Chip removing apparatus and chip removing method

Abstract

To provide a chip removing device and a chip removing method for easily recovering a removal object chip separated from a substrate, and for easily confirming whether or not the removed chip can be recovered.SOLUTION: The chip removing device 100 is provided with a laser light source 1 for irradiating a removal target chip C t with laser light L and an adhesive member 2 for adhesively holding the removal target chip C t to separate and adhesively hold the removal target chip C t from the holding substrate S in a state where the adhesive member 2 is opposed to and spaced from the chip C.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a chip removal device and a chip removal method, and more particularly to a chip removal device and a chip removal method that include a laser light source that irradiates a chip to be removed with laser light. [Background technology]

[0002] BACKGROUND ART Conventionally, there has been known a lift-off apparatus that irradiates a chip to be removed held on a substrate with laser light to separate and remove the chip from the substrate (see, for example, Patent Document 1).

[0003] The above-mentioned Patent Document 1 discloses a laser lift-off device that irradiates a chip to be removed on a substrate with laser light to separate and remove the chip from the substrate. In the laser lift-off device of the above-mentioned Patent Document 1, the chip is detached by irradiation with laser light, and the chip to be removed is thrown into the air, which is then lifted up and swept away by an air current generated by a blower, whereby the chip to be removed is recovered. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2015-199094 Summary of the Invention [Problem to be solved by the invention]

[0005] However, in the laser lift-off apparatus described in Patent Document 1, the chip removal speed and direction are irregular, so unless the removed chip flies into a strong air current, the removed chip cannot be lifted up, making it difficult to recover the removed chip. Furthermore, because the chip itself is small, it is difficult to confirm whether the removed chip has been successfully recovered. Therefore, there is a need for a chip removal apparatus and chip removal method that can easily recover chips to be removed that have been separated from a substrate and easily confirm whether the removed chip has been successfully recovered.

[0006] This invention has been made to solve the above-mentioned problems, and one object of this invention is to provide a chip removal device and a chip removal method that make it easy to recover chips to be removed that have been separated from a substrate, and that make it easy to confirm whether the removed chips have been recovered. [Means for solving the problem]

[0007] In order to achieve the above object, the chip removal device according to this first aspect includes a laser light source that irradiates laser light onto a chip to be removed among a plurality of chips held on the surface of a holding substrate by a holding section, and an adhesive member that recovers the chip to be removed by adhesively holding it, and is configured so that, with the adhesive member facing the chip but spaced apart, the chip to be removed is separated from the holding substrate by irradiating the laser light onto the chip to be removed and then adhesively held by the adhesive member.

[0008] As described above, the chip removal device according to this first aspect is configured to irradiate the target chip with laser light while the adhesive member is positioned opposite but spaced from the chip, thereby separating the target chip from the holding substrate and adhesively holding the chip with the adhesive member. Therefore, even if the chip's removal speed or direction is irregular, the target chip separated from the holding substrate by the laser light irradiation can be easily recovered by adhesively holding the target chip with the adhesive member positioned opposite but spaced from the chip. Furthermore, because the recovered target chip is adhesively held on the adhesive member, even if the chip itself is small, it is easy to confirm whether the target chip has been recovered by checking the adhesive member. Furthermore, because the adhesive member is spaced from the chip, adverse effects on normal chips other than the target chip due to contact between the adhesive member and the target chip can be prevented.

[0009] In the chip removal device according to the first aspect, the laser light emitted from the laser light source is preferably configured to pass through the adhesive member and irradiate the chip to be removed. With this configuration, even if the holding substrate is not a transparent substrate and the laser light cannot be passed through the holding substrate to irradiate the chip to be removed, the laser light can be irradiated onto the chip to be removed from the adhesive member side.

[0010] In the chip removal device according to the first aspect, the holding unit is preferably provided between the holding substrate and the chip, and configured so that ablation occurs in which the holding unit is evaporated or atomized by irradiation of laser light from the laser light source, and the ablation imparts momentum to the chip to be removed toward the adhesive member, causing the chip to separate from the holding substrate. With this configuration, momentum is imparted to the chip to be removed toward the adhesive member that faces the chip but is spaced apart from it, so that the chip to be removed can be detached in the direction of the adhesive member, and the chip to be removed can be more reliably recovered by the adhesive member.

