Easy-to-assemble large-current composite circuit board and manufacturing method thereof

Abstract

To provide a large-current composite circuit board which includes a bottom plate assembly composed of an outer shell body, an insulating plate, a composite circuit board, and an insulating sealing layer in order from top to bottom, and is easy to assemble.SOLUTION: The composite circuit board is provided with an insulating groove and a mounting hole for conduction, and the housing and the insulating plate are provided with a through hole corresponding to the position of the mounting hole. In the present disclosure, the structure is simple, the base plate assembly made of the composite circuit board has a better load-bearing effect, the conductive column is connected to the composite circuit board by riveting, and the connecting wire is screwed and fixed to the upper end of the conductive column by the conductive screw, so that the component is electrically connected to the composite circuit board. With this structure, the assembly process is simplified, the assembly efficiency is improved, and the test can be performed after the conductive pillars are riveted, thereby effectively avoiding the situation that the base plate assembly is found to be defective after the components are assembled, reducing the occurrence of defective products and the rework rate, ensuring the qualification rate of the finished product, and reducing the production cost.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to the technical field of electrical control devices, and more particularly to a large current composite circuit board that is easy to assemble and a method for manufacturing the same. [Background technology]

[0002] Control boxes are widely used in electrical control equipment in all industries, and are suitable for low-voltage power distribution equipment related to various large production and manufacturing facilities, construction machinery equipment, new energy-related facilities, high-speed railways and ships, buildings and elevators, etc.

[0003] In the manufacturing process of conventional control boxes currently on the market, electrical components are manually attached to the control box, and then wired and connected according to the electrical circuit diagram. The entire installation process is completed by workers manually wiring and connecting, completing production and assembly. This manual assembly method not only has low production efficiency, but also increases the labor intensity of workers. Long working hours are prone to wiring errors, which leads to installation errors, resulting in high raw material consumption and higher labor costs. In addition, because connecting wires are used for wiring, multiple harnesses are formed inside, making the product larger in volume and making it difficult to miniaturize.

[0004] Some electrical components currently available on the market use PCBs instead of traditional wiring, with wires connecting the electrical components to the PCB, simplifying the wiring process. Using soldering to connect the wires to the PCB eliminates the need for internal harnesses and allows for more compact designs. However, assembly and production using this method requires the assistance of a second worker when soldering the connections between the wires and the PCB. One person aligns and holds the electrical component from the front, while the other performs the soldering from the back. While this construction method improves production and assembly efficiency, it also incurs high labor costs. Furthermore, product testing is required after soldering is complete. If the product fails the test, disassembly and reassembly can be extremely tedious and result in wasteful material. Furthermore, when using a soldering process for high-current circuit boards, soldering can easily result in poor soldering, insufficient connection stability, and low reliability.

[0005] Therefore, it was necessary to research new technical means to solve the above problems. Summary of the Invention [Problem to be solved by the invention]

[0006] SUMMARY OF THE INVENTION Accordingly, the present invention has been made in view of the drawbacks of the prior art, and has as its main object to provide a large current composite circuit board that is easy to assemble and a method for manufacturing the same. [Means for solving the problem]

[0007] In order to achieve the above object, the present invention employs the following technical means.

[0008] An easy-to-assemble high-current composite circuit board includes a bottom plate assembly made up of, in order from top to bottom, an outer shell, an insulating plate, a composite circuit board, and an insulating sealing layer, wherein insulating grooves and conductive mounting holes are drilled in the composite circuit board, and through holes are formed in the outer shell and the insulating plate corresponding to the positions of the mounting holes.

[0009] In a preferred embodiment, the composite circuit board is formed by laminating a metal layer, an adhesive layer, and a polymer insulating layer in that order, and the metal layer has insulating grooves and mounting holes formed by milling.

[0010] In a preferred embodiment, the insulating groove is filled with a sealant layer for insulating protection, and the sealant layer is made of a sealing sheet preformed with an insulating material or a layer formed by flow-filling a liquid insulating material.

[0011] In a preferred embodiment, the insulating plate, insulating sealing layer and sealant layer are made of epoxy resin material, and the polymer material insulating layer is made of epoxy resin, glass fiber plate, bakelite plate, silicone rubber plate or plastic plate.

