Coil device

The coil device with a metal powder and resin core, along with a coupling adjustment material, addresses positioning inaccuracies and magnetic material issues, achieving precise and flexible coupling coefficient adjustment.

JP2026019664APending Publication Date: 2026-02-05TDK CORP
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Patent Information

Application Number
JP2024121386
Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Filing Date
2024-07-26
Publication Date
2026-02-05

AI Technical Summary

Technical Problem

Conventional coil devices face challenges in accurately adjusting the coupling coefficient between conductors due to positioning inaccuracies and the presence of magnetic materials in the gap, leading to deviations from the intended design value.

Method used

The coil device incorporates a core made of metal powder and resin, with conductors having specific connection and mounting portions, and utilizes a coupling adjustment material in the inter-conductor gap to adjust the coupling coefficient, ensuring precise positioning and a wide adjustment range.

Benefits of technology

This design enhances positioning accuracy and allows for flexible adjustment of the coupling coefficient, reducing variations and enabling manufacturing of coil devices with varied coupling coefficients while maintaining consistent external shape.

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Abstract

To provide a coil device capable of accurately adjusting a coupling coefficient between a first conductor and a second conductor.SOLUTION: A first conductor portion including a core portion including a magnetic powder and a resin, a first coil portion in the core portion, a first mounting portion facing a mounting target, and a first connecting portion connecting the first coil portion and the first mounting portion, and a second conductor portion including a second coil portion in the core portion, a second mounting portion facing a mounting target, and a second connecting portion connecting the second coil portion and the second mounting portion, the second coil portion extends along the winding direction of the first coil portion inside the first coil portion, a coupling adjuster including at least one of a non-magnetic material portion containing a resin and a magnetic material portion containing a magnetic material is disposed in the second coil portion, and an inter-conductor gap in which a distance between the first conductor portion and the second conductor portion increases as the first connecting portion and the second connecting portion move away from the winding direction is formed between the first conductor portion and the second conductor portion.SELECTED DRAWING: Figure 1
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Description

[Technical Field]

[0001] The present invention relates to a coil device used as an inductor or the like for low-voltage, high-current applications. [Background technology]

[0002] There has been an increasing demand for coil devices for low-voltage, high-current applications, such as in TLVR circuits. For example, the coil device shown in Patent Document 1 has been proposed as an example of a coil device for low-voltage, high-current applications. However, conventional coil devices have a problem in that it is difficult to adjust the coupling coefficient between the first conductor and the second conductor inside the core. For example, if the positioning accuracy between the first conductor and the second conductor is low or if a magnetic material unintentionally enters the gap between the first conductor and the second conductor, the coupling coefficient between the first conductor and the second conductor may not be the value intended at the time of design, which is a problem. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Publication No. 2022-33703 Summary of the Invention [Problem to be solved by the invention]

[0004] The present disclosure relates to a coil device that can accurately adjust the coupling coefficient between a first conductor and a second conductor. [Means for solving the problem]

[0005] In order to solve the above problem, the coil device according to the present disclosure includes a core portion including metal powder and resin; a first conductor portion having a first coil portion located within the core portion, a first mounting portion at least a portion of which is exposed from the core portion and faces a mounting target, and a first connection portion which connects the first coil portion and the first mounting portion; a second conductor portion including a second coil portion located within the core portion, a second mounting portion at least a portion of which is exposed from the core portion and faces a mounting target, and a second connection portion which connects the second coil portion and the second mounting portion; the second coil portion extends inside the first coil portion along the winding direction of the first coil portion, A conductor gap is formed between the first conductor portion and the second conductor portion, in which the distance between the first conductor portion and the second conductor portion increases as at least one of the first connection portion and the second connection portion moves away from the winding direction and approaches the mounting target side, and a coupling adjustment material having at least one of a non-magnetic material portion containing resin and a magnetic material portion containing magnetic material is arranged in the conductor gap.

[0006] In this coil device, the second coil portion of the second conductor extends inside the first coil portion along the winding direction of the first coil portion, thereby improving the positioning accuracy between the first conductor portion and the second conductor portion and suppressing variations in the coupling coefficient between the first conductor and the second conductor. Furthermore, because an inter-conductor gap is formed between the first conductor portion and the second conductor portion, this coil device can accurately adjust the coupling coefficient between the first conductor and the second conductor by changing the size of this inter-conductor gap or the coupling adjustment material disposed in the inter-conductor gap. Furthermore, because the inter-conductor gap has a shape that widens as it approaches the mounting target side, this coil device can ensure a wide adjustment range for the coupling coefficient between the first conductor portion 30 and the second conductor portion 40.

[0007] Furthermore, for example, the content of the resin contained in the bond adjuster may be greater than the content of the resin contained in the core portion.

[0008] By increasing the content of resin in the bond adjuster and decreasing the content of magnetic material, the coupling coefficient between the first conductor and the second conductor can be increased.

[0009] Furthermore, for example, the bond adjuster may have a magnetic material portion containing a magnetic material.

[0010] By including a magnetic material portion in the coupling adjuster, it is possible to ensure a wide adjustment range for the coupling coefficient between the first conductor and the second conductor.

[0011] Furthermore, for example, the magnetic material contained in the bond adjuster may be metal powder, and the content ratio of the metal powder to the resin contained in the bond adjuster may be substantially the same as that of the core portion.

[0012] Such a coil device is easy to manufacture because the coupling adjustment material can be constructed by placing the same material as that constituting the core portion in the gap between the conductors, and it is possible to more effectively prevent variation in the coupling coefficient from the design value.

[0013] Furthermore, for example, the magnetic material portion may have a higher magnetic permeability than the core portion.

[0014] By using a material with high magnetic permeability as a coupling adjustment material, the coupling coefficient between the first conductor and the second conductor can be made lower, and a wide adjustment range for the coupling coefficient between the first conductor and the second conductor can be ensured.

[0015] Furthermore, for example, the first connection portion is bent, and the first mounting portion to which the first connection portion is connected extends toward a side away from the central axis of the device with respect to the first connection portion connected to the first coil portion, The second connection portion may be curved, and the second mounting portion to which the second connection portion is connected may extend toward the side closer to the central axis of the device relative to the second connection portion connected to the second coil portion.

[0016] In such a coil device, the first connection portion and the second connection portion are bent in opposite directions, so that a wide gap can be formed between the conductors, and such a coil device can ensure a wide adjustment range for the coupling coefficient between the first conductor and the second conductor.

[0017] Furthermore, for example, the connection position between the first connection portion and the first coil portion may be further away from a plane including a first mounting surface facing the mounting target in the first mounting portion and a second mounting surface facing the mounting target in the second mounting portion than the connection position between the second connection portion and the second coil portion.

[0018] By positioning the connection position between the first coil portion arranged on the outside and the first connection portion higher than the connection position between the second coil portion arranged on the inside and the second connection portion, the curvature of the curved portions included in the first conductor portion, such as the first connection portion, can be suppressed overall, and shape variations in the first conductor portion due to bending processing can be suppressed.