[0011] The chip removal device according to the first aspect preferably includes an adhesive member separation direction movement mechanism that moves the adhesive member in a direction separating the adhesive member from the chip to be removed, and a control unit, the control unit being configured to control the separation of the chip to be removed and the adhesive member by a predetermined separation distance when irradiating the chip to be removed with laser light. This configuration allows the separation distance to be preset to a distance at which the chip to be removed separated by the irradiation of the laser light is adhesively held by the adhesive member without bouncing. As a result, bouncing of the chip to be removed is suppressed, thereby more reliably recovering the chip to be removed using the adhesive member.

[0012] The chip removal device according to the first aspect preferably includes a holding substrate holding unit that holds a holding substrate, a holding substrate holding unit movement mechanism that moves the holding substrate holding unit in a direction parallel to the surface of the holding substrate, and a control unit, wherein the control unit is configured to control the holding substrate holding unit to move relative to the surface of the holding substrate while the laser light irradiation position of the laser light source and the adhesive member are fixed, thereby selectively irradiating the laser light to the chips to be removed held on the surface of the holding substrate held by the holding substrate holding unit. With this configuration, the chips to be removed are adhesively held around the laser light irradiation position of the adhesive member, regardless of the position of the chips to be removed on the holding substrate. As a result, there is no variation in the location where the chips to be removed are adhesively held on the adhesive member due to the position of the chips to be removed on the holding substrate, and the adhesion of the chips to the adhesive member can be controlled, thereby allowing efficient use of the adhesive member.

[0013] In this case, the device preferably includes an adhesive member parallel movement mechanism configured to hold the adhesive member and move in a direction parallel to the surface of the holding substrate, and the control unit is configured to control the movement of the adhesive member in a direction parallel to the surface of the holding substrate by a predetermined parallel distance each time the laser light is irradiated onto the chip to be removed a predetermined number of times. With this configuration, the adhesive member is moved in a direction parallel to the surface of the holding substrate by the adhesive member parallel movement mechanism, and the portion of the adhesive member that does not hold the chip to be removed is positioned above the chip to be removed. As a result, the chip to be removed can be recovered from a portion of the adhesive member that is not adhesively held by the chip to be removed, avoiding the portion of the adhesive member where the chip to be removed is adhesively held by multiple laser light irradiations, thereby increasing the recovery rate of the chip to be removed.

[0014] The chip removal method for removing a chip to be removed from among a plurality of chips held by a holding portion on the surface of a holding substrate according to this second aspect includes the steps of arranging the chip and an adhesive member in a spaced-apart state, and separating the chip to be removed from the holding substrate by irradiating laser light from a laser light source with the adhesive member facing the chip and spaced apart.

[0015] As described above, the chip removal method according to the second aspect includes a step of separating the chip to be removed from the holding substrate by irradiating the adhesive member with laser light from a laser light source while the adhesive member is facing but spaced from the chip. Therefore, a chip removal method can be provided that can easily recover the chip to be removed that has been separated from the holding substrate by irradiating the chip with laser light, by adhesively holding the chip to be removed from the holding substrate with an adhesive member that is positioned facing but spaced from the chip. Furthermore, since the recovered chip to be removed is adhesively held on the adhesive member, a chip removal method can be provided that can easily confirm whether the chip to be removed has been recovered by checking the adhesive member. Furthermore, since the adhesive member is spaced from the chip, a chip removal method can be provided that can reduce the impact on normal chips other than the chip to be removed that would be caused by contact of the adhesive member with the normal chips. [Effects of the Invention]

[0016] According to the present invention, as described above, it is possible to provide a chip removal device and a chip removal method that can easily recover chips to be removed that have been separated from a substrate, and that can easily confirm whether the removed chips have been recovered. [Brief explanation of the drawings]

