Carrier separating method and package device manufacturing method

Abstract

To provide a method of separating a carrier capable of reducing the probability that a workpiece is damaged when the carrier bonded to the workpiece via a temporary bonding layer is separated from the workpiece.SOLUTION: A carrier separating method for separating a carrier bonded to a workpiece through a temporary bonding layer from the workpiece includes a separation start point forming step of forming a separation start point in the temporary bonding layer by inserting a projection into the temporary bonding layer so as to enter between the workpiece and the carrier, and a carrier separating step of separating the carrier from the workpiece by applying an external force to each of the workpiece and the carrier after performing the separation start point forming step.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present invention relates to a carrier separation method for separating a carrier adhered to a workpiece via a temporary adhesive layer from the workpiece, and a package device manufacturing method for manufacturing a package device from the workpiece. [Background technology]

[0002] Chips equipped with devices such as electronic circuits are essential components of electronic devices such as mobile phones and personal computers. These chips are manufactured by, for example, forming multiple devices in a matrix on a wafer made of a semiconductor such as silicon, and then dividing the wafer along the boundaries of the multiple devices.

[0003] This chip is electrically connected to terminals of a printed circuit board by wire bonding or the like, and then packaged with a molding resin. In a packaged device manufactured by packaging a chip, deterioration of the device due to external factors such as impact, light, heat, or water is suppressed.

[0004] In addition, such packaging may be performed on the wafer itself, rather than on chips obtained by dividing the wafer. In this case, packaged devices are manufactured by, for example, forming a redistribution layer (RDL) on the wafer, packaging the wafer with a molding compound, and then dividing it.

[0005] Furthermore, with the recent trend toward higher integration of chips, a technology for manufacturing a packaged device in which the size of the redistribution layer is larger than the size of the chip (so-called FOWLP (Fan-Out Wafer Level Package) or FOPLP (Fan-Out Panel Level Packaging)) has also been proposed (see, for example, Patent Document 1). In this technology, a carrier such as the above-mentioned wafer or panel (typically, a panel made of glass used in the manufacture of flat panel displays) is temporarily used.

[0006] Specifically, in this technology, a rewiring layer is formed on a carrier via a temporary adhesive layer, and then multiple chips are bonded to the rewiring layer. The multiple chips are then encapsulated with a molding resin to form a wafer- or panel-like structure (workpiece) including the rewiring layer, multiple chips, and molding resin. The carrier is then separated from the workpiece, and the workpiece is divided to produce each package device.

[0007] Alternatively, in this technology, multiple chips are bonded to a carrier via a temporary adhesive layer, and then the multiple chips are encapsulated with a molding resin to form a wafer- or panel-like structure (workpiece) containing the multiple chips and the molding resin. After the carrier is separated from the workpiece, a rewiring layer is formed on the workpiece, and the workpiece is then divided to produce each packaged device. [Prior art documents] [Patent documents]

[0008] [Patent Document 1] Japanese Patent Application Laid-Open No. 2016-201519 Summary of the Invention [Problem to be solved by the invention]

[0009] Separation of the carrier from the workpiece is achieved, for example, by applying an external force to each of the carriers that pulls them apart. However, if the adhesive strength of the temporary adhesive layer is strong, a crack that serves as the starting point for separation may not form until a strong external force is applied to the temporary adhesive layer. Furthermore, immediately after the crack forms, it may extend significantly toward the workpiece, potentially damaging the workpiece. In view of this, an object of the present invention is to provide a carrier separation method that can reduce the likelihood of workpiece damage when separating a carrier that is adhered to a workpiece via a temporary adhesive layer from the workpiece. [Means for solving the problem]

[0010] According to one aspect of the present invention, there is provided a method for separating a carrier from a workpiece that is adhered to the workpiece via a temporary adhesive layer, the method comprising: forming a separation starting point in the temporary adhesive layer by inserting a protrusion into the temporary adhesive layer so as to penetrate between the workpiece and the carrier; and, after forming the separation starting point in the temporary adhesive layer, separating the carrier from the workpiece by applying an external force to each of the workpiece and the carrier.

[0011] According to another aspect of the present invention, there is provided a method for manufacturing a package device, which manufactures a package device from a workpiece adhered to a carrier via a temporary adhesive layer, the method comprising: forming a separation starting point in the temporary adhesive layer by inserting a protrusion into the temporary adhesive layer so as to penetrate between the workpiece and the carrier; after forming the separation starting point in the temporary adhesive layer, separating the carrier from the workpiece by applying an external force to each of the workpiece and the carrier; and dividing the workpiece.