[0019] Furthermore, for example, the first connection portion is linear and connects the first coil portion and the first mounting portion in a straight line, The second connection portion may be curved, and the second mounting portion to which the second connection portion is connected may extend toward a side closer to the central axis of the device relative to the second connection portion connected to the second coil portion.

[0020] By making the first connection portion of the first conductor portion arranged on the outside linear, the curvature of the curved portion included in the first conductor portion can be reduced overall, and variation in the shape of the first conductor portion can be reduced.

[0021] Furthermore, for example, the first coil portion may have a larger cross-sectional area in a cross section perpendicular to the winding direction than the second coil portion.

[0022] In such a coil device, the first coil section, which has a larger cross-sectional area, is positioned outside the second coil section, thereby reducing the overall curvature of the curved portions included in the first conductor section and reducing shape variation in the first conductor section.

[0023] Furthermore, for example, at least one of the first mounting portion upper surface, which is the surface in the first mounting portion facing the opposite direction from the first mounting surface facing the mounting target, and the second mounting portion upper surface, which is the surface in the second mounting portion facing the opposite direction from the second mounting surface facing the mounting target, may be farther away from the plane including the first mounting surface and the second mounting surface than the core lower surface of the core portion.

[0024] In such a coil device, by lowering the lower surface of the core portion, the self-inductance can be increased and leakage of magnetic flux to the outside can be suppressed.

[0025] Furthermore, for example, the bond adjuster may be disposed inside the core portion.

[0026] Such a coil device can lower the coupling coefficient between the first conductor portion and the second conductor portion by increasing the magnetic flux passing through the coupling adjustment material, and can ensure a wide adjustment range for the coupling coefficient between the first conductor portion and the second conductor portion.

[0027] Further, for example, the inner surface of the first coil portion and the outer surface of the second coil portion may be connected by an adhesive hardened portion where an adhesive is hardened, The adhesive curing portion may extend along the winding direction and have an end connected to the bond adjuster.

[0028] Such a coil device prevents misalignment of the first and second conductor portions during manufacturing, and allows the amount of resin contained in the joint adjustment material to be adjusted with precision, thereby enabling more precise adjustment of the coupling coefficient between the first conductor and the second conductor. [Brief explanation of the drawings]

[0029] [Figure 1] FIG. 1 is a perspective view of a coil device according to an embodiment of the present disclosure, viewed obliquely from below. [Figure 2] FIG. 2 is a perspective view of the coil device shown in FIG. 1, seen obliquely from above. [Figure 3]3 is a bottom view of the core of the coil device shown in FIG. [Figure 4] FIG. 4 is a first cross-sectional view of the coil device shown in FIG. [Figure 5] FIG. 5 is a second cross-sectional view of the coil device shown in FIG. [Figure 6] 6 is a perspective view showing a first conductor portion, a second conductor portion, an adhesive curing portion, and a bond adjuster of the coil device shown in FIG. [Figure 7] FIG. 7 is a conceptual diagram showing a first conductor portion, an adhesive curing portion, and a bond adjuster of the coil device shown in FIG. [Figure 8] FIG. 8 is a conceptual diagram showing a second conductor portion of the coil device shown in FIG. [Figure 9] FIG. 9 is a conceptual diagram showing the positional relationship between the core portion and the inter-conductor gaps of the coil device shown in FIG. [Figure 10] FIG. 10 is a conceptual diagram showing the positional relationship between the core portion and the inter-conductor gaps of the coil device according to the first modified example. [Figure 11] FIG. 11 is a conceptual diagram showing the positional relationship between the core portion and the inter-conductor gaps of a coil device according to a second modified example. [Figure 12] FIG. 12 is a conceptual diagram of a coil device according to the second embodiment. [Figure 13] FIG. 13 is a conceptual diagram showing the first conductor, the second conductor, the adhesive curing portion, and the bond adjuster included in the coil device shown in FIG. [Figure 14] FIG. 14 is a conceptual diagram of a coil device according to the third embodiment. [Figure 15] FIG. 15 is a conceptual diagram showing the first conductor, the second conductor, and the coupling adjuster included in the coil device shown in FIG. [Figure 16] FIG. 16 is a conceptual diagram of a coil device according to an embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0030] The following describes the embodiments.

[0031] First embodiment As shown in FIGS. 1 and 2, the coil device 10 according to the embodiment has a substantially rectangular parallelepiped shape and is used as a coil device for low-voltage, high-current applications, such as a TLVR circuit. The dimensions of the coil device 10 are, for example, an X-axis width of 3.0 to 12.0 mm, a Y-axis width of 3.0 to 6.0 mm, and a Z-axis width of 3.0 to 12.0 mm. In the drawings, the X, Y, and Z axes are substantially perpendicular to one another. In this embodiment, the Z axis coincides with the height direction of the coil device 10. In the following description, the direction along each axis toward the center of a component (e.g., the center of the coil device 10) is defined as inward, and the direction away from the center is defined as outward.

[0032] As shown in FIGS. 1 to 3 , the coil device 10 includes a core 20 containing metal powder and resin, a first conductor 30, and a second conductor 40. The first conductor 30 includes two first mounting portions 32a and 32b, at least partially exposed from the core 20. The second conductor 40 includes two second mounting portions 42a and 42b, at least partially exposed from the core 20. In the coil device 10, the first conductor 30, which is disposed relatively outward, functions as a primary coil, and the second conductor 40, which is disposed relatively inward, functions as a secondary coil. However, which of the first conductor 30 and the second conductor 40 is the primary coil or the secondary coil may be appropriately changed depending on the application of the coil device 10, and the inner coil may be the primary coil and the outer coil may be the secondary coil. Details of the first conductor 30 and the second conductor 40 will be described later using FIGS. 4 to 7 .

[0033] The core portion 20 is obtained, for example, by compacting a material powder mixture of metal powder and resin in a mold with the first conductor portion 30 and the second conductor portion 40 disposed therein, as shown in Fig. 6. Examples of metal powder include, but are not limited to, Fe-Ni alloy powder, Fe-Si alloy powder, Fe-Si-Cr alloy powder, Fe-Co alloy powder, Fe-Si-Al alloy powder, and amorphous iron. Examples of resin contained in the core portion 20 include, but are not limited to, epoxy resin, phenol resin, polyester resin, polyurethane resin, polyimide resin, and other synthetic resins.

[0034] As shown in FIGS. 1 to 3 , the core portion 20 has a substantially rectangular parallelepiped outer shape. The outer surfaces of the core portion 20 include a core upper surface 21, a core lower surface 22, a first outer surface 23, a second outer surface 24, a third outer surface 25, and a fourth outer surface 26. As shown in FIG. 1 , first mounting portions 32a and 32b, which are part of the first conductor portion 30, and second mounting portions 42a and 42b, which are part of the second conductor portion 40, are exposed from the downward-facing core lower surface 22. In the coil device 10, the outer surfaces of the core portion 20, namely, the core upper surface 21, the first outer surface 23, the second outer surface 24, the third outer surface 25, and the fourth outer surface 26, excluding the core lower surface 22, are flat surfaces. However, surfaces other than the core lower surface 22 may also have irregularities or protrusions.

