Method and apparatus for manufacturing segmented workpiece

Abstract

To provide a manufacturing method and a machining device of a divided workpiece capable of improving machining efficiency when dividing a workpiece having an element to be divided.SOLUTION: The method includes a placing step of placing a workpiece on a conveyor, the workpiece having an element to be divided which is an object to be divided and fixed to a support member, and a dividing step of dividing the workpiece into a plurality of divided workpieces by irradiating the workpiece placed on the conveyor with a laser beam.SELECTED DRAWING: Figure 6

Description

[Technical Field]

[0001] The present invention relates to a method for manufacturing divided processed products obtained by dividing a workpiece, and to a processing device for dividing a workpiece into divided processed products. [Background technology]

[0002] Device chips mounted on electronic devices such as mobile phones and personal computers are manufactured by processing semiconductor wafers.

[0003] A plurality of planned dividing lines (streets) are set in a grid pattern on one surface of the semiconductor wafer, and devices such as ICs (Integrated Circuits) are formed in each rectangular area defined by the planned dividing lines. The semiconductor wafer on which the devices have been formed is cut along each planned dividing line, thereby dividing the semiconductor wafer into a plurality of device chips.

[0004] For example, a laser processing device is used to divide a semiconductor wafer. The laser processing device includes an oscillator that emits a laser beam, a mirror that reflects the laser beam and guides it to a target area, and a focusing lens that focuses the laser beam onto a focal point.

[0005] In a laser processing device, a laser beam having a wavelength that is absorbed by a semiconductor wafer is emitted from an oscillator and irradiated along each planned dividing line of the semiconductor wafer, which is the workpiece. The laser beam is focused inside the semiconductor wafer by a focusing lens, and the semiconductor wafer is divided into multiple device chips by laser ablation. Examples of documents that describe technology related to such semiconductor wafer processing include Patent Document 1.

[0006] It should be noted that the objects to be processed by such laser processing devices are not limited to semiconductor wafers. For example, a molded body in which a plurality of device chips are sealed with a sealing material containing epoxy resin or the like and the device chips are continuously arranged in a plate or rod shape may also be the object of division processing.

[0007] Such a molded body is formed, for example, by electrically connecting a plurality of device chips to a semiconductor package substrate, sealing the plurality of device chips with a sealing material, and compression molding the molded body, which is then cut along predetermined division lines with a laser processing device to obtain individual device packages as divided processed products.

[0008] When dividing workpieces such as semiconductor wafers and molded bodies using a laser processing device, a chuck table is often used, which holds the workpiece by suction using negative pressure, for example. With the workpiece held on the chuck table, a laser beam is irradiated onto the workpiece while the laser beam irradiation unit and the chuck table are moved relative to each other.

[0009] With the focal point of the laser beam positioned on the extension of the planned dividing line on the workpiece, when the irradiation unit and the chuck table move relatively in the direction of the planned dividing line (when processing feed is performed), the laser beam is irradiated onto the workpiece along the planned dividing line.

[0010] Next, the irradiation unit and the chuck table are moved relative to each other in a direction perpendicular to the intended dividing line (indexing feed is performed). By indexing, the focal point of the laser beam is positioned on an extension of another intended dividing line adjacent to the previously processed intended dividing line. The irradiation unit and the chuck table are again moved relative to each other along the direction of this intended dividing line, and the laser beam is irradiated onto the workpiece along this intended dividing line.

[0011] In this way, when processing a workpiece by moving the laser beam irradiation unit and the chuck table relative to each other, during processing feed, for example, it is necessary to accelerate the chuck table, which is in a stationary state, to a predetermined speed, and then decelerate the holding table, which is moving at the predetermined speed, to make it stationary.

[0012] During this acceleration / deceleration in the processing feed, the workpiece cannot be processed. If the laser beam is irradiated onto the workpiece before the relative speed between the irradiation unit and the chuck table reaches a predetermined speed, the amount of irradiation of the laser beam on that part of the workpiece will be greater than the amount of irradiation on the part that would be irradiated with the laser beam when the relative speed reaches the predetermined speed, resulting in differences in the degree of processing between areas of the workpiece.

[0013] However, when machining along a plurality of planned dividing lines, if the irradiation unit and the chuck table are to be moved back and forth relative to each other, time for acceleration and deceleration inevitably occurs.

[0014] For example, the chuck table is moved from a stationary state (0 mm / s) to a predetermined speed (e.g., 1000 mm / s) at 1 G (9.8 m / s 2 ), it takes about 0.1 seconds to accelerate. A similar amount of time is required for deceleration. In other words, in laser processing, an extra time of about 0.2 seconds is required for each planned dividing line.

[0015] Furthermore, in semiconductor processing, multiple processing feeds may be performed for one planned dividing line. For example, if 20 processing feeds are performed for one planned dividing line (processing is performed with 20 passes), it takes about 4 seconds (= about 0.2 seconds × 20) for acceleration and deceleration per planned dividing line.

[0016] Furthermore, since one workpiece usually has multiple planned dividing lines, the above time is incurred for each planned dividing line. For example, if one workpiece has 48 planned dividing lines and 20 processing feeds are performed for each of them, an extra time of approximately 192 seconds (= approximately 4 seconds x 48) will be incurred due to acceleration and deceleration.

[0017] On the other hand, further improvements in production efficiency are required in the process of processing a workpiece using a laser processing device. [Prior art documents] [Patent documents]

[0018] [Patent Document 1] Japanese Patent Application Publication No. 2023-91141 Summary of the Invention [Problem to be solved by the invention]

[0019] The present invention has been made in view of the above problems, and has as its object to provide a manufacturing method and processing device for a divided product that can suitably perform dividing processing on a workpiece having a divided element. [Means for solving the problem]

[0020] According to another aspect of the present invention, there is provided a method for manufacturing a divided processed product, comprising: a loading step of loading a workpiece, which is provided with a divisible element that is the target of dividing processing and in which the divisible element is fixed to a support member, onto a conveyor; and a dividing step of irradiating a laser beam onto the workpiece while it is being placed on the conveyor and transported, thereby dividing the workpiece into a plurality of divided processed products.

[0021] According to one aspect of the present invention, there is provided a method for manufacturing a divided processed product, comprising: a loading step of loading a workpiece, which is provided with a divisible element that is the target of dividing processing and in which the divisible element is fixed to a support member, onto a conveyor; and a dividing step of irradiating the workpiece placed on the conveyor with a laser beam to divide the workpiece into a plurality of divided processed products.

[0022] Preferably, in the dividing step, the workpiece is divided, but the support member is not divided.

[0023] Preferably, in the dividing step, the direction in which the workpiece is moved by the conveyor is defined as a first direction, and the irradiation position of the laser beam is moved in a second direction intersecting the first direction.

