Mounting table, bonding apparatus, and bonding system

Abstract

To provide a technique capable of improving accuracy of position measurement.SOLUTION: A mounting table according to one aspect of the present disclosure includes a surface plate and a frame. The first device is placed on the surface plate. The frame to which the second device is fixed is assembled on the surface plate. The frame includes a fixed column, a first movable column, and a second movable column. The fixed column is fixed to the surface plate. The first movable column and the second movable column are movably supported on the surface plate. The surface plate includes a first guide portion and a second guide portion. The first guide portion allows the first movable column to move along the first direction. The second guide portion allows the second movable column to move along the second direction.SELECTED DRAWING: Figure 7

Description

[Technical Field]

[0001] The present disclosure relates to a mounting table, a bonding apparatus, and a bonding system. [Background technology]

[0002] Conventionally, a bonding device has been disclosed that bonds an upper substrate held by an upper chuck to a lower substrate held by a lower chuck that is movable relative to the upper chuck in horizontal and vertical directions (see Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2016-039364 Summary of the Invention [Problem to be solved by the invention]

[0004] The present disclosure provides techniques that can improve the accuracy of position measurements. [Means for solving the problem]

[0005] A mounting table according to one embodiment of the present disclosure includes a base and a frame. A first device is placed on the base. A second device is fixed to the frame, which is assembled on the base. The frame has a fixed column and a first and second movable columns. The fixed column is fixed to the base. The first and second movable columns are movably supported on the base. The base has a first guide portion and a second guide portion. The first guide portion allows the first movable column to move along a first direction. The second guide portion allows the second movable column to move along a second direction. [Effects of the Invention]

[0006] According to the present disclosure, it is possible to improve the accuracy of position measurement. Note that the effects described herein are not necessarily limited to those described herein, and any of the effects described in the present disclosure may be employed. [Brief explanation of the drawings]

[0007] [Figure 1] FIG. 1 is a schematic diagram showing the configuration of a bonding system according to an embodiment. [Figure 2] FIG. 2 is a schematic diagram showing the state before the first substrate and the second substrate according to the embodiment are bonded together. [Figure 3] FIG. 3 is a plan view of the joining device according to the embodiment. [Figure 4] FIG. 4 is a side view of the joining device according to the embodiment. [Figure 5] FIG. 5 is a side view of the upper chuck and the lower chuck according to the embodiment. [Figure 6] FIG. 6 is a flowchart showing the procedure of the process executed by the joint system according to the embodiment. [Figure 7] FIG. 7 is a perspective view showing the configuration of the mounting table according to the embodiment. [Figure 8] FIG. 8 is a diagram for explaining a deformation state of the frame in the reference example. [Figure 9] FIG. 9 is a diagram for explaining a deformed state of the frame according to the embodiment. [Figure 10] FIG. 10 is a diagram for explaining the configuration of the first moving column according to the embodiment. [Figure 11] FIG. 11 is a perspective view showing the configuration of a mounting table according to the first modification of the embodiment. [Figure 12] FIG. 12 is a perspective view showing the configuration of a mounting table according to the second modification of the embodiment. [Figure 13] FIG. 13 is a perspective view showing the configuration of a mounting table according to the third modification of the embodiment. [Figure 14] FIG. 14 is a diagram illustrating the configuration of a first moving column according to the fourth modification of the embodiment. [Figure 15]FIG. 15 is a diagram illustrating the configuration of a first moving column according to the fifth modification of the embodiment. [Figure 16] FIG. 16 is a diagram illustrating the configuration of a first moving column according to the sixth modification of the embodiment. [Figure 17] FIG. 17 is a diagram illustrating the configuration of a first pressing mechanism according to the seventh modification of the embodiment. [Figure 18] FIG. 18 is a diagram illustrating the configuration of a first pressing mechanism according to the eighth modification of the embodiment. [Figure 19] FIG. 19 is a diagram illustrating the configuration of a first pressing mechanism according to the ninth modification of the embodiment. [Figure 20] FIG. 20 is a diagram illustrating the configuration of a first guide portion according to the tenth modification of the embodiment. [Figure 21] FIG. 21 is a side view of a joining device according to the eleventh modification of the embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0008] Hereinafter, embodiments of the mounting table, bonding device, and bonding system disclosed in the present application will be described in detail with reference to the accompanying drawings. Note that the present disclosure is not limited to the embodiments described below. It should be noted that the drawings are schematic, and the dimensional relationships and ratios of the elements may differ from the actual ones. Furthermore, the dimensional relationships and ratios may differ between the drawings.

[0009] In addition, in the following embodiments, expressions such as "orthogonal," "vertical," "right-angled," and "parallel" may be used, but these expressions do not necessarily mean "orthogonal," "vertical," "right-angled," or "parallel" in the strict sense. In other words, the above expressions allow for deviations due to, for example, manufacturing precision, installation precision, and the like.

[0010] In addition, in the drawings referred to below, for ease of understanding, an orthogonal coordinate system may be shown in which the X-axis, Y-axis, and Z-axis directions are defined as being perpendicular to each other, and the positive Z-axis direction is the vertically upward direction.

[0011] 2. Description of the Related Art A bonding apparatus has been disclosed that bonds an upper substrate held by an upper chuck to a lower substrate held by a lower chuck that is movable relative to the upper chuck in horizontal and vertical directions.

[0012] In this joining apparatus, the upper chuck and the lower chuck are placed on a mounting table that is configured, for example, with a surface plate and a frame. For example, the lower chuck is placed on the surface plate, and the upper chuck is fixed to the frame.

[0013] On the other hand, in the conventional technology, when the frame of the mounting table expands and contracts due to temperature changes, the geometric relationship is not maintained and the frame becomes distorted, which deteriorates the parallelism and squareness of the measuring device, which can reduce the measurement accuracy of the relative position between the upper and lower substrates. This can reduce the accuracy of bonding the upper and lower substrates together.

[0014] Therefore, there is a need for a technology that can overcome the above-mentioned problems and improve the accuracy of position measurement.

[0015] <Configuration of the joining system> First, the configuration of a bonding system 1 according to an embodiment will be described with reference to Fig. 1 and Fig. 2. Fig. 1 is a schematic diagram showing the configuration of a bonding system 1 according to an embodiment. Fig. 2 is a schematic diagram showing a state before bonding of a first substrate W1 and a second substrate W2 according to an embodiment.

[0016] The bonding system 1 shown in FIG. 1 forms a laminated substrate T by bonding a first substrate W1 and a second substrate W2. The first substrate W1 and the second substrate W2 are, for example, single-crystal silicon wafers, and have multiple electronic circuits formed on their surfaces. The first substrate W1 and the second substrate W2 have approximately the same diameter. Note that one of the first substrate W1 and the second substrate W2 may be a substrate on which no electronic circuits are formed, for example.

[0017] 2, of the surfaces of the first substrate W1, the surface that is bonded to the second substrate W2 will be referred to as the "bonding surface W1j," and the surface opposite the bonding surface W1j will be referred to as the "non-bonding surface W1n." Furthermore, of the surfaces of the second substrate W2, the surface that is bonded to the first substrate W1 will be referred to as the "bonding surface W2j," and the surface opposite the bonding surface W2j will be referred to as the "non-bonding surface W2n."

[0018] 1, the bonding system 1 includes a loading / unloading station 2 and a processing station 3. The loading / unloading station 2 is located on the positive Y-axis direction side of the processing station 3 and is integrally connected to the processing station 3.

[0019] The loading / unloading station 2 includes a mounting table 10 and a transfer area 20. The mounting table 10 includes a plurality of mounting plates 11. Each mounting plate 11 is placed with one of cassettes C1 to C4, each of which stores a plurality of substrates (for example, 25 substrates) in a horizontal position.