[0035] 4 is a first cross-sectional view of the coil device 10 shown in Fig. 1, and is a cross-sectional view of the coil device 10 observed along a cross section that includes a device central axis A2 that passes through the center of the coil device 10 and is parallel to the height direction (Z-axis) and is parallel to the X-axis. As shown in Fig. 4, the first conductor portion 30 has a first coil portion 31 located within the core portion 20, first mounting portions 32a and 32b that are at least partially exposed from the core portion 20 and face the mounting target, and two first connection portions 33a and 33b that connect the first coil portion 31 to each of the first mounting portions 32a and 32b.

[0036] Fig. 6 is a schematic perspective view showing the first conductor portion 30 and the second conductor portion 40 of the coil device 10 shown in Fig. 1 to Fig. 3. As shown in Fig. 6 and Fig. 4, the inner surface 31a of the first coil portion 31 and the outer surface 41b of the second coil portion 41 in the second conductor portion 40 face each other and are connected by an adhesive cured portion 60 where the adhesive is cured.

[0037] FIG. 7 is a schematic perspective view showing the first conductor portion 30, the adhesive curing portion 60, and the like of the coil device 10. As shown in FIGS. 4, 6, and 7, the first conductor portion 30 has a rectangular wave shape that protrudes upward when viewed from the Y-axis direction. The first conductor portion 30 can be produced, for example, by machining a metal rod or a rectangular wire, but the method for producing the first conductor portion 30 is not particularly limited. Examples of materials for the first conductor portion 30 include well-conductive metals such as copper, iron, gold, silver, aluminum, and alloys thereof, but are not particularly limited as long as they function as a current path for the coil device 10.

[0038] 4 and 6, an insulating coating such as resin may be formed on the surface of the first conductor 30. Note that, in the contact portion between the first conductor 30 and the second conductor 40 shown in FIG. 6, electrical insulation is ensured by the insulating coating on the surface of the first conductor 30 or the second conductor 40 when the adhesive curing portion 60 is not used, or by these and the adhesive curing portion 60 when an insulating adhesive curing portion 60 is used. Note that the insulating coating of the first conductor 30 is not formed on the first mounting surfaces 32aa and 32ba, which are the lower surfaces of the first mounting portions 32a and 32b.

[0039] 4 and 6, the two first mounting portions 32a, 32b of the first conductor portion 30 are disposed at one end and the other end in the Y-axis direction of the first conductor portion 30. The single first coil portion 31 of the first conductor portion 30 is disposed in the center of the first conductor portion 30 in the Y-axis direction.

[0040] The first coil section 31 has a U-shaped outer shape that opens downward when viewed from the Y-axis direction, and the central part of the coil device 10 is surrounded by the first coil section 31 from three directions: from above and on both sides in the X-axis direction.

[0041] The first mounting portion 32a, which constitutes the end portion of the first conductor portion 30 on the negative X-axis direction side, is connected via a first connecting portion 33a to the end portion of the first coil portion 31 on the negative X-axis direction and downward (negative Z-axis direction). The first connecting portion 33a is bent, and the first mounting portion 32a to which the first connecting portion 33a is connected extends toward the outside D22 of the device (the side away from the device central axis A2) with respect to the first connecting portion 33a connected to the first coil portion 31.

[0042] Meanwhile, the first mounting portion 32b constituting the end portion of the first conductor portion 30 on the positive X-axis direction side is connected via a first connecting portion 33b to the end portion of the first coil portion 31 on the positive X-axis direction and downward (negative Z-axis direction). The first connecting portion 33b is bent, and the first mounting portion 32b to which the first connecting portion 33b is connected extends toward the outside D22 of the device with respect to the first connecting portion 33b connected to the first coil portion 31. The first conductor portion 30 has a symmetrical shape with respect to the device central axis A2.

[0043] 5 is a second cross-sectional view of the coil device 10 shown in FIG. 1, and is a cross-sectional view of the coil device 10 observed along a cross section that includes a device central axis A2 that passes through the center of the coil device 10 and is parallel to the height direction (Z axis) and is parallel to the Y axis. As shown in FIG. 5, the inner surface 31a of the first coil portion 31 and the outer surface 41b of the second coil portion 41 in the second conductor portion 40 are fixed by an adhesive curing portion 60 that is thinner than the first coil portion 31 and the second coil portion 41. The adhesive curing portion 60 is made of resin or the like.

[0044] 4, the gap G1 between the inner surface 31a of the first coil portion 31 and the outer surface 41b of the second coil portion 41, which is formed by the adhesive cured portion 60, is formed to be approximately constant along the winding direction 62 of the first coil portion 31 and the second coil portion 41. The average thickness of the gap G1 between the inner surface 31a of the first coil portion 31 and the outer surface 41b of the second coil portion 41 is preferably, for example, approximately 1 / 16 to 1 / 4 of the average thickness of the first coil portion 31, from the viewpoints of ensuring the fixing strength between the first conductor portion 30 and the second conductor portion 40 and preventing the intrusion of metal powder and the like into the gap between the first conductor portion 30 and the second conductor portion 40.

[0045] In addition, a resin spacer or the like may be used between the inner surface 31a of the first coil portion 31 and the outer surface 41b of the second coil portion 41 in place of or in addition to the adhesive hardening portion 60.

[0046] 1 and 6, the lower halves of the first mounting portions 32a and 32b and parts of the first connecting portions 33a and 33b are exposed downward from the core lower surface 22 of the core unit 20. By exposing not only the first mounting surfaces 32aa and 32ab, which are the lower surfaces of the first mounting portions 32a and 32b, but also the side surfaces of the first mounting portion 32a and parts of the first connecting portions 33a and 33b downward from the core lower surface 22 of the core unit 20, it becomes easier to form solder fillets during mounting, and the mounting strength can be increased.

[0047] Fig. 8 is a schematic perspective view showing the external shape of the second conductor portion 40 of the coil device 10. As shown in Fig. 4 and Fig. 7, the second conductor portion 40 has a second coil portion 41 located inside the core portion 20, second mounting portions 42a and 42b at least partially exposed from the core portion 20 and facing the mounting target, and two second connection portions 43a and 43b connecting the second coil portion 41 and each of the second mounting portions 42a and 42b.

[0048] As shown in FIG. 4, the second coil portion 41 of the second conductor portion 40 extends inside the first coil portion 31 along the winding direction 62 while being in close contact with the first coil portion 31 via the adhesive cured portion 60. As shown in FIGS. 4 and 8, the second conductor portion 40 has a rectangular ring shape (C-ring shape) with a discontinuity at the bottom when viewed from the Y-axis direction. The material and manufacturing method of the second conductor portion 40 are the same as those exemplified for the first conductor portion 30. Note that the second conductor portion 40 and the first conductor portion 30 may be made of the same material or different materials.