[0012] In a preferred embodiment, the metal layer is made of a tough pitch copper plate, a copper alloy plate, or an aluminum alloy plate, the material used for the adhesive layer is prepreg, the thickness of the metal layer is in the range of 0.2 mm to 3 mm, the thickness of the polymer material insulating layer is in the range of 0.5 mm to 5 mm, and the total thickness of the composite circuit board is 0.9 mm to 8.2 mm.

[0013] In a preferred embodiment, the device further includes a conductive pillar having an upper end and a lower end, the diameter of the lower end being smaller than that of the upper end, the lower end of the conductive pillar passing through the through holes of the outer shell and the insulating plate and the mounting hole of the composite circuit board in that order to be fixed to the bottom plate assembly, and the upper end of the conductive pillar having an internal threaded hole extending from top to bottom on its upper end surface.

[0014] In a preferred embodiment, the conductive posts are fixed to the bottom plate assembly by riveting, and the lower ends of the conductive posts are fixed to the lower end surface of the composite circuit board by riveting.

[0015] In a preferred embodiment, the base plate assembly further includes a component fixed to the base plate assembly and a connecting wire provided between the component and the conductive post, one end of the connecting wire being connected and fixed to the component, and the other end being screwed into a female threaded hole in the conductive post using a conductive screw, thereby achieving electrical continuity.

[0016] A method for manufacturing a large current composite circuit board that is easy to assemble, comprising the following steps: S1: A material preparation step for laminating and forming a composite circuit board, laminating a metal layer, an adhesive layer and a polymer material insulating layer with a laminator to form a single board; S2: A composite circuit board processing step of milling the metal plate of the composite circuit board with a numerically controlled milling machine to form insulating grooves and mounting holes; S3: Putting a sealant layer into the insulating groove on the composite circuit board (the sealant layer is pre-prepared or injected into the insulating groove by fluid); S4: A step of laser cutting the outer shell body with a laser processing machine and forming the outer shell body with a sheet metal processing machine; S5: printing circuit identification marks and related information on the molded outer shell; S6: A step of attaching the conductive pillar by riveting the conductive pillar to the composite circuit board along the pre-drilled mounting holes using a riveting machine, and fixing the lower end of the conductive pillar to the composite circuit board by riveting, thereby achieving electrical continuity; S7: A step of assembling the bottom plate assembly, in which the insulating plate and the composite circuit board with the conductive posts riveted are sequentially placed inside the outer shell body and stacked to assemble, and then an adhesive material is applied to the connecting portion between the composite circuit board and the inner end surface of the outer shell body for adhesive fixation; S8: A preliminary test and inspection step in which an electrical test is performed on the bottom plate assembly with the conductive pillars attached to check for any abnormalities such as short circuits. S9: After the preliminary test is completed, apply adhesive to the rivet joint surface of the bottom plate assembly that passed the test to provide insulation protection. S10: A step of mounting components according to pre-drilled hole positions and maintaining a certain distance between adjacent components to promote heat dissipation; S11: An attachment step of the connecting wire, in which one end of the connecting wire is connected to the part, and the two are connected and fixed, and then the other end is placed on a conductive post, and a conductive screw is passed through the connecting wire and screwed into the conductive post to fix it, thereby forming a complete electrical continuity; S12: A finished product testing step in which the assembled finished product is retested to select defective products. S13: Packaging and boxing step.

[0017] In a preferred embodiment, the bottom plate assembly of step S9 can be used for assembly immediately after being manufactured, or stored in a warehouse for later use. [Effects of the Invention]

[0018] Compared with the prior art, the present invention has obvious advantages and advantageous effects. Specifically, the above technical means have revealed the following: The present invention has a simple structure, is convenient and quick to use, and the base plate assembly made of the composite circuit board has better load-bearing capacity. The conductive posts are riveted to the composite circuit board using riveting technology, and then connecting wires are fastened to the upper ends of the conductive posts using conductive screws, thereby electrically connecting the components to the composite circuit board. This structure simplifies the assembly process, improves assembly efficiency, and provides good safety and reliability. Furthermore, testing can be performed after the conductive posts are riveted, effectively avoiding situations where defects in the base plate assembly are discovered after the components are assembled. This reduces the number of rejects and the rate of rework and repair, ensures a pass rate for finished products, and reduces production costs for companies.