[0020] Cassette C1 can accommodate a plurality of first substrates W1. Cassette C2 can accommodate a plurality of second substrates W2. Cassette C3 can accommodate a plurality of superimposed substrates T. Cassette C4 is, for example, a cassette for recovering a substrate that has become defective. Note that the number of cassettes C1 to C4 placed on the placement plate 11 is not limited to that shown in the figure.

[0021] The transport area 20 is located adjacent to the negative side of the Y-axis of the mounting table 10. The transport area 20 is provided with a transport path 21 extending in the X-axis direction and a transport device 22 that is movable along the transport path 21. The transport device 22 is movable not only in the Y-axis direction but also in the X-axis direction and is rotatable around the Z-axis.

[0022] The transport device 22 transports the first substrate W1, the second substrate W2 and the overlapped substrate T between the cassettes C1 to C4 placed on the mounting plate 11 and the third processing block G3 of the processing station 3, which will be described later.

[0023] Processing station 3 is provided with, for example, three processing blocks G1, G2, and G3. The first processing block G1 is located on the rear side of processing station 3 (the positive X-axis side in FIG. 1). The second processing block G2 is located on the front side of processing station 3 (the negative X-axis side in FIG. 1). The third processing block G3 is located on the loading / unloading station 2 side of processing station 3 (the positive Y-axis side in FIG. 1).

[0024] The first processing block G1 is located with a surface modification device 30 that modifies the bonding surfaces W1j, W2j (see FIG. 2) of the first substrate W1 and the second substrate W2. The surface modification device 30 modifies the bonding surfaces W1j, W2j by breaking the SiO2 bonds on the bonding surfaces W1j, W2j of the first substrate W1 and the second substrate W2 to form single-bonded SiO, thereby making the bonding surfaces W1j, W2j more easily hydrophilic thereafter.

[0025] Specifically, in the surface modification device 30, for example, oxygen gas or nitrogen gas, which is a processing gas, is excited to plasma and ionized in a reduced pressure atmosphere. The oxygen ions or nitrogen ions are then irradiated onto the bonding surfaces W1j and W2j of the first substrate W1 and the second substrate W2, whereby the bonding surfaces W1j and W2j are subjected to plasma processing and modified.

[0026] The first processing block G1 also includes a surface hydrophilization device 40. The surface hydrophilization device 40 hydrophilizes the bonding surfaces W1j and W2j of the first substrate W1 and the second substrate W2 using, for example, pure water, and cleans the bonding surfaces W1j and W2j.

[0027] Specifically, the surface hydrophilization device 40 supplies pure water onto the first substrate W1 or the second substrate W2 while rotating the first substrate W1 or the second substrate W2 held by, for example, a spin chuck. As a result, the pure water supplied onto the first substrate W1 or the second substrate W2 spreads over the bonding surfaces W1j, W2j of the first substrate W1 or the second substrate W2, thereby making the bonding surfaces W1j, W2j hydrophilic.

[0028] In the example of Figure 1, the surface modification device 30 and the surface hydrophilization device 40 are arranged side by side, but the surface hydrophilization device 40 may be stacked above or below the surface modification device 30.

[0029] The second processing block G2 is located with a bonding device 41. The bonding device 41 bonds the hydrophilized first substrate W1 and second substrate W2 together by intermolecular forces. The specific configuration of the bonding device 41 will be described later.

[0030] A transfer region 60 is located in an area surrounded by the first processing block G1, the second processing block G2, and the third processing block G3. A transfer device 61 is located in the transfer region 60. The transfer device 61 has a transfer arm that is movable, for example, vertically, horizontally, and around a vertical axis.

[0031] The transport device 61 moves within the transport region 60 and transports the first substrate W1, second substrate W2 and overlapped substrate T to predetermined devices within the first processing block G1, second processing block G2 and third processing block G3 adjacent to the transport region 60.

[0032] The bonding system 1 also includes a control device 70. The control device 70 controls the operation of the bonding system 1. The control device 70 is, for example, a computer, and includes a control unit and a storage unit (not shown).

[0033] The control unit includes a microcomputer and various circuits that have a CPU (Central Processing Unit), ROM (Read Only Memory), RAM (Random Access Memory), input / output ports, etc. The CPU of such a microcomputer reads and executes programs stored in the ROM to realize the control described below.

[0034] The storage unit is realized by, for example, a semiconductor memory element such as a RAM or a flash memory, or a storage device such as a hard disk or an optical disk.

[0035] The program executed by the control unit may be recorded on a computer-readable recording medium and installed from the recording medium into the storage unit of the control device 70. Examples of computer-readable recording media include a hard disk (HD), a flexible disk (FD), a compact disk (CD), a magnetic optical disk (MO), and a memory card.

[0036] <Configuration of the joining device> Here, a configuration example of the joining device 41 will be described with reference to Fig. 3 to Fig. 5. Fig. 3 is a plan view of the joining device 41 according to the embodiment. Fig. 4 is a side view of the joining device 41 according to the embodiment.

[0037] 4, a bonding apparatus 41 according to the embodiment includes a mounting table 100, a first holding unit 110, a second holding unit 120, and a position measurement unit 130. The first holding unit 110 is an example of the second device, and the second holding unit 120 is an example of the first device.

[0038] The mounting table 100 is, for example, a box having a rectangular shape in a plan view with open sides, and is equipped with a first holding unit 110, a second holding unit 120, and a position measuring unit 130. The mounting table 100 includes, for example, a surface plate 101 and a frame 102.

[0039] The surface plate 101 has an upper surface 101a that directly or indirectly supports various devices that constitute the bonding apparatus 41. There are no particular limitations on the size and shape of the upper surface 101a, but it is required to have at least a size that allows the various devices that constitute the bonding apparatus 41 to be installed thereon.

[0040] The frame 102 is assembled on the surface plate 101. That is, the frame 102 is supported by an upper surface 101a of the surface plate 101. The frame 102 has a frame body 103 and a plurality of, for example, four pillars 104.

[0041] The frame 103 has, for example, a frame shape, and various devices constituting the joining device 41 are fixed to the front and back sides thereof. The plurality of pillars 104 have, for example, a column shape, and hold the frame 103 above the upper surface 101a. The detailed configuration of the mounting table 100 will be described later.

[0042] The first holding unit 110 is fixed to the frame body 103 of the frame 102 and holds the first substrate W1. The first holding unit 110 has an upper chuck 111 and an elevator unit 112. The upper chuck 111 suction-holds the non-bonding surface W1n (see FIG. 2) of the first substrate W1 from above.

[0043] The lifting / lowering unit 112 is located between the frame body 103 and the upper chuck 111, and moves the upper chuck 111 in the vertical direction (Z-axis direction). In this way, the lifting / lowering unit 112 can bring the upper chuck 111 closer to the lower chuck 121.

[0044] The second holding part 120 is provided below the first holding part 110 and holds the second substrate W2. The second holding part 120 is placed on the upper surface 101a of the surface plate 101. The second holding part 120 has a lower chuck 121 and a moving part 122. The lower chuck 121 suction-holds the non-bonding surface W2n (see FIG. 2) of the second substrate W2 from below.

[0045] The moving unit 122 moves the lower chuck 121 in the horizontal direction. Specifically, as shown in Fig. 3, the moving unit 122 has a first moving unit 123 that moves the lower chuck 121 along the X-axis direction and a second moving unit 124 that moves the lower chuck 121 along the Y-axis direction.

[0046] The first moving part 123 is attached to a pair of first rails 125 extending along the X-axis direction, and is configured to be movable along the pair of first rails 125. The pair of first rails 125 are provided on the upper surface 101a of the base plate 101. Both ends of the first moving part 123 in the Y-axis direction can be moved independently along the pair of first rails 125 by driving devices such as linear motors.

[0047] The second moving part 124 is attached to a pair of second rails 126 extending along the Y-axis direction, and is configured to be movable along the pair of second rails 126. The pair of second rails 126 are provided on the upper surface of the first moving part 123.