[0049] 4 and 8, an insulating coating such as a resin may be formed on the surface of the second conductor 40. As with the first conductor 30, the insulating coating of the second conductor 40 is not formed on the second mounting surfaces 42aa and 42ba, which are the lower surfaces of the second mounting portions 42a and 42b.

[0050] 4, the two second mounting portions 42a, 42b of the second conductor portion 40 constitute the lower end portion (the end portion on the negative Z-axis direction side) of the second conductor portion 40. The second mounting portions 42a, 42b face each other across a discontinuous portion of the second conductor portion 40. The single second coil portion 41 of the second conductor portion 40 constitutes the portion of the second conductor portion 40 above the second mounting portions 42a, 42b and second connecting portions 43a, 43b (the portion on the positive Z-axis direction side).

[0051] Similar to the first coil section 31, the second coil section 41 has a U-shaped outer shape that opens downward when viewed in the Y direction, and the central portion of the coil device 10 is surrounded by the second coil section 41 from three directions, namely, from above and both sides in the X-axis direction. Also, as shown in Figures 4 and 6, the first coil section 31 and the second coil section 41 have a double structure along the winding direction 62, and the central portion of the coil device 10 is doubly surrounded by the first coil section 31 and the second coil section 41 from three directions, namely, from above and both sides in the X-axis direction.

[0052] The second mounting portion 42a, which is disposed on the negative X-axis side of the device central axis A2, is connected via a second connecting portion 43a to the end portion of the second coil portion 41 that is on the negative X-axis side and downward (negative Z-axis direction). The second connecting portion 43a is bent, and the second mounting portion 42a to which the second connecting portion 43a is connected extends toward the device center D21 (the side approaching the device central axis A2) relative to the second connecting portion 43a that is connected to the second coil portion 41.

[0053] Meanwhile, the second mounting portion 42b of the second conductor 40, which is disposed on the positive X-axis side of the device central axis A2, is connected via a second connecting portion 43b to the end of the second coil 41 on the positive X-axis side and downward (negative Z-axis side). The second connecting portion 43b is bent, and the second mounting portion 42b to which the second connecting portion 43b is connected extends toward the device central side D21 relative to the second connecting portion 43b connected to the second coil 41. The second conductor 40 has a symmetrical shape with respect to the device central axis A2.

[0054] As shown in Figure 5, the second coil section 41 of the coil device 10 has a thickness L4, which is the length along the direction from the outside to the inside of the coil device 10, in a cross section perpendicular to the winding direction 62 (for example, Figure 5), which is thinner than the thickness L3 of the first coil section 31.

[0055] In the coil device 10, the first coil portion 31 and the second coil portion 41 have a rectangular cross section (e.g., FIG. 5) perpendicular to the winding direction 62. The first coil portion 31 has a larger cross-sectional area in the cross section perpendicular to the winding direction 62 than the second coil portion 41.

[0056] 5, in a cross section orthogonal to the winding direction 62, the first coil portion 31 and the second coil portion 41 have shapes that are generally symmetrical with respect to a common axis of symmetry (the device central axis A2 in FIG. 5). In such a coil device 10, the first coil portion 31 and the second coil portion 41 are arranged generally symmetrically, and therefore, characteristic variations that occur within the range of allowable manufacturing variations can be suppressed.

[0057] 4, in the coil device 10, an inter-conductor gap 50 is formed in the gap between the inner surfaces of the first connection portions 33a, 33b and the outer surface of the second conductor portion 40. The inter-conductor gap 50 is a substantially triangular portion in FIG. 4 where the distance between the first conductor portion 30 and the second conductor portion 40 increases as the distance approaches the mounting target side downward due to at least one of the first connection portions 33a, 33b and the second connection portions 43a, 43b moving away from the winding direction 62.

[0058] A coupling adjuster 51 having at least one of a non-magnetic material portion 51a containing resin and a magnetic material portion 51b containing magnetic material is disposed in the conductor gap 50. Note that the hollow portion where no coupling adjuster 51 is disposed is not included in the conductor gap 50.

[0059] 9 is a conceptual diagram showing the positional relationship between the core portion 20 of the coil device 10 and the conductor gap 50. As can be seen from FIGS. 4 and 9, the lower end of the coupling adjustment material 51 is aligned with the core lower surface 22 of the core portion 20 or is further away from the mounting surface P1 than the core lower surface 22 of the core portion 20, and the coupling adjustment material 51 is disposed inside the core portion 20.

[0060] In the coil device 10, first mounting portion upper surfaces 32ab and 32bb, which are surfaces of the first mounting portions 32a and 32b facing the opposite direction from the first mounting surfaces 32aa and 32ba that face the mounting target, are farther from the mounting surface P1 than the core lower surface 22 of the core unit 20. In addition, second mounting portion upper surfaces 42ab and 42bb, which are surfaces of the second mounting portions 42a and 42b facing the opposite direction from the second mounting surfaces 42aa and 42ba that face the mounting target, may also be farther from the mounting surface P1 than the core lower surface 22 of the core unit 20.

[0061] By making the core lower surface 22 of the core unit 20 lower than at least one of the first mounting portion upper surfaces 32ab, 32bb and the second mounting portion upper surfaces 42ab, 42bb, at least a portion of the coupling adjuster 51 is disposed inside the core unit 20, thereby ensuring a wide adjustment range for the coupling coefficient between the first conductor unit 30 and the second conductor unit 40. Furthermore, by bringing the core lower surface 22 closer to the mounting surface, the volume of the core unit 20 can be increased, thereby improving the self-inductance of each of the conductor units 30, 40 in the coil device 10.

[0062] 9, connection position 34 between first connection portions 33a, 33b and first coil portion 31 is farther from mounting surface P1 than connection position 44 between second connection portions 43a, 43b and second coil portion 41. In other words, distance L1 between connection position 34 between first connection portions 33a, 33b and first coil portion 31 and mounting surface P1 is longer than distance L2 between connection position 44 between second connection portions 43a, 43b and second coil portion 41 and mounting surface P1.

[0063] By positioning connection position 34 between first coil portion 31 arranged on the outside and first connection portions 33a, 33b higher than connection position 44 between second coil portion 41 arranged on the inside and second connection portions 43a, 43b, it is possible to suppress the overall curvature of curved portions included in first conductor portion 30, such as first connection portions 33a, 33b, and suppress variation in the shape of first conductor portion 30. Note that mounting surface P1 is a plane that includes first mounting surfaces 32aa, 32ba that face the mounting target in first mounting portions 32a, 32b and second mounting surfaces 42aa, 42ba that face the mounting target in second mounting portions 42a, 42b.

[0064] As shown in FIG. 9 , in the coil device 10, the upper end of the conductor gap 50 starts at the same height as the connection position 34 between the first coil portion 31 and the first connection portions 33a and 33b. As the distance from the connection position 34 moves downward, the inner surfaces of the first connection portions 33a and 33b move away from the winding direction 62 (parallel to the Z-axis direction). Therefore, the distance between the first conductor portion 30 and the second conductor portion 40 increases from the connection position 34 downward toward the device outer side D22. Furthermore, below the connection position 44 between the second coil portion 41 and the second connection portions 43a and 43b, the outer surfaces of the second connection portions 43a and 43b move away from the winding direction 62 (parallel to the Z-axis direction). Therefore, below the connection position 44, the distance between the first conductor portion 30 and the second conductor portion 40 also increases toward the device center side D21.