[0012] Preferably, the present invention further comprises removing an outer periphery of one of the workpiece and the carrier to newly expose a surface of the outer periphery of the other before forming the separation starting point in the temporary adhesive layer, and applying a pressing force to the surface of the outer periphery of the other of the workpiece and the carrier to separate the one from the other of the workpiece and the carrier when separating the carrier from the workpiece. In this case, the separation of the carrier from the workpiece is preferably carried out in a state where a fluid is sprayed onto the temporary adhesive layer, a state where the temporary adhesive layer is submerged in liquid, a state where the temporary adhesive layer is submerged in liquid and the pressing force is applied to vibrate the outer periphery of the other of the workpiece and the carrier, a state where the temporary adhesive layer is submerged in liquid and ultrasonic waves are applied to the water in which the temporary adhesive layer is immersed, or a state where the temporary adhesive layer is submerged in a liquid containing a surfactant.

[0013] Furthermore, in the present invention, when forming the separation starting point in the temporary adhesive layer, it is preferable to rotate the workpiece and the carrier, which are integrated via the temporary adhesive layer, by a predetermined angle around a straight line that passes through the center of the workpiece and the carrier, which are integrated via the temporary adhesive layer, and is parallel to the thickness direction of the workpiece and the carrier, as a rotation axis; after rotating the workpiece and the carrier, which are integrated via the temporary adhesive layer, by the predetermined angle, insert the protrusion, which is positioned in a predetermined direction when viewed from the center in a plan view, into the temporary adhesive layer by moving the protrusion in a direction opposite to the predetermined direction; and after inserting the protrusion into the temporary adhesive layer, remove the protrusion from the temporary adhesive layer by moving the protrusion in the predetermined direction. This series of steps is repeated until the protrusion has been inserted into the temporary adhesive layer a predetermined number of times. [Effects of the Invention]

[0014] In the present invention, a separation initiation point is formed in the temporary adhesive layer prior to separation of the carrier from the workpiece. In this case, even if the adhesive strength of the temporary adhesive layer is strong, a crack can be gradually propagated from the separation initiation point formed in the temporary adhesive layer when a relatively weak external force is applied to the temporary adhesive layer. As a result, in the present invention, it is possible to reduce the probability of damage to the workpiece during separation. [Brief explanation of the drawings]

[0015] [Figure 1] Figure 1(A) is a perspective view showing a schematic example of a laminated body including a workpiece and a carrier that are integrated via a temporary adhesive layer, and Figure 1(B) is a cross-sectional view showing a schematic example of the laminated body shown in Figure 1(A). [Figure 2] FIG. 2 is a flow chart that schematically shows an example of a carrier separation method for separating the carrier of the multilayer body shown in FIGS. 1(A) and 1(B) from the workpiece. [Figure 3] FIG. 3 is a flow chart schematically illustrating an example of the separation starting point forming step shown in FIG. [Figure 4] 4(A) is a plan view schematically showing an example of the position adjustment step shown in FIG. 3, and FIG. 4(B) is a cross-sectional view showing the cross section along line IVB-IVB shown in FIG. 4(A). [Figure 5] 5(A) is a plan view schematically showing an example of the insertion step shown in FIG. 3, and FIG. 5(B) is a cross-sectional view showing a cross section along line VB-VB shown in FIG. 5(A). [Figure 6] 6(A) is a plan view schematically showing an example of the extraction step shown in FIG. 3, and FIG. 6(B) is a cross-sectional view showing a cross section along line VIB-VIB shown in FIG. 6(A). [Figure 7] 7(A) is a plan view schematically showing an example of the rotation step shown in FIG. 3, and FIG. 7(B) is a cross-sectional view showing a cross section taken along line VIIB-VIIB shown in FIG. 7(A). [Figure 8]8(A) and 8(B) are each a partial cross-sectional side view schematically showing an example of the carrier separation step shown in FIG. [Figure 9] FIG. 9 is a flow chart that schematically shows another example of a carrier separation method for separating the carrier of the multilayer body shown in FIGS. 1(A) and 1(B) from the workpiece. [Figure 10] Figure 10(A) is a partially cross-sectional side view schematically showing an example of the outer peripheral portion removal step shown in Figure 9, and Figure 10(B) is a cross-sectional view schematically showing the multi-layer body after the outer peripheral portion removal step shown in Figure 10(A). [Figure 11] Figures 11(A), 11(B) and 11(C) are partial cross-sectional side views each showing a schematic example of a carrier separation step performed in a manner different from that shown in Figures 8(A) and 8(B). [Figure 12] FIG. 12 is a flow chart schematically showing an example of a method for manufacturing a package device from the multilayer workpiece shown in FIGS. 1(A) and 1(B). DETAILED DESCRIPTION OF THE INVENTION

[0016]

[0023] An embodiment of the present invention will be described with reference to the accompanying drawings. Fig. 1(A) is a perspective view showing an example of a multilayer body including a workpiece and a carrier integrated via a temporary adhesive layer, and Fig. 1(B) is a cross-sectional view showing the multilayer body shown in Fig. 1(A). The multilayer body 1 shown in Fig. 1(A) and Fig. 1(B) includes a disk-shaped carrier 3.

