Heat seal portion processing device

Abstract

To eliminate the need of additionally securing a space for inspection in order to process and inspect a heat seal part of a specimen, and to improve the processing efficiency of the specimen.SOLUTION: The ultrasonic testing device includes two blocks 2, 3 for sandwiching and cooling a heat seal part 101 of a subject 100, a transmitter 4 provided in the first block 2 and transmitting ultrasonic waves W1, and a receiver 5 provided in the second block 3 and capable of receiving the ultrasonic waves transmitted from the transmitter. This heat seal part processing device 1 inspects the heat seal part based on an ultrasonic wave transmitted from a transmitting element and received by a receiving element via the heat seal part in a state where the heat seal part is positioned between two blocks.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present invention relates to a heat-sealing processing device. [Background technology]

[0002] Patent document 1 discloses a sealing machine that heat-seals the filling port of a retort pouch (subject), and then sandwiches the sealed filling port (heat-sealed portion) between two cooling blocks (cooling blocks) to cool the filling port and remove any wrinkles. Patent Document 2 discloses a method in which the sealed portion of a retort pouch (subject) is melt-bonded (heat-sealed), the sealed portion (heat-sealed portion) is then clamped between two cooling bars (cooling blocks) to cool it, and the surface of the sealed portion is then inspected using a television camera or the like. There are also inspection devices that use ultrasonic waves to detect defects inside heat-sealed portions of various test specimens. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Special Publication No. 55-020922 [Patent Document 2] Japanese Patent Application Laid-Open No. 58-193237 Summary of the Invention [Problem to be solved by the invention]

[0004] However, in the machines and methods of Patent Documents 1 and 2, in order to detect internal defects in the heat-sealed portion of the test specimen, it is necessary to install an additional inspection device before or after the point where the heat-sealed portion is cooled by the cooling block. In this case, it is necessary to secure additional space for installing the inspection device and for installing a mechanism for guiding the heat-sealed portion of the test specimen to the inspection device. Reserving such space is undesirable because it increases the size of the entire test specimen processing device. Furthermore, since the cooling process of the heat-sealed portion and the inspection process are carried out separately, the processing time for the specimen is longer than if there was no inspection process, which means that the processing efficiency of the specimen is low.

[0005] The present invention has been made in consideration of the above-mentioned circumstances, and aims to provide a heat-sealing processing device that does not require additional space for testing and also enables improved processing efficiency of specimens. [Means for solving the problem]

[0006] One aspect of the present invention is a heat-sealing processing device that includes two blocks that sandwich at least a heat-sealed portion of a test object and cool the heat-sealed portion, a emitting element that is provided in the first of the two blocks and emits ultrasonic waves or electromagnetic waves, and a receiving element that is provided in the first or second of the two blocks and is capable of receiving the ultrasonic waves or electromagnetic waves emitted from the emitting element, and that cools the heat-sealed portion by sandwiching the heat-sealed portion between the two blocks, and inspects the heat-sealed portion based on the ultrasonic waves or electromagnetic waves that are emitted from the emitting element and received by the receiving element through the heat-sealed portion when the heat-sealed portion is positioned between the two blocks. [Effects of the Invention]

[0007] According to the present invention, there is no need to secure additional space for testing, and it is possible to improve the processing efficiency of specimens. [Brief explanation of the drawings]

[0008] [Figure 1] 1 is a perspective view schematically showing a heat-sealing processing device according to a first embodiment. FIG. [Figure 2] 2 is a cross-sectional view showing a state in which a heat-sealed portion of a test object is sandwiched between two blocks in the heat-sealing processing device of FIG. 1. FIG. [Figure 3] 3 is a plan view showing an arrangement of a plurality of receiving elements in the heat-sealing processing device of FIGS. 1 and 2. FIG. [Figure 4] 10 is a cross-sectional view showing a state in which a heat-sealed portion of a test object is sandwiched between two blocks in a heat-sealing processing device according to a second embodiment. FIG. DETAILED DESCRIPTION OF THE INVENTION

[0009] First Embodiment A first embodiment of the present invention will be described below with reference to FIGS. As shown in Figures 1 and 2, the heat-sealing processing device 1 is a device that cools and inspects a heat-sealed portion 101 of an object 100. In this embodiment, the object 100 is formed by overlapping the edge portions of a sheet-shaped member 102 and joining them by heat sealing (melting adhesion). The heat-sealed portion 101 of the object 100 is the edge portion of the sheet-shaped member 102 joined by heat sealing. In Figure 1, the heat-sealed portion 101 is formed in a long, narrow rectangular shape. The heat-sealing processing device 1 inspects whether there are any defects such as air bubbles inside the heat-sealed portion 101.