[0065] 4 and 9, the coupling adjuster 51 disposed in the inter-conductor gap 50 has a non-magnetic material portion 51a containing resin. The non-magnetic material portion 51a constituting part of the coupling adjuster 51 is connected to an adhesive-cured portion 60 disposed between the inner surface 31a of the first coil portion 31 and the outer surface 41b of the second coil portion 41. That is, the adhesive-cured portion 60 extends along the winding direction 62, and both ends 60a are connected to the non-magnetic material portion 51a of the coupling adjuster 51. The adhesive-cured portion 60 and the non-magnetic material portion 51a are made of the same material.

[0066] It is preferable that the non-magnetic material portion 51a does not contain a magnetic material, from the viewpoint of adjusting the coupling coefficient between the first conductor portion 30 and the second conductor portion 40 by adjusting the volume ratio with the magnetic material portion 51b. However, the non-magnetic material portion 51a may contain a magnetic material such as magnetic powder in a content that is sufficiently smaller than that of the magnetic material portion 51b and the core portion 20.

[0067] 4 and 9, the coupling adjuster 51 disposed in the inter-conductor gap 50 has a magnetic material portion 51b containing a magnetic material. In the coil device 10, a non-magnetic material portion 51a containing a resin is disposed in a region near the upper end of the inter-conductor gap 50, and a magnetic material portion 51b containing a magnetic material is disposed in a region near the lower end.

[0068] In the coil device 10, the material of the magnetic material portion 51b is the same as the material of the core portion 20. That is, the magnetic material contained in the magnetic material portion 51b is metal powder, and the content ratio of the metal powder to the resin contained in the magnetic material portion 51b is approximately the same as that of the core portion 20. In the coil device 10 in which the core portion 20 and the magnetic material portion 51b are made of the same material, the shapes of the magnetic material portion 51b and the inter-conductor gap 50 can be easily adjusted by, for example, adjusting the height of the core lower surface 22 shown in FIGS. 4 and 9. This makes it easy to manufacture the coil device 10, and enables the coupling coefficient between the first conductor portion 30 and the second conductor portion 40 to be adjusted with high precision.

[0069] Furthermore, in the coil device 10, the coupling adjuster 51 has not only the magnetic material portion 51b, which is made of the same material as the core portion 20, but also the non-magnetic material portion 51a, and therefore the resin content of the entire coupling adjuster 51 is greater than the resin content of the core portion 20. By increasing the resin content of the coupling adjuster 51 and decreasing the magnetic material content, the coupling coefficient between the first conductor portion 30 and the second conductor portion 40 can be increased.

[0070] 4 and 9, the material of the magnetic material portion 51b of the coupling adjuster 51 may be different from that of the core portion 20, and the magnetic material portion 51b may have a higher magnetic permeability than the core portion 20. By increasing the magnetic permeability of the magnetic material portion 51b, the coupling coefficient between the first conductor portion 30 and the second conductor portion 40 can be greatly varied by the small inter-conductor gap 50 and the coupling adjuster 51. Furthermore, by making the magnetic material portion 51b have a high magnetic permeability or by increasing the volume ratio of the magnetic material portion 51b in the coupling adjuster 51, the characteristics of the conductor portions 30, 40 of the coil device 10, such as the self-inductance, can be improved.

[0071] As shown in FIGS. 4 , 7 , and 9 , in the coil device 10, the second coil portion 41 of the second conductor portion 40 extends inside the first coil portion 31 along the winding direction 62 of the first coil portion 31. This improves the positioning accuracy between the first conductor portion 30 and the second conductor portion 40, thereby reducing variations in the coupling coefficient between the first conductor portion 30 and the second conductor portion 40. Furthermore, since an inter-conductor gap 50 is formed between the first conductor portion 30 and the second conductor portion 40, the coil device can accurately adjust the coupling coefficient between the first conductor portion 30 and the second conductor portion 40 by changing the size of the inter-conductor gap 50 or the coupling adjuster 51 disposed in the inter-conductor gap 50. Furthermore, since the inter-conductor gap 50 has a shape that widens as it approaches the mounting target side, the coil device 10 can ensure a wide adjustment range for the coupling coefficient between the first conductor portion 30 and the second conductor portion 40. Furthermore, by changing only the conductor gap 50 and the coupling adjustment material 51, coil devices 10 having various coupling coefficients while having almost the same external shape can be manufactured, thereby enabling flexible response to design changes, etc.

[0072] Furthermore, in the coil device 10, the coupling adjuster 51 disposed in the inter-conductor gap 50 has both the non-magnetic material portion 51a and the magnetic material portion 51b, and therefore by adjusting the volume ratio and materials of the non-magnetic material portion 51a and the magnetic material portion 51b, the coupling coefficient between the first conductor portion 30 and the second conductor portion 40 can be flexibly and accurately adjusted. However, alternatively, the coupling adjuster 51 may have only the non-magnetic material portion 51a, and such a coil device 10 can appropriately prevent the problem of the magnetic material of the core portion 20 getting into the inter-conductor gap 50, increase the coupling coefficient between the first conductor portion 30 and the second conductor portion 40, and suppress variation in the coupling coefficient.

[0073] In addition, the coupling adjustment material 51 may have only the magnetic material portion 51b, and such a coil device can accurately reduce the coupling coefficient between the first conductor portion 30 and the second conductor portion 40.

[0074] While the coil device according to the present disclosure has been described above using embodiments, it goes without saying that the technical scope of the coil device according to the present disclosure is not limited to the above-described embodiments and includes many other examples and modifications. For example, Fig. 10 is a conceptual diagram showing the positional relationship between the core portion 20 and the inter-conductor gap 150 in a coil device 110 according to a first modification.

[0075] 10 differs from the coil device 10 according to the first embodiment in the shapes of the first conductor portion 130, the inter-conductor gap 150, the coupling adjustment material 151, etc., but the outer shape of the core portion 20 and the second conductor portion 40 are the same as those of the coil device 10 according to the first embodiment. The explanation of the coil device 110 will focus on the differences from the coil device 10, and a description of the points in common with the coil device 10 will be omitted.

[0076] 10, in the first conductor portion 130, the shape of the first coil portion 131 is substantially the same as that of the first coil portion 31 shown in FIG. 9, but the shapes of the first connection portions 133a, 133b and the first mounting portions 132a, 132b are different. That is, in the first conductor portion 130, the first connection portions 133a, 133b are linear and connect the first coil portion 131 and the first mounting portions 132a, 132b in a straight line along the extension direction of the winding direction 62.