[0048] The lower chuck 121 is attached to the second moving part 124 and moves integrally with the second moving part 124. As described above, the second moving part 124 is attached to the first moving part 123 via the pair of second rails 126.

[0049] Therefore, the moving unit 122 can move the lower chuck 121 along the X-axis direction by moving the first moving unit 123. Furthermore, the moving unit 122 can move the lower chuck 121 along the Y-axis direction by moving the second moving unit 124. The moving unit 122 also includes a rotating unit (not shown) that rotates the lower chuck 121 around a vertical axis.

[0050] In this way, the moving unit 122 moves the lower chuck 121 in the X-axis direction, Y-axis direction, and θ direction, thereby aligning the first substrate W1 held by the upper chuck 111 with the second substrate W2 held by the lower chuck 121 in the horizontal direction.

[0051] The moving unit 122 only needs to be able to relatively move the upper chuck 111 and the lower chuck 121 in the X-axis direction, the Y-axis direction, and the θ direction. For example, the moving unit 122 may move the upper chuck 111 in the X-axis direction, the Y-axis direction, and the θ direction.

[0052] The moving unit 122 may also move the lower chuck 121 in the X-axis direction and the Y-axis direction, and move the upper chuck 111 in the θ direction. The moving unit 122 may also move the lower chuck 121 in the X-axis direction and the Y-axis direction, and move the upper chuck 111 and the lower chuck 121 in the θ direction.

[0053] 4 has a camera (not shown) and lasers (not shown), and measures the relative position between the first substrate W1 and the second substrate W2. The position measurement unit 130 is fixed to the frame body 103 of the frame 102.

[0054] The position measurement unit 130 measures the relative positions of the first substrate W1 and the second substrate W2, for example, by measuring the position of the first substrate W1 held by the upper chuck and the position of the second substrate W2 held by the lower chuck 121.

[0055] Here, a configuration example of the upper chuck 111 and the lower chuck 121 will be described with reference to Fig. 5. Fig. 5 is a side view of the upper chuck 111 and the lower chuck 121 according to the embodiment.

[0056] 5, the upper chuck 111 is supported by a support member 111a. A through-hole 111b is formed in the upper chuck 111 and the support member 111a, passing through the upper chuck 111 and the support member 111a in the vertical direction.

[0057] The position of the through-hole 111b corresponds to the center of the first substrate W1 that is sucked and held by the upper chuck 111. A pressing pin 211 of a striker 210 is inserted into the through-hole 111b.

[0058] The striker 210 is located on the upper surface of the support member 111a, and includes a pressing pin 211, an actuator unit 212, and a linear motion mechanism 213. The pressing pin 211 is a cylindrical member that extends in the vertical direction, and is supported by the actuator unit 212.

[0059] The actuator unit 212 generates a constant pressure in a certain direction (vertically downward in this case) using air supplied from, for example, an electropneumatic regulator (not shown). The actuator unit 212 contacts the center of the first substrate W1 and can control the pressure load applied to the center of the first substrate W1 using the air supplied from the electropneumatic regulator.

[0060] The tip of the actuator part 212 is movable up and down in the vertical direction by air from an electropneumatic regulator through the through-hole 111b.

[0061] The actuator section 212 is supported by a linear motion mechanism 213. The linear motion mechanism 213 moves the actuator section 212 in the vertical direction by means of a drive section incorporating a motor, for example.

[0062] The striker 210 controls the movement of the actuator part 212 by the linear motion mechanism 213, and the actuator part 212 controls the pressing load on the first substrate W1 by the pressing pin 211. As a result, the striker 210 presses the center of the first substrate W1, which is sucked and held by the first holding part 110, to bring it into contact with the second substrate W2.

[0063] A plurality of pins 111c that come into contact with the non-bonding surface W1n (see FIG. 2) of the first substrate W1 are provided on the lower surface of the upper chuck 111. The pins 111c each have a diameter of, for example, 0.1 mm to 1 mm and a height of several tens to several hundreds of μm. The pins 111c are evenly spaced, for example, at intervals of 2 mm.

[0064] The upper chuck 111 has a plurality of suction portions for suctioning the first substrate W1 in a part of the region where the plurality of pins 111c are provided. Specifically, the lower surface of the upper chuck 111 is provided with a plurality of outer suction portions 111d and a plurality of inner suction portions 111e for suctioning the first substrate W1 by vacuuming.

[0065] The outer suction portions 111d and the inner suction portions 111e have suction regions that are arc-shaped in plan view, and are the same height as the pins 111c.

[0066] The outer suction portions 111d are arranged on the outer periphery of the upper chuck 111. The outer suction portions 111d are connected to a suction device (not shown) such as a vacuum pump, and suck the outer periphery of the first substrate W1 by vacuuming.

[0067] The inner suction portions 111e are arranged side by side along the circumferential direction, radially inward of the outer suction portions 111d of the upper chuck 111. The inner suction portions 111e are connected to a suction device (not shown), such as a vacuum pump, and suck the area between the outer periphery and the center of the first substrate W1 by vacuuming.

[0068] A plurality of pins 121a that come into contact with the non-bonding surface W2n (see FIG. 2) of the second substrate W2 are provided on the upper surface of the lower chuck 121. The pins 121a each have a diameter of, for example, 0.1 mm to 1 mm and a height of several tens of μm to several hundreds of μm. The pins 121a are evenly spaced, for example, at intervals of 2 mm.

[0069] Furthermore, a lower rib 121b is provided in an annular shape around the outer periphery of the pins 121a on the upper surface of the lower chuck 121. The lower rib 121b is formed in an annular shape and supports the outer periphery of the second substrate W2 over the entire circumference.

[0070] The lower chuck 121 also has a plurality of lower suction ports 121c. The plurality of lower suction ports 121c are provided in a suction region surrounded by the lower ribs 121b. The plurality of lower suction ports 121c are connected to a suction device (not shown), such as a vacuum pump, via a suction pipe (not shown).

[0071] The lower chuck 121 depressurizes the suction region surrounded by the lower ribs 121b by vacuuming the suction region through the plurality of lower suction ports 121c, thereby suctioning and holding the second substrate W2 placed in the suction region to the lower chuck 121.

[0072] Because the lower ribs 121b support the entire outer periphery of the lower surface of the second substrate W2, the second substrate W2 is properly vacuumed up to the outer periphery. This allows the lower chuck 121 to suction and hold the entire surface of the second substrate W2. Furthermore, because the lower surface of the second substrate W2 is supported by multiple pins 121a, the second substrate W2 is easily peeled off from the lower chuck 121 when the vacuum is released.

[0073] The bonding device 41 suction-holds the first substrate W1 on the upper chuck 111 of the first holding unit 110, and suction-holds the second substrate W2 on the lower chuck 121 of the second holding unit 120. Thereafter, the bonding device 41 releases the suction-holding of the first substrate W1 by the multiple inner suction units 111e, and lowers the pressing pin 211 of the striker 210 to press down the center of the first substrate W1.

[0074] As a result, the first substrate W1 and the second substrate W2 are bonded together to form a laminated substrate T (see FIG. 2). The laminated substrate T is carried out of the bonding apparatus 41 by the transfer device 61 (see FIG. 1).

[0075] Although not shown in Figures 3 to 5, the bonding device 41 includes a transition, a position adjustment mechanism, and an inversion mechanism. The transition temporarily places the first substrate W1, the second substrate W2, and the overlapping substrate T. The position adjustment mechanism adjusts the horizontal orientations of the first substrate W1 and the second substrate W2. The inversion mechanism inverts the first substrate W1.

[0076] <Specific operation of the joining system> Next, specific operations of the bonding system 1 according to the embodiment will be described with reference to Fig. 6. Fig. 6 is a flowchart showing the procedure of processing executed by the bonding system 1 according to the embodiment. The various processing shown in Fig. 6 is executed based on the control of the control device 70.