[0017] [Figure 1] 1 is a schematic diagram showing a chip removal device according to a first embodiment of the present invention. [Figure 2] 1A is a schematic diagram showing a state in which a chip to be removed is separated from a holding substrate by ablation according to the first embodiment of the present invention, and momentum is imparted to the adhesive member side, and the chip is adhesively held by the adhesive member. FIG. [Figure 3] FIG. 2 is a schematic diagram illustrating a state before movement of an adhesive member according to the first embodiment of the present invention. [Figure 4] 1 is a schematic diagram showing a state in which a plurality of chips to be removed are sucked and held by an adhesive member above a laser light irradiation position according to a first embodiment of the present invention. FIG. [Figure 5]FIG. 10 is a schematic diagram showing a state in which a portion of an adhesive member where a chip to be removed is not adhesively held is moved above a position irradiated with laser light according to the first embodiment of the present invention. [Figure 6] 5 is a flowchart illustrating the operation of the chip removing device according to the first embodiment of the present invention. [Figure 7] FIG. 10 is a schematic diagram showing a laser transfer device according to a second embodiment of the present invention. [Figure 8] 10 is a schematic diagram showing how a chip is transferred from a donor substrate to an acceptor substrate in a laser transfer apparatus according to a second embodiment of the present invention. FIG. [Figure 9] FIG. 10 is a schematic diagram showing chip removal in a laser transfer apparatus according to a second embodiment of the present invention. [Figure 10] FIG. 2 is a schematic view showing a chip removal device according to a first modified example of the first embodiment of the present invention. [Figure 11] FIG. 10 is a schematic view showing a chip removal device according to a second modified example of the first embodiment of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0018] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, specific embodiments of the present invention will be described with reference to the accompanying drawings.

[0019] [First embodiment] The configuration of a chip removing device 100 according to a first embodiment of the present invention will be described with reference to FIGS.

[0020] (Configuration of chip removal device) As shown in FIG. 1, the chip removal device 100 according to the first embodiment is configured to detach the chip Ct to be removed from the holding substrate S by irradiating it with laser light L, and recover the detached chip Ct to be removed by adhesively holding it with an adhesive member 2.

[0021] As shown in FIG. 1, the chip removal device 100 according to the first embodiment includes a laser light source 1, an adhesive member 2, an adhesive member moving mechanism 3, a substrate holding table 4, a holding substrate moving mechanism 5, and a control unit 6. In this specification, the left-right direction of the chip removal device 100 (one direction parallel to the surface of the holding substrate S) is defined as the X direction. The up-down direction of the chip removal device 100 (the direction in which the adhesive member 2 separates from the chip C) is defined as the Z direction. The upward direction is defined as the Z1 direction, and the downward direction is defined as the Z2 direction. The direction parallel to the surface of the holding substrate S, which is perpendicular to the X and Z directions, is defined as the Y direction.

[0022] The laser light source 1 is configured to irradiate laser light L onto a chip Ct to be removed among a plurality of chips C held on the surface of a holding substrate S by a holding part H. Here, the wavelength of the laser light L is 532 nm, which causes ablation in the holding part H, which will be described later.

[0023] The adhesive member 2 is configured to collect the chips Ct to be removed by adhesively holding them. Here, the adhesive member 2 includes an adhesive member substrate 21, which is a transparent substrate, and an adhesive layer 22 made of an adhesive. For example, the adhesive used for the adhesive layer 22 is made of silicon or the like that does not absorb the 532 nm wavelength of the laser light L described above.

[0024] The adhesive member moving mechanism 3 is configured to move the adhesive member 2 in a direction separating the adhesive member 2 and the chip C and in a direction parallel to the surface of the holding substrate S. The adhesive member moving mechanism 3 is also configured to move the adhesive member 2 by moving the adhesive member holding unit 31 that holds the adhesive member 2 from the adhesive member substrate 21 side. The adhesive member moving mechanism 3 is an example of the "adhesive member separating direction moving mechanism" and "adhesive member parallel moving mechanism" in the claims. For example, the adhesive member moving mechanism 3 is a three-axis stage that is driven by a motor and can move in the X, Y, and Z directions.

[0025] The substrate holder 4 is configured to hold a holding substrate S. For example, the substrate holder 4 that holds the holding substrate S is connected to a negative pressure source (not shown), and is configured to adsorb and hold the holding substrate S by sucking air through pores provided on the mounting surface of the holding substrate S. The substrate holder 4 is also an example of a "holding substrate holder" in the claims.