[0019] 1. By using a composite board instead of a traditional PCB, the load-bearing capacity of the base plate assembly is improved, allowing it to withstand the weight and current of more components. Furthermore, by drilling grooves and holes in the composite circuit board, the composite circuit board has a conductive circuit effect, and the grooves are filled with insulating material to provide insulation protection and prevent short circuits. The base plate assembly has a four-layer structure: an outer shell, an insulating plate, a composite circuit board, and an insulating sealing layer. Information patterns such as electrical symbols, component names, and numbers are printed on the top surface of the outer shell, making subsequent assembly easier and improving efficiency. Furthermore, the base plate assembly can be pre-assembled and transported to the assembly workshop when needed, shortening the overall assembly time and further improving production assembly efficiency.

[0020] 2. The conductive post is made of copper material and has excellent conductivity. It is fixed to the composite circuit board using riveting technology. The upper inner end of the conductive post is also equipped with a female thread. The connecting wire can be quickly screwed into the conductive post using a conductive screw with a locking function, ensuring conductivity and providing excellent reliability and stability.

[0021] 3. The components used are connected to the conductive posts with several connecting wires, which ensures electrical connection, allowing for quick removal and installation of components, improving assembly efficiency, enabling damage-free removal and installation, and reducing component waste.

[0022] 4. During the assembly process, multi-layer insulation layers are used for protection, which can effectively protect the stability and safety of the connections between the internal composite circuit board and components, and also has excellent effects such as dustproof, waterproof, moisture-proof, corrosion-resistant, aging-resistant, and preventing displacement due to vibration.

[0023] 5. The composite circuit board used is made of tough pitch copper plate, alloy copper plate or aluminum alloy plate, all of which can withstand high current operation, giving the base plate assembly more options and applicability and meeting various customer usage needs and usage scenarios.

[0024] 6. The total thickness of the selected composite circuit board is in the range of 0.9mm to 8.2mm, of which the thickness of the metal layer is in the range of 0.2mm to 3mm, and the thickness of the polymer insulating layer is in the range of 0.5mm to 5mm. By combining different thicknesses, it can meet the use needs of various scenarios.

[0025] In order to clearly explain the technical means in the embodiments of the present application, the accompanying drawings that need to be used to depict the embodiments or prior art will be briefly described below. The accompanying drawings described below are only some embodiments of the present application, and those skilled in the art can obtain other drawings based on these accompanying drawings without any creative effort. [Brief explanation of the drawings]

[0026] [Figure 1] 1 is a schematic overall configuration diagram of a bottom plate assembly according to the present invention; [Figure 2] 1 is a schematic top view of a base plate assembly of the present invention; [Figure 3] FIG. 2 is a partial cross-sectional view of the base plate assembly of the present invention. [Figure 4] 1 is a schematic top view of a composite circuit board of the present invention. [Figure 5] 1 is a schematic exploded view of a composite circuit board according to the present invention. [Figure 6] 1 is a schematic assembly diagram of an electrical component of the present invention; [Figure 7] 1 is a schematic exploded view of an electrical component of the present invention; DETAILED DESCRIPTION OF THE INVENTION

[0027] In order to clarify the technical problems, technical means and advantageous effects that the present application aims to solve, the present application will be described in detail with reference to the accompanying drawings and embodiments. It will be understood that the specific embodiments described herein are merely for clarifying the technical contents of the present application and are not intended to limit the present application.

[0028] When an element is referred to as being "anchored" to another element, it may be directly on the other element, or there may be intervening elements. Note that when an element is referred to as being "coupled" to another element, it may be directly coupled to the other element, or there may be intervening elements.

[0029] The orientations or positional relationships indicated by the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," etc. are based on the orientations or positional relationships shown in the drawings and are merely for the purpose of making this application easier to explain, and are not intended to indicate or suggest that the devices or components shown necessarily have a particular orientation or are configured and operated in a particular orientation, and should not be construed as limitations on this application.

[0030] It should be noted that the terms "first" and "second" are used merely for descriptive purposes and should not be understood to indicate or suggest relative importance or to implicitly specify the number of technical features indicated. Thus, a feature qualified by "first" or "second" expresses or implies the inclusion of one or more of such features. Furthermore, in this application, unless otherwise stated, "plurality" means two or more.

[0031] In order to make the objectives, technical means and advantages of the present invention clearer, the present invention will be specifically described with reference to the accompanying drawings and embodiments.