[0010] The heat-sealing unit processing device 1 includes two blocks 2 and 3, a transmitting element 4, a receiving element 5, and an acoustic matching layer 6.

[0011] The two blocks 2, 3 sandwich and cool at least the heat-sealed portion 101 of the subject 100. The two blocks 2, 3 have contact surfaces 2a, 3a that come into contact with the heat-sealed portion 101, respectively. The contact surfaces 2a, 3a may intersect the direction in which the two blocks 2, 3 are arranged. In this embodiment, the contact surfaces 2a, 3a are perpendicular to the direction in which the two blocks 2, 3 are arranged. Each block 2, 3 is formed in an elongated shape corresponding to the shape of the heat-sealed portion 101. The contact surfaces 2a, 3a of each block 2, 3 are also formed in a similarly elongated shape. It is preferable that each block 2, 3 be formed from a material with high thermal conductivity, for example.

[0012] In the following description, the direction in which the two blocks 2 and 3 are aligned may be referred to as the arrangement direction Z. Furthermore, the longitudinal direction of the contact surfaces 2a and 3a of the blocks 2 and 3 may be referred to as the first orthogonal direction X, and the lateral direction of the contact surfaces 2a and 3a may be referred to as the second orthogonal direction Y.

[0013] The two blocks 2, 3 are movable relative to each other in the arrangement direction Z. This allows the two blocks 2, 3 to move closer to or farther away from each other. In FIG. 1, both of the two blocks 2, 3 are movable in the arrangement direction Z as shown by arrow D1, but, for example, only one of the two blocks 2, 3 may be movable in the arrangement direction Z. By moving closer to or farther away from each other, the two blocks 2, 3 can be switched between an open state in which they are spaced apart from the heat-sealed portion 101 as shown in FIG. 1 and a clamping state in which they clamp the heat-sealed portion 101 as shown in FIG. 2. In the following description, one of the two blocks 2 and 3 may be referred to as a first block 2, and the other of the two blocks 2 and 3 may be referred to as a second block 3.

[0014] The transmitting element 4 is provided in the first block 2. The transmitting element 4 transmits ultrasonic waves W1 toward the second block 3. The transmitting element 4 is formed in an elongated shape corresponding to the shape of the heat-sealed portion 101.

[0015] The receiving element 5 is capable of receiving the ultrasonic wave W1 transmitted from the transmitting element 4. In this embodiment, the receiving element 5 is provided in the second block 3.

[0016] The heat-sealing processing device 1 of this embodiment includes a plurality of receiving elements 5. As shown in Figures 2 and 3, the plurality of receiving elements 5 are arranged in a matrix along the contact surface 3a of the second block 3. That is, the plurality of receiving elements 5 are aligned in a first orthogonal direction X and a second orthogonal direction Y that are orthogonal to the arrangement direction Z.

[0017] 2, the acoustic matching layer 6 constitutes the contact surfaces 2a, 3a of the first block 2 and the second block 3 on which the transmitting element 4 and the receiving element 5 are provided. When the heat-sealed portion 101 of the subject 100 is sandwiched between the two blocks 2, 3, the acoustic matching layer 6 is located between the transmitting element 4 and the receiving element 5 and the heat-sealed portion 101. The acoustic impedance value of the acoustic matching layer 6 is set to a value between the acoustic impedance values ​​of the transmitting element 4 and the receiving element 5 and the acoustic impedance value of the heat-sealed portion 101.