[0026] The holding substrate moving mechanism 5 is configured to move the substrate holding table 4 in a direction parallel to the surface of the holding substrate S. For example, it is a two-axis stage that is driven by a motor and is movable in the X and Y directions.

[0027] The control unit 6 is configured to control the laser light source 1, the adhesive member moving mechanism 3, and the holding substrate moving mechanism 5. For example, the control unit 6 is a computer that includes a CPU (Central Processing Unit) as a processor, a ROM (Read Only Memory), a RAM (Random Access Memory), a GPU (Graphics Processing Unit), etc., and enables control processing of the equipment.

[0028] Here, the chip C is, for example, a μLED chip. The holding substrate S is a TFT (Thin Film Transistor) substrate on which the μLED chip is mounted. The holding portion H is solder for fixing the μLED chip to the TFT substrate.

[0029] 1, the holding portion H is provided between the holding substrate S and the chip C, and is configured to cause ablation by irradiation with laser light L from the laser light source 1. For example, the wavelength of the laser light L is 532 nm, which is a wavelength that causes ablation in the solder that is the holding portion H.

[0030] 1, the adhesive member 2 is disposed facing the chip C while being spaced apart from it. The laser light source 1 is disposed facing the adhesive member 2 and on the opposite side of the holding substrate S that holds the chip C. The laser light L irradiated from the laser light source 1 is configured to pass through the adhesive member 2 and be irradiated onto the chip Ct to be removed.

[0031] (Chip removal device operation) Next, the operation of the chip removal device 100 will be described. As shown in Fig. 1, the chip removal device 100 according to the first embodiment is configured to irradiate a laser beam L onto a removal target chip Ct in a state in which the adhesive member 2 is separated from the chip C, thereby separating the removal target chip Ct from the holding substrate S and adhesively holding the chip Ct by the adhesive member 2. Here, the removal target chip Ct is a chip C that has been determined to be defective by inspection prior to the operation of the chip removal device 100, and the position of the removal target chip Ct on the holding substrate S has been acquired in advance.

[0032] 2, when the chip to be removed Ct is irradiated with laser light L, the holding portion H provided between the holding substrate S and the chip to be removed Ct undergoes ablation, which evaporates or atomizes the holding portion H due to the irradiation of laser light L. Therefore, the chip to be removed Ct is configured to be separated from the holding substrate S by imparting momentum to the adhesive member 2 side (Z1 direction) due to the ablation.

[0033] 2 needs to be set appropriately. If the distance between the adhesive member 2 and the chip C is too close, the chip Ct to be removed that has separated from the holding substrate S may bounce back without being adhesively held by the adhesive member 2.

[0034] Therefore, the control unit 6 performs control to separate the chip C from the adhesive member 2 by a predetermined appropriate separation distance d when irradiating the removal target chip Ct with the laser light L. Here, the separation distance d is a distance at which the removal target chip Ct is adhesively held by the adhesive member 2 without rebounding, as previously obtained. For example, for a chip C with a chip size of 20 μm × 40 μm, the separation distance d is 200 μm or more and 300 μm or less.

[0035] As shown in Fig. 3, when the irradiation position of the laser light L and the adhesive member 2 are fixed and the removal target chips Ct are irradiated with the laser light L multiple times, a large number of removal target chips Ct are adsorbed and held above the laser light irradiation position (Z1 direction) as shown in Fig. 4. Note that for convenience of drawing, two removal target chips Ct are depicted on the adhesive member 2 in Fig. 4, but in reality, a large number of removal target chips Ct are adsorbed and held. Furthermore, when the number of removal target chips Ct held on the adhesive member 2 increases, the separated removal target chips Ct may collide with the removal target chips Ct already adhesively held on the adhesive member 2 in the same location, resulting in a lack of contact between the adhesive member 2 and the removal target chips, and the removal target chips may not be adhesively held on the adhesive member 2.

