Surface height distribution measuring apparatus

Abstract

To provide a surface height distribution measuring device capable of more accurately measuring.SOLUTION: The surface height measuring apparatus 1000 includes first and second noncontact distance-measuring units 2A and 2B that measure distances to surfaces of the measured object WA in a noncontact manner, a supporting and moving unit 3 that relatively moves the measured object WA and the first and second noncontact distance-measuring units 2A and 2B, and a plate-shaped member 35 that is substantially parallel to the measured object WA in a noncontact manner with the measured object WA when measured by the first and second noncontact distance-measuring units 2A and 2B and is provided at a position covering at least a part of the measured object WA when viewed from a direction perpendicular to the surfaces of the measured object WA.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a surface height distribution measuring device that measures the surface height distribution of a plate-like measurement target. [Background technology]

[0002] A measuring device for measuring the surface height of a plate-shaped object is disclosed, for example, in Patent Document 1. The flatness measuring device disclosed in Patent Document 1 includes three support parts for supporting a disk-shaped object at three points, a pair of capacitance-type displacement sensors for measuring the distance from each of the top and bottom of the object to the top and bottom surfaces of the object, an elevator and rotation device, and a computer, in which the elevator and rotation device lifts the object and rotates it by a predetermined angle, then lowers it and supports it on the support parts, a line passing through the center of the object is scanned and measured with each of the pair of capacitance-type displacement sensors, the computer determines the thickness of the object based on the measured values ​​on the top surface and the measured values ​​on the bottom surface, the object is returned to the elevator and rotation device, and the elevator and rotation device lifts, rotates, and lowers the object to scan and measure the next line. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2003-75147 Summary of the Invention [Problem to be solved by the invention]

[0004] However, in the flatness measuring device disclosed in Patent Document 1, when the object to be measured vibrates slightly in the vertical direction, measurements are taken using a pair of capacitance-type displacement sensors, which causes errors in the distance to the top and bottom surfaces of the object to be measured, resulting in a deterioration in measurement accuracy.

[0005] The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a surface height distribution measuring device that can perform measurements with higher accuracy. [Means for solving the problem]

[0006] After extensive investigation, the inventors have found that the above object can be achieved by the following invention. That is, a surface height distribution measuring device according to one aspect of the present invention is a device for measuring the surface height distribution of a plate-shaped measurement target, and includes: a non-contact distance measurement unit that measures the distance to the surface of the measurement target in a non-contact manner, a moving unit that moves the measurement target and the non-contact distance measurement unit relatively, and a plate-shaped member that is in a non-contact state with the measurement target and is approximately parallel to the measurement target during measurement by the non-contact distance measurement unit, and is positioned so as to cover at least a portion of the measurement target when viewed from a direction perpendicular to the surface of the measurement target.

[0007] Such a surface height distribution measuring device includes a plate-like member, and therefore vibrations can be suppressed by the air layer between the measurement object and the plate-like member, allowing for more accurate measurements.

[0008] In another aspect, in the above-mentioned surface height distribution measuring device, the measurement object is either a conductor or a semiconductor, the non-contact distance measuring unit is a capacitance-type displacement meter, and the plate-like member is either a grounded conductor or a semiconductor.

[0009] In such a surface height distribution measuring device, a capacitor is formed between the measurement target and the plate-like member. If the non-contact distance measuring unit is a capacitance-type displacement meter, an AC electric field is generated during measurement, and the surface height distribution measuring device can reduce noise in the measurement by the capacitance-type displacement meter by using the capacitor.

[0010] In another aspect, in the above-mentioned surface height distribution measuring device, the measurement object is disk-shaped and further includes a first rotating unit that is arranged at a first position and rotates the measurement object circumferentially by a predetermined angle, and a second rotating unit that is arranged at a second position different from the first position and rotates the measurement object circumferentially by the predetermined angle, and the moving unit moves the measurement object and the non-contact distance measuring unit relatively between the first and second positions.

[0011] Such a surface height distribution measuring device measures each surface height distribution on both the outbound path from the first position to the second position and the return path from the second position to the first position, thereby reducing the measurement time compared to measurements on only one of the outbound path or the return path. [Effects of the Invention]

[0012] The surface height distribution measuring device according to the present invention can perform measurements with higher accuracy. [Brief explanation of the drawings]

[0013] [Figure 1] 1A and 1B are diagrams for explaining the structural configuration of a surface height distribution measuring device according to an embodiment. [Figure 2] FIG. 2 is a block diagram showing the electrical configuration of the surface height distribution measuring device. [Figure 3] 4 is a flowchart showing the operation of the surface height distribution measuring device. [Figure 4] 5A to 5C are diagrams for explaining the operation of the surface height distribution measuring device. DETAILED DESCRIPTION OF THE INVENTION

[0014] Hereinafter, one or more embodiments of the present invention will be described with reference to the drawings. However, the scope of the invention is not limited to the disclosed embodiments. In addition, components with the same reference numerals in each drawing indicate the same components, and their description will be omitted as appropriate. In this specification, when referring to a general term, a reference numeral without a subscript is used, and when referring to an individual component, a reference numeral with a subscript is used.