[0024] Preferably, in the dividing step, the irradiation position of the laser beam moves in a first direction in which the workpiece is moved by the conveyor.

[0025] According to another aspect of the present invention, there is provided a processing device for divided processed products, characterized in that it comprises a conveyor having a transport surface on which a workpiece is placed, which transports the workpiece placed on the transport surface, and an irradiation mechanism which irradiates a laser beam onto the workpiece, and is configured to irradiate the laser beam onto the workpiece placed on the transport surface of the conveyor and while it is being transported, and to perform dividing processing on the divided elements of the workpiece.

[0026] Preferably, the irradiation mechanism is configured to move the irradiation position of the laser beam in a second direction intersecting with a first direction in which the workpiece is moved by the conveyor when irradiating the laser beam.

[0027] Preferably, the irradiation mechanism is configured such that, when irradiating the laser beam, the irradiation position of the laser beam moves in a first direction in which the workpiece is moved by the conveyor. [Effects of the Invention]

[0028] In one aspect of the present invention, a method for manufacturing a divided processed product is performed by placing the workpiece, in which the divided elements are fixed to a support member, on a conveyor and then dividing the workpiece, thereby reducing the time and effort required for the series of steps.

[0029] In addition, in a divided workpiece processing device according to another aspect of the present invention, even if the workpiece moves in a first direction as it is transported, the laser beam can be irradiated onto the workpiece to continue laser processing.

[0030] As a result, the divided product manufacturing method and processing device of the present invention can suitably divide a workpiece having a divided element. [Brief explanation of the drawings]

[0031] [Figure 1]FIG. 1(A) is a plan view of a workpiece according to the first embodiment, and FIG. 1(B) is a side view of the workpiece according to the first embodiment. [Figure 2] FIG. 2 is a front view schematically showing the configuration of the processing device (laser processing device) according to the first embodiment. [Figure 3] FIG. 3 is a side view schematically showing the laser processing device according to the first embodiment and the configuration of the optical system in the laser processing device. [Figure 4] FIG. 4 is a perspective view schematically showing a configuration of a part of the optical system in the laser processing apparatus of the first embodiment. [Figure 5] FIG. 5 is a flowchart illustrating an example of a procedure for manufacturing a divided processed product. [Figure 6] FIG. 6 is a side view for schematically explaining the flow of processing a workpiece in the laser processing device of the first embodiment. [Figure 7] FIG. 7 is a front view schematically showing another example of the arrangement of the optical system in the laser processing apparatus of the first embodiment. [Figure 8] FIG. 8 is a plan view of a workpiece according to the second embodiment. [Figure 9] FIG. 9 is a plan view of a workpiece according to the third embodiment. [Figure 10] FIG. 10 is a side view schematically showing the laser processing apparatus according to the second embodiment and the configuration of the optical system in the laser processing apparatus. DETAILED DESCRIPTION OF THE INVENTION

[0032] An embodiment of the present invention will be described with reference to the accompanying drawings. First, the shape of a workpiece to be processed as a target for dividing processing will be described. Fig. 1(A) is a plan view of a workpiece 2 according to a first embodiment, and Fig. 1(B) is a side view showing the shape of the workpiece 2 as viewed from below in Fig. 1(A).

[0033] The workpiece 2 of the first embodiment has a plurality of dividable elements 4, each of which is linear in plan view. The dividable elements 4 include, for example, a lead frame, a semiconductor package substrate, etc. Terminals 6 protrude from the side surfaces of the dividable elements 4 of this embodiment. Note that the terminals 6 do not necessarily have to protrude from the side surfaces of the dividable elements 4; for example, they may simply be exposed on the side surfaces of the dividable elements 4.

[0034] In each of the dividable elements 4, a plurality of electronic components 8 such as ICs are arranged along the longitudinal direction of the dividable element 4. Note that Fig. 1(A) representatively shows only two electronic components 8 located at different positions.

[0035] Each electronic component 8 is sealed with a molding resin such as epoxy resin. Each electronic component 8 itself is built into the dividable element 4 and is not exposed to the outside. The terminals 6 electrically connected to each electronic component 8 protrude from the side of the dividable element 4 as described above.

[0036] A plurality of planned division lines 10 are set at approximately equal intervals in the longitudinal direction (the up-down direction on the paper surface of FIG. 1(A)) on the upper surface of the dividable element 4. Each electronic component 8 is sandwiched between two planned division lines 10 on each side in the longitudinal direction of the dividable element 4.

[0037] The plurality of planned division lines 10 may or may not be drawn on the top surface of the dividable element 4. In the first embodiment, it is assumed that the planned division lines 10 are not drawn.

[0038] When the planned dividing lines 10 are not drawn, for example, alignment marks (not shown) separately provided on the workpiece 2 are used to virtually set a plurality of planned dividing lines 10 in a processing device (laser processing device) 20 described later. Note that for alignment, the shape of a specific part of the workpiece 2 (for example, the end of the dividable element 4, the terminal 6 exposed on the side surface of the dividable element 4, etc.) can also be used as an alignment mark.

[0039] The multiple dividable elements 4 are arranged approximately parallel to one another and at approximately equal intervals on the workpiece 2. These dividable elements 4 have one surface (the lower surface in the example shown in FIGS. 1(A) and 1(B); the far side in the plane of FIG. 1(A); the lower side in the plane of FIG. 1(B)) fixed to a support member 12.

[0040] The dividable element 4 and the support member 12 are bonded to each other by an adhesive layer 14 made of, for example, an ultraviolet-curing adhesive. Note that, as a mechanism for fixing the dividable element 4 to the support member 12, various adhesive resins and various other mechanisms that fix the dividable element 4 and the support member 12 to each other and allow them to be separated as needed can be used.

[0041] However, during the laser processing described below, if the material of the adhesive layer 14 absorbs the laser beam, the material may be modified, and the divided element 4 and the support member 12 may suddenly peel off. Therefore, it is preferable that the adhesive layer be made of a material that is transparent to the laser beam used in the laser processing.

[0042] It is desirable that the support member 12 is an article that will not be divided together with the divided element 4 during the dividing process using a laser beam, which will be described later.

[0043] For example, the support member 12 can be made of a material that is transparent to the laser beam that is irradiated onto the workpiece 2 for dividing it. For example, silicon dioxide, artificial sapphire (alumina), etc., have high transparency to laser beams with a wavelength of 1064 nm (a wavelength that is absorbed by the divided element 4 made of a resin or the like and that can be used for processing by laser ablation), so even when irradiated with the laser beam, the occurrence of ablation is suppressed compared to the divided element 4, and they are not divided together with the divided element 4, making them suitable materials for the support member 12.