[0017] The carrier 3 is, for example, a wafer made of a semiconductor such as silicon. The thickness of the carrier 3 is, for example, 2.0 mm or less, typically 1.1 mm. That is, the carriers 3 are spaced apart from one another at intervals of, for example, 2.0 mm or less, typically 1.1 mm, and each carrier has a circular front surface 3a and a circular back surface 3b.

[0018] A disk-shaped temporary adhesive layer 5 is provided on the surface 3a of the carrier 3 so as to cover the entire surface 3a. The thickness of this temporary adhesive layer 5 is, for example, 20 μm or less, typically 5.0 μm. The temporary adhesive layer 5 is made of a material such as a resin that functions as an adhesive. The temporary adhesive layer 5 bonds the carrier 3 and the disk-shaped workpiece 7 together.

[0019] The thickness of the workpiece 7 is, for example, 1.5 mm or less, typically 0.6 mm. That is, the workpieces 7 are spaced apart from one another by, for example, 1.5 mm or less, typically 0.6 mm, and each workpiece has a circular front surface 7a and a circular back surface 7b. The front surface 7a of the workpiece 7 may be ground in advance.

[0020] The workpiece 7 also includes a plurality of chips 9 arranged in a matrix and a molding resin 11 provided to seal the plurality of chips 9. The workpiece 7 may further include a rewiring layer (not shown) provided between the temporary adhesive layer 5 and the plurality of chips 9 and the molding resin 11.

[0021] The laminate 1 may include a rectangular plate-shaped carrier instead of the disk-shaped carrier 3. This rectangular plate-shaped carrier is, for example, a panel made of glass containing silicon dioxide as a main component. In this case, the planar shapes of the temporary adhesive layer 5 and the workpiece 7 are also rectangular, just like the carrier.

[0022] Fig. 2 is a flowchart schematically illustrating an example of a carrier separation method for separating the carrier 3 from the workpiece 7. In this method, first, separation start points are formed in the temporary adhesive layer 5 (separation start point formation step S1). Fig. 3 is a flowchart schematically illustrating an example of the separation start point formation step S1.

[0023] In this separation starting point forming step S1, first, the relative positions of the laminated body 1 and the needle are adjusted (position adjusting step S10) so that the needle can be inserted into the temporary adhesive layer 5. Fig. 4(A) is a plan view schematically showing an example of the position adjusting step S10, and Fig. 4(B) is a cross-sectional view showing the cross section along line IVB-IVB shown in Fig. 4(A).

[0024] In this position adjustment step S10, the relative positions of the laminated body 1 and the needle 2 are adjusted so that the needle 2 is positioned in a predetermined direction (for example, to the right in plan view) as viewed from the center C of the laminated body 1 in plan view. For example, in this position adjustment step S10, the laminated body 1 is moved in the front-to-rear direction so that the center C is positioned to the left in plan view as viewed from the needle 2, which extends in the left-to-right direction and has its left end as its tip, and then the needle 2 is raised or lowered so that it is positioned at a height corresponding to the temporary adhesive layer 5.

[0025] After performing the position adjustment step S10, the needle 2 is inserted into the temporary adhesive layer 5 (insertion step S11). Fig. 5(A) is a plan view schematically showing an example of the insertion step S11, and Fig. 5(B) is a cross-sectional view showing a cross section along line VB-VB shown in Fig. 5(A).

[0026] In this insertion step S11, for example, the needle 2 is moved in a direction opposite to the above-mentioned predetermined direction (for example, leftward in a plan view) until the tip of the needle 2 reaches a predetermined depth from the side surface of the temporary adhesive layer 5. Note that this predetermined depth is, for example, more than 0 mm and not more than 5.0 mm, preferably not less than 0.1 mm and not more than 2.0 mm.

[0027] After the insertion step S11 is performed, the needle 2 is removed from the temporary adhesive layer 5 (removal step S12). Fig. 6(A) is a plan view schematically showing an example of the removal step S12, and Fig. 6(B) is a cross-sectional view showing a cross section along line VIB-VIB shown in Fig. 6(A).

[0028] In this extraction step S12, the needle 2 is moved in the predetermined direction by, for example, the same distance as the distance moved by the needle 2 in the insertion step S11. As a result, the needle 2 is extracted from the temporary adhesive layer 5, and a depression 5a formed as the needle 2 is inserted in the insertion step S11 remains in the temporary adhesive layer 5. Note that this depression 5a functions as a separation starting point in the carrier separation step S2, which will be described later.

[0029] If the insertion step S11 has not been performed the predetermined number of times n (step S13: NO), the multi-layer body 1 is rotated by a predetermined angle θ (rotation step S14). Note that the predetermined number of times n is a natural number equal to or greater than 2. The predetermined angle θ is, for example, an angle obtained by dividing 360° by the predetermined number of times n.