[0015] Fig. 1 is a diagram for explaining the structural configuration of a surface height distribution measuring device in an embodiment. Fig. 1A is a front view, Fig. 1B is a side view, and Fig. 1C is a top view. Fig. 2 is a block diagram showing the electrical configuration of the surface height distribution measuring device.

[0016] The surface height distribution measuring device 1000 in the embodiment includes, for example, first and second lifting and rotating units 1A, 1B, first and second non-contact distance measuring units 2A, 2B, a support moving unit 3, a control processing unit 4, an input unit 5, an output unit 6, an interface unit (IF unit) 7, and a memory unit 8, as shown in Figures 1 and 2.

[0017] The first and second lifting and rotating units 1A and 1B are each electrically connected to a control processor 4 and, under the control of the control processor 4, lift and lower a plate-shaped, in this embodiment, disc-shaped, measurement object WA and rotate the measurement object WA by a predetermined angle in the circumferential direction. The first lifting and rotating unit 1A is disposed at a predetermined first position P1, and the second lifting and rotating unit 1B is disposed at a predetermined second position P2 different from the first position P1. Because the first lifting and rotating unit 1A and the second lifting and rotating unit 1B have the same structure, the following description will mainly focus on the first lifting and rotating unit 1A. By listing the reference numerals corresponding to the components of the first lifting and rotating unit 1A in parentheses after the reference numerals corresponding to the components of the second lifting and rotating unit 1B, a description of the second lifting and rotating unit 1B will be omitted.

[0018] More specifically, the first lifting and rotating unit 1A (1B) includes a rotating unit 1-1A (1-1B) and a lifting and rotating unit 1-2A (1-2B). The rotating unit 1-1A (1-1B) includes a rotating member and a rotation mechanism electrically connected to the control processing unit 4 and configured to rotate the rotating member in the circumferential direction under the control of the control processing unit 4. By rotating the rotating member in the circumferential direction with the rotation mechanism, the measurement object WA placed on the upper surface of the rotating member is rotated in the circumferential direction. The rotation mechanism includes, for example, a stepping motor and a transmission mechanism connected to the output shaft of the stepping motor, connecting its outer circumferential surface to the inner circumferential surface of the cylindrical member, and transmitting the rotational force of the stepping motor to the rotating member. The lifting unit 1-2A (1-2B) includes a guide member that guides the rotating unit 1-1A (1-1B), and a lifting mechanism that is electrically connected to the control processing unit 4 and that lifts and lowers the rotating unit 1-1A (1-1B) according to the control of the control processing unit 4, and that includes, for example, an electromagnetic cylinder, and by lifting and lowering the rotating unit 1-1A (1-1B) using the lifting mechanism, the measurement object WA placed on the upper surface of the rotating member is lifted and lowered.

[0019] The first and second lifting and rotating units 1A and 1B are disposed at predetermined first and second positions P1 and P2, respectively, on the upper surface of a first support unit 11, which is a plate-like member extending in one direction. The first support unit 11 is connected and fixed at both ends to a pair of first and second legs 12-1 and 12-2, which are plate-like members erected on a base plate BP, for example. Therefore, the first leg 12-1, first support unit 11, and second leg 12-2 are connected in this order, and as shown in FIG. 2B, the first support unit 11 has a generally downward U-shape in side view.

[0020] For ease of explanation, as shown in FIG. 1, an xyz Cartesian coordinate system is set up in which the direction of extension of the first support part 11 is the x-axis (x-direction, front-to-back direction), the width direction of the first support part 11 perpendicular to the extension direction is the y-axis (y-direction, left-to-right direction), and the direction perpendicular to each of the x-direction and y-direction is the z-axis (z-direction, height direction), and is used as appropriate.