[0044] Of course, depending on the wavelength and output of the laser beam, the internal condition of the support member 12 made of silicon dioxide, etc., it is possible that the laser beam may modify part of the inside of the support member 12. However, by adjusting the thickness of the support member 12, it is possible to prevent the support member 12 from being divided across its entire thickness, even if the laser beam is irradiated onto the support member 12 in the thickness direction, for example.

[0045] Here, "the support member 12 is not divided together with the dividable element 4" means that, for example, when laser processing is performed on the dividable element 4 throughout its thickness direction (the direction of irradiation with the laser beam) and the dividable element 4 is divided at that portion, the support member 12 adhered to the dividable element 4 is not cut throughout its thickness direction.

[0046] In this case, at the position of division by the laser beam, the divided elements 4 are divided into each other in a planar view (view from the direction of irradiation of the laser beam), but the support members 12 located at the back side as viewed from the direction of irradiation of the laser beam are not divided into each other and remain connected.

[0047] To put it more simply, "the support member 12 is not divided together with the dividable element 4" means that even if the dividable element 4 is divided by the laser beam, the support member 12 fixed to the dividable element 4 by the same laser beam is not divided, and the dividable elements 4 that have been divided from each other are connected to each other via the support member 12 fixed to the dividable element 4.

[0048] Furthermore, regardless of the material of the support member 12, it is possible to prevent the support member 12 from splitting along with the dividable element, for example, by having a sufficient thickness of the support member 12. In this case, for example, the material of the support member 12 can be various substances such as silicon dioxide and alumina as mentioned above, metal, ceramic, the same resin as the dividable element 4, silicon, etc.

[0049] For example, when laser processing is performed on the dividable element 4 by focusing a laser beam at the position of the dividable element 4, the illuminance of the laser beam decreases the further away from the focusing point. Therefore, if the laser beam is focused at an appropriate position during laser processing, the degree of processing on the support member 12 can be made smaller than the degree of processing on the dividable element 4, so that even if the dividable element 4 is divided, the support member 12 will not be divided.

[0050] Furthermore, if the support member 12 has a sufficient thickness (dimension in the direction of irradiation with the laser beam), even if the laser beam is absorbed by part of the support member 12 during processing, causing ablation, other parts will be spared from processing that causes ablation and will not result in splitting.

[0051] In this way, when division of the support member 12 is avoided, the thickness of the support member 12 may be, for example, about two times or more and ten times or less than the thickness of the dividable element 4 .

[0052] If the support member 12 is not thick enough, it may be divided along with the dividing process of the dividable elements 4, or the workpiece 2 may be warped or flexed, making it difficult to transport the dividable elements 4 after dividing. On the other hand, if the thickness is too large, the weight may increase, which may cause problems in handling, such as transportation. For this reason, the thickness of the support member 12 is appropriate within the range described above, for example.

[0053] Alternatively, it is also possible to scatter the laser beam on the surface of the support member 12. For example, the support member 12 may be made of a material containing a filler, which scatters the laser beam irradiated onto the surface of the support member 12. If the laser beam is scattered, the energy applied to the support member 12 from the laser beam is dispersed, thereby making it possible to suppress modification of the support member 12 by the laser beam.

[0054] In this case, the support member 12 can be made of alumina ceramic, for example. Alternatively, the surface of the support member 12 made of metal, for example, can be roughened to scatter the laser beam.

[0055] Furthermore, it is preferable that the support member 12 is a plate-like member having sufficient thickness and rigidity, rather than a dicing tape or the like that is generally used to hold semiconductor wafers, for the convenience of handling the divided products (device packages) 16 and the workpiece 2 after the dividing process of the dividable elements 4.

[0056] When the workpiece 2 as described above is subjected to laser processing, which will be described later, and the plurality of dividable elements 4 provided on the workpiece 2 are divided along each of the planned dividing lines 10, a plurality of device packages (i.e., semiconductor devices) 16 are separated from each of the dividable elements 4. In other words, each of the planned dividing lines 10 functions as a mark line for dividing the workpiece 2 into the plurality of device packages 16.

[0057] The device package 16 is, for example, an SOP (Small Outline Package), but is not limited to this and may be a semiconductor device other than an SOP.

[0058] Note that Figure 1(A) illustrates an example in which the positions of the planned dividing lines 10 in the longitudinal direction (the vertical direction on the paper surface of Figure 1(A)) of multiple linear divisible elements 4 provided on the workpiece 2 are aligned with each other between the divisible elements 4, but the arrangement of the divisible elements 4 is not limited to this example.

[0059] For example, the position of the planned dividing line 10 in the longitudinal direction of some of the dividable elements 4 may be shifted from the position of the planned dividing line 10 in the longitudinal direction of other dividable elements 4. In this case, the dividable elements 4 can be correctly divided along each planned dividing line 10 by adjusting the irradiation position of the laser beam during laser processing, which will be described later.

[0060] Next, the configuration of the processing apparatus (laser processing apparatus) 20 according to the first embodiment is shown in Figs. 2 to 4. Fig. 2 is a front view schematically showing the configuration of the laser processing apparatus 20. Fig. 3 is a side view schematically showing the configuration of the laser processing apparatus 20 and an optical system 30 provided in the laser processing apparatus 20. Fig. 4 is a perspective view schematically showing the configuration of a part of the optical system 30.

[0061] 2 to 4, the X-axis, Y-axis, and Z-axis represent three mutually orthogonal directions in three-dimensional space. The XY plane defined by the X-axis and Y-axis is parallel to the horizontal plane, and the Z-axis is parallel to the vertical direction.

[0062] The laser processing device 20 includes a conveyor 22 that supports and transports the workpiece 2, and an irradiation mechanism 24 that performs dividing processing on the workpiece 2 transported by the conveyor 22 using a laser beam.

[0063] The conveyor 22 transports the workpiece 2 and the device packages 16 obtained by dividing the dividable elements 4 that make up the workpiece 2 in a direction along the Y axis. The irradiation mechanism 24 irradiates the workpiece 2 being transported by the conveyor 22 with a laser beam in a direction along the Z axis (downward) to divide the dividable elements 4.

[0064] Here, the term "divided product" as used in this specification refers to an article obtained as a result of dividing a workpiece by laser processing, such as an individual device package 16. Of course, the divided product is not limited to the individual device package 16. For example, the divided product may be an article in the form of a plurality of device chips connected together, or it may not be a device chip.

[0065] The term "conveyor" refers to a mechanism that supports and transports items such as the workpiece 2 and divided processed products (device packages) 16 on its upper surface. The conveyor 22 may be, for example, a belt conveyor or a roller conveyor. Considering that laser processing is to be performed, a belt conveyor that can suppress vertical movement is considered to be preferable as the conveyor 22 provided in the laser processing device 20, but a roller conveyor may also be used depending on the required accuracy, the roller diameter, and other device configurations.