[0032] 1 to 3, the easy-to-assemble high-current composite circuit board includes a bottom plate assembly 100 that is made up of, from top to bottom, an outer shell 110, an insulating plate 120, a composite circuit board 130, and an insulating sealing layer 140. The composite circuit board 130 is provided with insulating grooves 134 and conductive mounting holes 135, and the outer shell 110 and the insulating plate 120 are provided with through holes 150 that correspond to the positions of the mounting holes 135.

[0033] 4 and 5. In this embodiment, the composite circuit board 130 is formed by laminating a metal layer 131, an adhesive layer 132, and a polymer material insulating layer 133 in this order, and an insulating groove 134 and a mounting hole 135 are formed in the metal layer 131 by milling, so that the metal layer 131 has a thin-walled area and a usable area, and the thin-walled area becomes the machined insulating groove 134.

[0034] Furthermore, a sealant layer 136 for insulating protection is filled into the insulation groove 134, and the sealant layer 136 is composed of a sealing sheet preformed with an insulating material or a layer formed by flow-filling a liquid insulating material. By preparing the sealing sheet in advance, after processing the insulation groove 134, the sealing sheet can be placed in the insulation groove 134 to provide insulating protection, or liquid insulating material can be injected into the insulation groove 134 to uniformly fill the insulation groove 134 with the insulating material, forming the sealant layer 136 and providing insulating protection.

[0035] In this embodiment, the insulating plate 120, insulating sealing layer 140 and sealant layer 136 are made of epoxy resin material and have good insulating protection effects, and the polymer material insulating layer 133 is made of epoxy resin, glass fiber plate, bakelite plate, silicone rubber plate or plastic plate and has an insulating effect of isolating the upper layer from the lower layer, preventing the two from being electrically connected and causing problems such as short circuits.

[0036] In this embodiment, the metal layer 131 is made of a tough pitch copper plate, a copper alloy plate, or an aluminum alloy plate, the material used for the adhesive layer 132 is prepreg, the thickness of the metal layer 131 is in the range of 0.2 mm to 3 mm, the thickness of the polymer material insulating layer 133 is in the range of 0.5 mm to 5 mm, and the total thickness of the composite circuit board 130 is 0.9 mm to 8.2 mm.

[0037] Specifically, the composite circuit board 130 can be made of a plate material with an appropriate thickness depending on the application needs. For example, a thin composite circuit board 130 can be made by assembling a 0.2 mm thick metal layer 131 and a 0.5 mm thick polymer insulating layer 133, resulting in an overall thickness of 0.9 mm, suitable for products with limited space. Alternatively, a conventional thickness of the composite circuit board 130, such as a 1 mm thick metal layer 131 and a 2 mm thick polymer insulating layer 133, can be selected to enable the composite circuit board 130 to be used in everyday applications. To mount more components 300 requiring higher currents, a thicker composite circuit board 130, such as a 3 mm thick metal layer 131 and a 5 mm thick polymer insulating layer 133, can be selected to mount more, heavier, and higher current components 300, with correspondingly improved insulation protection.

[0038] In this embodiment, the conductive post 200 further includes an upper end 210 and a lower end 220, the diameter of which is smaller than that of the upper end 210. The lower end 220 of the conductive post 200 is fixed to the bottom plate assembly 100 by passing through the through holes 150 of the outer shell 110 and the insulating plate 120 and the mounting hole 135 of the composite circuit board 130 in that order, and the upper end surface of the upper end 210 of the conductive post 200 is provided with an internal threaded hole 211 extending from top to bottom.

[0039] In this embodiment, the conductive pillar 200 is fixed to the base plate assembly 100 by rivet joining, and the lower end 220 of the conductive pillar 200 is fixed to the lower end surface of the composite circuit board 130 by rivet joining.

[0040] Please refer to Figures 6 and 7. In this embodiment, the base plate assembly 100 further includes a component fixed thereto, and a connecting wire 400 provided between the component 300 and the conductive post 200, one end of the connecting wire 400 being connected and fixed to the component 300, and the other end being screwed into the female threaded hole 211 of the conductive post 200 using a conductive screw, thereby achieving electrical continuity.

[0041] Specifically, the components 300 used include electronic components 300 and electrical components 300, which are selected according to the usage needs of different scenarios and meet the needs of different customers.

[0042] Furthermore, the present invention is suitable for installation and use in a control box or electrical cabinet, replacing traditional wiring methods, making assembly and use more convenient and quicker, and capable of withstanding larger currents.