[0021] The first position P1 is a position at the center of the measurement object WA where the measurement object WA can be raised and lowered and rotated after the first and second non-contact distance measurement units 2A and 2B finish scanning the measurement object WA along a straight line passing through the center of the measurement object WA on the return path from the second position P2 to the first position P1. For example, the first position P1 is a position on one side of the x-direction relative to the positions of the first and second non-contact distance measurement units 2A and 2B, and is farther away from the positions of the first and second non-contact distance measurement units 2A and 2B than the diameter of the measurement object WA. Similarly, the second position P2 is a position at the center of the measurement object WA where the measurement object WA can be raised and lowered and rotated after the first and second non-contact distance measurement units 2A and 2B finish scanning the measurement object WA along a straight line passing through the center of the measurement object WA on the outward path from the first position P1 to the second position P2. For example, the second position P2 is a position on the other side of the x-direction relative to the positions of the first and second non-contact distance measurement units 2A, 2B, that is farther away from the positions of the first and second non-contact distance measurement units 2A, 2B than the diameter of the measurement object WA.

[0022] The measurement object WA may be any plate-shaped member, and in this embodiment it is disk-shaped, such as a wafer used in semiconductor manufacturing (e.g., a silicon wafer, etc.) or an aluminum or glass magnetic disk substrate used in hard disks.

[0023] The first and second non-contact distance measurement units 2A and 2B are each electrically connected to the control processing unit 4 and are devices that measure the distance to the surface of the measurement object WA in a non-contact manner under the control of the control processing unit 4. Examples of such devices include a capacitance displacement meter, an eddy current displacement meter, a laser displacement meter, and a confocal displacement meter. In this embodiment, a capacitance displacement meter is used to reduce noise. The first and second non-contact distance measurement units 2A and 2B are arranged facing each other with a predetermined gap (first gap) between them to allow the measurement object WA to pass through. With this arrangement, the first non-contact distance measurement unit 2A measures a first distance to one surface of the measurement object WA, and the second non-contact distance measurement unit 2B measures a second distance to the other surface of the measurement object WA. The first and second non-contact distance measurement units 2A and 2B each output their respective measurement results to the control processing unit 4.

[0024] The first non-contact distance measurement unit 2A is disposed at one end (location) on the underside of the first support arm 22-1, which is a plate-like member extending in one direction (x direction), and the second non-contact distance measurement unit 2B is disposed at one end (location) on the upper surface of the second support arm 22-2, which is a plate-like member extending in one direction (x direction) and whose width in the y direction is wider than the outer diameter of the second lift-and-rotate unit 1B. The first and second support arms 22-1, 22-2 are each connected at the other end thereof to and fixed to second support 21, which is a columnar member erected on base plate BP, on the outer side in the x direction of second leg 12-2 (or on the outer side in the x direction of first leg 12-1), so that the first non-contact distance measurement unit 2A and the second non-contact distance measurement unit 2B face each other with the first gap between them. Therefore, the first and second support arm portions 22-1 and 22-2 are spaced apart in the z direction, and the first support arm portion 22-1, the second support arm portion 22-2, and the second support portion 21 are generally F-shaped in side view, as shown in Fig. 2B. A through opening is formed in the second support arm portion 22-2 at a position corresponding to the location of the second lifting and rotating portion 1B, so that the second lifting and rotating portion 1B can appear and disappear in the z direction relative to the second support arm portion 22-2.

[0025] The first non-contact distance measurement unit 2A and the second non-contact distance measurement unit 2B may be held by other means so as to pass through the center of the measurement object WA.

[0026] The support moving unit 3 is electrically connected to the control processing unit 4 and, under the control of the control processing unit 4, supports the measurement object WA and moves the measurement object WA and the first and second non-contact distance measurement units 2A, 2B relatively between the first and second positions P1, P2 so that the first and second non-contact distance measurement units 2A, 2B pass through the center of the measurement object WA. In this embodiment, as described above, the first and second non-contact distance measurement units 2A, 2B are fixedly disposed by the first and second support arm units 22-1, 22-2 and the second support unit 21, and the support moving unit 3 supporting the measurement object WA moves so that the measurement object WA moves relative to the first and second non-contact distance measurement units 2A, 2B. Note that the surface height distribution measuring device 1000 may also be configured so that the first and second non-contact distance measurement units 2A, 2B move relative to the fixedly disposed measurement object WA.