[0066] In this specification, expressions such as "along the Z direction" and "along the XY plane" are used, but these do not necessarily mean that the direction of an object or its movement, the angle of a light ray, etc., strictly coincide with or are parallel to these axes or planes. For example, they may be at a slight angle to each other but generally point in the same direction, or the direction of an object or its movement, the angle of a light ray, etc., may include a directional component.

[0067] The irradiation mechanism 24 is provided above the transport surface 22a of the conveyor 22. The irradiation mechanism 24 includes a laser oscillator 26 as a light source device, and an optical system 30 that guides a laser beam 28 emitted from the laser oscillator 26 to an area (irradiated portion) where the workpiece 2 is located.

[0068] The laser oscillator 18 is a device that generates and emits a laser beam by oscillating a laser such as a YAG laser, a YVO4 laser, or a YLF laser. The emitted laser beam 28 is guided by an optical system 30 to the irradiated portion where the workpiece 2 is located, and is irradiated onto the workpiece 2.

[0069] The optical system 30 is configured to include a plurality of optical elements provided on the optical path of the laser beam 28, and these optical elements control the traveling direction, shape, focusing position, etc. of the laser beam 28.

[0070] The optical system 30 in the first embodiment includes, as optical elements, a first position adjustment mechanism 32, a second position adjustment mechanism 34, mirrors 36A, 36B, 36C, and a condenser lens 38. The condenser lens 38 is incorporated into an irradiation unit 40 that is provided so as to be movable in the X and Y directions.

[0071] The first position adjustment mechanism 32 is a mechanism for adjusting the direction of the laser beam 28, such as an acousto-optic deflector (AOD), an electro-optic deflector (EOD), an optical MEMS (Micro Electro Mechanical Systems), or a galvanometer scanner, and has the function of refracting the laser beam 28 emitted from the laser oscillator 26 and adjusting its position.

[0072] In the case of the laser processing apparatus 20 of the first embodiment, the workpiece 2 is transported along the Y direction on the conveyor 22, and a laser beam 28 is emitted upward along the Z direction from a laser oscillator 26 provided in the irradiation mechanism 24. The first position adjustment mechanism 32 refracts the upward-moving laser beam 28 along the YZ plane, thereby deflecting the optical path of the laser beam 28 downstream from the first position adjustment mechanism 32 in the Y direction, thereby adjusting the irradiation position of the laser beam 28 on the workpiece 2 in the Y direction.

[0073] In addition to the examples given above, various optical mechanisms can be employed as the first position adjustment mechanism 32 as long as they can suitably adjust the irradiation position of the laser beam 28.

[0074] A laser beam emitted from the laser oscillator is reflected by a plurality of mirrors A, B, and C and is guided to a second position adjustment mechanism .

[0075] The second position adjustment mechanism 34 is, for example, a polygon mirror. The second position adjustment mechanism 34, which is a polygon mirror, is a polyhedron having an axis oriented along the Y direction, and a plurality of side surfaces forming surfaces approximately parallel to the Y direction are configured to reflect the laser beam 28. The second position adjustment mechanism 34, which is a polygon mirror, is configured to rotate around a rotation axis provided along the Y direction by the power of a motor or the like (not shown).

[0076] 3, in the optical system 30 of the laser processing apparatus 20 of the first embodiment, the laser beam 28 emitted from the laser oscillator 26 passes through the first position adjustment mechanism 32, is reflected in order by mirrors 36A to 36C, and is then guided to the second position adjustment mechanism 34. The mirrors 36A to 36C are reflective optical elements. For example, dielectric multilayer film mirrors or the like can be used as the mirrors 36A to 36C.

[0077] 2 to 4, laser beam 28 emitted upward from laser oscillator 26 first passes through first position adjustment mechanism 32, where its angle along the YZ plane with respect to the Z axis is changed as necessary, and then travels to mirror 36A provided above first position adjustment mechanism 32, where it is reflected by mirror 36A and travels in the X direction. Mirror 36B is located in the direction in which laser beam 28 reflected from mirror 36A travels, and laser beam 28 is reflected by mirror 36B and travels downward.

[0078] A mirror 36C is positioned below the mirror 36B, and the laser beam 28 is reflected by the mirror 36C and enters the second position adjustment mechanism 34, which is a polygon mirror, and is reflected by the mirror surface of the second position adjustment mechanism 34 and directed downward.

[0079] In the second position adjustment mechanism 34, which is a polygon mirror, the mirror surface forming the side surface of the rectangular pillar rotates in a direction along the XZ plane. When the laser beam 28 is incident on a certain position at the bottom of the rotating second position adjustment mechanism 34 in the X direction, it is reflected downward, and the angle of the reflected laser beam 28 varies within a certain range depending on the angle of the mirror surface at that time. As a result, the laser beam 28 incident on the side surface of the second position adjustment mechanism 34 is deflected at various angles in the X direction after reflection.

[0080] The laser beam 28 reflected by the second position adjustment mechanism 34 enters the irradiation unit 40 provided below the second position adjustment mechanism 34, passes through a condenser lens 38 built into the irradiation unit 40, and is irradiated onto the workpiece 2 located below. The condenser lens 38 is, for example, an fθ lens, and is configured to condense the laser beam 28 and irradiate it onto the workpiece 2.

[0081] The laser beam 28 incident on the focusing lens 38 is refracted by the focusing lens 38 and focused at the target position (for example, inside the element 4 to be divided in the workpiece 2, at the portion on its upper surface where the planned dividing line 10 is set).

[0082] Thus, in the optical system 30 of the laser processing apparatus 20 of the first embodiment, the direction of the laser beam 28 emitted from the laser oscillator 26 is first adjusted in the Y direction by the first position adjustment mechanism 32. Next, the laser beam 28 is guided by mirrors 36A to 36C to the second position adjustment mechanism 34, where the direction of the laser beam 28 is adjusted in the X direction, and the laser beam 28 is irradiated from the condenser lens 38 onto the workpiece 2 so as to scan in the X direction.

[0083] In this way, in the laser processing apparatus 20 of the first embodiment, the direction in which the workpiece 2 moves by the conveyor 22 (direction along the Y-axis) is defined as the first direction, and the direction intersecting (orthogonal to) the first direction (direction along the X-axis) is defined as the second direction, and the irradiation position of the laser beam 28 is moved by the first position adjustment mechanism 32 in the first direction, and the irradiation position of the laser beam 28 is moved by the second position adjustment mechanism 34 in the second direction.

[0084] Explaining this in relation to the workpiece 2 of the first embodiment shown in Fig. 1(A), when a laser beam 28 (Figs. 2 to 4) is irradiated onto the division lines 10 that are arranged at equal intervals in the vertical direction (Y direction) on the plane of Fig. 1(A) and each extend in the horizontal direction (X direction) on the upper surface of the dividable element 4, which division line 10 the laser beam 28 is to be irradiated onto is adjusted by the refraction of the laser beam 28 in the first position adjustment mechanism 32. Then, the angle of the laser beam 28 is changed by the rotation of the second position adjustment mechanism 34, so that the laser beam 28 is irradiated onto each division line 10 so as to scan in the X direction.