[0077] First, a cassette C1 containing a plurality of first substrates W1, a cassette C2 containing a plurality of second substrates W2, and an empty cassette C3 are placed on a predetermined loading plate 11 in the load / unload station 2. Then, the first substrate W1 in the cassette C1 is removed by the transport device 22 and transported to a transition device located in the third processing block G3.

[0078] Next, the first substrate W1 is transported by the transport device 61 to the surface modification device 30 in the first processing block G1. In the surface modification device 30, oxygen gas, which is a processing gas, is excited to plasma and ionized in a predetermined reduced-pressure atmosphere. The oxygen ions are irradiated onto the bonding surface of the first substrate W1, and the bonding surface is subjected to plasma processing. This modifies the bonding surface of the first substrate W1 (step S101).

[0079] Next, the first substrate W1 is transported by the transport device 61 to the surface hydrophilization device 40 in the first processing block G1. In the surface hydrophilization device 40, pure water is supplied onto the first substrate W1 while the first substrate W1 held by the spin chuck is being rotated. This makes the bonding surface of the first substrate W1 hydrophilic. The bonding surface of the first substrate W1 is also cleaned with the pure water (step S102).

[0080] Next, the first substrate W1 is transported to the bonding device 41 in the second processing block G2 by the transport device 61. After being carried into the bonding device 41, the first substrate W1 is transported to the position adjustment mechanism via a transition, and its horizontal orientation is adjusted by the position adjustment mechanism (step S103).

[0081] Thereafter, the first substrate W1 is transferred from the position adjustment mechanism to the inversion mechanism, which inverts the first substrate W1 upside down (step S104). Specifically, the bonding surface W1j of the first substrate W1 faces downward. Next, the first substrate W1 is transferred from the inversion mechanism to the first holding unit 110, and the first substrate W1 is held by suction by the first holding unit 110 (step S105).

[0082] The processing of the second substrate W2 overlaps with the processing of steps S101 to S105 for the first substrate W1. First, the transfer device 22 removes the second substrate W2 from the cassette C2 and transfers it to a transition device arranged in the third processing block G3.

[0083] Next, the second substrate W2 is transported by the transport device 61 to the surface modification device 30, where the bonding surface W2j of the second substrate W2 is modified (step S106). Thereafter, the second substrate W2 is transported by the transport device 61 to the surface hydrophilization device 40, where the bonding surface W2j of the second substrate W2 is hydrophilized and the bonding surface is cleaned (step S107).

[0084] Thereafter, the second substrate W2 is transported to the bonding device 41 by the transport device 61. The second substrate W2 carried into the bonding device 41 is transported to the position adjustment mechanism via the transition. Then, the horizontal orientation of the second substrate W2 is adjusted by the position adjustment mechanism (step S108).

[0085] Thereafter, the second substrate W2 is transported to the second holding unit 120 and is sucked and held by the second holding unit 120 with the notch facing in a predetermined direction (step S109).

[0086] Next, the horizontal positions of the first substrate W1 held by the first holding unit 110 and the second substrate W2 held by the second holding unit 120 are adjusted (step S110). For example, the horizontal positions of the first substrate W1 and the second substrate W2 are adjusted based on the positions of the first substrate W1 and the second substrate W2 measured by the position measurement unit 130.

[0087] Next, the first substrate W1 and the second substrate W2 are bonded together (step S111). First, the vertical positions of the first substrate W1 held by the first holding unit 110 and the second substrate W2 held by the second holding unit 120 are adjusted. Specifically, the first holding unit 110 is lowered using the lifting unit 112, thereby bringing the second substrate W2 closer to the first substrate W1.

[0088] Next, after the suction and holding of the first substrate W1 by the plurality of inner suction portions 111e is released, the pressing pin 211 of the striker 210 is lowered to press down the center of the first substrate W1.

[0089] When the center of the first substrate W1 comes into contact with the center of the second substrate W2 and the centers of the first substrate W1 and the second substrate W2 are pressed together with a predetermined force by the striker 210, bonding begins between the pressed centers of the first substrate W1 and the second substrate W2.

[0090] That is, since the bonding surface W1j of the first substrate W1 and the bonding surface W2j of the second substrate W2 are modified, first, van der Waals forces (intermolecular forces) are generated between the bonding surfaces W1j and W2j, and the bonding surfaces W1j and W2j are bonded to each other.

[0091] Furthermore, because the bonding surface W1j of the first substrate W1 and the bonding surface W2j of the second substrate W2 are hydrophilized, the hydrophilic groups between the bonding surfaces W1j and W2j form hydrogen bonds, firmly bonding the bonding surfaces W1j and W2j together, thus forming a bonding region.

[0092] Thereafter, a bonding wave is generated between the first substrate W1 and the second substrate W2, with the bonding area expanding from the center to the periphery of the first substrate W1 and the second substrate W2. Thereafter, the suction and holding of the first substrate W1 by the outer suction portions 111d is released.

[0093] This causes the outer periphery of the first substrate W1, which has been sucked and held by the outer sucking portion 111d, to fall. As a result, the bonding surface W1j of the first substrate W1 and the bonding surface W2j of the second substrate W2 come into contact with each other over their entire surfaces, and the overlapped substrate T is formed.

[0094] Thereafter, the pressing pin 211 is raised to the first holding part 110, and the suction and holding of the second substrate W2 by the second holding part 120 is released. Thereafter, the laminated substrate T is carried out of the bonding device 41 by the transfer device 61. In this way, a series of bonding processes is completed.

[0095] <Configuration of the mounting table> Next, the configuration of the mounting table 100 according to the embodiment will be described with reference to Figures 7 to 10. Figure 7 is a perspective view showing the configuration of the mounting table 100 according to the embodiment.

[0096] In the following drawings, only the components that make up the mounting table 100 are shown, and the first holding unit 110 (see Figure 4), the second holding unit 120 (see Figure 3), the position measurement unit 130 (see Figure 4), etc. are not shown.

[0097] As described above, the mounting table 100 includes the surface plate 101 and the frame 102. The surface plate 101 has an upper surface 101a that directly or indirectly supports various devices that constitute the bonding apparatus 41. The frame 102 is assembled on the surface plate 101.

[0098] The frame 102 has a frame body 103 and a plurality of, for example, four, pillars 104. The frame body 103 has, for example, a frame shape, and various devices that make up the joining device 41 are fixed to the front and back sides. The plurality of pillars 104 have, for example, a column shape, and hold the frame body 103 above the upper surface 101 a.

[0099] In this embodiment, the plurality of columns 104 include a fixed column 104a, a first movable column 104b, a second movable column 104c, and a third movable column 104d. The fixed column 104a is fixed to the base plate 101. The fixed column 104a is fastened to the base plate 101 with screws, for example.

[0100] The first moving column 104b, the second moving column 104c, and the third moving column 104d are supported so as to be movable on the base 101. For example, the first moving column 104b, the second moving column 104c, and the third moving column 104d are movable so as to slide on the upper surface 101a of the base 101.

[0101] In this embodiment, the base 101 has a first guide portion 101b and a second guide portion 101c. The first guide portion 101b allows the first moving column 104b to move along a first direction (for example, the Y-axis direction) and restricts the first moving column 104b from moving along directions other than the first direction.

[0102] The second guide portion 101c allows the second moving column 104c to move along a second direction (for example, the X-axis direction) and restricts the second moving column 104c from moving along directions other than the second direction.

[0103] The first guide portion 101b is, for example, a step located on the upper surface 101a of the base plate 101 and extending along the first direction. The second guide portion 101c is, for example, a step located on the upper surface 101a of the base plate 101 and extending along the second direction.

[0104] This configuration in the embodiment can prevent distortion due to loss of geometrical relationship when the frame 102 expands and contracts due to temperature changes. The reason for this will be explained with reference to FIGS.