[0030] Fig. 7(A) is a plan view schematically showing an example of the rotation step S14, and Fig. 7(B) is a cross-sectional view showing a cross section taken along line VIIB-VIIB shown in Fig. 7(A). In this rotation step S14, the laminated body 1 is rotated by a predetermined angle (for example, 45°) around a rotation axis that is a straight line passing through the center C and parallel to the thickness direction of the laminated body 1.

[0031] Furthermore, in the separation starting point forming step S1, a series of steps consisting of the above-mentioned rotation step S14, insertion step S11, and extraction step S12 is repeated until the insertion step S11 is performed a predetermined number of times (e.g., 8 times). Then, when the insertion step S11 is performed the predetermined number n of times (step S13: YES), the separation starting point forming step S1 is completed.

[0032] After the separation start point forming step S1 is performed, the carrier 3 is separated from the workpiece 7 (carrier separation step S2). Each of Figures 8(A) and 8(B) is a partial cross-sectional side view schematically showing an example of the carrier separation step S2.

[0033] The carrier separation step S2 is performed, for example, in a separation device 4. The separation device 4 includes a chuck table 6 having a circular upper surface (holding surface) that is approximately parallel to a horizontal plane. The chuck table 6 is connected to a table-side suction mechanism (not shown) that includes, for example, a vacuum pump or the like.

[0034] When this table-side suction mechanism is operated, a suction force acts on the space near the holding surface of the chuck table 6. Therefore, when the table-side suction mechanism is operated with the multi-layer body 1 placed on the holding surface, the multi-layer body 1 is held on the holding surface of the chuck table 6.

[0035] A separation unit 8 is provided above the chuck table 6. This separation unit 8 has a suction plate 10 with a plurality of suction ports formed on its underside. The plurality of suction ports communicate with a separation unit-side suction mechanism including a vacuum pump or the like via suction paths formed inside the suction plate 10. When the separation unit-side suction mechanism is operated, a suction force acts on the space near the underside of the suction plate 10.

[0036] A vertical movement mechanism 12 is connected to the upper surface of the suction plate 10. The vertical movement mechanism 12 includes, for example, a ball screw and a motor. When the vertical movement mechanism 12 is operated, the suction plate 10 moves in the vertical direction.

[0037] When the carrier separation step S2 is performed in the separation device 4, first, the multilayer body 1 having the recess 5a formed in the temporary adhesive layer 5 is placed on the holding surface of the chuck table 6 with the workpiece 7 facing up, with the chuck table 6 and the suction plate 10 sufficiently spaced apart. Next, the table-side suction mechanism is operated so that the carrier 3 side of the multilayer body 1 is held on the holding surface of the chuck table 6.

[0038] Next, the vertical movement mechanism 12 lowers the suction plate 10 so that the lower surface of the suction plate 10 contacts the surface 7a of the workpiece 7 (see FIG. 8(A)). Next, the separation unit side suction mechanism is operated so that the workpiece 7 side of the composite body 1 is sucked upward. Next, the vertical movement mechanism 12 raises the suction plate 10 so that the suction plate 10 is separated from the chuck table 6 (see FIG. 8(B)).

[0039] This applies an external force (specifically, a suction force) to the carrier 3 and the workpiece 7 such that they separate from each other. As a result, a crack propagates from the depression 5a formed in the temporary adhesive layer 5 toward the interior thereof, and the multilayer body 1 cleaves in the temporary adhesive layer 5. That is, the carrier 3 is separated from the workpiece 7 with the depression 5a formed in the temporary adhesive layer 5 as the separation starting point. This completes the carrier separation step S2, that is, the carrier separation method shown in FIG. 2 is completed.

[0040] 2, prior to separating the carrier 3 from the workpiece 7, a depression 5a serving as a separation initiation point is formed in the temporary adhesive layer 5. In this case, even if the adhesive strength of the temporary adhesive layer 5 is strong, a crack can be gradually propagated from the separation initiation point formed in the temporary adhesive layer 5 when a relatively weak external force is applied to the temporary adhesive layer 5. As a result, this method can reduce the likelihood of the workpiece 7 being damaged during this separation.

[0041] It should be noted that the above is one aspect of the present invention, and the present invention is not limited to the above. For example, in the separation starting point forming step S1 of the present invention, any protrusion capable of forming a separation starting point may be used. In addition to the needle 2, examples of such protrusions include wedges and structures having a needle-shaped portion or a wedge-shaped portion.

[0042] Furthermore, in the separation start point forming step S1 of the present invention, a needle 2 provided so as to be inclined with respect to the above-mentioned predetermined direction may be used. Specifically, in the separation start point forming step S1 (specifically, the inserting step S11), a needle 2 provided so as to be inclined so as to locally separate the outer periphery of the workpiece 7 from the outer periphery of the carrier 3 may be used.