[0036] 5, the control unit 6 controls the adhesive member 2 to move a predetermined parallel distance h in a direction parallel to the surface of the holding substrate S every time the removal target chip Ct is irradiated with the laser light L a predetermined number of times. In the first embodiment, the distance that the removal target chip Ct, which has been separated from the holding substrate S by irradiation with the laser light L, moves in a direction parallel to the surface of the holding substrate S is expected to be about 2.5 mm. Therefore, the predetermined parallel distance h is sufficient to be, for example, about twice the expected movement distance, and is therefore 5 mm or more and 6 mm or less.

[0037] (How to remove chips) Next, a chip removal method in the first embodiment will be described with reference to Figures 1 to 6. The positions of the chips Ct to be removed on the holding substrate S are acquired in advance by inspecting the chips C in advance.

[0038] 1 and 2, in step S1 shown in Fig. 6, the control unit 6 controls the adhesive member moving mechanism 3 to separate the chip C from the adhesive member 2 by a preset separation distance d. Then, the process proceeds to step S2.

[0039] 6, the control unit 6 controls the holding substrate moving mechanism 5 to move the holding substrate S in a direction parallel to the surface of the holding substrate S, thereby moving the removal target chip Ct to an irradiation position of the laser light L. Thereafter, the process proceeds to step S3.

[0040] 6, the control unit 6 irradiates the removal target chip Ct with laser light L, as shown in FIG. 2. By irradiating the removal target chip Ct with laser light L in step S3, momentum is imparted to the removal target chip Ct in the direction of the adhesive member 2, and the removal target chip Ct is separated from the holding substrate S. Furthermore, the removal target chip Ct separated from the holding substrate S is adhesively held by the adhesive member 2. Thereafter, the process proceeds to step S4.

[0041] 6, the control unit 6 determines whether or not irradiation of the laser light L to all the removal target chips Ct has been completed. If it is determined in step S4 that irradiation of the laser light L to all the removal target chips Ct has been completed, the flow for the chip removal method ends. If it is determined in step S4 that irradiation of the laser light L to all the removal target chips Ct has not been completed, the process proceeds to step S5.

[0042] In step S5 shown in Fig. 6, the control unit 6 determines whether or not the laser light L has been irradiated a predetermined number of times. If it is determined in step S5 that the laser light L has been irradiated a predetermined number of times, the control unit 6 controls the adhesive member moving mechanism 3 to move the adhesive member 2 in a direction parallel to the surface of the holding substrate S by a predetermined parallel distance h, as shown in Figs. 3 to 5. Thereafter, the process returns to step S2. If it is determined in step S5 that the laser light L has not been irradiated a predetermined number of times, the process returns to step S2.

[0043] (Effects of the first embodiment) In the first embodiment, the following effects can be obtained.

[0044] The chip removal device 100 of the first embodiment is configured to irradiate the removal target chip Ct with laser light L while the adhesive member 2 is positioned opposite but spaced from the chip C as described above, thereby separating the removal target chip Ct from the holding substrate S and adhesively holding the chip Ct with the adhesive member 2. Therefore, even if the removal speed or direction of the removal target chip Ct is irregular, the removal target chip Ct separated from the holding substrate S by irradiation with laser light L can be easily collected by adhesively holding the removal target chip Ct with the adhesive member 2 positioned opposite but spaced from the chip C. Furthermore, because the collected removal target chip Ct is adhesively held on the adhesive member 2, even if the chip C itself is small, it is easy to confirm whether the removal target chip Ct has been collected by checking the adhesive member 2. Furthermore, because the adhesive member 2 is spaced from the chip C, adverse effects on normal chips C other than the removal target chip Ct due to contact between the adhesive member 2 and the normal chips C can be prevented.

[0045] Furthermore, in the first embodiment, the laser light L irradiated from the laser light source 1 is configured to irradiate the removal target chips Ct after passing through the adhesive member 2. With this configuration, even if the holding substrate S is not a transparent substrate and the removal target chips Ct cannot be irradiated with the laser light L by passing through the holding substrate S, the removal target chips Ct can be irradiated with the laser light L from the adhesive member 2 side.