[0105] 8 is a diagram for explaining a deformed state of the frame 102 in the reference example. In this reference example, all four pillars 104 are fixed to the surface plate 101 (see FIG. 7).

[0106] The surface plate 101 has a large heat capacity and is stable (insensitive) to temperature changes, whereas the frame 102 has a smaller heat capacity and a larger surface area relative to its volume than the surface plate 101, and is therefore more susceptible to changes in ambient temperature. In other words, the frame 102 is more likely to expand and contract due to temperature changes than the surface plate 101.

[0107] Therefore, for example, when the temperature rises, the frame 103 thermally expands, while the positions of the multiple columns 104 fixed to the surface plate 101 hardly change. As a result, when the temperature rises, the frame 103 deforms so as to bulge outward as shown by the thick line from the rectangular shape (shown by the dashed line) that it had before the temperature rise, as shown in FIG.

[0108] Furthermore, the upper ends of the pillars 104 move outward due to the frame 103 deforming so as to bulge outward. As a result, the positions of the upper and lower ends of the pillars 104 become misaligned, and all the pillars 104 deform so as to warp outward.

[0109] Therefore, in the reference example, the parallelism and squareness of the position measuring unit 130 (see FIG. 4) fixed to the frame 103 deteriorate, resulting in a decrease in the accuracy of position measurement.

[0110] 9 is a diagram illustrating a deformed state of the frame 102 according to the embodiment. As shown in Fig. 9, in the embodiment, a first moving column 104b, a second moving column 104c, and a third moving column 104d are movably supported on a base 101 (see Fig. 7).

[0111] Therefore, for example, when the temperature rises, the first moving column 104b, the second moving column 104c, and the third moving column 104d move away from the fixed column 104a in response to the thermal expansion of the frame body 103.

[0112] As a result, even if the temperature rises, the frame 103 can deform as shown in FIG. 9, while maintaining the geometric relationship as indicated by the thick line, relative to the rectangular shape (shown by the dashed line) before the temperature rise.

[0113] That is, in the embodiment, it is possible to prevent deterioration in parallelism and squareness in the position measurement unit 130 (see FIG. 4) fixed to the frame body 103. Therefore, according to the embodiment, it is possible to improve the accuracy of position measurement in the position measurement unit 130.

[0114] Returning to the description of Figure 7, in the embodiment, the first direction in which the first moving column 104b is movable and the second direction in which the second moving column 104c is movable may be orthogonal to each other and parallel or perpendicular to the drive axis of the second holding part 120 (see Figure 3).

[0115] This makes it easier to correct deviations in position measurement by the position measurement unit 130 when the frame 103 is deformed due to a temperature change while maintaining the geometric relationship. Therefore, according to the embodiment, the accuracy of position measurement by the position measurement unit 130 can be further improved.

[0116] In addition, in the present disclosure, the first direction in which the first moving column 104b can move and the second direction in which the second moving column 104c can move are not limited to being perpendicular to each other, and the angle formed by the first direction and the second direction may be either an acute angle or an obtuse angle.

[0117] In addition, in the embodiment, the angle formed by the first direction and the second direction may be equal to or smaller than the angle formed between the two beam portions of the frame body 103 that contact the fixed column 104a. This makes it possible to prevent the first moving column 104b or the second moving column 104c from moving away from the first guide portion 101b or the second guide portion 101c when the frame body 103 expands or contracts due to temperature changes.

[0118] Therefore, according to the embodiment, the accuracy of the position measurement by the position measurement unit 130 can be further improved.

[0119] In the embodiment, the first guide portion 101b and the second guide portion 101c that restrict the movements of the first moving column 104b and the second moving column 104c, respectively, may be steps located on the upper surface 101a of the base 101.

[0120] In this way, the movements of the first moving column 104b and the second moving column 104c can be precisely restricted by making the first guide portion 101b and the second guide portion 101c steps integral with the base 101. Therefore, according to the embodiment, the accuracy of position measurement by the position measurement unit 130 can be further improved.

[0121] Furthermore, in the embodiment, the frame 102 may have a third movable column 104d that is supported so as to be movable without restriction on the base plate 101. In this way, by supporting the four corners of the rectangular frame body 103 with four columns 104, the first holding unit 110 and the position measuring unit 130 that are fixed to the frame body 103 can be stably supported.

[0122] In addition, in the embodiment, devices that serve as a measurement reference, such as a light source, mirror, and reference surface of the position measurement unit 130, may be disposed near the fixed column 104a of the frame 102.

[0123] In this way, by placing the measurement reference equipment such as the light source, mirror, and reference surface of the position measurement unit 130 near the fixed column 104a, which serves as the reference for changes in geometric relationships due to temperature changes, the accuracy of position measurement by the position measurement unit 130 can be further improved.

[0124] In addition, in the embodiment, the surface plate 101 and the frame 102 may be made of stone such as granite. This can reduce changes in the shape of the surface plate 101 and the frame 102 due to temperature changes, thereby further improving the accuracy of position measurement by the position measurement unit 130.

[0125] 10 is a diagram for explaining the configuration of the first moving column 104b according to the embodiment, and is a diagram showing the first moving column 104b and its surroundings as viewed from above. As shown in FIG. 10, in the embodiment, the first moving column 104b may be a square column.

[0126] As a result, the first moving column 104b and the first guide portion 101b come into contact with each other at their surfaces, so that the frame 103 (see FIG. 7) can be deformed while maintaining the geometric relationship with high precision.

[0127] Therefore, according to the embodiment, the position measurement unit 130 (see FIG. 4) fixed to the frame body 103 can be further prevented from deteriorating in parallelism and squareness, thereby further improving the accuracy of position measurement by the position measurement unit 130.

[0128] 10, the first moving pillar 104b is a square pillar, but the second moving pillar 104c (see FIG. 7) may be a square pillar. This also makes it possible to further improve the accuracy of position measurement by the position measurement unit 130.

[0129] <Variation 1> Next, various modified examples of the embodiment will be described with reference to Figures 11 to 20. In the following various modified examples, the same parts as those in the embodiment will be denoted by the same reference numerals, and redundant description will be omitted.

[0130] 11 is a perspective view showing the configuration of a mounting table 100 according to Modification 1 of the embodiment. As shown in FIG. 11, in Modification 1, the configuration of a surface plate 101 is different from that of the above-described embodiment.

[0131] Specifically, in Modification 1, the base 101 may have a first base 101A and a second base 101B. The first base 101A has an upper surface 101a and a first guide portion 101b. The second base 101B has, for example, a rectangular parallelepiped shape and forms a second guide portion 101c on the first base 101A.

[0132] In the mounting table 100 of the first modification, the fixed columns 104a of the frame 102 are fixed to the first base plate 101A, and the second base plate 101B is fixed to the fixed columns 104a. That is, in the first modification, the second base plate 101B is not fixed directly to the first base plate 101A, but is fixed to the first base plate 101A via the fixed columns 104a.

[0133] In this way, by dividing the surface plate 101 into two members, the angles between the surface plate 101 and the frame 102 can be more easily aligned compared to when both the first guide portion 101b and the second guide portion 101c are formed on one surface plate 101. Therefore, according to the first modification, the surface plate 101 can be manufactured easily.

[0134] 11 shows an example in which the second base plate 101B forms the second guide portion 101c, but the present disclosure is not limited to this example, and the second base plate 101B may form the first guide portion 101b. This also makes it possible to easily manufacture the base plate 101.

[0135] In the present disclosure, the first guide portion 101b and the second guide portion 101c may be formed by a first base plate 101A having an upper surface 101a and two second base plates 101B, respectively. This also makes it possible to easily manufacture the base plate 101.