[0043] A method for manufacturing a large current composite circuit board that is easy to assemble, comprising the following steps: S1: A material preparation step in which a metal layer 131, an adhesive layer 132, and a polymer material insulating layer 133 are laminated by a laminator to form a single composite circuit board 130; S2: A composite circuit board 130 processing step of milling the metal plate of the composite circuit board 130 using a numerically controlled milling machine to form the insulating grooves 134 and the mounting holes 135; S3: Putting a sealant layer 136 into the insulating groove 134 on the composite circuit board 130 (the sealant layer 136 can be pre-fabricated or injected into the insulating groove 134 in a fluid manner); S4: A step of laser cutting the outer shell 110 with a laser processing machine, processing the through-holes 150 in the outer shell 110, and then performing a molding process on the outer shell 110 with a sheet metal processing machine; S5: printing circuit identification marks and related information on the top surface of the molded outer shell 110; S6: A step of attaching the conductive pillars 200 to the composite circuit board 130 by riveting the conductive pillars 200 along the pre-drilled mounting holes 135 using a riveting machine, and fixing the lower ends of the conductive pillars 200 to the composite circuit board 130 by riveting, thereby achieving electrical continuity; S7: An assembly step for assembling the bottom plate assembly in which the insulating plate 120 and the composite circuit board 130 with the conductive columns 200 riveted thereto are sequentially placed inside the outer shell body 110 and stacked to assemble, and then an adhesive material for bonding and fixing is applied to the connection between the composite circuit board 130 and the inner end surface of the outer shell body 110 so that when placed inside the outer shell body 110, the adhesive material allows the two to be firmly bonded together inside the outer shell 110 (the adhesive material includes glue made of adhesive, adhesive-backed sticky paper, etc.). S8: A preliminary test and inspection step in which an electrical test is performed on the bottom plate assembly 100 to which the conductive columns 200 are attached to check for any abnormalities such as short circuits. S9: After the preliminary test is completed, apply adhesive to the rivet joint surface of the bottom plate assembly 100 that has passed the test to form an insulating sealing layer 140 to provide insulating protection. S10: A step of attaching components 300 according to the positions of pre-drilled holes and maintaining a certain distance between adjacent components 300 to promote heat dissipation; S11: An attachment step of the connecting conductor 400, in which one end of the connecting conductor 400 is connected to the component 300, and the two are fixed together, and then the other end is placed on the conductive post 200, and a conductive screw is passed through the connecting conductor 400 and screwed into the conductive post 200 to fix the connecting conductor 400, thereby forming a complete electrical connection; S12: A finished product testing step in which the assembled finished product is retested to screen out defective products and prevent the outflow of defective products. S13: Packaging and boxing step.

[0044] In this embodiment, the bottom plate assembly 100 in step S9 can be used for assembly immediately after being manufactured, or can be stored in a warehouse for later use.

[0045] The above description is only a preferred embodiment of the present invention and merely describes the technical principles of the present invention. These descriptions are intended to explain the principles of the present invention and cannot be interpreted as limiting the scope of protection of the present invention in any way. Based on the interpretation herein, all modifications, equivalent replacements and improvements made within the spirit and principles of the present invention, as well as other specific embodiments of the present invention that can be conceived by those skilled in the art without any creative effort, should be included in the scope of protection of the present invention. [Explanation of symbols]

[0046] 100 Bottom plate assembly 110 Exoskeleton 120 Insulating plate 130 Composite Circuit Board 131 Metal layer 132 Adhesive layer 133 Polymeric insulating layer 134 Insulation Groove 135 mounting holes 136 Sealant Layer 140 Insulating sealing layer 150 through holes 200 Conductive Pillars 210 Upper end 211 Female thread hole 220 Lower end 300 parts 400 Connecting wire