[0027] More specifically, the support movement unit 3 includes three first to third support pins 31-1 to 31-3, a pair of third and fourth support units 32-1 and 32-2, a connecting unit 33, a moving unit 34, and a plate-like member 35. The first to third support pins 31-1 to 31-3 are each needle-like or thin columnar members, and support the measurement object WA from its underside at their respective tips, which are one end in the z direction (three-point support). In this embodiment, the first to third support pins 31-1 to 31-3 are each made of an insulating material such as resin. The first support pin 31-1 stands at its base end, which is the other end in the z direction, from one end face in the z direction of the third support unit 32-1, which is a plate-like member. The second support pin 31-2 stands upright at its base end, which is the other end in the z direction, from one end face in the z direction of the fourth support portion 32-2, which is a plate-like member, and similarly, the third support pin 31-3 stands upright at its base end, which is the other end in the z direction, from one end face in the z direction of the fourth support portion 32-2, which is a plate-like member, and the second support pin 31-2 and the third support pin 31-3 are disposed at a predetermined interval (second interval) from each other in the x direction. The connecting portion 33 is a plate-like member that is wider in the y direction than the first support portion 11, and both ends of the connecting portion 33 in the y direction are connected and fixed to the other end faces in the z direction of the third and fourth support portions 32-1 and 32-2, respectively, so that the third and fourth support portions 32-1 and 32-2 stand upright. The third support portion 32-1 and the fourth support portion 32-2 are disposed on the outside of the first support portion 11 at a predetermined interval (third interval) in the y direction, and the third support portion 32-1, the connecting portion 33, and the fourth support portion 32-2 are sequentially connected in this order, forming a generally upward U-shape in front view, as shown in Fig. 2A. The first support portion 11 is disposed inside the U-shape formed by the third support portion 32-1, the connecting portion 33, and the fourth support portion 32-2. The first through third support pins 31-1 to 31-3 are disposed on the third and fourth support portions 32-1 and 32-2 so as to be located at the vertices of a triangle.The moving unit 34 is electrically connected to the control processing unit 4 and is a device for moving the first to third support pins 31-1 to 31-3 supported by the third and fourth support units 32-1, 32-2 and the connecting unit 33 in accordance with the control of the control processing unit 4 so that the center of the measurement object WA supported by the first to third support pins 31-1 to 31-3 can move along the x direction at least between the first position P1 and the second position P2. The moving unit 34 includes, for example, a box-shaped housing 34-1 and a pedestal 34-2 extending in the x direction from the inside of the first leg 12-1 to the inside of the second leg 12-2, the pedestal 34-2 including a rack extending in the x direction, the housing 34-1 being fixedly connected to the connecting unit 33 at its upper surface and including a pinion for linear movement on the rack and an actuator such as a servo motor for rotating the pinion, and the moving unit 34 is configured to linearly move the housing 34-1 and the connecting unit 33 relative to the pedestal 34-2 by the rack and pinion. The movement of the connecting unit 33 causes the measurement object WA supported by the first to third support pins 31-1 to 31-3 to move along the x direction.

[0028] The number of support pins 31 may be more than 3. The shape of the support pins 31 may be a shape other than a needle-like member or a thin column-like member.

[0029] The first leg 12-1, first support 11 and second leg 12-2 on which the first and second lifting and rotating units 1A and 1B are arranged, and the first support arm 22-1, second support arm 22-2 and second support 21 on which the first and second non-contact distance measurement units 2A and 2B are arranged are arranged so that the center of the first lifting and rotating unit 1A (first position P1), the centers of the first and second non-contact distance measurement units 2A and 2B and the center of the second lifting and rotating unit 1B (second position P2) are aligned in this order on a straight line along the x direction. The moving unit 3 is arranged relative to the first leg 12-1, first support unit 11, and second leg 12-2 and the first support arm 22-1, second support arm 22-2, and second support unit 21 arranged as described above so that when the measurement object WA is placed on the first lifting and rotating unit 1A (or the second lifting and rotating unit 1B) with the center of the first lifting and rotating unit 1A (or the center of the second lifting and rotating unit 1B) aligned with the center of the measurement object WA and the placed measurement object WA is supported by the first to third support pins 31-1 to 31-3, the center of the measurement object WA supported by the first to third support pins 31-1 to 31-3 moves on a straight line passing through the center of the first lifting and rotating unit 1A (first position P1) and the center of the second lifting and rotating unit 1B (second position P2).

[0030] The plate-like member 35 is a member that is provided in a position that is substantially parallel to the measurement object WA without contacting it during measurement by the first and second non-contact distance measurement units 2A and 2B, and that covers at least a portion of the measurement object WA when viewed from a direction perpendicular to the surface of the measurement object WA (the z direction in this embodiment). In this embodiment, since the measurement object WA is moved by the moving unit 34, the plate-like member 35 includes first and second plate-like members 35-1 and 35-2 that are arranged at a predetermined interval (fourth interval) that is slightly wider than the width (length in the y direction) of the first lifting and rotating unit 1A and the second lifting and rotating unit 1B.