[0136] <Modifications 2 and 3> 12 and 13 are perspective views showing the configuration of the mounting table 100 according to Modifications 2 and 3 of the embodiment. As shown in Fig. 12, in Modification 2, the configuration of the first guide portion 101b is different from that of Modification 1. Specifically, in Modification 2, the step forming the first guide portion 101b may be higher on the inside than on the outside of the upper surface 101a of the base plate 101.

[0137] It is desirable to carry out final adjustments to the mounting table 100 of the present disclosure when the bonding device 41 is installed after it is delivered to a semiconductor manufacturing factory or the like. This is because the environmental temperature during manufacturing of the mounting table 100 does not completely match the environmental temperature within the semiconductor manufacturing factory. Therefore, it is desirable to screw the fixing posts 104a to the surface plate 101 after delivery to the semiconductor manufacturing factory.

[0138] In the second modification, the step that constitutes the first guide portion 101b is higher on the inside than on the outside of the top surface 101a, so that when the fixed column 104a is screwed to the base 101, it can be accessed and screwed from the outside of the frame 102. Therefore, according to the second modification, the mounting table 100 can be easily installed.

[0139] The configuration of the first guide portion 101b is not limited to the example shown in Fig. 12. For example, as shown in Fig. 13, the first guide portion 101b may be arranged so as to be bent at the upper surface 101a.

[0140] This also allows the fixed columns 104a to be screwed to the surface plate 101 by accessing them from outside the frame 102. Therefore, according to the third modification, the mounting table 100 can be easily installed.

[0141] In the examples of Figures 12 and 13, the step that constitutes the first guide portion 101b is higher on the inside than on the outside of the upper surface 101a, but the step that constitutes the second guide portion 101c may be higher on the inside than on the outside of the upper surface 101a.

[0142] This also allows the fixing columns 104a to be screwed to the surface plate 101 by accessing them from the outside of the frame 102, making it possible to easily install the mounting table 100.

[0143] <Variation 4> Fig. 14 is a diagram illustrating the configuration of the first moving column 104b according to the fourth modification of the embodiment, and corresponds to Fig. 10 of the embodiment. As shown in Fig. 14, in the fourth modification, the first moving column 104b may be a semi-cylinder. Also, in the fourth modification, the curved surface of the first moving column 104b may be positioned so as to contact the first guide portion 101b.

[0144] This reduces the contact area between the first moving column 104b and the first guide portion 101b, so that when the frame body 103 (see Figure 7) deforms, the movement of the first moving column 104b is hindered, which prevents the geometric relationship of the frame body 103 from being maintained and causing distortion.

[0145] Therefore, according to variant example 4, the position measurement unit 130 (see Figure 4) fixed to the frame body 103 can be further prevented from deteriorating in parallelism and squareness, thereby further improving the accuracy of position measurement by the position measurement unit 130.

[0146] 14 shows an example in which the first moving column 104b is a semi-cylinder, but the second moving column 104c (see FIG. 7) may also be a semi-cylinder, which can further improve the accuracy of position measurement by the position measurement unit 130.

[0147] <Variation 5> Fig. 15 is a diagram illustrating the configuration of a first moving column 104b according to Modification 5 of the embodiment. As shown in Fig. 15, in Modification 5, the first moving column 104b may be a cylinder.

[0148] This reduces the contact area between the first moving column 104b and the first guide portion 101b, so that when the frame body 103 (see Figure 7) deforms, the movement of the first moving column 104b is hindered, which prevents the geometric relationship of the frame body 103 from being maintained and causing distortion.

[0149] Therefore, according to variant example 5, the position measurement unit 130 (see Figure 4) fixed to the frame body 103 can be further prevented from deteriorating in parallelism and squareness, thereby further improving the accuracy of position measurement by the position measurement unit 130.

[0150] 15 shows an example in which the first moving column 104b is a cylinder, but the second moving column 104c (see FIG. 7) may be a cylinder, which also further improves the accuracy of position measurement by the position measurement unit 130.

[0151] In the present disclosure, at least one of the first moving column 104b and the second moving column 104c may be an elliptical column, which also makes it possible to further improve the accuracy of position measurement by the position measurement unit .

[0152] <Variation 6> Fig. 16 is a diagram illustrating the configuration of a first moving column 104b according to Modification 6 of the embodiment. As shown in Fig. 16, in Modification 6, the side surface of the first moving column 104b, which is a cylinder, may be coated with a lubricant A.

[0153] This reduces the frictional force between the first moving column 104b and the first guide part 101b, so that when the frame body 103 (see Figure 7) deforms, the movement of the first moving column 104b is hindered, which prevents the geometric relationship of the frame body 103 from being maintained and causing distortion.

[0154] Therefore, according to variant example 6, the position measurement unit 130 (see Figure 4) fixed to the frame body 103 can be further prevented from deteriorating in parallelism and squareness, thereby further improving the accuracy of position measurement by the position measurement unit 130.

[0155] 16 shows an example in which the first moving column 104b is coated with the lubricant A, but the second moving column 104c (see FIG. 7) may also be coated with the lubricant A. This also makes it possible to further improve the accuracy of position measurement by the position measurement unit 130.

[0156] 16 shows an example in which the lubricant A is coated on the first moving column 104b, which is a cylinder, but the lubricant A may be coated on the first moving column 104b or the second moving column 104c, which is a square column, a semi-cylinder, or an elliptical column. This also makes it possible to further improve the accuracy of position measurement by the position measurement unit 130.

[0157] <Modifications 7 and 8> Fig. 17 is a diagram illustrating the configuration of a first pressing mechanism 105 according to Modification 7 of the embodiment. As shown in Fig. 17, the mounting table 100 according to Modification 7 may further include a first pressing mechanism 105 near the first moving column 104b.

[0158] The first pressing mechanism 105 has a function of pressing the first moving column 104b against the first guide portion 101b. The first pressing mechanism 105 has a partition portion 106 and a pressure mechanism 107.

[0159] The partition 106 is positioned so as to surround the first moving column 104b, which is in contact with the first guide portion 101b, on the remaining three sides. The partition 106 forms an isolated area 106a around the first moving column 104b, which is isolated from the outside world.

[0160] Also, second partition section 106A is located in isolation region 106a. Second partition section 106A is substantially flat and divides isolation region 106a into isolation region 106a1 and isolation region 106a2. Second partition section 106A is, for example, substantially parallel to first guide section 101b. First moving column 104b is located in isolation region 106a2.

[0161] The partition 106 is fixed to the base 101, and the second partition 106A is movable within the isolation area 106a. The width L of the partition 106 is set to be larger than the range in which the first movable column 104b moves due to temperature changes.

[0162] The pressure mechanism 107 pressurizes the isolation area 106a1 by supplying a medium such as air or water to the isolation area 106a1. When the pressure mechanism 107 operates to pressurize the isolation area 106a1, the second partition section 106A presses the first moving column 104b against the first guide section 101b.

[0163] In the seventh modification, the first pressing mechanism 105 can prevent the first moving column 104b from separating from the first guide part 101b when the frame body 103 expands and contracts due to a temperature change. Therefore, according to the seventh modification, the accuracy of the position measurement by the position measurement part 130 (see FIG. 4) can be further improved.

[0164] In addition, in the seventh modification, the pressure mechanism 107 is operated when the position measurement unit 130 performs position measurement, and the pressure mechanism 107 does not need to be operated when the position measurement unit 130 does not perform position measurement.

[0165] This prevents the first moving column 104b from being pressed excessively against the first guide portion 101b when the frame body 103 expands and contracts due to temperature changes, thereby preventing the expansion and contraction of the frame body 103 from being hindered.

[0166] The configuration of the first pressing mechanism 105 is not limited to the example in Fig. 17. Fig. 18 is a diagram for explaining the configuration of the first pressing mechanism 105 according to Modification 8 of the embodiment. In Modification 8, the first pressing mechanism 105 has a partition portion 106 and a spring portion 108.