Claims

1. An easily assembled high-current composite circuit board, comprising a bottom plate assembly including, in order from top to bottom, an outer shell, an insulating plate, a composite circuit board, and an insulating sealing layer, wherein insulating grooves and conductive mounting holes are formed in the composite circuit board, and through holes are formed in the outer shell and the insulating plate corresponding to the positions of the mounting holes; The composite circuit board is formed by laminating a metal layer, an adhesive layer, and a polymer material insulating layer in this order, and the insulating grooves and the mounting holes are formed in the metal layer by milling; the metal layer is made of a tough pitch copper plate, a copper alloy plate, or an aluminum alloy plate, the material used for the adhesive layer is prepreg, the thickness of the metal layer is in the range of 0.2 mm to 3 mm, the thickness of the polymer material insulating layer is in the range of 0.5 mm to 5 mm, and the total thickness of the composite circuit board is 0.9 mm to 8.2 mm; a circuit identification mark and related information printed on the molded outer shell; a conductive post having an upper end and a lower end, the diameter of the lower end being smaller than that of the upper end, the lower end being fixed to the bottom plate assembly by passing through the through holes of the outer shell and the insulating plate and the mounting hole of the composite circuit board in that order, the conductive post having an internally threaded hole extending from top to bottom on an upper end surface of the upper end; a component fixed to the bottom plate assembly; and a connecting wire having one end connected and fixed to the component and the other end screwed into the internally threaded hole of the conductive post using a conductive screw, The circuit board is suitable for a control box or an electrical cabinet. A large-current composite circuit board that is easy to assemble.

2. 2. The easy-to-assemble large-current composite circuit board according to claim 1, wherein the insulating groove is filled with a sealant layer for insulating protection, and the sealant layer is formed by a sealing sheet preformed with an insulating material or by flow-filling a liquid insulating material.

3. 3. The easy-to-assemble large-current composite circuit board according to claim 2, wherein the insulating plate, the insulating sealing layer and the sealant layer are made of epoxy resin material, and the polymer material insulating layer is made of epoxy resin, glass fiber plate, Bakelite plate, silicone rubber plate or plastic plate.

4. 2. The easy-to-assemble high-current composite circuit board according to claim 1, wherein the conductive posts are fixed to the bottom plate assembly by rivet joining, and the lower ends of the conductive posts are fixed to the lower end surface of the composite circuit board by rivet joining.

5. 2. The easy-to-assemble large-current composite circuit board according to claim 1, further comprising: a component fixed to the bottom plate assembly; and a connecting wire provided between the component and the conductive post, wherein one end of the connecting wire is connected and fixed to the component, and the other end is screwed into the female threaded hole of the conductive post using a conductive screw to achieve electrical continuity.

6. A method for producing an easy-to-assemble large-current composite circuit board, comprising the easy-to-assemble large-current composite circuit board according to any one of claims 1 to 5, comprising: S1: A material preparation step for laminating the composite circuit board, laminating a metal layer, an adhesive layer, and a polymer material insulating layer with a laminator to form a single board; S2: A composite circuit board processing step of milling the metal plate of the composite circuit board using a numerically controlled milling machine to form insulating grooves and mounting holes; S3: Putting a sealant layer into the insulating groove on the composite circuit board (the sealant layer is prepared in advance or injected into the insulating groove in a fluid manner); S4: A step of laser cutting the outer shell body with a laser processing machine and subjecting the outer shell body to shaping processing with a sheet metal processing machine; S5: printing circuit identification marks and related information on the molded outer shell; S6: A step of attaching the conductive pole to the composite circuit board by using a riveting machine along the pre-drilled mounting holes, and fixing the lower end of the conductive pole to the composite circuit board by riveting, thereby achieving electrical continuity; S7: A step of assembling the bottom plate assembly, in which the insulating plate and the composite circuit board with the riveted conductive posts are sequentially placed inside the outer shell body and stacked to assemble, and then an adhesive material is applied to the connecting portion between the composite circuit board and the inner end surface of the outer shell body for adhesive fixation; S8: A preliminary test and inspection step of conducting an electrical test on the bottom plate assembly with the conductive posts attached to check for any abnormalities such as short circuits. S9: After the preliminary test is completed, apply adhesive to the rivet joint surface of the bottom plate assembly that has passed the preliminary test to provide insulation protection. S10: Mounting components according to pre-drilled hole positions and maintaining a certain distance between adjacent components to promote heat dissipation; S11: An attachment step of the connecting wire, in which one end of the connecting wire is connected to the component, and the two are connected and fixed, and then the other end is placed on the conductive post, and a conductive screw is passed through the connecting wire and screwed into the conductive post to fix the connecting wire, thereby forming a complete electrical continuity; S12: A finished product testing step in which the assembled finished product is retested to select defective products; and S13: Packaging and boxing step A method for manufacturing a large-current composite circuit board that is easy to assemble, characterized by having the above configuration.

7. 7. The method of claim 6, wherein the bottom plate assembly in step S9 can be used for assembly immediately after manufacturing or stored in a warehouse for later use.

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