[0077] The first conductor 130 has an overall U-shaped outer shape that opens downward when viewed from the Y-axis direction, with one end face and the other end face of the first conductor 130 facing downward, and each end face forming a first mounting surface of the first mounting portions 132a, 132b that faces the mounting target. The first conductor 130 having the first connecting portions 133a, 133b that are linear is a preferable shape when the cross-sectional area perpendicular to the winding direction 62 of the first coil portion 131 is large (for example, the cross-sectional area is at least twice the cross-sectional area of ​​the second coil portion 41). The first conductor 130 having the linear first connecting portion 133a has a simple shape and is easy to manufacture, and because of its large cross-sectional area, the end faces of the first conductor 130 can ensure the necessary facing area with respect to the mounting target.

[0078] 10, in the coil device 110, the upper end of the conductor gap 150 starts at the same height as the connection position 44 between the second coil portion 41 and the second connection portions 43a and 43b. As the distance from the connection position 44 moves downward, the outer surfaces of the second connection portions 43a and 43b move away from the winding direction 62 (parallel to the Z-axis direction), and therefore the distance between the first conductor portion 30 and the second conductor portion 40 increases downward from the connection position 44 toward the device center D21.

[0079] The coupling adjuster 151 disposed in the inter-conductor gap 150 has a non-magnetic material portion 151a containing resin. The non-magnetic material portion 151a constituting a part of the coupling adjuster 151 is connected to an adhesive curing portion 160 disposed between the inner surface 131a of the first coil portion 131 and the outer surface 41b of the second coil portion 41.

[0080] Furthermore, the coupling adjuster 151 disposed in the inter-conductor gap 50 has a magnetic material portion 151b containing a magnetic material. The material of the magnetic material portion 151b is the same as the material of the core portion 20.

[0081] 10, like the coil device 10 according to the first embodiment, the coil device can accurately adjust the coupling coefficient between the first conductor portion 130 and the second conductor portion 40 by changing the size of the inter-conductor gap 150 and the coupling adjuster 151 disposed in the inter-conductor gap 150. Note that in the coil device 110, the size of the inter-conductor gap 150 is smaller than in the coil device 10, and therefore the adjustment range of the coupling coefficient tends to be smaller than in the coil device 10 according to the first embodiment. However, the coil device 110 is superior in terms of the adjustment accuracy of the coupling coefficient because the first connection portions 133a, 133b extend straight, which can suppress variation in the shape of the inter-conductor gap 150.

[0082] The coil device 110 has the same shape as the coil device 10 according to the first embodiment, but the first conductor 130 has a different shape. However, other coil devices may have the same shape as the coil device 10 according to the first embodiment, but the second conductor 30 has a different shape than the second conductor 40 of the coil device 10. In this case, the second conductor of the other coil device has a U-shaped outer shape that opens downward as a whole when viewed from the Y-axis direction. One end face and the other end face of the second conductor face downward, and each end face constitutes a first mounting surface of the second mounting portion that faces the mounting target (see the shape of the first conductor 130 in FIG. 10). A conductor gap is formed between the linear second connection portion and the curved first connection portion.

[0083] Fig. 11 is a conceptual diagram showing the positional relationship between the core portion 20 and the inter-conductor gap 250 in a coil device 210 according to a second modified example. The coil device 210 according to the second modified example shown in Fig. 11 differs from the coil device 10 according to the first embodiment in the shapes of the first conductor portion 230, the inter-conductor gap 250, the coupling adjuster 251, etc., but the outer shape of the core portion 20 and the second conductor portion 40 are similar to those of the coil device 10 according to the first embodiment. The description of the coil device 210 will focus on the differences from the coil device 10, and a description of the points in common with the coil device 10 will be omitted.

[0084] 11 , the first conductor 230 differs from the first conductor 30 according to the first embodiment in that the connection position 234 between the first coil 231 and the first connecting portions 233a and 233b is different between the inner surface and the outer surface of the first conductor 230. That is, the height (distance from the mounting surface P1) at which the first conductor 230 starts to bend outward, which is the connection position 234, differs between the inner surface and the outer surface of the first conductor 230. The connection position 234 is closer to the mounting surface P1 on the inner surface and farther from the mounting surface P1 on the outer surface. In this first conductor 230, the first coil 231, the first connecting portions 233a and 233b, and the connection position 234 are located on the inner surface facing the second conductor 40.

[0085] The first connecting portions 33a, 33b and first mounting portions 32a, 32b of the first conductor portion 30 as shown in FIG. 9 are produced, for example, by bending, whereas the first connecting portions 233a, 233b and first mounting portions 232a, 232b of the first conductor portion 230 as shown in FIG. 11 are produced, for example, by drawing or cutting.

[0086] 11 , in the coil device 210, the upper end of the conductor gap 250 starts at the same height as the connection position 44 between the second coil portion 41 and the second connection portions 43 a, 43 b. As the distance from the connection position 44 moves downward, the outer surfaces of the second connection portions 43 a, 43 b move away from the winding direction 62 (parallel to the Z-axis direction), and therefore the distance between the first conductor portion 230 and the second conductor portion 40 increases downward from the connection position 44 toward the device inner side D21. Meanwhile, the connection position 234 on the inner surface of the first conductor portion 230 is located lower than the lower end of the coupling adjuster 251, and therefore the shape of the inner surface of the first conductor portion 230 does not affect the shape of the conductor gap 250 in the coil device 210.

[0087] The coupling adjuster 251 disposed in the inter-conductor gap 250 has a non-magnetic material portion 251a containing resin and a magnetic material portion 251b containing a magnetic material. The characteristics of the coupling adjuster 251 are similar to those of the coupling adjuster 151 included in the coil device 10 according to the first modified example shown in FIG.

[0088] The coil device 210 according to the second modification shown in FIG. 11 also has the same effects as the coil device 10 of the first embodiment and the coil device 110 according to the first modification, in terms of commonalities with these coil devices 10, 110.

[0089] Fig. 12 is a conceptual diagram showing a schematic structure of a coil device 310 according to the second embodiment, and Fig. 13 is a conceptual diagram showing the arrangement relationship between core portions 320 and inter-conductor gaps 350 in the coil device 310. The coil device 310 according to the second embodiment has four combinations of first conductor portions 330 and second conductor portions 340 as shown in Fig. 13 in one core portion 320. The first conductor portions 330 and second conductor portions 340 are arranged at approximately equal intervals along the Y-axis direction of the coil device 310.

[0090] 10, 12, and 13, the coil device 310 (see FIGS. 12 and 13) differs from the coil device 110 according to the first modified example (see FIG. 10), which has one set of the first conductor portion 130 and the second conductor portion 40, in that the coil device 310 has a plurality of sets of the first conductor portion 330 and the second conductor portion 340. However, as can be understood from a comparison between FIGS. 10 and 13, the arrangement of the set of the first conductor portion 330 and the second conductor portion 340 and the core portion 320 of the coil device 310, when viewed from the Y-axis direction, is the same as the arrangement of the first conductor portion 130 and the second conductor portion 40 and the core portion 20 of the coil device 110, when viewed from the Y-axis direction.

[0091] That is, as shown in FIG. 13, in the first conductor portion 330, the first connection portions 333a and 333b are linear and connect the first coil portion 331 and the first mounting portions 332a and 332b straight along the extension direction of the winding direction 62.

