflects light from the workpiece (object to be imaged) 11 toward the lower camera 82, and a lower camera moving mechanism (first moving mechanism) 80 that can change the distance between the lower camera 82 and the reflecting member 84c without changing the distance between the workpiece 11 and the reflecting member 84c, so that the focus of the lower camera 82 can be adjusted without moving the lower camera 82 closer to or further away from the workpiece 11.

[0064] The present invention is not limited to the above-described embodiment and can be implemented in various modifications. For example, in the above-described embodiment, the cutting machine 2 incorporating the imaging mechanism (imaging device) 62 is illustrated, but the imaging mechanism (imaging device) according to the present invention may be incorporated into other processing machines. Specifically, for example, the imaging mechanism (imaging device) according to the present invention can be incorporated into a laser processing machine having a condenser that focuses a laser beam on a workpiece.

[0065] In addition, the structures, methods, etc. according to the above-described embodiments and modifications may be modified as appropriate without departing from the scope of the present invention. [Explanation of symbols]

[0066] 2: Cutting equipment (processing equipment) 4: Base 6: Cassette table 8: Cassette 10: Table movement mechanism (processing feed mechanism, second movement mechanism) 12: X-axis guide rail 14:X-axis moving part 14a: Bottom plate 14b: Side plate 14c: Top plate 14d: Space 14e: Nut part 14f: Opening 16: Screw shaft 18: Rotation drive source 20: Table (holding table, chuck table) 22:Frame body 22a: Space 24: Holding plate 24a: 1st surface (top surface) 24b: 2nd side (bottom side) 26: Pulley 28: Rotation drive source 30: Pulley 32: Belt 36:Support structure 38: Cutting unit movement mechanism (indexing feed mechanism, cutting feed mechanism) 54: Cutting unit (processing unit) 60: Upper imaging unit (upper camera) 62: Imaging mechanism (imaging device) 64:Y-axis movement mechanism (third movement mechanism) 66: Y-axis guide rail 68: Y-axis moving plate 70: Nut part 72: Screw shaft 74: Rotation drive source 76 :Support 78: Lower imaging unit 80: Lower camera movement mechanism (first movement mechanism) 80a: Moving part 82: Lower camera 84:Reflector 84a: Reflector housing 84b: Opening 84c: Reflective material 86: Cleaning unit 88: Controller (control unit) 90: Processing equipment 92: Storage device 94: Touch screen (input / output device, input device, output device) 11: Workpiece (object to be imaged) 11a: 1st side (front) 11b: 2nd side (back side) 13: Processing line (street) 15: Device 21a: Optical path 21b: Optical path 21c: Optical path

Claims

1. An imaging device for capturing an image of an object, A camera and a reflecting member that reflects light from the object toward the camera; and a first moving mechanism configured to change the distance between the camera and the reflecting member without changing the distance between the object and the reflecting member by moving the camera and the reflecting member relative to each other.

2. a second moving mechanism configured to change the positions of the reflecting member and the camera relative to the object without changing the distance between the object and the reflecting member; The imaging device according to claim 1 , wherein the first moving mechanism is configured to be able to change the distance between the camera and the reflecting member without changing the position of the reflecting member relative to the object.

3. 3. The imaging device according to claim 1, wherein the reflecting member is a prism or a mirror.

4. A processing device for processing a workpiece, a holding table having a holding plate at least a portion of which is light-transmitting and configured to be able to hold the workpiece on a first surface side of the holding plate; a processing unit configured to process the workpiece held by the holding table; an imaging mechanism configured to be able to image the workpiece held by the holding table from a second surface side of the holding plate opposite to the first surface, The imaging mechanism includes: A camera and a reflecting member that reflects light from the workpiece held by the holding table toward the camera; a first moving mechanism configured to change the distance between the camera and the reflecting member without changing the distance between the workpiece held by the holding table and the reflecting member by moving the camera and the reflecting member relative to each other.

5. a second moving mechanism configured to move the holding table; 5. The processing apparatus according to claim 4, wherein the first moving mechanism is configured to be able to change the distance between the camera and the reflecting member without changing the position of the reflecting member relative to the workpiece held by the holding table.

6. 6. The processing apparatus according to claim 4, wherein the processing unit has a spindle on which a processing tool to be brought into contact with the workpiece is attached, or a condenser that focuses a laser beam on the workpiece.

7. 6. The processing device according to claim 4, wherein the reflecting member is a prism or a mirror.

Images