[0043] For example, in the separation starting point forming step S1, the position of the base end of the needle 2 shown in Figures 4(B), 5(B), 6(B), and 7(B) may be slightly higher without changing the position of the tip of the needle 2. In this case, after the tip of the needle 2 is inserted into the temporary adhesive layer 5 in the inserting step S11, an external force acts on the workpiece 7 to peel the outer periphery of the needle 2 from the outer periphery of the carrier 3. As a result, the outer periphery of the workpiece 7 can be locally peeled from the outer periphery of the carrier 3.

[0044] Furthermore, the carrier separation step S2 of the present invention may be performed with the laminated body 1 turned upside down. That is, the carrier separation step S2 may be performed with the workpiece 7 side of the laminated body 1 being sucked onto the holding surface of the chuck table 6 of the separating device 4, and the carrier 3 side of the laminated body 1 being sucked onto the lower surface of the suction plate 10.

[0045] In the present invention, the laminate 1 may be processed prior to the separation start point forming step S1 so that the carrier 3 can be easily separated from the workpiece 7 in the carrier separation step S2. Fig. 9 is a flow chart schematically showing an example of such a carrier separation method.

[0046] In the carrier separation method shown in Fig. 9, before performing separation start point forming step S1, one of the outer peripheries of the workpiece 7 and the carrier 3 is removed to newly expose one surface of the outer periphery of the other (outer periphery removing step S3). Fig. 10(A) is a partial cross-sectional side view schematically showing an example of outer periphery removing step S3, and Fig. 10(B) is a cross-sectional view schematically showing the multilayer body 1 after outer periphery removing step S3 shown in Fig. 10(A).

[0047] The outer peripheral portion removing step S3 is performed, for example, by a cutting device 14. The cutting device 14 includes a chuck table 16 having a circular upper surface (holding surface) that is generally parallel to a horizontal plane. The chuck table 16 is connected to a suction mechanism (not shown) having, for example, an ejector or the like, a rotation mechanism (not shown) having, for example, a pulley and a motor or the like, and a first horizontal movement mechanism (not shown) having, for example, a ball screw and a motor or the like.

[0048] When the suction mechanism is operated, a suction force acts on the space near the holding surface of the chuck table 16. Therefore, when the suction mechanism is operated with the laminated body 1 placed on the holding surface, the laminated body 1 is held on the holding surface of the chuck table 16. When the rotation mechanism is operated, the chuck table 16 rotates around a rotation axis that passes through the center of the holding surface and is aligned in the vertical direction. When the first horizontal movement mechanism is operated, the chuck table 16 moves along a first direction (processing feed direction) that is parallel to the holding surface of the chuck table 16.

[0049] A cutting unit 18 is provided above the chuck table 16. This cutting unit 18 has a spindle 20 that extends parallel to the holding surface of the chuck table 16 and along a second horizontal direction (indexing feed direction) that is perpendicular to the first horizontal direction. A motor (not shown) for rotating the spindle is connected to the base end of this spindle 20, and an annular cutting blade 22 is attached to the tip end of the spindle.

[0050] When the motor is operated, the cutting blade 22 rotates together with the spindle 20 around a straight line parallel to the second horizontal direction as the rotation axis. The width of the cutting blade 22 (the length along the second horizontal direction) is, for example, 0.2 mm to 5 mm. Furthermore, the spindle 20 is connected to a second horizontal movement mechanism (not shown) and a vertical movement mechanism (not shown), each of which has, for example, a ball screw, a motor, etc.

[0051] When the second horizontal movement mechanism is operated, the cutting blade 22 moves in the second direction together with the spindle 20. When the vertical movement mechanism is operated, the cutting blade 22 moves in the vertical direction together with the spindle 20, i.e., the cutting blade 22 moves up and down together with the spindle 20.

[0052] When performing the outer peripheral portion removing step S3 in the cutting device 14, first, the multi-layer body 1 is placed on the holding surface of the chuck table 16 with the workpiece 7 facing up. Next, the suction mechanism is operated so that the carrier 3 side of the multi-layer body 1 is held on the holding surface of the chuck table 16.

[0053] Next, the first direction movement mechanism moves the chuck table 16 along the first direction so that the cutting blade 22 is positioned directly above one end of the composite body 1 in the second horizontal direction, and / or the second direction movement mechanism and / or the vertical direction movement mechanism moves the spindle 20 along the second direction and / or the vertical direction.

[0054] Next, the motor connected to the base of the spindle 20 is operated to rotate the cutting blade 22. Next, while the cutting blade 22 is still rotating, the vertical movement mechanism lowers the spindle 20 until the lower end of the cutting blade 22 is positioned lower than the front surface 3a of the carrier 3 and higher than the back surface 3b (see FIG. 10(A)).