[0018] In the heat-sealing processing apparatus 1 configured as above, the heat-sealed portion 101 of the specimen 100 is sandwiched between the two blocks 2 and 3, thereby cooling the heat-sealed portion 101. Furthermore, with the heat-sealed portion 101 positioned between the two blocks 2 and 3, the heat-sealed portion 101 is inspected based on ultrasonic waves W1 that are transmitted from the transmitting element 4 and received by the receiving element 5 via the heat-sealed portion 101. That is, in order to cool the heat-sealed portion 101, inspection of the heat-sealed portion 101 using ultrasonic waves W1 is carried out while the heat-sealed portion 101 is positioned between the two blocks 2 and 3.

[0019] Inspection of the heat-sealed portion 101 in the heat-sealing processing apparatus 1 of this embodiment is performed as follows. First, as shown in Fig. 2, ultrasonic waves W1 emitted from the transmitting element 4 provided in the first block 2 pass through the heat-sealed portion 101 and reach the receiving element 5 provided in the second block 3. Then, by analyzing the ultrasonic waves W1 received by the receiving element 5, the heat-sealed portion 101 is inspected for defects therein.

[0020] The above-described inspection of the heat-sealed portion 101 may be carried out in a state in which the heat-sealed portion 101 is sandwiched between two blocks 2 and 3, as illustrated in Fig. 2. In other words, the inspection may be carried out simultaneously with the cooling of the heat-sealed portion 101. Furthermore, the above-described inspection of the heat-sealed portion 101 may be performed, for example, in a state in which the heat-sealed portion 101 is located between the two blocks 2 and 3, and one or both of the two blocks 2 and 3 are separated from the heat-sealed portion 101. In other words, the inspection may be performed immediately before or after the heat-sealed portion 101 is cooled.

[0021] As described above, in the heat-sealing processing apparatus 1 of the first embodiment, the transmitting element 4 and the receiving element 5 are provided in the two blocks 2 and 3. The heat-sealed portion 101 of the test object 100 is sandwiched between the two blocks 2 and 3 to cool the heat-sealed portion 101. With the heat-sealed portion 101 positioned between the two blocks 2 and 3, the heat-sealed portion 101 is inspected based on the ultrasonic waves W1 transmitted from the transmitting element 4 and received by the receiving element 5 via the heat-sealed portion 101. Therefore, there is no need to secure additional space for testing, compared to when the testing transmitting element 4 and receiving element 5 are provided separately from the two cooling blocks 2 and 3. Furthermore, since both cooling and testing of the heat-sealed portion 101 can be performed while the heat-sealed portion 101 is positioned between the two blocks 2 and 3, the processing efficiency of the specimen 100 can also be improved.

[0022] Furthermore, in the heat-sealing processing apparatus 1 of the first embodiment, the heat-sealed portion 101 can be inspected while sandwiched between the two blocks 2 and 3. That is, the heat-sealed portion 101 is inspected while the two cooling blocks 2 and 3, each equipped with a transmitting element 4 and a receiving element 5, are in contact with the heat-sealed portion 101 of the test object 100. This allows the inspection ultrasonic waves W1 to pass only through the inside of the heat-sealed portion 101 and not through the air. This improves the reception sensitivity of the ultrasonic waves W1 at the receiving element 5, enabling defects inside the heat-sealed portion 101 to be detected with higher accuracy.

[0023] Furthermore, in the heat-sealing portion processing apparatus 1 of the first embodiment, the transmitting element 4 is provided in the first block 2, and the receiving element 5 is provided in the second block 3. That is, the transmitting element 4 and the receiving element 5 are arranged in different blocks 2 and 3. This makes it possible to arrange the transmitting element 4 and the receiving element 5 more closely in each block 2 and 3, compared to when the transmitting element 4 and the receiving element 5 are arranged in the same block. As a result, the resolution for inspecting the heat-sealed portion 101 can be improved.