[0092] The first conductor portion 330 has an overall U-shaped outer shape that opens downward when viewed from the Y-axis direction, with one end face and the other end face of the first conductor portion facing downward, and each end face forming the first mounting surface of the first mounting portions 332a, 332b facing the mounting target.

[0093] The second conductor portion 340 has a schematic shape similar to that of the second conductor portion 40 of the coil devices 10 and 110 according to the first embodiment and the first modification. That is, the second conductor portion 340 has a second coil portion 341 located within the core portion 320, second mounting portions 342a and 342b at least partially exposed from the core portion 20 and facing the mounting target, and two second connection portions 343a and 343b connecting the second coil portion 341 to each of the second mounting portions 342a and 342b. The second coil portion 341 of the second conductor portion 340 extends along the winding direction 62 inside the first coil portion 331 while being in close contact with the first coil portion 331 via the adhesive cured portion 360.

[0094] 13, in the coil device 310, the upper end of the conductor gap 350 starts at the same height as the connection position 344 between the second coil portion 341 and the second connection portions 343a and 343b. As the distance goes downward from the connection position 344, the outer surfaces of the second connection portions 343a and 343b move away from the winding direction 62 (parallel to the Z-axis direction), and therefore the distance between the first conductor portion 330 and the second conductor portion 340 increases downward from the connection position 344 toward the device center D21.

[0095] The coupling adjuster 351 disposed in the inter-conductor gap 350 has a non-magnetic material portion 351a containing resin and a magnetic material portion 351b containing a magnetic material. The characteristics of the coupling adjuster 351 are similar to those of the coupling adjuster 151 included in the coil device 10 according to the first modified example shown in FIG.

[0096] The four sets of first conductor parts 330 and second conductor parts 340 of the coil device 310 all have the same structure shown in Fig. 13. In the coil device 310, as in the coil device 110 according to the first modification, by changing the size of the inter-conductor gaps 350 and the material and content ratio of the constituent substances of the coupling adjustment material 351 disposed in the inter-conductor gaps 350, such coil device 310 can accurately adjust the coupling coefficient between each of the first conductor parts 330 and the second conductor parts 340.

[0097] Furthermore, since the coil device 310 has multiple sets of first conductor portions 330 and second conductor portions 340 incorporated into one core portion 320, the process of mounting a circuit that uses multiple (four) coil devices 110 according to the first modified example can be completed with a single transport operation with the coil device 310, thereby improving manufacturing efficiency. In addition, the coil device 310 has similar effects to the coil devices 10 and 110 according to the first embodiment and the first modified example in terms of their commonalities.

[0098] Fig. 14 is a conceptual diagram showing a schematic structure of a coil device 410 according to the third embodiment, and Fig. 15 is a conceptual diagram showing the arrangement relationship between core portions 420 and inter-conductor gaps 450 in the coil device 410. Similar to the coil device 310 according to the second embodiment, the coil device 410 according to the third embodiment has four combinations of first conductor portions 430 and second conductor portions 440 as shown in Fig. 15 in one core portion 420. The first conductor portions 430 and second conductor portions 440 are arranged at approximately equal intervals along the Y-axis direction of the coil device 410.

[0099] As can be seen from a comparison of FIGS. 9, 14, and 15, the coil device 410 (see FIGS. 14 and 15) differs from the coil device 10 according to the first embodiment (see FIG. 9) that has one set of the first conductor portion 30 and the second conductor portion 40 in that the coil device 410 has a plurality of sets of the first conductor portion 430 and the second conductor portion 440. Furthermore, the coil device 410 differs from the inter-conductor 50 and the coupling adjuster 51 of the coil device 10 shown in FIG. 9 in that the coupling adjuster 451 disposed in the inter-conductor gap 450 does not have a nonmagnetic material portion and only has a magnetic material portion. However, as can be seen from a comparison of FIGS. 9 and 15, the schematic shape of the set of the first conductor portion 430 and the second conductor portion 440 and the core portion 420 of the coil device 410 as viewed from the Y-axis direction is similar to the schematic shape of the set of the first conductor portion 30 and the second conductor portion 40 and the core portion 420 of the coil device 10 as viewed from the Y-axis direction.

[0100] 15, the first conductor 430 has a rectangular wave shape that protrudes upward when viewed in the Y-axis direction. Similar to the first conductor 30 shown in Fig. 9, the first conductor 430 has a first coil 431 located inside the core 420, first mounting portions 432a and 432b that are at least partially exposed from the core 20 and face the mounting target, and two first connection portions 433a and 433b that connect the first coil 431 to each of the first mounting portions 432a and 432b.

[0101] Further, the second conductor portion 440 has a second coil portion 441 located within the core portion 420, second mounting portions 442a, 442b at least partially exposed from the core portion 420 and facing the mounting target, and two second connection portions 443a, 443b connecting the second coil portion 441 to each of the second mounting portions 442a, 442b. No adhesive curing portion is disposed between the first conductor portion 430 and the second conductor portion 440. The second coil portion 441 of the second conductor portion 440 extends along the winding direction 62 inside the first coil portion 431 while being in close contact with the first coil portion 431.

[0102] In the coil device 410, similarly to the coil device 10 shown in FIG. 9, the upper end of the conductor gap 450 starts at the same height as the connection position 434 between the first coil portion 431 and the first connection portions 433a and 433b. As the distance from the connection position 434 moves downward, the inner surfaces of the first connection portions 433a and 433b move away from the winding direction 62 (parallel to the Z-axis direction). Therefore, the distance between the first conductor portion 430 and the second conductor portion 440 increases from the connection position 434 downward toward the device outer side D22. Furthermore, below the connection position 444 between the second coil portion 441 and the second connection portions 443a and 443b, the outer surfaces of the second connection portions 443a and 443b move away from the winding direction 62 (parallel to the Z-axis direction). Therefore, below the connection position 444, the distance between the first conductor portion 430 and the second conductor portion 440 also increases toward the device center side D21.

[0103] The coupling adjuster 451 disposed in the conductor gap 450 has a magnetic material portion containing a magnetic material, but does not have a non-magnetic material portion containing no magnetic material. The material of the magnetic material portion of the coupling adjuster 451 is the same as that of the magnetic material portion 51b of the coupling adjuster 51 of the coil device 110 according to the first embodiment shown in FIG.

[0104] The four sets of first conductor portions 430 and second conductor portions 440 of the coil device 410 all have the same structure as shown in Fig. 14. As with the coil device 10 according to the first embodiment, the coil device 410 can accurately adjust the coupling coefficient between each of the first conductor portions 430 and the second conductor portions 440 by changing the size of the inter-conductor gaps 450 and the material and content ratio of the constituent substances of the coupling adjuster 451 disposed in the inter-conductor gaps 450. Otherwise, the coil device 410 has similar effects to the coil devices 10 and 310 according to the first and second embodiments in terms of the commonalities therebetween.