[0055] Next, while keeping the cutting blade 22 rotating, the rotation mechanism rotates the chuck table 16 so as to rotate the laminated body 1 at least once. This removes the outer periphery of the workpiece 7 and the surface 3a side of the outer periphery of the carrier 3. As a result, one surface 3c of the outer periphery of the carrier 3 is newly exposed. In other words, a step 1a is formed in the laminated body 1, with this surface 3c as the lower surface and the surface 7a of the workpiece 7 as the upper surface.

[0056] In the outer peripheral portion removing step S3, the multilayer body 1 may be processed so as to remove the outer peripheral portion of the carrier 3 and the back surface 7b side of the outer peripheral portion of the workpiece 7. In this case, the outer peripheral portion removing step S3 is performed as described above, except that, for example, the multilayer body 1 is placed on the holding surface of the chuck table 16 with the carrier 3 facing up, and then the workpiece 7 side of the multilayer body 1 is held on the holding surface of the chuck table 16.

[0057] The separation start point forming step S1 for the multi-layer body 1 having the step 1a formed therein is carried out in the same manner as the separation start point forming step S1 shown in Fig. 3. In this case, the needle 2 used in the separation start point forming step S1 may be coupled to the spindle 20 of the cutting device 14, and the separation start point forming step S1 may be carried out in the cutting device 14.

[0058] The carrier separation step S2 for the laminate 1 in which the step 1a is formed and the temporary adhesive layer 5 has the recess 5a formed therein may be carried out in the same manner as the carrier separation step S2 shown in Figures 8(A) and 8(B), or may be carried out in a manner different from this. Figures 11(A), 11(B), and 11(C) are partial cross-sectional side views each showing a schematic example of the carrier separation step S2 carried out in a manner different from the carrier separation step S2 shown in Figures 8(A) and 8(B).

[0059] 11(A) is performed in a separation device 24. The separation device 24 includes a holding plate 26 having a circular lower surface (holding surface) that is generally parallel to a horizontal plane. The holding plate 26 is connected to, for example, a suction mechanism (not shown) having an ejector or the like, and a first lifting mechanism 28 having a ball screw, a motor, or the like.

[0060] Further, a pressing member 30 is provided on the side of the holding plate 26, which is located directly above at least a portion of one surface 3c of the outer periphery of the carrier 3 when the workpiece 7 side of the laminated body 1 is held on the holding surface of the holding plate 26. This pressing member 30 is connected to a second lifting mechanism (not shown) having, for example, a ball screw, a motor, etc.

[0061] When the carrier separation step S2 is performed in the separation device 24, first, the first lifting mechanism lowers the holding plate 26 so that the holding surface of the holding plate 26 contacts the surface 7a of the workpiece 7. Next, the suction mechanism is operated so that the workpiece 7 side of the laminate 1 is held by the holding surface of the holding plate 26.

[0062] Next, the first lifting mechanism 28 lifts the holding plate 26 so that the laminated body 1 is raised and positioned at a predetermined height, thereby exposing the carrier 3. Next, with the laminated body 1 positioned at the predetermined height, the second lifting mechanism lowers the pressing member 30 so that the lower surface of the pressing member 30 presses against one surface 3c of the outer periphery of the carrier 3.

[0063] This applies an external force to each of the carrier 3 and the workpiece 7, pulling them apart. Specifically, a pressing force is applied to the carrier 3, and a suction force is applied to the workpiece 7. As a result, a crack propagates from the depression 5a formed in the temporary adhesive layer 5 toward the interior thereof, causing the multilayer body 1 to cleave at the temporary adhesive layer 5. In other words, the carrier 3 is separated from the workpiece 7, with the depression 5a formed in the temporary adhesive layer 5 serving as the separation starting point.

[0064] The carrier separation step S2 shown in Figure 11(B) is performed in a separation device 32. This separation device 32 has a nozzle 34 in addition to the components of the separation device 24. This nozzle 34 is directed toward the temporary adhesive layer 5 of the laminate 1, the workpiece 7 side of which is held on the holding surface of the holding plate 26 and positioned at the above-mentioned predetermined height. The nozzle 34 also communicates with a fluid supply source (not shown) via piping (not shown) and a valve (not shown). When this valve is opened and the fluid supply source is operated, a fluid (specifically, a gas such as air or a liquid such as water) F is sprayed from the nozzle 34.

[0065] When the carrier separation step S2 is performed in the separation device 32, first, the laminated body 1 is positioned at the above-mentioned predetermined height by operating the holding plate 26, etc., in the same manner as when the carrier separation step S2 is performed in the separation device 24. Next, while the laminated body 1 is positioned at the above-mentioned predetermined height, the second lifting mechanism lowers the pressing member 30 so that the lower surface of the pressing member 30 presses against one surface 3c of the outer periphery of the carrier 3, and the fluid F is sprayed from the nozzle 34 onto the temporary adhesive layer 5. In this case, separation of the carrier 3 from the workpiece 7 is easier than when the carrier separation step S2 is performed in the separation device 24.