[0031] The first plate-shaped member 35-1 is, for example, rectangular, and is attached and fixed to the first support pins 31-1 so that when the measurement object WA is placed at the tips of the first to third support pins 31-1 to 31-3, the back surface of the measurement object WA and the front surface of the first plate-shaped member 35-1 are parallel and the tips of the first support pins 31-1 protrude outside the first plate-shaped member 35-1. Therefore, the first plate-shaped member 35-1 and the measurement object WA are separated in the z direction by an interval (fifth interval) whose length corresponds to the length of the tips of the first support pins 31-1. Furthermore, in this embodiment, the first plate-shaped member 35-1 is attached to the first support pin 31-1 so that its side edge on the first support section 11 side, extending in the one direction (x direction), is parallel to the side edge of the first support section 11 and so that the first plate-shaped member 35-1 is positioned outside the first lifting and rotating section 1A and the second lifting and rotating section 1B in the width direction (y direction) of the first support section 11. When the measurement object WA is positioned at the tips of the first through third support pins 31-1 through 31-3, the first plate-shaped member 35-1 has an area that covers at least a portion of the measurement object WA that is outward in the +y direction from the first support section 11 (a first portion of the measurement object WA) as viewed from the z direction, and is attached to the first support pin 31-1 so that the back side of the measurement object WA covers this first portion. Therefore, the first portion of the measurement object WA and the first plate-shaped member 35-1 overlap in the z direction. The first plate-shaped member 35-1 is made of a conductive metal (including an alloy) such as aluminum and is grounded. Alternatively, the first plate-shaped member 35-1 is made of a semiconductor material such as a silicon semiconductor and is grounded. The first support pin 31-1 and the first plate-shaped member 35-1 may be configured to be attached to a member disposed below the first plate-shaped member 35-1.

[0032] The second plate-shaped member 35-2 is, for example, rectangular, and is attached and fixed to the second and third support pins 31-2, 31-3 so that when the measurement object WA is placed at the tips of the first to third support pins 31-1 to 31-3, the back surface of the measurement object WA and the front surface of the second plate-shaped member 35-2 are parallel and the tips of the second and third support pins 31-2, 31-3 protrude outside the second plate-shaped member 35-2 by a length corresponding to the fifth spacing. Therefore, the second plate-shaped member 35-2 and the measurement object WA are separated in the z direction by the fourth spacing. Furthermore, in this embodiment, the second plate-shaped member 35-2 is attached to the second and third support pins 31-2 and 31-3 so that its side edge on the first support member 11 side, extending in the one direction (x direction), is parallel to the side edge of the first support member 11 and is positioned outside the first lifting and rotating unit 1A and the second lifting and rotating unit 1B in the width direction (y direction) of the first support member 11. When the measurement object WA is positioned at the tips of the first through third support pins 31-1 through 31-3, the second plate-shaped member 35-2 has an area that covers at least a portion of the measurement object WA that is outward in the -y direction from the first support member 11 (a second portion of the measurement object WA) as viewed from the z direction, and is attached to the second and third support pins 31-2 and 31-3 so that the back side of the measurement object WA covers this second portion. Therefore, the second portion of the measurement object WA and the second plate-shaped member 35-2 overlap in the z direction. The second plate-shaped member 35-2 is made of a conductive metal (including an alloy) such as aluminum and is grounded. Alternatively, the second plate-shaped member 35-2 is made of a semiconductor material such as a silicon semiconductor and is grounded. The second and third support pins 31-2 and 31-3 and the second plate-shaped member 35-2 may be configured to be attached to a member disposed below the second plate-shaped member 35-2.

[0033] It is preferable that the first and second plate-like members 35-1, 35-2 each cover as much of the measurement object WA as possible without hindering the appearance and disappearance of the first and second lifting and rotating units 1A, 1B and without hindering the measurement of the second non-contact distance measurement unit 2B.

[0034] The fifth interval is a length that prevents contact between the measurement object WA and the first and second plate-like members 35-1 and 35-2 due to deflection of the measurement object WA due to its own weight, individual differences (product variations), etc. The shorter (smaller) the better. The fifth interval is, for example, several millimeters or less, such as 0.5 mm, 1 mm, or 2 mm.

[0035] The first and second plate-like members 35-1 and 35-2 are not limited to a rectangular shape and may have other shapes, such as a semicircular shape. When the first non-contact distance measurement unit 2A measures only the surface height distribution of the measurement target WA from a predetermined reference plane and the second non-contact distance measurement unit 2B does not perform measurement, the plate-like member 35 may be a single member, such as a square or circular member, with a through opening formed in the center that allows the first and second lifting and rotating units 1A and 1B to appear and disappear in the z direction.