[0105] Below, we will explain the coil device according to the present disclosure using more specific examples, but the features of these examples are merely examples of the features of the coil device, and these examples are not intended to limit the features of the coil device.

[0106] In the embodiment, a simulation model of the coil device 510 as shown in FIG. 16 was created, and it was confirmed that the coupling coefficient between the first conductor portion 530 and the second conductor portion 540 changes by changing the material of the coupling adjustment material placed in the conductor gap 550.

[0107] As shown in FIG. 16(a), the coil device 510 has a core portion 520 containing metal powder and resin, a first conductor portion 530 having a first coil portion 531, first mounting portions 532a, 532b and first connecting portions 533a, 533b, and a second conductor portion 540 having a second coil portion 541, second mounting portions 542a, 542b and second connecting portions 543a, 543b.

[0108] In addition, in the coil device 510, a conductor gap 550 is formed between the first conductor portion 530 and the second conductor portion 540, in which the distance between the first conductor portion 530 and the second conductor portion 540 increases as the first connection portions 533a, 533b and the second connection portions 543a, 543b move away from the winding direction and approach the mounting target side.

[0109] In the example, two samples were prepared: Sample 1 in which a coupling adjuster 551a having a non-magnetic material portion made of resin was placed in the inter-conductor gap 550 as shown in Fig. 16(b), and Sample 2 in which a coupling adjuster 551b having a magnetic material portion made of magnetic material was placed in the inter-conductor gap 550 as shown in Fig. 16(c). The relative permeability of the coupling adjuster 551a of Sample 1 was set to 1, and the relative permeability of the coupling adjuster 551b of Sample 2 was set to 35. Sample 1 and Sample 2 were made under the same conditions except for the coupling adjusters 551a and 551b placed in the inter-conductor gap 550.

[0110] When the coupling coefficient (k factor) between the first conductor part 530 and the second conductor part 540 was calculated for Sample 1 and Sample 2, the coupling coefficient of Sample 2 was found to be 5% lower than that of Sample 1. This example proves that the coupling coefficient (k factor) between the first conductor part 530 and the second conductor part 540 can be adjusted by changing the material of the coupling adjustment materials 551a and 551b placed in the inter-conductor gap 550. [Explanation of symbols]

[0111] 10, 110, 210, 310, 410, 510... Coil device 20, ... Core section 21...Core top surface 22...underside of core 23...First outer surface 24…Second outer surface 25...Third outer surface 26...4th outer surface D21: Center side of the device (side closer to the device's central axis) D22: Outside of the device (side away from the device's central axis) A2…Device center axis 30, 130, 230, 330, 430, 530...First conductor part 31, 131, 231, 331, 431, 531...First coil section 31a…Inner surface 62...winding direction 32a, 32b, 132a, 132b, 232a, 232b, 332a, 332b, 432a, 432b, 532a, 532b...First mounting section 32aa, 32ba...First mounting surface 32ab, 32bb...Top surface of first mounting section 33a, 33b, 133a, 133b, 233a, 233b, 333a, 333b, 433a, 433b, 533a, 533b...first connection portion 34...Connection position 40, 340, 440, 540...Second conductor section 41, 341, 441...Second coil section 41b…Outer surface 42a, 42b, 342a, 342b, 442a, 442b, 542a, 542b...Second mounting section 42aa, 42ba...Second mounting surface 42ab, 42bb...Top surface of second mounting section 43a, 43b, 343a, 343b, 443a, 443b, 543a, 543b...Second connection part 34, 44, 344, 444...Connection positions 50, 150, 250, 350, 450, 550...Gap between conductors 51, 151, 251, 351, 451…bonding adjustment material 51a, 151a, 251a, 351a...Nonmagnetic material section 51b, 151b, 251b, 351b...Magnetic material section 60...Adhesive hardening part 60a...End P1: Mounting surface L1, L2…distance G1…Spacing

Claims

1. a core portion including metal powder and resin; a first conductor portion including a first coil portion located within the core portion, a first mounting portion at least a portion of which is exposed from the core portion and faces a mounting target, and a first connection portion which connects the first coil portion and the first mounting portion; a second conductor portion including a second coil portion located within the core portion, a second mounting portion at least a portion of which is exposed from the core portion and faces a mounting target, and a second connection portion which connects the second coil portion and the second mounting portion; the second coil portion extends inside the first coil portion along the winding direction of the first coil portion, A conductor gap is formed between the first conductor portion and the second conductor portion, in which the distance between the first conductor portion and the second conductor portion increases as at least one of the first connection portion and the second connection portion moves away from the winding direction and approaches the mounting target side, and a coupling adjustment material having at least one of a non-magnetic material portion containing resin and a magnetic material portion containing magnetic material is arranged.

2. The coil device according to claim 1 , wherein the content of the resin contained in the bond adjuster is greater than the content of the resin contained in the core portion.

3. The coil device according to claim 1 , wherein the coupling adjuster has a magnetic material portion containing a magnetic material.

4. The coil device according to claim 3 , wherein the magnetic material contained in the magnetic material portion is metal powder, and the content ratio of the metal powder to the resin contained in the magnetic material portion is substantially the same as that of the core portion.

5. The coil device according to claim 3 , wherein the magnetic material portion has a higher magnetic permeability than the core portion.

6. the first connection portion is bent, and the first mounting portion to which the first connection portion is connected extends toward a side away from a central axis of the device with respect to the first connection portion connected to the first coil portion; The coil device according to claim 1, wherein the second connection portion is curved, and the second mounting portion to which the second connection portion is connected extends toward the side closer to the central axis of the device relative to the second connection portion connected to the second coil portion.

7. 7. The coil device according to claim 6, wherein a connection position between the first connection portion and the first coil portion is farther from a plane including a first mounting surface facing a mounting target in the first mounting portion and a second mounting surface facing a mounting target in the second mounting portion than a connection position between the second connection portion and the second coil portion.

8. the first connection portion is linear and connects the first coil portion and the first mounting portion in a straight line; The coil device according to claim 1, wherein the second connection portion is curved, and the second mounting portion to which the second connection portion is connected extends toward a side closer to the central axis of the device relative to the second connection portion connected to the second coil portion.

9. The coil device according to claim 1 , wherein the first coil portion has a larger cross-sectional area in a cross section perpendicular to the winding direction than the second coil portion.

10. 2. The coil device according to claim 1, wherein at least one of the upper surface of the first mounting portion, which is the surface facing the opposite direction from the first mounting surface facing the mounting target in the first mounting portion, and the upper surface of the second mounting portion, which is the surface facing the opposite direction from the second mounting surface facing the mounting target in the second mounting portion, is farther from a plane including the first mounting surface and the second mounting surface than the lower core surface of the core portion.

11. The coil device according to claim 1 , wherein the bond adjuster is disposed inside the core portion.

12. an inner surface of the first coil portion and an outer surface of the second coil portion are connected by an adhesive hardened portion where an adhesive is hardened; The coil device according to claim 1 , wherein the adhesive curing portion extends along the winding direction and has an end connected to the bond adjuster.

Citation Information

Patent Citations

  • Coil device

    JP2022033703A