[0046] Moreover, in the first embodiment, the holding unit H is provided between the holding substrate S and the chip C, and is configured so that irradiation with laser light L from the laser light source 1 causes ablation that evaporates or atomizes the holding unit H, and the ablation imparts momentum to the chips Ct to be removed in the direction of the adhesive member 2, causing the chips Ct to be removed to separate from the holding substrate S. With this configuration, momentum is imparted to the chips Ct to be removed toward the adhesive member 2, which is opposed to but spaced apart from the chips C, so that the chips Ct to be removed can be detached in the direction of the adhesive member 2, and the chips Ct to be removed can be more reliably collected by the adhesive member 2.

[0047] Moreover, in the first embodiment, the apparatus includes a substrate holder 4 that holds a holding substrate S, a holding substrate moving mechanism 5 that moves the substrate holder 4 in a direction parallel to the surface of the holding substrate S, and a control unit 6. The control unit 6 is configured to control the movement of the substrate holder 4 relative to the surface of the holding substrate S while the irradiation position of the laser light L of the laser light source 1 and the adhesive member 2 are fixed, thereby selectively irradiating the laser light L to the removal target chips Ct held on the surface of the holding substrate S held by the holder H. With this configuration, the removal target chips Ct are adhesively held around the irradiation position of the laser light L on the adhesive member 2, regardless of the position of the removal target chips Ct on the holding substrate S. As a result, there is no variation in the location where the removal target chips Ct are adhesively held on the adhesive member 2 due to the position of the removal target chips Ct on the holding substrate S, and the way in which the removal target chips Ct are attached to the adhesive member 2 can be controlled, thereby enabling efficient use of the adhesive member 2.

[0048] Moreover, in the first embodiment, an adhesive member moving mechanism 3 is provided that holds the adhesive member 2 and is configured to be movable in a direction parallel to the surface of the holding substrate S, and the control unit 6 is configured to control the movement of the adhesive member 2 in a direction parallel to the surface of the holding substrate S by a predetermined parallel distance h each time the removal target chips Ct are irradiated with the laser light L a predetermined number of times. With this configuration, the adhesive member 2 is moved in a direction parallel to the surface of the holding substrate S by the adhesive member moving mechanism 3, and the portion of the adhesive member 2 that does not hold the removal target chips Ct is positioned above the removal target chips Ct. As a result, by irradiating the laser light L multiple times, the removal target chips Ct can be collected from the portion of the adhesive member 2 where the removal target chips Ct are not adhesively held, avoiding the portion on the adhesive member 2 where the removal target chips Ct are adhesively held. This increases the collection rate of the removal target chips Ct.

[0049] [Second embodiment] (Configuration of chip removal device functioning as laser transfer device) The chip removal device of the present invention functions as a laser transfer device 200 by having the adhesive member holding section 31 hold a donor substrate 220 instead of the adhesive member 2, and the substrate holding table 4 hold a receptor substrate Sr instead of the holding substrate S.

[0050] 7 and 8, a case where a chip removal device according to the present invention functions as a laser transfer device 200 of a second embodiment will be described. As shown in FIG. 7, the laser transfer device 200 includes a laser light source 210 instead of the laser light source 1 (see FIG. 1) of the first embodiment. The adhesive member holding unit 31 holds a donor substrate 220 instead of the adhesive member 2. The substrate holding table 4 holds a receptor substrate Sr instead of the holding substrate S. Here, the laser transfer device 200 is a device that irradiates a laser beam L2 onto a chip C held on the donor substrate 220, thereby separating the chip C from the donor substrate 220 and transferring the chip C onto the receptor substrate Sr.

[0051] The laser light source 210 is configured to irradiate laser light L2 onto a plurality of chips C held on the donor substrate 220. The wavelength of the laser light L2 is 266 nm, which is a wavelength that causes ablation in the release agent 222, which will be described later, to evaporate or atomize the release agent 222.

[0052] The donor substrate 220 includes a transparent substrate 221 and a release agent 222 made of an adhesive, and the plurality of chips C are held on the donor substrate 220 by the release agent 222 .

[0053] The receptor substrate Sr also contains a catch agent Ha made of an adhesive, and the catch agent Ha is configured to adhesively hold the chip C separated from the donor substrate 220.