[0036] The input unit 5 is electrically connected to the control processing unit 4 and is a device that inputs various commands, such as a command to start measurement, and various data required to operate the surface height distribution measuring device 1000, such as the name of the measurement target WA and a predetermined angle, to the surface height distribution measuring device 1000, and is, for example, a plurality of input switches to which predetermined functions are assigned, a keyboard, a mouse, etc. The output unit 6 is electrically connected to the control processing unit 4 and is a device that outputs the commands, data, calculation results, etc. input from the input unit 5 under the control of the control processing unit 4, and is, for example, a display device such as a CRT display, LCD (liquid crystal display), or organic EL display, or a printing device such as a printer.

[0037] The input unit 5 and the output unit 6 may be configured as a touch panel. In this case, the input unit 5 is a position input device, such as a resistive or capacitive type, that detects and inputs an operation position, and the output unit 6 is a display device. In this touch panel, a position input device is provided on the display surface of the display device, and one or more input content candidates that can be input are displayed on the display device. When a user touches the display position showing the input content they want to input, the position is detected by the position input device, and the display content displayed at the detected position is input to the surface height distribution measuring device 1000 as the user's operation input content. Such a touch panel makes it easy for the user to intuitively understand input operations, providing a surface height distribution measuring device 1000 that is easy for the user to use.

[0038] The IF unit 7 is electrically connected to the control processing unit 4 and is a circuit that inputs and outputs data to and from, for example, an external device under the control of the control processing unit 4, and is, for example, an interface circuit for RS-232C, which is a serial communication method, an interface circuit using the Bluetooth (registered trademark) standard, an interface circuit using the USB standard, etc. The IF unit 7 may also be, for example, a communication interface circuit that transmits and receives communication signals to and from an external device, such as a data communication card or a communication interface circuit conforming to the IEEE802.11 standard, etc.

[0039] The storage unit 8 is electrically connected to the control processing unit 4, and is a circuit that stores various predetermined programs and various predetermined data under the control of the control processing unit 4.

[0040] The various predetermined programs include, for example, a control processing program, and the control processing program includes, for example, a control program and a measurement control program. The control program controls each of the units 1A, 1B, 2A, 2B, 3, 5 to 8 of the surface height distribution measuring device 1000 according to the function of each unit. The measurement control program is a program that controls the measurement of the measurement object WA.

[0041] The various types of predetermined data include data necessary for executing each of these programs, such as the name of the measurement object WA, the predetermined angle, the predetermined sampling interval, and the measurement results.

[0042] The storage unit 8 includes, for example, a ROM (Read Only Memory), which is a nonvolatile storage element, and an EEPROM (Electrically Erasable Programmable Read Only Memory), which is a rewritable nonvolatile storage element. The storage unit 8 also includes a RAM (Random Access Memory), which serves as a working memory for the control processing unit 4 and stores data generated during execution of the predetermined program. The storage unit 8 may also be configured to include a hard disk drive or a solid state drive (SSD) with a relatively large storage capacity.

[0043] The control processing unit 4 is a circuit for controlling each of the units 1A, 1B, 2A, 2B, 3, 5 to 8 of the surface height distribution measuring device 1000 in accordance with the function of each unit, and for measuring the surface height distribution of the measurement object. The control processing unit 4 is configured to include, for example, a CPU (Central Processing Unit) and its peripheral circuits. In the control processing unit 4, a control unit 41 and a measurement control unit 42 are functionally configured by executing the control processing program.

[0044] The control unit 41 controls each of the units 1A, 1B, 2A, 2B, 3, 5 to 8 of the surface height distribution measuring device 1000 according to the function of each unit, and controls the surface height distribution measuring device 1000 as a whole.

[0045] The measurement control unit 42 controls the measurement of the measurement object WA. More specifically, the measurement control unit 42 controls the first lifting and rotating unit 1A to rotate the measurement object WA in the circumferential direction by a predetermined angle, controls the first lifting and rotating unit 1A and the support moving unit 3 to support the measurement object WA from the first lifting and rotating unit 1A, controls the support moving unit 3 and the first and second non-contact distance measuring units 2A and 2B to measure a first distance to the one surface of the measurement object WA and a second distance to the other surface of the measurement object WA at predetermined sampling intervals while the measurement object WA is moved by the support moving unit 3 from the first position P1 to the second position P2, and controls the support moving unit 3 and the first and second non-contact distance measuring units 2A and 2B to support the measurement object WA from the support moving unit 3. The moving unit 3 and the second lifting and rotating unit 1B are controlled to rotate the measurement object WA in the circumferential direction by the specified angle, the second lifting and rotating unit 1B and the support moving unit 3 are controlled to cause the support moving unit 3 to support the measurement object WA, the support moving unit 3 and the first and second non-contact distance measuring units 2A, 2B are controlled to measure the first and second distances at the specified sampling intervals while the measurement object WA is moved by the support moving unit 3 from the second position P2 to the first position P1, and the support moving unit 3 and the first lifting and rotating unit 1A are controlled to cause the measurement object WA to be supported by the first lifting and rotating unit 1A.