[0167] The spring portion 108 is located between the partition portion 106 and the first moving pillar 104b, and presses the first moving pillar 104b against the first guide portion 101b with its elastic force.

[0168] This also makes it possible to prevent the first moving column 104b from separating from the first guide part 101b when the frame body 103 expands and contracts due to a change in temperature. Therefore, according to the eighth modification, the accuracy of position measurement by the position measurement part 130 (see FIG. 4) can be further improved.

[0169] <Variation 9> 19 is a diagram illustrating the configuration of a first pressing mechanism 105 according to Modification 9 of the embodiment. In Modification 9, the first pressing mechanism 105 has a partition section 106, a suction mechanism 107A, and a vacuum pad 109.

[0170] The suction mechanism 107A applies suction to the vacuum pad 109. The vacuum pad 109 is located at a position in the first guide portion 101b where it comes into contact with the first moving column 104b.

[0171] In the ninth modification, the suction mechanism 107A operates to suck the vacuum pad 109, so that the first moving column 104b in contact with the vacuum pad 109 is pressed against the first moving column 104b.

[0172] This also makes it possible to prevent the first moving column 104b from separating from the first guide part 101b when the frame body 103 expands and contracts due to a change in temperature. Therefore, according to the eighth modification, the accuracy of position measurement by the position measurement part 130 (see FIG. 4) can be further improved.

[0173] Furthermore, in the ninth modification, the partitioning section 106 partitions the periphery of the first moving column 104b, so that the vacuum pad 109 can effectively suck the first moving column 104b.

[0174] Furthermore, the configuration of the first pressing mechanism 105 is not limited to the examples shown in FIGS. 17 to 19, and the first moving column 104b may be pressed against the first guide portion 101b by, for example, a bearing mechanism or the like provided in the isolation area 106a.

[0175] In addition, the mounting table 100 of the present disclosure may have a configuration similar to the first pressing mechanism 105 described so far and may be equipped with a second pressing mechanism that presses the second moving column 104c (see Figure 7) against the second guide portion 101c (see Figure 7).

[0176] This prevents the second moving column 104c from separating from the second guide portion 101c when the frame body 103 expands and contracts due to temperature changes, thereby further improving the accuracy of position measurement by the position measurement portion 130.

[0177] <Modification 10> In the embodiment and various modified examples described so far, examples have been shown in which the first guide portion 101b and the second guide portion 101c are configured as steps, but the present disclosure is not limited to such examples. Fig. 20 is a diagram for explaining the configuration of the first guide portion 101b according to a modified example 10 of the embodiment.

[0178] 20, in Modification 10, the first guide portion 101b may be a groove located on the upper surface 101a of the surface plate 101 and extending along the first direction (for example, the Y-axis direction). This can improve the yield of the surface plate 101.

[0179] Furthermore, in Modification 10, the tip of the first moving column 104b may be hemispherical. This reduces the contact area between the first moving column 104b and the first guide part 101b, and therefore when the frame body 103 (see FIG. 7) deforms, the movement of the first moving column 104b is hindered, which prevents the geometric relationship of the frame body 103 from being lost and causing distortion.

[0180] Therefore, according to variant example 10, the position measurement unit 130 (see Figure 4) fixed to the frame body 103 can be further prevented from deteriorating in parallelism and squareness, thereby further improving the accuracy of position measurement by the position measurement unit 130.

[0181] In addition, in the present disclosure, the second guide portion 101c (see FIG. 7) may be a groove located on the upper surface 101a of the surface plate 101 and extending along the second direction (for example, the X-axis direction). This can improve the yield of the surface plate 101.

[0182] <Variation 11> FIG. 21 is a side view of a joining device 41 according to the eleventh modification of the embodiment, and corresponds to FIG. 4 of the embodiment.

[0183] As shown in FIG. 21, a bonding apparatus 41 according to the eleventh modification includes a mounting table 100, a first holding unit 110, a second holding unit 120, a position measuring unit 130, and a plurality of displacement measuring units 140.

[0184] Of these components, the mounting table 100, the first holding unit 110, the second holding unit 120, and the position measuring unit 130 are the same as those in the above-described embodiment, and therefore a description thereof will be omitted.

[0185] The plurality of displacement measuring units 140 measure displacements at a plurality of locations on the mounting table 100. The plurality of displacement measuring units 140 measure displacements at, for example, the side surface of the base 101, the side surface of the upper portion of the frame 102, the top surface of the frame 103, the front surface of the frame 103, and the back surface of the frame 103.

[0186] This allows the plurality of displacement measuring units 140 to measure the parallelism and perpendicularity of the frame 103 and the plurality of columns 104.

[0187] In the eleventh modification, the work of installing the joining device 41, such as screwing the fixed column 104a, may be performed while measuring the parallelism and squareness of the frame body 103 and the multiple columns 104 using multiple displacement measuring units 140.

[0188] Then, if the error in parallelism and squareness is equal to or greater than a given first threshold value, the value of the error in parallelism and squareness can be used to correct the position measured by the position measurement unit 130. This can further improve the accuracy of the position measurement by the position measurement unit 130.

[0189] In addition, in variant example 11, if the error in parallelism and squareness is equal to or greater than a given second threshold value (where the second threshold value is greater than the first threshold value), an alarm or the like may be used to notify the worker to readjust the installation position of the frame 102.

[0190] This makes it possible to prevent the installation work from being completed with large errors in parallelism and squareness, thereby further improving the accuracy of position measurement by the position measurement unit 130.

[0191] In addition, in Modification 11, the bonding process of the first substrate W1 and the second substrate W2 may be performed while measuring the parallelism and perpendicularity of the frame 103 and the plurality of columns 104 using a plurality of displacement measuring units 140.

[0192] The measured parallelism and squareness error values ​​can then be used to correct the position measured by the position measurement unit 130. This can further improve the accuracy of position measurement by the position measurement unit 130.

[0193] The mounting table 100 according to the embodiment includes a base 101 and a frame 102. A first device (second holding unit 120) is placed on the base 101. A second device (first holding unit 110) is fixed to the frame 102, which is assembled on the base 101. The frame 102 includes a fixed column 104a, a first movable column 104b, and a second movable column 104c. The fixed column 104a is fixed to the base 101. The first movable column 104b and the second movable column 104c are supported movably on the base 101. The base 101 includes a first guide unit 101b and a second guide unit 101c. The first guide unit 101b allows the first movable column 104b to move along a first direction. The second guide portion 101c allows the second moving column 104c to move along the second direction, thereby improving the accuracy of the position measurement by the position measurement portion .

[0194] Furthermore, in the mounting table 100 according to the embodiment, the first direction and the second direction are orthogonal to each other and parallel or perpendicular to the drive axis of the first device (second holding unit 120). This can further improve the accuracy of position measurement by the position measuring unit 130.

[0195] In addition, in the mounting table 100 according to the embodiment, the first guide portion 101b is a step located on the upper surface 101a of the base 101 and extending along the first direction, and the second guide portion 101c is a step located on the upper surface 101a of the base 101 and extending along the second direction. This can further improve the accuracy of position measurement by the position measurement unit 130.

[0196] Furthermore, in the mounting table 100 according to the embodiment, the step is higher on the inside than on the outside of the upper surface 101a of the surface plate 101. This allows the mounting table 100 to be easily installed.

[0197] In addition, in the mounting table 100 according to the embodiment, the base 101 includes a first base 101A on which the first guide portion 101b is provided, and a second base 101B on which the second guide portion 101c is formed on the first base 101A. This allows the base 101 to be manufactured easily.

[0198] Moreover, the mounting table 100 according to the embodiment further includes a first pressing mechanism 105 that presses the first moving column 104b against the first guide portion 101b, and a second pressing mechanism that presses the second moving column 104c against the second guide portion 101c, thereby further improving the accuracy of position measurement by the position measurement unit 130.