[0054] 7, the laser light source 210 is disposed so as to face the donor substrate 220 and is disposed on the transparent substrate 221 side of the donor substrate 2a. Therefore, the laser light L2 emitted from the laser light source 210 passes through the transparent substrate 221 and is configured to irradiate the chip C.

[0055] 7, the release agent 222 is provided between the transparent substrate 221 and the chip C, and is configured to cause ablation when irradiated with laser light L2 from the laser light source 210. For example, the wavelength of the laser light L2 is 266 nm, which is a wavelength that causes ablation in the adhesive that is the release agent 222.

[0056] The configuration of the second embodiment is the same as that of the first embodiment, except for the laser light source 210, the donor substrate 220 held by the adhesive member holding portion 31, and the receptor substrate Sr held by the substrate holding table 4.

[0057] (Operation of the chip removal device functioning as a laser transfer device) Next, the operation of the laser transfer apparatus 200 in the second embodiment will be described with reference to FIGS.

[0058] First, the control unit 6 controls the adhesive member moving mechanism 3 to increase the distance d2 between the receptor substrate Sr and the donor substrate 220. Here, the distance d2 is a predetermined distance appropriate for transferring the chips C from the donor substrate 220 to the receptor substrate Sr. For example, the distance d2 is 80 μm or more and 120 μm or less.

[0059] As shown in FIG. 7, after performing control to set the separation distance d2, the control unit 6 irradiates the chip C with laser light L2.

[0060] 8, when the chip C is irradiated with the laser light L2, ablation occurs, which evaporates or atomizes the release agent 222 between the chip C and the transparent substrate 221. Therefore, the ablation gives the chip C momentum toward the receptor substrate Sr (Z1 direction), and the chip C is configured to be separated from the donor substrate 220.

[0061] The chip C separated from the donor substrate 220 is adhesively held by the catch agent H2 on the receptor substrate Sr, and thus the chip C is transferred from the donor substrate 220 to the receptor substrate Sr.

[0062] After the transfer of the chips C to the receptor substrate Sr is completed, the chips C are inspected and chips Ct to be removed are identified.

[0063] After the inspection of the chip C, the chip Ct to be removed is removed by replacing the donor substrate 220 with the adhesive member 2, as shown in Fig. 9. Since the catch agent H2 is an adhesive, ablation occurs due to the laser light L2 irradiated from the laser light source 210. Chip removal in the second embodiment is the same as in the first embodiment, except that the holding part H is the catch agent H2 and the wavelength of the laser light L2 irradiated from the laser light source 210 is a wavelength that causes ablation in the catch agent H2.

[0064] [Variations] The present invention is not limited to the above embodiments, but is illustrated by the claims, and includes all modifications within the scope of the claims.

[0065] For example, in the first embodiment described above, an example was shown in which the adhesive member 2 was arranged on the upper side (Z1 side) and the holding substrate S was arranged on the lower side (Z2 side), but the present invention is not limited to this. A configuration in which the holding substrate S is arranged on the upper side and the adhesive member 2 is arranged on the lower side may also be used. Furthermore, as long as the adhesive member 2 is arranged in the direction of the momentum imparted to the removal target chips Ct by the irradiation of the laser light L and the removal target chips Ct can be recovered by adhesively holding them, the holding substrate S and the adhesive member 2 may be arranged in any manner.

[0066] Furthermore, in the first embodiment, an example has been shown in which the laser light L irradiated from the laser light source 1 passes through the adhesive member 2 to irradiate the chips Ct to be removed, but the present invention is not limited to this. When the holding substrate S is transparent, instead of the configuration in which the laser light L irradiated from the laser light source 1 passes through the adhesive member 2 to irradiate the chips Ct to be removed, the laser light L irradiated from the laser light source 1 may be configured to pass through the holding substrate S to irradiate the chips Ct to be removed.

[0067] In the first embodiment, the chip C is spaced apart from the adhesive member 2 by a predetermined distance d to prevent the chip C from bouncing back. However, the present invention is not limited to this. For example, the intensity of the laser light L may be adjusted to adjust the speed at which the chip C is removed, thereby preventing the chip C from bouncing back.