[0066] The carrier separation step S2 shown in Figure 11(C) is performed in a separation device 36. This separation device 36 has a liquid tank 38 in addition to the components of the separation device 24. This liquid tank 38 is a bottomed, rectangular cylindrical structure, and is large enough to accommodate the laminated body 1 inside. In addition, a movement mechanism (not shown) is connected to this liquid tank 38 to move the liquid tank 38 between a position directly below the holding plate 26 that holds the workpiece 7 side of the laminated body 1 on the holding surface and a position where it does not overlap with this holding plate 26.

[0067] When the carrier separation step S2 is performed in the separation device 36, first, the laminate 1 is positioned at the above-mentioned predetermined height by operating the holding plate 26 etc. in the same manner as when the carrier separation step S2 is performed in the separation device 24. Next, the movement mechanism moves the liquid tank 38 so that it is positioned directly below the holding plate 26. Next, the liquid tank 38 is filled with a liquid L such as water.

[0068] The liquid L may contain a surfactant. Examples of such surfactants include an anionic surfactant or a cationic surfactant that easily penetrates the temporary adhesive layer 5. When the liquid L contains such a surfactant, the propagation of cracks in the temporary adhesive layer 5 is suppressed. Therefore, in this case, the carrier 3 can be more easily separated from the workpiece 7 than when the liquid L does not contain such a surfactant.

[0069] Next, the first lifting mechanism 28 lowers the holding plate 26 so that at least the temporary adhesive layer 5 is submerged in the liquid L. Next, while the temporary adhesive layer 5 is still submerged in the liquid L, the second lifting mechanism lowers the pressing member 30 so that the lower surface of the pressing member 30 is pressed against one surface 3c of the outer periphery of the carrier 3. In this case, the carrier 3 separated from the workpiece 7 falls gently in the liquid L. Therefore, in this case, the probability that the carrier 3 will be damaged due to a collision caused by the fall is reduced compared to when the carrier 3 separated from the workpiece 7 falls through the air.

[0070] Furthermore, when the lower surface of the pressing member 30 is pressed against the surface 3c of the outer periphery of the carrier 3 in the separating device 36, the pressing member 30 may be vibrated by applying ultrasonic waves to the pressing member 30. In this case, ultrasonic waves may be applied to the liquid L in addition to or instead of applying ultrasonic waves to the pressing member 30. In these cases, separation of the carrier 3 from the workpiece 7 becomes easier compared to when the pressing member 30 is not vibrated and ultrasonic waves are not applied to the liquid L.

[0071] The present invention may also be a method for manufacturing a package device, in which a package device is manufactured from a workpiece 7 of a multi-layer body 1. Fig. 12 is a flow chart schematically showing one example of this method. In this method, after performing a separation start point forming step S1 and a carrier separation step S2, the workpiece 7 is divided (division step S4).

[0072] Specifically, in the dividing step S4, the workpiece 7 is processed so as to remove portions of the workpiece 7 located at the boundaries between the plurality of chips 9. As a result, a plurality of packaged devices, each including a chip 9, are manufactured from the workpiece 7.

[0073] The dividing step S4 is performed by a known processing device such as a cutting device or a laser processing device. For example, the dividing step S4 is performed by a cutting device in which an annular cutting blade is rotated and cuts into the workpiece 7 along the boundary. Alternatively, the dividing step S4 may be performed by a laser processing device in which a laser beam having a wavelength absorbed by the workpiece 7 is irradiated onto the workpiece 7 along the boundary.

[0074] In addition, the structures and methods according to the above-described embodiments can be modified as appropriate without departing from the scope of the present invention. [Explanation of symbols]

[0075] 1: Multi-layered body (1a: step) 2: Needle 3: Carrier (3a: front side, 3b: back side) 4: Separation device 5: Temporary adhesive layer (5a: recess) 6: Chuck table 7: Workpiece (7a: front surface, 7b: back surface) 8: Separation unit 9: Tip 10: Suction plate 11:Mold resin 12: Vertical movement mechanism 14:Cutting device 16: Chuck table 18: Cutting unit 20:Spindle 22: Cutting blade 24: Separation device 26: Holding plate 28: First lifting mechanism 30: Pressing member 32: Separation device 34: Nozzle 36: Separation device 38:Liquid tank

Claims

1. A method for separating a carrier from a workpiece, the carrier being adhered to the workpiece via a temporary adhesive layer, comprising the steps of: forming a separation starting point in the temporary adhesive layer by inserting a protrusion into the temporary adhesive layer so as to penetrate between the workpiece and the carrier; After forming the separation origin in the temporary adhesive layer, separating the carrier from the workpiece by applying an external force to each of the workpiece and the carrier; A carrier separation method comprising:

2. Before forming the separation origin in the temporary adhesive layer, the method further comprises removing an outer periphery of one of the workpiece and the carrier to newly expose one surface of an outer periphery of the other; 2. The method for separating carriers according to claim 1, wherein when separating the carrier from the workpiece, a pressing force is applied to the one surface of the outer periphery of the other of the workpiece and the carrier so as to separate the other from the other of the workpiece and the carrier.