[0085] There is no limitation on the type of optical elements that make up the optical system 30, and any appropriate optical elements can be used as long as they can properly guide the laser beam 28 to the irradiated area. For example, the optical system 30 may include optical elements other than those listed above, such as an optical scanner, an output adjuster, a mirror or lens, a polarizing beam splitter (PBS), a diffractive optical element (DOE), or an LCOS-SLM (Liquid Crystal On Silicon - Spatial Light Modulator).

[0086] For example, the above-mentioned optical system 30 has been described as including a first position adjustment mechanism 32, which is an acousto-optic deflector or the like that refracts the laser beam 28 to adjust its direction, as a mechanism for adjusting the irradiation position of the laser beam 28 in the Y direction. However, it is also conceivable that the optical system 30 may additionally include a beam splitter that splits the laser beam 28 into multiple beams, and these multiple beams of laser beam 28 may be simultaneously irradiated onto multiple planned division lines 10 in the Y direction.

[0087] As will be described later, it is also possible to irradiate different areas in the X direction with the laser beam 28 split into multiple beams by a beam splitter, thereby expanding the area that can be irradiated with the laser beam 28 in the X direction.

[0088] The irradiation unit 40 incorporating the condenser lens 38 is configured to be movable up and down along the Z direction by a movement mechanism (not shown), thereby enabling the position of the focal point of the laser beam 28 formed by the condenser lens 38 to be adjusted up and down.

[0089] Furthermore, the irradiation unit 40 or a part or all of the optical system 30 including the irradiation unit 40 is configured to be movable in the X and Y directions by a movement mechanism (not shown), thereby making it possible to adjust the irradiation position of the laser beam 28 on the workpiece 2 on the conveying surface 22a (particularly, the position where irradiation starts) in the X and Y directions.

[0090] Various mechanisms can be conceived as a mechanism for moving the irradiation unit 40 and part or all of the optical system 30 in the Z direction and the X and Y directions. For example, a mechanism can be conceived in which a ball screw is rotated by a pulse motor, and an object such as the irradiation unit 40 attached to the ball screw via a nut is moved along the axial direction of the ball screw.

[0091] Of course, any suitable mechanism can be adopted as the movement mechanism (not shown) as long as it can appropriately adjust the positions of the irradiation unit 40 and part or all of the optical system 30.

[0092] A detection unit 42 for detecting the position of the workpiece 2 is provided adjacent to the irradiation unit 40. The detection unit 42 includes a microscope camera (not shown) having a light source such as an LED (Light Emitting Diode), an objective lens, and a solid-state image sensor (light receiving element) such as a CCD (Charge-Coupled Device).

[0093] A microscope camera is, for example, a two-dimensional camera (area camera) in which multiple light-receiving elements are arranged regularly in the vertical and horizontal directions, but it may also be a one-dimensional camera (line camera) in which multiple light-receiving elements are arranged in a row in a predetermined direction.

[0094] In the laser processing apparatus 20 of this first embodiment, the controller 50, which will be described later, determines the position in the XY direction of the planned division line 10 that has already been set or will be set on the workpiece 2 based on the image obtained by the microscope camera of the detection unit 42.

[0095] The housing of the detection unit 42 is attached to the laser processing apparatus 20 by a mechanism (not shown) so as to be movable in the X and Y directions. The detection unit 42 may be configured to move in the X and Y directions independently of part or all of the optical system 30, or may be configured to move in the X and Y directions together with part or all of the optical system 30.

[0096] The detection unit 42 may be provided with, for example, a fiber sensor instead of a microscope camera. The fiber sensor has a light source, a light receiving element, an optical fiber, etc. When a fiber sensor is used, the position of the end of the dividable element 4 in the longitudinal direction is identified by irradiating light from a light source (not shown) via the fiber sensor onto the workpiece 2 and receiving the light reflected from the workpiece 2 with the light receiving element via the fiber sensor.

[0097] The operation of each part that constitutes the laser processing apparatus 20, such as the conveyor 22, the irradiation mechanism 24, the detection section 42, the movement mechanism (not shown) for the irradiation unit 40 and the optical system 30, and the movement mechanism (not shown) for the detection section 42, is controlled by the controller 50.

[0098] The controller 50 is configured by a computer having a processor 50a, such as a CPU (Central Processing Unit), and a memory 50b. The memory 50b includes a main storage device such as a DRAM (Dynamic Random Access Memory) and an auxiliary storage device such as a flash memory.

[0099] The auxiliary storage device stores software. The functions of the controller 50 are realized by operating the processor 50a and the like in accordance with this software. The auxiliary storage device stores, for example, a first program for detecting the relative position of the focal point of the laser beam 28 and the workpiece 2 in the X and Y directions.

[0100] The first program is a program for performing image processing, and by executing the first program by the processor 50a, image processing is performed on the image obtained using the detection unit 42. The alignment mark is identified by the image processing.

[0101] For example, if the planned dividing line 10 is not drawn on the top surface of the dividable element 4 (see FIG. 1(A)), the workpiece 2 is imaged with the microscope camera of the detection unit 42 to obtain images of alignment marks (not shown) provided on the dividable element 4, excess areas of the dividable element 4 (ends of the dividable element 4 where electronic components 8 are not provided), etc. Next, the positions (coordinates) of the alignment marks, etc. on the XY plane are identified by image processing.

[0102] The positional relationship between the alignment marks and each of the planned dividing lines 10 is determined in advance for each of the dividable elements 4, so if the position of the alignment marks can be identified, the controller 50 can identify the position of each of the planned dividing lines 10.

[0103] When a fiber sensor is used in place of a microscope camera in the detection unit 42, the end of the fiber sensor that serves as the light entrance and exit is moved in the XY direction while light is irradiated from the fiber sensor onto the workpiece 2 and the fiber sensor receives the reflected light from the workpiece 2.

[0104] The controller 50 identifies, for example, the position of the end of the dividable element 4 based on the change in the amount of reflected light obtained through the fiber sensor. In this case, the auxiliary storage device stores a second program for identifying the position of the end of the dividable element 4 based on the change in the amount of reflected light.

[0105] The reflectance of the light in a predetermined wavelength band irradiated from the light source is determined depending on the material of the object. Therefore, by moving the detection unit 42 in the X and Y directions while irradiating the workpiece 2 with light, the position of the end of the divided element 4, etc., can be identified based on the change in the amount of reflected light.

[0106] Since the positional relationship between the end of the dividable element 4 and the planned dividing lines 10 is predetermined according to the dividable element 4, the controller 50 can identify the position of each planned dividing line 10 if it can identify the position of the end of the dividable element 4.