[0199] In addition, in the mounting table 100 according to the embodiment, the first guide portion 101b is a groove located on the upper surface 101a of the surface plate 101 and extending along the first direction, and the second guide portion 101c is a groove located on the upper surface 101a of the surface plate 101 and extending along the second direction. This can improve the yield of the surface plate 101.

[0200] Furthermore, in the mounting table 100 according to the embodiment, the frame 102 has a third movable column 104d that is supported so as to be freely movable on the base 101. This allows the first holding unit 110 and the position measuring unit 130, which are fixed to the frame body 103, to be stably supported.

[0201] Furthermore, in the mounting table 100 according to this embodiment, the surface plate 101 and the frame 102 are made of stone, which can further improve the accuracy of position measurement by the position measurement unit 130.

[0202] In the mounting table 100 according to this embodiment, at least one of the first moving column 104b and the second moving column 104c is a semi-cylinder, which can further improve the accuracy of position measurement by the position measurement unit 130.

[0203] In addition, in the mounting table 100 according to this embodiment, at least one of the first moving column 104b and the second moving column 104c is a cylinder, which can further improve the accuracy of position measurement by the position measurement unit 130.

[0204] Furthermore, in the mounting table 100 according to the embodiment, at least one of the first moving column 104b and the second moving column 104c is coated with the lubricant A. This can further improve the accuracy of position measurement by the position measurement unit 130.

[0205] Moreover, the bonding apparatus 41 according to the embodiment includes the above-described mounting table 100, a first holding unit 110, and a second holding unit 120. The first holding unit 110 is fixed to the frame 102 and holds the first substrate W1 by suction from above. The second holding unit 120 is placed on the surface plate 101 and holds the second substrate W2 by suction from below. Moreover, the bonding apparatus 41 according to the embodiment bonds the first substrate W1 held by the first holding unit 110 and the second substrate W2 held by the second holding unit 120. This can improve the bonding accuracy between the first substrate W1 and the second substrate W2.

[0206] Furthermore, the bonding apparatus 41 according to the embodiment includes a plurality of displacement measuring units 140 that respectively measure displacement at a plurality of locations on the mounting table 100, and a control unit that controls each unit. When the frame 102 is installed on the surface plate 101, the control unit uses the plurality of displacement measuring units 140 to measure the parallelism and squareness of the mounting table 100. This can further improve the accuracy of position measurement by the position measuring unit 130.

[0207] Furthermore, the bonding apparatus 41 according to the embodiment includes a plurality of displacement measuring units 140 that respectively measure displacement at a plurality of locations on the mounting table 100, and a control unit that controls each unit. When bonding the first substrate W1 and the second substrate W2, the control unit uses the plurality of displacement measuring units 140 to measure the parallelism and squareness of the mounting table 100. This can further improve the accuracy of position measurement by the position measuring unit 130.

[0208] The bonding system 1 according to the embodiment includes a surface modification device 30 that modifies the surfaces of the first substrate W1 and the second substrate W2, a surface hydrophilization device 40 that hydrophilizes the modified surfaces of the first substrate W1 and the second substrate W2, and the above-described bonding device 41. This can improve the bonding accuracy of the first substrate W1 and the second substrate W2.

[0209] Although the embodiments of the present disclosure have been described above, the present disclosure is not limited to the above-described embodiments, and various modifications are possible without departing from the spirit of the present disclosure.

[0210] For example, in the above embodiment, an example has been shown in which the frame 102 has four pillars 104, but the present disclosure is not limited to such an example, and for example, of the four pillars 104, the third moving pillar 104d may be absent.

[0211] This reduces disturbances transmitted from the pillar 104 to the position measurement unit 130, thereby further improving the accuracy of position measurement by the position measurement unit 130.

[0212] Furthermore, in the above embodiment, an example has been described in which the mounting table 100 is provided in the bonding apparatus 41, but the present disclosure is not limited to such an example. For example, the mounting table 100 of the present disclosure may be provided in an apparatus that requires high accuracy in position measurement, such as an exposure apparatus or a machining apparatus. This also improves the accuracy of position measurement.

[0213] The disclosed embodiments should be considered in all respects as illustrative and not restrictive. Indeed, the above-described embodiments may be embodied in various forms. Furthermore, the above-described embodiments may be omitted, substituted, or modified in various ways without departing from the scope and spirit of the appended claims. [Explanation of symbols]

[0214] 1. Joint System 30 Surface modification equipment 40 Surface hydrophilization device 41 Joining equipment 100 Mounting table 101 Surface Plate 101a Top side 101b 1st information section 101c 2nd information section 101A First surface plate 101B Second base plate 102 frames 103 Frame 104 pillars 104a Fixed column 104b First Moving Column 104c 2nd moving column 104d 3rd moving column 105 1st pressing mechanism 110 First holding unit (an example of the second device) 120 second holding portion (an example of the first device) 140 Displacement measurement unit A Lubricant W1 First board W2 Second board

Claims

1. a base on which the first device is placed; a frame to which a second device is fixed and which is assembled on the surface plate; Equipped with the frame has a fixed column fixed to the base, and a first movable column and a second movable column movably supported on the base, The base has a first guide portion that allows the first moving column to move along a first direction, and a second guide portion that allows the second moving column to move along a second direction. Mounting stand.

2. The first direction and the second direction are orthogonal to each other and parallel or perpendicular to the drive axis of the first device. The stage according to claim 1 .

3. the first guide portion is a step located on an upper surface of the base and extending along the first direction, The second guide portion is a step located on the upper surface of the base and extending along the second direction. The mounting table according to claim 1 or 2.

4. The step is higher on the inside than on the outside of the top surface of the surface plate. The stage according to claim 3 .

5. The surface plate includes a first surface plate on which the first guide portion is provided, and a second surface plate on which the second guide portion is formed on the first surface plate. The mounting table according to claim 1 or 2.

6. a first pressing mechanism that presses the first moving column against the first guide portion; a second pressing mechanism that presses the second moving column against the second guide portion. The mounting table according to claim 1 or 2.

7. the first guide portion is a groove located on an upper surface of the base and extending along the first direction, The second guide portion is a groove located on the upper surface of the base and extending along the second direction. The mounting table according to claim 1 or 2.

8. The frame has a third movable column supported on the base plate so as to be movable without restriction. The mounting table according to claim 1 or 2.

9. The surface plate and the frame are made of stone. The mounting table according to claim 1 or 2.

10. At least one of the first moving column and the second moving column is a semi-cylindrical column. The mounting table according to claim 1 or 2.

11. At least one of the first moving column and the second moving column is a cylinder. The mounting table according to claim 1 or 2.

12. At least one of the first moving column and the second moving column is coated with a lubricant. The mounting table according to claim 1 or 2.

13. The mounting table according to claim 1 or 2; a first holding portion fixed to the frame and configured to suction-hold a first substrate from above; a second holding portion that is placed on the surface plate and that suction-holds a second substrate from below; Equipped with The first substrate held by the first holding unit and the second substrate held by the second holding unit are joined together. Bonding equipment.

14. a plurality of displacement measuring units that measure displacements at a plurality of locations on the mounting table; a control unit that controls each unit; Equipped with The control unit measures the parallelism and squareness of the mounting table using the plurality of displacement measuring units when the frame is installed on the surface plate. The joining device according to claim 13.

15. a plurality of displacement measuring units that measure displacements at a plurality of locations on the mounting table; a control unit that controls each unit; Equipped with The control unit measures the parallelism and perpendicularity of the mounting table using the plurality of displacement measuring units when bonding the first substrate and the second substrate. The joining device according to claim 13.

16. a surface modification device for modifying the surfaces of the first substrate and the second substrate; a surface hydrophilization device for hydrophilizing the modified surfaces of the first substrate and the second substrate; The joining device according to claim 13; A joining system comprising:

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