[0068] In the first embodiment, the chip C and the adhesive member 2 are separated by a predetermined separation distance d by the adhesive member moving mechanism 3, but the present invention is not limited to this. As in the first modified example shown in Fig. 10, if the chip C and the adhesive member 2 are separated in advance by an appropriate separation distance d, the separation between the chip C and the adhesive member may be fixed without using the adhesive member moving mechanism 3.

[0069] In the first embodiment, the substrate holder 4 is moved to selectively irradiate the plurality of removal target chips Ct with the laser light L, but the present invention is not limited to this. For example, the laser light source 1 may be moved, or, as in a second modified example shown in FIG. 11 , the laser light L may be selectively irradiated onto the plurality of removal target chips Ct using a galvanometer scanner 7 and an fθ lens 8.

[0070] In the first embodiment, the adhesive member 2 is moved in a direction parallel to the surface of the holding substrate S every time the removal target chip Ct is irradiated with the laser light L a predetermined number of times, but the present invention is not limited to this. For example, the adhesive member 2 may be configured to be moved every time the laser light L is irradiated. [Explanation of symbols]

[0071] 1, 210 laser light source 2 Adhesive material 21 Adhesive material substrate 22 Adhesive layer 3. Adhesive member movement mechanism 31 Adhesive material holding portion 4 Board holding stand 5. Holding substrate moving mechanism 6 Control Unit 100, 100a, 100b Chip removal device 200 Laser transfer device 220 Donor Substrate 221 Transparent substrate 222 Release Agent C-chip Ct Removal target chip H holding part H2 catcher L, L2 laser light S Holding board Sr receptor substrate d, d2 separation distance h parallel distance

Claims

1. Among the plurality of chips held on the surface of the holding substrate by the holding part, the chip to be removed is a laser light source that irradiates laser light; an adhesive member that adhesively holds the tip to be removed and thereby recovers the tip, A chip removal device configured to irradiate the chip to be removed with laser light while the adhesive member is facing and spaced apart from the chip, thereby separating the chip to be removed from the holding substrate and adhesively holding it in place with the adhesive member.

2. The chip removal device according to claim 1 , wherein the laser light emitted from the laser light source passes through the adhesive material and is then irradiated onto the chip to be removed.

3. the holding portion is provided between the holding substrate and the chip, and is configured so that ablation occurs in which the holding portion is evaporated or atomized by irradiation of laser light from the laser light source; The tip removal device according to claim 1 , wherein the ablation applies a force to the tip to be removed in the direction of the adhesive member, thereby separating the tip from the holding substrate.

4. an adhesive member moving mechanism for moving the adhesive member in a direction in which the adhesive member and the removal target chip are separated from each other; a control unit, The chip removal device according to claim 1, wherein the control unit is configured to control the separation of the chip to be removed from the adhesive material by a predetermined separation distance when irradiating the laser light onto the chip to be removed.

5. a holding substrate holding part that holds the holding substrate; a holding substrate holding unit moving mechanism that moves the holding substrate holding unit in a direction parallel to a surface of the holding substrate; a control unit, 2. The chip removal device according to claim 1, wherein the control unit is configured to control the selective irradiation of laser light onto the chip to be removed held on the surface of the holding substrate held by the holding substrate holding unit, by moving the holding substrate holding unit relative to the surface of the holding substrate while the laser light irradiation position of the laser light source and the adhesive member are fixed.

6. an adhesive member parallel movement mechanism configured to hold the adhesive member and to be movable in a direction parallel to a surface of the holding substrate; The chip removal device according to claim 5, wherein the control unit is configured to control the adhesive member to move in a direction parallel to the surface of the holding substrate by a predetermined parallel distance each time the chip to be removed is irradiated with laser light a predetermined number of times.

7. A chip removal method for removing a chip to be removed from a plurality of chips held by a holding unit on a surface of a holding substrate, comprising: disposing the chip and the adhesive member in a spaced-apart state; and separating the chip to be removed from the holding substrate by irradiating the adhesive member with laser light from a laser light source while the adhesive member is facing the chip and spaced apart.

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