[0046] The thickness of the object WA can be calculated using the following method. The distance between the positions of the first non-contact distance measurement unit 2A and the second non-contact distance measurement unit 2B is determined in advance, and the thickness can be calculated from the distance from the first non-contact distance measurement unit 2A to the surface of the object WA and the distance from the second non-contact distance measurement unit 2B to the back surface of the object WA ((thickness of the object WA) = (distance between the positions of the first non-contact distance measurement unit 2A and the second non-contact distance measurement unit 2B) - ((first distance to the surface of WA measured by the first non-contact distance measurement unit 2A) + (second distance to the surface of WA measured by the second non-contact distance measurement unit 2B)). An apparatus that determines the thickness distribution of the object WA by determining the thickness at each measurement point of the object WA in this manner is also one form of the surface height distribution measuring device of the present invention.

[0047] The control processing unit 4, input unit 5, output unit 6, IF unit 7 and storage unit 8 in the surface height distribution measuring device 1000 can be configured by, for example, a desktop or notebook computer.

[0048] Next, the operation of this embodiment will be described. Fig. 3 is a flowchart showing the operation of the surface height distribution measuring device. Fig. 4 is a diagram for explaining the operation of the surface height distribution measuring device.

[0049] When the surface height distribution measuring device 1000 having such a configuration is powered on, it initializes the necessary parts and starts operation. The control processing unit 4 is functionally configured with a control unit 41 and a measurement control unit 42 by executing a control processing program.

[0050] In Figures 2 and 3, when the measurement object WA is placed on the first lifting and rotating unit 1A with its centers aligned, for example by a user or a robot arm (not shown), and an instruction to start measurement is given, the surface height distribution measuring device 1000 controls the first lifting and rotating unit 1A by the measurement control unit 42 of the control processing unit 4 so as to rotate the measurement object WA in the circumferential direction by a predetermined angle (S1, 1. Rotation of measurement object WA).

[0051] Next, the surface height distribution measuring device 1000 controls the first lifting and rotating unit 1A and the support moving unit 3 by the measurement control unit 42 so that the measurement object WA is supported by the support moving unit 3 by lifting and lowering from the first lifting and rotating unit 1A (S2).

[0052] Next, the surface height distribution measuring device 1000 controls the support and movement unit 3 and the first and second non-contact distance measurement units 2A and 2B by the measurement control unit 42 so that the first and second non-contact distance measurement units 2A and 2B measure a first distance to one surface of the measurement object WA and a second distance to the other surface of the measurement object WA at predetermined sampling intervals while moving the measurement object WA from the first position P1 to the second position P2 using the support and movement unit 3 (S3, 2. Measurement of the measurement object WA). The surface height distribution of one surface of the measurement object WA (the 1A surface height distribution (each height at each measurement point at the predetermined sampling interval)) measured by the first non-contact distance measurement unit 2A and the surface height distribution of the other surface of the measurement object WA (the 1B surface height distribution (each height at each measurement point at the predetermined sampling interval)) measured by the second non-contact distance measurement unit 2B are stored in the memory unit 8 in association with the measurement order n (or the cumulative rotation angle from the initial position (= (one rotation angle) × (number of measurements n)).

[0053] Next, the surface height distribution measuring device 1000 controls the support moving unit 3 and the second lifting and rotating unit 1B by the measurement control unit 42 so that the measurement object WA is supported by the second lifting and rotating unit 1B from the support moving unit 3 by raising and lowering (S4, measurement of 3.n line completed).

[0054] Next, the surface height distribution measuring device 1000 controls the second lifting and rotating unit 1B by the measurement control unit 42 so as to rotate the measurement object WA in the circumferential direction by the predetermined angle (S5, 4. Rotation of measurement object WA to the next line).

[0055] Next, the surface height distribution measuring device 1000 controls the second lifting and rotating unit 1B and the support moving unit 3 by the measurement control unit 42 so that the measurement object WA is supported by the support moving unit 3 by lifting and lowering from the second lifting and rotating unit 1B (S6).

[0056] Next, the surface height distribution measuring device 1000 controls the support and movement unit 3 and the first and second non-contact distance measurement units 2A and 2B by the measurement control unit 42 so that the first and second non-contact distance measurement units 2A and 2B measure the first and second distances at the predetermined sampling intervals while moving the measurement object WA from the second position P2 to the first position P1 by the support and movement unit 3 (S7, 5. Measurement of measurement object WA). The surface height distribution of one surface of the measurement object WA (the second-A surface height distribution), which is the measurement result of the first non-contact distance measurement unit 2A, and the surface height distribution of the other surface of the measurement object WA (the second-B surface height distribution), which is the measurement result of the second non-contact distance measurement unit 2B, are stored in the memory unit 8 in association with the measurement order n (or the cumulative rotation angle from the initial position).