3. The method for separating a carrier according to claim 2 , wherein the separation of the carrier from the workpiece is carried out in a state where a fluid is sprayed onto the temporary adhesive layer.

4. The method for separating a carrier according to claim 2 , wherein the separation of the carrier from the workpiece is carried out in a state where the temporary adhesive layer is submerged in a liquid.

5. The method for separating a carrier according to claim 2, wherein the separation of the carrier from the workpiece is carried out while the temporary adhesive layer is submerged in a liquid and a pressing force is applied so as to vibrate the outer periphery of the other of the workpiece and the carrier.

6. The method for separating a carrier according to claim 2, wherein the separation of the carrier from the workpiece is carried out while the temporary adhesive layer is submerged in a liquid and ultrasonic waves are applied to the water in which the temporary adhesive layer is immersed.

7. The method for separating a carrier according to claim 2 , wherein the separation of the carrier from the workpiece is carried out in a state where the temporary adhesive layer is submerged in a liquid containing a surfactant.

8. When forming the separation starting point in the temporary adhesive layer, Rotating the workpiece and the carrier, which are integrated via the temporary adhesive layer, by a predetermined angle around a straight line that passes through the center of the workpiece and the carrier, which are integrated via the temporary adhesive layer, and is parallel to the thickness direction of the workpiece and the carrier. After rotating the workpiece and the carrier that are integrated via the temporary adhesive layer by the predetermined angle, the protrusion positioned in a predetermined direction as viewed from the center in a plan view is moved in a direction opposite to the predetermined direction to insert the protrusion into the temporary adhesive layer; After inserting the protrusion into the temporary adhesive layer, the protrusion is removed from the temporary adhesive layer by moving the protrusion in the predetermined direction; 8. The carrier separation method according to claim 1, wherein a series of steps comprising the steps of: a) inserting the projections into the temporary adhesive layer a predetermined number of times;

9. 1. A method for manufacturing a packaged device, comprising the steps of: manufacturing a packaged device from a workpiece adhered to a carrier via a temporary adhesive layer; forming a separation starting point in the temporary adhesive layer by inserting a protrusion into the temporary adhesive layer so as to penetrate between the workpiece and the carrier; After forming the separation origin in the temporary adhesive layer, separating the carrier from the workpiece by applying an external force to each of the workpiece and the carrier; dividing the workpiece; A method for manufacturing a packaged device comprising:

10. Before forming the separation origin in the temporary adhesive layer, the method further comprises removing an outer periphery of one of the workpiece and the carrier to newly expose one surface of an outer periphery of the other; 10. The method for manufacturing a packaged device according to claim 9, wherein when separating the carrier from the workpiece, a pressing force is applied to the one surface of the outer periphery of the other of the workpiece and the carrier so as to separate the other from the other.

11. The method for manufacturing a packaged device according to claim 10 , wherein the separation of the carrier from the workpiece is performed with a fluid sprayed onto the temporary adhesive layer.

12. The method for manufacturing a packaged device according to claim 10 , wherein the separation of the carrier from the workpiece is performed while the temporary adhesive layer is submerged in a liquid.

13. The method for manufacturing a packaged device according to claim 10, wherein the separation of the carrier from the workpiece is carried out while the temporary adhesive layer is submerged in a liquid and while the pressing force is applied so as to vibrate the outer periphery of the other of the workpiece and the carrier.

14. The method for manufacturing a packaged device according to claim 10 , wherein the separation of the carrier from the workpiece is performed while the temporary adhesive layer is submerged in a liquid and ultrasonic waves are applied to the water in which the temporary adhesive layer is immersed.

15. The method for manufacturing a packaged device according to claim 10 , wherein the separation of the carrier from the workpiece is performed while the temporary adhesive layer is submerged in a liquid containing a surfactant.

16. When forming the separation starting point in the temporary adhesive layer, Rotating the workpiece and the carrier, which are integrated via the temporary adhesive layer, by a predetermined angle around a straight line that passes through the center of the workpiece and the carrier, which are integrated via the temporary adhesive layer, and is parallel to the thickness direction of the workpiece and the carrier. After rotating the workpiece and the carrier that are integrated via the temporary adhesive layer by the predetermined angle, the protrusion positioned in a predetermined direction as viewed from the center in a plan view is moved in a direction opposite to the predetermined direction to insert the protrusion into the temporary adhesive layer; After inserting the protrusion into the temporary adhesive layer, the protrusion is removed from the temporary adhesive layer by moving the protrusion in the predetermined direction; The method for manufacturing a packaged device according to claim 9 , further comprising repeating a series of steps configured as follows until the projections are inserted into the temporary adhesive layer a predetermined number of times.

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