[0024] Furthermore, in the heat-sealing portion processing device 1 of the first embodiment, the acoustic matching layer 6 is located between the transmitting element 4 and the receiving element 5 and the heat-sealed portion 101 when the heat-sealed portion 101 is sandwiched between the two blocks 2 and 3. This reduces the difference in acoustic impedance between the transmitting element 4, the receiving element 5 and the heat-sealed portion 101 in the acoustic matching layer 6. Therefore, when the heat-sealed portion 101 is sandwiched between the two blocks 2 and 3, the ultrasonic waves W1 emitted from the transmitting element 4 can be prevented from reflecting or interfering at the boundary between the transmitting element 4 and the heat-sealed portion 101. Furthermore, when the heat-sealed portion 101 is sandwiched between the two blocks 2 and 3, the ultrasonic waves W1 emitted from the transmitting element 4 and passing through the heat-sealed portion 101 can be prevented from reflecting or interfering at the boundary between the heat-sealed portion 101 and the receiving element 5. This makes it possible to detect defects inside the heat-sealed portion 101 with higher accuracy.

[0025] Furthermore, in the heat-sealing processing apparatus 1 of the first embodiment, the plurality of receiving elements 5 are arranged in a matrix along the contact surface 3a of the second block 3 on which the receiving elements 5 are provided, which contacts the heat-sealed portion 101 of the test object 100. This allows the plurality of receiving elements 5 to correspond to the entire contact surface. Therefore, it becomes possible to detect defects inside the heat-sealed portion 101 with high accuracy compared to, for example, a case where one receiving element 5 corresponds to the entire contact surface 3a.

[0026] Second Embodiment Next, a second embodiment of the present invention will be described with reference to Fig. 4. In the following description, components common to those already described will be assigned the same reference numerals and duplicated description will be omitted.

[0027] 4, the heat-sealing section processing device 1C of the second embodiment is configured similarly to the first embodiment except for the position of the receiving element 5. In the second embodiment, the receiving element 5 is provided in the first block 2 together with the transmitting element 4, and is not provided in the second block 3. The second block 3 is preferably configured to reflect the ultrasonic waves W1 transmitted from the transmitting element 4 of the first block 2 at least at the contact surface 3a.

[0028] 4, the transmitting element 4 and the receiving element 5 provided in the same first block 2 are integrally formed, but this is not limiting. For example, the transmitting element 4 and the receiving element 5 may be provided separately in the same first block 2. In this case, the transmitting element 4 and the receiving element 5 should be provided in the first block 2 so that the ultrasonic waves W1 transmitted from the transmitting element 4 are not blocked by the receiving element 5 before being emitted from the contact surface 2a of the first block 2 to the outside, and so that the ultrasonic waves W1 incident on the contact surface 2a of the first block 2 from the outside reach the receiving element 5 without being blocked by the transmitting element 4.

[0029] The heat-sealing section processing device 1C of the second embodiment may include a plurality of receiving elements 5, similar to the first embodiment. In this case, the plurality of receiving elements 5 may be arranged in a matrix along the contact surface 2a of the first block 2.

[0030] In the heat-sealing portion processing device 1C of the second embodiment, the acoustic matching layer 6 constitutes the contact surface 2a of the first block 2 on which the transmitting element 4 and the receiving element 5 are provided. When the heat-sealed portion 101 of the subject 100 is sandwiched between the two blocks 2 and 3, the acoustic matching layer 6 is located between the transmitting element 4 and the receiving element 5 provided in the first block 2 and the heat-sealed portion 101.

[0031] In the heat-sealing processing apparatus 1C of the second embodiment configured as described above, the heat-sealed portion 101 of the specimen 100 is sandwiched between the two blocks 2 and 3 to cool the heat-sealed portion 101, as in the first embodiment. Furthermore, as in the first embodiment, when the heat-sealed portion 101 is positioned between the two blocks 2 and 3, the heat-sealed portion 101 is inspected based on the ultrasonic waves W1 transmitted from the transmitting element 4 and received by the receiving element 5 via the heat-sealed portion 101.