[0107] In this way, the controller 50 uses the detection unit 42 to identify the position of the workpiece 2 and the position of the planned dividing line 10 on the workpiece 2. Based on this, the controller 50 controls the irradiation position of the laser beam 28 in the X and Y directions.

[0108] It is also possible to adjust the position of the irradiation unit 40 in the Z direction using the detection unit 42. For example, if the detection unit 42 is equipped with a microscope camera or the like, the relative positional relationship between the workpiece 2, which is the target object, and the detection unit 42 can be grasped using the focal length of the microscope camera.

[0109] For example, an alignment mark (not shown) on the top surface of the workpiece 2 can be imaged using a microscope camera or the like of the detection unit 42, and the distance in the Z direction between the top surface of the workpiece 2 and the detection unit 42 can be determined from the focal length when the alignment mark is in focus.

[0110] Based on this, the controller 50 adjusts the distance in the Z direction of the irradiation unit 40 relative to the workpiece 2 and controls the laser beam 28 to be focused at an appropriate position relative to the workpiece 2.

[0111] Next, a procedure for processing the workpiece 2 to manufacture a plurality of divided processed products (device packages) 16 from the workpiece 2 will be described with reference to Figures 5 and 6. Figure 5 is a flowchart illustrating an example of a procedure for manufacturing divided processed products. Figure 6 is a side view that schematically illustrates the flow of processing the workpiece 2 (manufacturing the device packages 16) in the laser processing device 20.

[0112] The procedure shown in FIG. 5 includes a supporting step (step S10), a placing step (step S20), a transporting step (steps S30, S60), a positioning step (step S40), and a processing step (step S50).

[0113] First, the dividable element 4 constituting the workpiece 2 is fixed to the support member 12 (supporting step; step S10). The dividable element 4 and the support member 12 are bonded together by an adhesive layer .

[0114] Next, the workpiece 2 with the support member 12 adhered thereto is placed on the conveyor 22 (placement step; step S20). As shown on the right side of Fig. 6, the unprocessed workpiece 2 (to be subjected to dividing processing) is placed on the conveying surface 22a of the conveyor 22. The workpiece 2 placed on the conveying surface 22a is conveyed from right to left in Fig. 6 by the operation of the conveyor 22 (conveying step; step S30).

[0115] When the workpiece 2 reaches a position where it can be processed by the irradiation mechanism 24 (a position below the irradiation unit 40), an alignment step (step S40) is performed (see FIG. 6; second from the right). The operation of the conveyor 22 is temporarily stopped, and the position of the stationary workpiece 2 is detected using the detection unit 42 and the alignment mark as described above.

[0116] Based on the detected position information, the position of the irradiation unit 40 in the XY and Z directions is adjusted by a moving mechanism (not shown) as necessary. Also, a planned division line 10 is set for the dividable element 4.

[0117] Next, the processing step (step S50) is performed (see FIG. 6; second from the right). Laser beam 28 is emitted from laser oscillator 26, passes through a path formed by first position adjustment mechanism 32, mirrors 36A to 36C, and second position adjustment mechanism 34, enters irradiation unit 40, and is irradiated onto workpiece 2 through condenser lens 38.

[0118] At this time, the irradiation position of the laser beam 28 on the workpiece 2 is adjusted in the Y direction by a first position adjustment mechanism 32 such as an acousto-optic deflector. Meanwhile, the laser beam 28 is scanned in the X direction by a second position adjustment mechanism such as a polygon mirror. In this way, the laser beam 28 is irradiated onto the dividable element 4 along the planned dividing line 10 set on the dividable element 4, and the dividable element 4 is divided along the planned dividing line 10.

[0119] When processing of one planned dividing line 10 by the laser beam 28 is completed, the processing object moves to the adjacent planned dividing line 10. At this time, for example, the controller 50 or an operator may operate the conveyor 22 to move the workpiece 2 side in the Y direction by the distance of the planned dividing line 10, or a moving mechanism (not shown) may move a part or the entire irradiation unit 40 or the optical system 30 in the Y direction by the distance of the planned dividing line 10.

[0120] Alternatively, depending on the adjustment range of the first position adjustment mechanism 32 (the range of angles over which the direction of the laser beam 28 can be changed), it is also possible to move the irradiation position of the laser beam 28 in the Y direction by the distance between the planned division lines 10 by adjusting the optical path of the laser beam 28 using the first position adjustment mechanism 32.

[0121] Furthermore, by appropriately combining these methods, the irradiation position of the laser beam 28 on the workpiece 2 may be adjusted. At this time, if necessary, alignment using the alignment mark and the detection unit 42 may be performed again.

[0122] It should be noted that the irradiation of the laser beam 28 is stopped from the time when processing along one division line 10 is completed until processing along the adjacent division line 10 is started.

[0123] The irradiation position of the laser beam 28 is moved to the adjacent dividing line 10, and dividing processing is performed by the laser beam 28 along the adjacent dividing line 10. This process is repeated, and the divided element 4 is manufactured into a device package 16, which is a divided product.

[0124] Here, the dividable elements 4 are fixed to the support member 12, and the support member 12 is not divided during the processing step. Therefore, the dividable elements 4 that have undergone the processing step are themselves divided into individual device packages 16, but are still connected to each other via the support member 12.

[0125] The conveyor 22 operates again, and the transport step (step S60) is executed. The workpiece 2 that has been divided is transported to the left side of FIG. 6 by the conveyor 22 (second from the left and leftmost in the drawing). Furthermore, the workpiece 2 is transferred to another device or the like by another transport mechanism (robot arm, etc.).

[0126] Here, since the support member 12 fixed to the dividable element 4 is not divided, when the workpiece 2 is handled by a conveying mechanism or the like other than the conveyor 22, the dividable element 4 divided into multiple device packages 16 can be handled as a single item (workpiece 2) including multiple device packages 16, which are divided processed products.

[0127] As mentioned above, it is preferable that the support member 12 is a plate-like material having sufficient thickness and rigidity, rather than dicing tape, etc. When such a material is used as the support member 12, warping or bending is less likely to occur in the portions of the workpiece 2 where the divided elements 4 and divided products (device packages) 16 are held, compared to when a flexible material such as dicing tape is used, and stable transportation is possible.

[0128] The other apparatus to which the workpieces 2 are transferred from the conveyor 22 is, for example, a die bonding apparatus. In this case, the device packages 16 fixed to the support member 12 via the adhesive layer 14 are individually removed from the adhesive layer 14 in the die bonding apparatus.

[0129] In the above-described laser processing apparatus 20 and the method for manufacturing the device package 16 using the laser processing apparatus 20, the workpiece 2 placed on the conveying surface 22a of the conveyor 22 is scanned with the laser beam 28 in the X direction to process the workpiece 2 along the planned dividing line 10.