[0057] Next, the surface height distribution measuring device 1000 controls the support moving unit 3 and the first lifting and rotating unit 1A by the measurement control unit 42 so that the measurement object WA is supported by the first lifting and rotating unit 1A from the support moving unit 3 by raising and lowering (S8, 6. Measurement of (n+1) line completed).

[0058] Next, the surface height distribution measuring device 1000 determines whether or not the measurement has ended using the measurement control unit 42 (S9). If the result of this determination is that the measurement has ended (Yes), the surface height distribution measuring device 1000 outputs each measurement result to the output unit 6 (S10) and ends this process. On the other hand, if the result of the determination is that the measurement has not ended (No), the surface height distribution measuring device 1000 returns the process to step S1. The determination of whether or not the measurement has ended is made based on whether or not measurements have been performed a required number of times, which is calculated by dividing 360 degrees by the angle of one rotation (if the required number of measurements is an even number, the end of the measurement is determined when the required number of measurements has been performed, and if the required number of measurements is an odd number, the end of the measurement is determined when (the required number of measurements + 1) has been performed).

[0059] If necessary, the measurement control unit 42 may output each measurement result to an external device via the IF unit 7. In addition, in the above description, this step S1 may be omitted in the first measurement immediately after the start of measurement.

[0060] As described above, the surface height distribution measuring device 1000 in the embodiment includes the plate-like member 35, and therefore vibrations can be suppressed by the air layer between the measurement object WA and the plate-like member 35, allowing for more accurate measurements.

[0061] In the surface height distribution measuring device 1000, a capacitor is formed between the measurement target and the plate-like member. When the first and second non-contact distance measuring units 2A and 2B are capacitance-type displacement meters, an AC electric field is generated during the measurement, and the capacitor enables the surface height distribution measuring device 1000 to reduce noise in the measurement by the capacitance-type displacement meters.

[0062] The surface height distribution measuring device 1000 measures each surface height distribution on the outbound path moving from the first position P1 to the second position P2 and on the return path moving from the second position P2 to the first position P1, thereby reducing the measurement time compared to when measurements are taken on only one of the outbound path or the return path.

[0063] The surface height distribution measuring device 1000 includes first and second non-contact distance measuring units 2A and 2B that face each other across the measurement object WA, and can therefore simultaneously measure the surface height distributions of one surface and the other surface of the measurement object WA.

[0064] In order to express the present invention, the present invention has been properly and sufficiently described above through the embodiments with reference to the drawings, but it should be recognized that those skilled in the art can easily change and / or improve the above-mentioned embodiments. Therefore, unless the changes or improvements made by those skilled in the art are at a level that causes departure from the scope of the claims described in the claims, such changes or improvements are interpreted as being included in the scope of the claims. [Explanation of symbols]

[0065] 1000 Surface height distribution measuring device 1A First lifting and rotating part 1B Second lifting and rotating section 2A 1st non-contact distance measurement section 2B 2nd non-contact distance measurement section 3 Support moving part 4 Control processing section 8 Memory section 35 Plate-shaped members 35-1 First plate-shaped member 35-2 Second plate-shaped member 42 Measurement control section

Claims

1. A surface height distribution measuring device for measuring a surface height distribution of a plate-shaped measurement target, comprising: a non-contact distance measurement unit that measures the distance to the surface of the measurement object in a non-contact manner; a moving unit that moves the measurement object and the non-contact distance measuring unit relatively; a plate-like member that is disposed in a position that is substantially parallel to the object to be measured without contacting the object to be measured during measurement by the non-contact distance measurement unit, and that covers at least a portion of the object to be measured when viewed from a direction perpendicular to the surface of the object to be measured; Surface height distribution measuring device.

2. the measurement object is either a conductor or a semiconductor, the non-contact distance measurement unit is a capacitance type displacement meter, the plate-shaped member is either a conductor or a semiconductor that is grounded; The surface height distribution measuring device according to claim 1 .

3. the measurement object is disk-shaped, a first rotating unit disposed at a first position and configured to rotate the measurement object by a predetermined angle in a circumferential direction; a second rotating unit that is arranged at a second position different from the first position and rotates the measurement object in a circumferential direction by the predetermined angle, the moving unit moves the measurement object and the non-contact distance measurement unit relatively between the first and second positions; The surface height distribution measuring device according to claim 1 .

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