[0032] However, the heat-sealed portion 101 is inspected in the heat-sealing processing apparatus 1C of the second embodiment as follows: First, ultrasonic waves W1 emitted from the transmitting element 4 provided in the first block 2 pass through the heat-sealed portion 101 and are reflected by the contact surface 3a of the second block 3. Next, the reflected ultrasonic waves W1 pass through the heat-sealed portion 101 again and reach the receiving element 5 provided in the first block 2. The ultrasonic waves W1 received by the receiving element 5 are then analyzed to inspect whether or not there are any defects inside the heat-sealed portion 101. Therefore, in the heat-sealing section processing device 1C of the second embodiment, the heat-sealed section 101 is also inspected while the heat-sealed section 101 is positioned between the two blocks 2 and 3 in order to cool the heat-sealed section 101.

[0033] 4, the heat-sealed portion 101 may be inspected while sandwiched between two blocks 2 and 3. Alternatively, the heat-sealed portion 101 may be inspected while the heat-sealed portion 101 is located between the two blocks 2 and 3 and one or both of the two blocks 2 and 3 are spaced apart from the heat-sealed portion 101.

[0034] The heat-sealing processing device 1C of the second embodiment has the same effects as the first embodiment. Furthermore, in the heat-sealing portion processing apparatus 1C of the second embodiment, both the transmitting element 4 and the receiving element 5 for inspection are provided in the first block 2. Therefore, the portion of the second block 3 that comes into contact with the heat-sealed portion 101 can be made of a material with higher thermal conductivity than the transmitting element 4 and the receiving element 5. This allows the heat-sealed portion 101 to be cooled efficiently.

[0035] Although the present invention has been described in detail above, the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the spirit of the present invention.

[0036] In the present invention, the transmitting element 4 may transmit, for example, electromagnetic waves. In this case, the receiving element 5 may be configured to be able to receive the electromagnetic waves. The electromagnetic waves may be, for example, X-rays or infrared rays. Such a heat-sealing portion processing device does not include an acoustic matching layer 6. Therefore, the transmitting element 4 and the receiving element 5 may form the contact surfaces 2a and 3a of the blocks 2 and 3. Even with such a configuration, the same effects as those of the above-mentioned embodiment can be achieved. [Explanation of symbols]

[0037] 1...heat seal processing device, 2...first block (block), 2a...contact surface, 3...second block (block), 3a...contact surface, 4...transmitting element, 5...receiving element, 6...acoustic matching layer, 100...subject, 101...heat seal portion

Claims

1. two blocks sandwiching at least a heat-sealed portion of the specimen and cooling the heat-sealed portion; a transmitting element provided in the first block of the two blocks and configured to transmit ultrasonic waves or electromagnetic waves; a receiving element provided in the first block or the second block of the two blocks and capable of receiving the ultrasonic waves or electromagnetic waves transmitted from the transmitting element; Equipped with the heat-sealed portion is cooled by sandwiching the heat-sealed portion between the two blocks; A heat seal processing device that inspects the heat seal portion based on ultrasonic or electromagnetic waves emitted from the emitting element and received by the receiving element via the heat seal portion when the heat seal portion is positioned between the two blocks.

2. 2. The heat-sealing processing device according to claim 1, wherein the heat-sealed portion is inspected based on ultrasonic waves or electromagnetic waves emitted from the emitting element and received by the receiving element through the heat-sealed portion while the heat-sealed portion is sandwiched between the two blocks.

3. The heat-sealing processing apparatus according to claim 1 or 2, wherein the receiving element is provided in the second block.

4. The heat-sealing processing apparatus according to claim 1 or 2, wherein the receiving element is provided in the first block.

5. The transmitting element transmits ultrasonic waves, the receiving element is capable of receiving the ultrasonic wave transmitted from the transmitting element, an acoustic matching layer that forms a contact surface that contacts the heat-sealed portion of the block on which the transmitting element and the receiving element are provided, 3. The heat-sealing processing device according to claim 1, wherein the acoustic matching layer is positioned between the transmitting element and the receiving element and the heat-sealing portion when the heat-sealing portion is sandwiched between the two blocks.

6. 3. The heat-sealing processing device according to claim 1, wherein the plurality of receiving elements are arranged in a matrix along a contact surface of the block on which the receiving elements are provided that contacts the heat-sealed portion.

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