[0130] For example, in the conventional method in which a holding table that holds the workpiece moves in the processing feed direction relative to an irradiation unit equipped with a focusing lens, laser processing is performed along the planned division line. This method has the drawback of requiring extra time for acceleration and deceleration associated with the back and forth movement of the holding table.

[0131] In contrast, in the laser processing apparatus 20 of the first embodiment described above, by using the second position adjustment mechanism 34 and scanning the laser beam 28 along the planned dividing line 10, laser processing can be performed on the divided element 4 along the planned dividing line 10 without moving the workpiece 2 relative to the irradiation unit 40.

[0132] In other words, there is no need to move the workpiece 2 back and forth in the processing feed direction, which saves the extra time that occurs when accelerating and decelerating the workpiece 2 and the holding table that holds it, thereby improving the production efficiency of the device package 16.

[0133] Furthermore, in the above procedure, processing with the laser beam 28 is performed with the workpiece 2 placed on the conveyor 22. In conventional laser processing, the workpiece 2 is generally held in a holding mechanism (holding table) called a chuck table that holds the workpiece by suction using negative pressure, but the procedure using the laser processing device 20 of the first embodiment described above does not require the effort of transferring the workpiece to the holding table and applying negative pressure, or releasing the negative pressure to remove the workpiece from the holding table, thereby further reducing the time and effort involved in the series of steps.

[0134] Here, in the laser processing, the dividable element 4 is divided, but it is important that the support member 12 fixed to the dividable element 4 is not divided. Even after the dividable element 4 is divided into a plurality of device packages 16, the device packages 16 remain connected to each other by the support member 12, which makes it easy to handle the workpiece 2 after processing and allows for smooth transportation.

[0135] It should be noted that the processing step (step S40) of the above-described procedure can also be performed while operating the conveyor 22. In that case, since the workpiece 2 moves in the Y direction during processing, the irradiation position of the laser beam 28 in the Y direction on the workpiece 2 can be moved in the Y direction at the same speed in accordance with the movement, for example, by the first position adjustment mechanism 32. This makes it possible to continue laser processing of the same planned dividing line 10 even if the workpiece 2 moves in the first direction (along the Y direction) as the conveyor 22 operates.

[0136] In this case, once processing along one planned dividing line 10 is completed, the optical path of the laser beam 28 is adjusted, for example, by the first position adjustment mechanism 32, and the irradiation position is moved to the adjacent planned dividing line 10 located behind in the conveying direction of the workpiece 2, and then processing is performed along the adjacent planned dividing line 10 while again moving the irradiation position of the laser beam 28 in the Y direction in conjunction with the movement of the workpiece 2 due to the operation of the conveyor 22.

[0137] In this way, there is no need to stop the conveyor 22 while laser processing is being performed on the workpiece 2, which reduces the time required to accelerate and decelerate the conveyor 22 and further improves productivity in manufacturing the device package 16.

[0138] Here, when moving the irradiation position of the laser beam 28 in the Y direction, instead of adjusting the optical path using the first position adjustment mechanism 32, it is also possible to move the irradiation unit 40 or part or all of the optical system 30 including it using a moving mechanism not shown.

[0139] However, doing so would require the irradiation unit 40 or the optical system 30 to reciprocate in the Y direction in order to sequentially perform processing along the multiple planned division lines 10. This may require the conveyor 22 to temporarily stop operating and therefore to perform positioning accordingly.

[0140] In any case, however, the time required for the reciprocating motion accompanying the processing feed (movement along the X direction) can be saved.

[0141] Furthermore, when considering performing laser processing without stopping the operation of the conveyor 22 as much as possible, it is theoretically possible to perform the alignment process (step S40) without stopping the conveyor 22, for example, by synchronizing the movement of the detection unit 42 with the operation of the conveyor 22.

[0142] 7 shows a modified example of the optical system 30 in the laser processing apparatus 20 of the first embodiment. FIG. 7 is a front view schematically showing another example of the arrangement of the optical system 30 in the laser processing apparatus 20.

[0143] In the laser processing device 20 and the optical system 30, the laser beam 28 is scanned in the X direction by the second position adjustment mechanism 34 which is a polygon mirror, but there is a limit to the range that can be scanned by one polygon mirror 34. Depending on conditions such as the configuration of the second position adjustment mechanism 34 which is a polygon mirror, the dimensions of the workpiece 2, and the distance between the second position adjustment mechanism 34 and the workpiece 2, it may be impossible to irradiate the entire planned division line 10 set along the X direction with the laser beam 28 by scanning with one polygon mirror.

[0144] In such a case, as shown in FIG. 7, a plurality of polygon mirrors (second position adjustment mechanisms) 34 may be provided in the X direction, and each second position adjustment mechanism 34 may scan the laser beam 28 in a different area in the X direction, thereby irradiating each planned division line 10 over the entire X direction.

[0145] In this case, for example, a laser beam 28 emitted from one laser oscillator can be split into multiple beams by a beam splitter or the like (the beam splitter and the like are not shown), and each of the split laser beams 28 can be incident on the second position adjustment mechanism 34. Of course, it is also possible to guide the laser beams 28 emitted from multiple laser oscillators to the second position adjustment mechanism 34, respectively.

[0146] The condenser lens 38 and the irradiation unit (not shown in FIG. 7) incorporating the condenser lens 38 may also be provided for each second position adjustment mechanism 34.

[0147] 8 and 9 show workpiece 2 in a form different from that of workpiece 2 of the first embodiment shown in Fig. 1(A) and Fig. 1(B), respectively. Fig. 8 and Fig. 9 are plan views of workpiece 2 according to second and third embodiments, respectively.

[0148] In the workpiece 2 of the first embodiment shown in Figures 1(A) and 1(B), the linear dividable elements 4 are arranged parallel to each other at a fixed interval, and the planned division lines 10 are set in a direction perpendicular to the longitudinal direction of these dividable elements 4. In the workpiece 2 of the second embodiment shown in Figure 8, the planned division lines 10 are set parallel to each other for the dividable elements 4 in the shape of a square plate, so that the dividable elements 4 are divided into linear divided products 16. A support member 12 is fixed to the underside of the dividable elements 4 (the back side in the plane of Figure 8).

[0149] In this way, even in the case of dividing the plate-shaped dividable element 4 linearly, the divided product 16 can be manufactured using the laser processing device 20 in the same manner as in the above-described procedure.

[0150] Furthermore, the support member 12 fixed to the dividable element 4 is not divided even when the dividable element 4 is divided by laser processing, and even after the dividable element 4 is divided, the workpiece 2 and the multiple divided processed products 16 can be handled as a single item in which the multiple divided processed products 16 are fixed to the support member 12.

[0151] Furthermore, after such dividing processing is performed, the orientation of the workpiece 2 can be changed to become the workpiece 2 shown in FIG.

[0152] In the workpiece 2 of the third embodiment shown in Fig. 9, linear divided products 16 obtained by dividing the plate-shaped dividable element 4 in the workpiece 2 of the second embodiment shown in Fig. 8 are used as the dividable elements 4, which are then further divided by laser processing to obtain the individual divided products 16. In the workpiece 2 of the third embodiment, the planned division lines 10 are set in a direction perpendicular to the longitudinal direction of the linear dividable elements 4.

[0153] For example, after dividing the workpiece 2 of the second embodiment shown in FIG. 8 using the laser processing device 20, the orientation of the workpiece 2 may be changed and the laser processing device 20 may divide the workpiece 2 in the same manner.

[0154] In this case, for example, another laser processing device 20 may be provided at a stage subsequent to the laser processing device 20 of the first embodiment described above, and the orientation of the workpiece 2 may be changed between the first-stage laser processing device 20 and the second-stage laser processing device 20 to perform continuous laser processing, or after the first processing of the workpiece 2 by the laser processing device 20 is completed, the orientation of the same workpiece 2 may be changed and processing may be performed again by the same laser processing device 20.

[0155] 10 is a side view schematically showing the laser processing apparatus 20 according to the second embodiment and the configuration of the optical system 30 in the laser processing apparatus 20. The configuration of the laser processing apparatus 20 according to the second embodiment is generally similar to that of the laser processing apparatus 20 according to the first embodiment (see FIGS. 2 to 4), except for the orientation of the irradiation mechanism 24 relative to the conveyor 22.

[0156] In the laser processing apparatus 20 according to the second embodiment, the workpiece 2 is placed on the conveying surface 22a so that the direction of the planned dividing line 10 (see FIG. 1) on the workpiece 2 is aligned with the conveying direction (direction Y) of the conveyor 22. That is, the direction of the workpiece 2 differs by 90° in plan view from the case of processing by the laser processing apparatus 20 according to the first embodiment.

[0157] In the first position adjustment mechanism 32, which is an acousto-optic deflector or the like, the irradiation position of the laser beam 28 is adjusted in the X direction (the direction perpendicular to the paper surface of FIG. 10), and in the second position adjustment mechanism 34, which is a polygon mirror, the laser beam 28 is scanned in the Y direction and irradiated onto the workpiece 2.

[0158] In the first position adjustment mechanism 32, the irradiation position of the laser beam 28 in the X direction is aligned with the target planned dividing line 10 (the multiple planned dividing lines set on the upper surface of the workpiece 2 extend left and right with respect to the plane of FIG. 10 and are arranged parallel to each other in a direction perpendicular to the plane of FIG. 10), and in the second position adjustment mechanism 34, the laser beam 28 is irradiated along the target planned dividing line 10 extending in the Y direction. Note that the planned dividing lines of the workpiece 2 are not shown in FIG. 10.

[0159] Even if the position of the irradiation mechanism 24 relative to the conveyor 22 and the orientation of the planned dividing line on the workpiece 2 are set in this manner, it is possible to divide the divided elements 4 (see Figure 1) on the workpiece 2 using a procedure generally similar to that of the first embodiment described above.

[0160] Furthermore, when dividing a single workpiece 2 along planned dividing lines 10 in different directions, such as when the workpiece 2 of the second embodiment shown in FIG. 8 is processed and then the workpiece 2 is processed as the workpiece 2 of the third embodiment shown in FIG. 9, it is possible to perform the dividing process in the following procedure: for example, with respect to the conveying direction by the conveyor 22, the first stage is provided with an irradiation mechanism 24 oriented in the same direction as the second embodiment shown in FIG. 10, and the second stage is provided with an irradiation mechanism 24 oriented in the same direction as the first embodiment shown in FIGS. 2 to 4, and the first stage irradiation mechanism 24 divides the divisible elements along the planned dividing line in the Y direction, and the subsequent second stage irradiation mechanism 24 divides the divisible elements along the planned dividing line in the X direction.

[0161] In addition, the configurations of the workpiece and processing device described above may be modified as appropriate without departing from the scope of the object of the present invention. [Explanation of symbols]

[0162] 2: Workpiece, 4: Divided element, 6: Terminal, 8: Electronic component, 10: Planned division line 12: Support member, 14: Adhesive layer, 16: Divided processed product (device package) 20: Processing device (laser processing device), 22: Conveyor, 22a: Transport surface 24: Irradiation mechanism, 26: Laser oscillator, 28: Laser beam, 30: Optical system 32: First position adjustment mechanism, 34: Second position adjustment mechanism 36A: Mirror, 36B: Mirror, 36C: Mirror, 38: Condenser lens 40: Irradiation unit, 42: Detection unit 50: Controller, 50a: Processor, 50b: Memory

Claims

1. a placing step of placing a workpiece, which includes a dividable element to be divided and which is fixed to a support member, on a conveyor; a dividing step of irradiating a laser beam onto the workpiece being placed on the conveyor and being transported, and dividing the workpiece into a plurality of divided workpieces. Manufacturing method for divided processed products.

2. a placing step of placing a workpiece, which includes a dividable element to be divided and which is fixed to a support member, on a conveyor; a dividing step of irradiating the workpiece placed on the conveyor with a laser beam and dividing the workpiece into a plurality of divided workpieces. Manufacturing method for divided processed products.

3. In the dividing step, dividing the workpiece while not dividing the support member; A method for manufacturing the divided processed product according to claim 2.

4. In the dividing step, a direction in which the workpiece is moved by the conveyor is defined as a first direction, and an irradiation position of the laser beam moves in a second direction intersecting the first direction; A method for producing the divided processed product according to claim 2 or 3.

5. In the dividing step, The irradiation position of the laser beam moves in a first direction in which the workpiece moves by the conveyor. A method for producing the divided processed product according to claim 2 or 3.

6. a conveyor having a conveying surface on which a workpiece is placed and conveying the workpiece placed on the conveying surface; an irradiation mechanism for irradiating the workpiece with a laser beam, The conveyor is configured to irradiate the workpiece placed on the conveying surface of the conveyor and being conveyed while moving, with a laser beam, and perform dividing processing on the divided elements of the workpiece. Processing equipment for divided processed products.

7. The irradiation mechanism includes: During irradiation of the laser beam, the irradiation position of the laser beam is moved in a second direction intersecting with a first direction in which the workpiece is moved by the conveyor. The apparatus for processing divided processed products according to claim 6.

8. The irradiation mechanism includes: When irradiating the laser beam, the irradiation position of the laser beam is moved in a first direction in which the workpiece is moved by the conveyor. The divided workpiece processing device according to claim 6 or 7.

Images